CN110828339A - Material taking unit and die bonder - Google Patents
Material taking unit and die bonder Download PDFInfo
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- CN110828339A CN110828339A CN201910953514.1A CN201910953514A CN110828339A CN 110828339 A CN110828339 A CN 110828339A CN 201910953514 A CN201910953514 A CN 201910953514A CN 110828339 A CN110828339 A CN 110828339A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
The invention relates to a material taking unit and a die bonder, which further comprise a driving device, a parallelism adjusting device and a material taking head, wherein the parallelism adjusting device comprises a first mounting plate and a second mounting plate, the first mounting plate is arranged at the output end of the driving device, the parallelism between the first mounting plate and the second mounting plate is adjustable, the material taking head is fixed on the second mounting plate, and the driving device can drive the material taking head to do linear reciprocating motion. According to the invention, the parallelism between the wafer and the mounting surface of the carrier can be adjusted in time by adjusting the parallelism between the first mounting plate and the second mounting plate, so that the wafer is prevented from being inclined, and the wafer and the carrier are prevented from being bonded insecurely, thereby improving the bonding yield of the wafer and ensuring the product quality.
Description
Technical Field
The invention relates to the technical field of chip die bonding, in particular to a taking unit and a die bonding machine.
Background
The semiconductor packaging is a process of processing a wafer passing through a test according to a product model and a function requirement to obtain an independent chip, and the specific packaging process is that the wafer is cut into small chips through a scribing process, the cut chips are pasted on small islands of corresponding substrate frames through glue, bonding pads of the chips are connected to corresponding pins of the substrates through superfine metal wires or conductive resin to form required circuits, then the independent chips are packaged and protected through plastic shells, and after plastic packaging, the packaging is completed through processes of inspection, testing, packaging and the like.
The material taking device is a core component of the die bonder, and has the function of sucking up the cut and separated die on the die, transferring and placing the die on a carrier (such as a lead frame, a PCB (printed circuit board), and performing adhesion or welding. For this reason, the material taking device is generally designed as a mechanism having two degrees of freedom (Y-axis direction and Z-axis direction), which needs to move to and from two positions, i.e., a pick-up point and a bonding point, precisely and smoothly to perform actions of picking up a wafer, transferring the wafer, bonding the wafer, and the like.
In the process of bonding the wafer, the wafer needs to be aligned with the mounting surface of the carrier and then attached to the mounting surface of the carrier, so that the wafer is prevented from being inclined, the wafer is not firmly attached to the carrier, and at the moment, the spatial angle between the material taking head and the carrier needs to be adjusted, so that the wafer needs to be designed.
Disclosure of Invention
The technical problem to be solved by the invention is how to adjust the parallelism between the wafer and the mounting surface of the carrier when the wafer is attached.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a get material unit, still includes drive arrangement, depth of parallelism adjusting device and gets the material head, depth of parallelism adjusting device is including first mounting panel and second mounting panel, first mounting panel sets up on drive arrangement's the output, the depth of parallelism between first mounting panel and the second mounting panel is adjustable, it fixes to get the material head on the second mounting panel, drive arrangement can order about it makes straight reciprocating motion to get the material head.
In a preferred embodiment, the material taking device further comprises a pressure sensor, and the pressure sensor can detect the force of the material taking head for attaching the material to the carrier.
In a preferred embodiment, the pressure sensor is arranged between the first mounting plate and the output of the drive.
In a preferred embodiment, the first mounting plate is slidably connected to the output end of the driving device, and the sliding direction of the first mounting plate relative to the output end of the driving device is parallel to the direction of the linear reciprocating motion of the material taking head.
In a preferred embodiment, the device further comprises a first sliding pair, and the first mounting plate is connected with the output end of the driving device through the first sliding pair.
In a preferred embodiment, the parallelism adjusting device further comprises a ball, a first elastic element and a set screw, the ball is clamped between the first mounting plate and the second mounting plate, the second mounting plate can rotate around the ball, the first elastic element gives the second mounting plate an elastic force close to the first mounting plate, the set screw is in threaded connection with the first mounting plate, and one end of the set screw abuts against the second mounting plate.
In a preferred embodiment, the parallelism adjusting device further includes a screw, the first elastic element is a first spring, a through hole is formed in the first mounting plate, the screw penetrates through the through hole and is in threaded connection with the second mounting plate, the first spring is sleeved on the screw, one end of the first spring abuts against one surface, far away from the second mounting plate, of the first mounting plate, and the other end of the first spring abuts against the screw.
In a preferred embodiment, two set screws are provided, and the plane of the axis of one set screw and the plane of the center of sphere of the ball are perpendicular to the plane of the axis of the other set screw and the plane of the center of sphere of the ball.
A die bonder comprises the material taking unit.
In a preferred embodiment, still including the fixing base, drive arrangement is voice coil motor, voice coil motor is including mounting bracket, coil and magnet, be provided with the storage tank on the mounting bracket, the coil is fixed in the storage tank, magnet is fixed on the fixing base.
In a preferred embodiment, the material taking unit is provided with two or more than two, the mounting frames respectively belonging to the two or more than two voice coil motors are arranged on the fixing base in parallel, and the magnet spans over the coils respectively belonging to the two or more than two voice coil motors.
In a preferred embodiment, two or more coils are provided.
The invention has the beneficial effects that:
the parallelism adjusting device comprises a first mounting plate and a second mounting plate, the first mounting plate is arranged at the output end of the driving device, the parallelism between the first mounting plate and the second mounting plate is adjustable, the material taking head is fixed on the second mounting plate, and the parallelism between the wafer and the mounting surface of the carrier can be adjusted in time by adjusting the parallelism between the first mounting plate and the second mounting plate, so that the wafer is prevented from being inclined, the wafer is prevented from being bonded with the carrier insecurely, the bonding yield of the wafer is improved, and the product quality is ensured.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is an isometric view of a die bonder in accordance with one embodiment of the present invention;
FIG. 2 is a right side view of the die bonder of FIG. 1;
FIG. 3 is a partial exploded view of the die bonder of FIG. 1;
FIG. 4 is a top view of the die bonder of FIG. 1;
fig. 5 is a sectional view taken along a-a in fig. 4.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the purpose of the drawings is to graphically supplement the description of the text portion of the specification, so that each feature and the whole technical solution of the present invention can be visually and vividly understood, but the scope of the present invention should not be construed as being limited thereto.
In the description of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. When a feature is referred to as being "disposed," "secured," or "connected" to another feature, it can be directly disposed, secured, or connected to the other feature or be indirectly disposed, secured, or connected to the other feature.
In the description of the present invention, if "a number" is referred to, it means one or more, if "a number" is referred to, it means two or more, if "more than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
In addition, unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 3, fig. 1 is an isometric view of a die bonder in accordance with an embodiment of the present invention, fig. 2 is a right side view of the die bonder in fig. 1, and fig. 3 is a partial exploded view of the die bonder in fig. 1. The die bonder of this embodiment includes a frame 1 and a material taking unit 2, the material taking unit 2 is disposed on the frame 1, the material taking unit 2 includes a second elastic element 20, a second sliding pair 21, a driving device 22, a connecting seat 23, a pressure sensor 24, a first sliding pair 25, a parallelism adjusting device 26, a material taking head 27, a grating ruler 28 and a photoelectric sensor assembly 29, an output end of the driving device 22 is connected with the frame 1 through the second sliding pair 21, the parallelism adjusting device 26 is fixed at an output end of the driving device 22 through the connecting seat 23, the material taking head 27 is disposed on the parallelism adjusting device 26, the material taking head 27 can perform a reciprocating linear motion under the driving of the driving device 22, in this embodiment, a sliding direction of the second sliding pair 21 is disposed along a Y-axis direction, and a direction of the material taking head 27 performing the reciprocating linear motion is the Y-axis direction.
The rack 1 includes a fixed seat 11, a connecting plate 12 and a third mounting plate 13, in this embodiment, the second elastic element 20 is a second spring, the upper end of the second spring is fixed on the fixed seat 11, the lower end of the second spring is fixed on the output end of the driving device 22, the second spring gives the driving device 22 an elastic force along the positive direction of the Y axis, and the spring force can offset the gravity of the load fixed on the output end of the driving device 22, thereby reducing the burden of the driving device 22 and saving energy.
In this embodiment, the driving device 22 is a specially-made voice coil motor, the specially-made voice coil motor includes a mounting bracket 221, a coil 222 and a magnet 223, the mounting bracket 221 is provided with an accommodating groove 224, the coil 222 is fixed in the accommodating groove 224 by gluing or caulking the coil 222 in the accommodating groove 224, the mounting bracket 221 is connected with the fixing base 11 through the second sliding pair 21, and the magnet 223 is fixed on the rack 1, when the coil 222 is energized, under the magnetic field effect of the magnet 223, the coil 222 drives the mounting bracket 221, that is, the pick-up head 27 is driven to make a reciprocating linear motion in the Y-axis direction.
In order to improve the working efficiency of the die bonder and save the installation space of the die bonder at the same time, the material taking unit 2 is provided with two material taking units, the two mounting frames 221 respectively belonging to the two voice coil motors are arranged on the fixing base 11 in parallel, the material taking heads 27 respectively belonging to the two voice coil motors are positioned on the same side, and the magnet 223 stretches across the coils 222 respectively belonging to the two voice coil motors.
Through the design, the coils 222 which respectively belong to the two voice coil motors are arranged in the magnetic field of one magnet 223, so that the independent driving of the two material taking heads 27 is realized while the installation space is saved; in addition, a single voice coil motor with two coils 222 provides greater power to the pick-up head 27.
The magnet 223 and the coil 222 of this embodiment are both rectangular, and the shape is regular, and when more material taking heads 27 need to be driven, the magnet 223 is lengthened, and the coil 222 is added, so that independent driving of a plurality of material taking heads 27 can be realized.
In addition, when a plurality of material taking heads 27 are arranged, the material taking heads 27 can be of the same type or different types, so that when different chips are mounted, a plurality of die bonder do not need to be manufactured, the die bonding efficiency can be improved, and the manufacturing cost can be reduced.
In other embodiments, the driving device 22 may be a rod motor.
In addition, in order to detect the displacement of the material taking head 27, a grating ruler 28 is provided, the grating ruler 28 comprises a scale grating and a grating reading head, the scale grating is fixed on the mounting frame 221 of the voice coil motor, the grating reading head is fixed on the third mounting plate 13, and by arranging the grating ruler 28, the displacement, the speed and the acceleration of the material taking head 27 can be detected in time and utilized, for example, when the material taking head 27 starts to move towards the carrier, the power of the voice coil motor can be improved, so that the material taking head 27 moves rapidly, and when the material taking head 27 is close to the carrier, the material taking head 27 can be decelerated in advance to prepare for die bonding.
In order to detect whether the movement of the material taking head 27 along the positive direction of the Y axis is in place or not, a photoelectric sensor assembly 29 is arranged, the photoelectric sensor assembly 29 comprises a light shielding sheet 291 and a photoelectric sensor 292, the light shielding sheet 291 is fixed on an installation frame 221 of a voice coil motor, the photoelectric sensor 292 is fixed on a third installation plate 13, when the material taking head 27 moves in place along the positive direction of the Y axis, the light shielding sheet 291 triggers the photoelectric sensor 292, and at the moment, it can be judged that the material taking head 27 has taken a wafer or the material taking head 27 has already placed a wafer.
Referring to fig. 3, 4 and 5, fig. 4 is a top view of the die bonder in fig. 1, fig. 5 is a cross-sectional view taken along a-a in fig. 4, the parallelism adjusting device 26 of the present embodiment includes a first mounting plate 261, a ball 262, a second mounting plate 263, a set screw 264, a screw 265, and a first elastic element, in the present embodiment, the first elastic element is a first spring, the first mounting plate 261 is disposed on the bonding holder 23, the ball 262 is sandwiched between the first mounting plate 261 and the second mounting plate 263, and the second mounting plate 263 is capable of rotating around the ball 262.
Specifically, arc-shaped grooves may be respectively provided in the first mounting plate 261 and the second mounting plate 263, the balls 262 are placed in the arc-shaped grooves, and a gap may exist between the first mounting plate 261 and the second mounting plate 263 by controlling the diameter of the balls 262 and controlling the depth of the arc-shaped grooves.
The first mounting plate 261 is provided with a through hole 266, the screw 265 is in clearance fit with the through hole 266, the screw 265 penetrates through the through hole 266 and then is in threaded connection with the second mounting plate 263, the first spring is sleeved on the screw 265, the lower end of the first spring is abutted against the upper surface of the first mounting plate 261, and the upper end of the first spring is abutted against the head of the screw 265, so that the first spring gives the first mounting plate 261 an elastic force close to the second mounting plate 263, and the first mounting plate 261 and the second mounting plate 263 cannot be separated from each other due to the connection effect of the screw 265.
The set screw 264 is in threaded connection with the first mounting plate 261, the lower end of the set screw 264 abuts against the second mounting plate 263, and by rotating the set screw 264, the set screw 264 can extend out of the first mounting plate 261, and the point on the second mounting plate 263 abutting against the set screw 264 is far away from the first mounting plate 261, or the set screw 264 retracts into the second mounting plate 263, and the point on the second mounting plate 263 abutting against the set screw 264 is close to the first mounting plate 261.
In this embodiment, two sets of the set screws 264, the screws 265 and the first springs are provided, the axis of one set screw 264 and the center of the ball 262 are located on the XY plane, the axis of the other set screw 264 and the center of the ball 262 are located on the YZ plane, and the two sets of the set screws are perpendicular to each other, so that the second mounting plate 263 can have two degrees of freedom of rotation around the X axis and rotation around the Z axis by controlling the two set screws 264, the material taking head 27 is fixed on the second mounting plate 263, thereby the parallelism between the wafer fixed on the material taking head 27 and the mounting surface of the carrier can be adjusted, the wafer and the carrier can be bonded more firmly, and the good wafer bonding rate is high.
In this embodiment, the pick-up head 49 is a vacuum nozzle made of rubber, bakelite, ceramic, or tungsten steel, and the vacuum nozzle is connected to a negative pressure air source to suck the wafer, and when the negative pressure in the vacuum nozzle disappears, the wafer is released.
The vacuum nozzle can be fixed by fastening members to the second mounting plate 263.
In another embodiment, the pick-up head 49 may also use a water surface tension adsorption clamping technique, which is to adhere a mesh-like foamed polyurethane cloth to the surface of a stainless steel sample plate and adsorb the wafer by using the water tension on the surface of the foamed polyurethane cloth.
In further embodiments, the first resilient element may also use a bellows.
In order to detect the force of the pick-up head 27 to attach the wafer to the carrier, a pressure sensor 24 is provided, in order to facilitate the installation of the pressure sensor 24, the pressure sensor 24 is provided between the first mounting plate 261 and the connection seat 23, by providing the pressure sensor 24, the force of the wafer attached to the carrier can be detected in real time, and when the attaching force reaches a predetermined target interval, the driving device 22 can be controlled to stop driving the pick-up head 27, thereby preventing the wafer or the carrier from being damaged, or preventing the wafer from being unattached due to insufficient attaching force.
In this embodiment, the pressure sensor 24 is a square sensor, two ends of the square sensor respectively abut against the first mounting plate 261 and the connecting seat 23, a gap is formed in the square sensor, and a strain gauge is arranged in the gap.
In further embodiments, the pressure sensor 24 may also use a ceramic pressure sensor or a diffused silicon pressure sensor.
In order to guide the movement of the parallelism adjusting device 26 and facilitate the square sensor to accurately detect the force of the material taking head 27 for placing the wafer, the first sliding pair 25 is arranged on the side surface of the connecting seat 23, the sliding direction of the first sliding pair 25 is arranged along the Y-axis direction, the first mounting plate 261 is connected with the connecting seat 23 through the first sliding pair 25, so that the first mounting plate 261 is restrained to move only along the Y-axis direction, namely, the parallelism adjusting device 26 only moves along the Y-axis direction, at the moment, the force of the material taking head 27 for placing the wafer can be intuitively embodied on the square sensor, and the phenomenon that the force of the material taking head 27 for placing the wafer is transmitted to the square sensor by only one component force because the moving direction of the parallelism adjusting device 26 deviates from the Y-axis direction is avoided, so that the detection distortion of the square sensor is caused.
In this embodiment, when the force with which the pickup head 27 is attached to the wafer is detected by the square sensor, it is necessary to consider the friction force of the first slide pair, the gravity of the parallelism adjusting device 26, and the gravity of the pickup head 27 as the influencing factors.
In this embodiment, the first sliding pair 25 is a linear guide, the slide rail of the linear guide is fixed to the connecting base 23, and the slide block of the linear guide is fixed to the first mounting plate 261.
In other embodiments, the first sliding pair 25 may also be a cross roller guide.
While the present invention has been described with reference to the preferred embodiments, it is to be understood that the present invention is not limited to the disclosed embodiments, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
1. The utility model provides a get material unit, its characterized in that still includes drive arrangement, depth of parallelism adjusting device and gets the material head, depth of parallelism adjusting device is including first mounting panel and second mounting panel, first mounting panel sets up on drive arrangement's the output, the depth of parallelism between first mounting panel and the second mounting panel is adjustable, it fixes to get the material head on the second mounting panel, drive arrangement can order about it makes straight reciprocating motion to get the material head.
2. The material extraction unit as recited in claim 1, further comprising a pressure sensor capable of detecting a force with which the material extraction head applies the material to the carrier.
3. The pickup unit as recited in claim 2, wherein the pressure sensor is disposed between the first mounting plate and the output of the drive device.
4. The take-off unit as claimed in claim 3, wherein the first mounting plate is slidably connected to the output end of the drive device, and the direction of sliding movement of the first mounting plate relative to the output end of the drive device is parallel to the direction of linear reciprocation of the take-off head.
5. The pickup unit as recited in claim 1, wherein the parallelism adjusting device further comprises a ball, a first resilient member, and a set screw, the ball being captured between the first mounting plate and the second mounting plate, the second mounting plate being rotatable about the ball, the first resilient member imparting a resilient force to the second mounting plate adjacent the first mounting plate, the set screw being threadably coupled to the first mounting plate, an end of the set screw abutting the second mounting plate.
6. The material taking unit as claimed in claim 5, wherein the parallelism adjusting device further comprises a screw, the first elastic element is a first spring, a through hole is formed in the first mounting plate, the screw penetrates through the through hole and is in threaded connection with the second mounting plate, the first spring is sleeved on the screw, one end of the first spring abuts against one surface, far away from the second mounting plate, of the first mounting plate, and the other end of the first spring abuts against the screw.
7. A die bonder, characterized by comprising a material taking unit as claimed in any one of claims 1 to 6.
8. The die bonder of claim 7, further comprising a fixing base, wherein the driving device is a voice coil motor, the voice coil motor comprises a mounting frame, a coil and a magnet, the mounting frame is provided with a receiving groove, the coil is fixed in the receiving groove, and the magnet is fixed on the fixing base.
9. The die bonder of claim 8, wherein the material fetching unit is provided with two or more than two, the mounting frames respectively belonging to the two or more than two voice coil motors are arranged on the fixing base in parallel, and the magnets cross over the coils respectively belonging to the two or more than two voice coil motors.
10. The die bonder of claim 8, wherein two or more coils are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953514.1A CN110828339A (en) | 2019-10-09 | 2019-10-09 | Material taking unit and die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910953514.1A CN110828339A (en) | 2019-10-09 | 2019-10-09 | Material taking unit and die bonder |
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| CN110828339A true CN110828339A (en) | 2020-02-21 |
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| CN201910953514.1A Pending CN110828339A (en) | 2019-10-09 | 2019-10-09 | Material taking unit and die bonder |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115739690A (en) * | 2022-11-24 | 2023-03-07 | 深圳市安泽通科技发展有限公司 | LED patch detection device and detection method |
| CN116403946A (en) * | 2023-05-24 | 2023-07-07 | 东莞市华越半导体技术股份有限公司 | Die bonder head pressure early warning device |
| CN117423643A (en) * | 2023-10-31 | 2024-01-19 | 东莞触点智能装备有限公司 | Material taking system and nondestructive material taking method for chip high-precision die bonder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115739690A (en) * | 2022-11-24 | 2023-03-07 | 深圳市安泽通科技发展有限公司 | LED patch detection device and detection method |
| CN115739690B (en) * | 2022-11-24 | 2023-10-27 | 深圳市安泽通科技发展有限公司 | LED patch detection equipment and detection method |
| CN116403946A (en) * | 2023-05-24 | 2023-07-07 | 东莞市华越半导体技术股份有限公司 | Die bonder head pressure early warning device |
| CN116403946B (en) * | 2023-05-24 | 2023-08-04 | 东莞市华越半导体技术股份有限公司 | Die bonder head pressure early warning device |
| CN117423643A (en) * | 2023-10-31 | 2024-01-19 | 东莞触点智能装备有限公司 | Material taking system and nondestructive material taking method for chip high-precision die bonder |
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