CN112768561A - Optical sensor packaging structure and manufacturing method - Google Patents
Optical sensor packaging structure and manufacturing method Download PDFInfo
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- CN112768561A CN112768561A CN202110029894.7A CN202110029894A CN112768561A CN 112768561 A CN112768561 A CN 112768561A CN 202110029894 A CN202110029894 A CN 202110029894A CN 112768561 A CN112768561 A CN 112768561A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 68
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000002955 isolation Methods 0.000 claims abstract description 91
- 229920003023 plastic Polymers 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000001746 injection moulding Methods 0.000 claims abstract description 13
- 239000004033 plastic Substances 0.000 claims description 38
- 239000003292 glue Substances 0.000 claims description 9
- 238000012858 packaging process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 12
- 238000005192 partition Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 108010064719 Oxyhemoglobins Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/125—Composite devices with photosensitive elements and electroluminescent elements within one single body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses a light sensor packaging structure and a manufacturing method thereof, which comprises the following steps: forming a transparent plastic package body on the optical sensor, wherein the optical sensor comprises a substrate and at least one optical sensor unit positioned on the substrate, and each optical sensor unit comprises a light emitting end and a light receiving end; forming at least one isolation groove in the transparent plastic package body, wherein the isolation groove comprises a first isolation groove positioned between a light emitting end and a light receiving end of the light sensor unit; and forming a packaging shell on the transparent plastic packaging body, wherein the packaging shell at least comprises a lighttight isolation wall, and the isolation wall comprises a first isolation wall which is matched with the first isolation groove to block an optical path between the light emitting end and the light receiving end in each light sensor unit in the packaging structure. The method provided by the invention combines the packaging process and the injection molding process, and realizes the technical effect of isolating the light receiving end and the light emitting end in the optical sensor at lower cost.
Description
Technical Field
The invention relates to the field of optical sensor packaging, in particular to an optical sensor packaging structure and a manufacturing method thereof.
Background
Along with the development of technology and the popularization of smart mobile phone, intelligence wearing equipment also gradually enters into people's life in the middle of, distance sensor among the smart mobile phone, the heart rate sensor among intelligent bracelet and the intelligent wrist-watch, oxyhemoglobin saturation detect etc. all need use optical sensor, and optical sensor includes light transmitting end and light receiving end usually, in the application, requires that the transmitting light of light transmitting end reflects back light receiving end from the outside as far as possible. The outside here refers to the outside of the optical sensor package body, and for the optical sensor, an optical path from the light emitting end to the light receiving end is not required inside the package body, and for the whole device with the optical sensor, an optical path from the light emitting end to the light receiving end is not required inside the whole device. Based on this requirement, the conventional optical sensor usually needs to be packaged by two sets of dies. The first set of mold separately wraps the transmitting end and the receiving end inside the independent plastic package body with the transparent plastic package material, the second set of mold wraps the two transparent plastic packages again with the black plastic package material, and two light holes are reserved to the outside. When the packaging appearance schemes are more, the number of the dies is also increased by times correspondingly, the purchase cost of the corresponding dies is greatly increased, and the development cost of new appearance is higher.
Disclosure of Invention
In view of this, the present invention provides a method for manufacturing a light sensor package structure, which combines a package process and an injection molding process to achieve a technical effect of isolating a light receiving end and a light emitting end of a light sensor at a lower cost.
In order to achieve the purpose, the invention adopts the following technical scheme:
according to an aspect of the present invention, a method for manufacturing a light sensor package structure is provided, which includes the following steps:
forming a transparent plastic package body on a light sensor, wherein the light sensor comprises a substrate and at least one light sensor unit positioned on the substrate, and each light sensor unit comprises a light emitting end and a light receiving end;
forming at least one isolation groove in the transparent plastic package body, wherein the isolation groove comprises a first isolation groove positioned between a light emitting end and a light receiving end of the light sensor unit;
and forming a packaging shell on the transparent plastic packaging body, wherein the packaging shell at least comprises a lighttight isolation wall, and the isolation wall comprises a first isolation wall which is matched with the first isolation groove to block a light path between a light emitting end and a light receiving end in each light sensor unit in the packaging structure.
Preferably, the isolation trench further includes a second isolation trench located around the photosensor unit.
Preferably, the isolation wall further includes a second isolation wall embedded in the second isolation groove, and the second isolation wall surrounds the light sensor unit to block the light sensor unit from the light path.
Preferably, the package housing includes a non-light-transmitting region and a light-transmitting region, wherein the light-transmitting region is located above the light emitting end and the light receiving end.
Preferably, the light-transmitting region is further provided with a lens.
Preferably, the lens is separately manufactured using an injection molding process.
Preferably, the lens is connected with the packaging shell through transparent glue or a buckle.
Preferably, the number of lenses matches the number of light emitting ends and/or light receiving ends.
Preferably, the shape of the lens matches the shape of the light-transmitting region.
Preferably, the isolation groove is formed by cutting the transparent plastic package.
Preferably, at least a part of the isolation groove completely penetrates through the transparent plastic package body from top to bottom and extends downwards to the substrate, and the cutting depth on the substrate is 5% -50% of the thickness of the substrate.
Preferably, each of said light sensor units comprises a light receiving end and at least one light emitting end.
Preferably, each of the light sensor units includes a plurality of light emitting ends, a third isolation groove is disposed between the light emitting ends, and a light path between the light emitting ends in the package structure is blocked by a third isolation wall on the package housing.
Preferably, the package housing is separately manufactured by an injection molding process.
Preferably, the package housing is connected with the transparent plastic package body through glue.
Preferably, the method further includes cutting a combination formed by the substrate and the package housing to obtain mutually independent package structures with photosensor units.
According to another aspect of the present invention, there is also provided a light sensor package structure manufactured by the manufacturing method described above, including: the optical sensor comprises a substrate, wherein an optical sensor unit is arranged on the substrate and comprises a light emitting end and a light receiving end; the transparent plastic package body wraps the optical sensor unit on the substrate, the plastic package body comprises at least one isolation groove, and the isolation groove comprises a first isolation groove positioned between a light emitting end and a light receiving end of the optical sensor unit; and the packaging shell at least comprises a light-tight isolation wall, and the isolation wall comprises a first isolation wall which is matched with the first isolation groove to block the light path between the light emitting end and the light receiving end in each light sensor unit in the packaging structure.
The invention has the beneficial effects that:
the manufacturing method of the optical sensor packaging structure provided by the invention has the advantages that the plastic package body and the packaging shell with the non-light-transmitting area are manufactured respectively, the plastic package body is cut and then combined, the scheme of isolating the light emitting end from the light receiving end in the plastic package body is realized, the packaging shell can be manufactured independently through an injection molding process, the related cost and the time consumed by the packaging process are greatly reduced, the development cost of the new appearance of the optical sensor is obviously reduced, the development period is also shortened, only one packaging process is needed, multiple packaging of multiple sets of molds is not needed, and the production cost is obviously reduced. And by adopting the jointed board design, a plurality of optical sensors can be produced in one batch, so that the consistency and stability of products are improved, the production cost is reduced, and the production efficiency is improved.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is an exploded view of a light sensor package structure according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a method for fabricating a light sensor package structure according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of a package housing during a process of manufacturing the optical sensor package structure according to the first embodiment of the present invention;
FIG. 4 is a schematic diagram of a substrate with a molding compound corresponding to a board of a package housing during a process of manufacturing a package structure of an optical sensor according to a first embodiment of the present invention;
FIGS. 5-9 are partial schematic views of steps of a method of fabricating a light sensor package structure according to a first embodiment of the invention;
FIGS. 10a and 10b are schematic diagrams of a lens in a light sensor package structure according to a second embodiment of the present invention;
FIG. 11 is an exploded view of a second embodiment of a light sensor package structure of the present invention;
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
Fig. 1 shows an exploded view of a light sensor package structure according to a first embodiment of the present invention. The optical sensor packaging structure comprises a substrate 110, a plastic package body 120 and a packaging shell 130, wherein an optical sensor unit is arranged on the substrate 110, the optical sensor unit comprises a light receiving end 111 and a light emitting end 112 (shown by dotted lines in the figure), the light receiving end 111 and the light emitting end 112 are both wrapped by the plastic package body 120, the plastic package body 120 is divided into a left part and a right part by a first isolation groove 121, the first isolation groove 121 is formed by cutting, for example, the plastic package body 120 at the left part of the first isolation groove 121 wraps the light receiving end 111, the plastic package body 120 at the right part of the first isolation groove 121 wraps the light emitting end 112, and the plastic package body 120 is made of a light-transmitting plastic package material because the light receiving end 111 and the light emitting end 112 are both optical devices.
The package housing 130 is matched with the substrate 110 and the plastic package body 120, the package housing 130 is made of an opaque material by an injection molding process, for example, the package housing 130 includes a side wall and a top surface, a first isolation wall (not shown in the figure, but blocked) matched with the first isolation groove 121 is further provided in a space enclosed by the side wall and the top surface of the package housing 130, when the package housing 130 is combined with the substrate 110 and the plastic package body 120, the non-transparent package housing 130 covers the plastic package body 120, the side wall of the package housing 130 surrounds the plastic package body 120, so as to isolate the light sensor unit from the surrounding external environment, and a first isolation wall is further provided in the package housing 130, and the first isolation wall is located in the first isolation groove 121 between the light receiving end 111 and the light emitting end 112, so as to block a light path between the light emitting end 112 and the light receiving end 111 in each light sensor unit in the package structure. Further, the package housing 130 includes a non-light-transmitting region and a light-transmitting region, the light-transmitting region is located on the top surface of the package housing 130 and includes a first opening 132 and a second opening 133, the first opening 132 is located above the light receiving end 111, for example, the size of the first opening 132 is not smaller than the size of the light receiving end 111 and does not obstruct the reception of light, and similarly, the second opening 133 is located above the light emitting end 112, for example, the size of the second opening 133 is not smaller than the size of the light emitting end 112 and does not obstruct the emission of light. Further, the side wall of the package housing 130 is also made of an opaque material, and the side wall of the package housing 130, for example, serves as a second isolation wall to block the light path between the light sensor unit of the package structure and the outside. Of course, the single light sensor unit in the drawing includes only one light receiving end 111 and one light emitting end 112, and when the single light sensor unit has a plurality of light emitting ends 112 and one light receiving end 111, a third partition wall may be further designed to separate the plurality of light emitting ends 112 and one light receiving end 111 in the single light sensor unit from each other. Of course, the package housing may not be made of a completely opaque material, and the package housing may also be made of a light-transmitting material and a non-opaque material, so as to form a package housing including a non-light-transmitting region and a light-transmitting region, wherein the light-transmitting region is located above the light-emitting end and the light-receiving end, and specifically, the light-transmitting region may be located at the positions of the first opening 132 and the second opening 133.
Fig. 2 is a schematic diagram illustrating a method for manufacturing a light sensor package structure according to a first embodiment of the present invention, which includes the following steps.
In step S10, forming a transparent plastic package on the optical sensor, wherein the optical sensor includes a substrate and at least one optical sensor unit on the substrate, the transparent plastic package covers each optical sensor unit on the substrate, each optical sensor unit includes a light emitting end and a light receiving end, the substrate is designed for a jigsaw, for example, and includes a plurality of optical sensor units, and gaps are formed between the optical sensor units;
in step S20, forming at least one isolation groove in the transparent plastic package body, wherein the isolation groove is formed by cutting, for example, the isolation groove includes a first isolation groove between the light emitting end and the light receiving end of the light sensor unit and a second isolation groove between the adjacent light sensor units;
in step S30, a package housing is formed on the transparent plastic package body, wherein the package housing is separately manufactured, for example, by an injection molding process, the package housing includes at least one light-tight partition wall, the partition wall is matched with the partition groove, the partition wall includes a first partition wall and a second partition wall, the first partition wall blocks a light path between a light emitting end and a light receiving end of each light sensor unit in the package structure, and the second partition wall blocks a light path between adjacent light sensor units.
Further, as the above-mentioned substrate is designed for a jointed board, a semi-finished product formed by assembling the package housing and the optical sensor includes a plurality of mutually independent optical sensor package structures, and the plurality of mutually independent optical sensor package structures including the optical sensor unit are separated by cutting the semi-finished product to obtain a single optical sensor product.
Fig. 3 and fig. 4 respectively show a schematic diagram of a board of a package housing and a corresponding schematic diagram of a substrate with a plastic package body in a process of manufacturing a light sensor package structure according to a first embodiment of the present invention; the package housing assembly 1300 includes, for example, 60 package housings, which are arranged in a layout of 10 × 6, each package housing has a first partition wall 131, a second partition wall 1312 is disposed between adjacent package housings, and accordingly, the substrate assembly 1200 also includes 60 optical sensor units, which are arranged in a layout of 10 × 6, a first isolation groove 121 is disposed on a plastic package body of each optical sensor unit, and a second isolation groove 1212 is further disposed between adjacent optical sensor units. However, the layout and the number of the makeup design of the package shell and the substrate are not limited to the layout and the number, the package shell and the substrate are designed by adopting the makeup and are cut to obtain a single optical sensor product after the package shell and the substrate are assembled, and the mode can obviously improve the production efficiency and the consistency of the product.
FIGS. 5-9 are partial schematic views of steps of a method for fabricating a light sensor package structure according to a first embodiment of the present invention, wherein a substrate 110 is designed as a jigsaw, and only a region of a single light sensor unit is shown as an example for clarity of description of variations of the steps; as shown in fig. 5, a light sensor unit is provided on a substrate 110, the light sensor unit including a light receiving end 111 and a light emitting end 112, the light receiving end 111 and the light emitting end 112 are attached to the left and right sides of the substrate 110, respectively, the light receiving end 111 on the left side is connected to a pad 113 on the substrate 110 through a metal wire 114, and similarly, the light emitting end 112 on the right side is also connected to a pad on the substrate through a metal wire. It is understood that, the light sensor unit includes a light receiving end and at least one light emitting end, and the specific number can be adjusted accordingly according to practical situations, which is not limited in this application.
In order to better protect the optical sensor unit on the substrate 110 and the connection between the optical sensor unit and the substrate 110, the optical sensor unit needs to be packaged, since the optical sensor unit is an optical element, in order to enable the optical sensor unit to be used normally, the packaging is performed by using a light-transmitting plastic package material, as shown in fig. 6, the light receiving end 111, the light emitting end 112, the metal wire 114 and the pad 113 on the substrate 110 are packaged together in the plastic package body 120.
As shown in fig. 7, the package-formed plastic package body 120 is cut, a first isolation groove 121 and a second isolation groove 1212 are formed on the plastic package body 120, the first isolation groove 121 is located between the light receiving end 111 and the light emitting end 112, for example, the second isolation groove 1212 is located around the light sensor unit, for example, further, in order to ensure the isolation between the light receiving end 111 and the light emitting end 112 in the final product in the plastic package body 120, the first isolation groove 121 and the second isolation groove 1212 completely penetrate through the plastic package body 120, for example, from top to bottom, and extend downward to the substrate 110, and the cutting depth on the substrate 110 is 5% to 50% of the thickness of the substrate, that is, the first isolation groove 121 and the second isolation groove 1212 formed by cutting not only penetrate through the plastic package body 120, but also partially cut the substrate 110.
Fig. 8 is a schematic view illustrating a package housing prepared in a light sensor package structure according to a first embodiment of the present invention, the package housing 130 is made of a light-proof material, for example, by an injection molding process, the package housing 130 includes a side wall and a top surface, a first isolation wall 131 is disposed at a position corresponding to the first isolation groove 121 in a space surrounded by the side wall and the top surface, the side wall of the package housing 130 is, for example, a second isolation wall 1312 corresponding to the second isolation groove 1212, a first opening 132 corresponding to the light receiving end 111 is disposed at the top surface of the package housing 130, the first opening 132 is, for example, rectangular, four corners are designed with rounded corners, and a second opening 133 corresponding to the light emitting end 112, the second opening 133 is, for example, also rectangular, four corners are designed with rounded corners, so that the light emitting end 112 can emit light from the package housing 130 through the second opening 133, the light receiving end 111 can receive light from the outside of the package housing 130 through the first opening 132, of course, the shape and size of the first opening 132 and the second opening 133 can be adjusted and changed according to the requirement, the size of the first opening 132 is not smaller than the size of the light receiving end 111, for example, and the size of the second opening 133 is not smaller than the size of the light emitting end 112, for example.
Fig. 9 is a partial schematic view of a package housing combined with a plastic package body and a substrate, for example, a single optical sensor package structure is taken as an example, the inner structure covered by a light-tight housing is shown by a dotted line, the package housing 130 is combined with the plastic package body 120 and the substrate 110, specifically, the package housing 130 is connected with the substrate 110 and the plastic package body 120 by using transparent or non-transparent glue, a first isolation wall 131 in the package housing 130 is embedded in the first isolation groove 121, so as to block the passage of the light receiving end 111 and the light emitting end 112 in the package housing 130, and the optical sensor unit is embedded in a second isolation groove 1212 through a second isolation wall 1312 to block the passage of light around the outside.
Specifically, the thickness of the substrate 110 is, for example, 0.3mm, the molding compound used in the molding compound 120 is a transparent thermosetting epoxy resin, and the thickness of the molding compound 120 is, for example, 0.4 mm. The cutting thickness (the width of the second isolation groove 1212) between the photo-sensor units is 0.5mm, the width of the first isolation groove 121 is 0.3mm, and the cutting depth is, for example, 0.42mm, and the cutting depth is greater than the thickness of the plastic package body 120 because the substrate 110 is also partially cut, so that the better sealing effect is achieved after the substrate is combined with the package housing 130. The package housing 130 is made of, for example, a light-tight plastic material (LCP, LIQUID CRYSTAL POLYMER), and is formed by an injection molding process, and can endure a high temperature of 340 ℃, for example, the height of the package housing 130 is 1.05mm, the height of the internal space is 0.4mm, and the thickness of the package housing 130 is 0.65 mm. The glue used in the combination is for example a low temperature thermosetting epoxy resin.
FIGS. 10a and 10b are schematic diagrams respectively illustrating a lens in a light sensor package structure according to a second embodiment of the present invention; the first lens 141 shown in fig. 10a is, for example, matched with the light receiving end 111, and disposed at the first opening 132 above the light receiving end 111, so that the received light irradiates the light receiving end 111 with converged light spots, and similarly, the second lens 142 shown in fig. 10b is, for example, matched with the light emitting end 112, and disposed at the second opening 133 above the light emitting end 112, so that the emitted light is emitted in a converged manner, and both lenses can improve the sensitivity of the optical sensor package structure, and the lenses are, for example, connected with the package housing 130 through transparent glue. Specifically, the first lens 141 and the second lens 142 are both designed to have a flat bottom and a curved top, and have a thickness of 0.5mm from the bottom to the top of the lens, for example, and are both made of a light-transmitting plastic material through an injection molding process. Of course, the shape and size of the lens may also be adjusted according to specific optical path design requirements. It is understood that, the light sensor unit includes a light receiving end and at least one light emitting end, and the specific number can be adjusted accordingly according to practical situations, which is not limited in this application. Of course, the number of lenses matches the number of light emitting ends and/or light receiving ends, and the shape of the lenses matches the shape of the openings.
Fig. 11 shows an exploded view of an optical sensor package structure according to a second embodiment of the present invention, which is similar to the first embodiment, and the structure of a part of the optical sensor package structure is not repeated herein, except that the embodiment has a first lens 141 and a second lens 142, the two lenses are respectively located above the light receiving end 111 and the light emitting end 112 to optimize the light path thereof, the first lens 141 is disposed at the first opening 132, for example, and the second lens 142 is disposed at the second opening 133, for example, although the lens and the package housing 130 can be connected by transparent glue, a corresponding fastening structure can also be disposed, when the lens and the package housing 130 are connected by transparent glue, the package housing 130 needs to be connected with the cut plastic package body 120 and the substrate 110 before the lens and the package housing 130 are connected. When the lens is connected to the package housing 130 through the snap structure, for example, a bayonet may be disposed on the inner side of the top surface of the package housing 130, and a buckle may be disposed on the edge of the lens, so that the lens may be snap-connected from the inside of the package housing 130, and after the connection, the package housing 130 is connected to the substrate 110 and the plastic package body 120, and each product is marked by laser printing, and finally, the product is cut to obtain a plurality of independent optical sensor package structures including optical sensor units.
The manufacturing method of the optical sensor packaging structure provided by the invention has the advantages that the plastic package body and the packaging shell with the non-light-transmitting area are manufactured respectively, the plastic package body is cut and then combined, the scheme of isolating the light emitting end from the light receiving end in the plastic package body is realized, the packaging shell can be manufactured independently through an injection molding process, the related cost and the time consumed by the packaging process are greatly reduced, the development cost of the new appearance of the optical sensor is obviously reduced, the development period is also shortened, only one packaging process is needed, multiple packaging of multiple sets of molds is not needed, and the production cost is obviously reduced. And by adopting the jointed board design, a plurality of optical sensors can be produced in one batch, so that the consistency and stability of products are improved, the production cost is reduced, and the production efficiency is improved.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Also, it should be understood that the example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of the present disclosure. Those skilled in the art will understand that specific details need not be employed, that example embodiments may be embodied in many different forms and that example embodiments should not be construed as limiting the scope of the disclosure. In some example embodiments, well-known device structures and well-known technologies are not described in detail.
When an element or layer is referred to as being "on," "engaged to," "connected to" or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another element, region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (17)
1. A method for manufacturing a light sensor packaging structure is characterized by comprising the following steps:
forming a transparent plastic package body on a light sensor, wherein the light sensor comprises a substrate and at least one light sensor unit positioned on the substrate, and each light sensor unit comprises a light emitting end and a light receiving end;
forming at least one isolation groove in the transparent plastic package body, wherein the isolation groove comprises a first isolation groove positioned between a light emitting end and a light receiving end of the light sensor unit;
and forming a packaging shell on the transparent plastic packaging body, wherein the packaging shell at least comprises a lighttight isolation wall, and the isolation wall comprises a first isolation wall which is matched with the first isolation groove to block a light path between a light emitting end and a light receiving end in each light sensor unit in the packaging structure.
2. The method of claim 1, wherein the isolation trench further comprises a second isolation trench disposed around the photosensor unit.
3. The method of claim 2, wherein the isolation wall further comprises a second isolation wall embedded in the second isolation groove, the second isolation wall surrounding the photosensor unit to block the photosensor unit from light passing therethrough.
4. The method of claim 1, wherein the package housing comprises a non-light transmissive region and a light transmissive region, wherein the light transmissive region is located above the light emitting end and the light receiving end.
5. The method of claim 4, wherein the light-transmissive region is further provided with a lens.
6. The method of claim 5, wherein the lens is separately formed using an injection molding process.
7. The method of claim 5, wherein the lens is connected to the package housing by a transparent glue or a snap.
8. The method of manufacturing according to claim 5, wherein the number of lenses matches the number of light emitting ends and/or light receiving ends.
9. The method of claim 8, wherein the shape of the lens matches the shape of the light-transmissive region.
10. The method of manufacturing according to claim 1, wherein the isolation groove is formed by cutting the transparent plastic package.
11. The method according to claim 1, wherein at least a portion of the isolation trench extends completely through the transparent plastic package body from top to bottom and extends downward to the substrate, and the cutting depth on the substrate is 5% to 50% of the thickness of the substrate.
12. The method of claim 1, wherein each of the light sensor units comprises a light receiving end and at least one light emitting end.
13. The method of claim 12, wherein each of the light sensor units comprises a plurality of light emitting ends, and a third isolation groove is disposed between the light emitting ends to block a light path between the light emitting ends in the package structure through a third isolation wall on the package housing.
14. The method of claim 1, wherein the package housing is separately formed by an injection molding process.
15. The method of claim 1, wherein the package housing is connected to the transparent plastic package body by glue.
16. The method according to claim 1, further comprising cutting a combination of the substrate and the package housing to obtain mutually independent package structures having the photosensor units.
17. A light sensor package structure fabricated by the fabrication method of any one of claims 1-16, comprising:
the optical sensor comprises a substrate, wherein an optical sensor unit is arranged on the substrate and comprises a light emitting end and a light receiving end;
the transparent plastic package body wraps the optical sensor unit on the substrate, the plastic package body comprises at least one isolation groove, and the isolation groove comprises a first isolation groove positioned between a light emitting end and a light receiving end of the optical sensor unit;
and the packaging shell at least comprises a light-tight isolation wall, and the isolation wall comprises a first isolation wall which is matched with the first isolation groove to block the light path between the light emitting end and the light receiving end in each light sensor unit in the packaging structure.
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