CN115732378B - Automatic calibration system and method for suction nozzle - Google Patents
Automatic calibration system and method for suction nozzle Download PDFInfo
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- CN115732378B CN115732378B CN202111004708.0A CN202111004708A CN115732378B CN 115732378 B CN115732378 B CN 115732378B CN 202111004708 A CN202111004708 A CN 202111004708A CN 115732378 B CN115732378 B CN 115732378B
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- thimble
- suction nozzle
- side camera
- taking device
- swing arm
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Abstract
The invention provides an automatic calibration system for a suction nozzle, which comprises a frame, an ejector pin XY axis fine adjustment platform, an ejector pin mechanism with an ejector pin, a chip taking device, an ejector pin mechanism, a Wafer side camera and a Bin side camera, wherein the ejector pin XY axis fine adjustment platform, the chip taking device, the ejector pin mechanism, the Wafer side camera and the Bin side camera are respectively arranged on the frame, the ejector pin mechanism is arranged on the ejector pin XY axis fine adjustment platform, the ejector pin mechanism, the chip taking device and the ejector pin mechanism are collinear, and the chip taking device is arranged between the ejector pin mechanism and the ejector pin mechanism. The invention also provides an automatic calibration method of the suction nozzle. The beneficial effects of the invention are as follows: the angle and the height inconsistent with the double suction nozzles caused by machining and mounting errors can be dynamically compensated, the centers of the ejector pin, the chip and the suction nozzles are better ensured to be on the same straight line, and the arrangement precision and the yield are improved.
Description
Technical Field
The invention relates to a calibration system, in particular to an automatic calibration system and method for a suction nozzle.
Background
In the process of sucking the chip, the centers of the ejector pin, the chip and the suction nozzle are required to be ensured to be on the same straight line, and if the deviation is too large, the chip is easy to cause: 1. the chip is overturned and falls when the inclination angle of the chip is overlarge in the ejection process of the ejector pin; 2. the suction nozzle is adsorbed to the edge of the chip, the chip is stressed unevenly, and the chip is easy to fall off in the rotating process; 3. the suction nozzle is adsorbed to the edge of the chip, the stress is uneven in the arrangement process, part of the suction nozzle is adhered to the blue film, and the other part of the suction nozzle is not adhered to the blue film, so that floating crystals are easy to cause; 4. affecting the accuracy of the alignment.
Therefore, how to better ensure that the centers of the thimble, the chip and the suction nozzle are on the same straight line is a technical problem to be solved urgently by the technicians in the field.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an automatic calibration system and method for a suction nozzle.
The invention provides an automatic calibration system for a suction nozzle, which comprises a frame, an ejector pin XY axis fine adjustment platform, an ejector pin mechanism with an ejector pin, a chip taking device, an ejector pin mechanism, a Wafer side camera and a Bin side camera, wherein the ejector pin XY axis fine adjustment platform, the chip taking device, the ejector pin mechanism, the Wafer side camera and the Bin side camera are respectively arranged on the frame, the ejector pin mechanism is arranged on the ejector pin XY axis fine adjustment platform, the ejector pin mechanism, the chip taking device and the ejector pin mechanism are collinear, and the chip taking device is arranged between the ejector pin mechanism and the ejector pin mechanism.
As a further improvement of the chip taking device, the chip taking device comprises a rotating mechanism and swing arms arranged on the rotating mechanism, wherein at least two swing arms are uniformly arranged around the circumferential direction of the rotating shaft of the rotating mechanism at intervals, and each swing arm is provided with a suction nozzle for sucking chips.
As a further improvement of the invention, each swing arm is provided with a prism matched with the Wafer side camera or the Bin side camera, and the Wafer side camera or the Bin side camera observes the position of the central hole of the suction nozzle through the prism on the swing arm.
As a further improvement of the invention, a Wafer bearing disc is arranged between the chip taking device and the ejector pin mechanism, and a Bin bearing disc is arranged between the chip taking device and the ejector pin mechanism.
The invention also provides an automatic calibration method of the suction nozzle, which comprises the following steps of:
s1, rotating a swing arm of a chip taking device to a suction position, wherein the swing arm is a first swing arm, a suction nozzle on the swing arm is a first suction nozzle, observing the position of a central hole of the first suction nozzle through a Wafer side camera, enabling the center of a mobile visual cross to coincide with the central hole of the first suction nozzle, and recording the position of the center of the visual cross as A1;
s2, the first swing arm is moved away, the thimble position of the thimble mechanism is observed through a Wafer side camera, the longitudinal line and the transverse longitudinal direction of the visual cross are adjusted through the thimble XY axis fine adjustment platform to be respectively overlapped with the thimble, and the motor pulse position is recorded as B1 at the moment;
s3, moving the other swing arm of the chip taking device to a suction position, wherein the swing arm is a second swing arm, a suction nozzle on the swing arm is a second suction nozzle, observing the position of a central hole of the second suction nozzle through a Wafer side camera, enabling the center of a mobile visual cross to coincide with the central hole of the second suction nozzle, recording the position of the center of the visual cross as A2, subtracting A1 from A2, and writing the compensation value into a control program as Wafer/Bin Table X and Y axis compensation values, so that the Wafer/Bin Table X and Y axes move according to the compensation values;
s4, the second swing arm is moved away, the thimble position of the thimble mechanism is observed through the Wafer side camera, the transverse longitudinal direction of the visual cross is adjusted through the thimble XY axis fine adjustment platform to be overlapped with the thimble, the pulse position of the motor at the moment is recorded as B2, the height difference compensation values of the first suction nozzle and the second suction nozzle are obtained by subtracting the B1 from the B2, and in operation, the height of the thimble is enabled to carry out compensation movement according to the height difference of the corresponding suction nozzle.
The beneficial effects of the invention are as follows: the angle and the height inconsistent with the double suction nozzles caused by machining and mounting errors can be dynamically compensated, the centers of the ejector pin, the chip and the suction nozzles are better ensured to be on the same straight line, and the arrangement precision and the yield are improved.
Drawings
Fig. 1 is a schematic diagram of a chip pick-up device of an automatic calibration system for a suction nozzle according to the present invention.
Fig. 2 is a schematic perspective view of an automatic calibration system for a suction nozzle according to the present invention.
FIG. 3 is a schematic plan view of an automatic calibration system for a suction nozzle according to the present invention.
Detailed Description
The invention is further described with reference to the following description of the drawings and detailed description.
As shown in fig. 1 to 3, an automatic calibration system for a suction nozzle includes a frame 9, a thimble XY axis fine adjustment platform, a thimble mechanism 6 having a thimble, a chip taking device, a thimble mechanism 13, a Wafer side camera 10 and a Bin side camera 11, the thimble XY axis fine adjustment platform includes a thimble Y axis fine adjustment motor 7 and a thimble X axis fine adjustment platform 8, the thimble Y axis fine adjustment motor 7, the thimble X axis fine adjustment platform 8, the chip taking device, the thimble mechanism 13, the Wafer side camera 10 and the Bin side camera 11 are respectively installed on the frame 9, the thimble mechanism 6 is installed on the thimble Y axis fine adjustment motor 7, the thimble Y axis fine adjustment motor 7 is installed on the thimble X axis fine adjustment platform 8, the thimble mechanism 6, the chip taking device and the thimble mechanism 13 are collinear, and the chip taking device is located between the thimble mechanism 6 and the thimble mechanism 13.
The chip taking device comprises a rotating mechanism and swing arms arranged on the rotating mechanism, wherein at least two swing arms are uniformly arranged around the circumferential direction of a rotating shaft of the rotating mechanism at intervals, and suction nozzles for sucking chips are arranged on each swing arm.
And each swing arm is provided with two prisms matched with the Wafer side camera 10 or the Bin side camera 11, the Wafer side camera 10 or the Bin side camera 11 observe the position of the central hole of the suction nozzle through the prisms on the swing arm, and the two prisms are respectively a Bin prism 14 and a Wafer prism 15, corresponding to the double-swing-arm structure.
Wafer bearing plate 5 is arranged between the chip taking device and the ejector pin mechanism 6, and Bin bearing plate 12 is arranged between the chip taking device and the ejector pin mechanism 13.
An automatic calibration method for a suction nozzle comprises the following specific processes:
firstly, the first swing arm 1 is rotated to a suction position, at the moment, the position of the central hole of the first suction nozzle 2 can be observed through the Wafer side camera 10, the center of the mobile vision cross is overlapped with the central hole of the first suction nozzle 2, and the central position of the cross is recorded as A1;
the first swing arm 1 is moved away, the position of the thimble can be observed through the Wafer side camera 10, the longitudinal line coincidence of the thimble and the visual cross is adjusted through the thimble X-axis fine adjustment platform 8, the transverse line coincidence of the thimble and the visual cross is adjusted through the thimble Y-axis fine adjustment motor 7, and the pulse position of the thimble Y-axis fine adjustment motor 7 is recorded as B1.
The second swing arm 3 is moved to the suction position, at the moment, the position of the center hole of the second suction nozzle 4 can be observed through the Wafer side camera 10, the center of the movable visual cross is overlapped with the center hole of the second suction nozzle 4, the center position of the cross is recorded as A2, A1 and A2 are subtracted to be used as compensation values, the compensation values are written into a control program, and the movement is performed according to the corresponding compensation values.
And the second swing arm 3 is moved away, the top needle position can be observed through the Wafer side camera 10, the ejector pin is adjusted to be coincident with the transverse line of the visual cross through the Z-direction motor cam structure, the pulse position of the motor is recorded to be B2, and the difference between the heights of the first suction nozzle 1 and the second suction nozzle 4 is obtained by subtracting the B1 from the B2, so that the ejector pin can perform compensation motion according to the corresponding suction nozzle height difference during operation.
The automatic calibrating system and method for the suction nozzles can dynamically compensate inconsistent angles and heights of the double suction nozzles caused by machining and mounting errors, and improve arrangement accuracy and yield.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (1)
1. An automatic calibrating method for a suction nozzle is characterized in that: the automatic calibration system for the suction nozzle comprises a frame, a thimble XY axis fine adjustment platform, a thimble mechanism with a thimble, a chip taking device, a jack post mechanism, a Wafer side camera and a Bin side camera, wherein the thimble XY axis fine adjustment platform, the chip taking device, the jack post mechanism, the Wafer side camera and the Bin side camera are respectively installed on the frame, the thimble mechanism is installed on the thimble XY axis fine adjustment platform, the thimble mechanism, the chip taking device and the jack post mechanism are collinear, the chip taking device is positioned between the thimble mechanism and the jack post mechanism, the chip taking device comprises a rotating mechanism and swing arms installed on the rotating mechanism, at least two swing arms are uniformly arranged around the circumferential interval of a rotating shaft of the rotating mechanism, suction nozzles for adsorbing chips are arranged on each swing arm, prisms matched with the Wafer side camera or the Bin side camera are arranged on each swing arm, the Wafer side camera or the Bin side camera observes the positions of central holes of the suction nozzles through the prisms on the swing arms, the Wafer taking device and the Wafer taking device are arranged between the chip taking device and the Wafer taking device, and the carrier disc are arranged between the Wafer taking device and the carrier disc;
the following processes are carried out through the automatic calibration system of the suction nozzle:
s1, rotating a swing arm of a chip taking device to a suction position, wherein the swing arm is a first swing arm, a suction nozzle on the swing arm is a first suction nozzle, observing the position of a central hole of the first suction nozzle through a Wafer side camera, enabling the center of a mobile visual cross to coincide with the central hole of the first suction nozzle, and recording the position of the center of the visual cross as A1;
s2, the first swing arm is moved away, the thimble position of the thimble mechanism is observed through a Wafer side camera, the longitudinal line and the transverse longitudinal direction of the visual cross are respectively overlapped with the thimble through the thimble XY axis fine adjustment platform, and the motor pulse position of the hour XY axis fine adjustment platform is recorded as B1;
s3, moving the other swing arm of the chip taking device to a suction position, wherein the swing arm is a second swing arm, a suction nozzle on the swing arm is a second suction nozzle, observing the position of a central hole of the second suction nozzle through a Wafer side camera, enabling the center of a mobile visual cross to coincide with the central hole of the second suction nozzle, recording the position of the center of the visual cross as A2, subtracting the A1 from the A2, and writing the subtracted value into a control program as a compensation value for motion compensation;
s4, the second swing arm is moved away, the thimble position of the thimble mechanism is observed through the Wafer side camera, the transverse longitudinal direction of the visual cross is adjusted through the thimble XY axis fine adjustment platform to be overlapped with the thimble, the pulse position of the motor at the moment is recorded as B2, the height difference compensation values of the first suction nozzle and the second suction nozzle are obtained by subtracting the B1 from the B2, and in operation, the height of the thimble is enabled to carry out compensation movement according to the height difference of the corresponding suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111004708.0A CN115732378B (en) | 2021-08-30 | 2021-08-30 | Automatic calibration system and method for suction nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111004708.0A CN115732378B (en) | 2021-08-30 | 2021-08-30 | Automatic calibration system and method for suction nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115732378A CN115732378A (en) | 2023-03-03 |
| CN115732378B true CN115732378B (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111004708.0A Active CN115732378B (en) | 2021-08-30 | 2021-08-30 | Automatic calibration system and method for suction nozzle |
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| CN103077915A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Adjustable double swing arm system three-core alignment method of chip grading equipment |
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| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
| TWI574022B (en) * | 2016-01-21 | 2017-03-11 | 旺矽科技股份有限公司 | Die Detection Apparatus And Die Delivery Method |
| CN107818934A (en) * | 2017-12-05 | 2018-03-20 | 桂林立德爱博半导体装备有限公司 | A kind of device of double-pendulum arms correcting working table |
| CN210092035U (en) * | 2019-04-16 | 2020-02-18 | 深圳市大成自动化设备有限公司 | Precise chip arrangement machine |
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2021
- 2021-08-30 CN CN202111004708.0A patent/CN115732378B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003243484A (en) * | 2002-02-15 | 2003-08-29 | Matsushita Electric Ind Co Ltd | Electronic part supply device, and electronic part mounting device and method for mounting the electronic part |
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN101780456A (en) * | 2010-01-08 | 2010-07-21 | 东莞华中科技大学制造工程研究院 | Crystal grain angle correction method applied to chip separating system |
| WO2011128981A1 (en) * | 2010-04-13 | 2011-10-20 | パイオニア株式会社 | Component transfer device and method |
| CN102931122A (en) * | 2012-11-13 | 2013-02-13 | 潍坊永昱电控科技有限公司 | Calibration method of light emitting diode (LED) wager automatic sorting machine |
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| CN103357584A (en) * | 2013-07-05 | 2013-10-23 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
| TWI574022B (en) * | 2016-01-21 | 2017-03-11 | 旺矽科技股份有限公司 | Die Detection Apparatus And Die Delivery Method |
| CN106373914A (en) * | 2016-11-10 | 2017-02-01 | 北京中电科电子装备有限公司 | Chip bonding device |
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| CN115732378A (en) | 2023-03-03 |
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