CN100338754C - Flip chip bonder and method therefor - Google Patents
Flip chip bonder and method therefor Download PDFInfo
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- CN100338754C CN100338754C CNB028268482A CN02826848A CN100338754C CN 100338754 C CN100338754 C CN 100338754C CN B028268482 A CNB028268482 A CN B028268482A CN 02826848 A CN02826848 A CN 02826848A CN 100338754 C CN100338754 C CN 100338754C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
- B65G2203/044—Optical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A flip bonder (100) has a pick-up turret assembly (110) with a number of pick-up nozzles (112A-D), and a placing turret assembly (115) with a number of placing nozzles (117 A-H). Each pick-up nozzle (112A-D) picks a die (107) by its bumped surface, and indexes the picked die (107) to the transfer location, thereby flipping the picked die (107). At the transfer location (310), the picked die is transferred to a placing nozzle (117A-H), with die now held by its back surface. The placing nozzle is indexed to a fluxing location where flux is applied to the die (107), and further indexed to a placing location, where the fluxed die (107) is placed on a target location (122A) on a leadframe (121), with the bumps abutting lead portions of the leadframe (121). The multiple nozzles (112A-D and 117 A-H) allow concurrent operations with each die (107), thus supporting an improved throughput.
Description
Technical field
The present invention relates to a kind of element fixing apparatus and component mounting method, more particularly, relate to a kind of more abovementioned of high productive capacity that has.
Background technology
Flip chip semiconductor package is known, and along with the increase to the needs of littler semiconductor packages, for example, the portable product that consumer wants is littler makes the market demand of flip chip semiconductor package increase rapidly probably.The production capacity of the abovementioned of using in the Flip-Chip Using is approximately per hour Unit 4,000 at present, still, because expected yield increases, wishes that production capacity further improves.
Flip chip semiconductor package is a upset bumped semiconductor element, makes its solder joint figure by being directly connected to the corresponding terminals figure on substrate or the lead frame after the salient point remelting.Then, the assembly of tube core, salient point and substrate or lead frame is enclosed in the mold compound, and therefrom forms single packaging part subsequently.An example is QFN (QFN) encapsulation, and this method for packing is at first molded, and sawing becomes single packaging part then.
When semiconductor dies in Flip-Chip Using, form salient point providing on the semiconductor wafer of tube core.That is to say that forming generally is the salient point that is made of solder on the solder joint of the singulated dies of semiconductor wafer.Sawing bumped semiconductor wafer then, and the semiconductor wafer that sawing is good is installed on the X-Y tube core pick-up table of tube core colligator.In forming the process of salient point, semiconductor wafer is installed is made outside solder joint is exposed to.As a result, after forming salient point, by with its back side in the face of the fixing bumped wafer of an adhesive film, make outside side of its formation salient point is exposed to.On this position, carry out sawing just to bumped semiconductor wafer.This has caused the single semiconductor element of being divided into of wafer to be fixed on the adhesive film, and outside salient point one side of semiconductor element is exposed to.As later be described, this has caused in some difficulty during at flip-chip semiconductor package semiconductor die package.
In a kind of habitual non-abovementioned, joint head moves horizontally between the tube core pick-up table, picks up tube core with a vacuum pick-up nozzle by solder joint one side of tube core, then, moves back to die placement location.Die placement location is aimed at the impeller on the lead frame, and when arriving die placement location, joint head is placed on the tube core that picks up on the impeller of lead frame.Generally before tube core is placed, epoxy resin is deposited on the impeller, and when being placed on semiconductor element on the epoxy resin with predetermined power by joint head, uncured epoxy resin causes the back side of tube core, promptly with the surface of solder joint surface opposite, is bonded on the impeller.Then, when heating when tube core, epoxy resin and lead frame, epoxy resin cure and with die attach to impeller.
In abovementioned, place bumped die in an identical manner, its bonded film in the back side is fixed and outside salient point is exposed to.Abovementioned must be picked up bumped die in a side of the formation salient point of tube core, and the upset bumped die is applied to scaling powder on the salient point, and tube core is placed on the lead frame, makes that the salient point on the tube core is aimed at the lead portion on the lead frame.Next, when remelting bumped die, scaling powder and lead frame, solder bumps melt, and with electricity of the solder joint on the tube core and the lead portion that is mechanically connected to lead frame.
An example of abovementioned is disclosed in the United States Patent (USP) 6171049 of applications such as Wirz and Alphasem AG that transfer Switzerland.Wirz etc. have proposed a kind of abovementioned, this abovementioned has a pick-up head that is used for picking up from the semiconductor wafer of installing tube core, an intermediate flipped member that is used for receiving tube core and upset tube core from pick-up head, and one be used for picking up the tube core of upset and tube core being placed on placement head on the substrate from middle flip component.
The action that the shortcoming of the colligator that people such as Wirz propose is to pick up, overturn, place then each semiconductor element is in sequence.This has influenced the production capacity of picking up and placing in the Flip-Chip Using.In addition, shift the transfer from middle flip component to placement head then just owing to have two tube cores from pick-up head to the intermediate flipped member, therefore, the suitable aligning of the semiconductor element that maintenance is placed, the aligning of particularly smaller semiconductor element will be very difficult.
Another kind of known coupling apparatus has made up one and has had a plurality of picking up and the vertical rotation picking up assembly of the head of the semiconductor element that overturns; And the placement head of a horizontal movement between transferring position and placement location.Each of picking up assembly picked up tube core from the wafer on the take-off location, and then, when tube core was positioned at transferring position, each rotation was with the direction of upset tube core.Placement head is aimed at pick-up head in transferring position, picks up tube core from pick-up head then.Then, placement head flatly moves back to placement location, and the tube core that shifts is placed on substrate or the lead frame.
Because placement head always is not with tube core ground to move to transferring position from placement location, therefore the shortcoming of this tube core coupling apparatus also is that production capacity is lower.
Summary of the invention
The objective of the invention is to provide a kind of can overcome, or reduces the element fixing apparatus of above-mentioned prior art problems and component mounting method at least.
Therefore, the present invention provides a kind of element fixing apparatus in one aspect, comprising:
At least one has the picking up assembly of a plurality of pick-up heads, wherein each pick-up head is suitable for picking up the element that at least one has the direction of picking up, change to shift direction with respect to picking up the direction of direction with at least one element, and at least one element with shift direction is provided to transferring position, this picking up assembly comprises a rotatable pick-up member of annular with a plurality of pick-up heads along its peripheral intervals; With
At least one has the placing modules of a plurality of placement head, wherein each placement head is suitable for picking up the element that at least one has shift direction in transferring position from each pick-up head, and at least one element with shift direction is placed on the placement location, this placing modules comprises a rotatable placement member of annular with a plurality of placement head along its peripheral intervals.
In another embodiment, the invention provides a kind of locational method of a plurality of component carriers that is used for a plurality of elements are installed in a component carrier, this method comprises the steps:
A) pick up first element in a plurality of elements at take-off location;
B) first element in a plurality of elements is moved to transferring position from take-off location, thereby change the direction of first element in a plurality of elements;
C) pick up second element in a plurality of elements;
D) discharge first element in a plurality of elements to shift in transferring position; With
E) pick up first element in a plurality of elements in transferring position;
F) first element in a plurality of elements is moved to from transferring position help welding position to put;
G) scaling powder is applied to first element in a plurality of elements;
H) with step (g) simultaneously, pick up second element in a plurality of elements in transferring position;
I) first element in a plurality of elements is moved to placement location;
J) with step (i) simultaneously, second element in a plurality of elements moved to help welding position to put;
K) first element in a plurality of elements is placed on first position of a plurality of component carriers position; With
L) with step (k) simultaneously, pick up the 3rd element in a plurality of elements in transferring position, and give second element dipping scaling powder in a plurality of elements.
In yet another embodiment, the invention provides a kind of element fixing apparatus, comprising:
At least one has the picking up assembly of a plurality of pick-up heads, wherein each pick-up head is suitable for picking up the element that at least one has the direction of picking up, and at least one element with shift direction is provided at transferring position, this picking up assembly comprises that one has along the rotatable pick-up member of annular of a plurality of pick-up heads of its peripheral intervals; With
At least one has the placing modules of a plurality of placement head, wherein each placement head is suitable for picking up the element that at least one has shift direction in transferring position from each pick-up head, with respect to shift direction the direction of at least one element is changed to placement direction, and at least one element with placement direction is placed on placement location, this placing modules comprises that one has along the rotatable placement member of annular of a plurality of placement head of its peripheral intervals.
Description of drawings
Below with reference to accompanying drawing, in illustrational mode, describe one embodiment of the present of invention in detail, wherein:
Fig. 1 shows the schematic diagram according to an abovementioned of the present invention;
Fig. 2 A-2B shows the flow chart of the operation of the abovementioned among Fig. 1;
Fig. 3 A-3J shows a series of end views of watching from first power pin of abovementioned among Fig. 1; With
Fig. 4 A-4J shows a series of end views of watching from second power pin of abovementioned among Fig. 1.
Embodiment
Abovementioned provided by the invention has a rotating turret that picks up that has a plurality of pick-up heads, and a placement rotating turret that has a plurality of placement head.The rotation axis that picks up rotating turret and place rotating turret is each other in the right angle, so that one of them pick-up head and one of them placement head are aimed in transferring position.The single-piece semiconductor wafer of bumped semiconductor element is installed on the movable mount, so that presenting of semiconductor element to be provided, and a lead frame is installed on the movable mount, so that the target of placing the bumped semiconductor element to be provided.Adjust the direction of the tube core on the movable mount, make their back side, just the one side with the surface opposite that forms salient point is positioned on the brace table.Each pick-up head picks up tube core by its bumped surface of tube core, and the tube core that is picked up is moved to transferring position, thus the tube core that upset is picked up.In transferring position, a placement head is aimed at the tube core that is picked up of still picked head maintenance, and tube core is transferred to placement head, and placement head keeps semiconductor element by the back side of tube core.Next, be immersed in the scaling powder, then,, the tube core that has flooded scaling powder be placed on the target location on the lead frame, make the lead portion of salient point near lead frame at a placement location at a salient point that helps welding position to put the tube core that will shift.Simultaneously, when the tube core that picks up was transferred to placement head in transferring position from pick-up head, another pick-up head picked up another tube core at take-off location.This advantage of action simultaneously makes the abovementioned of the invention described above that higher production capacity can be provided.
Fig. 1 shows the abovementioned 100 according to the present invention, comprises movable wafer mount 105, picks up rotating frame component 110, places rotating frame component 115 and movable leadframe mount 120.Movable wafer mount 105 comprises an X-Y platform that also can rotate.The semiconductor wafer 106 of single-pieceization (part illustrate) comprises a plurality of general by the fixing bumped semiconductor elements of adhesive film (not shown) (for example 107), and adhesive film remains on the movable wafer mount 105 by vacuum.Shown in one group of arrow 108 among the figure, movable wafer mount 105 can move along X, Y and Z axle, and can rotate R around the Z axle.X-Y moves and makes movable wafer mount 105 to move at a common horizontal plane upper edge X and Y reference axis, so that each tube core on the movable wafer mount 105 and one are with reference to the take-off location lateral alignment.In addition, movable wafer mount 105 is around the rotation R of Z vertical axis motion, makes through the tube core of radial angle displacement can radially to aim at take-off location by picking up before rotating frame component 110 picks up from movable wafer mount 105.
Those skilled in the art know, can use optics assisted pick and place system to determine position and the direction of tube core 107 on movable wafer mount 105.Can be provided to movable wafer mount 105 to the output of the optics assisted pick of this use fluorescence detector and place system then.Then, movable wafer mount 105 moves, so that specific tube core 107 is aimed at take-off location.Unless help understanding better the content of the invention described above, here optics assisted pick and place system further do not described in detail.
In one embodiment, in the process of assembly equipment, can use movable wafer mount 105 to set distance between the tube core 107 that picks up on rotating frame component 110 and the movable wafer mount 105 along the additional movement of Z axle.Carry out this setting and can guarantee to pick up the tube core, particularly thickness that rotating frame component 110 can pick up on the movable wafer mount 105 reliably and surpass the tube core of 2mm, and can not cause damage tube core.
Pick up rotating frame component 110 and comprise a kind of four pick-up head 111A-111D being circular layout on common vertical plane, each pickup head device has a vacuum pick-up nozzle 112A-112D.Pick up rotating frame component 110 and rotate, each nozzle 112A-112D is moved or indexing four predetermined position order around a fixing trunnion axis.These four positions comprise a take-off location respect to one another and a transferring position, and two other centre positions between take-off location and transferring position.When at take-off location, nozzle 112A-112D respectively picks up a tube core since movable wafer mount 105, and when transferring position, sequentially the tube core that picks up is transferred to from nozzle 112A-112D and placed rotating frame component 115.
Vacuum pick-up nozzle 112A-112D is adapted to pass through its bumped surface near the exposure of semiconductor element 107, and use vacuum bumped die 107 is remained on the end of nozzle 112A-112D, and pick up tube core from movable wafer mount 105, for example 107.Pick up on the rotating frame component 110, four pick-up head 111A-111D each other with 90 degree equally at interval.Each pick-up head 111A-111D can comprise a load on spring actuator that can make each nozzle 112A-112D move and can independently control between a predetermined retracted position and predetermined extended position.
In a preferred embodiment, used a single stationary actuator, and as any one pick-up head 111A-111D during at take-off location, stationary actuator be in four pick-up head 111A-111D in each position engaged.When actuator starts, make that for example 112A moves to extended position from retracted position at the nozzle of take-off location.Then, nozzle 112A picks up tube core 107 from movable wafer mount 105, and spring makes nozzle 112A turn back to retracted position.Next, the rotation of picking up rotating frame component 110 makes nozzle 112A move to transferring position from take-off location.
In this embodiment, pick up rotating frame component and comprise motor-driven four position protractors.Use a cam drive leverage as actuator, this actuator and each pick-up head 111A-111D co-operation are to promote the motion of nozzle 112A-112D from predetermined retracted position to predetermined extended position.In addition, four mechanical valve are switched vacuum, so that nozzle 112A-112D opening and closing.
Although can use have two heads of installing toward each other pick up rotating frame component 110, but, tube core arrives the range ability of transferring position by the angle of 180 degree from take-off location, and, caused because the danger that centrifugal force makes the tube core that picks up fly away from from pick-up nozzle for running time of the weak point that satisfies required production capacity.Four-head arrangement has reduced the tube core range ability under the given production capacity, thereby has reduced this danger.Those skilled in the art should be known in that different die-sizes and production capacity require can to cause having the rotating frame component that picks up of head more than four.
Another relevant problem is its quality and the momentum of generation when rotating frame component is picked up in rotation, and the effect of its generation when nozzle keeps tube core.The distance of operation is big more, and the momentum that causes is big more, makes to be difficult to more control the motion of picking up rotating frame component, thereby makes rotatablely moving of it not steady.It is necessary preventing the tube core displacement that nozzle keeps or falling.In addition, according to the size and the required production capacity of tube core, can use to have four rotating frame components that pick up with the higher authorities.
Place rotating frame component 115 and comprise being circular layout of a kind of eight placement head 116A-116H on a common horizontal plane, each placement head is being equipped a vacuum pick-up nozzle 117A-117H.Each placement head 116A-116H can comprise the actuator that can independently control that can move their corresponding nozzle 117A-117H between a predetermined retracted position and a predetermined extended position.Place rotating frame component 115 and rotate around a fixed vertical axis, mobile each nozzle 117A-117H sequentially by transferring position, help welding position to put and placement location.On transferring position, nozzle 117A-117H utilizes the actuator among the placement head 116A-116H, and the tube core 107 that is provided in transferring position by the nozzle 112A-112D that picks up rotating frame component 110 is provided.Next, helping after welding position puts moving to, also is by starting the actuator among the placement head 116A-116H, the tube core 107 that shifts being immersed in the flux container (not shown).This is applied to scaling powder on the salient point of tube core 107.Then, movable leadframe mount 120 is aimed at the target location 122A of the tube core on the lead frame 121 107 with placement location.When the tube core 107 that shifts is moved to placement location, utilize the actuator of placement head 116A-116H once more, tube core 107 is placed on the 122A of target location.
Vacuum is placed the back side that nozzle 117A-117H is adapted to pass through close semiconductor element 107, and utilizes vacuum that bumped die 107 is fixed to the end of nozzle 117A-117H, and picks up semiconductor element 107.Placing on the rotating frame component 115, eight placement head 116A-116H with 45 degree evenly at interval.
In a preferred embodiment, used three stationary actuator, and suitably given three actuator position, so as respectively transferring position, help welding position put with placement location and placement head 116A-116H in any one engagement and with they biconditional operations.When any one started in three actuators, at the nozzle that shifts, helps weldering or placement location, for example 117A moved to extended position from retracted position.On transferring position, the nozzle 117A that stretches out picks up tube core 107 from for example pick-up nozzle 112A, and a spring makes nozzle 117A turn back to its retracted position.Equally, helping weldering and placement location, nozzle 117A moves between withdrawal and extended position by the actuator separately of each position.In addition, eight mechanical valve are switched vacuum, so that nozzle 117A-117H opening and closing.In addition, place rotating frame component 115 and comprise a motor-driven 8 positions protractor.Nozzle 117A-117H switches from predetermined retracted position to the motion of being scheduled to extended position with to the vacuum of nozzle 117A-117H, is by implementing with clutch-brake mechanism of three actuator one biconditional operations.
As with shown in 123 one group of arrow representing, movable leadframe mount 120 can move along X, Y and Z axle, and can rotate R around the Z axle.Movable leadframe mount 120 comprises an X-Y platform (part illustrates), and the X-Y platform also comprises further rotatablely move R and moving along the Z axle.The lead frame 121 (part illustrates) that comprises a plurality of target location 122A, 122B or the like generally is fixed to the X-Y platform by vacuum and/or clamping device.X-Y moves and makes that movable leadframe mount 120 can be along X on the common horizontal plane and the transverse movement of Y reference axis, so that each target location 122A, 122B etc. on the lead frame 121 are aimed at the reference placement location.In addition, movable leadframe mount 120 is around the R that rotatablely moves of vertical axis Z, the target location of an angle that makes it possible to before placing semiconductor element 107, to have made displacement, and for example 122A and placement location are aimed at.In addition, known to those skilled in the art, also can use optics assisted pick and place system to determine position and the direction of target location 112A.Then, can be provided to movable leadframe mount 120 to the output of this optics assisted pick and place system.Unless help understanding better the content of the invention described above, here optics assisted pick and place system further do not described in detail.
In one embodiment, in the assembling process of equipment, can use the additional distance that move the lead frame 121 set rotating frame component 115 and movable leadframe mount 120 between of movable leadframe mount 120 along the Z axle.This setting has guaranteed that placement rotating frame component 115 is placed into tube core 107 on the lead frame 121 reliably, and particularly thickness surpasses the tube core of 2mm, and can not cause damage to tube core.
In a preferred embodiment, help welding position put after and before the placement location, place rotating frame component 115 and move placement head 117A-117H by two additional positions, direction detection position and standby position.On the direction position, optical direction detector is determined the direction through the tube core of dipping, and its direction with target location on the lead frame 121 of target location is compared.Then, mobile movable leadframe mount 120 is with any difference on the compensation direction.
General use a video camera as fluorescence detector, and, in the preferred embodiment of abovementioned 100, visual pick up with place system in used three video cameras altogether.Tube core on camera alignment movable wafer mount 105, the dipping on the target location of the lead frame on another alignment activity lead-in wire brace table, the 3rd camera alignment direction detection position the tube core of scaling powder.
Although this specification is understood in detail pick up semiconductor element and place it on the lead frame, but, the invention described above can be suitable for picking up with place take-off location wherein on direction and the placement location of element on any element on the different component carrier of the component orientation of requirement on the component carrier.Photodetector is an example of this element.In addition, component carrier can comprise various substrates and the printed circuit board (PCB) that is used for direct chip attach applications.
With reference to figure 2A with partly with reference to figure 3A-J and Fig. 4 A-J, the operation 202 of picking up rotating frame component 110 starts from step 205, and in step 210, the actuator operated among the pick-up head 111A makes nozzle 112A pick up tube core 107A at take-off location.Certainly, before picking up, tube core 107A is aimed at pick-up nozzle 112A on the take-off location by X-Y wafer station 120.Then, in step 215, pick up rotating frame component 110 rotations or transposition 90 degree, 107A moves to transferring position from take-off location with tube core, thereby has overturn tube core 107A.Meanwhile, another nozzle 112B moves to take-off location.
Next, X-Y platform 120 with another tube core 107B with after take-off location is aimed at, by the operation of the actuator among the pick-up head 111B, nozzle 112B picks up another tube core 107B.Then, pick up the angle that rotating frame component 110 further rotates 90 degree, 107A moves to transferring position with tube core, and the tube core 107B that nozzle 112B is kept removes from take-off location simultaneously, and another nozzle 112C is moved to take-off location.By the displacement of two 90 degree, the direction of tube core 107A is put upside down with respect to its direction on take-off location or is overturn.Then, simultaneously in step 220, nozzle 112C picks up another tube core 107C, and nozzle 112A discharges tube core 107A on transferring position, so that pick up by placing rotating frame component 115.Then, operation 202 turns back to step 210, and repeats aforesaid operations.
With reference to figure 2B, and partial reference Fig. 3 A-J and Fig. 4 A-J, the operation 204 of placing rotating frame component 115 starts from step 250, in step 255, nozzle, for example a 117A, by the operation of the actuator among the placement head 116A, pick up tube core 107A from pick-up head 111A in transferring position.Keep under the situation of tube core at the back side by tube core 107A, rotating frame component 115 rotates tube core 107A and move to one and helps welding position to put.In step 260, helping welding position to put, by the operation of the actuator among the placement head 116A, tube core is immersed in the flux container, so that scaling powder is applied on the salient point of tube core 107A.Meanwhile, the actuator among the placement head 116B starts, to pick up another tube core 107B that is in transferring position now.
Then in step 265, place rotating frame component 115 and rotate, 107A moves to placement location with tube core, and tube core 107B moved to helps welding position to put.Next in step 270, movable leadframe mount 120 with the target location 122A on the lead frame 121 with after placement location is aimed at, by the operation of the actuator among the pick-up head 111A, tube core 107A is placed on target location 122A.Meanwhile, pick-up head 116B is helping welding position to put with scaling powder dipping tube core 107B, and pick-up head 116C picks up another tube core 107C that is positioned at transferring position now.Then, operation 204 turns back to step 255, and repeats aforesaid operations.
With reference now to Fig. 3 A-J and Fig. 4 A-J, illustrate in greater detail the operation of the invention described above.At first with reference to figure 3A and 4A, a plurality of tube cores of the bumped semiconductor wafer 106 of single-piece comprise tube core 107A, are fixed on the adhesive film 301, and adhesive film 301 is installed on the movable wafer mount 105.Tube core 107A is aimed at the take-off location 305 on being positioned at vertical reference axes 304.As mentioned above, this finishes by movable wafer mount 105.
Pick up rotating frame component 110 and place rotating frame component 115 fixed to one another meeting at right angles, thereby make among the pick-up nozzle 112A-112D one can aim at along one among vertical reference axes 304 and the placement nozzle 117A-117H in transferring position 310.As a starting point, for convenience of explanation, with pick-up nozzle 112C with place nozzle 117G and be shown as in transferring position 310 and aim at vertical reference axes 304.Meanwhile, another pick-up nozzle 112A aims at vertical reference axes 304 at take-off location 305, to pick up tube core 107A; Meanwhile, another is placed nozzle 117F and aims at helping weldering spools 306 helping welding position to put 315; And another is placed nozzle 117E and aims at placement axle 307 at placement location 320.
Next, with reference to figure 3B and 4B, the actuator among the pick-up head 111A causes the nozzle 1112A on take-off location 305 to move to extended position, and near its bumped surface of tube core 107A.Then, apply vacuum through nozzle 112A, vacuum remains on tube core 107A on the nozzle 112A.When the actuator among the pick-up head 111A with nozzle 112A when extended position moves to retracted position, tube core 107A is torn from adhesive film 301. Arrow 325 and 425 motions of indication nozzle 112A between the extended and retracted position.Generally speaking, a pin (not shown) in the movable wafer mount 105 is aimed at the tube core 107A that will pick up, and upwards promotes the back side of tube core 107A, takes off tube core 107A to help nozzle 112A from adhesive film 301.When picking up less tube core, pin forms the point that pierces through adhesive film 301 usually.
With reference now to Fig. 3 C and 4C,, picked up after the tube core 107A, pick up rotating frame component 110 and place rotating frame component 115 rotations.Pick up rotating frame component 110 and rotate 330 and 430 angles, the tube core 107A that picks up is removed from take-off location 305, and pick-up nozzle 112B is aimed at vertical reference axes 304 at take-off location 305 by 90 degree.Then, movable wafer mount 105 is aimed at take-off location 305 another tube core 107B with vertical reference axes 304.But the aligning that should be known in tube core 107B occurs in and has picked up after the tube core 107A, but any time before nozzle 112B picks up tube core 107B.
Place rotating frame component 115 rotations or change 332 and 432 1 miter angles, nozzle 117H is aimed at vertical reference axes 304, nozzle 117G is aimed at helping weldering axle 306, and nozzle 117F is aimed at placement axle 307.
With reference to figure 3D and 4D, the actuator among the pick-up head 111B causes pick-up nozzle 112B to pick up tube core 107B at take-off location 305.As mentioned above, this also is by shown in arrow 335 and 435, and mobile pick-up nozzle 112B and application vacuum are finished between the extended and retracted position.At this point, two tube core 107A and 107B are taken off from movable wafer mount 105, and keep by picking up rotating frame component 110.
In Fig. 3 E and 4E, after having picked up tube core 107B, pick up rotating frame component 110 and rotate once more with placement rotating frame component 115.Pick up rotating frame component 110 rotation 340 and 440 angles, aim at vertical reference axes 304, thereby changed the direction of the tube core that will put upside down or overturn so that tube core 107A is moved in transferring position 310 by 90 degree.This angular transition is also removed tube core 107B from take-off location 305, and pick-up nozzle 112C moved at take-off location 305 aims at vertical reference axes 304.Meanwhile, movable wafer mount 105 is aimed at take-off location 305 another tube core 107C with vertical reference axes 304.
Place the angles of rotating frame component 115 rotations 342 and 442, nozzle 117A is aimed at vertical reference axes 304, nozzle 117H is aimed at helping weldering axle 306, and nozzle 117E is aimed at placement axle 307 by another one 45 degree.
Therefore, pick up rotating turret and pick up bumped die, and put upside down the tube core that picks up, advantageously manifest the back side of tube core,, thereby made things convenient for directly adhering to of upset tube core so that directly be placed on lead frame or the substrate by its bumped surface.
With reference now to Fig. 3 F and 4F,, the actuator among placement head 116A and the pick-up head 111C is operated simultaneously.This causes that pick-up nozzle 112C picks up tube core 107C at take-off location 305, and as previously mentioned, this is by being shown between the extended and retracted position mobile pick-up nozzle 112C as arrow 345 and 445 and using vacuum as described above and finish.In addition, in the vacuum of the pick-up nozzle 112A on its bumped surface that discharges tube core 107A, place nozzle 117A and pick up tube core 107A by the back side of tube core from pick-up nozzle 112A in transferring position 310.Actuator among the placement head 116A moves between the extended and retracted position like that shown in arrow 350 and 450 and places nozzle 117A, and uses vacuum, thereby has finished this transfer.In order to help the transfer of tube core 107A, can reduce the vacuum on the pick-up nozzle 112A, rather than close vacuum from pick-up nozzle 112A to placement nozzle 117A.This can reduce the possibility that tube core 107A falls or loses.
With reference to figure 3G and 4G, after tube core 107A transfers to placement head 117A and picked up tube core 107C, pick up rotating frame component 110 and place rotating frame component 115 rotation simultaneously once more.Pick up rotating frame component 110 and rotate 360 and 460 angles, aim at vertical reference axes 304 so that tube core 107B is moved in transferring position 310, and tube core 107C is removed from take-off location 305 by another 90 degree.In addition, pick-up nozzle 112D aims at vertical reference axes 304 at take-off location 305, and movable wafer mount 105 is aimed at take-off location 305 another tube core 107CD with vertical reference axes 304.
Place rotating frame component 115 and rotate 355 and 455 angles by another 45 degree, nozzle 117B is aimed at vertical reference axes 304, the nozzle 117A that will keep tube core 107A aims at helping weldering spools 306, and nozzle 117H and placement spools 307 aimed at.
With reference now to Fig. 3 H and 4H,, the actuator among placement head 116A, 116B and the pick-up head 111D is operated simultaneously.This makes pick-up nozzle 112D pick up tube core 107D at take-off location 305, and pick-up nozzle 112D such as arrow 365 and 465 is shown between the extended and retracted position move, and uses vacuum as mentioned above.Meanwhile, place nozzle 117A help welding position put 315 as arrow 375 and 475 be shown between the extended and retracted position mobile, with dipping tube core 107A, more particularly, be that the salient point on the tube core 107A is immersed in the scaling powder 303, and, place nozzle 117B and pick up tube core 107B from pick-up nozzle 112B by the back side of tube core in transferring position 310.This is by move placing nozzle 117B like that between the extended and retracted position shown in arrow 370 and 470, and uses that vacuum finishes.At this operating point, pick up rotating frame component 110 and keeping two tube core 107C and 107D, place rotating frame component 115 and keeping two tube core 107A and 107B, tube core 107A has the scaling powder on the salient point that is applied to it.
Next, with reference to figure 3I and 4I, pick up rotating frame component 110 and place rotating frame component 115 rotation simultaneously once more.Pick up rotating frame component 110 and rotate 385 and 485 angles, aim at vertical reference axes 304 so that tube core 107C is moved on transferring position 310, and tube core 107D is removed from take-off location 305 by another 90 degree.In addition, pick-up nozzle 112A aims at vertical reference axes 304 on take-off location 305 once more, and movable wafer mount 105 is aimed at another tube core 107E on take-off location 305 with vertical reference axes 304.
Place rotating frame component 115 and rotate 380 and 480 angles, nozzle 117C is aimed at vertical reference axes 304 by another 45 degree.This rotates the nozzle 117B also will keep tube core 107B and aims at helping weldering axle 306, and nozzle 117A and the placement spools 307 that is keeping having flooded the tube core 107A of scaling powder aimed at.At this moment, movable leadframe mount 120 is aimed at placement axle 307 the target location 122A on the lead frame 121 on placement location 320.
Next, with reference to figure 3J and 4J, the actuator among placement head 116A, 116B, 116C and the pick-up head 111A is operated simultaneously.This makes pick-up nozzle 112A pick up tube core 107E at take-off location 305, and as mentioned above, this also is by such shown in arrow 398 and 498, and mobile pick-up nozzle 112A and application vacuum are finished between the extended and retracted position.Meanwhile, placing nozzle 117B moves between the extended and retracted position like that shown in arrow 392 and 492, with tube core 107B, more particularly is with the salient point on the tube core 107B, be immersed in the scaling powder 303 helping welding position to put on 315.In about same time, place nozzle 117C and pick up tube core 107C by the back side of tube core 107C from pick-up nozzle 112C in transferring position 310.This is to place nozzle 117C and use vacuum and finish by moving between the extended and retracted position like that shown in arrow 390 and 490.Also be in the identical time, when place nozzle 117A shown in arrow 396 and 496 like that between the extended and retracted position when mobile, place the tube core 107A that nozzle 117A will flood scaling powder and be placed on the 122A of target location.At this operating point, pick up rotating frame component 110 and keeping two tube core 107D and 107E, keeping two tube core 107B and 107C and place rotating frame component 115, tube core 107B has the scaling powder on the salient point that is applied to it.In addition, tube core 107A has been placed on the lead frame 121.
Then, repeat the step described in Fig. 3 A-3J and Fig. 4 A-4J, on all target locations that tube core are placed on the lead frame 121, then, take off lead frame 121, and another lead frame is installed on the movable leadframe mount 120.Then, the lead frame 121 that remelting is taken off is welded to connect so that lead-in wire on salient point on the tube core 107A and the lead frame 121 or solder joint form.Equally, when not having tube core on the movable wafer mount 105, the bumped wafer of another single-pieceization is installed on the movable wafer mount 105.
Pick up the rotating frame component tube core that picks up and overturn although more than illustrate the present invention as, with the tube core of placing rotating frame component dipping scaling powder and placement transfer, but, pick up tube core when picking up rotating frame component, during with the upset of placement rotating frame component, dipping scaling powder and placement tube core, also can obtain same effect.Certainly, owing to place the rotation of rotating frame component, may need a replacement device that applies scaling powder, still, this can apply scaling powder by for example target location on lead frame and solve.
Therefore, as mentioned above, the invention provides a kind of more abovementioned of high productive capacity that has.
This is all to have of a plurality of nozzles by each to pick up rotating turret and one and place rotating turret and finish.Pick up and place nozzle simultaneous operation, thus each pick-up nozzle picks and upset tube core, and meanwhile, each places the tube core of nozzle from the pick-up nozzle picks upset, another tube core is immersed in the scaling powder, and another tube core is placed on the lead frame.Because each keeps a tube core that is used for independent operation a plurality of nozzles, independent operation just picks up tube core, tube core is transferred to the placement nozzle, flooded tube core and place tube core with scaling powder from pick-up nozzle, and therefore, these operations can be carried out simultaneously.As mentioned above, operation has simultaneously advantageously improved the production capacity of abovementioned.
Therefore, the invention provides and a kind ofly overcome, or be to have reduced at least, abovementioned of the problems referred to above of prior art and method.
Although should be known in only to describe a specific embodiments of the present invention in detail,, those skilled in the art can carry out various modifications and improvement, and do not depart from the scope of the present invention.
Claims (23)
1. element fixing apparatus comprises:
At least one has the picking up assembly of a plurality of pick-up heads, wherein each pick-up head is suitable for picking up the element that at least one has the direction of picking up, change to shift direction with respect to picking up the direction of direction with at least one element, and at least one element with shift direction is provided to transferring position, this picking up assembly comprises a rotatable pick-up member of annular with a plurality of pick-up heads along its peripheral intervals; With
At least one has the placing modules of a plurality of placement head, wherein each placement head is suitable for picking up the element that at least one has shift direction in transferring position from each pick-up head, and at least one element with shift direction is placed on the placement location, this placing modules comprises a rotatable placement member of annular with a plurality of placement head along its peripheral intervals.
2. element fixing apparatus according to claim 1 further comprises at least one movable element brace table, and described movable element brace table is used for having at least one relatively, and the element that picks up direction of each pick-up head is provided to take-off location.
3. element fixing apparatus according to claim 2, wherein at least one movable element brace table further comprises the input equipment of the component orientation data of a direction that is used to receive at least one element of indication, described at least one movable element brace table is used for determining the direction of at least one element, so that this element has the direction of picking up with respect to each pick-up head at take-off location.
4. element fixing apparatus according to claim 3, further comprise a component orientation detector that is operably connected at least one movable element brace table, described component orientation detector is used to detect the direction of at least one element at least one movable element brace table, and the component orientation data are provided.
5. element fixing apparatus according to claim 4, wherein at least one movable element brace table comprises that at least one can along X and the Y reference axis moves and the movable mount of rotating around the Z reference axis.
6. element fixing apparatus according to claim 5 wherein can along X and the Y reference axis moves and be suitable for moving along the Z reference axis in addition around at least one movable mount that the Z reference axis rotates.
7. element fixing apparatus according to claim 4, wherein the component orientation detector comprises a fluorescence detector of aiming at least one element.
8. element fixing apparatus according to claim 1, comprise that further at least one is used to provide the movable element carrier supported platform that has the component carrier of at least one component carrier position at least one its, described at least one movable element carrier supported platform be used for placement location determine at least one component carrier position with respect to the direction of the shift direction of at least one element so that receive at least one element.
9. element fixing apparatus according to claim 8, wherein at least one movable element carrier supported platform further comprises the input equipment of the component carrier locality data of a direction that is used to receive at least one component carrier position of indication, described at least one movable element carrier supported platform is used for determining the direction of at least one component carrier position, so that this component carrier has shift direction with respect at least one element at placement location.
10. element fixing apparatus according to claim 9, further comprise a component carrier locality detector that is connected at least one movable element carrier supported platform, described component carrier locality detector is used to detect the direction of at least one the component carrier position at least one movable element carrier supported platform, and component carrier locality data are provided.
11. element fixing apparatus according to claim 8, wherein at least one movable element carrier supported platform comprises that at least one can along X and the Y reference axis moves and the movable mount of rotating around the Z reference axis.
12. element fixing apparatus according to claim 11 wherein can along X and the Y reference axis moves and be suitable for moving along the Z reference axis around at least one movable mount that the Z reference axis rotates.
13. element fixing apparatus according to claim 10, wherein component carrier locality detector comprises a fluorescence detector of aiming at least one component carrier position.
14. element fixing apparatus according to claim 1, wherein a plurality of pick-up heads extend radially out with respect to the rotation axis of the rotatable pick-up member of annular, and a plurality of placement head are stretched out abreast with the rotation axis that annular turns placement member.
15. element fixing apparatus according to claim 1, at least one placing modules that wherein has a plurality of placement head comprises that one has a plurality of along the annular rotatable member of its periphery with space relation placement head at interval.
16. element fixing apparatus according to claim 15, wherein each placement head comprises that at least one is operably connected to the actuator of at least one vacuum nozzle, described at least one actuator is used for moving at least one vacuum nozzle between a predetermined retracted position and a predetermined extended position, at least one vacuum nozzle is used for picking up at least one element when the predetermined extended position in transferring position, at least one vacuum nozzle is used for keeping at least one element when in predetermined retracted position, at least one vacuum nozzle is used for discharging at least one element when the predetermined extended position on placement location.
17. the locational method of a plurality of component carriers that is used for a plurality of elements are installed to a component carrier comprises the steps:
A) pick up first element in a plurality of elements at take-off location;
B) first element in a plurality of elements is moved to transferring position from take-off location, thereby change the direction of first element in a plurality of elements;
C) pick up second element in a plurality of elements;
D) discharge first element in a plurality of elements to shift in transferring position; With
E) pick up first element in a plurality of elements in transferring position;
F) first element in a plurality of elements is moved to from transferring position help welding position to put;
G) scaling powder is applied to first element in a plurality of elements;
H) with step (g) simultaneously, pick up second element in a plurality of elements in transferring position;
I) first element in a plurality of elements is moved to placement location;
J) with step (i) simultaneously, second element in a plurality of elements moved to help welding position to put;
K) first element in a plurality of elements is placed on first position of a plurality of component carriers position; With
L) with step (k) simultaneously, pick up the 3rd element in a plurality of elements in transferring position, and give second element dipping scaling powder in a plurality of elements.
18. the locational method of a plurality of component carriers that is used for a plurality of elements are installed to a component carrier according to claim 17 comprises step with first element alignment take-off location in a plurality of elements before in step (a).
19. the locational method of a plurality of component carriers that is used for a plurality of elements are installed to a component carrier according to claim 17, step (a) afterwards and step (b) further comprise before first element in a plurality of elements moved at least one centre position from take-off location, then first element in a plurality of elements is moved to the step of transferring position.
20. the locational method of a plurality of component carriers that is used for a plurality of elements are installed to a component carrier according to claim 17, step (g) afterwards and step (i) comprise the steps: before
First element in a plurality of elements is moved to direction determine the position, to determine the direction of first element in a plurality of elements;
The direction of first position in the direction of first element in a plurality of elements and a plurality of component carriers position on placement location is compared; With
Change the direction of first position in a plurality of component carriers position at placement location, so that identical with the direction of first element in a plurality of elements.
21. the locational method of a plurality of component carriers that is used for a plurality of elements are installed to a component carrier according to claim 20, after the step of the direction of first position in changing a plurality of component carriers position and step (i) before, comprise the step that first element in a plurality of elements is moved to a standby position.
22. an element fixing apparatus comprises:
At least one has the picking up assembly of a plurality of pick-up heads, wherein each pick-up head is suitable for picking up the element that at least one has the direction of picking up, and at least one element with shift direction is provided at transferring position, this picking up assembly comprises that one has along the rotatable pick-up member of annular of a plurality of pick-up heads of its peripheral intervals; With
At least one has the placing modules of a plurality of placement head, wherein each placement head is suitable for picking up the element that at least one has shift direction in transferring position from each pick-up head, with respect to shift direction the direction of at least one element is changed to placement direction, and at least one element with placement direction is placed on placement location, this placing modules comprises that one has along the rotatable placement member of annular of a plurality of placement head of its peripheral intervals.
23. element fixing apparatus according to claim 22, wherein each placement head comprises that at least one is operably connected to the actuator of at least one vacuum nozzle, described at least one actuator is used for moving at least one vacuum nozzle between a predetermined extended position and a predetermined retracted position, at least one vacuum nozzle is used for picking up at least one element when the predetermined extended position on transferring position, at least one vacuum nozzle is used for keeping at least one element when at retracted position, and at least one vacuum nozzle is used for discharging at least one element when the predetermined extended position on placement location.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200200076A SG104292A1 (en) | 2002-01-07 | 2002-01-07 | Flip chip bonder and method therefor |
| SG2002000768 | 2002-01-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1613146A CN1613146A (en) | 2005-05-04 |
| CN100338754C true CN100338754C (en) | 2007-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028268482A Expired - Fee Related CN100338754C (en) | 2002-01-07 | 2002-12-09 | Flip chip bonder and method therefor |
Country Status (5)
| Country | Link |
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| CN (1) | CN100338754C (en) |
| MY (1) | MY141298A (en) |
| SG (1) | SG104292A1 (en) |
| TW (1) | TW200304197A (en) |
| WO (1) | WO2003058708A1 (en) |
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- 2002-12-09 WO PCT/SG2002/000286 patent/WO2003058708A1/en not_active Application Discontinuation
- 2002-12-09 CN CNB028268482A patent/CN100338754C/en not_active Expired - Fee Related
- 2002-12-23 MY MYPI20024853A patent/MY141298A/en unknown
-
2003
- 2003-01-03 TW TW092100101A patent/TW200304197A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI669258B (en) * | 2015-01-28 | 2019-08-21 | 美商克萊譚克公司 | Flipping apparatus, system and method for processing articles |
| CN110137100A (en) * | 2018-02-09 | 2019-08-16 | 上海微电子装备（集团）股份有限公司 | Bonding apparatus and bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1613146A (en) | 2005-05-04 |
| MY141298A (en) | 2010-04-16 |
| TW200304197A (en) | 2003-09-16 |
| SG104292A1 (en) | 2004-06-21 |
| WO2003058708A1 (en) | 2003-07-17 |
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