TW201312306A - Die sorter with multiple pick-and-place nozzle structures and alignment method thereof - Google Patents

Die sorter with multiple pick-and-place nozzle structures and alignment method thereof Download PDF

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TW201312306A
TW201312306A TW100132017A TW100132017A TW201312306A TW 201312306 A TW201312306 A TW 201312306A TW 100132017 A TW100132017 A TW 100132017A TW 100132017 A TW100132017 A TW 100132017A TW 201312306 A TW201312306 A TW 201312306A
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Taiwan
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pick
module
platform
die
place
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TW100132017A
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Chinese (zh)
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TWI447543B (en
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Ching-Nan Liu
Kuei-Chih Sung
Chen-Po Chao
sheng-ming Ou
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Mpi Corp
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Priority to TW100132017A priority Critical patent/TWI447543B/en
Priority to CN201210220057.3A priority patent/CN102983090B/en
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Abstract

The present invention provides a die sorter with multiple pick-and-place nozzle structure and an alignment method thereof, which may solve the alignment problem of multiple pick-and-place nozzle structures during die sorting. The method comprises: first employing a fixed image capture module to capture the image of one pick-and-place nozzle from multiple pick-and-place nozzle structures and transmitting the position records to a setup processing unit; using the setup processing unit to set a first position center; and then rotating another pick-and-place nozzle for image capture by the fixed image capture module and using the setup processing unit to set a second position center; the present invention may utilize the first position center and the second position center to provide a position reference for placing or picking dies from the die pick-and-place platform, so as to solve the alignment problem of the multiple pick-and-place nozzle structures of the prior art occurred during to-and-fro rotating displacement due to structural asymmetry.

Description

具有多取放嘴結構的晶粒挑揀機及其對位方法Die picker with multi-drop nozzle structure and alignment method thereof

本發明係有關一種晶粒挑揀機,尤指一種具有多取放嘴結構的晶粒挑揀機及其對位方法。The invention relates to a grain picker, in particular to a grain picker with a multi-drop nozzle structure and a aligning method thereof.

隨著發光二極體之發展,不同亮度的控制以及波長變化已越見多樣化,而在依據晶粒的亮度以及波長的分類上也由原本的十多種分類一直到現在有200多種分類。因此,晶粒的挑揀分類速度便直接影響到生產的速度。請參閱「圖1」所示,其係為一習知技術的晶粒挑揀結構,其利用一挑揀臂1結構於一取晶平台2上進行晶粒4之分類擷取,並透過旋轉而轉放於一置晶平台3上。為了準確地進行晶粒4之拿取與置放,必須透過一攝像單元5進行挑揀臂1上之一吸嘴6的定位,從而可以對位後的吸嘴6位置為中心點,進行取晶平台2以及置晶平台3之位移參考,讓該挑揀臂1進行精準的晶粒4取放。With the development of light-emitting diodes, the control of different brightness and the wavelength change have become more diversified, and there are more than 200 classifications from the original classification of more than a dozen types according to the brightness and wavelength of the crystal grains. Therefore, the sorting speed of the grain directly affects the speed of production. Please refer to FIG. 1 , which is a prior art die picking structure. The picking arm 1 is configured to perform the sorting of the crystal grains 4 on a crystal pulling platform 2 and rotate through the rotation. Placed on a crystal platform 3. In order to accurately take and place the die 4, the positioning of one of the nozzles 6 on the picking arm 1 must be performed through an image pickup unit 5, so that the position of the nozzle 6 after the alignment can be centered and crystallized. The displacement reference of the platform 2 and the crystallizing platform 3 allows the picking arm 1 to perform precise grain picking and discharging.

在晶粒挑揀作業之前,必須先進行儀器位置的定位校準,在此以取晶平台2之定位順序舉例,並說明如下:Before the die picking operation, the positioning and calibration of the instrument position must be performed. Here, the positioning sequence of the crystal pulling platform 2 is taken as an example, and the following is explained:

一、將吸嘴調整至視覺中心:將吸嘴6移動到該取晶平台2上,並移動攝像單元5直到該吸嘴6之尖端位置對應到該攝像單元5的視覺中心,一般來說,因為吸嘴6為精密儀器,不太適合進行位移距離的調整,而改以調整攝像單元5的視覺中心至該吸嘴6的位置。1. Adjusting the nozzle to the visual center: moving the nozzle 6 to the crystal pulling platform 2, and moving the camera unit 5 until the tip position of the nozzle 6 corresponds to the visual center of the camera unit 5, in general, Since the suction nozzle 6 is a precision instrument, it is not suitable for adjusting the displacement distance, and instead, the visual center of the imaging unit 5 is adjusted to the position of the suction nozzle 6.

二、將吸嘴6移開。Second, remove the nozzle 6 away.

三、將頂針7位置調整至視覺中心:需先說明的是,頂針7設置於該取晶平台2的下方,用以將晶粒4頂出供吸嘴6揀取,而於本步驟中,係以手動的方式進行頂針7位置的調整,將頂針7調整至該攝像單元5的視覺中心,藉此完成三心(吸嘴6、攝像單元5及頂針7)調整。3. Adjusting the position of the ejector pin 7 to the visual center: It should be noted that the ejector pin 7 is disposed below the crystal pulling platform 2 for ejecting the die 4 for picking up the nozzle 6, and in this step, The position of the thimble 7 is adjusted manually, and the ejector pin 7 is adjusted to the visual center of the imaging unit 5, thereby completing the adjustment of the three cores (the nozzle 6, the imaging unit 5, and the thimble 7).

而為了加快晶粒4取放的速度,雙吸嘴6結構便因應而生,請參閱「圖2」所示,其係藉由相對設立於轉軸中心的兩挑揀臂1而分別於該取晶平台2以及置晶平台3進行晶粒4的取放。但由於該挑揀臂1上之結構較為複雜且會有些微的不對稱,兩挑揀臂1上之吸嘴6分別旋轉至同一平台時並無法恰好定位於同一點上,晶粒4之體積小,些微的誤差就會造成晶粒4取放時的不精準而有晶粒4掉落或者置放時相互碰觸而損毀之可能,造成晶粒4之毀損。In order to speed up the pick-and-place of the die 4, the structure of the double-nozzle 6 is generated accordingly, as shown in Fig. 2, which is respectively obtained by the two picking arms 1 which are opposite to the center of the rotating shaft. The platform 2 and the crystallizing platform 3 perform pick and place of the crystal grains 4. However, since the structure on the picking arm 1 is relatively complicated and slightly asymmetrical, the nozzles 6 on the two picking arms 1 cannot be positioned at the same point when rotated to the same platform, and the volume of the crystal grains 4 is small. A slight error will cause inaccuracies in the pick-and-place of the die 4, and the die 4 may fall or be damaged when placed, causing damage to the die 4.

為了解決上述問題,有業者於其中一邊的挑揀臂1上設置調整機構(未圖示),藉由調整單邊的挑揀臂1長度而使兩邊的挑揀臂1的吸嘴於旋轉至同一平台時能定在同一定位點上,但額外的調整機構會增加挑揀臂1的重量,造成結構剛性上的缺陷,並且因必須透過人工進行調整,調整所耗費時間長,且人工調整不僅有工作危險的問題,也可能因為人工調整之誤觸而破壞了周邊的機械結構。In order to solve the above problem, an operator provides an adjustment mechanism (not shown) on one of the picking arms 1 to adjust the length of the single-side picking arm 1 so that the nozzles of the picking arms 1 on both sides are rotated to the same platform. Can be set at the same positioning point, but the additional adjustment mechanism will increase the weight of the picking arm 1, causing structural rigidity defects, and because it has to be adjusted manually, the adjustment takes a long time, and the manual adjustment is not only dangerous to work. The problem may also damage the surrounding mechanical structure due to the accidental touch of manual adjustment.

本發明之主要目的,在於解決雙挑揀臂結構不對稱而造成晶粒取放不準確的問題。The main object of the present invention is to solve the problem that the structure of the double picking arm is asymmetrical and the grain picking and unloading is inaccurate.

為達上述目的,本發明提供一種具有多取放嘴結構的晶粒挑揀機,其包含有一晶粒取置平台、一取放結構、一固定式影像擷取模組以及一設定處理單元。該晶粒取置平台具有一位移模組以及一晶粒置放部,該位移模組與該晶粒置放部連接,控制該晶粒置放部之活動位移。該取放結構與一座體固定連接設置,並具有一旋轉中心模組、至少二取放臂以及至少二取放嘴,該至少二取放臂係與該旋轉中心模組連接並以該旋轉中心模組為圓心相對設置,該至少二取放嘴分別設置但不限於該至少二取放臂遠離該旋轉中心模組之端點,且該至少二取放嘴藉由該旋轉中心模組旋轉至該晶粒取置平台對應該晶粒置放部之位置。To achieve the above objective, the present invention provides a die picker having a multi-drop nozzle structure, comprising a die pick-up platform, a pick-and-place structure, a fixed image capture module, and a setting processing unit. The die access platform has a displacement module and a die placement portion. The displacement module is coupled to the die placement portion to control the movable displacement of the die placement portion. The pick-and-place structure is fixedly connected to the body, and has a rotating center module, at least two picking arms and at least two picking nozzles, and the at least two picking and lowering arms are connected to the rotating center module and the rotating center The module is disposed opposite to the center of the circle, and the at least two nozzles are respectively disposed, but are not limited to, the at least two picking arms are away from the end of the rotating center module, and the at least two picking nozzles are rotated by the rotating center module to The die attaching platform corresponds to the position of the die placement portion.

該固定式影像擷取模組與該座體固定連接設置,設置於該晶粒取置平台之上方。該設定處理單元與該固定式影像擷取模組及該晶粒取置平台連接,該設定處理單元接收該固定式影像擷取模組之影像以對該至少二取放嘴進行位置紀錄,並藉由位置記錄控制該晶粒取置平台之位移。The fixed image capturing module is fixedly connected to the base and disposed above the die-receiving platform. The setting processing unit is connected to the fixed image capturing module and the die removing platform, and the setting processing unit receives the image of the fixed image capturing module to perform position recording on the at least two picking nozzles, and The displacement of the die extraction platform is controlled by position recording.

除此之外,本發明更提供一種具有多取放嘴結構的晶粒挑揀機之對位方法,其包含有下列步驟:In addition, the present invention further provides a method for aligning a die picker having a multi-drop nozzle structure, which comprises the following steps:

S1:第一取放嘴之定位設定,將該第一取放嘴藉由一旋轉中心模組旋轉至一晶粒取置平台上的晶粒置放部,且透過一固定式影像擷取模組取得一第一中心位置。S1: positioning setting of the first pick-and-place nozzle, rotating the first pick-and-place nozzle by a rotating center module to a die placement portion on a die-receiving platform, and transmitting through a fixed image capturing mode The group gets a first central location.

S2:第二取放嘴之定位設定,將該第二取放嘴藉由該旋轉中心模組旋轉至該晶粒取置平台上的晶粒置放部,且透過該固定式影像擷取模組取得一第二中心位置。S2: a positioning setting of the second pick-and-place nozzle, the second pick-and-place nozzle is rotated by the rotating center module to a die placement portion on the die-receiving platform, and the fixed image capturing mode is transmitted through the fixed image capturing module The group gets a second central location.

S3:中心點補償,該固定式影像擷取模組將該第一中心位置及該第二中心位置傳送至一設定處理單元進行記錄,並進行位置補償。S3: Center point compensation, the fixed image capturing module transmits the first center position and the second center position to a setting processing unit for recording, and performs position compensation.

S4:完成位置調校並進行挑揀,藉由該設定處理單元之位置補償,控制該晶粒取置平台的一位移模組調整一晶粒置放部之位置,以對應該第一中心位置及該第二中心位置,供該第一取放嘴及該第二取放嘴進行取放作業。S4: performing position adjustment and picking, and by using the position compensation of the setting processing unit, controlling a displacement module of the die-receiving platform to adjust a position of a die placement portion to correspond to the first center position and The second center position is for the first pick-and-place nozzle and the second pick-and-place nozzle to perform pick-and-place operations.

由上述說明可知,該固定式影像擷取模組及該取放結構係與該座體固定設置,因而可使該固定式影像擷取模組作為一校準定位的定位參考點,並藉由該設定處理單元對該至少二取放嘴之位置進行中心位置的記錄並調校,利用該至少二取放嘴之中心位置而可供該晶粒取置平台作為移動之依據,並分別於該至少兩取放嘴移動至該晶粒取置平台時,根據其各別之中心位置而進行移動對位。因而有效解決習知技術中之多取放嘴結構因些微誤差造成的取放誤差。As can be seen from the above description, the fixed image capturing module and the pick-and-place structure are fixedly disposed with the base, so that the fixed image capturing module can be used as a positioning reference point for calibration positioning, and The setting processing unit records and adjusts the central position of the position of the at least two nozzles, and the center position of the at least two nozzles is used for the die access platform as a basis for movement, and at least When the two pick-up nozzles move to the die-receiving platform, the mobile alignment is performed according to their respective center positions. Therefore, the pick-and-place error caused by the slight error of the multi-nozzle structure in the prior art is effectively solved.

有關本發明之詳細說明及技術內容,現就配合圖式說明如下:The detailed description and technical contents of the present invention will now be described as follows:

請參閱「圖3」及「圖4」所示,其係分別為本發明一較佳實施例之立體結構及方塊配置示意圖,需特別說明的是,「圖4」僅為具有電性連接之方塊的配置示意,目的在於揭露調校的功能方塊,因而並未顯示所有結構。如圖所示:本發明係為一種具有多取放嘴結構的晶粒挑揀機,其包含有一晶粒取置平台10、一取放結構20、一固定式影像擷取模組30以及一設定處理單元40。該晶粒取置平台10具有一位移模組111、121以及一晶粒置放部112、122,該位移模組111、121分別與該晶粒置放部112、122連接,控制該晶粒置放部112、122之活動位移。而於本實施例中,該晶粒取置平台10具有兩個,分別為一取晶平台11及一置晶平台12,該取晶平台11上之該晶粒置放部112係為框體結構而具有一窗口112a,且該取晶平台11具有一頂針模組113,而該頂針模組113設置於該窗口112a的下方,更詳細的說明,該窗口112a係用以設置一芯片(圖未示),芯片上係設置有複數待挑揀的晶粒,而該頂針模組113係設置於該芯片的正下方並對準取放嘴23,該頂針模組113用以頂出芯片上的晶粒,而讓該取放嘴23揀取該芯片上的晶粒,而需特別注意的是,該頂針模組113透過一位移構件(圖未示)與該設定處理單元40連接,該設定處理單元40藉由該位移構件控制該頂針模組113之位移。Please refer to FIG. 3 and FIG. 4, which are schematic views of a three-dimensional structure and a block configuration of a preferred embodiment of the present invention. It should be particularly noted that "FIG. 4" is only electrically connected. The configuration of the block is intended to reveal the functional blocks of the tuning and thus does not show all the structures. As shown in the figure: the present invention is a die picker having a multi-drop nozzle structure, comprising a die picking platform 10, a pick-and-place structure 20, a fixed image capturing module 30, and a setting Processing unit 40. The die-receiving platform 10 has a displacement module 111, 121 and a die placement portion 112, 122. The displacement modules 111, 121 are respectively connected to the die placement portions 112, 122 to control the die. The active displacement of the placement portions 112, 122. In this embodiment, the die attaching platform 10 has two, respectively, a crystal pulling platform 11 and a crystallizing platform 12, and the die placing portion 112 on the crystal pulling platform 11 is a frame. The structure has a window 112a, and the crystal pulling platform 11 has a thimble module 113, and the ejector module 113 is disposed under the window 112a. In more detail, the window 112a is used to set a chip (Fig. Not shown, the chip is provided with a plurality of dies to be picked, and the thimble module 113 is disposed directly under the chip and aligned with the pick and place nozzle 23, and the thimble module 113 is used to eject the chip. And the ejector module 113 is connected to the setting processing unit 40 through a displacement member (not shown). The setting is made by the ejector module 113. The processing unit 40 controls the displacement of the thimble module 113 by the displacement member.

該取放結構20與一座體50固定連接設置,並具有一旋轉中心模組21、至少二取放臂22以及至少二取放嘴23,該至少二取放臂22係與該旋轉中心模組21連接並以該旋轉中心模組21為圓心相對設置,該至少二取放嘴23分別設置但不限於該至少二取放臂22遠離該旋轉中心模組21之端點,且透過該旋轉中心模組21之旋轉讓該至少二取放嘴23移動至該晶粒取置平台10對應該晶粒置放部112、122之位置。而如「圖3」中所示,該取晶平台11與該置晶平台12對應該至少二取放嘴23之位置並分別設置於該旋轉中心模組21的兩側,該頂針模組113之移動範圍對應該至少二取放嘴23,詳細的說明,該至少二取放嘴23依序於該取晶平台11上之晶粒置放部112進行晶粒之揀取,該頂針模組113係由該晶粒置放部112的另一側配合取放嘴23,而讓晶粒較容易被拿取。The pick-and-place structure 20 is fixedly connected to the body 50, and has a rotating center module 21, at least two pick-up arms 22, and at least two pick-and-place nozzles 23, and the at least two pick-up arms 22 are coupled to the rotating center module. 21 is connected and disposed opposite to the center of the rotation center module 21, and the at least two nozzles 23 are respectively disposed, but not limited to, the end points of the at least two pick-up arms 22 away from the rotation center module 21, and through the rotation center The rotation of the module 21 causes the at least two pick-and-place nozzles 23 to move to the position of the die-receiving platform 10 corresponding to the die placement portions 112, 122. As shown in FIG. 3, the crystal pulling platform 11 and the crystallizing platform 12 correspond to at least two positions of the nozzles 23 and are respectively disposed on two sides of the rotating center module 21. The thimble module 113 The moving range is corresponding to at least two nozzles 23. In detail, the at least two nozzles 23 sequentially pick the die from the die placement portion 112 on the crystal pulling platform 11, and the thimble module The 113 is fitted with the nozzle 23 by the other side of the die placing portion 112, so that the crystal grains are more easily taken.

而該固定式影像擷取模組30也與該座體50固定連接,並設置於該晶粒取置平台10之上方,且該固定式影像擷取模組30對應該窗口112a之位置,於本實施例中,該固定式影像擷取模組30具有兩個,分別對應該取晶平台11以及該置晶平台12。The fixed image capturing module 30 is also fixedly connected to the base 50 and disposed above the die access platform 10, and the fixed image capturing module 30 corresponds to the position of the window 112a. In this embodiment, the fixed image capturing module 30 has two, respectively corresponding to the crystal pulling platform 11 and the crystallizing platform 12.

該設定處理單元40與該固定式影像擷取模組30以及該晶粒取置平台10連接,更詳細的說明,該設定處理單元40可為一電腦系統,該設定處理單元40係與該晶粒取置平台10上之位移模組111、121連接,除了以直接連接之外,也可以透過網路或無線連線的方式進行資料的連結以及傳輸。該設定處理單元40接收該固定式影像擷取模組30之影像以對該至少二取放嘴23進行位置紀錄,並由該旋轉中心模組21輸出之訊號辨別不同之取放嘴23,且藉由位置記錄控制該晶粒取置平台10中之位移模組111、121之位移,需特別說明的是,於該取晶平台11一端,該設定處理單元40控制該頂針模組113之位移,因而可依序配合該至少二取放嘴23之拿取位置而進行對應的移動,換句話說,該至少二取放嘴23位移至該取晶平台11上之位置會不一樣,而透過該設定處理單元40控制該頂針模組113位移,而可分別於該至少二取放嘴23移動到該取晶平台11時進行對應的位置移動,並頂出晶粒以讓該至少二取放嘴23進行挑揀。需額外說明的是,本實施例及圖式僅以兩組取放嘴23進行說明,實際上係依實際使用狀況可進行取放嘴23之增加,而該頂針模組113會依序配合每一個取放嘴23之位置進行對應位移。The setting processing unit 40 is connected to the fixed image capturing module 30 and the die access platform 10. In more detail, the setting processing unit 40 can be a computer system, and the setting processing unit 40 is connected to the crystal. The displacement modules 111 and 121 on the granule handling platform 10 are connected, and in addition to the direct connection, the data can be connected and transmitted through the network or wireless connection. The setting processing unit 40 receives the image of the fixed image capturing module 30 to record the position of the at least two pick-and-place nozzles 23, and distinguishes the different pick-and-place nozzles 23 by the signal output by the rotating center module 21, and The displacement of the displacement modules 111 and 121 in the die-receiving platform 10 is controlled by the position recording. Specifically, at one end of the crystal-receiving platform 11, the setting processing unit 40 controls the displacement of the ejector module 113. Therefore, the corresponding movement of the at least two pick-up nozzles 23 can be performed in sequence, in other words, the position of the at least two pick-up nozzles 23 displaced to the crystal-plating platform 11 is different, and the The setting processing unit 40 controls the displacement of the ejector module 113, and respectively performs corresponding positional movement when the at least two pick-and-place nozzles 23 move to the crystal pulling platform 11, and ejects the die to allow the at least two pick and place. The mouth 23 is picked. It should be noted that the embodiment and the drawing are only described by the two sets of the nozzles 23, in fact, the addition of the nozzle 23 can be performed according to the actual use condition, and the thimble module 113 will be matched with each step. A position of a pick-and-place nozzle 23 is correspondingly displaced.

請配合參閱「圖5A」至「圖5D」以及「圖6」所示,「圖5A」至「圖5D」分別為本發明一較佳實施例之調校流程示意圖,而「圖6」係為本發明一較佳實施例之步驟流程示意圖,如圖所示:本發明更揭露了一種具有多取放嘴結構的晶粒挑揀機之對位方法,而需先行說明的是,於本實施例中,其係以晶粒取置平台10上的取晶平台11上的操作進行說明,並包含有下列步驟:Please refer to "FIG. 5A" to "FIG. 5D" and "FIG. 6", and FIG. 5A to FIG. 5D are respectively schematic diagrams of the calibration process according to a preferred embodiment of the present invention, and FIG. 6 is a schematic diagram of the calibration process. The flow chart of the steps of a preferred embodiment of the present invention is as shown in the figure. The present invention further discloses a method for aligning a die picker having a multi-drop nozzle structure, which needs to be described first. In the example, the operation is performed on the crystal pulling platform 11 on the die-receiving platform 10, and the following steps are included:

S1:一第一取放嘴231之定位設定,將該第一取放嘴231藉由旋轉中心模組21旋轉至取晶平台11上的晶粒置放部112,而於一與該固定式影像擷取模組30連接的螢幕(如圖5A)上可以看到該第一取放嘴231之位置,將該第一取放嘴231之位置定義為第一中心位置60,而為了讓該設定處理單元40得知第一中心位置60,其係以滑鼠操控並點觸螢幕中該第一中心位置60的地方,以讓該設定處理單元40取得該第一中心位置60的詳細座標,而該第一取放嘴231係為該至少二取放嘴23之其中之一。S1: a positioning setting of the first pick-and-place nozzle 231, the first pick-and-place nozzle 231 is rotated by the rotating center module 21 to the die placing portion 112 on the crystal pulling platform 11, and The position of the first pick-and-place nozzle 231 can be seen on the screen connected to the image capturing module 30 (as shown in FIG. 5A), and the position of the first pick-and-place nozzle 231 is defined as the first center position 60, and The setting processing unit 40 knows the first central position 60, which is controlled by the mouse and touches the first central position 60 of the screen, so that the setting processing unit 40 obtains the detailed coordinates of the first central position 60. The first pick-and-place nozzle 231 is one of the at least two pick-and-place nozzles 23.

S1A:頂針模組113之第一調校,於取晶平台11一側,必須要對該頂針模組113進行調校作業,於取得該第一中心位置60後,必須先移開該第一取放嘴231,以避免該第一取放嘴231阻擋到由該固定式影像擷取模組30觀看到該頂針模組113的視線,接著將該頂針模組113移動至該第一中心位置60進行調校對應,並藉此記錄該頂針模組113的移動距離,以便下次位移到達同樣的位置。S1A: The first adjustment of the thimble module 113, on the side of the crystal pulling platform 11, the thimble module 113 must be calibrated. After the first central position 60 is obtained, the first must be removed first. The nozzle 231 is removed to prevent the first pick-and-place nozzle 231 from blocking the line of sight of the thimble module 113 viewed by the fixed image capturing module 30, and then the thimble module 113 is moved to the first center position. 60 adjusts the correspondence, and thereby records the moving distance of the thimble module 113 so that the next displacement reaches the same position.

S2:一第二取放嘴232之定位設定,該第二取放嘴231亦同樣為該至少二取放嘴23之其中之一,其係將該第二取放嘴232藉由該旋轉中心模組21旋轉至該取晶平台11上的晶粒置放部112,同樣的,也藉由螢幕(如圖5C)上可以看到該第二取放嘴232之位置,並將該第二取放嘴232之位置定義為第二中心位置61,接著以滑鼠操控並點觸螢幕中該第二中心位置61的地方,以讓該設定處理單元40取得該第二中心位置61的詳細座標,而於本實施例中,該第一取放嘴231與該第二取放嘴232係以180度相對設置於一直線上。S2: positioning setting of a second pick-and-place nozzle 232, the second pick-and-place nozzle 231 is also one of the at least two pick-and-place nozzles 23, and the second pick-and-place nozzle 232 is used by the center of rotation The module 21 is rotated to the die placement portion 112 on the crystal pulling platform 11. Similarly, the position of the second pick-and-place nozzle 232 can be seen by the screen (as shown in FIG. 5C), and the second The position of the pick and place mouth 232 is defined as a second center position 61, and then the mouse is used to control and touch the second center position 61 of the screen to allow the setting processing unit 40 to obtain the detailed coordinates of the second center position 61. In the embodiment, the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 are disposed on the straight line at 180 degrees.

S2A:頂針模組113之第二調校,於取得該第二中心位置61後,於取晶平台11一側,必須要進行頂針模組113之調校作業,同樣的也必須先將該第二取放嘴232移開,避免阻擋視線,接著將該頂針模組113移動至該第二中心位置61進行調校對應,並藉此記錄該頂針模組113的移動距離,以便下次位移到達同樣的位置。S2A: The second adjustment of the thimble module 113, after obtaining the second center position 61, on the side of the crystal pulling platform 11, the adjustment of the thimble module 113 must be performed, and the same must be performed first. The two take-off nozzles 232 are removed to avoid blocking the line of sight, and then the thimble module 113 is moved to the second center position 61 for adjustment, and the moving distance of the thimble module 113 is recorded to be used for the next displacement. The same location.

S3:中心點補償,該固定式影像擷取模組30將該第一中心位置60及該第二中心位置61的位置資訊傳送至一設定處理單元40進行記錄,並進行位置補償,而更進一步的說明,該設定處理單元40係以軟體補償的方式,進行該第一中心位置60及該第二中心位置61的位置補償。S3: center point compensation, the fixed image capturing module 30 transmits the position information of the first center position 60 and the second center position 61 to a setting processing unit 40 for recording, and performs position compensation, and further In the description, the setting processing unit 40 performs position compensation of the first center position 60 and the second center position 61 in a software compensation manner.

S4:完成位置調校並進行挑揀,藉由上述步驟完成準心之校準,並利用該設定處理單元40之位置補償,控制該晶粒取置平台10的一位移模組111、121分別調整一晶粒置放部112、122之位置,以對應該第一中心位置60及該第二中心位置61,供該第一取放嘴231及該第二取放嘴232進行取放作業,而該頂針模組113也必須在該第一取放嘴231移動至該第一中心位置60時,同時移到該第一中心位置60,並頂出晶粒讓該第一取放嘴231進行揀取,而當該第二取放嘴232移動到該第二中心位置61時,該頂針模組113也必須同時移動到該第二中心位置61,並頂出晶粒讓該第二取放嘴232進行挑揀。S4: Performing the position adjustment and performing the picking, and completing the alignment of the alignment by the above steps, and using the position compensation of the setting processing unit 40, controlling a displacement module 111, 121 of the die access platform 10 to adjust one Positioning the die placing portions 112, 122 to correspond to the first center position 60 and the second center position 61 for the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 to perform pick and place operations, and The thimble module 113 must also move to the first central position 60 while the first pick-and-place nozzle 231 is moved to the first central position 60, and eject the die to pick the first pick-and-place nozzle 231. When the second pick-and-place nozzle 232 moves to the second center position 61, the thimble module 113 must also move to the second center position 61 at the same time, and the die is ejected for the second pick-and-place nozzle 232. Pick it up.

需說明的是,上述實施方式之頂針機構113的第一調校並不需要緊接在步驟S1後,而可於該第一取放嘴231及該第二取放嘴232都完成定位設定後再進行,並且該頂針模組113係透過該位移構件而與該設定處理單元40連接,進而可自動且快速的進行位移的調整。另需注意的是,上述步驟僅說明二取放嘴23之調校步驟,若取放嘴23之數目多於兩個,可依步驟S2及S2A的方式進行多取放嘴23之位置調校,並供該設定處理單元40進行多取放嘴位置的中心點補償。而於置晶平台12之操作上,因為其不需要頂針機構113的設置,因而可省略步驟S1A及步驟S2A。It should be noted that the first adjustment of the ejector mechanism 113 of the above embodiment does not need to be immediately after the step S1, but after the positioning of the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 is completed. Further, the thimble module 113 is connected to the setting processing unit 40 through the displacement member, so that the displacement can be automatically and quickly adjusted. It should be noted that the above steps only explain the adjustment steps of the two nozzles 23. If the number of the nozzles 23 is more than two, the position adjustment of the plurality of nozzles 23 can be performed according to the steps S2 and S2A. And the setting processing unit 40 performs center point compensation of the position of the multi-take nozzle. On the other hand, in the operation of the crystallizing platform 12, since the setting of the ejector mechanism 113 is not required, the steps S1A and S2A can be omitted.

而該頂針模組113係用以配合該第一取放嘴231以及該第二取放嘴232進行晶粒的挑揀,其配合移動方式係請配合參閱「圖7」並說明如下:該第一取放嘴231以及該第二取放嘴232因為與該旋轉中心模組21連接結構上的些微差異,因而在進行旋轉位移時分別具有一第一軌跡70以及一第二軌跡80,而該第一軌跡70與該第二軌跡80不會重疊,且該第一取放嘴231以及該第二取放嘴232會分別位於該第一軌跡70以及該第二軌跡80上的該第一中心位置60以及該第二中心位置61停下,以進行晶粒的挑揀。該頂針模組113分別利用一X軸向91與一Y軸向92之位移而移動至該第一中心位置60以及該第二中心位置61,以分別配合該第一取放嘴231以及該第二取放嘴232進行晶粒的挑揀,其中該X軸向91與該Y軸向92相互垂直。The ejector module 113 is configured to cooperate with the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 for picking up the crystal grains. For the movement mode, please refer to FIG. 7 and explain as follows: The pick-and-place nozzle 231 and the second pick-and-place nozzle 232 have a slight difference in the connection structure with the rotation center module 21, and thus have a first track 70 and a second track 80 when performing rotational displacement, respectively. A track 70 and the second track 80 do not overlap, and the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 are respectively located at the first center position on the first track 70 and the second track 80. 60 and the second center position 61 are stopped for picking of the crystal grains. The thimble module 113 is moved to the first central position 60 and the second central position 61 by displacement of an X-axis 91 and a Y-axis 92, respectively, to respectively engage the first pick-and-place nozzle 231 and the first The two pick-and-place nozzles 232 perform picking of the crystal grains, wherein the X-axis 91 and the Y-axis 92 are perpendicular to each other.

另請配合參閱「圖8」所示,除了利用X軸向91以及Y軸向92雙向移動的方式進行位移至該第一中心位置60以及該第二中心位置61之外,亦可控制該第一中心位置60以及該第二中心位置61於相同的X軸向91線上。藉此,該頂針模組113僅需要進行X軸向91的平移即可分別移動至該第一中心位置60以及該第二中心位置61而於不同的時間點對應該第一取放嘴231以及該第二取放嘴232。Please also refer to FIG. 8 for controlling the displacement of the first central position 60 and the second central position 61 by means of bidirectional movement of the X-axis 91 and the Y-axis 92. A center position 60 and the second center position 61 are on the same X-axis 91 line. Therefore, the ejector module 113 only needs to perform the translation of the X-axis 91 to move to the first central position 60 and the second central position 61 respectively, and corresponds to the first pick-and-place nozzle 231 at different time points. The second pick and place nozzle 232.

再者,請配合參閱「圖9」所示之第三種實施例,其係控制該第一中心位置60以及該第二中心位置61於相同的Y軸向92線上。藉此,該頂針模組113僅需要進行Y軸向92的平移即可分別移動至該第一中心位置60以及該第二中心位置61而於不同的時間點對應該第一取放嘴231以及該第二取放嘴232。藉由上述三種頂針模組113移動的實施方式,而可對應該第一取放嘴231以及該第二取放嘴232之晶粒挑揀。Furthermore, please refer to the third embodiment shown in FIG. 9 for controlling the first central position 60 and the second central position 61 on the same Y-axis 92 line. Therefore, the thimble module 113 only needs to perform the translation of the Y-axis 92 to move to the first central position 60 and the second central position 61 respectively, and corresponds to the first pick-and-place nozzle 231 at different time points. The second pick and place nozzle 232. The die of the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 can be picked up by the above-described three thimble module 113 moving embodiments.

綜上所述,本發明利用該固定式影像擷取模組30及該取放結構20係與該座體50固定設置,因而可使該固定式影像擷取模組30作為一校準定位的定位參考點,並藉由該設定處理單元40對該至少二取放嘴23之位置進行中心位置的記錄並調校,利用該至少二取放嘴23之中心位置而可供該晶粒取置平台10作為移動之依據,並分別於該至少兩取放嘴23移動至該晶粒取置平台10時,根據其各別之中心位置而進行移動對位。而特別於取晶平台11上,該頂針模組113利用位移構件而可自動且快速的配合該第一取放嘴231以及第二取放嘴232進行第一中心位置60及第二中心位置61的來回位移,因而有效解決習知技術中之雙取放嘴23結構因些微誤差造成的取放誤差。因此本發明極具進步性及符合申請發明專利之要件,爰依法提出申請,祈 鈞局早日賜准專利,實感德便。In summary, the fixed image capturing module 30 and the pick-and-place structure 20 are fixedly disposed with the base 50, so that the fixed image capturing module 30 can be positioned as a calibration positioning. Referring to the point, and by the setting processing unit 40, the position of the at least two pick-and-place nozzles 23 is recorded and adjusted at the center position, and the center position of the at least two pick-and-place nozzles 23 is used for the die-receiving platform. 10 is used as a basis for the movement, and when the at least two pick-and-place nozzles 23 are moved to the die-receiving platform 10, respectively, the mobile alignment is performed according to their respective center positions. In particular, the ejector module 113 can automatically and quickly cooperate with the first pick-and-place nozzle 231 and the second pick-and-place nozzle 232 to perform the first center position 60 and the second center position 61 by using the displacement member 11 . The back and forth displacement thus effectively solves the pick and place error caused by slight errors in the structure of the double pick and place nozzle 23 in the prior art. Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent application, and the application is filed according to law, and the praying office grants the patent as soon as possible.

以上已將本發明做一詳細說明,惟以上所述者,僅爲本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

習知技術Conventional technology

1...挑揀臂1. . . Picking arm

2...取晶平台2. . . Crystal platform

3...置晶平台3. . . Crystal platform

4...晶粒4. . . Grain

5...攝像單元5. . . Camera unit

6...吸嘴6. . . Nozzle

7...頂針7. . . thimble

本發明this invention

10...晶粒取置平台10. . . Grain acquisition platform

11...取晶平台11. . . Crystal platform

111...位移模組111. . . Displacement module

112...晶粒置放部112. . . Grain placement

112a...窗口112a. . . window

113...頂針模組113. . . Thimble module

12...置晶平台12. . . Crystal platform

121...位移模組121. . . Displacement module

122...晶粒置放部122. . . Grain placement

20...取放結構20. . . Pick and place structure

21...旋轉中心模組twenty one. . . Rotary center module

22...取放臂twenty two. . . Pick and place arm

23...取放嘴twenty three. . . Take the mouth

231...第一取放嘴231. . . First pick and place

232...第二取放嘴232. . . Second pick and place

30...固定式影像擷取模組30. . . Fixed image capture module

40...設定處理單元40. . . Setting processing unit

50...座體50. . . Seat

60...第一中心位置60. . . First central location

61...第二中心位置61. . . Second central location

70...第一軌跡70. . . First track

80...第二軌跡80. . . Second track

91...X軸向91. . . X axis

92...Y軸向92. . . Y axis

S1、S1A、S2、S2A、S3、S4...步驟S1, S1A, S2, S2A, S3, S4. . . step

圖1,係習知技術的晶粒挑揀結構立體示意圖。Figure 1 is a perspective view of a conventional grain picking structure.

圖2,係另一習知技術的晶粒挑揀結構立體示意圖。FIG. 2 is a perspective view showing another conventional crystal picking structure.

圖3,係本發明一較佳實施例之立體結構示意圖。Figure 3 is a perspective view of a preferred embodiment of the present invention.

圖4,係本發明一較佳實施例之方塊配置示意圖。4 is a block diagram showing a configuration of a preferred embodiment of the present invention.

圖5A,係本發明一較佳實施例之調校流程示意圖一。FIG. 5A is a schematic diagram 1 of a calibration process according to a preferred embodiment of the present invention.

圖5B,係本發明一較佳實施例之調校流程示意圖二。FIG. 5B is a second schematic diagram of a calibration process according to a preferred embodiment of the present invention.

圖5C,係本發明一較佳實施例之調校流程示意圖三。FIG. 5C is a third schematic diagram of a calibration process according to a preferred embodiment of the present invention.

圖5D,係本發明一較佳實施例之調校流程示意圖四。FIG. 5D is a schematic diagram 4 of a calibration process according to a preferred embodiment of the present invention.

圖6,係本發明一較佳實施例之步驟流程示意圖。Figure 6 is a flow chart showing the steps of a preferred embodiment of the present invention.

圖7,係本發明第一實施例之頂針位移示意圖。Fig. 7 is a schematic view showing the displacement of the thimble according to the first embodiment of the present invention.

圖8,係本發明第二實施例之頂針位移示意圖。Figure 8 is a schematic view showing the displacement of the thimble of the second embodiment of the present invention.

圖9,係本發明第三實施例之頂針位移示意圖。Figure 9 is a schematic view showing the displacement of the thimble of the third embodiment of the present invention.

10...晶粒取置平台10. . . Grain acquisition platform

11...取晶平台11. . . Crystal platform

111...位移模組111. . . Displacement module

112...晶粒置放部112. . . Grain placement

112a...窗口112a. . . window

113...頂針模組113. . . Thimble module

12...置晶平台12. . . Crystal platform

121...位移模組121. . . Displacement module

122...晶粒置放部122. . . Grain placement

20...取放結構20. . . Pick and place structure

21...旋轉中心模組twenty one. . . Rotary center module

22...取放臂twenty two. . . Pick and place arm

23...取放嘴twenty three. . . Take the mouth

231...第一取放嘴231. . . First pick and place

232...第二取放嘴232. . . Second pick and place

30...固定式影像擷取模組30. . . Fixed image capture module

40...設定處理單元40. . . Setting processing unit

50...座體50. . . Seat

Claims (16)

一種具有多取放嘴結構的晶粒挑揀機,其包含有:
一晶粒取置平台,其具有一位移模組以及一晶粒置放部,該位移模組與該晶粒置放部連接,控制該晶粒置放部之活動位移;
一取放結構,其係與一座體固定連接設置,並具有一旋轉中心模組、至少二取放臂以及至少二取放嘴,該至少二取放臂係與該旋轉中心模組連接並以該旋轉中心模組為圓心相對設置,該至少二取放嘴分別設置於該至少二取放臂遠離該旋轉中心模組之端點,且該至少二取放嘴藉由該旋轉中心模組旋轉至該晶粒取置平台對應該晶粒置放部之位置;
一固定式影像擷取模組,其係與該座體固定連接,並設置於該晶粒取置平台之上方;以及
一設定處理單元,其係與該固定式影像擷取模組及該晶粒取置平台連接,該設定處理單元接收該固定式影像擷取模組之影像以對該至少二取放嘴進行位置紀錄,並藉由位置記錄控制該晶粒取置平台之位移。
A die picker having a multi-drop nozzle structure, comprising:
a die-removing platform having a displacement module and a die placement portion, the displacement module being coupled to the die placement portion to control the movable displacement of the die placement portion;
a pick-and-place structure, which is fixedly connected to the body, and has a rotating center module, at least two pick-up arms, and at least two pick-and-place nozzles, and the at least two pick-and-place arms are connected to the rotating center module and The rotation center module is disposed opposite to the center of the rotation, and the at least two nozzles are respectively disposed at an end of the at least two pick-up arms away from the rotation center module, and the at least two nozzles are rotated by the rotation center module Up to the position of the die placement platform corresponding to the die placement portion;
a fixed image capturing module fixedly connected to the base and disposed above the die receiving platform; and a setting processing unit coupled to the fixed image capturing module and the crystal The splicing platform is connected, and the setting processing unit receives the image of the fixed image capturing module to perform position recording on the at least two picking nozzles, and controls displacement of the arranging platform by position recording.
如申請專利範圍第1項所述之具有多取放嘴結構的晶粒挑揀機,其中該晶粒取置平台具有兩個,分別為一取晶平台及一置晶平台,且該取晶平台及該置晶平台分別設置於該旋轉中心模組之兩側,並對應該至少二取放嘴,該取晶平台上之該晶粒置放部係為框體結構而具有一窗口。The die picker having a multi-drop nozzle structure according to claim 1, wherein the die pick-up platform has two, respectively, a crystal pulling platform and a crystal pulling platform, and the crystal pulling platform And the crystallizing platform is respectively disposed on two sides of the rotating center module, and at least two nozzles are taken, and the crystal placing portion on the crystal pulling platform has a window structure and has a window. 如申請專利範圍第2項所述之具有多取放嘴結構的晶粒挑揀機,其中該固定式影像擷取模組亦具有兩個,分別對應該取晶平台以及該置晶平台。The die picker having a multi-pick and discharge structure as described in claim 2, wherein the fixed image capturing module also has two, respectively corresponding to the crystal platform and the crystal plate. 如申請專利範圍第2項所述之具有多取放嘴結構的晶粒挑揀機,其中該取晶平台具有一頂針模組,而該頂針模組係設置於該窗口之下方。The die picker having a multi-drop nozzle structure according to claim 2, wherein the crystal pulling platform has a thimble module, and the ejector module is disposed below the window. 如申請專利範圍第4項所述之具有多取放嘴結構的晶粒挑揀機,其中該頂針模組透過一位移構件與該設定處理單元連接,該設定處理單元藉由該位移構件控制該頂針模組之位移。The cullet picker having a multi-pick-and-drop structure as described in claim 4, wherein the thimble module is coupled to the setting processing unit via a displacement member, and the setting processing unit controls the ejector by the displacement member The displacement of the module. 如申請專利範圍第5項所述之具有多取放嘴結構的晶粒挑揀機,其中該頂針模組之移動範圍對應該至少二取放嘴,該兩取放嘴依序於該取晶平台上之該晶粒置放部進行晶粒之揀取。The die picker having a multi-pick-and-drop structure as described in claim 5, wherein the ejector module has a moving range corresponding to at least two nozzles, and the two pick-and-drop nozzles sequentially follow the crystal pulling platform The die placement portion performs grain picking. 一種具有多取放嘴結構的晶粒挑揀機之對位方法,其係包含有下列步驟:
一第一取放嘴之定位設定,將該第一取放嘴藉由一旋轉中心模組旋轉至一晶粒取置平台上的晶粒置放部,且透過一固定式影像擷取模組取得一第一中心位置;
一第二取放嘴之定位設定,將該第二取放嘴藉由該旋轉中心模組旋轉至該晶粒取置平台上的晶粒置放部,且透過該固定式影像擷取模組取得一第二中心位置;
中心點補償,該固定式影像擷取模組將該第一中心位置及該第二中心位置傳送至一設定處理單元進行記錄,並進行位置補償;及
完成位置調校並進行挑揀,藉由該設定處理單元之位置補償,控制該晶粒取置平台的一位移模組調整一晶粒置放部之位置,以對應該第一中心位置及該第二中心位置,供該第一取放嘴及該第二取放嘴進行取放作業。
A method for aligning a die picker having a multi-drop nozzle structure, comprising the following steps:
a first pick and place nozzle positioning setting, the first pick and place nozzle is rotated by a rotating center module to a die placement portion on a die access platform, and through a fixed image capturing module Obtaining a first central location;
Positioning a second pick-and-place nozzle, the second pick-and-place nozzle is rotated by the rotating center module to a die placement portion on the die-receiving platform, and the fixed image capturing module is transmitted through the fixed image capturing module Obtaining a second central location;
Center point compensation, the fixed image capturing module transmits the first center position and the second center position to a setting processing unit for recording, and performs position compensation; and completes position adjustment and picking, by Positioning compensation of the processing unit, controlling a displacement module of the die access platform to adjust a position of a die placement portion to correspond to the first center position and the second center position for the first nozzle And the second pick and place nozzle performs the pick and place operation.
如申請專利範圍第7項所述之對位方法,其中該第一取放嘴與該第二取放嘴係以180度相對設置於一直線上。The alignment method of claim 7, wherein the first pick-and-place nozzle and the second pick-and-place nozzle are disposed on a straight line at 180 degrees. 如申請專利範圍第7項所述之對位方法,其中該設定處理單元係以軟體補償的方式,進行該第一中心位置及該第二中心位置的位置補償。The aligning method of claim 7, wherein the setting processing unit performs position compensation of the first center position and the second center position in a software compensation manner. 如申請專利範圍第7項所述之對位方法,其中該晶粒取置平台係為一取晶平台,且更具有一步驟:一頂針模組之第一調校,於取得該第一中心位置後,將該頂針模組移動至該第一中心位置進行調校對應。The method for aligning the seventh aspect of the patent application, wherein the arranging platform is a crystal pulling platform, and there is a step: a first adjustment of a thimble module to obtain the first center After the position, the thimble module is moved to the first center position for adjustment. 如申請專利範圍第10項所述之對位方法,其中更具有一步驟:頂針模組之第二調校,於取得該第二中心位置後,將該頂針模組移動至該第二中心位置進行調校對應。For example, in the alignment method described in claim 10, there is a further step: the second adjustment of the thimble module, after the second center position is obtained, the thimble module is moved to the second center position Make adjustments. 如申請專利範圍第7項所述之對位方法,其中該晶粒取置平台係為一置晶平台。The alignment method of claim 7, wherein the die extraction platform is a crystal placement platform. 如申請專利範圍第7項所述之對位方法,其中該晶粒取置平台具有兩個,分別為一取晶平台及一置晶平台,並該取晶平台及該置晶平台分別設置於該旋轉中心模組之兩側,並對應該至少二取放臂,且該第一取放嘴及該第二取放嘴分別移動至該取晶平台及該置晶平台進行定位調校。The aligning method of the seventh aspect of the invention, wherein the arranging platform has two crystal pulling platforms and a crystal arranging platform, and the crystallization platform and the crystal arranging platform are respectively disposed on The two sides of the rotating center module are disposed at least two, and the first pick-and-place nozzle and the second pick-and-place nozzle are respectively moved to the crystal pulling platform and the crystallizing platform for positioning adjustment. 如申請專利範圍第7項所述之對位方法,其中於完成位置調校並進行挑揀的步驟中,該第一取放嘴以及該第二取放嘴會分別以一第一軌跡以及一第二軌跡進行位移,並分別於位於該第一軌跡及該第二軌跡上之該第一中心位置以及該第二中心位置停下,該頂針模組分別利用一X軸向與一Y軸向之位移而移動至該第一中心位置以及該第二中心位置,該X軸向係垂直於該Y軸向,藉此分別配合該第一取放嘴以及該第二取放嘴進行晶粒的挑揀。The alignment method of claim 7, wherein in the step of performing position adjustment and picking, the first pick-and-place nozzle and the second pick-and-place nozzle respectively have a first track and a first The two trajectories are displaced and stopped at the first central position and the second central position on the first trajectory and the second trajectory respectively, and the thimble module utilizes an X axial direction and a Y axial direction respectively. Displacement and moving to the first central position and the second central position, the X-axis is perpendicular to the Y-axis, thereby respectively engaging the first pick-and-place nozzle and the second pick-and-drop nozzle for grain picking . 如申請專利範圍第7項所述之對位方法,其中於完成位置調校並進行挑揀的步驟中,該第一取放嘴以及該第二取放嘴會分別以一第一軌跡以及一第二軌跡進行位移,並分別於同一X軸向線上的該第一中心位置以及該第二中心位置停下,該頂針模組利用X軸向之位移而移動至該第一中心位置以及該第二中心位置,藉此分別配合該第一取放嘴以及該第二取放嘴進行晶粒的挑揀。The alignment method of claim 7, wherein in the step of performing position adjustment and picking, the first pick-and-place nozzle and the second pick-and-place nozzle respectively have a first track and a first The two trajectories are displaced and respectively stopped at the first central position and the second central position on the same X-axis line, and the thimble module is moved to the first central position and the second by displacement of the X-axis The central position, whereby the first pick and place nozzle and the second pick and place nozzle are respectively matched to perform grain picking. 如申請專利範圍第7項所述之對位方法,其中於完成位置調校並進行挑揀的步驟中,該第一取放嘴以及該第二取放嘴會分別以一第一軌跡以及一第二軌跡進行位移,並分別於同一Y軸向線上的該第一中心位置以及該第二中心位置停下,該頂針模組利用Y軸向之位移而移動至該第一中心位置以及該第二中心位置,藉此分別配合該第一取放嘴以及該第二取放嘴進行晶粒的挑揀。The alignment method of claim 7, wherein in the step of performing position adjustment and picking, the first pick-and-place nozzle and the second pick-and-place nozzle respectively have a first track and a first The two trajectories are displaced and respectively stopped at the first central position and the second central position on the same Y-axis line, and the thimble module is moved to the first central position and the second by displacement of the Y-axis The central position, whereby the first pick and place nozzle and the second pick and place nozzle are respectively matched to perform grain picking.
TW100132017A 2011-09-06 2011-09-06 Grain picker with multi - take - and - letting structure and its alignment method TWI447543B (en)

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