TWI700234B - Die selecting apparatus - Google Patents

Die selecting apparatus Download PDF

Info

Publication number
TWI700234B
TWI700234B TW108131261A TW108131261A TWI700234B TW I700234 B TWI700234 B TW I700234B TW 108131261 A TW108131261 A TW 108131261A TW 108131261 A TW108131261 A TW 108131261A TW I700234 B TWI700234 B TW I700234B
Authority
TW
Taiwan
Prior art keywords
unit
die
module
vision
pick
Prior art date
Application number
TW108131261A
Other languages
Chinese (zh)
Other versions
TW202108485A (en
Inventor
石敦智
黃良印
Original Assignee
均華精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 均華精密工業股份有限公司 filed Critical 均華精密工業股份有限公司
Priority to TW108131261A priority Critical patent/TWI700234B/en
Priority to CN201910887499.5A priority patent/CN112447566A/en
Application granted granted Critical
Publication of TWI700234B publication Critical patent/TWI700234B/en
Publication of TW202108485A publication Critical patent/TW202108485A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Adie selection apparatus comprises: a supply unit; a first turnover unit neighbored to the supply unit; a pick and place unit neighbored to the first turnover unit; a receiving unit neighbored to the pick and place unit, and the receiving unit being vertical or parallel to the supply unit ; and a second turnover unit between the pick and place unit and the receiving unit; wherein, the supply unit provides at least one die to the first turnover unit, the first turnover unit flips the die to a first predetermined angle, the pick and place unit receives the die that has been flipped to the first predetermined angle, the pick and place unit provides the die to the second turnover unit, the second turnover unit flips the die to a second predetermined angle, and provides the die to the receiving unit.

Description

晶粒挑揀裝置 Die picking device

一種晶粒挑揀裝置，且特別是有關於一種提升晶粒完整性、降低工時與提升效率之裝置。 A device for picking crystal grains, in particular, relates to a device for improving the integrity of the crystal grains, reducing working hours and improving efficiency.

現有的晶粒挑揀技術，由供應單元取下晶粒，在移動至承接單元，以將晶粒放置於承接單元。然於實際製程中，供應單元至承接單元的路徑較長，故製程需要較長的時間，而使效率較為低落。 In the existing die picking technology, the supply unit removes the die and moves to the receiving unit to place the die in the receiving unit. However, in the actual manufacturing process, the path from the supply unit to the receiving unit is relatively long, so the manufacturing process takes a long time and the efficiency is relatively low.

雖有廠商為了縮短供應單元至承接單元之間的路徑，而將供應單元與承接單元變更為直立式，供應單元係平行於承接單元，藉以提升效率。但將晶粒由直立式供應單元取下時，晶粒易由直立式供應單元掉落，故雖可提升效率，但晶粒之報廢率亦提升。 Although some manufacturers change the supply unit and the receiving unit to a vertical type in order to shorten the path between the supply unit and the receiving unit, the supply unit is parallel to the receiving unit to improve efficiency. However, when the die is removed from the vertical supply unit, the die is easily dropped from the vertical supply unit, so although the efficiency can be improved, the scrap rate of the die is also increased.

綜合上述，現有的晶粒挑揀技術具有效率低、工時較長與報廢率高的缺點，所以如何改善現有的晶粒挑揀技術就有可以改善的空間。 In summary, the existing die picking technology has the disadvantages of low efficiency, long working hours and high scrap rate, so how to improve the existing die picking technology has room for improvement.

有鑑於上述之現有的晶粒挑揀技術仍有可改善空間，本發明提供一種晶粒挑揀裝置，其係將晶粒依序翻轉一第一預定角度與一第二預定角度，藉此降低晶粒之報廢率，以及提升效率與降低工時。 In view of the above-mentioned existing die picking technology, there is still room for improvement. The present invention provides a die picking device which sequentially turns the die at a first predetermined angle and a second predetermined angle, thereby reducing the die size. The scrap rate, increase efficiency and reduce working hours.

為達上述之發明目的，本發明提出一種晶粒挑揀裝置，其包含有：一供應單元；一第一翻轉單元，其係相鄰於該供應單元；一取放單元，其係相鄰於該第一翻轉單元； 一接收單元，其係相鄰於該取放單元，並且該接收單元係垂直或平行於該供應單元；以及一第二翻轉單元，其係位於該取放單元與該接收單元之間；其中，該供應單元係提供至少一晶粒給該第一翻轉單元，該第一翻轉單元係將該晶粒翻轉一第一預定角度，該取放單元係接收已翻轉至該第一預定角度之該晶粒，該取放單元係將該晶粒提供給該第二翻轉單元，該第二翻轉單元再將該晶粒翻轉至一第二預定角度，並將該晶粒提供給該接收單元。 To achieve the above-mentioned object of the invention, the present invention proposes a die picking device, which includes: a supply unit; a first turning unit, which is adjacent to the supply unit; a pick-and-place unit, which is adjacent to the First turning unit A receiving unit, which is adjacent to the pick-and-place unit, and the receiving unit is perpendicular or parallel to the supply unit; and a second turning unit, which is located between the pick-and-place unit and the receiving unit; wherein, The supply unit provides at least one die to the first turning unit, the first turning unit turns the die at a first predetermined angle, and the pick-and-place unit receives the die turned to the first predetermined angle The pick-and-place unit provides the die to the second flip unit, and the second flip unit flips the die to a second predetermined angle, and provides the die to the receiving unit.

於一實施例中，一第一視覺單元、一第二視覺單元與一第三視覺單元；該第一視覺單元係設於該供應單元的上方；該第二視覺單元係設於該翻轉單元的上方；該第三視覺單元系設於該接收單元的上方。 In one embodiment, a first vision unit, a second vision unit, and a third vision unit; the first vision unit is arranged above the supply unit; the second vision unit is arranged on the side of the turning unit Above; the third vision unit is located above the receiving unit.

於一實施例中，一多面檢測單元，該多面檢測單元係相鄰於該取放單元。 In one embodiment, a multi-face detection unit is adjacent to the pick-and-place unit.

基於上述，本發明之接收單元係垂直於供應單元，故當供應單元提供晶粒時，晶粒不會由供應單元上掉落，所以可確保晶粒之完整性，藉以提升晶粒的完整率。 Based on the above, the receiving unit of the present invention is perpendicular to the supply unit, so when the supply unit provides the die, the die will not fall from the supply unit, so the integrity of the die can be ensured, thereby improving the integrity rate of the die .

再者，直立式的接收單元係垂直或平行於供應單元之設計亦可縮短接收單元與供應單元之間的路徑，藉此提升效率，並且縮短整體製程時間。 Furthermore, the design of the vertical receiving unit being perpendicular or parallel to the supply unit can also shorten the path between the receiving unit and the supply unit, thereby improving efficiency and shortening the overall process time.

為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

10:供應單元 10: Supply unit

100:供應載台 100: supply stage

101:頂針 101: Thimble

11:第一翻轉單元 11: The first flip unit

110:第一吸取模組 110: The first suction module

111:第一轉動模組 111: The first rotating module

12:取放單元 12: Pick and place unit

120:旋轉模組 120: Rotation module

121:自轉模組 121: Rotation Module

122:吸取模組 122: suction module

13:接收單元 13: receiving unit

130:接收載台 130: receiving platform

14:第一視覺單元 14: The first visual unit

15:第二視覺單元 15: The second visual unit

16:第三視覺單元 16: The third visual unit

17:多面檢測單元 17: Multi-faceted detection unit

170:側視覺模組 170: Side Vision Module

171:仰視覺模組 171: Upward Vision Module

18:第二翻轉單元 18: The second flip unit

180:第二吸取模組 180: The second suction module

181:第二轉動模組 181: The second rotating module

20:膜 20: membrane

21:晶粒 21: Die

22:錫球 22: tin ball

30:供應單元 30: supply unit

300:供應載台 300: Supply stage

301:頂針 301: Thimble

31:第一翻轉單元 31: The first flip unit

310:第一吸取模組 310: The first suction module

311:第一轉動模組 311: The first rotating module

32:取放單元 32: Pick and place unit

320:旋轉模組 320: Rotating module

321:自轉模組 321: Rotation Module

322:吸取模組 322: Suction Module

33:接收單元 33: receiving unit

330:接收載台 330: receiving platform

34:第一視覺單元 34: The first visual unit

35:第二視覺單元 35: The second visual unit

36:第三視覺單元 36: Third Vision Unit

371:仰視覺模組 371: Upward Vision Module

38:第二翻轉單元 38: The second flip unit

380:第二吸取模組 380: The second suction module

381:第二轉動模組 381: The second rotating module

40:膜 40: Membrane

41:晶粒 41: Die

42:錫球 42: tin ball

第1圖為本發明之一種晶粒挑揀裝置之第一實施例之示意圖。 Figure 1 is a schematic diagram of a first embodiment of a die picking device of the present invention.

第2圖為本發明之一種晶粒挑揀裝置之之第一實施例之俯視示意圖。 Figure 2 is a schematic top view of the first embodiment of a die picking device of the present invention.

第3圖為本發明之一種晶粒挑揀裝置之第一實施例之動作示意圖。 Figure 3 is a schematic diagram of the operation of the first embodiment of a die picking device of the present invention.

第4圖為本發明之一種晶粒挑揀裝置之第一實施例之又一動作示意圖。 Figure 4 is a schematic diagram of another action of the first embodiment of the die picking device of the present invention.

第5圖為本發明之一種晶粒挑揀裝置之第一實施例之再一動作示意圖。 FIG. 5 is a schematic diagram of another action of the first embodiment of the die picking device of the present invention.

第6圖為本發明之一種晶粒挑揀裝置之第二實施例之動作示意圖。 Figure 6 is a schematic diagram of the operation of the second embodiment of a die picking device of the present invention.

第7圖為本發明之一種晶粒挑揀裝置之第二實施例之又一動作示意圖。 FIG. 7 is another schematic diagram of the operation of the second embodiment of the die picking device of the present invention.

請配合參考第1圖與第2圖所示，本發明係一種晶粒挑揀裝置之第一實施例，其具有一供應單元10、一第一翻轉單元11、一取放單元12、一接收單元13、一第一視覺單元14、一第二視覺單元15、一第三視覺單元16、一多面檢測單元17與一第二翻轉單元18。 Please refer to Figures 1 and 2 together. The present invention is a first embodiment of a die picking device, which has a supply unit 10, a first turning unit 11, a pick-and-place unit 12, and a receiving unit 13. A first vision unit 14, a second vision unit 15, a third vision unit 16, a multi-face detection unit 17, and a second turning unit 18.

供應單元10具有一供應載台100與至少一頂針101。頂針101係位於供應載台100的下方。供應載台100係供一膜20與至少一晶片21設置。晶片21係黏附於膜20的頂端。各晶片21具有一錫球22。 The supply unit 10 has a supply carrier 100 and at least one thimble 101. The thimble 101 is located below the supply stage 100. The supply stage 100 is for setting a film 20 and at least one wafer 21. The chip 21 is adhered to the top of the film 20. Each chip 21 has a solder ball 22.

第一翻轉單元11係相鄰於供應單元10。第一翻轉單元11具有至少一第一吸取模組110與至少一第一轉動模組111。第一吸取模組110係設於第一轉動模組111。 The first turning unit 11 is adjacent to the supply unit 10. The first turning unit 11 has at least one first suction module 110 and at least one first rotating module 111. The first suction module 110 is disposed on the first rotating module 111.

取放單元12係相鄰於翻轉模組11。取放單元12具有一旋轉模組120、至少一自轉模組121與至少一吸取模組122。各自轉模組121係設於旋轉模組120。各吸取模組122係設於各自轉模組121。 The pick-and-place unit 12 is adjacent to the turning module 11. The pick-and-place unit 12 has a rotation module 120, at least one rotation module 121 and at least one suction module 122. The respective rotating modules 121 are provided in the rotating module 120. Each suction module 122 is provided in the respective turning module 121.

請再配合參考第2圖所示，接收單元13係相鄰於取放單元12。接收單元13具有一接收載台130。接收載台130係相對於供應單元10呈一垂直狀，若更進一步說明，接收載台130係相對於供應單元10為一垂直呈立式。 於本實施例中，接收載台130可為一膜。接收單元13更具有一膜供應模組。前述之膜(接收載台130)係由膜供應模組所提供。 Please refer to FIG. 2 again. The receiving unit 13 is adjacent to the pick-and-place unit 12. The receiving unit 13 has a receiving carrier 130. The receiving platform 130 is a vertical shape with respect to the supply unit 10, if it is further described, the receiving platform 130 is a vertical shape with respect to the supply unit 10. In this embodiment, the receiving stage 130 may be a film. The receiving unit 13 further has a film supply module. The aforementioned film (receiving stage 130) is provided by the film supply module.

第一視覺單元14係設於供應單元10的上方。第二視覺單元15係設於翻轉單元11與取放單元12之間的上方。第三視覺單元16係設於接收單元13的上方。 The first vision unit 14 is arranged above the supply unit 10. The second visual unit 15 is arranged above the turning unit 11 and the pick-and-place unit 12. The third visual unit 16 is arranged above the receiving unit 13.

多面檢測單元17係相鄰於取放單元12。多面檢測單元17具有至少一側視覺模組170與一仰視覺模組171。側視覺模組170係位於於取放單元12之吸取模組123的一側。仰視覺模組171係位於吸取模組123的下方。 The multi-face detection unit 17 is adjacent to the pick-and-place unit 12. The multi-face detection unit 17 has at least one side vision module 170 and a upward vision module 171. The side vision module 170 is located on one side of the suction module 123 of the pick-and-place unit 12. The upward vision module 171 is located below the suction module 123.

第二翻轉單元18係位於接收單元13與吸取單元12之間，並且位於第三視覺單元16的下方。第二翻轉單元18具有至少一第二吸取模組180與至少一第二轉動模組181。第二吸取模組180係設於第二轉動模組181。 The second turning unit 18 is located between the receiving unit 13 and the suction unit 12 and is located below the third visual unit 16. The second turning unit 18 has at least one second suction module 180 and at least one second rotating module 181. The second suction module 180 is disposed on the second rotating module 181.

請再配合參考第1圖所示，第一視覺單元14係擷取位於供應載台100之晶片20的影像資訊，並將影像資訊傳送給頂針101與翻轉單元11。頂針101依據影像資訊，以頂出所欲頂出之晶粒21，而使晶粒21與膜20相互分離。 Please refer to FIG. 1 again. The first vision unit 14 captures the image information of the chip 20 on the supply stage 100 and transmits the image information to the ejector pin 101 and the turning unit 11. The ejector pin 101 ejects the desired die 21 according to the image information, so that the die 21 and the film 20 are separated from each other.

請配合參考第3圖所示，第一翻轉單元11依據第一視覺單元14之影像資訊，以使第一吸取模組110吸取已被頂針101所頂出之晶粒21。請配合參考第3圖所示，第一轉動模組100係將已被吸取之晶粒21轉動至一第一特定角度。該第一特定角度可為180度。第一吸取模組110係吸取晶粒21具有錫球22的一面。第一吸取模組110具有可容納錫球22的空間。 Please refer to FIG. 3, the first turning unit 11 makes the first sucking module 110 suck the die 21 that has been ejected by the ejector pin 101 according to the image information of the first visual unit 14. Please refer to FIG. 3, the first rotating module 100 rotates the sucked die 21 to a first specific angle. The first specific angle may be 180 degrees. The first sucking module 110 sucks the die 21 on one side with the solder ball 22. The first suction module 110 has a space that can accommodate the solder balls 22.

第二視覺單元15係擷取位於翻轉單元11之晶粒21之影像資訊，並將影像資訊傳送給取放單元12。旋轉模組120依據第二視覺單元15之影像資訊，將吸取模組122轉動至可吸取位於翻轉單元11之晶粒21的位置。待吸取 模組122吸取晶粒21後，旋轉模組120係將吸取有晶粒21之吸取模組122移動至多面檢測單元17。吸取模組122係吸取晶粒21未具有錫球22的一面。 The second visual unit 15 captures the image information of the die 21 located in the flip unit 11 and transmits the image information to the pick-and-place unit 12. The rotating module 120 rotates the sucking module 122 to a position capable of sucking the die 21 located in the turning unit 11 according to the image information of the second visual unit 15. To be absorbed After the module 122 sucks the die 21, the rotating module 120 moves the sucking module 122 with the die 21 to the multi-face detection unit 17. The sucking module 122 sucks the side of the die 21 without the solder balls 22.

請配合參閱第4圖與第2圖所示，當吸取有晶粒21之吸取模組122被轉動至側視覺模組170之位置。側視覺模組170係擷取晶粒21之一面的影像資訊。轉動模組120係持續轉動，自轉模組121係開始作動，以使其餘的側視覺模組170能擷取晶粒21之數面的影像資訊。 Please refer to FIG. 4 and FIG. 2 together, when the suction module 122 sucking the die 21 is rotated to the position of the side vision module 170. The side vision module 170 captures image information on one side of the die 21. The rotation module 120 continues to rotate, and the rotation module 121 starts to operate, so that the remaining side vision modules 170 can capture the image information of the multiple sides of the die 21.

待旋轉模組120將晶粒21轉動至仰視覺模組171的上方時，仰視覺模組171係擷取晶粒21面對仰視覺模組171之影像資訊。上述之第一視覺單元14之影像資訊、側視覺模組170之影像資訊與仰視覺模組171之影像資訊係用於檢測晶粒21的各面是否有毀損。 When the rotating module 120 rotates the die 21 to the top of the upward vision module 171, the upward vision module 171 captures image information of the die 21 facing the upward vision module 171. The above-mentioned image information of the first vision unit 14, the image information of the side vision module 170 and the image information of the upward vision module 171 are used to detect whether each surface of the die 21 is damaged.

當旋轉模組120將晶粒21轉動至接收單元13方向時，請配合參考第5圖所示，第二翻轉單元18之第二吸取模組180係吸取位於吸取模組122之晶粒21，第二轉動模組181係將被第二吸取模組180之晶粒21翻轉至一第二預定角度，第二預定角度為90度。第二吸取模組180係吸取晶粒21具有錫球22的一面。第二吸取模組180具有可容納錫球22的空間。 When the rotating module 120 rotates the die 21 to the direction of the receiving unit 13, please refer to Fig. 5. The second suction module 180 of the second turning unit 18 sucks the die 21 located in the suction module 122. The second rotating module 181 turns the die 21 of the second suction module 180 to a second predetermined angle, and the second predetermined angle is 90 degrees. The second sucking module 180 sucks the die 21 on one side with the solder ball 22. The second suction module 180 has a space that can accommodate the solder balls 22.

此時，晶粒21未具有錫球22的一面係面對接收載台130，第二翻轉單元18係將晶粒21放置於接收載台130。若接收載台130為膜，則第二翻轉單元18係晶粒21接合或貼附於接收載台130。而當接收載台130之晶粒21達到一預定數量時，模供應模組係提供另一膜，以使第二翻轉單元18將晶粒21放置於另一膜。具有達到預定數量之晶粒21之膜係至下一製程。 At this time, the side of the die 21 without the solder balls 22 faces the receiving platform 130, and the second turning unit 18 places the die 21 on the receiving platform 130. If the receiving stage 130 is a film, the second turning unit 18 is a die 21 bonded or attached to the receiving stage 130. When the die 21 of the receiving stage 130 reaches a predetermined number, the die supply module provides another film, so that the second turning unit 18 places the die 21 on the other film. The film with the predetermined number of dies 21 is passed to the next process.

請配合參考第6圖與第7圖所示，本發明係一種晶粒挑揀裝置之第二實施例，其具有一供應單元30、一第一翻轉單元31、一取放單元32、一接收單元33、一第一視覺單元34、一第二視覺單元35、一第三視覺單元36、一多面檢測單元與一第二翻轉單元38。 Please refer to FIGS. 6 and 7 together. The present invention is a second embodiment of a die picking device, which has a supply unit 30, a first turning unit 31, a pick-and-place unit 32, and a receiving unit 33. A first vision unit 34, a second vision unit 35, a third vision unit 36, a multi-face detection unit, and a second turning unit 38.

於本實施例中，接收單元33係平行供應單元30。供應單元30、供應載台300、頂針301、第一翻轉單元31、第一吸取模組310、第一轉動模組311、取放單元32、旋轉模組320、自轉模組321、吸取模組322、第一視覺單元34、多面檢測單元、側視覺模組、仰視覺模組371、第二翻轉單元38、接收單元33與接收載台330的配置方式係近似上述之第一實施例，故不在此多作贅述，特先陳明。 In this embodiment, the receiving unit 33 is a parallel supply unit 30. Supply unit 30, supply stage 300, thimble 301, first turning unit 31, first suction module 310, first rotation module 311, pick and place unit 32, rotation module 320, rotation module 321, suction module 322. The arrangement of the first vision unit 34, the multi-face detection unit, the side vision module, the upward vision module 371, the second turning unit 38, the receiving unit 33, and the receiving stage 330 is similar to the above-mentioned first embodiment, so I won't repeat it here, and I will first explain it.

請再配合參考第6圖與第7圖所示，供應載台300係供一膜40與至少一晶片41設置。第一翻轉單元31依據第一視覺單元34之影像資訊，以使第一吸取模組310吸取欲被頂針301所頂出之晶粒41。第一吸取模組310具有可容納錫球42的空間。第一吸取模組310係吸取晶粒41具有錫球42的一面。頂針301係頂出所欲頂出之晶粒41。第一轉動模組300係將已被吸取之晶粒41轉動至一第一特定角度。該第一特定角度可為90度。 Please refer to FIG. 6 and FIG. 7 together. The supply stage 300 is provided with a film 40 and at least one chip 41. The first turning unit 31 makes the first sucking module 310 suck the die 41 to be ejected by the ejector pin 301 according to the image information of the first visual unit 34. The first suction module 310 has a space that can accommodate the solder balls 42. The first sucking module 310 sucks the die 41 on a side with a solder ball 42. The ejector pin 301 ejects the desired die 41. The first rotating module 300 rotates the sucked die 41 to a first specific angle. The first specific angle may be 90 degrees.

第二視覺單元35係擷取位於翻轉單元31之晶粒41之影像資訊，並將影像資訊傳送給取放單元32。旋轉模組320依據第二視覺單元35之影像資訊，將吸取模組322轉動至可吸取位於翻轉單元31之晶粒41的位置。待吸取模組322吸取晶粒41後，旋轉模組320係將吸取有晶粒41之吸取模組322移動至多面檢測單元。吸取模組322係吸取晶粒41未具有錫球42的一面。 The second visual unit 35 captures the image information of the die 41 located in the flip unit 31 and transmits the image information to the pick-and-place unit 32. The rotating module 320 rotates the sucking module 322 to a position capable of sucking the die 41 located in the turning unit 31 according to the image information of the second visual unit 35. After the sucking module 322 sucks the die 41, the rotating module 320 moves the sucking module 322 with the die 41 to the multi-face inspection unit. The sucking module 322 sucks the side of the die 41 without the solder ball 42.

當吸取有晶粒41之吸取模組322被轉動至側視覺模組之位置。側視覺模組係擷取晶粒41之一面的影像資訊。轉動模組320係持續轉動，自轉模組321係開始作動，以使其餘的側視覺模組能擷取晶粒41之數面的影像資訊。 When sucking the die 41, the sucking module 322 is rotated to the position of the side vision module. The side vision module captures image information on one side of the die 41. The rotation module 320 continues to rotate, and the rotation module 321 starts to operate, so that the remaining side vision modules can capture the image information of the multiple sides of the die 41.

待旋轉模組320將晶粒41轉動至仰視覺模組371的上方時，仰視覺模組371係擷取晶粒41面對仰視覺模組371之影像資訊。上述之第一視覺單 元34之影像資訊、側視覺模組之影像資訊與仰視覺模組371之影像資訊係用於檢測晶粒41的各面是否有毀損。 When the rotating module 320 rotates the die 41 to above the head-up vision module 371, the head-up vision module 371 captures the image information of the die 41 facing the head-up vision module 371. The first visual list above The image information of the element 34, the image information of the side vision module, and the image information of the upward vision module 371 are used to detect whether each surface of the die 41 is damaged.

當旋轉模組320將晶粒41轉動至接收單元33方向時，第二翻轉單元38之第二吸取模組380係吸取位於吸取模組322之晶粒41，第二轉動模組381係將被第二吸取模組380之晶粒41翻轉至一第二預定角度，第二預定角度為90度。第二吸取模組380係吸取晶粒41具有錫球42的一面。第二吸取模組380具有可容納錫球42的空間。 When the rotating module 320 rotates the die 41 to the direction of the receiving unit 33, the second suction module 380 of the second turning unit 38 sucks the die 41 located in the suction module 322, and the second rotating module 381 will be The die 41 of the second suction module 380 is turned over to a second predetermined angle, and the second predetermined angle is 90 degrees. The second sucking module 380 sucks the die 41 on a side with a solder ball 42. The second suction module 380 has a space that can accommodate the solder balls 42.

晶粒41未具有錫球42的一面係面對接收載台330，第二翻轉單元38係將晶粒41放置於接收載台330。若接收載台330為膜，則第二翻轉單元38係晶粒41接合或貼附於接收載台330。而當接收載台330之晶粒41達到一預定數量時，模供應模組係提供另一膜，以使第二翻轉單元38將晶粒41放置於另一膜。具有達到預定數量之晶粒41之膜係至下一製程。 The side of the die 41 without the solder ball 42 faces the receiving platform 330, and the second turning unit 38 places the die 41 on the receiving platform 330. If the receiving stage 330 is a film, the second turning unit 38 is a die 41 bonded or attached to the receiving stage 330. When the die 41 of the receiving stage 330 reaches a predetermined number, the die supply module provides another film, so that the second turning unit 38 places the die 41 on the other film. The film with the predetermined number of dies 41 is advanced to the next process.

綜合上述，本發明之晶粒挑揀裝置，其係利用第一翻轉單元將晶粒翻轉至第一預定角度，再由第二翻轉單元將晶粒翻轉至第二預定角度，藉此將晶粒放置於直立式的接收單元。 In summary, the die picking device of the present invention uses the first turning unit to turn the die to a first predetermined angle, and then the second turning unit reverses the die to a second predetermined angle, thereby placing the die In the vertical receiving unit.

另外，直立式的接收單元係垂直於供應單元，所以當頂針於供應載台頂出晶粒時，被頂出的晶粒不會由供應載台上掉落，故可確保晶粒之完整性，藉以提升晶粒的完整率。 In addition, the vertical receiving unit is perpendicular to the supply unit, so when the ejector pin ejects the die from the supply platform, the ejected die will not fall off the supply platform, so the integrity of the die can be ensured , In order to improve the integrity rate of the die.

再者，直立式的接收單元係垂直於供應單元之設計亦可縮短接收單元與供應單元之間的路徑，藉此提升效率，並且縮短整體製程時間。 Furthermore, the design of the vertical receiving unit perpendicular to the supply unit can also shorten the path between the receiving unit and the supply unit, thereby improving efficiency and shortening the overall process time.

綜上所述，本發明雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field should be able to do so without departing from the spirit and scope of the present invention. With some changes and modifications, the protection scope of the present invention shall be subject to the scope of the attached patent application.

10:供應單元 10: Supply unit

100:供應載台 100: supply stage

101:頂針 101: Thimble

11:第一翻轉單元 11: The first flip unit

110:第一吸取模組 110: The first suction module

111:第一轉動模組 111: The first rotating module

12:取放單元 12: Pick and place unit

120:旋轉模組 120: Rotation module

121:自轉模組 121: Rotation Module

122:吸取模組 122: suction module

13:接收單元 13: receiving unit

130:接收載台 130: receiving platform

14:第一視覺單元 14: The first visual unit

15:第二視覺單元 15: The second visual unit

16:第三視覺單元 16: The third visual unit

171:仰視覺模組 171: Upward Vision Module

18:第二翻轉單元 18: The second flip unit

180:第二吸取模組 180: The second suction module

181:第二轉動模組 181: The second rotating module

20:膜 20: membrane

21:晶粒 21: Die

22:錫球 22: tin ball

Claims (6)

一種晶粒挑揀裝置，其包括：一供應單元；一第一翻轉單元，其係相鄰於該供應單元，該第一翻轉單元具有至少一第一吸取模組與至少一第一轉動模組，該第一吸取模組係設於該第一轉動模組；一取放單元，其係相鄰於該第一翻轉單元；一接收單元，其係相鄰於該取放單元，並且該接收單元係垂直或平行於該供應單元；以及一第二翻轉單元，其係位於該取放單元與該接收單元之間，該第二翻轉單元具有至少一第二吸取模組與至少一第二轉動模組，該第二吸取模組係設於該第二轉動模組；其中，該供應單元係提供至少一晶粒給該第一翻轉單元，該第一吸取模組吸取該晶粒具有錫球的一面，該第一吸取模組具有可容納該錫球的空間，該第一翻轉單元係將該晶粒翻轉一第一預定角度，該第一預定角度為180度，該取放單元係接收已翻轉至該第一預定角度之該晶粒，該取放單元係吸取該晶粒未具有該錫球的一面，該取放單元係將該晶粒提供給該第二翻轉單元，該第二吸取模組吸取該晶粒具有錫球的一面，該第二吸取模組具有可容納該錫球的空間，該第二翻轉單元再將該晶粒翻轉至一第二預定角度，該第二預定角度為90度，並將該晶粒提供給該接收單元，該晶粒未具有該錫球的一面係面對該接收單元。 A die picking device, comprising: a supply unit; a first turning unit adjacent to the supply unit, the first turning unit having at least one first suction module and at least one first rotation module, The first suction module is set in the first rotating module; a pick-and-place unit is adjacent to the first turning unit; a receiving unit is adjacent to the pick-and-place unit, and the receiving unit Is perpendicular or parallel to the supply unit; and a second turning unit, which is located between the picking and placing unit and the receiving unit, the second turning unit having at least one second suction module and at least one second rotating mold Group, the second suction module is set in the second rotating module; wherein, the supply unit provides at least one die to the first turning unit, and the first suction module sucks the die with a solder ball On one side, the first suction module has a space for accommodating the solder balls, the first turning unit turns the die at a first predetermined angle, the first predetermined angle is 180 degrees, and the pick-and-place unit receives The die turned to the first predetermined angle, the pick-and-place unit sucks the side of the die without the solder ball, the pick-and-place unit provides the die to the second reversing unit, and the second sucking The die is sucked by the module and has a solder ball side, the second sucking module has a space capable of accommodating the solder ball, and the second turning unit turns the die to a second predetermined angle, the second predetermined angle It is 90 degrees, and the die is provided to the receiving unit, and the side of the die without the solder ball faces the receiving unit. 如申請專利範圍第1項所述之晶粒挑揀裝置，其更具有一第一視覺單元、一第二視覺單元與一第三視覺單元；該第一視覺單元係設於該供應單元的上方；該第二視覺單元係設於該翻轉單元的上方；該第三視覺單元係設於該接收單元的上方。 The die picking device described in the first item of the scope of patent application further has a first vision unit, a second vision unit and a third vision unit; the first vision unit is arranged above the supply unit; The second visual unit is arranged above the turning unit; the third visual unit is arranged above the receiving unit. 如申請專利範圍第1項所述之晶粒挑揀裝置，其更具有一多面檢測單元，該多面檢測單元係相鄰於該取放單元。 For example, the die picking device described in item 1 of the scope of patent application further has a multi-face detection unit, and the multi-face detection unit is adjacent to the pick-and-place unit. 如申請專利範圍第3項所述之晶粒挑揀裝置，其中該取放單元具有一旋轉模組、至少一自轉模組與至少一吸取模組，該自轉模組係設於該旋轉模組，該吸取模組係耦接該自轉模組。 For example, the die picking device described in item 3 of the scope of patent application, wherein the pick-and-place unit has a rotation module, at least one rotation module and at least one suction module, and the rotation module is provided on the rotation module, The suction module is coupled to the rotation module. 如申請專利專利範圍第4項所述之晶粒挑揀裝置，其中該多面檢測單元具有至少一側視覺模組與一仰視覺模組，該側視覺模組係位於該吸取模組的一側，該仰視覺模組係位於該吸取模組的下方。 For example, the die picking device described in claim 4, wherein the multi-face detection unit has at least one side vision module and a upward vision module, and the side vision module is located on one side of the suction module, The upward vision module is located below the suction module. 如申請專利範圍第1項所述之晶粒挑揀裝置，其中該供應單元具有一供應載台與至少一頂針，該頂針係位於該供應載台的下方。 In the die picking device described in item 1 of the scope of patent application, the supply unit has a supply carrier and at least one thimble, and the thimble is located below the supply carrier.
TW108131261A 2019-08-30 2019-08-30 Die selecting apparatus TWI700234B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW108131261A TWI700234B (en) 2019-08-30 2019-08-30 Die selecting apparatus
CN201910887499.5A CN112447566A (en) 2019-08-30 2019-09-19 Crystal grain picking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108131261A TWI700234B (en) 2019-08-30 2019-08-30 Die selecting apparatus

Publications (2)

Publication Number Publication Date
TWI700234B true TWI700234B (en) 2020-08-01
TW202108485A TW202108485A (en) 2021-03-01

Family

ID=73002925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108131261A TWI700234B (en) 2019-08-30 2019-08-30 Die selecting apparatus

Country Status (2)

Country Link
CN (1) CN112447566A (en)
TW (1) TWI700234B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201433530A (en) * 2012-12-04 2014-09-01 Ueno Seiki Co Ltd Transfer equipment
TWM501640U (en) * 2015-02-06 2015-05-21 Gallant Micro Machining Co Ltd Die selection device with multiple detection capability
TWM555561U (en) * 2017-10-26 2018-02-11 Gallant Micro Machining Co Ltd Nozzle
CN108025875A (en) * 2015-12-11 2018-05-11 上野精机株式会社 Shifting apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
KR101216362B1 (en) * 2011-03-18 2012-12-28 (주)제이티 Apparatus for inspecting LED device
WO2014112041A1 (en) * 2013-01-15 2014-07-24 上野精機株式会社 Posture correction device, electronic component conveyance device, and electronic component transfer device
TWM472943U (en) * 2013-05-27 2014-02-21 Wecon Automation Corp Chip select device
KR20130062320A (en) * 2013-05-27 2013-06-12 (주)제이티 Apparatus for sorting led device
TWI566308B (en) * 2013-11-08 2017-01-11 均華精密工業股份有限公司 High accuracy die bonding apparatus with high yield
KR20170130792A (en) * 2016-05-19 2017-11-29 (주)에이피텍 Automation system for wafer level packaging
TWI621154B (en) * 2017-05-02 2018-04-11 均華精密工業股份有限公司 Vertically die stacked bonder and method using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201433530A (en) * 2012-12-04 2014-09-01 Ueno Seiki Co Ltd Transfer equipment
TWM501640U (en) * 2015-02-06 2015-05-21 Gallant Micro Machining Co Ltd Die selection device with multiple detection capability
CN108025875A (en) * 2015-12-11 2018-05-11 上野精机株式会社 Shifting apparatus
TWM555561U (en) * 2017-10-26 2018-02-11 Gallant Micro Machining Co Ltd Nozzle

Also Published As

Publication number Publication date
TW202108485A (en) 2021-03-01
CN112447566A (en) 2021-03-05

Similar Documents

Publication Publication Date Title
US7669317B2 (en) Method for reversing a chip vertically
TWI626707B (en) Mark detection method
TWI723362B (en) Electronic parts packaging device
TWI716570B (en) Transfer system for flipping and multiple checking of electronic devices
US9218995B2 (en) Transfer apparatus for transferring electronic devices and changing their orientations
US20120210554A1 (en) Apparatus and method for picking up and mounting bare dies
TW201320254A (en) Apparatus and method for die bonding
TW200428539A (en) Apparatus and method for picking up semiconductor chip
WO2016084407A1 (en) Sorting device
TWI700234B (en) Die selecting apparatus
TWI574022B (en) Die Detection Apparatus And Die Delivery Method
JP4016982B2 (en) Electronic component mounting apparatus and electronic component mounting method
WO2013108367A1 (en) Electronic component mounting device and electronic component mounting method
TWM449958U (en) Panel inspection device with reversing mechanism
TWM501640U (en) Die selection device with multiple detection capability
TWI578428B (en) Die picking apparatus with plurality faces inspection ability and method thereof
TWI621192B (en) A chip appearance inspection device and method
TWI749604B (en) Substrate treatment apparatus
TWI780424B (en) Improving accuracy and speed of bonding apparatus
TWI408763B (en) A combination of wafer ejection devices and image capturing devices
KR102172744B1 (en) Die bonding apparatus
TWI621154B (en) Vertically die stacked bonder and method using the same
TWM604488U (en) Automatic bonding and releasing device
JP2001068529A (en) Method for picking up semiconductor chip
TWI703668B (en) Large size wafer bonding apparatus