CN109411396A - A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method - Google Patents

A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method Download PDF

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Publication number
CN109411396A
CN109411396A CN201811447717.5A CN201811447717A CN109411396A CN 109411396 A CN109411396 A CN 109411396A CN 201811447717 A CN201811447717 A CN 201811447717A CN 109411396 A CN109411396 A CN 109411396A
Authority
CN
China
Prior art keywords
joint robot
visual inspection
silicon wafer
piece basket
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811447717.5A
Other languages
Chinese (zh)
Inventor
张亚昆
张淳
齐风
戴超
李诺
刘琦
孙晨光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Tianjin Zhonghuan Advanced Material Technology Co Ltd
Original Assignee
Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd filed Critical Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Priority to CN201811447717.5A priority Critical patent/CN109411396A/en
Publication of CN109411396A publication Critical patent/CN109411396A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67288Monitoring of warpage, curvature, damage, defects or the like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8803Visual inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8835Adjustable illumination, e.g. software adjustable screen

Abstract

The present invention provides a kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection methods, including frame, six-joint robot, auxiliary lamp and piece basket, silicon wafer is placed in piece basket, six-joint robot, auxiliary lamp and piece basket are respectively positioned in frame, auxiliary lamp includes fluorescent lamp, strip light, major light and grating, six-joint robot is connect with frame upper bed-plate, fluorescent lamp and strip light are arranged on frame top, and it is located above piece basket, major light is fixed above piece basket, the side of major light is vertically arranged with grating, and six-joint robot is connect with six axis mouses.The present invention utilizes six-joint robot to assist visual inspection silicon chip surface quality, and using auxiliary visual inspection method, increase detection accuracy is high, time-consuming is short, can be automatically controled, reduces artificial participation, raising testing efficiency.

Description

A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method
Technical field
The invention belongs to semi-conductor silicon chip detection device fields, assist visual inspection silicon wafer more particularly, to a kind of six-joint robot Device and aided detection method.
Background technique
In semiconductor silicon single crystal manufacturing field, the manual visual inspection of silicon wafer will have a direct impact on product qualification rate.Existing test skill The shortcomings that art detection silicon chip surface quality, is that artificial visual inspection error, or even meeting maloperation can be generated.By assisting visual inspection equipment Integrated optimization, it is possible to reduce artificial visual inspection error improves the degree of automation.It can be seen that accurately and rapidly visual inspection silicon wafer is No qualification has very important application value to batch visual inspection silicon chip surface quality.
Summary of the invention
In view of this, the present invention is directed to propose a kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method, Visual inspection silicon chip surface quality is assisted using six-joint robot, using auxiliary visual inspection method, increase detection accuracy is high, time-consuming is short, can It automatically controls, reduces artificial participation, improves testing efficiency.
In order to achieve the above objectives, the technical scheme of the present invention is realized as follows:
A kind of six-joint robot auxiliary visual inspection silicon chip devices, including frame, six-joint robot, auxiliary lamp and piece basket, silicon Piece is placed in piece basket, and six-joint robot, auxiliary lamp and piece basket are respectively positioned in frame, and auxiliary lamp includes fluorescent lamp, bar shaped Lamp, major light and grating, six-joint robot are connect with frame upper bed-plate, and fluorescent lamp and strip light are arranged on frame top, and position Above piece basket, major light is fixed above piece basket, and the side of major light is vertically arranged with grating, six-joint robot and six The connection of axis mouse.Six-joint robot can make silicon wafer rotate and move along 6 freedom degrees, control silicon wafer placement position.Auxiliary lamp It observes and identifies silicon wafer, when occurring identifying deviation, manually adjust silicon wafer using six axis mouses and put, it is identified, it is real Now automatic detection.
Further, the lamp cap of major light diagonally downward, is radiated at from the silicon wafer that piece basket takes out.
Further, the lamp cap position of major light tilts down 60 °.
Further, grating model F3SJ-A0295N30, producer: Omron.
Further, fluorescent lamp model TL5-HE-14W830, producer: Philip.
Further, strip light model HX-30120-38W, brand ring are auspicious.
Further, six axis mouses include gyroscope and inertia meter.Everyone observation angle is different, automatically records its high frequency The position of appearance;Another person's observation automatically records the position of another its high frequency appearance, and the mutual switching of different angle is convenient for Everyone repetitive operation.
The present invention also provides can a kind of auxiliary visual inspection silicon chip devices auxiliary visual inspection of six-joint robot method, including walk as follows It is rapid:
Step 1: six-joint robot is moved to the piece basket station that silicon wafer is filled on right side by the position HOME, draws silicon wafer;
Step 2: six-joint robot follows six axis mouses servo-actuated, the placement position of silicon wafer is constantly regulate, by largely learning It practises, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: and then the silicon wafer got is sent to designated position respectively, when there is deviation in placement position, six-joint robot Control is transferred to artificial six axis mouse operation and control and is recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot to control automatically after manual control six-joint robot completes detection System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, underproof to be placed into unqualified basket, so recycles.
Compared with the existing technology, six-joint robot auxiliary visual inspection silicon chip devices of the present invention and aided detection method tool There is following advantage:
Six-joint robot auxiliary visual inspection silicon chip devices of the present invention and aided detection method, may be implemented silicon wafer each Visual inspection under a angle, various light efficiently avoids the drawbacks such as high, the acquisition uncertainty of artificial visual inspection error, error rate, mentions High visual inspection accuracy, reduces cost, saves the time, improves working efficiency.
Detailed description of the invention
The attached drawing for constituting a part of the invention is used to provide further understanding of the present invention, schematic reality of the invention It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram that six-joint robot described in the embodiment of the present invention assists visual inspection silicon chip devices;
Fig. 2 is the positional relationship that six-joint robot described in the embodiment of the present invention assists each section inside visual inspection silicon chip devices Schematic diagram.
Description of symbols:
1- frame;2- six-joint robot;3- fluorescent lamp;4- strip light;5- major light;6- grating;7- piece basket;Six axis mouse of 8- Mark.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase Mutually combination.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower", The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple " It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition Concrete meaning in the present invention.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figs. 1-2, a kind of six-joint robot assists visual inspection silicon chip devices, including frame 1, six-joint robot 2, auxiliary Lamps and lanterns and piece basket 7, silicon wafer are placed in piece basket 7, and six-joint robot 2, auxiliary lamp and piece basket 7 are respectively positioned in frame 1, auxiliary lamp Tool includes fluorescent lamp 3, strip light 4, major light 5 and grating 6, and six-joint robot 2 is connect with 1 upper bed-plate of frame, fluorescent lamp 3 and item The setting of shape lamp 4 is located at 7 top of piece basket on the top of frame 1, and major light 5 is fixed above piece basket 7, the side of major light 5 It is vertically arranged with grating 6, six-joint robot 2 is connect with six axis mouses 8.
The lamp cap of above-mentioned major light 5 diagonally downward, is radiated at from the silicon wafer that piece basket 7 takes out.
The lamp cap position of above-mentioned major light 5 tilts down 60 °.
Above-mentioned 6 model F3SJ-A0295N30 of grating, producer: Omron.
Above-mentioned 3 model TL5-HE-14W830 of fluorescent lamp, producer: Philip.
Above-mentioned 4 model HX-30120-38W of strip light, brand ring are auspicious.
Above-mentioned six axis mouse 8 includes gyroscope and inertia meter.
Working principle:
The following steps are included:
Step 1: six-joint robot 2 is moved to 7 station of piece basket that silicon wafer is filled on right side by the position HOME, silicon wafer is drawn;
Step 2: six-joint robot 2 follows six axis mouses 8 servo-actuated, the placement position of silicon wafer is constantly regulate, by a large amount of Study, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: the silicon wafer got then is sent to designated position respectively, and when there is deviation in placement position, six-joint robot 2 controls are transferred to artificial six axis mouse 8 to manipulate and are recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot 2 to control automatically after manual control six-joint robot 2 completes detection System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, and it is underproof to be placed into unqualified basket, so recycle.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (5)

1. a kind of six-joint robot assists visual inspection silicon chip devices, it is characterised in that: including frame (1), six-joint robot (2), auxiliary Lamps and lanterns and piece basket (7) are helped, silicon wafer is placed in piece basket (7), and six-joint robot (2), auxiliary lamp and piece basket (7) are respectively positioned on frame (1) in, auxiliary lamp includes fluorescent lamp (3), strip light (4), major light (5) and grating (6), six-joint robot (2) and frame (1) upper bed-plate connects, and fluorescent lamp (3) and strip light (4) are arranged on frame (1) top, and are located above piece basket (7), major light (5) it is fixed at piece basket (7) above, the side of major light (5) is vertically arranged with grating (6), six-joint robot (2) and six axis Mouse (8) connection.
2. six-joint robot according to claim 1 assists visual inspection silicon chip devices, it is characterised in that: the lamp of major light (5) Head tilt is downward, is radiated at from the silicon wafer that piece basket (7) take out.
3. six-joint robot according to claim 2 assists visual inspection silicon chip devices, it is characterised in that: the lamp of major light (5) Head position tilts down 60 °.
4. six-joint robot according to claim 1 assists visual inspection silicon chip devices, it is characterised in that: six axis mouses (8) packet Include gyroscope and inertia meter.
5. a kind of side using six-joint robot according to any one of claims 1-4 auxiliary visual inspection silicon chip devices auxiliary visual inspection Method, characterized by the following steps:
Step 1: six-joint robot (2) is moved to piece basket (7) station that silicon wafer is filled on right side by the position HOME, draws silicon wafer;
Step 2: six-joint robot (2) follows six axis mouses (8) servo-actuated, the placement position of silicon wafer is constantly regulate, by a large amount of Study, the high frequency position that record silicon wafer occurs, convenient for manually constantly being operated;
Step 3: and then the silicon wafer got is sent to designated position respectively, when there is deviation in placement position, six-joint robot (2) Control is transferred to artificial six axis mouse (8) to manipulate and is recorded, convenient for the automatic control of next time;
Step 4: system operatio permission transfers to six-joint robot (2) to control automatically after manual control six-joint robot (2) completes detection System;Manually press acceptance or rejection button;
Step 5: qualified product is put into qualified basket, underproof to be placed into unqualified basket, so recycles.
CN201811447717.5A 2018-11-29 2018-11-29 A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method Pending CN109411396A (en)

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CN201811447717.5A CN109411396A (en) 2018-11-29 2018-11-29 A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method

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Application Number Priority Date Filing Date Title
CN201811447717.5A CN109411396A (en) 2018-11-29 2018-11-29 A kind of six-joint robot auxiliary visual inspection silicon chip devices and aided detection method

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114408301A (en) * 2022-03-01 2022-04-29 中环领先半导体材料有限公司 Automatic packaging design method for large-diameter silicon wafer box

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330186A (en) * 1998-05-11 1999-11-30 Hitachi Ltd Wafer inspecting equipment
TW434771B (en) * 1998-11-30 2001-05-16 Nippon Kogaku Kk Appearance inspecting method and appearance inspecting device
CN101055168A (en) * 2006-04-11 2007-10-17 Aju高技术公司 Optical detection system
CN101512325A (en) * 2006-08-28 2009-08-19 爱普斯有限公司 Board appearance inspection method and device
CN201934976U (en) * 2010-12-09 2011-08-17 扬州晶新微电子有限公司 Silicon-wafer eye-examining illuminating floodlight in semiconductor silicon-integrating manufacturing technology
CN102227701A (en) * 2008-10-20 2011-10-26 莱克西普公司 Mouse with six movement axes
CN103322917A (en) * 2013-05-17 2013-09-25 湖南腾远智能设备有限公司 High-speed intelligent detector for thickness, specification and squareness of substrate
CN203417856U (en) * 2013-07-17 2014-02-05 京隆科技(苏州)有限公司 Chip sorting instrument assisted by optical projection
CN104078402A (en) * 2014-06-30 2014-10-01 武汉新芯集成电路制造有限公司 Auxiliary device for mechanical arm position adjusting
CN204470779U (en) * 2014-12-31 2015-07-15 东莞市合鼎电路有限公司 A kind of aluminium base cutting on line checkout gear
CN105424717A (en) * 2014-09-05 2016-03-23 由田新技股份有限公司 Optical detection device for detecting multiple defects
CN206410992U (en) * 2016-11-01 2017-08-15 控智(厦门)机器人科技有限公司 Omni-directional visual detection machine
TW201810471A (en) * 2016-08-17 2018-03-16 詳維科技股份有限公司 A chip appearance inspection device and method
CN209183512U (en) * 2018-11-29 2019-07-30 天津中环领先材料技术有限公司 A kind of six-joint robot auxiliary visual inspection silicon chip devices

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330186A (en) * 1998-05-11 1999-11-30 Hitachi Ltd Wafer inspecting equipment
TW434771B (en) * 1998-11-30 2001-05-16 Nippon Kogaku Kk Appearance inspecting method and appearance inspecting device
CN101055168A (en) * 2006-04-11 2007-10-17 Aju高技术公司 Optical detection system
CN101512325A (en) * 2006-08-28 2009-08-19 爱普斯有限公司 Board appearance inspection method and device
CN102227701A (en) * 2008-10-20 2011-10-26 莱克西普公司 Mouse with six movement axes
CN201934976U (en) * 2010-12-09 2011-08-17 扬州晶新微电子有限公司 Silicon-wafer eye-examining illuminating floodlight in semiconductor silicon-integrating manufacturing technology
CN103322917A (en) * 2013-05-17 2013-09-25 湖南腾远智能设备有限公司 High-speed intelligent detector for thickness, specification and squareness of substrate
CN203417856U (en) * 2013-07-17 2014-02-05 京隆科技(苏州)有限公司 Chip sorting instrument assisted by optical projection
CN104078402A (en) * 2014-06-30 2014-10-01 武汉新芯集成电路制造有限公司 Auxiliary device for mechanical arm position adjusting
CN105424717A (en) * 2014-09-05 2016-03-23 由田新技股份有限公司 Optical detection device for detecting multiple defects
CN204470779U (en) * 2014-12-31 2015-07-15 东莞市合鼎电路有限公司 A kind of aluminium base cutting on line checkout gear
TW201810471A (en) * 2016-08-17 2018-03-16 詳維科技股份有限公司 A chip appearance inspection device and method
CN206410992U (en) * 2016-11-01 2017-08-15 控智(厦门)机器人科技有限公司 Omni-directional visual detection machine
CN209183512U (en) * 2018-11-29 2019-07-30 天津中环领先材料技术有限公司 A kind of six-joint robot auxiliary visual inspection silicon chip devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114408301A (en) * 2022-03-01 2022-04-29 中环领先半导体材料有限公司 Automatic packaging design method for large-diameter silicon wafer box

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