CN205545597U - Module of making a video recording based on integrative packaging technology - Google Patents
Module of making a video recording based on integrative packaging technology Download PDFInfo
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- CN205545597U CN205545597U CN201620269534.9U CN201620269534U CN205545597U CN 205545597 U CN205545597 U CN 205545597U CN 201620269534 U CN201620269534 U CN 201620269534U CN 205545597 U CN205545597 U CN 205545597U
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Abstract
A module of making a video recording based on integrative packaging technology, it includes encapsulation photosensitive assembly and a camera lens, encapsulation photosensitive assembly includes a potting part and a photosensitive assembly, photosensitive assembly further includes a sensitization chip, a circuit board, the sensitization chip with circuit board turn -on connection, potting part encapsulate in surface of circuit board with an at least side and/or the bottom surface of circuit board, thereby reinforcing the make a video recording intensity and the heat dissipation of module to reduce cutting procedure.
Description
Technical field
This utility model relates to a camera module, particularly relates to a camera module based on integral packaging technique, molds in wiring board side or bottom.
Background technology
Conventional mobile phone camera module encapsulation wiring board posts electric capacity and working of plastics in general above, and capacitance resistance ware and working of plastics are all individually present, and the most not overlapping, working of plastics plays a supportive role.This kind of scheme is primarily present following problem:
1, bond in the circuit board by glue after plastic stent is separately formed, easily because the out-of-flatness of plastic stent itself and the assembling attached tilt, ultimately cause module；2, capacitance resistance ware exists in the same space with sensitive chip, and the dust of capacitance resistance ware part is not easy to clean up, and then it is bad to affect module final stain stain；3, wiring board some structural strength is the strongest；4, size is difficult to the least, especially lateral dimension, and the size between two camera modules has the waste compared, and have impact on the size of entirety.
Summary of the invention
The purpose of this utility model is to provide a camera module based on integral packaging technique, uses wiring board side or bottom surface molding scheme, it is possible to strengthen module by force intensity.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side molding scheme, by increasing capacitance it is possible to increase wiring board cutting efficiency.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side molding scheme, makes module design more flexible.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses molding scheme bottom wiring board, it is possible to strengthen modular structure intensity.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side or bottom surface molding scheme, it is possible to promote module radiating efficiency.
Another object of the present utility model is to provide a camera module based on integral packaging technique, use wiring board side or bottom surface molding scheme, the sensitive chip surface of module and the depth of parallelism of the upper surface of encapsulation part, and the flatness of encapsulation part upper surface can be improved.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side or bottom surface molding scheme, it is possible to reduce manufacturing procedure, improves production efficiency.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side or bottom surface molding scheme, it is possible to make module overall dimensions less.
Another object of the present utility model is to provide a camera module based on integral packaging technique, uses wiring board side or bottom surface molding scheme, it is possible to after preventing module molding, dust enters affects performance.
To achieve these goals, this utility model provides a camera module based on integral packaging technique,
Camera module based on integral packaging technique, it is characterized in that, including at least one encapsulation photosensory assembly and at least one camera lens, described encapsulation photosensory assembly includes at least one encapsulation part and at least one photosensory assembly, described photosensory assembly farther includes at least one sensitive chip, at least one wiring board, described sensitive chip and described wiring board can conductively connect, described camera lens is positioned at the photosensitive path of described sensitive chip, and described encapsulation part is packaged in a top surface of described wiring board and at least one side of described wiring board integratedly.
In one embodiment, described encapsulation part also encapsulates a bottom surface of described wiring board.
In one embodiment, the bottom surface of described wiring board is close to be provided with a stiffening plate.
In one embodiment, described encapsulation part encapsulates at least one sidepiece of described stiffening plate.
In one embodiment, described encapsulation part encapsulates bottom the one of described stiffening plate.
In one embodiment, described encapsulation part is also packaged in the non-photo-sensing region of described sensitive chip.
In one embodiment, described sensitive chip and described wiring board are connected by one group of lead-in wire, and wherein said encapsulation part is coated with described lead-in wire.
In one embodiment, it also includes at least one optical filter, and wherein said encapsulation part is as the support carrying described optical filter.
In one embodiment, described optical filter is superimposed on described sensitive chip, and described encapsulation part is also packaged in described optical filter.
In one embodiment, the top of described encapsulation part upwardly extends formation at least one holding tank respectively, for accommodating described camera lens.
In one embodiment, described camera module based on integral packaging technique also includes a motor, and described motor is installed on described encapsulation part, and is connected with the conducting of described wiring board.
In one embodiment, described encapsulation part has electric property, connects described motor and described wiring board to be turned on.
In one embodiment, described wiring board is additionally provided with at least one perforation, and described encapsulation part extends imbeds described perforation.
In one embodiment, described packaging technology is moulding technology, such as injection or mould pressing process.
In one embodiment, described camera module is to focus camera module.
In one embodiment, described camera module is automatic focusing camera module.
Accompanying drawing explanation
Fig. 1 is the side sectional view of the preferred embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 2 is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 3 A is that the molding that correlation technique is formed forms camera module schematic diagram.
Fig. 3 B is that molding traditional in correlation technique forms camera module schematic diagram.
Fig. 3 C is that molding traditional in correlation technique forms camera module schematic diagram.
Fig. 3 D is that molding traditional in correlation technique forms camera module schematic diagram.
Fig. 3 E is that molding traditional in correlation technique forms camera module schematic diagram.
Fig. 4 A is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 4 B is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 5 is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 6 is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 7 A is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 7 B is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 8 A is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 8 B is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 9 A is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Fig. 9 B is the side sectional view of another embodiment according to of the present utility model one camera module based on integral packaging technique.
Figure 10 is motor and the side sectional view of wiring board conduction mode of the above-described embodiment according to of the present utility model one camera module based on integral packaging technique.
Figure 11 is motor and the side sectional view of wiring board another kind conduction mode of the above-described embodiment according to of the present utility model one camera module based on integral packaging technique.
Figure 12 is motor and the side sectional view of wiring board another kind conduction mode of the above-described embodiment according to of the present utility model one camera module based on integral packaging technique.
Detailed description of the invention
Hereinafter describe and be used for disclosing this utility model so that those skilled in the art are capable of this utility model.Preferred embodiment in below describing is only used as citing, it may occur to persons skilled in the art that other obvious modification.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that is, in exposure of the present utility model, term " longitudinally ", " laterally ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, the most above-mentioned term is it is not intended that to restriction of the present utility model.
It is understood that term " " is interpreted as " at least one " or " one or more ", the most in one embodiment, the quantity of one element can be one, and in a further embodiment, the quantity of this element can be multiple, term " " is it is not intended that logarithm quantitative limitation.
Owing to described module of the present utility model is to be formed based on packaging technology integral packaging, in each embodiment of the present utility model, explanation as a example by the moulding technology in packaging technology.Therefore, in order to more clearly disclose content of the present utility model, first moulding technology is made brief description.Moulding technology typically has two kinds of ways of realization, and one is MOB (Molding On Board), say, that encapsulation part be formed only on the wiring board of module；Another kind is MOC (Molding On Chip), say, that encapsulation part be formed on wiring board and the sensitive chip of module.This utility model will enumerate embodiment in follow-up exposure respectively from different molding ways of realization.
Additionally, moulding technology typically from the difference of equipment for have injection and mold.Injection also can dispensing molding die platen press and casting die.Injection (mo(u)lding) machine (being called for short injector or injection machine) is to utilize mould for plastics to make the main former of variously-shaped plastic thermoplastic or thermosetting material, and injection moulding is realized by injection machine and mould.Mold pressing is the abbreviation of compression molding, also known as compression moulding.Moulding material such as plastics or rubber size are shaped to goods by heating, pressurization in closed mould cavity.Using the mold pressing in moulding technology to illustrate in this utility model, it will be understood by those skilled in the art that this utility model is not limited only to mould pressing process, also have other packaging technologies, this utility model is not limited thereto.
Be illustrated in figure 1 a preferred embodiment of of the present utility model one camera module based on integral packaging technique, employing for MOB technique.Described camera module based on integral packaging technique includes encapsulation photosensory assembly 10, optical filter 20, camera lens 30 and a motor 40.It will be appreciated by those skilled in the art that, described motor 40 such as relates to focusing in (FF) module can not have in other embodiment, and this utility model is not limited thereto.It is to say, this preferred embodiment of the present utility model is as a example by auto-focusing (AF) module.Encapsulation part 11 and a photosensory assembly 12 is included at described encapsulation photosensory assembly 10.Described photosensory assembly 12 farther include a sensitive chip 121 and a wiring board 122, its be configured with one group of electronic devices and components 123 (such as resistance, electric capacity, driving etc., later referred to as IC) and one group of lead-in wire 124.Described lead-in wire 124 connects and described sensitive chip 121 and described wiring board 122 is turned on, and certain described sensitive chip 121 and described wiring board 122 can also have other conduction modes.In this preferred embodiment of the present utility model, described lead-in wire 124 may be implemented as gold thread.Described encapsulation part 11 as carry described optical filter 20 support, described encapsulation part 11 can have electric property, can carve circuit energising connection as described in motor 40 and as described in photosensory assembly 12, it is possible to replace traditional motor bonding wire, reduce traditional manufacturing process.Certainly, described motor 40 and described wiring board 122 can also be welded by traditional horse leg and turn on.In encapsulation process, described wiring board 122 is packaged by described encapsulation part 11, and in this preferred embodiment of the present utility model, described encapsulation part 11 encapsulates the region on described wiring board 122 in addition to contacting with described sensitive chip 121 and described lead-in wire 124.Described encapsulation part 11 not only encapsulates the top surface 1221 of described wiring board 122, and described encapsulation part 11 also encapsulates at least one side 1222 being coated with described wiring board 122.It is understood that in encapsulation process, described encapsulation part 11 can also be by described electronic devices and components 123 integral packaging.
The molding showing in correlation technique such as Fig. 3 A to Fig. 3 E forms module.In Fig. 3 A, part and wiring board 122P on the left of encapsulation part 11P flush, and the design that the side of this kind of wiring board 122P flushes with encapsulation part 11P side is generally also adopted by correlation technique.Therefore, for reaching above design requirement, as shown in Figure 3 B, the structure reaching in figure is needed before module group assembling, when molding, described wiring board 122P does such as the process of Fig. 3 B, is namely linked together by described wiring board 122P more than two panels, molds, between the most in figure 3b, part machine cuts, but is accomplished by newly-increased cutting equipment.If without the mode in Fig. 3 B, certain deviation is had with mould para-position in view of described wiring board 122P, the edge of described wiring board 122P can not flush design with described encapsulation part 11P, so being typically only capable to be designed to as shown in Figure 3 C, wiring board 122P described in figure needs to protrude one section and is usually 0.3mm～1mm on branch for mould pressing, described wiring board 122P protrusion length.As shown in FIGURE 3 E, if not using cutting, this section of described wiring board 122P protuberance branch affects module final size, makes module size increase 0.3mm～1mm, have impact on the quality of product.
Therefore, compare with correlation technique, described camera module based on integral packaging technique of the present utility model, described wiring board 122 is inside contracted design, the side making described encapsulation part 11 is coated with the described side 1222 of described wiring board 122, thus the side of described encapsulation part 11 and the described wiring board 122 still reserved space that necessarily misplaces, and does not has, at the trailing flank molded, the situation that described wiring board 122 protrudes, reduce cutting action, improve the quality of product.
It is noted that described encapsulation part 11 can all be packaged cladding to two sides of described wiring board 122.During of the present utility model this is preferable to carry out, owing to right side also has other elements such as flexible circuit board to connect, therefore, only encapsulate the left side of described wiring board 122, the most described side 1222.But, it will be appreciated by those skilled in the art that is, described encapsulation part 11 is possible not only to encapsulate the described side 1222 of described wiring board 122, in other embodiments, the all right encapsulation of side simultaneously is coated with the partially or fully region of two sides of described wiring board 122, and this utility model is not limited thereto.
It is illustrated in figure 2 the another embodiment of described camera module based on integral packaging technique of the present utility model, in order to the module after ensureing moulding technology can be easy to installation and location, and improve flatness, being to use MOB form equally, described camera module based on integral packaging technique includes encapsulation photosensory assembly 10 ', optical filter 20 ', a camera lens 30 ' and a motor 40 '.Similarly, owing to, as a example by AF module, therefore disclosing described motor 40 ', but in other FF modules, it may not be necessary to described motor 40 ', this utility model is not limited thereto.
Specifically, described encapsulation photosensory assembly 10 ' includes an encapsulation part 11 ' and a photosensory assembly 12 '.Described photosensory assembly 12 ' farther include a sensitive chip 121 ' and a wiring board 122 ', its be configured with one group of electronic devices and components 123 ' and one group of lead-in wire 124 '.Described encapsulation part 11 ' is as the support of the described optical filter 20 ' of carrying, described module portion 11 ' the engraving circuit energising described motor of connection 40 ' and described photosensory assembly 12 '.Compared with above preferred embodiment of the present utility model, in moulding process, except described wiring board 122 ' and described electronic devices and components 123 ' are packaged by described encapsulation part 11 ', and encapsulation is coated with the described end face 1221 ' of described wiring board 122 ' and at least beyond one side 1222 ', described encapsulation part 11 ' is also carried out molded packages to bottom the one of described wiring board 122 ' 1223 '.Thus after ensure that molding completes, described camera module based on integral packaging technique side on the whole and the planarization of bottom, also allow for installation and be positioned in other frocks.
It is worth mentioning that, described encapsulation part 11 ' can encapsulate the whole described bottom 1223 ' being coated with described wiring board 122 ', can also be in other embodiments, according to different needs, encapsulation is coated with a part for the described bottom 1223 ' of described wiring board 122 ', and this utility model is not limited thereto.
It is worth mentioning that, in this preferred embodiment of the present utility model, owing in the figure of described camera module, the right side of signal can also connect other elements or carry out other processing technique, the right flank of the most described wiring board 122 ' is not packaged, but in other embodiments, described encapsulation part 11 ' can encapsulate two or more sides being coated with described wiring board 122 ' simultaneously, and all or part of region of the described bottom 1223 ' of the described wiring board 122 ' of encapsulation cladding simultaneously, this utility model is not limited thereto.
The form that have employed MOB in shown in Fig. 1 and Fig. 2 two embodiment discloses, and following variant embodiment is changed to use the form of MOC, and combines various different modular structure and disclose the side to wiring board or bottom surface carries out the encapsulation of module portion.
It is another embodiment of described camera module based on integral packaging technique of the present utility model as shown in Figure 4 A.Described camera module based on integral packaging technique includes encapsulation part 11A, a photosensory assembly 12A, an optical filter 20A and a camera lens 30.Described photosensory assembly 12A farther includes an a sensitive chip 121A and wiring board 122A, and it is configured with one group of electronic devices and components 123A and one group of lead-in wire 124A.Described encapsulation part 11A as carrying the support of described optical filter 20A, directly other drape forming in addition to chip photosensitive area on described wiring board 122A.It is to say, this embodiment of the present utility model uses MOC form.It is noted that described sensitive chip 121A includes the non-photo-sensing region 1212A beyond a photosensitive region 1211A and described photosensitive region 1211A, when encapsulation, described encapsulation part 11A does not encapsulate described photosensitive region 1211A.But encapsulate the described non-photo-sensing region 1212A of described sensitive chip 121A.Described non-photo-sensing region 1212A is additionally provided with pin and described lead-in wire 124A connects, and is used for turning on described sensitive chip 121A.
Similarly, in camera module based on integral packaging technique described in shown in Fig. 4 A, described wiring board 122A has carried out inside contracting design, the side making described encapsulation part 11A is coated with the described side 1222A of described wiring board 122A, thus the side of described encapsulation part 11A and the described wiring board 122A still reserved space that necessarily misplaces, there is no, at the trailing flank molded, the situation that described wiring board 122A protrudes.Additionally, in other modes of texturing based on the present embodiment, described encapsulation part 11A can all be packaged cladding to multiple sides of described wiring board 122A.
It is another embodiment of described camera module based on integral packaging technique of the present utility model as shown in Figure 4 B.Unlike the embodiment in Fig. 4 A, except described encapsulation part 11A ' described wiring board 122A ' and described electronic devices and components 123A ' is packaged, and encapsulation is coated with beyond the described end face 1221A ' and at least one side 1222A ' of described wiring board 122A ', described encapsulation part 11A ' 1223A ' bottom the one of described wiring board 122A ' is also carried out molded packages.Thus after ensure that molding completes, described camera module based on integral packaging technique side on the whole and the planarization of bottom, also allow for installation and be positioned in other frocks.
It is illustrated in figure 5 another embodiment of described camera module based on integral packaging technique of the present utility model.Unlike the embodiment in Fig. 4 A, the top design structure of described encapsulation part 11B is different, and in the embodiment of Fig. 4 A, the top of described encapsulation part 11A is protruding upward, and and the side of described optical filter 20A between there is a clearance groove 1121A, for installing different camera lenses or motor.And the embodiment of Fig. 5 does not has described clearance groove.Additionally, the bottom surface of described wiring board 122B is glued with a stiffening plate 125B.Described stiffening plate 125B may be implemented as a metallic plate.Other structures are identical with the structure in Fig. 4 A.For described encapsulation part 11B, the end face 1221B of described wiring board 122B, at least one side 1221B, the sidepiece of described stiffening plate 125B, the non-photo-sensing region 1212B of described sensitive chip 121B, described electronic devices and components 123B and described lead-in wire 124B are all coated with encapsulated moulding.
It is illustrated in figure 6 another embodiment of described camera module based on integral packaging technique of the present utility model.Unlike the embodiment in Fig. 5, for described wiring board 122B ' and described stiffening plate 125B ', except described encapsulation part 11B, ' by addition to the described end face 1221B ' and at least one side 1222B ' of described wiring board 122B ', described encapsulation part 11B ' is also carried out molded packages to the bottom of described stiffening plate 125B '.Thus after ensure that molding completes, described camera module based on integral packaging technique side on the whole and the planarization of bottom, also allow for location is installed.
Modular structure shown in Fig. 7 A is that other structures are identical to a deformation of modular structure in Fig. 5 embodiment, except for the difference that, is placed on described sensitive chip 121C by described optical filter 20C and utilizes described encapsulation part 11C to be packaged together.So can reduce described sensitive chip 121C injury during encapsulation and use, and the back focal length of camera lens can be reduced, so that smaller.
Similarly, the modular structure shown in Fig. 7 B is that other structures are identical to a deformation of modular structure in Fig. 6 embodiment, except for the difference that, is placed on described sensitive chip 121C ' by described optical filter 20C ' and utilizes described encapsulation part 11C together ' it is packaged.So can reduce the described sensitive chip 121C ' injury during encapsulation and use, and the back focal length of camera lens can be reduced, so that smaller, the most also can reduce height, the heat that described sensitive chip 121C ' sends can be released, there is the highest heat-sinking capability..
Fig. 8 A is a deformation of modular structure in embodiment based on Fig. 7 A.Essentially consist in the deformation of described encapsulation part 11D.The top of described encapsulation part 11D upwardly extends formation bearing wall 111D, described bearing wall 111D respectively and forms a holding tank 1111D, be used for accommodating camera lens.It is to say, described encapsulation part 11D can directly carry camera lens, thus realize high accuracy and focus (FF) module.
Fig. 8 B is a deformation of modular structure in embodiment based on Fig. 7 B.Essentially consist in described encapsulation part 11D ' deformation.Described encapsulation part 11D ' it is coated with the bottom surface of described wiring board 121D ', and its top upwardly extends formation bearing wall 111D ', described bearing wall 111D ' respectively and forms a holding tank 1111D ', be used for accommodating camera lens.It is to say, described encapsulation part 11D ' can directly carry camera lens, thus realize high accuracy and focus (FF) module.
Fig. 9 A and 9B is a deformation of modular structure in embodiment based on Fig. 8 A.Essentially consist in the deformation of described encapsulation part 11E.Therefore, described wiring board 121E is provided with one or more perforation 126E, and the moulding material forming described encapsulation part 11E enters described perforation 126E and is embedded in described perforation 126E, thus strengthens the strengthening action to described wiring board 121E further.Similarly, described encapsulation part 11E can not only be coated on the end face of described wiring board 121E, it is also possible to the side of cladding to described wiring board 121E and bottom surface.It is understood that the mode that described wiring board 121E here arranges described perforation 126E can also be applied to other embodiments of the present utility model.
It is noted that based in each embodiment shown in Fig. 4 A to 7B, in the technology of the MOC of above-described embodiment, when needs connect motor, motor pin and several connected modes in Figure 10 to 12 of wiring board conducting.
A variant embodiment structure as shown in Figure 10, employing for MOC technique.Described camera module based on integral packaging technique includes an encapsulation photosensory assembly, an optical filter 20F, a camera lens 30F and a motor 40F.It is to say, this preferred embodiment of the present utility model is as a example by auto-focusing (AF) module.Encapsulation part 11F and a photosensory assembly 12F is included at described encapsulation photosensory assembly.Described photosensory assembly 12F farther includes a sensitive chip 121F, a wiring board 122F, one group of electronic devices and components 123F and one group of lead-in wire 124F.Described lead-in wire 124F connects and turns on described sensitive chip 121F and described wiring board 122F.In this embodiment of the present utility model, described lead-in wire 124F may be implemented as gold thread.Described encapsulation part 11F is as the support carrying described optical filter 20F.In encapsulation process, described wiring board 122F is packaged by described encapsulation part 11F, and in this embodiment of the present utility model, described encapsulation part 11F encapsulates the part on described wiring board 122F in addition to the photosensitive region of described sensitive chip 121F.Described encapsulation part 11F not only encapsulates the top surface 1221F of described wiring board 122F, and described encapsulation part 11F also encapsulates at least one side 1222F being coated with described wiring board 122F.It is understood that in encapsulation process, described encapsulation part 11F is also by described electronic devices and components 123F integral packaging.
It is worth mentioning that, one encapsulation part pin 1101F of described encapsulation part 11F and described motor 40F is electricity conducting, by an inner lead 1102F of described encapsulation part 11F, being turned on by least one motor pin 41F of described motor 40F and described wiring board 122F, this embodiment can need not use welding procedure.
And in embodiment as shown in figure 11, welding procedure can be used, described encapsulation part 11G has straight-through upper and lower recess channels 1103G, can be used to place described motor pin 41G, make described motor pin 41G be welded at a pad 60G with a wiring board pin 1231G of described wiring board 122G by described recess channels 1103G.
Correspondingly, the structure in Figure 12 and Figure 10, Figure 11 structure comparison is similar, but due to the aspect ratio of described encapsulation part 11H is higher, the motor pin in the structure of Figure 10, Figure 11 may be unable to reach the longest in design, thus can only use the structure of Figure 12.That is, recess channels 1103H of described encapsulation part 11H outer wall is not the end of through to, but described motor pin 41H described encapsulation part pin 1101H with described encapsulation part 11H in described recess channels 1103H welds, one pad is 60H, and be directly connected with described wiring board 122H by the described inner lead 1102H of described encapsulation part 11H, thus realize the conducting between motor and wiring board.
It addition, according to other a kind of embodiment, described encapsulation part can also utilize laser direct forming technique to form plated conductive circuit on surface, it is used for connecting described motor and described wiring board.Certainly, described encapsulation part can not also have the electric property mentioned in above-described embodiment, but uses traditional mode to be welded by welding manner with described wiring board by described motor.
It will be appreciated by those skilled in the art that, three embodiments of Figure 10 to 12 signal are merely to illustrate that in the case of having motor, described motor and the different modes of described wiring board conducting.Described encapsulation part in three embodiments not merely encapsulates end face and the side of described wiring board, it is also possible to mentions in aforementioned each variant embodiment, encapsulates the bottom surface of described wiring board.Additionally, other structures of described camera module can also do corresponding deformation, this utility model is not limited thereto.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown the most in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.
Claims (18)
1. a camera module based on integral packaging technique, it is characterised in that include at least one encapsulation photosensory assembly,
At least one camera lens, described encapsulation photosensory assembly includes at least one encapsulation part and at least one photosensory assembly, described sense
Optical assembly farther includes at least one sensitive chip, and at least one wiring board, described sensitive chip and described circuit
Plate can conductively connect, and described camera lens is positioned at the photosensitive path of described sensitive chip, and described encapsulation part is sealed integratedly
It is loaded on a top surface of described wiring board and at least one side of described wiring board.
2. camera module based on integral packaging technique as claimed in claim 1, wherein said encapsulation part also encapsulates
One bottom surface of described wiring board.
3. camera module based on integral packaging technique as claimed in claim 1, the bottom surface of wherein said wiring board
It is close to be provided with a stiffening plate.
4. camera module based on integral packaging technique as claimed in claim 3, wherein said encapsulation part encapsulates institute
State at least one sidepiece of stiffening plate.
5. camera module based on integral packaging technique as claimed in claim 3, wherein said encapsulation part encapsulates institute
State bottom the one of stiffening plate.
6. the camera module based on integral packaging technique as described in arbitrary in claim 1 to 5, wherein said envelope
Dress portion is also packaged in the non-photo-sensing region of described sensitive chip.
7. camera module based on integral packaging technique as claimed in claim 6, wherein said sensitive chip and institute
Stating wiring board to be connected by one group of lead-in wire, wherein said encapsulation part is coated with described lead-in wire.
8. the camera module based on integral packaging technique as described in arbitrary in claim 1 to 5, also includes at least
One optical filter, wherein said encapsulation part is as the support carrying described optical filter.
9. camera module based on integral packaging technique as claimed in claim 8, wherein said encapsulation part also encapsulates
Non-photo-sensing region in described sensitive chip.
10. the camera module based on integral packaging technique as described in arbitrary in claim 1 to 5, wherein said
Optical filter is superimposed on described sensitive chip, and described encapsulation part is also packaged in described optical filter.
In 11. such as claim 1 to 5 arbitrary as described in camera module based on integral packaging technique, wherein said
The top of encapsulation part upwardly extends formation at least one holding tank respectively, for accommodating described camera lens.
In 12. such as claim 1 to 5 arbitrary as described in camera module based on integral packaging technique, wherein said
Camera module based on integral packaging technique also includes a motor, and described motor is installed on described encapsulation part, and with
The conducting of described wiring board connects.
13. camera modules based on integral packaging technique as claimed in claim 12, wherein said encapsulation part has
Electric property, connects described motor and described wiring board to be turned on.
In 14. such as claim 1 to 5 arbitrary as described in camera module based on integral packaging technique, wherein said
Wiring board is additionally provided with at least one perforation, and described encapsulation part extends imbeds described perforation.
15. camera modules based on integral packaging technique as claimed in claim 6, wherein said wiring board also sets
Being equipped with at least one perforation, described encapsulation part extends imbeds described perforation.
In 16. such as claim 1 to 5 arbitrary as described in camera module based on integral packaging technique, wherein said
Packaging technology be moulding technology.
17. camera modules based on integral packaging technique as claimed in claim 16, wherein said moulding technology is
Injection or mould pressing process.
In 18. such as claim 1 to 5 arbitrary as described in camera module based on integral packaging technique, wherein said
Camera module is to focus camera module or automatic focusing camera module.
Priority Applications (28)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620269534.9U CN205545597U (en) | 2016-04-01 | 2016-04-01 | Module of making a video recording based on integrative packaging technology |
| US15/999,858 US11877044B2 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
| KR1020187026982A KR102282687B1 (en) | 2016-02-18 | 2016-07-28 | Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof |
| PCT/CN2016/092020 WO2017140092A1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| JP2018543321A JP6829259B2 (en) | 2016-02-18 | 2016-07-28 | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them |
| KR1020217023290A KR102465474B1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| EP16890320.1A EP3419275A4 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| KR1020187029304A KR20180132684A (en) | 2016-03-12 | 2017-03-09 | Camera module, its photosensitive part and method of manufacturing the same |
| PCT/CN2017/076041 WO2017157211A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| EP17765753.3A EP3429183A4 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
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| KR1020217005352A KR102360319B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW108135672A TWI742441B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135671A TWI769403B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670D TWI758644B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW106203507U TWM559558U (en) | 2016-03-12 | 2017-03-13 | Camera module and light-sensing component |
| TW108135674A TW202019155A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106108217A TWI754632B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670A TW202017356A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW108135674D TWI758645B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108100078A TWI708987B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof |
| TW106110049A TWI648587B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing |
| TW106204229U TWM561225U (en) | 2016-04-01 | 2017-03-26 | Integral packaging process-based camera module and integral base component of same |
| TW108100066A TWI743429B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof |
| JP2021007710A JP2021073520A (en) | 2016-02-18 | 2021-01-21 | Integral package process base camera module, integral base component thereof, and manufacturing method thereof |
| US17/847,569 US20230019091A1 (en) | 2016-03-12 | 2022-06-23 | Camera module, and photosensitive component thereof and manufacturing method therefor |
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| CN201620269534.9U CN205545597U (en) | 2016-04-01 | 2016-04-01 | Module of making a video recording based on integrative packaging technology |
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