CN108933883A - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN108933883A CN108933883A CN201710381172.1A CN201710381172A CN108933883A CN 108933883 A CN108933883 A CN 108933883A CN 201710381172 A CN201710381172 A CN 201710381172A CN 108933883 A CN108933883 A CN 108933883A
- Authority
- CN
- China
- Prior art keywords
- camera module
- packaging body
- sensitive chip
- circuit board
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The present invention relates to a kind of camera modules, including：Circuit board；Sensitive chip, setting is on circuit boards；And packaging body, it is arranged on circuit boards and encapsulates at least partly structure of sensitive chip, the packaging body includes lateral surface, medial surface and top surface, the top surface is opposite with the circuit board and connects the lateral surface and medial surface, the medial surface includes that the cambered surface for connecting the sensitive chip and the vertical plane of the connection top surface, the vertical plane are vertical with the circuit board.The medial surface of packaging body is provided with the cambered surface of connection sensitive chip and the vertical plane of connection top surface by above-mentioned camera module, the part of medial surface connection top surface is arranged to vertically, and unconventional inclination, the area of top surface can be made to increase, so as to provide more colloid loaded areas, so that the fixation for the lens subassembly being arranged on top surface is more firm.
Description
Technical field
The present invention relates to field of camera technology, more particularly to a kind of camera module.
Background technique
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Vehicle field, medical domain etc., such as camera module have become for portable electronic devices such as smart phone, tablet computers
One of standard fitting.The camera module for being applied to portable electronic device can not only obtain image, but also can help
Portable electronic device realizes the functions such as instant video call.The increasingly lightening development trend of portable electronic device, it is desirable that
The overall dimensions of camera module are smaller and smaller.However the lens subassembly in camera module is generally fixed by way of gluing, if
The carrier dimensions for carrying lens subassembly are excessively narrow, and enough glue amounts can not be provided on carrier makes lens subassembly by firm fixation,
It will affect the stability of the imaging capability of camera module.
Summary of the invention
The present invention is intended to provide a kind of camera module that not only there is smaller size but also there is preferable imaging capability.
A kind of camera module, including：
Circuit board；
Sensitive chip, setting is on circuit boards；And
Packaging body is arranged on circuit boards and encapsulates at least partly structure of sensitive chip, and the packaging body includes outside
Face, medial surface and top surface, the top surface is opposite with the circuit board and connects the lateral surface and medial surface, the inside bread
The vertical plane of the cambered surface for connecting the sensitive chip and the connection top surface is included, the vertical plane is vertical with the circuit board.
The medial surface further includes the inclined-plane for connecting the cambered surface and the vertical plane in one of the embodiments,.Setting
The up big and down small structure on inclined-plane, the cavity that packaging body can be made to be formed becomes apparent, and is conducive to packaging body demoulding after molding.
The sensitive chip has optical axis, one end that the inclined-plane is connect with the vertical plane in one of the embodiments,
Far from the optical axis beat, the angle between the inclined-plane and the optical axis is 30 ± 5 °.The corner dimension on the inclined-plane is arranged
In above-mentioned specific value, it not only can satisfy packaging body demoulding convenience after molding, but also will not influence the width dimensions of top surface, made
The colloid bearing capacity of top surface is restricted.
The radius of the cambered surface is 0.10 ± 0.02mm in one of the embodiments,.The radius size setting of cambered surface exists
Above-mentioned specific value not only can satisfy packaging body demoulding convenience after molding, but also will not influence the width dimensions of top surface, make to push up
The colloid bearing capacity in face is restricted.
The cambered surface is recessed towards the lateral surface in one of the embodiments,.
The cambered surface is convex backwards to the lateral surface in one of the embodiments,.The specific form multiplicity of cambered surface
Change, then the mold range of choice for forming the packaging body is wider, convenient for flexibly controlling the forming cost of packaging body.
The height of the vertical plane is 0.14 ± 0.05mm in one of the embodiments,.
In one of the embodiments, the circuit board with a thickness of 0.40 ± 0.05mm, the packaging body with a thickness of
0.41±0.05mm.By controlling the relative dimensions of vertical, circuit board, packaging body, can make camera module realize preferably at
As being minimized under the premise of function to the overall dimensions of camera module.
In a ring, the sensitive chip includes non-photo-sensing region and photosensitive to the packaging body in one of the embodiments,
Region, the packaging body encapsulate at least partly non-photo-sensing region of the sensitive chip.Due to the protection of packaging body, in production
It can avoid sensitive chip during stating camera module and the electric connection of circuit board destroyed.
The cambered surface of the packaging body is close to one end of the sensitive chip to the photosensitive area in one of the embodiments,
The distance in domain is 0.14 ± 0.05mm.By photosensitive region specific range described in packaging body interval, for ensure camera module at
As quality and minimize helpful.
The packaging body includes the lateral surface of multiple head and the tail connections in one of the embodiments, at least one is described outer
One end that side is connect with the top surface close to the optical axis beat, the angle between the lateral surface and the optical axis is 10 ±
5°.At least one lateral surface is obliquely installed, the stripping forming of packaging body is conducive to, while being also beneficial to the small-sized of camera module
Change.
The sensitive chip is electrically connected by conducting wire and circuit board in one of the embodiments, and the conducting wire is by institute
State packaging body package.Conducting wire is packaged body package, and conducting wire can be prevented mobile, meanwhile, conducting wire is in sealed environment, can be subtracted
Moisture in few conducting wire and air, the service life of extension lead.
In one of the embodiments, further include lens subassembly, is fixedly connected on the top surface of the packaging body.Exterior light
Signal is received by the focusing of lens subassembly by sensitive chip.
The medial surface of packaging body is provided with the cambered surface of connection sensitive chip and the vertical plane of connection top surface by above-mentioned camera module,
The part of medial surface connection top surface is arranged to vertically, and unconventional inclination, the area of top surface can be made to increase, so as to
More colloid loaded areas are provided, so that the fixation for the lens subassembly being arranged on top surface is more firm.On the other hand, inside
The part that face connects sensitive chip retains cambered surface design, is conducive to the stripping forming of packaging body.
Detailed description of the invention
Fig. 1 is the schematic top plan view for the camera module that one embodiment of the invention provides；
Fig. 2 is the schematic cross-sectional view of the line A-A along Fig. 1；
Fig. 3 is the enlarged diagram of the part Fig. 2 circle I；
Fig. 4 is the enlarged diagram of the part Fig. 2 circle II.
Specific embodiment
As depicted in figs. 1 and 2, a kind of camera module that one embodiment of the invention provides, including circuit board 10, sensitive chip
20 and packaging body 30.
Circuit board 10 can be printed circuit board, and in some embodiments, circuit board 10 can be flexible circuit board.Circuit board
Circuit is formed on 10, and by electronic equipment (such as the mobile terminals such as mobile phone) applied by these circuits and camera module
Other component, which is formed, to be electrically connected.
In some embodiments, flexible piece of the circuit board 10 including two substrates of two substrates and connection, sensitive chip 20,
The elements such as packaging body 30 are disposed therein on a substrate.Also settable electronic component on another substrate, electronic component can be with
For resistance, capacitor, diode, triode, potentiometer, relay or driver.It is appreciated that as shown in Figure 1, sensitive chip
20, may also set up electronic component 104 on the substrate where packaging body 30, electronic component 104 can for resistance, capacitor, diode,
Triode, potentiometer, relay or driver.
Sensitive chip 20 is arranged on the circuit board 10.Sensitive chip 20 is electrically connected with the circuit on circuit board 10.
For the photosurface 201 of sensitive chip 20 away from circuit board 10 to receive optical signal, sensitive chip 20 converts optical signals to electric signal,
And external image processing apparatus or image memory device are transmitted to through circuit board 10.
Sensitive chip 20 has an optical axis L.The geometric center of sensitive chip 20 is in the optical axis L.Sensitive chip 20 wraps
Include non-photo-sensing region 21 and photosensitive region 22.Wherein non-photo-sensing region 21 surrounds the photosensitive region 22.The photosensitive region 22
Upper surface define the photosurface 201.
Sensitive chip 20 is electrically connected by conducting wire 202 and circuit board 10, specifically, one end of conducting wire 202 and photosensitive core
Contact connection on the non-photo-sensing region 21 of piece 20, the other end of conducting wire 202 are connect with the corresponding contacts on circuit board 10.In addition
Some embodiments in, sensitive chip 20 can also by weld directly on circuit board 10 contact be electrically connected without borrowing
Assistant director of a film or play's line 202.
Packaging body 30 is arranged on the circuit board 10 and encapsulates at least partly structure of sensitive chip 20.Packaging body 30 is for protecting
Shield sensitive chip 20 and circuit board 10 are connected to manufacture, are not invaded and harassed by the external world in intermediate links, with ensure sensitive chip 20 and
The connection reliability of circuit board 10.In one embodiment, the packaging body 30 is by the non-photo-sensing area of the surrounding of the sensitive chip 20
Domain 21 encapsulates on the circuit board 10.In addition in some embodiments, the packaging body 30 can also be by certain of sensitive chip 20
The non-photo-sensing region 21 of side or part side encapsulates on the circuit board 10.In batch making production process, large stretch of circuit board
It is first fixedly connected with sensitive chip 20 on 10, re-forms packaging body 30, independent unit then is formed to the segmentation of large stretch of circuit board 10,
Due to the protection of packaging body 30, it can avoid sensitive chip 20 in cutting procedure and the electric connection of circuit board 10 destroyed.
It is being formed in the embodiment to electrically conduct between sensitive chip 20 and circuit board 10 with conducting wire 202, the conducting wire
202 can be wrapped up by the packaging body 30.Conducting wire 202 is packaged the package of body 30, and conducting wire 202 can be prevented mobile, meanwhile, conducting wire
202 in sealed environment, it is possible to reduce the moisture in conducting wire 202 and air, the service life of extension lead 202.
The electronic component 104 being arranged on the circuit board 10 can also be wrapped up by the packaging body 30.Electronic component 104 is sealed
It fills body 30 to wrap up, electronic component 104 can be made to invade and harass from the external world, also can avoid electronic component 104 and the moisture in air,
Prolong the service life.
With reference to Fig. 3 and Fig. 4, the packaging body 30 includes lateral surface 301, top surface 302 and medial surface 303, top surface 302
The lateral surface 301 and medial surface 303 are connected, and opposite with the circuit board 10.The one end of lateral surface 301 far from top surface 302
It being connect with circuit board 10, the one end of medial surface 303 far from top surface 302 connect with circuit board 10 or connect with sensitive chip 20,
Such as when medial surface 303 encapsulates the sensitive chip 20 of respective side, then connect with sensitive chip 20, and when medial surface 303 does not have
When encapsulating the sensitive chip 20 of respective side, then it is connect with circuit board 10.
In one embodiment, the packaging body 30 is annular in shape, it is possible to understand that lateral surface 301, top surface 302 and medial surface 303 are equal
Annularly.In one embodiment, packaging body 30 has square frame structure, thus four including being sequentially connected end to end lateral surfaces
301, four top surfaces 302 being sequentially connected end to end and four medial surfaces 303 being sequentially connected end to end.
As shown in figs. 2 and 4, one end that at least one described lateral surface 301 is connect with the top surface 302 is close to described
Optical axis L beat, the angle between the lateral surface 301 and the optical axis L are 10 ± 5 °.
The lateral surface 301 is arranged with respect to optical axis L inclination, the stripping forming of packaging body 30 can be conducive to, together
When can also reduce volume shared by packaging body 30, be conducive to the miniaturization of camera module.In some embodiments, four lateral surfaces
301 can tilt with respect to optical axis L, and angle can be equal or different.During mass production, due to using in a large stretch of electricity
Plate last time injection molding packaging in road forms multiple sensitive chips 20, then is separated circuit board, packaging body using cutting technique, obtains more
A independent unit, thus injection molding cuts the portions of lateral side of resulting packaging body in the sensitive chip 20 of middle section
301 perpendicular to the circuit board, i.e., parallel with the optical axis L.
The top surface 302 is opposite with circuit board 10, is arranged in parallel with circuit board 10, and the top surface 302 is for carrying lens
Component.
As shown in Figures 2 and 3, the medial surface 303, which encloses, sets to form a cavity 304.The sensitive chip 20 it is photosensitive
Region 22 is placed in the cavity 304, and photosurface 201 is exposed in cavity 304, with the optical signal outside reception.The sense
It is wrapped up by the packaging body 30 in at least partly non-photo-sensing region 21 of optical chip 20.
The medial surface 303 includes the cambered surface 305 for connecting the sensitive chip 20 and the vertical plane of the connection top surface 302
306, the vertical plane 306 is vertical with the circuit board 10.The part that medial surface 303 connects top surface 302 is arranged to vertically, rather than
Traditional inclination can be such that the area of top surface 302 increases, so as to provide more colloid loaded areas, to be arranged in
The fixation of lens subassembly on top surface 302 is more firm.On the other hand, medial surface 303 connects the part of sensitive chip 20 still
Setting with cambered surface 305, thus on the whole, cavity 304 still has up big and down small structure, so as to packaging body 30
Demoulding after molding.In some embodiments, the cambered surface 305 is in arc surface, and radius is 0.10 ± 0.02mm.Cambered surface 305
Radius size needs to consider the convenience of demoulding and the overall dimensions of packaging body 30.Cambered surface 305 is set, is to make cavity
304 still have up big and down small structure, so as to the demoulding after molding of packaging body 30.If too small, do not have to the convenience of demoulding
It is helpful, if excessive, cause the width of 30 top surface 302 of packaging body smaller and influence colloid bearing capacity.
The cambered surface 305 of the packaging body 30 is close to one end of the sensitive chip 20 to the photosensitive area of the sensitive chip 20
The distance d in domain 22 is 0.14 ± 0.05mm.The packaging body 30 is subsequent will to be used to carry colloid used in fixed lens group part.If
Too close to the photosensitive region 22 of sensitive chip 20, colloid pollution sensitive chip 20 will be caused during sizing, influences to take the photograph
As the image quality of mould group.If packaging body 30 too far away from sensitive chip 20, is unfavorable for the miniaturization of camera module again.Thus
Maximum value 0.19mm, minimum value 0.09mm are set by above-mentioned distance d in some embodiments.By experimental verification, find above-mentioned
Distance both can preferably form camera module, be unlikely to keep processing and manufacturing cost excessive, and can ensure the imaging of camera module
Quality.
In Fig. 2 and embodiment shown in Fig. 3, the cambered surface 305 is recessed towards the lateral surface 301.In addition one
In a little embodiments, the cambered surface 305 can also be convex backwards to the lateral surface 301.The specific form of cambered surface 305 can multiplicity
Change, thus the mold range of choice for forming the packaging body 30 is wider, convenient for flexibly controlling the forming cost of packaging body 30.
In some embodiments, the thickness T1 of the circuit board 10 is 0.40 ± 0.05mm, the thickness of the packaging body 30
T2 is 0.41 ± 0.05mm.Further, the height h of the vertical plane 306 is 0.14 ± 0.05mm.The arc length of the cambered surface 305
For 0.1mm.
In some embodiments, the medial surface 303 further includes the inclined-plane for connecting the cambered surface 305 and the vertical plane 306
307.The inclined-plane 307 is set, the up big and down small structure of cavity 304 is become apparent, it is after molding de- to be conducive to packaging body 30
Mould.More specifically, one end that the inclined-plane 307 is connect with the vertical plane 306 is far from the optical axis L beat, the inclined-plane 307
Angle between the optical axis L is 30 ± 5 °.The corner dimension on the inclined-plane 307 need to consider convenience and the encapsulation of demoulding
The overall dimensions of body 30.If inclined-plane 307 and the angle of optical axis L are excessive, cause the width of 30 top surface 302 of packaging body smaller and shadow
Colloid bearing capacity is rung, conversely, not helping if inclined-plane 307 and the angle of optical axis L are too small the convenience of demoulding.
In some embodiments, the camera module further includes lens subassembly, and lens subassembly is adhesively fixed on by colloid
On the top surface 302 of the packaging body 30.External optical signal is received by the focusing of lens subassembly by sensitive chip 20.Lens group
Part may include lens, in some embodiments, can be set up directly on lens on the top surface 302 of packaging body 30.Lens subassembly can
To include the lens barrel of fixed lens, in some embodiments, lens barrel can be set up directly on the top surface 302 of the packaging body 30.
In some embodiments, lens subassembly can also include the bracket of fixed lens barrel, and bracket can be arranged in the top of the packaging body 30
On face 302.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (13)
1. a kind of camera module, it is characterised in that including：
Circuit board；
Sensitive chip, setting is on circuit boards；And
Packaging body, setting on circuit boards and encapsulate at least partly structure of sensitive chip, and the packaging body includes lateral surface, interior
Side and top surface, the top surface is opposite with the circuit board and connects the lateral surface and medial surface, and the medial surface includes connecting
It connects the cambered surface of the sensitive chip and the vertical plane of the connection top surface, the vertical plane is vertical with the circuit board.
2. camera module according to claim 1, which is characterized in that the medial surface further includes connecting the cambered surface and institute
State the inclined-plane of vertical plane.
3. camera module according to claim 2, which is characterized in that the sensitive chip have optical axis, the inclined-plane with
Far from the optical axis beat, the angle between the inclined-plane and the optical axis is 30 ± 5 ° for one end of the vertical plane connection.
4. camera module according to claim 1, which is characterized in that the radius of the cambered surface is 0.10 ± 0.02mm.
5. camera module according to claim 1, which is characterized in that the cambered surface is recessed towards the lateral surface.
6. camera module according to claim 1, which is characterized in that the cambered surface is convex backwards to the lateral surface.
7. camera module according to claim 1, which is characterized in that the height of the vertical plane is 0.14 ± 0.05mm.
8. camera module according to claim 1, which is characterized in that the circuit board with a thickness of 0.40 ± 0.05mm,
The packaging body with a thickness of 0.41 ± 0.05mm.
9. camera module according to claim 1, which is characterized in that the packaging body in a ring, the sensitive chip packet
Non-photo-sensing region and photosensitive region are included, the packaging body encapsulates at least partly non-photo-sensing region of the sensitive chip.
10. camera module according to claim 9, which is characterized in that the cambered surface of the packaging body is close to the photosensitive core
The distance of one end of piece to the photosensitive region is 0.14 ± 0.05mm.
11. camera module according to claim 9, which is characterized in that the packaging body includes the outer of multiple head and the tail connections
Side, one end that at least one described lateral surface is connect with the top surface close to the optical axis beat, the lateral surface with it is described
Angle between optical axis is 10 ± 5 °.
12. camera module according to claim 1, which is characterized in that the sensitive chip passes through conducting wire and circuit board electricity
Property connection, the conducting wire wrapped up by the packaging body.
13. camera module according to claim 1, which is characterized in that further include lens subassembly, be fixedly connected on the envelope
On the top surface for filling body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710381172.1A CN108933883A (en) | 2017-05-25 | 2017-05-25 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710381172.1A CN108933883A (en) | 2017-05-25 | 2017-05-25 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108933883A true CN108933883A (en) | 2018-12-04 |
Family
ID=64450232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710381172.1A Pending CN108933883A (en) | 2017-05-25 | 2017-05-25 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108933883A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101285921A (en) * | 2007-04-13 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image-forming module group |
| US20090033789A1 (en) * | 2007-08-03 | 2009-02-05 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN101436603A (en) * | 2007-11-14 | 2009-05-20 | 鸿富锦精密工业（深圳）有限公司 | Imaging die set |
| KR101022865B1 (en) * | 2009-09-10 | 2011-03-16 | 삼성전기주식회사 | Camera module |
| CN104898351A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| JP2016063003A (en) * | 2014-09-16 | 2016-04-25 | 株式会社東芝 | Solid-state imaging device |
| CN105721754A (en) * | 2016-04-01 | 2016-06-29 | 宁波舜宇光电信息有限公司 | Camera module based on integral encapsulation process |
| CN105827916A (en) * | 2016-04-28 | 2016-08-03 | 宁波舜宇光电信息有限公司 | Image picking up module and manufacturing method thereof |
| CN205961279U (en) * | 2016-08-01 | 2017-02-15 | 宁波舜宇光电信息有限公司 | Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof |
| CN207117765U (en) * | 2017-05-25 | 2018-03-16 | 南昌欧菲光电技术有限公司 | Camera module |
-
2017
- 2017-05-25 CN CN201710381172.1A patent/CN108933883A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101285921A (en) * | 2007-04-13 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image-forming module group |
| US20080252771A1 (en) * | 2007-04-13 | 2008-10-16 | Hon Hai Precision Industry Co., Ltd. | Camera module with compact packaging of image sensor chip and method of manufacturing the same |
| US20090033789A1 (en) * | 2007-08-03 | 2009-02-05 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN101436603A (en) * | 2007-11-14 | 2009-05-20 | 鸿富锦精密工业（深圳）有限公司 | Imaging die set |
| KR101022865B1 (en) * | 2009-09-10 | 2011-03-16 | 삼성전기주식회사 | Camera module |
| CN104898351A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| JP2016063003A (en) * | 2014-09-16 | 2016-04-25 | 株式会社東芝 | Solid-state imaging device |
| CN105721754A (en) * | 2016-04-01 | 2016-06-29 | 宁波舜宇光电信息有限公司 | Camera module based on integral encapsulation process |
| CN105827916A (en) * | 2016-04-28 | 2016-08-03 | 宁波舜宇光电信息有限公司 | Image picking up module and manufacturing method thereof |
| CN205961279U (en) * | 2016-08-01 | 2017-02-15 | 宁波舜宇光电信息有限公司 | Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof |
| CN207117765U (en) * | 2017-05-25 | 2018-03-16 | 南昌欧菲光电技术有限公司 | Camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7138695B2 (en) | Image sensor module and method for fabricating the same | |
| US7408205B2 (en) | Digital camera module | |
| US7964945B2 (en) | Glass cap molding package, manufacturing method thereof and camera module | |
| KR101070058B1 (en) | Camera Module Package | |
| CN101271885B (en) | Image sensor encapsulation and image taking device using the same | |
| JP2011015392A (en) | Camera module | |
| US20060016973A1 (en) | Multi-chip image sensor package module | |
| CN101271913B (en) | Optical device, camera module, mobile phone, digital still camera, and medical endoscope | |
| CN210629641U (en) | Photosensitive assembly, camera module and electronic equipment | |
| CN207117765U (en) | Camera module | |
| TW200950505A (en) | Image sensor structure and integrated lens module thereof | |
| CN111477693A (en) | Optical chip packaging structure, packaging method thereof and photoelectric device | |
| CN112188043A (en) | Chip packaging structure, camera module and electronic equipment | |
| US7302125B2 (en) | Optical device and optical apparatus | |
| US20040041938A1 (en) | Embedded type camera module | |
| US20070120213A1 (en) | Wire under dam package and method for packaging image-sensor | |
| CN206865578U (en) | Camera module and its photosensory assembly | |
| US6740973B1 (en) | Stacked structure for an image sensor | |
| US20040070076A1 (en) | Semiconductor chip package for image sensor and method of the same | |
| CN108881675A (en) | Camera module | |
| US20070200212A1 (en) | Image sensor package | |
| CN206865584U (en) | Camera module | |
| CN110943049B (en) | Optical sensor | |
| CN108933883A (en) | Camera module | |
| CN206865583U (en) | Camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |