CN101707181A - Chip pick-and-place control method and device - Google Patents
Chip pick-and-place control method and device Download PDFInfo
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- CN101707181A CN101707181A CN200910272685A CN200910272685A CN101707181A CN 101707181 A CN101707181 A CN 101707181A CN 200910272685 A CN200910272685 A CN 200910272685A CN 200910272685 A CN200910272685 A CN 200910272685A CN 101707181 A CN101707181 A CN 101707181A
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Abstract
The invention provides a chip pick-and-place control method, wherein a chip pick-and-place device is switched to a low speed from a high speed directly in the descending process to reduce the impact force in the decelerating process and effectively finish the picking or the placing of a chip. A device for implementing the method comprises a supporting mechanism, a straight-line motion mechanism, a rotary motion mechanism, a spline and a chip pick-and-place mechanism, wherein the two motion mechanisms drive the spline to perform straight-line motions and rotary motions respectively; the spline is connected with the chip pick-and-place mechanism and is provided with an elastic component; and a straight-line driving mechanism can be restored by the elastic force of the elastic component. The rotary motion mechanism serves as an auxiliary shaft, and the motion of the auxiliary shaft is attached to the straight-line driving mechanism through a transmission mechanism so that the auxiliary shaft can accurately run for a preset angle and ensure the placing accuracy of the chip; and the straight-line motion mechanism has the capacity of switching among three modes of position control, speed control and current (force) control to ensure that the placing actions are finished at a high speed under a constant pressure so that the chip generates no cracks or breakages in the placing process.
Description
Technical field
The present invention relates to the Electronic Packaging field, be specifically related to a kind of chip pick-and-place control method and device.
Background technology
Picking up and mounting of micro chip all is the difficult problem of Electronic Packaging industry all the time.In recent years, in order to obtain lighter, littler, thinner electronic product, ultra-thinization of strong request semiconductor chip, and the back side by grinding, grinding and etched semiconductor wafer can make chip thickness be as thin as below the 100 μ m.But for the chip of thickness below 100 μ m, the difficulty of picking up and mounting of chip has further strengthened.Semiconductor chip all is frangible usually, and thin chip is more prone to break or damage, and must carry out strictness control to its operating physical force.During the chip pick-and-place device busy, need preestablish the pressure when picking up, and must give a certain amount of pressure when being placed on chip on framework or the substrate, so that make chip and framework or substrate that better bonding be arranged with pasting chip.So mount in the process in actual chips, necessary accurate setting and the size of controlling this pressure, the assurance chip does not damage chip when reliably boning.According to the pertinent literature introduction, need to realize impulsive force＜100g in the chip attachment process, contact pressure＜40g, the attenuate impact power and the contact pressure of chip have proposed more harsh requirement.
Except that power control function, the chip pick-and-place device also must have the characteristics fast of responding to improve the efficient of finishing equipment.In addition, because chip often produces small change in location in the process of picking up, before mounting, need the position of chip is corrected, this is particularly important for the high sealed in unit of positioning accuracy request, must carry out the deviation of the rotation of certain angle with compensated position to mounting the chip of drawing.Have this function, the chip pick-and-place device must also have rotary freedom.
The part pick and place device has only adopted spring that this pressure is controlled at present, as patent CN 1533237A, spring controlled pressure scheme principle is simple, but the adjusting of pressure is comparatively rough, precision is not enough, pick up easily less than phenomenons such as chip or chip attach are insecure, and damage chip easily.Also have patent scheme (CN 101005757A) to adopt the mode of air pressure to come controlled pressure, this class scenario-frame is simple, but pressure regulate to be difficult for, and pneumatic action all has certain hysteresis quality usually, and response speed is fast inadequately; And pneumatic actuator descends with bigger speed and makes in the process of chip and substrate contacts and bear bigger impulsive force.In addition, most variations (CN 2633839Y, CN 1533239A etc.) when only having considered chip attachment rectilinear motion and do not consider the position of rotation compensation of chip, angle did not have the occasion of accurate requirement when this chip pick-and-place device generally only was fit to mount.
Summary of the invention
The object of the present invention is to provide a kind of chip pick-and-place control method, realize the reliable bonding of chip and prevent that effectively chip from damaging because pressure is excessive in the process of mounting.
Another object of the present invention is to provide a kind of two-freedom chip pick-and-place device, finish picking up of thin chip, and behind the pose of correcting chip, mount, finally realize the reliable bonding of chip and prevent that effectively chip from damaging because pressure is excessive in the process of mounting.
A kind of chip pick-and-place control method is specially: the chip pick-and-place device is with the first speed V
1Drop to the speed switching position, it directly is decelerated to second speed V
2, again with second speed V
2Drop to chip and wait to pick up or mount the place, finish chip pickup or mount 0.2m/s≤V
1≤ 0.3m/s, 0.02≤V
2≤ 0.04m/s.
A kind of chip pick-and-place device comprises supporting mechanism 30, straight line driving mechanism 10, rotary drive mechanism 20, spline 24 and chip pick-and-place mechanism 40 mounted thereto, and spline 24 comprises splined shaft 242 and is enclosed within its surperficial splined shaft 242;
Straight line driving mechanism 10 comprises linear drives voice coil motor 11, spring 22, electric limit assembly 13 and motor position detection components 14, linear drives voice coil motor 11 connects splined shaft 242 1 ends, the other end of splined shaft 242 connects chip pick and place machine structure 40, splined shaft 242 is provided with spring 22, one side of splined shaft 242 is provided with electric limit assembly 13, and opposite side is provided with motor position detection components 14;
Rotary drive mechanism 20 comprises transmission mechanism and rotary drive motor 23, and spline housing 243 connects rotary drive motor 23 by transmission mechanism.
Control method of the present invention has been optimized the rate curve that control is mixed in classical power/position, motor speed when position control mode switches to speed control mode is decelerated to zero and then to accelerate to a lower speed-optimization be that speed directly carries out the transition to a lower speed from high deceleration earlier, thereby reduced the impulsive force of moderating process.Pick device employing voice coil motor is realized the switching controls of three kinds of patterns, and has designed rotary drive mechanism and before chip attachment the chip pose has been proofreaied and correct, and realizes the reliable bonding and the accurate pose paster of chip.
Description of drawings
Fig. 1 is the general structure schematic diagram of a kind of embodiment of apparatus of the present invention;
Fig. 2 is the three-dimensional exploded view of Fig. 1 cathetus driving mechanism;
Fig. 3 is the three-dimensional exploded view of Fig. 2 bottom bracket structure;
Fig. 4 is the three-dimensional exploded view of rotary drive mechanism among Fig. 1;
Fig. 5 is the flow chart of chip attachment process;
Fig. 6 is the rate curve schematic diagram of chip attachment decline process, and Fig. 6 (a) is the speed curve diagram that control is mixed in existing classical power/position, and Fig. 6 (b) is the speed curve diagram of control method of the present invention.
Embodiment
As shown in Figure 1, chip pick-and-place device of the present invention can be divided into five parts according to component movement mode and function, be respectively straight line driving mechanism 10, rotary drive mechanism 20, supporting mechanism 30, spline and chip pick-and-place mechanism 40.Spline mainly comprises splined shaft 242 and spline housing 243.
As shown in Figure 1, supporting mechanism 30 mainly comprises linear drives voice coil motor mounting panel 31, base plate 32, seal cover board 33 and Z-shaped plate 34, wherein base plate 32 is fundamental parts of whole pick and place device, all parts all directly or mounted thereto indirectly, and it also is the union piece of pick and place device and other parts.Voice coil motor mounting panel 31 is connected in the top of base plate 32, and the counter sink that circumference array distributes on it then is the hole that installs and fixes of voice coil motor stator.Z-shaped plate 34 is fixed on the base plate 32 by the side, and rotation drive stepping motor 23 has been installed on its right, and spline 24 has been installed on the left side.33 of seal cover boards directly are connected on the Z-shaped plate 34.
Shown in Fig. 2 and 3, straight line driving mechanism 10 mainly comprises linear drives voice coil motor 11, straight-line guidance assembly 12 electric limit assemblies 13, motor position detection components 14, spring 22.Guide rail 123 in the straight-line guidance assembly 12 is placed on the base plate 32, lay slide block 122 on the guide rail 123, one end of slide block 122 connects linear drives voice coil motor 11, the other end of slide block 122 connects splined shaft 242, splined shaft 242 connects chip pick and place machine structure 40, be with spring 22 on the splined shaft 242 between slide block 122 and chip pick-and-place mechanism 40, a side of guide rail 123 is provided with electric limit assembly 13, and the opposite side of guide rail 123 is provided with motor position detection components 14.Each modular construction and mounting means are as follows in detail:
The top and the voice coil motor mounting panel 31 of the stator 111 of voice coil motor 11 are connected, there is not matching relationship between voice coil motor mover 112 and the stator 111, when giving the electric current of mover 112 logical different sizes and different rates of change, it realizes the motion of different acceleration, actuating force under the effect in stator 111 generation magnetic fields.This voice coil motor 11 can adopt Position Control, speed control, three kinds of patterns of power control at least, and can arbitrarily change between three kinds of patterns, and these some functions all follow the controller of voice coil motor itself relevant with driver and control method thereof certainly.There are four of circumference array the lower end of voice coil motor mover 112, is connected with it in the hole of L type keyset 121 by correspondence position.The surface that L type keyset 121 is vertical with voice coil motor mover 112 lower surfaces is connected with slide block 122,123 on guide rail directly directly is connected on the base plate 32 by screw thread, a guide vane end stop 124 has been installed at the two ends of line slideway respectively, the guide rail 123 in case limited slip block 122 slips away.The formed plane of axis of the symmetrical axis of line slideway 123 and voice coil motor 11 and the Surface Vertical of base plate 32, this virtual plane, base plate 32 planes and voice coil motor mounting panel 31 plane threes intersect vertically in twos, can set up a frame of reference according to these three planes, this coordinate system as shown in Figure 2.In this coordinate system, straight-line guidance assembly 12 is positioned at Z forward, the Y negative sense of voice coil motor 11, and X overlaps to both.
Motor position detection components 14 is positioned at the X forward of straight-line guidance assembly, base plate 32 right sides.Motor position detection components 14 is made of grating chi zero point sensor 141, grating chi mounting panel 142, grating chi 143 and grating ruler reading head 144, is used for detecting in real time voice coil motor mover 112 residing positions, and then accurately determines the switching position of each pattern.Two counter sinks are arranged on the grating chi mounting panel 142, pack into and can directly be connected on the L type keyset 121 behind the bolt, grating chi mounting panel 142 sides are bonded in preposition with grating chi 143 after with the acetone scrub, and the two ends of grating chi 143 fix with the little briquetting bonding that carries.Two bolts of grating chi zero point sensor 141 usefulness directly are connected in the Y forward of the side grating chi 143 of grating chi mounting panel 142.144 direct back side bolt of grating ruler reading head from base plate 32, when read head is installed, must guarantee X between grating ruler reading head 144 and the grating chi 143 to spacing, and grating ruler reading head 144 and grating chi zero point sensor 141 both Y to spacing.
Be with a spring 22 between splined shaft 242 top shoes 122 and chip pick-and-place mechanism 40, a flexible plastic tube can be installed in the outside of this spring, prevents the splined shaft 242 exposed pollutions that are subjected to extraneous dust outside.Spring 22 is in compressive state always, guarantee that chip pick-and-place mechanism 40 is in retracted mode always under the situation that does not have linear drives power, and along with the decline decrement of chip pick-and-place mechanism 40 increases, under normal operation, also can weaken the shock effect of linear drives power on the other hand, prevent the actuating force overshoot.
Chip pick-and-place mechanism 40 comprises tracheae connector 41, suction nozzle fixture 42 and rubber suction nozzle 43.The end of splined shaft 242 is equipped with suction nozzle fixture 42, it is by being threaded into an end of splined shaft 242, tighten behind this screw thread pair and be screwed into a holding screw respectively in two minor thread holes on suction nozzle fixture 42 peripheries, prevent that this thread connection is loosening, rubber suction nozzle 43 directly is inserted on the small boss of suction nozzle fixture 42 and gets final product, and suction nozzle 43 has just moved with splined shaft 242 like this.
As shown in Figure 4, the angle that rotary drive mechanism 20 is used to correct chip on the suction nozzle 43 realizes mounting with accurate, consistent angle to guarantee chip, and these parts mainly comprise rotary drive motor 23, the adaptor 25 that rotatablely moves, synchronous belt drive mechanism 26 and return spare part.Spline housing 243 is enclosed within on the splined shaft 242, and between spring 22 and chip pick-and-place mechanism 40, spline housing 243 surfaces are with spline fitting 241.Spline fitting 241, spline housing 243 and splined shaft 242 are formed spline 24 together.Spline fitting 241 is interfaces of spline 24 and other parts, and four through holes of circumference array are arranged on it, and bolt can pass this through hole and Z-shaped plate 34 is connected.Spline fitting 241 has a circle ball with 243 of spline housings, this circle ball makes both fix in axial holding position on the one hand, make on the other hand between the two and can have related rotation, spline fitting 241 is fixed in this programme, spline housing 243 obtains behind the rotary driving force and then will rotatablely move passing to splined shaft 242, so far splined shaft 242 has just been realized straight line simultaneously and has been rotatablely moved as the main shaft of pick and place device, spline 24 realize simultaneously rotatablely moving in the present invention program effect of transmission and straight-line guidance.Spline housing 243 connects rotary drive motor 23 by synchronous belt drive mechanism 26.Synchronous belt drive mechanism 26 comprises driven pulley 261, is with 262 and driving wheel 263 synchronously.261 of spline housing 243 and driven pulleys join by the adaptor 25 that rotatablely moves, stepping motor 23 is fixed on the right side of Z-shaped plate 34, the driving wheel 263 of synchronous belt drive mechanism 26 is connected on the output shaft of stepping motor 23,261 of driven pulleys are fixed on the cylinder adaptor 252, adjust driving wheel 263 in the axial position of rotary drive motor 23 according to the Z of driven pulley 261 to the position, make driving wheel 263 and driven pulley 261 at Z to concordant.Returning spare part is used for providing an accurate target reference position to the anglec of rotation adjustment of splined shaft 242, it constitutes by returning zero transducer 27 and Z type shielding plate 28, before the device work, at first drive splined shaft 242 rotations, Z type shielding plate 28 is followed together and is rotated, when it forwards the somewhere to and triggers back zero transducer 27, this position is designated as the target reference position.When rotary drive motor 23 itself has positioning function, then do not need back spare part.Rotary drive motor 23 can adopt stepping motor or servomotor.
Rotation for fear of splined shaft 242 drives 112 rotations of voice coil motor mover, rectilinear motion to voice coil motor 11 has a negative impact, be fixed with bearing near 11 of linear drives voice coil motors on the splined shaft 242 of the present invention, increase the fixed support part of bearing 214 simultaneously, thereby formed moving shaft holder 21.Moving shaft holder 21 directly is fixed on the L type keyset 121, and it forms structure as shown in Figure 4.Wherein two bearing 214 end faces are assemblied in the bearing chamber base 215 with fitting tightly, one outer ring adjustable ring 213 is arranged on the outer ring of bearing, compress bearing 214 by outer ring adjustable ring 213 when but the thickness of repair outer ring adjustable ring 213 assurance bearing chamber loam cake 211 fits tightly with bearing chamber base 215 during assembling, thereby make bearing not have the kinematic accuracy that end play guarantees rectilinear direction.Inner ring one end of two bearings 214 adopts the shaft shoulder of splined shaft 242 to position, the other end encircles in the inner ring adjustment under the effect of 212 gentle pipe connections 41 and positions, tighten the binding thread of tracheae connector 41 and splined shaft 242, can make inner ring adjustment ring 212 press the inner ring of bearing 214, realize that inner ring does not have gap, no axial endplay.Moving shaft holder has been eliminated splined shaft 242 rotations, and (splined shaft 242 when rotated to the influence of voice coil motor, the inner ring of bearing 214 and then rotates and the outer ring is motionless, moving shaft holder 21 whole nothings are rotated), and the rectilinear motion of voice coil motor mover 112 passed to splined shaft 242, be vital assembly in the decoupling-structure of the present invention.
Under some specific application scenario, this invention can also be done some simplification or Structure Conversion, and embodiment is as follows:
(1) its rectilinear motion do not had the guiding accuracy of influence or ball spline 24 be enough to satisfy under the situation of required precision of equipment rotatablely moving of voice coil motor mover 112, can remove straight-line guidance assembly 12, directly utilize splined shaft to do rectilinear motion.
(2) can adopt the mode of Magnetic ruler in the not high situation upper/lower positions detection components 14 of linear position required precision.
Consult Fig. 5 and 6, the control method of the pick and place device that the present invention relates to mainly is the control at 11 motions of voice coil motor in chip pick-up and two processes of chip attachment and power.In a duty cycle, pick and place device at first is parked in the chip pick-up position, wait chip to be ready to after, pick and place device has just been started working.
Shown in step 501 among Fig. 5, voice coil motor 11 drives chip pickup and mounts mechanism 40 under position control mode, and 14 pairs of current locations of position probing assembly detect in real time and feedback result is given actuator and then realized that the chip high speed on the suction nozzle 43 drops to target location I (target location I determines generally speaking to drop to the position that distance is treated pick-up chip substrate 0.5～1mm place for chip pick-up mechanism by the experiment of carrying out in advance).This target location I promptly is set at position control mode and speed control mode switching position, and chip just switches to speed control mode after arriving this position.
When carrying out the switching of position control mode and speed control mode, control method of the present invention is mixed control to the power/position of classics and is optimized, Fig. 6 has contrasted the rate curve that classical power/position is mixed control and control method of the present invention, and the Position Control mode that classical power/position mixing is controlled at high-speed motion can adopt when switching to the approaching speed control method of low speed speed is dropped to the zero v that accelerates to again then earlier
2Indirect mode.And in the control method of the present invention, can control voice coil motor when pick and place device will move to target location I slows down, and by suitable calculating, voice coil motor 11 still has a speed v when making chip arrive target location I
2(size is generally 0.02～0.04m/s, and occurrence is decided according to the size of target location I), thus make in the curve after the improvement, when the Position Control mode switches to speed control method, directly carry out the transition to speed v from moderating process
2Meaning from rate curve, the area of graph size that itself and reference axis surround has promptly been expressed the size of displacement, under the identical situation of the kinematic parameter in Position Control stage, surround the identical figure of area size, the maximal rate v in speed control stage before improving
1(0.2m/s≤v
1≤ 0.3m/s) obviously be greater than maximal rate v after the improvement
2The reducing of this maximal rate can make on the one hand the speed that improves whole action deceleration time that shortens under the speed control method; Also can reduce acceleration in the moderating process on the other hand, and then reduce the impulsive force in the chip attachment process, thereby chip is farthest protected.
Shown in step 502 among Fig. 5, moving under a lower speed after the voice coil motor 11 admission velocity control models further descends chip.This process is to the maximum falling speed v of voice coil motor 11
2Limit and to reduce chip suffered impulsive force when slow down arriving chip pick-up position or chip attachment position.
Shown in step 503 among Fig. 5 and 506, when chip pick-up, voice coil motor 11 slows down and rests on relevant chip absorption position, and chip pick-up mechanism 40 finishes the absorption of chip under the vacuum suction effect, and then voice coil motor 11 is switching to fast rise under the position control mode.So far pick and place device has just realized whole actions of chip pick-up.
Then, the chip pick-and-place device with mass motion directly over chip attachment position vertical.In this motion process, chip will be through a detection position, and this place's testing tool can be a vision system generally speaking.Whether this vision system can be judged on the one hand has chip on the suction nozzle 43 this moment, if do not have the chip pick-and-place device then directly get back to the chip pick-up position, chip is arranged then according to the attained pose of this chip of chip pose image calculation of collecting, this attained pose and standard form are compared obtain deviate and also this deviate is fed back to performance element.Whole in the process of chip attachment position motion in pick and place device, rotating moving part 20 is rectified a deviation to chip according to the result of image processing feedback, guarantee accurately to aim at fixed position on the substrate after chip entangles appearance, guarantee that pick and place device provided by the invention has higher placement accuracy.
Step 501 among Fig. 5 and 502 also is that the chip attachment process must experience.Chip pastes the decline of suction device 40 low speed and finishes through the action that feedback unit detects determining step 502, voice coil motor 11 slow down arrive chip attachment positions (being the speed/power switching position of chip when touching substrate) after, voice coil motor just switches to force control mode by speed control mode.Then, shown in step 504 among Fig. 5 and 505, voice coil motor 11 makes the abundant contact substrate of chip and applies certain pressure under force control mode, this pressure slowly is increased to a threshold value (this threshold value is with thickness, the size of chip, and suction nozzle is relevant with the factors such as material of substrate).After pressure reaches this setting contact pressure threshold value, keep this threshold pressure a period of time (experimentizing the size of force value and the time of exerting pressure according to the firm situation of the necessary bonding of chip in advance) that chip and substrate are reliably bondd then.Afterwards, chip paste to be inhaled device and is just closed vacuum suction and then open vacuum immediately and arrange soon, suction nozzle and chip surface no longer is attached together, meanwhile voice coil motor 11 fast rise under position control mode, vacuum is closed the action of completing steps 506 after coming the time-delay certain hour soon.Last pick and place device integral body is got back to the chip pick-up position by the chip attachment position under the transportation of X-Y workbench.So far this pick and place device is just finished the absorption of chip and the complete motion flow of a cover that mounts.
Claims (6)
1. chip pick-and-place control method, be specially: the chip pick-and-place device is with the first speed V
1Drop to the speed switching position, it directly is decelerated to second speed V
2, again with second speed V
2Drop to chip and wait to pick up or mount the place, finish chip pickup or mount, wherein 0.2m/s≤V
1≤ 0.3m/s, 0.02≤V
2≤ 0.04m/s.
2. chip pick-and-place control method according to claim 1 is characterized in that, described speed switching position is meant that the chip pick-and-place device is apart from chip pickup or mount 0.5～1mm place, position.
3. chip pick-and-place device, comprise supporting mechanism 30, straight line driving mechanism (10), rotary drive mechanism (20), spline (24) and chip pick-and-place mechanism (40) mounted thereto, spline (24) comprises splined shaft (242) and is enclosed within its surperficial splined shaft (242);
Straight line driving mechanism (10) comprises linear drives voice coil motor (11), spring (22), electric limit assembly (13) and motor position detection components (14), linear drives voice coil motor (11) connects splined shaft (242) one ends, the other end of splined shaft (242) connects chip pick and place machine structure (40), splined shaft (242) is provided with spring (22), one side of splined shaft (242) is provided with electric limit assembly (13), and opposite side is provided with motor position detection components (14);
Rotary drive mechanism (20) comprises transmission mechanism and rotary drive motor (23), and spline housing (243) connects rotary drive motor (23) by transmission mechanism.
4. chip pick-and-place device according to claim 3, it is characterized in that, between linear drives voice coil motor (11) and splined shaft (242), be provided with straight-line guidance assembly (12), straight-line guidance assembly (12) comprises guide rail (123) and puts thereon slide block (122), slide block (122) one ends connect linear drives voice coil motor (11), and the other end connects splined shaft (242).
5. chip pick-and-place device according to claim 4 is characterized in that, is fixed with bearing at splined shaft 242 near the axial end of linear drives voice coil motors 11, and wherein bearing inner race is connected with splined shaft, and bearing outer ring links to each other with voice coil motor.
6. according to claim 3 or 4 or 5 described chip pick-and-place devices, it is characterized in that described rotary drive motor (23) is servomotor or stepping motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102726854A CN101707181B (en) | 2009-11-06 | 2009-11-06 | Chip pick-and-place control method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102726854A CN101707181B (en) | 2009-11-06 | 2009-11-06 | Chip pick-and-place control method and device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100666714A Division CN102157351B (en) | 2009-11-06 | 2009-11-06 | Chip pickup and placement control method |
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| CN101707181A true CN101707181A (en) | 2010-05-12 |
| CN101707181B CN101707181B (en) | 2011-08-10 |
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