TW201527112A - Display device - Google Patents

Display device Download PDF

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Publication number
TW201527112A
TW201527112A TW103100704A TW103100704A TW201527112A TW 201527112 A TW201527112 A TW 201527112A TW 103100704 A TW103100704 A TW 103100704A TW 103100704 A TW103100704 A TW 103100704A TW 201527112 A TW201527112 A TW 201527112A
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TW
Taiwan
Prior art keywords
display
cover
display device
area
accommodating space
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Application number
TW103100704A
Other languages
Chinese (zh)
Inventor
Wei-Chih Hsu
Chung-Hsien Li
Original Assignee
Wintek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Wintek Corp filed Critical Wintek Corp
Priority to TW103100704A priority Critical patent/TW201527112A/en
Priority to CN201420440780.7U priority patent/CN204155230U/en
Priority to CN201410383529.6A priority patent/CN104765484A/en
Publication of TW201527112A publication Critical patent/TW201527112A/en

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Abstract

A display device includes a display panel and a cover substrate disposed on the top side of the display panel. The display panel includes a display substrate, a display element layer and a circuit control element. The display substrate has a display region and a periphery region at least positioned at a side of the display region. The display element layer is disposed on the upper surface of the display substrate in the display region. The circuit control element is disposed on the upper surface of the display substrate in the periphery region. The cover substrate has a transparent region and a border region defined thereon. The transparent region and the border region are corresponding to the display region and the periphery region of the display substrate respectively. The cover substrate has a containing space disposed in the border region. The containing space is corresponding to the circuit control element and used for containing at least a portion of the circuit control element.

Description

顯示裝置 Display device

本發明係有關於一種顯示裝置,尤指一種在蓋板表面設置有容置空間之顯示裝置。 The present invention relates to a display device, and more particularly to a display device in which an accommodation space is provided on a surface of a cover plate.

隨著科技發展,各種顯示裝置,特別是搭配了觸控功能的顯示裝置,已被廣泛應用於各種電子產品中,例如智慧型手機、衛星導航系統、平板電腦、個人數位助理等。一般而言,顯示裝置的基板上會設置各種電子元件或顯示元件,由於這些元件的厚度並不相同,若要將顯示裝置與其他裝置相結合或進行組裝,則可能會因為某些厚度較厚的元件(例如具有0.2至0.3毫米厚的驅動晶片)而導致顯示裝置無法與其他裝置順利組裝,或者必須在顯示裝置與其他裝置之間留下較厚之空隙,限制了產品輕薄化的可能性。 With the development of technology, various display devices, especially display devices equipped with touch functions, have been widely used in various electronic products, such as smart phones, satellite navigation systems, tablet computers, personal digital assistants, and the like. In general, various electronic components or display components are disposed on the substrate of the display device. Since the thickness of these components is not the same, if the display device is combined or assembled with other devices, some thickness may be thick. The components (for example, having a drive wafer of 0.2 to 0.3 mm thick) cause the display device to be unable to be assembled smoothly with other devices, or a thick gap must be left between the display device and other devices, limiting the possibility of lightening and thinning the product. .

本發明之主要目的之一在於提供一種顯示裝置,其包括顯示面板與蓋板,且蓋板具有呈凹陷結構之一容置空間,用以容納顯示面板表面之元件,藉此以降低整體顯示裝置的厚度。 One of the main objects of the present invention is to provide a display device including a display panel and a cover plate, and the cover plate has an accommodating space in a recessed structure for accommodating components of the surface of the display panel, thereby reducing the overall display device. thickness of.

根據本發明之實施例,本發明揭露一種顯示裝置,其包括一顯示面板以及一蓋板。顯示面板包括一顯示基板、一顯示元件層及一電路控制元件。顯示基板具有一顯示區與一周邊電路區,其中周邊電路區位於顯示區之至少一側。顯示元件層係設於顯示基板之上表面上並位於顯示區。電路控制元件係設於顯示基板之上表面上並位於周邊電路區。蓋板表面定義有一透光區與一周邊區,其中透光區對應於顯示基板之顯示區,而周邊區對應於顯示基板之周邊電路區。蓋板設於該顯示面板朝該電路控制元件之一側,且蓋板 具有一容置空間設於周邊區,容置空間對應於電路控制元件且係用來容置該電路控制元件。 According to an embodiment of the invention, a display device includes a display panel and a cover. The display panel includes a display substrate, a display element layer and a circuit control element. The display substrate has a display area and a peripheral circuit area, wherein the peripheral circuit area is located on at least one side of the display area. The display element layer is disposed on the upper surface of the display substrate and located in the display area. The circuit control component is disposed on the upper surface of the display substrate and located in the peripheral circuit region. The surface of the cover plate defines a light transmissive area and a peripheral area, wherein the light transmissive area corresponds to the display area of the display substrate, and the peripheral area corresponds to the peripheral circuit area of the display substrate. a cover plate is disposed on the display panel toward one side of the circuit control component, and the cover plate An accommodating space is disposed in the peripheral area, and the accommodating space corresponds to the circuit control component and is used for accommodating the circuit control component.

根據本發明,由於蓋板表面的容置空間可以容納顯示面板表面之特定元件,例如電路控制元件,因此,即使顯示面板表面的特定元件較其他元件(例如顯示元件層)的高度更高,該特定元件仍可設置於蓋板的容置空間中,不需因而加大蓋板與顯示面板之間的距離,進而能縮短蓋板與顯示面板之間的設置距離,降低顯示裝置的整體厚度,也不需在蓋板與顯示面板之間設置額外具有較大厚度的固定機構。因此,本發明容置空間之設計增加了顯示面板與其他裝置組立之可能性。 According to the present invention, since the accommodating space of the surface of the cover plate can accommodate a specific component of the surface of the display panel, such as a circuit control component, even if the specific component of the surface of the display panel is higher than the height of other components (for example, the display component layer), The specific component can still be disposed in the accommodating space of the cover plate, thereby eliminating the distance between the cover plate and the display panel, thereby shortening the installation distance between the cover plate and the display panel, and reducing the overall thickness of the display device. It is also unnecessary to provide an additional fixing mechanism having a large thickness between the cover and the display panel. Therefore, the design of the accommodating space of the present invention increases the possibility that the display panel is assembled with other devices.

10‧‧‧觸控面板 10‧‧‧Touch panel

12‧‧‧顯示面板 12‧‧‧ display panel

14、141、142、143、144‧‧‧蓋板 14, 141, 142, 143, 144 ‧ ‧ cover

14a‧‧‧上表面 14a‧‧‧Upper surface

14b‧‧‧外表面 14b‧‧‧ outer surface

16‧‧‧電路板 16‧‧‧ boards

18‧‧‧觸控元件層 18‧‧‧Touch element layer

20‧‧‧顯示基板 20‧‧‧ display substrate

20a‧‧‧上表面 20a‧‧‧ upper surface

22‧‧‧顯示元件層 22‧‧‧Display component layer

24‧‧‧保護層 24‧‧‧Protective layer

26、261、262、263‧‧‧容置空間 26, 261, 262, 263‧‧‧ accommodating space

26a、261a、262a、263a‧‧‧內側壁 26a, 261a, 262a, 263a‧‧‧ inner side wall

26b、261b‧‧‧頂壁 26b, 261b‧‧‧ top wall

26c‧‧‧外側壁 26c‧‧‧Outer side wall

26d、262d‧‧‧短側壁 26d, 262d‧‧‧ short side walls

28‧‧‧電路控制元件 28‧‧‧Circuit control components

28a‧‧‧頂面 28a‧‧‧ top surface

30‧‧‧封膠 30‧‧‧Packing

32‧‧‧外蓋 32‧‧‧ Cover

100、102、104、106、108‧‧‧顯示裝置 100, 102, 104, 106, 108‧‧‧ display devices

200‧‧‧電子產品 200‧‧‧Electronic products

202‧‧‧裝飾層 202‧‧‧Decorative layer

A1‧‧‧透光區 A1‧‧‧Light transmission area

A2‧‧‧周邊區 A2‧‧‧ surrounding area

A3‧‧‧連接區 A3‧‧‧Connected area

R1‧‧‧顯示區 R1‧‧‧ display area

R2‧‧‧周邊電路區 R2‧‧‧ peripheral circuit area

T1、T2、T3、T4‧‧‧厚度 T1, T2, T3, T4‧‧‧ thickness

第1圖為本發明顯示裝置之第一實施例的剖面示意圖。 Figure 1 is a cross-sectional view showing a first embodiment of the display device of the present invention.

第2圖為第1圖所示顯示裝置之蓋板的外觀示意圖。 Fig. 2 is a schematic view showing the appearance of the cover of the display device shown in Fig. 1.

第3圖為本發明顯示裝置之第二實施例的剖面示意圖。 Figure 3 is a schematic cross-sectional view showing a second embodiment of the display device of the present invention.

第4圖為第3圖所示顯示裝置之蓋板的外觀示意圖。 Fig. 4 is a schematic view showing the appearance of the cover of the display device shown in Fig. 3.

第5圖為本發明顯示裝置之第三實施例的剖面示意圖。 Figure 5 is a cross-sectional view showing a third embodiment of the display device of the present invention.

第6圖為第5圖所示顯示裝置之蓋板的外觀示意圖。 Fig. 6 is a schematic view showing the appearance of the cover of the display device shown in Fig. 5.

第7圖為第5圖所示顯示裝置應用於一電子產品的外觀示意圖。 Fig. 7 is a schematic view showing the appearance of the display device shown in Fig. 5 applied to an electronic product.

第8圖為本發明顯示裝置之第四實施例的剖面示意圖。 Figure 8 is a cross-sectional view showing a fourth embodiment of the display device of the present invention.

第9圖為第8圖所示顯示裝置之蓋板的外觀示意圖。 Figure 9 is a schematic view showing the appearance of the cover of the display device shown in Figure 8.

第10圖為本發明顯示裝置之第五實施例的剖面示意圖。 Figure 10 is a cross-sectional view showing a fifth embodiment of the display device of the present invention.

第11圖為第10圖所示顯示裝置之蓋板的外觀示意圖。 Figure 11 is a schematic view showing the appearance of the cover of the display device shown in Figure 10.

請同時參考第1圖與第2圖,其中第2圖為第1圖中蓋板14的外觀示意圖,為了使圖式能更清楚易懂,第2圖所示蓋板14與第1圖上下相反,亦即蓋板14的上表面14a係畫於上側,並且省略了蓋板14表面的其他元件。 根據本發明,顯示裝置100包括一顯示面板12以及設於顯示面板12上側的一蓋板14。顯示面板12包括一顯示基板20、一顯示元件層22及一電路控制元件28。顯示基板20具有一顯示區R1與一周邊電路區R2,周邊電路區R2位於顯示區R1之至少一側,本實施例係以周邊電路區R2環繞顯示區R1為例,但不以此為限。顯示元件層22設於顯示基板20之一上表面20a,並且位於顯示區R1內。顯示元件層22可以為各種形式且可提供顯示功能之元件層。本實施例係以顯示元件層22為有機發光元件層來舉例說明,例如顯示元件層22可包括有機發光元件材料、驅動開關元件、掃瞄線與訊號線及絕緣層等,但不以此為限。因此,顯示元件層22可以包括不只一層膜層,甚至包括複數個形狀圖案不同的薄膜堆疊。電路控制元件28係設於顯示基板20之上表面20a的周邊電路區R2內,其中電路控制元件28係耦接於顯示元件層22中的至少一顯示元件,以提供控制顯示元件的訊號。電路控制元件28舉例為積體電路(IC)晶片,但不以此為限。顯示面板12另可選擇性地包括一保護層24設置於顯示基板20的上表面20a,覆蓋且披覆顯示元件層22的表面與側壁,以提供顯示元件層22所需之保護功能,亦即保護層24是設置於顯示元件層22與蓋板14之間。以IC晶片為例,通常電路控制元件28的厚度T2會大於以薄膜為主的顯示元件層22之厚度T1,甚至會大於顯示元件層22與保護層24的總厚度T3,例如電路控制元件28的厚度T2舉例為0.2至0.3毫米,因此,電路控制元件28的頂部會高出於顯示元件層22與保護層24。 Please refer to Fig. 1 and Fig. 2 at the same time. Fig. 2 is a schematic view of the appearance of the cover plate 14 in Fig. 1. In order to make the drawing more clear and easy to understand, the cover plate 14 and Fig. 1 shown in Fig. 2 are up and down. On the contrary, the upper surface 14a of the cover 14 is drawn on the upper side, and other elements on the surface of the cover 14 are omitted. According to the present invention, the display device 100 includes a display panel 12 and a cover 14 disposed on the upper side of the display panel 12. The display panel 12 includes a display substrate 20, a display element layer 22, and a circuit control element 28. The display substrate 20 has a display area R1 and a peripheral circuit area R2, and the peripheral circuit area R2 is located on at least one side of the display area R1. This embodiment uses the peripheral circuit area R2 to surround the display area R1 as an example, but is not limited thereto. . The display element layer 22 is provided on one of the upper surfaces 20a of the display substrate 20 and is located in the display area R1. The display element layer 22 can be in various forms and can provide a component layer for display functions. In this embodiment, the display device layer 22 is exemplified as an organic light-emitting device layer. For example, the display device layer 22 may include an organic light-emitting device material, a driving switch device, a scan line, a signal line, an insulating layer, etc., but limit. Thus, display element layer 22 can include more than one film layer, even including a plurality of film stacks having different shape patterns. The circuit control component 28 is disposed in the peripheral circuit region R2 of the upper surface 20a of the display substrate 20, wherein the circuit control component 28 is coupled to at least one of the display component layers 22 to provide a signal for controlling the display component. The circuit control component 28 is exemplified by an integrated circuit (IC) chip, but is not limited thereto. The display panel 12 further optionally includes a protective layer 24 disposed on the upper surface 20a of the display substrate 20 to cover and cover the surface and sidewalls of the display element layer 22 to provide the protection function required for the display element layer 22, that is, The protective layer 24 is disposed between the display element layer 22 and the cover plate 14. Taking the IC wafer as an example, the thickness T2 of the circuit control element 28 is generally greater than the thickness T1 of the thin film-based display element layer 22, and may even be greater than the total thickness T3 of the display element layer 22 and the protective layer 24, such as the circuit control element 28. The thickness T2 is exemplified by 0.2 to 0.3 mm, and therefore, the top of the circuit control element 28 may be higher than the display element layer 22 and the protective layer 24.

另一方面,蓋板14的表面定義有一透光區A1與一周邊區A2,其中透光區A1對應於顯示基板20之顯示區R1,而周邊區A2對應於顯示基板20之周邊電路區R2。為了縮短蓋板14與顯示面板12之間的垂直距離以及使顯示面板12可以順利與蓋板14組合,本發明蓋板14的周邊區A2具有一容置空間26,對應於電路控制元件28。如第1圖與第2圖所示,相對於蓋板14的上表面14a而言,容置空間26係為一凹陷結構,且本實施例的容置空間26係為一凹槽,由蓋板14之上表面14a向蓋板14之外表面14b方向內 凹。呈凹槽形狀之容置空間26具有一內側壁26a、一外側壁26c、二短側壁26d以及一頂壁26b,其中短側壁26d位於內側壁26a與外側壁26c之間。因此,當蓋板14固接於顯示面板12之上側時,呈凹槽狀的容置空間26係用來容置電路控制元件28之至少一部分,以使電路控制元件28凸出於顯示元件層22與保護層24的部分(即電路控制元件28的頂部)能剛好容置於容置空間26中,因此,電路控制元件28之頂部的頂面28a係高於蓋板14之上表面14a。蓋板14的材料舉例為玻璃或塑膠,但不以此為限,且蓋板14表面可另塗佈阻水氧膜層。再者,在本發明較佳實施例中,蓋板14的上表面14a上可設置有觸控元件層18。舉例而言,觸控元件層18可包括導電電極和絕緣層或保護層,導電電極可具有雙層或單層結構,可以包括軸向電極、矩形電極、類三角形電極等可種能提供感測或觸控功能之電極,但不以此為限。因此,觸控元件層18與蓋板14可視為構成一單片式觸控面板10,例如單片式玻璃觸控(OGS)面板。在第1圖中所繪示的觸控元件層18係大體上設於透光區A1並對應於顯示元件層22,但不以此為限,在不同實施例中,觸控元件層18的一部分電極可延伸至透光區A1以外的部分,例如延伸至周圍區A2,並且不是完全與顯示元件層22相對應。此外,蓋板14的上表面14a或外表面14b可另設置一至多層裝飾層(圖未示),裝飾層可位於周圍區A2,以提供美觀效果並遮蔽周邊電路區R2之元件,也可以改善具凹陷結構之容置空間26所造成的色差。 On the other hand, the surface of the cover plate 14 defines a light-transmitting area A1 corresponding to the display area R1 of the display substrate 20, and a peripheral area A2 corresponding to the peripheral circuit area R2 of the display substrate 20. In order to shorten the vertical distance between the cover 14 and the display panel 12 and to allow the display panel 12 to be smoothly combined with the cover 14, the peripheral area A2 of the cover 14 of the present invention has an accommodation space 26 corresponding to the circuit control element 28. As shown in FIG. 1 and FIG. 2, the accommodating space 26 is a recessed structure with respect to the upper surface 14a of the cover plate 14. The accommodating space 26 of the embodiment is a recess. The upper surface 14a of the plate 14 is directed in the direction of the outer surface 14b of the cover plate 14. concave. The accommodating space 26 having a groove shape has an inner side wall 26a, an outer side wall 26c, two short side walls 26d, and a top wall 26b, wherein the short side wall 26d is located between the inner side wall 26a and the outer side wall 26c. Therefore, when the cover plate 14 is fixed to the upper side of the display panel 12, the recessed accommodating space 26 is for accommodating at least a portion of the circuit control element 28 such that the circuit control element 28 protrudes from the display element layer. The portion of the 22 and protective layer 24 (i.e., the top of the circuit control component 28) can be just received in the housing space 26 such that the top surface 28a of the top of the circuit control component 28 is higher than the upper surface 14a of the cover panel 14. The material of the cover plate 14 is exemplified by glass or plastic, but not limited thereto, and the surface of the cover plate 14 may be additionally coated with a water-blocking oxygen film layer. Moreover, in the preferred embodiment of the present invention, the upper surface 14a of the cover plate 14 may be provided with a touch element layer 18. For example, the touch element layer 18 may include a conductive electrode and an insulating layer or a protective layer. The conductive electrode may have a double layer or a single layer structure, and may include an axial electrode, a rectangular electrode, a triangular-like electrode, etc. Or the electrode of the touch function, but not limited to this. Therefore, the touch element layer 18 and the cover 14 can be considered to constitute a single-chip touch panel 10, such as a monolithic glass touch (OGS) panel. The touch element layer 18 is substantially disposed in the light-transmitting area A1 and corresponds to the display element layer 22, but is not limited thereto. In different embodiments, the touch element layer 18 is A portion of the electrode may extend to a portion other than the light transmitting region A1, for example, to the peripheral region A2, and does not completely correspond to the display element layer 22. In addition, the upper surface 14a or the outer surface 14b of the cover plate 14 may be further provided with one or more decorative layers (not shown), and the decorative layer may be located in the surrounding area A2 to provide an aesthetic effect and shield the components of the peripheral circuit area R2, and may also be improved. The chromatic aberration caused by the accommodating space 26 having a recessed structure.

本實施例另利用一封膠30來固接蓋板14與顯示面板12。如第1圖所示,封膠30設於蓋板14與顯示基板20之間,且封膠30位於周邊電路區R2,用來固接蓋板14與12顯示面板。其中,封膠30舉例為玻璃熔接膠,厚度T4為約5至10微米,但不以此為限。再者,在本實施例中,蓋板14表面另定義有一連接區A3,其中連接區A3並未對應於顯示基板20之顯示區R1與周邊電路區R2,因此蓋板14的尺寸稍大於顯示基板20的尺寸,當蓋板14固接於顯示基板20上側時,連接區A3區域的蓋板14係突出於顯示基 板20,但不以此為限。再者,蓋板14上可另設置一電路板16,電路板16的至少一部分位於蓋板14之下表面14a的連接區A3中。電路板16可耦接於觸控元件層18以用來傳遞觸控訊號。因此,電路板16可以視為觸控面板10之一部分。並且,觸控面板10之連接區A3為避免與容置空間26產生干涉,因此,觸控面板10之連接區A3與容置空間26分別設置於蓋板14之不同側。由上述可知,由於顯示裝置100包含單片式觸控面板10與顯示面板12,因此顯示裝置100為一具有觸控功能之顯示裝置。 In this embodiment, an adhesive 30 is used to fix the cover 14 and the display panel 12. As shown in FIG. 1, the sealant 30 is disposed between the cover plate 14 and the display substrate 20, and the sealant 30 is located in the peripheral circuit region R2 for fixing the cover plates 14 and 12 to the display panel. The sealant 30 is exemplified by a glass frit adhesive, and the thickness T4 is about 5 to 10 micrometers, but not limited thereto. Furthermore, in the embodiment, the surface of the cover 14 is further defined with a connection area A3, wherein the connection area A3 does not correspond to the display area R1 of the display substrate 20 and the peripheral circuit area R2, so the size of the cover 14 is slightly larger than the display. The size of the substrate 20 is such that when the cover 14 is fixed to the upper side of the display substrate 20, the cover 14 of the area of the connection area A3 protrudes from the display base. Board 20, but not limited to this. Furthermore, a circuit board 16 may be additionally disposed on the cover plate 14, and at least a portion of the circuit board 16 is located in the connection area A3 of the lower surface 14a of the cover plate 14. The circuit board 16 can be coupled to the touch element layer 18 for transmitting touch signals. Therefore, the circuit board 16 can be regarded as a part of the touch panel 10. The connection area A3 of the touch panel 10 is arranged to avoid interference with the accommodating space 26 . Therefore, the connection area A3 and the accommodating space 26 of the touch panel 10 are respectively disposed on different sides of the cover 14 . As can be seen from the above, since the display device 100 includes the monolithic touch panel 10 and the display panel 12, the display device 100 is a display device having a touch function.

本發明第一實施例中容置空間26的製作方式說明如下,例如,可以先在蓋板14表面製作觸控元件層18後,待進行蓋板14的外型磨邊與尺寸定義時一併製作容置空間26。製作方法可分為物理式與化學式的處裡,其中物理式處理可利用一般鑽孔技術(例如視訊孔或感測孔的鑽孔技術),以模具於蓋板14的上表面14a挖出溝槽或凹槽,而化學式處理可以利用網版印刷製程在上表面14a欲蝕刻的位置塗佈蝕刻膏,再對蓋板14進行蝕刻以形成凹槽。化學處理的另一種方式是以保護膜或抗酸膜搭配氫氟酸來定義蝕刻出凹槽。本發明容置空間26的製作方式不以上述為限。 The manufacturing method of the accommodating space 26 in the first embodiment of the present invention is as follows. For example, after the touch element layer 18 is formed on the surface of the cover 14 , the outer edging and size definition of the cover 14 are to be performed together. The accommodating space 26 is made. The manufacturing method can be divided into a physical type and a chemical type, wherein the physical processing can utilize a general drilling technique (for example, a drilling hole of a video hole or a sensing hole) to dig a groove on the upper surface 14a of the cover 14 with a mold. The grooves or grooves, and the chemical treatment can apply an etching paste at a position where the upper surface 14a is to be etched by a screen printing process, and then etch the cover plate 14 to form a groove. Another way of chemical treatment is to define the etched grooves by using a protective film or an acid resistant film with hydrofluoric acid. The manufacturing space of the present invention is not limited to the above.

請參考第3圖與第4圖,在本發明之第二實施例中,顯示裝置102與第一實施例的不同處主要在於容置空間261的設置方式。本實施例之容置空間261仍然為一凹陷結構,但蓋板141表面的容置空間261係為一具有斷差之凹陷,其僅具有一臨近於透光區A1之內側壁261a而不具有如第1、2圖所示之外側壁26c和短側壁26d,然而,容置空間261仍具有頂壁261b,因此,頂壁261b與內側壁261a所圍成之區域即形成容置空間261,且頂壁261b與蓋板141的上表面14a具有高低落差或斷差。容置空間261的設計也可以視為蓋板141的部分薄化設計,其製作方式舉例如以研磨方式薄化蓋板141外側,或以前述實施例中的化學式處理製程來製作,但不以此為限。 Referring to FIG. 3 and FIG. 4, in the second embodiment of the present invention, the difference between the display device 102 and the first embodiment is mainly in the manner in which the accommodation space 261 is disposed. The accommodating space 261 of the embodiment is still a recessed structure, but the accommodating space 261 on the surface of the cover 141 is a recess having a gap, and has only one inner side wall 261a adjacent to the transparent area A1 without The outer side wall 26c and the short side wall 26d are shown in the first and second figures. However, the accommodating space 261 still has the top wall 261b. Therefore, the area enclosed by the top wall 261b and the inner side wall 261a forms the accommodating space 261. And the top wall 261b has a height difference or a gap with the upper surface 14a of the cover plate 141. The design of the accommodating space 261 can also be regarded as a partial thinning design of the cover plate 141, which is made by, for example, thinning the outer side of the cover plate 141 by grinding, or by the chemical treatment process in the foregoing embodiment, but not by This is limited.

請參考第5圖與第6圖,本發明第三實施例之顯示裝置104與第二實施例的主要不同處在於蓋板142之容置空間262係為一缺口,其具有內 側壁262a,且蓋板142於缺口型容置空間262之兩側分別形成有二短側壁262d,但不具有如第1圖所示之頂壁26b與外側壁26c,其中短側壁26d係分別與內側壁262a相接,亦即容置空間262係由內側壁262a和二個短側壁262d所圍成的空間所構成。因此,第5圖剖面圖所示之容置空間262僅看到內側壁262a。本實施例顯示裝置104在應用於電子產品時,可選擇性地另包括一外蓋32設置於容置空間262的外側,其具有類似頂壁與外側壁之功能,設於容置空間262外圍並覆蓋電路控制元件28,可以進一步提供電路控制元件28保護之功能。請參考第7圖,舉例而言,當顯示裝置104應用在如智慧型手機或平板電腦之電子產品200中時,外蓋32可以為電子產品200原先即具有之孔洞蓋板,例如耳音孔,但不以此為限。需注意的是,外蓋32的尺寸與大小可依電子產品之外形考量而具有不同設計。此外,第7圖中亦以虛線區域表示裝飾層202可以設置在顯示裝置104的表面。 Referring to FIG. 5 and FIG. 6 , the main difference between the display device 104 and the second embodiment of the third embodiment of the present invention is that the accommodating space 262 of the cover 142 is a notch having an inner portion. The side wall 262a and the cover plate 142 are respectively formed with two short side walls 262d on both sides of the notch-type accommodating space 262, but do not have the top wall 26b and the outer side wall 26c as shown in Fig. 1, wherein the short side walls 26d are respectively The inner side walls 262a are in contact with each other, that is, the accommodating space 262 is constituted by a space surrounded by the inner side wall 262a and the two short side walls 262d. Therefore, the accommodating space 262 shown in the cross-sectional view of Fig. 5 only sees the inner side wall 262a. When the display device 104 is applied to an electronic product, the display device 104 can be further disposed on the outer side of the accommodating space 262, and has a function similar to the top wall and the outer side wall, and is disposed on the periphery of the accommodating space 262. Covering the circuit control component 28, the functionality of the circuit control component 28 can be further provided. Please refer to FIG. 7. For example, when the display device 104 is applied to an electronic product 200 such as a smart phone or a tablet, the cover 32 may be a hole cover originally provided by the electronic product 200, such as an ear sound hole. , but not limited to this. It should be noted that the size and size of the outer cover 32 may have different designs depending on the shape of the electronic product. In addition, the decorative layer 202 may be disposed on the surface of the display device 104 as indicated by a broken line in FIG.

容置空間262的製作方式舉例包括機械式處理與非接觸式處理。機械式處理可先以刀輪在蓋板142表面劃線產生大約為蓋板142厚度之10至20%的裂縫深度,再利用機械應力將玻璃扳裂,最候再以磨邊方式將表面磨平。非接觸式處理舉例為先在切割道的起始與結尾處形成裂痕,再利用瞬間熱漲冷縮所造成的應力作用來使蓋板142沿著切割路徑裂開,其優點為只需一次切割而不須磨邊製程。然而,容置空間262的製作方式並不以上述為限。 Examples of the manner in which the accommodating space 262 is fabricated include mechanical processing and non-contact processing. The mechanical treatment can firstly scribe the surface of the cover plate 142 with a cutter wheel to produce a crack depth of about 10 to 20% of the thickness of the cover plate 142, and then use mechanical stress to crack the glass, and then grind the surface by grinding. level. The non-contact treatment is exemplified by forming a crack at the beginning and the end of the scribe line, and then using the stress caused by the instantaneous heat expansion and contraction to crack the cover plate 142 along the cutting path, which has the advantage of only one cutting. No need to grind the process. However, the manner in which the accommodation space 262 is made is not limited to the above.

請參考第8圖與第9圖,本發明第四實施例之顯示裝置106與前述實施例的不同處在於蓋板143之容置空間263僅具有內側壁263a而不具有其他側壁與頂壁,亦即,蓋板143於對應電路控制元件28之區域係被完全移除而形成容置空間263,因此,就顯示裝置106之外觀來看,容置空間263處形成一凹陷結構。再者,類似於第三實施例,本實施例之顯示裝置106可另外包括外蓋32對應於電路控制元件28,以與內側壁263a相接而構成容置空間263,也可以說外蓋32是設置於容置空間263的外側。容置空間263可配合蓋板143的尺寸定義與磨邊製程一同製作,也可參考前述實施例的其他 製作方式,且並不以上述為限。 Referring to FIG. 8 and FIG. 9, the display device 106 of the fourth embodiment of the present invention is different from the foregoing embodiment in that the accommodating space 263 of the cover 143 has only the inner side wall 263a and no other side walls and the top wall. That is, the cover plate 143 is completely removed from the area corresponding to the circuit control element 28 to form the accommodating space 263. Therefore, in terms of the appearance of the display device 106, a recessed structure is formed at the accommodating space 263. Moreover, similarly to the third embodiment, the display device 106 of the present embodiment may further include an outer cover 32 corresponding to the circuit control element 28 to be in contact with the inner side wall 263a to form the accommodating space 263. It is disposed outside the accommodating space 263. The accommodating space 263 can be combined with the edging process in accordance with the size definition of the cover 143, and can also refer to other The method of production is not limited to the above.

請參考第10圖與第11圖,本發明第五實施例之顯示裝置108與第一實施例的不同處在於蓋板144的容置空間26係為一孔洞,其貫穿蓋板144的上表面14a與外表面14b,所以容置空間26不具有頂壁,但仍具有內側壁26a與外側壁26c。此外,在蓋板144表面可另設置其他元件來覆蓋或遮蔽電路控制元件28。 Referring to FIG. 10 and FIG. 11 , the display device 108 of the fifth embodiment of the present invention is different from the first embodiment in that the accommodating space 26 of the cover 144 is a hole that penetrates the upper surface of the cover 144 . 14a and the outer surface 14b, so the accommodating space 26 does not have a top wall, but still has an inner side wall 26a and an outer side wall 26c. In addition, other components may be provided on the surface of the cover 144 to cover or shield the circuit control component 28.

此外,本發明上述所有實施例中的蓋板側邊與蓋板面對到容置空間的表面(例如26a、261a、262a、263a等內側壁)可以是經過化學或物理強化的一強化表面,例如強化表面是被氫氟酸(HF)蝕刻過的一蝕刻表面,此方式可以去除表面的微小裂痕(crack)或是減少微小裂痕的數量或深度以增進表面強度。另外,蓋板側邊與蓋板面對容置空間的表面也可以採用塗佈膠層並固化的方式,使之成為一具有塗膠固化層的表面,此膠層可以提供緩衝功能並增進表面強度。 In addition, the surface of the cover plate and the cover plate facing the accommodating space (for example, the inner side walls of 26a, 261a, 262a, 263a, etc.) in all the above embodiments of the present invention may be a chemically or physically strengthened surface. For example, the reinforced surface is an etched surface etched by hydrofluoric acid (HF) in such a way as to remove small cracks in the surface or to reduce the number or depth of microcracks to enhance surface strength. In addition, the surface of the cover side and the cover plate facing the accommodating space may also be coated and cured to make it a surface having a glued cured layer, which can provide a cushioning function and enhance the surface. strength.

由上述可知,由於本發明係在蓋板對應於電路控制元件之區域設置容置空間,因此,即使電路控制元件之厚度大於顯示元件層、保護層及觸控元件層的總厚度或是封膠的厚度,其頂部也可容置於容置空間中,使蓋板與顯示面板可以更緊密且順利地結合,以降低顯示裝置的整體厚度,不需變更電路控制元件的設置位置。此外,本發明中容置空間的製作方式非常簡便,甚至可以與蓋板的尺寸定義與磨邊等製程一同合併製作,不需耗費額外的製程成本。 It can be seen from the above that since the present invention provides an accommodating space in a region corresponding to the circuit control component of the cover plate, even if the thickness of the circuit control component is greater than the total thickness of the display component layer, the protective layer and the touch component layer, or the sealing material The thickness of the top can also be accommodated in the accommodating space, so that the cover plate and the display panel can be combined more closely and smoothly, so as to reduce the overall thickness of the display device without changing the position of the circuit control component. In addition, the accommodating space in the present invention is very simple to manufacture, and can even be combined with the size definition of the cover plate and the edging process, and does not require additional process cost.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10‧‧‧觸控面板 10‧‧‧Touch panel

12‧‧‧顯示面板 12‧‧‧ display panel

14‧‧‧蓋板 14‧‧‧ Cover

14a‧‧‧上表面 14a‧‧‧Upper surface

14b‧‧‧外表面 14b‧‧‧ outer surface

16‧‧‧電路板 16‧‧‧ boards

18‧‧‧觸控元件層 18‧‧‧Touch element layer

20‧‧‧顯示基板 20‧‧‧ display substrate

20a‧‧‧上表面 20a‧‧‧ upper surface

22‧‧‧顯示元件層 22‧‧‧Display component layer

24‧‧‧保護層 24‧‧‧Protective layer

26‧‧‧容置空間 26‧‧‧ accommodating space

26a‧‧‧內側壁 26a‧‧‧ inner side wall

26b‧‧‧頂壁 26b‧‧‧ top wall

26c‧‧‧外側壁 26c‧‧‧Outer side wall

28‧‧‧電路控制元件 28‧‧‧Circuit control components

28a‧‧‧頂面 28a‧‧‧ top surface

30‧‧‧封膠 30‧‧‧Packing

100‧‧‧顯示裝置 100‧‧‧ display device

A1‧‧‧透光區 A1‧‧‧Light transmission area

A2‧‧‧周邊區 A2‧‧‧ surrounding area

A3‧‧‧連接區 A3‧‧‧Connected area

R1‧‧‧顯示區 R1‧‧‧ display area

R2‧‧‧周邊電路區 R2‧‧‧ peripheral circuit area

T1、T2、T3、T4‧‧‧厚度 T1, T2, T3, T4‧‧‧ thickness

Claims (17)

一種顯示裝置,包括:一顯示面板,其包括:一顯示基板,其具有一顯示區與一周邊電路區,該周邊電路區位於該顯示區之至少一側;一顯示元件層,設於該顯示基板之上表面上並位於該顯示區;以及一電路控制元件,設於該顯示基板之上表面上並位於該周邊電路區;以及一蓋板,設於該顯示面板朝該電路控制元件之一側,該蓋板表面定義有一透光區與一周邊區,其中該透光區與該周邊區分別對應於該顯示基板之該顯示區與該周邊電路區,且該蓋板具有一容置空間設於該周邊區,該容置空間對應於該電路控制元件且係用來容置至少一部分之該電路控制元件。 A display device comprising: a display panel comprising: a display substrate having a display area and a peripheral circuit area, the peripheral circuit area being located on at least one side of the display area; a display element layer disposed on the display a display surface on the upper surface of the substrate; and a circuit control component disposed on the upper surface of the display substrate and located in the peripheral circuit region; and a cover plate disposed on the display panel toward the control element of the circuit a surface of the cover plate defines a light-transmissive area and a peripheral area, wherein the light-transmissive area and the peripheral area respectively correspond to the display area of the display substrate and the peripheral circuit area, and the cover has an accommodation space In the peripheral region, the accommodating space corresponds to the circuit control component and is used to accommodate at least a portion of the circuit control component. 如請求項1所述之顯示裝置,其中該電路控制元件之厚度大於該顯示元件層之厚度。 The display device of claim 1, wherein the thickness of the circuit control element is greater than the thickness of the display element layer. 如請求項1或2所述之顯示裝置,其中該電路控制元件之頂部位於該容置空間中,且該頂部之頂面係高於該蓋板之上表面。 The display device of claim 1 or 2, wherein a top of the circuit control element is located in the accommodating space, and a top surface of the top portion is higher than an upper surface of the cover plate. 如請求項1所述之顯示裝置,其另包括一觸控元件層設於該蓋板之上表面,且該蓋板與該觸控元件層係構成一單片式觸控面板。 The display device of claim 1, further comprising a touch component layer disposed on the upper surface of the cover, and the cover and the touch component layer form a single-chip touch panel. 如請求項4所述之顯示裝置,其另包括一封膠,設於該蓋板與該顯示基板之間,且該封膠位於該周邊電路區,用來固接該蓋板與該顯示面板,且該電路控制元件之厚度大於該封膠之厚度。 The display device of claim 4, further comprising a glue disposed between the cover plate and the display substrate, wherein the sealant is located in the peripheral circuit area for fixing the cover plate and the display panel And the thickness of the circuit control component is greater than the thickness of the sealant. 如請求項4所述之顯示裝置,其中該蓋板之該容置空間係為一凹槽,該凹槽係由該蓋板之上表面向該蓋板之外表面內凹。 The display device of claim 4, wherein the receiving space of the cover is a recess, the recess being recessed from the upper surface of the cover toward the outer surface of the cover. 如請求項4所述之顯示裝置,其中該蓋板之該容置空間係為一缺口,該蓋板於該缺口之兩側分別形成有一側壁。 The display device of claim 4, wherein the receiving space of the cover is a notch, and the cover is respectively formed with a side wall on both sides of the notch. 如請求項7所述之顯示裝置,其另包括一外蓋,設置於該蓋板之該容置空間之外側,並且該外蓋與該蓋板之一側壁形成該容置空間。 The display device of claim 7, further comprising an outer cover disposed on an outer side of the accommodating space of the cover, and the outer cover and the one side wall of the cover form the accommodating space. 如請求項4所述之顯示裝置,其中該蓋板之該容置空間係為一孔洞。 The display device of claim 4, wherein the receiving space of the cover is a hole. 如請求項4所述之顯示裝置,其中該蓋板表面另定義有一連接區,該連接區不對應於該顯示基板之該顯示區與該周邊電路區,且該顯示裝置另包括一電路板,至少設置於該蓋板之該連接區內。 The display device of claim 4, wherein the cover surface further defines a connection area, the connection area does not correspond to the display area of the display substrate and the peripheral circuit area, and the display device further comprises a circuit board. It is disposed at least in the connection area of the cover. 如請求項10所述之顯示裝置,其中該觸控面板之該連接區與該容置空間分別設置於該蓋板之不同側。 The display device of claim 10, wherein the connection area of the touch panel and the accommodating space are respectively disposed on different sides of the cover. 如請求項1或4所述之顯示裝置,其中該顯示元件層係為一有機發光顯示層。 The display device of claim 1 or 4, wherein the display element layer is an organic light emitting display layer. 如請求項1或4所述之顯示裝置,其中該電路控制元件係為一積體電路晶片。 The display device of claim 1 or 4, wherein the circuit control element is an integrated circuit chip. 如請求項1或4所述之顯示裝置,其中該容置空間係為該蓋板上的一凹陷結構,該凹陷結構具有一頂壁,且該頂壁與該蓋板之上表面具有一高低落差。 The display device of claim 1 or 4, wherein the accommodating space is a recessed structure on the cover plate, the recessed structure has a top wall, and the top wall has a height above the upper surface of the cover plate Drop. 如請求項1所述之顯示裝置,其中該顯示面板另包括一保護層,設於該顯示元件層與蓋板之間。 The display device of claim 1, wherein the display panel further comprises a protective layer disposed between the display element layer and the cover. 如請求項1所述之顯示裝置,其中該蓋板面對該容置空間的表面是一強化表面。 The display device of claim 1, wherein the surface of the cover plate facing the accommodating space is a reinforced surface. 如請求項16所述之顯示裝置,其中該強化表面是被蝕刻過的一蝕刻表面或是一具有塗膠固化層的表面。 The display device of claim 16, wherein the reinforcing surface is an etched etched surface or a surface having a cured layer.
TW103100704A 2014-01-08 2014-01-08 Display device TW201527112A (en)

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