TWI648587B - Camera module based on integrated packaging process and integrated base assembly and manufacturing - Google Patents

Abstract

A camera module based on an integrated packaging process, and an integrated base assembly and manufacturing method thereof, wherein the camera module comprises: at least one lens, at least one photosensitive wafer, at least one filter, and at least one integrated base assembly; Wherein the integrated base assembly includes a base portion and a circuit board portion, the base portion is integrally packaged on the circuit board portion, and the photosensitive wafer is mounted on the circuit board portion, the base portion At least one via is formed to provide a light path for the photosensitive wafer, the lens being located in a light path of the photosensitive wafer.

Description

Camera module based on integrated packaging process and integrated base assembly and manufacturing thereof method

The invention provides a camera module based on an integrated packaging process and an integrated base assembly and a manufacturing method thereof, in particular to a camera module based on an integrated packaging process and an integrated base assembly and a manufacturing method thereof.

The COB (Chip on Board) process is an extremely important process in the assembly and manufacturing process of a camera module. The structure of the conventional COB process camera module is assembled by components such as a circuit board, a photosensitive wafer, a lens holder, a motor drive, and a lens.

As shown in FIG. 1 , it is a schematic diagram of a camera module manufactured by a conventional COB process. The camera module includes a circuit board 1P, a photosensitive wafer 2P, a bracket 3P, a filter 4P, a motor 5P and a lens 6P. The photosensitive wafer 2P is mounted on the wiring board 1P to which the filter 4P is mounted, the lens 6P is mounted to the motor 5P, and the motor 5P is mounted to the bracket 3P so that the lens 6P is located Above the photosensitive wafer 2P.

It is worth mentioning that some circuit devices 11P, such as resistors, capacitors, etc., are usually mounted on the circuit board 1P. These circuit devices 11P protrude from the surface of the circuit board 1P, and the bracket 3P needs to be mounted on the circuit board 1P. The circuit board 1P has the circuit device 11P, and the assembly coordination relationship between the circuit board 1P, the circuit device 11P and the bracket 3P in the conventional COB process has some disadvantages, and the camera is limited to some extent. The development of the module towards thinning.

Specifically, first, the circuit device 11P is directly exposed to the surface of the circuit board 1P, so that in the subsequent assembly process, for example, the process of attaching the bracket 3P and soldering the motor 5P is inevitably affected, during soldering. The solder resist, dust, and the like are easily adhered to the circuit device 11P, and the circuit device 11P and the photosensitive wafer 2P are located in a space in which the mutual contact is made, so that dust contaminants easily affect the photosensitive wafer 2P, and such influence may cause assembly. The camera module has black spots and other undesirable phenomena, which reduces the yield of the product.

Secondly, the bracket 3P is located outside the circuit device 11P, so when mounting the lens holder and the circuit board 1P, it is necessary to reserve a certain safety distance between the bracket 3P and the circuit device 11P, and in the horizontal direction and The safety distance needs to be reserved in the upward direction, which increases the demand for the thickness of the camera module to a certain extent, making it difficult to reduce the thickness.

Thirdly, in the process of assembling the COB, the bracket 3P is pasted to the circuit board 1P by a glue or the like, and an AA (Active Arrangement) process is usually performed when pasting, that is, the bracket 3P and the circuit board are adjusted. 1P and the central axis of the motor 5P are made to be consistent in the horizontal direction and the vertical direction. Therefore, in order to satisfy the AA process, it is necessary to pre-determine between the bracket 3P and the circuit board 1P and between the mirror base and the motor 5P. There are more glues to make adjustment space between each other, and this requirement increases the thickness requirement of the camera module to a certain extent, so that the thickness is difficult to reduce. On the other hand, the assembly process is repeated several times. It is easy to cause the inclination of the assembly to be inconsistent, and the flatness of the lens holder 3P, the wiring board 1P, and the motor 5P is required to be high.

In addition, in the conventional COB process, the circuit board 1P provides the most basic fixing and supporting carrier, and therefore, the circuit board 1P itself is required to have a certain structural strength, and this requirement makes the circuit board 1P have a large thickness, thereby On the other hand, the thickness requirement of the camera module is added.

With the development of various electronic products and smart devices, camera modules are increasingly developing in the direction of high performance, lightness and thinness, and in the face of various high-performance development requirements such as high pixel and high image quality, electronic components in circuits More and more, the area of the wafer is getting larger and larger, and the passive components such as the driving resistor and the capacitor are correspondingly increased. This makes the specifications of the electronic device become larger and larger, the assembly difficulty increases, and the overall size of the camera module becomes more and more. Large, and from the above point of view, the traditional assembly methods of the mirror base, circuit board and circuit components are also a great limitation to the development of the thin and light camera module.

An object of the present invention is to provide a camera module based on a molding process, and a molded wiring board assembly and a manufacturing method thereof, wherein the circuit board assembly includes a molding portion and a wiring board portion, and the molding portion is molded In the circuit board section.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly therefor, and a manufacturing method thereof, wherein the molded wiring board assembly includes at least one circuit component, the circuit component being wrapped around the circuit board assembly It is not directly exposed to the external environment.

It is an object of the present invention to provide a camera module based on a molding process and a molded wiring board assembly therefor, and a method of fabricating the same, wherein the circuit component is integrally molded by the molded circuit board assembly by molding.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly therefor, and a manufacturing method thereof, wherein the molded circuit board assembly includes a molding portion and a wiring board portion, and the molding portion mold The circuit board portion is molded, and the circuit component disposed on the wiring portion is moldedly wrapped.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board portion includes a circuit board body and a photosensitive wafer, and the wafer is disposed on the circuit board The inner surface, the molding portion surrounds the outside of the photosensitive wafer.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board body has an inner ring groove, and the photosensitive wafer is disposed in the inner ring groove. Thereby, the height requirement for the molded portion can be reduced.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly therefor, and a manufacturing method thereof, wherein the circuit board main body has a wafer passage, and the photosensitive wafer is adapted to be removed from the back surface of the main body of the circuit board Mounting, and the photosensitive area of the photosensitive wafer faces the front side, providing a more convenient way of mounting the photosensitive wafer flip-chip.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly and a manufacturing method thereof, wherein a filter is mounted on an inner port of the wafer channel of the main body of the circuit board, thereby eliminating the need for Provide an additional location to mount the filter.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit body has at least one reinforcing hole, and the molding portion extends to the reinforcing hole, thereby increasing the The bonding force of the molded portion and the wiring board portion, and the structural strength of the wiring board main body is increased by the molding portion.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly and a manufacturing method thereof, wherein the molding portion includes a support table adapted to support the filter to provide the filter The installation location of the piece.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein a molded portion is adapted to be mounted with a motor assembly or a lens, which can be used as a conventional bracket. Providing the motor assembly or the support fixed position of the lens.

An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly and a manufacturing method thereof, wherein the molding portion replaces a conventional bracket, so that assembly and assembly of the bracket and the circuit board are not required during assembly. Process to increase process accuracy.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module is assembled from the molded circuit board assembly, and can have a smaller thickness and have A camera module with better performance.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module is assembled and manufactured by molding, thereby changing the COB process of the conventional camera module. .

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module includes a seat, and the holder is mounted to the molding portion The filter is mounted to the holder.

An object of the present invention is to provide a camera module based on a molding process, a molded wiring board assembly and a manufacturing method thereof, the lens comprising a lens barrel, the filter being mounted in the lens barrel, thereby There is no need to provide additional components to mount the filter.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the filter is mounted on an upper end of the wafer via, thereby reducing the camera module Back focus.

An object of the present invention is to provide a camera module based on a molding process, and a molded wiring board assembly and a manufacturing method thereof, wherein the base portion is integrally packaged to the wiring board portion, and the molding portion The structural strength requirement can be achieved with a small thickness, so that the longitudinal dimension of the camera module can be reduced.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein, in manufacturing the camera module, a plurality of the moldings are simultaneously packaged in one package. The board realizes the jigsaw operation of the camera module and improves production efficiency.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board portion includes a reinforcing layer which is laminated on the bottom of the circuit board main body To enhance the structural strength and heat dissipation performance of the circuit board body.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the molding portion includes a lens mounting portion adapted to mount a lens of the camera module To provide a stable mounting position for the lens.

An object of the present invention is to provide a camera module based on a molding process, and a molded wiring board assembly and a manufacturing method thereof, wherein the molding portion molds a side surface and a bottom surface of the wiring board main body to enhance the image capturing mold The structural strength of the group.

It is an object of the present invention to provide a camera module based on a molding process and a molded wiring board assembly therefor.

The invention provides a camera module comprising: at least one lens; at least one photosensitive wafer; at least one filter; at least one integrated base assembly; and at least one seat; wherein the integrated base assembly comprises a base a seat portion and a circuit board portion, the base portion is integrally packaged on the circuit board portion, and the photosensitive wafer is mounted on the circuit board portion The base portion forms at least one through hole for providing a light path for the photosensitive wafer, the lens is located in a light path of the photosensitive wafer, the holder is mounted on the base portion, and the filter is Mounted on the holder and located in the light path of the photosensitive wafer.

In an embodiment of the invention, the support has a first seat groove on the top side, the first seat groove communicates with the through hole, and the filter is mounted on the first Support slot.

In an embodiment of the invention, the holder has a second seating groove on the bottom side for engaging the top end of the base portion.

In an embodiment of the invention, the base portion has a mounting slot, the mounting slot communicates with the through hole, and the mount is mounted to the mounting slot.

In an embodiment of the invention, the base portion has a mounting groove, and the mounting groove communicates with the through hole.

In an embodiment of the invention, the base portion forms a platform, and the support is mounted to the platform.

In an embodiment of the invention, the mounting groove has at least one notch that communicates the through hole with the outside, and the support includes at least one extended edge, and the extended edge is adapted to be overlapped with the notch.

In an embodiment of the invention, the mounting groove has at least one notch forming a U-shaped structure, and the abutting portion includes at least one extending edge, the extending edge filling an opening of the U-shaped structure.

In an embodiment of the invention, the integral base assembly includes at least one circuit component, the base portion encasing the circuit component.

In an embodiment of the invention, the lens is at least partially mounted to the mount.

In an embodiment of the invention, the camera module includes at least one motor, the lens is mounted to the motor, and the motor is at least partially mounted to the mount.

In an embodiment of the invention, the lens is mounted to the base portion.

In an embodiment of the invention, the camera module includes at least one motor, the lens is mounted to the motor, and the motor is mounted to the base portion or mounted to the holder.

In an embodiment of the invention, the integrated package is a molded integral package.

In an embodiment of the invention, the integral base assembly includes an annular barrier element disposed on the circuit board portion, and the barrier element is at least partially integrally encapsulated by the base portion.

In an embodiment of the present invention, the base portion has at least one first inner side surface integrally extending from the circuit board portion, forming at least a portion of the through hole, the first inner side surface being inclined It extends upwards.

In an embodiment of the invention, the first inner side surface and the optical axis of the camera module have an inclination angle α, wherein the size of α ranges from 3° to 85°.

In an embodiment of the invention, the first inner side surface surrounds the lower end of the through hole, and the inner diameter of the lower end of the through hole gradually increases from bottom to top.

In an embodiment of the invention, the base portion has a second inner side surface, the second side surface is bent and extended from the first inner side surface, and the second inner side surface surrounds the through side. An upper end of the hole, the second inner side extends upward in an inclined manner.

In an embodiment of the invention, the second inner side surface and the optical axis of the camera module have an inclination angle β, wherein the size of β ranges from 3° to 45°.

In an embodiment of the present invention, the base portion has an outer side surface that is integrally inclined upwardly from the circuit board portion and has an inclination angle γ between the optical axis of the camera module, wherein The size of γ ranges from 3° to 45°.

Another aspect of the present invention provides a camera module including: at least one lens; at least one photosensitive wafer; and at least one integrated base assembly; wherein the integrated base assembly includes a base portion and a circuit board portion. The base portion is integrally connected to the circuit board portion, the photosensitive wafer is mounted on the circuit board portion, and the base portion forms at least one through hole to provide a light path for the photosensitive wafer, the lens a light path located in the photosensitive wafer, the base portion having at least one first inner side surface surrounding at least a portion of the through hole, the first inner side surface extending obliquely upward.

Another aspect of the present invention provides a camera module including: at least one lens; at least one photosensitive wafer; and at least one integrated base assembly; wherein the integrated base assembly includes a base portion and a circuit board The base portion is molded on the circuit board portion, and the base portion forms at least one through hole to provide a light path for the photosensitive wafer and the lens.

In an embodiment of the invention, the base portion has a top surface that extends in a plane.

In an embodiment of the invention, the base portion has a mounting groove, the mounting groove communicates with the through hole, and the base portion includes at least one protruding step, the protruding step forms the mounting groove.

In an embodiment of the invention, the circuit board portion includes at least one side surface, and the base covers at least one of the side surfaces of the circuit board portion.

In an embodiment of the invention, the base portion further covers a bottom portion of the circuit board portion.

In an embodiment of the present invention, the base portion has two mounting slots in sequence along the optical axis direction of the camera module, and each of the mounting slots communicates with the through hole to form an inner portion of the base portion. Step structure.

In an embodiment of the invention, the camera module includes at least one filter, and the filter is mounted on the top surface such that the filter is mounted flat.

In an embodiment of the invention, the lens is mounted to the top surface.

In an embodiment of the invention, the camera module includes at least one motor, the lens is mounted to the motor, and the motor is mounted on the top surface of the base portion.

In an embodiment of the invention, the camera module includes at least one filter, and the filter is mounted to the mounting slot.

In an embodiment of the invention, the lens is mounted to the raised step.

In an embodiment of the invention, the camera module includes at least one motor, the lens is mounted to the motor, and the motor is mounted to the raised step.

In an embodiment of the invention, the camera module includes a filter, and the filter is mounted to the mounting slot at a lower position.

In an embodiment of the invention, the lens is mounted to the mounting slot in the upper position.

In an embodiment of the invention, the base portion integrally extends upward from the mounting slot at a higher position to form a lens inner wall.

In an embodiment of the invention, the inner surface of the lens is flat and suitable for mounting a threadless lens.

In an embodiment of the invention, there is further included at least one lens mount mounted to the base portion, the lens mount being adapted to mount the lens.

In an embodiment of the invention, the camera module includes at least one seat and at least one filter, the holder is mounted on the mounting slot, and the filter is mounted on the holder .

In an embodiment of the invention, the circuit board portion has an inner groove communicating with the through hole, and the photosensitive wafer is received in the inner groove.

In an embodiment of the invention, the lens comprises a lens barrel and at least one lens, each of the lenses is mounted on the lens barrel, and the filter is mounted on the lens barrel, and the lens is located in the lens Below.

In an embodiment of the invention, the camera module includes at least one motor and at least one filter, the filter is mounted on the motor, and the lens is mounted on the motor, Above the filter.

In an embodiment of the invention, the integral base assembly includes at least one circuit component, the base portion encasing the circuit component.

In an embodiment of the invention, the circuit component is selected from the group consisting of: a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, a processor, and a memory.

In an embodiment of the invention, the circuit board portion has at least one passage that communicates with both sides of the circuit board portion, and the photosensitive wafer is mounted to the passage.

In an embodiment of the invention, the circuit board portion has a reinforcing hole, and the base portion extends into the reinforcing hole.

In an embodiment of the invention, the circuit board portion includes a reinforcing layer disposed on the bottom of the circuit board portion.

In an embodiment of the invention, the circuit board portion includes a shielding layer wrapped around the camera module.

In an embodiment of the invention, the circuit board portion includes a shielding layer surrounding the inner side of the base portion.

In an embodiment of the invention, the circuit board portion includes a circuit board body, and the circuit board body material is selected from the group consisting of: a combination of a soft and hard bonding board, a ceramic substrate, and a PCB hard board.

In an embodiment of the invention, the base portion material is selected from the group consisting of one or more of nylon, LCP, PP, and resin.

In an embodiment of the invention, the molding portion molding process is insert molding or molding.

In an embodiment of the invention, the photosensitive wafer is electrically connected to the circuit board portion through at least one connecting wire.

Another aspect of the present invention provides a camera module including: at least one lens; at least one photosensitive wafer; at least one integrated base assembly; and at least one motor; wherein the integrated base assembly includes a base portion and a circuit board The base portion is integrally packaged on the circuit board portion, the photosensitive wafer is mounted on the circuit board portion, and the lens is located in the a photosensitive path of the photosensitive wafer, the base portion forming a through hole for providing a light path for the photosensitive wafer; the integrated base assembly including at least one motor connection structure, the motor connection structure being preset to the base The motor is electrically connected to the circuit board portion through the motor connection structure, and the lens is mounted to the motor to facilitate adjustment of the lens by the motor.

In an embodiment of the invention, the circuit board portion includes a circuit board body, and the base portion is integrally molded to the circuit board main body in a molding manner.

In an embodiment of the invention, the motor connection structure includes at least one lead wire and at least one lead slot, the lead wire is disposed on the base portion, and is electrically connected to the circuit board main body, the lead a foot slot is disposed at an upper end of the base portion, the lead wire includes a motor connection end, and the motor connection end is exposed on the bottom wall of the slot to facilitate insertion of at least one motor pin of the motor The pin slot is electrically connected to the motor connection end.

In an embodiment of the invention, the motor connection structure includes at least one lead slot and at least one circuit contact, the circuit contact is electrically connected to the circuit board main body, and the pin slot is disposed in the a base portion extending from the circuit board body to a top end of the base portion, and the circuit contacts are exposed in the pin slots to facilitate insertion of at least one motor pin of the motor The pin slot is electrically connected to the circuit contact.

In an embodiment of the invention, the motor connection structure includes at least one engraving line disposed on the base portion and electrically connected to the circuit board main body to electrically connect a motor pin.

In an embodiment of the invention, the thickness of the base portion ranges from 0.3 to 1.2 mm.

In an embodiment of the invention, the horizontal cross-sectional dimension of the camera module ranges from 5 to 20 mm.

In an embodiment of the invention, the height of the camera module ranges from 3 to 6 mm.

In an embodiment of the invention, the thickness of the circuit board portion ranges from 0.15 to 0.5 mm.

In an embodiment of the invention, the base portion is adjacent to the outside of the photosensitive wafer, thereby expanding the thickness of the base portion, so that the base portion and the circuit board portion have stronger connection. Sex.

Another aspect of the present invention provides an integrated base assembly that utilizes a camera module that includes: a base portion; and a circuit board portion; the base portion is integrally packaged in the circuit board portion, and a photosensitive wafer of the camera module is adapted to be mounted on the circuit board portion, the base portion At least one via is formed to provide a light path for the photosensitive wafer, the lens being located in a light path of the photosensitive wafer.

In an embodiment of the invention, the integral base assembly includes at least one circuit component, the base portion encasing the circuit component.

In an embodiment of the invention, the integral base assembly includes at least one circuit component, and the circuit component is located inside the base portion, and the base portion does not cover the circuit component.

10A‧‧‧Circuit board assembly

100‧‧‧ camera module

1010, 1010A, 1010B, 1010C, 1010D, 1010E, 1010F‧‧‧ molded circuit board assemblies

1011, 1011A, 1011B, 1011C, 1011D, 1011E, 1011F‧‧‧ molding department

10111A, 10111B, 10111C, 10111D‧‧‧ support table

10113, 10113A, 10113B, 10113C, 10113D‧‧‧ inner ring groove

10117F‧‧‧ first inner side

10118F‧‧‧Second inner side

10119F‧‧‧Outside

101100, 101100A, 101100B, 101100C, 101100D, 101100E, 101100F‧‧‧ through holes

1012, 1012A, 1012B, 1012C, 1012D, 1012E, 1012F‧‧‧ circuit board

10121, 10121A, 10121B, 10121C, 10121D, 10121E‧‧‧ circuit board main body

101211A‧‧‧ Inside groove

101212B, 101212E‧‧‧ pathway

101213B, 101213E‧‧‧ outer ring groove

101214C‧‧‧through hole

10122, 10122A, 10122B, 10122C, 10122D, 10122E, 10122F, 10122G‧‧‧ circuit components

1030, 1030B, 1030D, 1030E‧‧‧Photosensitive wafers

1031D‧‧‧Leader

1040, 1040D‧‧‧ Filters

1050, 1050D, 1050E‧‧ lens

1060, 1060E‧‧ ‧ motor

1061, 1061A‧‧‧ motor pin

1070‧‧‧ bracket

1014G‧‧‧Blocking components

200‧‧‧Manufacture equipment

210‧‧‧Molding mould

211‧‧‧ first mold

2111‧‧‧Light window molding block

21111‧‧‧Fitting surface

212‧‧‧Second mold

213‧‧‧Forming cavity

2131‧‧‧Filling Department

2132‧‧‧ Housing

214‧‧‧Feeding channel

220‧‧‧Feeding agency

2010‧‧‧PCB components

2011‧‧‧Packing Department

20112, 20112G‧‧‧ top surface

20113A, 20113C, 20113G‧‧‧ installation slots

201131G‧‧‧ gap

20115, 20115G‧‧‧ raised steps

201100‧‧‧through hole

2012‧‧‧PCB department

20121, 20121F‧‧‧ circuit board main body

201212F‧‧‧ pathway

201213F‧‧‧outer groove

20122‧‧‧ Circuit components

2030‧‧‧Photosensitive wafer

2031‧‧‧Connecting line

2040‧‧‧Filter

2050, 2050E‧‧ lens

2051E‧‧·Mirror tube

20511E‧‧‧ bottom

2052E‧‧‧Lens

2060, 2060D‧‧‧ motor

2061‧‧‧Motor pins

2070, 2070B, 2070C, 2070G‧‧‧ support

2071C, 2071G‧‧‧ first seat slot

2071C, 2072G‧‧‧Second seat

2073G‧‧‧ extended edge

2080‧‧‧ bracket

3010‧‧‧Integrated base assembly

3011, 3011F‧‧‧Base section

30112‧‧‧ top surface

30113, 30113F‧‧‧ mounting slots

30114, 30114F‧‧‧ covered section

30115, 30115F‧‧‧ Filter mounting section

30116F‧‧‧ lens mounting section

301161F‧‧‧ lens inner wall

301162F‧‧‧Installation section

301100, 301100F‧‧‧through hole

3012‧‧‧Wiring Board Department

30121, 30121A, 30121B, 30121D, 30121E‧‧‧ circuit board main body

301211A‧‧‧ Inside groove

301212B‧‧‧ pathway

301213B‧‧‧ outer groove

30122‧‧‧ Circuit components

30123C‧‧‧ reinforcement layer

30124, 30124A‧‧‧Shield

301214D, 301214E‧‧‧ reinforcement holes

3013‧‧‧Motor connection structure

30131‧‧‧Leader

301311‧‧‧Motor connection

30132‧‧‧Circuit contacts

30133‧‧‧ lead slot

30134‧‧‧Leader

301341‧‧‧Motor connection

30135‧‧‧ lead slot

30136‧‧‧Engraving lines

3030‧‧‧Photosensitive wafer

3040‧‧‧Filter

3050‧‧‧ lens

3060‧‧‧Motor

3061‧‧‧Motor pins

3070G, 3070H‧‧‧ support

3071G, 3071H‧‧‧ first seat slot

3072G, 3072H‧‧‧Second seat

400‧‧‧Molding materials

4010, 4010A‧‧‧ package photosensitive components

4011, 4011P, 4011A‧‧‧Packing Department

4012, 40121P, 4012A‧‧‧Photosensitive components

40121, 40121P, 40121A‧‧‧ circuit board

401215‧‧‧ top surface

401216, 401216A‧‧‧ side

401217A‧‧‧ bottom

40122, 40122A‧‧‧ Electronic components

4040‧‧‧Filter

4030, 4030A‧‧‧Photosensitive wafer

4031‧‧‧Leader

4040, 4040A‧‧‧ Filters

4050, 4050A‧‧ lens

4060, 4060A‧‧ ‧ motor

30‧‧‧Photosensitive wafer

40‧‧‧Filter

50‧‧‧ lens

60‧‧‧ motor

1P‧‧‧ circuit board

11P‧‧‧circuit devices

2P‧‧‧Photosensitive wafer

3P‧‧‧ bracket

4P‧‧‧Filter

5P‧‧‧Motor

6P‧‧‧ lens

1 is a cross-sectional view of a camera module of a conventional COB packaging process.

2 is a cross-sectional view of a camera module in accordance with a first preferred embodiment of the present invention.

3 is a schematic exploded view of a camera module in accordance with a first preferred embodiment of the present invention.

4 is a partially enlarged view of a camera module in accordance with a first preferred embodiment of the present invention.

Figure 5 is a schematic view showing the process of forming a molded circuit assembly of a camera module in accordance with a first preferred embodiment of the present invention.

Figure 6A is a cross-sectional view showing a first modified embodiment of a molded wiring board assembly of a camera module according to a first preferred embodiment of the invention.

Figure 6B is a partially enlarged schematic view showing a first modified embodiment of the molded wiring board assembly of the camera module in accordance with the first preferred embodiment of the present invention.

Figure 7A is a cross-sectional view showing a second modified embodiment of a molded wiring board assembly of a camera module according to a first preferred embodiment of the present invention.

7B is a partially enlarged schematic view showing a second modified embodiment of the circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

Figure 8A is a cross-sectional view showing a third modified embodiment of the circuit board assembly of the camera module in accordance with the first preferred embodiment of the present invention.

Figure 8B is a partial enlarged view of a third modified embodiment of the circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

9 is a cross-sectional view of a camera module in accordance with a second preferred embodiment of the present invention.

Figure 10 is a schematic exploded view of a camera module in accordance with a second preferred embodiment of the present invention.

Figure 11 is a partially enlarged view of a camera module in accordance with a second preferred embodiment of the present invention.

Figure 12 is a cross-sectional view of a camera module in accordance with a third preferred embodiment of the present invention.

Figure 13 is a schematic view showing the process of forming a molded circuit assembly of a camera module in accordance with a third preferred embodiment of the present invention.

Figure 14 is a cross-sectional view showing a camera module in accordance with a fourth preferred embodiment of the present invention.

Figure 15 is an exploded view of a camera module in accordance with a fourth preferred embodiment of the present invention.

Figure 16 is a cross-sectional view showing a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.

Figure 17 is a perspective exploded view of a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.

Figure 18A is another embodiment of a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.

Figure 18B is another embodiment of a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.

Figure 18C is another embodiment of a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.

Figure 19 is a cross-sectional view showing a camera module based on a molding process in accordance with a sixth preferred embodiment of the present invention.

Figure 20 is a cross-sectional view showing a camera module based on a molding process in accordance with a seventh preferred embodiment of the present invention.

Figure 21 is a schematic cross-sectional view showing an image forming process based on a molding process in accordance with an eighth preferred embodiment of the present invention.

Figure 22 is a cross-sectional view showing a camera module based on a molding process in accordance with a ninth preferred embodiment of the present invention.

Figure 23 is a cross-sectional view showing a camera module based on a molding process in accordance with a tenth preferred embodiment of the present invention.

Figure 24 is a cross-sectional view showing a camera module based on a molding process in accordance with an eleventh preferred embodiment of the present invention.

25A and 25B are schematic cross-sectional views showing different angles of a camera module based on a molding process according to a twelfth preferred embodiment of the present invention.

Figure 26 is a partial perspective view of a camera module based on a molding process in accordance with a twelfth preferred embodiment of the present invention.

27 is a cross-sectional view of a camera module based on an integrated packaging process in accordance with a thirteenth preferred embodiment of the present invention.

Figure 28 is a schematic view showing the manufacturing process of the integrated base assembly in accordance with the thirteenth preferred embodiment of the present invention.

Figure 29 is a schematic illustration of a method of fabricating an integrated base assembly in accordance with a thirteenth preferred embodiment of the present invention.

30 is another embodiment of a camera module based on an integrated packaging process in accordance with a thirteenth preferred embodiment of the present invention.

31A, 31B, 31C and 31D are different embodiments of a camera module based on an integrated packaging process and a motor connection structure thereof according to a fourteenth preferred embodiment of the present invention.

32 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof according to a fifteenth preferred embodiment of the present invention.

33 is a cross-sectional view of a camera module and an integrated base assembly thereof based on an integrated packaging process in accordance with a sixteenth preferred embodiment of the present invention.

Figure 34 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a seventeenth preferred embodiment of the present invention.

35 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof according to an eighteenth preferred embodiment of the present invention.

36 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof according to a nineteenth preferred embodiment of the present invention.

37 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof according to a twentieth preferred embodiment of the present invention.

38 is a cross-sectional view of a camera module and an integrated base assembly thereof based on an integrated packaging process in accordance with a twenty-first preferred embodiment of the present invention.

39 is a cross-sectional view of a camera module and an integrated base assembly thereof based on an integrated packaging process in accordance with a twenty-second preferred embodiment of the present invention.

40 is another embodiment of a camera module based on an integrated packaging process in accordance with a twenty-second preferred embodiment of the present invention.

41 is a schematic diagram showing the structural strength comparison between an imaging and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.

FIG. 42 is a schematic diagram showing a horizontal dimension comparison between a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention.

FIG. 43 is a schematic diagram showing the height comparison between the camera module and the conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.

FIG. 44 is a schematic diagram showing the flatness of a camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.

45 is a schematic diagram showing the comparison of imaging quality between a camera module and a conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.

46A and 46B are schematic diagrams showing a comparison of a manufacturing process of a camera module and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.

Figure 47 is a side cross-sectional view of a camera module based on an integrated packaging process in accordance with a twenty-third preferred embodiment of the present invention.

Figure 48 is a side cross-sectional view of a camera module based on an integrated packaging process in accordance with a twenty-fourth preferred embodiment of the present invention.

Figure 49A is a schematic view of a molded image forming module formed by a comparative technique.

Figure 49B is a schematic view of a conventional molded image forming module in the comparative art.

Figure 49C is a schematic view of a conventional molded image forming module in the comparative art.

Figure 49D is a schematic view of a conventional molded image forming module in the comparative art.

Figure 49E is a schematic view of a conventional molded image forming module in the comparative art.

Figure 50 is a cross-sectional view showing a camera module of a twenty-fifth preferred embodiment of the present invention.

Figure 51 is a perspective view of a molded wiring board assembly of a camera module in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 52 is a perspective view showing a tilt angle of a molded wiring board assembly of a camera module according to a twenty-fifth preferred embodiment of the present invention.

Figure 53 is a schematic view of a light ray of a camera module according to a twenty-fifth preferred embodiment of the present invention.

54A and 54B are views showing a manufacturing process of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 55 is a schematic view showing the demolding process of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 56 is a variant embodiment of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 57 is another modified embodiment of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 58 is a schematic diagram of an application of a camera module in accordance with a twenty-fifth preferred embodiment of the present invention.

Figure 59 is a variant embodiment of a camera module in accordance with a twenty-first preferred embodiment of the present invention.

The present invention will be described in detail by the following detailed description of the embodiments of the invention, Those skilled in the art will be able to carry out the invention. The preferred embodiments in the following description are by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention as defined in the following description may be applied to other embodiments, modifications, improvements, equivalents, and other embodiments without departing from the spirit and scope of the invention.

It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", " The orientation or positional relationship of the indications of "upright", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is merely for convenience of description of the present invention and The above description of the invention is not to be construed as a limitation of the invention.

It will be understood that the term "a" is understood to mean "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term "a" cannot be construed as limiting the quantity.

As shown in FIGS. 2 to 5, a camera module based on a molding process according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist in the shooting activities through the camera module. For example, the camera module can be used to capture images or video images of objects or people. Preferably, the camera module can be applied to a mobile electronic device. For example, the mobile electronic device can be, but not limited to, a mobile phone, a tablet device, a television, an intelligent vehicle, an intelligent monitoring device, and the like.

2 to 5, a camera module according to a first preferred embodiment of the present invention. The camera module can be a dynamic focus camera module including a molded circuit board assembly 1010, a lens 1050, a motor 1060, and a photosensitive wafer 1030. Of course, it can be understood that in this embodiment and the following variants of the embodiment with the driver (motor), the camera module can be modified to be a fixed focus camera module without the motor. The lens may be mounted to a lens holder and then mounted to the molded circuit board assembly.

The motor 1060 is mounted to the molded wiring board assembly 1010, and the lens 1050 is mounted to the motor 1060 such that the lens 1050 is supported above the molded wiring board assembly 1010.

Still further, the molded wiring board assembly 1010 includes a molding portion 1011 and a wiring board portion 1012, and the molding portion 1011 is molded to connect the wiring board portion 1012.

The circuit board portion 1012 includes a circuit board main body 10121, and the photosensitive wafer 1030 is disposed on the circuit board main body 10121 and located inside the molding portion 1011.

Specifically, the motor 1060 is mounted on the molding portion 1011 of the molded wiring board assembly 1010 and electrically connected to the wiring board portion 1012, and the lens 1050 is mounted to the motor 1060. And the lens 1050 can be adapted by the motor 1060 to auto focus. The lens 1050 is located in the photosensitive path of the photosensitive wafer 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the lens. 1030 is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012 includes a photosensitive circuit and at least one circuit component 10122. The photosensitive circuit is preset in the circuit board main body 10121, and the circuit component 10122 is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive operation process of the photosensitive wafer 1030. The circuit component 10122 can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

In particular, in an embodiment of the present invention, when assembling the image forming mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the motor pin 1061 is soldered to The circuit board main body 10121.

It is worth mentioning that the molding portion 1011 can enclose the circuit component 10122 inside, thus making the circuit component 10122 not directly exposed to the space, more specifically, not exposed to the In the closed environment in which the photosensitive wafer 1030 communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive wafer. The molding portion 1011 forms a through hole 101100 such that the molding portion 1011 surrounds the outside of the photosensitive wafer 1030 and provides a light path of the lens 1050 and the photosensitive wafer 1030. In other words, the molding portion forms a light window for the photosensitive wafer, and in the camera module, light passing through the lens 1050 further passes through the light window to reach the photosensitive wafer.

It is worth mentioning that the molding portion 1011 envelops the circuit component 10122 has the advantages of protecting the circuit component 10122 and corresponding performance improvement of the camera module, but those skilled in the art should understand that The molding portion 1011 is not limited to wrapping the circuit component 10122. That is, in other embodiments of the present invention, the molding portion 1011 may be directly molded to the wiring board of the circuit component 10122 which is not protruded, or may be molded to the outside of the circuit component 10122. Different locations, such as around, or embedded in the interior of the board body 10121.

It is to be noted that, in an embodiment of the invention, the molding portion 1011 is convexly surrounding the outside of the photosensitive wafer 1030, and in particular, the molding portion 1011 is integrally closed and connected to have A good seal is provided so that when the motor 1060 is mounted to the molding portion 1011, the photosensitive wafer 1030 is sealed inside to form a closed inner space.

Specifically, in the manufacture of the molded wiring board assembly, a conventional wiring board may be used as the wiring board main body 10121, and the surface of the wiring board main body 10121 may be molded, such as by an injection molding machine, by insert molding ( Insert molding process The wiring board after the SMT process (Surface Mount Technology surface mount process) is molded to form the molding portion 1011, or the molding portion 1011 is formed by a molding process commonly used in a semiconductor package. The circuit board main body 10121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molding portion 1011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The molding material 1011 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process can be adopted. Resin. Those skilled in the art should It is to be understood that the above-described alternative manufacturing methods and materials that can be selected are merely illustrative of the manner in which the invention can be practiced and are not limiting of the invention.

It is also worth mentioning that the motor 1060 is mounted on the molding portion 1011 of the molded wiring board assembly 1010, so that the molding portion 1011 is equivalent to the function of the bracket in the conventional camera module. The motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes. The bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011 is fixed to the circuit board main body 10121 by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the molding portion 1011 and the circuit board main body 10121, thereby reducing the conventional camera module AA. The adjusted reserved space is such that the thickness of the camera module is reduced; on the other hand, the molding portion 1011 is wrapped around the circuit component 10122, so that the conventional bracket function and the circuit component can be spatially overlapped, It is required to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the molding portion 1011 having a bracket function can be set in a small range, thereby further providing a reduction in the thickness of the camera module. space. In addition, the molding portion 1011 replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly, and reduces the cumulative tolerance of the assembly of the camera module.

Further, the molding portion 1011 includes a support table 10111 adapted to mount a filter 1040 such that the filter 1040 is positioned above the photosensitive wafer 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive wafer 1030. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The support table 10111 of the molding portion 1011 forms an inner ring groove 10113 to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011 replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011, the filter 1040 and the circuit component 10122 are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030, so that the camera module is minimized. At the same time, by means of the molding process, the molding portion 1011 is provided with the flat support table 10111, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.

More specifically, the inner ring groove 10113 has an L-shaped cross section and communicates with the through hole 101100 of the molding portion 1011 so that the filter 1040 is supported and mounted on the photosensitive wafer 1030. path.

According to this embodiment of the invention, the photosensitive wafer 1030 is connected to the wiring board main body 10121 through a series of leads 1031, and is electrically connected to the photosensitive circuit. The lead 1031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 1031 of the photosensitive wafer 1030 may be connected to the circuit board body 10121 by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection of the photosensitive wafer 1030 and the circuit board main body 10121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 1030 to the circuit board main body 10121 can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 1030 is disposed on an upper surface of the circuit board main body 10121, such as attached to an upper surface, the molding portion. 1011 surrounding the outer side of the photosensitive wafer 1030, when manufacturing the molded wiring board assembly 1010, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the circuit board main body 10121 may be first used. The photosensitive wafer 1030 is mounted thereon, and then outside the photosensitive wafer 1030, the edge portion of the wiring board main body 10121 is molded to form the molding portion 1011, and will protrude from the wiring board main body 10121. The circuit component 10122 is wrapped around it. In another embodiment of the present invention, the edge portion of the circuit board main body 10121 may be molded to form the molding portion 1011, and the circuit component protruding from the circuit board main body 10121 may be formed. The 10122 is wrapped inside, and the photosensitive wafer 1030 is then mounted on the wiring board main body 10121 so as to be located inside the molding portion 1011.

As shown in Figs. 6A and 6B, there is shown a first modified embodiment of a molded wiring board assembly of a camera module according to a first preferred embodiment of the present invention. The molded wiring board assembly 1010A includes a molding portion 1011A and a wiring board portion 1012A, and the molding portion 1011A is molded to connect the wiring board portion 1012A.

The wiring board portion 1012A includes a wiring board main body 10121A, and the photosensitive wafer 1030 is disposed on the wiring board main body 10121A and located inside the molding portion 1011A.

Specifically, the motor 1060 is mounted on the molding portion 1011A of the wiring board assembly 10A, and is electrically connected to the wiring board portion 1012A, and the lens 1050 is mounted to the motor 1060, and The lens 1050 can be adjusted by the motor 1060 to be suitable for autofocus. The lens 1050 is located in the photosensitive path of the photosensitive wafer 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the lens. 1030 is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012A includes a light sensing circuit and at least one circuit component 10122A. The photosensitive circuit is preset in the circuit board main body 10121A, and the circuit component 10122A is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive operation process of the photosensitive wafer 1030. The circuit component 10122A can be, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

In particular, in an embodiment of the present invention, when assembling the image forming mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061A, and the motor pin 1061A is soldered to The circuit board main body 10121.

It is worth mentioning that the molding portion 1011A encloses the circuit component 10122A inside, thus making the circuit component 10122A not directly exposed to the space, more specifically, not exposed to the photosensitive The closed environment in which the wafers 1030 communicate is different from the manner in which the circuit components in the conventional camera module exist, such as a container, thereby preventing dust and debris from staying on the circuit components and contaminating the photosensitive wafer. The molding portion 1011A forms a through hole 101100A such that the molding portion surrounds the outside of the photosensitive wafer 1030 and provides a light path of the lens 1050 and the photosensitive wafer 1030.

Further, the circuit board main body 10121A includes an inner recess 101211A, and the photosensitive wafer 1030 is disposed in the inner recess 101211A. Different from the molded circuit board assembly of the above embodiment, the inner groove 101211A is disposed in the circuit board main body 10121A, and the photosensitive wafer 1030 is accommodated therein, so that the photosensitive wafer 1030 can be prevented from being significantly protruded. On the upper surface of the wiring board main body 10121A, the height of the photosensitive wafer 1030 relative to the molding portion 1011A is lowered, thereby reducing the height limitation of the photosensitive wafer 1030 to the molding portion 1011A, providing further reduction High probability.

Specifically, in manufacturing the molded wiring board assembly 1010, a conventional wiring board may be used as the wiring board main body 10121A, and the surface of the wiring board main body 10121A may be molded, such as by an injection molding machine, by insert molding. (insert molding) Process The wiring board after the SMT process (Surface Mount Technology surface mount process) is molded to form the molding portion 1011A, or the molding portion 1011A is formed by a molding process commonly used in a semiconductor package. In particular, in an embodiment, the inner groove 101211 needs to be opened to the circuit board main body 10121A. That is, the inner groove 101211A is opened on a conventional wiring board to accommodate the mounting of the photosensitive wafer 1030. The circuit board main body 10121A may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molding portion 1011A is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The molding part 1011A may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

It is also worth mentioning that the motor 1060 is mounted to the molding portion 1011A of the molded wiring board assembly 1010A, so that the molding portion 1011A is equivalent to the function of the bracket in the conventional camera module, The motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes. The bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011A is fixed to the circuit board main body 10121A by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the molding portion 1011A and the board main body, The reserved space of the conventional camera module AA is reduced, so that the thickness of the camera module is reduced; on the other hand, the molding portion 1011A is wrapped around the circuit component 10122A, so that the conventional bracket function and circuit components are It can be spatially overlapped, and it is not necessary to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the molded portion 1011A having a bracket function can be set in a small range, thereby further providing The space in which the thickness of the camera module can be reduced. In addition, the molding portion 1011A replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

Further, the molding portion 1011A includes a support table 10111A adapted to mount the filter 1040 such that the filter 1040 is positioned above the photosensitive wafer 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive wafer 1030. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The support table 10111A of the molding portion 1011A forms an inner ring groove 10113A to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011 replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion The 1011A, the filter 1040, and the circuit component 10122A are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030 to minimize the camera module. At the same time, the molding portion 1011A is provided with the flat support table 10111A by means of a molding process, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.

More specifically, the inner ring groove 10113A may have an L-shaped cross section and communicate with the through hole 101100A of the molding portion 1011A, so that the filter 1040 is supported and mounted on the photosensitive wafer 1030. path.

According to this embodiment of the invention, the photosensitive wafer 1030 is connected to the wiring board main body 10121A through a series of leads 1031A, and is electrically connected to the photosensitive circuit. The lead 51A may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 1031A of the photosensitive wafer 1030 may be connected to the circuit board body 10121A by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection of the photosensitive wafer 1030 and the circuit board main body 10121A can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 1030 to the circuit board main body 10121A can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 1030 is disposed in the inner groove 101211A of the circuit board main body 10121A, and the molding portion 1011A surrounds the photosensitive wafer Outside of 1030. In the manufacture of the molded wiring board assembly, different manufacturing sequences may be selected. For example, but not limited to, in one embodiment, the inner groove 101211A may be first opened on the circuit board main body 10121A, and then The photosensitive wafer 1030 is mounted in the inner groove 12110A of the wiring board main body 10121, and then the molding portion 1011A is molded at an edge position of the wiring board main body 10121A outside the photosensitive wafer 1030, and The circuit component 10122A protruding from the board main body 10121A is wrapped inside. In another embodiment of the present invention, the inner groove 101211A may be opened on the circuit board main body 10121A, and then The edge portion of the wiring board main body 10121A is molded to form the molding portion 1011A, and the circuit component 10122A protruding from the wiring board main body 10121A is wrapped therein, and then the photosensitive wafer 1030 is mounted on The inner groove 101211A of the wiring board main body 10121A is located inside the molding portion 1011A.

As shown in Figs. 7A and 7B, there is shown a second modified embodiment of the molded wiring board assembly of the camera module according to the first preferred embodiment of the present invention. The molded wiring board assembly 1010B includes a molding portion 1011B and a wiring board portion 1012B that is moldedly joined to the wiring board portion 1012B.

The wiring board portion 1012B includes a wiring board main body 10121B, and the photosensitive wafer 1030 is disposed on the wiring board main body 10121B and located inside the molding portion 1011B.

Specifically, the motor 1060 is mounted on the molding portion 1011B of the wiring board assembly 10B, and is electrically connected to the wiring board portion 1012B, and the lens 1050 is mounted to the motor 1060, and The lens 1050 can be adapted by the motor 1060 to auto focus. The lens 1050 is located in the photosensitive path of the photosensitive wafer 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the lens. 1030 is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012B includes a photosensitive circuit (not shown) and at least one circuit component 10122B. The photosensitive circuit is preset in the circuit board main body 10121B, and the circuit component 10122B is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive operation process of the photosensitive wafer 1030. The circuit component 10122B can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

In particular, in an embodiment of the present invention, when assembling the image forming mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the wire is soldered to the line Plate body 10121B.

It is worth mentioning that the molding portion 1011B encloses the circuit component 10122B inside, thus making the circuit component 10122B not directly exposed to the space, more specifically, not exposed to the photosensitive The closed environment in which the wafers 1030 communicate is different from the manner in which the circuit components in the conventional camera module exist, such as a container, thereby preventing dust and debris from staying on the circuit components and contaminating the photosensitive wafer. The molding portion 1011B forms a through hole 101100B such that the molding portion surrounds the outside of the photosensitive wafer 1030 and provides a light path of the lens 1050 and the photosensitive wafer 1030.

Further, the board main body 10121B has a passage 101212B, and a lower portion of the passage 101212B is adapted to mount the photosensitive wafer 1030. The via 101212B causes the upper and lower sides of the wiring board main body 10121B to communicate, so that when the photosensitive wafer 1030 is mounted on the back surface of the wiring board main body 10121B and the photosensitive area is mounted upward on the wiring board main body 10121B, The photosensitive wafer 1030B of the photosensitive wafer 1030 is capable of receiving light entering by the lens 1050.

Further, the via 101212B has an outer ring groove 101213B on the bottom side to provide a mounting position of the photosensitive wafer 1030. In particular, when the photosensitive wafer 1030 is mounted on the outer ring groove 101213 on the bottom side, the bottom surface of the photosensitive wafer 1030 and the surface of the circuit board main body 10121B are in the same plane, and may be The bottom surface of the photosensitive wafer 1030 is recessed inwardly with respect to the surface of the wiring board main body 10121B, that is, the bottom surface of the photosensitive wafer 1030 may not protrude from the bottom surface of the wiring board main body 10121B, thereby securing the mold. The surface flatness of the plastic circuit board assembly 1010B.

In this embodiment of the invention, the via 101212B is stepped to facilitate mounting of the photosensitive wafer 1030, providing a stable mounting location for the photosensitive wafer 1030 and exposing its photosensitive region to the interior space.

It is worth mentioning that in this embodiment of the invention, a different wafer mounting method, that is, a Flip Chip, is provided. The photosensitive wafer 1030 is attached to the wiring board main body 10121B from the back surface direction of the wiring board main body 10121B instead of being required from the front surface of the wiring board main body 10121, that is, from the wiring board as in the above embodiment. Above the main body 10121, the photosensitive region of the photosensitive wafer 1030 is mounted on the wiring board main body 10121 upward. Such a structure and mounting manner such that the photosensitive wafer 1030 and the molding portion 1011B are relatively independent, the mounting of the photosensitive wafer 1030 is not affected by the molding portion 1011B, and the molding of the molding portion 1011B The influence of the molding on the photosensitive wafer 1030 is also small. In addition, the photosensitive wafer 1030 is embedded on the outer side surface of the circuit board main body 10121B, and does not protrude from the inner side surface of the circuit board main body 10121B, thereby leaving a larger space inside the circuit board main body 10121B. The height of the molded portion 1011B is not limited by the height of the photosensitive wafer 1030, so that the molded portion 1011B can reach a smaller height.

Specifically, in the manufacture of the molded wiring board assembly, a conventional wiring board may be used as the wiring board main body 10121B, and the surface of the wiring board main body 10121B may be molded, such as by an injection molding machine, by insert molding ( Insert molding process to form the molding portion 1011B by a wiring board after performing an SMT process (Surface Mount Technology surface mount process), or to form the molding portion 1011B by a molding process commonly used in a semiconductor package, and The via 101212B is opened on the wiring board main body 10121B. The circuit board main body 10121B may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. Said The manner in which the molded portion 1011B is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The molding part 1011B may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

It is also worth mentioning that the motor 1060 is mounted on the molding portion 1011B of the molded wiring board assembly 1010B, so that the molding portion 1011B is equivalent to the function of the bracket in the conventional camera module, The motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes. The bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011 is fixed to the circuit board main body 10121B by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molding parts 1011 and the circuit board body, thereby reducing the pre-adjustment of the conventional camera module AA. The space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011B is wrapped around the circuit component 10122B, so that the conventional bracket function and the circuit component can be spatially overlapped, without the need for The camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011B having the bracket function can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the molding portion 1011B replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

Further, the molding portion 1011B includes a support table 10111B, and the support table 10111B is adapted to mount the filter 1040 such that the filter 1040 is located on the photosensitive wafer 1030. Above. That is, the light entering the lens 1050 reaches the photosensitive wafer 40 after passing through the filter 1040. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The support table 10111B of the molding portion 1011B forms an inner ring groove 10113B to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011B replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011B, the filter 1040, and the circuit component 10122B are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030, thereby minimizing the camera module. At the same time, the molding portion 1011B is provided with the flat support table 10111B by means of a molding process, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.

More specifically, the inner ring groove 10113B has an L-shaped cross section that communicates with the through hole 101100B of the molding portion 1011B so that the filter 1040 is supported and mounted on the photosensitive wafer 1030. Photosensitive path.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 1030 is disposed on the lower surface of the wiring board main body 10121B, and the molding portion 1011B surrounds the outside of the wiring board main body 10121B. edge. In fabricating the molded wiring board assembly 1010B, different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the via 101212B may be first opened on the wiring board body 10121B, and then the The photosensitive wafer 1030 is flip-chip mounted to the via 101212B of the wiring board main body 10121, and then outside the photosensitive wafer 1030, the edge position of the wiring board main body 10121B is molded to form the molding portion 1011B, and The circuit component 10122B protruding from the board main body 10121B is wrapped inside. Yet another implementation of the invention In an example, the via 101212B may be first opened on the board main body 10121B, and then the molding portion 1011B is molded at an edge position of the wiring board main body 10121B, and will protrude from the wiring board main body. The circuit component 10122B of 10121B is wrapped therein, and then the photosensitive wafer 1030 is mounted on the wiring board main body 10121B so as to be located in the outer ring groove 101213B of the wiring board main body 10121B. In another embodiment of the present invention, the molding portion 1011B may be molded at an edge position of the wiring board main body 10121B, and the circuit component 10122B protruding from the wiring board main body 10121B may be formed. The via 101212B is opened on the inside of the circuit board main body 10121B, and then the via 101212B is opened on the wiring board main body 10121B, and then the photosensitive wafer 1030 is flip-chip mounted on the wiring board main body 10121B. The path 101212B.

As shown in Figs. 8A and 8B, there is shown a third modified embodiment of the molded wiring unit of the image pickup module according to the first preferred embodiment of the present invention. The molded wiring board assembly 1010C includes a molding portion 1011C and a wiring board portion 1012C that is moldedly joined to the wiring board portion 1012C.

The wiring board portion 1012C includes a wiring board main body 10121C, and the photosensitive wafer 1030 is disposed on the wiring board main body 10121C and located inside the molding portion 1011C.

Specifically, the motor 1060 is mounted on the molding portion 1011C of the wiring board assembly 10C, and is electrically connected to the wiring board portion 1012C, and the lens 1050 is mounted to the motor 1060, and The lens 1050 can be adapted by the motor 50 to be auto focus. The lens 1050 is located in the photosensitive path of the photosensitive wafer 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the lens. 1030 is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012C includes a photosensitive circuit (not shown) and at least one circuit component 10122C. The photosensitive circuit is preset in the circuit board main body 10121C, and the circuit component 10122C is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive operation process of the photosensitive wafer 1030. The circuit component 10122C can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

In particular, in an embodiment of the present invention, when assembling the image forming mold, the motor 1060 is electrically connected to the photosensitive circuit through a motor pin 1061, and the motor pin 106 is soldered to The circuit board main body 10121C.

It is worth mentioning that the molding portion 1011C wraps the circuit component 10122C inside, thus making the circuit component 10122C not directly exposed to the space, more specifically, not exposed to the photosensitive The closed environment in which the wafers 1030 communicate is different from the manner in which the circuit components in the conventional camera module exist, such as a container, thereby preventing dust and debris from staying on the circuit components and contaminating the photosensitive wafer. The molding portion 1011C forms a through hole 101100C such that the molding portion surrounds the outside of the photosensitive wafer 1030 and provides a light path of the lens 1050 and the photosensitive wafer 1030.

Further, the circuit board main body 10121C has at least one via 101214C, and the molding portion 1011 is immersed in the via 101214C. Each of the via holes 101214C is provided in a molding region of the wiring board main body, and is disposed in coordination with the circuit component 10122C. It is to be noted that the via 101214C is disposed such that the molding portion 1011C is immersed in the wiring board main body 10121C at the time of molding, and the molding portion 1011C and the wiring board main body 10121C are reinforced. The adhesive force between the molding portion 1011C and the circuit board main body 10121C is not easily detached, and the circuit board main body is reinforced The structural strength of the 10121C itself allows the board body 10121C to have a smaller thickness. The location and number of vias 101214C can be set as desired, and those skilled in the art will appreciate that the location and number of vias 101214C are not a limitation of the present invention.

It should be noted that in other embodiments of the present invention, the circuit board main body 10121C may further be provided with the inner groove 101211A or the path 101212B, so that the molded circuit board assembly 1010C may have different Advantages such as smaller thickness and higher structural strength.

It is worth mentioning that the arrangement of the via holes 101214C on the circuit board main body 10121C in the embodiment may bring some advantages, such as increasing the mode of the circuit board main body 10121C and the molding portion 1011C. Plastic bonding, reinforcing the structural strength of the circuit board main body 10121C, etc., of course, those skilled in the art should understand that the arrangement of the via hole 101214C of the circuit board main body 10121C is not a limitation of the present invention. That is, in other embodiments of the present invention, the vias 101214C may not be provided, or different layouts, different numbers of the vias 101214C may be provided as needed.

Specifically, in the manufacture of the molded wiring board assembly, a conventional wiring board may be used as the wiring board main body 10121C, and the surface of the wiring board main body 10121C may be molded, such as by an injection molding machine, by insert molding ( Insert molding process The wiring board after the SMT process (Surface Mount Technology surface mount process) is molded to form the molding portion 1011C, or the molding portion 1011C is formed by a molding process commonly used in a semiconductor package. The circuit board main body 10121C may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molding portion 1011C is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The material to be selected for the molding portion 1011C is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer) Compound), PP (Polypropylene, polypropylene), etc., the molding process can use a resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

It is also worth mentioning that the motor 1060 is mounted on the molding portion 1011C of the molded wiring board assembly 1010C, so that the molding portion 1011C is equivalent to the function of the bracket in the conventional camera module, The motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes. The bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011C is fixed to the circuit board main body 10121C by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the main body of the circuit board in the molding part 1011C, thereby reducing the pre-adjustment of the conventional camera module AA. The space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011C is wrapped around the circuit component 10122C, so that the conventional bracket function and circuit components can be spatially overlapped, without the need for The camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011C having the bracket function can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the molding portion 1011C replaces the conventional bracket, avoiding the tilt error caused by the bracket during the sticking assembly, and reducing the cumulative tolerance of the assembly of the camera module.

Further, the molding portion 1011C includes a support table 10111C adapted to mount the filter 1040 such that the filter 1040 is positioned above the photosensitive wafer 1030. That is, the light entering the lens 1050 reaches the photosensitive wafer 40 after passing through the filter 1040. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The support table 10111C of the molding portion 1011C forms an inner ring groove 10113C to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011C replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011C, the filter 1040, and the circuit component 10122C are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030, thereby minimizing the camera module. At the same time, by means of the molding process, the molding portion 1011C is provided with the flat support table 10111C, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.

More specifically, the inner ring groove 10113C has an L-shaped cross section, communicating with the through hole 101100C of the molding portion 1011C, so that the filter 1040 is supported by the photosensitive path of the photosensitive wafer 1030. .

According to this embodiment of the invention, the photosensitive wafer 1030 is connected to the wiring board main body 10121C through a series of leads 1031, and is electrically connected to the photosensitive circuit. The lead 1031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 1031 of the photosensitive wafer 1030 may be connected to the circuit board body 10121C by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection of the photosensitive wafer 1030 and the circuit board main body 10121C can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 1030 and the circuit board main body 10121C can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 1030 is disposed on the upper surface of the wiring board main body 10121C, and the molding portion 1011C surrounds the outer side of the photosensitive wafer, When manufacturing the molded wiring board assembly, different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the photosensitive wafer 1030 may be first mounted on the wiring board main body 10121C, and then in the photosensitive Outside the wafer 1030, the edge position of the wiring board main body 10121C is molded to form the molding portion 1011C, and the circuit component 10122C protruding from the wiring board main body 10121C is wrapped therein. In another embodiment of the present invention, the edge position of the circuit board main body 10121C may be first molded to form the molding portion 1011C, and the circuit component protruding from the circuit board main body 10121C may be formed. The 10122C is wrapped inside, and then the photosensitive wafer 1030 is attached to the wiring board main body 10121C so as to be positioned inside the molding portion 1011C.

As shown in FIG. 9 to FIG. 11, it is a camera module according to a second preferred embodiment of the present invention. The camera module is a fixed focus camera module. The camera module includes a molded circuit board assembly 1010D, a lens 1050D, and a photosensitive wafer 1030D.

The lens 1050D is mounted over the molded wiring board assembly 1010D. Further, the molded wiring board assembly 1010D includes a molding portion 1011D and a wiring board portion 1012D, and the molding portion 1011D is molded to connect the wiring board portion 1012D.

The wiring board portion 1012D includes a wiring board main body 10121D that is disposed on the wiring board main body 10121D and located inside the molding portion 1011D.

Specifically, the lens 1050D is located in the photosensitive path of the photosensitive wafer 1030D, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050D. The photosensitive wafer 1030D is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012D includes a light sensing circuit and at least one circuit component 10122. The photosensitive circuit is preset in the circuit board main body 10121D, and the circuit component 10122D is electrically connected to the photosensitive circuit and the photosensitive wafer 1030D for the photosensitive operation process of the photosensitive wafer 1030D. The circuit component 10122D can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

It is worth mentioning that the molding portion 1011D wraps the circuit component 10122D inside, thus making the circuit component 10122D not directly exposed to the space, more specifically, not exposed to the photosensitive The closed environment in which the wafer 1030D communicates is different from the manner in which the circuit components in the conventional camera module exist, such as a resistive container member, thereby preventing dust and debris from staying at the circuit component 10122D, contaminating the photosensitive wafer 1030D. The molding portion 1011D forms a through hole 101100D such that the molding portion 1011D surrounds the outside of the photosensitive wafer 1030D and provides a light path of the lens 1050D and the photosensitive wafer 1030D.

Specifically, in the manufacture of the molded wiring board assembly, a conventional wiring board may be used as the wiring board main body 10121D, and the surface of the wiring board main body 10121D may be molded, such as by an injection molding machine, by insert molding. An insert molding process is performed by molding a wiring board after performing an SMT process (Surface Mount Technology surface mount process) to form the molding portion 1011D, or forming the molding portion by a molding process commonly used in a semiconductor package. 1011D. The circuit board main body 10121D may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the molding portion 1011D is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The molding part 1011D may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. ability It will be understood by those skilled in the art that the foregoing alternatives, and the materials that may be selected, are merely illustrative of the manner in which the invention may be practiced and are not intended to be limiting.

It is also worth mentioning that the lens 1050D is mounted on the molding portion 1011D of the molded wiring board assembly 1010D, so that the molding portion 1011D is equivalent to the function of the bracket in the conventional camera module. The lens 1050D provides support, fixed position, but assembly is different from conventional COB processes. The bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011D is fixed to the circuit board main body 10121D by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molding part 1011D and the circuit board main body, thereby reducing the pre-adjustment of the conventional camera module AA. The space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011D is wrapped around the circuit component 10122D, so that the conventional bracket function and the circuit component can be spatially overlapped, without the need for The camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011D having the function of the bracket can be set in a small range, thereby further providing a space in which the thickness of the camera module can be reduced. A fixed-focus camera module with a smaller thickness. In addition, the molding portion 1011D replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

Further, the molding portion 1011D includes a support table 10111D adapted to mount a filter 1040D such that the filter 1040D is positioned above the photosensitive wafer 1030D. That is, the light entering the lens 1050D passes through the filter 1040D and reaches the photosensitive wafer 40D. The filter 1040D can be implemented as, but not limited to, an infrared cut filter (IRCF).

The support table 10111D of the molding portion 1011D forms an inner ring groove 10113D to provide a sufficient installation space for the filter 1040D. It is worth mentioning that the molding portion 1011D replaces the conventional bracket, and connects the lens 1050D with the wiring board portion 1012D while providing the mounting position of the filter 1040D, so that the molding portion 1011D, the filter 1040D, and the circuit component 10122D are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030D, thereby minimizing the camera module. At the same time, by means of the molding process, the molding portion 1011D is provided with the flat support table 10111D, so that the filter 1040D can be mounted flat, ensuring the consistency of the optical path.

More specifically, the inner ring groove 10113D is L-shaped and communicates with the through hole 101100D of the molding portion 1011D so that the filter 1040D is supported to be mounted on the photosensitive path of the photosensitive wafer 1030D.

According to this embodiment of the invention, the photosensitive wafer 1030D is connected to the wiring board main body 10121D through a series of leads 1031D, and is electrically connected to the photosensitive circuit. The lead 51D may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the series of leads 1031D of the photosensitive wafer 1030D may be connected to the circuit board body 10121D by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection of the photosensitive wafer 1030D and the circuit board main body 10121D can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 1030D to the circuit board main body 10121D can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.

It is worth mentioning that in the traditional manufacturing process, after the circuit board is finished with the SMT, the traditional COB package is applied, and then the wafer is attached, the gold wire is attached, and the plastic bracket or the motor is attached by glue. In one manufacturing method of the present invention, after the SMT, the molding portion 1011D is formed on the surface of the wiring board by a molding process, and then wafer bonding is performed to punch a gold wire.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 121D is disposed on the upper surface of the wiring board main body 10121D, and the molding portion 1011D surrounds the outer side of the photosensitive wafer, When manufacturing the molded wiring board assembly, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the photosensitive wafer 1030D may be first mounted on the wiring board main body 10121D, and then in the photosensitive Outside the wafer 1030D, the edge position of the wiring board main body 10121D is molded to form the molded portion 1011D, and the circuit component 10122D protruding from the wiring board main body 10121D is wrapped therein. In another embodiment of the present invention, the edge position of the circuit board main body 10121D may be first molded to form the molding portion 1011D, and the circuit component protruding from the circuit board main body 10121D may be formed. The 10122D is wrapped inside, and then the photosensitive wafer 1030D is attached to the wiring board main body 10121D so as to be positioned inside the molding portion 1011D.

It should be noted that the lens 1050D can also be combined with different embodiments of the molded circuit assembly in the above preferred embodiment to be assembled into a fixed-focus camera module of different configurations, that is, the lens 1050D and the mode respectively. The plastic circuit board assembly 1010A, the molded circuit board assembly 1010B, and the molded circuit board assembly 1010C are assembled to form different fixed focus camera modules. The structure of the molded circuit board assembly can be referred to the above preferred embodiment. , will not repeat them here.

As shown in FIG. 12 and FIG. 13, it is a camera module according to a third preferred embodiment of the present invention. The camera molding is a dynamic focus camera module including a molded circuit board assembly 1010E, a lens 1050E, and a motor 1060E.

The motor 1060E is mounted to the molded wiring board assembly 1010E, and the lens 1050E is mounted to the motor 1060E such that the lens 1050E is supported above the molded wiring board assembly 1010E.

The molded wiring board assembly 1010E includes a molding portion 1011E and a wiring board portion 1012E that is moldedly joined to the wiring board portion 1012E.

The circuit board portion 1012E includes a circuit board main body 10121E and a photosensitive wafer 1030E. The photosensitive wafer 1030E is disposed on the circuit board main body 10121E and located inside the molding portion 1011E.

Specifically, the motor 1060E is mounted on the molding portion 1011E of the wiring board assembly 10E, and is electrically connected to the wiring board portion 1012E, and the lens 1050E is mounted to the motor 1060E, and The lens 1050 can be adapted to autofocus by the motor 1060E. The lens 1050 is located in the photosensitive path of the photosensitive wafer 1030E, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050E to be further used by the lens. 1030E is received to be suitable for photoelectric conversion.

Further, the circuit board portion 1012E includes a light sensing circuit and at least one circuit component 10122E. The photosensitive circuit is preset in the circuit board main body 10121E, and the circuit component 10122E is electrically connected to the photosensitive circuit and the photosensitive wafer 1030E for the photosensitive operation process of the photosensitive wafer 1030E. The circuit component 10122E can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

Specifically, in an embodiment of the present invention, when the image forming molding is assembled, the motor 1060E is electrically connected to the photosensitive circuit through a motor pin 1061E, and the wire is soldered to the wiring board Body 10121E.

It is worth mentioning that the molding portion 1011E encloses the circuit component 10122E inside, thus making the circuit component 10122E not directly exposed to the space, more specifically, not exposed to the photosensitive The closed environment in which the wafer 1030E communicates is different from the manner in which the circuit components in the conventional camera module exist, such as a resistive container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive wafer. The molding portion 1011E forms a through hole 101100E such that the molding portion surrounds the outside of the photosensitive wafer 1030E and provides a light path of the lens 1050E and the photosensitive wafer 1030E.

Further, the board main body 10121E has a passage 101212E, and a lower portion of the passage 101212E is adapted to mount the photosensitive wafer 1030E. The via 101212E causes the upper and lower sides of the wiring board main body 10121E to communicate with each other, so that when the photosensitive wafer 1030E is mounted on the back surface of the wiring board main body 10121E and the photosensitive area is upwardly mounted on the wiring board main body 10121E, The photosensitive region of the photosensitive wafer 1030E is capable of receiving light entering by the lens 1050E.

Further, the via 101212E has an outer ring groove 101213E that provides a mounting position of the photosensitive wafer 1030E. In particular, when the photosensitive wafer 1030E is mounted on the outer ring groove 101213, the outer surface of the photosensitive wafer 1030E and the surface of the circuit board main body 10121E are in the same plane, thereby ensuring the molding line. The surface flatness of the panel assembly 1010E.

In this embodiment of the invention, the via 101212E is stepped to facilitate mounting of the photosensitive wafer 1030E, providing a stable mounting position for the photosensitive wafer 1030E and exposing its photosensitive region to the inner space.

It is worth mentioning that in this embodiment of the invention, a different wafer mounting method than the conventional wafer flipping method is provided. The photosensitive wafer 1030E is attached to the wiring board main body 10121E from the back surface direction of the wiring board main body 10121E instead of being required from the front surface of the wiring board main body 10121, that is, from the wiring board as in the above embodiment. Above the main body 10121, the photosensitive region of the photosensitive wafer 1030 is mounted on the wiring board main body 10121 upward. Such a structure and mounting manner such that the photosensitive wafer 1030E and the molding portion 1011E are relatively independent, the mounting of the photosensitive wafer 1030E is not affected by the molding portion 1011E, and the molding of the molding portion 1011E The influence of the molding on the photosensitive wafer 1030E is also small. In addition, the photosensitive wafer 1030E is embedded on the outer side surface of the circuit board main body 10121E, and does not protrude from the inner side surface of the circuit board main body 10121E, so that a larger space is left inside the circuit board main body 10121E. The height of the molded portion 1011E is not limited by the height of the photosensitive wafer 1030E, so that the molded portion 1011E can reach a smaller height.

Specifically, in the manufacture of the molded wiring board assembly, a conventional wiring board may be used as the wiring board main body 10121E, and the surface of the wiring board main body 10121E may be molded, such as by an injection molding machine, by insert molding ( Insert molding process to form the molding portion 1011E by a wiring board after performing an SMT process (Surface Mount Technology surface mount process), or to form the molding portion 1011E by a molding process commonly used in a semiconductor package, and The via 101212E is opened on the wiring board main body 10121E. The circuit board main body 10121E may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCE hard board (without a soft board), and the like. The manner in which the molding portion 1011E is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The material to be selected for the molding portion 1011E is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP. (Polypropylene, polypropylene), etc., the molding process can use a resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

It is also worth mentioning that the motor 1060E is mounted on the molding portion 1011E of the circuit board assembly 10E, so that the molding portion 1011E is equivalent to the function of the bracket in the conventional camera module, Motor 1060E provides support, fixed position, but assembly is different from conventional COE processes. The bracket of the camera module of the conventional COE process is fixed to the circuit board in a pasting manner, and the molding portion 1011E is fixed to the circuit board main body 10121E by a molding process, and the bonding process is not required, and the molding method is relatively pasted. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molding parts 1011E between the circuit board bodies, thereby reducing the pre-adjustment of the conventional camera module AA. The space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011E is wrapped around the circuit component 10122E, so that the conventional bracket function and the circuit component can be spatially overlapped, without the need for The camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011E having the bracket function can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the molding portion 1011E replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

It is to be noted that, in the above preferred embodiment, the camera module includes a filter 1040E, and the filter 1040E is mounted on the circuit board body 10121E at the photosensitive wafer 1030E. The upper portion, that is, the upper port of the path 101212E of the circuit board main body 10121E, causes the light entering by the lens 1050E to pass through the filter 1040E first when passing through the path 101212E. Unlike the above embodiment, the molding portion 1011E does not need to be provided. The mounting position of the filter 1040E does not need to be provided with the support table 10111, and in turn, the circuit board main body 11E provides a mounting position for the filter 1040E, and the filter 1040E and the filter are reduced. The distance between the photosensitive wafers 1030E is such that the height of the molded portion 1011E is further reduced.

The filter 1040E can be implemented as, but not limited to, an infrared cut filter (IRCF).

It is worth mentioning that, in this embodiment of the invention, the arrangement of the via 101212E in the FC wafer flip-chip mode enables the filter 1040E to be mounted on the wiring board body 10121E, thereby The circuit board assembly 10E and the camera module assembled by the circuit board assembly 10E have advantages brought by the FC mounting method and the mounting manner of the filter 1040E, such as facilitating assembly, reducing thickness, and the like. However, it should be understood by those skilled in the art that the mounting position of the filter 1040E is not limited by the present invention. In other embodiments of the present invention, the filter 1040E may also be installed in different positions, for example. The but not limited to, the molded portion 1011, a bracket, a motor, or the like.

It is worth mentioning that the molding portion 1011E connects the motor 1060E with the circuit board portion 1012E instead of the conventional bracket, and the circuit board portion 1012E provides the mounting position of the filter 1040E, so that The molding portion 1011E, the filter 1040E, and the circuit component 10122E are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive wafer 1030E, thereby minimizing the camera module. At the same time, by means of the molding process, the molding portion 1011E is provided with a flat fixed position, so that the motor 1060E can be mounted flat, ensuring the consistency of the optical path.

It is to be noted that, in this embodiment of the invention, the photosensitive wafer 1030E is disposed on a lower surface of the wiring board main body 10121E, and the molding portion 1011E surrounds the wiring board main body 10121E. edge. When manufacturing the molded wiring board assembly 1010E, it is possible to choose not to In the same manufacturing sequence, for example, but not limited to, in one embodiment, the via 101212E may be first opened on the circuit board main body 10121E, and then the photosensitive wafer 1030E may be flip-chip mounted on the circuit board main body 10121. The via 101212E, and then outside the photosensitive wafer 1030E, the edge position of the wiring board main body 10121E, molding the molding portion 1011E, and the circuit protruding from the wiring board main body 10121E Element 10122E is wrapped inside it. In another embodiment of the present invention, the via 101212E may be first opened on the circuit board main body 10121E, and then the molding portion 1011E is molded at an edge position of the wiring board main body 10121E, and The circuit component 10122E protruding from the circuit board main body 10121E is wrapped therein, and then the photosensitive wafer 1030E is mounted on the circuit board main body 10121E so as to be located in the outer ring of the circuit board main body 10121E. Slot 101213E. In another embodiment of the present invention, the molding portion 1011E may be molded at an edge position of the wiring board main body 10121E, and the circuit component 10122E protruding from the wiring board main body 10121E may be formed. The path 101212E is opened on the inside of the circuit board main body 10121E, and then the path 101212E is opened on the circuit board main body 10121E, and then the photo-sensitive chip 1030E is flip-chip mounted on the circuit board main body 10121E. The path 101212E.

It is worth mentioning that the mounting manner of the molded circuit board assembly 1010E and the filter 1040E can also be applied to a fixed focus camera module.

14 and 15 are camera modules in accordance with a fourth preferred embodiment of the present invention. Different from the above first preferred embodiment, the camera module further includes a bracket 1070, the bracket 1070 is mounted on the molded circuit board assembly 1010, and the motor 1060 is mounted on the mold. On the plastic circuit board assembly 1010, the lens 1050 is mounted to the motor 1060 to facilitate securing the lens 1050 over the molded wiring board assembly 1010. That is, the molded wiring board assemblies 1010, 1010A, 1010B, 1010C can be combined with conventional brackets to be assembled into different types of cameras. Modules, such as a focus camera module, a fixed focus camera module. The filter 1040 may be selectively mounted to the bracket 1070, the molding portion 1011, or the motor 1060.

It can be seen from the above preferred embodiment that the camera module adopting the molding process can increase the competitiveness of the product in the market, especially in the high-end products, the camera module mainly has the following advantages:

1. The length and width of the module can be reduced, and the molded part and the refractory container part can overlap in space; the conventional solution bracket needs to be outside the capacitor, and a certain safety distance needs to be reserved, and the molding manufacturing method of the invention can be directly Using the capacitor space, the plastic is filled directly around the capacitor to form a bracket.

2. Reduce the tilt of the module, and the molded part can replace the existing plastic bracket design to reduce the cumulative tolerance.

3, molding to enhance the structural strength of the circuit board, under the same structural strength, because the molded part can play a supporting role, can increase the strength, the circuit board can be made thinner, reduce the module height.

4, in the height space, the traditional solution capacitors and brackets need to reserve a safe space for assembly, the molding process can not be reserved, reducing the module height. In the conventional solution, the capacitor top end distance bracket needs to reserve a safety gap to prevent interference. In the present invention, the circuit components, such as capacitors, can be directly filled with plastic, and no space gap is required.

5. The resistor capacitor parts can be wrapped by molding, which can avoid the bad black spots of the module, such as solder resist and dust, and improve the product yield.

6, suitable for high-efficiency large-scale mass production. 14 to 18C, a camera module according to a fifth preferred embodiment of the present invention. The camera module includes a circuit board assembly 2010, a photosensitive wafer 2030, and a lens 2050.

Further, the photosensitive wafer 2030 is mounted on the circuit board assembly 2010, the lens 2050 is located on the circuit board assembly 2010, and the lens 2050 is located in a photosensitive path of the photosensitive wafer 2030. The circuit board assembly 2010 can be coupled to the electronic device for use with the electronic device. It will be understood by those skilled in the art that the lens 2050 and the wafer can cooperate with each other to capture an image. Specifically, light reflected by a subject, such as an object or a character, is received by the photosensitive wafer 2030 for photoelectric conversion after passing through the lens 2050. In other words, the photosensitive wafer 2030 can convert an optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the circuit board assembly 2010, thereby generating and capturing the object on the electronic device. Related images.

The circuit board assembly 2010 includes an encapsulation portion 2011 and a circuit board portion 2012 that are integrally packaged and connected to the circuit board portion 2012, such as moldedly connected to the circuit board portion 2012. More specifically, the encapsulation portion 2011 is molded and attached to the wiring board portion by molding in a mold (Molding On Board, MOB), and the molding process may be a process such as injection molding or molding.

The circuit board portion 2012 includes a circuit board main body 20121, and the package portion 2011 is integrally connected to the circuit board main body 20121. The encapsulation portion 2011 forms a through hole 201100 such that the encapsulation portion 2011 surrounds the outside of the photosensitive wafer 2030 and provides a light path of the lens 2050 and the photosensitive wafer 2030. The photosensitive wafer 2030 is disposed on the wiring board main body 20121 at a position corresponding to the through hole 201100.

The circuit board portion 2012 includes a connection line 2031 and at least one circuit component 20122. The connection line 2031 is preset to the circuit board main body 20121, and the circuit component 20122 is electrically connected to the connection circuit for The photosensitive operation process of the photosensitive wafer 2030. The circuit component 20122 can be, for example but not limited to, resistors, capacitors, diodes, transistors, potentiometers, relays, drivers, processors, and memories.

It is worth mentioning that the encapsulation portion 2011 can enclose the circuit component 20122 component inside, thus making the circuit component 20122 not directly exposed to the space, more specifically, not exposed to the The photosensitive wafer 2030 is in a closed environment in which it is in communication. The circuit device in different conventional camera modules exists in such a manner that the resisting container member protrudes from the circuit board, thereby preventing dust and debris from staying in the circuit component 20122 and contaminating the photosensitive wafer 2030. In this embodiment of the invention, the circuit component 20122 is exemplified by the circuit board body 20121, and in other embodiments of the invention, the circuit component 20122 is embedded in the circuit. The inside of the board main body 20121 does not protrude from the board main body 20121, and it will be understood by those skilled in the art that the structure, type, and position of the circuit element 20122 are not limited by the present invention. It can be understood that in the camera module of the transmission, the circuit device protrudes from the circuit board, and the base can only be installed on the outer side of the circuit component 20122, so the circuit device and the base need to be fixed. The spatial position, therefore, requires a higher dimension in the lateral direction of the board. For the camera module based on the molding process of the present invention, the package portion 2011 is integrally packaged in the circuit board body 20121 and covers the circuit component 20122, and thus the package portion 2011 and the circuit component 20122 The spaces overlap each other, thereby increasing the space that the encapsulation portion 2011 can be disposed inward, reducing the external extension requirement of the circuit board main body 20121, thereby reducing the lateral dimension of the camera module, so that it can satisfy Equipment for miniaturization needs.

It is worth mentioning that the encapsulation portion 2011 encapsulating the circuit component 20122 has the advantage of protecting the circuit component 20122 from being contaminated and being accidentally touched, and at the same time bringing advantages to the corresponding camera module. However, it should be understood by those skilled in the art that the package portion 2011 is not limited The circuit component 20122 is wrapped. That is, in other embodiments of the present invention, the package portion 2011 may be directly molded to the circuit board main body 20121 of the circuit component 20122 without protruding, or may be molded on the circuit component. The outside of 20122, around and other different locations.

In this embodiment of the present invention, the encapsulation portion 2011 is convexly surrounding the outer side of the photosensitive wafer 2030, and in particular, the encapsulation portion 2011 is integrally closed and connected to have a good sealing property, so that when When the lens 2050 is mounted on the photosensitive path of the photosensitive wafer 2030, the photosensitive wafer 2030 is sealed inside to form a corresponding closed inner space.

Specifically, in manufacturing the circuit board assembly 2010, a conventional wiring board can be selected as the wiring board main body 20121, and molding is performed on the surface of the wiring board main body 20121. For example, in an embodiment, the circuit board after the SMT process (Surface Mount Technology surface mount process) may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The encapsulation portion 2011 is formed by the encapsulation portion 2011, or by a molding process commonly used in semiconductor packaging. Further, each of the photosensitive wafers 2030 is attached to the wiring board main body 20121, and then each of the photosensitive wafers 2030 and the wiring board main body 20121 are electrically connected, for example, by a gold wire. The circuit board main body 20121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the encapsulation portion 2011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The encapsulating portion 2011 may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

In another embodiment of the present invention, the process of manufacturing the circuit board assembly 2010 may be performed by first performing an SMT process on the circuit board main body 20121, and then mounting the photosensitive wafer 2030 on the circuit board main body 20121. And electrically connecting the photosensitive wafer 2030 to the circuit board main body 20121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 20121, such as a molding package, by insert molding. The encapsulation portion 2011, or the encapsulation portion 2011 is formed by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the circuit board assembly 2010 is not a limitation of the present invention.

The camera module includes a filter 2040 that is mounted to the package portion 2011 to provide stable, flat mounting conditions for the filter 2040.

More specifically, in an embodiment of the invention, the filter 2040 is implemented as an Infra-Red Cut Filter (IRCF), which uses a precision optical coating. The technology alternately applies a high refractive index optical film on an optical substrate to realize a high-transmission, near-infrared (700-1100 nm) cut-off optical filter in the visible light region (400-630 nm), which can eliminate infrared light to the photosensitive wafer. 2030 imaging effects such as CCD or CMOS. By adding the infrared cut filter to the imaging system of the camera module, the imaging system partially blocks the infrared light of the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.

It is worth mentioning that, because the photosensitive wafer 2030, such as CCD or CMOS, is different from the human eye in sensing the light, the human eye can only see visible light in the 380-780 nm band, and the photosensitive wafer 2030 can sense more. Multi-bands, such as infrared light and ultraviolet light, are especially sensitive to infrared light, so infrared light must be suppressed in the camera module, and high transmission of visible light is maintained, so that the sensing of the photosensitive wafer 2030 is close to The human eye, so that the image captured by the camera module is also inductive to the eye, so the infrared cut filter is indispensable for the camera module.

In particular, in an embodiment of the invention, the filter 2040 may be selected from the group consisting of a wafer level infrared cut filter, a narrow band filter, and a blue glass IRCF. It will be understood by those skilled in the art that the type of filter 2040 is not a limitation of the present invention.

In the conventional COB assembled camera module, the filter is usually mounted on a plastic base, and the base is usually attached to the circuit board by bonding, so the plastic base and the corresponding mounting manner are not easily offset. Or tilting, and the surface of the plastic holder is poorly flat, so that the filter 2040 cannot be provided with good mounting conditions. According to this preferred embodiment of the present invention, the filter 2040 is mounted to the package portion 2011, and based on the molding process, good surface flatness can be obtained, so that the filter 2040 can be provided with a flat surface. The mounting conditions and the manner of integral molding make the package portion 2011 less prone to offset and tilting, thereby reducing the cumulative tolerance when the filter 2040 is mounted.

In this embodiment of the invention, the top surface 20112 of the encapsulation portion 2011 extends integrally planarly, and the filter 2040 is mounted to the top surface 20112 of the encapsulation portion 2011. In particular, the filter 2040 may be bonded to the top surface 20112 of the package portion 2011 by bonding.

In this embodiment of the invention, the camera module includes a motor 2060, such as a voice coil motor, a piezoelectric motor. The lens 2050 is mounted on the motor 2060 to facilitate the movement of the lens 2050 by the motor 2060 to adjust the focal length of the camera module, that is, the camera module is a moving focus module ( Automatic Focus Module, AFM). Of course, the camera module may not have a driver, that is, the motor 2060 is not provided, and a certain focus camera module is formed.

The motor 2060 is mounted on the encapsulation portion 2011 of the circuit board assembly 2010, and further, the motor 2060 is mounted on the top surface 20112 of the encapsulation portion 2011, That is, the filter 2040 and the motor 2060 coordinately occupy the top surface 20112 of the package portion 2011. The motor 2060 is electrically connected to the circuit board body 20121 through at least one motor pin 2061.

The lens 2050 is mounted on the motor 2060, and the motor 2060 and the filter 2040 are mounted on the package portion 2011, so that the package portion 2011 is equivalent to the function of the base of the conventional camera module. The motor 2060 and the filter 2040 provide a supported, fixed position, but are manufactured, assembled, and otherwise shaped differently than conventional COB processes. The base of the camera module of the conventional COB process is fixed to the circuit board in an adhesive manner, and the package portion 2011 is fixed to the circuit board main body 20121 by molding on the circuit board, and does not require a bonding and fixing process. The molding method has better connection stability and controllability of the process than the bonding and fixing method, and has high flatness, and provides good mounting conditions for the motor 2060 and the filter 2040, and the The encapsulation portion 2011 and the circuit board main body 20121 do not have an AA-adjusted glue space, thereby eliminating the reserved space for the adjustment of the conventional camera module AA, so that the thickness of the camera module is reduced; The encapsulation portion 2011 encloses the circuit component 20122, so that the conventional pedestal space and the circuit component 20122 installation space can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, thereby having a pedestal The package portion 2011 of the function can be disposed in a small size, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the encapsulation portion 2011 replaces the conventional base, avoiding the tilt error caused by the base during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

It is also worth mentioning that the shape of the encapsulation portion 2011 can be determined as needed, for example, extending inwardly at the position of the circuit component 20122 to form a protrusion, thereby increasing the corresponding width of the encapsulation portion 2011, and In the position where the circuit component 20122 is absent, the package portion 2011 The ground extends to form a relatively regular shape with a small width. It should be understood by those skilled in the art that the specific shape of the package portion 2011 is not a limitation of the present invention.

According to this embodiment of the invention, the photosensitive wafer 2030 can be electrically connected to the wiring board main body 20121 through at least one connection line 2031, and can be electrically connected to the connection line. The connecting line 2031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the connecting line 2031 of the photosensitive wafer 2030 may be connected to the wiring board main body 20121 by a conventional COB method, for example, but not limited to, a soldering manner. That is to say, the connection of the photosensitive wafer 2030 and the circuit board main body 20121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 2030 to the circuit board main body 20121 can also be realized by any other connection method capable of realizing the object of the present invention, and the present invention is in this aspect. Unlimited.

It is to be noted that, in this embodiment of the invention, each of the photosensitive wafers 2030 is disposed on an upper surface of the wiring board main body 20121, and the encapsulation portion 2011 surrounds an outer side of the photosensitive wafer 2030. In the manufacture of the circuit board assembly 2010, different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the photosensitive wafer 2030 may be first mounted on the circuit board main body 20121, and then in the photosensitive Outside the wafer 2030, the package portion 2011 is molded on the wiring board main body 20121, and the circuit element 20122 protruding from the wiring board main body 20121 is covered inside. In another embodiment of the present invention, the package portion 2011 may be molded on the circuit board main body 20121, and the circuit component 20122 protruding from the circuit board main body 20121 may be covered. Inside, the photosensitive wafer 2030 is then mounted on the wiring board main body 20121 so as to be located inside the package portion 2011.

FIG. 18A is another embodiment of a camera module according to a fifth preferred embodiment of the present invention. The camera module may be a Focus Focus Module (FFM). In the camera module, the lens 2050 is mounted on the top surface 20112 of the package portion 2011, that is, the focal length of the camera module cannot be freely adjusted. The lens 2050 and the filter 2040 coordinately configure the top surface 20112 of the encapsulation portion 2011. It will be understood by those skilled in the art that the type of imaging molding is not a limitation of the present invention.

It is worth mentioning that, according to this preferred embodiment of the present invention, the package portion 2011 can be used to support the mounting of the filter 2040 and the lens 2050, having the function of a conventional base, and based on the advantages of molding. The package portion 2011 can control the flatness and consistency of the package portion 2011 by means of a mold, thereby providing a flat and consistent installation environment for the filter color of the camera module and the lens 2050, thereby It is easier to ensure the consistency of the optical axes of the lens 2050 and the filter 2040 and the photosensitive wafer 2030, which is not easily achieved by conventional camera modules.

FIG. 18B is another embodiment of a camera module according to a fifth preferred embodiment of the present invention. The camera module may be a Fix Focus Module (FFM). In the camera module, the lens 2050 is mounted on a lens holder 2080, and the lens holder 2080 is mounted on the top surface 20112 of the package portion 2011, that is, the focal length of the camera module cannot be freely Adjustment. It can be understood that the lens holder 2080 can be a threaded bracket on the inner wall or a bracket without a thread.

FIG. 18C is another embodiment of a camera module according to a fifth preferred embodiment of the present invention. The camera module may be a Fix Focus Module (FFM). In the camera module, the lens 2050 is mounted on a lens holder 2080. The lens holder 2080 is mounted on a seat 2070. The holder 2070 is mounted on a top side of the package portion 2011.

As shown in FIG. 19, it is a camera module according to a sixth preferred embodiment of the present invention. Different from the above preferred embodiment, the package portion 2011 has a mounting groove 20113A, and the mounting groove 20113A communicates with the through hole 201100 to provide sufficient installation space for the filter 2040. That is, the top surface 20112 of the encapsulation portion 2011 has a stepped structure, and does not extend integrally. The steps of the top surface 20112 can be used to mount the filter 2040, the lens 2050 or The motor 2060.

Further, the height of the mounting slot 20113A is greater than the thickness of the filter 2040, so that when the filter 2040 is mounted on the mounting slot 20113A, the filter 2040 does not protrude from the The top of the package part 2011.

In particular, according to this embodiment of the invention, the filter 2040 is square, and the shape of the mounting groove 20113A is adapted to the shape of the filter 2040. That is, the mounting groove 20113A has a square ring shape and communicates with the through hole 201100.

It is worth mentioning that in this embodiment of the invention, the mounting slot 20113A can be used to mount the filter 2040, while in other implementations of the invention, the mounting slot 20113A can be used to mount the installation. The motor 2060 of the camera module or the lens 2050 and the like, those skilled in the art should understand that the use of the mounting slot 20113 is not a limitation of the present invention.

It is also worth mentioning that, in this embodiment of the present invention, the moving focus module is taken as an example for description, and in other embodiments of the present invention, the camera may be a certain focus module, It will be understood by those skilled in the art that the type of camera module is not a limitation of the present invention.

20 is a schematic cross-sectional view of a camera module based on a molding process in accordance with a seventh preferred embodiment of the present invention. Different from the above preferred embodiment, the camera module includes a seat 2070B for mounting the filter 2040. The holder 2070B is mounted on In the package portion 2011, the filter 2040 is mounted on the package portion 2011, and the motor 2060 or the lens 2050 is mounted on the holder 2070B.

According to this embodiment of the invention, the holder 2070B has a first seating groove 2071B and a second seating groove 2072B for mounting the filter 2040. The surface of the filter 2040 does not protrude from the top end of the holder 2070B. The second seating groove 2072B is mounted on the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070, and the position of the filter 2040 is relatively downward, thereby reducing The back focal length of the camera module is small.

In other words, the holder 2070B extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive wafer 2030, and utilizes the space inside the through hole 201100. When the filter 2040 is stably mounted, the filter 2040 does not occupy an external space.

It is worth mentioning that the distance inward of the holder 2070B is outside the photosensitive area of the photosensitive wafer 2030, that is, the holder 2070B does not block the photosensitive area of the photosensitive wafer 2030. In order to avoid affecting the photosensitive process of the photosensitive wafer 2030, the size of the holder 2070B can be specifically designed.

In this embodiment of the present invention and the corresponding drawings, a moving focus module is described as an example. The lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070B. That is, the holder 2070 provides a mounting position for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted to the holder 2070B, that is, the holder 2070B is the filter 2040 and the lens 2050 provide a mounting position, and those skilled in the art will appreciate that the specific structure of the holder 2070B and the type of camera module are not limitations of the present invention.

Figure 21 is a schematic cross-sectional view showing an image forming process based on a molding process in accordance with an eighth preferred embodiment of the present invention. Different from the above preferred embodiment, the package portion 2011 has a mounting groove 20113C, and the mounting groove 20113C communicates with the through hole 201100. That is to say, the top surface 20112 of the encapsulation portion 2011 has a stepped structure and does not extend integrally.

The camera module includes a seat 2070C for mounting the filter 2040. The holder 2070C is mounted on the package portion 2011, the filter 2040 is mounted on the package portion 2011, and the motor 2060 or the lens 2050 is mounted on the package portion 2011.

Further, the holder 2070C is mounted on the mounting groove 20113C of the package portion 2011, and the height of the mounting groove 20113C is greater than the mounting height of the holder 2070C, so that the holder 2070C does not protrude. Out of the end of the encapsulation portion 2011. That is, the holder 2070C may be disposed inside the package portion 2011.

According to this embodiment of the invention, the holder 2070C has a first seating groove 2071C and a second seating groove 2072C for mounting the filter 2040. The surface of the filter 2040 does not protrude from the top end of the holder 2070C. The second seating groove 2072C is mounted on the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070C, and the position of the filter 2040 is downward. The back focus of the camera module is reduced. It can be understood that, in other modified embodiments, the support 2070C may not have the second seat groove 2072C, and the flat bottom surface of the support 72C is directly attached to the package portion 2011.

In other words, the holder 2070C extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive wafer 2030, and utilizes the through hole The space in 201100 causes the filter 2040 to be stably installed, and the filter 2040 does not occupy an external space. Further, the holder 2070 is located outside the photosensitive region of the photosensitive wafer 2030 so as not to block the photosensitive path of the photosensitive wafer.

It is worth mentioning that the distance inwardly extending from the holder 2070C is outside the photosensitive area of the photosensitive wafer 2030, that is, the holder 2070C does not block the photosensitive wafer 2030 to avoid affecting the object. The photosensitive process of the photosensitive wafer 2030, the size of the support 2070C can be designed according to specific needs.

Different from the third preferred embodiment, the second seating groove 2072C and the mounting groove 20113C of the package cooperate with each other to form a matching snap-fit structure, thereby making the support 2070C stable. Installed in the installation slot 20113C. With respect to the third preferred embodiment, the filter 2040 in this embodiment is smaller than the photosensitive wafer 2030, and the camera module having a smaller back focus can be obtained.

In this embodiment of the present invention and the corresponding drawings, a moving focus module is described as an example. The lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070C. That is, the holder 2070C provides a mounting position for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted to the holder 2070C, that is, the holder 2070C provides a mounting position for the filter 2040 and the lens 2050, as will be understood by those skilled in the art. The specific structure of the support 2070 and the type of the camera module are not limitations of the present invention.

FIG. 22 is a cross-sectional view showing a camera module based on a molding process according to a ninth preferred embodiment of the present invention. Different from the above preferred embodiment, the filter 2040 is mounted Mounted on a motor 2060D, the motor 2060D is mounted to the package portion 2011 so that no additional components need to be provided to mount the filter 2040.

The motor 2060D includes a lower end 2062D that is adapted to be mounted to the filter 2040. That is, the lens 2050 is attached to the upper end of the motor 2060D, and the filter 2040 is attached to the lower end portion 2062D of the motor 2060D, below the lens 2050.

In this embodiment of the invention, the filter 2040 is mounted to the motor 2060D such that no additional components need to be provided to mount the filter 2040, and the motor 2060D is mounted directly to the package. In step 2011, the motor 2060D is provided with flat mounting conditions.

FIG. 23 is a cross-sectional view showing a camera module based on a molding process according to a tenth preferred embodiment of the present invention. Different from the above preferred embodiment, the lens 2050E includes a lens barrel 2051E and at least one lens 2052E, and each of the lenses 2052E is mounted in the lens barrel 2051E.

In accordance with this embodiment of the invention, the filter 2040 is mounted within the barrel 2051E below each of the lenses 2052E so that no additional components need to be provided to mount the filter 2040.

More specifically, the lens barrel 2051E includes a bottom portion 20511E for mounting the filter 2040. The base of the lens barrel 2051E is adapted to the shape of the filter 2040, that is, the base has a hollow square structure to facilitate mounting the filter 2040 therein. The upper portion of the lens barrel 2051E is used to mount the lens 2052E, and the shape of the lens 2052E is adapted, and the lower portion is used for mounting the filter 2040, and is adapted to the shape of the filter 2040. Therefore, the upper portion of the lens barrel 2051E is a circular tubular cylinder, and the inside of the lower portion is square, and the circular tube and the square are integrally connected.

The motor 2060 is mounted to the package portion 2011, and the filter 2040 is mounted to the lens barrel 2051E, so that it is not necessary to provide an additional component to mount the filter 2040.

As shown in FIG. 24, it is a schematic cross-sectional view of a camera module based on a molding process in accordance with an eleventh preferred embodiment of the present invention. Different from the above preferred embodiment, the circuit board assembly 2010 includes a circuit board body 20121F having a passage 201212F, and a lower portion of the passage 201212F is adapted to mount the photosensitive wafer 2030. Each of the vias causes the upper and lower sides of the wiring board main body 20121F to communicate, so that when the photosensitive wafer 2030 is mounted on the back surface of the wiring board main body 20121F and the photosensitive area is mounted upward on the wiring board main body 20121F, The photosensitive area of the photosensitive wafer 2030 is capable of receiving light entering by the lens 2050.

Further, the circuit board main body 20121F has an outer groove 201213F, and the outer groove 201213F communicates with the corresponding passage to provide a mounting position of the photosensitive wafer 2030. In particular, when the photosensitive wafer 2030 is mounted on the outer groove 201213F, the outer surface of the photosensitive wafer 2030 and the outer surface of the circuit board main body 20121F are in the same plane, thereby ensuring the circuit board. Surface flatness of the assembly 2010 In this embodiment of the invention, the passage is stepped to facilitate mounting the photosensitive wafer 2030, providing a stable mounting position for the photosensitive wafer 2030, and presenting the photosensitive region thereof Inner space.

It is worth mentioning that in this embodiment of the invention, a different wafer mounting method, i.e., Flip Chip (FC), is provided. The photosensitive wafer 2030 is attached to the wiring board main body 20121F from the back surface direction of the wiring board main body 20121F, instead of being required from the front surface of the wiring board main body 20121F, that is, from the wiring board as in the above embodiment. main body Above the 20121F, the photosensitive region of the photosensitive wafer 2030 is mounted upward on the wiring board main body 20121F. The structure and the mounting manner are such that the photosensitive wafer 2030 and the package portion 2011 are relatively independent, and the mounting of the photosensitive wafer 2030 is not affected by the package portion 2011, and the molding portion of the package portion 2011 is molded. The effect of the photosensitive wafer 2030 is also small. In addition, the photosensitive wafer 2030 is embedded on the outer side surface of the circuit board main body 20121F, and does not protrude from the inner side surface of the circuit board main body 20121F, thereby leaving a larger space inside the circuit board main body 20121F. The height of the package portion 2011 is not limited by the height of the photosensitive wafer 2030, so that the package portion 2011 can reach a smaller height.

It is worth mentioning that in this embodiment of the invention, the filter 2040 is mounted on the upper end of the path, that is, the filter 2040 covers the path of the circuit board body 20121F. The filter 2040 does not need to be mounted on the package portion 2011, thereby greatly reducing the back focus of the array camera module and reducing the height of the image. In particular, the filter 2040 can be an embodiment of an infrared cut filter IRCF. That is, the filter 2040 is mounted to the wiring board main body 20121F without providing an additional component such as a holder.

As shown in Figs. 25A to 26, a camera module based on a molding process according to a twelfth preferred embodiment of the present invention. Different from the above preferred embodiment, the package portion 2011 has a mounting groove 20113G, and the mounting groove 20113G communicates with the through hole 201100. That is to say, the top surface 20112G of the encapsulation portion 2011 has a stepped structure and does not extend integrally.

Further, the camera module includes a seat 2070G for mounting the filter 2040. The holder 2070G is mounted to the package portion 2011, the filter 2040 is mounted to the holder 2070G, and the motor 2060 or the lens 2050 is mounted to the package Ministry 2011. For example, the holder 2070G can be fixedly mounted to the package portion 2011 by bonding.

Further, the encapsulation portion 2011 has a convex step 20115G on at least two side faces of the top side, at least one side surface does not have the above-mentioned convex step 20115G, and a mounting groove 20113G is formed. That is, in this embodiment, the cross section of the mounting groove 20113G is not a closed structure, but a notch 201131G exists at least on one side. For the sake of smoothness, at least two symmetrical said raised steps 20115G may be provided, ie two symmetrical said mounting grooves 20113 are formed. For example, the number of the protrusion steps 20115G may be one, two, three or four. When the number of the protrusion steps 20115G is two, the two sides of the symmetry may be selectively disposed on the two sides of the symmetry, and the other two sides are symmetrically formed by the notch 201131G; when the number of the protrusions 20115G is three Optionally, any three sides are disposed, and one of the notches 201131G is formed; when the number of the protruding steps 20115G is four, the notch 201131G is not formed, that is, the raised step 20115G is closed, The installation slot 20113G is closed. In different embodiments, the support 2070G and the protruding step 20115 of different structures and the mounting groove 201131G formed thereof are matched, when the support 2070G is mounted on the mounting groove 20113G, The notch 201131G is filled to form a closed inner environment for the photosensitive wafer 2030. In other words, the mount 2070G can extend to the gap 201131G.

It is worth mentioning that the shape of the protruding step 20115G may be a regular linear structure or an irregular bending structure. Correspondingly, the cross-sectional structure of the support 2070G may be a regular structure or an irregular bent structure.

Further, the support 2070G includes at least one extended edge 2073G, and the extended edge 2073G corresponds to the notch 201131G of the mounting slot 20113G. In particular, the number of positions of the extended sides 2073G corresponds to the number and position of the notches 201131G. Of course, when the raised steps The number of 20115G is four. When a closed structure is formed, the extended side 2073G is not required to be provided, and each side of the support 2070 corresponds to the mounting groove 20113G. Of course, in another embodiment of the present invention, the encapsulation portion 2011 may not be provided with the protruding step 20115G, that is, the encapsulation portion 2011 forms a platform structure, and the support 2070 is mounted on the The platform structure, and correspondingly, the support 2070G includes four extending sides 2073G, respectively adapted to be overlapped on the sides of the encapsulation portion 2011. The width of each of the extended sides may be determined according to the width of the encapsulation portion 2011, and is not limited to a uniform width, that is, the support may have a wider extension edge 2073G, or may have a narrower The extended edge 2073G.

The holder 2070G is mounted on the mounting groove 20113G of the package portion 2011, and the height of the mounting groove 20113G is greater than the mounting height of the holder 2070G, so that the holder 2070G does not protrude. The top end of the encapsulation portion 2011. For example, the height of the mounting groove 20113G is 0.05 mm larger than the height of the support 2070G, so that when the motor 2060 is mounted on the package portion 2011, the bottom of the motor 2060 is not directly in contact with the The holder 2070G and the lens mounted in the motor 2060 are also not in contact with the holder 2070G. It is to be noted that, in this embodiment of the present invention, a moving focus camera module is taken as an example, the motor is mounted on the package portion 2011, and in other embodiments of the present invention, The camera module may also be a fixed focus module. The lens 2050 is mounted on the package portion 2011. In particular, the holder 2070G is not in direct contact with the lens barrel and the lens of the lens 2050.

It can be understood that when the size of the photosensitive wafer 2030 is large and the wall thickness of the package portion 2011 is small, the above design can still provide the package portion 2011 with space to mount the support 2070G, thereby providing Install the filter. As shown in FIG. 11A to FIG. 12, the top portion of the encapsulation portion 2011 may form the convex step 20115 on three sides, and the convex step on the other side. It is used directly to support the support 2070G in 20115. As shown in the cross-sectional view shown in Fig. 25A, it can be seen that the left and right sides have the raised step 20115, and the inner side thereof is used to mount the holder 2070G. In the other cross-sectional view shown in FIG. 25B, the top surface of the encapsulation portion 2011 on the left side directly supports the support 2070G, and the inner side of the convex step 20115 on the right side is used to limit the support 2070G. .

Moreover, in this embodiment, the top surface of the raised step 20115 may be higher than the top surface of the support 2070G, such that the motor 2060 is attached to the raised step 20115, because the package portion 2011 The motor 2060 is only integrally formed with the convex step 20115 of the package portion 2011, so that the tilt of the motor 2060 can be reduced.

It is worth mentioning that the circuit component 20122 may not be uniformly arranged on the circuit board main body 20121, so the position of the package portion 2011 reserved on the circuit board main body 20121 is not a regular symmetrical relationship. For example, a wider one is reserved on the side with the circuit element 20122, and the side without the circuit element 20122 is relatively narrow. In this case, there is a problem in that the package portion is narrow. The mounting slot is more difficult to set, and in this embodiment of the invention, the mounting slot 20113G is U-shaped, that is, on the narrow side of the encapsulation portion 2011, the mounting slot 20113G The 113G is open to the outside, and the package portion 2011 is wider. The mounting groove 20113G communicates only with the through hole 201100, and does not communicate with the external environment, thereby forming a U-shaped mounting groove 20113G. The holder 2070G is mounted to the mounting groove 20113G, and stable support can be obtained in a wider or narrower region of the package portion 2011, so that the filter 2040 is stably mounted. In other words, the extended side 2073G of the holder 2070G is filled in the opening of the U-shaped structure, so that the mounting groove 20113G is closed, and the top surface height of the package portion 2011 is relatively uniform for easy installation. The motor 60 or the lens 50.

It is worth mentioning that, according to an embodiment of the invention, the height of the mounting groove 20113G is greater than the height of the support 2070G, so in the U-shaped opening area of the mounting groove 20113G, when the support 2070G is When the mounting slot 20113G is mounted, there is a gap between the support 2070G and the side of the motor 2060, so in the camera module, the gap is sealed by a seal, so that the photosensitive The wafer 2030 is isolated from the outside. In particular, in one embodiment, the seal is a gel. That is, after the camera module is assembled, the holder 2070G is attached to the package portion 2011 by the gel to seal.

According to this embodiment of the invention, the holder 2070G has a first seating groove 2071G and a second seating groove 2072G, and the first seating groove 2071G is used to mount the filter 2040. The surface of the filter 2040 does not protrude from the top end of the holder 2070G. The second seating groove 2072G is mounted to the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070G, and the filter 2040 is positioned downwardly, thereby The back focus of the camera module is reduced.

The shape of the first seat groove 2071G matches the shape of the filter 2040, and the shape of the second seat groove 2072 matches the shape of the mounting groove 20113 of the package portion 2011.

In other words, the holder 2070G extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive wafer 2030, and utilizes the space in the through hole 201100. When the filter 2040 is stably mounted, the filter 2040 does not occupy an external space.

It is worth mentioning that the distance inward of the holder 2070G is outside the photosensitive area of the photosensitive wafer 2030, that is, the holder 2070G does not block the photosensitive wafer 2030. In order to avoid affecting the photosensitive process of the photosensitive wafer 2030, the size of the holder 2070G can be designed according to specific needs.

Different from the seventh preferred embodiment, the second seating groove 2072G and the mounting groove 20113G of the encapsulation portion 2011 cooperate with each other to form a matching snap-fit structure, so that the support 2070G can be Stable installation in the installation slot 20113G. With respect to the third preferred embodiment, the filter 2040 in this embodiment is smaller than the photosensitive wafer 2030, and the camera module having a smaller back focus can be obtained.

In this embodiment of the present invention and the corresponding drawings, a moving focus module is described as an example. The lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070G. That is, the holder 2070C provides a mounting position for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted to the holder 2070G, that is, the holder 2070G provides a mounting position for the filter 2040 and the lens 2050, as will be understood by those skilled in the art. The specific structure of the support 2070G and the type of the camera module are not limitations of the present invention.

It is worth mentioning that the support 2070G can be designed as a different structure according to different needs, such as the support 1070 of the foregoing embodiment, the support 2070 and the subsequent support 3070G, the branch. The seat 3070H facilitates the mounting of different components, such as the filter 2040, the motor 2060, the lens 2050, and the like. In this embodiment of the invention, the filter 2040 is mounted to the holder 2070G, the holder 2070G is mounted to the package portion 2011, and the lens 2050 is mounted to the motor 2060. The bottom portion of the motor 2060 is supported by the package portion 2011, and the other portion is located above the support 2070G, for example, while being lapped to the support 2070G to form a moving focus module. In another embodiment of the present invention, the bottom portion of the lens 2050 is supported by The encapsulation portion 2011, and another portion is located above the support 2070G to form a certain focus module. In another embodiment of the present invention, the filter 2040 is mounted to the holder 2070, the holder 2070 is mounted to the package portion 2011, and the lens is mounted to the motor 2060. The motor 2060 is completely supported and mounted on the package portion 2011 without the support of the support 2070, that is, the support is completely inside the package portion 2011. In another embodiment of the present invention, the lens 2050 is completely supported and mounted on the package portion 2011 to form a certain focus module. In another embodiment of the present invention, the motor 2060 or the lens 2050 is fully supported and mounted on the holder 2070, that is, the holder 2070 is disposed on the package portion 2011 and the Between the motor 2060 or the lens 2050. In another embodiment of the present invention, the filter 2040 is not mounted to the holder but is mounted to the photosensitive wafer 2030 or the wiring board main body 20121.

It should be understood by those skilled in the art that the structural features of the encapsulation portion 2011 and the support 2070G in this embodiment of the present invention may be combined and applied in other embodiments of the present invention, and are not limited to the present invention. This embodiment.

In the above embodiments and the accompanying drawings, the principle of the present invention is described by taking a moving focus module as an example. In other embodiments of the present invention, the camera module may also be fixed-focus molding, and those skilled in the art. It should be understood that the type of camera module is not a limitation of the present invention. As shown in FIG. 27 to FIG. 29, it is a camera module based on an integrated packaging process according to a thirteenth preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist the electronic device to perform shooting activities through the camera module. For example, the camera module can be used to capture images or video images of objects or people. Wait. Preferably, the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be, but not limited to, a mobile phone or a tablet device.

As shown in FIG. 27 to FIG. 29, the camera module includes an integrated base assembly 3010, a photosensitive wafer 3030, and a lens 3050.

Further, the photosensitive wafer 3030 is mounted on the integrated base assembly 3010, the lens 3050 is located on the integrated base assembly 3010, and the lens 3050 is located in a photosensitive path of the photosensitive wafer 3030. The integral base assembly 3010 can be coupled to the electronic device for use with the electronic device. It should be understood by those skilled in the art that the lens 3050 and the photosensitive wafer 3030 can cooperate with each other to capture an image. Specifically, light reflected by a subject, such as an object or a character, is received by the photosensitive wafer 3030 for photoelectric conversion after passing through the lens 3050. In other words, the photosensitive wafer 3030 can convert an optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the integrated base assembly 3010, thereby generating and photographing on the electronic device Object related image.

The unitary base assembly 3010 includes a base portion 3011 and a circuit board portion 3012 integrally connected to the circuit board portion 3012, such as moldedly connected to the circuit board portion 3012. . More specifically, the base portion 3011 is molded and connected to the wiring board portion 3012 by molding in a Molding On Board (MOB). That is, the base portion 3011 is directly connected to the circuit board portion 3012 instead of being connected by an intermediate such as glue, so that the base portion 3011 has a good connection with the circuit board portion 3012. Firmness.

The circuit board portion 3012 includes a circuit board main body 30121, and the base portion 3011 is integrally connected to the circuit board main body 30121. The base portion 3011 forms a through hole 301100 such that the base portion 3011 surrounds the outside of the photosensitive wafer 3030 and provides a light path of the lens 3050 and the photosensitive wafer 3030. The photosensitive wafer 3030 is disposed on the wiring board main body 30121 at a position corresponding to the through hole 301100.

The circuit board portion 3012 includes a connection circuit and at least one circuit component 30122. The connection circuit is preset to the circuit board body 30121, and the circuit component 30122 is electrically connected to the connection circuit for the photosensitive chip. The photographic process of the 3030. The circuit component 30122 can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, a processor, a memory, and the like.

It is worth mentioning that the base portion 3011 can cover the circuit component 30122 inside, thus making the circuit component 30122 not directly exposed to the space, more specifically, not exposed to the The photosensitive wafer 3030 is in a closed environment in which it is in communication. The circuit device in different conventional camera modules exists in such a manner that the resisting container member protrudes from the circuit board, thereby preventing dust and debris from remaining on the circuit component 30122 and contaminating the photosensitive wafer 3030. In this embodiment of the invention, the circuit component 30122 is illustrated as being exemplified by the circuit board body 30121. In other embodiments of the invention, the circuit component 30122 is embedded in the circuit. The inside of the board main body 30121 does not protrude from the board main body 30121, and it should be understood by those skilled in the art that the structure, type, and position of the circuit element 30122 are not limited by the present invention. It can be understood that in the camera module of the transmission, the circuit device protrudes from the circuit board, and the base can only be mounted on the outer side of the circuit component 30122, so the circuit device and the base need to be fixed. The spatial position, therefore, requires a higher dimension in the lateral direction of the board. For the camera module based on the integrated package process of the present invention, the base portion 3011 is integrally packaged in the circuit board main body 30121, and covers the circuit component 30122, so the base portion 3011 and the circuit The components 30122 overlap each other in space, thereby increasing the space that the base portion 3011 can be disposed inwardly, reducing the external extension requirement of the circuit board main body 30121, thereby reducing the lateral size of the camera module, so that It can meet the needs of miniaturization equipment.

It is worth mentioning that the base portion 3011 enclosing the circuit component 30122 has the advantage of protecting the circuit component 30122 from being contaminated and being accidentally touched, and bringing the corresponding camera module. Advantages, but those skilled in the art will appreciate that the base portion 3011 is not limited to encasing the circuit component 30122. That is, in other embodiments of the present invention, the base portion 3011 may be directly molded to the circuit board main body 30121 of the circuit component 30122 that is not protruding, or may be molded on the circuit. Different positions such as the outer side and the periphery of the element 30122.

In this embodiment of the present invention, the base portion 3011 is convexly surrounding the outer side of the photosensitive wafer 3030, and in particular, the base portion 3011 is integrally closed and connected to have a good sealing property. When the lens 3050 is mounted on the photosensitive path of the photosensitive wafer 3030, the photosensitive wafer 3030 is sealed inside to form a corresponding closed inner space.

Specifically, in manufacturing the integrated base assembly 3010, a conventional wiring board can be selected as the wiring board main body 30121, and molding is performed on the surface of the wiring board main body 30121. For example, in an embodiment, the circuit board after the SMT process (Surface Mount Technology surface mount process) may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The base portion 3011, or the base portion 3011 is formed by a molding process commonly used in a semiconductor package. Further, each of the photosensitive wafers 3030 is attached to the wiring board main body 30121, and then each of the photosensitive wafers 3030 and the wiring board main body 30121 are electrically connected, for example, by a gold wire. The circuit board main body 30121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like. The manner in which the base portion 3011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The material of the base portion 3011 can be selected, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene). Etc., the molding process can use epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.

In another embodiment of the present invention, the process of manufacturing the integrated base assembly 3010 may be performed by performing an SMT process on the circuit board main body 30121, and then mounting the photosensitive wafer 3030 on the circuit board main body. 30121, and the photosensitive wafer 3030 is electrically connected to the circuit board main body 30121, such as a gold wire electrical connection, and then the circuit board main body 30121 is integrally packaged, such as a molded package, by insert molding. The base portion 3011 is formed, or the base portion 3011 is formed by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the unitary base assembly 3010 is not a limitation of the present invention.

The camera module includes a filter 3040 that is mounted to the base portion 3011 to provide stable, flat mounting conditions for the filter 3040.

More specifically, in an embodiment of the invention, the filter 3040 is implemented as an Infra-Red Cut Filter (IRCF), which uses a precision optical coating. The technology alternately applies a high refractive index optical film on an optical substrate to realize a high-transmission, near-infrared (700-1100 nm) cut-off optical filter in the visible light region (400-630 nm), which can eliminate infrared light to the photosensitive wafer. 3030 imaging effects such as CCD or CMOS. By adding the infrared cut filter 3040 to the imaging system of the camera module, the imaging system partially blocks the infrared light of the imaging quality, so that the image formed by the camera module is more in line with the best feeling of the human eye.

It is worth mentioning that, because the photosensitive wafer 3030, such as CCD or CMOS, is different from the human eye in sensing the light, the human eye can only see visible light in the 380-780 nm band, and the photosensitive wafer 3030 can sense more. Multi-band, such as infrared and ultraviolet light, especially sensitive to infrared light, so In the camera module, infrared light must be suppressed, and high transmission of visible light is maintained, so that the sensing of the photosensitive wafer 3030 is close to the human eye, so that the image captured by the camera module also blinks. Therefore, the infrared cut filter 3040 is indispensable for the camera module.

In particular, in an embodiment of the invention, the filter 3040 may be selected from the group consisting of a wafer level infrared cut filter, a narrow band filter, and a blue glass IRCF. It will be understood by those skilled in the art that the type of filter 3040 is not a limitation of the present invention.

In the conventional COB assembled camera module, the filter is usually mounted on a plastic base, and the base is usually attached to the circuit board by bonding, so the plastic base and the corresponding mounting manner are not easily offset. Or tilting, and the surface of the plastic bracket is poorly flat, so the filter 3040 cannot be provided with good mounting conditions. According to this preferred embodiment of the present invention, the filter 3040 is mounted to the base portion 3011, and based on the molding process, good surface flatness can be obtained, so that the filter 3040 can be provided with a flat surface. The mounting condition and the integrally formed manner make the base portion 3011 less prone to eccentricity and tilting, thereby reducing the cumulative tolerance when the filter 3040 is mounted.

It is also worth mentioning that the shape of the base portion 3011 can be determined as needed, for example, extending inwardly at the position of the circuit component 30122 to form a protrusion, thereby increasing the corresponding width of the base portion 3011. In the absence of the circuit component 30122, the base portion 3011 extends uniformly to form a relatively regular shape with a small width. It will be understood by those skilled in the art that the specific shape of the base portion 3011 is not a limitation of the present invention.

Further, the base portion 3011 includes a covering portion 30114 and a filter mounting portion 30115. The filter mounting portion 30115 is integrally molded and integrally connected to the covering portion 30114. The segment 30114 is molded and coupled to the circuit board body 30121 for cladding the circuit component 30122. The filter mounting section 30115 is for mounting the filter 3040.

That is, when the integrated base assembly 3010 is used to assemble the camera module, the filter 3040 of the camera module is mounted to the filter mounting section 30115 such that the The filter 3040 is located on the corresponding photosensitive path of the photosensitive wafer 3030 and does not require the provision of an additional filter 3040 mounting bracket. That is to say, the base portion 3011 has the function of a conventional mirror base here, but based on the advantages of the integrated packaging process, the top of the filter mounting section 30115 can be made to have a good process by means of a mold process. The flatness is such that the filter 3040 is mounted flat, which is also superior to the conventional camera module.

Further, the filter mounting portion 30115 forms a mounting slot 30113, and the mounting slot 30113 communicates with the through hole 301100 to provide sufficient installation space for the filter 3040, so that the filter 3040 It does not protrude from the top surface of the filter mounting section 30115. That is, the mounting groove 30113 is disposed at the upper end of the base portion 3011, so that the filter 3040 is stably mounted to the base portion 3011 and does not protrude from the base portion 3011. The top of the.

It should be noted that in this embodiment of the invention, the mounting slot 30113 can be used to mount the filter 3040, while in other implementations of the invention, the mounting slot 30113 can be used to mount the device. The components of the motor or lens of the camera module, those skilled in the art will appreciate that the use of the mounting slot 30113 is not a limitation of the present invention.

In other words, the base portion 3011 has the mounting groove 30113, and the mounting groove 30113 communicates with the through hole 301100 to provide a sufficient installation space for the filter 3040. That is, the top surface 30112 of the base portion 3011 has a stepped structure, and is not integrally extended. The steps of the top surface 30112 can be used to mount the filter 3040, the lens 3050, or the motor 3060.

Further, the height of the mounting groove 30113 is greater than the thickness of the filter 3040, so that when the filter 3040 is mounted on the mounting groove 30113, the filter 3040 does not protrude from the The top end of the base portion 3011.

In particular, according to this embodiment of the invention, the filter 3040 has a square shape, and the shape of the mounting groove 30113 is adapted to the shape of the filter 3040. That is, the mounting groove 30113 has a square ring shape in cross section and communicates with the through hole 301100.

It should be noted that in this embodiment of the invention, the mounting slot 30113 can be used to mount the filter 3040, while in other implementations of the invention, the mounting slot 30113 can be used to mount the device. The motor 3060 of the camera module or the lens 3050 and the like, those skilled in the art should understand that the use of the mounting groove 30113 is not a limitation of the present invention.

In this embodiment of the invention, the camera module includes a motor 3060, such as a voice coil motor, and the lens 3050 is mounted to the motor 3060 to facilitate movement of the lens 3050 by the motor 3060. Adjusting the focal length of the camera module, that is, the camera module is an Automatic Focus Module (AFM). The motor 3060 is electrically connected to the circuit board body 30121 through at least one motor pin 3061.

It is also worth mentioning that, in this embodiment of the present invention, the moving focus module is taken as an example for description, and in other embodiments of the present invention, the camera may be a certain focus module, It will be understood by those skilled in the art that the type of camera module is not a limitation of the present invention.

The motor 3060 is mounted to the base portion 3011 of the integrated base assembly 3010. Further, the motor 3060 is mounted to the top surface 30112 of the base portion 3011. That is, the filter 3040 and the motor 3060 coordinately occupy the top surface 30112 of the base portion 3011. The motor 3060 is electrically connected to the circuit board body 30121 through at least one motor pin 3061.

The lens 3050 is mounted on the motor 3060, and the motor 3060 and the filter 3040 are mounted on the base portion 3011, so that the base portion 3011 functions as a base of a conventional camera module. The motor 3060 and the filter 3040 are provided with a supported, fixed position, but the manufacturing, assembly, and form are different from the conventional COB process. The base of the camera module of the conventional COB process is fixed to the circuit board in an adhesive manner, and the base portion 3011 is fixed to the circuit board main body 30121 by molding on the circuit board, and the bonding and fixing process is not required. The molding method has better connection stability and controllability of the process with respect to the bonding and fixing manner, and has higher flatness, and provides good mounting conditions for the motor 3060 and the filter 3040, and The base portion 3011 and the circuit board main body 30121 do not have an AA-adjusted glue space, thereby eliminating the reserved space for the adjustment of the conventional camera module AA, so that the thickness of the camera module is reduced; The base portion 3011 encloses the circuit component 30122 such that the conventional pedestal space and the circuit component 30122 installation space can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module. The base portion 3011 having a base function can be disposed in a small size, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the base portion 3011 replaces the conventional base, avoiding the tilt error caused by the base during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.

It is also worth mentioning that the shape of the base portion 3011 can be more determined, for example, extending inwardly at the position of the circuit component 30122 to form a protrusion, thereby increasing the corresponding width of the base portion 3011. And in the position where the circuit component 30122 is absent, the continuous molding portion 1 The ground extends to form a relatively regular shape with a small width. It will be understood by those skilled in the art that the shape of the base portion 3011 is not a limitation of the present invention.

According to this embodiment of the invention, the photosensitive wafer 3030 can be electrically connected to the wiring board main body 30121 through at least one connection line 3031, and can be electrically connected to the connection line. The connection line 3031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the connecting line 3031 of the photosensitive wafer 3030 may be connected to the wiring board main body 30121 by a conventional COB method, for example, but not limited to, a soldering manner. That is to say, the connection of the photosensitive wafer 3030 and the circuit board main body 30121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources. Of course, it should be understood by those skilled in the art that the connection of the photosensitive wafer 3030 and the circuit board main body 30121 can also be realized by any other connection method capable of realizing the object of the present invention, and the present invention is in this aspect. Unlimited.

It is to be noted that, in this embodiment of the invention, each of the photosensitive wafers 3030 is disposed on an upper surface of the wiring board main body 30121, and the base portion 3011 surrounds an outer side of the photosensitive wafer 3030. . In the fabrication of the integrated base assembly 3010, different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the photosensitive wafer 3030 may be first mounted on the wiring board body 30121, and then in the Outside the photosensitive wafer 3030, the base portion 3011 is molded on the wiring board main body 30121, and the circuit component 30122 protruding from the wiring board main body 30121 is covered inside. In another embodiment of the present invention, the base portion 3011 may be molded on the circuit board main body 30121, and the circuit component 30122 protruding from the circuit board main body 30121 may be covered. Inside, the photosensitive wafer 3030 is then attached to the wiring board main body 30121 so as to be located inside the base portion 3011.

Referring to FIG. 30, another embodiment of a camera module according to a thirteenth preferred embodiment of the present invention may be a Fix Focus Module (FFM). In the camera module, the lens 3050 is mounted on the top surface 30112 of the base portion 3011, that is, the focal length of the camera module cannot be freely adjusted. The lens 3050 and the filter 3040 coordinately configure the top surface 30112 of the base portion 3011, and the filter 3040 is mounted with the mounting groove 30113. It will be understood by those skilled in the art that the type of imaging molding is not a limitation of the present invention.

It is worth mentioning that, according to this preferred embodiment of the present invention, the base portion 3011 can be used to support the mounting of the filter 3040 and the lens 3050, having the function of a conventional base, and based on molding. Advantageously, the base portion 3011 can control the flatness and uniformity of the base portion 3011 by means of a mold to provide a flat and uniform color for the filter 3040 and the lens 3050 of the camera module. The mounting environment makes it easier to ensure the consistency of the optical axes of the lens 3050 and the filter 3040 and the photosensitive wafer 3030, which is not easily achieved by conventional camera modules.

Referring to FIG. 31A, in accordance with a camera module of a fourteenth preferred embodiment of the present invention, the integrated base assembly 3010 of the camera module includes a motor connection structure 3013 for connecting the camera module. Motor 3060. The motor 3060 has at least one motor pin 3061. The motor connection structure 3013 includes at least one lead 30131, and each of the leads 30131 is for electrically connecting the motor 3060 and the circuit board main body 30121. Each of the leads 30131 is electrically connected to the board main body 30121. Further, each of the leads 30131 is electrically connected to a connection circuit of the circuit board main body 30121. The lead wire 30131 is disposed to the base portion 3011 and extends to a top end of the base portion 3011. The lead wire 30131 includes a motor connection end 3013111311 exposed at a top end of the base portion 3011 for electrically connecting the motor pin 3061 of the motor 3060. It is worth mentioning that the lead 30131 can be in the shape The base portion 3011 is provided in an embedded manner. In the conventional connection mode, components such as a drive motor are connected to the circuit board by providing separate wires, and the manufacturing process is relatively complicated, and the method of embedding the lead wires 30131 in the molding of the present invention can replace the conventional one. Processes such as motor welding and make the circuit connection more stable. In one embodiment of the present invention, the lead wire 30131 is a wire that is embedded inside the base portion 3011. For example, the motor pin 3061 motor pin 3061 may be connected to the motor connection end 301311 through an anisotropic conductive film, or may be connected to the motor connection end 301311 by soldering.

It is to be noted that the buried position of the lead 30131 and the position of the motor connecting end 301311 of the lead 30131 at the base portion 3011 can be set as needed, for example, in an embodiment of the invention. The motor connection end 301311 of the lead wire 30131 may be disposed at a periphery of the base portion 3011, that is, a top surface of the base portion 3011, a top surface of the filter mounting portion 30115, and In another embodiment of the present invention, the motor connection end 301311 can be disposed on the inner circumference of the base portion 3011, that is, the bottom surface of the mounting groove 30113 of the base portion 3011, so that the motor can be provided. 3060 different installation locations. In other words, when the motor 3060 needs to be mounted to the top of the base portion, the motor connection end 301311 is disposed on the peripheral top surface of the base portion, when the motor 3060 needs to be mounted to the mounting groove 30113. The motor connecting end 301311 is disposed on the inner circumference of the base portion 3011, that is, the bottom surface of the mounting groove 30113.

That is, when the integrated base assembly 3010 is manufactured, each of the photosensitive wafers 3030 may be attached to the wiring board main body 30121, and then the MOB is molded on the wiring board main body 30121. a base portion 3011, and the lead wire 30131 may be disposed inside the base portion 3011 in a buried manner during molding, and the lead wire 30131 is electrically connected to the circuit board main body 30121, and the lead wire 30131 is caused The motor connection end 301311 is displayed on the base portion The top end is adapted to be coupled to the motor pin 3061 of the motor 3060. For example, when the integral base assembly 3010 is used to assemble the imaging molding, each of the motor pins 3061 of the motor 3060 is connected to the motor connection end of the lead 30131 by soldering. 301311, such that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire is required to connect the motor 3060 and the circuit board main body 30121, and the motor pin of the motor 3060 is made The length of 3061 can be reduced.

Figure 31B is an equivalent embodiment of the motor connection structure in accordance with the above-described preferred embodiment of the present invention. The motor connection structure 3013 includes a lead slot 30133 for receiving the motor pin 3061 motor pin 3061 of the motor 3060 of the camera module. The lead groove 30133 is provided at an upper end of the base portion 3011. The motor connection structure 3013 includes at least one lead 30134, each of the leads 30134 for electrically connecting the motor 3060 and the circuit board body 30121. The lead wire 30134 is disposed to the base portion 3011 and extends upward to a groove bottom wall of the lead groove 30133 of the base portion 3011. The lead 30134 includes a motor connection end 301341 exposed on the bottom wall of the pin slot 30133 of the base portion 3011 for electrically connecting the motor pin 3061 of the motor 3060 to the motor pin 3061. . In particular, in one embodiment, the motor connection end 301341 can be implemented as a pad. The lead wire 30134 may be implemented as a wire that is buried inside the base portion 3011.

That is, when the integrated base assembly 3010 is manufactured, the photosensitive wafer 3030 is first mounted, and then the base portion 3011 is molded on the circuit board main body 30121 in an MOB manner, and is preset. The lead groove 30133 of a predetermined length, and the lead wire 30134 may be disposed in a buried manner at the time of molding, and the lead wire 30134 is electrically connected to the circuit board main body 30121, and the motor of the lead wire 30134 is caused The connecting ends 301311, 301341 are displayed on the base portion 3011 The bottom wall of the slot 30133 is adapted to be coupled to the motor pin 3061 of the motor 3060. For example, when the integrated base assembly 3010 is used to assemble the imaging molding, each of the motor pins 3061 of the motor 3060 is inserted into the lead slot 30133, and is connected to the ground by soldering. The motor connection ends 301311, 301341 of the lead 30134, such that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire is required to connect the motor 3060 and the circuit board main body 30121, and The motor pin 3061 of the motor 3060 can be stably connected to prevent externally unneeded contact with the motor pin 3061. In particular, the lead 30134 may be implemented as a wire that is embedded inside the base portion 3011.

Referring to Fig. 31C, there is shown another alternative embodiment of the motor connecting structure according to the above preferred embodiment of the present invention. The motor connection structure 3013 includes a lead slot 30135 for receiving the motor pin 3061 of the motor 3060 of the camera module. The lead groove 30135 is provided to the base portion 3011. The motor connection structure 3013 includes at least one circuit contact 30132 that is preset to the circuit board body 30121 and electrically connected to the connection line of the circuit board body 122. Further, each of the lead slots 30135 extends from the top end of the base portion 3011 to the board body 30121, and causes the circuit contacts 30132 to be displayed. In one embodiment, the motor pin 3061 is adapted to be inserted into the lead slot 30135 and may be soldered to the circuit contact 30132.

That is, when the integrated base assembly 3010 is manufactured, each of the circuit contacts 30132 is preset on the circuit board main body 30121, and then the photosensitive core 121 is mounted, and then the circuit board main body is mounted. At 30121, the base portion 3011 is molded in a MOB manner, and the lead groove 30135 of a predetermined length is preset, and the circuit contact 30132 is displayed through the lead groove 30135 so as to be connected to The motor pin 3061 of the motor 3060. For example, in the integrated base assembly When the 3010 is used to assemble the image forming mold, each of the motor pins 3061 of the motor 3060 is inserted into the lead slot 30135, and is connected to the circuit contact on the board main body 30121 by soldering. 30132, thereby causing the motor 3060 to be electrically connected to the circuit board main body 30121, and the motor pin 3061 of the motor 3060 can be stably connected to prevent externally unnecessarily touching the motor pin 3061.

Referring to Figure 31D, there is shown another alternative embodiment of the motor attachment structure in accordance with the above preferred embodiment of the present invention. The motor connection structure 3013 includes an engraving line 30136 for electrically connecting the connection line on the board main body 30121, the photosensitive wafer 3030, and a motor. By way of example and not limitation, the engraving line 30136 can be disposed by laser forming (LDS) when the base portion 3011 is formed. In the conventional connection mode, components such as a drive motor are connected to the wiring board by providing separate wires, and the manufacturing process is relatively complicated, and the manner of providing the engraving line 30136 in the molding of the present invention can be replaced. Conventional motor welding and other processes, and make the circuit connection more stable. More specifically, the engraving line 30136 may be formed by the fact that the base portion 3011 is now provided with an engraving groove, and then an electric circuit is provided in the engraving groove by electroplating.

In a different embodiment of the present invention, the manner in which the motor 3060 of the camera module is coupled to the integrated base assembly 3010 can be freely combined with the connection manners corresponding to FIGS. 6A, 6B, 6C, and 6D, and is selected to be suitable. The motor 3060 is connected in a manner such as the lead slot 30133 and the lead 30134, the lead slot 30135, and the circuit contact 30132. In an embodiment of the invention, referring to Fig. 2, the motor 3060 can be coupled to the unitary base assembly 3010 in a conventional manner, such as by welding. It will be understood by those skilled in the art that the manner in which the motor 3060 and the unitary base assembly 3010 are coupled is not a limitation of the present invention.

As shown in FIG. 32, it is a camera module and an integrated base assembly thereof according to a fifteenth preferred embodiment of the present invention. In contrast to the preferred embodiment described above, the unitary base assembly 3010 includes a circuit board body 30121A. The circuit board main body 30121A includes two inner recesses 301211A, and each of the photo-sensing wafers 3030 is disposed in the corresponding inner recess 301211A. Unlike the integrated base assembly 3010 of the above embodiment, the photosensitive wafer 3030 is disposed in the inner recess 301211A and accommodates the photosensitive wafer 3030 therein so that the photosensitive wafer 3030 does not protrude significantly The upper surface of the circuit board main body 30121A reduces the height of the photosensitive wafer 3030 relative to the base portion 3011, thereby reducing the height limitation of the photosensitive wafer 3030 to the base portion 3011, and further reducing the height. The possibility that the photosensitive wafer 3030 is mounted in the inner groove 301211A can protect the photosensitive wafer 3030, especially the connecting line 3031, from external components from being inadvertently touched by the photosensitive wafer 3030.

Further, the photosensitive wafer 3030 is connected to the wiring board main body 30121 through the connection line 3031, and is electrically connected to the connection line. The leads may be implemented as, for example but not limited to, gold wires, copper wires, aluminum wires, silver wires. That is, the photosensitive wafer 3030 and the connecting line 3031 are both located in the inner groove 301211A of the wiring board main body 30121A. In an embodiment, when the integrated base assembly 3010 is manufactured, the inner groove 301211A needs to be disposed on the circuit board main body 30121A. That is, the inner groove 301211A is opened on a conventional wiring board to be adapted to accommodate the mounting of the photosensitive wafer 3030.

Figure 33 is a cross-sectional view showing a camera module and an integrated base assembly thereof in accordance with a sixteenth preferred embodiment of the present invention.

Different from the above preferred embodiment, the integrated base assembly 3010 includes a circuit board main body 30121B, and the circuit board main body 30121B has a passage 301212B, the passage The lower portion of 301212B is adapted to mount the photosensitive wafer 3030. The via 301212B causes the upper and lower sides of the wiring board main body 30121B to communicate, so that when the photosensitive wafer 3030 is mounted on the back surface of the wiring board main body 30121B and the photosensitive area is mounted upward on the wiring board main body 30121B, The photosensitive area of the photosensitive wafer 3030 is capable of receiving light entering by the lens 3050.

Further, the circuit board main body has an outer groove 301213B, and the outer groove 301213B communicates with the corresponding path 301212B to provide a mounting position of the photosensitive wafer 3030. In particular, when the photosensitive wafer 3030 is mounted on the outer groove 301213B, the outer surface of the photosensitive wafer 3030 and the surface of the circuit board main body 30121B are in the same plane, thereby ensuring the integrated base. The surface flatness of the assembly 3010.

That is, in this embodiment of the invention, the via 301212B is stepped to facilitate mounting the photosensitive wafer 3030, providing a stable mounting position for the photosensitive wafer 3030, and displaying the photosensitive region therein. space.

It is worth mentioning that in this embodiment of the invention, a different wafer mounting method, i.e., Flip Chip (FC), is provided. The photosensitive wafer 3030 is attached to the wiring board main body 30121B from the back surface direction of the wiring board main body 30121B instead of being required from the front surface of the wiring board main body 30121B, that is, from the wiring board as in the above embodiment. Above the main body 30121B, the photosensitive region of the photosensitive wafer 3030 is mounted upward on the wiring board main body 30121B. The structure and the mounting manner are such that the photosensitive wafer 3030 and the base portion 3011 are relatively independent, and the mounting of the photosensitive wafer 3030 is not affected by the base portion 3011, and the mold of the base portion 3011 The influence of the molding on the photosensitive wafer 3030 is also small. In addition, the photosensitive wafer 3030 is embedded on the outer side surface of the circuit board main body 30121B, and does not protrude from the inner side surface of the circuit board main body 30121B, so that a larger space is left inside the circuit board main body 30121B. Make The height of the base portion 3011 is not limited by the height of the photosensitive wafer 3030, so that the base portion 3011 can reach a smaller height.

It is worth mentioning that in other embodiments of the present invention, the filter 3040 is mounted on the upper end of the via 301212B, that is, the filter 3040 does not need to be mounted on the base portion 3011. Thereby reducing the back focus of the camera module and reducing the height of the camera. In particular, the filter 3040 can be an embodiment of an infrared cut filter IRCF.

Figure 34 is a cross-sectional view showing a camera module and an integrated base assembly thereof in accordance with a seventeenth preferred embodiment of the present invention.

The integrated base assembly 3010 includes a reinforcement layer 30123C that is laminatedly coupled to the bottom layer of the circuit board body 30121 to enhance the structural strength of the circuit board body 30121. That is, the reinforcement layer 30123C is placed on the bottom layer of the base portion 3011 and the region where the photosensitive wafer 3030 is located on the circuit board main body 30121, so that the circuit board main body 30121 stably and reliably supports the The base portion 3011 and the photosensitive wafer 3030.

Further, the reinforcing layer 30123C is a metal plate attached to the bottom layer of the circuit board main body 30121 to increase the structural strength of the circuit board main body 30121, and on the other hand, the integrated base assembly is added. The heat dissipation performance can effectively dissipate the heat generated by the photosensitive wafer 3030.

It is worth mentioning that the circuit board main body 30121 can adopt an FPC (Flex Print Circuit), and the rigidity of the FPC by the reinforcing layer 30123C enables the FPC with good bending performance to satisfy. The load bearing requirements of the integral base assembly. That is to say, the circuit board body 30121 has a wider range of options, such as a PCB (Printed Circuit Board), FPC, RG (Rigid Flex, soft and hard board). Through the reinforcement layer 30123B increases the structural strength of the circuit board main body 30121 and improves heat dissipation performance, so that the thickness of the circuit board main body 30121 can be reduced, so that the height of the integrated base assembly is further reduced, and the imaging mode assembled therefrom The height of the group is reduced.

35 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with an eighteenth preferred embodiment of the present invention.

Different from the above preferred embodiment, the circuit board main body 30121D has at least one reinforcing hole 301214D, and the base portion 3011 extends into the reinforcing hole 301214D, thereby enhancing the structural strength of the circuit board main body 30121D.

The position of the reinforcing hole 301214D can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure. The structural strength of the circuit board main body 30121D is enhanced by the arrangement of the reinforcing holes 301214D, so that the thickness of the circuit board main body 30121D can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the integrated base assembly.

It is worth mentioning that the reinforcing hole 301214D is in the shape of a groove, so that when the integral base assembly is manufactured, the molding material of the base portion 3011 does not leak out from the reinforcing hole 301214D.

Figure 36 is a cross-sectional view showing a camera module and an integrated base assembly thereof according to a nineteenth preferred embodiment of the present invention.

Different from the above preferred embodiment, the circuit board main body 30121E has at least one reinforcing hole 301214E, and the base portion 3011 extends into the reinforcing hole 301214E, thereby enhancing the structural strength of the circuit board main body 30121E.

The position of the reinforcing hole 301214E can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure. By the design of the reinforcing hole 301214E The structural strength of the circuit board main body 30121E is enhanced, so that the thickness of the circuit board main body 30121E can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the heat dissipation performance of the integrated base assembly can be improved.

It is to be noted that the reinforcing holes 301214E are perforated, that is, pass through the circuit board main body 30121E such that both sides of the circuit board main body 30121E communicate, thereby manufacturing the integrated base assembly. The molding material of the base portion 3011 is sufficiently combined with the wiring board main body 30121E to form a more robust composite material structure, and the perforation is easier to manufacture than the groove-like structure.

37 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with a twentieth preferred embodiment of the present invention.

Different from the above preferred embodiment, the base portion 3011F includes a covering portion 30114F, a filter mounting portion 30115F and a lens mounting portion 30116F, the filter mounting portion 30115F and the lens mounting. The segment 30116F is integrally molded in series with the cladding segment 30114F, and the cladding segment 30114F is molded and coupled to the circuit board body 30121 for covering the circuit component 30122 and the connection line 3031. The filter mounting section 30115F is used to mount the filter 3040, that is, when the integrated base component is used to assemble the camera module, the filter 3040 of the camera module The filter mounting section 30115F is mounted such that the filter 3040 is positioned on the photosensitive path of the photosensitive wafer 3030 without the need to provide an additional filter 3040 mounting bracket. That is, the base portion 3011F has the function of a conventional bracket here, but based on the advantages of the integrated packaging process, the top of the filter mounting portion 30115F can be well flattened by means of a mold-forming process. This makes the filter 3040 mounted flat, which is also superior to the conventional camera module. The lens mounting section 30116F is for mounting the lens 3050, that is, when When the integrated base assembly is used to assemble the camera module, the lens 3050 is mounted inside the lens mounting section 113F of the base portion 3011F to provide a stable mounting position for the lens 3050.

Further, the filter mounting portion 30115F has a mounting slot 30113F, and the mounting slot 30113F communicates with the corresponding through hole 301100F to provide sufficient installation space for each of the filters 3040. The filter 3040 is stably mounted. The lens mounting section 30116F has a lens mounting slot 301131F, and each of the lens mounting slots 301131F communicates with the corresponding through hole 301100F to provide sufficient mounting space for each of the lenses 3050.

In other words, the filter mounting section 30115F and the lens mounting section 30116F extend integrally upwardly, and a stepped structure is formed inside to provide a support fixing position for the filter 3040 and the lens 3050, respectively. There is no need to provide additional components to mount the filter 3040 and the lens 3050. That is, the base portion 3011 has two mounting slots, one of which is located at a lower position, and one of the mounting slots 30113F is located at a higher position to form a two-step stepped structure. The mounting slot 30113F in the lower position is used to mount the filter 3040, and the mounting slot 30113F in the upper position is used to mount the lens 3050.

The lens mounting section 30116F has two lens inner walls 301161F, and each of the lens inner walls 301161F has a closed annular shape, which is suitable for providing a mounting space for the lens 3050. It is worth mentioning that each of the lens inner walls 301161F of the lens mounting section 301162F has a flat surface, so as to be suitable for mounting the unthreaded lens 3050 to form a fixed focus module. In particular, the lens 3050 can be fixed to the lens mounting segment 30116F by bonding.

Referring to Figure 38, there is shown an integrated base assembly and camera module in accordance with a twenty-first preferred embodiment of the present invention. Different from the above preferred embodiment, the integrated base assembly 3010 includes a The shielding layer 30124 encloses the circuit board main body 30121 and the base portion 3011, thereby enhancing the electromagnetic resistance of the integrated base assembly 3010 while enhancing the structural strength of the circuit board main body 30121 Interference ability.

Referring to Figure 39, a camera module and an integrated base assembly thereof according to a twenty-second preferred embodiment of the present invention. Different from the above preferred embodiment, the camera module includes at least one seat 3070G for mounting each of the filters 3040, each of the lenses 3050 or each of the motors 3060. According to this embodiment of the invention, the holder 3070 is mounted to the base portion 3011, and each of the filters 3040 is mounted to the holder 3070, and each of the motors 3060 is mounted to the holder Block 3070. The specific shape of the support 3070 can be set as needed, such as a boss is provided to facilitate the mounting of each of the filters.

According to this embodiment of the invention, the holder 3070G has a first holder groove 3071G and a second holder groove 3072G, and the first holder groove 3071G is used to mount the filter 3040. The surface of the filter 3040 does not protrude from the top end of the holder 3070. The second seat groove 3072G is mounted to the base portion 3011 such that the base portion 3011 extends upward along the support 3070G, and the position of the filter 3040 is downward. Thereby reducing the back focus of the camera module.

In other words, the holder 3070G extends into the through hole 301100 and extends downward to support the filter 3040 over the photosensitive wafer 3030, and utilizes the space in the through hole 301100. When the filter 3040 is stably mounted, the filter 3040 does not occupy an external space.

It is worth mentioning that the distance inward of the holder 3070G is outside the photosensitive area of the photosensitive wafer 3030, that is, the holder 3070G does not block the photosensitive wafer 3030. The photosensitive region is to avoid affecting the photosensitive process of the photosensitive wafer 3030, and the size of the holder 3070G can be specifically designed.

In this embodiment of the present invention and the corresponding drawings, a moving focus module is described as an example. The lens 3050 is press-fitted to the motor 3060, and the motor 3060 is mounted to the holder 3070G. That is, the holder 3070G provides a mounting position for the filter 3040 and the motor 3060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 3050 is mounted to the holder 3070G, that is, the holder 3070G provides a mounting position for the filter 3040 and the lens 3050, as will be understood by those skilled in the art. The specific structure of the support 3070 and the type of the camera module are not limitations of the present invention.

Referring to Figure 40, another embodiment of a camera module in accordance with a twenty-second preferred embodiment of the present invention. Different from the above preferred embodiment, the camera module includes a seat 3070H for mounting the filter 3040. The holder 3070H is attached to the base portion 3011, the filter 3040 is attached to the base portion 3011, and the motor 3060 or the lens 3050 is attached to the base portion 3011.

Further, the support 3070H is mounted on the mounting groove 30113 of the base portion 3011, and the height of the mounting groove 30113 is greater than the mounting height of the support 3070H, so that the support 3070H does not Projecting from the top end of the base portion 3011.

According to this embodiment of the invention, the holder 3070H has a first holder groove 3071H and a second holder groove 3072H, and the first holder groove 3071H is used for mounting the filter 3040. The surface of the filter 3040 does not protrude from the top end of the holder 3070H. The second seat groove 3072H is for mounting on the base portion 3011 such that the base portion 3011 is along the support The 3070H extends upward, and the position of the filter 3040 is downward, thereby reducing the back focus of the camera module.

In other words, the holder 3070H extends into the through hole 301100 and extends downward to support the filter 3040 over the photosensitive wafer 3030, and utilizes the space inside the through hole 301100. When the filter 3040 is stably mounted, the filter 3040 does not occupy an external space.

It is worth mentioning that the distance inwardly extending from the holder 3070H is outside the photosensitive area of the photosensitive wafer 3030, that is, the holder 3070H does not block the photosensitive wafer 3030 to avoid affecting the object. The photosensitive process of the photosensitive wafer 3030, the size of the support 3070C can be designed according to specific needs.

Different from the above preferred embodiment, the second seating groove 3072H and the mounting groove 30113 of the package cooperate with each other to form a matching snap-fit structure, so that the support 3070H can be stably installed on the support. The installation slot 30113 is inside. With respect to the third preferred embodiment, the filter 3040 in this embodiment is smaller than the photosensitive wafer 3030, and the camera module having a smaller back focus can be obtained.

In this embodiment of the present invention and the corresponding drawings, a moving focus module is described as an example. The lens 3050 is press-fitted to the motor 3060, and the motor 3060 is mounted to the holder 3070H. That is, the holder 3070H provides a mounting position for the filter 3040 and the motor 3060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 3050 is mounted to the holder 3070H, that is, the holder 3070H provides a mounting position for the filter 3040 and the lens 3050, as will be understood by those skilled in the art. The specific structure of the support 3070H and the type of the camera module are not limitations of the present invention.

41 is a schematic diagram showing the structural strength comparison between an imaging and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention. The left side of FIG. 42 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. The thickness of the holder 3P of the conventional image pickup module is indicated by a1, and the thickness of the base portion 3011 of the image pickup module of the present invention is indicated by a2.

In the conventional camera module, the bracket 3P is used to mount the filter 4P, the motor 5P or the lens 6P, and the bracket 3P is usually a plastic component formed by injection molding. In the conventional camera module, the bracket 3P is generally mounted on the outer side of the circuit device 11P, so that the installation space reserved for the bracket 3P is limited without increasing the lateral dimension of the circuit board body. The thickness a1 of the bracket 3P can only be limited to a small range, such as 0.3 mm. At this time, the mutual bonding area of the bracket 3P and the circuit board 1P is small, so the connection stability is poor, that is, The bracket 3P is easily separated from the wiring board 1P or cracked when it is used for a long period of time or has a strong external force.

According to the camera module of the integrated package process according to the preferred embodiment of the present invention, the base portion 3011 is integrally packaged in the circuit board main body 30121, and is packaged on the circuit board by molding. The main body covers the circuit component 30122, so the base portion 3011 has a larger configurable space with respect to the bracket 3P and extends toward the inside of the circuit board main body 30121, so the circuit board is not expanded. The outer dimensions of the body. According to this embodiment of the invention, the base portion 3011 can reach a greater thickness a2, such as 0.6 mm. The base portion 3011 has better support stability, and the base portion 3011 is more firmly connected to the circuit board main body 30121 by means of integral packaging, so that the camera module is in use. More stable and reliable. On the other hand, the base portion 3011 is integrally packaged in the circuit board main body 30121, and the connecting portion is added. The structural strength of the road plate main body 30121 functions to protect the circuit board main body 30121.

FIG. 42 is a schematic diagram showing a horizontal dimension comparison between a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention. The left side of FIG. 43 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. The lateral cross-sectional dimension of the conventional camera module is indicated by b1, and the transverse cross-sectional dimension of the camera module based on the integrated packaging process of the present invention is indicated by b2.

In the camera module in the conventional COB process, the bracket 3P is mounted on the outer side of the circuit device 11P, and the bracket 3P and the circuit device 11P are independent of each other in the installation space, and all need to occupy a certain space, and The circuit device 11P needs to reserve a certain safety distance around the circuit device 11P, for example, a safety distance of 0.35 mm is reserved. These factors make the lateral dimension b1 of the camera module larger and the lateral size smaller. The small possibility is small and cannot meet the demand for the small size of the camera module.

According to the camera module of the integrated package process according to the present invention, the base portion 3011 is encapsulated in the circuit board main body 30121, and the base portion 3011 covers the circuit component 30122, so the base The portion 3011 satisfies the requirement of the basic strength, and only needs to cover the circuit component 30122 with a small size, such as 0.15 mm, and the base portion 3011 and the circuit component 30122 overlap each other to make full use of the installation space. Therefore, the lateral dimension B2 of the camera module is reduced. In particular, according to an embodiment of the present invention, the lateral dimension b2 of the camera module based on the integrated packaging process can be 0.2 mm smaller than the lateral dimension b1 of the conventional camera module.

FIG. 43 is a schematic diagram showing the height comparison between the camera module and the conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention. The left side of Figure 44 is the traditional camera module, and the right side is the root. The camera module based on the integrated packaging process according to the present invention. The height of the conventional camera module is represented by c1, the height of the camera module based on the integrated package process of the present invention is represented by c2, the thickness of the circuit board 1P of the conventional camera module is represented by d1, and the basis of the present invention is represented by d2. The thickness of the circuit board main body 30121 of the camera module of the integrated packaging process. The bracket 3P of the conventional camera module is bonded to the circuit board 1P, and in order to meet the AA adjustment requirement, the glue amount is large, the glue layer is thick, and the circuit device 11P also needs to be installed above. The distance thus makes the height c1 of the camera module large. On the other hand, the bracket 3P is located outside the circuit device 11P and has a large lateral span. Therefore, the circuit board 1P is required to have a high strength to ensure the shape of the camera module, thereby requiring the circuit board 1P. The thickness d1 is large, which also makes the overall height d1 of the camera module large.

According to the camera module of the integrated package process according to the present invention, the susceptor 11 is integrally packaged in the circuit board main body 30121, and does not require a glue bonding space, and does not need to reserve an AA adjustment space, and does not need to be The circuit component 30122 reserves a safe distance, so that the height c2 of the camera module based on the molding process is reduced. On the other hand, the base portion 3011 covers the circuit component 30122 such that the base portion 3011 can extend inwardly, reducing the lateral span of the middle portion of the base portion 3011, and the number of deformations of the same circuit board is more Small, thus reducing the strength requirement of the circuit board main body 30121, and the base portion 3011 can enhance the structural strength of the circuit board main body 30121, so that the thickness d2 of the circuit board main body 30121 can be reduced. Therefore, the overall height c1 of the camera module based on the integrated packaging process is further reduced.

FIG. 44 is a schematic diagram showing the flatness of a camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.

The bracket 3P of the conventional camera module is manufactured by injection molding, and is assembled to the camera module by bonding. Therefore, the camera module is prone to tilting, eccentricity, and the like. Elephant. Moreover, the surface flatness of the bracket 3P is poor, and it is not possible to provide flat mounting conditions for components such as filters, motors, or lenses.

According to the camera module of the integrated package process according to the present invention, the base portion 3011 is connected to the circuit board main body 30121 by integral packaging, and is, for example, moldedly connected to the circuit board main body 30121. Further, in manufacturing the integral base assembly, the base portion is formed by a molding die 1, and the surface flatness of the base portion 3011 is ensured by the molding die 1, and the base is made The top surface 30112 of the seat portion 3011 coincides with the surface of the attaching area 301216 of the photosensitive wafer, and the filter 3040, the lens 3050 or the motor 3060 is subjected to flat mounting conditions, and the photosensitive wafer 3030 is caused. The optical axes of the filter 3040, the lens 3050, and the motor 3060 are identical.

45 is a schematic diagram showing the comparison of imaging quality between a camera module and a conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention. The left side of FIG. 46 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. The circuit device 11P of the conventional camera module is exposed to a closed environment in which the photosensitive wafer 2P communicates with each other, and when the camera module is assembled, some dust is usually attached to the circuit device 11P, such as in soldering. a solder resist at the time of the motor, and the dust is hard to remove and remains on the surface of the circuit device 11P. After the camera module is packaged, the dust moves freely, and when the dust falls onto the photosensitive wafer, especially When the photosensitive area of the photosensitive wafer is the photosensitive area, the camera module may appear black spots, thus making the imaging quality of the camera module poor.

According to the camera module based on the integrated package process of the present invention, the circuit component 30122 is covered by the base portion and is not exposed to the same environment as the photosensitive wafer 3030, so even in the circuit component 11P has residual dust, such as solder resist, and will not be packaged by the camera module. After falling to the photosensitive wafer, the stability of the imaging quality of the camera module can be ensured, and no black spots appear after the package.

46A and 46B are schematic diagrams showing a comparison of a manufacturing process of a camera module and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.

The assembly and manufacturing process of the conventional camera module is generally: manufacturing the bracket 3P by injection molding; cutting the entire circuit board, bonding the bracket 3P to the separate circuit board 1P; and then attaching the wafer In the circuit board 1P, components such as the filter 4P, the lens 6P or the motor 5P are mounted on the bracket 3P to be assembled into a fixed focus module or a moving focus module. In this manufacturing assembly process, the bracket 3P is completed by injection molding, and only a small amount, such as 4 to 8, can be manufactured at a time, and then the separate brackets 3P are respectively bonded to the independent circuit board 1P. These make the manufacturing efficiency of the camera module low, and the consistency between the modules is difficult to control.

The assembly and manufacturing process of the camera module based on the integrated packaging process according to the present invention is generally: integrally molding a plurality of the base portions 3011 on the imposition circuit board 2 by molding; and then dividing the imposition Separating the imposition into a plurality of separate integral base assemblies; further mounting the photosensitive wafer 3030 on the integrated base assembly, and then the filter 3040, the lens 3050 or the The motor 3060 mounts the base portion to be assembled into a moving focus module or a fixed focus module. This process is different from the traditional assembly method, the production mode of the camera module is greatly improved, and the consistency between the plurality of modules is more easily ensured. For example, in the imposition operation, 90 of the integral base assemblies can be formed at one time. Since the module of the present invention is integrally packaged based on a packaging process, in various embodiments of the present invention, a molding process in a packaging process is taken as an example. Therefore, in order to more clearly disclose the contents of the present invention, a molding process will be briefly described first. In addition, the molding process generally has injection molding and molding from the standpoint of the equipment. Injection molding can also be injection molding molding And die casting method. Injection molding machine (referred to as injection machine or injection molding machine) is the main molding equipment for making thermoplastic or thermosetting materials into plastic products of various shapes by using plastic molding die. Injection molding is realized by injection molding machine and mold. Molding is the abbreviation of compression molding, also known as compression molding. A molding material such as a plastic or rubber compound is molded into an article by heating and pressurization in a closed cavity. Molding in the molding process is used in the present invention, but it will be understood by those skilled in the art that the present invention is not limited to the molding process, and other packaging processes, and the present invention is not limited thereto.

FIG. 47 shows a twenty-third preferred embodiment of a camera module based on an integrated packaging process according to the present invention, which adopts an MOB process. The camera module based on the integrated packaging process includes a package photosensitive component 4010, a filter 4040, a lens 4050, and a motor 4060. It will be understood by those skilled in the art that the motor 4060 may not be present in other embodiments, such as a fixed focus (FF) module, and the invention is not so limited. That is to say, in the preferred embodiment of the invention, an autofocus (AF) module is taken as an example. The package photosensitive unit 4010 includes a package portion 4011 and a photosensitive member 4012. The photosensitive module 4012 further includes a photosensitive wafer 4030, and a wiring board 40121, which is provided with a set of electronic components 40122 (eg, resistors, capacitors, drivers, etc., hereinafter referred to as ICs) and a set of leads 4031. The lead 4031 is connected to connect the photosensitive wafer 4030 and the circuit board 40121. Of course, the photosensitive wafer 4030 and the circuit board 40121 may have other conduction modes. In this preferred embodiment of the invention, the lead 4031 can be implemented as a gold wire. The encapsulation portion 4011 serves as a support for carrying the filter 4040. The encapsulation portion 4011 may have electrical properties, such as an electrically engraved line electrically connected to the motor 4060 and the photosensitive member 4012, which can replace the conventional motor bonding wire. , reducing the traditional process. Of course, the motor 4060 and the circuit board 40121 can also be turned on by conventional soldering. In the encapsulation process, the encapsulation portion 4011 encapsulates the circuit board 40121. In the preferred embodiment of the present invention, the package portion 4011 is packaged. A region other than the contact with the photosensitive wafer 4030 and the lead 4031 is formed on the wiring board 40121. The encapsulation portion 4011 not only encapsulates the top surface 401215 of the circuit board 40121 , but the package portion 4011 further encapsulates at least one side surface 401216 of the circuit board 40121 . It can be understood that the encapsulation portion 4011 can also integrally package the electronic component 40122 during the packaging process. The motor 4060 is electrically connected to the circuit board 40121 through at least one motor pin.

A molding forming module in the comparative art is shown in Figs. 49A to 49E. The portion on the left side of the package portion 4011P in FIG. 50A is flush with the wiring board 40121P, and the design of the side surface of the wiring board 40121P flush with the side surface of the package portion 4011P is also generally adopted for comparison. Therefore, in order to achieve the above design requirements, as shown in FIG. 49B, the structure in the figure needs to be achieved before the module is assembled. When the molding is performed, the circuit board 40121P is processed as shown in FIG. 49B, that is, two or more pieces are used. The circuit boards 40121P are connected together, molded, and finally machine cut in the middle portion of Fig. 49B, but new cutting equipment is required. If the manner of FIG. 49B is not used, considering that the circuit board 40121P has a certain deviation from the mold alignment, the edge of the circuit board 40121P may not be flush with the package portion 4011P, so it can usually only be designed as As shown in Fig. 49C, the circuit board 40121P in the figure needs to protrude a section for mold pressing, and the length of the wiring board 40121P is usually 0.1 mm to 1 mm in value.

Therefore, compared with the comparison technology, the camera module based on the integrated package process of the present invention retracts the circuit board 40121 so that the side of the package portion 4011 covers the circuit board 40121. The side surface 401216, so that the side surface of the encapsulation portion 4011 and the circuit board 40121 still reserve a certain misalignment space, and the side surface is not protruded after the molding, the cutting process is reduced, and the product is improved. quality.

It is worth mentioning that the encapsulation portion 4011 can encapsulate both sides of the circuit board 40121. In this preferred embodiment of the invention, there are other elements on the right side such as soft The circuit boards are connected so that only the left side of the circuit board 40121, that is, the side 401216, is packaged. However, it can be understood by those skilled in the art that the package portion 4011 can not only encapsulate the side surface 401216 of the circuit board 40121, but in other embodiments, the circuit board 40121 can be packaged side by side at the same time. The present invention is not limited by the partial or total area of the two sides.

FIG. 48 shows a twenty-fourth preferred embodiment of the camera module based on the integrated package process of the present invention, in order to ensure that the module after the molding process can be easily installed and positioned, and the flatness is improved. Also in the form of MOB, the camera module based on the integrated package process includes a package photosensitive component 4010A, a filter 4040A, a lens 4050A, and a motor 4060A. Similarly, since the AF module is taken as an example, the motor 4060A is disclosed, but in other FF modules, the motor 4060A may not be required, and the present invention is not limited thereto.

Specifically, the package photosensitive member 4010A includes a package portion 4011A and a photosensitive member 4012A. The photosensitive member 4012A further includes a photosensitive wafer 4030A, and a wiring board 40121A configured with a set of electronic components 40122A and a set of leads 4031A. The encapsulation portion 4011A serves as a support for carrying the filter 4040A, and the engraving line of the module portion 11A is electrically connected to the motor 4060A and the photosensitive member 4012A. Compared with the above preferred embodiment of the present invention, in the molding process, the circuit board 40121A and the electronic component 40122A are packaged except for the package portion 4011A, and the circuit board 40121A is packaged. The package portion 4011A is also molded and packaged on a bottom portion 401217A of the circuit board 40121A, in addition to the top surface 1221A and the at least one side surface 401216A. Therefore, after the molding is completed, the planarity of the camera module based on the integrated packaging process from the overall side and the bottom is also convenient for installation and positioning on other tooling.

It is to be noted that the encapsulation portion 4011A may encapsulate the entire bottom portion 401217A of the circuit board 40121A, or in other embodiments, according to different needs. The package encloses a portion of the bottom portion 401217A of the wiring board 40121A, and the present invention is not limited thereto.

It should be noted that, in the preferred embodiment of the present invention, since the right side of the camera module is connected to other components or other processing processes, the right side of the circuit board 40121A is not The encapsulation is performed, but in other embodiments, the encapsulation portion 4011A can simultaneously encapsulate two or more sides of the circuit board 40121A, and at the same time package all of the bottom 401217A covering the circuit board 40121A. Or part of the area, the invention is not limited by this.

As shown in Figures 50 through 55 and 58, there is a camera module in accordance with a twenty-fifth preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices 300, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the like. The electronic device implements image acquisition and reproduction of the target object.

The molded wiring board assembly 1010F of the camera module 100 is manufactured by a manufacturing apparatus 200.

Unlike the first preferred embodiment, the molding portion 1011F has a first inner side surface 10117F, a second inner side surface 10118F and an outer side surface 10119F, the first inner side surface 10117F and the second portion. The inner side faces 10118F are each closed to form the through holes 101100F to provide a light path for the photosensitive wafer. That is, the molding portion 1011F forms a light window through the first inner side surface 10117F and the second inner side surface 10118F to provide a window for light entering the photosensitive wafer, and the lower connection of the light window The shape of the crucible is determined by the surrounding shape of the first inner side surface 10117F. The first inner side surface 10117F surrounds the through hole 101100F or the lower end of the light window, and the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window.

The first inner side surface 10117F extends upward in an inclined shape, and has a trapezoidal shape with a cross section gradually increasing from a lower to an upper opening. That is, the cross section of the through hole 101100F or the lower end of the light window has a trapezoidal shape that gradually increases from the bottom to the upper opening. Defining the inclination angle of the first inner side surface 10117F to be a first inclination angle α, that is, the angle between the first inner side surface 10117F and the central optical axis Y direction of the molded camera module is a first inclination angle α.

In an embodiment, the first inner side surface 10117F is surrounded and the inner diameter is gradually increased from bottom to top, that is, the lower end of the light window is gradually increased from the bottom to the inner diameter. Of course, in other embodiments of the present invention, the first inner side surface 10117F may also be surrounded by other trapezoidal structures. It will be understood by those skilled in the art that the surrounding shape of the first inner side 10117F is not a limitation of the present invention. The surrounding shape of the first inner side surface 10117F may be determined according to the shape of the lens 50, the photosensitive wafer 30, or the filter 40. It is worth mentioning that the cross-section pyramid is an approximate structure. In the actual manufacturing process, the corners of the pyramid are not sharp corners that meet straight lines, but are rounded corners.

According to an embodiment of the invention, the first inclination angle α is greater than 0°, that is, the first inner side surface 10117F and the central optical axis Y direction are not in a parallel state. Since the central optical axis Y is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the first inner side surface 10117F and the circuit board main body 10121 is not in a vertical relationship. The provision of the first angle of inclination a contributes to the forming of the molded part 1011F, which will be explained in connection with the subsequent manufacturing process for ease of understanding.

It is worth mentioning that the setting of the first inclination angle α, that is, the inclination of the first inner side surface 10117F, causes the incident angle of the light reaching the first inner side surface 10117F to decrease, and the corresponding reflection angle decreases. Thereby, the reflected light is made away from the photosensitive wafer 30, thereby reducing the influence of the reflected stray light of the molded portion 1011F on the image quality of the image pickup module. On the other hand, the through hole The 101100F or the light window is formed in a trapezoidal structure in which the opening gradually increases in section, thereby increasing the light flux, thereby further improving the imaging quality of the camera module.

Further, the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window, that is, the shape of the upper end of the light window is determined by the surrounding shape of the second inner side surface 10118F. The second inner side surface 10118F extends obliquely upward, and the cross section forms a trapezoidal shape that gradually increases from the lower to the upper opening. That is, the cross section of the through hole 101100F or the upper end of the light window has a trapezoidal shape that gradually increases from bottom to top. Defining the inclination angle of the second inner side surface 10118F to be a second inclination angle β, that is, the angle between the second inner side surface 10118F and the central optical axis Y direction of the molded camera module is a second inclination angle β.

In an embodiment, the second inner side 10118F surrounds forming a headless vertebral structure that gradually increases from bottom to top. That is, the upper end of the light window has a headless vertebral structure that gradually increases from bottom to top. Of course, in other embodiments of the present invention, the second inner side surface 10118F may also be surrounded by other trapezoidal structures, such as a headless cone and a quadrangular pyramid. It will be understood by those skilled in the art that the surrounding shape of the second inner side 10118F is not a limitation of the present invention. The surrounding shape of the second inner side surface 10118F may be determined according to the shape of the lens, the photosensitive element, or the filter.

According to an embodiment of the invention, the second inclination angle β is greater than 0°, that is, the second inner side surface 10118F is not parallel to the central optical axis direction. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the second inner side surface 10118F and the circuit board main body 10121 is not in a vertical relationship. The provision of the second inclination angle β facilitates the forming of the molded body, which will be explained in connection with the subsequent manufacturing process for ease of understanding.

Further, the molded body includes an outer side surface 10119F that surrounds the outside of the light window. The outer side surface 10119F extends upward from the circuit board main body 10121 in an inclined manner, and has a trapezoidal shape formed in a cross section which is gradually reduced from a bottom to an upper opening. Defining the outer side surface 10119F and the tilt angle as a third tilt angle γ, that is, the angle between the outer side surface 10119F and the central optical axis Y direction of the molded camera module is a third tilt angle γ .

According to an embodiment of the invention, the third inclination angle γ is greater than 0°, that is, the outer side surface 10119F is not parallel to the central optical axis direction. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the outer side surface 10119F and the circuit board main body 10121 is not in a vertical relationship. The provision of the third inclination angle γ facilitates the forming of the molded body, which will be explained in connection with the subsequent manufacturing process for ease of understanding.

By way of example and not limitation, the first angle of inclination a is preferably in the range of from 3[deg.] to 85[deg.]. The second inclination angle β preferably ranges from 3° to 45°. The third inclination angle γ preferably ranges from 3° to 45°.

In this embodiment of the invention, the first tilt angle α ranges from 3° to 45°, and in some embodiments, it may be 3° to 15°, or 15° to 20°, or 20°. ~30° or 45°~60°. The second tilt angle β ranges from 3° to 45°, and in some embodiments, it may be 3° to 15°, or 15° to 30°, or 30° to 45°. The third tilt angle γ ranges from 3° to 45°, and in some embodiments, it may be 3° to 15°, or 15° to 20°, or 20° to 30°.

It is worth mentioning that in this embodiment of the invention, the first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface, and the outer side surface 10119F forms a two-stepped step structure for respectively mounting different components, and in the present invention In other embodiments, there may be fewer steps or more steps. For example, only the first inner side surface 10117F, the second inner side surface 10118F and the outer side surface 10119F form a first step, or a top surface and an inner side surface are superposed to form a third step. Steps, it will be understood by those skilled in the art that the number of the inner side, the top and the outer side 10119F, and the number of steps formed are not a limitation of the present invention.

It is also worth mentioning that the first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface and the outer side surface 10119F are each in a closed structure, so as to facilitate Providing a closed interior environment for the molded camera module. When the lens 1050 or the motor 1060 and the lens 50 are mounted on the molded wiring board assembly 1010F, a closed inner environment is formed for the photosensitive wafer 1030 to isolate interference from external light.

As shown in Figs. 54A and 54B, there is shown a manufacturing apparatus and a manufacturing process of a molded wiring board assembly of a molded image pickup module according to a first preferred embodiment of the present invention. The manufacturing apparatus 200 is used to manufacture the molded wiring board assembly 1010F, and further, to manufacture the molded wiring board assembly 1010F by molding.

The manufacturing apparatus 200 of the molded wiring board assembly 1010F includes a molding die 210 and a feeding mechanism 220. The feeding mechanism 220 is for supplying the molding material 400 to the molding die 210 so as to be molded by the molding die 210. The molding material 400 may be selected from the group consisting of nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.

The molding die 210 includes a first die 211 and a second die 212, and the first die 211 and the second die 212 are capable of opening and clamping. That is, the molding die 210 includes two states of mold opening and mold clamping.

In an embodiment, the molding die 210 can control the opening and closing of the first mold 211 and the second mold 212 by a fixing device. Referring to FIGS. 54A, 54B, when the molding die 210 is in the mold clamping state, the first die 211 and the second die 212 form a molding cavity 213 and a supply passage 214, and the supply passage 214 is connected. In the molding cavity 213. The molding chamber 213 is for accommodating the wiring board portion 1012F for conveying the molding material 400 into the molding cavity 213, and molding at a predetermined position on the wiring board portion 1012F. That is, the wiring board portion 1012F is placed in the second mold 212 in a state in which the molding die 210 is opened, and then the molding die 210 is in a mold clamping state, by the action of the feeding structure. The molding material 400 is transported into the molding cavity 213 through the supply passage 214 by the molding material 400, such as high pressure, and the remaining portion of the molding cavity 213 is filled by the molding material 400 to form The molded portion 1011F.

The first mold 211 includes a light window forming block 2111 for blocking the molding material 400 such that the molding material 400 forms a hollow through hole along the light window forming block 2111. 101100F or the light window.

The first mold 211 includes a plurality of molding faces respectively provided with the first inclination angle α, the second inclination angle β, and the third inclination angle γ corresponding to the molding portion 1011F to facilitate formation. The first inner side surface 10117F, the second inner side surface 10118F, and the outer side surface 10119F.

Further, the light window forming block 2111 includes a pressing surface 21111. In the molding process, the pressing surface 21111 is pressed against the wiring board portion 1012F such that the position corresponding to the pressing surface 21111 on the wiring board portion 1012F is not filled with the molding material 400. The light window connected to the wiring board portion 1012F is formed.

Further, the molding cavity 213 includes a filling portion 2131 for filling the molding material 400, and a receiving portion 2132 for accommodating the wiring board main body 10121. In an embodiment of the invention, the filling portion 2131 is disposed on the first mold 211, and the receiving portion 2132 is disposed in the second mold 212. That is, in the molding process, the circuit board main body 10121 is placed in the accommodating portion 2132 of the second mold 212, and is formed in the circuit board main body 10121 and the first mold 211. The filling portion 2131 is filled with the molding material 400 in a space, thereby molding the molding portion 1011F on the top surface of the wiring board portion 1012F.

It is to be noted that the circuit board portion 1012F is provided with the circuit component 10122F, that is, when the circuit board main body 10121 is placed in the housing portion 2132 of the molding cavity 213, the circuit The element 10122F is housed in the filling portion 2131. When the molding material 400 is filled in the filling portion 2131 of the molding cavity 213, the circuit component 10122F is covered by the molding material 400.

It can be understood that due to the setting of the first inclination angle α, the second inclination angle β, and the third inclination angle γ, the demolding, that is, the first mold 211 and the second During the process of separating the mold 212, the friction between the molding portion 1011F and the first mold 211 is reduced, and the first mold 211 is more easily pulled out of the molding portion 1011F so that The molded portion 1011F is preferably in a formed state. Referring to Fig. 55, more specifically, during the demolding process, the optical window forming block 2111 and the molding portion 1011F are relatively moved at the moment of demolding, and then the optical window forming block 2111 and the A gap is formed between the molding portions 1011F, so that during the subsequent movement, the optical window forming block 2111 and the molding portion 1011F are not in contact with each other to generate a frictional force, so that they can be smoothly pulled out.

As shown in FIG. 56, according to a modified embodiment of the twenty-fifth embodiment of the present invention, the photosensitive wafer 1030 may be connected to the wiring board main body 10121F through the lead 1031 before the molding process, and The circuit board main body 10121F may be provided with an annular blocking member 1014G which is mounted or coated on the circuit board main body 10121 and has elasticity and is higher than the highest point of the lead 1031 so as to be in the molding process. The light window forming block 2111 is press-fitted to the blocking member 1014G to prevent the light window forming block 214 from being pressed against the circuit board main body 10121F and the lead wire 1031 and Damage to the photosensitive wafer 1030. In one specific example, the barrier element 1014G is in the form of a square ring and is implemented as a step glue. In other words, the barrier element is at least partially encapsulated by the molding portion, spaced between at least a portion of the molding portion 1011F and the wiring board body 10121F.

As shown in Fig. 57, there is shown another modified embodiment of the twenty-fifth embodiment of the present invention. Different from the above preferred embodiment, the circuit board portion 1012F includes at least one circuit component 10122G, and the circuit component 10122G is disposed on the circuit board main body 10121. The circuit component 10122G protrudes from the wiring board main body 10121 and is located inside the molding portion 1011F. In other words, the circuit component 10122G is located within the via 101100F. That is, the circuit component 10122G is not molded by the molding portion 1011F. At the time of molding, the light window forming block in the molding die has a groove inside, so that it is covered in the circuit component 10122G in the molding process, so that the formed molding portion 1011F can be not covered. The circuit component 10122G. Of course, in other embodiments of the invention, the circuit component 10122F to be molded may also be provided, that is, a portion of the circuit component 10122F is molded while another portion of the circuit component 10122G is not molded. .

As shown in FIG. 59, a modified embodiment of an integrated base assembly and camera module in accordance with a twenty-first preferred embodiment of the present invention. Different from the above preferred embodiment, the integrated The base assembly 3010 includes a shielding layer 30124A surrounding the inner side of the base portion 3011 to enhance the resistance of the integrated base assembly 3010 while enhancing the structural strength of the circuit board main body 30121. Electromagnetic interference capability. The shielding layer 30124A may be a metal mesh or a metal plate.

It should be understood by those skilled in the art that the molded portion, the structure of the base portion and the encapsulation portion in various embodiments of the present invention may be combined with various structural features of the camera module in other embodiments. Perform a permutation and combination. The various preferred embodiments described above are merely illustrative of different ways in which the present invention may be implemented. Various structural features in different embodiments may be combined in various arrangements to form a new embodiment. The present invention is not limited to the embodiments shown in the drawings. It is not limited to a single embodiment.

It is worth mentioning that the plurality of camera modules may be arranged in an array to form an array camera module. Each camera module may have the structure of the camera module in each of the above embodiments. Each camera module of the array camera module may have the same structure or may be different. The plurality of camera modules may be of a unitary structure or a split structure. The integrated structure may be a base portion having a joint body or a connected circuit board portion; or a base portion having a joint body and a circuit board portion connected to each other.

Those skilled in the art should understand that the embodiments of the present invention described in the above description and the accompanying drawings are only by way of illustration and not limitation. The object of the invention has been achieved completely and efficiently. The present invention has been shown and described with respect to the embodiments of the present invention, and the embodiments of the present invention may be modified or modified without departing from the principles.

Claims (13)

An integrated base assembly, comprising: a camera module, comprising: a base portion; and a circuit board portion; wherein the base portion is integrally packaged in the circuit board portion by molding, the camera A photosensitive wafer of the module is adapted to be mounted on the circuit board portion, the base portion forming at least one through hole for providing a light path for the photosensitive wafer, the lens being located in a light path of the photosensitive wafer. The integrated base assembly of claim 1, wherein the base portion has a top surface that extends in a plane. The integrated base assembly of claim 1, wherein the base portion has a mounting groove, the mounting groove communicates with the through hole, and the base portion includes at least one raised step, The raised step forms the mounting groove. The integrated base assembly of claim 1, wherein the base portion has two mounting slots, and each of the mounting slots communicates with the through hole such that a stepped structure is formed inside the base portion. The integrated base assembly of claim 4, wherein the mounting groove in the upper position integrally extends upwardly to form a lens inner wall. The integrated base assembly of claim 1, wherein the base covers at least one of the side surfaces and/or at least one bottom surface of the circuit board portion. The integrated base assembly of claim 1, wherein the integrated base set The device includes at least one circuit component, the base portion encasing one or more of the at least one circuit component, wherein the circuit component is selected from the group consisting of: a resistor, a capacitor, a diode, a triode, a potentiometer, a relay One or more of a drive, a processor, and a memory. The integrated base assembly of claim 1, wherein the base portion has at least one first inner side surface that surrounds at least a portion of the through hole, the first inner side surface extending obliquely upward In the circuit board portion. The integral base assembly of claim 1, wherein the base portion has a second inner side surface, and the second side surface is bent and extended from the first inner side surface, the second The inner side surrounds an upper end of the through hole, and the second inner side extends upward in an inclined shape. The integrated base assembly of claim 1, wherein the integral base assembly comprises a motor connection structure, the motor connection structure being selected from one of the following: the motor connection structure is preset to the a base portion, the motor is electrically connected to the circuit board portion through the motor connection structure, a motor of the camera module is adapted to be electrically connected to the circuit board portion through the motor connection structure; or The motor connection structure includes at least one lead wire and at least one lead slot, the lead wire is disposed on the base portion and electrically connected to the circuit board main body, and the lead slot is disposed at an upper end of the base portion The lead includes a motor connecting end, the motor connecting end is exposed on the bottom wall of the slot, so that when at least one motor pin of the motor is inserted into the pin slot, the motor is electrically connected to the motor a connecting end; or the motor connecting structure includes at least one lead slot and at least one circuit contact, the circuit contact is electrically connected to the circuit board main body, and the pin slot is disposed on the base portion, By the circuit board Extending to a top end of the base portion, and the circuit contacts are exposed in the pin slots to electrically connect the at least one motor pin of the motor to the pin slot Circuit contact; or The motor connection structure includes at least one engraving line disposed on the base portion and electrically connected to the circuit board portion to electrically connect a motor pin of the motor. A camera module, comprising: an integral base assembly according to any one of claims 1 to 10, and a lens. The camera module of claim 11, wherein the camera module is a fixed focus camera module or an auto focus camera module. The camera module of claim 11, further comprising a pedestal and a filter, wherein the pedestal is mounted on the base portion, and the filter is mounted on the Support.