CN205752187U - A kind of optical sensor package structure - Google Patents
A kind of optical sensor package structure Download PDFInfo
- Publication number
- CN205752187U CN205752187U CN201620450180.8U CN201620450180U CN205752187U CN 205752187 U CN205752187 U CN 205752187U CN 201620450180 U CN201620450180 U CN 201620450180U CN 205752187 U CN205752187 U CN 205752187U
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- China
- Prior art keywords
- light
- optical sensor
- passing board
- lobe
- sensor chip
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Light Receiving Elements (AREA)
Abstract
This utility model relates to a kind of optical sensor package structure, and including the lobe between light-passing board, optical sensor chip, described lobe is around the optical region of described optical sensor chip；Described light-passing board is bonded on optical sensor chip by lobe；Also include that described optical sensor chip is encapsulated on substrate by the light tight plastic-sealed body of injection mo(u)lding, described light tight plastic-sealed body, light-passing board.Encapsulating structure of the present utility model, light-passing board is bonded on optical sensor chip by this lobe, reduce the area of bonding, allow to uniformly coat glue in lobe, realize the excellent sealing between light-passing board and optical sensor chip, solving when being molded light tight plastic-sealed body, light-proof material can pierce the problem between light-passing board and optical region, it is ensured that the optical property of optical sensor chip.
Description
Technical field
This utility model relates to the encapsulating structure of a kind of chip, more specifically, this utility model relates to one
Plant the encapsulating structure of optical pickocff.
Background technology
At present, optical pickocff is more and more extensive in the application of consumer electronics, such as mobile phone, intelligence hands
Table, Intelligent bracelet etc..Utilize optical pickocff, it is possible to achieve close to light detection, ambient light detection,
Heart rate detection, the detection of blood oxygen, gesture identification etc..Its ultimate principle is that LED chip sends specific wavelength
Light, this light arrives after object under test, can return a branch of light relevant to object under test, arrive
Reach optics and receive the optics reception area of chip, be called for short PD.
Wherein, the light for preventing LED chip from sending directly arrives optics and receives the optics reception of chip
Region, in encapsulation process, needs encapsulating structure is carried out particular design, to reach optics reception core
Optoisolated purpose between sheet and LED chip.But this structure is in encapsulation process, the glue under glass
The water capacity is easily generated hole, in the injection moulding process carrying out light-proof material, has some lighttight materials
Material pierces between clear glass and optical region, thus causes the poor optical properties of optical pickocff, light
Learn sensitivity decrease.
Utility model content
A purpose of the present utility model there is provided a kind of optical sensor package structure.
According to an aspect of the present utility model, it is provided that a kind of optical sensor package structure, including base
Plate and the optical sensor chip being arranged on substrate, also include covering described optical sensor chip
The light-passing board of middle optical region, and the lobe between light-passing board, optical sensor chip,
Described lobe is around the optical region of described optical sensor chip；Described light-passing board passes through lobe
It is bonded on optical sensor chip；Also include the light tight plastic-sealed body of injection mo(u)lding, described light tight
Described optical sensor chip is encapsulated on substrate by plastic-sealed body, light-passing board.
Optionally, described lobe and light-passing board are one, and described lobe is by etching printing opacity
Plate obtains.
Optionally, described light-passing board is glass plate.
Optionally, described lobe is made up of the transmitting organic material arranged on a glass.
Optionally, described lobe by coating transmitting organic material on a glass and etches printing opacity
Organic material obtains.
Optionally, it is additionally provided with the most packaged LED chip on the substrate, described impermeable
Described LED chip is wrapped up by light plastic-sealed body.
Optionally, the pin of described LED chip is connected directly between in the respective pad on substrate, institute
The pin stating optical sensor chip is connected with the respective pad on substrate by lead-in wire.
Encapsulating structure of the present utility model, is provided with between described optical sensor chip and light-passing board
Around the lobe of described optical region, light-passing board is bonded in optical sensor chip by this lobe
On, reduce the area of bonding so that can uniformly coat glue in lobe, it is achieved light-passing board
And the excellent sealing between optical sensor chip, solves when being molded light tight plastic-sealed body, impermeable
Luminescent material can pierce the problem between light-passing board and optical region, it is ensured that the light of optical sensor chip
Learn performance.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
The accompanying drawing of the part constituting description describes embodiment of the present utility model, and together with saying
Bright book is used for explaining principle of the present utility model together.
Fig. 1 is the schematic diagram of this utility model encapsulating structure.
Fig. 2 is the structural representation of this utility model transmittance section.
Fig. 3 is the schematic diagram of another embodiment of this utility model transmittance section.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but
In the appropriate case, described technology and equipment should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1, this utility model provides a kind of optical sensor package structure, and it includes substrate
1 and optical sensor chip 3 on substrate 1 is set；Substrate 1 can use circuit board, in institute
State and on substrate 1, be provided with the pad 5 corresponding with optical sensor chip 3, optical sensor chip 3
Pin can be connected with the pad 5 on substrate 1 by the way of lead-in wire, thus by optical pickocff core
The signal of sheet 3 introduces in substrate 1.Optical sensor chip 3 of the present utility model has optical region
6, received the optical signal in the external world by this optical region 6 so that optical sensor chip 3 can root
The unlike signal received according to the external world sends corresponding control signal.Optical pickocff of the present utility model
Chip 3 can be fixing on substrate 1 by mounting method well-known to those skilled in the art, at this not
Illustrate again.
Encapsulating structure of the present utility model, also includes covering light school district in described optical sensor chip 3
The light-passing board 7 in territory 6, described light-passing board 7 covers on the optical region 6 of optical sensor chip 3
Side, such that it is able to the optical region 6 of protection optical sensor chip 3 is without damage, the most not shadow
Ring this optical region 6 and receive the optical signal in the external world.At described light-passing board 7, optical sensor chip 3
Between be provided with lobe 8 so that this light-passing board 7 can be bonded in optical sensing by this lobe 8
The top of device chip 3.Described lobe 8 is around the optical region 6 of described optical sensor chip 3
Distribution.
In one specific embodiment of this utility model, described lobe 8 is permissible with light-passing board 7
It is one, such as, the lower end of light-passing board 7 can be performed etching thus obtain described lobe 8,
With reference to Fig. 2.Light-passing board 7 can use light transmissive material well-known to those skilled in the art, such as may be used
To use glass plate etc..Directly the lower end of glass plate can be performed etching, thus obtain middle part for groove,
Edge is the structure of lobe 8.In another specific embodiment of this utility model, described projection
Portion 8 is made up of the transmitting organic material arranged on a glass, with reference to Fig. 3.Such as can be at glass plate
One layer of transmitting organic material of upper coating, then performs etching this transmitting organic material, thus obtains institute
Stating lobe 8, the mode this be coated, etched belongs to the common knowledge of those skilled in the art,
No longer illustrate at this.
Encapsulating structure of the present utility model, also includes the light tight plastic-sealed body 2 of injection mo(u)lding, described not
Printing opacity plastic-sealed body 2 can use light-proof material well-known to those skilled in the art, and it is moulded in base
After on plate 1, together with light-passing board 7, described optical sensor chip 3 is encapsulated on substrate 1.
Encapsulating structure of the present utility model, is provided with between described optical sensor chip and light-passing board
Around the lobe of described optical region, light-passing board is bonded in optical sensor chip by this lobe
On, reduce the area of bonding so that can uniformly coat glue in lobe, it is achieved light-passing board
And the excellent sealing between optical sensor chip, solves when being molded light tight plastic-sealed body, impermeable
Luminescent material can pierce the problem between light-passing board and optical region, it is ensured that the light of optical sensor chip
Learn performance.
This utility model one preferred embodiment in, described substrate 1 is additionally provided with in advance
Packaged LED chip 4, described LED chip 4 is wrapped up by described light tight plastic-sealed body 2.
LED chip 4 is through encapsulation in advance, then mounts on substrate 1, and the pin of LED chip 4 can be direct
Connect in respective pad 5 on substrate 1, be molded light-proof material the most again so that molding is not
LED chip 4 is wrapped up by printing opacity plastic-sealed body 2.Light tight plastic-sealed body is it should be noted that at this
2 need the optical window by LED chip 4 to expose, in order to the optical signal that LED chip 4 sends is permissible
Spread out of through this optical window.LED chip 4 uses the structure encapsulated in advance so that need not LED
The optical region of chip 4 is separately provided light-passing board and protects.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, above example is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (7)
1. an optical sensor package structure, it is characterised in that: include substrate (1) and arrange
Optical sensor chip (3) on substrate (1), also includes covering described optical sensor chip
(3) light-passing board (7) of optical region (6) in, and it is positioned at light-passing board (7), optical sensing
Lobe (8) between device chip (3), described lobe (8) is around described optical pickocff core
The optical region (6) of sheet (3)；Described light-passing board (7) is bonded in optics by lobe (8)
On sensor chip (3)；Also include the light tight plastic-sealed body (2) of injection mo(u)lding, described light tight
Described optical sensor chip (3) is encapsulated in substrate (1) by plastic-sealed body (2), light-passing board (7)
On.
Encapsulating structure the most according to claim 1, it is characterised in that: described lobe (8)
Being one with light-passing board (7), described lobe (8) is obtained by etching light-passing board (7).
Encapsulating structure the most according to claim 1, it is characterised in that: described light-passing board (7)
For glass plate.
Encapsulating structure the most according to claim 3, it is characterised in that: described lobe (8)
It is made up of the transmitting organic material arranged on a glass.
Encapsulating structure the most according to claim 4, it is characterised in that: described lobe (8)
By coating transmitting organic material on a glass and etching transmitting organic material and obtain.
Encapsulating structure the most according to claim 1, it is characterised in that: in described substrate (1)
On be additionally provided with the most packaged LED chip (4), described light tight plastic-sealed body (2) is by described
LED chip (4) wraps up.
Encapsulating structure the most according to claim 6, it is characterised in that: described LED chip (4)
Pin be connected directly between in the respective pad (5) on substrate (1), described optical sensor chip
(3) pin is connected with the respective pad (5) on substrate (1) by lead-in wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620450180.8U CN205752187U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620450180.8U CN205752187U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752187U true CN205752187U (en) | 2016-11-30 |
Family
ID=57364728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620450180.8U Active CN205752187U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752187U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009475A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
-
2016
- 2016-05-17 CN CN201620450180.8U patent/CN205752187U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009475A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
| CN111009475B (en) * | 2019-11-22 | 2021-08-27 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |