CN114760776A - High-precision chip mounter welding head mechanism - Google Patents
High-precision chip mounter welding head mechanism Download PDFInfo
- Publication number
- CN114760776A CN114760776A CN202210512163.2A CN202210512163A CN114760776A CN 114760776 A CN114760776 A CN 114760776A CN 202210512163 A CN202210512163 A CN 202210512163A CN 114760776 A CN114760776 A CN 114760776A
- Authority
- CN
- China
- Prior art keywords
- ball spline
- welding head
- spline shaft
- connecting piece
- chip mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Die Bonding (AREA)
Abstract
A high-precision chip mounter welding head mechanism comprises a welding head base, a rotary bearing integrated ball spline, a suction head, a synchronous belt and a rotary bearing integrated ball spline, wherein the welding head base is arranged on the front side of a fixing frame; the upper end of the hollow ball spline shaft is connected with a vacuum air inlet block, and the vacuum air inlet block is connected with a low-friction air cylinder; a connecting piece is arranged on the front side of a rotor of the voice coil motor, and a guide rail is arranged on the front side of the connecting piece; one side of the welding head base is matched with the guide rail to install a sliding block, the connecting piece is connected with a lower pressure bearing, a fixed ring is arranged on the hollow ball spline shaft, and the front end of the lower pressure bearing is positioned above the fixed ring. The invention simultaneously satisfies the accurate force control of the welding head, the accurate control of high rotation precision and height position, realizes perfect substitution for the welding head structure of the existing chip mounter, and satisfies the technical requirements of the high-precision chip mounter for picking and placing chips.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging.
Background
The high-precision chip mounter is indispensable equipment in the packaging process of an integrated circuit, and is mainly used for completing the chip mounting step in the packaging process. Die-bonding is the assembly of the die onto a lead frame. The bonding head mechanism is the most critical component of the chip mounter, and is used for taking down the chip from the wafer and then placing the chip on the lead frame. The bonding tool needs to have the ability to vacuum, the ability to rotate an angle, and the amount of force required to contact the die needs to be precisely controlled.
The existing welding head structure is mainly divided into 2 types, one type is a welding head without a rotation function, and the other type is a welding head with a rotation function. The load control of the welding head is either spring control or single control of a voice coil or an air cylinder. The welding head with the rotation function is difficult to meet the requirements of accurate force control, high rotation precision and high position precision simultaneously due to the complex structure of the welding head.
Disclosure of Invention
In order to solve the problems of the existing chip mounter welding head, the invention provides a high-precision chip mounter welding head mechanism.
The technical scheme adopted by the invention for realizing the purpose is as follows: a high-precision chip mounter welding head mechanism comprises a welding head base 5, a rotary bearing integrated type ball spline 1, a hollow ball spline shaft 22, a suction head 8 and a ball spline side synchronous belt pulley 24, wherein the welding head base 5 is installed on the front side of a fixing frame 15; a rotary driving motor 11 is arranged on the fixed frame 15, a motor side synchronous pulley 20 is arranged on an output shaft of the rotary driving motor 11, and a synchronous belt 16 is arranged between the motor side synchronous pulley 20 and a ball spline side synchronous pulley 24; the upper end of the hollow ball spline shaft 22 is connected with a vacuum air inlet block 2, and the vacuum air inlet block 2 is connected with a low-friction cylinder 4; a voice coil motor is arranged on the fixed frame 15, a voice coil motor stator 19 is fixed on the fixed frame 15, a connecting piece 18 is arranged on the front side of the voice coil motor rotor 12, a guide rail 17 is arranged on the front side of the connecting piece 18, and the low-friction cylinder 4 is positioned above the connecting piece 18; one side of the welding head base 5 is matched with the guide rail 17 to install the sliding block 3, the connecting piece 18 is connected with the lower pressure bearing 13, the hollow ball spline shaft 22 is provided with the fixing ring 14, and the front end of the lower pressure bearing 13 is positioned above the fixing ring 14.
The hollow ball spline shaft 22 is mounted on the welding head base 5 through a slewing bearing 21, and a ball spline shaft sleeve 23 is mounted on the hollow ball spline shaft 22.
The lower end of the hollow ball spline shaft 22 is provided with a hollow absorbing head rod 6, a magnet 7 is arranged on the absorbing head rod 6, the absorbing head rod 6 is provided with a hollow absorbing head 8 through the magnet, and a sealing ring 9 is arranged between the absorbing head 8 and the absorbing head rod 6.
A compression spring 25 is arranged between the lower side of the low-friction cylinder 4 and the connecting piece 18.
The grating encoder 10 is mounted on the connecting piece 18.
The high-precision chip mounter welding head mechanism simultaneously meets the requirements of accurate force control, high rotation precision and accurate control of height position of the welding head, realizes perfect substitution for the existing chip mounter welding head structure, and meets the technical requirements of the high-precision chip mounter on chip picking and placing.
Drawings
Fig. 1 is a front view of a bonding head mechanism of the high-precision chip mounter according to the present invention.
Fig. 2 is an exploded view of a bonding head mechanism of the high-precision chip mounter according to the present invention.
Fig. 3 is a perspective view of a bonding head mechanism of the high-precision chip mounter according to the present invention.
Fig. 4 is a front sectional view of a bonding head mechanism of the high-precision chip mounter according to the present invention.
Fig. 5 is a structure diagram of a swivel bearing integrated ball spline of the high-precision chip mounter welding head mechanism according to the present invention.
In the figure: 1. the device comprises a slewing bearing integrated ball spline, 2, a vacuum air inlet block, 3, a sliding block, 4, a low-friction cylinder, 5, a welding head base, 6, a suction head rod, 7, a magnet, 8, a suction head, 9, a sealing ring, 10, a grating encoder, 11, a rotary driving motor, 12, a voice coil motor mover, 13, a lower pressure bearing, 14, a fixing ring, 15, a fixing frame, 16, a synchronous belt, 17, a guide rail, 18, a connecting piece, 19, a voice coil motor stator, 20, a motor side synchronous belt pulley, 21, a slewing bearing, 22, a hollow ball spline shaft, 23, a ball spline shaft sleeve, 24, a ball spline side synchronous belt pulley, 25 and a compression spring.
Detailed Description
As shown in fig. 1-4, the welding head mechanism of the high-precision chip mounter is characterized in that a welding head base 5 is installed on the front side of a fixing frame 15, a rotary bearing integrated type ball spline 1 is longitudinally installed on the welding head base 5, a hollow ball spline shaft 22 is arranged in the center of the rotary bearing integrated type ball spline 1, as shown in fig. 5, the hollow ball spline shaft 22 is installed on the welding head base 5 through a rotary bearing 21, and a ball spline shaft sleeve 23 is installed on the hollow ball spline shaft 22. A hollow absorbing head rod 6 is arranged at the lower end of the hollow ball spline shaft 22, a magnet 7 is arranged on the absorbing head rod 6, the absorbing head rod 6 is provided with a hollow absorbing head 8 through the magnet, a sealing ring 9 is arranged between the absorbing head 8 and the absorbing head rod 6, and a ball spline side synchronous belt pulley 24 is arranged on the hollow ball spline shaft 22; a rotary driving motor 11 is arranged on the fixed frame 15, a motor side synchronous pulley 20 is arranged on an output shaft of the rotary driving motor 11, and a synchronous belt 16 is arranged between the motor side synchronous pulley 20 and a ball spline side synchronous pulley 24; the upper end of the hollow ball spline shaft 22 is connected with a vacuum air inlet block 2, and the vacuum air inlet block 2 is connected with a low-friction cylinder 4; a voice coil motor is arranged on the fixed frame 15, a voice coil motor stator 19 is fixed on the fixed frame 15, a connecting piece 18 is arranged on the front side of a rotor 12 of the voice coil motor, a guide rail 17 is arranged on the front side of the connecting piece 18, the low-friction cylinder 4 is positioned above the connecting piece 18, a grating encoder 10 is arranged on the connecting piece 18, and a compression spring 25 is arranged on the lower side of the low-friction cylinder 4; one side of the welding head base 5 is matched with the guide rail 17 to install the sliding block 3, the connecting piece 18 is connected with the lower pressure bearing 13, the hollow ball spline shaft 22 is provided with the fixing ring 14, and the front end of the lower pressure bearing 13 is positioned above the fixing ring 14.
The working principle is as follows: the rotation driving motor 11 is connected with a motor side synchronous pulley 20, and drives the slewing bearing integrated ball spline 1 to rotate through a synchronous belt 16, so that the rotation function of the welding head suction head rod 6 is realized, and the welding head suction head rod can rotate at any angle of 360 degrees. The low friction cylinder 4 introduces vacuum through the vacuum inlet block 2, passes through the hollow ball spline shaft 22 to the suction head rod 6, and then to the suction head 8, and realizes the vacuum suction function of the suction head 8. Compressed gas is introduced into the low-friction cylinder 4, downward pressure is generated to act on the connecting piece 18, the voice coil motor rotor 12 is fixed on the connecting piece 18, the connecting piece 18 is connected with the guide rail 17, and downward or upward force is generated by the voice coil motor rotor 12 to act on the connecting piece 18; the compression spring 25 compresses itself to generate a downward force acting on the connecting piece 18; the connecting piece 18 is connected with a lower pressure bearing 13, the lower pressure bearing 13 enables the resultant force of the low-friction cylinder 4, the voice coil motor rotor 12 and the compression spring 25 to act on the fixing ring 14, the fixing ring 14 is fixed with the hollow ball spline shaft 22, and the force is transmitted to the hollow ball spline shaft 22 to the suction head rod 6 and then to the suction head 8, so that the force control during chip pickup is realized. The grating encoder 10 reads the up-down position of the connecting piece 18, and the positions of the connecting piece 18 and the suction head 8 are completely synchronous movement and have the same variation, so the film taking height can be accurately fed back in real time.
The pressure of the welding head contacting the chip is accurately controlled by the voice coil motor and the bottom friction cylinder 4, and can be accurately controlled within +/-5 g within the range of 30g-3 Kg; the force control structure is independently arranged on a sliding block 3 and absorbs the downward pressing conduction force of the rod spline shaft through a bearing with the welding head, and the precision of load control cannot be influenced due to poor parallelism of the two assemblies. The height position of the welding head rod when sucking the chip is fed back accurately through the grating encoder. The magnetic suction head structure with high precision avoids the problems of vacuum leakage and eccentricity of the suction head caused by a jackscrew structure, and the suction head is more quickly and conveniently replaced. The whole welding head is small in structure, highly integrated, made of aviation aluminum materials and smaller than 300g in total mass.
The present invention has been described in terms of embodiments, and it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides a high accuracy chip mounter bonding tool mechanism which characterized in that: a welding head base (5) is arranged on the front side of the fixing frame (15), a slewing bearing integrated ball spline (1) is longitudinally arranged on the welding head base (5), a hollow ball spline shaft (22) is arranged at the center of the slewing bearing integrated ball spline (1), a suction head (8) is arranged at the lower end of the hollow ball spline shaft (22), and a ball spline side synchronous pulley (24) is arranged on the hollow ball spline shaft (22); a rotary driving motor (11) is arranged on the fixed frame (15), a motor side synchronous pulley (20) is arranged on an output shaft of the rotary driving motor (11), and a synchronous belt (16) is arranged between the motor side synchronous pulley (20) and the ball spline side synchronous pulley (24); the upper end of the hollow ball spline shaft (22) is connected with a vacuum air inlet block (2), and the vacuum air inlet block (2) is connected with a low-friction air cylinder (4); a voice coil motor is arranged on the fixed frame (15), a stator (19) of the voice coil motor is fixed on the fixed frame (15), a connecting piece (18) is arranged on the front side of a rotor (12) of the voice coil motor, a guide rail (17) is arranged on the front side of the connecting piece (18), and the low-friction cylinder (4) is positioned above the connecting piece (18); one side of the welding head base (5) is matched with the guide rail (17) to install the sliding block (3), the connecting piece (18) is connected with the lower pressure bearing (13), the hollow ball spline shaft (22) is provided with the fixing ring (14), and the front end of the lower pressure bearing (13) is positioned above the fixing ring (14).
2. The high-precision bonding tool mechanism of the chip mounter according to claim 1, wherein: the hollow ball spline shaft (22) is arranged on the welding head base (5) through a rotary bearing (21), and a ball spline shaft sleeve (23) is arranged on the hollow ball spline shaft (22).
3. The high-precision bonding tool mechanism of the chip mounter according to claim 1, wherein: the hollow ball spline shaft is characterized in that a hollow suction head rod (6) is arranged at the lower end of the hollow ball spline shaft (22), a magnet (7) is installed on the suction head rod (6), the suction head rod (6) is provided with a hollow suction head (8) through the magnet, and a sealing ring (9) is arranged between the suction head (8) and the suction head rod (6).
4. The high-precision bonding tool mechanism of the chip mounter according to claim 1, wherein: and a compression spring (25) is arranged between the lower side of the low-friction cylinder (4) and the connecting piece (18).
5. The high-precision bonding tool mechanism of the chip mounter according to claim 1, wherein: and the grating encoder (10) is arranged on the connecting piece (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210512163.2A CN114760776B (en) | 2022-05-12 | 2022-05-12 | High-precision welding head mechanism of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210512163.2A CN114760776B (en) | 2022-05-12 | 2022-05-12 | High-precision welding head mechanism of chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114760776A true CN114760776A (en) | 2022-07-15 |
| CN114760776B CN114760776B (en) | 2023-07-25 |
Family
ID=82336033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210512163.2A Active CN114760776B (en) | 2022-05-12 | 2022-05-12 | High-precision welding head mechanism of chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114760776B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090255979A1 (en) * | 2008-04-11 | 2009-10-15 | Tdk Corporation | Ultrasonic mounting apparatus |
| CN101707181A (en) * | 2009-11-06 | 2010-05-12 | 华中科技大学 | Chip pick-and-place control method and device |
| CN104942872A (en) * | 2015-05-14 | 2015-09-30 | 重庆大学 | Method for achieving punch rod moving through voice coil motor during numerical control punching and coining |
| US20160186732A1 (en) * | 2012-05-04 | 2016-06-30 | Zhejiang Fai Electronics Co., Ltd. | Energy-storing-type high-pressure electric fuel pump, fuel-supplying apparatus, and application method therefor |
| CN110446424A (en) * | 2019-08-30 | 2019-11-12 | 恩纳基智能科技无锡有限公司 | Multi-functional double-station flexibility Welding head mechanism |
| CN215100624U (en) * | 2021-04-25 | 2021-12-10 | 湖南健坤激光科技有限公司 | Voice coil motor material taking and placing mechanism |
-
2022
- 2022-05-12 CN CN202210512163.2A patent/CN114760776B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090255979A1 (en) * | 2008-04-11 | 2009-10-15 | Tdk Corporation | Ultrasonic mounting apparatus |
| CN101707181A (en) * | 2009-11-06 | 2010-05-12 | 华中科技大学 | Chip pick-and-place control method and device |
| US20160186732A1 (en) * | 2012-05-04 | 2016-06-30 | Zhejiang Fai Electronics Co., Ltd. | Energy-storing-type high-pressure electric fuel pump, fuel-supplying apparatus, and application method therefor |
| CN104942872A (en) * | 2015-05-14 | 2015-09-30 | 重庆大学 | Method for achieving punch rod moving through voice coil motor during numerical control punching and coining |
| CN110446424A (en) * | 2019-08-30 | 2019-11-12 | 恩纳基智能科技无锡有限公司 | Multi-functional double-station flexibility Welding head mechanism |
| CN215100624U (en) * | 2021-04-25 | 2021-12-10 | 湖南健坤激光科技有限公司 | Voice coil motor material taking and placing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114760776B (en) | 2023-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107387959B (en) | Integrated high-speed ultra-precise positioning two-dimensional platform | |
| CN109640616A (en) | High-speed, high precision mounting head | |
| CN114760776B (en) | High-precision welding head mechanism of chip mounter | |
| CN110446424A (en) | Multi-functional double-station flexibility Welding head mechanism | |
| CN112701065B (en) | Automatic chip mounter | |
| CN104966687A (en) | Bond head device | |
| CN115623697B (en) | Chip mounting mechanism | |
| CN209787739U (en) | high-speed high-precision mounting head | |
| US8256658B2 (en) | Wire bonding apparatus comprising rotary positioning stage | |
| CN216727988U (en) | Workpiece dispensing equipment | |
| CN115560793A (en) | High-speed rotation detection platform of magnetic encoder | |
| CN112103211B (en) | Multi-head chip pick-up binding mechanism | |
| CN207834259U (en) | A kind of nation's head improved structure of bonder | |
| JP3494144B2 (en) | Positioning device | |
| CN209242062U (en) | A kind of horizontal ruler ruler body material arranging apparatus | |
| CN219591374U (en) | Pushing device and chip loading machine | |
| CN209902615U (en) | Module is paid to lock | |
| CN203887630U (en) | Air floating type linear grating ruler device | |
| CN210668286U (en) | Chip laminating mechanism and chip assembly equipment | |
| CN220041799U (en) | ZR module with buffering and pressure closed loop | |
| CN215853899U (en) | Material taking and placing mechanism | |
| CN110890298A (en) | High-efficient double-end solid brilliant device | |
| CN219577428U (en) | Tin drawing device suitable for chip mounter | |
| CN218916404U (en) | Magnetic encoder high-speed rotation detection platform | |
| CN216154930U (en) | Four-axis gantry module for taking and placing materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |