TWI574022B - Die Detection Apparatus And Die Delivery Method - Google Patents

Description

Grain detecting device and die transfer method

The invention provides a detecting device and a transmitting method, in particular to a die detecting device and a die transferring method capable of increasing a transfer rate and a detection rate of a die.

Light-emitting diode (LED) is a kind of semiconductor electronic component that can emit light. Because of its high efficiency, fast response speed and long life, the light-emitting diode has been widely used in lighting fixtures, traffic signs and display panels in recent years. In the field.

The light-emitting diodes generally seen in the market are mostly light-emitting components in which a semiconductor die is packaged into one body. Since the crystal grain is the core of the light-emitting diode and affects the light-emitting characteristics of the light-emitting diode, after the fabrication of the crystal grain, it is generally required to perform photoelectric characteristics for each of the produced crystal grains. Detection, classifying the electrical and/or optoelectronic properties of each die for application to different products.

During the detection of the die, it is generally necessary to shift the die on the cutting platform to another detection platform through the swing arm of the detecting device to perform the detecting process. However, prior to this, the wafer cutting device first stretched the soft film to expand the inter-granular distance, thereby causing problems such as different distribution distances of the crystal grains and positional shift. In addition, before the die is moved to the other platform through the swing arm of the detecting device on the detecting platform, the die may be rotated or displaced due to the touch of the probe during the detecting process.

However, such problems such as positional shift and grain rotation will affect the overall transfer rate and detection rate, and the pick-and-place nozzle on the swing arm cannot be accurately sucked and accurately displaced to a preset position for release, or even It may cause damage to the grain due to improper pick-up of the pick-and-place nozzle, for example: drop. Therefore, how to make the pick-and-place nozzle on the swing arm accurately absorb the die and accurately shift the die to a preset position to release, and improve the overall transfer rate and detection rate to reduce the overall production cost. It is an important topic that people in the technical field want to ponder.

In view of this, an embodiment of the present invention provides a die detecting apparatus, including a first picking platform, an image capturing device, a second picking platform, a correcting module, and a transfer mechanism. The first access platform has a first bearing surface, and the first bearing surface can be used to carry the die. The imaging device has an imaging lens, and the imaging device is disposed above the first bearing surface with the imaging lens facing the first bearing surface. Here, the camera device can be used to capture an image of the die. The second access platform has a second bearing surface. The transfer mechanism is located between the first take-up platform and the second take-up platform. The calibration module is coupled to the camera device. The correction module can be used to calculate the target point of the die and the rotation offset according to the image of the die, and calculate the rotation correction amount according to the rotation offset. The transfer mechanism is coupled to the correction module and located between the first take-up platform and the second take-up platform. The transfer mechanism can include a seat body, a swing arm, and a pick and place nozzle. Wherein, the swing arm has a first end and a second end opposite to the first end, wherein the swing arm is connected to the base body with the first end thereof, and the swing arm can be rotated at the first end thereof Between a bearing surface and a second bearing surface. The pick and place nozzle is located at the second end of the swing arm. Wherein, the swing arm can have a predetermined amount of rotation as its preset rotation amount, so that the swing arm can be at the first predetermined position of the first bearing surface of the first pick-up platform and the second bearing surface of the second pick-up platform Actuated between the second predetermined positions. Here, when the die has a rotational offset, the swing arm can be actuated according to the predetermined amount of rotation and the rotation correction amount to compensate the rotational offset of the die, and can be self-oriented from the die when rotated to the first bearing surface. The die is sucked and the die is placed at a placement point from the die to the second load bearing surface.

An embodiment of the present invention provides a die transfer method, comprising: capturing an image of a die; calculating a target point and a rotation offset of the die according to the image; calculating a rotation correction amount according to the rotation offset; and The amount of rotation and the amount of rotation correction drive the swing arm to compensate for the rotational offset of the die and allow the swing arm to pick up the die from the target point of the die on the first load bearing surface and move the die from the first load bearing surface to A die is placed at a placement point of the second bearing surface.

In summary, the die detecting device and the die transfer method according to an embodiment of the present invention act to compensate the rotation offset of the die by actuating the swing arm according to a predetermined amount of rotation and a rotation correction amount to enhance the crystal. The transfer rate and the detection rate of the particles transferred from the first bearing surface to the placement point of the second bearing surface, thereby reducing the overall production cost.

The detailed features and advantages of the present invention are described in detail in the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art.

Referring to FIG. 1 and FIG. 2 , the die detecting device 100 includes at least two positioning platforms (hereinafter referred to as a first positioning platform 110 and a second receiving platform 120 respectively), an imaging device 130, and a calibration module 150. And at least one transfer mechanism 140. In the following, the two loading platforms 110 and 120 and a transfer mechanism 140 are taken as an example. However, the present invention is not limited thereto, and the number of the loading platforms and the number of the transfer mechanisms depend on the use requirements. For example, the number of the access platforms may be three, and the number of the transfer mechanisms may be two, and the two transfer mechanisms are arranged at intervals from the three access platforms.

The first access platform 110 can include a first placement portion 112, and the first placement portion 112 has a first bearing surface 110a that can be used to carry the die C1.

In this embodiment, the first placement portion 112 can be a wafer ring, and since the wafer ring is generally a hollow frame structure and has a window, a soft film can be adhered to the bottom of the wafer ring, for example, blue. A blue tape is placed on the flexible film to place the crystal grain C1 which has been subjected to wafer cutting and to be tested, and at this time, the first bearing surface 110a refers to the surface of the soft film. In addition, the first positioning platform 110 further includes a ejector mechanism (not shown) disposed below the window of the first placement portion 112. Here, the ejector mechanism can be assisted to move through the shifting assembly (not shown) to assist the pick-and-place nozzle 143 of the transfer mechanism 140 to pick up the crystal grain C1 on the flexible film from bottom to top. However, the present invention is not limited thereto. The first placement portion 112 can be a physical platform, and the first bearing surface 110a is the upper surface of the physical platform, and the die C1 or the patch wafer can be directly placed on the substrate. The first placement surface 112 of the first placement portion 112 is on the first bearing surface 110a. Here, the patch wafer refers to a combination of the diced wafer and the flexible film for wafer attachment.

In addition, it should be noted that the area or volume of the crystal C1 generally described is very small. For ease of illustration and description, the ratio of the ratio of all of the dies C1 to the dies of the dies in the drawings of the present invention may be inconsistent with the actual ratio, which is for reference only and is not intended to limit the invention. In a practical example, the size of the crystal grain C1 may be approximately equal to or only slightly larger than the size of the pick-and-place nozzle 143 to be described later.

Likewise, the second access platform 120 can include a second placement portion 122, and the second placement portion 122 has a second bearing surface 120a that can be used to carry the die C1. In this embodiment, the second placement portion 122 can be a wafer ring, and since the wafer ring is generally a hollow frame, a soft film such as a blue film can be adhered to the bottom of the wafer ring. The crystal grain C1 is placed on the flexible film, wherein the second bearing surface 120a at this time means a soft film. However, the present invention is not limited thereto. The second placement portion 122 can be a physical platform, the second bearing surface 120a is the upper surface of the physical platform, and the die C1 can be directly placed on the second placement portion 122. On the second bearing surface 120a. In addition, a soft film may be attached to the second bearing surface 120a of the second placing portion 122 to prevent the crystal grain C1 placed on the second bearing surface 120a from being displaced or rotated by external interference.

In this embodiment, the first access platform 110 and the second access platform 120 can be implemented by an XYZ-table and a T-table, and the first access platform 110 and the first The two-position platform 120 can be moved on a horizontal plane (ie, an XY plane), or can move along a Z-axis perpendicular to a horizontal plane through a lifting structure, and can also perform T-axis movement through a rotating axis. However, the present invention is not limited thereto, and the first accommodating platform 110 and the second accommodating platform 120 may be implemented by arranging and combining the above-mentioned respective axes.

The imaging device 130 has an imaging lens 131, and the imaging device 130 can have its imaging lens 131 facing the first bearing surface 110a to capture the image S1 of the crystal C1 on the first bearing surface 110a. In another embodiment, the imaging device 130 may also face the imaging lens 131 toward the second bearing surface 120a to capture an image of the crystal C1 on the second bearing surface 120a. Here, the imaging device 130 may be a camera, a camera, or a CCD (charge-coupled device) camera or the like.

The calibration module 150 is coupled to the camera 130 and receives the image S1 captured by the camera 130. In this embodiment, the correction module 150 can be used to calculate a target point T1 of the die C1 according to the image S1 captured by the camera 130, and can determine the die C1 according to the image S1 and the preset preset image. Whether or not a rotation phenomenon occurs, and the rotation offset amount of the crystal grain C1 can be calculated based on the result of the judgment, and the corresponding rotation correction amount S2 can be generated based on the calculated rotation offset amount. In one embodiment, the calibration module 150 calculates the desired target point T1 and the rotation correction amount S2 by image analysis techniques. Here, the target point T1 is used for aligning the pick-and-place nozzle 143 on the transfer mechanism 140 to be described later on the die C1. In this embodiment, the correction module 150 can directly use the center point of the die C1 as the target point T1, but the invention is not limited thereto.

Here, the correction module 150 can be implemented by using a software program and a processor.

The transfer mechanism 140 is located between the first access platform 110 and the second access platform 120. In the present embodiment, the transfer mechanism 140 includes a seat body 141, a swing arm 142, and a pick-and-place nozzle 143. The swing arm 142 includes two opposite ends (hereinafter referred to as a first end and a second end, respectively). The swing arm 142 is connected to the base 141 with its first end, and the first end serves as the axis of rotation thereof, and the pick-and-place nozzle 143 is located at the second end of the swing arm 142. Therefore, the swing arm 142 of the transfer mechanism 140 can rotate between the first pick-up platform 110 and the second pick-up platform 120, and the die C1 is sucked from the first pick-up platform 110 through the pick-and-place nozzle 143. And a placement point P1 on the second bearing surface 120a of the second access platform 120 is displaced.

In this embodiment, the transfer mechanism 140 may include a vacuum pump (not shown), and the vacuum pump may be connected to the pick-and-place nozzle 143 at the second end of the swing arm 142 through the pipeline, so that the pick-and-place nozzle 143 has vacuum suction. Features.

In addition, the transfer mechanism 140 can be coupled to the correction module 150 to be driven according to the rotation correction amount S2 generated by the correction module 150 and a predetermined rotation amount S3 corresponding to the position of the die C1 at the first bearing surface 110a. The swing arm 142 performs a corresponding rotating motion and displaces the die C1 from the first picking platform 110 to the second picking platform 120. The detailed operation of the transfer mechanism 140 will be described later.

Here, the predetermined rotation amount S3 means that the crystal grain C1 rotates between the first predetermined position of the first bearing surface 110a and the second predetermined position of the second bearing surface 120a when the crystal grain C1 does not have the rotational offset amount. The amount of rotation required. The first predetermined position is the initial position of the die C1 on the first bearing surface 110a, and the second predetermined position is the predetermined placement point P1 of the die C1 on the second carrying surface 120a.

The die detecting device 100 further includes a horizontal displacement mechanism 160 coupled to the calibration module 150. In this embodiment, when the swing arm 142 moves to the first pick-up platform 110 for sucking up the die C1, the horizontal displacement mechanism 160 can adjust the first position according to the target point T1 generated by the correction module 150. The relative position of the die C1 and the swing arm 142 on the first bearing surface 110a of the platform 110 is such that the swing arm 142 is rotated to the first bearing surface 110a of the first pick-up platform 110, and is placed on the swing arm 142. The suction nozzle 143 can be aligned with the target point T1 of the crystal grain C1 and suck the crystal grain C1 from this target point T1.

In one embodiment, the horizontal displacement mechanism 160 can be disposed under the first accommodating platform 110 to drive the first accommodating platform 110 to shift to change the relative positions of the crystal C1 and the swing arm 142. However, the present invention is not limited thereto. In another embodiment, the horizontal displacement mechanism 160 may be disposed under the transfer mechanism 140 to drive the transfer mechanism 140 to shift to change the die C1 and the swing arm 142. relative position.

When the swing arm 142 is moved to the second take-up platform 120 for placing the die C1, the horizontal displacement mechanism 160 can also adjust the position on the swing arm 142 according to the placement point P1 pre-stored in the correction module 150. After the relative position of the suction nozzle 143 and the second receiving platform 120 is rotated to rotate the swing arm 142 to the second bearing surface 120a of the second receiving platform 120, the pick-and-place nozzle 143 located on the swing arm 142 can be crystallized. The pellet C1 is placed on the placement point P1 of the second bearing surface 120a.

In one embodiment, the horizontal displacement mechanism 160 can be disposed under the transfer mechanism 140 to drive the transfer mechanism 140 to shift to change the relative position of the pick-and-place nozzle 143 and the second pick-up platform 120. However, the present invention is not limited thereto. In another embodiment, the horizontal displacement mechanism 160 can be disposed under the second positioning platform 120 to drive the second positioning platform 120 to shift to change the pick-and-place nozzle. The relative position of the 143 and the second access platform 120.

Referring to FIG. 1 to FIG. 4, the die transfer method of the present embodiment mainly performs a rotation operation according to a predetermined rotation amount S3 and a rotation correction amount S2 by driving the swing arm 142 of the die detecting device 100 to compensate the die. The rotational offset of C1 is horizontally moved in conjunction with the drive horizontal displacement mechanism 160 to move the die C1 from the first take-up platform 110 to the second take-up platform 102. In the die transfer method of the embodiment, all the rotations are performed by the swing arm 142, so that the whole die transfer method can be improved compared with the conventional die transfer method by the pick-up platform. Transmission and detection rate.

The die transfer method according to an embodiment of the present invention includes capturing the image S1 of the die C1 (step S11), calculating the target point T1 of the die C1 and the rotation offset according to the image S1 (step S12), according to the rotation offset Calculating the rotation correction amount S2 (step S13), and driving the swing arm 142 according to the predetermined rotation amount S3 and the rotation correction amount S2 to compensate the rotation offset amount of the crystal grain C1, and allowing the swing arm 142 to take the crystal grain C1 from the first The bearing surface 110a is moved to the placement point P1 of the second bearing surface 120a (step S14).

In step S11, the die detecting device 100 can pass the die C1 or the chip wafer on the first bearing surface 110a of the first picking platform 110 through the camera device 130 located above the first picking platform 110 (cutting The subsequent wafer and the combination of the flexible film for wafer attachment) capture image S1.

In step S12, the die detecting device 100 can find the position of the desired target point T1 according to the image S1 captured by the camera 130 through the correction module 150, and compare the image S1 with the preset image information to The rotation offset of the crystal grain C1 is judged and calculated. Here, the correction module 150 takes the center point of the crystal grain C1 as the target point T1, but the invention is not limited thereto.

Referring to FIG. 4, a solid line is used to illustrate a state in which the crystal grain C1 is captured by the image capturing device 130, and a broken line is used to illustrate the aspect in which the crystal grain C1' should originally be presented. Therefore, in an embodiment, the correction module 150 can know the rotation offset of the crystal C1 by directly comparing the crystal C1 shown by the solid line with the crystal C1' indicated by the broken line or directly by the image. The analysis technique analyzes the image S1 to obtain the desired target point T1 and the rotational offset.

In step S13, the die detecting device 100 can generate a corresponding rotation correction amount S2 according to the calculated rotation offset amount through the correction module 150.

For example, if the correction module 150 obtains a rotation offset of +30 degrees according to the image S1 (ie, the die C1 is shifted by 30 degrees with respect to the die C1'), the correction module 150 can be rotated according to the rotation. The offset amount, that is, +30 degrees, is calculated as the rotation correction amount S2 being -30 degrees.

In step S14, the swing arm 142 of the transfer mechanism 140 of the die detecting device 100 can perform a corresponding rotating action according to the rotation correction amount S2 obtained in step S13 and the predetermined predetermined rotation amount S3 to compensate the die. The rotation offset of C1, and when the swing arm 142 is rotated to the first take-up platform 110, the crystal grain C1 can be sucked from the first bearing surface 110a from the target point T1 of the die C1, and the die C1 can be The displacement is placed on the placement point P1 of the second bearing surface 120a of the second access platform 120 (as shown in FIGS. 6 to 14).

Wherein, the predetermined rotation amount S3 means that the crystal grain C1 does not have a rotation offset amount (as shown in FIG. 4C1'), and the swing arm 142 takes the crystal grain C1 from the first predetermined position of the first bearing surface 110a (ie, the initial position) Position) a desired rotation angle that is moved to a second predetermined position (ie, a placement point) of the second bearing surface 120a. On the first bearing surface 110a, the swing arm 142 picks up the crystal grain C1 through the lower side of the crystal grain C1 to the target point T1 of the crystal grain C1, and the crystal grain C1 does not have a rotational offset. The arm 142 has an included angle θ with the lower side of the die C1 as shown in FIG.

In an embodiment of the present invention, the swing arm 142 can compensate for the rotational offset of the die C1 when the first predetermined position of the first bearing surface 110a is to be rotated, and according to the predetermined rotation amount S3 and The rotation correction amount S2 generated by the correction module 150 is rotated to the first bearing surface 110a. In addition, in the embodiment, the horizontal displacement mechanism 160 adjusts the relative position of the die C1 and the swing arm 142 according to the target point T1 output by the correction module 150, so that the swing arm 142 is based on the predetermined rotation amount S3. When the rotation correction amount S2 is rotated to the first bearing surface 110a, the pick-and-place nozzle 143 located at one end of the swing arm 142 can be aligned with the target point T1 of the crystal grain C1 and suck the crystal grain C1 from the target point T1. In this state, on the first bearing surface 110a, the swing arm 142 has an angle θ1 with the lower side of the crystal grain C1 as shown in Fig. 7, and the included angle θ1 is the same as the aforementioned angle θ.

For example, if the predetermined rotation amount is 150 degrees and the rotation correction amount is -30 degrees, the swing arm 142 can reduce the rotation angle of 30 degrees when rotating to the first bearing surface 110a, in other words, the swing arm 142 is first. The amount of rotation between the bearing surface 110a and the second bearing surface 120a will be changed from 150 degrees to 120 degrees to compensate for the rotational offset of the die C1, and the horizontal displacement mechanism 160 adjusts the die C1 according to the target point T1. The relative position of the swing arm 142 is such that the pick-and-place nozzle 143 on the swing arm 142 can be aligned with the target point T1 of the die C1 and suck the die C1 as shown in FIGS. 6 and 9. Then, after the die C1 is sucked up, the swing arm 142 of the transfer mechanism 140 can again rotate the lens C1 to the second bearing surface 120a according to the rotation correction amount S2 and the predetermined rotation amount S3, that is, rotate 120 degrees to the first The two bearing surfaces 120a are arranged to place the crystal grains C1 on the placement point P1 of the second bearing surface 120a, as shown in FIGS. 7 and 10.

In this embodiment, the horizontal displacement mechanism 160 can be disposed on the transfer mechanism 140 or the first access platform 110 to drive the transfer mechanism 140 or the first access platform 110 to shift to change the die C1 and the swing arm. The relative position of 142. Here, the horizontal displacement mechanism 160 can be operated simultaneously with the swing arm 142. However, the present invention is not limited thereto, and the horizontal displacement mechanism 160 can also be sequentially operated with the swing arm 142.

However, the present invention is not limited thereto. In another embodiment, the swing arm 142 may also be rotated to the second predetermined position of the second bearing surface 120a after picking up the die C1, and then performing the die C1. The rotation offset is compensated, and is rotated to the second bearing surface 120a according to the predetermined rotation amount S3 and the rotation correction amount S2. In the embodiment, the horizontal displacement mechanism 160 adjusts the relative position of the pick-and-place nozzle 143 and the second bearing surface 120a on the swing arm 142 according to the pre-stored placement point P1, so that the swing arm 142 is predetermined. When the rotation amount S3 and the rotation correction amount S2 are rotated to the second bearing surface 120a, the crystal grain C1 can be placed on the placement point P1 of the second bearing surface 120a. In this state, on the first bearing surface 110a, the swing arm 142 has an angle θ2 with the lower side of the crystal grain C1 as shown in Fig. 12, and the included angle θ2 is different from the aforementioned angle θ.

For example, assuming that the predetermined rotation amount is 150 degrees and the rotation correction amount is -30 degrees, the swing arm 142 may first rotate to the first bearing surface 110a according to a predetermined rotation amount of 150 degrees to drive the crystal grain C1 from the first bearing surface. 110a is sucked up, as shown in Fig. 11, and then rotated by 30 degrees to reduce the rotational offset of C1 when rotated to the second bearing surface 120a, and adjusted with the horizontal displacement mechanism 160 according to the placement point P1. The relative position of the suction nozzle 143 and the second bearing surface 120a is such that the die C1 carried by the swing arm 142 can be placed on the placement point P1 of the second bearing surface 120a, as shown in FIGS. 13 and 14. Show.

In this embodiment, the horizontal displacement mechanism 160 can be disposed on the transfer mechanism 140 or the second access platform 120 to drive the transfer mechanism 140 or the second access platform 120 to shift to change the pick-and-place nozzle 143 and The relative position of the second bearing surface 120a. Here, the horizontal displacement mechanism 160 can be operated simultaneously with the swing arm 142. However, the present invention is not limited thereto, and the horizontal displacement mechanism 160 can also be sequentially operated with the swing arm 142.

In still another embodiment, the swing arm 142 can be rotated about the rotation of the die C1 at a first predetermined position to be rotated to the first bearing surface 110a and a second predetermined position to be rotated to the second bearing surface 120a, respectively. The amount is compensated. Therefore, in this embodiment, the rotation correction amount S2 generated by the correction module 150 may be divided into a first rotation correction component and a second rotation correction component according to a proportional distribution, for example, 1:2 or 1:3.

The swing arm 142 can be rotated to the first bearing surface 110a according to the predetermined rotation amount S3 and the first rotation correction component, and the horizontal displacement mechanism 160 adjusts the relative position of the crystal grain C1 and the swing arm 142 according to the target point T1, so that When the swing arm 142 is rotated to the first bearing surface 110a, the pick-and-place nozzle 143 at one end of the swing arm 142 can be aligned with the target point T1 of the die C1 and suck the die C1 from the target point T1. Thereafter, the swing arm 142 can be rotated to the second bearing surface 120a according to the predetermined rotation amount S3 and the second rotation correction component, and the horizontal displacement mechanism 160 adjusts the pick-and-place nozzle 143 located on the swing arm 142 according to the pre-stored placement point P1. The relative position of the second bearing surface 120a is such that when the swing arm 142 is rotated to the second bearing surface 120a, the die C1 can be placed on the placement point P1 of the second bearing surface 120a.

In this embodiment, the horizontal displacement mechanism 160 can be disposed on the transfer mechanism 140, the first access platform 110, and/or the second access platform 120 to drive the transfer mechanism 140, the first access platform 110, and/or Or the second access platform 120 performs shifting. Here, the horizontal displacement mechanism 160 can be operated simultaneously with the swing arm 142. However, the present invention is not limited thereto, and the horizontal displacement mechanism 160 can also be sequentially operated with the swing arm 142.

In the foregoing, the die detecting device and the die transfer method according to an embodiment of the present invention, by driving the swing arm to operate according to a predetermined amount of rotation and a rotation correction amount, to compensate for a rotational offset of the die to improve the die self. The transfer rate of the first bearing surface to the placement point of the second bearing surface and the detection rate, which in turn reduces the overall production cost.

The technical contents of the present invention have been disclosed in the preferred embodiments as described above, and are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be The scope of the invention is therefore defined by the scope of the appended claims.

100‧‧‧ grain inspection device

110‧‧‧First access platform

110a‧‧‧First bearing surface

112‧‧‧First Placement Department

120‧‧‧Second access platform

120a‧‧‧second bearing surface

122‧‧‧Second Placement Department

130‧‧‧ camera

131‧‧‧ camera lens

140‧‧‧Transportation mechanism

141‧‧‧ body

14‧‧‧ swing arm

143‧‧‧Receiving nozzle

150‧‧‧ calibration module

160‧‧‧Horizontal displacement mechanism

T1‧‧‧ target point

C1, C1’‧‧‧ grain

P1‧‧‧ placement point

S1‧‧ images

S2‧‧‧rotation correction

S3‧‧‧ scheduled rotation

Step S11‧‧‧ Capture the image of the die

Step S12‧‧‧ Calculate the target point and rotation offset of the die from the image

Step S13‧‧‧ Calculate the amount of rotation correction based on the rotation offset

Step S14‧‧‧ driving the swing arm according to the predetermined rotation amount and the rotation correction amount to compensate the rotation offset of the die, and the swing arm can move the die from the first bearing surface to the placement point of the second bearing surface

Fig. 1 is a schematic perspective view showing a crystal grain detecting apparatus according to an embodiment of the present invention. Fig. 2 is a schematic block diagram showing a crystal grain detecting apparatus according to an embodiment of the present invention. [Fig. 3] is a schematic flow chart showing a flow of a die transfer method according to a first embodiment of the present invention. [Fig. 4] is a schematic diagram showing an image captured by an image pickup apparatus. [Fig. 5] is a schematic view showing an angle formed between a swing arm and a crystal grain having no rotational offset. Fig. 6 is a schematic view (1) showing the operation of the die detecting device according to an embodiment of the present invention. [Fig. 7] is a partially enlarged schematic view of Fig. 6. [Fig. 8] Fig. 8 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (2). [Fig. 9] Fig. 9 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (3). [Fig. 10] Fig. 10 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (4). [Fig. 11] Fig. 11 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (5). [Fig. 12] is a partially enlarged schematic view of Fig. 11. [Fig. 13] Fig. 13 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (6). Fig. 14 is a schematic view showing the operation of the die detecting device according to an embodiment of the present invention (7).

Step S11‧‧‧ Capture the image of the die

Step S12‧‧‧ Calculate the target point and rotation offset of the die from the image

Step S13‧‧‧ Calculate the amount of rotation correction based on the rotation offset

Step S14‧‧‧ driving the swing arm according to the predetermined rotation amount and the rotation correction amount to compensate the rotation offset of the die, and the swing arm can move the die from the first bearing surface to the placement point of the second bearing surface

Claims (11)

A die detecting device includes: a first loading platform having a first bearing surface for carrying a die; an image capturing device having an image capturing lens, wherein the camera device uses the camera lens The first bearing surface is disposed above the first bearing surface to capture an image of the die; a second receiving platform has a second bearing surface; and a correction module coupled to the camera The correction module calculates a target point and a rotation offset of the die according to the image of the die, and the correction module calculates a rotation correction amount according to the rotation offset; and a transfer The mechanism is coupled to the calibration module and located between the first positioning platform and the second positioning platform, the transfer mechanism includes a body, a swing arm and a pick-and-place nozzle, the swing arm has a a first end and a second end opposite to the first end, the swing arm is coupled to the base body by the first end, and the swing arm is rotatable to the first bearing surface with the first end as an axis Between the second bearing surface, the pick-and-place nozzle is located at the second end, and the swing arm is pre- The amount of rotation is a preset amount of rotation, the swing arm is actuated between a first predetermined position of the first bearing surface and a second predetermined position of the second bearing surface; wherein the swing arm is according to the predetermined amount of rotation And rotating the correction amount to compensate the rotation offset of the die, and sucking the die from the target point of the die on the first bearing surface and moving to a placement point of the second bearing surface The die is placed on it. The die detecting device of claim 1, wherein the swing arm is actuated according to the rotation correction amount at the first predetermined position to cause the swing arm to pick up the die from the target point on the first bearing surface, And placing, on the second bearing surface, the swing arm from the placement point. The die detecting device of claim 1, wherein the swing arm is moved to the first predetermined position, so that the pick-and-place nozzle can suck the die on the first bearing surface, and the swing arm rotates to the The second predetermined position is actuated according to the rotation correction amount to place the die from the placement point on the second bearing surface. The die detecting device of claim 1, wherein the rotation correction amount includes a first rotation correction component and a second rotation correction component, and the swing arm is actuated according to the first rotation correction component at the first predetermined position, Taking the die from the target point on the first bearing surface, the swing arm is rotated to the second predetermined position and actuated according to the second rotation correction component to place the second bearing surface from the placement point Grain. The grain detecting device according to any one of claims 1 to 4, further comprising a horizontal displacement mechanism coupled to the correction module, wherein the swing arm moves to the first positioning platform, and the horizontal displacement mechanism is based on the target Adjusting a relative position of the die to the swing arm, so that the swing arm can suck the die from the target point on the first bearing surface, and the swing arm rotates to the second take-up platform, and the horizontal displacement mechanism is The placement point is such that the swing arm places the die on the placement point of the second bearing surface. The grain detecting device according to claim 5, wherein the horizontal displacement mechanism is disposed in the transfer mechanism. The grain detecting device according to claim 5, wherein the horizontal displacement mechanism is disposed on the first pick-up platform and/or the second pick-up platform. The die detecting device of claim 1, wherein the placement point is preset in the correction module. A method for transmitting a die includes: capturing an image of a die; and calculating a target point and a rotational offset of the die according to the image; Calculating a rotation correction amount according to the rotation offset; and driving a swing arm according to the predetermined rotation amount and the rotation correction amount to compensate the rotation offset of the die, and causing the swing arm to be in a first load The surface is sucked from the target point of the die and moved to a placement point of the second bearing surface to place the die. The die transfer method of claim 9, wherein the predetermined amount of rotation is a predetermined amount of rotation of the swing arm for causing the swing arm to be at a first predetermined position of the first bearing surface and the first Actuating between a second predetermined position of the two bearing surfaces, in the step of driving the swing arm according to the predetermined rotation amount and the rotation correction amount, the swing arm is according to the predetermined rotation when it is to be rotated to the first predetermined position The amount is actuated by the rotation correction amount or when the rotation is to be rotated to the second predetermined position, and the rotation correction amount is actuated according to the predetermined rotation amount. The method of claim 10, wherein the swing arm is in the first predetermined position according to the rotation correction amount, further comprising: adjusting the relative orientation of the die and the swing arm according to the target point position.