CN216054625U

CN216054625U - Chip picking transfer table device

Info

Publication number: CN216054625U
Application number: CN202122694157.7U
Authority: CN
Inventors: 刘维强
Original assignee: Shenzhen Silicon Valley Semiconductor Equipment Co ltd
Current assignee: Shenzhen Silicon Valley Semiconductor Equipment Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-03-15
Anticipated expiration: 2031-11-04

Abstract

The utility model discloses a chip picking transfer table device, which is arranged between an external chip picking swing arm and an external crystal fixing device and comprises a transfer table, an X-axis adjusting mechanism, a Y-axis adjusting mechanism and visual detection mechanisms respectively arranged above and below the transfer table, wherein the transfer table is provided with a transfer base, an alignment bearing table and a sucker assembly arranged on the alignment bearing table, the X-axis adjusting mechanism is used for compensating the position deviation of the transfer table and the crystal fixing device in the X axial direction, and the Y-axis adjusting mechanism is used for compensating the position deviation of the transfer table and the crystal fixing device in the Y axial direction. According to the structure, when the chip picking swing arm and the swing arm of the die bonder have position deviation, the position deviation of the chip can be compensated through the transfer table, the position and the angle of the chip are detected in real time through the visual detection mechanism located above the sucker component, the appearance of the chip and the angle of the chip are detected in real time through the visual detection mechanism located below the sucker component, and the product yield is improved.

Description

Chip picking transfer table device

Technical Field

The utility model relates to the technical field of semiconductor packaging processes, in particular to a chip picking transfer table device.

Background

The existing semiconductor die bonding equipment usually packages a chip in a linear motion die bonding device by picking up the chip through a swing arm, and the structural design has the control precision requirement on the swing arm and a linear driving source, so that the cost is increased, and the increasing production requirements are difficult to meet, so that the improvement is needed.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a chip picking transfer table device, which can compensate the position deviation of a chip through a transfer table, detect the position and the angle of the chip in real time through a visual detection mechanism positioned above a sucker assembly, further confirm the compensated precision, ensure the accuracy of chip die bonding and packaging, and detect the appearance of the chip in real time through the visual detection mechanism positioned below the sucker assembly, thereby improving the product yield.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a revolving stage device in chip pickup, set up in between external chip pickup swing arm and the external solid crystalline substance device, it includes the revolving stage, X axle adjustment mechanism, Y axle adjustment mechanism and set up respectively in revolving stage top and/or below visual detection mechanism, the revolving stage is provided with the transit base, install in the counterpoint plummer of transit base and install in the sucking disc subassembly of counterpoint plummer, the sucking disc subassembly is used for adsorbing the chip that is picked up by the chip pickup swing arm, X axle adjustment mechanism is used for remedying revolving stage and solid crystalline substance device at the X axial position deviation, Y axle adjustment mechanism is used for remedying revolving stage and solid crystalline substance device at the Y axial position deviation.

In a further technical scheme, X axle adjustment mechanism is provided with X axle base and X axle driving source, and Y axle adjustment mechanism is provided with Y axle base and Y axle driving source, and the left and right sides of Y axle base sets up Y axle slide rail respectively, and the upper and lower both sides of X axle base are provided with X axle slide rail respectively, the left and right sides of transfer base is provided with Y axle slider respectively, and the upper and lower both sides of Y axle base are provided with Z axle slider respectively, well revolving stage is via Y axle slider slidable mounting in Y axle slide rail, Y axle base slidable mounting in X axle slide rail.

In a further technical scheme, a Y-axis in-place switch is arranged on the Y-axis base, and a Y-axis triggering elastic sheet matched with the Y-axis in-place switch in a triggering mode is installed on the transfer base.

In a further technical scheme, an X-axis in-place switch is arranged on the X-axis base, and an X-axis trigger elastic sheet matched with the X-axis in-place switch in a trigger mode is installed on the Y-axis base.

In the further technical scheme, the middle part of Y axle base installs Y axle guide holder, and the middle part of Y axle guide holder is hollowed out and is formed with Y axle guide slot, the transfer base is installed one and is slided the Y axle slide that sets up in Y axle guide slot, and the left and right sides of Y axle slide extends to two Y axle slider departments respectively.

In a further technical scheme, a pressure sensor is arranged at the position of the alignment bearing platform corresponding to the sucker component.

After adopting the structure, compared with the prior art, the utility model has the advantages that:

the structure can compensate the position deviation of the chip through the transfer table when the chip picking swing arm and the swing arm of the die bonding device have the position deviation, and further confirm the compensated precision through the position and the angle of the chip detected by the visual detection mechanism positioned above the sucker component in real time, so that the die bonding packaging accuracy of the chip is ensured, the appearance of the chip is detected in real time through the visual detection mechanism positioned below the sucker component, and the product yield is improved.

2. And a pressure sensor is arranged at the position of the alignment bearing platform corresponding to the sucker assembly, and the force of an external swing arm suction head or an external die bonding suction head is corrected and monitored in real time or at regular time through the pressure sensor on the bearing platform.

Drawings

The utility model is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the relay table and the Y-axis adjusting mechanism.

Detailed Description

The following are merely preferred embodiments of the present invention, and do not limit the scope of the present invention.

As shown in fig. 1 to 2, the turntable device for picking up a chip provided by the present invention is disposed between an external swing arm for picking up a chip and an external die bonder, and includes a turntable, an X-axis adjusting mechanism 2, a Y-axis adjusting mechanism 3, and a vision detecting mechanism respectively disposed above and/or below the turntable, wherein the turntable is provided with a transfer base 10, an aligning bearing platform 11 mounted on the transfer base 10, and a suction cup assembly 12 mounted on the aligning bearing platform 11, the suction cup assembly 12 is used for adsorbing a chip picked up by the swing arm for picking up a chip, the X-axis adjusting mechanism 2 is used for compensating a position deviation of the turntable and the die bonder in an X-axis direction, and the Y-axis adjusting mechanism 3 is used for compensating a position deviation of the turntable and the die bonder in a Y-axis direction. According to the structure, when the chip picking swing arm and the swing arm of the die bonding device have position deviation, the position deviation of the chip can be compensated through the transfer table, the position and the angle of the chip are detected in real time through the visual detection mechanism located above the sucker component 12, the compensated precision is further confirmed, the die bonding and packaging accuracy of the chip is guaranteed, the appearance of the chip is detected in real time through the visual detection mechanism located below the sucker component 12, and the product yield is improved.

Specifically, the X-axis adjusting mechanism 2 is provided with an X-axis base 20 and an X-axis drive source, the Y-axis adjusting mechanism 3 is provided with a Y-axis base 30 and a Y-axis drive source, Y-axis slide rails are respectively provided on the left and right sides of the Y-axis base 30, X-axis slide rails are respectively provided on the upper and lower sides of the X-axis base 20, Y-axis slide blocks are respectively provided on the left and right sides of the transfer base 10, Z-axis slide blocks are respectively provided on the upper and lower sides of the Y-axis base 30, the transfer table is slidably mounted on the Y-axis slide rails through the Y-axis slide blocks, and the Y-axis base 30 is slidably mounted on the X-axis slide rails.

Specifically, the Y-axis base 30 is provided with a Y-axis in-place switch 31, the transfer base 10 is provided with a Y-axis trigger spring plate in trigger fit with the Y-axis in-place switch 31, the X-axis base 20 is provided with an X-axis in-place switch, and the Y-axis base 30 is provided with an X-axis trigger spring plate in trigger fit with the X-axis in-place switch. The whole precision of equipment is better, and the position is remedied more accurately through the structural design.

Specifically, the middle part of Y axle base 30 installs Y axle guide holder 32, and the middle part of Y axle guide holder 32 is hollowed out and is formed with Y axle guide slot, transfer base 10 installs one and slides the Y axle slide 33 that sets up in Y axle guide slot, and the left and right sides of Y axle slide 33 extends to two Y axle slider departments respectively. Through setting up Y axle guide holder 32 and Y axle slide 33 to ensure that the transfer platform removes the process more steadily.

Specifically, a pressure sensor 13 is arranged at a position of the aligning bearing table 11 corresponding to the suction cup assembly 12, and the force of an external swing arm suction head or an external die bonding suction head is corrected and monitored in real time or at regular time through the pressure sensor 13 on the bearing table 1111.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.

Claims

1. The utility model provides a revolving stage device in chip pickup, sets up in that the swing arm is picked up to external chip and external solid brilliant device between, its characterized in that: including the transfer platform, X axle adjustment mechanism (2), Y axle adjustment mechanism (3) and set up respectively in the visual detection mechanism of transfer platform top and/or below, the transfer platform is provided with transfer base (10), install counterpoint plummer (11) in transfer base (10) and install sucking disc subassembly (12) in counterpoint plummer (11), sucking disc subassembly (12) are used for adsorbing the chip that picks up the swing arm and pick up by the chip, X axle adjustment mechanism (2) are used for remedying transfer platform and solid brilliant device at X axial position deviation, Y axle adjustment mechanism (3) are used for remedying transfer platform and solid brilliant device at Y axial positional deviation.

2. The chip picking transfer table apparatus of claim 1, wherein: x axle adjustment mechanism (2) are provided with X axle base (20) and X axle driving source, and Y axle adjustment mechanism (3) are provided with Y axle base (30) and Y axle driving source, and the left and right sides of Y axle base (30) sets up Y axle slide rail respectively, and the upper and lower both sides of X axle base (20) are provided with X axle slide rail respectively, the left and right sides of transfer base (10) is provided with Y axle slider respectively, and the upper and lower both sides of Y axle base (30) are provided with Z axle slider respectively, well revolving stage is in Y axle slide rail via Y axle slider slidable mounting, Y axle base (30) slidable mounting is in X axle slide rail.

3. The chip picking transfer table apparatus of claim 2, wherein: the Y-axis base (30) is provided with a Y-axis in-place switch (31), and the transfer base (10) is provided with a Y-axis triggering elastic sheet which is in triggering fit with the Y-axis in-place switch (31).

4. The chip picking transfer table apparatus of claim 2, wherein: the X-axis base (20) is provided with an X-axis in-place switch, and the Y-axis base (30) is provided with an X-axis trigger elastic sheet matched with the X-axis in-place switch in a trigger mode.

5. The chip picking transfer table apparatus of claim 2, wherein: the middle part of Y axle base (30) installs Y axle guide holder (32), and the middle part of Y axle guide holder (32) is hollowed out and is formed with Y axle guide slot, transfer base (10) are installed one and are slided Y axle slide (33) that sets up in Y axle guide slot, and the both sides extend to two Y axle slider departments respectively about Y axle slide (33).

6. The chip picking transfer table apparatus of claim 1, wherein: and a pressure sensor (13) is arranged at the position of the alignment bearing platform (11) corresponding to the sucker component (12).