CN103077915A - Adjustable double swing arm system three-core alignment method of chip grading equipment - Google Patents
Adjustable double swing arm system three-core alignment method of chip grading equipment Download PDFInfo
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- CN103077915A CN103077915A CN201310007466XA CN201310007466A CN103077915A CN 103077915 A CN103077915 A CN 103077915A CN 201310007466X A CN201310007466X A CN 201310007466XA CN 201310007466 A CN201310007466 A CN 201310007466A CN 103077915 A CN103077915 A CN 103077915A
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Abstract
The invention discloses an adjustable double swing arm system three-core alignment method of chip grading equipment. The method comprises the following steps of: step I, confirming chip taking positions of a first swing arm and a second swing arm, and enabling centers of a chip taking position of a first suction nozzle hole of the first swing arm and a chip taking position of a second suction nozzle hole of the second swing arm to be coincided with a center of a supply area lens cross curve; and step II, adjusting an XY moving platform of an ejector pin seat, aligning a center of the ejector pin to the center of the supply area lens cross curve, and finishing three-core alignment operation. The three-core alignment operation method is simple to operate, can accurately realize three-core alignment process, and in addition, a deviation compensation value of an arraying area platform for the swing arm system can be obtained, and the chip grading yield and the chip arraying accuracy can be improved.
Description
Technical Field
The invention relates to the technical field of chip sorting, in particular to a three-heart alignment method of an adjustable double-swing-arm system of chip sorting equipment.
Background
The chip sorting equipment is used for sorting and discharging the chips. In the working process, the chips to be sorted are uniformly adhered to the flip-chip film, and the flip-chip film is tightly fixed on the tray; the tray is arranged on a supply platform which can move towards X, Y and rotate around the axis of the tray, and a scanning CCD system is arranged above the supply platform to identify and position each chip in a supply area on the crystal turning film; the XY cross platform transfers the crystal grains to the center of the thimble; the thimble jacks up and pierces the film to peel off the crystal grains; the chip transfer system grabs the chips and places the chips into the arrangement area of the receiving platform according to rules, so that the chip sorting process is completed.
The swing arm system is an important component of chip sorting equipment, belongs to a chip transfer system, and mainly has the function of transferring chips from a supply platform to a receiving platform through rotation and lifting of the swing arm. The swing arm system is the key for realizing the chip sorting process, and the rotating and lifting motion characteristics of the swing arm determine the success or failure of chip transfer and the transfer efficiency.
The chip sorting equipment needs to ensure normal sorting, and three centers of a lens center, a suction nozzle center and a thimble center are required to be positioned on the same straight line, and the process is called three-center alignment operation.
In the double swing arm system of the chip sorting equipment, two swing arms all need to carry out three-heart alignment operation, because the contained angle between two swing arms of the double swing arm system of the chip sorting equipment is not necessarily 180 degrees due to the errors of manufacturing and installation, and the lengths of the two swing arms are also not necessarily completely the same, therefore, the three-heart alignment operation of the two swing arms is difficult.
In the prior art, most chip sorting equipment is set as a single swing arm system, and the three-core alignment operation of the single swing arm system is simple and easy to complete; for the double-swing-arm system, the three-core alignment process is complex to operate, and the operation is inconvenient and fast.
Therefore, it is important to provide a technology of an adjustable three-center alignment method of a double-swing-arm system for a chip sorting apparatus.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provides a three-core alignment method of an adjustable double-swing-arm system of chip sorting equipment.
The purpose of the invention is realized by the following technical scheme:
the method for aligning the three centers of the adjustable double-swing-arm system of the chip sorting equipment comprises the following steps:
determining chip taking positions of a first swing arm and a second swing arm, and enabling the chip taking position of a first suction nozzle hole of the first swing arm and the chip taking position of a second suction nozzle hole of the second swing arm to be coincided with the center of a lens cross line of a supply area;
and step two, adjusting an XY moving platform of the thimble seat, aligning the center of the thimble to the center of the lens cross line of the supply area, and finishing the three-center alignment operation.
Wherein,and step three, after the three-center alignment operation is finished, compensating deviation through the motion of the platform in the arrangement area, so that the center of the first suction nozzle hole and the center of the second suction nozzle hole are overlapped at the center of the lens cross line in the arrangement area.
Wherein,the third step specifically comprises:
(1) moving the first swing arm to the arrangement area;
(2) moving the lens in the arrangement area to enable the center of the cross line of the lens in the arrangement area to be superposed with the center of the first suction nozzle hole;
(3) rotating the first swing arm by a certain angle to enable the arrangement area lens to see the arrangement area chips, moving any one arrangement area chip to enable the arrangement area chip to be positioned in the center of the arrangement area lens cross line, and recording the coordinates of the Bin disc as A;
(4) moving the second swing arm to the arrangement area;
(5) moving the lens in the arrangement area to enable the center of the cross line of the lens in the arrangement area to be superposed with the center of the second suction nozzle hole;
(6) rotating the second swing arm by a certain angle to enable the arrangement area lens to see the arrangement area chips, moving the arrangement area chip obtained in the step (3) to the center of the arrangement area lens cross line, and recording the coordinates of the Bin disc as B;
(7) and subtracting the Bin disc coordinate A and the Bin disc coordinate B to obtain a coordinate deviation compensation value of the arrangement area platform motion to the second swing arm.
Wherein,the first step specifically comprises:
(1) moving the first swing arm to the initial chip taking position, and adjusting the position of the first swing arm to enable the first suction nozzle hole of the first swing arm to be closest to the central cross line of the lens in the supply area;
(2) the length of the first swing arm is adjusted through a cam mechanism on the first swing arm, so that the first suction nozzle hole is positioned in the center of the lens cross line of the supply area, and the position is set as the position of a core taking sheet of the first swing arm;
(3) rotating the first swing arm by 180 degrees, positioning the second swing arm at the initial chip taking position, and adjusting the position of the second swing arm to enable the second suction nozzle hole to be closest to the center of the lens cross line of the supply area;
(4) the length of the second swing arm is adjusted through a cam mechanism on the second swing arm, so that the second suction nozzle hole is positioned in the center of the lens cross line of the supply area, and the position is set as the chip taking position of the second swing arm.
In the step (1), the centers of the first swing arm and the lens in the supply area are adjusted to be positioned on the same horizontal line, and at the moment, the first suction nozzle hole of the first swing arm is closest to the cross line of the center of the lens in the supply area.
And in the step (3), the centers of the second swing arm and the lens in the supply area are adjusted to be positioned on the same horizontal line, and at the moment, the second suction nozzle hole of the second swing arm is closest to the cross line of the centers of the lens in the supply area.
The invention has the beneficial effects that:
the invention discloses a three-center alignment method of an adjustable double-swing-arm system of chip sorting equipment, which comprises the following steps of: determining chip taking positions of the first swing arm and the second swing arm, and enabling the chip taking position of a first suction nozzle hole of the first swing arm and the chip taking position of a second suction nozzle hole of the second swing arm to be coincided with the center of a supply area lens cross line; and adjusting an XY moving platform of the thimble seat, aligning the center of the thimble to the center of the lens cross line of the supply area, and finishing the three-center alignment operation. The three-center alignment method is simple to operate, can accurately realize the three-center alignment process, can obtain the deviation compensation value of the arrangement area platform to the swing arm system, and can improve the chip sorting yield and the chip arrangement precision.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic structural illustration of an adjustable double-swing-arm system three-center alignment method of a chip sorting apparatus according to the present invention.
Fig. 2 is a flowchart of a first step of the adjustable double-swing-arm system three-heart alignment method of the chip sorting apparatus according to the present invention.
Fig. 3 is a flowchart of a third step of the adjustable double-swing-arm system three-heart alignment method of the chip sorting apparatus according to the present invention.
In fig. 1, 2 and 3, included are:
21-first swing arm, 211-first suction nozzle hole, 22-second swing arm, 221-second suction nozzle hole, 23-rotary motor shaft, 24-supply zone lens cross line, 25-arrangement zone lens cross line.
Detailed Description
The invention is further described with reference to the following examples.
It should be noted that the adjustable double-swing-arm system mentioned in the present invention is shown in fig. 1, and specifically includes a first swing arm 21 and a second swing arm 22, wherein one end of the first swing arm 21 is provided with a first suction nozzle hole 211, one end of the second swing arm 22 is provided with a second suction nozzle hole 221, and the other end of the first swing arm 21 and the other end of the second swing arm 22 are connected through a rotating motor shaft 23; wherein the first swing arm 21 and the second swing arm 22 are both provided with a cam mechanism of adjustable length.
Example 1.
One of the specific implementation modes of the adjustable double-swing-arm system three-heart alignment method of the chip sorting equipment comprises the following steps of:
step one, determining the positions of core taking sheets of a first swing arm 21 and a second swing arm 22, and enabling the position of a chip taking position of a first suction nozzle hole 211 of the first swing arm 21 and the position of a chip taking position of a second suction nozzle hole 221 of the second swing arm 22 to be superposed with the center of a lens cross line 24 of a supply area;
and step two, taking out the Wafer disc, adjusting an XY moving platform of the thimble seat, aligning the center of the thimble to the center of the lens cross line 24 of the supply area, and finishing the three-center alignment operation.
The three-core alignment method is simple to operate and can accurately realize the three-core alignment process.
Preferably, as shown in fig. 2, the first step specifically includes:
s11: the first swing arm 21 is moved to its initial chip pick position.
S12: the position of the first swing arm 21 is adjusted so that the first nozzle hole 211 of the first swing arm 21 is closest to the lens center cross line of the supply area.
S13: the length of the first swing arm 21 is adjusted by the cam mechanism on the first swing arm 21 so that the first nozzle hole 211 is located at the center of the lens cross line 24 in the supply area, and this position is set as the chip taking position of the first swing arm 21, that is, the chip placing position of the second swing arm 22.
S14: the first swing arm 21 is rotated 180 deg., at which time the second swing arm 22 is in its initial chip-picking position.
S15: the position of the second swing arm 22 is adjusted so that the second nozzle hole 221 is closest to the center of the supply area lens reticle 24.
S16: the length of the second swing arm 22 is adjusted by the cam mechanism on the second swing arm 22, so that the second nozzle hole 221 is positioned at the center of the lens cross line 24 in the supply area, and the position is set as the chip taking position of the second swing arm 22, that is, the chip placing position of the first swing arm 21.
S17: moving the first swing arm 21 to the supply area, it is found that the center of the second nozzle hole 221 is not at the center of the arrangement area lens reticle 25.
In the above S11, the first swing arm 21 and the lens center of the supply area are adjusted to be on the same horizontal line, and at this time, the first nozzle hole 211 of the first swing arm 21 is closest to the cross line of the lens center of the supply area.
In the above-mentioned S13, the second swing arm 22 and the lens center of the feed area are adjusted to be on the same horizontal line, and at this time, the second nozzle hole 221 of the second swing arm 22 is closest to the cross line of the lens center of the feed area.
Example 2.
In a second specific implementation manner of the adjustable double-swing-arm system three-center alignment method for chip sorting equipment according to the present invention, the main technical solution of this embodiment is the same as that in embodiment 1, and features not explained in this embodiment adopt the explanations in embodiment 1, and are not described again here.
The difference between this embodiment and embodiment 1 is that a third step is further included, after the three-center alignment operation is completed, the deviation is compensated by the motion of the platform in the arrangement region, so that the center of the first nozzle hole 211 and the center of the second nozzle hole 221 coincide with each other at the center of the lens cross line 25 in the arrangement region. The invention can also obtain the deviation compensation value of the arrangement area platform to the two swing arms, and can improve the chip sorting yield and the chip arrangement precision.
Preferably, as shown in fig. 3, the step three specifically includes:
s31: moving the first swing arm 21 to the arrangement area; the center of the first nozzle hole 211 is found not to be at the center of the arrangement area lens reticle 25.
S32: the arrangement region lens is moved so that the center of the arrangement region lens cross line 25 coincides with the center of the first nozzle hole 211.
S33: the first swing arm 21 is rotated by a certain angle so that the chips in the arrangement area can be seen by the lens in the arrangement area, any one chip in the arrangement area is moved to be positioned at the center of the cross line 25 of the lens in the arrangement area, and the coordinate of the Bin disk is recorded as A.
S34: the second swing arm 22 is moved to the alignment area.
S35: the arrangement region lens is moved so that the center of the arrangement region lens cross line 25 coincides with the center of the second nozzle hole 221.
S36: and (3) rotating the second swing arm 22 by a certain angle to enable the arrangement area lens to see the arrangement area chips, moving the arrangement area chips obtained in the step (3) to the center of an arrangement area lens cross line 25, and recording the coordinates of the Bin disk as B.
S37: and subtracting the Bin disc coordinate A and the Bin disc coordinate B to obtain a coordinate deviation compensation value of the arrangement area platform motion to the second swing arm 22.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A three-center alignment method of an adjustable double-swing-arm system of chip sorting equipment is characterized by comprising the following steps:
determining chip taking positions of a first swing arm and a second swing arm, and enabling the chip taking position of a first suction nozzle hole of the first swing arm and the chip taking position of a second suction nozzle hole of the second swing arm to be coincided with the center of a lens cross line of a supply area;
and step two, adjusting an XY moving platform of the thimble seat, aligning the center of the thimble to the center of the lens cross line of the supply area, and finishing the three-center alignment operation.
2. The method of claim 1, wherein the adjustable double-swing-arm system three-center alignment method comprises the following steps: and step three, after the three-center alignment operation is finished, compensating deviation through the motion of the platform in the arrangement area, so that the center of the first suction nozzle hole and the center of the second suction nozzle hole are overlapped at the center of the lens cross line in the arrangement area.
3. The method of claim 2, wherein the step three specifically comprises:
(1) moving the first swing arm to the arrangement area;
(2) moving the lens in the arrangement area to enable the center of the cross line of the lens in the arrangement area to be superposed with the center of the first suction nozzle hole;
(3) rotating the first swing arm by a certain angle to enable the arrangement area lens to see the arrangement area chips, moving any one arrangement area chip to enable the arrangement area chip to be positioned in the center of the arrangement area lens cross line, and recording the coordinates of the Bin disc as A;
(4) moving the second swing arm to the arrangement area;
(5) moving the lens in the arrangement area to enable the center of the cross line of the lens in the arrangement area to be superposed with the center of the second suction nozzle hole;
(6) rotating the second swing arm by a certain angle to enable the arrangement area lens to see the arrangement area chips, moving the arrangement area chip obtained in the step (3) to the center of the arrangement area lens cross line, and recording the coordinates of the Bin disc as B;
(7) and subtracting the Bin disc coordinate A and the Bin disc coordinate B to obtain a coordinate deviation compensation value of the arrangement area platform motion to the second swing arm.
4. The method of claim 1, wherein the first step specifically comprises:
(1) moving the first swing arm to the initial chip taking position, and adjusting the position of the first swing arm to enable the first suction nozzle hole of the first swing arm to be closest to the central cross line of the lens in the supply area;
(2) the length of the first swing arm is adjusted through a cam mechanism on the first swing arm, so that the first suction nozzle hole is positioned in the center of the lens cross line of the supply area, and the position is set as the position of a core taking sheet of the first swing arm;
(3) rotating the first swing arm by 180 degrees, positioning the second swing arm at the initial chip taking position, and adjusting the position of the second swing arm to enable the second suction nozzle hole to be closest to the center of the lens cross line of the supply area;
(4) the length of the second swing arm is adjusted through a cam mechanism on the second swing arm, so that the second suction nozzle hole is positioned in the center of the lens cross line of the supply area, and the position is set as the chip taking position of the second swing arm.
5. The method of claim 4, wherein the method comprises the following steps: in the step (1), the centers of the first swing arm and the lens in the supply area are adjusted to be positioned on the same horizontal line, and at the moment, the first suction nozzle hole of the first swing arm is closest to the cross line of the center of the lens in the supply area.
6. The method of claim 4, wherein the method comprises the following steps: and in the step (3), the centers of the second swing arm and the lens in the supply area are adjusted to be positioned on the same horizontal line, and at the moment, the second suction nozzle hole of the second swing arm is closest to the cross line of the centers of the lens in the supply area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310007466.XA CN103077915B (en) | 2013-01-09 | 2013-01-09 | A kind of adjustable double-pendulum arms system three-core alignment method of die grading equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310007466.XA CN103077915B (en) | 2013-01-09 | 2013-01-09 | A kind of adjustable double-pendulum arms system three-core alignment method of die grading equipment |
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| CN103077915A true CN103077915A (en) | 2013-05-01 |
| CN103077915B CN103077915B (en) | 2015-07-29 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103357584A (en) * | 2013-07-05 | 2013-10-23 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
| CN104992918A (en) * | 2015-05-08 | 2015-10-21 | 江苏艾科瑞思封装自动化设备有限公司 | Die bonder automatic calibration method and system |
| CN107716324A (en) * | 2017-11-21 | 2018-02-23 | 中邮科技有限责任公司 | Double-pendulum arms vertical belt mail sorting equipment and the method using its sort mail |
| CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
| CN114688934A (en) * | 2022-06-02 | 2022-07-01 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge part of ship |
| CN115732378A (en) * | 2021-08-30 | 2023-03-03 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103357584A (en) * | 2013-07-05 | 2013-10-23 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
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| CN107716324A (en) * | 2017-11-21 | 2018-02-23 | 中邮科技有限责任公司 | Double-pendulum arms vertical belt mail sorting equipment and the method using its sort mail |
| CN107716324B (en) * | 2017-11-21 | 2024-06-11 | 中邮科技股份有限公司 | Double-swing-arm vertical belt mail sorting equipment and mail sorting method using same |
| CN115732378A (en) * | 2021-08-30 | 2023-03-03 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
| CN115732378B (en) * | 2021-08-30 | 2023-09-26 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
| CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
| CN114688934A (en) * | 2022-06-02 | 2022-07-01 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge part of ship |
| CN114688934B (en) * | 2022-06-02 | 2022-07-29 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge position of ship |
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