CN101930312A - Sensor unit and manufacture method thereof - Google Patents
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- CN101930312A CN101930312A CN2009101505981A CN200910150598A CN101930312A CN 101930312 A CN101930312 A CN 101930312A CN 2009101505981 A CN2009101505981 A CN 2009101505981A CN 200910150598 A CN200910150598 A CN 200910150598A CN 101930312 A CN101930312 A CN 101930312A
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- 238000005520 cutting process Methods 0.000 claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000001514 detection method Methods 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 24
- 238000000465 moulding Methods 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 7
- 230000006698 induction Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 230000008034 disappearance Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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Abstract
The invention discloses a sensor unit and a manufacture method thereof. The manufacture method of the sensor unit comprises the following steps of: providing a substrate, wherein each sensor region on the substrate is provided with two independent circuit regions on the substrate, and the two circuit regions are respectively provided with a signal emitter and a signal sensor; forming a first package structure on the substrate by using a die to cover the signal emitter and the signal sensor; carrying out first cutting to form a first cutting channel around the two circuit regions and a second cutting channel positioned between the two circuit regions; forming a second package structure in the first and the second cutting channels by using the die; and carrying out second cutting to form a plurality of single sensor units, wherein the second package structure is used for isolating the signal emitter from the signal sensor.
Description
Technical field
The present invention relates to a kind of sensor unit and manufacture method thereof, refer to a kind of inductor manufacture method of utilizing same mould to carry out the model step of two passages especially, and the sensor unit with high-precision configuration.
Background technology
Along with the development of electronic product, the input media of many types is used in commence operation, for example button or button, slide-mouse, trace ball, touch control screen or the like in the electronic system at present.And the application of touch control screen recently is more and more general, and touch control screen can comprise contact panel, and it can be has the transparent panel that touches sensitive surfaces, so that operation surface is covered in the zone inspected of display screen.Touch control screen permission user is by finger or pointer touch-control display screen makes one's options and moving cursor, and reaches the computing action according to the touch-control incident.The close induction type sensor of infrared light (IR proximity sensor) then is widely used on the hand-holding communication device, being used to detect user's face, and then reaches operational control effect.
The close induction type sensor can be applicable to hand-held product, and for example when the user did not use the screen function, screen can automatically lock, and prolongs battery service time thus; Perhaps can allow contact panel at user's head when the screen, automatically lock the screen function, avoid head false touch keyboard in the conversation and interrupt dialogue.In addition, whether the close induction type sensor of long distance can be detected distance close about 20 to 80cm object, and powered-down function automatically when the user leaves can be applicable to Related products such as display.
The close induction type sensor has signal radiated element device (emitter) and signal detection device (detector), crosstalk (crosstalk) for fear of signal, known close induction type sensor construction be signal radiated element device and signal detection device are encapsulated earlier with encapsulating material after, be sticked in above-mentioned encapsulating structure with metal framework again, utilize metal framework to form barrier structure with Signal Spacing effect.But said structure has following disappearance: must form snap-in structure on this encapsulating structure in order to this metal framework of assembling, therefore improve technology and structural complicacy; Or on encapsulating structure gluing, utilize gluing mode to fix above-mentioned metal framework, yet the coating of viscose glue is wayward, the glue amount will cause the problem of the glue that overflows too much; The glue amount very little, the degree of fixation of metal framework is not good, comes off easily or displacement, will cause the isolation of signal not good.
Moreover, under the trend of component size downsizing, metal framework and encapsulating structure must have quite high precision, just are able to mutual winding and form the sensor unit of high isolation effect, therefore the difficulty of technology significantly improves, and the yield of product more can't effectively promote.
Edge is, the improving of the above-mentioned disappearance of inventor's thoughts proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
Fundamental purpose of the present invention; be to provide a kind of sensor unit and manufacture method thereof; this manufacture method utilizes same mould to carry out the model step of two passages; first encapsulating structure with difference moulding guard signal transmitter and signal detection device; and second encapsulating structure of isolated signal projector and signal detection device; and the engaging that can interfix when solidifying of first, second encapsulating structure is to form firm, high-precision Signal Spacing structure.
In order to reach above-mentioned purpose, the invention provides a kind of manufacture method of sensor unit, comprise: substrate is provided, include a plurality of inductors zone on this substrate, each inductor zone is provided with at least two independently circuit regions in this substrate, each inductor zone also includes signal projector and signal detection device, and this signal projector in each inductor zone and this signal detection device are arranged at respectively on this two circuit region in each inductor zone at least; Utilize mould that first encapsulating structure is taken shape on this substrate, this first encapsulating structure coats this signal projector and this signal detection device in each inductor zone, and the outer rim definition of between the circuit region and inductor zone has cutting zone; Remove this mould and carry out first cutting step along cutting zone, to form first Cutting Road of sealing ground around this two circuit region in each inductor zone, and second Cutting Road between this two circuit region in each inductor zone, and the two ends of this second Cutting Road are connected in this first Cutting Road; Utilize this mould that second encapsulating structure is taken shape among this first Cutting Road and this second Cutting Road again, with this signal projector and this signal detection device of isolating each inductor zone; And remove this mould and carry out second cutting step, this second cutting step is to cut along second encapsulating structure between the adjacent inductor zone, to form a plurality of these single sensor units.
It is a kind of according to the prepared sensor unit of above-mentioned manufacture method that the present invention also provides, and it comprises: substrate which is provided with two independently circuit regions; Be arranged at the signal projector and the signal detection device of this two circuit region respectively; Second encapsulating structure, it is located on this substrate being located in this signal projector and this signal detection device, and forms two cavitys this signal projector is isolated from this signal detection device; First encapsulating structure, it is arranged at this two cavity, to coat this signal projector and this signal detection device.
And in a further embodiment, this second encapsulating structure only takes shape in this signal projector and isolates between this signal detection device, with this signal projector and this signal detection device of isolating each inductor zone.And this manufacture method step is as follows: substrate is provided, include a plurality of inductors zone on this substrate, each inductor zone is provided with at least two independently circuit regions in this substrate, each inductor zone also includes signal projector and signal detection device, and this signal projector in each inductor zone and this signal detection device are arranged at respectively on this two circuit region in each inductor zone at least; Utilize mould that first encapsulating structure is coated these at least two circuit regions and be located at this signal projector and this signal detection device on these at least two circuit regions respectively, definition has cutting zone between each circuit region; Along this cutting zone between each circuit region this first encapsulating structure is carried out first cutting step, to form second Cutting Road between these at least two circuit regions, up to exposing this substrate; Utilize this mould second encapsulating structure to be taken shape on this second Cutting Road that exposes this substrate again, with this signal projector and this signal detection device of isolating each inductor zone; Carry out second cutting step again to form single sensor unit.
The present invention has following useful effect: the manufacture method that the present invention proposes, and the use single mold carries out the model of two passages, to reach cost-effective effect; And the sensor unit of made of the present invention has high-precision coating and signal isolation structures, makes this sensor unit have preferred fiduciary level.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 to Fig. 4 is the synoptic diagram of sensor unit manufacture method of the present invention.
Fig. 5 is the cut-open view of the sensor unit 5-5 along the line of Fig. 4.
Fig. 6 is the synoptic diagram of the sensor unit of the second embodiment of the present invention.
Description of reference numerals
1 sensor unit 1A inductor zone
10 substrate 10A, 10B circuit region
12 first encapsulating structure 13A, first Cutting Road
13B second Cutting Road 14 second encapsulating structures
Embodiment
See also Fig. 1 to Fig. 4, the invention provides a kind of manufacture method of sensor unit 1, this manufacture method is to utilize twice model method to carry out the encapsulation and the isolation of the element of sensor unit 1, it has the effect that reduces the technology cost, can also solve the disappearance of traditional assembling mode, its manufacture method comprises the steps:
Step of the present invention (one) be, substrate 10 is provided, and includes a plurality of inductors zone 1A on this substrate 10.As shown in Figure 1, in this specific embodiment, include two inductor zone 1A on this substrate 10, and each inductor zone 1A all can form a sensor unit 1 (as shown in Figure 4) after finishing technology described later.Each inductor zone 1A is provided with two independently circuit region 10A, 10B (but the number of this circuit region can be more than two) in the surface and the inside of this substrate 10, and in the present embodiment, the signal projector 11A of sensor unit 1 and signal detection device 11B then are installed on respectively on this two circuit region 10A, the 10B of each inductor zone 1A.This sensor unit 1 is a kind of close induction type inductor (proximity sensor unit) in this specific embodiment, and this signal projector 11A is light-emitting component (emitter), this signal detection device 11B then is a light detecing element (detector), above-mentioned signal projector 11A and signal detection device 11B are fixedly arranged on this two circuit region 10A of each inductor zone 1A respectively with chip sticking method (die attaching), on the 10B, and utilize lead-in wire that signal projector 11A and signal detection device 11B are electrically connected at its pairing this circuit region 10A, 10B.
Step (two) moulding first encapsulating structure 12 is on this substrate 10.In this step, be that encapsulating material is taken shape on this substrate 10, and coat signal projector 11A and signal detection device 11B on this substrate 10.Please again with reference to figure 1, in this specific embodiment, be to utilize mould (figure does not show) to carry out primary model step, with with the encapsulation material solidifies moulding, with coat above-mentioned circuit region 10A, 10B, with signal projector 11A and signal detection device 11B, and between circuit region 10A, the 10B, and cutting zone is arranged around the definition of the outer rim of this circuit region 10A, 10B; And in this model step employed encapsulating material, the light signal that light signal that signal projector 11A sent and signal detection device 11B institute desire are received penetrates, to avoid having influence on the running of this sensor unit 1.For instance, this signal detection device 11B can be a kind of integrated distance and environment light source detecing element (integrated ambient and proximity sensor), and this encapsulating material then is the encapsulating material of light-permeable; Or signal detection device 11B can be a kind of infrared light of simple function apart from detecing element (IR proximity sensor), this encapsulating material is the encapsulating material for allowing infrared light penetrate then, in other words, the present invention does not limit the material of first encapsulating structure 12, but the material of first encapsulating structure 12 must be selected according to the specification of signal projector 11A and signal detection device 11B, causes the characteristic of sensor unit 1 to descend to avoid first encapsulating structure 12.
Step (three) removes this mould and carries out first cutting step.After treating this first encapsulating structure 12 of encapsulation material solidifies moulding in the step (two), this mould is removed on this substrate 10, to carry out first cutting step.Please refer to Fig. 2, cutting zone along the periphery of each inductor zone 1A in this step forms the first Cutting Road 13A, in other words, this first Cutting Road 13A sealing ground (please notes around this two circuit region 10A, the 10B of each inductor zone 1A, succinct for accompanying drawing do not drawn out circuit region 10A, 10B among Fig. 2); This first cutting step more cutting zone between this two circuit region 10A, the 10B of each inductor zone 1A forms the second Cutting Road 13B, and the two ends of this second Cutting Road 13B are connected in this first Cutting Road 13A, and this first Cutting Road 13A and this second Cutting Road 13B all expose this substrate 10, therefore, this the first Cutting Road 13A and the second Cutting Road 13B are construed as the Cutting Road that is similar to " 8 font ", and utilize above-mentioned Cutting Road with circuit region 10A and signal projector 11A, and circuit region 10B and signal detection device 11B are separated.
On the other hand, in order to reach the purpose that exposes this substrate 10, the degree of depth of this first Cutting Road 13A and the second Cutting Road 13B is all greater than the thickness of this first encapsulating structure 12, so that extending downward in this substrate 10, this first Cutting Road 13A and the second Cutting Road 13B expose the circuit region 10A that is formed on these substrate 10 inside, 10B, in other words, this first cutting step is except removing the material of first encapsulating structure 12, also remove the material of this substrate 10 downwards, to form the first Cutting Road 13A and the second Cutting Road 13B, and in this specific embodiment, this first cutting step removes this substrate 10 of about 0.2 millimeters deep, but does not exceed with above-mentioned.Therefore, in Fig. 2, this substrate 10 can form the structure with ladder aspect.
Step (four) utilizes this mould that second encapsulating structure 14 is taken shape among this first Cutting Road 13A and the second Cutting Road 13B that exposes this substrate 10 again.Please refer to Fig. 3, in this step, be utilize with step (two) in identical mould carry out secondary model step, this mould cooperates with first encapsulating structure 12, this the first Cutting Road 13A and the second Cutting Road 13B are exposed, encapsulating material is filled among this first Cutting Road 13A and the second Cutting Road 13B, form this second encapsulating structure 14.Because the first above-mentioned Cutting Road 13A is that signal transmitting terminal (comprising circuit region 10A and signal projector 11A) is separated into two zones with signal receiving end (circuit region and 10B signal detection device 11B) with the Cutting Road structure that the second Cutting Road 13B is formed, therefore, when these second encapsulating structure, 14 curing moldings, this second encapsulating structure 14 promptly can be used for isolating this signal projector 11A and this signal detection device 11B of each sensor unit 1, to avoid the signal cross-talk (crosstalk) between the two elements.
Moreover, this second encapsulating structure 14 is best for completely cutting off the encapsulating material institute curing molding of infrared light, thus, what this second encapsulating structure 14 can be considered a kind of infrared light blocks structure (IR barrier), and because first encapsulating structure 12 and second encapsulating structure 14 are made by the model method, so both can quite firmly affixed moulding, and can not produce the problem that structure breaks away from or comes off.
Again on the one hand, consider the flatness on these substrate 10 surfaces, for fear of second encapsulating structure, 14 bottom surfaces and substrate 10 surfaces to contact aspect not good, and cause the signal of signal projector 11A and signal detection device 11B to interact.Therefore, in step (three), this first Cutting Road 13A and the second Cutting Road 13B extend downward in this substrate 10, so that second encapsulating structure 14 is imbedded in this substrate 10; As shown in Figure 5, second encapsulating structure 14 extends to about 0.2 millimeter (promptly the first Cutting Road 13A and the second Cutting Road 13B extend downward the degree of depth in this substrate 10) in this substrate 10, uses the signal of guaranteeing signal projector 11A and signal detection device 11B and can reach preferred isolation.
Step (five) removes this mould and carries out second cutting step, please refer to Fig. 4.After these second encapsulating structure, 14 curing moldings, this mould is removed on this substrate 10, to carry out second cutting step, make the sensor unit 1 of single the form of sensor unit 1 formation of masterplate (panel) aspect.So in this specific embodiment, this second cutting step is two sensor units 1 of masterplate aspect to be cut into single sensor unit 1, and this second cutting step cuts along second encapsulating structure 14 between the adjacent sensor unit 1, in other words, the Cutting Road of second cutting step can be overlapping with the first Cutting Road 13A of the part of first cutting step, and the width of the Cutting Road of second cutting step is less than the width of this first Cutting Road 13A, to keep the periphery of second encapsulating structure 14 in this signal projector 11A and signal detection device 11B.In this specific embodiment, the width of this first Cutting Road 13A is about 0.4 millimeter (being same as the width of second encapsulating structure 14), and the width of the Cutting Road of second cutting step is about 0.1 millimeter.
After above-mentioned steps, the structure of sensor unit 1 of the present invention comprises: substrate 10, which is provided with two independently circuit region 10A, 10B, this signal projector 11A and signal detection device 11B then are arranged at respectively on this two circuit region 10A, the 10B, and are electrically connected on this two circuit region 10A, 10B in modes such as lead-in wires respectively; Second encapsulating structure 14 is located on this substrate 10 to be located in this signal projector 11A and signal detection device 11B, and form two cavitys this signal projector 11A is isolated from this signal detection device 11B, in other words, this second encapsulating structure 14 is by the encapsulating material institute curing molding that can completely cut off infrared light, therefore this signal projector 11A and signal detection device 11B can be centered on by second encapsulating structure 14 respectively, and make signal each other can not produce interference.In addition, first encapsulating structure 12 is arranged in this two cavity, and coats this signal projector 11A and signal detection device 11B, to reach the purpose of protection this signal projector 11A and signal detection device 11B.And first encapsulating structure 12 and second encapsulating structure 14 utilize the moulding of same mould institute in different model steps, therefore the cost of mould can significantly descend, and first encapsulating structure 12 can closely set firmly with second encapsulating structure 14 and combine, with the problem of avoiding both to break away from, the signal of more avoiding causing after the encapsulating structure disengaging disturbs.
On the other hand, this second encapsulating structure 14 extends downward this substrate 10 inside, signal can fully be completely cut off by second encapsulating structure 14, and then reach the isolated effect of this signal projector 11A and signal detection device 11B.Moreover the material behavior of first encapsulating structure 12 and second encapsulating structure 14 is similar, and therefore, both have close thermal expansion character, when this sensor unit 1 is operated under hot environment, can have preferred fiduciary level.
Please refer to Fig. 6, it is the sensor unit 1 of the second embodiment of the present invention, is that with the difference of first embodiment this second encapsulating structure 14 only takes shape between this signal projector 11A and the signal detection device 11B, and its manufacturing step is as follows:
Step (one): substrate 10 is provided, includes a plurality of inductors zone 1A on this substrate 10.Please cooperate Fig. 1, in this specific embodiment, include two inductor zone 1A on this substrate 10, and each inductor zone 1A all can form a sensor unit 1 (as shown in Figure 4) after finishing technology described later.Each inductor zone 1A is provided with two independently circuit region 10A, 10B in the surface and the inside of this substrate 10, and the signal projector 11A of sensor unit 1 and signal detection device 11B then are installed on respectively on this two circuit region 10A, the 10B of each inductor zone 1A.
Step (two): utilize mould (figure does not show) to carry out primary model step, encapsulation material solidifies is shaped to first encapsulating structure 12, with coat above-mentioned circuit region 10A, 10B, with signal projector 11A and signal detection device 11B, and definition has a cutting zone between circuit region 10A, the 10B.
Step (three): carry out first cutting step, the cutting zone between this two circuit region 10A, the 10B of each inductor zone 1A forms the second Cutting Road 13B, and this second Cutting Road 13B exposes this substrate 10.As first embodiment, this second Cutting Road 13B can extend downward substrate 10 inside, to guarantee the Signal Spacing effect of follow-up second encapsulating structure 14.
Step (four): utilize this mould that second encapsulating structure 14 is taken shape among the second Cutting Road 13B again.This mould cooperates with first encapsulating structure 12, and the second Cutting Road 13B is exposed, and encapsulating material being filled among the second Cutting Road 13B, and forms this second encapsulating structure 14, to isolate this signal projector 11A and signal detection device 11B.
Step (five) removes this mould and carries out second cutting step, and it cuts along first encapsulating structure 12 between the adjacent inductor zone 1A, to form a plurality of these single sensor units 1.
In addition, employed material or other technological parameters all can not repeat them here with reference to first embodiment among second embodiment.
In sum, the present invention has following all advantage:
1. consider with regard to technologic, the manufacture method that the present invention proposes can utilize same mould to carry out the model step of two passages, so can reduce the cost of mould, and the precision of product is higher.
Moreover, in other words the reciprocatable tight engaging of above-mentioned two model step institute shaped structures, has higher fixedly aspect on the structure of the present invention, and be difficult for to produce the problem that structure comes off, and also more can guarantee the fiduciary level of product.
The above only is the preferred embodiments of the present invention, non-ly is intended to limit to Patent right requirement of the present invention, so the equivalent variations of using instructions of the present invention and accompanying drawing content to do such as all in like manner all is contained in the claim of the present invention, closes and gives Chen Ming.
Claims (10)
1. the manufacture method of a sensor unit is characterized in that may further comprise the steps:
Substrate is provided, include a plurality of inductors zone on this substrate, each inductor zone includes at least two circuit regions independent of each other, each circuit region is formed on the surface of this substrate with inner, and this signal projector in each inductor zone and this signal detection device are arranged at respectively on this two circuit region in each inductor zone at least;
Utilize mould that first encapsulating structure is taken shape on this substrate, this first encapsulating structure coats these at least two circuit regions, reaches this signal projector and this signal detection device be located at respectively on these at least two circuit regions, and defined cutting zone between each circuit region;
Along defined this cutting zone between each circuit region this first encapsulating structure is carried out first cutting step to form second Cutting Road between these at least two circuit regions, up to exposing this substrate; And
Utilize this mould second encapsulating structure to be taken shape on this second Cutting Road that exposes this substrate again, with this signal projector and this signal detection device of isolating each inductor zone.
2. the manufacture method of sensor unit as claimed in claim 1, it is characterized in that: this first encapsulating structure is carried out in the step of cutting along this cutting zone, also further form first Cutting Road of sealing ground around this at least two circuit region in each inductor zone, up to exposing this substrate, and the two ends of this second Cutting Road are connected in this first Cutting Road.
3. the manufacture method of sensor unit as claimed in claim 2, it is characterized in that: utilize this mould second encapsulating structure to be taken shape in the step of this second Cutting Road that exposes this substrate again, this second encapsulating structure also further is received in this first Cutting Road, and sealing ground is around this two circuit region in each inductor zone, and this second encapsulating structure of inserting this second Cutting Road is between this at least two circuit region in each inductor zone.
4. the manufacture method of sensor unit as claimed in claim 3, it is characterized in that: utilize this mould second encapsulating structure to be taken shape in after this second Cutting Road that exposes this substrate again, carry out second cutting step along second encapsulating structure between the adjacent inductor zone, to form a plurality of these single sensor units.
5. the manufacture method of sensor unit as claimed in claim 1, it is characterized in that: utilize this mould second encapsulating structure to be taken shape in after this second Cutting Road that exposes this substrate again, cut along first encapsulating structure between the adjacent inductor zone, to form a plurality of these single sensor units.
6. the manufacture method of sensor unit as claimed in claim 1, it is characterized in that: this signal projector in each inductor zone and this signal detection device are fixedly arranged on respectively on this two circuit region in each inductor zone with the chip sticking method, and this signal projector in each inductor zone and this signal detection device all are electrically connected at its pairing this circuit region with lead-in wire.
7. the manufacture method of sensor unit as claimed in claim 1, it is characterized in that: the made encapsulating material that maybe can allow infrared light penetrate of the encapsulating material that this first encapsulating structure is a light-permeable is made.
8. the manufacture method of sensor unit as claimed in claim 1 is characterized in that: the degree of depth of this first Cutting Road and this second Cutting Road is all greater than the thickness of this first encapsulating structure, and exposes the circuit region that is formed on this substrate inside.
9. the manufacture method of sensor unit as claimed in claim 4, it is characterized in that: in the step of moulding second encapsulating structure, be that the encapsulating material that can completely cut off infrared light fills in this first Cutting Road and this second Cutting Road, and make this encapsulation material solidifies that can completely cut off infrared light with this second encapsulating structure of moulding.
10. the manufacture method of sensor unit as claimed in claim 4, it is characterized in that: in second cutting step, the width of the Cutting Road of this second cutting step is less than the width of this first Cutting Road.
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| CN 200910150598 CN101930312B (en) | 2009-06-23 | 2009-06-23 | Sensor unit and manufacture method thereof |
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| CN 200910150598 CN101930312B (en) | 2009-06-23 | 2009-06-23 | Sensor unit and manufacture method thereof |
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| CN101930312B CN101930312B (en) | 2013-07-03 |
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| CN102628945A (en) * | 2012-03-30 | 2012-08-08 | 瑞声声学科技(深圳)有限公司 | Manufacturing method for light distance sensing device |
| CN102738012A (en) * | 2011-04-01 | 2012-10-17 | 光宝新加坡有限公司 | Method for producing sensor unit |
| CN107608001A (en) * | 2016-07-11 | 2018-01-19 | 光宝新加坡有限公司 | Sensing device further and its manufacture method |
| CN112466957A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
| CN112466958A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
| CN112466959A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102738012A (en) * | 2011-04-01 | 2012-10-17 | 光宝新加坡有限公司 | Method for producing sensor unit |
| CN102628945A (en) * | 2012-03-30 | 2012-08-08 | 瑞声声学科技(深圳)有限公司 | Manufacturing method for light distance sensing device |
| CN107608001A (en) * | 2016-07-11 | 2018-01-19 | 光宝新加坡有限公司 | Sensing device further and its manufacture method |
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| CN112466957A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
| CN112466958A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
| CN112466959A (en) * | 2020-10-28 | 2021-03-09 | 杭州士兰微电子股份有限公司 | Packaging method of optical sensor packaging body and packaging method of packaging structure |
| CN112768561A (en) * | 2021-01-11 | 2021-05-07 | 杭州士兰微电子股份有限公司 | Optical sensor packaging structure and manufacturing method |
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