TW201810471A - A chip appearance inspection device and method - Google Patents

Abstract

A chip appearance inspection device adapted to detect the appearance of a chip. The device comprises a base module, a detection module, a flip auxiliary module, and a moving module. The base module includes a base, and a Chip placement area. The detection module includes an image capture unit, and an image detection area. The flip auxiliary module includes a flip auxiliary plate, and a chip temporary storage area. The moving module includes a robotic arm to move the chip moving in the respective areas.

Description

Wafer appearance detecting device and method thereof

The present invention relates to a detecting device, and more particularly to a device for detecting the appearance of a wafer.

In recent years, with the advancement of related technologies such as electronic technology and the Internet, and the increase in the consumption level of the global electronic market, the demand for electronic products such as personal computers, multimedia, workstations, networks, and communication-related equipment has soared, driving the whole world. The semiconductor industry is booming, and in Taiwan, the semiconductor industry has become a major force in maintaining the national economic artery.

In the semiconductor packaging process, it is necessary to perform inspection for each manufacturing process, including electrical or appearance inspection. Among them, the current wafer appearance inspection has progressed to use image information to inspect the finished product in a non-contact manner, by computer image. The processing technology detects abnormalities such as foreign matter or pattern abnormality, and effectively reduces errors caused by personnel discrimination.

Referring to FIG. 1, a quartz wafer size and defect visual inspection device for a Continental patent CN 103090795 A includes a wafer inspection section 1, a carrier carrying device 2, two open boxes 3 arranged side by side, and a fixed connection on the detection platform. The bearing housing 4, the straight rod 5 movably connected to the bearing housing through the linear bearing, the end of the straight rod 5 is connected with a stepping motor 6, driving the pick-up head 7 which can move up and down, and the stepping motor 6 is connected with the determined wafer position and guiding The wafer pick-up device picks up the wafer detection probe 8, and the detection platform beside the carrier plate is further provided with a wafer-loaded hopper 9.

The wafer inspection section includes three CXD cameras, two of which are located on the table of the detection platform, and the two CXD cameras are separated by a certain distance, the areas they illuminate are perpendicular to each other, and the other is located under the table of the detection platform, and the illumination area is upward. , the detection platform where the wafer detection segment is located The mesa is a light transmissive material such as glass. When the wafer is placed in the area covered by the three CCD cameras, the wafer can be stereoscopically detected from three different orientations. The CCD camera captures the length, width and height of the wafer and the specific conditions of the defect are fed back to the computer, and the computer saves the standard map. For comparative analysis, determine if the wafer is qualified.

However, the conventional defect visual inspection device has the following disadvantages when it is actually used:

First, can not accurately judge:

The conventional method for detecting the lower surface of the wafer is to use a light-transmitting material for the mesa, and the CCD camera is placed under the mesa, and the screen on the lower surface of the wafer is taken through the mesa, and the screen obtained through the light-transmitting material is not only The picture taken is different from the actual chip picture, and it is even more difficult to avoid the dust on the table surface, which makes the computer unable to judge accurately.

Second, causing wafer damage

If you want to get a direct shot, you must set up a flipping mechanism, which will cause damage to the surface of the wafer and reduce the yield.

Third, the cost can not be reduced

Early detection of the appearance of the wafer, must be set up with multiple CCD cameras, generally used for semiconductor image capture equipment, and computer equipment to identify the appearance of the crystal inspection, the price is very expensive, this will increase the price of equipment, the cost of equipment can not be built decline.

Therefore, how to improve the detection accuracy of the appearance of the wafer and reduce the construction cost of the inspection equipment is an urgent need of the related art.

In view of the above, an object of the present invention is to provide a wafer appearance detecting device suitable for detecting the appearance of a wafer having an upper surface and a lower surface, the device comprising a base module, a detecting module, A flip assist module and a shift module.

The base module includes a base and a wafer placement area disposed on the base.

The detection module is disposed on the base and includes an image capture device and an image detection area in front of the image capture device.

The inversion assisting module includes a flipping auxiliary plate, and a wafer temporary release area above the inverting auxiliary board. The inverting auxiliary board has a fixing portion disposed on the base and extending outward from one side of the fixing portion. An extension, and a movement space between the extensions.

The transfer module includes a robot arm disposed on the base for moving the wafer to the wafer placement area, the image detection area, and the wafer temporary release section.

Another technical means of the present invention is that the robot arm has a rotating base disposed on the base, a plurality of supporting members, a plurality of joint members disposed between the plurality of supporting members, and one of the supporting members. a rotating member, and a wafer pick-up member coupled to the rotating member, wherein one of the supporting members is coupled to the rotating base.

Another technical means of the present invention is that the robot arm further has a wafer size detecting member disposed beside the wafer suction member to detect the size of the wafer placed in the wafer placement area, and calculate the machine. The position at which the wafer pick-up of the arm is in contact with the wafer.

According to still another aspect of the present invention, the wafer further has a plurality of sides connected to the upper and lower surfaces, and the robot arm rotates the wafer in the image detecting area to enable the image picker to detect the wafer. Plural side.

Another technical means of the present invention is that the wafer placement area has a defective product placement container for placing the wafer of the appearance.

Another object of the present invention is to provide a method for detecting the appearance of a wafer, which is suitable for the above-mentioned wafer appearance detecting device, which comprises a wafer taking step, a first detecting step, a changing suction surface step, A second detecting step and a wafer placing step.

The wafer taking step is first performed, and the wafer pick-up member of the robot arm contacts the upper surface of the wafer to pick up and move the wafer placed in the wafer placement area.

Then performing the first detecting step, the robot arm moves the wafer to the image detecting area, so that the image picker captures an image of the lower surface of the wafer.

And then performing the change suction surface step, the robot arm moves the wafer and places it in the wafer temporary release area, the wafer suction member of the robot arm is separated from the upper surface of the wafer, and is moved to contact the lower surface of the wafer to The wafer placed in the wafer temporary discharge area is sucked and moved.

Then performing the second detecting step, the robot arm moves the wafer to the image detecting area, so that the image picker captures an image of the upper surface of the wafer.

Finally, the wafer placement step is performed, the robot arm moves the wafer and places it in the wafer placement area and detaches the wafer.

Another technical method of the present invention is the method for detecting the appearance of the wafer, further comprising a step of confirming the size of the wafer before the step of taking the wafer, first detecting the size of the wafer placed in the wafer placement area, and calculating the size The position of the robot arm in contact with the upper surface of the wafer.

Another technical means of the present invention is that in the first detecting step, the robot arm changes the angle of the wafer and rotates the wafer so that the image picker can capture the plurality of sides of the wafer.

According to still another aspect of the present invention, in the step of modifying the suction surface, the wafer placed in the wafer placement area is placed on the two extensions, and the moving space between the two extensions can provide the suction The robotic arm of the wafer moves.

Another technical means of the present invention is that in the step of modifying the suction surface, after the wafer pick-up member is separated from the upper surface of the wafer, the size and orientation of the wafer placed in the temporary holding area of the wafer are first detected to calculate The position where the robot arm is in contact with the lower surface of the wafer.

The beneficial effect of the present invention is that the robot arm absorbs the upper surface of the wafer by vacuum suction technology, and moves the wafer to the image detecting area, so that the image picker can directly photograph the lower surface of the wafer, and It is accurately judged whether the appearance of the lower surface of the wafer is good. The flip assisting plate assists the robot arm to pick up the lower surface of the wafer and move the wafer to the image detecting area, so that the image picker can directly capture the upper surface of the wafer and accurately determine the upper surface of the wafer. Whether the appearance is good.

A‧‧‧ wafer protection disk

2‧‧‧ wafer

21‧‧‧ upper surface

22‧‧‧ Lower surface

23‧‧‧ side

3‧‧‧Base module

31‧‧‧Base

32‧‧‧ wafer placement area

321‧‧‧Don't place the container

4‧‧‧Test module

41‧‧‧Image capture device

42‧‧‧Image detection area

5‧‧‧Flip auxiliary module

51‧‧‧Flip auxiliary board

511‧‧‧ Fixed Department

512‧‧‧Extension

513‧‧‧Mobile space

52‧‧‧ wafer temporary release area

6‧‧‧Transfer module

61‧‧‧Machine arm

611‧‧‧Rotating base

612‧‧‧Support

613‧‧‧ joint parts

614‧‧‧Rotating parts

615‧‧‧ wafer pick-up parts

616‧‧‧ Wafer size detection

91~96‧‧‧Steps

1 is a schematic view of a device, illustrating a continental patent CN103090795A, a wafer size and defect visual inspection device; and FIG. 2 is a schematic view of a preferred embodiment of the wafer appearance detecting device of the present invention; FIG. 3 is a schematic top view. FIG. 4 is a schematic view of a device for explaining a flip assist module of the preferred embodiment; FIG. 5 is a schematic view of the device for detecting the side of a wafer of the preferred embodiment. FIG. 6 is a step diagram illustrating the method of detecting the wafer of the preferred embodiment.

The related features and technical details of the present invention will be apparent from the following detailed description of the preferred embodiments.

2 and 3, a preferred embodiment of a wafer appearance detecting apparatus according to the present invention is suitable for detecting the appearance of a wafer 2 having an upper surface 21, a lower surface 22, and a plurality of upper surfaces 21 connected thereto. And the side surface 23 of the lower surface 22, the wafer appearance detecting device comprises a base module 3, a detecting module 4, a flip assisting module 5, and a moving mold Group 6.

The base module 3 includes a base 31 and a wafer placement area 32 disposed on the base 31. In the preferred embodiment, the base 31 is a support frame generally disposed on the ground, and the base 31 can be provided with a computer, a computer, a power source, a drive, and the like.

The wafer placement area 32 is disposed above the base 31 for providing a plurality of wafers 2. Preferably, the plurality of wafers 2 are placed in at least one of the wafer protection trays A to provide a plurality of wafers to be inspected. The placement area 32 has at least one defective product placement container 321 to provide placement of the wafer 2 which is determined to be defective after the wafer appearance detecting means detects the wafer 2.

The detecting module 4 is disposed on the base 31 and includes an image capturing device 41 and an image detecting area 42 in front of the image capturing device 41. Preferably, the image capturing device 41 has a The lens of the image detection area 42 is captured, and a picture recognition host that can recognize whether the picture is a normal wafer appearance, and the picture recognition host can transmit the recognized information.

Referring to FIG. 4, the inversion assisting module 5 includes a flipping auxiliary plate 51, and a wafer temporary release area 52 above the inversion auxiliary board 51. The inverting auxiliary board 51 has a fixing portion 511 disposed on the base 31. And an extending portion 512 extending outward from one side of the fixing portion 511 and a moving space 513 between the two extending portions 512. The wafer temporary placement area 52 is disposed above the two extensions 512 and the movement space 513 to provide the wafer 2 on the extension portion 512.

The transfer module 6 includes a robot arm 61 disposed on the base 31 for moving the wafer 2 between the wafer placement area 32, the image detection area 42, and the wafer temporary discharge area 52.

In the preferred embodiment, the robot arm 61 has a rotating base 611 disposed on the base 31, a plurality of support members 612, a plurality of joint members 613 disposed between the plurality of support members 612, and one of A rotating member 614 connected to the supporting member 612 and a wafer sucking member 615 connected to the rotating member 614 are connected to the rotating base 611.

The rotary base 611 has a rotary motor therein to effectively provide the upper support member 612 to rotate horizontally by an angle. The rotating member 614 is used to rotate the wafer pick-up member 615. The plurality of rotating members 614 can control the angle of the plurality of supports 612 to cooperate with the rotating base 611 to bring the wafer pick-up 615 to a designated position.

One end of the wafer suction member 615 is connected to the rotating member 614, and the other end of the wafer suction member 615 has at least one nozzle, and the nozzle can suck the upper surface 21 or the lower surface 22 of the wafer 2 to make the machine The arm 61 can suck and move the wafer 2. Due to the control of the robot arm 61 and the technical means of handling the wafer 2 by vacuum suction technology, techniques that are familiar to the industry are not described in detail herein.

First, at least one wafer 2 to be inspected is placed on the wafer placement area 32. The robot arm 61 utilizes the plane of the upper surface 21 of the wafer 2. The nozzle of the wafer suction member 615 is vacuum-drawn by the technique. 2 adsorbing, and moving the wafer 2 to the image detecting area 42 to the image detecting area 42 so that the image picker 41 detects the lower surface 22 of the wafer 2.

Next, the wafer 2 is moved and placed in the wafer temporary discharge area 52. First, the wafer suction member 615 reverses the upper surface 21 of the wafer 2 downward, and the robot arm 61 moves the wafer suction member 615 by the movement. The space 513 enters the flip assisting plate 51 to enter the wafer 2 into the wafer temporary discharge region 52, and releases the vacuum to detach the wafer pick-up member 615 from the upper surface 21 of the wafer 2.

Next, the wafer pick-up member 615 of the robot arm 61 is detached from the moving space 513 and moved to the lower surface 22 of the wafer 2. With the plane of the lower surface 22 of the wafer 2, the nozzle of the wafer pick-up member 615 is vacuumed. The technique of suction sucks the wafer 2 and the wafer 2 is The wafer placement area 32 is moved to the image detection area 42 to cause the image picker 41 to detect the upper surface 21 of the wafer 2. Finally, the wafer 2 is moved to the wafer placement area 32 for placement.

The robot arm 61 further has a wafer size detecting member 616 disposed beside the wafer pick-up member 615 to detect the size of the wafer 2 placed in the wafer placement area 32 and the wafer temporary discharge area 52, and determine the wafer 2 The size and placement orientation are calculated, and the position of the wafer pick-up 615 of the robot arm 61 in contact with the wafer 2 is calculated. The wafer size detecting member 616 has a lens and a host for determining the size of the wafer 2 for confirming the size of the wafer 2 and the optimum position of the robot arm 61 for absorbing the upper surface 21 of the wafer 2.

The wafer appearance detecting device can detect different sizes of the wafer 2. In the preferred embodiment, the wafer 2 is a mobile phone screen driving chip, and the wafer 2 has a length of about 15 mm to 45 mm and a width of about 0.8 mm, and is arranged side by side. Discharged in the wafer protection disk A of the wafer placement area 32, before the robot arm 61 picks up one of the wafers 2 of the wafer protection disk A, the wafer size detecting unit 616 is used to capture the wafer placement area 32. The screen is used to determine the size and placement of the wafer 2 placed in the wafer placement area 32, and calculate the optimum position at which the robot arm 61 picks up the upper surface 21 of the wafer 2.

Referring to FIG. 5, when the image capturing device 41 captures the upper surface 21 of the wafer 2 or photographs the lower surface 22 of the wafer 2, the robot arm 61 can rotate the imaging surface of the wafer 2 by 90 degrees. The side surface 23 of the wafer 2 is aligned with the lens of the image capturing device 41. The robot arm 61 can rotate the wafer 2 in the image detecting area 42 so that the image capturing device 41 detects the plurality of sides 23 of the wafer 2. . Generally, the side surface 23 of the wafer 2 is generally four sides, and the rotating member 614 of the robot arm 61 is rotated at a fixed angle to rotate the wafer suction member 615 to rotate the wafer 2 so that the detecting module 4 can detect the wafer. 2 of the plural side 23 .

Generally, the side 23 of the wafer 2 is too small in area. It is not a flat surface, so the robot arm 61 can only draw the wafer 2 by the plane of the upper surface 21 or the lower surface 22 of the wafer 2, without using the side 23 of the wafer 2. When detecting the upper surface of the wafer 2, the robot arm 61 can invert the wafer 2 so that the image picker 41 detects the plurality of sides 23 of the wafer 2. .

The inventors have emphasized that the preferred embodiment uses the wafer protection disk A to support a plurality of wafers 2 that can be transported by other robotic arms or placed in the production line to transport the tape. The wafer protection disk A is moved or manually moved. The wafer size detecting member 616 of the robot arm 61 can detect the size and orientation of the wafer 2 first. The wafer adsorbing member 615 can hold the wafer 2 for moving.

In addition, the inverting auxiliary module 5 can be provided with an illumination member for illuminating the inversion auxiliary plate 51 for illuminating the wafer 2 placed on the wafer temporary discharge area 52. Preferably, the illumination element is an LED illumination element, which can be disposed on The fixing portion 511 or the two extending portions 512 are provided in a backlight manner to capture a picture of the wafer 2 by the wafer size detecting member 616 to determine the size and placement orientation of the wafer 2.

Referring to FIG. 6, a method for detecting the wafer for the preferred embodiment includes a size confirmation step 91, a wafer pickup step 92, a first detection step 93, a change suction surface step 94, and a second method. Detection step 95, and a wafer placement step 96.

First, the size confirming step 91 is performed, the wafer placement area 32 is placed on the wafer 2 to be inspected, and the wafer appearance detecting program is started. The robot arm 61 of the moving module 6 moves the wafer size detecting unit 616 to the wafer. Above the discharge area 32, the size and position of the wafer 2 placed on the wafer placement area 32 are detected, and the wafer suction member 615 of the robot arm 61 is calculated to be in contact with the upper surface 21 of the wafer 2, and The position at which the wafer 2 is adsorbed.

Generally, the wafer 2 is placed in a crystal arrangement. In the chip protection disk A, the wafer 2 size detecting component can separately separate the image of the wafer 2 to be detected to obtain the size and placement position of the wafer 2, and calculate the wafer suction member 615 to absorb The position of the surface 21 above the wafer 2.

Then, the wafer taking step 92 is performed, the robot arm 61 contacts the suction cup of the wafer suction member 615 to the upper surface 21 of the wafer 2, and utilizes the vacuum suction between the plane of the upper surface 21 of the wafer 2 and the suction cup. The wafer 2 placed in the wafer placement area 32 is moved to separate the wafer 2 from the wafer protection disk A.

Then, the first detecting step 93 is performed, the robot arm 61 moves the wafer 2 to the image detecting area 42 so that the image capturing device 41 captures the image of the lower surface 22 of the wafer 2, and analyzes the wafer 2 Whether the lower surface 22 is damaged, the image picker 41 transmits the result outward. The image capture device 41 can store normal appearance information of a plurality of different types of wafers 2 to recognize different types of wafer appearances.

When the lower surface 22 of the wafer 2 is photographed, the robot arm 61 changes the angle of the wafer 2 such that one of the side faces 23 of the wafer 2 faces the image picker 41, and the image picker 41 The side 23 of the wafer 2 can be photographed and it is judged whether or not the appearance of the side surface 23 is good.

Then, the rotating member 614 of the robot arm 61 rotates the wafer suction member 615 for rotating the wafer 2, so that the image capturing device 41 can capture the appearance of the plurality of sides 23 of the wafer 2, and determine the wafer 2 Whether the appearance of the plurality of side faces 23 is good, the image picker 41 can transmit the result outwards, so that the wafer appearance detecting device obtains the detection result of the appearance of the wafer 2. In the actual implementation, the step of inspecting the side 23 of the wafer 2 can also be placed in the second detecting step 95, and should not be limited thereto.

Then, the change suction surface step 94 is performed, the wafer suction member 615 reverses the upper surface 21 of the wafer 2 downward, and the robot arm 61 enters the wafer suction member 615 from the gap of the moving space 513 into the inversion auxiliary plate 51. To insert the wafer 2 into the wafer temporary discharge area 52, and release the true The wafer detachment member 615 is detached from the upper surface 21 of the wafer 2.

Next, the wafer pick-up member 615 of the robot arm 61 is detached from the moving space 513 and moved to the lower surface 22 of the wafer 2. With the plane of the lower surface 22 of the wafer 2, the nozzle of the wafer pick-up member 615 is vacuumed. The technique of picking up adsorbs the wafer 2 and moves the wafer 2 to the image detecting area 42 in the wafer placement area 32.

In actual implementation, the robot arm 61 can also move the wafer 2 to the wafer temporary discharge area 52, and the lower surface 22 of the wafer 2 is placed over the second extension portion 512 of the inversion auxiliary board 51 to the wafer 2 Placed in the wafer temporary discharge area 52, at this time, the wafer suction member 615 and the upper surface 21 of the wafer 2 are vacuumed, so that the robot arm 61 is separated from the upper surface 21 of the wafer 2, and the robot arm 61 sucks the wafer. The member 615 is moved below the wafer 2, and is in contact with the lower surface 22 of the wafer 2 through the inversion auxiliary plate 51. The wafer suction member 615 utilizes a vacuum suction force with the lower surface 22 of the wafer 2 to suck the wafer 2. stand up.

When the wafer pick-up member 615 has absorbed the lower surface 22 of the wafer 2, the robot arm 61 lifts the wafer 2 slightly upward to separate the lower surface 22 of the wafer 2 from the second extension portion 512. The wafer 2 suction member is separated from the toggle assisting plate by the moving space 513 to move the wafer 2 placed in the wafer temporary discharge region 52.

It is worth mentioning that the control technology of the robot arm 61 can effectively control the moving speed. When the wafer 2 is placed in the wafer temporary discharge area 52, the wafer 2 can be placed in the second extension in the lightest manner. The portion 512 effectively prevents the wafer 2 from colliding with the flip assisting plate 61 to excessively damage the wafer 2.

Here, the inventors will emphasize that when the wafer pick-up member 615 is separated from the upper surface 21 of the wafer 2 by the bottom, the size and orientation of the wafer 2 placed in the wafer temporary discharge region 52 are first detected. The wafer size detecting member 616 is moved above the wafer temporary discharge area 52, and the lower surface 22 of the wafer 2 placed in the wafer temporary discharge area 52 is taken to calculate the The position at which the robot arm is in contact with the lower surface of the wafer.

Then, the second detecting step 95 is performed, the robot arm 61 moves the wafer 2 to the image detecting area 42 so that the image capturing device 41 captures the image of the upper surface 21 of the wafer 2, and analyzes the wafer 2 Whether or not the lower surface 22 is damaged, the image picker 41 transmits the result outward so that the wafer appearance detecting device obtains the detection result of the appearance of the wafer 2.

Finally, the wafer placing step 96 is performed, the robot arm 61 moves the wafer 2 to the wafer placement area 32, and places the wafer 2 on the wafer protection tray A in the wafer placement area 32, and the robot arm The wafer pick-up member 615 of 61 is separated from the lower surface 22 of the wafer 2. When the wafer appearance detecting device determines that the appearance of the wafer 2 is defective, the robot arm 61 places the wafer in the defective product placing container 321.

The inventors have emphasized that the flipping mechanism provided on the early wafer appearance inspection machine can effectively flip the wafer 2, but the surface of the wafer 2 is damaged by the turning mechanism, thereby causing a decrease in yield.

The wafer appearance detecting device and the method thereof of the present invention mainly utilize the manipulation technology of the currently very pure robot arm 61 to move the wafer suctioning member 615 to a desired position and orientation, and cooperate with the inverting auxiliary plate 51 created by the inventor. The wafer 2 in the detection is prevented from being damaged by multiple collisions.

In addition, the wafer appearance detecting device of the present invention only needs to provide a high-resolution image capturing device 41, so as to obtain the most direct and clear photos of the respective surfaces of the wafer 2, and effectively improve the early wafer appearance inspection machine must be set. A plurality of lenses are used to photograph each surface of the wafer 2.

As can be seen from the above description, the present invention does have the following effects:

First, shoot the clearest picture:

The robot arm 61 directly faces the upper surface 21, the lower surface 22, and the plurality of side surfaces 23 of the wafer 2 toward the image capturing device 41, so that there is no transparent material between the image capturing device 41 and the wafer 2. Block, so that the picture is the clearest.

Second, save the installation cost:

By moving the wafer 2 through the robot arm 61, only one image picker 41 can obtain the upper surface 21, the lower surface 22, and the plurality of side surfaces 23 of the wafer 2, thereby saving the installation cost.

Third, to avoid wafer damage:

When the robot arm 61 needs to replace the suction surface of the wafer 2, the wafer suction member 615 of the wafer 2 is sucked, and the wafer suction member 615 is moved to the moving space with the upper surface 21 of the wafer 2 facing downward. 513 is moved to cause the wafer 2 to reach the wafer temporary discharge area 52. The wafer suction member 615 breaks the vacuum and leaves the upper surface 21 of the wafer 2, and then moves the wafer suction member 615 to the lower surface 22 of the wafer 2. In order to absorb the wafer 2, it is effective to prevent the wafer 2 from being damaged by collision.

In summary, the robot arm 61 of the present invention draws the upper surface 21 of the wafer 2 by a vacuum suction technique to move the wafer 2 to the image detecting area 42 and determine whether the lower surface 22 of the wafer 2 is good. Then, the robot arm 61 uses the two extension portions 512 protruding from the inversion assisting plate 51 to enable the robot arm 61 to suck the lower surface 22 of the wafer 2 to move the wafer 2 to the image detecting area 42 and discriminate the wafer. 2 Is the upper surface 21 good? The rotating member 614 of the robot arm 61 can rotate the wafer 2 to enable the image capturing device 41 to acquire and recognize the image of the plurality of sides 23 of the wafer 2. The inversion assisting plate 51 effectively prevents the wafer 2 from being damaged by collision, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

Claims (10)

A wafer appearance detecting device, which is suitable for detecting the appearance of a wafer having an upper surface and a lower surface, the device comprising: a base module comprising a base and a wafer placement area disposed on the base a detection module is disposed on the base and includes an image capture device and an image detection area in front of the image capture device; a flip assist module including a flip assist plate, and a Reversing the wafer temporary release area above the auxiliary board, the flip auxiliary board has a fixing portion disposed on the base, an extending portion extending outward from one side of the fixing portion, and a moving space between the two extending portions And a moving module, comprising a robot arm disposed on the base for moving the wafer in the wafer placement area, the image detection area, and the wafer temporary placement interval. The wafer appearance detecting device according to claim 1, wherein the robot arm has a rotating base disposed on the base, a plurality of supporting members, a plurality of joint members disposed between the plurality of supporting members, and a plurality of A rotating member connected to the supporting member and a wafer sucking member connected to the rotating member, wherein one of the supporting members is coupled to the rotating base. The wafer appearance detecting device according to claim 2, wherein the robot arm further has a wafer size detecting member disposed beside the wafer suction member to detect a wafer size placed in the wafer placement area, And calculating the position of the wafer pick-up member of the robot arm in contact with the wafer. The wafer appearance detecting device according to claim 3, wherein the wafer further has a plurality of sides connected to the upper and lower surfaces, and the robot arm rotates the wafer in the image detecting area to capture the image. The device detects the complex sides of the wafer. The wafer appearance detecting device according to the fourth aspect of the invention, wherein the wafer placement area has a defective product placement container. A method for detecting the appearance of a wafer, which is applicable to the device of any one of claims 1 to 5, the method comprising the steps of: a wafer taking step, the wafer pick-up member of the robot arm contacting the upper surface of the wafer to The wafer placed in the wafer placement area is sucked and moved; in a first detecting step, the robot arm moves the wafer to the image detecting area, so that the image picker captures an image of a lower surface of the wafer; a step of changing the suction surface, the robot arm moves the wafer and places it in the wafer temporary release area, the wafer suction member of the robot arm is separated from the upper surface of the wafer, and is moved to the lower surface of the wafer for contact to be placed on The wafer in the temporary holding area of the wafer is sucked and moved; in a second detecting step, the robot arm moves the wafer to the image detecting area, so that the image picker captures an image of the upper surface of the wafer; In the wafer placement step, the robot arm moves the wafer and places it in the wafer placement area and detaches the wafer. According to the method for detecting the appearance of the wafer according to claim 6, further comprising a step of confirming the size of the wafer before the step of taking the wafer, first detecting the size of the wafer placed in the wafer placement area, and calculating the robot arm A location in contact with the upper surface of the wafer. The wafer appearance detecting method according to claim 7, wherein in the first detecting step, the robot arm changes an angle of the wafer and rotates the wafer, so that the image picker can capture the wafer. The plural side. According to the method of detecting the appearance of the wafer according to claim 8, wherein in the step of modifying the suction surface, the wafer placed on the wafer placement area is placed on the two extensions, and between the two extensions The moving space provides movement of the robotic arm that draws the wafer. According to the method for detecting the appearance of a wafer according to claim 9, wherein in the step of modifying the suction surface, after the wafer suction member is separated from the upper surface of the wafer, the wafer is placed on the wafer temporary release area. Dimensions and orientations to calculate the position of the robot arm in contact with the lower surface of the wafer.