CN116403946B - Die bonder head pressure early warning device - Google Patents
Die bonder head pressure early warning device Download PDFInfo
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- CN116403946B CN116403946B CN202310587362.4A CN202310587362A CN116403946B CN 116403946 B CN116403946 B CN 116403946B CN 202310587362 A CN202310587362 A CN 202310587362A CN 116403946 B CN116403946 B CN 116403946B
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- 239000013078 crystal Substances 0.000 claims abstract description 10
- 238000001179 sorption measurement Methods 0.000 claims abstract description 10
- 230000008878 coupling Effects 0.000 claims description 35
- 238000010168 coupling process Methods 0.000 claims description 35
- 238000005859 coupling reaction Methods 0.000 claims description 35
- 230000001360 synchronised effect Effects 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 8
- 230000006698 induction Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 210000001503 joint Anatomy 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 63
- 238000001514 detection method Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The utility model discloses a die bonding head pressure early warning device of a die bonder, which comprises a frame body component and a die bonding head component, wherein the die bonding head component comprises a transverse plate body. According to the utility model, whether the pressure of the crystal fixing head assembly is overlarge or not is judged by the first pressure sensor only used for contact detection, the sensing disc is contacted with the first pressure sensor, then the condition of overlarge pressure is judged to perform early warning, and the response is more sensitive by contact sensing compared with the mode of detecting the overlarge pressure according to the pressure value in real time, so that the condition of early warning hysteresis is avoided; meanwhile, after the wafer is adsorbed by the adsorption head, the ball can generate pressure on the third pressure sensor, the fact that the positions of the wafers are not offset is indicated when the pressure is consistent, the fact that the wafers are offset in the vertical position is indicated when the pressure is inconsistent, at the moment, the angle calibration assembly works to adjust the vertical direction of the wafer fixing head assembly, so that the wafers are located at the non-offset positions, and the situation that the positions of the wafers are offset when the wafers are placed at the wafer fixing station is avoided.
Description
Technical Field
The utility model relates to the technical field of die bonding equipment, in particular to a die bonding head pressure early warning device of a die bonder.
Background
The die bonder is key equipment in a chip packaging production line, and the die bonding process comprises the following steps: the substrate firstly performs dispensing operation on a die bonding station, then the die bonding head moves to the wafer station by utilizing the die bonding swing arm to adsorb and pick the die, then the wafer is placed at the die bonding station adhesive position, and the die bonding head is a die bonding structure of the die bonding machine, and mainly completes the die bonding and die bonding operation through an adsorption nozzle, and the defects of the die bonding head at present have the following two points: when the wafer is taken, the situation that the pressure is overlarge sometimes occurs to the adsorption nozzle of the wafer fixing head, and a worker cannot acquire information of the situation in time, so that the risk of wafer breakage is generated when the wafer is taken for many times; when placing the wafer die bonding, according to the suction nozzle and getting the wafer position, the wafer has the risk of shifting in the vertical direction, and the slight deviation can influence the accuracy of the wafer die bonding position.
In this regard, the chinese patent of the patent issued to the present disclosure CN215680645U discloses a die-bonding head and pressure warning device capable of measuring pressure, the die-bonding head and pressure warning device includes a motor, a suction nozzle, a force transmission member, and a pressure sensor, the motor includes a motor body, and a motor spindle connected to the motor body, the suction nozzle is connected to the motor spindle, the motor spindle drives the force transmission member to move along with the movement of the motor spindle, and the force transmission member extrudes the pressure sensor when moving.
This solid brilliant head and pressure early warning device detects pressure in real time through pressure sensor, carries out the early warning when pressure exceeds the threshold value, and the main mode is pressure sensor real-time detection pressure data and compares with the threshold value, and when pressure is greater than the threshold value and reports to the police, and its judgement flow is longer, and early warning sensitivity is lower, can appear early warning hysteresis phenomenon, and this solid brilliant head does not solve the situation that the wafer appears the vertical direction skew when getting the brilliant in addition, still can appear placing the phenomenon that the position is inaccurate when solidifying the brilliant.
Therefore, we propose a die bonder head pressure pre-warning device for solving the above problems.
Disclosure of Invention
The utility model aims to provide a die bonder die bonding head pressure early warning device so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a die bonder head pressure early warning device, includes support body subassembly and die bonder head subassembly, die bonder head subassembly includes the diaphragm body, the perpendicular rigid coupling casing of diaphragm body top surface and first small-size servo gear motor, the shell cavity is seted up to the casing bottom surface, the diaphragm body is located shell cavity central point put and sets up the commentaries on classics hole perpendicularly, commentaries on classics hole rotation connection main shaft, the main shaft bottom is located the diaphragm body below and rigid coupling adsorption head, the hollow frame of horizontal rigid coupling in the shell cavity, the main shaft week side is located the position rigid coupling induction disc in hollow frame below, the ring groove is seted up to hollow frame bottom surface inboard, induction disc clearance fit is in the ring groove bottom, the ring groove bottom scarf joint first pressure sensor;
the angle calibration assembly comprises a vertical plate, the bottom end of one side of the vertical plate is rotationally connected with a rotating plate, two sides of the bottom end of the rotating plate are fixedly connected with two first side lugs respectively, two side lugs are rotationally connected with a crystal-fixing head mounting plate, the bottom end of the crystal-fixing head mounting plate is fixedly connected with the top surface of a transverse plate body, the crystal-fixing head mounting plate is located between a shell and a first small-sized servo gear motor, the top plate is horizontally fixedly connected with a top plate, the inner side wall of the rotating hole is uniformly rotationally connected with eight balls, eight third pressure sensors are fixedly connected to the positions of the transverse plate body close to the eight balls respectively, and the third pressure sensors are in contact with the balls.
Preferably, the inner side of the shell cavity is positioned below the induction disc and horizontally fixedly connected with a supporting frame, the bottom surface of the supporting frame is uniformly fixedly connected with a plurality of disc springs, the bottom surface of the disc springs is fixedly connected with a sleeve block, and the sleeve block is rotatably sleeved on the periphery of the main shaft.
Preferably, the inner side of the sleeve block is provided with an inner ring groove, the circumference side of the main shaft is fixedly connected with a supporting column, the supporting column is rotatably sleeved in the inner ring groove, a first bearing is fixedly connected between the circumference side of the supporting column and the inner side wall of the inner ring groove, the bottom surface of the supporting frame is fixedly connected with a second pressure sensor, and the second pressure sensor is contacted with the top surface of the sleeve block.
Preferably, the top surface of the shell cavity is provided with a top opening, the top opening is movably connected with the top surface of the top block, the bottom surface of the top block is provided with a top groove, the top end of the main shaft is rotatably sleeved in the top groove, and a second bearing is fixedly connected between the peripheral side of the main shaft and the top groove.
Preferably, the bottom surface of the transverse plate body is fixedly connected with the bottom surface of the second driving bottom shell, the main shaft is rotationally connected with the bottom surface of the second driving bottom shell, the main shaft is positioned in the second driving bottom shell, the driven synchronous pulley is fixedly sleeved at the position, in the second driving bottom shell, of the main shaft, the first small servo speed reducing motor is positioned in the second driving bottom shell through the transverse plate body, and is fixedly connected with the driving synchronous pulley, the driving synchronous pulley and the driven synchronous pulley are sleeved with the driving belt, and the surface of the shell is fixedly connected with the buzzer and the alarm lamp.
Preferably, one side of the bottom end of the vertical plate is fixedly connected with a second small-sized servo gear motor, the rotating shaft end of the second small-sized servo gear motor is fixedly connected with the rotating shaft of the rotating plate, the top end of the crystal fixing head mounting plate is positioned at the same horizontal position of two first side lugs to form a notch, the side wall of the rotating plate is positioned in the notch and fixedly connected with the double-shaft small-sized servo gear motor, the two rotating shaft ends of the double-shaft small-sized servo gear motor are fixedly connected with two sides of the notch respectively, and a plurality of triangular reinforcing plates are fixedly connected between the two sides of the vertical plate and the top plate.
Preferably, the drive assembly is fixedly connected to the angle calibration assembly, the drive assembly comprises a main plate body arranged in the vertical direction, two linear slide rails are fixedly connected to one side of the main plate body, two slide bases are respectively and vertically connected to the linear slide rails in a sliding mode, two slide base side walls are fixedly connected to the top end of the movable plate, the bottom end of the movable plate is fixedly connected to the side wall of the top plate, and the cross section of each linear slide rail is in a T-shaped shape.
Preferably, the movable plate top is kept away from slide one side central point put two second side ears of rigid coupling, two rotate between the second side ear and connect the transfer line bottom, the mainboard body top is located the position rigid coupling U type seat between two linear slide rail, two draw bar one end is rotated respectively to two inboard of U type seat, two rigid coupling axostylus axostyle between the draw bar other end, the axostylus axostyle rotates and cup joints the transfer line top.
Preferably, the main board body is close to the fixed connection U type cover of fly leaf one side, the inboard same horizontal position rigid coupling of U type seat that is located of U type cover is small-size servo gear motor, the extension axle of third small-size servo gear motor pivot end rigid coupling, one of them pull rod pivot end rigid coupling of extension axle tip, the main board body and the fixed connection of U type cover top install the diaphragm.
Preferably, the frame body assembly comprises a frame, frame top surface rotates and connects swing arm one end, swing arm other end bottom surface rigid coupling installation diaphragm top surface, frame top surface rigid coupling main drive gear motor, frame bottom surface rigid coupling first drive drain pan, the swing arm pivot end passes the frame and is located first drive drain pan and rigid coupling driven gear, main drive gear motor pivot end passes the frame and is located first drive drain pan and rigid coupling driving gear, the driven gear is connected in the driving gear meshing, the opening is offered near solid brilliant head assembly position to the frame.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, whether the pressure of the crystal fixing head assembly is overlarge or not is judged by the first pressure sensor only used for contact detection, when a wafer is taken under normal pressure, the high-rigidity disc spring cannot generate stroke change, when the pressure is overlarge, the disc spring can generate micro compression, at the moment, the sensing disc is contacted with the first pressure sensor to judge the condition of overlarge pressure for early warning, and compared with a mode of detecting the overlarge pressure according to the pressure value in real time through contact sensing, the reaction is more sensitive, and the condition of early warning lag is avoided; meanwhile, after the wafer is adsorbed by the adsorption head, the ball can generate pressure on the third pressure sensor, the fact that the positions of the wafers are not offset is indicated when the pressure is consistent, the fact that the wafers are offset in the vertical position is indicated when the pressure is inconsistent, at the moment, the angle calibration assembly works to adjust the vertical direction of the wafer fixing head assembly, so that the wafers are located at the non-offset positions, and the situation that the positions of the wafers are offset when the wafers are placed at the wafer fixing station is avoided.
Drawings
FIG. 1 is a schematic diagram of a main structure of a first embodiment of the present utility model;
FIG. 2 is a schematic diagram showing the structures of the first and second embodiments of the present utility model at the position of the die-bonding head assembly, the angle calibration assembly and the driving assembly;
FIG. 3 is a schematic view showing the structure of a first and second embodiment of the present utility model at a die attach head assembly;
FIG. 4 is a schematic diagram showing a cross-sectional structure of a first and second embodiment of a die assembly according to the present utility model;
FIG. 5 is an enlarged schematic view of the structure of FIG. 4A according to the present utility model;
FIG. 6 is a schematic view of a part of a cross-section of an angle calibration assembly according to a second embodiment of the present utility model;
FIG. 7 is a schematic view of a driving assembly in a partially cut-away configuration according to a third embodiment of the present utility model;
FIG. 8 is a schematic view showing the structure of a transmission rod according to a third embodiment of the present utility model;
fig. 9 is a schematic view showing a bottom structure of a main body according to a third embodiment of the present utility model.
In the figure: 1. a frame assembly; 2. a die head assembly; 3. an angle calibration assembly; 4. a drive assembly; 11. a frame; 12. swing arms; 13. a notch; 14. a first driving bottom case; 15. a main drive gear motor; 16. a drive gear; 17. a driven gear; 21. a cross plate body; 22. a housing; 23. a first small-sized servo speed reducing motor; 24. a shell cavity; 25. a turning hole; 26. a main shaft; 27. an adsorption head; 28. sleeving blocks; 29. an inner ring groove; 210. abutting the column; 211. sensing a disc; 212. a hollow frame; 213. a bottom ring groove; 214. a first pressure sensor; 215. abutting against the frame; 216. a disc spring; 217. a second pressure sensor; 219. a first bearing; 220. a top opening; 221. a top block; 222. a top groove; 223. a second bearing; 224. a second driving bottom case; 225. a driven synchronous pulley; 226. a driving synchronous pulley; 227. a transmission belt; 228. a ball; 229. a third pressure sensor; 230. a buzzer; 231. an alarm lamp; 31. a top plate; 32. a vertical plate; 33. a rotating plate; 34. a first side ear; 35. a die-bonding head mounting plate; 36. a second small-sized servo speed reducing motor; 37. a notch; 38. a double-shaft small-sized servo speed reducing motor; 39. triangular reinforcing plates; 41. a main board body; 42. a linear slide rail; 43. a slide; 44. a movable plate; 45. a second side ear; 46. a transmission rod; 47. a U-shaped seat; 48. a pull rod; 49. a shaft lever; 410. a U-shaped cover; 411. a third small-sized servo speed reducing motor; 412. an extension shaft; 413. and installing a transverse plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1:
referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a die bonder die bonding head pressure early warning device, including support body subassembly 1 and die bonding head subassembly 2, die bonding head subassembly 2 includes diaphragm body 21, diaphragm body 21 top surface vertical fixation casing 22 and first small-size servo gear motor 23, casing 22 bottom surface sets up shell cavity 24, diaphragm body 21 is located shell cavity 24 central point put and sets up the change in the perpendicular commentaries on classics hole 25, change in the commentaries on classics hole 25 rotation and connect spindle 26, spindle 26 bottom is located diaphragm body 21 below and fixedly connected with absorption head 27, horizontal rigid connection cavity 212 in the shell cavity 24, spindle 26 week side is located cavity 212 below position rigid connection induction disc 211, cavity 212 bottom surface inboard sets up end annular 213, induction disc 211 clearance fit is in end annular 213, end annular 213 bottom surface scarf joint first pressure sensor 214, first pressure sensor 214 only is used for contacting the judgement, indicate that the pressure is too big when induction disc 211 contacts first pressure sensor 214, promptly indicate that the pressure is too big when first pressure sensor 214 receives the pressure, promptly indicate that can start working through buzzer 230 and warning lamp 231, through the change in the pressure value of pressure value is big change of pressure value, it is more rapid than the problem that the problem of the alarm can not confirm that the working is more rapid is difficult to begin, the working is not confirmed;
the die-bonding head assembly 2 is fixedly connected with the angle calibration assembly 3, the angle calibration assembly 3 comprises a vertical plate 32, the bottom end of one side of the vertical plate 32 is rotationally connected with a rotating plate 33, two sides of the bottom end of the rotating plate 33 are fixedly connected with two first side lugs 34 respectively, a die-bonding head mounting plate 35 is rotationally connected between the two first side lugs 34, the bottom end of the die-bonding head mounting plate 35 is fixedly connected to the top surface of a transverse plate body 21, the die-bonding head mounting plate 35 is positioned between a shell 22 and a first small-sized servo reducing motor 23, the top end of the vertical plate 32 is horizontally fixedly connected with a top plate 31, the inner side wall of a rotating hole 25 is uniformly rotationally connected with eight balls 228, the positions of the transverse plate body 21 close to the eight balls 228 are fixedly connected with eight third pressure sensors 229 respectively, the third pressure sensors 229 contact with the balls 228, after the wafer is adsorbed by the adsorbing heads 27, the balls 228 generate pressure, the position of the wafer is not deviated, the wafer is not deviated due to the fact that the pressure is inconsistent, the deviation appears in the vertical position, at the moment, the wafer is not deviated due to the fact that the vertical direction of the wafer is caused, the position of the wafer is not to the deviation, the angle calibration assembly 3 works to the vertical direction of the die-bonding head assembly 2, and the position is accurately.
Example 2:
referring to fig. 2-6, in the second embodiment of the utility model, based on the previous embodiment, the inner side of the housing 24 is located below the sensing disc 211 and is horizontally and fixedly connected with the supporting frame 215, the bottom surface of the supporting frame 215 is uniformly and fixedly connected with a plurality of disc springs 216, the bottom surface of the plurality of disc springs 216 is fixedly connected with the sleeve block 28, the sleeve block 28 is rotatably sleeved on the peripheral side of the spindle 26, the disc springs 216 have higher rigidity, when the wafer is taken under normal pressure, the disc springs 216 cannot be changed, when the pressure is too large, the disc springs 216 can be slightly compressed, and at the moment, the sensing disc 211 contacts the first pressure sensor 214, and the condition of too large pressure is judged to perform early warning.
An inner ring groove 29 is formed in the inner side of the sleeve block 28, a supporting column 210 is fixedly connected to the peripheral side of the main shaft 26, the supporting column 210 is rotatably sleeved in the inner ring groove 29, a first bearing 219 is fixedly connected between the peripheral side of the supporting column 210 and the inner side wall of the inner ring groove 29, a second pressure sensor 217 is fixedly connected to the bottom surface of the supporting frame 215, the second pressure sensor 217 contacts the top surface of the sleeve block 28, and the second pressure sensor 217 can detect the wafer taking pressure of the adsorption head 27 in real time.
The top surface of the shell cavity 24 is provided with a top opening 220, the top opening 220 is movably connected with the top surface of a top block 221, the bottom surface of the top block 221 is provided with a top groove 222, the top end of the main shaft 26 is rotatably sleeved in the top groove 222, and a second bearing 223 is fixedly connected between the peripheral side of the main shaft 26 and the top groove 222.
The bottom surface of the transverse plate body 21 is fixedly connected with the bottom surface of the second driving bottom shell 224, the main shaft 26 is rotationally connected with the bottom surface of the second driving bottom shell 224, the main shaft 26 is positioned in the second driving bottom shell 224 and fixedly sleeved with the driven synchronous pulley 225, the first small-sized servo speed reduction motor 23, the rotating shaft end penetrates through the transverse plate body 21 and is positioned in the second driving bottom shell 224 and is fixedly connected with the driving synchronous pulley 226, the driving synchronous pulley 226 and the driven synchronous pulley 225 are sleeved with the transmission belt 227 for driving the adsorption head 27 to rotate, and the surface of the shell 22 is fixedly connected with the buzzer 230 and the alarm lamp 231.
The second small-sized servo gear motor 36 is fixedly connected to one side of the bottom end of the vertical plate 32, the rotating shaft end of the second small-sized servo gear motor 36 is fixedly connected to the rotating shaft of the rotating plate 33, the second small-sized servo gear motor 36 is used for adjusting the vertical angle of the rotating plate 33, the top end of the crystal fixing head mounting plate 35 is provided with a notch 37 at the same horizontal position of the two first side lugs 34, the side wall of the rotating plate 33 is fixedly connected with the double-shaft small-sized servo gear motor 38 at the position in the notch 37, the two rotating shaft ends of the double-shaft small-sized servo gear motor 38 are fixedly connected with two sides of the notch 37 respectively, the double-shaft small-sized servo gear motor 38 is used for adjusting the vertical angle of the crystal fixing head mounting plate 35, the crystal fixing head assembly 2 is conveniently subjected to angle calibration, and a plurality of triangular reinforcing plates 39 are fixedly connected between the two sides of the vertical plate 32 and the top plate 31.
Example 3:
referring to fig. 7-9, in a third embodiment of the present utility model, the driving assembly 4 is fixedly connected to the angle calibration assembly 3 according to the above two embodiments, the driving assembly 4 includes a main board body 41 disposed in a vertical direction, two linear sliding rails 42 are fixedly connected to one side of the main board body 41, two sliding carriages 43 are respectively and vertically slidably connected to the two linear sliding rails 42, side walls of the two sliding carriages 43 are fixedly connected to top ends of a movable plate 44, bottom ends of the movable plate 44 are fixedly connected to side walls of the top plate 31, and cross sections of the linear sliding rails 42 are in a T shape to prevent the main board body 41 from being separated from the movable plate 44.
The top end of the movable plate 44 is far away from the center of one side of the sliding seat 43 and fixedly connected with two second side lugs 45, the bottom ends of the transmission rods 46 are rotatably connected between the two second side lugs 45, a U-shaped seat 47 is fixedly connected between the two linear sliding rails 42 above the main plate body 41, two inner sides of the U-shaped seat 47 are respectively rotatably connected with one ends of two pull rods 48, a shaft rod 49 is fixedly connected between the other ends of the two pull rods 48, and the shaft rod 49 is rotatably sleeved on the top ends of the transmission rods 46.
The main board body 41 is fixedly connected with the U-shaped cover 410 at one side close to the movable plate 44, the inner side of the U-shaped cover 410 is fixedly connected with the third small-sized servo speed reducing motor 411 at the same horizontal position of the U-shaped seat 47, the rotating shaft end of the third small-sized servo speed reducing motor 411 is fixedly connected with the extension shaft 412, the end part of the extension shaft 412 is fixedly connected with the rotating shaft end of one of the pull rods 48, the pull rods 48 are driven to rotate through the third small-sized servo speed reducing motor 411, the movable plate 44 is pulled to move upwards or downwards through the transmission rod 46 to perform wafer taking actions, and the top ends of the main board body 41 and the U-shaped cover 410 are fixedly connected with the mounting transverse plate 413.
The frame body assembly 1 comprises a frame 11, one end of a swing arm 12 is rotatably connected to the top surface of the frame 11, the bottom surface of the other end of the swing arm 12 is fixedly connected with the top surface of a transverse plate 413, the top surface of the frame 11 is fixedly connected with a main driving gear motor 15, the bottom surface of the frame 11 is fixedly connected with a first driving bottom shell 14, the rotating shaft end of the swing arm 12 penetrates through the frame 11 to be positioned in the first driving bottom shell 14 and fixedly connected with a driven gear 17, the rotating shaft end of the main driving gear motor 15 penetrates through the frame 11 to be positioned in the first driving bottom shell 14 and fixedly connected with a driving gear 16, the driving gear 16 is meshed with the driven gear 17, a notch 13 is formed in the position, close to the crystal fixing head assembly 2, of the frame 11, the notch 13 is used for falling into the crystal fixing head assembly 2, and the swing arm 12 can swing out and take-out of a wafer under the action of the main driving gear motor 15.
Example 4:
referring to fig. 1-9, in a fourth embodiment of the present utility model, when the present utility model is used, the swing arm 12 swings out under the action of the main driving gear motor 15 to move the wafer fixing head assembly 2 to the wafer station, the movable plate 44 in the driving assembly 4 moves down to drive the wafer fixing head assembly 2 to move down, the adsorbing head 27 adsorbs and removes the wafer, the driving assembly 4 moves the wafer fixing head assembly 2 up and returns to the position, the swing arm 12 moves the wafer fixing head assembly 2 to the wafer fixing station, the wafer is placed at the dispensing position, the second pressure sensor 217 detects the pressure condition of the adsorbing head 27 in real time during the whole wafer fixing process, the sensing disc 211 contacts the first pressure sensor 214 when the pressure is too large, the first pressure sensor 214 is touched and alarms immediately, and when the wafer moves, the eight third pressure sensors 229 detect the pressure of the main shaft 26 in real time, the pressure is consistent, the wafer position is not deviated at the moment, the wafer is not consistent, the wafer is adsorbed and the wafer is removed at the vertical position, the angle calibration assembly 3 works to adjust the vertical direction of the wafer fixing head assembly 2, so that the wafer is not placed at the vertical position; according to the utility model, whether the pressure of the wafer fixing head assembly 2 is overlarge or not is judged by the first pressure sensor 214 only used for contact detection, when a wafer is taken under normal pressure, the high-rigidity disc spring 216 cannot generate stroke change, when the pressure is overlarge, the disc spring 216 can generate micro compression, at the moment, the sensing disc 211 contacts the first pressure sensor 214 to judge the overlarge condition for early warning, and compared with a mode of detecting the overlarge pressure according to the pressure value in real time through contact sensing, the reaction is more sensitive, and the condition of early warning lag is avoided; meanwhile, after the wafer is adsorbed by the adsorption head 27, the third pressure sensor 229 is pressed by the balls 228, the wafer is not deviated in position if the pressure is consistent, the wafer is deviated in vertical position if the pressure is inconsistent, and the angle calibration assembly 3 is used for adjusting the vertical direction of the wafer fixing head assembly 2 at the moment, so that the wafer is in a non-deviated position, and the situation of positional deviation cannot occur when the wafer is placed at the wafer fixing station.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a solid brilliant head pressure early warning device of solid brilliant machine, includes support body subassembly (1) and solid brilliant head subassembly (2), its characterized in that:
the crystal fixing head assembly (2) comprises a transverse plate body (21), a shell (22) and a first small-sized servo speed reducing motor (23) are vertically fixedly connected to the top surface of the transverse plate body (21), a shell cavity (24) is formed in the bottom surface of the shell (22), a rotating hole (25) is vertically formed in the center of the shell cavity (24), the rotating hole (25) is rotationally connected with a main shaft (26), the bottom end of the main shaft (26) is positioned below the transverse plate body (21) and fixedly connected with an adsorption head (27), a hollow frame (212) is horizontally fixedly connected in the shell cavity (24), a sensing disc (211) is fixedly connected below the hollow frame (212) on the periphery of the main shaft (26), a bottom ring groove (213) is formed in the inner side of the bottom surface of the hollow frame (212), the sensing disc (211) is in clearance fit in the bottom ring groove (213), and the bottom surface of the bottom ring groove (213) is in scarf joint with the first pressure sensor (214).
The utility model provides a die-bonding head subassembly (2) rigid coupling angle calibration subassembly (3), angle calibration subassembly (3) include perpendicular board (32), perpendicular board (32) one side bottom rotates and connects rotating plate (33), two first side ear (34) of rotating plate (33) bottom both sides rigid coupling respectively, two rotate between first side ear (34) and connect die-bonding head mounting panel (35), die-bonding head mounting panel (35) bottom rigid coupling is at diaphragm body (21) top surface, die-bonding head mounting panel (35) are located between casing (22) and first small-size servo gear motor (23), perpendicular board (32) top level rigid coupling roof (31), eight balls (228) are connected in even rotation of rotating hole (25) inside wall, diaphragm body (21) are close to eight ball (228) position rigid couplings respectively eight third pressure sensor (229), third pressure sensor (229) contact ball (228).
2. The die bonder die bonding head pressure pre-warning device according to claim 1, wherein: the inner side of the shell cavity (24) is positioned below the induction disc (211) and is horizontally fixedly connected with a supporting frame (215), the bottom surface of the supporting frame (215) is uniformly fixedly connected with a plurality of disc springs (216), the bottom surfaces of the disc springs (216) are fixedly connected with a sleeve block (28), and the sleeve block (28) is rotatably sleeved on the periphery of the main shaft (26).
3. The die bonder die head pressure pre-warning device according to claim 2, wherein: the inner side of the sleeve block (28) is provided with an inner ring groove (29), the periphery of the main shaft (26) is fixedly connected with a supporting column (210), the supporting column (210) is rotationally sleeved in the inner ring groove (29), a first bearing (219) is fixedly connected between the periphery of the supporting column (210) and the inner side wall of the inner ring groove (29), the bottom surface of the supporting frame (215) is fixedly connected with a second pressure sensor (217), and the second pressure sensor (217) is contacted with the top surface of the sleeve block (28).
4. The die bonder die bonding head pressure pre-warning device according to claim 1, wherein: the top surface of the shell cavity (24) is provided with a top opening (220), the top opening (220) is movably connected with the top surface of the top block (221), the bottom surface of the top block (221) is provided with a top groove (222), the top end of the main shaft (26) is rotationally sleeved in the top groove (222), and a second bearing (223) is fixedly connected between the peripheral side of the main shaft (26) and the top groove (222).
5. The die bonder die bonding head pressure pre-warning device according to claim 1, wherein: the utility model discloses a motor drive device, including horizontal plate body (21) bottom surface rigid coupling second drive drain pan (224), main shaft (26) rotate and connect second drive drain pan (224) bottom surface, main shaft (26) are located second drive drain pan (224) internal position fixed driven synchronous pulley (225), first small-size servo gear motor (23), pivot end pass horizontal plate body (21) and are located second drive drain pan (224) and rigid coupling initiative synchronous pulley (226), cup joint drive belt (227) on initiative synchronous pulley (226) and driven synchronous pulley (225), casing (22) surface rigid coupling buzzer (230) and alarm lamp (231).
6. The die bonder die bonding head pressure pre-warning device according to claim 1, wherein: the utility model discloses a motor-driven vertical plate, including vertical plate (32), small-size servo gear motor (36) of second, small-size servo gear motor (36) pivot end rigid coupling pivot board (33) department, notch (37) are seted up on solid brilliant first mounting panel (35) top in two first side ear (34) same horizontal position, the lateral wall of rotating board (33) is located notch (37) internal position rigid coupling biax small-size servo gear motor (38), small-size servo gear motor (38) of biax both sides pivot end rigid coupling notch (37) both sides respectively, rigid coupling a plurality of triangle reinforcing plates (39) between vertical plate (32) both sides and roof (31).
7. The die bonder die bonding head pressure pre-warning device according to claim 1, wherein: the angle calibration assembly is characterized in that the angle calibration assembly is fixedly connected with the driving assembly (4), the driving assembly (4) comprises a main plate body (41) arranged in the vertical direction, two linear sliding rails (42) are fixedly connected to one side of the main plate body (41), two sliding seats (43) are respectively and vertically connected to the linear sliding rails (42) in a sliding mode, two side walls of the sliding seats (43) are fixedly connected with the top ends of movable plates (44), the bottom ends of the movable plates (44) are fixedly connected with the side walls of the top plates (31), and the cross section of each linear sliding rail (42) is in a T-shaped shape.
8. The die bonder die head pressure warning device according to claim 7, wherein: the movable plate (44) top is kept away from slide (43) one side central point put rigid coupling two second side ear (45), two rotate between second side ear (45) and connect transfer line (46) bottom, position rigid coupling U type seat (47) between two linear slide rail (42) are located above mainboard body (41), two inboard rotation respectively of U type seat (47) connect two pull rod (48) one end, two rigid coupling axostylus axostyle (49) between the pull rod (48) other end, axostylus axostyle (49) rotate and cup joint transfer line (46) top.
9. The die bonder die head pressure warning device according to claim 8, wherein: the main board body (41) is close to a U-shaped cover (410) fixedly connected to one side of the movable plate (44), the inner side of the U-shaped cover (410) is fixedly connected with a third small-sized servo speed reduction motor (411) at the same horizontal position of a U-shaped seat (47), a rotating shaft end of the third small-sized servo speed reduction motor (411) is fixedly connected with an extension shaft (412), the end part of the extension shaft (412) is fixedly connected with the rotating shaft end of one pull rod (48), and the main board body (41) and the top end of the U-shaped cover (410) are fixedly connected with a transverse plate (413).
10. The die bonder die head pressure warning device according to claim 9, wherein: the frame body assembly (1) comprises a frame (11), swing arm (12) one end is connected in the rotation of frame (11) top surface, swing arm (12) other end bottom surface rigid coupling installation diaphragm (413) top surface, frame (11) top surface rigid coupling main drive gear motor (15), frame (11) bottom surface rigid coupling first drive drain pan (14), swing arm (12) pivot end passes frame (11) and is located first drive drain pan (14) and rigid coupling driven gear (17), main drive gear motor (15) pivot end passes frame (11) and is located first drive drain pan (14) and rigid coupling driving gear (16), driven gear (17) are connected in the meshing of driving gear (16), frame (11) are close to solid crystal head assembly (2) position and offer opening (13).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310587362.4A CN116403946B (en) | 2023-05-24 | 2023-05-24 | Die bonder head pressure early warning device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310587362.4A CN116403946B (en) | 2023-05-24 | 2023-05-24 | Die bonder head pressure early warning device |
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| CN116403946A CN116403946A (en) | 2023-07-07 |
| CN116403946B true CN116403946B (en) | 2023-08-04 |
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| CN117316855B (en) * | 2023-11-27 | 2024-02-02 | 东莞市华越半导体技术股份有限公司 | Rotatory chip die bonder of getting material |
| CN117352442B (en) * | 2023-12-06 | 2024-02-02 | 东莞市华越半导体技术股份有限公司 | Crystal fixing machine with stable swing arm |
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| JP2004158743A (en) * | 2002-11-08 | 2004-06-03 | Juki Corp | Component holding device |
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| CN114927434A (en) * | 2022-05-17 | 2022-08-19 | 合肥欣奕华智能机器股份有限公司 | Die bonder and control method thereof |
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2023
- 2023-05-24 CN CN202310587362.4A patent/CN116403946B/en active Active
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|---|---|---|---|---|
| JP2004158743A (en) * | 2002-11-08 | 2004-06-03 | Juki Corp | Component holding device |
| CN110299312A (en) * | 2019-07-04 | 2019-10-01 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower bonder |
| CN110828339A (en) * | 2019-10-09 | 2020-02-21 | 深圳市盛世智能装备有限公司 | Material taking unit and die bonder |
| KR20220021085A (en) * | 2020-08-12 | 2022-02-22 | 주식회사 야스 | Automatic system for replacement of adhesion sheets of adhesives chuck |
| CN114927434A (en) * | 2022-05-17 | 2022-08-19 | 合肥欣奕华智能机器股份有限公司 | Die bonder and control method thereof |
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| CN116403946A (en) | 2023-07-07 |
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