CN205752188U - A kind of optical sensor package structure - Google Patents
A kind of optical sensor package structure Download PDFInfo
- Publication number
- CN205752188U CN205752188U CN201620453888.9U CN201620453888U CN205752188U CN 205752188 U CN205752188 U CN 205752188U CN 201620453888 U CN201620453888 U CN 201620453888U CN 205752188 U CN205752188 U CN 205752188U
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- Prior art keywords
- optical
- cavity volume
- optical window
- encapsulating structure
- chip
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- 230000003287 optical effect Effects 0.000 title claims abstract description 118
- 238000002834 transmittance Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000002347 injection Methods 0.000 abstract description 7
- 239000007924 injection Substances 0.000 abstract description 7
- 238000002955 isolation Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Abstract
This utility model relates to a kind of optical sensor package structure, including snapping together and formed the substrate of lighttight outer enclosure structure and prefabricated lid, first optical window corresponding with the first cavity volume, and second optical window corresponding with the second cavity volume it is provided with in described outer enclosure structure；Also include that mould filling is in the first optical window, the transmittance section of the second optical window position.Encapsulating structure of the present utility model, define for isolating the first optical chip, the encapsulating structure of the second optical chip by prefabricated lid and substrate, and in the position of optical window, transmittance section is formed by injection light transmissive material, thus by the isolation of the first cavity volume of outer enclosure structure, the second cavity volume and external environment condition；The design of such structure improves the dimensional accuracy of encapsulating structure, it is ensured that the concordance of encapsulating structure.
Description
Technical field
This utility model relates to the encapsulating structure of a kind of chip, more specifically, this utility model relates to one
Plant the encapsulating structure of optical pickocff.
Background technology
At present, optical pickocff is more and more extensive in the application of consumer electronics, such as mobile phone, intelligence hands
Table, Intelligent bracelet etc..Utilize optical pickocff, it is possible to achieve close to light detection, ambient light detection,
Heart rate detection, the detection of blood oxygen, gesture identification etc..Its ultimate principle is that LED chip sends specific wavelength
Light, this light arrives after object under test, can return a branch of light relevant to object under test, arrive
Reach optics and receive the optics reception area of chip, be called for short PD.
Wherein, the light for preventing LED chip from sending directly arrives optics and receives the optics reception of chip
Region, in encapsulation process, needs encapsulating structure is carried out particular design, to reach optics reception core
Optoisolated purpose between sheet and LED chip.If the light that LED chip sends, directly arrive
Optics receives the optics receiving area of chip, and optics can be caused equally to receive the photoresponse of chip, so
Signal be the information that can not reflect object under test.
At present in the packing forms of Most optical sensor, it usually needs instill thoroughly in optical window position
Bright protection material, it is achieved the protection to chip.The program problematically, transparent protection material
Can be recessed during solidification, concrete recessed degree is uncontrollable, and this can produce impact to product specification,
Cause properties of product deviation bigger.
Utility model content
A purpose of the present utility model there is provided a kind of optical sensor package structure.
According to an aspect of the present utility model, it is provided that a kind of optical sensor package structure, including button
It is combined and is formed the substrate of lighttight outer enclosure structure and prefabricated lid, in described outside
The first cavity volume isolated from one another, the second cavity volume it is provided with in encapsulating structure；Also include being arranged on described
The first optical chip in one cavity volume, and the second optical chip being arranged in the second cavity volume；Described
Be provided with first optical window corresponding with the first cavity volume in outer enclosure structure, and with the second cavity volume
The second corresponding optical window；Also include that mould filling is in the first optical window, the second optical window position
The transmittance section put.
Optionally, described first cavity volume, the second cavity volume are separated by compartment.
Optionally, described first cavity volume, the second cavity volume, spacer portion be molded lid time one-body molded.
Optionally, described first optical window, the second optical window sidewall on be provided with projection
Structure.
Optionally, described bulge-structure is arranged on the first optical window, the second optical window sidewall
Middle part.
Optionally, described first optical window, the second optical window sidewall on be provided with sawtooth
Structure.
Optionally, described broached-tooth design be distributed in the first optical window, the second optical window whole
On sidewall.
Optionally, described first optical chip is optical sensor chip, described second optical chip
For LED chip.
Optionally, described transmittance section is provided with optical lens structure.
Optionally, described optical lens structure is arranged on the inner surface of transmittance section.
Encapsulating structure of the present utility model, is defined for isolating first by prefabricated lid and substrate
Optical chip, the encapsulating structure of the second optical chip, and in the position of optical window, by injection thoroughly
Luminescent material forms transmittance section, thus by the first cavity volume of outer enclosure structure, the second cavity volume and external rings
The isolation in border；The design of such structure improves the dimensional accuracy of encapsulating structure, it is ensured that encapsulating structure
Concordance.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
The accompanying drawing of the part constituting description describes embodiment of the present utility model, and together with saying
Bright book is used for explaining principle of the present utility model together.
Fig. 1 is the schematic diagram of this utility model encapsulating structure.
Fig. 2 is the schematic diagram of this utility model another embodiment of encapsulating structure.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but
In the appropriate case, described technology and equipment should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1, this utility model provides a kind of optical sensor package structure, and it includes fastening
Together and form the substrate 1 of outer enclosure structure, prefabricated lid 7, described substrate 1, lid 7
Lighttight material is all used to make so that its outer enclosure structure formed is lighttight.Institute
First cavity volume the 2, second cavity volume 3 isolated from one another it is provided with in stating outer enclosure structure.This utility model
Lid 7 can be pre-formed by the way of injection, constitutes the sidewall of first cavity volume the 2, second cavity volume 3
Portion can be arranged on lid 7；Described first cavity volume the 2, second cavity volume 3 can be by a spacer portion 4 points
Separate；Described first cavity volume the 2, second cavity volume 3, spacer portion 4 all one can become when being molded lid 7
Type.Substrate 1 of the present utility model can be pcb board, and lid 7 such as can be solid by the way of bonding
It is scheduled on pcb board, defines described outer enclosure structure.
Encapsulating structure of the present utility model, also includes the first optical chip, the second optical chip, optics
There is on chip optical region 10, receive by this optical region 10 or send optical signal.This
The optical chip of utility model can be the those skilled in the art such as optical sensor chip, LED chip
Known optical chip.Wherein, the optical region of optical sensor chip is used for sensing optical signal,
Such as optical sensor chip can be made to send different control signals according to the power of light；LED chip
Optical region be used for launch optical signal, it can be the luminescent devices such as light emitting diode.
For the ease of understanding the technical solution of the utility model, existing with the first optical chip as optical sensing
Device chip 5, as a example by the second optical chip is LED chip 6, enters the technical solution of the utility model
Line description.Wherein, those skilled in the art can the most rationally select the type of optical chip,
To obtain the optical sensor package structure of difference in functionality, no longer illustrate at this.
Optical sensor chip 5 is arranged in the first cavity volume 2, and LED chip 6 is arranged on the second cavity volume
In 3, open owing to the first cavity volume 2 is isolated from one another with the second cavity volume 3 so that optical sensor chip 5
Will not disturb each other with LED chip 6.Optical sensor chip 5, LED chip 6
Fixing on substrate 1, such as these two optical chips can be by patch well-known to those skilled in the art
Dress mode is installed.
Described outer enclosure structure is provided with first optical window corresponding with the first cavity volume 2, with
And second optical window corresponding with the second cavity volume 3.Make to be positioned at the first appearance by the first optical window
Optical sensor chip 5 in chamber 2 can accept from extraneous light, so that optical pickocff
Different optical signals that chip 5 receives according to it and make corresponding response；By the second optical window
Make the LED chip 6 being positioned in the second cavity volume 3 can send optical signal.
The transmittance section 8 of injection it is additionally provided with in described first optical window, the position of the second optical window.
This transmittance section 8 uses light transmissive material well-known to those skilled in the art, and available mould is molded
It is filled in the first optical window of lid 7, the second optical window position, by transmittance section 8 by first
Optical window, the second optical window are encapsulated, such that it is able to protection optical sensor chip 5, LED
Chip 6 is without damage, does not simultaneously the most affect optical sensor chip 5, LED chip 6 receives, sends
Optical signal.
Encapsulating structure of the present utility model, is defined for isolating first by prefabricated lid and substrate
Optical chip, the encapsulating structure of the second optical chip, and in the position of optical window, by injection thoroughly
Luminescent material forms transmittance section, thus by the first cavity volume of outer enclosure structure, the second cavity volume and external rings
The isolation in border；The design of this structure improves the dimensional accuracy of encapsulating structure, it is ensured that encapsulating structure
Concordance.
Encapsulating structure of the present utility model, first can utilize the injection of light tight capsulation material to be formed impermeable
The lid of light, and on lid, reserve optical window；In the position of optical window by the side of injection
Formula fills light transmissive material, forms transmittance section；Substrate mounts optical chip, and by the side of routing
The lead-in wire of optical chip is connected on the pad of substrate by formula；Above-mentioned prefabricated lid is mounted on substrate
On, define encapsulating structure of the present utility model.
This utility model one preferred embodiment in, at described first optical window, the second light
Learning and be provided with bulge-structure 9 on the sidewall of window, described bulge-structure 9 such as may be provided at the first light
Learn window, the middle part of the second optical window sidewall, can ensure that transmittance section 8 by this bulge-structure 9
The stability being connected with optical window.
This utility model another preferred embodiment in, at described first optical window, the second light
Learn window sidewall on be provided with broached-tooth design, described broached-tooth design can be distributed in the first optical window,
On the whole sidewall of the second optical window, it is also possible to be distributed in its partial sidewall.Note at optical window
After moulding transmittance section 8, this broached-tooth design can ensure that transmittance section 8 and stablizing that optical window sidewall is connected
Property.
The end face of this utility model transmittance section 8 can be with the end face of lid 7, with reference to Fig. 1；Also may be used
To be, the inner surface or outer surface of described transmittance section 8 are provided with optical lens structure 11, should
Optical lens structure 11 can be in hemispherical, and it can be integrated with transmittance section 8, with reference to figure
2.The optical lens that this optical lens structure 11 can come in and go out as optical signal, thus can improve light
The intensity that signal goes out, enters, thus improve optical sensor chip, the sensitivity of LED chip and divide
Resolution.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, above example is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (10)
1. an optical sensor package structure, it is characterised in that: include snapping together and being formed
The substrate (1) of lighttight outer enclosure structure and prefabricated lid (7), in described outer enclosure
The first cavity volume (2) isolated from one another, the second cavity volume (3) it is provided with in structure；Also include being arranged on
The first optical chip in described first cavity volume (2), and be arranged in the second cavity volume (3)
Two optical chips；First optics corresponding with the first cavity volume (2) it is provided with in described outer enclosure structure
Window, and second optical window corresponding with the second cavity volume (3)；Also include that mould filling is first
Optical window, the transmittance section (8) of the second optical window position.
Encapsulating structure the most according to claim 1, it is characterised in that: described first cavity volume (2),
Second cavity volume (3) is separated by spacer portion (4).
Encapsulating structure the most according to claim 2, it is characterised in that: described first cavity volume (2),
Second cavity volume (3), spacer portion (4) are one-body molded when being molded lid (7).
Encapsulating structure the most according to claim 1, it is characterised in that: at described first optics
Window, the second optical window sidewall on be provided with bulge-structure (9).
Encapsulating structure the most according to claim 4, it is characterised in that: described bulge-structure (9)
It is arranged on the first optical window, the middle part of the second optical window sidewall.
Encapsulating structure the most according to claim 1, it is characterised in that: at described first optics
Window, the second optical window sidewall on be provided with broached-tooth design.
Encapsulating structure the most according to claim 6, it is characterised in that: described broached-tooth design divides
Cloth the first optical window, the second optical window whole sidewall on.
Encapsulating structure the most according to claim 1, it is characterised in that: described first optical core
Sheet is optical sensor chip (5), and described second optical chip is LED chip (6).
Encapsulating structure the most according to claim 1, it is characterised in that: in described transmittance section (8)
On be provided with optical lens structure (11).
Encapsulating structure the most according to claim 9, it is characterised in that: described optical lens is tied
Structure (11) is arranged on the inner surface of transmittance section (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620453888.9U CN205752188U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620453888.9U CN205752188U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752188U true CN205752188U (en) | 2016-11-30 |
Family
ID=57364759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620453888.9U Active CN205752188U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752188U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784031A (en) * | 2017-01-18 | 2017-05-31 | 华天科技（西安）有限公司 | A kind of packaging part of novel photoelectric sensor |
| CN111973167A (en) * | 2020-08-19 | 2020-11-24 | 青岛歌尔智能传感器有限公司 | Wearable device, optical module and packaging method thereof |
| CN112327273A (en) * | 2021-01-04 | 2021-02-05 | 南京芯视界微电子科技有限公司 | Packaging structure of flight time distance sensor |
| CN112768561A (en) * | 2021-01-11 | 2021-05-07 | 杭州士兰微电子股份有限公司 | Optical sensor packaging structure and manufacturing method |
| WO2022128529A1 (en) * | 2020-12-15 | 2022-06-23 | Ams International Ag | Optical system packaging |
-
2016
- 2016-05-17 CN CN201620453888.9U patent/CN205752188U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784031A (en) * | 2017-01-18 | 2017-05-31 | 华天科技（西安）有限公司 | A kind of packaging part of novel photoelectric sensor |
| CN111973167A (en) * | 2020-08-19 | 2020-11-24 | 青岛歌尔智能传感器有限公司 | Wearable device, optical module and packaging method thereof |
| WO2022128529A1 (en) * | 2020-12-15 | 2022-06-23 | Ams International Ag | Optical system packaging |
| CN112327273A (en) * | 2021-01-04 | 2021-02-05 | 南京芯视界微电子科技有限公司 | Packaging structure of flight time distance sensor |
| CN112768561A (en) * | 2021-01-11 | 2021-05-07 | 杭州士兰微电子股份有限公司 | Optical sensor packaging structure and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200628 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |