1239573 5久、發明說明： 【發明所屬之技術領域】 本發明係關於-種影像感測器後段封裝製程之上μ 封裝方法’尤指-種應1於影像感測器後段封裝過程中， 針對待封裝於影像感測器物件上之透明蓋板、鏡頭座或且 透明蓋板之鏡頭座等上物件的封裝方法所提出之啖卄用 以確保影像感測器封裝後之潔淨度、定位精準度2結合強 度。 【先前技術】 目前常見之影像感測器係一包括有具影像感測功能的 先學半導體晶片之產品，由於該影測器内部晶片之感測區 需保持高標準之潔淨度，避免感測區之部份畫素被微塵或 水氣遮蔽，而無法感測，故必雷斟兮成 又乂而對忒感測器元件施以適當 的封裝手段，以保護感測器元件内部感測區免受水氣及微 塵之侵人造成遮蔽’另使該晶片可透過基板之線路重佈作 外部連接，藉以受控作為影像感測之用途。 習知影像感測器之封裝方法，如互補式金屬氧化半導 體（CMOS影像感測器）或光電耦合元件等（ccd影 像感測器）等’主要錢於具線路之基板上敎黏晶區模 塑成型出方形環圈狀的堤牆，次將晶片感光面朝上黏著於 基板相對於堤牆内側之位置，再以打線接合手段將晶片與 基板上之㈣構成電性連接，最㈣基板之堤牆頂緣進行 點膠’再將如i R渡光玻片等之透明蓋板蓋置於堤牆頂緣 再烘烤，以完㈣影像感測器之封裝作業，或可再於該透 1239573 明蓋板上黏著一镑t百& 了 m、 像感測器。鏡❹’而構成—具有影像感測功能之影 另有—種軟式基版的方式，係為_具有開口設計 式基板，於基板下方以霜 板連結，再於美板chlp)方式將晶片與基 ^ £、 方點勝並設置-I R濾、光玻片之透明 盍板，再黏貼上物件並供^ 透月 封裝作業。 奴式基板之衫像感測器 惟上述習知影像感測器之封裝方法，於實際使用時 仍具有以下所述之諸多缺點存在： 只際使用時’ 蓋板1二2狀態下做後製程之上物件（即前述之透明 著…Γ1 封裝，易因大氣存中在的微塵、水氣附 '件及基板上而影響封裝後之影像品質。 2、該影像感測器於封裝過程中，並未對封裝前 物件及基板本身施以任何 其7/糸處理，因此，如上物件或 基板在封裝前，若其表面 干飞 兩者於熱塵封m 咖塵或其它雜質時，則當 旦遮蔽影像感測區的部飞雜貝一 於兮皮你H·、 旦素〇卩份晝素即無法感測，另 於Μ感測器完成封裝後，只能 清潔處理，對於己你钮脸认β Α 干 < 外表面施以 p.^s ^ 4衫像感測器内部之微塵或雜質 已無法再重工處理。 /、貝 3、當影像感測器進行封裝過程中，其基 置上物件後，係必需再利用封裝設備將 扭烤^ ，以完成封裝作業，苴击m ^ 王人、烤裝置 卜且… 因基板與上物件間的接合區很1239573 Description of the invention for 5 years: [Technical field to which the invention belongs] The present invention relates to a method of μ packaging on the rear-end packaging process of an image sensor, especially-a kind of 1 should be used in the rear-end packaging process of the image sensor. A method for packaging objects such as a transparent cover, a lens holder or a transparent cover lens holder to be packaged on an image sensor object is proposed to ensure the cleanness and accurate positioning of the image sensor package. Degree 2 bonding strength. [Previous technology] The current common image sensor is a product that includes a first-learning semiconductor wafer with an image sensing function. Because the sensing area of the internal chip of the image sensor needs to maintain a high standard of cleanliness, avoiding sensing Part of the pixels in the area are blocked by dust or water and cannot be sensed. Therefore, it is necessary to protect the sensor area inside the sensor element by applying appropriate packaging methods to the sensor element. Protected from the intrusion of moisture and dust, and also allows the chip to be redistributed through the circuit of the substrate for external connection, thereby being controlled for image sensing purposes. Know how to package image sensors, such as complementary metal oxide semiconductors (CMOS image sensors) or optocouplers (ccd image sensors), etc. A square ring-shaped bank wall is molded, and the wafer with the photosensitive side facing upward is adhered to the position of the substrate relative to the inside of the bank wall, and then the wafer is electrically connected to the substrate on the substrate by wire bonding. Dispense the top edge of the embankment wall, and then place a transparent cover, such as an iR crossing light slide, on the top edge of the embankment wall and bake to complete the packaging operation of the image sensor. 1239573 One pound t hundred & m, like sensor is stuck on the cover plate. It is composed of mirrors—with shadows that have image sensing functions—a kind of soft base plate, which is a substrate with an opening design, which is connected by a frosted plate under the substrate and then by the US board (chlp). Base ^ £, square points win and set -IR filter, transparent slide plate of light slides, and then paste the objects for ^ moon moon packaging operation. Slave-type shirt-like image sensor, but the above-mentioned conventional image sensor packaging method still has many shortcomings described below in actual use: When used only, the cover plate is made in the post-process state in the state of 1-2. The above objects (that is, the aforementioned transparent ... Γ1 package, it is easy to affect the image quality of the package after the dust, water and gas attached to the atmosphere and the substrate. 2. The image sensor is in the packaging process, Before the package, the object and the substrate itself are not subjected to any 7 / 因此 treatment. Therefore, before the package or the substrate is sealed, if the surface of the object or the substrate is dry and both are sealed with hot dust or other impurities, it should be shielded. As soon as the image of the image sensor area, you will not be able to detect it once you have been exposed to H., dentin and hydrazine. After the M sensor is packaged, you can only clean it. β Α dry < p. ^ s ^ 4 shirt-like dust or impurities inside the sensor can no longer be reworked. /, Bay 3, when the image sensor is being packaged, its base is placed on After the objects, the packaging equipment must be twisted and roasted ^ to complete the sealing Installation operation, tap m ^ king, baking device, and ... because the bonding area between the substrate and the upper object is very
小細讀送過程中，由於透明蓋板與基板間的勝體I 1239573 未π王固化，故無法提供兩者間適當的定位效果，導致上 物件容易因輸送過程中晃動而產生位移，使基板與上物件 間的接合度不良。 【發明内容】 因此，為？文善前述影像感㈣器封裝方法的缺點，本發 明者乃研發設計出—種「影像感測器後段封裝製程之上物 件封4方法」，希藉此設計，於影像感測器封裝過程中， 2供具有潔淨層流控制之内部環境，並將待封裝感測器物 件及欲封裝其上之上物件施以表面清潔處理，並以視覺系 =行=，且即時預烤預熱強化上物件與待封裝感测器 之。度’以確保影像感測器封裝後之潔淨度、待封 裝感測n物件及上物件定位精準及結合強度 之發明目的。 ~土要 為達到前述發明目的，本發明所運用的技術手段係在 共；種影像感測器後段封裝製程之上物件封裝方法， "要係以-氧化碳三態變化反應手段，分別對該待封裝 影像感心物❹、面，以及待㈣之上 、 清潔處理，續將上物件對位翔#^_+ 她以表面 之預定/ 讀待封裝影㈣測器物件 熱壓合手段增加上物件固…f理形成定位效果’再以 合強度’藉以使封裝後二=封裝影像感测器物件的結 .^ τ忒傻之衫像感測器物件上的上物件不合 附著微塵及雜f，JL使上物 物件不會 件上。 牛精確疋位於待封裝感測器物 藉由上述方法之實施流程’該影像感測器之封裝過程 1239573 中’將待封裝感測器物件 及上物件，於封裝作業前，分別 進行表面清潔處理， 曰 、 ^ . 提汁待封裝感測器物件及上物件的 避免感測區之部份畫素被微塵或水氣遮蔽，而無 姊之/貝1丨亦可先行對待封裝感測器物件及上物件間的膠 月豆施以預烤處理，以描 ’ 仏兩者間極佳的定位效果，而有效 防止該上物件於輸送過程 无勖屋生不當位移，以確保 封；後之影像感測器的產品品質。 【實施方式】 ' 為使 貴審查委員可被告* &丄 苴— 一、崔男了解本發明之結構設計，及 …匕創作目的與功效，以下茲一 — 圖式詳細說明如下： 出--體貫施例，並配合 依據前揭技術方幸之讯〜 ^ ^ °又汁，本务明係應用於影像感測 ^ ^ 万套其中，上物件可為透明蓋 板或鏡碩座等，請參閱第一圖及第二圖所示： 首先如第四圖所示，係 封肚认 ㈣上物件為透明蓋板（3 0 ) ▲於已完成基板上模塑耀體堤 後之待封裝影像感測器物件（2〇)::者及打線接合 ㈣日日# # U 0 )上的製程步驟設計提 出祝明，其封裝製程步驟主要包括有： 提供具有潔淨層流控制之内部環境。 哭物Π =三態變化反應手段清潔該待封襄影像感測 r/Γ 面；配合參閱第三圖乂所示，主要传 、主封裝設備（1 〇 )預設之第一清洗裂置（工工厂該 /月洗裝置預設有一進氣孔及排氣孔 " 進人、、主1 ^ 使一虱化杈從進氣孔 琨入π冼爰置，再於排氣孔排出， 配合一氧化碳因溫度及 1239573 μ力的改變產生三態變化後之微細分 感測器物件（2 〇 )的 > 而—” 糸待封褎衫像 ' ，完成該待封裝感測器物件（ 2 0 )之清洗處理，用以去 去除待封叙感測物件（2 ΓΜ夂 表面所附著之微塵及雜質。 以點膠手段於待封裝影像感測器 塗設膠體，·配合參閱第：圖± 』疋胺頂緣 门η… 要係利用封裝設備 c 1 〇 )預设之點膠裝置（1 2 )，斜6忐、主、士占 封裝感測器物件（2 〇 )上 人 子 』了貝疋、、σ D σ卩位施以點膠作業 ’使其堤牆頂緣塗附熱固性膠體，並將其傳送[下^ 的定位工作區（A )。 " • 減石厌三態變化反應手段清潔該透明蓋板之表面 ’配合參閱第三圖C所示，主要係利用封裝設肖（U) 預設之第二清洗裝置（13)，並藉由取置器（14)取 置透明蓋板（30)，使其容置於該第二清洗裝置（13 )内部，該第二清洗裝置設有一進氣孔及—排氣孔，使二 氧化碳從進氣孔進人第二清洗裝置（1 3 )，再由排氣孔 :出’配合二氧化碳因溫度及壓力而產生三態變化對透明 盍板（3 0 ) @表面產生之清洗效果，用以去除透明蓋板 (3 0 )表面所附著之微塵及雜質。 利用視覺系統進行定位，將透明蓋板（3 〇 )精確定 位於膠體堤牆頂緣上，同時施以預烤加熱處理，使透明蓋 板定位於膠體堤牆上；配合參閱第三圖c、d所示，於第 二清洗裝置一側設有一組視覺系統，擷取透明蓋板（3 〇 )之影像位置，並於定位工作區（A)的上方設另一組視 1239573 覺系統，擷取待封裝影像感測器物件之影像位置進行定位 ，取置器（1 4 )係、藉由該二組視覺系統進行定位，將透 明蓋板（3 〇 )設置於待封裝感測器物件（2 〇 )上的預 定結合部，同時利用具烘烤照射功能的預烤裝置（i 5 ) ，如紫外線光.源照射燈等’對兩者結合部位施以預烤處理 ’且在待封裝感測器物# ( 2 〇 )的下方設有一加埶户且 ，使該待封裝感測器物# (2 〇 )的堤牆頂緣與透明蓋板 (3 〇 ) %的勝體加熱至默之溫度，達到狀的定形作 用，並有效減少膠體流動性，以形成極佳的定位效果。 以熱壓合手段將透明蓋板強化固著於膠體堤牆上；主 要係將待封裝感測器物# (2Q)㈣裝其上的透明^ (3嶋送至加壓裝置對對透明蓋板（3〇)施以二 :合，增加透明蓋板（30)與堤牆間之的接合強度，： ㈣封裝後之影像感測器之整體高度及共平面性，再送入 二烤裝置使膠體完全固化，以完成該影像感測器之封裝作 物件爲且：述Ϊ封裝方法，亦可適用於如第六圖所示，」 板：明盍板（3 0 )之鏡頭座（4 0 )封裝於已男 =上模塑膠體堤牆（亦可為無堤牆 鏡頭座設置於其姑η 我a 影像感測器心（20)、：片黏著及打線接合後之待封果 件（2 Q)上的製程，其步驟如上所述。 又’本發明亦適用於 頭座（5〇)封二已五圖所示’將不具鏡片之. 著、打線接合，… 板上模塑膠體堤牆、晶片黎 者透明蓋板（3 〇 )後的待封裝景」 1239573 像她物件（20)上之封裝製程步驟，主要包括有： 提t、具有溧淨層流控制之内部環境。 号物碳三態變化反應手段清潔該待封裝影像感測 = 主要係利用封裝設備（10)預設之第- 使-氧11)’ 4清洗裝置設有—進氣孔及排氣孔， 2 —乳化μ進氣孔進人清洗裝置，再於排氣孔排出，配 炭因！度及屋力的改變而產生三態變&，清潔待 ( 2 Q >的表面’完成該待封裝感測 :(广之清洗處理，用以去除待封裝感麵^ d u )各表面所附著之微塵及雜質。 以點膠手段於待封裝影像感測器物件外側之透明蓋板 :塗設膠體；主要係利用封裝設備（工〇)預設之點膠 t (12) ’對完成清洗處理之待封裝感測器物件（2 〇 )上的預定結合部位施以點膠作業，使其透明蓋板（3 〇)周邊塗附膠體，並將其傳送至下一個製程的定位工作 區（A ) 〇 以二氧化碳三態變化反應手段清潔該鏡頭座之表面； ’主要係利用封裝設備（10)預設之第二清洗裝置（！ 3)，並藉由取置器、（14)取置鏡頭座，使其容置於該 第二清洗裝置（i 3 )内部，第二清洗裝4 (丄3 )設有 一進氣孔及一排氣孔，使二氧化碳從進氣孔進入第二清洗 士置（1 3 )’再由排氣孔排出，配合二氧化碳因溫度及 壓力而產生三態變化對鏡頭座（5 〇 )的表面產生之清洗 效果，用以去除鏡頭座（5 〇 )表面所附著之微塵及雜質 10 1239573 利用視覺系統進行定位，將鏡 於透明蓋板（“）周邊頂緣上，同時施以二：確定位 读日日掌k γ ο a、 了々β M加熱處理，佶 -板（3 0 )定位於膠體堤牆上；於第二清洗 3 ) 一側設有—組視覺系統，擷取鏡 、 像位置，並於定位工㈣（A)的上 (5〇)之影 ，擷取待封步旦 q金斤, 勺上方0又另—組視覺系統 广“像感測器物彳（2 0 )之影像位置 立，取置器（1 4 )藉由二組視覺系統進行定位，將 =5〇)設置於待封裝感測器物件（2〇) 1的預 °部，同時在待封裝感測器物件（2 0 ) $下方設有—、° 熱治具，使該待封裝感測器物件（2 0)透明蓋:（/° ^周邊頂緣上與鏡頭座（5〇) f4的膠體加熱至預定之阳 度，達到預定的定形作用，並有效減少谬體 开现 成極佳的定位效果。 乂形 以熱麼合手段將將鏡頭座（5〇)完全固著於透明蓋 =(3 0 )上；主要係將待封裝感測器物件（2 〇 )與封 裝其上的鏡頭I ( 5 Q )輸送至加Μ裝置對鏡頭座（5、〇 )施以加壓壓合，增加鏡頭I ( 5 0 )與透明蓋板（3 〇 1門之的接合強度’並可控制封裝後之影像感測器之整體 高度及共平面生’再$入烘烤裝置使膠完全固&，以完： 該影像感測器之封裝作業。 稭此，於該影像感測器的封裝過程中，待封裝感測器 物件（2 0 )及組裝其上的上物件’如前述之透明蓋板 3 〇 )或鏡頭座（4 〇 )、（ 5 〇 )等，可於進入烘烤裝 1239573 置進行封裝作業前，先分 封裝作業完成後，盆表面了：^々潔處理，使兩者於 另亦可先行對待封裝感測器物件（20) /塵及雜貝， 位間的熱固性膠體施以預烤處 ：物件結合部 位效果，而有效防止1μ^七、兩者間極佳的定 口亥上物件於輸送 產生不當位移。 王夂烤裝置的過程中 另’如第七圖及第八岡痛—丄 板（60)之旦，傻^ 所不’本發明亦適用於軟式基 」之〜像感測器之後段封梦 物件可為玻璃罢板f q n a "上物件封裝，其上 坡t板（3 〇 )或具有玻璃蓋板（ 上（4 0 )，封裝於已完成基板下方以覆兄 連接之待封裝f彡像感 f :— ，主要包括有： *件（20)上之封裝製程步驟 提供具有潔淨層流控制之内部環境。 写物化碳三態變化反應手段清潔該待封I影像感測 、:面；主要係利用封裝設備（"）預設之第- (1 1 )，該清洗裝置設有-進氣孔及排氣孔， ，—乳化碳從進氣孔進入清洗裝置，再於排氣孔排出，配 口—乳化碳因溫度及壓力的改變而產生三態變化，清：絮待 2影像感測器物件（2〇)的表面，完成該待封裝感測 σ。勿件（2 〇 )之清洗處理，用以去除待封裝感測物件（ 2 0 )各表面所附著之微塵及雜質。 以點膠手段於待封裝影像感測器物件之基板上方塗設 膠體；主要係利用封裝設備（！ 〇 )預設之點膠裝置（1 2 )，對完成清洗處理之待封裝感測器物件（2 〇 )上的 12 1239573 預定結合部位施以點膠作業， 將其傳送至下一個製程的定位 使其基板上方塗 工作區（A )。 附膠體，並 悲變化反應手段清潔該透明蓋板之表面 主要係利用封裝設備（1 〇)預設之第二清洗 )，並藉由取置器（14)取置透明蓋板或且 鏡頭座，使其容置於該第二清洗裝置（i 3 ) 清洗裝置設有一進氣孔及一排氣孔，使二氧化 進入第二清洗裝置，再由排氣孔排出，配合二 度及壓力而產生三態變化對透明蓋板（3 0) 板（3 0 )的鏡頭座（4 〇 )的表，面產生之清 以去除透明蓋板（3 0 )或具透明蓋板（3 〇 (4 0 )表面所附著之微塵及雜質。 或鏡頭座； 裝置（1 3 透明蓋板之 内部，第二 碳從進氣孔 氧化碳因溫 或具透明蓋 洗效果，用 )的鏡頭座 #利用視覺系統進行定位，將透明蓋板（3 ◦)或具透 明蓋板（3 0 )的鏡職（4 〇 )精確定位於基板上同 時施以預烤加熱.處自’使透明蓋板（3 〇 )或具透明蓋板 :30)主的鏡頭座（4〇)定位於軟式基板（6〇)上， 於第二清洗裝置一側設有一組視覺系统，擷取透明蓋板（ 3 〇 )或具透明蓋板（3 0 )的鏡頭纟（4 0 )之影像位 置/並於疋位工作區（A )的上方設另一組視覺系統，擷 取待封裝影像感測H物件（2 Q )之影像位置進行定位， 取置益（1 4 )藉由二組視覺系統進行定位，將透明蓋板 (3〇)或具透明蓋板（30)的鏡頭座（4 0)設置於 待封裝感測器物件（2 0 ) _L的預定結合部，同時利用具 烘烤照射功能的預烤裝置（丄5 )，如紫外線光源照射燈 13 1239573 等，對兩者結合部位施以預烤處理（若為具透明蓋板之鏡 頭座，則不施以預烤處理，因鏡頭座為不透光之材質，紫 外線無法照射）且在待封裝感測器物件（2 〇 )的下方二 有一加熱治具，使該待封裝感測器物件（2 0 )的堤牆= 緣與透明蓋板（3 〇 )間的膠體加熱至預定之溫度，=到 預定的定形作用’並有效減少膠體流動性，以形成極佳的 定位效果。 以熱麼合手段將透明蓋板（3 0 )或具透明蓋板（3 ◦)的鏡頭座（40)強化固著於軟式基板（6〇)上. 主要係將待封裝感測器物件（2〇)與封裝其上的透明苗 板（30)或具透明蓋板（3〇)的鏡頭座"〇)輸： 至加壓裝置對透明蓋板（3 η ) 士目、* η # 一 攸1 或具透明蓋板（30)的 鏡頭座（4 0 )施以加壓壓人， ϋ 口，以增加透明蓋板（3 或具透明蓋板（30) / , n、 的鏡頭座（40)與軟式基板（6 0 )間之接合強度，：可批在丨私壯 :几制封裝後之影像感測器之整體高 又二 达入烘烤裝置使膠完全固化，以完成， ❿ 影像感測器之封裝作業。 成邊 首由上述實施流程說明中 段封裝製程之上物件封⑴:：，本發明影像感測器後 卞了衣方法的特點在於： 1、該影像感測器於封裝過程中，可 測器物件及組裝其上之上物 、寺彳羞感 )或鏡頭座（4 0 ) 、（ r η、姑 ^ J 0 態變化反應手段的表面清潔、”別施以-乳化碳三 成封裝製程後，幾乎不合附^理’亦即該影像感測器於完 曰耆任何的微塵及雜質，提昇待 14 1239573 封衣感測器物件及上物件” -f- Μ η ^ ^ ^ 、，糸，梦度，避免感測區之部份畫 素被U塵或水氣遮蔽無法感測。 系统像感測器於進行封裝過程中，藉由二組視覺 (2 ;丁广使上物件可精確定位於待封裝感測器物件 一 0 )上，上物件組裝於待封裝感測器物件（2 預疋組裝部位後，同時對 、 上物件結合定位於待封壯Γ 預 熱處理，強化 口疋位於待封ι感測器物件（20)上之結合強 度’形成極佳的定位效果古 f 里&立 果而有效防止該上物件於輸送過 私中因晃動產生不當位移，以 產品品f。 . f封竑叙影像感測器的 由以上的說明可知，本發明影像感測器後段封裝製 ==裝方法’可於影像感測器封裝過程中，先分 免^心物件及組裝其上之上物件施以清潔處理 避免感職之部份畫素被微塵 ，曰私A 土 i >机&献，而無法感測 佳的η"里 τ “預烤加熱處理，形成極 位移，以防止上物件於輸送過程中因晃動而產生 位移，確為一相當優異之設計。 【圖式簡單說明】 (一）圖式部分 第一圖係本發明之實施流程圖。 第二圖係本發明所配合使用之 了忒5又備的立體外觀圖 第二圖Α〜D係本發明之實施示意圖。 第四圖係本發明待封裝感測器物件與上物件之示意圖 一）。 " 15 1239573 第五圖係本發明待封裝感測器物件與上物件之示意圖（ 二）。 第六圖係本發明待封裝感測器物件與上物件之示意圖（ 三） 。 第七圖係本發明待封裝感測器物件與上物件之示意圖（ 四） 。 第八圖係本發明待封裝感測器物件與上物件之示意圖（ 五） 。 (二）元件代表符號 (1 0 )封裝設備 （1 1 )第一清洗裝置 (1 2 )點膠裝置 （1 3 )第二清洗裝置 (14)取置器 （15)預烤裝置 (2 0 )待封裝感測器物件（3 0 )透明蓋板 (40)鏡頭座 （50)鏡頭座 (6 0 )軟式基板During the small reading process, because the winner I 1239573 between the transparent cover and the substrate was not cured, it could not provide the proper positioning effect between the two, which caused the upper object to be easily displaced due to shaking during the transportation process, which caused the substrate Poor joint with upper object. SUMMARY OF THE INVENTION So, what? Wenshan has the disadvantages of the aforementioned image sensor packaging method. The inventor has developed a "4 methods for sealing objects on the back-end packaging process of image sensors", and hopes to use this design in the process of image sensor packaging. , 2 for the internal environment with clean laminar flow control, and the surface of the sensor object to be packaged and the object to be packaged with a surface cleaning treatment, and visual system = line =, and real-time pre-baking pre-heating and strengthening Object and sensor to be packaged. Degree 'to ensure the cleanliness of the image sensor after being packaged, the precise positioning of the n-objects and the objects to be packaged and the positioning of the objects and the strength of the invention. In order to achieve the aforementioned object of the invention, the technical means used in the present invention is a common method; an object packaging method on the back-end packaging process of an image sensor, " is a method of reacting with three states of carbon oxide, respectively, to The to-be-packaged image sensory object, surface, and to-be-cleaned surface are cleaned, and the upper object is aligned to the position # ^ _ + She adds the surface pre-ordering / reading of the to-be-packaged image sensor object by thermocompression The object is fixed ... the formation effect of the positioning effect is then combined with the intensity, so that the second package = the knot of the packaged image sensor object. ^ Τ 忒 The upper object on the sensory object like the sensor object is not attached to dust and debris. , JL keeps the objects from getting on. Niu Jingyu is located in the sensor object to be packaged through the above method implementation process 'the packaging process of the image sensor 1235573'. The sensor object and the upper object to be packaged are subjected to surface cleaning treatment before the packaging operation, Said, ^. Part of the pixels in the sensing area of the sensor object to be packaged and the object to be packaged are covered with dust or water vapor, and without sensor / shell1, you can also treat the packaged sensor object and Pre-bake processing of the plastic moon beans between the upper objects to describe the excellent positioning effect between the two, and effectively prevent the upper objects from being improperly displaced during the transportation process to ensure the seal; Product quality. [Implementation] 'In order for your review committee to be accused * &A; Cui Nan understands the structural design of the present invention, and ... the purpose and effect of the creation of the invention, the following is described in detail below:- Implement the example in detail, and cooperate with Fang Xingxun, which is based on the front-reveal technology. ^ ^ ° It is a juice, this service is applied to image sensing ^ 10,000 sets of which, the upper object can be a transparent cover or a mirror seat, etc., please Refer to the first and second figures: First, as shown in the fourth figure, the object on the seal is identified as a transparent cover (30). ▲ The image to be packaged after the flares are molded on the completed substrate. The design of the process steps on the sensor object (20) :: 者 and wire bonding ㈣ 日 日 # # U 0) proposes that the packaging process steps mainly include: Provide an internal environment with clean laminar flow control. Crying object Π = three-state response means cleans the r / Γ surface of the to-be-closed image sensor; as shown in Fig. 3 (c), the main cleaning and main packaging equipment (10) preset the first cleaning crack ( The factory / the monthly cleaning device is preset with an air inlet and an air outlet " Into the main, the main 1 ^ Make a lice branch from the air inlet into the π, and then discharge through the air outlet, cooperate The micro-segmentation sensor object (20) after the tri-state change due to the change in temperature and 1235973 μ force of carbon monoxide > and — "糸 Seal image to be sealed ', complete the sensor object to be packaged (2 0 ) Cleaning process to remove the dust and impurities attached to the surface of the sensing object (2 ΓΜ 夂). Apply glue to the image sensor to be packaged by dispensing method. For details, please refer to the following figure: The amine top edge door η ... It is necessary to use the preset dispensing device (1 2) of the packaging device c 1 〇), oblique 6 忐, the main, Shizang package sensor object (2 〇) on the son点 ,, σ D σ 卩 position to apply the dispensing operation 'make the top edge of the embankment wall coated with thermosetting colloid, and transfer it [下 ^ 的 的The working area (A). &Quot; • Clean the surface of the transparent cover plate by reducing the three-state change reaction of stone anorexia '. Refer to the third figure C, which is mainly the second cleaning preset by the packaging device (U). The device (13), and the transparent cover (30) is taken by the taker (14), so that it is accommodated inside the second cleaning device (13), the second cleaning device is provided with an air inlet hole and- The exhaust hole allows carbon dioxide to enter the second cleaning device (1 3) from the air inlet hole, and then the exhaust hole: out 'cooperates with the three-state change of carbon dioxide due to temperature and pressure on the transparent fascia (30) @surface The cleaning effect produced is used to remove the dust and impurities attached to the surface of the transparent cover (30). Using the vision system for positioning, the transparent cover (30) is accurately positioned on the top edge of the colloidal bank wall, and simultaneously applied Pre-baking heat treatment, so that the transparent cover is positioned on the colloidal bank wall; as shown in Figures c and d of the third figure, a set of vision system is provided on the side of the second cleaning device to capture the transparent cover (30). Position of the image, and set another set of views 1235573 above the positioning work area (A) The system captures the position of the image of the image sensor object to be packaged for positioning. The positioner (1 4) is used for positioning by the two sets of vision systems, and the transparent cover plate (30) is set to the sensor to be packaged. The pre-baking device (i 5) with a baking and irradiating function, such as ultraviolet light, source irradiation lamp, etc., is used to pre-bake the pre-baking treatment on the combination of the two, and the There is a plus customer under the sensor object # (20) to be packaged, and the top edge of the bank wall and the transparent cover (30)% of the object to be packaged sensor object # (2〇) are heated to The silent temperature achieves the shape setting effect and effectively reduces the colloid fluidity to form an excellent positioning effect. The transparent cover plate is reinforced and fixed on the colloidal bank wall by thermocompression bonding; it is mainly a transparent device on which the sensor object # (2Q) to be packaged is mounted (3) is sent to the pressure device to the transparent cover plate. (30) Applying two-to-one to increase the bonding strength between the transparent cover plate (30) and the embankment wall: ㈣The overall height and coplanarity of the encapsulated image sensor, and then send it to the two-bake device to make the colloid Completely cured to complete the packaged crop of the image sensor is as follows: The packaging method described above can also be applied as shown in the sixth figure, "Board: Lens holder (40) of the Ming board (30) Encapsulated in the male body = upper mold plastic body wall (also can be set for the wallless lens holder on its surface) Image sensor core (20), the piece of fruit to be sealed (2) The process of Q) is as described above, and the present invention is also applicable to the head cover (50) as shown in the fifth figure. It will be without lens. Joining, wire bonding, ... The scene to be packaged after the transparent cover (30) on the wall or chip ”1239573 Like the packaging process steps on her object (20), it mainly includes: To improve the internal environment with laminar flow control. Clean the to-be-encapsulated image by means of the three-state change of carbon number. The main purpose is to use packaging equipment (10) preset No.-make-oxygen 11) '4 cleaning The device is provided with—air inlet and exhaust holes, 2—emulsion μ air inlets are fed into the cleaning device, and then discharged through the air outlets. The carbon distribution is changed due to changes in the degree and roof force & clean. The surface to be packaged (2 Q >) completes the sensing of the package to be packaged: (Guangzhi's cleaning process to remove the surface to be packaged ^ du) dust and impurities attached to each surface. The glue is used to apply the image to the package. The transparent cover on the outside of the sensor object: coated with glue; it is mainly the use of the dispensing t (12) preset by the packaging equipment (work 〇) 'the reservation on the sensor object (2 〇) to be packaged after the cleaning process is completed. Glue operation is performed on the joint part, so that the transparent cover (30) is coated with gel on the periphery and transferred to the positioning work area (A) of the next process. The lens holder is cleaned by the three-state change method of carbon dioxide. Surface; 'mainly using the second cleaning equipment preset by the packaging equipment (10) (! 3), and the lens holder is placed in the second cleaning device (i 3) by using the picker and (14), and the second cleaning device 4 (丄 3) is provided with an air inlet. Hole and an exhaust hole, so that the carbon dioxide enters the second cleaning device (1 3) 'from the air inlet hole and then is exhausted from the exhaust hole, in accordance with the three-state change of carbon dioxide due to temperature and pressure on the lens holder (50). The cleaning effect generated on the surface is used to remove the dust and impurities attached to the surface of the lens holder (50). 10 1239573 Use the vision system to position the mirror on the top edge of the transparent cover ("), and apply two: OK The reading day and day palm k γ ο a. After 々β M heating treatment, the 佶 -plate (30) is positioned on the colloidal bank wall; on the second cleaning 3) there is a group of vision systems, a capture lens, Image position, and a shadow on the positioning tool (A) above (50), capture the step to be sealed, the top of the spoon is 0, and the other is a group of visual system "image sensor object (2 0)" The position of the image is vertical, and the positioner (1 4) is positioned by two sets of vision systems, and = 5〇) is set on the sensor object to be packaged (2 〇) 1 part of the pre- °, at the same time under the sensor object to be packaged (2 0) $-° ° thermal fixture, so that the sensor object to be packaged (20) transparent cover: (/ ° ^ The colloid on the top edge of the periphery and the lens holder (50) f4 is heated to a predetermined positivity to achieve a predetermined shaping effect, and effectively reduces the excellent positioning effect of the absurd body. The 乂 shape will completely fix the lens holder (50) on the transparent cover = (3 0) by means of thermal coupling; it is mainly the sensor object (20) to be packaged and the lens I (5) packaged on it. Q) It is conveyed to the plus M device to apply pressure and compression to the lens holder (5, 0) to increase the bonding strength between the lens I (50) and the transparent cover (301 door), and control the image after encapsulation. The overall height and coplanarity of the sensor are re-entered into the baking device to completely solidify the adhesive: to complete the packaging operation of the image sensor. In this way, during the packaging of the image sensor, The sensor object (20) to be packaged and the upper object assembled thereon, such as the aforementioned transparent cover plate 3 0) or the lens holder (4 0), (50), etc., can be carried out in the baking installation 1235573. Before the encapsulation operation, the sub-encapsulation operation is completed, and the surface of the basin is cleaned: ^ 々 cleaned, so that the two can also treat the encapsulated sensor object (20) / dust and miscellaneous materials, and apply thermosetting gel between the positions. Pre-baking place: the effect of the combination of the objects, which effectively prevents 1μ ^ 7. The excellent objects on the mouth between the two are generated during transportation. When the displacement. In the process of the roasting device of Wang Yan, another example is as shown in the seventh figure and the eighth Gangtong—the stern plate (60), silly ^ What's not. The present invention is also applicable to soft foundations ”~ like the dream of the sensor after the paragraph The object can be a glass board fqna " upper object package, which has an uphill t-plate (30) or a glass cover (up (40)), which is packaged under the completed substrate to cover the f-images to be encapsulated. Sensing f:-, mainly including: * The packaging process steps on (20) provide a clean internal environment with laminar flow control. Write the physical carbon three-state change reaction method to clean the to-be-sealed I image sensor, the surface; the main; It is the first-(1 1) preset using packaging equipment ("). The cleaning device is provided with-air inlet holes and exhaust holes, and-emulsified carbon enters the cleaning device from the air inlet holes and is discharged through the exhaust holes. Matching port—Emulsified carbon undergoes three-state changes due to temperature and pressure changes. Clear: wait for the surface of the image sensor object (2) to complete the to-be-packaged sensing σ. Do not (2 〇) The cleaning process is used to remove the dust and impurities attached to each surface of the sensing object (20) to be packaged. The glue means is used to apply glue on the substrate of the image sensor object to be packaged; it mainly uses the dispensing device (1 2) preset by the packaging equipment (! 〇) to clean the sensor object to be packaged (2) 〇) on 12 1239573. Dispensing operation is performed on the predetermined bonding part, and it is transferred to the next process to position it so that the substrate is coated with a work area (A). Attach the colloid, and clean the surface of the transparent cover by tragic reaction. It mainly uses the second cleaning preset by the packaging equipment (10), and the transparent cover or the lens holder is taken by the taker (14), so that it is accommodated in the second cleaning device (i 3) The cleaning device is provided with an air inlet hole and an exhaust hole, so that the dioxide enters the second cleaning device, and then is discharged through the exhaust hole. A three-state change occurs with the second degree and pressure. The transparent cover plate (3 0) plate (3 0) The surface of the lens holder (40) is cleaned to remove the dust and impurities attached to the surface of the transparent cover (30) or the surface with the transparent cover (30 (40).) Or the lens holder; device (1 3 Inside the transparent cover, the second carbon oxidizes carbon from the air inlet Because of the warm or transparent cover washing effect, the lens holder # is used for positioning by the vision system, and the transparent cover (3 ◦) or the mirror post (4 〇) with the transparent cover (30) is accurately positioned on the substrate. At the same time, pre-baking heating is applied. The lens holder (40) with the main cover of transparent cover (30) or with transparent cover: 30) is positioned on the flexible substrate (60). There is a set of vision system on the side, which captures the image position of the transparent cover (30) or the lens 纟 (40) with a transparent cover (30) / and sets another one above the work area (A). The group vision system captures the image position of the H object (2 Q) to be packaged for image sensing for positioning. The benefit (1 4) uses two groups of vision system to locate the transparent cover (30) or transparent. The lens holder (40) of the cover plate (30) is arranged at a predetermined joint portion of the sensor object (20) _L to be packaged, and a pre-baking device (丄 5) with a baking irradiation function is used, such as an ultraviolet light source to irradiate Lamp 13 1239573, etc., apply pre-baking treatment to the combination of the two (if it is a lens holder with a transparent cover, no pre-baking is applied. Because the lens holder is opaque material, ultraviolet rays cannot be irradiated) and there is a heating fixture below the sensor object (20) to be packaged, so that the bank of the sensor object (2 0) to be packaged = The colloid between the edge and the transparent cover (30) is heated to a predetermined temperature, = to a predetermined setting effect 'and effectively reduces the colloid fluidity to form an excellent positioning effect. The transparent cover (30) or the lens holder (40) with the transparent cover (3 ◦) is reinforced and fixed on the flexible substrate (60) by means of thermal coupling. It mainly consists of the sensor object to be packaged ( 2) With the transparent seedling board (30) or the lens holder with a transparent cover plate (30) enclosed thereon: To the pressurizing device to the transparent cover plate (3 η), the head, * η # 1 or 1 or a lens holder (40) with a transparent cover (30) is pressurized, and a mouth is added to add a transparent cover (3 or a lens holder with a transparent cover (30) / n, The bonding strength between (40) and the flexible substrate (60) can be approved. 丨 Private: The overall height of the image sensor after several packages is integrated into the baking device to completely cure the glue.封装 The packaging operation of the image sensor. The edge is sealed by the objects on the middle packaging process described in the above implementation process :: The image sensor method of the present invention is characterized by: 1. The image sensor During the encapsulation process, the object of the device can be measured and assembled on top of it, the temple feels shameful) or the lens holder (40), (r η, ^ J 0 state change reaction hand After cleaning the surface, "Do n’t apply-emulsified carbon 30% packaging process, it is almost unreasonable", that is, the image sensor is finished with any dust and impurities, and it will be improved. "On object" -f- Μ ^ ^ ^ ^, 糸, dream, avoid some pixels in the sensing area can not be detected by U dust or water vapor. During the packaging process of the system image sensor, Two sets of vision (2; Ding Guang enable the upper object to be accurately positioned on the sensor object to be packaged 0), and the upper object is assembled on the sensor object to be packaged (2 after pre-assembling the assembly site, and simultaneously, the upper object Combined with the pre-heat treatment positioned on the to-be-sealed Γ, the bonding strength of the mouthpiece on the sensor object (20) to be sealed is enhanced to form an excellent positioning effect. The improper displacement due to shaking during transportation has caused the product f to be f.............. The image sensor is sealed by f. From the above description, it can be known that the rear-end packaging of the image sensor of the present invention == installation method can be used for image sensing. In the packaging process of the device, first separate the heart-free objects and assemble them. The parts are cleaned to prevent some of the pixels from being sensed by dust. It is said that the private machine and the machine are not available, but it is impossible to sense the good η "quote" "pre-bake heat treatment to form extreme displacement to prevent The displacement of the upper object due to shaking during transportation is indeed a very good design. [Simplified description of the drawings] (a) The first diagram of the diagram part is the implementation flowchart of the present invention. The second diagram is the institute of the present invention. The three-dimensional appearance diagrams prepared with the use of 忒 5 and the second diagrams A to D are schematic diagrams of the implementation of the present invention. The fourth diagram is the first diagram of the sensor object to be packaged and the upper object of the present invention. " 15 1239573 The fifth diagram is a schematic diagram of a sensor object and an upper object to be packaged according to the present invention (2). The sixth figure is a schematic diagram (3) of the sensor object and the upper object to be packaged according to the present invention. The seventh diagram is a schematic diagram (4) of the sensor object and the upper object to be packaged according to the present invention. The eighth figure is a schematic diagram (five) of the sensor object and the upper object to be packaged according to the present invention. (2) Symbols of components (1 0) Packaging equipment (1 1) First cleaning device (1 2) Dispensing device (1 3) Second cleaning device (14) Remover (15) Pre-baking device (2 0 ) Sensor object to be packaged (30) Transparent cover (40) Lens mount (50) Lens mount (60) Soft substrate