CN113596313B

CN113596313B - Image pickup module, support thereof, photosensitive device, manufacturing method thereof and electronic equipment

Info

Publication number: CN113596313B
Application number: CN202111073363.4A
Authority: CN
Inventors: 赵波杰; 梅哲文; 王明珠
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-07-21
Filing date: 2018-07-23
Publication date: 2023-06-13
Anticipated expiration: 2038-07-23
Also published as: CN113596313A; CN114584690B; CN109286736B; CN112600998A; CN109286736A; WO2019015692A1; CN110892702A; CN110892702B; CN114584690A; CN112600998B

Abstract

The invention provides an image pickup module, a support, a photosensitive device, a manufacturing method and electronic equipment thereof, wherein the support is provided with at least one light transmission channel, a light filtering unit is formed after at least one light filtering element is attached to the support and the light transmission channel is closed by the light filtering element, the support is attached to a molded photosensitive unit so as to form at least one sealed space between the light filtering unit and the molded photosensitive unit, the support is also provided with at least one ventilation channel, and the ventilation channel is communicated with the sealed space and the external environment of the image pickup module so that gas in the sealed space can be exchanged with the gas in the external environment of the image pickup module through the ventilation channel.

Description

Image pickup module, support thereof, photosensitive device, manufacturing method thereof and electronic equipment

The present application is a divisional application of the chinese invention patent application with application number "201880045508. X". The application date of the original application is 2018, 7 and 23 (PCT international application date), the national application number of China is "201880045508.X" (PCT international application number is PCT/CN 2018/096649), and the invention is named "image pickup module and support, photosensitive device and manufacturing method, and electronic equipment".

Technical Field

The present invention relates to the field of optical imaging, and in particular, to a camera module, a support, a photosensitive device, a manufacturing method of the camera module, and an electronic device.

Background

In recent years, intelligent electronic devices have become increasingly popular, and the development of electronic devices such as smartphones, tablet computers, etc. has increasingly changed the lifestyle and entertainment modes of people. Many functions of the intelligent electronic device benefit from development of the camera module and related technologies configured in the electronic device, for example, with development of the camera module with high pixels and high quality, the intelligent electronic device is capable of replacing the traditional card type digital camera. As is well known, the hardware basis of the high-pixel and high-quality camera module is that the photosensitive element has a larger photosensitive area and a larger number of larger-sized passive components, and the intelligent electronic device pursues higher pixels and higher quality, so that the volume of the camera module is larger and larger, and the development trend of the camera module is not in line with the development trend of the thinning of the electronic device. For example, in order to control the thickness dimension of the smart electronic device, even further reduction of the smart electronic device is required, once the volume of the camera module configured in the smart electronic device is increased, the number of camera modules protruding from the smart electronic device or other smart components (such as but not limited to gyroscopes, sensors, processors, etc.) configured in the smart electronic device must be reduced, and the size is reduced. It can be appreciated that if the camera module protrudes from the intelligent electronic device, on the one hand, the design of the intelligent electronic device is affected, and on the other hand, in the process that the user carries the intelligent electronic device, the camera module protruding from the intelligent electronic device is easily touched, so that the camera module is damaged. If the number and size of the intelligent electronic devices are reduced, the performance of the camera module is adversely affected, and the intelligent electronic devices are further limited to develop towards the intelligent direction.

In order to reduce the volume of a high-pixel and high-quality camera module, the inventor introduces a molding packaging process applied to the field of semiconductor packaging into the packaging process of the camera module, specifically, firstly, a passive electronic component is attached to a circuit board through a surface attaching process, and then a molding material is integrally combined with the circuit board by utilizing the molding process to form an integrated base, wherein the integrated base can embed the passive electronic component, and the integrated base can prevent the adjacent passive electronic component from generating a mutual interference phenomenon in a mode of isolating the adjacent passive electronic component because a safe distance is not required between the integrated base and the passive electronic component, so that the passive electronic component with larger number and larger size can be attached on the limited attaching area of the circuit board, which is beneficial to further improving the quality of the camera module. If the photosensitive element is firstly attached to the circuit board and then the molding process is carried out, the integrated base integrally combined with the circuit board formed by the molding process can further embed the non-photosensitive area of the photosensitive element, so that a safety distance is not required to be reserved between the integrated base and the photosensitive element, and the size of the camera module is further reduced.

In addition, a filter element is held between the optical lens and the photosensitive element for filtering stray light in light entering the inside of the image capturing module from the optical lens. Typically, the filter element is a glass sheet, such as, but not limited to, blue glass, on the one hand, the filter element is weaker and the filter element with a larger length-width dimension is weaker, and on the other hand, the cost of the filter element is higher and the cost of the filter element with a larger length-width dimension is higher. When the filter element with a relatively large length and width is mounted on the integrated base, the filter element is thin and fragile, and then cracks or chipping of the filter element are easily caused in the mounting process. In addition, according to the optical imaging principle, the area of the filter element that is actually effectively utilized is actually small, and the region located only in the middle of the filter element is the filter region. In other words, the area of the filtering element occupies a relatively small area of the whole filtering element, which causes waste of the filtering element and greatly increases the cost of the camera module.

In order to reduce the length-width dimension of the filter element and to increase the proportion of the filter area of the filter element to the entire area of the filter element, a frame-shaped holder for connecting the filter element and the integrated base is employed by the inventors. Specifically, the filter element is first attached to the inner side of the frame-shaped support, and then the outer side of the frame-shaped support is attached to the integral base by glue, at this time, the inner side of the frame-shaped support can extend from the non-photosensitive region of the photosensitive element toward the photosensitive region, and the light passing hole of the frame-shaped support is made to correspond to the photosensitive region of the photosensitive element, and the filter element is made to be held on the photosensitive path of the photosensitive element. In the prior art, the frame-shaped support is mounted on the integrated base by using glue, the glue is firstly applied to the lower mounting surface of the frame-shaped support and/or the upper surface of the integrated base, then the lower mounting surface of the frame-shaped support and the upper surface of the integrated base are mounted together, and then a baking process is performed, at this time, the lower mounting surface of the frame-shaped support can be reliably mounted on the upper surface of the integrated base. Then, because after the lower surface of the frame-shaped support is attached to the upper surface of the integrated base, a sealed space is formed among the optical filter element, the frame-shaped support, the integrated base and the circuit board, at this time, in the baking process, the air pressure in the sealed space and the air pressure in the external environment are not balanced, and according to the principle of thermal expansion and cold contraction, the air pressure in the sealed space can be greater than the air pressure in the external environment, thus, the fragile components such as the optical filter element and the photosensitive element are affected by the air pressure, the air pressure can cause the fragile components such as the optical filter element and the photosensitive element to deform or crack, and once the bad phenomena occur, the quality of the camera module can be inevitably affected, and even the camera module can be scrapped. Therefore, it is important to develop a method of balancing the air pressure in the sealed space and the air pressure in the external environment during the baking process, so as to ensure the quality and yield of the camera module.

Disclosure of Invention

An object of the present invention is to provide an image pickup module having at least one sealed space, and a support, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, in which the pneumatic pressure of the sealed space and the pneumatic pressure of the outside of the photosensitive device of the image pickup module can be kept balanced all the time during the manufacturing of the image pickup module, in such a manner that the occurrence of a bad phenomenon that each part of the photosensitive device for forming the sealed space is damaged due to the unbalance of pressure can be avoided.

An object of the present invention is to provide an image pickup module, a holder therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which an air pressure of the sealed space and an air pressure of the outside of the photosensitive device can be kept balanced all the time during the manufacture of the image pickup module, and in such a manner that the air pressures received by the upper and lower portions of the filter element of the photosensitive device can be ensured to be uniform, thereby avoiding an adverse phenomenon in which the filter element is cracked or broken due to an imbalance in the pressures received by the upper and lower portions of the filter element.

An object of the present invention is to provide an image capturing module, a support thereof, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, wherein the photosensitive device has at least one ventilation channel for communicating the sealed space with the exterior of the photosensitive device, so that the air pressure of the sealed space and the air pressure of the exterior of the photosensitive device are balanced by the ventilation channel when the baking process is performed.

An object of the present invention is to provide an image pickup module, a holder therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which the ventilation passage is curvedly extended to prevent contaminants such as dust from entering the sealed space from the outside environment via the ventilation passage, thereby preventing a photosensitive region held in the sealed space and a portion of the filter element for forming the sealed space from being contaminated.

An object of the present invention is to provide an image pickup module, a holder therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which the ventilation passage can be sealed by a sealing medium to prevent contaminants such as dust from entering the sealing space from the outside of the photosensitive device via the ventilation passage, thereby preventing a photosensitive region held in the sealing space and a portion of the filter element forming the sealing space from being contaminated.

An object of the present invention is to provide an image pickup module, a mount therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which the ventilation passage extends curvedly, in such a manner that the ventilation passage can prevent the sealing medium from flowing into the sealing space when the ventilation passage is sealed with the sealing medium, thereby preventing a photosensitive region of the photosensitive element held in the sealing space from being contaminated.

An object of the present invention is to provide an image pickup module, a holder therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which the ventilation passage extends curvedly, in such a manner that the sealing medium does not flow to an inner wall of the sealing space to cause a rugged phenomenon in the inside of the sealing space when the ventilation passage is sealed with the sealing medium, by which light entering the sealing space via the filter element can be prevented from being affected to ensure imaging quality of the image pickup module.

An object of the present invention is to provide an image pickup module, a holder for the same, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, wherein the holder has at least one ventilation groove that forms the ventilation passage between the holder and a molded base of the image pickup module when the holder is attached to the molded base by a mounting medium.

An object of the present invention is to provide an image pickup module, a holder, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, wherein the molded base has at least one ventilation groove that forms the ventilation passage between the holder and the molded base when the holder is attached to the molded base by the attaching medium.

An object of the present invention is to provide an image pickup module, a mount for the same, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, wherein the mount has at least one ventilation hole and at least one ventilation groove, the ventilation hole and the ventilation groove communicate with each other to form the ventilation passage, and an extending direction of the ventilation hole and an extending direction of the ventilation groove do not coincide, so that the ventilation passage can be curvedly extended.

An object of the present invention is to provide an image pickup module, a mount, a photosensitive device, a manufacturing method thereof, and an electronic apparatus, wherein a depth dimension of the vent groove is larger than a thickness dimension of the mounting medium, so that an adverse phenomenon that the vent groove is filled to block the vent passage when the mounting medium is thermally expanded during a baking process can be avoided, thereby ensuring that an air pressure in the sealed space and an air pressure outside the photosensitive device are kept balanced by keeping the vent passage formed by the vent hole and the vent groove clear.

An object of the present invention is to provide an image pickup module, a holder therefor, a photosensitive device, a manufacturing method therefor, and an electronic apparatus, in which a plurality of small-sized ventilation holes can communicate with the same ventilation groove to form the ventilation passage, in such a manner that the small-sized ventilation holes can prevent contaminants such as dust from entering the sealed space from the outside environment via the ventilation passage to contaminate a photosensitive region of the photosensitive element held in the sealed space and a portion of the filter element for forming the sealed space.

According to one aspect of the present invention, there is provided an image capturing module, comprising at least one optical lens and at least one photosensitive device, wherein the photosensitive device comprises:

at least one light filtering unit, wherein the light filtering unit comprises at least one support and at least one light filtering element, the support is provided with at least one light transmission channel, the light filtering element is attached to the support, and the light transmission channel of the support corresponds to the light filtering element; and

at least one molded photosensitive unit, wherein the molded photosensitive unit further comprises:

at least one circuit board, wherein the circuit board comprises at least one substrate;

At least one photosensitive element, wherein the photosensitive element is provided with a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive element is connected to the substrate in a conductive manner; and

at least one molded base, wherein the molded base has at least one optical window, the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive area of the photosensitive element, and the photosensitive area of the photosensitive element corresponds to the optical window of the molded base, wherein the mount is attached to a top surface of the molded base, and at least one sealed space is formed between the filter unit and the molded photosensitive unit, the photosensitive area of the photosensitive element is held in the sealed space, wherein the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element;

wherein the photosensitive device is provided with at least one ventilation channel for communicating the sealed space and the outside of the photosensitive device, wherein the ventilation channel is used for exchanging the gas inside the sealed space and the gas outside the photosensitive device during the manufacturing process of the photosensitive device so as to balance the gas pressure inside the sealed space and the gas pressure outside the photosensitive device.

According to one embodiment of the invention, the vent channel is formed in the support; or the vent channel is formed in the molded base; or the vent channel is formed between the support and the molded base; or a part of the ventilation channel is formed in the support, and the other part is formed between the molded base and the support.

According to one embodiment of the invention, the ventilation channel extends curvedly; or the vent passage extends obliquely; or the shape of the ventilation channel is selected: the shape group is composed of an L shape, an S shape, a V shape or a Y shape.

According to one embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one ventilation hole, and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, the inner side surface defines the ventilation channel, wherein the ventilation hole extends from the upper surface toward the lower surface, the ventilation groove is formed at the lower surface, and the ventilation groove extends from the inner side surface toward the outer side surface, wherein the ventilation hole and the ventilation groove communicate with each other to form the ventilation channel of the photosensitive device.

According to one embodiment of the present invention, the extending direction of the vent hole and the extending direction of the vent groove are perpendicular to each other.

According to an embodiment of the present invention, one of the ventilation holes and one of the ventilation grooves communicate with each other to form the ventilation channel of the photosensitive device; or a plurality of the ventilation holes and one of the ventilation grooves are communicated with each other to form the ventilation channel of the photosensitive device; or one of the ventilation holes and a plurality of the ventilation grooves are communicated with each other to form the ventilation channel of the photosensitive device.

According to one embodiment of the invention, the vent slot is stepped.

According to one embodiment of the present invention, a parameter of the depth dimension of the vent groove of the support is set to be h1, wherein the range of values of the parameter h1 of the depth dimension of the vent groove is: h1 And is more than or equal to 0.1mm.

According to one embodiment of the present invention, let the parameter of the depth dimension of the vent groove of the support be H1, let the parameter of the thickness dimension of the support be H, wherein the ratio of the parameter of the depth dimension of the vent groove H1 to the parameter of the thickness dimension of the support H is in the range: 0.5 to 70 percent.

According to one embodiment of the invention, the vent groove of the holder has an open end and a communication end corresponding to the open end, wherein a portion of the communication end of the vent groove is defined as a first vent groove, a portion of the open end of the vent groove is defined as a second vent groove, such that the first vent groove communicates with the second vent groove and the vent hole, respectively, and the second vent groove communicates with the sealed space, wherein a depth dimension of the first vent groove is greater than a depth dimension of the second vent groove.

According to one embodiment of the invention, the depth dimension of the first ventilation groove of the support is 0.1mm and the depth dimension of the second ventilation groove of the support is 0.03mm.

According to one embodiment of the present invention, let the parameter of the width dimension of the first ventilation groove of the support be W, and let the parameter of the diameter dimension of the lower end of the ventilation hole be R, wherein the ratio of the width dimension of the first ventilation groove of the support to the diameter dimension of the lower end of the ventilation hole has the following range: 2:1-1:1.

According to one embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface, and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, the inner side surface defines the ventilation channel, wherein the ventilation groove is formed at the lower surface, and the ventilation groove extends from the inner side surface to the outer side surface, wherein the ventilation groove forms the ventilation channel of the photosensitive device between the support and the molded base after the lower surface of the support is attached to the top surface of the molded base.

According to one embodiment of the invention, the ventilation slot extends curvedly.

According to one embodiment of the invention, the shape of the vent slot is selected from: the shape group is composed of an L shape, an S shape, a V shape and a Y shape.

According to one embodiment of the invention, the support has at least a first groove extending from the inner side of the support in the direction of the outer side, and at least a second groove extending from the outer side of the support in the direction of the inner side, and the first groove and the second groove communicate with each other to form the groove of the support.

According to one embodiment of the invention, the direction of extension of the first recess and the direction of extension of the second recess of the abutment have an angle.

According to one embodiment of the invention, one of said first grooves and one of said second grooves are in communication with each other to form said groove of said seat; or a plurality of the first grooves and one of the second grooves are communicated with each other to form the grooves of the holder; or one of the first grooves and a plurality of the second grooves are communicated with each other to form the grooves of the holder.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards respectively to connect to the upper surface and the lower surface, the inner side defines the ventilation channel, wherein the area of the lower surface close to the light window is defined as a non-picture area, and the area of the lower surface remote from the light window is defined as a picture area surrounding the non-picture area, wherein the ventilation groove is formed at the lower surface, and the ventilation groove extends from the outer side to a suitable position of the non-picture area via the picture area, wherein the ventilation groove forms a ventilation channel between the lower surface of the support and the top surface of the molded base after the picture area of the lower surface of the support is attached to the top surface of the molded base.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defining the light-passing channel, wherein the area of the lower surface close to the light window is defined as a non-glue-drawing area, and the area of the lower surface remote from the light window is defined as a glue-drawing area surrounding the non-glue-drawing area, wherein the ventilation hole extends from the upper surface to the non-glue-drawing area of the lower surface of the support, wherein the glue-drawing area of the lower surface of the support is attached to the top surface of the molded base, the ventilation hole of the support forming the ventilation channel of the light-sensing device.

According to one embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, the inner side surface defines the ventilation channel, wherein the ventilation groove is formed at the upper surface of the holder, and the ventilation groove extends from the inner side surface toward the outer side surface, wherein the filter element is attached to the upper surface of the holder, and the filter element leaves a portion of the ventilation groove exposed, wherein the ventilation groove of the holder forms the ventilation channel of the photosensitive device between the filter element and the holder after the lower surface of the holder is attached to the top surface of the mold base.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defines the ventilation channel, wherein the area of the upper surface close to the light window is defined as an upper surface inside, and the area of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein the inner side has an inner side upper side and an inner side lower side, the inner side upper side extends upwards and downwards to connect to the upper surface inside and the lower surface inside, respectively, wherein the groove is provided inside the upper surface, the lower side is provided to the support, and the ventilation groove is provided to the upper side of the support, wherein the ventilation groove is provided to the upper side of the support, and the ventilation groove is provided to the upper side of the support, wherein the ventilation groove is provided to the upper side of the support, and the ventilation groove is provided to the ventilation groove.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defines the ventilation channel, wherein the area of the upper surface close to the light window is defined as an upper surface inside, and the area of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein the inner side has an inner side upper side and an inner side lower side, the inner side upper side extends upwards and downwards to connect to the upper surface inside and the lower surface inside, respectively, the ventilation hole extends from the upper surface inside to the lower surface inside, wherein the filter element is formed to the support and the upper surface inside the ventilation channel, and the ventilation channel is formed by a top surface and the ventilation channel, the ventilation channel is formed between the support and the support.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation groove and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side extend upwards and downwards respectively to connect to the upper surface and the lower surface, the inner side defines the light-passing channel, wherein the area of the upper surface close to the light window is defined as an upper surface inside, and the area of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein the inner side has an inner side upper side and an inner side lower side, the inner side upper side extends upwards and downwards respectively to connect to the upper surface inside and the lower surface inside, the groove extends from the upper surface to the lower surface inside, the ventilation groove is formed to the ventilation groove is attached to the support, and the ventilation groove is formed on the support.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion and a filter attaching portion, the connecting portion extending upward and downward to be connected to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defines the light passing channel, the filter element is attached to the filter attaching portion of the holder, and a gap is formed between an outer wall of the filter element and the connecting portion, wherein the base attaching portion of the holder is attached to the top surface of the molded base, and the filter attaching portion is held at the light window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter attaching portion, and the light passing hole communicates with the gap at the upper surface of the filter attaching portion to form the light passing channel of the photosensitive device.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion and a filter attaching portion, the connecting portion extending upward and downward to connect to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defining the light passing channel, the filter element being attached to the filter attaching portion of the holder, the base attaching portion of the holder being attached to the top surface of the molded base, and the filter attaching portion being held at the light window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein a slit is formed between a base inner surface of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the base attaching portion, and the light passing hole communicates with the slit at a lower surface of the base attaching portion to form the light passing channel of the photosensitive device.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion and a filter attaching portion, the connecting portion extending upward and downward to be connected to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defining the light passing channel, the filter element being attached to the filter attaching portion of the holder and forming a gap between an outer wall of the filter element and the connecting portion, the base attaching portion of the holder being attached to the top surface of the molded base, and the filter attaching portion being held at the optical window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein another gap is formed between an inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole extending from one side to the other side of the connecting portion to be respectively communicated between an outer wall of the filter element and the connecting portion and the light passing channel formed between the outer wall of the molded base and the light passing channel.

According to one embodiment of the invention, the top surface of the molded base has at least one vent slot extending from a base inner surface to a base outer surface of the molded base to communicate the light window and the outside, wherein the vent slot forms the vent channel of the photosensitive device between the support and the top surface of the molded base after the support is attached to the top surface of the molded base.

According to one embodiment of the invention, the ventilation slot of the molded base extends curvedly.

According to one embodiment of the invention, the shape of the vent slot of the molded base is selected from: the shape group is composed of an L shape, an S shape, a V shape and a Y shape.

According to one embodiment of the invention, the molding base has at least a first groove extending from the base inner surface of the molding base toward the substrate outer surface, and at least a second groove extending from the base outer surface of the molding base toward the base inner surface, and the first groove and the second groove communicate with each other to form the groove of the molding base.

According to one embodiment of the invention, one of said first grooves and one of said second grooves are in communication with each other to form said groove of said molded base; or one of the first grooves and a plurality of the second grooves are in communication with each other to form the grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the groove of the molded base.

According to one embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface, an outer side surface and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, the ventilation hole extends from the upper surface to the lower surface of the support, wherein the top surface of the molded base has at least one ventilation groove extending from the base inner surface of the molded base toward the base outer surface to a proper position, wherein the ventilation hole of the support and the ventilation groove of the molded base communicate with each other to form the ventilation channel of the photosensitive device after the lower surface of the support is attached to the top surface of the molded base.

According to one embodiment of the present invention, the molding base has a first groove and a second groove, the first groove communicates with the second groove and the vent hole, respectively, and the second groove communicates with the sealed space, wherein a depth dimension of the first groove is larger than a depth dimension of the second groove.

According to one embodiment of the present invention, the camera module further includes at least one sealing member formed on and held in the ventilation channel.

According to one embodiment of the invention, the substrate is provided with a substrate front surface, a substrate back surface and at least one accommodating space, wherein the substrate front surface and the substrate back surface correspond to each other, the accommodating space extends from the substrate front surface to the substrate back surface, and the photosensitive device is accommodated in the accommodating space.

According to one embodiment of the invention, the substrate is provided with a substrate front surface, a substrate back surface and at least one containing space, wherein the substrate front surface and the substrate back surface correspond to each other, the containing space extends from the substrate front surface to the substrate back surface so as to be communicated with the substrate front surface and the substrate back surface, the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the substrate surrounds the periphery of the photosensitive area of the photosensitive element, so that the photosensitive area of the photosensitive element corresponds to the containing space of the substrate.

According to one embodiment of the invention, the molded base is integrally bonded to at least a portion of the non-photosensitive region of the photosensitive element; or the molded base is integrally bonded to the substrate.

According to one embodiment of the invention, the circuit board comprises at least one electronic component conductively connected to the substrate, wherein the molding base embeds at least a portion of at least one of the electronic components protruding from the front surface of the substrate.

According to one aspect of the present invention, the electronic device with a camera module is further provided, which includes a device body and at least one camera module disposed on the device body, wherein the camera module includes at least one optical lens and at least one photosensitive device, and the photosensitive device includes:

According to another aspect of the present invention, the present invention further provides an image capturing module, which includes at least one optical lens and at least one photosensitive device, wherein the photosensitive device includes:

at least one light filtering unit, wherein the light filtering unit comprises at least one support and at least one light filtering element, the support is provided with at least one light passing channel, at least one air passing channel and at least one second light passing space, the light passing channel and the air passing channel are respectively communicated with the second light passing space, the light filtering element is attached to the support, and the light passing channel of the support corresponds to the light filtering element; and

at least one molding part, wherein the molding part comprises at least one molding body and at least one first light-transmitting space, the molding body is integrally combined with the substrate, and the molding body forms at least the first light-transmitting space, wherein the support is attached to the molding body so that the first light-transmitting space and the second light-transmitting space are communicated with each other to form at least one sealed space between the light filtering unit and the molded photosensitive unit, the ventilation channel of the support is used for communicating the sealed space and the outside of the photosensitive device, wherein the photosensitive area of the photosensitive element is kept in the sealed space, wherein the optical lens is kept in a photosensitive path of the photosensitive element, and the light filtering element is kept between the optical lens and the photosensitive element.

According to one embodiment of the invention, the support comprises a support body and at least one extension arm integrally extending to the support body, the second light-passing space being formed between the support body and the extension arm, the light-passing channel being formed in the support body, the light-passing channel being formed in the extension arm, wherein the extension arm of the support is attached to the molded body of the molded part.

According to one embodiment of the present invention, the holder includes at least one holder body and at least one extension arm integrally extended to the holder body, the second light-passing space and at least one second installation space communicating with the second light-passing space are formed between the holder body and the extension arm, the light-passing channel is formed in the holder body, the air-passing channel is formed in the extension arm, wherein at least one first installation space is formed between adjacent molded bodies, wherein at least a portion of the extension arm of the holder is held in the first installation space of the molded body when the holder is attached to the molded body, and at least a portion of the molded body is held in the second installation space of the holder to form the sealed space between the filter unit and the molded photosensitive unit.

According to one embodiment of the invention, the molded body has an "I" shape and the extension arm has a "" shape; or the molded body is in a shape of , and the extension arm is in a shape of I; or the molded body is L-shaped, and the extension arm is L-shaped; or the two molding bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and the extension arm are both shaped like a Chinese character 'kou'.

According to one embodiment of the invention, the ventilation channel extends obliquely.

According to another aspect of the present invention, the electronic device with a camera module is further provided, which includes a device body and at least one camera module, wherein the camera module includes at least one optical lens and at least one photosensitive device, and the photosensitive device includes:

According to another aspect of the present invention, there is further provided a photosensitive device, comprising:

at least one molded base, wherein the molded base has at least one optical window, the molded base is integrally combined with the substrate, the molded base surrounds the periphery of the photosensitive area of the photosensitive element, and the photosensitive area of the photosensitive element corresponds to the optical window of the molded base, wherein the support is attached to the top surface of the molded base, and at least one sealed space is formed between the optical filter unit and the molded photosensitive unit, the photosensitive area of the photosensitive element is held in the sealed space, and the optical filter element is held in a photosensitive path of the photosensitive element;

According to one embodiment of the invention, the vent slot is stepped.

at least one molding part, wherein the molding part comprises at least one molding body and at least one first light-transmitting space, the molding body is integrally combined with the substrate, and the molding body forms at least the first light-transmitting space, wherein the support is attached to the molding body, so that the first light-transmitting space and the second light-transmitting space are communicated with each other to form at least one sealed space between the light filtering unit and the molded photosensitive unit, the ventilation channel of the support is used for communicating the sealed space and the outside of the photosensitive device, the photosensitive area of the photosensitive element is kept in the sealed space, and the light filtering element is kept in the photosensitive path of the photosensitive element.

According to another aspect of the present invention, there is further provided a support, wherein the support comprises an inner portion and an outer portion surrounding the inner portion, wherein the support further has at least one light-passing channel and at least one air-passing channel, the inner portion defines the light-passing channel, the air-passing channel extends from the outer portion to the inner portion, and the air-passing channel communicates the outer portion and the inner portion.

According to one embodiment of the invention, the ventilation channel extends curvedly.

According to one embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface and an outer side surface, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, wherein the upper surface and the outer side surface form an exposed surface of the outer side portion, and the lower surface and the inner side surface form an exposed surface of the inner side portion, wherein the ventilation passage extends from the upper surface to the lower surface of the holder.

According to one embodiment of the present invention, the support has an upper surface, a lower surface, an inner side surface and an outer side surface, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, wherein the upper surface and the outer side surface form an exposed surface of the outer side portion, and the lower surface and the inner side surface form an exposed surface of the inner side portion, wherein the ventilation passage extends from the upper surface of the support to the inner side surface of the support.

According to one embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one ventilation groove, and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, wherein the upper surface and the outer side surface form an exposed surface of the outer side portion, the lower surface and the inner side surface form an exposed surface of the inner side portion, wherein the ventilation hole extends from the upper surface toward the lower surface, the ventilation groove is formed at the lower surface, and the ventilation groove extends from the inner side toward the outer side surface, and the ventilation groove and the ventilation hole communicate with each other to form the ventilation passage.

According to one embodiment of the present invention, the vent groove has an open end and a communication end, a portion of the vent groove at the communication end is defined as a first vent groove, a portion of the vent groove at the open end is defined as a second vent groove, such that the first vent groove communicates the vent hole with the second vent groove, and a depth dimension of the first vent groove is greater than a depth dimension of the second vent groove.

According to one embodiment of the present invention, the parameter of the depth dimension of the vent groove is set to be H1, the parameter of the thickness dimension of the support is set to be H, and the ratio of the parameter H1 of the depth dimension of the vent groove to the parameter H of the thickness dimension of the support is set to have the following value range: 0.5 to 70 percent.

According to an embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface and an outer side surface, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to be connected to the upper surface and the lower surface, respectively, wherein the upper surface and the outer side surface form an exposed surface of the outer side portion, wherein the upper surface of the holder is used for mounting a filter element or the lower surface of the holder is used for mounting the filter element, and the light-passing channel of the holder corresponds to the filter element after the filter element is mounted to the upper surface or the lower surface of the holder, whereby the filter element closes the light-passing channel of the holder, wherein the lower surface of the holder is used for mounting a molded photosensitive unit, and the upper surface of the holder is held with an optical lens or a drive unit, wherein the molded unit comprises:

At least one electronic component;

at least one photosensitive element, wherein the photosensitive element is provided with a photosensitive area and a non-photosensitive area surrounding the photosensitive area;

at least one circuit board, wherein the circuit board comprises a substrate and a connecting plate connected to the front side or the back side of the substrate, wherein the connecting plate is a flexible connecting plate for being connected to a device body to form an electronic device, wherein the photosensitive element is conductively connected to the substrate through a group of connecting wires, or the photosensitive element is conductively connected to the substrate through being attached to the substrate, and the electronic component is attached to or semi-embedded in the front side and/or the back side of the substrate; and

a molded base, wherein the molded base has at least one optical window, wherein the molded base is integrally bonded to the substrate front surface of the substrate, or the molded base is integrally bonded to a portion of the substrate front surface of the substrate and the non-photosensitive region of the photosensitive element, or the molded base is integrally bonded to the substrate front surface of the substrate and the electronic component, or the molded base is integrally bonded to the substrate front surface of the substrate and a portion of the non-photosensitive region of the electronic component and the photosensitive element, and the molded base surrounds the periphery of the photosensitive region of the photosensitive element such that the photosensitive region of the photosensitive element corresponds to the optical window of the molded base, wherein the lower surface of the mount is attached to a top surface of the molded base such that the filter element is held in a photosensitive path of the photosensitive element, wherein the driver is attached to the upper surface of the mount, or the driver is attached to the top surface of the mount, and the driver is attached to the lens barrel such that the filter element is held in a photosensitive path between the photosensitive element and the top surface of the molded base.

at least one filter element;

at least one support, wherein the support comprises an inner side and an outer side surrounding the inner side, wherein the support further has at least one light-passing channel and at least one air-passing channel, the inner side defines the light-passing channel, the air-passing channel extends from the outer side to the inner side, and the air-passing channel communicates the outer side and the inner side, wherein the optical filter element is attached to the outer side or the inner side of the support, and the light-passing channel of the support corresponds to the optical filter element;

at least one circuit board, wherein the circuit board is provided with at least one substrate, and the photosensitive element is connected to the substrate in a conductive manner; and

at least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive area of the photosensitive element such that the photosensitive area of the photosensitive element corresponds to the light window of the molded base, wherein at least a portion of the inner side of the holder is attached to a top surface of the molded base, or at least a portion of the outer side of the holder is attached to a top surface of the molded base to form at least one sealed space between the filter element, the holder, the substrate, and the molded base, wherein the photosensitive element is held in the sealed space, and wherein the ventilation passage of the holder is used to communicate the sealed space with an outside of the photosensitive device.

According to another aspect of the present invention, the present invention further provides an image capturing module, which includes at least one optical lens and at least one photosensitive device, wherein the photosensitive device further includes:

at least one filter element;

at least one molded base, wherein the molded base has at least one optical window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the photosensitive region of the photosensitive element such that the photosensitive region of the photosensitive element corresponds to the optical window of the molded base, wherein at least a portion of the inner side of the mount is attached to a top surface of the molded base, or at least a portion of the outer side of the mount is attached to a top surface of the molded base to form at least one sealed space between the filter element, the mount, the substrate, the molded base, wherein the photosensitive element is held in the sealed space, wherein the ventilation passage of the mount is for communicating the sealed space with an outside of the photosensitive device, wherein the optical lens is held in a photosensitive path of the photosensitive element of the photosensitive device, and the filter element is held between the optical lens and the photosensitive element.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation slot, and at least one light-passing channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side is used for defining the light-passing channel, wherein a region of the lower surface near the light window is defined as a non-painted area, a region of the lower surface far from the light window is defined as a painted area surrounding the non-painted area, and the non-painted area extends inward to connect to the inner side, and the painted area extends outward to connect to the outer side, wherein the ventilation slot is provided on the lower surface, and the ventilation slot extends from the outer side to the inner side to a proper position in a direction of the non-painted area via the painted area.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation slot, and at least one light-passing channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side is used for defining the light-passing channel, wherein a region of the lower surface near the light window is defined as a non-painted area, a region of the lower surface far from the light window is defined as a painted area surrounding the non-painted area, and the non-painted area extends inward to connect to the inner side, and the painted area extends outward to connect to the outer side, wherein the ventilation slot is provided on the lower surface, and the ventilation slot extends from the outer side to the outer side sequentially via the painted area and the non-painted area.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation slot, and at least one ventilation channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side is for defining the ventilation channel, wherein the ventilation slot is provided at the outer side, and the ventilation slot extends from the upper surface to the lower surface.

According to one embodiment of the invention, the vent slot forms at least one vent channel between the outer side of the support and the base inner surface of a molded base after the outer side of the support is attached to the base inner surface of the molded base.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation slot, and at least one light-passing channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side is for defining the light-passing channel, wherein the ventilation slot is provided on the upper surface, and the ventilation slot extends from the inner side to the outer side to a proper position.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation slot, and at least one ventilation channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side is used for defining the ventilation channel, wherein the ventilation slot is provided on the upper surface, and the ventilation slot extends from the inner side to the outer side.

According to another aspect of the present invention, there is further provided a holder, wherein the holder has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation groove, and at least one ventilation channel, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side is for defining the ventilation channel, wherein a portion of the upper surface adjacent to the light window is defined as an upper surface inside, a portion of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein a portion of the inner side adjacent to the upper surface is defined as an inner side upper side, a portion of the inner side adjacent to the lower surface is defined as an inner side lower side, wherein the inner side upper side extends upward and downward to connect to the upper surface inside, the inner side and the upper side is connected to the upper side and the lower side, and the inner side extends from the upper side and the lower side to the inner side, and the inner side is connected to the inner side and the inner side.

According to another aspect of the present invention, there is further provided a stand, wherein the ventilation slot extends curvedly.

According to one embodiment of the invention, the vent slot forms at least one vent channel between the lower surface of the support and the top surface of a molded base after the glue area of the support is attached to the top surface of the molded base.

According to one embodiment of the invention, the vent slot forms at least one vent channel between a filter element and the upper surface of the support after the filter element is attached to the upper surface of the support.

at least one sealing element;

at least one molded base, wherein the molded base has at least one optical window, the molded base is integrally combined with the substrate, and the molded base surrounds the photosensitive area of the photosensitive element, and the photosensitive area of the photosensitive element corresponds to the optical window of the molded base, wherein the support is attached to the top surface of the molded base, and at least one sealed space is formed between the optical filtering unit and the molded photosensitive unit, and the photosensitive area of the photosensitive element is held in the sealed space;

wherein the photosensitive device has at least one ventilation passage for communicating the sealed space with the outside of the photosensitive device, wherein the ventilation passage is for exchanging gas inside the sealed space with gas outside the photosensitive device to balance the gas pressure inside the sealed space and the gas pressure outside the photosensitive device during the process of manufacturing the photosensitive device, wherein the sealing member is held in the ventilation passage.

According to one embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one ventilation hole, and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side surface defines the ventilation channel, wherein the ventilation hole extends from the upper surface toward the lower surface, the ventilation groove is formed in the lower surface, and the ventilation groove extends from the inner side surface toward the outer side surface, wherein the ventilation hole and the ventilation groove communicate with each other to form the ventilation channel of the photosensitive device, wherein the sealing member is held at the ventilation hole.

According to one embodiment of the present invention, the holder has an upper surface, a lower surface, an inner side, an outer side, and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side defines the ventilation channel, wherein the ventilation groove is formed at the lower surface, and the ventilation groove extends from the inner side to the outer side, wherein after the lower surface of the holder is attached to the top surface of the mold base, the ventilation groove forms the ventilation channel of the photosensitive device between the holder and the mold base, wherein the sealing member is held at the ventilation groove.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defines the ventilation channel, wherein the area of the lower surface close to the light window is defined as a non-picture glue area, and the area of the lower surface remote from the light window is defined as a picture glue area surrounding the non-picture glue area, wherein the ventilation groove is formed at the lower surface, and the ventilation groove extends from the outer side to a suitable position of the non-picture glue area via the picture glue area, wherein the ventilation groove forms a ventilation channel between the support and the base of the lower surface of the support after the picture glue area of the lower surface of the support is attached to the top surface of the molded base, wherein the ventilation groove is formed between the ventilation channel.

According to one embodiment of the invention, the holder has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defining the light-passing channel, wherein the area of the lower surface close to the light window is defined as a non-glue-drawing area, and the area of the lower surface remote from the light window is defined as a glue-drawing area surrounding the non-glue-drawing area, wherein the ventilation hole extends from the upper surface to the non-glue-drawing area of the lower surface of the holder, wherein the glue-drawing area of the lower surface of the holder is attached to the top surface of the molded base, the ventilation hole of the holder forms the ventilation channel of the light-sensing device, wherein the sealing element is held at the ventilation hole.

According to one embodiment of the invention, the holder has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side defines the ventilation channel, wherein the ventilation groove is formed in the upper surface of the holder, and the ventilation groove extends from the inner side toward the outer side, wherein the filter element is attached to the upper surface of the holder, and the filter element leaves a portion of the ventilation groove exposed, wherein the ventilation groove of the holder forms the ventilation channel of the photosensitive device between the filter element and the holder after the lower surface of the holder is attached to the top surface of the molded base, wherein the sealing element is held in the ventilation groove.

According to one embodiment of the invention, the holder has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation slot, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side defines the ventilation channel, wherein a region of the upper surface near the light window is defined as an inner side of the upper surface, and a region of the upper surface remote from the light window is defined as an outer side of the upper surface surrounding the inner side of the upper surface, wherein the inner side has an upper side of the inner side and a lower side of the inner side, the inner side upper side extends upward and downward to connect to the upper surface outside and the upper surface inside, respectively, the inner side lower side extends upward and downward to connect to the upper surface inside and the lower surface, respectively, wherein the ventilation groove is provided inside the upper surface, and the ventilation groove extends from the inner side lower side to the inner side upper side, wherein the filter element is attached to the upper surface inside of the holder, and a gap is formed between a side wall of the filter element and the inner side upper side, the ventilation groove of the holder and the gap communicate with each other to form the ventilation channel of the photosensitive device, wherein the lower surface of the holder is attached to the top surface of the mold base, wherein the sealing element is held at the gap.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the inner side defines the light-passing channel, wherein the area of the upper surface close to the light window is defined as an upper surface inside, and the area of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein the inner side has an inner side upper side and an inner side lower side, the inner side upper side extends upwards and downwards to connect to the upper surface inside and the lower surface inside, respectively, wherein the ventilation hole extends from the upper surface inside to the lower surface inside, wherein the filter element is formed to the support, and the ventilation hole is formed to the upper surface inside the support, wherein the ventilation hole is formed to the upper surface and the side of the support is formed to be in contact with the side of the filter element, and the ventilation hole is formed to the side of the support, wherein the ventilation hole is formed to the filter element is formed to the side of the support.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side, at least one ventilation groove and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side extend upwards and downwards respectively to connect to the upper surface and the lower surface, the inner side defines the light passage, wherein the area of the upper surface close to the light window is defined as an upper surface inside, and the area of the upper surface remote from the light window is defined as an upper surface outside surrounding the upper surface inside, wherein the inner side has an inner side upper side and an inner side lower side, the inner side upper side extends upwards and downwards respectively to connect to the upper surface inside and the lower surface inside, the groove extends from the upper surface to the lower surface inside, the ventilation groove is formed to the ventilation groove and the ventilation groove is formed to the support, wherein the ventilation groove is connected to the ventilation groove.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion, and a filter attaching portion, the connecting portion extending upward and downward to be connected to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defining the light passing channel, the filter element is attached to the filter attaching portion of the holder, and a slit is formed between an outer wall of the filter element and the connecting portion, wherein the base attaching portion of the holder is attached to the top surface of the molded base, and the filter attaching portion is held at the light window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the filter attaching portion, and the light passing hole communicates with the slit at the upper surface of the filter attaching portion to form the light sensing device, wherein the light passing channel is held at the slit sealing element.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion and a filter attaching portion, the connecting portion extending upward and downward to connect to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defines the light passing channel, the filter element is attached to the filter attaching portion of the holder, the base attaching portion of the holder is attached to the top surface of the molded base, and the filter attaching portion is held at the light window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein a slit is formed between a base inner surface of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole, wherein the light passing hole extends from an upper surface to a lower surface of the base attaching portion, and the light passing hole communicates with the slit at a lower surface of the base attaching portion to form the slit, wherein the light passing hole of the device is held at the light passing channel.

According to an embodiment of the present invention, the holder includes a base attaching portion, a connecting portion and a filter attaching portion, the connecting portion extending upward and downward to be connected to the base attaching portion and the filter attaching portion, respectively, the filter attaching portion defining the light passing channel, the filter element being attached to the filter attaching portion of the holder and forming a gap between an outer wall of the filter element and the connecting portion, the base attaching portion of the holder being attached to the top surface of the molded base, and the filter attaching portion being held at the optical window of the molded base such that the molded base surrounds the filter attaching portion of the holder, wherein another gap is formed between an inner surface of the base of the molded base and the connecting portion of the holder, wherein the holder has at least one light passing hole extending from one side to the other side of the connecting portion to be respectively communicated between an outer wall of the filter element and the connecting portion and forming a light passing channel between the outer wall of the molded base and the connecting portion, and the light passing device being held between the outer wall of the molded base and the connecting portion, and the light passing channel being formed between the outer wall of the molded base and the light passing device.

According to one embodiment of the invention, the top surface of the molded base has at least one vent channel extending from a base inner surface to a base outer surface of the molded base to communicate the light window and the outside, wherein the vent channel forms the vent channel of the photosensitive device between the support and the top surface of the molded base after the support is attached to the top surface of the molded base, wherein the sealing element is held at the vent channel of the molded base.

According to one embodiment of the invention, the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upwards and downwards to connect to the upper surface and the lower surface, respectively, the ventilation hole extends from the upper surface to the lower surface of the support, wherein the top surface of the molded base has at least one ventilation groove extending from the base inner surface of the molded base towards the base outer surface to a proper position, wherein after the lower surface of the support is attached to the top surface of the molded base, the ventilation hole of the support and the ventilation groove of the molded base communicate with each other to form the ventilation channel of the photosensitive device, wherein the sealing element is held at the ventilation hole of the support.

According to another aspect of the present invention, the present invention further provides an image capturing module, which includes:

at least one optical lens; and

at least one photosensitive device, wherein the photosensitive device further comprises:

at least one sealing element;

Wherein the photosensitive device has at least one ventilation passage for communicating the sealed space with the outside of the photosensitive device, wherein the ventilation passage is for exchanging gas inside the sealed space with gas outside the photosensitive device to balance the gas pressure inside the sealed space and the gas pressure outside the photosensitive device during the manufacturing of the photosensitive device, wherein the sealing member is held in the ventilation passage, wherein the optical lens is held in a photosensitive path of the photosensitive member, and the filter member is held between the optical lens and the photosensitive member.

According to another aspect of the present invention, there is further provided a support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one flash groove, at least one vent groove, and at least one vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side is for defining the light passing channel, wherein the flash groove and the vent groove are provided on the lower surface respectively, and the vent groove communicates with the light passing channel and the flash groove, wherein the vent hole extends from the upper surface to the lower surface, and the vent hole communicates with the flash groove.

According to one embodiment of the invention, the area of the lower surface close to the optical window is defined as a non-glue-drawing area, the area of the lower surface far away from the optical window is defined as a glue-drawing area surrounding the periphery of the non-glue-drawing area, the non-glue-drawing area extends inwards to connect the inner side surface, the glue-drawing area extends outwards to connect the outer side surface, wherein the air exhaust groove extends from the inner side surface to the glue-drawing area, and the glue overflow groove is communicated with the air exhaust groove and the vent hole in the non-glue-drawing area.

According to one embodiment of the invention, the area of the lower surface close to the optical window is defined as a non-photoresist-drawing area, the area of the lower surface far away from the optical window is defined as a photoresist-drawing area surrounding the periphery of the non-photoresist-drawing area, the non-photoresist-drawing area extends inwards to connect the inner side surface, the photoresist-drawing area extends outwards to connect the outer side surface, wherein the air exhaust groove extends from the inner side surface to the photoresist-drawing area, the photoresist overflow groove is communicated with the air exhaust groove in the non-photoresist-drawing area, and is communicated with the light through hole in the photoresist-drawing area.

According to one embodiment of the invention, the depth dimension of the glue overflow groove is larger than the depth dimension of the exhaust groove.

According to one embodiment of the invention, the depth dimension of the glue overflow groove is 0.1mm, and the depth dimension of the exhaust groove is 0.03mm.

According to one embodiment of the present invention, the parameter of the width dimension of the glue overflow groove is set as W, and the parameter of the diameter dimension of the lower end of the vent hole is set as R, wherein the ratio of the width dimension of the glue overflow groove to the diameter dimension of the lower end of the vent hole has a value ranging from: 2:1-1:1.

According to one embodiment of the invention, the inner side of the abutment extends obliquely.

at least one filter element;

at least one support, wherein the support has an upper surface, a lower surface, an inner side surface, an outer side surface, at least one glue overflow groove, at least one air vent groove, and at least one air vent hole, wherein the upper surface and the lower surface correspond to each other, the inner side surface and the outer side surface correspond to each other, and the inner side surface and the outer side surface extend upward and downward respectively to be connected to the upper surface and the lower surface, the inner side surface is used for defining the light-passing channel, wherein the glue overflow groove and the air vent groove are respectively provided on the lower surface, and the air vent groove is communicated with the light-passing channel and the glue overflow groove, wherein the air vent hole extends from the upper surface to the lower surface direction, and the air vent hole is communicated with the glue overflow groove, wherein the light-filtering element is attached to the upper surface or the lower surface of the support, and the light-passing channel of the support corresponds to the light-filtering element;

at least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the light sensing region of the light sensing element such that the light sensing region of the light sensing element corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the support is attached to a top surface of the molded base to form at least one sealed space between the light filtering element, the support, the substrate, and the molded base, wherein the light sensing element is held in the sealed space, wherein the vent groove of the support, the flash groove, and the vent hole form at least one vent channel for communicating the sealed space with an outside of the light sensing device.

at least one filter element;

at least one molded base, wherein the molded base has at least one light window, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the light sensing region of the light sensing element such that the light sensing region of the light sensing element corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the holder is attached to a top surface of the molded base to form at least one sealed space between the light filtering element, the holder, the substrate, and the molded base, wherein the light sensing element is held in the sealed space, wherein the vent groove of the holder, the flash groove, and the vent hole form at least one vent passage for communicating the sealed space with an outside of the light sensing device, wherein the optical lens is held in a light sensing path of the light sensing element, and the light filtering element is held between the optical lens and the light sensing element.

at least one filter unit, wherein the filter unit comprises at least one filter element and at least one support, wherein the support has an upper surface, a lower surface, an inner side, an outer side, at least one light-passing channel, and at least one vent, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side defines the light-passing channel, the vent extends from the upper surface to the lower surface, wherein the filter element is attached to the support, and the light-passing channel of the support corresponds to the filter element; and

At least one molded base, wherein the molded base has at least one light window, at least one ventilation groove, at least one base inner surface, a base outer surface, and a top surface, wherein the base inner surface is for defining the light window, the top surface extends inward and outward to be connected to the base inner surface and the base outer surface, respectively, the ventilation groove is provided at the top surface, and the ventilation groove extends from the base inner surface to the base outer surface direction to a proper position, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds the periphery of the light-sensing region of the photosensitive element, and the light-sensing region of the photosensitive element corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the support is attached to the top surface of the molded base, and at least one sealing space is formed between the light filter unit and the molded light-sensing unit, the light-sensing region of the photosensitive element is held in the sealing space, wherein the ventilation hole of the support and the molded base are in communication with each other to form at least one ventilation channel for the ventilation channel.

According to one embodiment of the invention, the molded base has at least a first groove and at least a second groove, the first groove is communicated with the second groove and the vent hole of the support, the second groove is communicated with the sealing space, wherein the depth dimension of the first groove is larger than the depth dimension of the second groove.

According to one embodiment of the invention, the molded photosensitive cell includes at least one electronic component, wherein the electronic component is conductively coupled to the substrate.

According to one embodiment of the invention, the molding base embeds at least a portion of at least one of the electronic components protruding from the substrate front side of the substrate.

According to one embodiment of the invention, the circuit board comprises at least one connection board having a module connection end and a device connection end corresponding to the module connection end, wherein the module connection end of the connection board is conductively connected to the substrate front surface or the substrate back surface of the substrate, or the module connection end of the connection board integrally extends to and is conductively connected to the substrate.

According to one embodiment of the present invention, the substrate has at least one mounting region and at least one connection line, the photosensitive element is mounted on the mounting region of the substrate, and both ends of the connection line are conductively connected to a substrate connector of the substrate and a chip connector of the photosensitive element, respectively, to conductively connect the photosensitive element and the substrate.

According to one embodiment of the present invention, the substrate has at least one accommodation space extending from a substrate front surface of the substrate toward a substrate back surface, the photosensitive element is held in the accommodation space, and at least one connection line, both end portions of which are conductively connected to a substrate connection member of the substrate and a chip connection member of the photosensitive element, respectively, to conductively connect the photosensitive element and the substrate.

According to an embodiment of the present invention, the photosensitive device further includes a sealing member, wherein the sealing member is formed at the vent hole of the support, and the sealing member is held at the vent hole of the support.

According to another aspect of the present invention, there is further provided an image capturing module, which includes at least one optical lens and at least one photosensitive device, wherein the photosensitive device further includes:

at least one molded base, wherein the molded base has at least one light window, at least one ventilation groove, at least one base inner surface, a base outer surface, and a top surface, wherein the base inner surface is for defining the light window, the top surface extends inward and outward to be connected to the base inner surface and the base outer surface, respectively, the ventilation groove is provided at the top surface, and the ventilation groove extends from the base inner surface toward the base outer surface to a proper position, wherein the molded base is integrally bonded to the substrate, and the molded base surrounds around the light-sensing region of the light-sensing element, and the light-sensing region of the light-sensing element corresponds to the light window of the molded base, wherein at least a portion of the lower surface of the mount is attached to the top surface of the molded base, and at least one sealing space is formed between the light-filtering unit and the molded light-sensing unit, the light-sensing region of the light-sensing element is held in the sealing space, wherein the light-passing hole of the mount and the light-sensing element are held in communication with each other in the direction of the base outer surface, and the ventilation groove is held in communication with the light-sensing element, wherein the light-sensing element is held in the light-sensing channel by the light-sensing element, and the light-sensing element is held in communication with the light-sensing channel.

Drawings

Fig. 1 is a schematic view illustrating an application state of an image capturing module according to a preferred embodiment of the present invention.

Fig. 2 is a schematic perspective view of the camera module according to the above preferred embodiment of the present invention.

Fig. 3 is an exploded view of the camera module according to the above preferred embodiment of the present invention.

Fig. 4A is a schematic view of the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 4B is a schematic view of an internal structure of the camera module according to the above preferred embodiment of the present invention, which is taken along the middle position.

Fig. 5 is an enlarged schematic view of a partial position of fig. 4A.

Fig. 6A is a perspective view of a stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 6B is a schematic perspective view of another view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of one of the manufacturing steps of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.

Fig. 8A and 8B are schematic cross-sectional views of a second step of the manufacturing process of the camera module according to the preferred embodiment of the invention.

FIG. 9 is a schematic cross-sectional view of a third manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the invention.

FIG. 10 is a schematic cross-sectional view of a fourth manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view of a fifth manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view of a sixth manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 13A and 13B are schematic cross-sectional views of seventh manufacturing steps of the manufacturing process of the image capturing module according to the preferred embodiment of the present invention.

Fig. 14 is a schematic cross-sectional view of an eighth manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 15 is a schematic cross-sectional view of a ninth manufacturing step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 16 is a schematic cross-sectional view of the manufacturing steps of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 17A to 17C are schematic cross-sectional views of eleven manufacturing steps of the above manufacturing process of the image capturing module according to the above preferred embodiment of the present invention.

Fig. 18 is a schematic cross-sectional view of twelve manufacturing steps of the manufacturing process of the camera module according to the preferred embodiment of the invention.

Fig. 19 is a schematic cross-sectional view of thirteen manufacturing steps of the manufacturing process of the camera module according to the preferred embodiment of the present invention.

Fig. 20A is a schematic view of the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 20B is a schematic view of an internal structure of the camera module according to a modified embodiment of the present invention, which is cut along the middle position.

Fig. 21 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 22 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 23 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 24 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 25 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 26 is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 27A is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 27B is a schematic view of an internal structure of the camera module according to another variant of the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 28A and 28B are schematic views of a variant implementation of a stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 29A and 29B are schematic views of another variant implementation of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 30 is a schematic perspective view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 31 is an exploded view of the camera module according to the above preferred embodiment of the present invention.

Fig. 32 is a schematic view of the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 33 is an enlarged schematic view of a part of the position of fig. 32.

Fig. 34A is a perspective view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 34B is a perspective view of another view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 34C is a schematic top view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 35 is a schematic view of a variant implementation of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 36 is a schematic view of a variant of the molded circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

Fig. 37 is an enlarged partial view of an internal structure of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 38A is a schematic view of an internal structure of the support of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 38B is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 38C is a schematic view of an internal structure of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 38D is an enlarged schematic view of the partial position of fig. 38C.

Fig. 39A is a schematic perspective view of a variant of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 39B is a schematic view of the internal structure of the support of the camera module according to the above-mentioned modified embodiment of the present invention, which is cut along the middle position.

Fig. 39C is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 39D is a schematic view of an internal structure of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 39E is an enlarged schematic view of the partial position of fig. 39D.

Fig. 40A is a schematic perspective view of a variant implementation of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 40B is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 40C is a schematic view illustrating an internal structure of the camera module according to a modified embodiment of the present invention, which is cut along the middle position.

Fig. 40D is an enlarged schematic view of the partial position of fig. 39C.

Fig. 41 is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 42A is a perspective view of a variant of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 42B is a schematic perspective view of another view of the variant embodiment of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 42C is a schematic view of the internal structure of the support of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 42D is a schematic diagram illustrating an internal structure of the camera module according to the above preferred embodiment of the invention after a filter unit is cut along the middle position.

Fig. 42E is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 42F is a schematic view illustrating an internal structure of the camera module according to a modified embodiment of the present invention, which is cut along the middle position.

Fig. 42G is an enlarged schematic view of a partial position of fig. 42F.

Fig. 43A and 43B are schematic internal structures of the photosensitive device of the camera module according to the above preferred embodiment of the present invention, which are cut along the middle position.

Fig. 44 is a schematic view of an internal structure of the photosensitive device of the camera module according to the above-mentioned preferred embodiment of the present invention, which is cut along the middle position.

Fig. 45 is a schematic perspective view of a variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 46 is an exploded view of the camera module according to the above preferred embodiment of the present invention.

Fig. 47 is a schematic view of the internal structure of the camera module according to the above preferred embodiment of the present invention, which is cut along the middle position.

Fig. 48 is an enlarged schematic view of the partial position of fig. 47.

Fig. 49A is a perspective view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 49B is a perspective view of another view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 49C is a schematic cross-sectional view of the stand of the camera module according to the above preferred embodiment of the present invention.

Fig. 50 is an exploded view of a variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 51 is an exploded view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 52 is an exploded view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 53 is an exploded view of another variant of the camera module according to the above preferred embodiment of the present invention.

Fig. 54 is an exploded view of another variant of the camera module according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Referring to fig. 1 of the drawings, an electronic device according to a preferred embodiment of the present invention is described, wherein the electronic device includes at least one camera module 100 and a device body 200, and the camera module 100 is disposed on the device body 200 to help the device body 200 obtain an image (e.g. video or image).

It should be noted that, although in the example of the electronic apparatus shown in fig. 1, the camera module 100 is disposed on the back side of the apparatus body 200 (the side facing away from the display screen of the apparatus body 200), it is understood that the camera module 100 may be disposed on the front side of the apparatus body 200 (the side on which the display screen of the apparatus body 200 is located), or at least one of the camera modules 100 may be disposed on the back side of the apparatus body 200 and at least one of the camera modules 100 may be disposed on the front side of the apparatus body 200, i.e., at least one of the camera modules 100 may be disposed on both the back side and the front side of the apparatus body 200. However, it will be appreciated by those skilled in the art that in other examples of the electronic apparatus, it is also possible to provide one or more of the camera modules 100 on the side of the apparatus body 200.

In addition, the type of the camera module 100 is not limited in the electronic device of the present invention, although the camera module 100 is implemented as a single-lens camera module in the example shown in fig. 1, and in other examples, the camera module 100 may be implemented as an array camera module, such as, but not limited to, a dual-lens camera module.

In addition, although the device body 200 of the electronic device shown in fig. 1 is a smart phone, in other examples, the device body 200 may be implemented as, but is not limited to, a tablet computer, an electronic book, MP3/4/5, a personal digital assistant, a camera, a television, a washing machine, a refrigerator, etc. any electronic product capable of being configured with the camera module 100.

Referring to fig. 2 to 6B of drawings, the camera module according to a preferred embodiment of the present invention is described in the following description, wherein the camera module 100 comprises at least one optical lens 10 and at least one molded photosensitive unit 20, wherein the molded photosensitive unit 20 further comprises at least one circuit board 21, at least one photosensitive element 22 and at least one molded base 23, wherein the photosensitive element 22 is conductively connected to the circuit board 21, and the molded base 23 is integrally coupled to the circuit board 21, wherein the optical lens 10 is held in a photosensitive path of the photosensitive element 22. The molding base 23 forms at least one light window 231 while being integrally coupled to the circuit board 21, wherein the light window 231 forms a light path between the optical lens 10 and the photosensitive element 22.

The camera module 100 further comprises at least one filter unit 30, wherein the filter unit 30 comprises at least one filter element 31, wherein the filter element 31 is held between the optical lens 10 and the photosensitive element 22. Light reflected by an object can be filtered by the filter element 31 after entering the inside of the camera module 100 from the optical lens 10, and then received by the photosensitive element 22 after passing through the light window 231 of the molding base 23 and subjected to photoelectric conversion to be imaged.

It should be noted that the type of the filter element 31 of the filter unit 30 is not limited in the camera module 100 of the present invention, and for example, the filter element 31 may be, but not limited to, an infrared cut filter, a full-transparent spectrum filter.

The circuit board 21 of the molded photosensitive unit 20 can be connected to the apparatus body 200, for example, the circuit board 21 of the molded photosensitive unit 20 and the apparatus body 200 can be electrically connected so that the image pickup module 100 is mounted and connected to the apparatus body 200. The digital signal of the image of the object obtained after the photoelectric conversion by the photosensitive element 22 can be subsequently transmitted to the device body 200, for example, but not limited to, can be stored in a memory of the device body 200, can be stored to a cloud through the device body 200, or can be displayed on a display screen of the device body 200. Preferably, after the digital signal about the image of the object obtained after the photoelectric conversion by the photosensitive element 22 is transmitted to the apparatus body 200, the digital signal can be displayed on the display screen of the apparatus body 200 while being stored in the memory or the cloud.

Further, the circuit board 21 further comprises at least one substrate 211 and at least one connection board 212, wherein the photosensitive element 22 is conductively connected to the substrate 211, wherein the connection board 212 has a module connection 2121 and a device connection 2122 corresponding to the module connection 2121, wherein the module connection 2121 of the connection board 212 is conductively connected to the substrate 211, and the device connection 2122 of the connection board 212 is electrically connected to the device body 200.

In one embodiment, the module connection 2121 of the connection board 212 is attached to the substrate 211 by a connection medium 2123, for example, the module connection 2121 of the connection board 212 can be attached to the substrate 211 by, but not limited to, anisotropic conductive adhesive, so that the module connection 2121 of the connection board 212 is conductively connected to the substrate 211. In other words, the connection medium 2123 can be implemented as, but is not limited to, an anisotropic conductive paste. Alternatively, the module connection end 2121 of the connection plate 212 integrally extends to the base plate 211, i.e., the connection plate 212 and the base plate 211 are of a unitary structure.

In addition, the connection plate 212 includes a connector 2124, wherein the connector 2124 is provided to the device connection end 2122 of the connection plate 212, or the connector 2124 is formed to the device connection end 2122 of the connection plate 212, wherein the device connection end 2122 of the connection plate 212 can be conveniently electrically connected to the device body 200 through the connector 2124 of the connection plate 212.

It should be noted that the connection board 212 is soft and can deform, wherein the camera module 100 is connected to the device body 200 through the connection board 212, in this way, the connection board 212 can buffer the assembly displacement and deformation caused by the manufacturing tolerance of the camera module 100 and the displacement of the camera module 100 caused by vibration during the use of the device body 200, so as to ensure the reliability of the electronic device during the use.

The substrate 211 has a substrate front side 2111 and a substrate back side 2112, wherein the substrate front side 2111 and the substrate back side 2112 correspond to each other. Typically, the substrate 211 is flat such that the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 are planar, such that the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 define a thickness dimension of the substrate 211. That is, the distance dimension between the substrate front surface 2111 and the substrate back surface 2112 of the substrate 211 is the thickness dimension of the substrate 211. Alternatively, the substrate front surface 2111 or the substrate back surface 2112 of the substrate 211 may be provided with a groove, for example, the groove may be provided at an edge of the substrate front surface 2111 or the substrate back surface 2112 of the substrate 211 for accommodating the module connection end 2121 of the connection board 212, so that a height difference between the module connection end 2121 of the connection board 212 and the substrate front surface 2111 of the substrate 211 or a height difference between the module connection end 2121 of the connection board 212 and the substrate back surface 2112 of the substrate 211 can be reduced. For example, when the module connection end 2121 of the connection plate 212 is connected to the substrate front surface 2111 of the substrate 211, the module connection end 2121 of the connection plate 212 may be received in the recess of the substrate 211 to avoid the module connection end 2121 of the connection plate 212 protruding from the substrate front surface 2111 of the substrate 211.

Referring to fig. 4A, the substrate 211 further has at least one flat mounting area 2113 and an edge area 2114 surrounding the mounting area 2113, wherein the mounting area 2113 and the edge area 2114 are formed on the front surface 2111 of the substrate 211, respectively. The photosensitive element 22 has a photosensitive region 221 and a non-photosensitive region 222 surrounding the photosensitive region 221, wherein the photosensitive element 22 is mounted on the mounting region 2113 of the substrate 211, wherein the molding base 23 is integrally bonded to at least a portion of the edge region 2114 of the substrate 211, and the molding base 23 surrounds the photosensitive region 221 of the photosensitive element 22 such that the photosensitive region 221 of the photosensitive element 22 corresponds to the light window 231 of the molding base 23. It will be appreciated that the molding base 23 extends upward from the substrate front surface 2111 of the substrate 211, and may form an annular light wall 26 surrounding the photosensitive region 221 of the photosensitive element 22, and the light wall 26 forms the light window 231 at a position corresponding to the photosensitive region 221 of the photosensitive element 22, so that the light is received by the photosensitive region 221 of the photosensitive element 22 and photoelectrically converted to form an image after passing through the light window 231.

In addition, the molded base 23 has a top surface 232, a base inner surface 234 and a base outer surface 235, wherein the base inner surface 234 is used to form the optical window 231, the base outer surface 235 is exposed outside the molded base 23, and the top surface 232 extends inwardly and outwardly to be connected to the base inner surface 234 and the base outer surface 235, respectively. The mold base 23 may be formed by a molding process, such as, but not limited to, transfer molding or compression molding, and the mold base 23 may be formed by a molding process having a higher flatness of the top surface 232 of the mold base 23 to facilitate improving the optical performance of the camera module 100.

Further, the base inner surface 234 of the molding base 23 is obliquely extended so that the cross section of the optical window 231 of the molding base 23 is inverted trapezoidal, in such a manner that stray light can be effectively avoided to improve the optical performance of the camera module 100. In other words, the light window 231 of the molding base 23 has an upper opening 2311 and a lower opening 2312 corresponding to the upper opening 2311, wherein the photosensitive region 221 of the photosensitive element 22 is held at the lower opening 2312 of the light window 231, the upper opening 2311 is directed toward the optical lens 10, i.e., an opening of the light window 231 on a side near the substrate 211 is defined as the lower opening 2312, and an opening of the light window 231 on a side near the optical lens 10 is defined as the upper opening 2311, wherein the size of the upper opening 2311 is larger than that of the lower opening 2312, in such a manner that stray light can be effectively avoided to improve the optical performance of the image pickup module 100.

In general, the substrate 211 has a good hardness to ensure flatness of the substrate 211, in such a manner that flatness of the photosensitive element 22 can be ensured after the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211. For example, the substrate 211 may be, but is not limited to, a hard board, a hard-soft bonded board, a ceramic substrate, etc. After the mold base 23 is integrally bonded to the substrate 211, the mold base 23 can also reinforce the strength of the substrate 211 to make the substrate 211 more flat. In addition, the molding base 23 has good heat dissipation, and when the heat generated by the photosensitive element 22 is transferred to the substrate 211, the molding base 23 can rapidly radiate the heat transferred to the substrate 211 to the external environment of the camera module 100, so that the stability and reliability of the camera module 100, which is used for a long time, can be ensured.

Further, the molded photosensitive unit 20 further includes at least one connection line 24, wherein both end portions of the connection line 24 are conductively connected to the photosensitive element 22 and the substrate 211, respectively, so that the photosensitive element 22 mounted to the mounting region 2113 of the substrate 211 is conductively connected to the substrate 211 through the connection line 24.

Specifically, the substrate 211 further has at least one substrate connector 2115, wherein each of the substrate connectors 2115 is disposed at the edge region 2114 of the substrate 211, respectively. For example, the substrate connectors 2115 may be arranged in two sets, but are not limited to, and each set of the substrate connectors 2115 is symmetrically disposed at both sides of the mounting area 2113, respectively. Accordingly, the photosensitive element 22 has at least one chip connection 223, wherein each chip connection 223 is disposed on the non-photosensitive region 222 of the photosensitive element 22. For example, the chip connectors 223 may be arranged in two sets, but not limited to, and each set of the chip connectors 223 is symmetrically disposed at both sides of the photosensitive region 221, respectively.

Preferably, after the photosensitive element 22 is mounted on the mounting region 2113 of the substrate 211, each of the chip connectors 223 disposed at the non-photosensitive region 222 of the photosensitive element 22 corresponds to each of the substrate connectors 2115 disposed at the edge region 2114 of the substrate 211, respectively.

The both end portions of the connection line 24 are connected to the substrate connection 2115 of the substrate 211 and the chip connection 223 of the photosensitive element 22, respectively, to conductively connect the photosensitive element 22 and the substrate 211. For example, the connection line 24 may be formed between the substrate connection 2115 of the substrate 211 and the chip connection 223 of the photosensitive element 22 by a wire bonding process, in such a way that the photosensitive element 22 and the substrate 211 are conductively connected by the connection line 24.

It should be noted that the bonding direction of the bonding wire 24 is not limited in the camera module 100 of the present invention, for example, the bonding direction of the bonding wire 24 may be from the substrate 211 to the photosensitive element 22 or from the photosensitive element 22 to the substrate 211. In addition, the type of the connection wire 24 may not be limited in the camera module 100 of the present invention, and for example, the connection wire 24 may be a gold wire, a lead wire, a copper wire, or the like.

Alternatively, in some other examples of the camera module 100, the substrate connector 2115 of the substrate 211 may be disposed at the mounting area 2113 of the substrate 211, and the chip connector 223 of the photosensitive element 22 may be disposed at the chip back 224 of the photosensitive element 22, wherein the chip connector 223 of the photosensitive element 22 and the substrate connector 2115 of the substrate 211 may be conducted by direct contact when the photosensitive element 22 is mounted at the mounting area 2113 of the substrate 211, so that the photosensitive element 22 is conductively connected to the substrate 211. In other words, the photosensitive element 22 may be directly conductively connected to the substrate 211 while the photosensitive element 22 is mounted to the substrate 211.

Further, the molded photosensitive unit 20 further comprises at least one electronic component 25, wherein the electronic component 25 is conductively connected to the substrate 211.

In one example of the camera module 100 of the present invention, the electronic component 25 may be mounted on the edge region 2114 of the substrate 211. Alternatively, a part or all of the electronic component 25 may be buried in the substrate 211. Still alternatively, a part of the electronic components 25 may be mounted on the substrate back surface 2112 of the substrate 211, or a part or all of the electronic components 25 located on the substrate back surface 2112 of the substrate 211 may be embedded in the substrate 211.

It should be noted that the type of the electronic component 25 is not limited, and for example, the electronic component 25 may be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, or the like. Referring to fig. 4A, the molding base 23 may not embed the electronic component 25 after being integrally bonded to the edge region 2114 of the substrate 211, or may embed at least a portion of at least one of the electronic components 25. Preferably, the molded base 23 encapsulates all of the electronic components 25 after being integrally bonded to the edge region 2114 of the substrate 211. It will be appreciated that, by embedding the electronic component 25 in the molding base 23 after molding, the molding base 23 prevents the electronic component 25 from contacting with the external environment, so as to avoid undesirable phenomena such as oxidation on the surface of the electronic component 25. The molding base 23 may also isolate adjacent electronic components 25 to prevent interference between adjacent electronic components 25. In addition, by embedding the electronic components 25 after the molding base 23 is formed, the molding base 23 can also make the space between adjacent electronic components 25 smaller, so that the electronic components 25 with larger number and size can be mounted on the limited mounting area of the substrate 211.

In addition, the molded base 23 also isolates the electronic component 25 from the photosensitive element 22 to avoid contamination of the photosensitive region 221 of the photosensitive element 22 by falling off of the surface of the electronic component 25. For example, the molding base 23 may be configured to isolate the electronic component 25 from the photosensitive element 22 by embedding the electronic component 25, or may be configured to isolate the electronic component 25 from the photosensitive element 22 by positioning the electronic component 25 and the photosensitive element 22 on both sides of the molding base 23.

It should be noted that, in other examples of the camera module 100, the camera module 100 may also have no electronic component 25, and referring to fig. 27B, in this way, the length and width dimensions and the height dimensions of the camera module 100 may be designed smaller, so that the camera module 100 may particularly meet the configuration requirements of the light and thin electronic device. It can be appreciated that, when the camera module 100 is assembled to the apparatus body 200, the camera module 100 can be electrically connected to the electronic components of the apparatus body 200, so that the electronic components of the apparatus body 200 can process the electrical signal obtained by the camera module 100 through photoelectric conversion.

Referring to fig. 2 to 6B, the optical filter unit 30 includes at least one frame-shaped support 32, wherein the support 32 has at least one light-transmitting channel 321, wherein the optical filter element 31 is attached to the support 32, and the optical filter element 31 closes the light-transmitting channel 321 of the support 32. The holder 32 is attached to the top surface 232 of the mold base 23 such that the light window 231 of the mold base 23 corresponds to the filter element 31 attached to the holder 32.

It should be noted that, since the molding base 23 is integrally bonded to the substrate front surface 2111 of the substrate 211 by a molding process, the top surface 232 of the molding base 23 has a high flatness, so that the consistency of the center axis of the optical filter 31 and the center axis of the photosensitive element 22 can be ensured after the mount 32 is attached to the top surface 232 of the molding base 23, thereby improving the optical performance of the camera module 100. That is, the optical axis of the photosensitive element 22 can be ensured to be perpendicular to the filter element 31.

After the holder 32 of the filter unit 30 is attached to the top surface 232 of the mold base 23, the filter unit 30 and the mold photosensitive unit 20 form a photosensitive device 1000. In other words, the photosensitive device 1000 includes one of the molded photosensitive units 20 and at least one of the filter units 30 attached to the molded photosensitive unit 20. It can be appreciated that the camera module 100 includes at least one of the optical lenses 10 and at least one of the photosensitive devices 1000, wherein the optical lenses 10 are held on the photosensitive path of the photosensitive elements 22 of the photosensitive device 1000.

The photosensitive device 1000 includes at least one mounting layer 1001 formed of a mounting medium 1002, wherein the mounting layer 1001 is held between the support 32 of the filter unit 30 and the top surface 232 of the molded base 23 of the molded photosensitive unit 20 for mounting the support 32 to the top surface 232 of the molded base 23.

It should be noted that the type of the mounting medium 1002 is not limited in the camera module 100 of the present invention, and for example, the mounting medium 1002 may be, but is not limited to, glue, wherein the mounting medium 1002 forms the mounting layer 1001 held between the stand 32 and the top surface 232 of the molded base 23 after curing.

The photosensitive device 1000 further has at least one sealing space 101 and at least one ventilation channel 102, wherein the sealing space 101 is formed between the light filtering unit 30 and the molded photosensitive unit 20 after the support 32 is attached to the top surface 232 of the molded base 23, for example, in a specific example of the camera module 100 of the present invention, the sealing space 101 may be formed between the light filtering element 31, the support 32, the molded base 23, and the substrate 211. Alternatively, in other examples of the camera module 100, the sealed space 101 may be formed between the filter element 31, the mount 32, the mold base 23, and the photosensitive element 22. The photosensitive region 221 of the photosensitive element 22 is held in the sealed space 101. The ventilation passage 102 is used to communicate the sealed space 101 with the outside of the photosensitive device 1000, so as to balance the internal air pressure of the sealed space 101 with the external air pressure of the photosensitive device 1000 during the process of manufacturing the camera module 100. That is, the gas in the sealed space 101 and the gas outside the photosensitive device 1000 can be exchanged through the ventilation passage 102, so that the balance between the gas pressure of the sealed space 101 and the gas pressure of the external environment can be ensured by the ventilation passage 102 during the process of manufacturing the image pickup module 100, thereby avoiding the occurrence of the bad phenomenon that each part of the photosensitive device 1000 for forming the sealed space 101 is damaged due to the unbalance of the pressure, in particular ensuring the uniform gas pressure of the upper part and the lower part of the filter element 31, and avoiding the bad phenomenon that the filter element 31 is cracked or broken due to the unbalance of the gas pressure of the upper part and the lower part of the filter element 31.

Preferably, the ventilation channel 102 extends curvedly to prevent contaminants such as dust from entering the sealed space 101 from the outside environment via the ventilation channel 102 from contaminating the photosensitive region 221 of the photosensitive element 22 held in the sealed space 101 and the portion of the filter element 31 for forming the sealed space 101.

Further, the camera module 100 includes at least one sealing member 103 formed of a sealing medium 104, wherein the sealing medium 104 filled in the ventilation channel 102 is cured to form the sealing member 103 after the baking process is performed on the photosensitive device 1000 during the manufacturing of the camera module 100, that is, the sealing member 103 is held in the ventilation channel 102 for preventing the ventilation channel 102 from communicating with the outside of the photosensitive device 1000. For example, the sealing member 103 held in the ventilation passage 102 can be formed after the ventilation passage 102 is filled with the sealing medium 104 and the sealing medium 104 is cured in the ventilation passage 102, and the sealing member 103 can prevent contaminants such as dust from entering the sealing space 101 from the outside of the photosensitive device 1000 via the ventilation passage 102 to contaminate the photosensitive region 221 of the photosensitive element 22 held in the sealing space 101 and the portion of the filter member 31 for forming the sealing space 101. The ventilation channel 102, which is curved and extends, is capable of preventing the sealing medium 104 from flowing to the inner wall of the sealing space 101 and preventing the sealing medium 104 from entering the sealing space 101, thereby preventing the sealing medium 104 from contaminating the photosensitive region 221 of the photosensitive element 22 and the portion of the filter element 31 for forming the sealing space 101.

Referring to fig. 6A and 6B, the vent passage 102 is formed in the support 32. Specifically, the support 32 has an inner side 322 and an outer side 323 surrounding the inner side 322, wherein the inner side 322 of the support 32 defines the light-transmitting channel 321 of the support 32. The vent passage 102 extends from the outer side 323 to the inner side 322 of the mount 32, and the vent passage 102 communicates the outer side 323 and the inner side 322 of the mount 32. At least a portion of the inner side 322 of the holder 32 is attached to the top surface 232 of the molding base 23 so that the ventilation channel 102 communicates with the sealed space 101 of the photosensitive device 1000 and the outside of the photosensitive device 1000.

Further, the support 32 has a lower surface 324, an inner side 325, an upper surface 326 and an outer side 327, wherein the lower surface 324 and the upper surface 326 of the support 32 correspond to each other, and the inner side 325 and the outer side 327 of the support 32 correspond to each other, wherein the inner side 325 of the support 32 is configured to define the light-passing channel 321. The lower surface 324 and the inner side 325 of the stand 32 are used to form the inner side 322 of the stand 32, and the upper surface 326 and the outer side 327 of the stand 32 are used to form the outer side 323 of the stand 32, wherein at least a portion of the lower surface 324 of the stand 32 is attached to the top surface 232 of the molded base 23. Preferably, the inner side 325 of the holder 32 extends obliquely in such a way that stray light can be avoided when light enters the inside of the camera module 100 from the optical lens 10 of the camera module 100 to pass through the light-passing channel 321 of the holder 32, so as to improve the optical performance of the camera module 100.

Referring to fig. 20A, in this particular example of the camera module 100 of the present invention, the filter element 31 is attached to the upper surface 326 of the stand 32, whereas in this particular example of the camera module 100 shown in fig. 20B, the filter element 31 may also be attached to the lower surface 324 of the stand 32. It will be understood by those skilled in the art that the position where the optical filter 31 is mounted on the support 32 is not limited in the camera module 100 of the present invention, as long as the optical filter 31 is mounted on the support 32, and the light-transmitting channel 321 of the support 32 can correspond to the optical filter 31. With further reference to fig. 20B, the lower surface 324 of the support 32 has a lower surface inner side 3243 and a lower surface outer side 3244 surrounding the lower surface inner side 3243, wherein the filter element 31 is attached to the lower surface inner side 3243 of the lower surface 324 of the support 32, and at least a portion of the lower surface outer side 3244 of the lower surface 324 of the support 32 is attached to the top surface 232 of the mold base 23 such that the filter element 31 is held on the photosensitive path of the photosensitive element 22. A height difference is provided between the lower surface inside 3243 and the lower surface outside 3244 of the holder 32 to form a lower filter element attaching groove 3245, wherein the filter element 31 attached to the lower surface inside 3243 of the holder 32 may be held in the lower filter element attaching groove 3245 of the holder 32.

The lower surface 324 of the support 32 has a non-glue-drawing area 3241 and a glue-drawing area 3242 surrounding the non-glue-drawing area 3241, wherein two sides of the non-glue-drawing area 3241 extend inward and outward to be connected to the inner side 325 and the glue-drawing area 3242, respectively, and two sides of the glue-drawing area 3242 extend inward and outward to be connected to the non-glue-drawing area 3241 and the outer side 327, respectively. The mounting medium 1002 is applied to the glue-drawing area 3242 of the lower surface 324 of the support 32 while mounting the support 32 to the top surface 232 of the mold base 23, and then the mounting medium 1002 is capable of forming the mounting layer 1001 held between the glue-drawing area 3242 of the lower surface 324 of the support 32 and the top surface 232 of the mold base 23 after mounting the lower surface 324 of the support 32 and the top surface 232 of the mold base 23 together. For example, in the specific example of the camera module 100 shown in fig. 20B, the filter element 31 may be attached to the glue area 3242 of the lower surface 324 of the support 32, such that the mold base 23 surrounds the filter element 31 when the support 32 is attached to the top surface 232 of the mold base 23. It is worth mentioning that at least a portion of the lower surface outer side 3244 of the lower surface 324 of the support 32 forms the glue-drawing area 3242 of the support 32.

Still further, the support 32 has at least one vent 328 and at least one vent slot 329, wherein the vent 328 extends from the upper surface 326 toward the lower surface 324 of the support 32, wherein the vent slot 329 is formed in the lower surface 324 of the support 32 and extends from the inner side 325 toward the outer side 327 of the support 32, wherein the vent 328 and the vent slot 329 are in communication with one another to form the vent channel 102. It will be appreciated that the opening of the vent 328 is formed in the upper surface 326 of the support 32, and that the opening of the vent 328 in the upper surface 326 forms the opening of the vent passage 102 in the upper surface 326. The vent slot 329 opening is formed in the lower surface 324 and the inner side 325 of the carrier 32, wherein after the lower surface 324 of the carrier 32 is attached to the top surface 232 of the molded base 23 by the mounting medium 1002, the top surface 232 of the molded base 32 closes the vent slot 329 opening formed in the lower surface 324 with only the vent slot 329 opening in the inner side 325 being exposed, and the vent slot 329 opening in the inner side 325 forming the vent channel 102 opening in the inner side 325.

Preferably, as shown in fig. 5 and 6B, the vent groove 329 of the support 32 has an open end 3291, a communication end 3292, a first vent groove 3293, and a second vent groove 3294, wherein the open end 3291 and the communication end 3292 of the vent groove 329 correspond to each other, and the vent groove 329 communicates with the sealed space 101 at the open end 3291 and communicates with the vent hole 328 at the communication end 3292, wherein the first vent groove 3293 is formed at the communication end 3292, the second vent groove 3294 is formed at the open end 3291, and the first vent groove 3293 communicates with the second vent groove 3294 and the vent hole 328, respectively, such that the second vent groove 3294, the first vent groove 3293, and the vent hole 328 form the vent channel 102 of the photosensitive device 1000.

It should be noted that, referring to fig. 4A, 5 and 20, the thickness dimension parameter of the support 32 is set to be H, that is, the distance dimension parameter between the upper surface 326 and the lower surface 324 of the support 32 is set to be H. Let the depth dimension parameter of the vent slot 329 of the stand-off 32 be h1. The thickness dimension parameter of the mounting medium 1002 applied to the glue-drawing area 3242 of the lower surface 324 of the support 32 is set to h2. It is worth mentioning that the mounting medium 1002 may also be applied to the top surface 232 of the molded base 23. In order to avoid the vent channel 102 being blocked by the mounting medium 1002 filling the vent channel 329 of the carrier 32 when mounting the carrier 32 to the molded base 23, the depth dimension parameter h1 of the vent channel 329 is generally greater than the thickness dimension parameter h2 of the mounting medium 1002. For example, in a specific example, the thickness dimension parameter h2 of the mounting medium 1002 has a value in a range of: h2 is less than or equal to 0.1mm, and accordingly, the depth dimension parameter h1 of the vent slot 329 of the support 32 has a range of values: h1 > 0.1mm. Since the mounting medium 1002 expands when heated during the baking process, the number of the depth dimension parameters h1 of the vent grooves 329 of the support 32 needs to be larger than the value of the thickness dimension parameter h2 of the mounting medium 1002, for example, the range of the depth dimension parameters h1 of the vent grooves 329 of the support 32 is preferably: h1 And is more than or equal to 0.15mm. More preferably, the depth dimension parameter h1 of the vent slot 329 of the support 32 is in the range of: h1 And is more than or equal to 0.3mm. In addition, to ensure the strength of the support 32, the depth of the vent slot 329 of the support 32 should not be too deep, for example, in one specific example, the ratio of the depth dimension parameter H1 of the vent slot 329 of the support 32 to the thickness dimension parameter H of the support 32 may be in the range of: 0.5% -70% (including 0.5% and 70%).

It is worth mentioning that the vent slot 329 of the seat 32 may be different in depth at different locations. Specifically, the depth of the vent groove 329 at the communication end 3292 is greater than the depth of the vent groove 329 at the opening end 3291, for example, the depth of the vent groove 329 at the opening end 3291 may be about 0.03mm, and the depth of the vent groove 329 at the communication end 3292 may be about 0.1mm, preferably about 0.15mm. In other words, the depth dimension of the first ventilation groove 3293 of the ventilation groove 329 is larger than the depth dimension of the second ventilation groove 3294, for example, the depth dimension of the first ventilation groove 3293 of the ventilation groove 329 may be about 0.1mm, preferably 0.15mm. The depth dimension of the second ventilation groove 3294 of the ventilation groove 329 may be about 0.03 mm. Preferably, the vent slot 329 is stepped. The deeper depth of the vent groove 329 at the communication end 3292 is designed to avoid filling the vent groove 329 with the mounting medium 1002, and the shallower depth of the vent groove 329 at the opening end 3291 is designed to reduce the opening size of the vent passage 102 at the sealed space 101 to prevent contaminants such as dust from entering the sealed space 101 from the external environment via the vent passage 102. It is worth mentioning that the mounting medium 1002 is not provided near the open end 3291 of the vent groove 329, so that even if the vent groove 329 is shallower in depth at the open end 3291, there is no fear that the mounting medium 1002 will fill the vent groove 329, for example, the vent groove 329 has a depth dimension in the range of 5 μm to 200 μm (including 5 μm and 200 μm) at the open end 3291. The mounting medium 1002 may be provided near the communication end 3292 of the vent slot 329 so that the vent slot 329 is deeper at the communication end 3292, for example, having a depth dimension ranging from 50 μm to 200 μm (including 50 μm and 200 μm).

Further, the support 32 further includes at least one glue overflow groove 3206 and at least one vent groove 3207, wherein the glue overflow groove 3206 and the vent groove 3207 are respectively formed on the lower surface 324 of the support 32, and the glue overflow groove 3206 communicates with the vent groove 3207 and the vent hole 328 to form the vent channel 102 of the photosensitive device 1000. The depth of the glue overflow groove 3206 of the support 32 may be the same as or different from the depth of the air discharge groove 3207. Preferably, the depth dimension of the flash groove 3206 of the pedestal 32 is greater than the depth dimension of the vent groove 3207, for example, the depth dimension of the flash groove 3206 of the pedestal 32 may be about 0.1mm, preferably 0.15mm, and the depth dimension of the vent groove 3207 may be about 0.03mm, preferably 0.15mm. When the lower surface 324 of the holder 32 and the top surface 232 of the molding base 23 are bonded by the mounting medium 1002, the surplus mounting medium 1002 can overflow into the overflow groove 3206 of the holder 32, and there is no fear that the mounting medium 1002 overflowed into the overflow groove 3206 fills the overflow groove 3206 of the holder 32, in such a manner that the vent passage 102 formed by the vent groove 3207, the overflow groove 3206 and the vent hole 328 can be ensured to be clear. In addition, the width of the glue overflow groove 3206 of the support 32 may be larger than the width of the air discharge groove 3207, so that, on one hand, the glue overflow groove 3206 with a larger size can avoid the paste medium 1002 overflowing into the glue overflow groove 3206 to fill the glue overflow groove 3206, and on the other hand, the air discharge groove 3207 with a smaller size can avoid the contaminants such as dust from entering the sealing space 101 from the outside of the photosensitive device 1000 via the air discharge groove 3207, thereby being beneficial to improving the optical performance of the camera module 100.

In addition, referring to fig. 6B, the width dimension of the vent groove 329 is greater than or equal to the diameter dimension of the bottom of the vent hole 328, and the distance dimension between the peripheral wall of the vent hole 328 and the side wall of the vent groove 329 is L1, where the range of values of L1 is: 0mm to 0.2mm (including 0mm and 0.2 mm). Let the diameter dimension parameter of the bottom of the vent hole 328 be R, let the width dimension parameter of the vent slot 329 at the communication end 3292 be W, where the ratio of the width dimension parameter W of the vent slot 329 at the communication end 3292 to the diameter dimension parameter R of the bottom of the vent hole 328 is in the range: 2:1 to 1:1 (including 2:1 and 1:1). In other words, the maximum dimension of the width of the vent groove 329 at the communication end 3292 is twice the diameter dimension of the bottom of the vent hole 328, and the minimum dimension of the width of the vent groove 329 at the communication end 3292 is equal to the diameter dimension of the bottom of the vent hole 328.

The filter element 31 is attached to the upper surface 326 of the holder 32 such that the light-transmitting channel 321 of the holder 32 corresponds to the filter element 31, whereby the filter element 31 is capable of closing the light-transmitting channel 321 of the holder 32. It will be appreciated that the vent passage 102 is held at the lower portion of the filter element 31 at the opening of the inner side 325, wherein the lower portion of the filter element 31 is used to form the sealed space 101.

Further, the upper surface 326 of the support 32 has an upper surface inner side 3261 and an upper surface outer side 3262 surrounding the upper surface inner side 3261, wherein the filter element 31 is attached to the upper surface inner side 3261 of the support 32. Preferably, the height dimension of the upper surface inner side 3261 is lower than the height dimension of the upper surface outer side 3262, that is, a height difference is formed between the upper surface inner side 3261 and the upper surface outer side 3262, so that a mounting groove 3201 of the mount 32 is formed at a position corresponding to the upper surface inner side 3261, wherein the mounting groove 3201 of the mount 32 communicates with the light-passing channel 321, such that the filter element 31 mounted on the upper surface inner side 3261 can be held in the mounting groove 3201, and the light-passing channel 321 of the mount 32 can correspond to the filter element 31, such that the height dimension of the camera module 100 can be reduced. Alternatively, the upper surface inner side 3261 and the upper surface outer side 3262 may be flush.

Further, the inner side 325 of the support 32 has an inner surface upper side 3251 and an inner surface lower side 3252, wherein the inner surface upper side 3251 is connected upwardly and downwardly to the upper surface outer side 3262 and the upper surface inner side 3261, respectively, and the inner surface lower side 3252 is connected upwardly and downwardly to the upper surface inner side 3261 and the lower surface 324, respectively. Preferably, the inner surface underside 3252 of the inner side 325 extends obliquely to facilitate avoiding stray light, thereby improving the optical performance of the camera module 100. For example, a distance between an upper edge of the inner surface lower side 3252 and a central optical axis of the camera module 100 is greater in size than a distance between a lower edge of the inner surface lower side 3252 and the central optical axis of the camera module 100, so that the inner surface lower side 3252 extends obliquely. In other words, the distance between the connection position of the inner surface lower side 3252 and the upper surface inner side 3261 to the central optical axis of the camera module 100 is larger than the distance between the connection position of the inner surface lower side 3252 and the lower surface 324 to the central optical axis of the camera module 100, so that the inner surface lower side 3252 extends obliquely.

Preferably, referring to fig. 6A and 6B, the support 32 may be an injection molded piece, i.e., the support 32 may be formed by an injection molding process. In one example of the camera module 100 of the present invention, the support 32 is injection molded while forming the vent 328 and the vent 329 of the support 32, and in another example of the camera module 100 of the present invention, the support 32 may be formed first and then the vent 328 and the vent 329 of the support 32 may be formed by a drilling or grooving process. The camera module 100 of the present invention is not limited in this respect.

The camera module 100 may be an auto focus and zoom camera module, referring to fig. 2 to 4B, the camera module 100 further includes at least one driver 40, wherein the optical lens 10 is drivably disposed on the driver 40, and the driver 40 is mounted on the support 32, so that the optical lens 10 is kept in the photosensitive path of the photosensitive element 22. Preferably, the driver 40 may be mounted to the upper surface outer side 3262 of the support 32. Alternatively, the driver 40 may not be attached to the holder 32, but the driver 40 may be attached to the top surface 232 of the molded base 23. The driver 40 can cause the optical lens 10 to be held in the photosensitive path of the photosensitive element 22, and the driver 40 can drive the optical lens 10 to move along the photosensitive path of the photosensitive element 22 to achieve focusing and zooming of the image pickup module 100 by adjusting the relative positions of the optical lens 10 and the photosensitive element 22. It is worth mentioning that the driver 40 may be implemented as, but is not limited to, a voice coil motor.

Preferably, the upper surface 326 of the carrier 32 is provided with at least one positioning protrusion 3230 for guiding the driver 40 to a correct mounting position when mounting the driver 40 on the outside 3262 of the upper surface of the carrier 32 or for guiding the driver 40 to a correct mounting position when mounting the driver 40 on the top surface 232 of the molded base 23. More preferably, the positioning boss 3230 protrudes outside the upper surface 3262 of the support 32. In addition, the number and shape of the positioning projections 3230 are not limited in the camera module 100 of the present invention, and for example, the number of the positioning projections 3230 may be implemented as 4, with each of the positioning projections 3230 being located at each corner of the support 32, respectively.

Further, the driver 40 has at least one motor pin 41, wherein the motor pin 41 of the driver 40 is connected to the substrate 211 to conduct the driver 40 and the substrate 211. The molding base 23 has at least one pin groove 233, wherein the motor pin 41 of the driver 40 is received in the pin groove 233 of the molding base 23 so that the motor pin 41 may not protrude from the outer wall of the molding base 23, thereby not only ensuring the reliability of the camera module 100, but also making the camera module 100 more beautiful.

Fig. 4B shows a variant embodiment of the camera module 100, unlike the camera module 100 shown in fig. 4, in this specific example of the camera module 100 shown in fig. 4B, the camera module 100 is implemented as an array camera module, specifically, the camera module 100 includes at least two optical lenses 10 and at least one molded photosensitive unit 20, wherein the molded photosensitive unit 20 further includes at least one circuit board 21, at least two photosensitive elements 22, and at least one molded base 23, the molded base 23 has at least two optical windows 231, wherein each of the photosensitive elements 22 is conductively connected to the circuit board 21, the molded base 23 is integrally bonded to the circuit board 21, and the molded base 23 surrounds the photosensitive area 221 of each of the photosensitive elements 22, such that the photosensitive area 221 of each of the photosensitive elements 22 respectively corresponds to each of the optical windows 23, wherein each of the photosensitive elements 22 is held in a respective photosensitive path 231 of the photosensitive elements 22.

Referring to fig. 7 to 20 of the drawings, a manufacturing process of the camera module 100 is set forth in the following description.

Referring to the stage shown in fig. 7, at least one of the electronic components 25 is conductively connected to the substrate 211 at the substrate front side 2111 of the substrate 211. For example, in a specific example of the camera module 100, the electronic component 25 may be mounted on the substrate front surface 2111 of the substrate 211 by means of mounting, so that the electronic component 25 is conductively connected to the substrate 211 on the substrate front surface 2111 of the substrate 211, and at this time, the electronic component 25 protrudes from the substrate front surface 2111 of the substrate 211. In other specific examples of the camera module 100, the electronic component 25 may be semi-buried in the substrate 211 on the substrate front surface 2111 of the substrate 211, and the electronic component 25 and the substrate 211 may be electrically connected to each other, and in this case, the electronic component 25 may also protrude from the substrate front surface 2111 of the substrate 211.

Alternatively, in other examples of the camera module 100, the electronic component 25 may be conductively connected to the substrate 211 so as to be mounted on the substrate back surface 2112 of the substrate 211, or the electronic component 25 may be conductively connected to the substrate 211 so as to be semi-embedded in the substrate 211 on the substrate back surface 2112 of the substrate 211. In another example of the camera module 100, the electronic components 25 may be entirely embedded in the substrate 211, that is, the electronic components 25 may not protrude from the substrate front surface 2111 of the substrate 211 and the substrate back surface 2112 of the substrate 211.

In addition, the position where the electronic components 25 protrude from the substrate front surface 2111 of the substrate 211 is not limited in the camera module 100 of the present invention, and is adjusted according to the specific application of the camera module 100, for example, in some examples of the camera module 100 of the present invention, a plurality of the electronic components 25 may be disposed in all regions of the substrate front surface 2111 of the substrate 211, while in other examples of the camera module 100 of the present invention, a plurality of the electronic components 25 may be disposed in specific regions of the substrate front surface 2111 of the substrate 211, such as corners or one side or both sides, etc., and the camera module 100 of the present invention is not limited in these respects.

It should be noted that the circuit board 21 of the camera module 100 may not provide the electronic component 25, that is, the camera module 100 may be a camera module 100 without an electronic component, where the camera module 100 can be turned on with the electronic component of the apparatus body 200 after the camera module 100 is assembled to the apparatus body 200.

In addition, more than one of the substrates 211 is arranged to form a imposition unit 3000. It should be noted that the arrangement of the base plates 211 forming the imposition unit 3000 is not limited in the camera module 100 of the present invention, and may be selected according to the need, for example, the arrangement of the imposition unit 3000 formed by the base plates 211 of a hard plate and the imposition unit 3000 formed by the base plates 211 of a soft and hard combined plate may be different. That is, the imposition unit 3000 includes at least one of the substrates 211. Preferably, the number of the substrates 211 of the imposition unit 3000 is implemented as two or more.

In the stage shown in fig. 8A and 8B, the imposition unit 3000 is put into a forming mold 300 to perform a molding process by the forming mold 300.

Specifically, the molding die 300 includes an upper die 301 and a lower die 302, wherein at least one of the upper die 301 and the lower die 302 is operable to enable the molding die 300 to be subjected to a clamping and a drawing operation. For example, in one example, the imposition unit 3000 is first placed on the lower mold 302, and then the upper mold 301 is placed on the lower mold 302 and/or the imposition unit 3000 to perform a mold closing operation on the molding mold 300, and at least one molding space 303 may be formed between the upper mold 301 and the substrate front surface 2111 of the substrate 211.

Preferably, when the number of the molding spaces 303 is two or more, at least one communication channel 304 may be further formed between the upper mold 301 and the substrate front surface 2111 of the substrate 21 for communicating with adjacent molding spaces 303. Thus, when one of the molding spaces 303 is filled with a fluid medium 400, the fluid medium 400 can flow into and be filled in the adjacent molding space 303 through the communication passage 304.

In addition, referring further to fig. 8A and 8B, a feed channel 306 is formed between the upper die 301 of the molding die 300 and the substrate front surface 2111 of the substrate 21, wherein the feed channel 306 communicates with at least one of the communication channels 304 to allow the fluid medium 400 to flow from the feed channel 306 to the communication channels 304, and then to allow the fluid medium 400 to flow through each of the communication channels 304 and each of the molding spaces 303 to fill all of the molding spaces 303, or the feed channel 306 communicates with at least one of the molding spaces 303 to allow the fluid medium 400 to flow from the feed channel 306 to the molding spaces 303, and then to allow the fluid medium 400 to flow through each of the molding spaces 303 and each of the communication channels 304 to fill all of the molding spaces 303.

Further, the forming die 300 comprises a feeding mechanism 307, wherein the feeding mechanism 307 comprises a hopper 3071 and a pusher 3072, wherein the hopper 3071 has a storage space 30711 and a pushing channel 30712, and the pushing channel 30712 communicates with the storage space 30711 and the feeding channel 306, wherein the pusher 3072 is operatively disposed in the storage space 30711 of the hopper 3071. When the pusher 3072 is operated, for example, when the pusher 3072 is operated by pressing the pusher 3072 by a hydraulic pump, but not limited to, the pusher 3072 can push the fluid medium 400 stored in the storage space 30711 to be pushed into the molding space 303 from the pushing passage 30712 and the feeding passage 306, respectively, and to flow through each of the molding space 303 and each of the communication passages 304 to fill all of the molding space 303.

In this example of the forming die 300 shown in fig. 8A and 8B, the hopper 3071 includes a first storage element 30713 and a second storage element 30714, wherein the first storage element 30713 and the upper die 301 are implemented as a unitary structure, the second storage element 30714 and the lower die 302 are implemented as a unitary structure, and the second storage element 30714 has a movable channel 30715. When the upper mold 301 and the lower mold 302 are closed, the storage space 30711 can be formed between the first storage element 30713 and the second storage element 30714, and the pushing channel 30712 can be formed at a position corresponding to the movable channel 30715 of the second storage element 30714. It should be noted that the fluid medium 400 may also be stored in the pushing channel 30712.

In one embodiment, the pusher 3072 may only provide pressure to press the fluid medium 400 stored in the storage space 30711 and drive the fluid medium 400 out of the feeding mechanism 307 from the pushing channel 30712. In another embodiment, at least one of the pusher 3072 and the accumulator 3071 may also provide heat to heat the fluid medium 400 stored in the storage space 30711, for example, after the fluid medium 400 is heated to melt, the fluid medium is pressurized by the pusher 3072 to be discharged from the pushing channel 30712 out of the feeding mechanism 307.

With continued reference to fig. 8A and 8B, the upper mold 301 further includes a molding guide 3011 and at least one light window molding portion 3012, and has at least one molding guide slot 3013, wherein the light window molding portion 3012 integrally extends to the molding guide 3011 to form the molding guide slot 3013 between the light window molding portion 3012 and the molding guide 3011, or to form the molding guide slot 3013 between adjacent light window molding portions 3012.

Further, the molding guide 3011 has a first pressing portion 30111, the optical window molding portion 3012 has a second pressing portion 30121, wherein after the molding die 300 is subjected to the die clamping process, the first pressing portion 30111 presses the outer side of the edge region 2114 of the substrate 211, the second pressing portion 30121 of the optical window molding portion 3012 presses the inner side of the edge region 2114 of the substrate 211, or the second pressing portion 30121 of the optical window molding portion 3012 presses at least a portion of the mounting region 2113 of the substrate 211, or the second pressing portion 30121 of the optical window molding portion 3012 presses both the at least a portion of the mounting region 2113 and the inner side of the edge region 2114 of the substrate 211 at the same time, so that the molding space 303 is formed at a position corresponding to the molding guide groove 3013, and a portion 303 of the edge region 2114 of the substrate 211 is held in the protruding space, and the electronic component 21125 can be held in the protruding space 21125 at this time.

Preferably, a safety space 30122 is formed in the middle of the light window molding 3012 in a concave manner, wherein the substrate connector 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting region 2113 of the substrate 211 can be held in the safety space 30122 of the light window molding 3012 when the second pressing portion 30121 of the light window molding 3012 presses the inner side of the edge region 2114 of the substrate 211, so as to avoid pressing the substrate connector 2115 protruding from the substrate front surface 2111 of the substrate 211 and the mounting region 2113 of the substrate 211.

Preferably, the forming mold 300 further includes at least one film 305, wherein the film 305 is overlapped on the inner surface of the upper mold 301, for example, the film 305 may be overlapped on the inner surface of the upper mold 301 by being attached to the inner surface of the upper mold 301. After the molding die 300 is clamped, the film 305 is located between the first pressing portion 30111 of the upper die 301 and the outside of the edge region 2114 of the substrate 21 and between the second pressing portion 30121 of the optical window molding portion 3012 and the inside of the edge region 2114 of the substrate 21, in such a manner that, on the one hand, the film 305 can absorb the impact force generated by the molding die 300 when clamped by deforming to avoid the impact force from directly acting on the substrate 211, and, on the other hand, the film 305 can isolate the first pressing portion 30111 of the upper die 301 from the outside of the edge region 2114 of the substrate 211 and isolate the second pressing portion 30121 from the inside of the edge region 2114 of the substrate 211 to prevent the upper die 301 from scratching the front substrate surface 2111 of the substrate 211, thereby protecting good electrical characteristics of the substrate 211.

In addition, the film 305 can prevent the occurrence of a gap between the first pressing portion 30111 of the upper die 301 and the outside of the edge region 2114 of the substrate 211 and a gap between the second pressing portion 30121 and the inside of the edge region 2114 of the substrate 211 by deforming, so that the fluid medium 400 can be prevented from entering the mounting region 2111 of the substrate 211, and at the same time, the occurrence of a "flash" phenomenon after the fluid medium 400 is cured can be avoided.

In addition, it is understood that the film 305 may also facilitate demolding of the upper mold 301 of the molding mold 300, and avoid damage to the molding base 23, particularly damage to the optical window 231 of the molding base 23, during demolding of the upper mold 301, so as to ensure reliability of the camera module 100.

Referring to the stage shown in fig. 9 and 10, the fluid medium 400 is added to the storage space 30711 of the feeding mechanism 307, and then the fluid medium 400 located in the storage space 30711 is pressurized by the pusher 3072, while at least one of the pusher 3072 and the accumulator 3071 is also capable of heating the fluid medium 400, wherein the fluid medium 400 is discharged from the pusher passage 30712 to the storage space 30711 when pressurized, and flows to the molding space 303 communicating with the feeding passage 306 through the feeding passage 306, and subsequently, the fluid medium 400 is able to fill all of the molding spaces 303 by each of the molding spaces 303 and each of the communicating passages 304 as the fluid medium 400 continues to be pressurized.

It should be noted that the fluid medium 400 may be a liquid, a solid, a mixture of a liquid and a solid, or the like, so that the fluid medium 400 can flow. In addition, the fluid medium 400 may be implemented as, but is not limited to, a thermoset material. Of course, it will be appreciated by those skilled in the art that in other possible examples, it is also possible that the fluid medium 400 is implemented as a photo-or self-curing material.

After the fluid medium 400 is filled in the molding space 303, the fluid medium 400 can cover the region of the edge region 2114 of the substrate 211 that is held in the molding space 303 and the electronic component 25 that is held in the molding space 303, and subsequently, the fluid medium 400 filled in the molding space 303 can be cured by heating to form a one-piece molding base 4200, wherein the one-piece molding base 4200 can be integrally bonded to the region of the substrate front surface 2111 of the substrate 211 and embed at least a portion of at least one of the electronic components 25. Preferably, the integral molding base 4200 is capable of embedding all of the electronic components 25. It is worth mentioning that the unitary molded base 4200 can be subsequently divided to form the molded base 23 of the molded photosensitive unit 20.

It should be noted that the fluid medium 400 filled in the molding space 303 may be solidified by cooling, or the fluid medium 400 filled in the molding space 303 may be solidified at normal temperature, and the camera module 100 of the present invention is not limited in this respect.

Referring to the stages shown in fig. 11 and 12, when the fluid medium 400 is solidified in the molding space 303 of the molding die 300 to form the one-piece molding base 4200 integrally bonded to the substrate front surface 2111 of the substrate 211, a pattern drawing operation is performed on the molding die 300 to obtain a molded circuit board assembly semi-finished product 2100, wherein the optical window 231 of the one-piece molding base 4200 can be formed at a position corresponding to the optical window molding portion 3012 of the upper die 301 of the molding die 300, and the optical window 231 of the one-piece molding base 4200 forms the optical window 231 of the molding base 23 when the one-piece molding base 4200 is divided to form the molding base 23. It is understood that in this specific example of the camera module 100 of the present invention, the molding base 23 can be wrapped around the mounting region 2113 of the substrate 211 such that the mounting region 2113 corresponds to the optical window 231 of the molding base 23. It is understood that the substrate connector 2115 of the substrate 211 is held within the light window 231 of the molded base 23. It is noted that the molded circuit board assembly blank 2100 is a blank of the molded photosensitive unit 20. That is, the molded circuit board assembly blank 2100 can be subsequently processed to form the molded photosensitive unit 20.

It should be noted that the inner surface 234 of the molding base 23 is formed after the molding die 300 is released, and the outer surface 235 of the molding base 23 may be formed after the molding die 300 is released, or may be formed after the molded circuit board assembly blank 2100 is divided.

Specifically, referring to the stages shown in fig. 13A and 13B, the molded circuit board assembly blank 2100 is singulated to form a molded circuit board assembly 2000, and the base outer surface 235 of the molded base 23 of the molded circuit board assembly 2000 may be formed simultaneously, while in other examples, the base outer surface 235 of the molded base 23 may also be formed after the outer surface of the molded base 23 is ground or polished after the molded circuit board assembly blank 2100 is singulated to form the molded circuit board assembly 2000.

In addition, the manner of dividing the molded circuit board assembly 2100 is not limited in the camera module 100 of the present invention, and the molded circuit board assembly semi-finished product 2100 may be divided, for example, by cutting to form the molded circuit board assembly 2000, or the molded circuit board assembly semi-finished product 2100 may be divided by etching to form the molded circuit board assembly 2000. It will be appreciated by those skilled in the art that the above-listed ways of singulating the molded circuit board assembly blank 2100 by cutting or etching are merely examples, and are not meant to limit the scope and content of the camera module 100 of the present invention. The molded circuit board assembly blank 2100 may be divided by other means by those skilled in the art to form the molded circuit board assembly 2000, so long as the molded circuit board assembly blank 2100 is divided. It is worth mentioning that the segmented outer surface of the one-piece molded base 4200 forms the base outer surface 235 of the molded base 23.

It will be appreciated that the base outer surface 235 of the molded base 23 may be inclined or may be vertical, which is selected as desired.

In addition, the direction of dividing the molded circuit board assembly semi-finished product 2100 is not limited in the image pickup module 100 of the present invention, and for example, in the example shown in fig. 13A, the dividing direction may be a direction from the direction in which the substrate front surface 2111 of the substrate 211 is located toward the substrate back surface 2112 of the substrate 211, whereas in the example shown in fig. 13B, the dividing direction may be a direction from the direction in which the substrate back surface 2112 of the substrate 211 is located toward the substrate front surface 2111 of the substrate 211.

After the molded circuit board assembly blank 2100 is singulated, the unitary mold base 4200 can form the mold base 23, and the optical windows 231 of the unitary mold base 4200 form the optical windows 231 of the mold base 23.

It is worth mentioning that the singulated sides of the molded circuit board assembly blank 2100 form a singulated side 2001 of the molded circuit board assembly 2000. That is, the molded circuit board assembly 2000 has at least one of the split sides 2001. In addition, the side of the molded circuit board assembly blank 2100 that is formed by the demolding is a demolding side 2002 of the molded circuit board assembly 2000. That is, in some examples of the camera module 100 of the present invention, the molded circuit board assembly 2000 may have at least one of the split sides 2001 and at least one of the release sides 2002. In other examples of the camera module 100, the molded circuit board assembly 2000 may also have four of the split sides 2001, or four of the release sides 2002. It is understood that both the parting side 2001 and the demolding side 2002 may form the base outer surface 235 of the molded base 23.

Referring to the stage shown in fig. 14, the photosensitive element 22 is mounted on the mounting area 2113 of the substrate 211, and the connection line 24 is formed between the chip connection 223 of the photosensitive element 22 and the substrate connection 2115 of the substrate 211 by a wire bonding process to conductively connect the photosensitive element 22 and the substrate 211 through the connection line 24.

Referring to the stages shown in fig. 15 and 16, the support 32 with the filter unit 30 is attached to the top surface 232 of the molding base 23 to form a photosensitive device blank 1100, wherein the photosensitive device blank 1100 is subsequently formed into the photosensitive device 1000.

Specifically, first, the mounting medium 1002 is applied on at least one of the top surface 232 of the molded base 23 and the lower surface 324 of the support 32, for example, the mounting medium 1002 may be applied on the glue-drawing area 3242 of the lower surface 324 of the support 32, wherein the mounting medium 1002 may be, but is not limited to, glue. The lower surface 324 of the support 32 and the top surface 232 of the molded base 23 are then laminated to one another such that the mounting medium 1002 is held between the lower surface 324 of the support 32 and the top surface 232 of the molded base 23, and the mounting layer 1001 held between the lower surface 324 of the support 32 and the top surface 232 of the molded base 23 is formed after the mounting medium 1002 is cured, wherein the mounting layer 1001 is used to connect the lower surface 324 of the support 32 and the top surface 232 of the molded base 23. It is worth mentioning that the excess mounting medium 1002 can overflow into the first air vent groove 3293 of the air vent groove 329, and since the depth dimension of the first air vent groove 3293 of the air vent groove 329 is larger than the thickness dimension of the mounting medium 1002, there is no fear that the mounting medium 1002 overflowed into the first air vent groove 3293 blocks the air vent passage 102 to ensure the unblocking of the air vent passage 102. That is, the surplus mounting medium 1002 located between the lower surface 324 of the holder 32 and the top surface 232 of the molding base 23 can overflow into the overflow groove 3206 of the holder 32, and the mounting medium 1002 that overflows into the overflow groove 3206 of the holder 32 does not block the ventilation channel 102, i.e., the mounting medium 1002 that overflows into the overflow groove 3206 does not fill the overflow groove 3206 to keep the ventilation channel 102 clear. It should be noted that the glue overflow groove 3206 is formed at a connection position between the non-glue-drawing area 3241 and the glue-drawing area 3242 of the lower surface 324 of the support 32, so that the surplus mounting medium 1002 located between the lower surface 324 of the support 32 and the top surface 232 of the molding base 23 can overflow from the glue-drawing area 3242 of the lower surface 324 into the glue overflow groove 3206 of the support 32, which is advantageous to ensure the flatness of the support 32, thereby improving the optical performance of the camera module 100.

After the holder 32 is attached to the mold base 23, the sealing space 101 is formed among the filter element 31, the holder 32, the mold base 23, and the substrate 211, wherein the photosensitive region 221 of the photosensitive element 22 is held in the sealing space 101, and wherein the ventilation passage 102 formed in the holder 32 is for communicating the sealing space 101 with the outside of the photosensitive device 1000. In addition, after the holder 32 is attached to the mold base 23, the holder 32 surrounds the photosensitive area 221 of the photosensitive element 22 so that the photosensitive area 221 of the photosensitive element 22 corresponds to the filter element 31. In other words, the light window 231 of the molding base 23 and the light passing channel 321 of the holder 32 correspond to each other, so that the light sensing region 221 of the light sensing element 22 corresponding to the light window 231 of the molding base 23 can correspond to the light filtering element 31 attached to the holder 32 and closing the light passing channel 321 of the holder 32.

It should be noted that the ventilation channel 102 extends in a curved manner, so that, after the support 32 is attached to the molding base 23, the ventilation channel 102 can prevent contaminants such as dust from entering the sealed space 101 from the external environment of the camera module 100 via the ventilation channel 102 to contaminate the photosensitive area 221 of the photosensitive element 22 held in the sealed space 101 and the portion of the filter element 31 for forming the sealed space 101, so as to prevent occurrence of adverse phenomena such as dirty dots, thereby ensuring the yield of the camera module 100.

Specifically, the vent passage 102 is formed by the vent hole 328 and the vent groove 329 of the holder 32 communicating with each other, wherein the extending direction of the vent hole 328 and the extending direction of the vent groove 329 are not uniform, so that the vent passage 102 extends curvedly. For example, the extending direction of the vent hole 328 and the extending direction of the vent groove 329 are perpendicular to each other, so that the middle portion of the vent passage 102 has a sharp turn, and thus, contaminants such as dust can be effectively prevented from entering the sealed space 101 from the outside environment via the vent passage 102.

Referring to the stage shown in fig. 17A and 17B, after the mount 32 is mounted on the mold base 23 through the mounting medium 1002, the photosensitive device 1000 needs to be subjected to a baking process to enable the mounting medium 1002 to be further cured to form the mounting layer 1001 held between the lower surface 324 of the mount 32 and the top surface 232 of the mold base 23, thereby enabling the mount 32 to be reliably mounted on the mold base 23 and the filter element 31 to be reliably held on the photosensitive path of the photosensitive element 22.

In the baking process, after the gas in the sealed space 101 expands due to heat, the gas can exchange with the gas outside the photosensitive device 1000 through the ventilation channel 102, so that the gas pressure in the sealed space 101 and the gas pressure outside the photosensitive device 1000 can be kept balanced all the time, and thus, the fragile components such as the filter element 31 and the photosensitive element 22 used for forming the sealed space 101 will not crack or chip due to uneven pressure, which is particularly important for ensuring the imaging quality and yield of the imaging module 100.

For example, if the ventilation channel 102 for communicating the sealed space 101 with the outside of the photosensitive device 1000 is not provided to exchange the gas in the sealed space 101 with the gas outside of the photosensitive device 1000, during the baking process, the gas in the sealed space 101 may expand due to expansion with heat and contraction with cold, which may cause the gas pressure in the sealed space 101 to become large and directly act on the photosensitive region 221 of the photosensitive element 22 and the portion of the filter element 31 held in the sealed space 101 for forming the sealed space 101, for example, for the photosensitive region 221 of the photosensitive element 22, once the photosensitive region 221 of the photosensitive element 22 is subjected to a relatively large pressure, the photosensitive region 221 of the photosensitive element 22 may be deformed such that the photosensitive region 221 of the photosensitive element 22 may be depressed, so as to affect the imaging quality of the camera module 100; for the optical filter 31, if the pressure applied to the lower portion of the optical filter 31 is greater than the pressure applied to the upper portion of the optical filter 31, the optical filter 31 may crack or fracture, and once the optical filter 31 cracks or fractures, the imaging quality of the camera module 100 may be affected, or even the camera module 100 may be disabled.

In the camera module 100 of the present invention, the ventilation channel 102 formed in the support 32 communicates with the sealed space 101 and the outside of the photosensitive device 1000, so that, when the gas in the sealed space 101 expands due to heat during the baking process, the expanded gas can be discharged to the outside of the photosensitive device 1000 through the ventilation groove 329 and the ventilation hole 328 in order, and at this time, the gas pressure in the sealed space 101 is balanced with the gas pressure of the outside of the photosensitive device 1000, so that the portion of the photosensitive region 221 of the photosensitive element 22 and the filter element 31, which are held in the sealed space 101 for forming the sealed space 101, is not subjected to the gas pressure. After the baking process is performed and when the photosensitive device 1000 is cooled, the gas outside the photosensitive device 1000 can be supplied to the sealed space 101 through the ventilation hole 328 and the ventilation groove 329 in order, and at this time, the gas pressure in the sealed space 101 is balanced with the gas pressure outside the photosensitive device 1000, so that the portion of the photosensitive region 221 of the photosensitive element 22 and the filter element 31 held in the sealed space 101 for forming the sealed space 101 is not subjected to the gas pressure. That is, the ventilation channel 102 can always keep the gas pressure in the sealed space 101 and the gas pressure outside the photosensitive device 1000 balanced, which is particularly important for ensuring the imaging quality and yield of the imaging module 100.

Meanwhile, the mounting medium 1002 may expand when heated, and the depth dimension of the glue overflow groove 3206 is larger than the thickness dimension of the mounting medium 1002, so that the expanded mounting medium 1002 may overflow into the glue overflow groove 3206 and may not block the ventilation channel 102. In other words, since the depth dimension of the first air passage 3293 is greater than the thickness dimension of the mounting medium 1002, the expanded mounting medium 1002 can overflow into the first air passage 3293 without blocking the air passage 102.

In addition, since the ventilation passage 102 is curvedly extended, even if contaminants such as dust are carried in the gas when the gas is supplied from the outside of the photosensitive device 1000 to the sealed space 101 via the ventilation passage 102, the contaminants such as dust can be trapped at the turning position of the ventilation passage 102, that is, the limit position of the entrance of the contaminants such as dust into the ventilation hole 328 of the ventilation passage 102 is the position of the ventilation passage 102, and the contaminants such as dust do not enter the ventilation groove 329 of the ventilation passage 102, so that the image pickup module 100 can avoid the occurrence of defects such as contamination points.

Referring to fig. 17C, after the baking process is completed, the sealing medium 104 is filled in the vent holes 328 forming the vent channels 102, and the sealing member 103 held in the vent holes 328 is formed after the sealing medium 104 is cured, wherein the sealing member 103 prevents the sealing space 101 from communicating with the outside of the photosensitive device 1000, so that the sealing space 101 can form a complete closed space, whereby contaminants such as dust are prevented from entering the sealing space 101 in the following. It should be noted that, since the extending direction of the vent hole 328 is different from the extending direction of the vent groove 329, when the sealing medium 104 is filled into the vent hole 328, the sealing medium 104 is prevented from entering the vent groove 329 due to poor fluidity of the sealing medium 104, in this way, the sealing medium 104 can be prevented from entering the sealing space 101, so as to ensure quality and product yield of the camera module 100.

In the stage shown in fig. 18, the driver 40 assembled with the optical lens 10 is attached to the upper surface 326 of the holder 32, and the motor pin 41 of the driver 40 is connected to the substrate 211 so that the optical lens 10 is held in the photosensitive path of the photosensitive element 22, and the filter element 31 is held between the optical lens 10 and the photosensitive element 22. In this process, the positioning protrusions 3230 protruding from the upper surface 326 of the support 32 can guide the driver 40 to be mounted to a correct position.

In the stage shown in fig. 19, the module connection end 2121 of the connection board 212 is attached to the substrate front surface 2111 of the substrate 211 through the connection medium 2123 to conductively connect the connection board 212 and the substrate 211, thereby obtaining the camera module 100 shown in fig. 20. Alternatively, in other examples of the camera module 100, the module connection end 2121 of the connection board 212 may be attached to the substrate back surface 2112 of the substrate 211 through the connection medium 2123.

It should be noted that the stage shown in fig. 19 may also be followed by the stage shown in fig. 7, so that the module connection end 2121 of the connection board 212 is first attached to the front substrate surface 2111 of the substrate 211 through the connection medium 2123, and then a molding process is performed, in which the molding base 23 integrally combined with the edge region 2114 of the substrate 211 is also capable of embedding the module connection end 2121 of the connection board 212, so that the molding base 23 can reliably attach the module connection end 2121 of the connection board 212 to the front substrate surface 2111 of the substrate 211 to prevent the module connection end 2121 of the connection board 212 from falling off from the substrate 211.

Fig. 21 shows a modified embodiment of the camera module 100, unlike the camera module 100 shown in fig. 20, in the camera module 100 shown in fig. 21, the driver 40 is attached to the top surface 232 of the mold base 23. In other words, the driver 40 is mounted on the outside of the top surface 232 of the molding base 23, and the stand 32 is mounted on the inside of the top surface 232 of the molding base 23, in such a manner that the height dimension of the camera module 100 can be further reduced.

Fig. 22 shows another variant embodiment of the camera module 100, unlike the camera module 100 shown in fig. 21, in the camera module 100 shown in fig. 22, the top surface 232 of the molding base 23 has a top surface inside 2321, a top surface outside 2322, and a base mounting groove 2323, wherein the top surface outside 2322 surrounds the top surface inside 2321, and the top surface outside 2322 is higher than the top surface inside 2321, so that a height difference is provided between the top surface outside 2322 and the top surface inside 2321, thereby forming the base mounting groove 2323, and the base mounting groove 2323 communicates with the optical window 231. In one example, the top surface inner side 2321, the top surface outer side 2322, and the base mounting groove 2323 of the top surface 232 of the molded base 23 are formed by the same molding process. In another example, the top surface outside 2322 of the top surface 232 of the molding base 23 may be first formed by a molding process, and then an inside portion of the top surface 232 of the molding base 23 may be formed by a process region such as grinding to form the top surface inside 2321 of the top surface 232 of the molding base 23 and the base mounting groove 2323.

The stand 32 is attached to the inside 2321 of the top surface 232 of the molding base 23 such that the stand 32 is held in the base attaching groove 2323, in such a manner that a difference in height between the upper surface 326 of the stand 32 and the outside 2322 of the top surface 232 of the molding base 23 can be reduced, thereby facilitating further reduction in imaging quality of the camera module.

Fig. 23 shows another modified embodiment of the camera module 100, unlike the camera module 100 shown in fig. 20, in the camera module 100 shown in fig. 23, the camera module 100 further includes at least one lens barrel 50, wherein the optical lens 10 is assembled to the lens barrel 50, the lens barrel 50 is attached to the top surface 232 of the mold base 23 such that the optical lens 10 is held in a photosensitive path of the photosensitive element 22, and the filter element 31 is held between the optical lens 10 and the photosensitive element 22. Alternatively, the lens barrel 50 may be integrally formed at the top surface 232 of the mold base 23, i.e., the lens barrel 50 and the mold base 23 may be integrally formed by the same molding process. Alternatively, the lens barrel 50 may be attached to the upper surface 326 of the holder 32, or the lens barrel 50 may be integrally formed with the holder 32.

In another modification of the camera module 100 shown in fig. 24, in the process of manufacturing the camera module 100, the photosensitive element 22 is first attached to the attaching region 2113 of the substrate 211, and the photosensitive element 22 and the substrate 211 are conducted with each other, and then a molding process is performed so that the molding base 23 integrally bonded to the edge region 2114 of the substrate 211 can be further bonded to the non-photosensitive region 222 of the photosensitive element 22, thereby integrally bonding the molding base 23, the photosensitive element 22 and the substrate 211. In this way, there is no need to reserve a safety position between the mold base 23 and the photosensitive element 22 to further reduce the length-width dimension of the camera module 100.

Fig. 25 shows another variant embodiment of the camera module 100, wherein the base plate 211 has at least one receiving space 2116, wherein the receiving space 2116 extends from the base plate front surface 2111 toward the base plate back surface 2112 of the base plate 211, wherein the photosensitive element 22 is held in the receiving space 2116 of the base plate 211, and the photosensitive element 22 and the base plate 211 are electrically connected to each other, and the mold base 23 is integrally coupled to the base plate 211 and the photosensitive element 22, in such a way that the height dimension of the camera module 100 can be further reduced. It should be noted that the accommodating space 2116 may be a groove or a through hole. It is to be understood that by making the photosensitive element 22 held in the accommodation space 2116 of the substrate 211, it is possible to reduce the difference in height between the upper surface of the photosensitive element 22 and the substrate front surface 2111 of the substrate 211, even to make the upper surface of the photosensitive element 22 flush with the substrate front surface 2111 of the substrate 211, or to make the upper surface of the photosensitive element 22 lower than the substrate front surface 2111 of the substrate 211.

Fig. 26 shows another variant embodiment of the camera module 100, in which the receiving space 2116 of the substrate 211 is implemented as a through hole, i.e., the receiving space 2116 forms a substrate passage of the base 211, the substrate connector 2115 of the substrate 211 is disposed at the substrate back 2112 of the substrate 211, wherein the non-photosensitive region 222 of the photosensitive element 22 is attached to the substrate back 2112 of the substrate 211, and the chip connector 223 disposed at the non-photosensitive region 222 of the photosensitive element 22 and the substrate connector 2115 disposed at the substrate back 2112 of the substrate 211 are mutually conductive, wherein the substrate 211 surrounds the periphery of the photosensitive region 221 of the photosensitive element 22, so that the photosensitive region 221 of the photosensitive element 22 corresponds to the receiving space 2116 of the substrate 211, wherein the molded base 23 is integrally bonded to the substrate 211 and the photosensitive element 22, whereby the camera module 100 can be further reduced in height.

Fig. 27A shows another variant embodiment of the camera module 100, the molded photosensitive unit 20 further includes at least one back mold 26, wherein the back mold 26 is integrally bonded to the substrate back surface 2112 of the substrate 211 for reinforcing the strength of the substrate 211. Preferably, the back surface molding part 26 is also capable of being bonded to at least a portion of the back surface of the chip of the photosensitive element 22, so that the back surface molding part 26 can enable the photosensitive element 22 to be reliably attached to the substrate back surface 2112 of the substrate 211 to prevent the photosensitive element 22 from falling off from the substrate back surface 2112 of the substrate 211. Preferably, the back molding 26 and the molding base 23 may be formed by the same molding process. Alternatively, it is also possible to form the molded base 23 by a molding process first and then form the back side mold 26 by a molding process.

Fig. 28A and 28B show a variant embodiment of the support 32, unlike the support 32 shown in fig. 6A and 6B, in the support 32 shown in fig. 28A and 28B the support 32 has a set of ventilation holes 328 and one ventilation slot 329, wherein each ventilation hole 328 is spaced apart from each other and each ventilation hole 328 extends from the upper surface 326 of the support 32 in the direction of the lower surface 324, wherein the ventilation slot 329 is formed in the lower surface 324 of the support 32 and extends from the inner side 325 of the support 32 to the outer side 327, wherein each ventilation hole 328 is in communication with the ventilation slot 329, respectively, such that the ventilation slot 329 and each ventilation hole 328 form the ventilation channel 102. It will be appreciated that in this particular example of the support 32 shown in fig. 28A and 28B, the inner diameter of each of the vent holes 328 of the support 32 may be smaller relative to the support 32 shown in fig. 6A and 6B, such that contaminants such as dust are effectively prevented from entering the sealed space 101 from the outside environment via each of the vent holes 328. And because the number of the ventilation holes 328 is relatively large, the ventilation channel 102 formed by the ventilation holes 328 having a smaller inner diameter size does not have any adverse effect on the gas exchange between the sealed space 101 and the external environment during the baking process. After the baking process is completed, the sealing medium 104 may be automatically filled into each of the vent holes 328 by applying the sealing medium 104 to the upper surface 326 of the support 32 to form the sealing element 103 held within each of the vent holes 328 after the sealing medium 104 is cured. For example, when attaching the driver 40 to the upper surface 326 of the carrier 32, it is necessary to glue the upper surface 326 of the carrier 32, at which time the glue applied may form the sealing medium 104 for further forming the sealing element 103 closing each of the ventilation holes 328, in such a way that no special procedure is required for closing the ventilation channel 102.

In another variant embodiment of the support 32 shown in fig. 29A and 29B, the support 32 has one vent 328 and a plurality of vent grooves 329, wherein the vent 328 extends from the upper surface 326 toward the lower surface 324 of the support 32, each vent groove 329 being formed in the lower surface 324 of the support 32 and extending from the inner side 325 toward the outer side 327 of the support 32, respectively, wherein the vent 328 and each vent groove 329 communicate with each other to form the vent channel 102. In this way, when the mount 32 is mounted on the molding base 23 through the mounting medium 1002, even if one of the ventilation grooves 329 is closed by the mounting medium 1002, the other ventilation groove 329 can be kept clear, so that the ventilation channel 102 is kept clear all the time, to improve the yield of the camera module 100.

It should be noted that, although the specific example of the stand 32 shown in fig. 29B is exemplified by the shape of the vent 329 having a "V" shape, it is not limited to the content and the scope of the camera module 100 of the present invention, and in other possible examples, the vent 329 may have any shape as long as it can communicate with the vent 328, and the vent 329 and the vent 328 form the vent channel 102.

Fig. 30 to 34C show another variant of the camera module 100, unlike the above-described example, in this particular example of the camera module 100 shown in fig. 30 to 34C, the ventilation channel 102 is formed between the support 32 and the molding base 23.

Specifically, referring to fig. 34A to 34C, the holder 32 has at least one vent groove 329, wherein the vent groove 329 is formed at the lower surface 324 of the holder 32, and the vent groove 329 extends from the inner side 325 to the outer side 327 of the holder 32, wherein after the lower surface 324 of the holder 32 and the top surface 232 of the mold base 23 are attached together by the attaching layer 1001 formed by the attaching medium 1002, the vent groove 329 of the holder 32 forms the vent passage 102 between the lower surface 324 of the holder 32 and the top surface 232 of the mold base 23, and the vent passage 102 serves to communicate the sealed space 101 and the outside of the photosensitive device 1000.

Preferably, the vent groove 329 of the holder 32 is curvedly extended, for example, the vent groove 329 may have an "S" shape or a "V" shape, so that the vent passage 102 formed between the lower surface 324 of the holder 32 and the top surface 232 of the mold base 23 at a position corresponding to the vent groove 329 after the holder 32 is attached to the mold base 23 is curvedly extended, and thus, it is possible to prevent contaminants such as dust from entering the sealed space 101 from the outside of the photosensitive device 1000 through the vent passage 102.

Further, the support 32 has at least one first groove 3210 and at least one second groove 3220, wherein the first groove 3210 extends from the outer side 327 of the support 32 toward the inner side 325 of the support 32, the second groove 3220 extends from the inner side 325 of the support 32 toward the outer side 327 of the support 32, and the first groove 3210 and the second groove 3220 are communicated with each other to form the ventilation channel 329, and thus the ventilation channel 102 is formed subsequently.

Preferably, the extending direction of the first groove 3210 and the extending direction of the second groove 3220 are not identical, so that the ventilation channel 102 is curvedly extended after the ventilation channel 102 is formed by the ventilation channel 329 formed by the first groove 3210 and the second groove 3220. Optionally, at least one of the first groove 3210 and the second groove 3220 is curvedly extended, so that the vent channel 102 is curvedly extended after the vent channel 329 formed by the first groove 3210 and the second groove 3220 forms the vent channel 102. In addition, the first groove 3210 and the second groove 3220 may have different depths, for example, a depth dimension of the first groove 3210 is greater than a depth dimension of the second groove 3220, in such a manner that the mounting medium 1002 can overflow into the first groove 3210 and prevent the mounting medium 1002 from filling the first groove 3210 when mounting the support 32 on the top surface 232 of the molding base 23, thereby ensuring the smoothness of the ventilation channel 102. Further, the first groove 3210 may be formed at the glue-drawing area 3242 of the support 32, and the second groove 3220 may be formed at the non-glue-drawing area 3241 of the support 32.

Fig. 35 shows another variant of the mount 32 of the camera module 100, in which the mount 32 shown in fig. 34A to 34C differs in that, in this particular example of the mount 32 shown in fig. 35, two second grooves 3220 can communicate with one and the same first groove 3210, for example, the ventilation channel 102 can have a "Y" shape after the ventilation channel 102 is formed by the first groove 3210 and the ventilation groove 329 formed by each of the second grooves 3220. That is, a plurality of the second grooves 3220 may communicate with the same one of the first grooves 3210. Alternatively, a plurality of the first grooves 3210 may communicate with the same one of the second grooves 3220.

Fig. 36 shows a variant embodiment of the molded circuit board assembly 2000, the vent groove 329 may be formed on the top surface 232 of the molded base 23, for example, the vent groove 329 is formed in synchronization with the molded base 23 when the molding process is performed, or the vent groove 329 is formed by removing a portion of the top surface 232 of the molded base 23 after the molded base 23 is formed, wherein the vent groove 329 extends from the base inner surface 234 to the base outer surface 235 of the molded base 23 such that the vent groove 329 communicates with the outside of the optical window 231 and the molded base 23, such that the vent channel 102 is formed at a position corresponding to the vent groove 329 for communicating the sealed space 101 with the outside of the photosensitive device 1000 after the support 32 is attached to the top surface 232 of the molded base 23. It is understood that the vent groove 329 formed on the top surface 232 of the molding base 23 may be formed by communicating at least one of the first grooves 3210 and at least one of the second grooves 3220 with each other.

Fig. 37 shows another variant embodiment of the camera module 100, the support 32 having at least one vent 328, wherein the vent 328 extends from the upper surface 326 to the lower surface 324 of the support 32, and the vent 328 communicates the upper surface 326 and the lower surface 324 of the support 32. The top surface 232 of the molded base 23 has at least one vent channel 329, wherein the vent channel 329 extends from the base inner surface 234 of the molded base 23 towards the base outer surface 235, wherein the vent holes 328 of the support 32 communicate with the vent channel 329 of the molded base 23 when the lower surface 324 of the support 32 is attached to the top surface 232 of the molded base 23 by the attachment layer 1001 such that the vent holes 328 of the support 32 and the vent channel 329 of the molded base 23 form the vent channel 102, whereby the vent channel 102 is used to communicate the sealed space 101 with the outside of the photosensitive device 1000.

Further, the top surface 232 of the molded base 23 further has a vent groove 3240 and a glue overflow groove 3250, wherein the vent groove 3240 and the glue overflow groove 3250 communicate with each other to form the vent groove 329. The glue overflow groove 3250 communicates the vent groove 3240 with the vent hole 328 of the support 32, wherein a depth dimension of the glue overflow groove 3250 is greater than a depth dimension of the vent groove 3240, such that the mounting medium 1002 overflowing into the vent groove 329 can be held within the glue overflow groove 3250 and the mounting medium 1002 overflowing into the glue overflow groove 3250 is prevented from filling the glue overflow groove 3250 to keep the vent passage 102 clear.

Fig. 38A shows a schematic cross-sectional view of a modified embodiment of the holder 32, fig. 38B shows a schematic cross-sectional view of a modified embodiment of the photosensitive device 1000, and fig. 38C and 38D show a schematic cross-sectional view and a partially enlarged schematic view, respectively, of a modified embodiment of the camera module 100, the vent holes 328 of the holder 32 extending from the upper surface 326 to the non-adhesive-drawing region 3241 of the lower surface 324 of the holder 32, and the vent holes 328 of the holder 32 corresponding to the optical windows 231 of the mold base 23 after the adhesive-drawing region 3242 of the lower surface 324 of the holder 32 is attached to the top surface 232 of the mold base 23, in such a manner that the vent holes 328 of the holder 32 can form the vent channels 102 for communicating the sealed space 101 with the outside of the photosensitive device 1000.

It should be noted that the position of the vent 328 is not limited in the camera module 100 of the present invention, and for example, the vent 328 may be formed in the middle of the support 32, may be formed at a corner of the support 32, or any other possible position.

Referring to fig. 38B to 38D, the photosensitive device 1000 further includes the sealing member 103, the sealing medium 104 is filled in the vent holes 328 of the holder 32 after the photosensitive device 1000 is obtained by baking the photosensitive device blank 1100, and the sealing member 103 held in the vent holes 328 is formed after the sealing medium 104 is cured in the vent holes 328, wherein the sealing member 103 is used to block the vent holes 328 to prevent the communication between the sealing space 101 and the outside of the photosensitive device 1000, so that contaminants such as dust outside the photosensitive device 1000 can be prevented from entering the sealing space 101 to ensure the yield of the image pickup module 100.

Fig. 39A shows a schematic perspective view of a modified embodiment of the holder 32, fig. 39B shows a schematic cross-sectional view of a modified embodiment of the filter unit 30, fig. 39C shows a schematic cross-sectional view of a modified embodiment of the photosensitive device 1000, fig. 39D and 39E are a schematic cross-sectional view and a partially enlarged schematic view, respectively, of a modified embodiment of the camera module 100, the vent groove 329 of the holder 32 is formed on the upper surface 326 of the holder 32, and the vent groove 329 extends from the inner side 325 to the outer side 327 of the holder 32, and the vent groove 329 forms the vent passage 102 between the holder 32 and the filter element 31 after the filter element 31 is attached to the upper surface 326 of the holder 32. It is understood that the vent passage 102 communicates with the vent passage 321 of the support 32. Referring to fig. 39C to 39E, the ventilation passage 102 formed between the holder 32 and the filter element 31 serves to communicate the sealed space 101 with the outside of the photosensitive device 1000.

Further, the vent groove 329 of the holder 32 is formed on the upper surface inner side 3261 of the upper surface 326 of the holder 32 and is located in the mounting groove 3201 of the holder 32, and the vent groove 329 extends from the inner surface lower side 3252 of the inner side 325 of the holder 32 toward the outer side 327, for example, the vent groove 329 may extend from the inner surface lower side 3252 of the inner side 325 to the inner surface upper side 3251. After the filter element 31 is attached to the upper surface inner side 3261 of the upper surface 326 of the holder 32 and the filter element 31 is held in the attaching groove 3201 of the holder 32, a slit 33 is formed between the outer wall of the filter element 31 and the inner surface upper side 3251 of the holder 32, wherein the ventilation groove 329 communicates with the ventilation channel 321 of the holder 32 and the slit 33, so that the ventilation groove 329 and the slit 33 form the ventilation channel 102.

Referring to fig. 39B to 39E, the photosensitive device 1000 further includes the sealing member 103, the sealing medium 104 is filled in the gap 33 formed between the holder 32 and the filter member 31 after the photosensitive device 1000 is obtained by baking the photosensitive device blank 1100, and the sealing medium 104 is cured in the gap 33 to form the sealing member 103 held in the gap 33 to prevent the sealing space 101 from communicating with the outside of the photosensitive device 1000, so that contaminants such as dust outside the photosensitive device 1000 can be prevented from entering the sealing space 101 to secure the yield of the camera module 100.

Fig. 40A shows a schematic perspective view of a variant embodiment of the support 32, fig. 40B shows a schematic cross-sectional view of a variant embodiment of the photosensitive device 1000, and fig. 40C and 40D show a schematic cross-sectional view and a schematic partially enlarged view of a variant embodiment of the camera module 100, respectively. The outer side 327 of the support 32 extends obliquely, and the angle of inclination of the outer side 327 of the support 32 coincides with the angle of inclination of the base inner surface 234 of the molded base 23, wherein the outer side 327 of the support 32 is attached to the base inner surface 234 of the molded base 23 such that the filter element 31 attached to the support 32 is held on the photosensitive path of the photosensitive element 22. That is, in this specific example of the camera module 100 of the present invention, the lower surface 324 of the stand 32 may not be attached to the top surface 232 of the mold base 23, but the outer side 327 of the stand 32 may be attached to the base inner surface 234 of the mold base 23, in such a manner that a space for attaching the stand 32 may not be required to be reserved on the top surface 232 of the mold base 23, thereby being advantageous in reducing the length-width dimension of the camera module 100. Moreover, since the inclination angle of the outer side surface 327 of the support 32 is identical to the inclination angle of the base inner surface 234 of the molded base 23, the flatness of the filter element 31 can be ensured after the outer side surface 327 of the support 32 and the base inner surface 234 of the molded base 23 are bonded together, so that the optical performance of the camera module 100 can be ensured.

The vent groove 329 of the holder 32 is provided at the outer side 327 of the holder 32, and the vent groove 329 extends from the upper surface 326 to the lower surface 324 of the holder 32 such that the vent groove 329 communicates with the upper surface 326 and the lower surface 324 of the holder 32, whereby the vent groove 329 forms the vent passage 102 between the outer side 327 of the holder 32 and the base inner surface 234 of the molded base 23 after the outer side 327 of the holder 32 and the base inner surface 234 of the molded base 23 are bonded to each other, wherein the vent passage 102 is used to communicate the sealed space 101 with the outside of the photosensitive device 1000. Preferably, the vent groove 329 of the support 32 extends in a curved manner, for example, the vent groove 329 of the support 32 may have, but is not limited to, an "S" shape, a "Y" shape, a "V" shape, or the like, so that the vent channel 102 formed between the outer side 327 of the support 32 and the base inner surface 234 of the molded base 23 after the outer side 327 of the support 32 and the base inner surface 234 of the molded base 23 are bonded to each other, extends in a curved manner, in such a manner as to facilitate preventing contaminants such as dust outside the photosensitive device 1000 from entering the sealed space 101 through the vent channel 102, and preventing the vent channel 102 from flowing into the sealed space 101 when the sealing medium 104 is filled in the vent channel 102, so that the sealing medium 104 is held in the vent channel 102 and forms the sealing element 103 after curing, thereby preventing the sealing medium 104 from contaminating the defective camera module 100 due to entering the sealed space 101.

It should be noted that the lower opening of the ventilation channel 102 is hidden outside the lower surface 324 of the support 32, so that no influence is exerted on the light entering the sealed space 101 from the filter element 31.

Alternatively, the vent groove 329 may be formed on the base inner surface 234 of the mold base 23 and extend from the top surface 232 of the mold base 23 toward the substrate 211 to a position such that the vent groove 329 forms the vent passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 between the outer side 327 of the holder 32 and the base inner surface 234 of the mold base 23 after the outer side 327 of the holder 32 and the base inner surface 234 of the mold base 23 are adhered to each other.

Fig. 41 shows a schematic cross-sectional view of another modified embodiment of the photosensitive device 1000, unlike the photosensitive device 1000 shown in fig. 40B, in this specific example of the photosensitive device 1000 shown in fig. 41, the support 32 of the photosensitive device 1000 has the vent holes 328, wherein the vent holes 328 extend from the upper surface 326 to the lower surface 324 of the support 32, so that the vent holes 328 form the vent passage 102 for communicating the sealed space 101 with the outside of the photosensitive device 1000 after the filter unit 30 is attached to the molded photosensitive unit 20.

Fig. 42A, 42B and 42C are respectively a perspective view and a cross-sectional view of another variant embodiment of the stand 32, fig. 42D is a cross-sectional view of the filter unit 30, fig. 42E is a cross-sectional view of the photosensitive device 1000, and fig. 42F and 42G are respectively a cross-sectional view and a partially enlarged view of the camera module 100.

Referring to fig. 42A to 42D, the holder 32 includes a base attaching portion 34, a connecting portion 35, and a filter attaching portion 36, wherein the connecting portion 35 extends upward and downward to be connected to the base attaching portion 34 and the filter attaching portion 36, respectively, for example, the base attaching portion 34, the connecting portion 35, and the filter attaching portion 36 of the holder 32 may be integrally formed by injection molding or the like such that the connecting portion 35 extends upward and downward to be connected to the base attaching portion 34 and the filter attaching portion 36, respectively, and in such a manner that the filter attaching portion 36 of the holder 32 can form a sunken filter attaching portion, and the holder 32 can form a sunken holder.

Specifically, after the base attaching portion 34 of the holder 32 is attached to the top surface 232 of the mold base 23, for example, after the base attaching portion 34 of the holder 32 is attached to the top surface inside 2321 of the mold base 23 so that the holder 32 is held in the base attaching groove 2323 of the mold base 23, the connection portion 35 causes the filter attaching portion 36 to be held in the light window 231 of the mold base 23, thereby further causing the filter element 31 attached to the filter attaching portion 36 to be held in the light window 231 of the mold base 23, and causing the filter element 31 to be held on the photosensitive path of the photosensitive element 22. The filter mounting part 36 has the light passing channel 321, wherein the connection part 35 surrounds the periphery of the filter mounting part 36, and the lower end of the connection part 35 is connected to the outside of the filter mounting part 36, or the lower end of the connection part 35 is integrally formed with the outside of the filter mounting part 36, wherein the base mounting part 34 surrounds the periphery of the connection part 35, and the higher end of the connection part 35 is connected to the inside of the base mounting part 34, or the higher end of the connection part 35 is integrally formed with the inside of the base mounting part 34.

It should be noted that the light-transmitting channel 321 may be formed synchronously when the base attaching portion 34, the connecting portion 35, and the filter attaching portion 36 of the support 32 are integrally formed, or the light-transmitting channel 321 may be formed by removing a middle portion of the filter attaching portion 36 after the base attaching portion 34, the connecting portion 35, and the filter attaching portion 36 of the support 32 are formed.

Referring to fig. 42A to 42G, after the base attaching portion 34 of the holder 32 is attached to the top surface 232 of the molding base 23, the connection portion 35 of the holder 32 extends from the top surface 232 of the molding base 23 toward the substrate 211 so that the filter attaching portion 36 is sunk into the light window 231 of the molding base 23, thereby surrounding the molding base 23 around the filter attaching portion 36 of the holder 32.

It should be noted that the length of the connection portion 35 of the support 32 determines a specific sinking position of the filter mounting portion 36, in other words, the length of the connection portion 35 of the support 32 determines the relative positions of the filter element 31 and the photosensitive element 22, and the relative positions of the filter element 31 and the photosensitive element 22 determine the size of the filter element 31. In other words, the length of the connection portion 35 of the support 32 determines the size of the filter element 31, so in the image capturing module 100 of the present invention, the size requirement of the image capturing module 100 for the filter element 31 can be changed by adjusting the length of the connection portion 35 of the support 32.

It is also worth mentioning that the extension distance of the connection portion 35 of the support 32 affects the sinking depth of the filter element 31 in the light window 231 of the molding base 23, and the extension distance of the filter mounting portion 36 affects the size of the filter element 31. For example, when the extension distance of the connection portion 35 of the holder 32 is greater, the position of the filter element 31 in the light window 231 of the molding base 23 is closer to the photosensitive element 22, and the back focal distance of the corresponding camera module 100 is smaller, and when the extension distance of the filter mounting portion 36 is greater, the size of the light transmission channel 321 of the holder 32 is smaller, the required size of the filter element 31 is smaller, so that the cost of the filter element 31 can be reduced. However, it will be understood by those skilled in the art that the extending distance of the connection portion 35 of the support 32 needs to be determined in combination with the imaging effect of the camera module 100, for example, a dark spot such as an image of dust is formed on the back focus of the camera module 100, and the extending distance of the filter mount 36 of the support 32 needs to consider factors such as the light path of the camera module 100, the photosensitive region 221 and the non-photosensitive region 222 of the photosensitive element 22, and the remaining width of the substrate 211. For example, when the filter mounting portion 36 is extended inward, in the case where the size of the filter element 31 is small, the filter mounting portion 36 does not block the photosensitive region 221 of the photosensitive element 22, does not block the incoming light too much, and can be extended more at a position where the package of the substrate 211 remains wide, and is extended less at a position where the package of the substrate 211 remains wide, so that the area of the filter element 31 is reduced as much as possible while ensuring the imaging quality of the imaging module 100, thereby ensuring the reliability of the imaging module 100 and reducing the manufacturing cost of the imaging module 100.

Further, a receiving groove 37 is formed between the base attaching portion 34 and the connecting portion 35 of the holder 32, and the attaching groove 3201 is formed between the connecting portion 35 and the filter attaching portion 36 of the holder 32, wherein the filter element 31 attached to the filter attaching portion 36 of the holder 32 is held in the attaching groove 3201, and wherein after the holder 32 is attached to the top surface 232 of the mold base 23, a portion of the mold base 23 is held in the receiving groove 37 of the holder 32, in such a manner that the length-width dimension and the height dimension of the camera module 100 can be advantageously further reduced to facilitate miniaturization of the camera module 100.

In this specific example of the camera module 100 shown in fig. 42A to 42G, the vent hole 328 of the mount 32 is provided to the filter mounting portion 36 of the mount 32, and the vent hole 328 extends from the upper surface to the lower surface of the filter mounting portion 36, and communicates the vent hole 328 with the mounting groove 3201, wherein after the filter element 31 is mounted to the filter mounting portion 36, the slit 33 is formed between the outer wall of the filter element 31 and the connection portion 35, wherein the vent hole 328 communicates with the slit 33, such that the vent hole 328 and the slit 33 form the vent passage 102 for communicating the sealed space 101 with the outside of the photosensitive device 1000.

In another possible example, referring to fig. 43A, the vent hole 328 is provided to the base attaching portion 34 of the holder 32, and the vent hole 328 extends from the upper surface to the lower surface of the base attaching portion 34, and communicates the vent hole 328 with the accommodation groove 37, wherein after the base attaching portion 34 of the holder 32 is attached to the top surface 232 of the mold base 23, the slit 33 is formed between the connection portion 35 and the base inner surface 234 of the mold base 23, wherein the vent hole 328 communicates with the slit 33, such that the vent hole 328 and the slit 33 form the vent passage 102 for communicating the sealed space 101 with the outside of the photosensitive device 1000.

In another possible example, referring to fig. 43B, the vent hole 328 of the holder 32 is provided to the connection portion 35 of the holder 32, and the vent hole 328 extends from the inner surface to the outer surface of the connection portion 35 such that the vent hole 328 communicates with the mounting groove 3201 and the accommodation groove 37, wherein the vent groove 329 of the holder 32 is provided to the filter mounting portion 36, and the vent groove 329 communicates with the mounting groove 3201 and the vent hole 328, wherein the vent groove 329 and the vent hole 328, which communicate with each other, form the vent passage 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 after the filter element 31 is mounted to the filter mounting portion 36 of the holder 32 to form the filter unit 30, and the top surface 232 of the molded base 23 of the holder 32.

Fig. 44 shows a schematic cross-sectional view of another variant embodiment of the camera module 100, the camera module 100 further comprising a light-transmissive protective element 60, wherein the protective element 60 has a light-transmissive region 61, an attachment region 62 and a gas escape space 63, wherein the attachment region 62 surrounds the light-transmissive region 61, the gas escape space 63 being implemented as a gas escape groove, wherein the gas escape space 63 extends from the attachment region 62 to a suitable location of the light-transmissive region 61, wherein the gas escape space 63 forms the gas vent channel 102 for communicating the sealing space 101 with the outside of the photosensitive device 1000 between the attachment region 62 of the protective element 60 and the top surface 232 of the molded base 23 after the attachment region 62 of the protective element 60 is attached to the top surface 232 of the molded base 23. Alternatively, the escape space 63 may be implemented as an escape hole, wherein the escape space 63 extends from the upper surface to the lower surface of the shielding member 60 at the light-transmitting region 61, so that the escape space 63 forms the ventilation channel 102 for communicating the sealed space 101 and the outside of the photosensitive device 1000 after the attaching region 62 of the shielding member 60 is attached to the top surface 232 of the molding base 23. Still alternatively, the escape space 63 may be formed at the top surface 232 of the mold base 23, so that after the attaching region 62 of the shielding member 60 is attached to the top surface 232 of the mold base 23, the escape space 63 forms the ventilation channel 102 for communicating the sealing space 101 with the outside of the photosensitive device 1000 between the top surface 232 of the mold base 23 and the attaching region 62 of the shielding member 60.

Referring to fig. 45 to 49C of the drawings, an image capturing module 100 'according to another preferred embodiment of the present invention is described in the following description, wherein the image capturing module 100' includes at least one optical lens 10 'and at least one molded photosensitive unit 20', wherein the molded photosensitive unit 20 'further includes at least one circuit board 21', at least one photosensitive element 22', and at least one molding part 27', wherein the photosensitive element 22 'is conductively connected to the circuit board 21', and the molding part 27 'is integrally coupled to the circuit board 21', wherein the optical lens 10 'is held in a photosensitive path of the photosensitive element 22'.

The circuit board 21 'further includes at least one substrate 211' and at least one connection board 212', wherein the photosensitive element 22' is conductively connected to the substrate 211', wherein the connection board 212' has a module connection 2121 'and a device connection 2122' corresponding to the module connection 2121', wherein the module connection 2121' of the connection board 212 'is conductively connected to the substrate 211', and the device connection 2122 'of the connection board 212' is electrically connected to the device body 200.

In one embodiment, the module connection 2121' of the connection plate 212' is attached to the substrate 211' by a connection medium 2123', such that the module connection 2121' of the connection plate 212' is conductively connected to the substrate 211'. Optionally, the module connection end 2121' of the connection plate 212' integrally extends to the base plate 211', i.e., the connection plate 212' and the base plate 211' are of a unitary structure.

In addition, the connection plate 212 'includes a connector 2124', wherein the connector 2124 'is provided to the device connection end 2122' of the connection plate 212', or the connector 2124' is formed to the device connection end 2122 'of the connection plate 212', wherein the device connection end 2122 'of the connection plate 212' can be conveniently electrically connected to the device body 200 through the connector 2124 'of the connection plate 212'.

It should be noted that the connection board 212 'is soft and capable of being deformed, wherein the camera module 100' is connected to the device body 200 through the connection board 212', in this way, the connection board 212' can buffer assembly displacement and deformation caused by manufacturing tolerance of the camera module 100', and displacement of the camera module 100' caused by vibration during the use of the device body 200, thereby ensuring reliability of the electronic device during the use.

The substrate 211' has a substrate front side 2111' and a substrate back side 2112', wherein the substrate front side 2111' and the substrate back side 2112' correspond to each other. Typically, the substrate 211 'is planar such that the substrate front surface 2111' and the substrate back surface 2112 'of the substrate 211' are planar, such that the substrate front surface 2111 'and the substrate back surface 2112' of the substrate 211 'define a thickness dimension of the substrate 211'. That is, the distance between the substrate front surface 2111 'and the substrate back surface 2112' of the substrate 211 'is the thickness dimension of the substrate 211'.

The substrate 211 'further has at least one flat mounting region 2113' and an edge region 2114 'surrounding the mounting region 2113', wherein the mounting region 2113 'and the edge region 2114' are formed on the substrate front surface 2111 'of the substrate 211', respectively, wherein the photosensitive element 22 'is mounted on the mounting region 2113' of the substrate 211', wherein the molding part 27' is integrally bonded to at least a portion of the edge region 2114 'of the substrate 211'.

In general, the substrate 211 'has a good hardness to ensure flatness of the substrate 211', in such a manner that flatness of the photosensitive element 22 'can be ensured when the photosensitive element 22' is mounted on the mounting area 2113 'of the substrate 211'. For example, the substrate 211' may be, but is not limited to, a hard board, a hard-soft bonded board, a ceramic substrate, etc.

Further, the molded photosensitive unit 20 'further includes at least one connection line 24', wherein both ends of the connection line 24 'are conductively connected to the photosensitive element 22' and the substrate 211', respectively, such that the photosensitive element 22' mounted on the mounting region 2113 'of the substrate 211' is conductively connected to the substrate 211 'through the connection line 24'.

Specifically, the substrate 211' further has at least one substrate connector 2115', wherein each of the substrate connectors 2115' is disposed at the edge region 2114' of the substrate 211', respectively. For example, the substrate connectors 2115' may be arranged in two sets, but not limited to, and each set of the substrate connectors 2115' is symmetrically disposed at both sides of the mounting area 2113', respectively. Accordingly, the photosensitive element 22' has a photosensitive area 221', a non-photosensitive area 222', and at least one chip connecting member 223', wherein the non-photosensitive area 222' surrounds the photosensitive area 221', and each chip connecting member 223' is disposed on the non-photosensitive area 222' of the photosensitive element 22'. For example, the chip connectors 223' may be arranged in two sets, but are not limited to, and each set of the chip connectors 223' is symmetrically disposed at both sides of the photosensitive region 221', respectively.

Preferably, after the photosensitive element 22' is mounted on the mounting region 2113' of the substrate 211', each of the chip connectors 223' provided to the non-photosensitive region 222' of the photosensitive element 22' corresponds to each of the substrate connectors 2115' provided to the edge region 2114' of the substrate 211', respectively.

The both end portions of the connection line 24' are connected to the substrate connection 2115' of the substrate 211' and the chip connection 223' of the photosensitive element 22', respectively, to conductively connect the photosensitive element 22' and the substrate 211'. For example, the connection line 24 'may be formed between the substrate connection 2115' of the substrate 211 'and the chip connection 223' of the photosensitive element 22 'through a wire bonding process, in such a way that the photosensitive element 22' and the substrate 211 'are conductively connected by the connection line 24'.

It should be noted that the bonding direction of the bonding wire 24' is not limited in the camera module 100' of the present invention, for example, the bonding direction of the bonding wire 24' may be from the substrate 211' to the photosensitive element 22', or may be from the photosensitive element 22' to the substrate 211'. In addition, the type of the connection line 24' may not be limited in the camera module 100' of the present invention, and for example, the connection line 24' may be a gold wire, a lead wire, a copper wire, or the like.

Further, the molded photosensitive unit 20 'further includes at least one electronic component 25', wherein the electronic component 25 'is conductively connected to the substrate 211'.

In one example of the camera module 100 'of the present invention, the electronic component 25' may be mounted on the edge region 2114 'of the substrate 211'. Alternatively, a part or all of the electronic component 25 'may be buried in the substrate 211'. Still alternatively, a part of the electronic component 25' may be mounted on the substrate back surface 2112' of the substrate 211', or a part or all of the electronic component 25' located on the substrate back surface 2112' of the substrate 211' may be embedded in the substrate 211'.

It should be noted that the type of the electronic component 25 'is not limited, and for example, the electronic component 25' may be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, and the like.

The molding portion 27' may be integrally bonded to the edge region 2114' of the substrate 211' without embedding the electronic component 25', or may embed at least a part of at least one electronic component 27 '. Preferably, the molding part 27 'embeds the entire electronic components 25' after being integrally bonded to the edge region 2114 'of the substrate 211'. It can be appreciated that, by embedding the electronic component 25' after the molding portion 27' is formed, the molding portion 27' can prevent the electronic component 25' from contacting with the external environment, so as to avoid adverse phenomena such as oxidation on the surface of the electronic component 25'. The molding portion 27' also isolates adjacent electronic components 25' to prevent interference between adjacent electronic components 25'. In addition, by embedding the electronic components 25 'in the molding portion 27' after molding, the molding portion 27 'can also make the interval between adjacent electronic components 25' smaller, thereby enabling the electronic components 25 'having a larger number and size to be mounted on the limited mounting area of the substrate 211'.

In addition, the molding part 27 'can also isolate the electronic component 25' from the photosensitive element 22 'to avoid the photosensitive region 221' of the photosensitive element 22 'from being contaminated by falling objects on the surface of the electronic component 25'. For example, the molding portion 27' may be configured to isolate the electronic component 25' from the photosensitive element 22' by embedding the electronic component 25', or may be configured to isolate the electronic component 25' from the photosensitive element 22' by positioning the electronic component 25' and the photosensitive element 22' on both sides of the molding portion 27 '.

The molding part 27' further includes at least one molding body 271', wherein the molding body 271' is integrally coupled to at least a portion of the edge region 2114' of the substrate 211' through a molding process. Preferably, the molding body 271 'embeds at least a portion of at least one of the electronic components 25' protruding from the substrate front surface 2111 'of the substrate 211'. For example, the molding 271 'can embed all of the electronic components 25'. More preferably, the molding body 271 'can extend from the edge region 2114' of the substrate 211 'to the non-photosensitive region 221' of the photosensitive element 22', i.e., the molding body 271' can embed a portion of the non-photosensitive region 221 'of the photosensitive element 22'. In other words, the molding body 271' can be integrally bonded to the edge region 2114' of the substrate 211' and the non-photosensitive region 222' of the photosensitive element 22'.

Preferably, the number of the molding bodies 271' is two, and the two molding bodies 271' can be symmetrically formed at both sides of the photosensitive region 221' of the photosensitive element 22', and a first light passing space 272' of the molding part 27' and two first installation spaces 273' communicating with the first light passing space 272' are formed between the two molding bodies 271 '.

The camera module 100' further comprises at least one filter unit 30', wherein the filter unit 30' comprises at least one filter element 31', wherein the filter element 31' is held between the optical lens 10' and the photosensitive element 22 '. After entering the image capturing module 100 'from the optical lens 10', the light reflected by the object can be filtered by the filter 31', and then received by the photosensitive element 22' for photoelectric conversion to form an image.

It should be noted that the type of the filter element 31 'of the filter unit 30' is not limited in the camera module 100 'of the present invention, and for example, the filter element 31' may be, but not limited to, an infrared cut filter, a full-spectrum filter.

The filter unit 30' further comprises at least one frame-shaped support 32', wherein the support 32' has at least one light-transmitting channel 321', and wherein the filter element 31' is attached to the support 32' such that the filter element 31' closes the light-transmitting channel 321' of the support 32 '. The support 32' has a second light-passing space 3202' and at least one second installation space 3203' communicating with the second light-passing space 3202', wherein the support 32' is attached to the molding part 27' such that at least a portion of each of the molding bodies 271' of the molding part 27' is installed in each of the second installation spaces 3203' of the support 32', and at least a portion of the support 32' is installed in each of the first installation spaces 273' of the molding part 27', such that the first light-passing space 272' of the molding part 27' and the second light-passing space 3202' of the support 32' can be mutually matched to form a light window 231', wherein the light sensing region 221' of the light sensing element 22' corresponds to the light window 231'.

Further, the mount 32 'includes a mount body 3204' and at least one extension arm 3205 'integrally extending from the mount body 3204'. In this specific example of the camera module 100' of the present invention, the number of the extension arms 3205' is implemented as two, wherein the two extension arms 3205' are respectively integrally and symmetrically extended to the mount body 3204' to form the second light-passing space 3202' and each of the second installation spaces 3203' between the two extension arms 3205', wherein the mount body 3204' has the light-passing channel 321', and the light-passing channel 321' communicates with the second light-passing space 3202'.

When the holder 32' is attached to the molding part 27', each of the extension arms 3205' of the holder 32' is respectively mounted and held in each of the first mounting spaces 273' of the molding part 27', and each of the molding bodies 271' of the molding part 27' is respectively mounted in each of the second mounting spaces 3203' of the holder 32', so that the first light-passing space 272' of the molding part 27' and the second light-passing space 3202' of the holder 32' can be mated with each other to form the light window 231'. After the mount 32' is attached to the molding part 27', a sealed space 101' of the camera module 100' is formed between the filter element 31', the mount 32', the molding part 27' and the substrate 211', wherein the photosensitive region 221' of the photosensitive element 22' is held in the sealed space 101'. In addition, a photosensitive device 1000' can be formed after the filter unit 30' and the molded photosensitive unit 20' are mounted together.

It should be noted that the shape and size of each of the extension arms 3205 'of the support 32' are matched with the shape and size of the first mounting space 273 'of the molding part 27', and the shape and size of each of the molding bodies 271 'of the molding part 27' are matched with the shape and size of each of the second mounting spaces 3203 'of the support 32', in such a manner that the sealing space 101 'of the camera module 100' can be formed between the filter element 31', the support 32', the molding part 27', and the substrate 211'.

The photosensitive device 1000 'includes at least one mounting layer 1001' formed with a mounting medium 1002', wherein the mounting layer 1001' is held between the support 32 'of the filter unit 30' and the molding part 27 'of the molded photosensitive unit 20' for mounting the support 32 'to the molding part 27'.

It should be noted that the type of the mounting medium 1002' is not limited in the camera module 100' of the present invention, for example, the mounting medium 1002' may be, but not limited to, glue, wherein the mounting medium 1002' forms the mounting layer 1001' held between the support 32' and the molding body 271' after curing.

Further, the camera module 100' has at least one ventilation channel 102', wherein the sealed space 101' can be formed between the filter unit 30' and the molded photosensitive unit 20', for example, the sealed space 101' is formed between the filter element 31', the support 32', the molded portion 27', and the substrate 211', and the ventilation channel 102' is used for communicating the sealed space 101' with the outside of the photosensitive device 1000 '. Alternatively, the sealing space 101' may also be formed between the filter element 31', the holder 32', the molding portion 27', and the photosensitive element 22 '. That is, the gas in the sealed space 101 'and the gas outside the photosensitive device 1000' can be exchanged through the ventilation passage 102', so that the balance between the gas pressure in the sealed space 101' and the gas pressure outside the photosensitive device 1000 'can be ensured by the ventilation passage 102' during the manufacture of the image pickup module 100', thereby avoiding the occurrence of the bad phenomenon that each part of the image pickup module 100' for forming the sealed space 101 'is damaged due to the unbalance of the pressure, in particular, the uniform gas pressure applied to the upper and lower parts of the filter element 31', thereby avoiding the bad phenomenon that the filter element 31 'is cracked or broken due to the unbalance of the gas pressure applied to the upper and lower parts of the filter element 31'.

Preferably, the vent channel 102 'is formed in the support 32'. More preferably, the vent channel 102' is formed at the extension arm 3205' of the holder 32', wherein the vent channel 102' communicates the second vent space 3202' with the external environment, so that the vent channel 102' formed at the extension arm 3205' can communicate the sealed space 101' with the external environment after the sealed space 101' is formed between the filter element 31', the holder 32', the molding part 27', and the substrate 211 '. Alternatively, the ventilation channel 102 'may be formed in the molding body 271'.

Preferably, the ventilation channel 102 'extends obliquely, that is, the extending direction of the ventilation channel 102' is not consistent with the extending direction of the plane where the photosensitive area 221 'of the photosensitive element 22' is located, so that when the sealing element 103 'held in the ventilation channel 102' is formed by filling a sealing medium 104 'in the ventilation channel 102', the sealing medium 104 'does not flow into the sealing space 101' in the following process, which is advantageous in ensuring the quality of the camera module 100 'and improving the yield of the camera module 100'.

The camera module 100 'further includes at least one driver 40', wherein the optical lens 10 'is drivably disposed on the driver 40', and the driver 40 'is mounted on the support 32' so that the optical lens 10 'is kept on the photosensitive path of the photosensitive element 22'. The driver 40 'can drive the optical lens 10' to move along the photosensitive path of the photosensitive element 22 'to achieve focusing and zooming of the image capturing module 100' by adjusting the relative positions of the optical lens 10 'and the photosensitive element 22'. It is worth mentioning that the driver 40' may be implemented as, but is not limited to, a voice coil motor.

Further, the driver 40' has at least one motor pin 41', wherein the motor pin 41' of the driver 40' is connected to the substrate 211' to conduct the driver 40' and the substrate 211'.

Fig. 50 shows another modified embodiment of the camera module 100', unlike the camera module 100' shown in fig. 45 to 49C, in this specific example of the camera module 100' shown in fig. 50, the number of the molding bodies 271' of the molding part 27' may be two, and the two molding bodies 271' may be in an "L" shape, and accordingly, the number of the extension arms 3205' of the holder 32' may be two, and the two extension arms 3205' may be in an "L" shape, so that the sealing space 101' may be formed between the filter element 31', the holder 32', the molding part 27', and the substrate 211', or the sealing space 101' may be formed between the filter element 31', the holder 32', the molding part 27', and the photosensitive element 22', after the holder 32' is attached to the molding part 27 '.

Fig. 51 shows a modified embodiment of the camera module 100', unlike the camera module 100' shown in fig. 45 to 49C, in this specific example of the camera module 100 'shown in fig. 51, the number of the molding bodies 271' of the molding part 27 'may be one, and accordingly, the number of the extension arms 3205' of the support 32 'is three, and the three extension arms 3205' are in the shape of "", so that the shape of the support 32 'can be matched with the shape of the molding part 27', so that the sealing space 101 'can be formed between the filter element 31', the support 32', the molding part 27' and the substrate 211', or the sealing space 101' can be formed between the filter element 31', the support 32', the molding part 27 'and the photosensitive element 22', after the support 32 'is attached to the molding part 27'.

Fig. 52 shows a variant embodiment of the camera module 100', unlike the camera module 100' shown in fig. 45 to 49C, in this particular example of the camera module 100 'shown in fig. 52, the number of the molding bodies 271' of the molding part 27 'may be three, and the three molding bodies 271' may be in the shape of "", respectively, the number of the extension arms 3205 'of the support 32' may be one, so that the shape of the support 32 'can be matched with the shape of the molding part 27', so that the sealing space 101 'can be formed between the filter element 31', the support 32', the molding part 27' and the substrate 211', or the sealing space 101' can be formed between the filter element 31', the support 32', the molding part 27 'and the photosensitive element 22', after the support 32 'is attached to the molding part 27'.

Fig. 53 shows another modified embodiment of the camera module 100', unlike the camera module 100' shown in fig. 45 to 49C, in this specific example of the camera module 100' shown in fig. 53, the number of the molding bodies 271' of the molding parts 27' is four, wherein two molding bodies 271' symmetrical to each other are defined as a first molding body 271a ', and the remaining two molding bodies 271' symmetrical to each other are defined as a second molding body 271b ', wherein each of the first molding bodies 271a ' and each of the second molding bodies 271b ' are connected end to end, respectively, and the height dimension of each of the first molding bodies 271a ' is higher than the height dimension of each of the second molding bodies 271b ', so that the first installation space 273 between the two first molding bodies 271a ' is formed at the position corresponding to each of the second molding bodies 271b '. When the mount 32' is attached to the molding part 27', the bottom surface of each extension arm 3205' of the mount 32' is attached to the top surface of each second molding body 271b ', and the side surface of each extension arm 3205' is attached to the side surface of each first molding body 271a ', so that each extension arm 3205' is mounted to each first mounting space 273', respectively. In other words, each of the first molding bodies 271' can extend to the mount main body 3204' of the mount 32', and each of the first molding bodies 271a ' can extend to each of the extension arms 3205'. The holder 32 'may have a shape that is matched with the shape of the molding part 27' so that the sealing space 101 'may be formed between the filter element 31', the holder 32', the molding part 27', and the substrate 211', or the sealing space 101' may be formed between the filter element 31', the holder 32', the molding part 27', and the photosensitive element 22', after the holder 32 'is attached to the molding part 27'.

Fig. 54 shows another variant of the camera module 100', unlike the camera module 100' shown in fig. 53, the extension arm 3205' of the support 32' is provided with at least one recess 3208', wherein the recess 3208' forms the ventilation channel 102' for connecting the sealing space 101' and the outside of the photosensitive device 1000' between the extension arm 3205' of the support 32' and the second molded body 271b ' of the molded body 271' when the support 32' is mounted on the molded body 271 '.

It should be noted that the position of the notch 3208 'of the support 32' is not limited in the camera module 100 'of the present invention, for example, the notch 3208' may be formed at a middle portion or a corner of the extension arm 3205 'of the support 32'.

Alternatively, in other examples of the camera module 100', the notch 3208' of the support 32 'may also form the ventilation channel 102' for communicating the sealed space 101 'with the outside of the photosensitive device 1000' between the extension arm 3205 'of the support 32' and the substrate front surface 2111 'of the substrate 211'.

According to another aspect of the present invention, the present invention further provides a method for manufacturing the photosensitive device 1000, wherein the method comprises the steps of:

(a) At least one sealing space 101 is formed between the light filtering unit 30 and the molded photosensitive unit 20 when the holder 32 is attached to the molded base 23;

(b) Communicating the sealed space 101 with the outside of the photosensitive device 1000 through at least one ventilation passage 102; and

(c) The gas of the sealed space 101 and the gas of the external environment are exchanged with each other via the ventilation channel 102 to balance the gas pressure of the sealed space 101 and the gas pressure of the outside of the photosensitive device 1000.

It should be noted that the vent channel 102 may be formed in the support 32, or the vent channel 102 may be formed in the molded base 23, or the vent channel 102 may be formed between the support 32 and the molded base 23, or a portion of the vent channel 102 may be formed in the support 32, and another portion may be formed in the molded base 23.

According to another aspect of the present invention, the present invention further provides a method for manufacturing the camera module 100, wherein the method comprises the following steps:

(B) Communicating the sealed space 101 with the outside of the photosensitive device 1000 through at least one ventilation passage 102;

(C) Exchanging the gas of the sealed space 101 and the gas of the external environment with each other via the ventilation channel 102 to balance the pneumatic pressure of the sealed space 101 and the pneumatic pressure of the outside of the photosensitive device 1000; and

(D) The optical lens 10 is held on the photosensitive path of the photosensitive element 22 of the molded photosensitive unit 20.

It will be appreciated by persons skilled in the art that the above embodiments are examples only, wherein the features of the different embodiments may be combined with each other to obtain an embodiment which is readily apparent from the disclosure of the invention but which is not explicitly indicated in the drawings. It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A photosensitive device, comprising:

Wherein the photosensitive device has at least one ventilation passage for communicating the sealed space with the outside of the photosensitive device, wherein the ventilation passage is for exchanging gas inside the sealed space with gas outside the photosensitive device to balance the gas pressure inside the sealed space and the gas pressure outside the photosensitive device during the process of manufacturing the photosensitive device;

wherein at least a portion of the lower surface of the support is mounted to the top surface of the molded base by a mounting medium; forming a vent groove in a lower surface of the support or in a top surface of the molding base, the vent groove forming the vent channel between the support and the molding base;

wherein the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation slot, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward respectively to connect to the upper surface and the lower surface, the inner side defines the ventilation channel, wherein the ventilation slot is formed on the lower surface, and the ventilation slot extends from the inner side to the outer side;

The photosensitive device further includes at least one sealing member formed and held in the ventilation channel, wherein the sealing member is formed by curing a sealing medium filled in the ventilation channel after the support is attached to the molded base and a baking process is performed.

2. The photosensitive device according to claim 1, wherein the ventilation groove extends curvedly.

3. The photosensitive device according to claim 1, wherein the shape of the ventilation groove is selected from the group consisting of: the shape group is composed of an L shape, an S shape, a V shape and a Y shape.

4. The photosensitive device according to claim 1, wherein the holder has at least a first groove and at least a second groove, the second groove extends from the inner side surface of the holder toward the outer side surface, the first groove extends from the outer side surface of the holder toward the inner side surface, and the first groove and the second groove communicate with each other to form the ventilation groove of the holder.

5. The photosensitive device according to claim 4, wherein an extending direction of the first groove and an extending direction of the second groove of the holder have an included angle.

6. The photosensitive device according to claim 4, wherein one of the first groove and one of the second grooves communicate with each other to form the ventilation groove of the holder; or a plurality of the first grooves and one of the second grooves are communicated with each other to form the vent grooves of the support; or one of the first grooves and a plurality of the second grooves communicate with each other to form the vent groove of the mount.

7. The photosensitive device of claim 4, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove and the depth dimension of the first groove is greater than a thickness dimension of the mounting medium such that the mounting medium can overflow into the first groove and prevent the mounting medium from filling the first groove to maintain the vent channel clear.

8. A photosensitive device, comprising:

wherein the support has an upper surface, a lower surface, an inner side, an outer side and at least one ventilation groove, wherein the upper surface and the lower surface correspond to each other, the inner side and the outer side correspond to each other, and the inner side and the outer side extend upward and downward to connect to the upper surface and the lower surface, respectively, the inner side defines the ventilation channel, wherein a region of the lower surface near the light window is defined as a non-painted area, and a region of the lower surface remote from the light window is defined as a painted area surrounding the non-painted area, wherein the ventilation groove is formed at the lower surface, and the ventilation groove extends from the outer side to a proper position of the non-painted area via the painted area, wherein the ventilation groove forms a ventilation channel between the lower surface of the support and the top surface of the molded base after the painted area of the lower surface of the support is attached to the top surface of the molded base;

9. The photosensitive device according to claim 8, wherein the ventilation groove has a first groove and a second groove which communicate with each other, the second groove communicating with the sealed space, wherein a depth dimension of the first groove is larger than a depth dimension of the second groove, and a depth dimension of the first groove is larger than a thickness dimension of the mounting medium, so that the mounting medium can overflow into the first groove and the mounting medium is prevented from filling the first groove to keep the ventilation channel clear.

10. A photosensitive device, comprising:

wherein the top surface of the molded base has at least one vent slot extending from a base inner surface to a base outer surface of the molded base to communicate the light window with the outside;

11. The photosensitive device of claim 10, wherein the vent slot of the molded base extends curvedly.

12. The photosensitive device of claim 10, wherein the shape of the vent slot of the molded base is selected from the group consisting of: the shape group is composed of an L shape, an S shape, a V shape and a Y shape.

13. The photosensitive device of claim 10, wherein the molded base has at least a first groove and at least a second groove, the second groove extending from the base inner surface of the molded base toward the substrate outer surface, the first groove extending from the base outer surface of the molded base toward the base inner surface, and the first groove and the second groove communicating with each other to form the vent groove of the molded base.

14. The photosensitive device according to claim 13, wherein one of the first groove and one of the second grooves communicate with each other to form the ventilation groove of the molded base; or one of the first grooves and a plurality of the second grooves are communicated with each other to form the vent grooves of the molded base; or a plurality of the first grooves and one of the first grooves communicate with each other to form the vent groove of the molded base.

15. The photosensitive device of claim 13, wherein a depth dimension of the first groove is greater than a depth dimension of the second groove and the depth dimension of the first groove is greater than a thickness dimension of the mounting medium such that the mounting medium can overflow into the first groove and prevent the mounting medium from filling the first groove to maintain the vent channel clear.

16. The photosensitive device according to any one of claims 1 to 15, wherein the substrate has a substrate front surface, a substrate back surface, and at least one accommodation space, wherein the substrate front surface and the substrate back surface correspond to each other, the accommodation space extending from the substrate front surface toward the substrate back surface, wherein the photosensitive device is accommodated in the accommodation space.

17. The photosensitive device according to any one of claims 1 to 15, wherein the substrate has a substrate front surface, a substrate back surface, and at least one accommodation space, wherein the substrate front surface and the substrate back surface correspond to each other, the accommodation space extends from the substrate front surface to the substrate back surface to communicate the substrate front surface and the substrate back surface, wherein the non-photosensitive region of the photosensitive element is mounted on the substrate back surface of the substrate, and the substrate surrounds the photosensitive region of the photosensitive element such that the photosensitive region of the photosensitive element corresponds to the accommodation space of the substrate.

18. The photosensitive device according to any one of claims 1 to 15, wherein the molding base embeds at least a portion of the non-photosensitive region of the photosensitive element.

19. The photosensitive device according to any one of claims 1 to 15, wherein the circuit board includes at least one electronic component conductively connected to the substrate, wherein the molding base embeds at least a portion of at least one of the electronic components protruding from the substrate front surface of the substrate.

20. A photosensitive device, comprising:

At least one molding part, wherein the molding part comprises at least one molding body and at least one first light-transmitting space, the molding body is integrally combined with the substrate, and the molding body forms at least the first light-transmitting space, wherein the support is attached to the molding body, so that the first light-transmitting space and the second light-transmitting space are communicated with each other to form at least one sealed space between the light filtering unit and the molded photosensitive unit, wherein the photosensitive area of the photosensitive element is kept in the sealed space, and the light filtering element is kept in a photosensitive path of the photosensitive element;

wherein the support comprises a support body and at least one extension arm integrally extending to the support body, the second light-passing space is formed between the support body and the extension arm, the light-passing channel is formed in the support body, the air-passing channel is formed in the extension arm, wherein the extension arm of the support is attached to the molding body of the molding part, and the air-passing channel formed in the extension arm can communicate the sealed space with the external environment;

the photosensitive device further includes at least one sealing member formed and held in the ventilation passage, wherein the sealing member is formed by curing a sealing medium filled in the ventilation passage after the support is attached to the molded body and a baking process is performed.

21. The photosensitive device of claim 20, wherein the vent channel extends obliquely.

22. A photosensitive device, comprising:

Wherein the holder includes at least one holder body and at least one extension arm integrally extended to the holder body, the second light-passing space and at least one second installation space communicating with the second light-passing space are formed between the holder body and the extension arm, the light-passing channel is formed to the holder body, the air-passing channel is formed to the extension arm, wherein at least one first installation space is formed between adjacent molded bodies, wherein at least a portion of the extension arm of the holder is held in the first installation space of the molded body when the holder is attached to the molded body, at least a portion of the molded body is held in the second installation space of the holder to form the sealed space between the filter unit and the molded photosensitive unit, and the air-passing channel formed to the extension arm is capable of communicating the sealed space with the external environment;

23. The photosensitive device of claim 22, wherein the molded body is "I" shaped and the extension arm is "" shaped; or the molded body is in a shape of , and the extension arm is in a shape of I; or the molded body is L-shaped, and the extension arm is L-shaped; or the two molding bodies are symmetrical to each other, and the two extension arms are symmetrical to each other; or the molded body and the extension arm are both shaped like a Chinese character 'kou'.

24. A photosensitive device according to claim 22 or 23, wherein said ventilation channel extends obliquely.

25. A camera module, its characterized in that includes:

at least one optical lens; and

the photosensitive device according to any one of claims 1 to 24, wherein the optical lens is held in a photosensitive path of the photosensitive element, and the filter element is held between the optical lens and the photosensitive element.

26. An electronic device with a camera module, comprising:

an equipment body; and

the at least one camera module of claim 25, wherein the camera module is disposed on the device body.