CN203967060U - The automation package system of image sensor chip - Google Patents
The automation package system of image sensor chip Download PDFInfo
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- CN203967060U CN203967060U CN201420370167.2U CN201420370167U CN203967060U CN 203967060 U CN203967060 U CN 203967060U CN 201420370167 U CN201420370167 U CN 201420370167U CN 203967060 U CN203967060 U CN 203967060U
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Abstract
An automation package system for image sensor chip, described automation package system comprises: system base station; Chip microscope carrier, is placed on described system base station, is suitable for assembling image sensor chip; Mechanical manipulator, is placed on described system base station, a side of described chip microscope carrier, is suitable for automatic Picking and transmits described image sensor chip; Throwing device, is placed on described system base station, and the opposite side of described chip microscope carrier is suitable for image sensor chip and throwing device that coupling is picked up by described mechanical manipulator, and described image sensor chip is carried out to metal bonding; Bonder, is placed on described system base station, is suitable for receiving and bonding base plate for packaging and the image sensor chip formation packaging part that completes metal bonding.Described automation package system can be saved and take up room, and improves packaging efficiency and package quality.
Description
Technical field
The utility model relates to technical field of semiconductors, particularly a kind of automation package system of image sensor chip.
Background technology
Imageing sensor (CIS:CMOS Image Sensor) is the transducer that can experience optical image information and convert thereof into usable output signal.Imageing sensor can improve the visual range of human eye, the microcosmos and the macrocosm that make people see that naked eyes cannot be seen, see that people temporarily cannot arrival place occurrence, see the various physics, the chemical change process that exceed naked eyes visual range, the generation evolution of life, physiology, pathology, etc.Visual picture transducer plays very important effect in people's culture, physical culture, production, life and scientific research.
In actual applications, imageing sensor is that the form of image taking sensor chip is brought into play the function that it is experienced optical image information and converts thereof into usable output signal.Image sensor chip is easily subject to the pollution of external environment in the course of the work, so need to encapsulate image sensor chip, make image sensor chip under sealed environment, thereby avoid the impact of external environment on image sensor chip, thereby improve the performance and used life of image sensor chip.
At present, the encapsulation of all imageing sensors adopts the production line encapsulation of high clean environment, high pollution complicated process equipment and material, mainly comprises that chip on board encapsulation (COB:Chip On Board) production line, wafer-level packaging (CSP:Chip Scale Package) production line and flip-chip envelope turn (FC:Flip Chip) production line.
COB packing producing line is mainly used in high pixel product, this packing producing line mainly comprises the circuit making of PCB substrate, on pcb board, putting glue is bonded in bare chip (Die) on PCB, then be cured, use gold thread nation determine pad (PAD) point that machine makes Die and the PAD point of PCB carries out metal wire nation calmly, lens mount and camera lens are installed after cleaning, are completed stuck-module structure.But there is following significantly problem in this production line: the clean room environment of 1 necessary 10 grades of all fronts, maintenance cost is high; The omnidistance exposed to air of 2 product surfaces, dust particale control difficulty is large, and one time yields is not high; The customization of 3 modular products is more serious, and degree of flexibility is not high; 4 wall scroll production line output are not high, and once investment is too high.
CSP packing producing line is mainly used in Wafer Level (wafer scale) encapsulation of low and middle-end, low pixel (2M pixel or following) imageing sensor and produces.This encapsulation production and application wafer scale glass and wafer binding, and use cofferdam to separate between the image sensor chip of wafer, then the T-shaped metal connection-core chip size encapsulation technology of pad side after the silicon puncturing technique (TSV:Through Silicon Via) that the wafer welding disking area after grinding connects by making bond pad surface or pad face endoporus side ring metal or cutting, and on wafer rear extended link, make solder ball grid array (BGA:Ball Grid Array), then after cutting, form the image sensor cell of single sealed cavity.Rear end forms modular structure by surface patch technology (SMT).But there is following obviously problem in CSP packaging line: 1 performance, especially the small pixel product of wafer scale thickness of glass considerable influence product and the organic protection layer of PAD metal part affect the reliability of product; After the size upgrading of 2 wafers, need to set up new production line completely; The high pixel of 3 production (large cavity) product difficulty is very large; 4 environmental pollutions are large, and scale of investment is large.
FC packaging line is Die Level (chip-scale) packing producing line of high-end, the high pixel of rising recently (5M or more than) imageing sensor.This production line is directly connected all contact tabs by the ultrasonic effect of heat is disposable with the pad of PCB carrying out the chip of metal coupling after grinding and cutting at pad with pad, form encapsulating structure unit.Rear end adopts surface patch technology (SMT) to form modular structure by pad or the tin ball in PCB outside.But there are the following problems for FC packaging line: 1PCB cost is very high; 2 fabrication reliability difficulty are large, and the hardwired consistency equipment requirement of projection and pad is high; 3 micronic dust control difficulty are large, process environments requires high; 3 producing lug costs are high.
In sum, need a kind of low cost that realizes high pixel, large chip sized image transducer, high-performance, high reliability, ultra-thin without cleaning automation integrated package system badly.
Utility model content
The problem that the utility model solves is to provide a kind of automatic packaging system of image sensor chip, to improve the efficiency of image sensor package and the package quality of image sensor chip.
For addressing the above problem, the utility model provides a kind of automatic packaging system of image sensor chip, comprising: system base station; Chip microscope carrier, is placed on described system base station, is suitable for assembling image sensor chip; Mechanical manipulator, is placed on described system base station, a side of described chip microscope carrier, is suitable for automatic Picking and transmits described image sensor chip; Throwing device, is placed on described system base station, the opposite side of described chip microscope carrier, is suitable for image sensor chip and throwing device that coupling is picked up by described mechanical manipulator, and described image sensor chip is carried out to metal bonding; Bonder, is placed on described system base station, is suitable for receiving and bonding base plate for packaging and the image sensor chip formation packaging part that completes metal bonding.
Optionally, described chip microscope carrier is suitable for loading the wafer of the image sensor chip that includes some separation.
Optionally, described mechanical manipulator comprises the chip pickup parts that are arranged on one end.
Optionally, described mechanical manipulator comprises mechanical arm, comprises at least one bearing, and described bearing is suitable for controlling described chip pickup parts and moves along the either direction within the scope of three dimensions.
Optionally, described bearing is suitable for controlling described chip pickup parts level, vertical or upset is mobile.
Optionally, described chip pickup parts are one or more, and the quantity of described mechanical arm is consistent with chip pickup number of components, the connection corresponding to single mechanical arm of one single chip pick-up part.
Optionally, described mechanical manipulator comprises mechanical arm, and the other end is arranged on the first guide rail, and described the first guide rail is arranged at described system base station, and described the first guide rail is suitable for controlling mechanical arm entirety and moves on system base station.
Optionally, described chip pickup parts comprise: be placed in the metal bonding work top on top, be suitable for placing described imageing sensor and chip metal bonding accessory.
Optionally, described mechanical manipulator also comprises: dust proof member, be laid in by described chip pickup parts, and be suitable for hiding the photosurface of described image sensor chip.
Optionally, described mechanical manipulator also comprises: heat supply parts, be laid in by described chip pickup parts, and be suitable for image sensor chip heat supply.
Optionally, described automation package system also comprises: the first positioner, is suitable for locating described image sensor chip and described chip pickup parts.
Optionally, described the first positioner is disposed at the top of described chip microscope carrier.
Optionally, one end of described throwing device is provided with bonding end.
Optionally, described automation package system also comprises: the second positioner, is suitable for image sensor chip and bonding end that location is picked up by described mechanical manipulator.
Optionally, described the second positioner is disposed at described throwing device top.
Optionally, described automation package system also comprises: conveyer belt, is placed on described system base station, by described bonder, is suitable for receiving and transmitting base plate for packaging.
Optionally, described automation package system also comprises: rotating operation table, is placed on described system base station, by described bonder, is suitable for receiving and transmitting base plate for packaging.
Optionally, described base plate for packaging is loaded into base plate for packaging loading tray, and described base plate for packaging loading tray is placed on described conveyer belt or rotating operation table separatedly.
Optionally, one end of described bonder is provided with bonding end.
Optionally, described automation package system also comprises: the 3rd positioner, is suitable for locating described base plate for packaging, completes the image sensor chip of metal bonding, bonding end.
Optionally, described the 3rd positioner is disposed at described bonder top.
Optionally, described package system also comprises: fixture, be placed in described bonder top, and be suitable for the position of the image sensor chip that completes metal bonding described in fixing to be matched with described base plate for packaging.
Optionally, it is characterized in that, described the first positioner, the second positioner, the 3rd positioner are image positioning device.
Optionally, described image positioning device comprises camera, video camera, imageing sensor or infrared sensor.
Optionally, described bonder also comprises: heater, is suitable for boning under heating condition.
Optionally, described automation package system also comprises: solidification equipment, is suitable for receiving and solidifies described packaging part.
Optionally, described solidification equipment provides ultraviolet light.
Compared with prior art, the technical solution of the utility model has the following advantages:
The automation package system of the image sensor chip that the technical solution of the utility model provides, is integrated into the packaging system of each step in encapsulation process in a package system, has reduced the space that packaging system occupies.By mechanical manipulator, pick up and transmit image sensor chip, because described automation package system takes up space littlely, described image sensor chip mobile distance in encapsulation process is less, can improve the packaging efficiency of package system.Can pass through independent package system, complete the whole encapsulation process of image sensor chip, thereby make, in the whole encapsulation process of imageing sensor, not need to contact external environment, and then can avoid image sensor chip to be polluted in encapsulation process.Because the integrated level of described automation package system is higher, take up space less, so safeguard that the cost of cleannes of described package system is lower.
Further, mechanical manipulator in the technical solution of the utility model comprises multiple chip pickup parts and mechanical arm, thereby can pick up multiple image sensor chips simultaneously, being sent to respectively different devices processes, whole automation package system can be encapsulated multiple image sensor chips simultaneously, improve the packaging efficiency of described automation package system.
Further, the automation package system in the technical solution of the utility model also comprises the first positioner, the second positioner and the 3rd positioner.Can accurately locate the image sensor chip in encapsulation process, mechanical manipulator, throwing device and bonder, improve package quality.
Brief description of the drawings
Fig. 1 is the automation package system overall schematic of an embodiment described in the utility model.
Fig. 2 is mechanical manipulator, the throwing device of automation package system in an embodiment described in the utility model, the partial schematic diagram of the second positioner.
Fig. 3 is the bonder of automation package system in an embodiment described in the utility model, the partial schematic diagram of base plate for packaging loading tray.
Fig. 4 to Fig. 6 is the structural representation of the image sensor chip encapsulation process of an embodiment of the present utility model.
100 system base stations; 110 mechanical manipulators; 120 throwing devices; 130 bonders; 140 solidification equipments; 150 conveyer belts; 101 chip microscope carriers; 102 first positioners; 103 second positioners; 104 the 3rd positioners; 105 first guide rails; 106 base plate for packaging loading trays; 111 chip pickup parts; 112 metal bonding work tops; 114 heat supply parts; 115 bearings; 121 bonding ends; 131 bonding ends; 132 heaters; 133 fixtures; 200 image sensor chip wafers; 201 image sensor chips; 202 pads; 203 image sensing districts; 204 plain conductors; 205 base plate for packaging; 206 adhesive layers; 207 annular seal spaces.
Embodiment
As described in the background art, the packaging efficiency of existing image sensor chip is lower, and chip is easily polluted.
Embodiment of the present utility model provides a kind of automation package system of imageing sensor, can improve packaging efficiency and package quality.
For above-mentioned purpose of the present utility model, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiment of the utility model is described in detail.
Please refer to Fig. 1, is the overall structure schematic diagram of the automation package system of the image sensor chip of the present embodiment.
The automation package system of described image sensor chip comprises: system base station 100; Chip microscope carrier 101, is placed on described system base station 100, is suitable for assembling image sensor chip; Mechanical manipulator 110, is placed on described system base station 100, a side of described chip microscope carrier 101, is suitable for automatic Picking and transmits described image sensor chip; Throwing device 120, is placed on described system base station 100, and the opposite side of described chip microscope carrier 101 is suitable for image sensor chip and throwing device 120 that coupling is picked up by described mechanical manipulator 110, and described image sensor chip is carried out to metal bonding; Bonder 130, is placed on described system base station 100, is suitable for receiving and bonding base plate for packaging and the image sensor chip formation packaging part that completes metal bonding.
Described system base station 100, for carrying each device of described automation package system, is integrated on this system base station 100 each device.Described system base station 100 can comprise square or circular table top and support the support of this table top, described system base station 100 frame bottom can be provided with roller, convenient mobile described system base station 100, described base station support can be also liftable support, is convenient to adjust the height of described system base station 100.In the present embodiment, described system base station 100 also comprises the framework 160 that is fixed on mesa edge position, wherein mechanical manipulator 110, throwing device 120, bonder 130 can fix with described framework 160 on, making whole automatic packaging system be contained in vertical direction distributes, thereby can improve the integrated level of described automatic packaging system, reduce the spatial volume that described automatic packaging system takies.
Described chip microscope carrier 101, for assembling image sensor chip.Described chip microscope carrier 101 is fixedly connected with system base station 100, in the present embodiment, described chip microscope carrier 101 is positioned at the center position of system base station 100, other device distribution of package system in described chip microscope carrier 101 around, be convenient to mechanical manipulator 110 captured image sensor chip from chip microscope carrier 101, and mobile described graphical sensory device to other equipment places carry out each encapsulation step.In other embodiment of the present utility model, described chip microscope carrier 101 also can be positioned at the marginal position of system base station 100.
In the present embodiment, described chip microscope carrier 101 can comprise: bracing frame and be positioned at the chip rest area at support frame as described above top.Support frame as described above is fixedly connected with system base station 100, and support frame as described above designs for liftable, is convenient to adjust the height of described chip rest area.Support frame as described above can also make described chip rest area rotate along shaft core position, to adjust the position that is positioned over the image sensor chip on described chip rest area.In the present embodiment, described chip put area is a circular groove, for loading the image sensor chip wafer 200 with some separating chips.In other embodiment of the present utility model, described chip put area can be also other shapes, is suitable for placing the image sensor chip of other shapes and size.
Please refer to Fig. 2, is the schematic side view of mechanical manipulator 110 and the throwing device 120 of A direction from Fig. 1.
Wherein, described mechanical manipulator 110, is placed on described system base station 100 and is positioned at a side of described chip microscope carrier 101, is suitable for automatic Picking and transmits described image sensor chip.One end of described mechanical manipulator 110 is connected with system base station 100, and one end is unsettled, for captured image sensing chip from chip microscope carrier 101, and described image sensor chip is sent in other packaging systems, processes.
In the present embodiment, described mechanical manipulator 110 comprises the chip pickup parts 111 that are arranged at one end, for captured image sensing chip.Described chip pickup parts 111 comprise: the metal bonding work top 112 that is placed in top, be suitable for placing described imageing sensor and chip metal bonding accessory, described metal bonding work top 112 can be non-sticky material end face, can adsorb described image sensor chip.The material of described non-sticky material end face can be metal, pottery, plastics, and described chip metal bonding accessory can be the accessory for metal bonding such as heater, Vltrasonic device, positioner, mould.
Described mechanical manipulator 110 also comprises mechanical arm 116, and one end of described mechanical arm 116 is connected with system base station 100, and the other end is connected with described chip pickup parts 111.One end of described mechanical arm 116 can be to be flexibly connected with chip pickup parts 111.Can be by actions such as accurate lifting, upset and the movements of controlling described chip pickup parts 111 of described mechanical arm 116, so that described chip pickup parts 111 captured image sensor chip from chip microscope carrier 101 accurately.
In embodiment of the present utility model, described mechanical manipulator 110 at least comprises one or more bearings 115, described mechanical arm 116 is connected with described chip pickup parts 111 by bearing 115, and described bearing 115 is suitable for controlling described chip pickup parts 111 levels, vertical or upset is mobile.In other embodiment of the present utility model, described bearing 115 is suitable for controlling described chip pickup parts 111 and moves along the either direction within the scope of three dimensions, thereby can accurately adjust the position of described image sensor chip, so that carry out follow-up encapsulation step.
Described mechanical manipulator 110 can also comprise the first guide rail 105 (please refer to Fig. 1), it is upper that described the first guide rail 105 is arranged at described system base station 100 (please refer to Fig. 1), and the mechanical arm 116 of described mechanical manipulator 110 is connected with system base station 100 by described the first guide rail 105.One end of described mechanical arm 116 is embedded in described the first guide rail 105, and is flexibly connected between described the first guide rail 105, and described mechanical arm 116 can be moved horizontally along described the first guide rail 105, thereby can expand the moving range of described mechanical arm 116.
In the present embodiment, on described system base station 100, be fixed with framework 160 (please refer to Fig. 1), described the first guide rail 105 fixing described framework 160 surfaces, thereby can make described mechanical manipulator 110 positions higher than chip microscope carrier 101, be convenient to the image sensor chip on pick-up chip microscope carrier 101.
In other embodiment of the present utility model, described chip pickup parts 111 can be that more than two the quantity of described mechanical arm 116 is consistent with the quantity of chip pickup parts 111, and one single chip pick-up part 111 connection corresponding to single mechanical arm 116.Single mechanical arm 116 is controlled separately chip pickup parts 111 and is independently picked up and moving image transmitting sensor chip, make in the time of described package system work, can process multiple image sensor chips simultaneously, thereby improve the operating efficiency of described package system.
In other embodiment of the present utility model, described mechanical manipulator 110 can also comprise dust proof member, be laid in described chip pickup parts 111 other, be suitable for hiding the photosurface of described image sensor chip, avoid the photosurface of described image sensor chip to be polluted in encapsulation process, affect the performance of described graphical sensory device chip.Described dust proof member can be dust-proof material, Electrostatic Absorption material, air-breathing or gas extraction system, for adsorbing, stop or discharging imageing sensor micronic dust around, thereby avoids image sensor chip to be polluted.
Described mechanical manipulator 110 also comprises: heat supply parts 114, be laid in described chip pickup parts 111 other, and be suitable for image sensor chip heat supply to picking up so that the follow-up bonding step of carrying out.Described heat supply parts 114 can be should be heated by resistive, the heater element of gas-heated, Electromagnetic Heating or infrared heating etc.In the present embodiment, described heat supply parts 114 are positioned at chip pickup parts 111 tops.
In the present embodiment, described automatic packaging system also comprises the first positioner 102 (please refer to Fig. 1).Described the first positioner 102 is suitable for locating the relative position of described image sensor chip and described chip pickup parts 111, thereby makes described mechanical manipulator 110 can accurately pick up pending chip.Described the first positioner 102 can be image positioning device, described the first positioner 102 is interior can comprise the image acquisition component such as camera, video camera, imageing sensor or infrared sensor, described the first positioner 102 is interior can also comprise image processing apparatus, by the figure obtaining is analyzed, to obtain the positional information of chip and chip pickup parts 111.
In the present embodiment, described the first positioner 102 be positioned at chip microscope carrier 101 directly over, thereby can obtain by described the first positioner 102 positional information of all image sensor chips of placing on chip microscope carrier 101, and in the time that chip pickup parts 111 move to chip microscope carrier 101 top, can be by the positional information of chip pickup parts 111 described in described the first positioner 102 Obtaining Accurates.
In other embodiment of the present utility model, the position that described the first positioner 102 can also be positioned at other and can obtain chip and chip pickup parts 111 positional informations.Described the first positioner 102 can be fixed on the framework 160 (please refer to Fig. 1) on described system base station 100 by support.
Throwing device 120 in described automatic packaging system, for described image sensor chip is carried out to metal bonding, described throwing device 120 is placed on described system base station 100, is positioned at the opposite side of described chip microscope carrier 101.When described mechanical manipulator 110 is from chip microscope carrier 101 after captured image sensor chip, described chip is moved to described throwing device 120 belows by described mechanical manipulator 110, and described throwing device 120 carries out metal bonding to described chip.
Described throwing device 120 one end are placed on system base station 100, and the other end is provided with bonding end 121, for image chip transducer is carried out to bonding.Described bonding end 121 can move in the vertical direction and in horizontal direction, and chip is carried out to bonding.
In the present embodiment, described automation package system also comprises: the second positioner 103, be suitable for the image sensor chip that picked up by described mechanical manipulator 110 and the bonding end 121 of throwing device 120 described in location, to make described throwing device 120 to carry out bonding at the accurate location place of image sensor chip.In the present embodiment, described the second positioner 103 is disposed at described throwing device 120 tops, can accurately know the positional information of the image sensor chip being sent by mechanical manipulator 110, thereby mobile bonding end 121, to accurate location, makes the position of described bonding end 121 treat that with image sensor chip bonding position is corresponding.
In other embodiment of the present utility model, the position that described the second positioner 103 can also be positioned at other and can obtain chip position information.Described the second positioner 103 can be image positioning device, described the second positioner 103 is interior can comprise the image acquisition component such as camera, video camera, imageing sensor or infrared sensor, described the second positioner 103 is interior can also comprise image processing apparatus, to obtain the positional information of chip and chip pickup parts 111.
Described bonder 130, is placed on described system base station 100, is suitable for receiving and bonding base plate for packaging and the image sensor chip formation packaging part that completes metal bonding.Please refer to Fig. 3, Fig. 3 is the generalized section of described bonder 130.One end of described bonder 130 is provided with bonding end 131, by described bonding end 131, base plate for packaging and image sensor chip is carried out bonding.Described bonder 130 can carry out the bonding mode of a glue, encapsulating, picture glue, silk screen printing or aforesaid way combination.
In the present embodiment, described bonder 130 also comprises adhesive glue storage device 134, and described adhesive glue storage device 134 is for depositing adhesive glue, and described adhesive glue storage device 134 is connected with bonding end 131, for providing adhesive glue to bonding end 131.
In the present embodiment, described bonder 130 also comprises heater 132, and described heater 132 is suitable for, chip and base plate for packaging are carried out in bonding process, the adhesive glue of adhesion process use being heated, to improve bonding quality.In the present embodiment, described heater 132 is between adhesive glue storage device and bonding end 131, and the adhesive glue being suitable for flowing to bonding end 131 heats, to improve the mobility of described adhesive glue.Simultaneously, can discharge the gas in cavity between base plate for packaging and image sensor chip, pressure while preventing high temperature in cavity is excessive, affects package quality, described heater 132 can be should be heated by resistive, the device of gas-heated, Electromagnetic Heating or infrared heating.
In other embodiment of the present utility model, described automatic packaging system also comprises fixture 133.Described fixture 133 is arranged at bonder 130 tops, be suitable for the position of the image sensor chip that completes metal bonding described in fixing to be matched with described base plate for packaging, and when the location matches of the image sensor chip of metal bonding is during in described base plate for packaging, the pressure of vertical direction is provided in described fixture 133, described pressure drives to image sensor chip by bonder 130, and image sensor chip and base plate for packaging pressing are not offset.
Please continue to refer to Fig. 1, in the present embodiment, described automation package system also comprises: conveyer belt 150, and described conveyer belt 150 is placed on described system base station 100, described bonder 130 is other, be suitable for receiving and transmitting base plate for packaging, the height of described bonder 130 is higher than described conveyer belt 150.Described base plate for packaging can be to be loaded in base plate for packaging loading tray 106, base plate for packaging loading tray 106 and the envelope transglutaminase substrate that is positioned at described base plate for packaging loading tray 106 are sent to described bonder 130 belows by described conveyer belt 150, subsequently mechanical manipulator 110 by the image sensor chip that completes metal bonding as on base plate for packaging, by the bonding described base plate for packaging of described bonder 130 and image sensor chip, form packaging part again.In the present embodiment, described base plate for packaging loading tray 106 has multiple separated regions, base plate for packaging be separated as in described base plate for packaging loading tray 106, described base plate for packaging loading tray 106 can be placed multiple base plate for packaging simultaneously.In the present embodiment, described base plate for packaging is matrix in base plate for packaging loading tray to be arranged, and is convenient to follow-up aligning with bonding.
In other embodiment of the present utility model, the conveyer of the base plate for packaging of described automation package system can also be rotating operation table, described rotating operation table has articles holding table that can be in rotary moving along axle center, base plate for packaging is placed on described articles holding table, by rotary moving to bonder 130 belows.
In the present embodiment, described automation package system can also comprise the 3rd positioner 104, be suitable for locating described base plate for packaging, complete image sensor chip, the bonding end 131 (please refer to Fig. 3) of metal bonding, thereby make between described image sensor chip and base plate for packaging position relationship corresponding, with accurately bonding, form packaging part.
Described the 3rd positioner 104 can be image positioning device, described the 3rd positioner 104 is interior can comprise camera, video camera, the image acquisition component such as imageing sensor or infrared sensor, described the 3rd positioner 104 is interior can also comprise image processing apparatus, to obtain base plate for packaging, complete the positional information of image sensor chip and the bonding end 131 of metal bonding, thereby controlling described mechanical manipulator 110 moves to accurate location by the imageing sensor that completes metal bonding and is positioned on base plate for packaging, and mobile bonder 130 is to accurate location, bonding to described imageing sensor and base plate for packaging, form packaging part.In the present embodiment, described the 3rd positioner 104 is arranged at bonder 130 tops.
Described automation package system also comprises solidification equipment 140, and described solidification equipment 140 is suitable for receiving and solidifies described packaging part.Described solidification equipment 140 has ultraviolet light generator, and ultraviolet light can be provided.In the present embodiment, described solidification equipment 140 is positioned at bonder 130 1 sides, is arranged at conveyer belt 150 tops, and is fixed on system base station 100 by support.Complete bonding packaging part and be sent to solidification equipment 140 belows by conveyer belt 150, described solidification equipment 140 carries out ultraviolet irradiation to packaging part described packaging part is cured.
In other embodiment of the present utility model, also can be cured described packaging part by mode of heating.
Above-mentioned automation package system is integrated into the packaging system of each step in encapsulation process in a package system, has reduced the space that packaging system occupies.By mechanical manipulator, pick up and transmit image sensor chip, because described automation package system takes up space littlely, described image sensor chip mobile distance in encapsulation process is less, can improve the packaging efficiency of package system.Can pass through independent package system, complete the whole encapsulation process of image sensor chip, thereby make, in the whole encapsulation process of imageing sensor, not need to contact external environment, and then can avoid image sensor chip to be polluted in encapsulation process.
Embodiment of the present utility model also provides a kind of automation package system that adopts above-mentioned automation package system to carry out.
Please also refer to Fig. 1 to Fig. 3, described automation method for packing comprises the steps: to receive and assemble image sensor chip by chip microscope carrier 101; Be positioned at the image sensor chip on chip microscope carrier 101 by mechanical manipulator 110 automatic Pickings, mobile described image sensor chip is to throwing device 120; Mate by throwing device 120 image sensor chip that described mechanical manipulator 110 picks up, the row metal bonding of going forward side by side; Move the image sensor chip of metal bonding by mechanical manipulator 110 to bonder 130; By bonder 130, receive and bonding base plate for packaging and the image sensor chip formation packaging part that completes metal bonding.
First, provide image sensor chip 201 (please refer to Fig. 4).There is image sensing district 203 in the front of described image sensor chip 201, and around the pad 202 in image sensing district 203.
Described chip microscope carrier 101 can comprise: bracing frame and be positioned at the chip rest area at support frame as described above top.Support frame as described above is fixedly connected with system base station 100, and support frame as described above designs for liftable, is convenient to adjust the height of described chip rest area.In the present embodiment, the image sensor chip wafer 200 of the image sensor chip 201 that is mounted with some separation is placed on chip microscope carrier 101, and one of the pad 202 that has of described image sensor chip 201 faces down and is placed in described chip microscope carrier 101 surfaces, exposes the back side of described image sensor chip 201.Then can, by adjusting support frame as described above to adjust wafer on described chip microscope carrier 101 in proper height, be convenient to by mechanical manipulator 110 captured image sensor chips 201.
In other embodiment of the present utility model, also can on described chip microscope carrier 101, place single or some image sensor chips.
In the present embodiment, described automatic packaging system also comprises the first positioner 102, described the first positioner 102 can be image positioning device, described the first positioner 102 is interior can comprise the image acquisition component such as camera, video camera, imageing sensor or infrared sensor, and described the first positioner 102 is interior can also comprise image processing apparatus.
In the present embodiment, described the first positioner 102 be positioned at chip microscope carrier 101 directly over, thereby can obtain on chip microscope carrier 101 by described the first positioner 102 positional information of all image sensor chips of placing.Place image sensor chip on described chip microscope carrier 101 after, obtain the positional information of described imageing sensor by described the first positioner 102, and can adjust described graphical sensory device to correct position by described positional information.The bracing frame of described chip microscope carrier 101 can make described chip rest area rotate along shaft core position, to adjust the position that is positioned over the image sensor chip on described chip rest area.In the present embodiment, can make the alignment mark of described wafer align with the alignment mark on chip microscope carrier 101, thereby locate the position of described imageing sensor.
Then, be positioned at the image sensor chip 201 on chip microscope carrier 101 by mechanical manipulator 110 automatic Pickings, mobile described image sensor chip 201 is to throwing device 120.
Described mechanical manipulator 110, one end is connected with system base station 100, and one end is unsettled, for captured image sensing chip from chip microscope carrier 101.In the present embodiment, described mechanical manipulator 110 comprises the chip pickup parts 111 that are arranged at one end, for captured image sensing chip.Described chip pickup parts 111 comprise: the metal bonding work top 112 that is placed in top, be suitable for placing described imageing sensor and chip metal bonding accessory, described metal bonding work top 112 can be non-sticky material end face, the material of described non-cohesive material end face can be metal, pottery or plastics etc., for adsorbing described image sensor chip 201.
In the present embodiment, described mechanical manipulator 110 also comprises mechanical arm 116, and one end of described mechanical arm 116 is connected with system base station 100, and one end is connected with described chip pickup parts 111, and one end of described mechanical arm 116 is flexibly connected with chip pickup parts 111.Can be by actions such as accurate lifting, upset and the movements of controlling described chip pickup parts 111 of described mechanical arm 116, so that described chip pickup parts 111 captured image sensor chip from chip microscope carrier 101 accurately.The mechanical arm 116 of described mechanical manipulator 110 can also comprise at least one bearing 115, and described bearing 115 is suitable for controlling the either direction of described chip pickup parts 111 within the scope of three dimensions and moves.In the present embodiment, described bearing 115 be suitable for controlling described chip pickup parts 111 along level, vertical, upset is mobile.
In the present embodiment, described mechanical manipulator 110 can also comprise the first guide rail 105, and described the first guide rail 105 is arranged on described system base station 100, and the mechanical arm of described mechanical manipulator 110 is connected with system base station 100 by described the first guide rail 105.Described mechanical arm is moving to pick up the image sensor chip at diverse location place along the first guide rail 105.
Move described mechanical arm 116 to correct position by described the first guide rail 105, and control described chip pickup parts 111 to chip microscope carrier 101 tops by described mechanical arm 116, after making metal bonding work top 112 positions of described chip pickup parts 111 corresponding with image sensor chip 201 positions on chip microscope carrier 101, reduce the height of described chip pickup parts 111, make metal bonding work top 112 adsorb image sensor chip 201, complete chip pickup action.In the present embodiment, can pass through the first positioner 102, locate the relative position of described image sensor chip and described chip pickup parts 111, thereby make described chip pickup parts 111 can accurately pick up pending chip.
In other embodiment of the present utility model, described chip pickup parts 111 are one or more, the quantity of described mechanical arm 116 is consistent with chip pickup parts 111 quantity, one single chip pick-up part 111 connection corresponding to single mechanical arm, in the time of described package system work, multiple chip pickup parts 111 captured image sensor chip successively, thereby make described automatic packaging system carrying out in encapsulation process, can process multiple image sensor chips simultaneously, thereby improve the operating efficiency of described package system.The time interval of different chip pickup pickup captured image processor chips is 2 seconds～4 seconds, both can improve the operating efficiency of package system, can not have influence on again the work of adjacent mechanical arm.
After described mechanical manipulator 110 picks up pending picture processing chip, improve the height of described chip pickup parts 111, and by described chip pickup parts 111 flip verticals, make the pad 202 of image sensor chip 201 upward, then described mechanical arm moves and moves to described throwing device 120 belows along the first guide rail 105, make described throwing device 120 relative with the pad 202 on image sensor chip 201, be convenient to follow-up described imageing sensor be carried out to bonding.
In the present embodiment, described mechanical manipulator 110 also comprises dust proof member, be laid in described chip pickup parts 111 other, be suitable for hiding the photosurface of described image sensor chip, avoid the photosurface of described image sensor chip to be polluted in mobile and encapsulation process, affect the performance of described graphical sensory device chip.Described dust proof member can be dust-proof material, Electrostatic Absorption, air-breathing or gas extraction system.
Then, mate the image sensor chip 201 being picked up by described mechanical manipulator 110 by throwing device 120, and described image sensor chip 201 is carried out to metal bonding, please refer to Fig. 5 is the image sensor chip 201 after bonding completes.
In the present embodiment, one end of described throwing device 120 is provided with bonding end 121, for chip bonding pad 202 is carried out to bonding.In the present embodiment, can pass through the first end of throwing device 120 by bonding plain conductor 204 on the pad 202 of image sensor chip 201, and extend the second end of plain conductor 204, and make the second end of described plain conductor 204 unsettled.
In other embodiment of the present utility model, can also pass through the first end of throwing device 120 by bonding plain conductor 204 on the pad 202 of image sensor chip 201, extend the second end of plain conductor 204 and be placed in the metal bonding accessory surface of chip pickup parts 111, described plain conductor 204 does not produce bonding action with metal bonding accessory surface.
The material of described plain conductor 204 can be the good conductor wires such as gold thread, copper cash, aluminum steel, silver-colored line or alloy wire.
In the present embodiment, described automation package system also comprises the second positioner 103, and described the second positioner 103 is disposed at described throwing device 120 tops.Before carrying out metal bonding, can locate the image sensor chip that picked up by described mechanical manipulator 110 and the position of bonding end 121 by the second positioner 103, make described bonding end 121 corresponding with chip bonding pad position.
In the present embodiment, described mechanical manipulator 110 also comprises: heat supply parts 114, be laid in described chip pickup parts 111 other, described image sensor chip being carried out in the process of bonding, can be to described image sensor chip heat supply, be used for promoting metal bonding, improve bonding efficiency and quality, described heat supply parts are no more than 250 DEG C to the temperature of image sensor chip heating.Described heat supply parts 114 can be should be heated by resistive, the heater element of gas-heated, Electromagnetic Heating, infrared heating etc.
After the image sensor chip 201 on described chip pickup parts 111 is completed to metal bonding, the image sensor chip 201 that has moved metal bonding by mechanical manipulator 110 is to bonder 130, and it is other to bonder 130 to transmit base plate for packaging 205 (please refer to Fig. 6) by conveyer belt 150 or rotating operation table.Fig. 6 has been the structural representation of the packaging part after bonding.
Described base plate for packaging 205 can be the transparent materials such as glass, plastics or sapphire, and the size of described base plate for packaging 205 is corresponding one by one with the size of image sensor chip 201, and described base plate for packaging surface has groove, in adhesion process, the image sensing district 203 of image sensor chip 201 is placed in described groove, form annular seal space 207, guarantee that described image sensing district 203 is not subject to the impact of external environment.Base plate for packaging 205 surfaces are not provided with groove in another embodiment, also include in an embodiment assisting base plate, assisting base plate is placed between image sensor chip 201 and base plate for packaging 205, is suitable for forming annular seal space with the image sensing district 203 of image sensor chip 201.Described base plate for packaging 205 tops are manufactured with infrared filtering film (IR), are manufactured with optical anti-reflective film (AR) in bottom, or make IR film in top, make AR film in bottom; Thereby increase light transmission and the anti-infrared jamming performance of base plate for packaging 205.
Described base plate for packaging 205 is loaded in base plate for packaging loading tray 106, what described base plate for packaging loading tray 106 was separated is placed on described conveyer belt 150 or rotating operation table, then transmits base plate for packaging loading tray 106 by conveyer belt 150 or rotating operation table base plate for packaging 205 is sent to bonder 130 sides.Described base plate for packaging loading tray 106 can be placed 1～30 base plate for packaging 205.In other embodiment of the present utility model, can, according to the different base plate for packaging loading trays of different product designs, make described base plate for packaging loading tray can place the base plate for packaging of suitable quantity.
In the present embodiment, described in mechanical manipulator 110 moves, completed the image sensor chip 201 of metal bonding to bonder 130 belows, then it is other to bonder 130 to transmit base plate for packaging 205 by conveyer belt 150 or rotating operation table.In other embodiment of the present utility model, also can, in transmitting described image sensor chip 201, base plate for packaging 205 be sent to bonder 130 belows, thereby can save the time of waiting for base plate for packaging 205.
Then,, by bonder 130, receive also bonding base plate for packaging 205 and form packaging part with the image sensor chip 201 that completes metal bonding.
One end of described bonder 130 is provided with bonding end 131.Can insert adhesive glue by being combined in the space between image sensor chip 201 and envelope transglutaminase substrate 205 of a glue, encapsulating, picture glue, silk screen printing or aforesaid way, thus bonding described image sensor chip 201 and envelope transglutaminase substrate 205.
Described bonder 130 also comprises heater 132, described heater 132 is suitable for image sensor chip 201 and base plate for packaging 205 are carried out in bonding process, adhesive glue to bonding end 131 interior outflows heats, improve the mobility of described adhesive glue, so that fill the space between described base plate for packaging 205 and image sensor chip 201, form compared with the adhesive layer 206 of high adherence energy.And, the adhesive glue with uniform temperature is filling in the process in the space between base plate for packaging 205 and image sensor chip 201, can be to the gas-heated in the cavity 207 between base plate for packaging 205 and image sensor chip 201, thereby discharge the gas in described cavity 207, avoid in follow-up encapsulation step, pressure in cavity 205 is excessive, the quality of packaging part and the quality of graphical sensory device chip 201 that impact forms
In the present embodiment, described automation package system also comprises the 3rd positioner 104, carrying out in bonding step, can pass through the 3rd positioner 104, locate described base plate for packaging 205, complete the image sensor chip 201 of metal bonding, the relative position of bonding end 131.Described the 3rd positioner 104 is disposed at described bonder 130 tops.
In described bonding step, can be by being placed in the fixture 133 on bonder 130 tops, described in fixing, complete the position of image sensor chip 201 of metal bonding to be matched with described base plate for packaging 205, the image sensing district 203 of described image sensor chip 201 is placed in the groove of described base plate for packaging 205, form cavity 207, and when the location matches of the image sensor chip 201 of metal bonding is during in described base plate for packaging 205, the pressure of vertical direction is provided by described fixture 133, described pressure drives to image sensor chip by bonder 130, make image sensor chip 201 and base plate for packaging 205 pressings, both are not offset.
In the present embodiment, can repeat after image sensor chip that above-mentioned steps completes multiple bondings is all placed on the base plate for packaging 205 in described base plate for packaging loading tray 106, successively base plate for packaging corresponding in described base plate for packaging reprinting dish and image sensor chip 201 are carried out again bonding, thereby can improve adhesion efficiency.
Described automation package system also comprises solidification equipment 140, is suitable for receiving and solidifies described packaging part.Described solidification equipment 140 has ultraviolet light generator, can improve ultraviolet light.In the present embodiment, described solidification equipment 140 is positioned at bonder 130 1 sides, is arranged at conveyer belt 150 tops, and is fixed on system base station 100 by support.
In the present embodiment, after the chip in base plate for packaging loading tray 106 is completed to bonding formation packaging part, be sent to solidification equipment 140 belows by conveyer belt 150 together with base plate for packaging loading tray 106, described solidification equipment 140 carries out ultraviolet irradiation to packaging part described packaging part is cured, and makes the adhesive glue curing molding on described packaging part.Because the area of base plate for packaging loading tray 106 is larger, can, in being cured, move the position of described base plate for packaging loading tray 106 by conveyer belt 150, make the packaging part in described base plate for packaging loading tray 106 can be subject to ultra-violet curing sizing.Have in the process of base plate for packaging loading tray 106 of packaging part mobile, can transmit the base plate for packaging loading tray 106 with envelope transglutaminase substrate to bonder 130 belows simultaneously, carry out the adhesion process of successive image sensor chip.
In the present embodiment, image sensor chip is carried out after bonding directly and base plate for packaging carries out bonding and curing molding immediately, having removed traditional cleaning, baking, inspection etc. from needs the technique of high-cleanness environmental condition, thereby can save process costs.And the final packaging part forming only comprises image sensor chip and base plate for packaging, and adhesive layer between described image sensor chip and base plate for packaging, so the thickness of described packaging part is less.And whole encapsulation process is carried out in an automation package system, can avoid described image sensor chip contact external environment, the image sensor chip after the encapsulation that can make to form has higher Performance And Reliability.
Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection range of the present utility model should be as the criterion with claim limited range.
Claims (29)
1. an automation package system for image sensor chip, is characterized in that, comprising:
System base station;
Chip microscope carrier, is placed on described system base station, is suitable for assembling image sensor chip;
Mechanical manipulator, is placed on described system base station, a side of described chip microscope carrier, is suitable for automatic Picking and transmits described image sensor chip;
Throwing device, is placed on described system base station, the opposite side of described chip microscope carrier, is suitable for image sensor chip and throwing device that coupling is picked up by described mechanical manipulator, and described image sensor chip is carried out to metal bonding;
Bonder, is placed on described system base station, is suitable for receiving and bonding base plate for packaging, forms packaging part with the image sensor chip that completes metal bonding.
2. automation package system according to claim 1, is characterized in that, described chip microscope carrier is suitable for loading the wafer of the image sensor chip that includes some separation.
3. automation package system according to claim 1, is characterized in that, described mechanical manipulator comprises the chip pickup parts that are arranged on one end.
4. automation package system according to claim 3, it is characterized in that, described mechanical manipulator comprises mechanical arm, and described mechanical arm comprises at least one bearing, and described bearing is suitable for controlling described chip pickup parts and moves along the either direction within the scope of three dimensions.
5. automation package system according to claim 4, is characterized in that, described bearing is suitable for controlling described chip pickup parts level, vertical or upset is mobile.
6. according to the automation package system described in claim 4 or 5, it is characterized in that, described chip pickup parts are one or more, and the quantity of described mechanical arm is consistent with chip pickup number of components, the connection corresponding to single mechanical arm of one single chip pick-up part.
7. automation package system according to claim 6, it is characterized in that, the other end of the mechanical arm of described mechanical manipulator is arranged on the first guide rail, and described the first guide rail is arranged on described system base station, and described the first guide rail is suitable for controlling mechanical arm entirety and moves on system base station.
8. automation package system according to claim 3, is characterized in that, described chip pickup parts comprise: be placed in the metal bonding work top on top, be suitable for placing described imageing sensor and chip metal bonding accessory.
9. automation package system according to claim 3, is characterized in that, described mechanical manipulator also comprises: dust proof member, be laid in by described chip pickup parts, and be suitable for hiding the photosurface of described image sensor chip.
10. automation package system according to claim 3, is characterized in that, described mechanical manipulator also comprises: heat supply parts, be laid in by described chip pickup parts, and be suitable for image sensor chip heat supply.
11. automation package systems according to claim 3, is characterized in that, described automation package system also comprises: the first positioner, is suitable for locating described image sensor chip and described chip pickup parts.
12. automation package systems according to claim 11, is characterized in that, described the first positioner is disposed at the top of described chip microscope carrier.
13. automation package systems according to claim 1, is characterized in that, one end of described throwing device is provided with bonding end.
14. automation package systems according to claim 13, is characterized in that, described automation package system also comprises: the second positioner, is suitable for image sensor chip and bonding end that location is picked up by described mechanical manipulator.
15. automation package systems according to claim 14, is characterized in that, described the second positioner is disposed at described throwing device top.
16. automation package systems according to claim 1, is characterized in that, described automation package system also comprises: conveyer belt, is placed on described system base station, by described bonder, is suitable for receiving and transmitting base plate for packaging.
17. automation package systems according to claim 1, is characterized in that, described automation package system also comprises: rotating operation table, is placed on described system base station, by described bonder, is suitable for receiving and transmitting base plate for packaging.
18. according to the automation package system described in claim 16 or 17, it is characterized in that, described base plate for packaging is loaded into base plate for packaging loading tray, and described base plate for packaging loading tray is placed on described conveyer belt or rotating operation table separatedly.
19. automation package systems according to claim 1, is characterized in that, one end of described bonder is provided with bonding end.
20. automation package systems according to claim 19, is characterized in that, described automation package system also comprises: the 3rd positioner, is suitable for locating described base plate for packaging, completes the image sensor chip of metal bonding, bonding end.
21. automation package systems according to claim 20, is characterized in that, described the 3rd positioner is disposed at described bonder top.
22. automation package systems according to claim 1, it is characterized in that, described package system also comprises: fixture, be placed in described bonder top, and be suitable for the position of the image sensor chip that completes metal bonding described in fixing to be matched with described base plate for packaging.
23. automation package systems according to claim 11, is characterized in that, described the first positioner is image positioning device.
24. automation package systems according to claim 14, is characterized in that, described the second positioner is image positioning device.
25. automation package systems according to claim 20, is characterized in that, described the 3rd positioner is image positioning device.
26. according to the automation package system described in claim 23,24 or 25, it is characterized in that, described image positioning device comprises camera, video camera, imageing sensor or infrared sensor.
27. automation package systems according to claim 1, is characterized in that, described bonder also comprises: heater, is suitable for boning under heating condition.
28. automation package systems according to claim 1, is characterized in that, described automation package system also comprises: solidification equipment, is suitable for receiving and solidifies described packaging part.
29. automation package systems according to claim 28, is characterized in that, described solidification equipment provides ultraviolet light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370167.2U CN203967060U (en) | 2014-07-04 | 2014-07-04 | The automation package system of image sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370167.2U CN203967060U (en) | 2014-07-04 | 2014-07-04 | The automation package system of image sensor chip |
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| CN203967060U true CN203967060U (en) | 2014-11-26 |
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| CN201420370167.2U Withdrawn - After Issue CN203967060U (en) | 2014-07-04 | 2014-07-04 | The automation package system of image sensor chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051318A (en) * | 2014-07-04 | 2014-09-17 | 格科微电子（上海）有限公司 | Automatic packaging system and automatic packaging method of image sensor chip |
| CN108807218A (en) * | 2017-05-02 | 2018-11-13 | 均华精密工业股份有限公司 | Vertical chip stacking device and method thereof |
-
2014
- 2014-07-04 CN CN201420370167.2U patent/CN203967060U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051318A (en) * | 2014-07-04 | 2014-09-17 | 格科微电子（上海）有限公司 | Automatic packaging system and automatic packaging method of image sensor chip |
| CN104051318B (en) * | 2014-07-04 | 2017-02-01 | 格科微电子（上海）有限公司 | Automatic packaging system and automatic packaging method of image sensor chip |
| CN108807218A (en) * | 2017-05-02 | 2018-11-13 | 均华精密工业股份有限公司 | Vertical chip stacking device and method thereof |
| CN108807218B (en) * | 2017-05-02 | 2020-12-11 | 均华精密工业股份有限公司 | Vertical chip stacking device and method thereof |
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