CN216084827U - Wafer moving mechanism - Google Patents
Wafer moving mechanism Download PDFInfo
- Publication number
- CN216084827U CN216084827U CN202122245894.9U CN202122245894U CN216084827U CN 216084827 U CN216084827 U CN 216084827U CN 202122245894 U CN202122245894 U CN 202122245894U CN 216084827 U CN216084827 U CN 216084827U
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- axis
- wafer
- module
- plate
- driving motor
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Abstract
The utility model aims to provide a wafer moving mechanism which is compact in structure, fast in moving and accurate in positioning. The wafer fixing jig comprises a two-axis moving module and a rotating module, wherein the rotating module is arranged at the movable end of the two-axis moving module and comprises a fixed plate, a rotating block, a sucker and a bearing plate are sequentially arranged on the fixed plate, a first driving motor is arranged on the fixed plate and is in transmission connection with the rotating block, a plurality of suction nozzles communicated with an external vacuum source are arranged on the sucker, a second driving motor and a transmission block are arranged at the bottom of the sucker, the transmission block is matched with the second driving motor to realize lifting action, stop blocks matched with the sucker are arranged at two ends of the transmission block, a plurality of air cylinders are arranged on the sucker and are in transmission connection with guide pillars, and the guide pillars penetrate through the sucker to be matched with notches of a wafer iron ring product and a wafer fixing product jig. The utility model is applied to the technical field of moving mechanisms.
Description
Technical Field
The utility model is applied to the technical field of moving mechanisms, and particularly relates to a wafer moving mechanism.
Background
In semiconductor chip sorting, chips are often required to be picked and placed on a wafer iron ring or a wafer fixing jig, and in the picking and placing process, the wafer iron ring or the wafer fixing jig is required to be adjusted in an X-axis, a Y-axis and an angle rotation mode, so that a mechanism is required to receive the wafer iron ring or the wafer fixing jig, enable the wafer iron ring or the wafer fixing jig to move in the X-axis and the Y-axis and realize the angle rotation, however, the wafer iron ring or the wafer fixing jig cannot share a wafer moving platform, and the X-axis and the Y-axis drive the wafer iron ring or the wafer fixing jig through a lead screw, so that the moving speed is slow, the positioning accuracy is low, the occupied space is large, and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides a wafer moving mechanism which is compact in structure, fast in moving and accurate in positioning.
The technical scheme adopted by the utility model is as follows: the vacuum suction device comprises a two-axis moving module and a rotating module, wherein the rotating module is arranged at the movable end of the two-axis moving module and comprises a fixed plate, a rotating block, a suction disc and a bearing plate are sequentially arranged on the fixed plate, a first driving motor is arranged on the fixed plate and is in transmission connection with the rotating block, a plurality of suction nozzles communicated with an external vacuum source are arranged on the suction disc, a second driving motor and a transmission block are arranged at the bottom of the suction disc, the transmission block is matched with the second driving motor to realize lifting action, and stop blocks matched with the suction disc are arranged at two ends of the transmission block.
According to the scheme, the two-axis moving module drives the rotating module to move in the X axis and the Y axis, the sucker is provided with a groove matched with the bearing plate, the bearing plate is arranged on the groove, the sucker is provided with a plurality of suction nozzles communicated with an external vacuum source, the second driving motor drives the transmission block to slide up and down through the transmission matching of the lead screw, the second driving motor drives the two stop blocks to move upwards to place the wafer iron ring product on the bearing plate, the second driving motor drives the two stop blocks to move downwards to realize the transverse limiting and fixing of the wafer iron ring product, the suction nozzles suck vacuum to enable the wafer iron ring product to be firmly adsorbed on the bearing plate to realize the longitudinal limiting and fixing of the wafer iron ring product, so that the limiting and fixing of the wafer iron ring product in the three-dimensional direction are realized, the first driving motor is in transmission fit with the rotating block through a belt, rotation adjustment is carried out according to the taking and placing angles, and if a wafer fixing jig product is taken and placed, the receiving plate is directly removed to carry out the same action.
According to a preferred scheme, the sucker is provided with a plurality of air cylinders, the air cylinders are in transmission connection with guide pillars, and the guide pillars penetrate through the sucker to be matched with notches of the wafer iron ring product and the wafer fixing jig product.
According to the scheme, the output end of the air cylinder is in transmission connection with the guide pillar, the guide pillar is used for positioning the wafer iron ring product and the wafer fixing jig product, the air cylinder drives the guide pillar to move upwards, the notch on the wafer iron ring product or the wafer fixing jig product is aligned and clamped into the guide pillar, the suction nozzle sucks vacuum to enable the wafer iron ring product or the wafer fixing jig product to be firmly adsorbed, the air cylinder drives the guide pillar to move downwards, the guide pillar still clamps the wafer iron ring product or the wafer fixing jig product after descending, and meanwhile, the movement of an external material taking mechanism can be avoided.
One preferred scheme is, the diaxon removes the module and includes bottom plate and mounting panel, be provided with Y axle straight line module on the bottom plate and two sets of with the parallel Y axle guide rail of Y axle straight line module, the one end setting of mounting panel is in the expansion end of Y axle straight line module, the other end and two sets of the mounting panel Y axle guide rail sliding fit, be provided with X axle straight line module on the mounting panel and two sets of with the parallel X axle guide rail of X axle straight line module, the one end setting of fixed plate is in the expansion end of X axle straight line module, the other end and two sets of the fixed plate X axle guide rail sliding fit.
According to the scheme, the two-axis moving module realizes the movement of the X axis and the Y axis of the rotating module through the matching of the X axis linear module and the Y axis linear module, the X axis guide rail and the Y axis guide rail are used for guiding the movement of the rotating module, and the X axis linear module and the Y axis linear module enable the movement of the rotating module to be more flexible and the positioning to be more accurate through the combination of all units.
One preferred scheme is, the mounting panel is close to the one end of X axle guide rail is provided with first installation piece, be provided with on the first installation piece with fixed plate complex X axle grating chi.
It can be seen from the above scheme that the X-axis grating ruler is used for feeding back the position information of the wafer iron ring product or the wafer fixing jig product moving on the X axis, and the movement is ensured to be faster through the cooperation with the X-axis linear module, the grating ruler is also called a grating ruler displacement sensor (grating ruler sensor), and is a measurement feedback device working by using the optical principle of the grating, and the grating ruler displacement sensor is often used for detecting linear displacement or angular displacement, and has the characteristics of large detection range, high detection precision and high response speed.
One preferred scheme is that one end of the bottom plate, which is close to the Y-axis guide rail, is provided with a second mounting block, and the second mounting block is provided with a Y-axis grating ruler matched with the mounting plate.
It can be seen from the above scheme that the Y-axis grating ruler is used for feeding back the position information of the wafer iron ring product or the wafer fixing jig product moving in the Y-axis, and the movement is ensured to be faster through the cooperation with the Y-axis linear module, the grating ruler is also called a grating ruler displacement sensor (grating ruler sensor), and is a measurement feedback device working by using the optical principle of the grating, and the grating ruler displacement sensor is often used for detecting linear displacement or angular displacement, and has the characteristics of large detection range, high detection precision and high response speed.
One preferred scheme is, the both ends symmetry of mounting panel is provided with first bumper, first bumper with slider cooperation on the X axle guide rail.
According to the scheme, the first buffer is used for limiting and buffering the sliding block on the X-axis guide rail, so that the phenomenon that the wafer iron ring product and the wafer fixing jig product are violently vibrated due to the fact that the fixing plate moves over the support in the X-axis direction is avoided.
One preferred scheme is that the both ends symmetry of bottom plate is provided with the second buffer, the bottom of mounting panel is provided with the lug, the second buffer with the lug cooperation.
According to the scheme, the second buffer is used for limiting and buffering the mounting plate, so that the mounting plate is prevented from moving over the support in the Y-axis direction, and the wafer iron ring product and the wafer fixing jig product are prevented from violently vibrating.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an exploded perspective view of the rotating module;
FIG. 3 is a schematic perspective view of the two-axis moving module;
FIG. 4 is a schematic perspective view of the wafer-fixing jig product;
fig. 5 is a schematic perspective view of the wafer iron ring product.
Detailed Description
As shown in fig. 1 to 5, in this embodiment, the present invention includes a two-axis moving module 1 and a rotating module 2, the rotating module 2 is disposed at a movable end of the two-axis moving module 1, the rotating module 2 includes a fixed plate 3, a rotating block 4, a suction cup 5 and a receiving plate 6 are sequentially disposed on the fixed plate 3, a first driving motor 7 is disposed on the fixed plate 3, the first driving motor 7 is in transmission connection with the rotating block 4, a plurality of suction nozzles 8 communicated with an external vacuum source are disposed on the suction cup 5, a second driving motor 9 and a transmission block 10 are disposed at the bottom of the suction cup 5, the second driving motor 9 and the transmission block 10 are matched to implement a lifting action, and both ends of the transmission block 10 pass through the rotating block 4 and are provided with a stopper 11 matched with the suction cup 5.
In this embodiment, the suction cup 5 is provided with a plurality of cylinders 12, the cylinders 12 are connected with guide pillars 13 in a transmission manner, and the guide pillars 13 penetrate through the suction cup 5 to be matched with notches 14 of the wafer iron ring product and the wafer fixing jig product.
In this embodiment, two-axis moving module 1 includes bottom plate 15 and mounting panel 16, be provided with Y axle straight line module 17 on bottom plate 15 and two sets of with the parallel Y axle guide rail 18 of Y axle straight line module 17, the one end setting of mounting panel 16 is in the expansion end of Y axle straight line module 17, the other end and two sets of mounting panel 16Y axle guide rail 18 sliding fit, be provided with X axle straight line module 19 on mounting panel 16 and two sets of with the parallel X axle guide rail 20 of X axle straight line module 19, the one end setting of fixed plate 3 is in the expansion end of X axle straight line module 19, the other end and two sets of fixed plate 3X axle guide rail 20 sliding fit.
In this embodiment, a first mounting block 22 is disposed at one end of the mounting plate 16 close to the X-axis guide rail 20, and an X-axis grating ruler 21 matched with the fixing plate 3 is disposed on the first mounting block 22.
In this embodiment, a second mounting block 24 is disposed at one end of the bottom plate 15 close to the Y-axis guide rail 18, and a Y-axis grating ruler 23 matched with the mounting plate 16 is disposed on the second mounting block 24.
In this embodiment, the two ends of the mounting plate 16 are symmetrically provided with first buffers 25, and the first buffers 25 are matched with the sliding blocks on the X-axis guide rail 20.
In this embodiment, the two ends of the bottom plate 15 are symmetrically provided with second buffers 26, the bottom of the mounting plate 16 is provided with a bump 27, and the second buffers 26 are matched with the bump 27.
The working principle of the utility model is as follows: the second driving motor drives the two stop blocks to move upwards, the cylinder drives the guide post to move upwards, the notch on the wafer iron ring product or the wafer fixing jig product is aligned and clamped into the guide post, the suction nozzle sucks vacuum to enable the wafer iron ring product or the wafer fixing jig product to be firmly adsorbed, the cylinder drives the guide post to move downwards, the second driving motor drives the two stop blocks to move downwards, the first driving motor is in transmission fit with the rotating block through a belt and is adjusted in a rotating mode according to the taking and placing angle, and the two-axis moving module achieves the movement of the X axis and the Y axis of the rotating module through the matching of the X axis linear module and the Y axis linear module.
Claims (7)
1. A wafer moving mechanism is characterized in that: the device comprises a two-axis moving module (1) and a rotating module (2), wherein the rotating module (2) is arranged at the movable end of the two-axis moving module (1), the rotating module (2) comprises a fixed plate (3), a rotating block (4), a sucking disc (5) and a bearing plate (6) are sequentially arranged on the fixed plate (3), a first driving motor (7) is arranged on the fixed plate (3), the first driving motor (7) is in transmission connection with the rotating block (4), the sucking disc (5) is provided with a plurality of suction nozzles (8) communicated with an external vacuum source, the bottom of the sucking disc (5) is provided with a second driving motor (9) and a transmission block (10), the transmission block (10) is matched with the second driving motor (9) to realize lifting action, both ends of the transmission block (10) are provided with stop blocks (11) matched with the suckers (5).
2. The wafer moving mechanism according to claim 1, wherein: the wafer fixing jig is characterized in that the sucker (5) is provided with a plurality of cylinders (12), the cylinders (12) are in transmission connection with guide pillars (13), and the guide pillars (13) penetrate through the sucker (5) to be matched with notches (14) of a wafer iron ring product and a wafer fixing jig product.
3. The wafer moving mechanism according to claim 1, wherein: two-axis moving module (1) comprises a base plate (15) and a mounting plate (16), Y-axis linear module (17) and two sets of Y-axis guide rails (18) parallel to the Y-axis linear module (17) are arranged on the base plate (15), one end of the mounting plate (16) is arranged at the movable end of the Y-axis linear module (17), the other end of the mounting plate (16) is arranged at two sets of Y-axis guide rails (18) in a sliding fit manner, X-axis linear module (19) and two sets of X-axis guide rails (20) parallel to the X-axis linear module (19) are arranged on the mounting plate (16), one end of a fixing plate (3) is arranged at the movable end of the X-axis linear module (19), and the other end of the fixing plate (3) is arranged at two sets of X-axis guide rails (20) in a sliding fit manner.
4. A wafer moving mechanism according to claim 3, wherein: the mounting panel (16) are close to the one end of X axle guide rail (20) is provided with first installation piece (22), be provided with on first installation piece (22) with fixed plate (3) complex X axle grating chi (21).
5. A wafer moving mechanism according to claim 3, wherein: one end of the bottom plate (15) close to the Y-axis guide rail (18) is provided with a second mounting block (24), and a Y-axis grating ruler (23) matched with the mounting plate (16) is arranged on the second mounting block (24).
6. A wafer moving mechanism according to claim 3, wherein: the both ends symmetry of mounting panel (16) is provided with first buffer (25), first buffer (25) with slider cooperation on X axle guide rail (20).
7. A wafer moving mechanism according to claim 3, wherein: the both ends symmetry of bottom plate (15) is provided with second buffer (26), the bottom of mounting panel (16) is provided with lug (27), second buffer (26) with lug (27) cooperation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122245894.9U CN216084827U (en) | 2021-09-16 | 2021-09-16 | Wafer moving mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122245894.9U CN216084827U (en) | 2021-09-16 | 2021-09-16 | Wafer moving mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216084827U true CN216084827U (en) | 2022-03-18 |
Family
ID=80677146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122245894.9U Withdrawn - After Issue CN216084827U (en) | 2021-09-16 | 2021-09-16 | Wafer moving mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216084827U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115180400A (en) * | 2022-08-17 | 2022-10-14 | 深圳市诺泰芯装备有限公司 | High-temperature rotary disc storage device and method |
| CN116729978A (en) * | 2023-08-16 | 2023-09-12 | 长园半导体设备(珠海)有限公司 | Material sorting equipment |
-
2021
- 2021-09-16 CN CN202122245894.9U patent/CN216084827U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115180400A (en) * | 2022-08-17 | 2022-10-14 | 深圳市诺泰芯装备有限公司 | High-temperature rotary disc storage device and method |
| CN116729978A (en) * | 2023-08-16 | 2023-09-12 | 长园半导体设备(珠海)有限公司 | Material sorting equipment |
| CN116729978B (en) * | 2023-08-16 | 2023-11-14 | 长园半导体设备(珠海)有限公司 | Material sorting equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20220318 Effective date of abandoning: 20230327 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20220318 Effective date of abandoning: 20230327 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |