CN111973167A - Wearable device, optical module and packaging method thereof - Google Patents
Wearable device, optical module and packaging method thereof Download PDFInfo
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- CN111973167A CN111973167A CN202010841503.7A CN202010841503A CN111973167A CN 111973167 A CN111973167 A CN 111973167A CN 202010841503 A CN202010841503 A CN 202010841503A CN 111973167 A CN111973167 A CN 111973167A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/024—Detecting, measuring or recording pulse rate or heart rate
- A61B5/02416—Detecting, measuring or recording pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
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- A—HUMAN NECESSITIES
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
- A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
- A61B5/6803—Head-worn items, e.g. helmets, masks, headphones or goggles
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
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- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
- A61B5/681—Wristwatch-type devices
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- G04G17/00—Structural details; Housings
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- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G21/00—Input or output devices integrated in time-pieces
- G04G21/02—Detectors of external physical values, e.g. temperature
- G04G21/025—Detectors of external physical values, e.g. temperature for measuring physiological data
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/125—Composite devices with photosensitive elements and electroluminescent elements within one single body
Abstract
The invention discloses wearable equipment, an optical device, an optical module and a packaging method thereof, wherein the packaging method comprises the following steps: providing a substrate loaded with components; forming the cover plate with a light-transmitting area by adopting a double-color injection molding, secondary injection molding or encapsulation process; and installing the cover plate on the substrate, wherein the cover plate protrudes towards one side departing from the substrate, an accommodating space is formed between the cover plate and the substrate, and the component is accommodated in the accommodating space to form the optical module. The forming shape of the cover plate can be flexibly changed, the outer surface of the cover plate can be formed into a plane or a curved surface or other complex curved surfaces, and then the adaptability adjustment is carried out according to the shape of the shell of the equipment, so that the waste of the internal space of the equipment is reduced, and the miniaturization of the equipment is facilitated. And, the shape of apron can be nimble changeable, and printing opacity district sets up on the apron, and the shape in printing opacity district also can be nimble changeable to improve the flexibility of light path design, and the processing cost is low.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to wearable equipment, an optical device, an optical module and a packaging method thereof.
Background
With the increasing health awareness of people, more and more intelligent electronic devices, such as a bracelet and a watch, are selected on an integrated optical device, such as a heart rate sensor, and the heart rate sensor measures the heart rate and the blood oxygen concentration of a user according to the PPG principle. In the industry, optical modules are generally encapsulated by pouring sealant or attaching a glass cover plate, and when the optical modules are applied to a whole machine, windowing design is often required to be performed on a shell of the equipment. However, the following problems exist in the way of pouring the sealant or attaching the glass cover plate: (1) the upper surface of the optical module is generally a plane, which cannot be well adapted to the situation when the casing of the equipment is a curved surface, and waste of the internal space of the equipment can be caused; (2) the shape of the light-transmitting body on the optical module is single, the flexibility of light path design is small, and the process cost is extremely high due to the structural design of the light-transmitting body with a complex shape; (3) because the distance between the optical module and the shell window cannot be completely eliminated during assembly, part of light emitted by the LED can be reflected to the PD by the lower surface of the window, so that optical crosstalk is formed, and the accuracy of a measuring signal is influenced.
Disclosure of Invention
The invention mainly aims to provide wearable equipment, an optical device, an optical module and a packaging method thereof, and aims to solve the technical problems that equipment space is wasted in the optical module and the flexibility of optical path design is low.
In order to achieve the above object, the present invention provides a method for packaging an optical module, which comprises the following steps:
providing a substrate loaded with components;
forming the cover plate with a light-transmitting area by adopting a double-color injection molding, secondary injection molding or encapsulation process;
and installing the cover plate on the substrate, wherein the cover plate protrudes towards one side departing from the substrate, an accommodating space is formed between the cover plate and the substrate, and the component is accommodated in the accommodating space to form the optical module.
Preferably, the cover plate comprises a light shading plate and a light transmitting block, and the step of forming the cover plate with the light transmitting area by adopting a two-shot injection molding, two-shot injection molding or encapsulation process comprises the following steps:
integrally forming the light screen and the light-transmitting block by adopting a double-color injection molding, secondary injection molding or encapsulation process;
the step of installing the cover plate on the substrate, the cover plate protruding towards one side deviating from the substrate, and an accommodating space formed between the cover plate and the substrate, the component being accommodated in the accommodating space, and forming the optical module includes:
one end of the light shielding plate is arranged on the substrate, the other end of the light shielding plate protrudes towards one side departing from the substrate, the light shielding plate is enclosed into the accommodating space, one side of the accommodating space departing from the substrate is provided with an opening, the light-transmitting block is arranged at the opening and seals the opening, and the light-transmitting block forms the light-transmitting area.
Preferably, a vent hole communicated with the accommodating space is formed in the position, corresponding to the accommodating space, of the substrate;
the step of installing one end of the light shielding plate on the substrate, the other end of the light shielding plate protruding towards one side departing from the substrate, the light shielding plate being enclosed into the accommodating space, one side of the accommodating space departing from the substrate being provided with an opening, the light-transmitting block being installed at the opening and blocking the opening, the light-transmitting block forming the light-transmitting area comprises:
one end of the shading plate is bonded on the substrate through an adhesive, and the vent hole is used for communicating the accommodating space with the cavity;
and baking and curing the adhesive.
Preferably, after the step of baking the optical module to cure the adhesive, the method further includes:
filling viscose into the vent hole;
and carrying out irradiation curing treatment on the adhesive so that the adhesive seals the vent hole.
Preferably, one surface of the light-transmitting block facing the accommodating space is a concave surface, a convex surface or a plane surface.
Preferably, the optical module has a plurality of receiving spaces arranged at intervals, any two adjacent receiving spaces are separated by the light shielding plate, and each receiving space is correspondingly provided with one light-transmitting block; the component comprises a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different accommodating spaces.
Preferably, the cover plate is of a rectangular structure or a circular structure;
when the cover plate is in a rectangular structure, the plurality of accommodating spaces are arranged at intervals along the length direction of the cover plate, and any two adjacent accommodating spaces contain a light-emitting element in one accommodating space and a light-receiving element in the other accommodating space;
when the cover plate is in a circular structure, one of the accommodating spaces accommodates the light-emitting element and is located at the center of the cover plate, and the other accommodating spaces accommodate the light-receiving elements and are arranged at intervals around the accommodating space at the center of the cover plate.
The invention also provides an optical module which is manufactured by adopting the packaging method of the optical module.
The invention also provides an optical device, which comprises a shell and the optical module;
the shell is internally provided with a cavity, and the shell is provided with a window communicated with the cavity;
the optical module is contained in the cavity, one side, deviating from the substrate, of the cover plate is embedded in the window to seal the window, and the light-transmitting area is located at the position corresponding to the window.
Preferably, the outer surface of the housing and the surface of the cover plate facing away from the cavity are smoothly and transitionally connected into a whole surface.
The invention also proposes a wearable device comprising an optical apparatus as described above.
According to the packaging method of the optical module, the substrate loaded with the components is provided, the cover plate with the light-transmitting area is formed by adopting a double-color injection molding, secondary injection molding or encapsulation process, the cover plate is arranged on the substrate, the cover plate protrudes towards one side away from the substrate, an accommodating space is formed between the cover plate and the substrate, and the components are accommodated in the accommodating space to form the optical module. Because optical module's apron adopts double-colored injection molding, secondary injection molding or rubber coating technology shaping, its shaping shape can change in a flexible way, and plane or curved surface or other complicated curved surfaces can be formed out to the surface of apron, promptly, the surface of apron can come the adaptability adjustment according to the shape of equipment shell, reduces the waste of equipment inner space, is favorable to realizing the miniaturization of equipment, especially to wearable equipment for the TWS earphone, and the miniaturization advantage is more obvious. And, the shape of apron can be nimble changeable, and printing opacity district sets up on the apron, and the shape in printing opacity district also can be nimble changeable to improve the flexibility of light path design, and the processing cost is low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a first embodiment of a method for packaging an optical module according to the present invention;
FIG. 2 is a flowchart illustrating a second embodiment of a method for packaging an optical module according to the present invention;
FIG. 3 is a detailed flowchart of step S300 of the method for packaging an optical module according to the present invention;
FIG. 4 is a schematic perspective view of an optical module according to an embodiment of the present invention;
FIG. 5 is a perspective view of an optical module according to an embodiment of the present invention, with a substrate omitted;
FIG. 6 is a schematic cross-sectional view of an optical module according to an embodiment of the invention;
FIG. 7 is a schematic cross-sectional view of an optical module according to another embodiment of the invention;
FIG. 8 is a schematic cross-sectional view of an optical module according to yet another embodiment of the present invention;
FIG. 9 is a schematic top view of an optical module according to another embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view of a functional chip outside an accommodating space in an optical module according to an embodiment of the invention;
FIG. 11 is a schematic cross-sectional view illustrating a functional chip in an accommodating space of an optical module according to an embodiment of the invention;
FIG. 12 is a schematic cross-sectional view of an optical module according to an embodiment of the invention;
FIG. 13 is a schematic cross-sectional view of an optical device according to an embodiment of the present invention;
FIG. 14 is a cross-sectional view of an optical device with a scratch-resistant layer according to an embodiment of the present invention;
FIG. 15 is a perspective view of an optical module and a housing of an optical device according to an embodiment of the invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The description of the orientations of "up", "down", "left", "right", etc. in the present invention, with reference to the orientations shown in fig. 6 and 13, is merely for explaining the relative positional relationship between the respective components in the postures shown in fig. 6 and 13, and if the specific posture is changed, the directional indication is changed accordingly.
The invention provides a packaging method of an optical module.
Referring to fig. 1, a flow chart of a first embodiment of the packaging method of the optical module of the present invention is shown, the method includes the following steps:
step S100, providing a substrate loaded with components;
referring to fig. 4 to 8, the component 22 is mounted on the lower surface of the substrate 21, and it can be understood that the component 22 may be used to receive and emit light. The substrate 21 of the present embodiment may be an organic substrate 21 or a ceramic substrate 21 with high strength, or may be a PCB. The component 22 is ground, diced, attached to the substrate 21, and wire bonded to the substrate 21.
S200, forming a cover plate with a light-transmitting area by adopting a double-shot injection molding, secondary injection molding or encapsulation process;
specifically, in this embodiment, materials such as PA (Polyamide), ABS (Acrylonitrile Butadiene Styrene), PMMC (polymethyl methacrylate), PC (Polycarbonate) and the like may be adopted, the cover plate 23 is formed by two-color injection molding, two-time injection molding or encapsulation, the cover plate 23 has a light-transmitting region, and it can be understood that the material of the light-transmitting region is PMMC or PC, and light can pass through the light-transmitting region. The cover plate 23 is integrally formed by adopting a double-shot injection molding, secondary injection molding or rubber coating process, so that the assembling step is omitted, the manufacture is easy, the production efficiency is improved, the assembling error is avoided, the consistency of finished products is improved, and the accuracy of a measuring algorithm is favorably improved.
Moreover, the cover plate 23 is formed by two-color injection molding, secondary injection molding or encapsulation, the forming shape of the cover plate can be flexibly changed, as shown in fig. 4 to 8, the outer surface of the cover plate 23 can be formed into a plane, as shown in fig. 12 and 15, the outer surface of the cover plate 23 can be formed into a curved surface, in other embodiments, the outer surface of the cover plate 23 can be formed into other complex shapes, so that the outer surface of the cover plate 23 can be adaptively adjusted according to the shape of the device housing 10, waste of the internal space of the device is reduced, the device can be miniaturized, and especially for the TWS headset which is a wearable device, the miniaturization advantage is more obvious. Moreover, the shape of the cover plate 23 can be flexible and changeable, the light-transmitting area is arranged on the cover plate 23, and the shape of the light-transmitting area can also be flexible and changeable, so that the flexibility of light path design is improved, and the process cost is low.
Step S300, the cover plate is installed on the substrate, the cover plate protrudes towards one side away from the substrate, an accommodating space is formed between the cover plate and the substrate, and the component is accommodated in the accommodating space to form the optical module.
As shown in fig. 4 to 14, the cover plate 23 is disposed on the bottom of the substrate 21, and the lower side of the cover plate 23 protrudes downward, so that a receiving space 24 is formed between the cover plate 23 and the substrate 21, and the component 22 is received in the receiving space 24, thereby forming the optical module 20.
The optical module 20 of this embodiment can be used on wearable equipment, for example, on bracelet, wrist-watch or earphone, and after bracelet or wrist-watch were worn on human wrist, the bottom of apron 23 was located wearable equipment's inboard, faces human skin side one side promptly. It can be understood that optical module 20 monitors human heart rate through the photoelectric projection measurement method, namely sends light through components and parts 22, for example, the LED lamp and shines the skin, because blood has the absorption to the light of specific wavelength, when every heart pumps blood, this wavelength all can be absorbed by a large amount to this just can confirm the heartbeat, realizes the monitoring to human heart rate. The monitoring of blood oxygen of human body is similar to heart rate monitoring, and is not repeated herein. The apron 23 of this embodiment has the printing opacity district, and the light that components and parts 22 sent shines human skin through the printing opacity district, and the light through human skin reflection passes through the printing opacity district and is received by components and parts 22 to realize optical module 20 to the monitoring of human rhythm of the heart, blood oxygen.
In the method for packaging the optical module 20 according to this embodiment, a substrate 21 loaded with the component 22 is provided, a cover plate 23 having a light-transmitting region is formed by two-shot molding, two-shot molding or encapsulation, the cover plate 23 is mounted on the substrate 21, the cover plate 23 protrudes toward a side away from the substrate 21, a receiving space 24 is formed between the cover plate 23 and the substrate 21, and the component 22 is received in the receiving space 24, so as to form the optical module 20. Because the cover plate 23 of the optical module 20 is formed by two-color injection molding, secondary injection molding or encapsulation, the forming shape can be flexibly changed, and the outer surface of the cover plate 23 can be formed into a plane or a curved surface or other complex curved surfaces, that is, the outer surface of the cover plate 23 can be adaptively adjusted according to the shape of the device shell 10, so that the waste of the inner space of the device is reduced, the miniaturization of the device is facilitated, and particularly, the miniaturization advantage is more obvious when the wearable device is a TWS earphone. Moreover, the shape of the cover plate 23 can be flexible and changeable, the light-transmitting area is arranged on the cover plate 23, and the shape of the light-transmitting area can also be flexible and changeable, so that the flexibility of light path design is improved, and the process cost is low.
Further, referring to fig. 2, a flowchart of a second embodiment of the method for packaging an optical module according to the present invention is shown, based on the first embodiment, where the step S200 includes:
step S201, integrally forming the light screen and the light-transmitting block by adopting a double-color injection molding, secondary injection molding or encapsulation process;
specifically, the light shielding plate 231 of the embodiment can be made of materials such as PA and ABS, the light transmitting block 232 can be made of materials such as PMMC and PC, and the light shielding plate 231 of the cover plate 23 and the light transmitting block 232 are integrally formed by two-color injection molding, secondary injection molding or encapsulation, so that the assembly steps are omitted, the manufacturing is easy, the production efficiency is improved, the assembly error is avoided, the consistency of finished products is improved, and the accuracy of a measurement algorithm is improved.
The step S300 includes:
step S301, one end of the light shielding plate is installed on the substrate, the other end of the light shielding plate protrudes towards one side departing from the substrate, the light shielding plate is enclosed into the accommodating space, one side of the accommodating space departing from the substrate is provided with an opening, the light transmitting block is installed at the opening and seals the opening, and the light transmitting block forms the light transmitting area.
The light shielding plate 231 and the light transmitting block 232 are integrally formed by adopting a double-shot injection molding, secondary injection molding or encapsulation process, so that the cover plate 23 is an integrally formed part. In the process of assembling the cover plate 23 and the base plate 21, the light shielding plate 231 of the cover plate 23 may be mounted on the base plate 21. Specifically, the upper end of the cover plate 23 is mounted on the base plate 21, the lower end of the light shielding plate 231 protrudes downward, the light shielding plate 231 encloses a receiving space 24, and the bottom of the receiving space 24 has an opening 241. The light-transmitting block 232 is installed at the opening 241, the opening 241 is blocked by the light-transmitting block 232, and the light-transmitting block 232 forms a light-transmitting area, so that light transmission is facilitated, and light receiving and transmitting in the accommodating space 24 are achieved.
Furthermore, the base plate 21 is provided with a vent hole 211 corresponding to the position of the accommodating space 24, and the vent hole 211 is communicated with the accommodating space 24; the step S301 includes:
step S3011, adhering one end of the shading plate to the substrate through an adhesive, wherein the vent hole communicates the accommodating space with the cavity;
step S3012, baking and curing the adhesive.
In this embodiment, the upper end of the light shielding plate 231 is bonded to the bottom of the substrate 21 by the adhesive 30, the substrate 21 is provided with a vent hole 211 corresponding to the accommodating space 24, and the vent hole 211 is communicated with the accommodating space 24. Specifically, the integrally formed cover plate 23 is attached to the substrate 21 by means of a scribing and SMT process, and is cured by high-temperature baking and curing to cure the adhesive 30 between the light shielding plate 231 of the cover plate 23 and the substrate 21, thereby improving the assembly stability of the cover plate 23 and the substrate 21. In order to balance the air pressure in the accommodating space 24 and the equipment cavity 11 during the high-temperature curing process and prevent the cover plate 23 from being separated from the base plate 21 due to gas expansion, in the embodiment, the base plate 21 is provided with the vent hole 211 at a position corresponding to the accommodating space 24, the vent hole 211 is communicated with the accommodating space 24, specifically, the vent hole 211 is communicated with the accommodating space 24 and the equipment cavity 11, and the balance of the air pressure in the accommodating space 24 and the equipment cavity 11 can be realized during the high-temperature curing process.
Further, after the step S3012, the method further includes:
step S3013, filling viscose into the vent hole;
step S3014, the adhesive is irradiated and cured to seal the vent hole.
After the high-temperature baking curing treatment is completed, the viscose is injected into the vent holes 211 from the outer side of the base plate 21, the viscose can be selected from UV glue, the vent holes 211 are sealed by the UV glue, the assembly sealing performance of the cover plate 23 and the base plate 21 is guaranteed, and the light leakage phenomenon is prevented. Understandably, the adhesive selects UV glue, and UV irradiation curing treatment is carried out after the UV glue is filled into the vent holes 211, so that the vent holes are completely sealed by the adhesive, and the sealing effect is optimized.
In this embodiment, since the light shielding plate 231 and the light transmitting block 232 are integrally formed by two-color injection molding, secondary injection molding or encapsulation, the light transmitting block 232 can be formed into a complex structure, the shape of the light transmitting block 232 is flexible and changeable, and one surface of the transparent block facing the accommodating space 24 is a concave surface, a convex surface or a plane. As shown in fig. 4 to 6, in the embodiment, one surface of the light-transmitting block 232 facing the accommodating space 24 is a plane, that is, the upper surface of the light-transmitting block 232 is a plane, so that the thickness of the light-transmitting block 232 is uniform and consistent, and the light rays can be vertically incident or emergent; as shown in fig. 7, in another embodiment, the upper surface of the light-transmitting block 232 is concave, so that the middle area of the light-transmitting block 232 is thinner, and the two end areas are thicker, thereby generating a diverging effect on the light to be transmitted and received; as shown in fig. 8, in another embodiment, the upper surface of the light-transmitting block 232 is a convex surface, so that the middle area of the light-transmitting block 232 is thicker, and the two end areas are thinner, thereby generating a converging effect on the light to be transmitted and received, and improving the flexibility of the light path design by changing the shape of the light-transmitting block 232.
In this embodiment, the optical module 20 has a plurality of receiving spaces 24 arranged at intervals, any two adjacent receiving spaces 24 are separated by a light shielding plate 231, and each receiving space 24 is correspondingly provided with a light transmitting block 232; the component 22 includes a light emitting element 221 and a light receiving element 222, and the light emitting element 221 and the light receiving element 222 are separately provided in different housing spaces 24. The light emitting element 221 of the present embodiment is an LED lamp, the light receiving element 222 is a PD, and the LED and the light receiving element 222 are separately provided in different housing spaces 24.
As shown in fig. 4 to 8, the number of the receiving spaces 24 is four, the four receiving spaces 24 are arranged at intervals in the left-right direction, and the first, second, third, and fourth receiving spaces 24 are respectively arranged from left to right, wherein the second receiving space 24 and the fourth receiving space 24 are respectively provided with a light emitting element 221, such as an LED lamp, and the first receiving space 24 and the third receiving space 24 are respectively provided with a light receiving element 222, such as a PD, light emitted from the LED lamp irradiates the skin of a human body, and is reflected and received by the PD adjacent to the LED lamp.
In addition, the opening 241 of the accommodating space 24 is blocked by the light-transmitting block 232, any two adjacent accommodating spaces 24 are separated by the light-shielding plate 231, so that the periphery of the light-transmitting block 232 is surrounded by the light-shielding plate 231, the light-shielding plate 231 is completely divided by the light-transmitting block 232, the light crosstalk between the light-transmitting block 232 and the light-shielding plate cannot occur, the signal to noise ratio is improved, and the accuracy of a measurement signal is improved.
Further, the cover plate 23 has a rectangular structure or a circular structure; when the cover plate 23 is rectangular, the plurality of receiving spaces 24 are arranged at intervals along the length direction of the cover plate 23, and of any two adjacent receiving spaces 24, one receiving space 24 receives the light emitting element 221, and the other receiving space 24 receives the light receiving element 222; when the cover plate 23 is in a circular structure, one of the receiving spaces 24 receives the light emitting element 221 and is located at the center of the cover plate 23, and the other receiving spaces 24 receive the light receiving elements 222 and are arranged at intervals around the receiving space 24 located at the center of the cover plate 23.
As shown in fig. 4 to 8, in an embodiment, the cover plate 23 has a rectangular structure, the length direction of the cover plate 23 is the left-right direction, the plurality of receiving spaces 24 are arranged at intervals along the left-right direction, one receiving space 24 of any two adjacent receiving spaces 24 receives an LED lamp, the other receiving space 24 receives a PD, and light emitted from the LED lamp irradiates the skin of a human body and is reflected by the PD adjacent to the LED lamp.
As shown in fig. 9, in another embodiment, the cover plate 23 is a circular structure, one of the accommodating spaces 24 is located at the center of the cover plate 23, the LED lamps are accommodated in the accommodating space 24, the rest of the accommodating spaces 24 are sequentially arranged in a circular structure, the accommodating spaces 24 located at the center of the cover plate 23 are uniformly spaced, and PDs are accommodated in the rest of the accommodating spaces 24, so that the light emitted from the LED lamps irradiates the skin of a human body, and is reflected and received by the PDs around the LED lamps.
It is understood that in other embodiments, the cover plate 23 may be made into other shapes and structures, and the structures are flexible and changeable to flexibly adapt to the device housing 10 to meet different use requirements.
In this embodiment, the optical module 20 further includes a connector 25, and the connector 25 is mounted on a side of the substrate 21 facing away from the receiving space 24. As shown in fig. 10 to 15, the connector 25 is attached to the upper side of the substrate 21 and located outside the accommodating space 24, the optical module 20 can form stable electrical connection with the main board of the wearable device by using the connector 25 to form communication and power supply, and the optical module 20 does not need to be attached to an FPC or a PCB, and the position thereof can be flexibly set according to actual situations.
The substrate 21 of the optical module 20 of this embodiment may further mount a plurality of functional chips 26, and the plurality of functional chips 26 may be an AFE chip, an acceleration chip, an ECG chip, a temperature sensor chip, a resistor, a capacitor, an inductor, and the like of PPG, respectively, so that the optical module 20 may perform operations such as amplification, filtering, analog-to-digital conversion, and the like on a received signal, or integrate other functions with the optical module 20. As shown in fig. 10, the functional chip 26 may be attached to the upper surface of the substrate 21, or may be attached to the lower surface of the substrate 21 and located outside the housing space 24, or as shown in fig. 11, the functional chip 26 may be attached to the lower surface of the substrate 21 and located in the housing space 24, and may be stacked with the light emitting element 221 or the light receiving element 222 in the up-down direction. The type and mounting position of the functional chip 26 can be flexibly selected according to actual conditions. The cover plate 23, the light emitting element 221, the light receiving element 222, the connector 25 and the plurality of functional chips 26 of the optical module 20 of the present embodiment are all unpackaged dies.
The invention further provides an optical module 20, and the optical module 20 is manufactured by the method for packaging the optical module 20. Since the optical module 20 adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and are not described in detail herein.
As shown in fig. 13 to fig. 15, the present invention further provides an optical apparatus 100, where the optical apparatus 100 includes a housing 10 and the optical module 20; a cavity 11 is formed in the shell 10, and a window 12 communicated with the cavity 11 is formed in the shell 10; the optical module 20 is accommodated in the cavity 11, and one side of the cover plate 23 departing from the substrate 21 is embedded in the window 12 to seal the window 12, and the light-transmitting area is located at a position corresponding to the window 12.
The optical apparatus 100 of the present embodiment can be applied to a wearable device, such as a bracelet, a watch, or an earphone, and when the bracelet or the watch is worn on the wrist of a human body, the window 12 is located on the inner side of the wearable device, i.e. the window 12 faces the skin side of the human body. As shown in fig. 13 to 15, a window 12 communicating with the cavity 11 is formed at the bottom of the housing 10, the optical module 20 is accommodated in the cavity 11, and the lower side of the cover plate 23 of the optical module 20 protrudes downward and is embedded in the window 12, so that the window 12 is sealed, and the optical module 20 and the housing 10 are assembled. Optical module 20 and shell 10 assembly back, optical module 20's the position that the light zone corresponds window 12, and the light that components and parts 22 sent shines human skin through the light zone, and the light that reflects through human skin passes through the light zone and is received by components and parts 22 to realize optical module 20 to the monitoring of human rhythm of the heart, blood oxygen.
In this embodiment optical device 100, the cover plate 23 of the optical module 20 protrudes and is embedded in the window 12 to plug the window 12, the cover plate 23 can be directly used as an optical window of the wearable device, the position of the window 12 of the housing 10 does not need to be additionally provided with a layer of transparent medium, the number of parts is reduced, the structure is compact, and the embedded structure greatly reduces the space occupied by the optical module 20 in the wearable device, reduce the waste of the internal space of the device, which is beneficial to realizing the miniaturization of the device, especially for the TWS earphone of the wearable device, the miniaturization advantage is more obvious. Moreover, the optical module 20 only needs to transmit and receive light rays through the light-transmitting area of the cover plate 23, and does not need to additionally pass through a transparent medium of the shell 10, so that the light effect loss is small, the light emitting efficiency of the optical module 20 is higher, the optical module 20 can obtain stronger light signals by using smaller component 22 driving current, and the power consumption is reduced.
Specifically, the light shielding plate 231 of the cover plate 23 is embedded at the window 12 of the housing 10 to close the window 12. The light-transmitting block 232 is arranged at the opening 241 of the accommodating space 24 enclosed by the light-shielding plate 231, and the light-transmitting block 232 forms a light-transmitting area, so that light transmission is facilitated, and light receiving and transmitting of the component 22 in the accommodating space 24 are realized.
Further, the outer surface of the housing 10 and the surface of the cover plate 23 facing away from the cavity 11 are smoothly and transitionally connected into an integrated surface, and further, the integrated surface is provided with a scratch-proof layer 40. In the cover plate 23, the light shielding plate 231 and the light transmitting block 232 are integrally formed by two-shot injection molding, two-shot injection molding or encapsulation, and a complex structure matched with the shape of the housing 10 can be formed, for example, after the cover plate 23 is embedded in the window 12, the outer surface of the cover plate 23 is fitted with the outer surface of the housing 10, and can be smoothly transitionally connected into an integrated surface, specifically, the surface of the cover plate 23 departing from the cavity 11 is the outer surface of the cover plate 23, and the outer surface of the cover plate 23 is smoothly transitionally connected with the outer surface of the housing 10 into an integrated surface.
The outer surface of the cover plate 23 can flexibly adapt to the outer surface of the housing 10, when the outer surface of the housing 10 is a plane, the outer surface of the cover plate 23 is also a plane flush with the outer surface of the housing 10, and when the outer surface of the housing 10 is a curved surface, the outer surface of the cover plate 23 is also a curved surface in smooth transition connection with the outer surface of the housing 10, so that the optical device 100 has an integrated outer surface. It can be understood that, when the outer surface of the housing 10 is other irregular surfaces, the outer surface of the cover plate 23 can be connected with the outer surface of the housing 10 in a smooth transition manner all the time to form an integrated surface, which is flexible and changeable and meets different use requirements.
After the optical module 20 is assembled with the housing 10, the outer surface of the cover plate 23 is directly coupled to the window 12 of the housing 10, the cover plate 23 can be used as a part of the housing 10, so as to improve the structural compactness of the optical device 100, and the light receiving element 222 and the light emitting element 221 of the optical module 20 are closer to the outer surface of the housing 10, and further closer to the skin of the human body, which is also beneficial to improving the measurement accuracy.
After the optical module 20 and the housing 10 are assembled, the surface of the optical device 100 may be covered with glue, that is, the outer surface of the cover plate 23 and the outer surface of the housing 10 are coated with a layer of transparent optical UV glue with shore hardness of more than D, and the thickness is about 30um, so as to form the scratch-resistant layer 40, thereby improving the scratch-resistant performance of the optical device 100, improving the sealing performance of the optical device, and improving the appearance aesthetic property of the optical device 100. In addition, the scratch-resistant layer 40 has a small thickness, so that the light collecting and releasing conditions of the optical module 20 are not affected.
The invention further provides a wearable device, which includes the optical apparatus 100. It can be understood that the wearable device can be an electronic product such as a smart watch, a bracelet, and an earphone. Since the wearable device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and are not repeated herein.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (11)
1. An optical module packaging method, characterized in that the optical module packaging method comprises the following steps:
providing a substrate loaded with components;
forming the cover plate with a light-transmitting area by adopting a double-color injection molding, secondary injection molding or encapsulation process;
and installing the cover plate on the substrate, wherein the cover plate protrudes towards one side departing from the substrate, an accommodating space is formed between the cover plate and the substrate, and the component is accommodated in the accommodating space to form the optical module.
2. The method of claim 1, wherein the cover plate comprises a light shielding plate and a light transmissive block, and the step of molding the cover plate with the light transmissive region using two-shot molding, two-shot molding or encapsulation comprises:
integrally forming the light screen and the light-transmitting block by adopting a double-color injection molding, secondary injection molding or encapsulation process;
the step of installing the cover plate on the substrate, the cover plate protruding towards one side deviating from the substrate, and an accommodating space formed between the cover plate and the substrate, the component being accommodated in the accommodating space, and forming the optical module includes:
one end of the light shielding plate is arranged on the substrate, the other end of the light shielding plate protrudes towards one side departing from the substrate, the light shielding plate is enclosed into the accommodating space, one side of the accommodating space departing from the substrate is provided with an opening, the light-transmitting block is arranged at the opening and seals the opening, and the light-transmitting block forms the light-transmitting area.
3. The method of claim 2, wherein the substrate has a vent hole corresponding to the receiving space and communicating with the receiving space;
the step of installing one end of the light shielding plate on the substrate, the other end of the light shielding plate protruding towards one side departing from the substrate, the light shielding plate being enclosed into the accommodating space, one side of the accommodating space departing from the substrate being provided with an opening, the light-transmitting block being installed at the opening and blocking the opening, the light-transmitting block forming the light-transmitting area comprises:
one end of the shading plate is bonded on the substrate through an adhesive, and the vent hole is used for communicating the accommodating space with the cavity;
and baking and curing the adhesive.
4. The method of encapsulating an optical module according to claim 3, wherein the step of baking the optical module to cure the adhesive further comprises, after the step of baking the optical module:
filling viscose into the vent hole;
and carrying out irradiation curing treatment on the adhesive so that the adhesive seals the vent hole.
5. The method of claim 2, wherein a surface of the light-transmitting block facing the receiving space is concave, convex or flat.
6. The method of packaging an optical module according to claim 2, wherein the optical module has a plurality of the receiving spaces arranged at intervals, any two adjacent receiving spaces are separated by the light shielding plate, and each receiving space is provided with one of the light-transmitting blocks; the component comprises a light-emitting element and a light-receiving element, and the light-emitting element and the light-receiving element are respectively arranged in different accommodating spaces.
7. The method of claim 6, wherein the cover plate has a rectangular or circular configuration;
when the cover plate is in a rectangular structure, the plurality of accommodating spaces are arranged at intervals along the length direction of the cover plate, and any two adjacent accommodating spaces contain a light-emitting element in one accommodating space and a light-receiving element in the other accommodating space;
when the cover plate is in a circular structure, one of the accommodating spaces accommodates the light-emitting element and is located at the center of the cover plate, and the other accommodating spaces accommodate the light-receiving elements and are arranged at intervals around the accommodating space at the center of the cover plate.
8. An optical module produced by the method for packaging an optical module according to any one of claims 1 to 7.
9. An optical device comprising a housing and the optical module of claim 8;
the shell is internally provided with a cavity, and the shell is provided with a window communicated with the cavity;
the optical module is contained in the cavity, one side, deviating from the substrate, of the cover plate is embedded in the window to seal the window, and the light-transmitting area is located at the position corresponding to the window.
10. The optical device of claim 9, wherein the outer surface of the housing and the surface of the cover plate facing away from the cavity smoothly transition to a unitary surface.
11. A wearable device, characterized in that it comprises an optical apparatus according to claim 9 or 10.
Priority Applications (1)
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| CN202010841503.7A CN111973167A (en) | 2020-08-19 | 2020-08-19 | Wearable device, optical module and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010841503.7A CN111973167A (en) | 2020-08-19 | 2020-08-19 | Wearable device, optical module and packaging method thereof |
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| CN111973167A true CN111973167A (en) | 2020-11-24 |
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| CN202010841503.7A Pending CN111973167A (en) | 2020-08-19 | 2020-08-19 | Wearable device, optical module and packaging method thereof |
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| CN113437181A (en) * | 2021-06-23 | 2021-09-24 | Oppo广东移动通信有限公司 | Manufacturing method of optical cover plate, optical cover plate and wearable device |
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| WO2022252988A1 (en) * | 2021-06-01 | 2022-12-08 | Oppo广东移动通信有限公司 | Preparation method for cover plate, cover plate and electronic device |
| CN116991054A (en) * | 2023-09-28 | 2023-11-03 | 荣耀终端有限公司 | Optical device, manufacturing method thereof and wearable equipment |
| WO2023240960A1 (en) * | 2022-06-14 | 2023-12-21 | Oppo广东移动通信有限公司 | Housing, manufacturing method for housing, and electronic device |
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Application publication date: 20201124 |