CN109495671A - Camera module and its photosensory assembly and manufacturing method - Google Patents
Camera module and its photosensory assembly and manufacturing method Download PDFInfo
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- CN109495671A CN109495671A CN201710810764.0A CN201710810764A CN109495671A CN 109495671 A CN109495671 A CN 109495671A CN 201710810764 A CN201710810764 A CN 201710810764A CN 109495671 A CN109495671 A CN 109495671A
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- circuit board
- molded base
- jigsaw
- photosensitive element
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- 238000005516 engineering process Methods 0.000 claims abstract description 45
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 143
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Camera module and its photosensory assembly and manufacturing method, the photosensory assembly include: circuit board.Photosensitive element and molded base in the circuit board and the photosensitive element and are formed as the photosensitive element and provide the optical window of passage of light wherein the molded base is integrally formed；Wherein correspond to the molded base adjacent to the part of the molded base of the first end side of the flexible region, the distance between outer edge and inner edges are a；The part of the molded base of the second opposite end side corresponding to the molded base far from the flexible region, the distance between outer edge and inner edges are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.Wherein the size of a and c to prevent part from cannot fill moulding material and forming defective products full of moulding material in corresponding forming tank in moulding technology.
Description
Technical field
The present invention relates to camera module fields, further, are related to photosensory assembly and its manufacturer of moulding technology production
Method and camera module with the photosensory assembly.
Background technique
The molded packages technology of camera module is the emerging a kind of encapsulation skill to grow up on the basis of traditional COB encapsulation
Art.It is the wiring board using the encapsulation of existing integral packaging technology as shown in Figure 1A to Fig. 1 C.In this configuration, by an encapsulation
Portion 1 is packaged in a wiring board 2 and a sensitive chip 3 by way of integral packaging, so that integral packaging component is formed, and
Encapsulation part 1 coats multiple electronic components 201 of the wiring board 2 and is electrically connected the sensitive chip 3 and the wiring board
A series of 2 leads 202, enable the length and width dimensions of camera module and thickness to reduce, and assembling tolerance is reduced,
Camera lens or lens assembly above integral packaging component can be entirely mounted, and solve to adhere on electronic component
Dust influences the problem of image quality of camera module.
More specifically, as shown in Figures 1 A and 1 B 1, it is in order to improve the production efficiency, general by the way of jigsaw production
The integral packaging component is produced, i.e., disposably produces multiple integral packaging components.More specifically, Figure 1A and 1B institute
Be shown as by molding die carry out jigsaw produce the integral packaging component in the way of.Wherein the molding die includes on one
Mould 101 and a lower die 102, one of wiring board jigsaw are placed into the lower die 102 of molding die, the wiring board jigsaw
Including multiple row circuit board, each column wiring board includes multiple wiring boards 2, and each wiring board 2 can place of working be connected with photosensitive core
Piece 3.Upper mold 101 and the molding of lower die 102 form a forming cavity, so that upper mold 101 is pressed together on the wiring board jigsaw, it is corresponding
In two end sides of sensitive chip 3 described on each column wiring board, two runners 103 and 104 of formation in the upper mold, and on
Mould 101 has multiple convex blocks 105, forms an intermediate flow channel 106 between the convex block 105 of adjacent two, it is multiple in this way in
Between runner 106 extend between two runners 103 and 104.
In moulding technology, the encapsulating material 4 of flow-like is filled along two flow forwards of runner 103 and 104
To the intermediate flow channel 106 between two neighboring convex block 105, the region between the sensitive chip 3 two neighboring so is also filled out
Fill the encapsulating material 4, thus the encapsulating material 4 after hardening can be in corresponding each wiring board 2 and each
The encapsulation part 1 is formed on the sensitive chip 3, and is formed in the position of each convex block 105 of correspondence and be located at the envelope
Optical window among dress portion 1, and these encapsulation parts 1 are integrally formed and form conjoined structure, as is shown in fig. 1C.
With reference to shown in Fig. 1 F, the heat cured encapsulating material 4 has a curing time T in moulding technology, with
The passage of time, viscosity are first decreased to minimum point, then gradually rise up to highest point again and be fully cured.Ideal situation
It is that, when the encapsulating material 4 is in viscosity smaller value, the runner 103,104 and 106 is full of by the encapsulating material 4,
And in the encapsulating material 4 in the larger still flow forward of viscosity, between the wiring board 2 and the sensitive chip 3
The lead 202 rub it is larger, so that the deformation and damage of the lead 202 can be easy to cause.
In above-mentioned moulding technology, the encapsulating material 4 is thermosetting material, and two 103 Hes of runner are entered after fusing
104, and solidify under heating condition effect.However find in actual production, in moulding technology encapsulating material 4 along
When two runners 103 and 104 flow forward, if the width of two runners 103 and 104 is different, proportional region is not one
When a zone of reasonableness, it will lead to the encapsulating material 4 and be out of step during flow forward.
More specifically, because the encapsulating material 4 is the fluid with predetermined viscosity, the ruler of two runners 103 and 104
Very little all relatively small and assume that runner 103 is relatively narrow runner, the flow in runner 103 is relatively small, and runner 103
Influence of the inner wall friction that the encapsulating material 4 of the flow-like in it is generated to its flow velocity it is relatively large, so runner
The flow velocity of the encapsulating material 4 in 103 is relatively slow.Runner 104 is wider runner, in flow it is relatively large, and
And the friction that the encapsulating material 4 of the flow-like in it is generated of the inner wall of runner 104 to the influence power of its flow velocity relatively
Small, the flow velocity of the encapsulating material 4 in such runner 104 is relatively fast.In this way, in the curing time of the encapsulating material 4
In T, the encapsulating material 4 in the runner 104 can flow to its end from its feed end, and will be at least partly described
Intermediate flow channel 106 fills the encapsulating material 4, however the encapsulating material 4 in the runner 103 may be in the solidification
Its end cannot be flow in time T from its feed end, cannot be full of so as to cause the local location of runner 103, such as institute in Fig. 1 D
The region S shown, so that a series of encapsulation part 1 with overall shapes cannot be formed between upper mold 101 and lower die 102
Conjoined structure, the position of corresponding region S, the encapsulation part 1 forms notch, so that the optical window of all round closure cannot be formed.
In addition, causing solid at this if 4 flow velocity of encapsulating material described in above-mentioned two runner 103 and 104 is inconsistent
Change in time T, the flow velocity in runner 104 is very fast and runner 104 and runner 106 can be filled the envelope when viscosity is lower
Package material 4, and the 4 flow forward speed of the encapsulating material in runner 103 is excessively slow, and when causing viscosity larger, still flowing
Flow forward in road 103, it is larger so as to cause the frictional force to the lead 202 flowed through, thus make the lead 202 to
It deflects to preceding larger degree of convergence, so that the lead 202 is easy to cause to deform and damage, and is easy to fall off from pad.
Another situation is when the encapsulating material 4 reaches between first sensitive chip and the second sensitive chip
Region when, more encapsulating materials 4 can be filled to the region by runner 104, in this way, with the encapsulating material 4 along
Two flow forwards of runner 103 and 104, the encapsulating material 4 that will lead to runner 104 are filled out between two adjacent sensitive chips 3
The accounting of the encapsulating material 4 filled incrementally increases, and the encapsulating material 4 for eventually leading to runner 104 may flow to runner
The forward further flowing of encapsulating material 4 in runner 103 is hindered at 103, in this way, may finally will lead in the encapsulation
After material 4 solidifies, the encapsulating material 4 in runner 103 may not flow to the end of runner 103, make entire forming cavity
In cannot fill the completely described encapsulating material 4, to cannot be provided for corresponding each wiring board 2 and the sensitive chip 3
The encapsulation part 1 of one complete annular.
Moreover, the sensitive chip 3 is connected with the wiring board 2 by the soft lead 202, flowed when two
The encapsulating material 4 of flow forward extends laterally to the institute between two adjacent sensitive chips in road 103 and 104
When stating intermediate flow channel 106, the encapsulating material 4 come from two streams of runner 103 and 104 is substantially corresponded in same size
Converge in the intermediate flow channel 106, so that its flow velocity is almost the same without generating turbulent flow, adjacent two will not be caused
For connecting the deformation and damage of the lead 202 of the sensitive chip 3 and the wiring board 2 between the sensitive chip 3
Wound.However, can be hindered when the encapsulating material 4 in wider runner 104 reaches runner 103 from the intermediate flow channel 106
The encapsulating material 4 of runner 103 continues flow forward, and because runner 10 and 103 size of runner are different, causes
Collision is generated between phase meet two fluids and forms turbulent flow, this turbulent flow is easy to cause the deformation of the lead 202,
The lead 202 is even caused to be broken, to form defective products.
More specifically, when the fluid of runner 104 flows into runner 103 and when towards feed end reverse flow, such as Fig. 1 E institute
Show, when the encapsulating material 4 in two runners 103 and 104 flows in the opposite direction face-to-face and generates turbulent flow,
There are pressure difference between two fluids, the lead 202 for causing two fluids to flow through is swung towards different directions, thus
The damage that rubs and may cause the lead 202 is generated between the adjacent lead 202.
In addition, when the width dimensions of two runners 103 and 104 are all sufficiently large, in curing time T, the package material
Material 4 can fill up the runner 103,104 and 106, however will lead in this way eventually form correspond to each wiring board 2
The encapsulation part 1 size it is larger, thus do not meet it is some miniaturization camera modules requirements.
Summary of the invention
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein in a sense
In the manufacturing method of one jigsaw of optical assembly, moulding material can be spelled full of the pedestal in a molding tool in moulding technology
Sheet metal forming guide groove avoids the generation of photosensory assembly defective products.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein molding
In technique, the moulding material can form a disjunctor molded base on a multiple-printed-panel for circuit board, and the disjunctor molds base
Seat can form an optical window of all round closure in the position of each photosensitive element of correspondence, thus in the photosensitive of the disjunctor that will be formed
After the cutting of component jigsaw, the molded base with the optical window is formed on each circuit board and the corresponding photosensitive element,
Prevent the molded base being partially formed the outside for being open and be connected to the optical window molded base.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the base
Seat jigsaw profiled guide slot on a column circuits plate for forming the disjunctor molded base, two diversion trenches with two sides,
And the multiple filling slots being laterally extended between two diversion trenches, the moulding material is in the diversion trench and described
Flow and solidify in filling slot, the dimension scale between two of them diversion trench within a preset range, to make the mold member
Material can be from the feed end flow forwards of two diversion trenches and full of described in the entire pedestal jigsaw profiled guide slot
Diversion trench and the filling slot.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the base
Seat jigsaw profiled guide slot is used to form the disjunctor molding base on the adjacent circuit board of rigid region two column joined integrally
Seat, two the first diversion trenches with two sides, the second intermediate diversion trench, and be located at two the first diversion trenches and
Multiple filling slots between second diversion trench, the moulding material flow simultaneously in the diversion trench and the filling slot
Solidification, the dimension scale described in two of them between the first diversion trench and second diversion trench within a preset range, to make
The moulding material can be from the feed end flow forwards of two diversion trenches and full of the entire pedestal jigsaw molding
The diversion trench and the filling slot of guide groove.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described
The size of diversion trench it is smaller be used to formed miniaturization the photosensory assembly when, by selecting the ruler between these diversion trenches
Very little proportionate relationship, so that the diversion trench of small size will the entire pedestal jigsaw profiled guide slot still in moulding technology
It fills up.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described
Before the viscosity of moulding material reaches high value and solidifies, the moulding material can be by the pedestal jigsaw profiled guide slot
It fills up, to prevent the connecting line between the circuit board and the photosensitive element by the higher molding of the viscosity of flow forward
Material damage.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described lead
The size and ratio of chute enable the moulding material described in moulding technology from each diversion trench within a preset range
Feed end reach its end, prevent the moulding material in a certain diversion trench from flowing to another diversion trench and hindering this another
Moulding material flow forward described in diversion trench.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein leading to respectively
The moulding material for crossing the diversion trench flow forward converges in the intermediate filling slot substantially, to prevent a certain lead
The moulding material in chute fills the full filling slot and flows to another diversion trench further to generate collision fierceness
Turbulent flow, lead to the deformation and damage that connect the connecting line of the circuit board and the photosensitive element.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the mould
Moulding material flow forward in the diversion trench, to prevent the moulding material in a certain diversion trench from flowing through the filling
Slot simultaneously further flows to another baffle and flows backward towards feed end, to influence moulding material described in flow-like
Charging efficiency, and cause the adjacent connecting line to deflect toward each other and generate friction to cause the connecting line
Damage.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the mould
Moulding material can choose the relatively high material of range of viscosities, thus when avoiding the selection lesser material of range of viscosities, the mould
Moulding material is easily accessible the photosensitive region of the photosensitive element in moulding technology and forms overlap, while being avoided to prevent
Overlap and increase pressure that optical window forming part is applied on the photosensitive element and cause to damage the photosensitive element by pressure.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the mould
Modeling technique can disposably form the disjunctor molding on the column circuits plate and a column photosensitive element with multiple circuit boards
Pedestal, to make to form the multiple photosensory assemblies of a column by board-splicing process, the photosensory assembly as described in preferred 2-12.
To reach the above at least goal of the invention, the present invention provides the manufacturing method of the photosensory assembly of a camera module,
Include the following steps:
(a) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes a column or more
Column circuits plate, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes combining
Rigid region and flexible region, and each circuit board can place of working be connected with photosensitive element；
(b) second mold and the first mold are molded, fills the moulding material of fusing in the base in the molding die
In seat jigsaw profiled guide slot, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(c) solidify the moulding material in the pedestal jigsaw profiled guide slot to correspond to the pedestal jigsaw
The position of profiled guide slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in each column institute corresponded to
Photosensitive element described in circuit board and each column is stated to form photosensory assembly jigsaw and in the position shape for corresponding to the optical window forming part
The optical window of passage of light is provided as each photosensitive element, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to institute
Disjunctor molded base is stated adjacent to the first diversion trench of the first end side of the flexible region and corresponds to the disjunctor molded base
The second diversion trench far from the flexible region, and extend between first diversion trench and second diversion trench
Multiple filling slots, wherein each optical window forming part is between two adjacent filling slots, wherein described first leads
The width of the bottom end of chute is a, and the width of the bottom end of second diversion trench is c, and wherein width a corresponds to the disjunctor mould
Mould pedestal adjacent to the part of the disjunctor molded base of the first end side of the flexible region outer edge and inner edges it
Between distance；Wherein width c corresponds to opposite second end side of the disjunctor molded base far from the flexible region
The distance between the outer edge of the part of the disjunctor molded base and inner edges, wherein 0.2mm≤a≤1mm, 0.2mm≤
c≤1.5a。
The photosensory assembly jigsaw is for manufacturing multiple photosensory assemblies, wherein the method also includes steps: also wrapping
It includes step: cutting the photosensory assembly jigsaw to obtain multiple photosensory assemblies, wherein each photosensory assembly includes the electricity
Road plate, the photosensitive element and the molded base, wherein the molded base is integrally formed in the circuit board and described
Photosensitive element and the optical window that the photosensitive element offer passage of light is provided.
Further, the method may further comprise the step of: cutting and correspond to the molded base far from the flexible region
The second opposite end side the photosensory assembly part so that the outer edge of the part of the remaining molded base with
The distance between inner edges are b, wherein 0.2mm≤b≤1.5a-0.2mm.
According to a further aspect of the invention, the present invention provides the manufacturing method of the photosensory assembly of a camera module, packet
Include following steps:
(A) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes multiple row circuit
Plate, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes the rigid region combined
Domain and flexible region, and each circuit board can place of working be connected with photosensitive element；
(B) second mold and the first mold are molded, fills the moulding material of fusing in the base in the molding die
In seat jigsaw profiled guide slot, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(C) solidify the moulding material in the pedestal jigsaw profiled guide slot to correspond to the pedestal jigsaw
The position of profiled guide slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in described in two adjacent column
Circuit board and the two adjacent column photosensitive elements are to form photosensory assembly jigsaw and in the position for corresponding to the optical window forming part
The optical window that each photosensitive element offer passage of light is provided is set, wherein the circuit board layout that two column are adjacent
At its flexible region away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to
The disjunctor molded base is adjacent to two the first diversion trenches of two end sides of the flexible region and corresponding to the two column phase
Second diversion trench in the region between the adjacent photosensitive element, and extend in two first diversion trenches and described the
Multiple filling slots between two diversion trenches, wherein each optical window forming part is between two adjacent filling slots,
Wherein the width of the bottom end of first diversion trench is a, and the width of the bottom end of second diversion trench is c, and wherein a corresponds to
The disjunctor molded base is adjacent to the part of the disjunctor molded base of each end side of the flexible region, outer edge
The distance between inner edges；Wherein c, which corresponds to, extends between the adjacent photosensitive element of two column
The part of the disjunctor molded base, the distance between two inward flanges, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a。
Correspondingly, the method also includes steps: cut the photosensory assembly jigsaw to obtain multiple photosensory assemblies,
In each photosensory assembly include the circuit board, the photosensitive element and the molded base, wherein the molded base
It is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element light of passage of light is provided
Window；And the part for the photosensory assembly being located between the two adjacent column photosensitive elements is cut, to be corresponded to
In the part of the molded base of opposite another side of the molded base far from the flexible region, and make outside it
The distance between edge and inner edges are b, wherein 0.2mm≤b≤1.5a-0.2mm.
According to a further aspect of the invention, the present invention provides the photosensory assembly of a camera module comprising:
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base in the circuit board and the photosensitive element and is formed wherein the molded base is integrally formed
The optical window of passage of light is provided for the photosensitive element；Wherein correspond to the molded base adjacent to the of the flexible region
The part of the molded base of one end, the distance between outer edge and inner edges are a；Corresponding to the molding base
The part of the molded base of opposite second end side of the seat far from the flexible region, outer edge and inner edges it
Between distance be c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
In some implementations, the part of the photosensory assembly of the second opposite end side far from the flexible region is suitable
Together in being cut, the distance between the outer edge of the remainder after cutting the molded base and inner edges are b,
Wherein 0.2mm≤b≤1.5a-0.2mm.
According to a further aspect of the invention, the present invention also provides the photosensory assemblies of a camera module comprising:
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base in the circuit board and the photosensitive element and is formed wherein the molded base is integrally formed
The optical window of passage of light is provided for the photosensitive element；Wherein correspond to the molded base adjacent to the of the flexible region
The part of the molded base of one end, the distance between outer edge and inner edges are a；Corresponding to the molding base
The part of the molded base of opposite second end side of the seat far from the flexible region has cut surface, and its outside
The distance between edge and inner edges are b, wherein 0.2mm≤a≤1mm, 0.2mm≤b≤1.5a-0.2mm.
According to a further aspect of the invention, the present invention also provides the photosensory assembly jigsaw of a camera module comprising:
One or more columns per page circuit board, each column circuit board include one or more circuit boards being arranged side by side, each electricity
Road plate includes the rigid region and flexible region combined；
One or more columns per page photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the column circuit
Plate and the column photosensitive element and the optical window that each photosensitive element offer passage of light is provided；Wherein correspond to institute
Disjunctor molded base is stated adjacent to the part of the disjunctor molded base of the first end side of the flexible region, outer edge with
The distance between inner edges are a；The second opposite end side corresponding to the disjunctor molded base far from the flexible region
The disjunctor molded base part, the distance between outer edge and inner edges are c, wherein 0.2mm≤a≤1mm,
0.2mm≤c≤1.5a。
According to a further aspect of the invention, the present invention also provides the photosensory assembly jigsaw of a camera module comprising:
Multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, each circuit board packet
Include the rigid region and flexible region combined；
Multiple row photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the adjacent institute of two column
Circuit board and two is stated to arrange the adjacent photosensitive element and the optical window of each photosensitive element offer passage of light is provided,
And the adjacent circuit board layout of two column at its flexible region away from each other and its rigid region is mutually adjacently, make
Each disjunctor molded base has two end sides of the neighbouring flexible region；Wherein correspond to the disjunctor and molds base
The part of the disjunctor molded base of each end side of the neighbouring flexible region of seat, between outer edge and inner edges
Distance be a；The disjunctor molded base extends between the adjacent photosensitive element of two column and two inner edges
The distance between edge is c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
According to a further aspect of the invention, the present invention also provides camera modules comprising:
Camera lens；
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base in the circuit board and the photosensitive element and is formed wherein the molded base is integrally formed
The optical window of passage of light is provided for the photosensitive element, wherein the camera lens is located at the photosensitive path of the photosensitive element；Wherein
Corresponding to the molded base adjacent to the part of the molded base of the first end side of the flexible region, outer edge with
The distance between inner edges are a；The institute of the second opposite end side corresponding to the molded base far from the flexible region
The part of molded base is stated, the distance between outer edge and inner edges are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c
≤1.5a。
According to a further aspect of the invention, the present invention also provides a molding tools, are applied to camera module to make
Photosensory assembly jigsaw comprising suitable for mutually separate with mutually closely sealed the first mold and the second mold, wherein described first and second
Mold forms forming cavity when mutually closely sealed, and the molding die is configured with optical window forming part and shape in the forming cavity
It is spelled at fixing circuit board is suitable in the pedestal jigsaw profiled guide slot and the forming cavity being located at around the optical window forming part
Plate, wherein the multiple-printed-panel for circuit board includes one or more columns per page circuit board, and each column circuit board includes one or more electricity being arranged side by side
Road plate, each circuit board includes the rigid region and flexible region combined, and each circuit board can place of working connection
Have a photosensitive element, the pedestal jigsaw profiled guide slot be suitable for filling the moulding material to correspond to the pedestal jigsaw at
The position of type guide groove forms disjunctor molded base, and wherein the disjunctor molded base is shaped in each column circuit corresponded to
Plate and each column photosensitive element are to form the photosensory assembly jigsaw and be formed as each in the position for corresponding to the optical window forming part
A photosensitive element provides the optical window of passage of light, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to disjunctor molding
Pedestal is adjacent to the first diversion trench of the first end side of the flexible region and corresponding to the disjunctor molded base far from the flex region
Second diversion trench in domain, and multiple filling slots between first diversion trench and second diversion trench are extended in, wherein
Each optical window forming part is between two adjacent filling slots, wherein the width of the bottom end of first diversion trench
Degree is a, and the width of the bottom end of second diversion trench is c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
According to a further aspect of the invention, the present invention also provides a molding tools, are applied to camera module to make
Photosensory assembly jigsaw comprising suitable for mutually separate with mutually closely sealed the first mold and the second mold, wherein described first and second
Mold forms forming cavity when mutually closely sealed, and the molding die is configured with optical window forming part and shape in the forming cavity
It is spelled at fixing circuit board is suitable in the pedestal jigsaw profiled guide slot and the forming cavity being located at around the optical window forming part
Plate, wherein the multiple-printed-panel for circuit board includes multiple row circuit board, and each column circuit board includes one or more circuit boards being arranged side by side,
Each circuit board be include the rigid region and flexible region combined, and each circuit board can place of working be connected with
Photosensitive element, wherein the pedestal jigsaw profiled guide slot be suitable for filling moulding material to correspond to the pedestal jigsaw at
The position of type guide groove forms disjunctor molded base, and wherein the disjunctor molded base is shaped in adjacent two and arranges the circuit board
The photosensitive element is arranged with adjacent two to form the photosensory assembly jigsaw and be formed in the position for corresponding to the optical window forming part
The optical window of passage of light is provided for each photosensitive element, wherein the adjacent circuit board layout of two column is at its flexible region
Away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to the disjunctor mold base
Between two the first diversion trenches of two end sides of the neighbouring flexible region of seat and the photosensitive element adjacent corresponding to two column
Region the second diversion trench, and extend between two first diversion trenches and second diversion trench multiple fill out
Slot is filled, wherein each optical window forming part is between two adjacent filling slots, wherein first diversion trench
The width of bottom end is a, and the width of the bottom end of second diversion trench is c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a。
According to a further aspect of the invention, the present invention also provides the manufacturing method of the photosensory assembly of a camera module,
Include the following steps:
(1) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes a column or more
Column circuits plate, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes combining
Rigid region and flexible region, and each circuit board can place of working be connected with photosensitive element；
(2) second mold and the first mold are molded, fills the moulding material of fusing in the base in the molding die
In seat jigsaw profiled guide slot, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；
(3) solidify the moulding material in the pedestal jigsaw profiled guide slot to correspond to the pedestal jigsaw
The position of profiled guide slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in each column institute corresponded to
Photosensitive element described in circuit board and each column is stated to form photosensory assembly jigsaw and in the position shape for corresponding to the optical window forming part
The optical window of passage of light is provided as each photosensitive element, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to institute
Disjunctor molded base is stated adjacent to the first diversion trench of the first end side of the flexible region and corresponds to the disjunctor molded base
The second diversion trench far from the flexible region, and extend between first diversion trench and second diversion trench
Multiple filling slots, wherein each optical window forming part is between two adjacent filling slots, wherein described first leads
The width of the bottom end of chute is a, and the width of the bottom end of second diversion trench is d, wherein 0.2mm≤a≤1mm, d > 1.5a,
And it is slow corresponding to being provided on the rigid region of the disjunctor molded base far from the second end side of the flexible region
Stream unit, and the unhurried current component is embedded by the disjunctor molded base.
According to a further aspect of the invention, the present invention also provides the manufacturing method of the photosensory assembly of a camera module,
Include the following steps:
(α) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes multiple row circuit
Plate, each column circuit board include one or more circuit board being arranged side by side, each circuit board be include the rigidity combined
Region and flexible region, and each circuit board can place of working be connected with photosensitive element；
(β) molds second mold and the first mold, fills the moulding material of fusing in the base in the molding die
In seat jigsaw profiled guide slot, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(γ) solidifies the moulding material in the pedestal jigsaw profiled guide slot to correspond to the pedestal jigsaw
The position of profiled guide slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in described in two adjacent column
Circuit board and the two adjacent column photosensitive elements are to form photosensory assembly jigsaw and in the position for corresponding to the optical window forming part
The optical window that each photosensitive element offer passage of light is provided is set, wherein the circuit board layout that two column are adjacent
At its flexible region away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to
The disjunctor molded base is adjacent to two the first diversion trenches of two end sides of the flexible region and corresponding to the two column phase
Second diversion trench in the region between the adjacent photosensitive element, and extend in two first diversion trenches and described the
Two diversion trenches multiple filling slots, wherein each optical window forming part is between two adjacent filling slots,
Described in the width of bottom end of the first diversion trench be a, the width of the bottom end of second diversion trench is d, wherein 0.2mm≤a≤
1mm, d > 1.5a, and in being provided with unhurried current component in second diversion trench on the hardboard.
According to a further aspect of the invention, the present invention also provides an electronic equipments comprising above-mentioned one or more
The camera module.The electronic equipment includes but is not limited to mobile phone, computer, television set, can intelligently screw on equipment, traffic work
Tool, camera and monitoring device.
Detailed description of the invention
Figure 1A is that existing integral packaging technique encapsulates to obtain the structural schematic diagram of the molding die of photosensory assembly.
Figure 1B is the forming process schematic diagram that existing integral packaging technique forms integral packaging component.
Fig. 1 C be in the existing integral packaging technique of signal encapsulating material along the enlarged structure of two runner flow forwards
Schematic diagram.
Fig. 1 D is the enlarged structure schematic diagram of local underfill encapsulating material in the existing integral packaging technique of signal.
Fig. 1 E is the enlarged structure schematic diagram that causes to rub between lead in existing integral packaging technique and damage.
The variation tendency schematic diagram of Fig. 1 F moulding material viscosity within curing time.
Fig. 2 is the manufacturing equipment of the photosensory assembly jigsaw of the camera module of first preferred embodiment according to the present invention
Block diagram representation.
Fig. 3 A is the manufacture of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention
The structural schematic diagram of the molding die of equipment.
Fig. 3 B is the manufacture of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention
The enlarged structure schematic diagram of the regional area A of first mold of the molding die of equipment.
Fig. 4 is the structure of the photosensory assembly jigsaw of the camera module of above-mentioned first preferred embodiment according to the present invention
Schematic diagram.
Fig. 5 A is the enlarged structure of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Schematic diagram.
Fig. 5 B is the attached view of amplification of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Structural schematic diagram.
Fig. 6 A is the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention along Fig. 5 A
The cross-sectional view of line C-C.
Fig. 6 B is the second end side of the photosensory assembly of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view after further being cut.
Fig. 7 A illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view when in mold by the moulding material propulsion pedestal jigsaw profiled guide slot of fusing, wherein the cross-sectional view corresponds to Fig. 4
The cross-sectional view in the line A-A direction of middle signal.
Fig. 7 B is the partial enlargement diagram in Fig. 7 A at B.
Fig. 8 illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to Fig. 4
The cross-sectional view in the line A-A direction of middle signal.
Fig. 9 illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to Fig. 4
The cross-sectional view in the line B-B direction of middle signal
Figure 10 illustrates the molding of the photosensory assembly jigsaw of above-mentioned first preferred embodiment according to the present invention
In mold execute demoulding step and formed disjunctor molded base correspond to Fig. 4 in line A-A direction cross-sectional view.
Figure 11 illustrates the schematic perspective view of the camera module of above-mentioned first preferred embodiment according to the present invention.
Figure 12 illustrates the decomposition texture schematic diagram of the camera module of above-mentioned first preferred embodiment according to the present invention.
Figure 13 A illustrates the line D-D along Figure 12 of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 13 B illustrates the E-E line along Figure 12 of the camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 14 illustrates one variant embodiment of camera module of above-mentioned first preferred embodiment according to the present invention
Cross-sectional view.
Figure 15 illustrates another variant embodiment of the camera module of above-mentioned first preferred embodiment according to the present invention
Camera module cross-sectional view.
Figure 16 illustrates another variant embodiment of the camera module of above-mentioned first preferred embodiment according to the present invention
Camera module cross-sectional view.
Figure 17 A is that the manufacture of the photosensory assembly jigsaw of the camera module of second preferred embodiment according to the present invention is set
The structural schematic diagram of standby molding die.
Figure 17 B is the system of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Enlarged structure schematic diagram at the Local C of first mold of the molding die of manufacturing apparatus.
Figure 18 is the structure of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Schematic diagram.
Figure 19 A is at the D of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
Enlarged structure schematic diagram.
Figure 19 B is the phase of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
The attached view structural schematic diagram of amplification of adjacent two photosensory assemblies.
Figure 20 A is the edge of the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention
The cross-sectional view of H-H line in Figure 19 A.
Figure 20 B is that the photosensory assembly jigsaw of the camera module of above-mentioned second preferred embodiment according to the present invention is cut
It cuts to obtain the structural schematic diagram of two photosensory assemblies.
Figure 21 A illustrate the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention it is described at
Cross-sectional view when in pattern tool by the moulding material propulsion pedestal jigsaw profiled guide slot of fusing, wherein the cross-sectional view corresponds to
The cross-sectional view in the F-F line direction illustrated in Figure 18.
Figure 21 B is the partial enlargement diagram in Figure 21 A at E.
Figure 22 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to figure
The cross-sectional view in the F-F line direction illustrated in 18.
Figure 23 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to figure
The cross-sectional view in the G-G line direction illustrated in 18.
Figure 24 illustrates the molding of the photosensory assembly jigsaw of above-mentioned second preferred embodiment according to the present invention
In mold execute demoulding step and formed disjunctor molded base correspond to Figure 18 in F-F line direction cross-sectional view.
Figure 25 A to 25C is to illustrate one of above-mentioned first and second preferred embodiment according to the present invention to become respectively
The enlarged structure schematic diagram for the photosensory assembly that the photosensory assembly jigsaw cross-sectional view of shape embodiment and cutting obtain.
Figure 26 A is the sense for illustrating another variant embodiment of above-mentioned second preferred embodiment according to the present invention
The structural schematic diagram of optical assembly jigsaw.
Figure 26 B be illustrate above-mentioned second preferred embodiment according to the present invention another variant embodiment it is photosensitive
The enlarged structure schematic diagram of component.
Figure 27 is photosensitive group of another variant embodiment for illustrating above-mentioned second preferred embodiment according to the present invention
The cross-sectional view of part I-I line along Figure 26 B.
Figure 28 A is that the manufacture of the photosensory assembly jigsaw of the camera module of third preferred embodiment according to the present invention is set
The structural schematic diagram of standby molding die.
Figure 28 B is the system of the photosensory assembly jigsaw of the camera module of above-mentioned third preferred embodiment according to the present invention
The enlarged structure schematic diagram of the local F of first mold of the molding die of manufacturing apparatus.
Figure 29 is the structure of the photosensory assembly jigsaw of the camera module of above-mentioned third preferred embodiment according to the present invention
Schematic diagram.
Figure 30 is the photosensory assembly jigsaw of the camera module of above-mentioned third preferred embodiment according to the present invention along Figure 29
Middle J-J line cross-sectional view figure.
Figure 31 is that the photosensory assembly removal embedding of the camera module of above-mentioned third preferred embodiment according to the present invention is slow
Enlarged structure cross-sectional view after stream unit.
Figure 32 illustrates the molding of the photosensory assembly jigsaw of above-mentioned third preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to figure
Along the cross-sectional view in J-J line direction in 29.
Figure 33 A is that the manufacture of the photosensory assembly jigsaw of the camera module of the 4th preferred embodiment according to the present invention is set
The structural schematic diagram of standby molding die.
Figure 33 B is the system of the photosensory assembly jigsaw of the camera module of above-mentioned 4th preferred embodiment according to the present invention
The local G enlarged structure schematic diagram of first mold of the molding die of manufacturing apparatus.
Figure 34 is the structure of the photosensory assembly jigsaw of the camera module of above-mentioned 4th preferred embodiment according to the present invention
Schematic diagram.
Figure 35 is the photosensory assembly jigsaw of the camera module of above-mentioned 4th preferred embodiment according to the present invention along Figure 34
It is middle along K-K line cross-sectional view figure.
Figure 36 is that the photosensory assembly removal embedding of the camera module of above-mentioned 4th preferred embodiment according to the present invention is slow
Enlarged structure cross-sectional view after stream unit.
Figure 37 illustrates the molding of the photosensory assembly jigsaw of above-mentioned 4th preferred embodiment according to the present invention
In mold by the moulding material of fusing be full of pedestal jigsaw profiled guide slot when cross-sectional view, wherein the cross-sectional view corresponds to figure
Along the cross-sectional view in K-K line direction in 34.
Figure 38 is the structural schematic diagram that above-mentioned camera module according to the present invention is applied to intelligent electronic device.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.In being described below
Preferred embodiment is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Boundary in the following description
Fixed basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and not have
There is the other technologies scheme away from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper",
The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned
Term is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment
In, the quantity of an element can be one, and in a further embodiment, the quantity of the element can be multiple, term
" one " should not be understood as the limitation to quantity.
It is the camera module 100 and photosensory assembly of first preferred embodiment according to the present invention as shown in Fig. 2 to Figure 14
10 and its manufacturing method.The camera module 100 can be applied to various electronic equipments 300, and the electronic equipment 300 wraps
Include equipment body 301 and the one or more institute's camera modules 100 for being installed on the equipment body 301, as shown in figure 38, institute
It states the citing of electronic equipment 30 ground but is not limited to smart phone, wearable device, computer equipment, television set, the vehicles, photograph
Machine, monitoring device etc., the camera module cooperate the electronic equipment to realize Image Acquisition and reproduction to target object.
More specifically, illustrating the photosensory assembly 10 and its manufacturing equipment 200 of the camera module 100 in figure.It is described
Photosensory assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13, and the molded base 12 is integrally formed
In the circuit board 11 and the photosensitive element 13 and formed to the optical window 122 of the photosensitive element 13 offer passage of light.Its
The middle molded base 12 of the invention is by the manufacturing equipment 200 via moulding technology, more specifically transfer modling work
Skill is integrally molded to the circuit board 11 and the photosensitive element 13, so that the molded base 12 can replace tradition
The microscope base or bracket of camera module, and do not need to need to paste microscope base or bracket by glue in similar traditional packaging process
Invest the circuit board 11.
Further, with reference to Fig. 2-4 and 7A to 10, the present invention manufactures a photosensory assembly by the manufacturing equipment 200
Jigsaw 1000 has the photosensory assembly jigsaw 1000 of multiple photosensory assemblies 10 by board-splicing process production.It is described photosensitive
Component jigsaw 1000 includes a multiple-printed-panel for circuit board 1100 and one or more disjunctor molded bases 1200.The multiple-printed-panel for circuit board
1100 include multiple row circuit board, and such as the 4 column circuits plates illustrated in Fig. 4, each column circuit board includes multiple circuit boards 11, such as 2-12
A circuit board 11, is illustrated as 6 circuit boards 11 in figure, each circuit board 11 can place of working connection one it is photosensitive
Element 13.Each disjunctor molded base 1200 be formed in the column circuit board and it is integrally formed in one column described in
Simultaneously expose the photosensitive element 13 at least part non-photo-sensing area 132 of each of photosensitive element 13 photosensitive element 13
Photosensitive area 131.Each disjunctor molded base 1200 has multiple optical windows 122, and the position of each optical window 122 is corresponding
In each photosensitive element 13, for providing passage of light for the corresponding photosensitive element 13.
Wherein the manufacturing equipment 200 of the photosensory assembly jigsaw 1000 of the camera module 100 has including a molding
210, a moulding material feeding machanism 220, a die fixture 230, a temperature control device 250 and a controller 260 are described
Moulding material feeding machanism 220 is used to provide a moulding material 14 to a pedestal jigsaw profiled guide slot 215.The mold is fixed
Device 230 is used to control the die sinking and molding of the molding die 210, and the temperature control device 250 is used for heat cured described
Moulding material 14 is heated, and the controller 260 is in moulding technology for automatically controlling the moulding material feeding machanism
220, the operation of the die fixture 230 and the temperature control device 250.
The molding die 210 includes one that can be opened and mold under the action of die fixture 230
One mold 211 and one second mold 212, i.e., the described die fixture 230 can be by first molds 211 and described
212 phase of two molds is separately with one forming cavity 213 of mutually closely sealed formation, and in molding, the multiple-printed-panel for circuit board 1100 is fixed on described
In forming cavity 213, and the moulding material 14 of flow-like enters the forming cavity 213, to be shaped in each column institute
It states on photosensitive element 13 described in circuit board 11 and corresponding each column, and cured formed later is shaped in described in each column
The disjunctor molded base 1200 on photosensitive element 13 described in circuit board 11 and each column.
More specifically, the shaping mould group 210 further have one or more pedestal jigsaw profiled guide slots 215 and
Including the multiple optical window forming parts 214 being located in the pedestal jigsaw profiled guide slot 215.In first and second mold 211
When with 212 molding, the optical window forming part 214 and the pedestal jigsaw profiled guide slot 215 are extended in the forming cavity 213,
And the moulding material 14 of flow-like is populated into the pedestal jigsaw profiled guide slot 215, and the corresponding optical window at
The position in type portion 214 cannot fill the moulding material 14 of flow-like, thus in the correspondence pedestal jigsaw profiled guide slot
215 position can form the disjunctor molded base 1200 after the moulding material 14 of flow-like is cured, wrap
The molded body 121 of the annular of the molded base 12 of corresponding each photosensory assembly 10 is included, and in the correspondence optical window
The position of forming part 214 will form the optical window 122 of the molded base 12.The moulding material 14 can choose but not
Be limited to nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, poly- third
Alkene), epoxy resin etc..
First and second mold 211 and 212, which can be, can generate two molds of relative movement, such as two molds
In it is one of fixed, another is removable；Or two molds are all removable, the present invention is not exposed to limit in this respect
System.In the example of this embodiment of the invention, first mold 211 is tangibly embodied as a fixed upper mold, and described
Second mold 212 is embodied as a removable lower die.The fixed upper mold and the removable lower die are coaxially arranged, such as described
Removable lower die can be capable of forming tight closure when with the fixed Ccope closing machine along multiple locating shaft upward slidings
The forming cavity 213.
Second mold 212 is that the lower die can have a circuit board locating slot 2121, can in groove-like or
It is formed by positioning column, with for installing and fixing the circuit board 11, and the optical window forming part 214 and the pedestal jigsaw
Profiled guide slot 215 can be formed in first mold 211, that is, be formed in the upper mold, when first and second mold
When 211 and 212 molding, the forming cavity 213 is formed.And the moulding material 14 of flow-like is injected into the circuit board
The pedestal jigsaw profiled guide slot 215 of the top side of jigsaw 1100, thus photosensitive described in circuit board 11 and each column described in each column
The top side of element 13 forms the disjunctor molded base 1200.
It is understood that the circuit board locating slot 2121 also can be set on first mold 211 is i.e. described
Mould, for installing and fixing the multiple-printed-panel for circuit board 1100, and the optical window forming part 214 and pedestal jigsaw molding are led
Slot 215 can be formed in second mold 211, when first and second mold 211 and 212 molding when, formed it is described at
Type chamber 213.The multiple-printed-panel for circuit board 1100 can be arranged just facing towards ground in the upper mold, and the mould of flow-like
Moulding material 14 is injected into the pedestal jigsaw profiled guide slot 215 of the bottom side of the inverted multiple-printed-panel for circuit board 1100, thus
The bottom side of the inverted multiple-printed-panel for circuit board 1100 forms the disjunctor molded base 1200.
More specifically, being molded in first and second mold 211 and 212 and when executing molding step, the optical window at
Type portion 214 is superimposed on the top surface of the photosensitive element 13 and fits closely, so that the moulding material 14 of flow-like is hindered
The photosensitive region 1311 for only entering the top surface 131 of the photosensitive element 13 on the circuit board 11, thus described in the correspondence
The position of optical window forming part 214 can ultimately form the optical window 122 of the disjunctor molded base 1200.It is understood that
It is that the optical window forming part 214 can be solid construction, is also possible to the internal knot with groove shapes as illustrated in the drawing
Structure.
It is understood that the forming surface that first mold 211 forms the pedestal jigsaw profiled guide slot 215 can be with
It is configured to burnishing surface, and is in same plane, in this way when 12 curing molding of molded base, the molded base
12 top surface is more smooth, thus the optical component such as driving of 10 top of the photosensory assembly for the camera module 100
Device, camera lens, fixed lens barrel provide smooth mounting condition, the heeling error of the camera module 100 after reducing assembling.
It is noted that the pedestal jigsaw profiled guide slot 215 and the optical window forming part 214 can integrally at
Type is in first mold 211.Being also possible to first mold 211 further includes dismountable molding structure, institute
It states molding structure and is formed with the pedestal jigsaw profiled guide slot 215 and the optical window forming part 214.In this way, according to different institutes
The shape and size for stating photosensory assembly 10 require the diameter and thickness of such as described molded base, can design different shape with
The pedestal jigsaw profiled guide slot 215 of size and the optical window forming part 214.In this way, it is only necessary to replace different molding knots
Structure, it can the manufacturing equipment is made to be suitably applied the photosensory assembly 10 of different specifications.It is understood that
Second mold 212 correspondingly also may include dismountable fixed block, to provide the groove of different shape and size
2121, to be convenient for changing the circuit board 11 for adapting to different shape and size.
It is understood that the moulding material 14 is thermosetting material, by that will be in that solid thermosetting material heats
Fusing becomes the moulding material 14 of flow-like.During described molded, the heat cured moulding material 14
Solidify by further heating process, and can no longer melt after hardening, to form the disjunctor molded base
1200。
It is understood that the moulding material 14 can be bulk, particle in the moulding technology of the invention
Shape, is also possible to powdered, becomes fluid in the molding die 210 after heated effect, then again it is cured to
Form the disjunctor molded base 1200.
More specifically, each pedestal jigsaw profiled guide slot 215 of the invention has the first substantially parallel diversion trench
2151 and second diversion trench 2152, and extend between first diversion trench 2151 and second diversion trench 2152
Multiple filling slots 2153 are such as schemed wherein being formed with the filling slot 2153 between two adjacent optical window forming parts 214
There is 7 filling slots 2153,6 optical window forming part 214 to distinguish for middle signal, the pedestal jigsaw profiled guide slot 215
Between two adjacent filling slots 2153.The moulding material 14 is along first diversion trench 2151 and described
Second diversion trench 2152 is flowed from its feed end 215A towards its end 215B, and in first diversion trench 2151 and institute
The size and ratio for stating the second diversion trench 2152 within a predetermined range when, the moulding material 14 described can be filled out full of each
Slot 2153 is filled, to form the disjunctor molded base 1200 after the moulding material 14 solidification.
As shown in Fig. 7 A to Figure 10, shown is the camera module 100 of this preferred embodiment according to the present invention
The manufacturing process schematic diagram of the photosensory assembly jigsaw 1000, as shown in Figure 7 A, the molding die 210 are in molding state,
The multiple-printed-panel for circuit board 1100 to be molded and the solid moulding material 14 prepare in place, the solid moulding material
14 are heated, and are admitted to the base when so that the moulding material 14 being molten into fluid state or semisolid semi-fluid condition
Seat jigsaw profiled guide slot 215, along first diversion trench 2151 and 2152 flow forward of the second diversion trench and is filled in
Filling slot 2153 between the optical window forming part 214 of adjacent two.
As shown in Figure 8 and Figure 9, when the molding for being stuffed entirely with flow-like in the pedestal jigsaw profiled guide slot 215
When material 14,14 curing molding of the moulding material of flow-like is set to be integrally formed described in each column using solidification process
The disjunctor molded base 1200 of photosensitive element 13 described in circuit board 11 and each column.
As shown in Figure 10, it after the moulding material 14 is formed by curing the disjunctor molded base 1200, executes of the invention
Knockout course, i.e., the described die fixture 230 are located remotely from each other first and second mold 211 and 212, described in this way
Optical window forming part 214 leaves the disjunctor molded base 1200, makes to form corresponding each institute in the disjunctor molded base 1200
State the optical window 122 of photosensitive element 13.
As shown in Figures 4 to 6, the photosensory assembly jigsaw 1000, which is made, further to be cut, to be made single
A photosensory assembly 10.Each photosensory assembly 10 includes at least one circuit board 11, at least one photosensitive member
Part 13 and the molded base 12 for being integrally molded to the circuit board 11 and the photosensitive element 13.Each electricity
Road plate 11 includes the rigid region 111 and a flexible region 112 combined, that is to say, that each circuit board 11 is at this
It may be embodied as Rigid Flex in this embodiment of invention.The wherein integrally formed circuit of the molded base 12
The rigid region 111 of plate 11 and at least part non-photo-sensing area 132 of the photosensitive element 13, and be formed as the sense
The photosensitive area 131 of optical element 13 provides the optical window 122 of passage of light.
It is noted that the manufacturing method of the photosensory assembly jigsaw 1000 of the invention is suitable for making small size
The photosensory assembly 10.In moulding technology, the width of the bottom end of first diversion trench 2151 is a, second water conservancy diversion
The width of the bottom end of slot 2152 is c.Width a corresponds to adjacent to the rigid region 111 of the circuit board 11 and described soft
Property region 112 width of the bottom end of first diversion trench 2151 of position that combines, width c is corresponding far from the flexibility
The width of the bottom end of second diversion trench 2152 of the other side in region 112.When width a and c meet following condition, i.e.,
The moulding material 14 of 0.2mm≤a≤1mm and 0.2mm≤c≤1.5a, flow-like can be along first diversion trenches
2151 and 2152 flow forward of the second diversion trench and will the entire pedestal jigsaw before the moulding material 14 solidifies
Profiled guide slot 215 is full of the moulding material 14.It is noted that more preferably 0.7a≤c≤1.3a, such as some
In embodiment, c=0.8a or c=1a or c=1.2a.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: one or more columns per page institute
State photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Described in each column
Circuit board 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 includes the institute combined
State rigid region 111 and the flexible region 112.Each disjunctor molded base 1200 is integrally formed in described in a column
Circuit board 11 and the column photosensitive element 13 and the optical window that each offer of the photosensitive element 13 passage of light is provided
122.Wherein correspond to the disjunctor molded base 1200 adjacent to the disjunctor mould of the first end side of the flexible region 112
The part 1200A of pedestal is moulded, the distance between outer edge 1201 and inner edges 1202 are a；It is molded corresponding to the disjunctor
The part 1200B of the disjunctor molded base of opposite second end side of the pedestal 1200 far from the flexible region 112,
The distance between outer edge 1203 and inner edges 1204 are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.Wherein
First end side of the disjunctor molded base 1200 corresponds to the rigid region 111 of the circuit board 11 and described
Flexible region 112 combines side, the i.e. proximal lateral adjacent to the flexible region 112；The institute of the disjunctor molded base 1200
The second end side is stated corresponding to distal side of the circuit board 11 far from the flexible region 112.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
Cutting can be in the disjunctor molded base 1200 in addition to two flanks of first end side and second end side are cut in step
It cuts, so that the molded base 12 is obtained, and the part 1200B of the molded base of corresponding second end side is not cut
It cuts, obtains the photosensory assembly 10 for the part 1200C that there is the disjunctor molded base in a pair of opposite flank in this way.
As shown in Figure 6A, correspondingly, the photosensory assembly 10 includes the circuit board 11, the photosensitive element 13 and institute
State molded base 12.Wherein the circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Institute
State that molded base 12 is integrally formed in the circuit board 11 and the photosensitive element 13 and to be formed as the photosensitive element 13 and mention
For the optical window 122 of passage of light.The circuit board 11 is connected with the photosensitive element 13 by a series of connecting lines 15
It connects.Corresponding to the molded base 12 adjacent to the part 12A of the molded base of the first end side of the flexible region 112,
The distance between its outer edge 1201 and inner edges 1202 are a；Corresponding to the molded base 12 far from the flexible region
The part 12B of the molded base of 112 the second opposite end side, between outer edge 1203 and inner edges 1204
Distance is c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
As shown in Figure 6B, correspondingly, in order to further reduce the size of the photosensory assembly 10, the molding base
At least part of the photosensory assembly 10 of opposite second end sides of the seat 12 far from the flexible region 112 be suitable for by
Removal is such as cut or is abraded with cutter, thus the outer edge of the remainder after cutting the molded base 12
The distance between 1205 and inner edges 1204 are b, wherein 0.2mm≤b≤1.5a-0.2mm.Wherein b is relative to c, reduction
0.2mm corresponds to the minimum precision of resecting tool, i.e. the cut lengths of the resecting tool limit can be such that the molded base 12 is cut
Cut the part of general width 0.2mm.
The photosensory assembly 10 described in the small size selects a≤1mm.And according to practical production experience, width a
With c it is relatively large sized when, when such as both greater than 1mm, flow velocity and flow in two diversion trenches 2151 and 2152 are enough
Full of the entire pedestal jigsaw profiled guide slot 215 before the moulding material 14 solidification.
It wherein finds in actual production, as a < 0.2mm or c < 0.2mm, because the size of width a and c are relatively small
When, the flow velocity and stream of mould the first day of the lunar month material 14 in corresponding first diversion trench 2151 and second diversion trench 2152
Measure it is all relatively small, so as to cause cannot be within the curing time of the moulding material, by the pedestal jigsaw profiled guide slot
215 are full of the moulding material 14.
Wherein as c > 1.5a, i.e., when the numerical value of c is greater than the numerical value of 1.5 times of a, when such as c=1.6a, in actual production
In, the part that will generate the pedestal jigsaw profiled guide slot 215 cannot be full of, and the case where generate defective products.Therefore, exist
In this embodiment of the invention, 0.2mm≤a≤1mm and 0.2mm≤c≤1.5a.The size range of above-mentioned width a and c makes
The pedestal jigsaw profiled guide slot 215 can be full of by obtaining moulding material 14 described in moulding technology, avoid photosensory assembly defective products
Generation.
In this embodiment of the invention, as 0.2mm≤a≤1mm and 0.2mm≤c≤1.5a, in moulding technology,
The moulding material 14 can form the disjunctor molded base 1200, and the company on the multiple-printed-panel for circuit board 1100
Body molded base 1200 can form the optical window 122 of all round closure in the position of each photosensitive element 13 of correspondence, from
And after the cutting of the photosensory assembly jigsaw 1200 for the disjunctor that will be formed, in each circuit board 11 and corresponding described photosensitive
The molded base 12 with the optical window 122 is formed on element 13, prevents being partially formed in similar Fig. 1 C for the molded base
Opening and the optical window 122 is connected to the outside of the molded base 12.
That is, the moulding material 14 of the invention can be from the charging of two diversion trenches 2151 and 2152
Hold 215A flow forward and the diversion trench 2151 and 2152 and institute full of the entire pedestal jigsaw profiled guide slot 215
State filling slot 2153.The moulding material 14 before curing can along two diversion trenches 2151 and 2152 from its into
Material end 215A flow to end 215B.And before the viscosity of the moulding material 14 reaches high value and solidifies, the mould
Moulding material 14 can fill up the pedestal jigsaw profiled guide slot 215, to prevent the circuit board 11 and the photosensitive element
The connecting line 15 between 13 is damaged by the higher moulding material 14 of the viscosity of flow forward.And it is led described in two
Fluid in chute 2151 and 2152 is substantially with identical step spoke flow forward, and two fluids is substantially in the filling slot 2153
In converge, avoid the moulding material 14 in a certain diversion trench from flowing to another diversion trench and hinder institute in another diversion trench
State 14 flow forward of moulding material.Nor turbulent flow and sinuous flow can be generated, lead to connect the circuit board 11 and described photosensitive
The connecting line 15 of element 13 it is irregular swing and cause deform and damage.
Correspondingly, the moulding material 14 of the invention is also able to can choose the relatively high material of range of viscosities, from
And when avoiding the selection lesser material of range of viscosities, the moulding material 14 is easily accessible the photosensitive member in moulding technology
The photosensitive region 131 of part 13 and form overlap.
In addition, it is noted that as shown in Figure 7 B, for convenience of demoulding and to the rigidity of the circuit board 11
The pressing in region 111, first mold 211 further one include multiple pressing blocks 216, the molded base 12 it is described
The outer edge of the rigid region 111 of outer edge 1201 and the circuit board 11 will form a pressing side 1111, and width is
W is suitble to the pressing block 216 to be pressed together on the area on the rigid region 111 of the circuit board 11 that is, in mould the first day of the lunar month technique
Domain, such as this pressing distance W can be 0.1~1mm, and such as in a specific example, this pressing distance W be can be
0.2mm.The pressing block 216 is further pressed together on the top of the flexible region 112 of circuit board 11 described in each column, prevents
Only moulding material 14 flows to the flexible region 112.In addition, 111 one of the rigid region of circuit board 11 described in each column
It forms and forms whole rigid region jigsaw 110, to facilitate the pressure of the first mold circuit board 11 described in each column
It closes.
Correspondingly, the present invention provides the manufacturing methods of the photosensory assembly 12 of the camera module 100 comprising
Following steps:
The multiple-printed-panel for circuit board 1100 is fixed on to second mold 212 of the molding die 210, wherein described
Multiple-printed-panel for circuit board 1100 includes one or more columns per page circuit board, and each column circuit board includes one or more circuit boards being arranged side by side
11, each circuit board 11 includes the rigid region 111 and flexible region 112 that combine, and each circuit board
111 can place of working be connected with the photosensitive element 13；
Second mold 212 and first mold 211 are molded by the die fixture 213, filling is molten
The moulding material 14 changed is in the pedestal jigsaw profiled guide slot 215 in the molding die 210, wherein corresponding to
The position of the optical window forming part 214 is prevented from filling the moulding material 14；
The moulding material 14 in the pedestal jigsaw profiled guide slot 215 undergoes solidification process to correspond to institute
The position for stating pedestal jigsaw profiled guide slot 215 forms the disjunctor molded base 1200, wherein the disjunctor molded base 1200
Photosensitive element 13 described in circuit board 11 and each column described in each column corresponded to is shaped in form photosensory assembly jigsaw 1000
And is formed as each photosensitive element 13 in the position for corresponding to the optical window forming part 214 and provides described in passage of light
Optical window 122, wherein the pedestal jigsaw profiled guide slot 215, which has, corresponds to the disjunctor molded base 1200 adjacent to described soft
Property region 112 the first end side the first diversion trench 2151 and correspond to the disjunctor molded base 1200 far from the flexibility
Second diversion trench 2152 in region 112, and extend between first diversion trench 2151 and second diversion trench 2152
For filling the position of the moulding material 14 between two photosensitive elements 13 adjacent into photosensitive element 13 described in each column
Filling slot 2153 between the two neighboring optical window forming part 214, wherein the width of the bottom end of first diversion trench 2151
Degree is a, and the width of the bottom end of the second diversion trench 2152 is c, and wherein it is neighbouring to correspond to the disjunctor molded base 2151 by width a
The outer edge 1201 and inner edges of the part 1200A of the disjunctor molded base of first end side of the flexible region 112
The distance between 1202；Wherein width c corresponds to the disjunctor molded base 1200 far from the opposite of the flexible region 112
The second end side the disjunctor molded base part 1200B outer edge 1203 and the distance between inner edges 1204,
Wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a, and preferably 0.7a≤c≤1.3a, such as c=0.8a or c=1a
Or c=1.2a, so that the width dimensions of first diversion trench 2151 and second diversion trench 2152 make first water conservancy diversion
Slot 2151 and second diversion trench 2152 mold member described in the moulding technology for forming the disjunctor molded base 1200
Material 14 can be full of the pedestal jigsaw profiled guide slot 215 and the moulding material 14 is from 2151 He of the first diversion trench
The feed end 215A of second diversion trench 2152 can arrive separately at first diversion trench 2151 and second diversion trench
2152 end 215B；
The photosensory assembly jigsaw 1000 is cut to obtain multiple photosensory assemblies 10, wherein each described photosensitive group
Part 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 is integrally
It takes shape in the circuit board 11 and the photosensitive element 13 and is formed as the photosensitive element 13 and the light of passage of light is provided
Window 122.
Also, the method may further comprise the step of: cutting and correspond to the molded base 12 far from the flexible region
The part of the photosensory assembly of 112 the second opposite end side, i.e. a part of the part 12B of molded base and the electricity
A part of road plate 11, so that the molded base 12B has in the second opposite end side far from the flexible region 112
Cut surface 125, and the distance between the outer edge 1203 of the part of the remaining molded base and inner edges 1204 are
B, wherein 0.2mm≤b≤1.5a-0.2mm.
As shown in Fig. 5 A to Fig. 6 B, the circuit board 11 includes being formed in the rigid region 111 as pasted by SMT technique
Multiple electronic components 113 of dress, the electronic component 113 include but is not limited to resistance, capacitor, driving element etc..At this
In this embodiment of invention, the molded base 12 is integrally coated on the electronic component 113, to prevent similar
Dust, sundries are adhered on the electronic component 113 in traditional camera module, and further pollute the photosensitive member
Part 13, to influence imaging effect.Furthermore it is preferred that the multiple setting of electronic component 113 is in addition to neighbouring described soft
Property region 112 and far from the flexible region 112 the circuit board 11 the rigid region 111 the first end side 11A and
At least flank 11C positioned at 11 two sides of photosensitive element on second end side 11B, the rigid region 111, wherein institute
It states molded base 12 and integrally embeds the electronic component 113.
That is, referring to shown in Fig. 8 and Fig. 9, in correspondence first diversion trench 2151 and second diversion trench
In 2152, without the electronic component 113, the electronic component 113 can be with concentrated setting in the filling slot 2153
In, so that any blocking is not had in first diversion trench 2151 and second diversion trench 2152 in moulding technology,
It is flowed forward to will not influence the moulding material 14 along first diversion trench 2151 and second diversion trench 2152
It is dynamic, so that the moulding material 14 be made to flow to its end 215B from its feed end 215A within a short period of time as far as possible.
It is understood that the connecting line 15 can be set in four sides of the photosensitive element 13, it can also concentrate and set
The two flank 11C in the rigid region 111 of the circuit board 11 are set, to also be centrally located in moulding technology described
In filling slot 2153, to not influence the moulding material 14 along first diversion trench 2151 and second diversion trench
2152 flow forwards.
If Figure 11 to Figure 14 is the camera module 100 that the photosensory assembly 10 of the invention is applied to production.It is described
Camera module includes a photosensory assembly 10, a camera lens 20 and a filtering assembly 30.The photosensory assembly 10 includes the electricity
Road plate 11, the molded base 12 and the photosensitive element 13.The camera lens 20 includes a structural member 21 and is contained in the knot
One or more eyeglasses 22 in component 21.The filtering assembly 30 includes a filter element microscope base 31 and a filter element 32,
The filter element microscope base 31 is assembled in the top side of the molded base 12, and 20 direct-assembling of camera lens is in the optical filtering member
The top side of part microscope base 31 is to form a fixed-focus camera module.Wherein in this embodiment, 12 top side of molded base is one
Plane, the filter element microscope base 31 are assembled in the top surface that the molded base 12 is in plane, and the filter element 32 rises
To the effect for the light for being filtered through the camera lens 20, the optical filter of filtering infrared ray such as may be embodied as, be located at the mirror
Between first 20 and the photosensitive element 13.In this way, the light for passing through the camera lens 30 can pass through the filter element 32, and
And the photosensitive element 13 is reached via the optical window 122, so that the camera module can be made after photoelectric conversion acts on
100 are able to provide optical imagery.
As shown in FIG. 13A, in the photosensory assembly 10 of the camera module 100, correspond to the molded base 12
The part 12A of the molded base of first end side of the neighbouring flexible region 112, outer edge 1201 and inner edges
The distance between 1202 be a；The second opposite end side corresponding to the molded base 12 far from the flexible region 112
The part 12B of the molded base, the distance between outer edge 1203 and inner edges 1204 be c, wherein 0.2mm≤a≤
1mm, 0.2mm≤c≤1.5a, so as to obtain the photosensory assembly 10 of small size, so that the entire camera module
100 size also further reduces.It is understood that the molded base 12 is far from the opposite of the flexible region 112
The second end side can be cut further into cutting side so that remainder after cutting the molded base 12 has
Face 125, and the distance between its outer edge and inner edges are b, wherein 0.2mm≤b≤1.5a-0.2mm, such as Figure 14
Shown in.In addition, as shown in Figure 13 B, it can be seen that the electronic component 113 can concentrated setting in the photosensory assembly
At least side in 10 two flanks, such as can be and concentrates on two flanks.
It is understood that in other variant embodiment, it can also be described without the filter element microscope base 31
Filter element 32 can be assembled in the camera lens 20 in the molded base 12 or the filter element 32 with direct-assembling, or
Filter element 32 described in person is assembled in the load-bearing part such as driver or fixed lens barrel of the camera lens 20.
As shown in figure 15, the camera module 100 may include a load-bearing part 40, be a driver or a fixed mirror
Cylinder, in this drawing signal are a driver, such as voice coil motor, piezo-electric motor, move burnt camera module to form one, described
Camera lens 20 is installed on the driver.12 top side of molded base has groove 123, can be used for installing the optical filtering member
Part microscope base 31, the driver can directly be loaded on the top side of the molded base 12.It is understood that in other change
In shape embodiment, the load-bearing part 40 can also be on the filter element microscope base 31, or a part is mounted in the filter
Optical element microscope base 31, another part is on the molded base 12.
As shown in Figure 16, in this embodiment in accordance with the invention and in attached drawing, the camera module 100 can wrap
A load-bearing part 40 is included, is a fixed lens barrel, the camera lens 20 is installed on the fixed lens barrel.12 top side of molded base
With groove 123, it can be used for installing the filter element microscope base 31, the fixed lens barrel is installed on the molded base 12
Top side.
It is the sense of the camera module 100 of second embodiment according to the present invention as shown in Figure 17 A to Figure 24
Optical assembly 10 and its manufacturing process.In this embodiment, a photosensory assembly jigsaw is equally made by way of jigsaw operation
1000, then cutting obtains the photosensory assembly 10.Wherein in the embodiment shown in Fig. 2 to Figure 16, multiple row circuit board
In, the rigid region 111 of a column circuits plate is arranged adjacent to the mode of the flexible region 112 of another column circuits plate.And
In this embodiment, two adjacent column circuits plates can be such that the rigid region 111 neighboringly arranges, and make corresponding institute
It is mutually separate to state flexible region 112.It is highly preferred that the rigid region 111 of two adjacent column circuits plates is integrally formed to phase
The intermediate of two adjacent column circuits plates forms whole rigid region.
Correspondingly, it more specifically, the molding die 210 forms a forming cavity 213 in molding, and provides multiple
Optical window forming part 214 and one or more pedestal jigsaw profiled guide slots 215, each pedestal jigsaw profiled guide slot 215 include
Positioned at substantially parallel first diversion trench 2151 arranged along the longitudinal direction at both ends, positioned at two first diversion trenches
The second diversion trench 2152 among 2151, and extend in two first diversion trenches 2151 and second diversion trench
Transversely arranged multiple filling slots 2153 between 2152, wherein the two column filling slots 2153 each extend over described in two
Between first diversion trench 2151 and second diversion trench 2152.
Such as in this embodiment, the multiple-printed-panel for circuit board 1100 includes the 4 column circuit boards 11, and two arrange institutes
It states circuit board 11 and is used as one group, during the rigid regions 111 of the two column circuit boards 11 of circuit board 11 described in every group are located at
Between and be integrally formed, as described in each column circuit board 11 have 6 circuit boards, rigid region 111 be integrally formed.It is described
There are two the pedestal jigsaw profiled guide slots 215 for the tool of molding die 210, and each pedestal jigsaw profiled guide slot 215 is each
There is 7 filling slots 2153, two neighboring optical window between first diversion trench 2151 and second diversion trench 2152
There is the filling slot 2153, each optical window forming part 214 is located at two adjacent fillings between forming part 214
Between slot 2153.The moulding material 14 is along two first diversion trenches 2151 and intermediate second diversion trench
2152 flow from its feed end 215A towards its end 215B, and in first diversion trench 2151 and second water conservancy diversion
The size and ratio of slot 2152 within a predetermined range when, the moulding material 14 can be full of each filling slot 2153, from
And the disjunctor molded base 1200 is formed after the moulding material 14 solidification.
In this embodiment in accordance with the invention, the disjunctor molded base 1200 is shaped in described in two adjacent column
Circuit board 11 and the adjacent two column photosensitive elements 13 with formed photosensory assembly jigsaw 1000 and correspond to the optical window at
The position in type portion 214 is formed as each photosensitive element 13 and provides the optical window 122 of passage of light.
As shown in Figure 21 A to Figure 24, shown is the camera module 100 of this preferred embodiment according to the present invention
The photosensory assembly jigsaw 1000 manufacturing process schematic diagram, as illustrated in fig. 21, the molding die 210 be in molding shape
State, the circuit board 11 to be molded and the solid moulding material 14 prepare in place, solid 14 quilt of moulding material
Heating is admitted to the pedestal and spells when so that the moulding material 14 being molten into fluid state or semisolid semi-fluid condition
Sheet metal forming guide groove 215 along first diversion trench 2151 and 2152 flow forward of the second diversion trench and is filled in adjacent
Two optical window forming parts 214 between the filling slot 2153.In addition, for the forming surface of first mold 211
It is fitted closely with the circuit board 11 and the photosensitive element 13 and conveniently stripped,.
As shown in Figure 22 and Figure 23, when two first diversion trenches 2151 of the pedestal jigsaw profiled guide slot 215,
When being stuffed entirely with the moulding material 14 of flow-like in second diversion trench 2152 and the filling slot 2153, then pass through
Crossing solidification process makes 14 curing molding of the moulding material of flow-like be integrally formed in the two adjacent column circuit boards 11
With the disjunctor molded base 1200 of the two column photosensitive elements 13.
As shown in figure 24, it after the moulding material 14 is formed by curing the disjunctor molded base 1200, executes of the invention
Knockout course, i.e., the described die fixture 230 are located remotely from each other first and second mold 211 and 212, described in this way
Optical window forming part 214 leaves the disjunctor molded base 1200, makes to form corresponding each institute in the disjunctor molded base 1200
State the two column optical windows 122 of photosensitive element 13.
As shown in fig. 20b, the photosensory assembly jigsaw 1000, which is made, further to be cut, to be made single
The photosensory assembly 10.Each photosensory assembly 10 includes at least one circuit board 11, at least one photosensitive element
13 and integrally it is molded to the molded base 12 of the circuit board 11 and the photosensitive element 13.Such as Figure 19 A to figure
Shown in 20B, integrally formed rigid region 111 is separated between the two adjacent column circuit boards 11, makes each electricity
Road plate 11 includes the rigid region 111 and the flexible region 112 combined.The molded base 12 is integrally formed
The rigid region 111 of the circuit board 11 and at least part non-photo-sensing area 132 of the photosensitive element 13, and formed
The optical window 122 of passage of light is provided for the photosensitive area 131 of the photosensitive element 13.
It is noted that the photosensory assembly jigsaw 1000 is through cutting each described photosensitive of prepared monomer
Component 10 for make dynamic burnt camera module i.e. automatic focusing camera mould group when, the molding die 210 is further provided with
Multiple driver pin Slot shaping blocks 218, each driver pin Slot shaping block 218 extend into the pedestal jigsaw
The filling slot 2153 of profiled guide slot 215, to not influence described in three diversion trenches 2151,2152 and 2153
The flowing of moulding material 14, and in molding process, it is each that the moulding material 14 of flow-like will not fill correspondence
The position of the driver pin Slot shaping block 218, thus after the curing step, in the photosensory assembly jigsaw 1000
Multiple optical windows 122 and multiple driver pin slots 124 are formed in the disjunctor molded base 1200, are made through cutting
The molded base 12 of each photosensory assembly 10 of obtained monomer is able to configured with the driver pin slot 124,
To which when making the dynamic burnt camera module 100, the pin of driver is able to connect by the modes such as welding or conducting resinl attaching
It is connected to the circuit board 11 of the photosensory assembly 10.
It is noted that the manufacturing method of the photosensory assembly jigsaw 1000 of the invention is suitable for making small size
The photosensory assembly 10.In moulding technology, the width of the bottom end of each first diversion trench 2151 is a, described second
The width of the bottom end of diversion trench 2152 is c.Width a corresponds to the rigid region 111 and institute adjacent to the circuit board 11
The width of the bottom end of first diversion trench 2151 for the position that flexible region 112 combines is stated, width c is corresponding far from described
The width of the bottom end of second diversion trench 2152 of the other side of flexible region 112.When width a and c meet following condition,
That is the moulding material 14 of 0.2mm≤a≤1mm and 0.2mm≤c≤1.5a, flow-like can be along described in two of outside
First diversion trench 2151 solidifies preceding incite somebody to action with intermediate 2152 flow forward of the second diversion trench and in the moulding material 14
The entire pedestal jigsaw profiled guide slot 215 is full of the moulding material 14.It is noted that more preferably 0.7a≤c≤
1.3a, such as in some embodiments, c=0.8a or c=1a or c=1.2a.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: one or more columns per page institute
State photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Described in each column
Circuit board 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 includes the institute combined
State rigid region 111 and the flexible region 112.It is adjacent that each disjunctor molded base 1200 is integrally formed in two column
The circuit board 11 and the two adjacent photosensitive elements 13 of column and be formed as each photosensitive element 13 to provide light logical
The optical window 122 on road, and the adjacent circuit board 11 of two column be arranged to its flexible region 112 away from each other and its just
Property region 11 be mutually adjacently, make each disjunctor molded base 1200 that there are two ends of the neighbouring flexible region 112
Side；Wherein correspond to the disjunctor of the disjunctor molded base 1200 adjacent to each end side of the flexible region 112 to mold
The part 1200A of pedestal, the distance between outer edge 1201 and inner edges 1202 are a；The disjunctor molded base 1200
Extend to the part 1200B being located between the adjacent photosensitive element 13 of two column, between two inward flanges 1204 away from
From for c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.Wherein each end of the disjunctor molded base 1200
Side corresponds to the rigid region 111 of the circuit board 11 and the flexible region 112 combines side, i.e., neighbouring described
The proximal lateral of flexible region 112；The disjunctor molded base 1200 corresponds to the circuit board 11 far from the flexible region
112 distal side extends between the adjacent photosensitive element 13 of two column.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
Cutting can be in the disjunctor molded base 1200 in addition to other lateral incisions of the part 1200A of the end side are cut, to obtain in step
To the molded base 12, wherein corresponding to the part 1200B of the molded base between the adjacent two column photosensitive element 13
Also it is cut.
Correspondingly, as shown in fig. 20b, the photosensory assembly 10 obtained after cutting comprising the circuit board 11, institute
State photosensitive element 13 and the molded base 12.Wherein the circuit board 11 includes the rigid region 111 combined and institute
State flexible region 112.The molded base 12 is integrally formed in the circuit board 11 and the photosensitive element 13 and to be formed as
The photosensitive element 13 provides the optical window 122 of passage of light.The circuit board 11 and the photosensitive element 13 pass through a system
Column connecting line 15 is connected.After cutting the photosensory assembly jigsaw 1000, make each photosensory assembly 10 similar to above-mentioned reality
The second end side that there is the first end side that do not cut and cutting to obtain with applying example.Corresponding to the molded base 12 adjacent to institute
State the part 12A of the molded base of the first end side of flexible region 112, outer edge 1201 and inner edges 1202 it
Between distance be a；The mould of the second opposite end side corresponding to the molded base 12 far from the flexible region 112
The part 12B for moulding pedestal, with cut surface 125, and the distance between its outer edge 1205 and inner edges 1204 are b,
Wherein 0.2mm≤a≤1mm, 0.2mm≤b≤1.5a-0.2mm.
The photosensory assembly 10 described in the small size selects a≤1mm.And find in actual production, when a <
When 0.2mm or c < 0.2mm, because when the size of width a and c are relatively small, corresponding two 2151 Hes of the first diversion trench
The flow velocity and flow of mould the first day of the lunar month material 14 in second diversion trench 2152 are all relatively small, so as to cause cannot be in institute
It states in the curing time of moulding material, the pedestal jigsaw profiled guide slot 215 is full of the moulding material 14.As c > 1.5a
When, i.e., when the numerical value of c is greater than the numerical value of 1.5 times of a, in actual production, the pedestal jigsaw profiled guide slot 215 will be generated
Part cannot be full of, and the case where generate defective products.Therefore, in this embodiment in accordance with the invention, 0.2mm≤a≤1mm
With 0.2mm≤c≤1.5a.The size range of above-mentioned width a and c enables moulding material 14 described in moulding technology to be full of
The pedestal jigsaw profiled guide slot 215, avoids the generation of photosensory assembly defective products.
That is, the moulding material 14 can be from three diversion trenches 2151 in this embodiment of the invention
Feed end 215A flow forward with 2152 and the diversion trench full of the entire pedestal jigsaw profiled guide slot 215
2151 and 2152 and the filling slot 2153.The moulding material 14 before curing can be along three diversion trenches
2151 and 2152 flow to end 215B from its feed end 215A.And reach high value simultaneously in the viscosity of the moulding material 14
And before solidifying, the moulding material 14 can fill up the pedestal jigsaw profiled guide slot 215, to prevent the circuit
The connecting line 15 between plate 11 and the photosensitive element 13 is damaged by the higher moulding material 14 of the viscosity of flow forward
It is bad.And the fluid in three diversion trenches 2151 and 2152 avoids a certain water conservancy diversion substantially with identical step spoke flow forward
The moulding material 14 in slot flow to another diversion trench and moulding material 14 described in another diversion trench is hindered to flow forward
It is dynamic.Nor turbulent flow and sinuous flow can be generated, lead to the connection for connecting the circuit board 11 and the photosensitive element 13
Line 15 it is irregular swing and cause deform and damage.
As illustrated in fig. 21b, described for convenience of demoulding and the pressing of the rigid region 111 to the circuit board 11
First mold 211 further one includes multiple pressing blocks 216, the outer edge 1201 and the electricity of the molded base 12
The outer edge of the rigid region 111 of road plate 11 will form a pressing side 1111, width W, i.e., in mould the first day of the lunar month technique,
Two pressing blocks 216 are pressed together on the region on the rigid region 111 of the two column circuit board 11, such as this respectively
A pressing distance W can be 0.1~1mm, and such as in a specific example, this pressing distance W can be 0.2mm.Two
The pressing block 216 is pressed together on the top of flexible region 112 described in each group of the adjacent two column circuit board 11, prevents from molding
Material 14 flows to the flexible region 112.In addition, 111 one of the rigid region of the adjacent two column circuit board 11 at
Type and form whole rigid region jigsaw 110, two pressing blocks 216 are pressed together on whole rigid region jigsaw respectively
110 two end sides, to facilitate pressing of first mold 211 to the adjacent two column circuit board 11.
It is correspondingly, of the invention that this embodiment provides for the manufactures of the photosensory assembly 12 of the camera module 100
Method comprising following steps:
The multiple-printed-panel for circuit board 1100 is fixed on to second mold 212 of the molding die 210, wherein described
Multiple-printed-panel for circuit board 1100 includes one or more columns per page circuit board, and each column circuit board includes one or more circuit boards being arranged side by side
11, each circuit board 11 includes the rigid region 111 and flexible region 112 that combine, and each circuit board
111 can place of working be connected with the photosensitive element 13；
Second mold 212 and first mold 211 are molded by the die fixture 213, filling is molten
The moulding material 14 changed is in the pedestal jigsaw profiled guide slot 215 in the molding die 210, wherein corresponding to
The position of the optical window forming part 214 is prevented from filling the moulding material 14；
Solidify the moulding material 14 in the pedestal jigsaw profiled guide slot 215 to correspond to pedestal spelling
The position of sheet metal forming guide groove 215 forms disjunctor molded base 1200, wherein the disjunctor molded base 1200 is shaped in phase
The adjacent two column circuit board 11 and the two adjacent column photosensitive elements 13 are to form photosensory assembly jigsaw 1000 and in correspondence
Be formed as each photosensitive element 13 in the position of the optical window forming part 214 and the optical window 122 of passage of light is provided, wherein
The adjacent circuit board 12 of two column is arranged to its flexible region 112 away from each other and its rigid region 11 is mutually adjacently,
Wherein the pedestal jigsaw profiled guide slot 215, which has, corresponds to the disjunctor molded base 1200 adjacent to the flexible region 112
Two end sides two the first diversion trenches 2151 and corresponding to the region between the adjacent photosensitive element 13 of two column
The second diversion trench 2152, and extend between two first diversion trenches 2151 and second diversion trench 2152 and use
The moulding material 14 is filled between adjacent two photosensitive element 13 to photosensitive element 13 described in each column and is located at
Filling slot 2153 between the two neighboring optical window forming part 214, wherein the width of the bottom end of first diversion trench 2151
For a, the width of the bottom end of second diversion trench 2152 is c, and wherein a corresponds to the disjunctor molded base 1200 adjacent to institute
State the part 1200A of the disjunctor molded base of each end side of flexible region 112, outer edge 1201 and inner edges
The distance between 1202；Wherein c corresponds to the company extended between the adjacent photosensitive element 13 of two column
The part 1200B of body molded base, the distance between two inward flanges 1204, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a；
The photosensory assembly jigsaw 1000 is cut to obtain multiple photosensory assemblies 10, wherein each described photosensitive group
Part 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 is integrally
It takes shape in the circuit board 11 and the photosensitive element 13 and is formed as the photosensitive element 13 and the light of passage of light is provided
Window 122.
Also, the method may further comprise the step of: cutting and be located between the two adjacent column photosensitive elements 13
The part of the photosensory assembly 10, to obtain corresponding to the molded base 12 far from the opposite another of the flexible region 112
The part 12B of the molded base of one end, and the distance between its outer edge 1205 and inner edges 1204 is made to be b,
Middle 0.2mm≤b≤1.5a-0.2mm.I.e. from the photosensory assembly 10 between the two adjacent column photosensitive elements 13
The molded base 12 and the rigid region 111 of the circuit board 11 be suitable for being cut so that described in adjacent two column
Distal side of the photosensory assembly 10 far from the flexible region 112 is cutting side respectively, and is respectively formed cut surface 125.
The circuit board 11 includes the multiple electronics member devices for being formed in the rigid region 111 and such as being mounted by SMT technique
Part 113, in corresponding two first diversion trenches 2151 and second diversion trench 2152, without the electronics member device
Part 113, the electronic component 113 can be with concentrated settings in the filling slot 2153, thus in moulding technology, and two
Any blocking is not had in first diversion trench 2151 and second diversion trench 2152, to will not influence the molding
Material 14 is along two first diversion trenches 2151 and 2152 flow forward of the second diversion trench, to make the molding
Material 14 flow to its end 215B from its feed end 215A as far as possible within the relatively short time.
Make monomer the photosensory assembly 10 the step of in: can by the photosensory assembly jigsaw 1000 cut with
Multiple independent photosensory assemblies 10 are obtained, with the camera module for making monomer.It can also be by two of integrally connected
Or multiple photosensory assemblies 10 cut from the photosensory assembly jigsaw 1000 and separate, to be taken the photograph for making split type array
As mould group, i.e., each camera module of the described array camera module respectively has the independent photosensory assembly 10, wherein
Two or more photosensory assemblies 10 are can connect respectively to the control mainboard of same electronic equipment, two such or multiple
The image that multiple camera modules are shot can be sent to the control by the prepared array camera module of the photosensory assembly 10
Mainboard processed carries out Image Information Processing.
It is another variant embodiment according to the present invention based on one embodiment as shown in Figure 25 A
Photosensory assembly jigsaw 1000 comprising the moulding technology of invention obtains the photosensory assembly jigsaw 1000 comprising: one column or
Described in photosensitive element 13 described in circuit board 11, one or more columns per page described in multiple row, one or more columns per page protecting frame 16 and one or more
Disjunctor molded base 1200.Circuit board 11 described in each column includes one or more circuit boards 11, Ge Gesuo being arranged side by side
Stating circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Each formation of the protecting frame 16
In the photosensitive element 13 and positioned at the non-photo-sensing area 132 of the photosensitive element 13, i.e., it is located at the photosensitive area 131
Outside, each disjunctor molded base 1200 is integrally formed in the column circuit board 11, one and arranges the photosensitive element
13 and one arrange the protecting frame 16 and are formed as the optical window 122 of each offer of the photosensitive element 13 passage of light.
That is, before molding forms the disjunctor molded base 1200, on each photosensitive element 13 in advance
The protecting frame 16 is formed, the other material that can be different from the moulding material 14 is formed, and such as be can be and is coated on
The glue in the non-photo-sensing area 132 of the photosensitive element 13, or can be rigid frame, and be mounted on by glue
The non-photo-sensing area 132 of the photosensitive element 13.To be formed in the technique of the disjunctor molded base 1200 in molding,
The optical window forming part 214 is pressed on the protecting frame 16 with predetermined hardness, and the moulding material 14 of flow-like enters
When the pedestal jigsaw profiled guide slot 215, it can prevent the moulding material 14 of flow-like from flowing into the described of the photosensitive element 13
Photosensitive area 131, to form molding overlap.Such as in a specific example, the protecting frame 16 is formed by glue, tool
There are predetermined elasticity and hardness, and can be further embodied as that still there is viscosity after solidification, for adherency system
Make the grit in the photosensory assembly 10 of obtained camera module.More specifically, in some embodiments, the protecting frame 16
Shore hardness range be A50-A80, elasticity modulus range be 0.1Gpa-1Gpa.
Similarly, corresponding to the disjunctor molded base 1200 adjacent to described in the first end side of the flexible region 112
The part 1200A of disjunctor molded base, the distance between outer edge 1201 and inner edges 1202 are a；Corresponding to the company
The part of the disjunctor molded base of opposite second end side of the body molded base 1200 far from the flexible region 112
1200B, the distance between outer edge 1203 and inner edges 1204 are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a.Wherein first end side of the disjunctor molded base 1200 corresponds to the rigid region of the circuit board 11
111 and the flexible region 112 combine side, the i.e. proximal lateral adjacent to the flexible region 112；The disjunctor molds base
Second end side of seat 1200 corresponds to distal side of the circuit board 11 far from the flexible region 112.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, in Figure 25 C
It is shown, wherein can be in the disjunctor molded base 1200 in addition to first end side and the second end in cutting step
Two flanks of side are cut, so that the molded base 12 is obtained, and the molded base of corresponding second end side
Part 1200B is not cut, and obtains the institute for the part 1200C for having the disjunctor molded base in a pair of opposite flank in this way
State photosensory assembly 10.
Correspondingly, the photosensory assembly 10 includes the circuit board 11, the photosensitive element 13,16 He of protecting frame
The molded base 12.Wherein the circuit board 11 includes the rigid region 111 and the flexible region 112 combined.
The molded base 12 is integrally formed in the circuit board 11, the photosensitive element 13 and the protecting frame 16 and to be formed as
The photosensitive element 13 provides the optical window 122 of passage of light.The circuit board 11 and the photosensitive element 13 pass through a system
Column connecting line 15 is connected.The protecting frame 16 can be located at the inside of the connecting line 15, can also coat the connecting line
15 at least part.The mould corresponding to first end side of the molded base 12 adjacent to the flexible region 112
The part 12A of pedestal is moulded, the distance between outer edge 1201 and inner edges 1202 are a；Corresponding to the molded base
The part 12B of the molded base of 12 the second opposite end sides far from the flexible region 112, outer edge 1203 with
The distance between inner edges 1204 are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
As shown in fig. 25 c, correspondingly, in order to further reduce the size of the photosensory assembly 10, the molding base
At least part of the photosensory assembly 10 of opposite second end sides of the seat 12 far from the flexible region 112 be suitable for by
Removal forms cut surface 125, thus in the outer edge 1205 of the remainder after cutting the molded base 12 and its
The distance between edge 1204 is b, wherein 0.2mm≤b≤1.5a-0.2mm.
It as shown in Figure 25 B, is that the variant embodiment of above-mentioned second embodiment of the invention is obtained by moulding technology
The photosensory assembly jigsaw 1000 comprising: photosensitive element 13 described in circuit board 11, one or more columns per page described in one or more columns per page,
One or more columns per page protecting frame 16 and one or more disjunctor molded bases 1200, each protecting frame 16 are formed in pair
On the photosensitive element 13 answered.Circuit board 11 described in each column includes one or more circuit boards 11 being arranged side by side, respectively
A circuit board 11 includes the rigid region 111 and the flexible region 112 combined.Each disjunctor molding
It is adjacent that pedestal 1200 is integrally formed in the adjacent column of the photosensitive element 13, two of the adjacent column of the circuit board 11, two of two column
The protecting frame 16 and be formed as each photosensitive element 13 optical window 122 of passage of light, and the two column phase be provided
The adjacent circuit board 11 is arranged to its flexible region 112 away from each other and its rigid region 11 is mutually adjacently, and makes each institute
State two end sides that disjunctor molded base 1200 has the neighbouring flexible region 112；Wherein correspond to the disjunctor and molds base
Part 1200A of the seat 1200 adjacent to the disjunctor molded base of each end side of the flexible region 112, outer edge
The distance between 1201 and inner edges 1202 are a；The disjunctor molded base 1200 extends to adjacent positioned at two column
Between the photosensitive element 13 and the distance between two inward flanges 1204 are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a.Wherein each end side of the disjunctor molded base 1200 corresponds to the rigid region of the circuit board 11
111 and the flexible region 112 combine side, the i.e. proximal lateral adjacent to the flexible region 112；The disjunctor molds base
Seat 1200 corresponds to the circuit board 11 and extends in adjacent described photosensitive of two column far from the distal side of the flexible region 112
Between element 13.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein cutting
Cutting can be in the disjunctor molded base 1200 in addition to other lateral incisions of the part 1200A of the end side are cut, to obtain in step
To the molded base 12, wherein corresponding to the part 1200B of the molded base between the adjacent two column photosensitive element 13
Also it is cut, obtains described photosensitive group of the part 1200C that there is the disjunctor molded base in a pair of opposite flank in this way
Part 10.Corresponding to the molded base 12 adjacent to the part of the molded base of the first end side of the flexible region 112
12A, the distance between outer edge 1201 and inner edges 1202 are a；Corresponding to the molded base 12 far from the flexibility
The part 12B of the molded base of the second opposite end side in region 112, with cut surface 125, and its outer edge
The distance between 1205 and inner edges 1204 are b, wherein 0.2mm≤a≤1mm, 0.2mm≤b≤1.5a-0.2mm, are such as schemed
Shown in 25C.
As shown in Figure 26 A to Figure 27, the moulding technology of the jigsaw operation can also be used to production with two or more
The photosensory assembly 10 of the optical window 122, wherein the array that such photosensory assembly 10 can be used to make common substrate is taken the photograph
As mould group.That is, by make it is double take the photograph the photosensory assembly 10 of mould group for, the multiple-printed-panel for circuit board 1100 it is each
For circuit board 11 in molding process planning, a circuit board substrate 111 is correspondingly provided with two optical window forming parts
214, in this way in moulding technology and after completing cutting, each circuit board 11, which is formed, shares the circuit board 11
There are two the molded base 12 of the optical window 122, two photosensitive elements 13 of corresponding installation and two camera lenses 30 for tool.
And the circuit board 11 can connect to the control mainboard of an electronic equipment, so prepared battle array in this embodiment
The image that multiple camera modules are shot can be sent to the control mainboard and carry out Image Information Processing by column camera module.
It is the manufacturing method of the photosensory assembly of third preferred embodiment according to the present invention as shown in Figure 28 A to Figure 32.
In this preferred embodiment of the invention, each pedestal jigsaw profiled guide slot 215 has the first substantially parallel water conservancy diversion
Slot 2151 and the second diversion trench 2152, and extend between first diversion trench 2151 and second diversion trench 2152
Multiple filling slots 2153, wherein being formed with the filling slot 2153 between two adjacent optical window forming parts 214, such as
Illustrate in figure, the pedestal jigsaw profiled guide slot 215 has 7 filling slots, 2153,6 optical window forming parts 214
Between two adjacent filling slots 2153.The moulding material 14 is along first diversion trench 2151 and described
Two diversion trenches 2152 are flowed from its feed end 215A towards its end 215B, and 2152 size of the second diversion trench is bigger, in institute
When stating the first mold 211 and second mold 212 molding, it is arranged on the circuit board 11 in second diversion trench 2152
There are one or more unhurried current components 114, the unhurried current component 114 slows down the mold member in second diversion trench 2152
The flow velocity of material 14, so that the moulding material 14 be enable to make in curing time T along two diversion trenches 2151 and 2152
The moulding material 14 of flow-like can be full of each filling slot 2153, thus after the moulding material 14 solidification
Form the disjunctor molded base 1200.
As shown in figure 32, it is shown be this preferred embodiment according to the present invention the camera module 100 the sense
The manufacturing process schematic diagram of optical assembly jigsaw 1000, the molding die 210 are in molding state, the circuit to be molded
Plate 11 and the solid moulding material 14 prepare in place, and the solid moulding material 14 is heated, thus by the molding
Material 14 is admitted to the pedestal jigsaw profiled guide slot 215 when being molten into fluid state or semisolid semi-fluid condition, along institute
It states the first diversion trench 2151 and 2152 flow forward of the second diversion trench and is filled in the optical window forming part of adjacent two
Filling slot 2153 between 214, wherein the unhurried current component 114 being located in second diversion trench 2152 stops described the
The flowing of fluid in two diversion trenches 2152, to make the flow velocity of the moulding material 14 in second diversion trench 2152
Reduce.In this way, can all be filled with the moulding material 14 of flow-like in the pedestal jigsaw profiled guide slot 215
When, so that 14 curing molding of the moulding material of flow-like is integrally formed the circuit board described in each column using solidification process
11 and each column described in photosensitive element 13 the disjunctor molded base 1200.
It is noted that in moulding technology, the width of the bottom end of first diversion trench 2151 is a, described second
The width of the bottom end of diversion trench 2152 is d.Width a corresponds to the rigid region 111 and institute adjacent to the circuit board 11
The width of the bottom end of first diversion trench 2151 for the position that flexible region 112 combines is stated, width d is corresponding far from described
The width of the bottom end of second diversion trench 2152 of the other side of flexible region 112.When width a and d meet following condition,
0.2mm≤a≤1mm and d > 1.5a, accordingly, because being arranged in second diversion trench 2152 in moulding technology
Unhurried current component 114 is stated, achievees the purpose that flow the full pedestal jigsaw profiled guide slot 215 in moulding technology to also be able to achieve.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: one or more columns per page institute
State photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Described in each column
Circuit board 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 includes the institute combined
State rigid region 111 and the flexible region 112.Each disjunctor molded base 1200 is integrally formed in described in a column
Circuit board 11 and the column photosensitive element 13 and the optical window that each offer of the photosensitive element 13 passage of light is provided
122.Wherein correspond to the disjunctor molded base 1200 adjacent to the disjunctor mould of the first end side of the flexible region 112
The part 1200A of pedestal is moulded, the distance between outer edge 1201 and inner edges 1202 are a；It is molded corresponding to the disjunctor
The part 1200B of the disjunctor molded base of opposite second end side of the pedestal 1200 far from the flexible region 112,
The distance between outer edge 1203 and inner edges 1204 are d, wherein 0.2mm≤a≤1mm, d > 1.5a.The disjunctor molding
Second end side of pedestal 1200 corresponds to the electricity of distal side of the circuit board 11 far from the flexible region 112
Road plate 11 further includes the one or more unhurried current components 114 being arranged on its rigid region 111, and the disjunctor mould
Modeling pedestal 1200 integrally embeds the unhurried current component 114.
The available single photosensory assembly 10 after the photosensory assembly jigsaw 1000 cutting, wherein described
Photosensory assembly 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12.Wherein the circuit board 11 wraps
Include the rigid region 111 and the flexible region 112 combined.The molded base 12 is integrally formed in the electricity
Road plate 11 and the photosensitive element 13 and the optical window 122 that the offer of photosensitive element 13 passage of light is provided.The electricity
Road plate 11 is connected with the photosensitive element 13 by a series of connecting lines 15.It is neighbouring described corresponding to the molded base 12
The part 12A of the molded base of first end side of flexible region 112, between outer edge 1201 and inner edges 1202
Distance be a；The molding of the second opposite end side corresponding to the molded base 12 far from the flexible region 112
The part 12B of pedestal, the distance between outer edge 1203 and inner edges 1204 are d, wherein 0.2mm≤a≤1mm, d >
1.5a, and the portion of the molded base of opposite second end side of the molded base 12 far from the flexible region 112
12B is divided to be embedded with the unhurried current component 114.
As shown in figure 31, correspondingly, in order to further reduce the size of the photosensory assembly 10, the molding base
At least part of the photosensory assembly 10 of opposite second end sides of the seat 12 far from the flexible region 112 be suitable for by
Removal such as with cutter cutting or is abraded, to form cut surface 125, and after cutting the molded base 12
The distance between the outer edge 1205 of remainder and inner edges 1204 are b, wherein 0.2mm≤b≤d-0.2mm.It is preferred that
Ground, the part for being embedded with the molded base 12 of the unhurried current component 114 are removed, the portion of the corresponding circuit board 11
Divide and be also removed, it is preferable that 0.2mm≤b≤1.5a-0.2mm.
Correspondingly, this of the invention embodiment provides the manufacturing method of the following photosensory assembly as mould group comprising such as
Lower step:
Fixing circuit board jigsaw 1100 is in the second mold 212 of molding die 210, wherein the multiple-printed-panel for circuit board 1100
Including one or more columns per page circuit board, each column circuit board includes one or more circuit boards being arranged side by side, 11 each circuits
Plate 11 includes the rigid region 111 and flexible region 112 that combine, and each circuit board 11 can place of working be connected with
Photosensitive element 13；
Second mold 212 and the first mold 211 are molded, fills the moulding material 14 of fusing in the molding die
In pedestal jigsaw profiled guide slot 215 in 210, wherein the position for corresponding to optical window forming part 214 is prevented from filling the molding
Material 14；
Solidify the moulding material 14 in the pedestal jigsaw profiled guide slot 215 to correspond to pedestal spelling
The position of sheet metal forming guide groove 214 forms disjunctor molded base 1200, wherein the disjunctor molded base 1200 is shaped in pair
Photosensitive element 13 described in circuit board 11 and each column described in each column of Ying Yu is to form photosensory assembly jigsaw 1000 and correspond to institute
The position for stating optical window forming part 214 is formed as each photosensitive element 13 and provides the optical window 122 of passage of light, wherein described
Pedestal jigsaw profiled guide slot 215, which has, corresponds to the disjunctor molded base 1200 adjacent to the first end of the flexible region 112
First diversion trench 2151 of side and the second water conservancy diversion corresponding to the disjunctor molded base 1200 far from the flexible region 112
Slot 2152, and extend between first diversion trench 2151 and second diversion trench 2152 and be used for sense described in each column
That fills the moulding material in optical element 13 between adjacent two photosensitive elements 13 is located at the two neighboring optical window
Filling slot 2153 between forming part 214, wherein the width of the bottom end of first diversion trench is a, second diversion trench
The width of bottom end be d, wherein 0.2mm≤a≤1mm, d > 1.5a, and it is separate to correspond to the disjunctor molded base 1200
Unhurried current component 114, and the unhurried current portion are provided on the rigid region 111 of second end side of the flexible region 112
Part 114 is embedded by the disjunctor molded base 1200；
The photosensory assembly jigsaw 1000 is cut to obtain multiple photosensory assemblies 10, wherein each photosensory assembly 10
Including the circuit board 11, the photosensitive element 13 and the molded base 12, wherein the molded base 12 is integrally formed
In the circuit board 11 and the photosensitive element 13 and is formed as the photosensitive element 13 optical window of passage of light is provided
122.And preferably, in cutting step, the part for embedding the molded base 12 of the unhurried current component 114 is removed.
It is the sense of the camera module 100 of the 4th embodiment according to the present invention as shown in Figure 33 A to Figure 37
Optical assembly 10 and its manufacturing process.In this embodiment, a photosensory assembly jigsaw is equally made by way of jigsaw operation
1000, then cutting obtains the photosensory assembly 10.In this embodiment, it is distinguished with above-mentioned third embodiment,
Two adjacent column circuits plates can be such that the rigid region 111 neighboringly arranges, and make corresponding 112 phase of the flexible region
It is separate.It is highly preferred that the rigid region 111 of two adjacent column circuits plates is integrally formed to two adjacent column circuits plates
Intermediate form whole rigid region.
Correspondingly, it more specifically, the molding die 210 forms a forming cavity 213 in molding, and provides multiple
Optical window forming part 214 and one or more pedestal jigsaw profiled guide slots 215, each pedestal jigsaw profiled guide slot 215 include
Positioned at substantially parallel first diversion trench 2151 arranged along the longitudinal direction at both ends, positioned at two first diversion trenches
The second diversion trench 2152 among 2151, and extend in two first diversion trenches 2151 and second diversion trench
Transversely arranged multiple filling slots 2153 between 2152, wherein the two column filling slots 2153 each extend over described in two
Between first diversion trench 2151 and second diversion trench 2152.
In this embodiment, it in moulding technology, is provided in larger second diversion trench 2152 of size slow
Stream unit 114, to reduce the fluid flow rate in second diversion trench 2152, thus 14 edge of moulding material
Two first diversion trenches 2151 and intermediate second diversion trench 2152 from its feed end 215A towards its end
215B flowing, and the moulding material 14 can be full of each filling slot 2153, thus solid in the moulding material 14
The disjunctor molded base 1200 is formed after change.
In this embodiment in accordance with the invention, the disjunctor molded base 1200 is shaped in described in two adjacent column
Circuit board 11 and the adjacent two column photosensitive elements 13 with formed photosensory assembly jigsaw 1000 and correspond to the optical window at
The position in type portion 214 is formed as each photosensitive element 13 and provides the optical window 122 of passage of light.The two column photosensitive elements
The unhurried current component 114 is provided on the rigid region 111 of the circuit board 11 between 13, to suitably hinder institute
State the flowing of the moulding material 14 in the second diversion trench 2152.
As shown in figure 37, the molding die 210 is in molding state, the circuit board 11 to be molded and solid
The moulding material 14 prepares in place, and the solid moulding material 14 is heated, so that the moulding material 14 is molten into
The pedestal jigsaw profiled guide slot 215 is admitted to when fluid state or semisolid semi-fluid condition, along first diversion trench
2151 and 2152 flow forward of the second diversion trench and the institute being filled between the optical window forming part 214 of adjacent two
Filling slot 2153 is stated, wherein the moulding material so that in second diversion trench 2152 is arranged in the unhurried current component 114
14 flows decrease.
As shown in figure 34 to figure 36, the photosensory assembly jigsaw 1000, which is made, further to be cut, to be made
The single photosensory assembly 10.Each photosensory assembly 10 includes at least one circuit board 11, and at least one is described photosensitive
Element 13 and the molded base 12 for being integrally molded to the circuit board 11 and the photosensitive element 13.Adjacent two
It arranges integrally formed rigid region 111 between the circuit board 11 to be separated, and preferably, the unhurried current component will be embedded
The part of 114 molded base 12 removes.
In moulding technology, the width of the bottom end of each first diversion trench 2151 is a, second diversion trench
The width of 2152 bottom end is c.Width a corresponds to the rigid region 111 and the flexibility adjacent to the circuit board 11
The width of the bottom end of first diversion trench 2151 for the position that region 112 combines, width d are corresponding far from the flex region
The width of the bottom end of second diversion trench 2152 of the other side in domain 112.Width a and d meet following condition, i.e. and 0.2mm≤
A≤1mm and d > 1.5a is arranged in second diversion trench 2152 on the rigid region 111 of the circuit board 11
Unhurried current component 114 is stated, the moulding material 14 of flow-like can be along two first diversion trenches 2151 in outside in
Between 2152 flow forward of the second diversion trench and before the moulding material 14 solidifies will the entire pedestal jigsaw at
Type guide groove 215 is full of the moulding material 14.
Correspondingly, moulding technology of the invention obtains the photosensory assembly jigsaw 1000 comprising: one or more columns per page institute
State photosensitive element 13 described in circuit board 11, one or more columns per page and one or more disjunctor molded bases 1200.Described in each column
Circuit board 11 includes one or more circuit boards 11 being arranged side by side, and each circuit board 11 includes the institute combined
State rigid region 111 and the flexible region 112.It is adjacent that each disjunctor molded base 1200 is integrally formed in two column
The circuit board 11 and the two adjacent photosensitive elements 13 of column and be formed as each photosensitive element 13 to provide light logical
The optical window 122 on road, and the adjacent circuit board 11 of two column be arranged to its flexible region 112 away from each other and its just
Property region 11 be mutually adjacently, make each disjunctor molded base 1200 that there are two ends of the neighbouring flexible region 112
Side；Wherein correspond to the disjunctor of the disjunctor molded base 1200 adjacent to each end side of the flexible region 112 to mold
The part 1200A of pedestal, the distance between outer edge 1201 and inner edges 1202 are a；The disjunctor molded base 1200
It extends between the adjacent photosensitive element 13 of two column and the distance between two inward flanges 1204 is d, wherein
0.2mm≤a≤1mm, d > 1.5a, and the circuit board 11 between the two adjacent photosensitive elements 13 of column it is described just
Be provided with the unhurried current component 114 on property region 111, the unhurried current component 114 by the disjunctor molded base 1200 integrally
Embedding.
Correspondingly, as shown in figure 36, the photosensory assembly 10 obtained after cutting comprising the circuit board 11, it is described
Photosensitive element 13 and the molded base 12.After cutting the photosensory assembly jigsaw 1000, make each photosensory assembly 10
The second end side that similar above-described embodiment there is the first end side that do not cut and cutting to obtain.Corresponding to the molding base
Seat 12 adjacent to the molded base of the first end side of the flexible region 112 part 12A, outer edge 1201 and its in
The distance between edge 1202 is a；Opposite second end corresponding to the molded base 12 far from the flexible region 112
The part 12B of the molded base of side forms cut surface 125, and between outer edge 1205 and inner edges 1204
Distance is b, wherein 0.2mm≤a≤1mm, 0.2mm≤b≤d-0.2mm, it is preferable that 0.2mm≤b≤1.5a-0.2mm.
That is, in this embodiment of the invention, because setting is in second diversion trench 2151 and 2152
Unhurried current component 114 is stated, the fluid flow rate in second diversion trench 2152 is reduced, and the moulding material 14 can be from three
The feed end 215A flow forward of a diversion trench 2151 and 2152 and full of the entire pedestal jigsaw profiled guide slot
215 diversion trench 2151 and 2152 and the filling slot 2153.The moulding material 14 before curing can be along three
A diversion trench 2151 and 2152 flow to end 215B from its feed end 215A.And in the viscosity of the moulding material 14
Before reaching high value and solidifying, the moulding material 14 can fill up the pedestal jigsaw profiled guide slot 215, thus
Prevent the connecting line 15 between the circuit board 11 and the photosensitive element 13 higher described by the viscosity of flow forward
Moulding material 14 damages.And the fluid in three diversion trenches 2151 and 2152 is substantially with the radial preceding stream of identical step
It is dynamic, avoid the moulding material 14 in a certain diversion trench from flowing to another diversion trench and hinder mould described in another diversion trench
14 flow forward of moulding material.Nor turbulent flow and sinuous flow can be generated, cause to connect the circuit board 11 and the photosensitive element
13 connecting line 15 it is irregular swing and cause deform and damage.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as lifting
Example and be not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention is
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or repair
Change.
Claims (49)
1. the manufacturing method of the photosensory assembly of camera module comprising following steps:
(a) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes one or more columns per page electricity
Road plate, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes the rigidity combined
Region and flexible region, and each circuit board can place of working be connected with photosensitive element；
(b) second mold and the first mold are molded, the moulding material for filling fusing is spelled in the pedestal in the molding die
In sheet metal forming guide groove, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(c) solidify the moulding material in the pedestal jigsaw profiled guide slot to lead corresponding to pedestal jigsaw molding
The position of slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in circuit board described in each column corresponded to
With photosensitive element described in each column to form photosensory assembly jigsaw and be formed as each in the position for corresponding to the optical window forming part
The photosensitive element provides the optical window of passage of light, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to disjunctor molding
Pedestal is adjacent to the first diversion trench of the first end side of the flexible region and corresponding to the disjunctor molded base far from described soft
Second diversion trench in property region, and multiple filling slots between first diversion trench and second diversion trench are extended in,
Wherein each optical window forming part is between two adjacent filling slots, wherein the bottom end of first diversion trench
Width is a, and the width of the bottom end of second diversion trench is c, and wherein it is neighbouring described to correspond to the disjunctor molded base by width a
The distance between the outer edge of the part of the disjunctor molded base of first end side of flexible region and inner edges；It is wherein wide
Spend the disjunctor molded base of opposite second end side of the c corresponding to the disjunctor molded base far from the flexible region
The distance between partial outer edge and inner edges, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
2. according to the method described in claim 1, further comprising the steps of: the cutting photosensory assembly jigsaw to obtain multiple photosensitive groups
Part, wherein each photosensory assembly includes the circuit board, the photosensitive element and the molded base, wherein the molding
Pedestal is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element and provides the institute of passage of light
State optical window.
3. according to the method described in claim 1, wherein 0.7a≤c≤1.3a.
4. according to the method described in claim 2, further comprising the steps of: cutting corresponds to the molded base far from the flex region
The part of the photosensory assembly of the second opposite end side in domain so that the outer edge of the part of the remaining molded base with
The distance between inner edges are b, wherein 0.2mm≤b≤1.5a-0.2mm.
5. according to claim 1 to any method in 4, wherein the rigid region of each circuit board is neighbouring
First end side of the flexible region is convenient for the pressing distance W pressed there are the pressing block of the first mold described in moulding technology,
Its numberical range is 0.1~1mm of electricity.
6. according to claim 1 to the method any in 4, wherein the rigid region one of circuit board described in each column at
Type and form whole rigid region jigsaw.
7. the manufacturing method of the photosensory assembly of camera module comprising following steps:
(A) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes multiple row circuit board, often
Column circuits plate includes one or more circuit board being arranged side by side, and each circuit board includes the rigid region combined and soft
Property region, and each circuit board can place of working be connected with photosensitive element；
(B) second mold and the first mold are molded, the moulding material for filling fusing is spelled in the pedestal in the molding die
In sheet metal forming guide groove, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(C) solidify the moulding material in the pedestal jigsaw profiled guide slot to lead corresponding to pedestal jigsaw molding
The position of slot forms disjunctor molded base, wherein the disjunctor molded base be shaped in adjacent two column circuit boards and
The two adjacent column photosensitive elements are to form photosensory assembly jigsaw and be formed as in the position for corresponding to the optical window forming part
Each photosensitive element provides the optical window of passage of light, wherein described two arrange the adjacent circuit board layout into its flex region
Domain away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to the disjunctor mold
Pedestal is adjacent described photosensitive adjacent to two the first diversion trenches of two end sides of the flexible region and corresponding to two column
Second diversion trench in the region between element, and extend between two first diversion trenches and second diversion trench
Multiple filling slots, wherein each optical window forming part is between two adjacent filling slots, wherein described first leads
The width of the bottom end of chute is a, and the width of the bottom end of second diversion trench is c, and wherein a corresponds to the disjunctor molded base
The part of the disjunctor molded base of each end side of the neighbouring flexible region, between outer edge and inner edges away from
From；Wherein c corresponds to the portion of the disjunctor molded base extended between the adjacent photosensitive element of two column
Divide, the distance between two inward flanges, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
8. according to the method described in claim 7, further comprising the steps of: the cutting photosensory assembly jigsaw to obtain multiple photosensitive groups
Part, wherein each photosensory assembly includes the circuit board, the photosensitive element and the molded base, wherein the molding
Pedestal is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element and provides the institute of passage of light
State optical window.
9. according to the method described in claim 7, wherein 0.7a≤c≤1.3a.
10. according to the method described in claim 8, further comprising the steps of: cutting is located at the two adjacent column photosensitive elements
Between the photosensory assembly part, to obtain corresponding to the molded base far from the opposite another of the flexible region
The part of the molded base of end side, and make the distance between its outer edge and inner edges be b, wherein 0.2mm≤b≤
1.5a-0.2mm。
11. according to the method any in claim 7 to 10, wherein the rigid region of each circuit board is in neighbour
There are the pressing blocks of the first mold described in moulding technology convenient for the pressing distance of pressing for first end side of the nearly flexible region
W, numberical range are 0.1~1mm of electricity.
12. according to the method any in claim 7 to 10, wherein the two adjacent column circuit boards is described rigid
Property region be integrally formed and form whole rigid region jigsaw.
13. the photosensory assembly of camera module characterized by comprising
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive element and to be formed as described
The optical window of photosensitive element offer passage of light；Wherein correspond to the molded base adjacent to the first end side of the flexible region
The part of the molded base, the distance between outer edge and inner edges are a；Corresponding to the molded base far from described
The part of the molded base of the second opposite end side of flexible region, the distance between outer edge and inner edges are c,
Wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
14. photosensory assembly according to claim 13, wherein 0.7a≤c≤1.3a.
15. photosensory assembly according to claim 13, wherein the institute of the second opposite end side far from the flexible region
The part for stating photosensory assembly is suitable for being cut, the outer edge of the remainder after cutting the molded base and its inner edge
The distance between edge is b, wherein 0.2mm≤b≤1.5a-0.2mm.
16. photosensory assembly according to claim 13, wherein the circuit board further includes multiple electronic components, wherein institute
Multiple electronic components are stated to be arranged in addition to the neighbouring flexible region and two end sides far from the flexible region, the rigidity
At least flank positioned at the photosensitive element two sides on region, wherein the molded base integrally embeds the electronics member
Device.
17. any photosensory assembly in 3 to 16 according to claim 1, wherein in the molded base adjacent to the flexibility
First end side in region, between the outer edge of the molded base and the outer edge of the rigid region there are in moulding technology at
The pressing block of pattern tool is convenient for being pressed on the pressing distance W of the rigid region, and numberical range is 0.1~1mm of electricity.
18. any photosensory assembly in 3 to 16 according to claim 1, wherein further including filter element and filter element mirror
Seat, wherein the filter element is assembled in the filter element microscope base, the filter element mirror seat set is loaded on the molded base
Top side.
19. any photosensory assembly in 3 to 16 according to claim 1 is arranged at described wherein further including protecting frame
On photosensitive element, the molded base is integrally molded to the circuit board, the photosensitive element and the protecting frame.
20. the photosensory assembly of camera module characterized by comprising
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive element and to be formed as described
The optical window of photosensitive element offer passage of light；Wherein correspond to the molded base adjacent to the first end side of the flexible region
The part of the molded base, the distance between outer edge and inner edges are a；Corresponding to the molded base far from described
The part of the molded base of the second opposite end side of flexible region has cut surface, and its outer edge and inner edges
The distance between be b, wherein 0.2mm≤a≤1mm, 0.2mm≤b≤1.5a-0.2mm.
21. photosensory assembly according to claim 20, wherein the circuit board further includes multiple electronic components, wherein institute
Multiple electronic components are stated to be arranged in addition to the neighbouring flexible region and two end sides far from the flexible region, the rigidity
At least flank positioned at the photosensitive element two sides on region, wherein the molded base integrally embeds the electronics member
Device.
22. according to the photosensory assembly any in claim 20 to 21, wherein in the molded base adjacent to the flexibility
First end side in region, between the outer edge of the molded base and the outer edge of the rigid region there are in moulding technology at
The pressing block of pattern tool is convenient for being pressed on the pressing distance W of the rigid region, and numberical range is 0.1~1mm of electricity.
23. according to the photosensory assembly any in claim 20 to 21, wherein further including filter element and filter element mirror
Seat, wherein the filter element is assembled in the filter element microscope base, the filter element mirror seat set is loaded on the molded base
Top side.
24., wherein further including protecting frame, being arranged at described according to the photosensory assembly any in claim 20 to 21
On photosensitive element, the molded base is integrally molded to the circuit board, the photosensitive element and the protecting frame.
25. the photosensory assembly jigsaw of camera module characterized by comprising
One or more columns per page circuit board, each column circuit board include one or more circuit boards being arranged side by side, each circuit board
Including the rigid region and flexible region combined；
One or more columns per page photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the column circuit board and one
It arranges the photosensitive element and is formed as each photosensitive element and the optical window of passage of light is provided；Wherein correspond to the disjunctor mould
Pedestal is moulded adjacent to the part of the disjunctor molded base of the first end side of the flexible region, outer edge and inner edges it
Between distance be a；The disjunctor of the second opposite end side corresponding to the disjunctor molded base far from the flexible region
The part of molded base, the distance between outer edge and inner edges are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤
1.5a。
26. photosensory assembly according to claim 25, wherein the photosensory assembly jigsaw include circuit board described in multiple row, it is more
The photosensitive element and multiple disjunctor molded bases are arranged, wherein in the two adjacent column circuit boards, a column circuit
Second end side of the disjunctor molded base far from the flexible region on plate is towards described in another arrange on the circuit board
Disjunctor molded base is adjacent to the first end side of the flexible region.
27. photosensory assembly jigsaw according to claim 25, wherein 0.7a≤c≤1.3a.
28. according to the photosensory assembly jigsaw any in claim 25 to 27, wherein each circuit board is described rigid
Property in the first end side of the neighbouring flexible region, there are the pressing blocks of the first mold described in moulding technology convenient for pressing in region
Pressing distance W, numberical range is 0.1~1mm of electricity.
29. according to the photosensory assembly jigsaw any in claim 25 to 27, wherein a column circuit board is described rigid
Property region be integrally formed and form whole rigid region jigsaw.
30. the photosensory assembly jigsaw of camera module characterized by comprising
Multiple row circuit board, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes phase
In conjunction with rigid region and flexible region；
Multiple row photosensitive element；And
One or more disjunctor molded bases, each disjunctor molded base are integrally formed in the adjacent circuit of two column
Plate and two arranges the adjacent photosensitive element and is formed as the optical window of each photosensitive element offer passage of light, and described
The two adjacent circuit board layouts of column at its flexible region away from each other and its rigid region is mutually adjacently, make each company
Body molded base has two end sides of the neighbouring flexible region；Wherein correspond to the disjunctor molded base adjacent to described soft
Property region each end side the disjunctor molded base part, the distance between outer edge and inner edges be a；It is described
Disjunctor molded base extends between the adjacent photosensitive element of two column and the distance between two inward flanges are
C, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
31. photosensory assembly jigsaw according to claim 30, wherein the rigid region of each circuit board is in neighbour
There are the pressing blocks of the first mold described in moulding technology convenient for the pressing distance of pressing for first end side of the nearly flexible region
W, numberical range are 0.1~1mm of electricity.
32. according to the photosensory assembly jigsaw any in claim 30 to 31, wherein the circuit that two column are adjacent
The rigid region of plate is integrally formed and forms whole rigid region jigsaw.
33. camera module characterized by comprising
Camera lens；
Circuit board comprising the rigid region and flexible region combined；
Photosensitive element；And
Molded base, wherein the molded base is integrally formed in the circuit board and the photosensitive element and to be formed as described
Photosensitive element provides the optical window of passage of light, wherein the camera lens is located at the photosensitive path of the photosensitive element；Wherein correspond to
The molded base is adjacent to the part of the molded base of the first end side of the flexible region, outer edge and inner edges
The distance between be a；The molding base of the second opposite end side corresponding to the molded base far from the flexible region
The part of seat, the distance between outer edge and inner edges are c, wherein 0.2mm≤a≤1mm, 0.2mm≤c≤1.5a.
34. camera module according to claim 33, wherein 0.7a≤c≤1.3a.
35. camera module according to claim 33, wherein the circuit board further includes multiple electronic components, wherein institute
Multiple electronic components are stated to be arranged in addition to the neighbouring flexible region and two end sides far from the flexible region, the rigidity
At least flank positioned at the photosensitive element two sides on region, wherein the molded base integrally embeds the electronics member
Device.
36. camera module according to claim 33, wherein being shaped in the circuit board and the photosensitive element
The molded base cuts from disjunctor molded base obtained in jigsaw moulding technology and obtains, and the molded base is separate
The second opposite end side of the flexible region corresponds to cutting side.
37. camera module according to claim 36, wherein corresponding to the molded base far from the flexible region
The cutting side of the molded base of the second opposite end side, the distance between outer edge and inner edges are c, wherein
0.2mm≤c≤1.5a-0.2mm。
38. according to the camera module any in claim 33 to 37, wherein further including filter element and filter element mirror
Seat, wherein the filter element is assembled in the filter element microscope base, the filter element mirror seat set is loaded on the molded base
Top side.
39. the camera module according to claim 38, wherein the lens assembling is in the molded base；Or the mirror
Head is assembled in the filter element microscope base；Or the lens assembling is in the molded base and the filter element microscope base.
40. the camera module according to claim 38, wherein further including driver, the lens assembling is in the driving
Device, the driver are assembled in the molded base；Or the driver is assembled in the filter element microscope base；Or it is described
Driver is assembled in the molded base and the filter element microscope base.
41. the camera module according to claim 38, wherein further including fixed lens barrel, the lens assembling is in the fixation
Lens barrel, the fixed lens barrel are assembled in the molded base；Or the fixed lens barrel is assembled in the filter element microscope base；Or
Fixed lens barrel described in person is assembled in the molded base and the filter element microscope base.
42. molding die, to make the photosensory assembly jigsaw for being applied to camera module comprising suitable for mutually separate with it is mutually closely sealed
First mold and the second mold, wherein first and second mold forms forming cavity, and the shaping mould when mutually closely sealed
Have and is led in the forming cavity configured with optical window forming part and the pedestal jigsaw formed around the optical window forming part molding
It is suitable for fixing circuit board jigsaw in slot and the forming cavity, wherein the multiple-printed-panel for circuit board includes one or more columns per page circuit board, often
Column circuits plate includes one or more circuit boards being arranged side by side, and each circuit board includes the rigid region combined and flexibility
Region, and each circuit board can place of working be connected with photosensitive element, the pedestal jigsaw profiled guide slot is suitable for filling the mould
Moulding material is to form disjunctor molded base in the position for corresponding to the pedestal jigsaw profiled guide slot, and wherein the disjunctor molds base
Seat is shaped in each column circuit board corresponded to and each column photosensitive element to form the photosensory assembly jigsaw and in correspondence
Be formed as each photosensitive element in the position of the optical window forming part and the optical window of passage of light is provided, wherein the pedestal jigsaw
Profiled guide slot, which has, to be corresponded to the disjunctor molded base adjacent to the first diversion trench of the first end side of the flexible region and corresponds to
Second diversion trench of the disjunctor molded base far from the flexible region, and extend in first diversion trench and described second and lead
Multiple filling slots between chute, wherein each optical window forming part is between two adjacent filling slots, wherein
The width of the bottom end of first diversion trench is a, and the width of the bottom end of second diversion trench is c, wherein 0.2mm≤a≤
1mm, 0.2mm≤c≤1.5a.
43. molding die, to make the photosensory assembly jigsaw for being applied to camera module comprising suitable for mutually separate with it is mutually closely sealed
First mold and the second mold, wherein first and second mold forms forming cavity, and the shaping mould when mutually closely sealed
Have and is led in the forming cavity configured with optical window forming part and the pedestal jigsaw formed around the optical window forming part molding
It is suitable for fixing circuit board jigsaw in slot and the forming cavity, wherein the multiple-printed-panel for circuit board includes multiple row circuit board, every column circuits
Plate includes one or more circuit board being arranged side by side, each circuit board be include the rigid region combined and flex region
Domain, and each circuit board can place of working be connected with photosensitive element, wherein the pedestal jigsaw profiled guide slot be suitable for fill mould
Moulding material is to form disjunctor molded base in the position for corresponding to the pedestal jigsaw profiled guide slot, and wherein the disjunctor molds base
Seat be shaped in adjacent two arrange the circuit board and adjacent two arrange the photosensitive element with formed the photosensory assembly jigsaw and
Position corresponding to the optical window forming part is formed as each photosensitive element and provides the optical window of passage of light, wherein the two column phase
The adjacent circuit board layout at its flexible region away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw forms
Guide groove, which has, to be corresponded to the disjunctor molded base adjacent to two the first diversion trenches of two end sides of the flexible region and corresponds to
Second diversion trench in the region between the adjacent photosensitive element of two column, and extend in two first diversion trenches and institute
State multiple filling slots between the second diversion trench, wherein each optical window forming part in two adjacent filling slots it
Between, wherein the width of the bottom end of first diversion trench is a, the width of the bottom end of second diversion trench is c, wherein 0.2mm
≤ a≤1mm, 0.2mm≤c≤1.5a.
44. the manufacturing method of the photosensory assembly of camera module comprising following steps:
(1) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes one or more columns per page electricity
Road plate, each column circuit board include one or more circuit boards being arranged side by side, and each circuit board includes the rigidity combined
Region and flexible region, and each circuit board can place of working be connected with photosensitive element；
(2) second mold and the first mold are molded, the moulding material for filling fusing is spelled in the pedestal in the molding die
In sheet metal forming guide groove, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；
(3) solidify the moulding material in the pedestal jigsaw profiled guide slot to lead corresponding to pedestal jigsaw molding
The position of slot forms disjunctor molded base, wherein the disjunctor molded base is shaped in circuit board described in each column corresponded to
With photosensitive element described in each column to form photosensory assembly jigsaw and be formed as each in the position for corresponding to the optical window forming part
The photosensitive element provides the optical window of passage of light, wherein the pedestal jigsaw profiled guide slot, which has, corresponds to disjunctor molding
Pedestal is adjacent to the first diversion trench of the first end side of the flexible region and corresponding to the disjunctor molded base far from described soft
Second diversion trench in property region, and multiple filling slots between first diversion trench and second diversion trench are extended in,
Wherein each optical window forming part is between two adjacent filling slots, wherein the bottom end of first diversion trench
Width is a, and the width of the bottom end of second diversion trench is d, wherein 0.2mm≤a≤1mm, d > 1.5a, and corresponds to institute
It states and is provided with unhurried current component, and institute on the rigid region of the disjunctor molded base far from the second end side of the flexible region
Unhurried current component is stated to be embedded by the disjunctor molded base.
45. it is multiple photosensitive to obtain according to the method for claim 44, to further comprise the steps of: the cutting photosensory assembly jigsaw
Component, wherein each photosensory assembly includes the circuit board, the photosensitive element and the molded base, wherein the mould
Modeling pedestal is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element and provides passage of light
The optical window.
46. according to the method for claim 44, further comprising the steps of: the removal disjunctor molded base embeds the unhurried current portion
A part of part.
47. the manufacturing method of the photosensory assembly of camera module comprising following steps:
(α) fixing circuit board jigsaw is in the second mold of molding die, wherein the multiple-printed-panel for circuit board includes multiple row circuit board, often
Column circuits plate includes one or more circuit board being arranged side by side, each circuit board be include the rigid region that combines with
Flexible region, and each circuit board can place of working be connected with photosensitive element；
(β) molds second mold and the first mold, and the moulding material for filling fusing is spelled in the pedestal in the molding die
In sheet metal forming guide groove, wherein the position for corresponding to optical window forming part is prevented from filling the moulding material；And
(γ) solidifies the moulding material in the pedestal jigsaw profiled guide slot to correspond to pedestal jigsaw molding
The position of guide groove forms disjunctor molded base, wherein the disjunctor molded base is shaped in the two adjacent column circuit boards
With the two adjacent column photosensitive elements to form photosensory assembly jigsaw and be formed in the position for corresponding to the optical window forming part
The optical window of passage of light is provided for each photosensitive element, wherein described two arrange the adjacent circuit board layout into its flexibility
Region away from each other and its rigid region is mutually adjacently, wherein the pedestal jigsaw profiled guide slot have correspond to the disjunctor mould
Pedestal is moulded adjacent to two the first diversion trenches of two end sides of the flexible region and the sense adjacent corresponding to two column
Second diversion trench in the region between optical element, and extend between two first diversion trenches and second diversion trench
Multiple filling slots, wherein each optical window forming part is between two adjacent filling slots, wherein described first
The width of the bottom end of diversion trench is a, and the width of the bottom end of second diversion trench is d, wherein 0.2mm≤a≤1mm, d >
1.5a, and in being provided with unhurried current component in second diversion trench on the hardboard.
48. it is multiple photosensitive to obtain according to the method for claim 47, to further comprise the steps of: the cutting photosensory assembly jigsaw
Component, wherein each photosensory assembly includes the circuit board, the photosensitive element and the molded base, wherein the mould
Modeling pedestal is integrally formed in the circuit board and the photosensitive element and to be formed as the photosensitive element and provides passage of light
The optical window.
49. according to the method for claim 48, further comprising the steps of: removal is located at the two adjacent column photosensitive elements
Between the disjunctor molded base part and remove embed it is described unhurried current component a part.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810764.0A CN109495671B (en) | 2017-09-11 | 2017-09-11 | Image pickup module, photosensitive assembly thereof and manufacturing method |
| TW107131707A TWI699118B (en) | 2017-09-11 | 2018-09-10 | Camera module and its photosensitive element, electronic equipment, molding die and manufacturing method |
| US16/645,537 US11433584B2 (en) | 2017-09-11 | 2018-09-11 | Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof |
| EP18854529.7A EP3684045A4 (en) | 2017-09-11 | 2018-09-11 | Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof |
| PCT/CN2018/104915 WO2019047960A1 (en) | 2017-09-11 | 2018-09-11 | Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof |
| US17/877,391 US20220362978A1 (en) | 2017-09-11 | 2022-07-29 | Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810764.0A CN109495671B (en) | 2017-09-11 | 2017-09-11 | Image pickup module, photosensitive assembly thereof and manufacturing method |
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| CN109495671A true CN109495671A (en) | 2019-03-19 |
| CN109495671B CN109495671B (en) | 2023-12-26 |
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| CN201710810764.0A Active CN109495671B (en) | 2017-09-11 | 2017-09-11 | Image pickup module, photosensitive assembly thereof and manufacturing method |
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