CN205752172U - A kind of optical sensor package structure - Google Patents
A kind of optical sensor package structure Download PDFInfo
- Publication number
- CN205752172U CN205752172U CN201620455469.9U CN201620455469U CN205752172U CN 205752172 U CN205752172 U CN 205752172U CN 201620455469 U CN201620455469 U CN 201620455469U CN 205752172 U CN205752172 U CN 205752172U
- Authority
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- China
- Prior art keywords
- optical sensor
- light
- sensor chip
- passing board
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000002347 injection Methods 0.000 claims abstract description 3
- 239000007924 injection Substances 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 17
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000007639 printing Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73227—Wire and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
Landscapes
- Light Receiving Elements (AREA)
Abstract
This utility model relates to a kind of optical sensor package structure, is provided with the groove around described optical region between optical sensor chip and the adhesive surface of light-passing board；Also include that described optical sensor chip is encapsulated on substrate by the light tight plastic-sealed body of injection mo(u)lding, described light tight plastic-sealed body, light-passing board.Encapsulating structure of the present utility model, when carrying out the bonding of optical sensor chip and light-passing board, this groove constitutes the structure of similar " moat ", such that it is able to prevent glue material from overflowing into the optical region of optical sensor chip, this allows for increasing glue-spread, such that it is able to the excellent sealing realized between optical sensor chip and light-passing board, solve when being molded light tight plastic-sealed body, light-proof material can pierce the problem between light-passing board and optical region, it is ensured that the optical property of optical sensor chip.
Description
Technical field
This utility model relates to the encapsulating structure of a kind of chip, more specifically, this utility model relates to one
Plant the encapsulating structure of optical pickocff.
Background technology
At present, optical pickocff is more and more extensive in the application of consumer electronics, such as mobile phone, intelligence hands
Table, Intelligent bracelet etc..Utilize optical pickocff, it is possible to achieve close to light detection, ambient light detection,
Heart rate detection, the detection of blood oxygen, gesture identification etc..Its ultimate principle is that LED chip sends specific wavelength
Light, this light arrives after object under test, can return a branch of light relevant to object under test, arrive
Reach optics and receive the optics reception area of chip, be called for short PD.
Wherein, the light for preventing LED chip from sending directly arrives optics and receives the optics reception of chip
Region, in encapsulation process, needs encapsulating structure is carried out particular design, to reach optics reception core
Optoisolated purpose between sheet and LED chip.But this structure is in encapsulation process, the glue under glass
The water capacity is easily generated hole, in the injection moulding process carrying out light-proof material, has some lighttight materials
Material pierces between clear glass and optical region, thus causes the poor optical properties of optical pickocff, light
Learn sensitivity decrease.
Utility model content
A purpose of the present utility model there is provided a kind of optical sensor package structure.
According to an aspect of the present utility model, it is provided that a kind of optical sensor package structure, including base
Plate and the optical sensor chip being arranged on substrate, also include by glue bond at optical pickocff
On chip and cover the light-passing board of optical region in described optical sensor chip, at described optical sensing
The groove around described optical region it is provided with between device chip and the adhesive surface of light-passing board；Also include note
Molded light tight plastic-sealed body, described light tight plastic-sealed body, light-passing board are by described optical pickocff core
Sheet is encapsulated on substrate.
Optionally, described groove is arranged on light-passing board.
Optionally, described groove is obtained by etching light-passing board.
Optionally, described light-passing board is glass plate.
Optionally, described groove by coating transmitting organic material on a glass and etches printing opacity and has
Machine material obtains.
Optionally, described groove is arranged on optical sensor chip.
Optionally, described groove is obtained by etching optical sensor chip.
Optionally, the termination of described recess sidewall is provided with the chamfering of circular arc.
Optionally, it is additionally provided with the most packaged LED chip on the substrate, described impermeable
Described LED chip is wrapped up by light plastic-sealed body.
Optionally, the pin of described LED chip is connected directly between in the respective pad on substrate, institute
The pin stating optical sensor chip is connected with the respective pad on substrate by lead-in wire.
Encapsulating structure of the present utility model, described optical sensor chip and light-passing board adhesive surface it
Between be provided with the groove around described optical region, carrying out the viscous of optical sensor chip and light-passing board
During knot, this groove constitutes the structure of similar " moat ", such that it is able to prevent glue material from overflowing into light
Learning on the optical region of sensor chip, this allows for increasing glue-spread, such that it is able to realize light
Learn the excellent sealing between sensor chip and light-passing board, solve when being molded light tight plastic-sealed body,
Light-proof material can pierce the problem between light-passing board and optical region, it is ensured that optical sensor chip
Optical property.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
The accompanying drawing of the part constituting description describes embodiment of the present utility model, and together with saying
Bright book is used for explaining principle of the present utility model together.
Fig. 1 is the schematic diagram of this utility model encapsulating structure.
Fig. 2 is the structural representation of light-passing board in Fig. 1.
Fig. 3 is the schematic diagram of this utility model another embodiment of encapsulating structure.
Fig. 4 is the structural representation of optical sensor chip in Fig. 3.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but
In the appropriate case, described technology and equipment should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1, this utility model provides a kind of optical sensor package structure, and it includes substrate
1 and optical sensor chip 3 on substrate 1 is set；Substrate 1 can use circuit board, in institute
State and on substrate 1, be provided with the pad 5 corresponding with optical sensor chip 3, optical sensor chip 3
Pin can be connected with the pad 5 on substrate 1 by the way of lead-in wire, thus by optical pickocff core
The signal of sheet 3 introduces in substrate 1.Optical sensor chip 3 of the present utility model has optical region
6, received the optical signal in the external world by this optical region 6 so that optical sensor chip 3 can root
The unlike signal received according to the external world sends corresponding control signal.Optical pickocff of the present utility model
Chip 3 can be fixing on substrate 1 by mounting method well-known to those skilled in the art, at this not
Illustrate again.
Encapsulating structure of the present utility model, also includes being bonded in the printing opacity above optical sensor chip 3
Plate 7, this light-passing board 7 such as can be bonded in optics by the glue material that those skilled in the art are known well and pass
On sensor chip 3, and the optical region 6 of described optical sensor chip 3 is covered.Described
Tabula rasa 7 covers above the optical region 6 of optical sensor chip 3, such that it is able to protection optics passes
The optical region 6 of sensor chip 3 is without damage, and the most not affecting this optical region 6 receives the external world simultaneously
Optical signal.Wherein, arrange between described optical sensor chip 3 and the adhesive surface of light-passing board 7
There is the groove 8 around described optical region 6.The shape phase of the shape of this groove 8 and optical region 6
Coupling, such as when optical region 6 is circular configuration, then this groove 8 entirety is matched circle
Shape；When optical region 6 is rectangular configuration, then this groove 8 entirety is matched rectangle.
In one specific embodiment of this utility model, described groove 8 may be provided at light-passing board 7
On, such as the lower end of light-passing board 7 can be performed etching thus obtain described groove 8, with reference to Fig. 2.
Light-passing board 7 can use light transmissive material well-known to those skilled in the art, such as, can use glass
Plates etc., perform etching the lower end of glass plate, thus obtain the groove 8 around described optical region 6.
This utility model preferred embodiment in, described groove 8 is had by the printing opacity arranged on a glass
Machine material is constituted.Such as can coat one layer of transmitting organic material on a glass, then this printing opacity be had
Machine material performs etching, thus obtains described groove 8.The mode this be coated, etched belongs to
The common knowledge of those skilled in the art, no longer illustrates at this.
In another specific embodiment of this utility model, described groove 8 is arranged on optical pickocff
On chip 3, such as, the upper end of optical sensor chip 3 can be performed etching thus obtain around institute
State the groove 8 of optical region 6 distribution, with reference to Fig. 3, Fig. 4.
Encapsulating structure of the present utility model, also includes the light tight plastic-sealed body 2 of injection mo(u)lding, described not
Printing opacity plastic-sealed body 2 can use light-proof material well-known to those skilled in the art, and it is moulded in base
After on plate 1, together with light-passing board 7, described optical sensor chip 3 is encapsulated on substrate 1.
Encapsulating structure of the present utility model, the adhesive surface at described optical sensor chip with light-passing board sets
It is equipped with the groove around described optical region, when carrying out the bonding of optical sensor chip and light-passing board,
This groove constitutes the structure of similar " moat ", such that it is able to prevent glue material from overflowing into optical sensing
On the optical region of device chip, this allows for increasing glue-spread, such that it is able to realize optical sensing
Excellent sealing between device chip and light-passing board, solves when being molded light tight plastic-sealed body, light tight
Material can be drilled into the problem between light-passing board and optical region, it is ensured that the light of optical sensor chip
Learn performance.
This utility model one preferred embodiment in, the termination of this groove 8 sidewall is provided with circle
The chamfering of arc, the chamfering of this circular arc can play good drainage, makes liquid glue material permissible
More successfully flow in groove 8, thus prevent it from overflowing into the light school district to optical sensor chip 3
On territory 6.
This utility model one preferred embodiment in, described substrate 1 is additionally provided with in advance
Packaged LED chip 4, described LED chip 4 is wrapped up by described light tight plastic-sealed body 2.
LED chip 4 is through encapsulation in advance, then mounts on substrate 1, and the pin of LED chip 4 can be direct
Connect in respective pad 5 on substrate 1, be molded light-proof material the most again so that molding is not
LED chip 4 is wrapped up by printing opacity plastic-sealed body 2.Light tight plastic-sealed body is it should be noted that at this
2 need the optical window by LED chip 4 to expose, in order to the optical signal that LED chip 4 sends is permissible
Spread out of through this optical window.LED chip 4 uses the structure encapsulated in advance so that need not LED
The optical region of chip 4 is separately provided light-passing board and protects.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, above example is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (10)
1. an optical sensor package structure, it is characterised in that: include substrate (1) and arrange
Optical sensor chip (3) on substrate (1), also includes by glue bond at optical pickocff
Chip (3) is gone up and covers the light-passing board (7) of optical region (6) in described optical sensor chip (3),
It is provided with around described between the adhesive surface of described optical sensor chip (3) and light-passing board (7)
The groove (8) of optical region (6)；Also include the light tight plastic-sealed body (2) of injection mo(u)lding, described
Described optical sensor chip (3) is encapsulated in substrate by light tight plastic-sealed body (2), light-passing board (7)
(1) on.
Optical sensor package structure the most according to claim 1, it is characterised in that: described
Groove (8) is arranged on light-passing board (7).
Optical sensor package structure the most according to claim 2, it is characterised in that: described
Groove (8) is obtained by etching light-passing board (7).
Optical sensor package structure the most according to claim 2, it is characterised in that: described
Light-passing board (7) is glass plate.
Optical sensor package structure the most according to claim 4, it is characterised in that: described
Groove (8) passes through to coat transmitting organic material on a glass and etch transmitting organic material to obtain.
Optical sensor package structure the most according to claim 1, it is characterised in that: described
Groove (8) is arranged on optical sensor chip (3).
Optical sensor package structure the most according to claim 6, it is characterised in that: described
Groove (8) is obtained by etching optical sensor chip (3).
Optical sensor package structure the most according to claim 1, it is characterised in that: described
The termination of groove (8) sidewall is provided with the chamfering of circular arc.
Encapsulating structure the most according to claim 1, it is characterised in that: in described substrate (1)
On be additionally provided with the most packaged LED chip (4), described light tight plastic-sealed body (2) is by described
LED chip (4) wraps up.
Encapsulating structure the most according to claim 9, it is characterised in that: described LED chip (4)
Pin be connected directly between in the respective pad (5) on substrate (1), described optical sensor chip
(3) pin is connected with the respective pad (5) on substrate (1) by lead-in wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620455469.9U CN205752172U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620455469.9U CN205752172U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752172U true CN205752172U (en) | 2016-11-30 |
Family
ID=57365051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620455469.9U Active CN205752172U (en) | 2016-05-17 | 2016-05-17 | A kind of optical sensor package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752172U (en) |
-
2016
- 2016-05-17 CN CN201620455469.9U patent/CN205752172U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |