CN110718485A - Material taking device and die bonder - Google Patents
Material taking device and die bonder Download PDFInfo
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- CN110718485A CN110718485A CN201910953728.9A CN201910953728A CN110718485A CN 110718485 A CN110718485 A CN 110718485A CN 201910953728 A CN201910953728 A CN 201910953728A CN 110718485 A CN110718485 A CN 110718485A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to a material taking device and a die bonder, which comprise a mounting frame, a driving device, a material taking head and a pressure sensor, wherein the material taking head is arranged at the output end of the driving device, the driving device can drive the material taking head to do linear reciprocating motion relative to the mounting frame, the pressure sensor can detect the force of the material taking head for pasting materials on a carrier, and when the pressure sensor detects a preset value, the driving device stops driving the material taking head. The wafer fixing device is provided with the pressure sensor, the pressure sensor can detect the force of the material taking head for pasting the wafer on the carrier, so that closed-loop control can be formed on the wafer fixing, when the force detected by the pressure sensor is in a reasonable interval, the material taking head can be stopped to advance by controlling the driving device, the precise control of the wafer fixing is realized, different pasting forces can be set for different products, and the precise and different control is realized.
Description
Technical Field
The invention relates to the technical field of chip die bonding, in particular to a material taking device and a die bonding machine.
Background
The semiconductor packaging is a process of processing a wafer passing through a test according to a product model and a function requirement to obtain an independent chip, and the specific packaging process is that the wafer is cut into small chips through a scribing process, then the cut chips are pasted on small islands of corresponding substrate frames through glue, and then bonding pads of the chips are connected to corresponding pins of the substrate through superfine metal wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, and after plastic packaging, carrying out inspection, testing, packaging and other procedures to finish packaging.
The material taking device is a core component of the die bonder, and has the function of sucking up the cut and separated die on the die, transferring and placing the die on a carrier (such as a lead frame, a PCB (printed circuit board), and performing adhesion or welding. For this reason, the material taking device is generally designed as a mechanism having two degrees of freedom (Y-axis direction and Z-axis direction), which needs to move to and from two positions, i.e., a pick-up point and a bonding point, precisely and smoothly to perform actions of picking up a wafer, transferring the wafer, bonding the wafer, and the like.
Because the thicknesses of the wafers are different and the movement of the material taking device has a certain error, in order to prevent the wafer and/or the carrier from being damaged due to overlarge acting force between the wafer and the carrier in the process of adhering the wafer, a spring is generally used for buffering between a material taking head and a driving device of the material taking device, and the acting force between the wafer and the carrier is ensured within a certain range by controlling the stroke of the material taking head.
Disclosure of Invention
The technical problem to be solved by the present invention is how to precisely control the acting force between the wafer and the carrier.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a material taking device, is including mounting bracket, drive arrangement, gets stub bar and pressure sensor, it sets up to get the stub bar on drive arrangement's the output, drive arrangement can order about it is relative to get the stub bar the mounting bracket makes straight reciprocating motion, pressure sensor can detect get the stub bar and paste the material and put the power on the carrier, work as when pressure sensor detects the predetermined value, drive arrangement stops the drive get the stub bar.
In a preferred embodiment, the material taking device further comprises a sliding pair, and the material taking head is connected with the mounting frame through the sliding pair.
In a preferred embodiment, the drive is a linear motor.
In a preferred embodiment, the pick-up head is a vacuum nozzle.
In a preferred embodiment, the apparatus further comprises a resilient member capable of imparting a resilient force to the pick head in a direction opposite to the direction of gravity.
In a preferred embodiment, the mounting frame further comprises a limiting block, the limiting block is fixed relative to the output end of the driving device, a limiting hole is formed in the mounting frame, and the limiting block is inserted into the limiting hole.
In a preferred embodiment, the limiting block further comprises a cushion pad, and the cushion pad is arranged on the limiting block in a surrounding mode.
In a preferred embodiment, the optical fiber grating device further includes a first grating ruler, the first grating ruler includes a first scale grating and a first grating reading head, the first scale grating is fixed relative to the output end of the driving device, and the first grating reading head is fixed relative to the mounting bracket.
A die bonder comprises the material taking device.
The invention has the beneficial effects that:
the invention is provided with the pressure sensor which can detect the force of the material taking head for pasting the wafer on the carrier, thereby forming closed-loop control on the die bonding of the wafer, and when the force detected by the pressure sensor is in a reasonable interval, the material taking head can be stopped to advance by controlling the driving device, thereby realizing the precise control of die bonding.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is an isometric view of a die bonder in accordance with one embodiment of the present invention;
FIG. 2 is a partial exploded view of the die bonder of FIG. 1;
fig. 3 is an exploded view of the reclaimer assembly of fig. 1.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the purpose of the drawings is to graphically supplement the description of the text portion of the specification, so that each feature and the whole technical solution of the present invention can be visually and vividly understood, but the scope of the present invention should not be construed as being limited thereto.
In the description of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. When a feature is referred to as being "disposed," "secured," or "connected" to another feature, it can be directly disposed, secured, or connected to the other feature or be indirectly disposed, secured, or connected to the other feature.
In the description of the present invention, if "a number" is referred to, it means one or more, if "a number" is referred to, it means two or more, if "more than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
In addition, unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 and 2, fig. 1 is an isometric view of a die bonder in accordance with one embodiment of the present invention, and fig. 2 is a partially exploded view of the die bonder of fig. 1. Wherein, the solid brilliant machine of this embodiment is including frame 1, linear guide 2, slip table 3, extracting device 4, second grating chi 5 and second photoelectric sensor subassembly 6, linear guide 2 is including guide rail 21 and slider 22, guide rail 21 is fixed in frame 1, guide rail 21 sets up along the Z axle direction, slip table 3 is fixed on slider 22, for making the motion of slip table 3 more steady, guide rail 21 is provided with two, and parallel arrangement, slip table 3 strides and establishes on two guide rails 21, and slip table 3 is connected through two sliders 22 with the guide rail 21 of singleness.
Be fixed with a extracting device 4 on two slip tables 3 respectively, for the accurate displacement of obtaining whole extracting device 4 relative frame 1, thereby reacing speed and acceleration isoparametric, be provided with second grating chi 5, second grating chi 5 is including second scale grating 51 and second grating reading head 52, second scale grating 51 sets up along the Z axle direction, second grating reading head 52 is fixed on extracting device 4, through the cooperation of second scale grating 51 and second grating reading head 52, can acquire extracting device 4's positional information in real time.
For carrying out timely effectual control to extracting device 4's motion range, prevent promptly when extracting device 4 from moving to the one end of guide rail 21, continue to move and cause the collision damage, be provided with second photoelectric sensor subassembly 6, second photoelectric sensor subassembly 6 is including second anti-dazzling screen 61 and second photoelectric sensor 62, the upper end of second anti-dazzling screen 61 is fixed on slip table 3, second photoelectric sensor 62 is provided with two, two second photoelectric sensor 62 are the both ends department of guide rail 21 respectively, the light transmission between the transmitting terminal and the receiving terminal of second photoelectric sensor 62 can be blocked to the lower extreme of second anti-dazzling screen 61, thereby trigger second photoelectric sensor 62, remind extracting device 4 to have moved extreme position, should in time stop extracting device 4's motion.
Referring to fig. 2 and 3, fig. 3 is an exploded view of the material taking device 4 in fig. 1, the material taking device 4 includes an installation frame 40, a first grating ruler 41, a sliding pair 42, a driving device 43, a limiting block 44, a fixing block 45, a sensor installation block 46, a pressure sensor 47, a clamping block 48, a material taking head 49, a first photoelectric sensor assembly 70, a buffer pad 71 and an elastic element 72, the installation frame 40 is fixed on the sliding table 3 in a manner of locking and fixing by using a fastening member, a fixed end of the driving device 43 is fixed on the installation frame 40, an output end of the driving device 43 is fixed with the fixing block 45, the material taking head 49 is fixed relative to the fixing block 45, and the fixing block 45 drives the material taking head 49 to make a reciprocating linear motion along a vertical direction under the driving of the.
In this embodiment, the driving device 43 is a voice coil motor, and the voice coil motor has the advantages of simple structure, small volume, high acceleration, high speed, fast response, smooth force characteristic and the like, so that the volume of the whole material taking device 4 is smaller, the weight is lower, the inertia of the material taking device 4 is smaller, the material taking device 4 is decelerated and accelerated to cause small vibration when moving on the rack 1, and the precision of die bonding is higher.
In another embodiment, the driving device 43 may be a rod motor.
In order to make the movement of the material taking head 49 more stable and the movement precision higher, the fixed block 45 is connected with the mounting rack 40 through the sliding pair 42, the sliding pair 42 is provided with two groups which are respectively connected at the left end and the right end of the fixed block 45, in the embodiment, the sliding pair 42 is a crossed roller guide rail, the crossed roller guide rail comprises two guide rails with V-shaped roller paths, a roller retainer and cylindrical rollers, and the cylindrical rollers which are arranged in a crossed mode reciprocate on the V-shaped roller path surface which is subjected to precision grinding, can bear the load in each direction, and realize high-precision and stable linear movement.
In other embodiments, the sliding pair 42 may alternatively be a linear guide.
When the taking head 49 attaches the wafer to the carrier, in order to accurately detect the acting force between the wafer and the carrier, prevent the wafer and/or the carrier from being damaged, and improve the yield, the pressure sensor 47 is arranged between the sensor mounting block 46 and the clamping block 48, the sensor mounting block 46 is fixed relative to the fixed block 45, the taking head 49 is clamped and fixed on the clamping block 48, the pressure sensor 47 can detect the pressure transmitted from the clamping block 48 to the sensor mounting block 46, and when the taking head 49 is not abutted against the carrier through the wafer, the clamping block 48 does not transmit the pressure to the sensor mounting block 46.
Through setting up pressure sensor 47, can carry out real-time feedback to the solid brilliant pressure of wafer, can feed according to solid brilliant pressure feedback control drive arrangement 43 from this, when pressure sensor 47 detected pressure and reached the predetermined value, drive arrangement 43 can stop the drive and get stub bar 49 for solid brilliant pressure control is in a reasonable interval, adapts to the solid brilliant of the wafer of different thickness from this, simultaneously, can weaken and get stub bar 49 movement accuracy and to the solid brilliant influence of wafer. Traditional spring buffering formula solid crystal controls solid crystal pressure through getting the displacement of stub bar 49, receives the motion accuracy of getting stub bar 49 to influence greatly, and the solid crystal pressure of wafer can't accurate control, and the solid brilliant uniformity of wafer is poor, and the comprehensive effect is poor.
In the present embodiment, the pressure sensor 47 is a strain gauge pressure sensor that has a strain gauge provided in a slit of an S-shaped housing and that detects a change in pressure by feeding back a change in resistance caused by deformation of the strain gauge to a detection circuit.
In other embodiments, the pressure sensor 47 may also use a piezoelectric pressure sensor.
In this embodiment, the pick-up head 49 is a vacuum nozzle made of rubber, bakelite, ceramic, or tungsten steel, and the vacuum nozzle is connected to a negative pressure air source to suck the wafer, and when the negative pressure in the vacuum nozzle disappears, the wafer is released.
In another embodiment, the pick-up head 49 may also use a water surface tension adsorption clamping technique, which is to adhere a mesh-like foamed polyurethane cloth to the surface of a stainless steel sample plate and adsorb the wafer by using the water tension on the surface of the foamed polyurethane cloth.
In order to balance the gravity of the fixing block 45 and the parts fixed on the fixing block 45, an elastic element 72 is provided, the elastic element 72 can give an elastic force to the fixing block 45 close to the mounting frame 40, in this embodiment, the elastic element 72 is a spring, the upper end of the spring is fixedly connected with the mounting frame 40, the lower end of the spring is fixedly connected with the fixing block 45, and the spring is in a stretching state.
In other embodiments, the resilient member 72 may also use a bellows.
In this embodiment, the driving device 43 is a voice coil motor, the voice coil motor is a kind of linear motor, in order to further reduce the working time of the voice coil motor, when the material taking device 4 transfers the wafer, the voice coil motor may not be powered on, and the material taking head 49 may not drop downward, the elastic force of the elastic element 72 may be greater than the gravity of the fixed block 45 and the parts fixed on the fixed block 45, meanwhile, the mounting frame 40 is provided with the limiting hole 401, the fixed block 45 is provided with the limiting block 44, the limiting block 44 is inserted into the limiting hole 401, under the action of the elastic element 72, the fixed block 45 moves upward, when the limiting block 44 abuts against the upper end face of the limiting hole 401, the fixed block 45 stops moving, and at this time, even if the voice coil motor is not powered on, the material taking head 49 may not drop downward.
For making more steady when spacing hole 401 restricts the motion of stopper 44, be provided with blotter 71 on the stopper 44, blotter 71 encircles stopper 44 and sets up, during the concrete implementation, stopper 44 adopts the screw, and screw locking is fixed on fixed block 5, and blotter 71 adopts the rubber circle, and the rubber circle cup joints on the screw to this cushions the motion of fixed block 5.
In order to detect whether the material taking head 49 moves upwards to a certain position, a first photoelectric sensor assembly 70 is arranged, the first photoelectric sensor assembly 70 comprises a first light shielding sheet 701 and a first photoelectric sensor 702, the first light shielding sheet 701 is fixed on the fixing block 45, the first photoelectric sensor 702 is fixed on the mounting frame 40, and when the material taking head 49 moves upwards to a certain position, the first light shielding sheet 701 triggers the first photoelectric sensor 702, so that the movement of the material taking head 49 is detected.
In order to detect the displacement of the material taking head 49 and facilitate the die bonding action of the wafer, a first grating ruler 41 is arranged, the first grating ruler 41 comprises a first scale grating and a first grating reading head, the first scale grating is fixed on the fixing block 45 and moves along with the fixing block 45, and the first grating reading head is fixed on the mounting frame 40. Through setting up first grating chi 41, displacement, speed and the acceleration of getting stub bar 49 can in time be detected, when getting stub bar 49 and beginning to move towards the carrier, can improve drive arrangement 43's power for get stub bar 49 rapid movement, when getting stub bar 49 and having close the carrier, can make in advance get stub bar 49 and slow down, prepare solid brilliant. While the present invention has been described with reference to the preferred embodiments, it is to be understood that the present invention is not limited to the disclosed embodiments, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (9)
1. The utility model provides a material taking device, its characterized in that, including mounting bracket, drive arrangement, get stub bar and pressure sensor, it sets up to get the stub bar on drive arrangement's the output, drive arrangement can order about it is relative to get the stub bar the mounting bracket makes straight reciprocating motion, pressure sensor can detect get the stub bar and paste the material and put the power on the carrier, works as when pressure sensor detects the predetermined value, drive arrangement stops the drive get the stub bar.
2. The material extracting apparatus as claimed in claim 1, further comprising a sliding pair, wherein the material extracting head is connected with the mounting frame through the sliding pair.
3. The reclaimer assembly of claim 1, wherein said drive assembly is a linear motor.
4. The take off device as claimed in claim 1, wherein the take off head is a vacuum nozzle.
5. The take off device of claim 1, further comprising a resilient member capable of imparting a resilient force to the take off head in a direction opposite the direction of gravity.
6. The material taking device as claimed in claim 5, further comprising a limiting block, wherein the limiting block is fixed relative to the output end of the driving device, a limiting hole is formed in the mounting frame, and the limiting block is inserted into the limiting hole.
7. The reclaiming apparatus as claimed in claim 6, further comprising a cushion disposed around the stopper.
8. The reclaiming apparatus as claimed in claim 1, further comprising a first grating scale including a first scale grating and a first grating reading head, wherein the first scale grating is fixed relative to the output end of the drive apparatus, and the first grating reading head is fixed relative to the mounting bracket.
9. A die bonder, characterized in that it comprises a material-taking device as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953728.9A CN110718485A (en) | 2019-10-09 | 2019-10-09 | Material taking device and die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953728.9A CN110718485A (en) | 2019-10-09 | 2019-10-09 | Material taking device and die bonder |
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| Publication Number | Publication Date |
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| CN110718485A true CN110718485A (en) | 2020-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910953728.9A Pending CN110718485A (en) | 2019-10-09 | 2019-10-09 | Material taking device and die bonder |
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| CN (1) | CN110718485A (en) |
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| CN111312651A (en) * | 2020-02-28 | 2020-06-19 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN111312651B (en) * | 2020-02-28 | 2020-10-13 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN112701065A (en) * | 2020-12-29 | 2021-04-23 | 微见智能封装技术(深圳)有限公司 | Automatic chip mounter |
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