WO2011128981A1

WO2011128981A1 - Component transfer device and method

Info

Publication number: WO2011128981A1
Application number: PCT/JP2010/056615
Authority: WO
Inventors: 昭一藤森; 寿治清水; 秀憲青木
Original assignee: パイオニア株式会社; 株式会社パイオニアＦａ
Priority date: 2010-04-13
Filing date: 2010-04-13
Publication date: 2011-10-20
Also published as: CN102834910A; CN102834910B; JP4919240B2; JPWO2011128981A1

Abstract

A component transfer device (1) takes out wafer-shaped chips (100), which are held in holding units (11, 200), by means of suction nozzles (31). Acquisition means (19, 40) acquire position information about the chips in the holding units, and then, before a first chip from among the plurality of chips is adhered, position information about that first chip is re-acquired and thus updated. A determination means (40) (i) determines a movement amount for moving the first chip to a pick-up position, on the basis of the updated position information for the first chip, and (ii) determines a movement amount for moving chips other than the first chip to a pick-up position on the basis of revised position information, which is the position information for chips other than the first chip which are held in a specified region, using the first chip as a reference, in the holding unit, having been revised on the basis of the pre-update position information and post-update position information for the first chip. Movement means (12, 40) move the chips to the pickup position on the basis of the determined movement amounts.

Description

Parts transfer apparatus and method

The present invention relates to a technical field of a component transfer device that picks up electronic components such as chips and arranges them at a transfer destination.

As this type of device, there is known a device that picks up wafer-like chip parts divided by dicing and arranges them at the transfer destination for each rank. A conventional component transfer apparatus picks up a chip from the upper side by an adsorption nozzle connected to a vacuum pump, and picks up and transfers the chips one by one by pushing up from the lower side.

However, since the above-described chip parts are produced in large numbers from a single wafer, a component transfer apparatus that transfers chip parts is required to transfer many chips in a short time. For example, in order to shorten the tact time of the transfer process, a structure capable of transferring a plurality of chips at the same time is required and research is being conducted.

The following prior art documents describe a configuration in which a plurality of suction nozzles arranged in a row are used to suck chips in a row and transfer them to a transfer destination. In this configuration, when picking up a chip, the chip of an appropriate rank is pushed up from the lower side by a push-up pin, so that pick-up assistance and rank classification of the chip to be picked up are performed.

Also, a configuration in which a plurality of suction nozzles are provided and each nozzle can be individually adjusted to a position where the chip can be properly sucked is described.

Japanese Patent No. 3712695 Patent 3719182

In the parts transfer device, in order to transfer many chips in a short time, it is required to shorten the tact time of various processes related to the transfer as much as possible.

For example, a configuration has been developed in which a plurality of suction nozzles are used to simultaneously pick up a plurality of chips in order to shorten the tact time. By the way, in the configuration in which the nozzles are arranged in a row as described in the above-described prior art documents, it may not be possible to cope with a case where the position of the chip is shifted, and appropriate pickup may not be performed. Further, when a mechanism for individually adjusting the positions of a plurality of nozzles is provided, there is a technical problem that the apparatus configuration becomes complicated and the processing amount of the apparatus becomes complicated.

For example, the wafer after dicing is divided into individual chip parts by extending an adhesive sheet on which the wafer is held, and passed to a pickup process by a head having a suction nozzle. At this time, the position of each chip component may change due to the expansion and contraction of the adhesive sheet over time.

In the above-described prior art documents, there is a description of a configuration in which the chip parts on the adhesive sheet are collectively detected to detect the position information immediately before the pickup process is started and the individual chip parts are taken out. In this method, there is a technical problem that it is necessary to detect the position twice for every chip, and the tact time is extended. Further, it is necessary to detect the position of all the chip components adsorbed to each of the plurality of nozzles, and there is a possibility that the time required for position detection is extended.

For example, it is required to inspect whether the chips arranged at the transfer destination are correctly arranged and the state of the chips. In the conventional configuration, an image is taken of the chips to be arranged, and the inspection is performed by image recognition. At this time, depending on the arrangement of the chips, a plurality of images may be required to perform an appropriate inspection, and the time required for imaging may be extended. In addition, since there is a need for image recognition for a plurality of types of images, there is a possibility that the tact time may be extended.

The present invention has been made in view of, for example, the above-described conventional problems, and provides a component transfer apparatus and method for appropriately picking up and transferring a chip component and reducing the cycle time of a work process. This is the issue.

In order to solve the above problems, a component transfer device according to the present invention is a component transfer device that takes out a plurality of wafer-like chips held in a holding unit and transfers them to a transfer destination, and holds the chips. Based on the position information, an acquisition means for acquiring the position information of the chip held in the holding portion, a storage means for storing the position information, a suction nozzle for sucking the chip at a predetermined pickup position, and Determining means for determining a movement amount for moving the chip to the pickup position, moving means for moving the chip to the pickup position by moving the holding unit based on the movement amount, A range setting unit configured to set a predetermined range with respect to the chip on the holding unit; and the acquisition unit acquires position information of the chip on the holding unit. Then, before the first chip of the plurality of chips is sucked by the suction nozzle, the position information of the first chip is re-acquired and updated. Determining a movement amount for moving the first chip to the pickup position based on the updated position information of the first chip; and (ii) using the first chip on the holding unit as a reference Correction performed by correcting position information of chips other than the first chip held within the predetermined range based on position information before and after updating the first chip. Based on the position information, a movement amount for moving a chip other than the first chip held in the predetermined range to the pickup position is determined.

In order to solve the above-described problems, a component transfer method of the present invention is a component transfer method in a component transfer apparatus that takes out a plurality of chips held in a holding unit, and includes positional information of the chips held in the holding unit. An acquisition step of acquiring, a storing step of storing the position information, a nozzle control step of controlling a suction nozzle that sucks the chip at a predetermined pickup position, and moving the chip to the pickup position based on the position information A determination step for determining a movement amount to be performed, a movement step for moving the chip to the pickup position based on the movement amount, and a range for setting a predetermined range based on the chip on the holding unit A setting step, wherein the obtaining step obtains position information of the plurality of chips on the holding unit, and then acquires the first of the plurality of chips. Before the chip is sucked by the suction nozzle, the position information of the first chip is updated again, and the determination step is based on (i) the position information after the first chip is updated. And determining the amount of movement for moving the first chip to the pickup position, and (ii) the first chip held within the predetermined range based on the first chip on the holding unit. The position information of chips other than the first chip is held within the predetermined range based on corrected position information obtained by performing correction based on position information before and after updating the first chip. A movement amount for moving a chip other than the first chip to the pickup position is determined.

The operation and other advantages of the present invention will be clarified from the embodiments described below.

It is a block diagram which shows the structure of the transfer apparatus of a present Example. It is a figure which shows the positional relationship and operation | movement direction of each part of a transfer apparatus. It is a figure which shows the aspect of the pick-up of the chip | tip by the transfer apparatus. It is a graph which shows the positional relationship of each part at the time of chip pick-up. It is a flowchart which shows the flow of operation | movement of the transfer apparatus of a present Example. It is a flowchart which shows the flow of the pick-up operation | movement of a present Example. It is a figure which shows the aspect of the position correction of the chip | tip in a pick-up operation. It is a flowchart which shows the flow of the place operation | movement of a present Example. It is a figure which shows the relationship between the arrangement | positioning position of the chip | tip at the time of a place operation | movement, and the inspection position of a chip | tip. It is a figure which shows the relationship between the arrangement | positioning position of the chip | tip at the time of a place operation | movement, and the inspection position of a chip | tip. It is a block diagram which shows the structure of the modification of a transfer apparatus. It is a figure which shows the positional relationship and operation | movement direction of each part of the modification of a transfer apparatus. It is a figure which shows the positional relationship and operation | movement direction of each part of the modification of a transfer apparatus. It is a figure which shows the positional relationship and operation | movement direction of each part of the modification of a transfer apparatus. It is a flowchart which shows the flow of operation | movement of the modification of a transfer apparatus.

An embodiment of the component transfer device of the present invention is a component transfer device that takes out a plurality of wafer-like chips held in a holding unit and transfers them to a transfer destination, the holding unit holding the chips, and the holding An acquisition means for acquiring the position information of the chip held in the unit, a storage means for storing the position information, a suction nozzle for sucking the chip at a predetermined pickup position, and the chip based on the position information. Determining means for determining a moving amount for moving to the pickup position; moving means for moving the chip to the pickup position by moving the holding unit based on the moving amount; and on the holding unit Range setting means for setting a predetermined range with reference to the chip, and the acquisition means acquires the position information of the chip on the holding unit and Before the first chip of the chips is sucked by the suction nozzle, the position information of the first chip is re-acquired and updated, and (i) the first means Determining a movement amount for moving the first chip to the pickup position based on the updated position information of the chip; and (ii) the predetermined chip based on the first chip on the holding unit. Based on corrected position information obtained by performing correction based on position information before and after updating the first chip with respect to position information of chips other than the first chip held in the range. The movement amount for moving the chips other than the first chip held in the predetermined range to the pickup position is determined.

According to the embodiment of the component transfer apparatus of the present invention, a plurality of wafer-like chips held on the holding unit are taken out by the suction nozzle. The holding unit is, for example, a member that holds an adhesive sheet for adhering and holding a plurality of chips, and is, for example, a ring that can be held in an expanded state. With respect to such a holding unit, a plurality of chips are held at positions separated from each other by a predetermined distance on a plane serving as a chip holding surface (in other words, an XY plane).

The acquisition unit includes, for example, a camera and a CPU connected to the camera, captures an image of a holding unit that holds the chip, and acquires the position information of the chip on the holding unit by analyzing the image. . Specifically, the CPU recognizes the position of each chip by analyzing an image captured by the camera, and sets coordinates based on a certain point for each chip.

The storage means is an information recording medium such as a memory connected to the CPU constituting the acquisition means. The CPU of the acquisition unit stores the coordinates of each chip as position information in the storage unit.

The suction nozzle is a cylindrical nozzle connected to a decompression device such as a vacuum pump. At the pickup position, the suction nozzle adsorbs a chip that is in contact with the end of the cylinder (preferably, the lower end) and serves as a holding unit. Remove from the adhesive sheet. For example, the suction nozzle is held by a transfer head unit that is movable between the holding unit and the transfer destination of the chip, and transfers the chip that is sucked by the suction nozzle.

Here, the pickup position is a position where the chip is taken out in the component transfer device, and specifically indicates a predetermined position in the X direction and the Y direction with reference to a certain position in the component transfer device. It is the purpose. Therefore, when the chip is sucked, the chip is held at the pickup position, and the suction nozzle is held at a position separated from the chip by a predetermined distance in the Z direction. Is also referred to as the pickup position.

The determining means determines a moving amount of the chip so that the chip to be taken out of the chips held by the holding unit comes to the pickup position. The determining means, for example, reads the position information of the desired chip and compares it with the coordinates of the pickup position set separately to determine the movement amount.

The moving means moves to the pickup position by moving the desired chip on the holding unit based on the moving amount determined by the determining means. For example, the moving means is an actuator that moves the chip by moving a holding unit that holds the chip.

The range setting means sets a predetermined range for each chip by applying a predetermined distance set separately to the chip position information. For example, the range setting means sets a predetermined range centered on the coordinates of one chip.

In the embodiment of the component transfer apparatus according to the present invention, in the chip pick-up process, first, the acquisition unit acquires the position information for each of the chips held by the holding unit and stores it in the storage unit.

Subsequently, when taking out the first chip among the chips held in the holding unit, the acquisition unit acquires the position information about the first chip again and stores it in the storage unit as update information. Thereafter, the determining means determines the amount of movement for the first chip to move to the pickup position based on the update information of the first chip, and the moving means moves the holding unit or the like based on the amount of movement. The first chip is moved to the pickup position. At the pickup position, the first chip is picked up by the suction nozzle and taken out.

Next, when taking out the second chip, first, is the second chip held within a predetermined range based on the position based on the position information before the update of the first chip? A determination is made whether or not. When the second chip is held within the predetermined range, the determination unit first applies the difference between the update information of the first chip and the position information before the update to the position information of the second chip. The update information of the second chip is created. Specifically, when the update information of the first chip is shifted by a distance B in a certain direction A as compared with the position information before the update, the determination unit sets the position information of the second chip in the direction A. The position information shifted by the distance B is used as update information.

Then, the determining means determines a moving amount for moving the second chip to the pickup position based on the update information of the second chip. The moving means moves the holding unit or the like based on the moving amount, whereby the second chip is moved to the pickup position. At the pickup position, the second chip is sucked by the suction nozzle and taken out.

Even when taking out subsequent chips, if the chip is held within a predetermined range based on the position based on the position information before the update of the first chip, the position information of the chip Then, the difference between the update information of the first chip and the position information before the update is applied, and the process of creating the update information is repeated.

On the other hand, when taking out the n-th chip, if the n-th chip is held outside a predetermined range with reference to the first chip, the acquisition means again obtains the position information about the n-th chip. It is acquired and stored in the storage means as update information. Thereafter, the determining means determines the amount of movement for the n-th chip to move to the pickup position based on the update information of the n-th chip, and the moving means moves the holding unit or the like based on the amount of movement. The nth chip is moved to the pickup position. At the pickup position, the nth chip is picked up by the suction nozzle and taken out.

As described above, according to the configuration and operation described above, each of the chips held by the holding unit is moved to the pickup position for taking out by the suction nozzle. For such movement, first, the position information is acquired for all the chips, and then the position information is acquired again for the chips to be taken out.

The pressure-sensitive adhesive sheet on which the chip is held is typically held in a stretched state on the holding unit for the purpose of properly separating the chips divided by dicing and preventing mutual contact. The stretched state of the pressure-sensitive adhesive sheet changes with time, and the position of the chip held on the pressure-sensitive adhesive sheet may change.

If there is a change in the position of the chip, it is not possible to determine the amount of movement for moving the chip to the pickup position appropriately only by using the position information before the change occurs. Therefore, the acquisition unit acquires the position information for the first chip to be extracted again immediately before the extraction, and updates the position information of the chip.

By the way, when the position of the chip changes due to the change in the stretched state of the adhesive sheet, it is determined that the same position change as that of the one chip occurs for the chip held in the vicinity of the one chip. I can do it. For this reason, with respect to a chip held within a predetermined range that is assumed to have the same position change with the first chip as a reference, the updated position information of the first chip and the position information before the update By applying the correction based on the position information, the position information after the position change can be estimated. When the chip within the predetermined range is moved, the moving amount for moving to the pickup position can be determined based on the position information estimated by the determining means without acquiring the position information again. For this reason, it is not necessary to re-acquire the position information immediately before taking out all of the chips to be taken out, so that the tact time can be shortened.

It should be noted that there may be a plurality of reference first chips as long as it is possible to estimate the position change of other chips within a predetermined range. At this time, the determining means calculates the correction amount to be applied to the second chip within the predetermined range based on the measured positional changes of the plurality of first chips, and can enjoy the above-described effect by applying the correction amount. It becomes.

In one aspect of the embodiment of the component transfer apparatus of the present invention, a plurality of the suction nozzles are held, a transfer unit that moves between the holding unit and the transfer destination of the chip, and the transfer unit It further includes nozzle moving means for moving the plurality of suction nozzles held by the transfer means to the pickup position one by one by moving them.

The transfer means is configured to hold the suction nozzle and move the chip sucked by the suction nozzle to a predetermined transfer destination. According to the configuration of the transfer means, a plurality of suction nozzles can be collectively moved to a transfer destination by one movement. For this reason, the tact time can be greatly reduced as compared with the conventional apparatus in which chips are transferred one by one.

The nozzle moving means is an actuator that moves the transfer means in the X direction and the Y direction. The nozzle moving means moves the suction nozzle held by the transfer means in the X direction and the Y direction as the transfer means moves, and positions the desired suction nozzle at the pickup position. According to the configuration of the nozzle moving means, one of the plurality of suction nozzles held by the transfer means performs suction of the chip at the pick-up position, and then moves the transfer means to move out of the plurality of suction nozzles. The other suction nozzle is moved to the pickup position, and the chips moved to the pickup position are sucked.

When transferring a chip using only a single suction nozzle as in the conventional apparatus, after suctioning the first chip and completing the transfer to the transfer destination, the suction nozzle is again moved to the pickup position of the holding unit. Is required to move. On the other hand, according to the configuration of this aspect, after the suction nozzle held by the transfer means sucks the first chip as a reference, the next suction nozzle is moved to the pickup position by the nozzle moving means. The next chip is prepared for adsorption. For this reason, the time required until the next chip is sucked after the first chip is sucked can be shortened as compared with the conventional apparatus.

As described above, the position of the chip held on the pressure-sensitive adhesive sheet in the holding portion changes with the expansion state of the pressure-sensitive adhesive sheet with the passage of time. For this reason, when sucking a chip within a predetermined range based on the first chip after sucking the first chip serving as a reference, the chip is separated as the time interval of sucking each chip increases. The position may change further.

On the other hand, according to the operation of the transfer means and the nozzle moving means of this aspect, the time interval until the next chip is sucked after the first chip is sucked can be shortened. Can be realized with high accuracy.

In another aspect of the embodiment of the component transfer apparatus of the present invention, the urging means for urging the plurality of suction nozzles held by the transfer means so as to be separated from the chip held by the holding portion. And a nozzle control means for pressing the suction nozzle against the urging force of the urging means at the pickup position and causing the suction nozzle to abut on the chip.

According to this aspect, the nozzle control means causes the chip to be sucked by bringing the end of the suction nozzle into contact with the chip at the pickup position. On the other hand, the nozzle control means releases the pressure of the suction nozzle, so that the suction nozzle is separated from the holding portion where the chip is held by the urging force while the chip is sucked. At this time, when the suction nozzle is sucking the chip, the chip is peeled off from the adhesive sheet or the like on the holding unit and taken out.

With this configuration, the chip can be taken out from a member such as an adhesive sheet that holds the chip with a relatively simple configuration.

In addition, since the nozzle control means is configured to press the suction nozzle at the pickup position, it is preferably fixed to the component transfer device at a position where such pressing is possible.

Further, the nozzle control means may be configured such that the nozzle control means presses one of the plurality of suction nozzles at an end provided at a tip of an arm member that is moved by driving of a rotating cam. Good.

With this configuration, the suction nozzle can be pressed and released with a relatively simple configuration.

Further, the nozzle control means may include a bearing-like end portion that presses one of the plurality of suction nozzles.

With this configuration, when pressing one of the plurality of suction nozzles held by the transfer means, the X direction between the end of the suction nozzle and the end of the nozzle control means Or even if it is a case where the shift | offset | difference has arisen in the position of a Y direction, it can prevent suitably pressing adjacent other suction nozzles. This is particularly effective when the clearance between the plurality of suction nozzles held by the transfer means is small.

In another aspect of the embodiment of the component transfer apparatus of the present invention, one of the plurality of chips held by the holding unit is sucked by one of the plurality of suction nozzles at the pickup position. Is further provided with pressing means for pressing the nozzle toward the suction nozzle.

According to this aspect, the pressing means is a member having a needle-like end that can move in the Z direction at the pickup position, and when the suction nozzle abuts on the chip and performs suction, the suction nozzle touches the tip. The chip is pressed in the direction of the suction nozzle from the side opposite to the contact side.

In the case of such a configuration, the chip is pressed by the pressing member in the same direction in addition to the force by the biasing force of the suction nozzle during the suction. For this reason, it becomes possible to peel the chip | tip adhered and hold | maintained on an adhesive sheet in a holding | maintenance part more suitably from an adhesive sheet, and to take out.

In addition, since the pressing means is configured to press the chip at the pickup position, it is preferably fixed to the component transfer device at a position where such pressing is possible.

An embodiment according to the component transfer method of the present invention is a component transfer method in a component transfer apparatus that takes out a plurality of wafer-like chips held in a holding unit and transfers them to a transfer destination, and is held by the holding unit An acquisition step for acquiring position information of a chip, a storage step for storing the position information, a nozzle control step for sucking the chip to a suction nozzle at a predetermined pickup position, and picking up the chip based on the position information A determining step for determining a moving amount for moving to a position; a moving step for moving the chip to the pickup position based on the moving amount; and a predetermined range based on the chip on the holding portion. A range setting step for setting, and after the acquisition step acquires the position information of the chip on the holding unit, among the plurality of chips Before the first chip is sucked by the suction nozzle, the position information of the first chip is updated by reacquisition, and the determination step includes (i) a position after the update of the first chip. Based on the information, the amount of movement for moving the first chip to the pickup position is determined, and (ii) held within the predetermined range with the first chip on the holding unit as a reference The position information of chips other than the first chip is within the predetermined range based on corrected position information obtained by performing correction based on position information before and after updating the first chip. A component transfer method comprising: determining a moving amount for moving a chip other than the held first chip to the pickup position.

According to the embodiment related to the component transfer method of the present invention, various effects similar to those of the embodiment related to the component transfer apparatus of the present invention described above can be enjoyed.

In the embodiment relating to the component transfer method of the present invention, it is possible to adopt various aspects similar to the various aspects of the embodiment related to the component transfer apparatus of the present invention described above.

As described above, the embodiment according to the component transfer device of the present invention includes the holding unit, the acquisition unit, the storage unit, the suction nozzle, the determination unit, the moving unit, and the range setting unit. The embodiment according to the component transfer method of the present invention includes an acquisition process, a storage process, a nozzle control process, a determination process, a movement process, and a range setting process. Accordingly, it is possible to appropriately pick up and transfer the chip parts and to shorten the tact time of the work process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1) Basic Configuration A configuration of a transfer device 1 that is an embodiment of the component transfer device of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram showing the configuration of the transfer device 1. In FIG. 1, the following description will be made with the left-right direction as the X direction, the direction from the near side to the far side as the Y direction, and the up and down direction as the Z direction.

As shown in FIG. 1, the transfer device 1 includes a pickup unit 10, a place unit 20, a transfer head 30, and a control unit 40. The pickup unit 10 and the place unit 20 are spaced apart from each other in the X direction.

The pickup unit 10 is a unit that picks up the chip 100 from the adhesive sheet 200 on which the chip 100 is held in the transfer device 1. The pickup unit 10 includes a pickup table 11, a pickup table actuator 12, a pickup hammer 13, an upper disk cam 14, a pickup motor 15, a push-up needle 16, a lower disk cam 17, a push-up motor 18 and a camera 19. .

In the pickup unit 10, one pickup position Pu for picking up the chip 100 held on the adhesive sheet 200 by the transfer head 30 is set. The pickup position Pu is intended to indicate a predetermined position in the X direction and the Y direction in the pickup unit 10.

The pickup table 11 is a member having a flat surface that can hold the adhesive sheet 200 on which the chip 100 is held. The pickup table 11 holds the peripheral edge of the pressure-sensitive adhesive sheet 200 and extends the elastic pressure-sensitive adhesive sheet 200 to separate the chips 100 held on the pressure-sensitive adhesive sheet 200 from each other by a predetermined distance.

The pickup stand actuator 12 is a unit composed of a plurality of actuators that can move the pickup stand 11 in a plane where the chip 100 is held (in other words, in the XY plane) and can rotate the pickup stand 11 in the plane. It is. The pickup stand actuator 12 moves the pickup stand 11 in accordance with a control signal supplied from the control unit 40, thereby transferring the desired chip 100 held on the adhesive sheet 200 to the pickup position Pu.

The pickup hammer 13 has a bearing-like end portion disposed above the adhesive sheet 200 at the pickup position Pu. The bearing-like end of the pickup hammer 13 is connected to the upper disc cam 14 via an arm. The upper disk cam 14 is a disk-shaped cam that can rotate according to the rotation of the pickup motor 15. The pickup motor 15 rotates according to a control signal supplied from the control unit 40 and rotates the upper disk cam 14. The pick-up hammer 13 reciprocates in the Z direction when the arm moves in accordance with the rotation of the upper disc cam 14 and the bearing-like end portion moves in the Z direction.

The push-up needle 16 has a needle-like configuration disposed below the adhesive sheet 200 at the pickup position Pu. The push-up needle 16 is connected to the lower disk cam 17 via an arm, and moves in the Z direction as the lower disk cam 17 rotates. As the push-up needle 16 moves upward in the Z direction by the rotation of the lower disc cam 17, the upper end of the push-up needle 16 contacts the adhesive sheet 200. The push-up needle 16 penetrates the adhesive sheet 200 at the upper end of the movement range, contacts the chip 100, and pushes up the chip 100. The push-up needle 16 is arranged in such a manner that the tip 100 having a needle-like upper end held at the pickup position Pu can be pushed up. The push-up motor 18 rotates the lower disk cam 17 in accordance with a control signal supplied from the control unit 40.

The camera 19 is configured and arranged so that the chip 100 whose position is adjusted to the pickup position Pu on the adhesive sheet 200 and the chip 100 held in the periphery can be accommodated in the imaging range. The image of the chip 100 captured by the camera 19 is transmitted to the control unit 40.

The place unit 20 is a part in the pickup unit 10 where the chip 100 adsorbed by the adsorption nozzle 31 is arranged on the arrangement sheet 300. The place unit 21, the place table actuator 22, the place hammer 23, the disc cam 24, the place A motor 25 and a camera 26 are provided. In the place portion, one place position Pl is set for placing the chip 100 sucked by the suction nozzle 31 held by the transfer head 30 on the placement sheet 300 (in other words, placing). .

The place position pl is intended to indicate a predetermined position in the X direction and the Y direction in the place unit 20. The place position Pl is set at a position separated from the pickup position Pu by a predetermined distance in the X direction.

The place table 21 is a member having a flat surface capable of holding the arrangement sheet 300 on which the chip 100 is arranged. The arrangement | positioning sheet | seat 300 is a member on the sheet | seat which has adhesiveness similarly to the adhesive sheet 200. FIG. The place base actuator 22 is an actuator having a movable axis that can move the place base 21 in a plane direction (in other words, the X direction and the Y direction) on which the chip 100 is disposed (in other words, placed).

In the arrangement sheet 300 held on the place table 21, a plurality of chips 100 held by the suction nozzle 31 of the transfer head 30 are arranged with a predetermined margin apart from each other. Hereinafter, the position where each chip 100 on the arrangement sheet 300 is to be arranged will be referred to as a chip arrangement position. Note that the chip placement positions are set in a matrix form including a plurality of columns and rows on the placement sheet 300.

The place hammer 23 has a bearing-like end connected to an arm, and is connected to the disc cam 24 via the arm. The disc cam 24 is configured to be rotatable in accordance with the drive of the place motor 25. As the disk cam 24 rotates, the arm moves, so that the bearing-shaped end of the place hammer 23 reciprocates in the Z direction. The place motor 25 rotates the disc cam 24 in accordance with a control signal supplied from the control unit 40.

The camera 26 is configured and arranged so that the chip 100 placed at the place position Pl on the arrangement sheet 300 and the periphery thereof can be accommodated in the imaging range. The image of the arrangement sheet 300 captured by the camera 26 is transmitted to the control unit 40.

The transfer head 30 holds a plurality of cylindrical suction nozzles 31 and moves between the pickup unit 10 and the place unit 20 under the operation of the head actuator 32 to perform the pickup operation and place operation of the chip 100. The transfer head 30 is disposed above the pickup table 11 of the pickup unit 10 and the place table 21 of the place unit 20 in the Z direction.

The suction nozzle 31 is connected to a decompression device (not shown) such as a vacuum pump via an intake passage (not shown) provided in the transfer head 30, and corresponds to a control signal supplied from the control unit 40. Then, suction of the chip 100 to be contacted and release of the suction are performed.

The head actuator 32 is a uniaxial actuator that can move the transfer head 30 in the X direction in accordance with a control signal supplied from the control unit 40. The head actuator 32 moves the transfer head 30 between the pickup unit 10 and the place unit 20 along a straight line connecting the pickup position Pu and the place position Pl as indicated by an arrow in FIG.

The transfer head 30 is provided with a spring mechanism that holds the lower end of the suction nozzle 31 at a predetermined distance from the upper end of the chip 100 in the Z direction and further biases the suction nozzle 31 upward in the Z direction so as to fix the suction nozzle 31 at the holding position. Have.

The positional relationship of each part of the transfer device 1 will be further described with reference to FIG. FIG. 2 is a diagram showing the arrangement and operation directions of the pickup table 11 of the pickup unit 10, the place table 21 of the place unit 20, and the transfer head 30 when the transfer device 1 of FIG. 1 is viewed from above in the Z direction. .

As shown in FIG. 2, the transfer head 30 has a plurality of suction nozzles 31 separated from each other by a predetermined margin on a straight line connecting the pickup position Pu of the pickup unit 10 and the place position Pl of the place unit 20. Hold in a row. Accordingly, in the pickup unit 10, when the transfer head 30 is moved in the X direction by the operation of the head actuator 32, the suction nozzles 31 held by the transfer head 30 are transferred to the pickup position Pu one by one. The On the other hand, in the place unit 20, the transfer head 30 is moved in the X direction by the operation of the head actuator 32, so that the suction nozzles 31 held by the transfer head 30 are transferred to the place position Pl one by one. Is done.

Returning to Fig. 1, the explanation will be continued. The control unit 40 is a control CPU that controls the operation of each unit of the pickup unit 10, the place unit 20, and the transfer head 30, and is electrically connected to each unit and operates by supplying a control signal. Take control.

The control unit 40 sets position coordinates for each chip 100 by analyzing an image of the chip 100 on the adhesive sheet 200 transmitted from the camera 19, for example. The control unit 40 adjusts the position of the pickup table 11 so that the chip 100 comes to the pickup position Pu by operating the pickup table actuator 12 according to the desired chip 100 position coordinates.

Further, the control unit 40 sets the position coordinates on the placement sheet 300, operates the place base actuator 22 so that the desired position is the chip placement position, and the chip placement position comes to the place position Pl. Adjust the position.

Further, the control unit 40 performs quality inspection, position information acquisition, and the like of the chip 100 arranged on the arrangement sheet 300 based on the image analysis result transmitted from the camera 26.

Referring to FIGS. 3 and 4, the operation in which the suction nozzle 31 of the transfer head 30 picks up the chip 100 on the adhesive sheet 200 by suction will be described. FIG. 3 shows the positional relationship of each part separately from state 1 to state 4. FIG. 4 shows time-series changes in the Z direction of the lower end of the pickup hammer 13 and the upper end of the push-up needle 16. It is a graph to show. The operation of each unit described below is performed under the control of the control unit 40.

In the pick-up operation of the chip 100, first, the pick-up table actuator 12 moves the pick-up table 11, and the desired chip 100 is moved to the pick-up position Pu (on the axis indicated by the dashed line). At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the desired suction nozzle 31 to the pickup position Pu (state 1). At this time, the lower end of the pickup hammer 13 and the upper end of the push-up needle 16 are in their initial positions as shown in FIG.

Subsequently, the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 downward. As the pickup hammer 13 moves, it contacts the upper end of the suction nozzle 31 and then pushes down the suction nozzle 31 against the biasing force of the spring mechanism that biases the suction nozzle 31 upward. The suction nozzle 31 pushed down contacts the chip 100 at a position where the pickup hammer 13 reaches the lower end of the moving range, and sucks the chip 100. Further, the push-up motor 18 rotates the lower disk cam 17 and moves the push-up needle 16 toward the tip 100 (state 2).

Subsequently, the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 upward to release the suction nozzle 31 from being pushed down. The suction nozzle 31 released from being pushed down moves upward in a state where the chip 100 is sucked by the biasing force of the spring mechanism. At the same time, the upper end of the push-up needle 16 penetrates the adhesive sheet 200 and pushes the chip 100 upward, and moves the lower end of the chip 100 in the direction of peeling from the adhesive sheet 200 (state 3).

The pick-up hammer 13 and the push-up needle 16 are returned to their initial positions as shown in FIG. 4, and the suction nozzle 31 having the tip 100 sucked to the lower end is also returned to the initial position in the Z direction. Thereafter, the pickup table actuator 12 moves the pickup table 11 and moves the next chip 100 to the pickup position Pu. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the next suction nozzle 31 to the pickup position Pu (state 4).

The chip 100 is sucked by the suction nozzle 31 of the transfer head 30 by the operation described above. By repeating the above-described operation a plurality of times, the chip 100 is sucked by each of the plurality of suction nozzles 31 held by the transfer head 30.

The place operation in the place unit 20 is performed in the same procedure. A specific procedure will be described below. In the place operation of the chip 100, first, the place table actuator 22 moves the place table 21, and moves the desired chip arrangement position on the arrangement sheet 300 to the place position Pl. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the chip 100 to the place position Pl. At this time, the place hammer 23 is in the initial position.

Subsequently, the place motor 25 rotates the disc cam 24 and moves the place hammer 23 downward. As the place hammer 23 moves, it contacts the upper end of the suction nozzle 31 and then pushes the suction nozzle 31 downward against the biasing force of the spring mechanism that biases the suction nozzle 31 upward. The chip 100 sucked by the sucked suction nozzle 31 comes into contact with the arrangement sheet 300 at a position where the place hammer 23 reaches the lower end of the moving range. At this time, the control unit 40 releases the suction of the suction nozzle 31 that holds the chip 100, whereby the chip 100 is placed at the chip placement position on the placement sheet 300. Since the arrangement sheet 300 has adhesiveness, the chip 100 adheres to the arrangement sheet 300 at the chip arrangement position.

Subsequently, the place motor 25 rotates the disc cam 24 and moves the place hammer 23 upward to release the suction nozzle 31 from being pushed down. The suction nozzle 31 released from being pushed down is moved upward in a state where the chip 100 is not sucked by the biasing force of the spring mechanism.

After the place hammer 23 returns to the initial position and the suction nozzle 31 that has finished the placement of the chip 100 also returns to the initial position in the Z direction, the place base actuator 22 moves the place base 21 to place the next chip at the place position Pl. Move position. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the next chip 100 to the place position Pl.

As described above, the chip 100 transferred by the transfer head 30 is arranged on the arrangement sheet 300 by the operation described above. By repeating the above-described operation a plurality of times, the chips 100 respectively adsorbed by the plurality of adsorption nozzles 31 held by the transfer head 30 are arranged on the arrangement sheet 300.

(2) Example of Operation The operation of the transfer device 1 will be described with reference to FIG. 5 which is a flowchart showing the overall operation flow including the pick-up operation and the place operation by the transfer device 1.

In the transfer device 1, at the start of a series of operations, the adhesive sheet 200 on which the chip 100 is held is placed on the pickup table 11 of the pickup unit 10 (step S1). At the same time or in succession, the arrangement sheet 300 on which the chip 100 is moved is installed on the place table 21 of the place unit 20 (step S2).

Next, the camera 19 of the pickup unit 10 captures images of all the chips 100 held on the adhesive sheet 200 and transmits the image information to the control unit 40. Based on the transmitted image information, the control unit 40 sets coordinates for each chip 100 on the adhesive sheet 200 and generates position information (step S3). The generated position information is stored in a memory in the control unit 40.

Subsequently, the control unit 40 moves the transfer head 30 to the pickup unit 10 (step S4) and executes a pickup operation (step S5). With this pickup operation, the chip 100 held on the adhesive sheet 200 is adsorbed by each of the plurality of adsorption nozzles 31 in the transfer head 30. The pickup operation will be described in detail later.

Subsequently, the control unit 40 moves the transfer head 30 to the place unit 20 (step S6) and executes a place operation (step S7). With such a place operation, the chip 100 sucked by each of the plurality of suction nozzles 31 in the transfer head 30 is placed on the placement sheet 300. The place operation will be described in detail later.

The controller 40 repeats a series of operations from step S4 to step S7 until all the chips 100 to be moved on the adhesive sheet 200 are moved to the arrangement sheet 300 (step S8: Yes), End the operation.

(2-1) Pickup Operation The pickup operation of the chip 100 by the pickup unit 10 of the transfer device 1 will be described with reference to the flowchart of FIG.

First, the control unit 40 sets the chip 100 to be picked up first as a reference chip. The camera 19 captures an image of the reference chip and transmits image information to the control unit 40. Based on the transmitted image information, the control unit 40 sets coordinates again on the reference chip and generates position information (step S101).

The control unit 40 compares the position information of all the chips 100 acquired first (FIG. 5, step S3) with the position information of the reference chips newly acquired, and the position of the reference chip is the first (that is, step S3). The amount of deviation from the position (detected in S3) is detected, and a position correction amount for correcting the deviation is calculated (step S102).

The control unit 40 applies the reference chip position information acquired anew, and updates the stored reference chip position information (step S103).

Next, the control unit 40 operates the pickup table actuator 12 based on the updated position information of the reference chip, and moves the pickup table 11 so that the reference chip is moved to the pickup position Pu (step S104).

At the same time or before and after, the control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 that does not suck the chip 100 is moved to the pickup position Pu (step S105). ).

Subsequently, the control unit 40 causes the suction nozzle 31 to suck the reference chip and picks up the chip 100 (step S106). Specifically, the control unit 40 drives the pickup motor 15 to cause the pickup hammer 13 to push down the suction nozzle 31. At the same time, the control unit 40 drives the push-up motor 18 to push the tip 100 up by the push-up needle 16. The chip 100 is adsorbed by contact with the suction nozzle 31 pushed down by the pickup hammer 13, and further, the suction nozzle 31 moves upward and is pushed up by the push-up needle 16, so that the chip 100 is peeled off from the adhesive sheet 200 and picked up. Is done.

Next, when there is a chip 100 that can be picked up (step S107: Yes) and there is a suction nozzle 31 that can suck the chip 100 without suction (step S108: Yes), the next chip 100 is picked up. Is done.

The control unit 40 reads the position information stored for the next chip 100, compares the coordinates of the chip 100 with the coordinates of the reference chip before update (that is, the coordinates detected in step S3), and the chip It is determined whether the position 100 is within the correction amount application area.

The correction amount application area is intended to indicate a predetermined range starting from the position coordinates of the reference chip. Within such a correction amount application area, for each chip 100, between the detection of the first chip 100 position (ie, step S3 in FIG. 5) and the re-detection of the position of the reference chip (ie, step S101 in FIG. 6). It can be considered that the positional deviations generated in the same are the same. The displacement of the position of the chip 100 is a major factor due to the expansion and contraction of the stretched adhesive sheet 200, and it is considered that the displacement of the position is the same if the chip 100 is within a certain range.

Fig. 7 (a) shows the positional relationship between the reference chip and the correction amount application area. If the chip 100B to be picked up is present in the correction amount application area after the reference chip A has been picked up, the positional deviation of the chip 100B is considered to be the same as the positional deviation of the reference chip A. It is done. For this reason, it is considered that the position information after the shift of the chip 100B can be calculated by applying the correction amount of the reference chip A without detecting the coordinates again for the chip 100B and acquiring the position information.

Note that the predetermined range centering on the reference chip that defines the correction amount application area may be changed as appropriate. For example, the predetermined range is appropriately determined according to the stretchability of the pressure-sensitive adhesive sheet 200 that causes the positional deviation of the chip 100. It may be changed.

When the position of the next chip 100 is within the correction amount application area with the reference chip as a reference (step S109: Yes), the control unit 40 uses the position correction amount of the reference chip to calculate the position information of the chip 100. Correction is performed (step S110). Specifically, the corrected position information is obtained by applying the reference chip position correction amount to the stored position information of the chip 100.

Based on the corrected position information of the next chip 100, the control unit 40 operates the pickup table actuator 12 to move the pickup table 11 so that the chip 100 is moved to the pickup position Pu (step S111). . Subsequently, the next suction nozzle 31 that does not suck the chip 100 is moved to the pickup position Pu (step S105), and the next chip 100 is picked up.

On the other hand, when the position of the next chip 100 is outside the correction amount application area based on the reference chip (step S109: No), the control unit 40 sets the chip 100 as a new reference chip. Then, for the new reference chip, the control unit 40 acquires position information by capturing an image (step S101), calculates a position correction amount (step S102), and updates the position information (step S103). Execute pickup operation.

Specifically, the case of picking up the chip 100C is illustrated in FIG. Since the chip 100C exists outside the correction amount application area with the reference chip A as a reference, the positional deviation of the chip 100C cannot be considered to be the same as the positional deviation of the reference chip A. Therefore, for the chip 100C, it is required to detect the coordinates again and acquire the position information. Therefore, as illustrated in FIG. 7B, the control unit 40 sets the chip 100C as a new reference chip and updates the position information. It can be considered that the positional deviation of the chip 100 existing in the correction amount application area based on the newly set reference chip C is the same as the positional deviation of the reference chip C.

The control unit 40 performs the series of operations from step S105 to step S111 until there is no chip 100 that can be picked up (step S107: No), or there is an adsorbing suction nozzle 31 that does not adsorb the chip 100. The process is repeatedly executed until no more (step S108: No). When there is no chip 100 that can be picked up (step S107: No), or when there is no suckable suction nozzle 31 that does not suck the chip 100 (step S108: No), the control unit 40 performs the pick-up operation. End.

As described above, according to the configuration described above, it is possible to perform the suction operation of the chips 100 continuously held on the adhesive sheet 200 with respect to the plurality of suction nozzles 31 held by the transfer head 30. Therefore, the plurality of chips 100 can be collectively transferred to the place unit 20 by one movement of the transfer head 30. For this reason, the tact time can be greatly shortened as compared with the conventional apparatus in which the transfer is performed one by one.

In the transfer device 1, a pickup position Pu which is a position where the chip 100 is taken out is determined, and the suction nozzle 31 and the chip 100 are transferred to the pickup position pu one by one in order. For this reason, positioning can be performed in a relatively short time, and the tact time can be shortened. Note that the tact time can be further shortened by transferring the chip 100 and the suction nozzle 31 in parallel. Further, the chips 100 can be sorted by appropriately selecting the chip 100 to be adsorbed according to the state and shape of the chip 100.

(2-2) Place Operation The place operation of the chip 100 by the place unit 20 of the transfer apparatus 1 will be described with reference to the flowchart of FIG.

The control unit 40 operates the place table actuator 22 based on coordinates set in advance on the place table 21 so that the desired chip arrangement position on the arrangement sheet 300 is moved to the place position Pl. Is moved (step S201).

At the same time or before and after, the control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 sucking the chip 100 is moved to the place position Pl (step S202). ).

Subsequently, the control unit 40 releases the suction so that the chip 100 sucked by the suction nozzle 31 is placed at the chip placement position on the placement sheet 300 (step S203). Specifically, the control unit 40 drives the motor 205 to cause the place hammer 23 to push down the suction nozzle 31. After the chip 100 adsorbed by the pressed suction nozzle 31 comes into contact with the placement sheet 300, the control unit 40 releases the suction of the suction nozzle 31 and places the chip 100 on the placement sheet 300.

Until the next placeable chip 100 does not exist (step S204: No), the control unit 40 repeats a series of operations from step S201 to step S203.

After all the chips 100 to be sucked by the suction nozzle 31 are placed on the placement sheet 300 (step S204: Yes), the control unit 40 takes an image of the chip 100 placed by the camera 26 and inputs image information. Receive. Based on the input image information, whether or not the chip 100 is arranged is inspected with respect to the arrangement accuracy of the chip 100 and the appearance of the chip 100 (step S208). After the chip 100 inspection, the control unit 40 ends the place operation.

The relationship between the chip placement position on the placement sheet 300 and the inspection of the placed chip 100 will be described. FIG. 9A is a diagram illustrating a chip arrangement position on the arrangement sheet 300 and an imaging area that is an area captured by the camera 26 by one imaging.

As shown in FIG. 9 (a), the chip arrangement positions are arranged in a matrix at a predetermined distance in the XY directions. The imaging area of the camera 26 is a rectangular range including a plurality of chip arrangement positions, for example. In the example shown in FIG. 9A, the image pickup area of the camera 26 contains four chips 100 in the X direction and three in the Y direction, for a total of twelve chips 100.

Here, consider a case where the transfer head 30 holds twelve suction nozzles 31. In the transfer apparatus 1 including the transfer head 30, twelve chips 100 can be arranged on the arrangement sheet 300 by one pick-up operation and place operation.

Further, when the chips 100 are arranged as indicated by the arrows in FIG. 9B, six chips 100 are arranged in the X direction and two chips 100 are arranged in the Y direction. At this time, since the next chip arrangement position is adjacent to the previous chip arrangement position (in other words, because it is the shortest distance), the arrangement from the arrangement of one chip 100 to the arrangement of the next chip 100 is performed. The amount of movement of the sheet 300 (in other words, the amount of movement of the place table 21) is the smallest. For this reason, the time required for the movement of the arrangement sheet 300 is minimized, which is beneficial for shortening the tact time.

However, when the chip 100 is arranged as shown by the arrow in FIG. 9B, the twelve chips 100 that are arranged do not fit within the imaging area of the camera 26. For this reason, for the inspection of the chip 100, the camera 26 is required to move the arrangement sheet 300 and capture images in the imaging area 1 and the imaging area 2 as shown in FIG. 9B. When a plurality of images are acquired in this way, the tact time is extended and the amount of processing for moving the arrangement sheet 300 is increased, which is not preferable in terms of apparatus operation.

Therefore, as shown in FIG. 9C, the control unit 40 determines the arrangement method of the chips 100 so that all the chips 100 are accommodated in the imaging area. Specifically, as indicated by the arrows in FIG. 9C, all the twelve chips 100 are accommodated in the imaging area of the camera 26 in which four chips 100 in the X direction and three chips 100 are accommodated in the Y direction. The positions at which the chips 100 are arranged are determined in the zigzag order (in other words, to draw a rectangular wave).

More specifically, the chip 100 is arranged in the following manner. First, the arrangement of the chip 100 is started from one corner of the rectangular imaging area, and the chip 100 is arranged at a position separated by a predetermined distance along one side of the imaging area. After the chip 100 is arranged at the other corner of the imaging area, the chip 100 is arranged at a position separated by a predetermined distance along the side orthogonal to the above-described side. Subsequently, the chip 100 is arranged at a position parallel to the first side and separated by a predetermined distance in the opposite direction. When the chip arrangement position hits the side of the imaging area, the chip 100 is arranged at a position separated by a predetermined distance along the side. Subsequently, the chip 100 is arranged at a position separated by a predetermined distance in a direction parallel to the first side. By repeating the above, the chip 100 is arranged.

Even if the chip 100 is arranged as shown by the arrow in FIG. 9C, the time required for the movement of the arrangement sheet 300 is reduced as described above, which is beneficial for shortening the tact time. In addition, since all twelve chips 100 can be inspected with one image when inspecting the chip 100 after all the chips 100 are arranged, the tact time for capturing an image is shortened.

In some cases, it may not be possible to fit all the chips 100 arranged in one place operation within one imaging area.

For example, in the example of FIG. 10A, four chips in the X direction and three in the Y direction fit in a single imaging area, a total of 12 chips 100, while the transfer head 30 has 15 suction nozzles. A case where 15 chips 100 can be arranged in a single place operation is described. At this time, the control unit 40 determines the position at which the chips 100 are arranged in the zigzag manner described above so that all the chips 100 fit in the smallest possible imaging area.

In the above example, the place operation starts in the Y direction (in other words, the column direction), is arranged in a zigzag manner, and the imaging area is moved in the X direction (in other words, the row direction). Explains. Not limited to this, as shown in FIG. 10B, the place operation is started in the X direction (row direction), the chips 100 are arranged in a zigzag manner, and the imaging area is set in the Y direction (column direction). It may be a mode of moving.

Thus, by determining the position where the chip 100 is arranged, it is possible to reduce the tact time required to capture an image for the inspection of the chip 100. If the above-described configuration can reduce the number of images to be captured to some extent, the above-described effects can be enjoyed.

(3) Modification A configuration of a transfer apparatus 1 ′, which is a modification of the transfer apparatus 1, will be described with reference to FIGS.

11 to 14 are schematic views showing the configuration of the transfer device 1 ′. FIG. 11 is a view of the transfer device 1 ′ as viewed from the Y direction. FIG. 12 shows the transfer device 1 ′ as viewed from above in the Z direction. FIG. 13 is a view of the pickup unit 10 ′ in the transfer device 1 ′ as viewed from the X direction, and FIG. 14 is a view of the place portion 20 ′ in the transfer device 1 ′ as viewed from the X direction.

As shown in FIG. 11, the transfer device 1 ′ includes a pickup unit 10 ′, a place unit 20 ′, and a control unit 40 ′, and a transfer head having the same configuration as the transfer head 30 included in the transfer device 1. 30a and a transfer head 30b. The transfer head 30 a holds a plurality of suction nozzles 31 a having the same configuration as the suction nozzle 31, and the transfer head 30 b holds a plurality of suction nozzles 31 b having the same configuration as the suction nozzle 31. The transfer head 30a can be moved in the X direction by a head actuator 32a having the same configuration as the head actuator 32, and the transfer head 30b can be moved in the X direction by a head actuator 32b having the same configuration as the head actuator 32. Can be moved to. As described above, the transfer device 1 ′ includes two sets of the transfer head 30, the suction nozzle 31, and the head actuator 32.

As shown in FIG. 12, the transfer head 30a and the transfer head 30b are arranged at positions separated by a predetermined distance in the Y direction.

In the pickup unit 10 ′ of the transfer device 1 ′, the first pickup position Pua for the transfer head 30 a to suck the chip 100 and the second pickup position for the transfer head 30 b to suck the chip 100. Two kinds of pickup positions Pu with Pub are set. Similarly, in the place unit 20 ′ of the transfer apparatus 1 ′, the first place position Pla for the transfer head 30 a to place the chip 100 and the second place for the transfer head 30 b to place the chip 100 are used. Two place positions Pl with the other place positions Plb are set.

The transfer head 30a holds the plurality of suction nozzles 31a in a line on the straight line connecting the pickup position Pua of the pickup unit 10 'and the place position Pla of the place unit 20', with a predetermined margin therebetween. Further, the head actuator 32a included in the transfer head 30a includes the pickup unit 10 ′ and the place unit 20 as shown by the arrows in FIG. 12 along the straight line connecting the transfer head 30a to the pickup position Pua and the place position Pla. Move between '.

The transfer head 30b holds the plurality of suction nozzles 31b in a line on the straight line connecting the pickup position Pub of the pickup section 10 'and the place position Plb of the place section 20' with a predetermined margin. Further, the head actuator 32b included in the transfer head 30b includes the pickup unit 10 ′ and the place unit 20 as shown by the arrows in FIG. 12 along the straight line connecting the transfer head 30b to the pickup position Pub and the place position Plb. Move between '.

The operation of the transfer head 30a and the transfer head 30b is controlled by the control unit 40 ′ so that one of them performs the pickup operation in the pickup unit 10 ′ while the other performs the place operation in the place unit 20 ′. .

The pickup position Pua and the pickup position Pub of the pickup unit 10 ′ are set apart from each other by a predetermined distance in the Y direction, and the place position Pla and the place position Plb of the place unit 20 ′ are separated by the same distance in the Y direction. Is set. For this reason, the movement axis of the transfer head 30a and the movement axis of the transfer head 30b are parallel to each other.

The configuration of each part of the transfer device 1 ′ will be further described with reference to FIGS. 13 and 14. As shown in FIG. 13, the pickup unit 10 ′ of the transfer apparatus 1 ′ holds the pickup hammer 13 a for pressing the suction nozzle 31 a held by the transfer head 30 a at the pickup position Pua, and the transfer head 30 b. Two pickup hammers including a pickup hammer 13b for pressing the suction nozzle 31b at the pickup position Pub are provided. The pick-up hammer 13a and the pick-up hammer 13b are connected to the upper disk cam 14 through the same arm so as to press the suction nozzle 31b at the corresponding pick-up position. For this reason, when the upper disk cam 14 rotates according to the operation of the pickup motor 15, the pickup hammer 13a and the pickup hammer 13b are simultaneously moved in the Z direction. According to the pick-up hammer 13a and the pick-up hammer 13b, the suction nozzle 31 held by either the transfer head 30a or the transfer head 30b during the pickup operation in the pickup unit 10 'is pressed.

As shown in FIG. 13, the pickup unit 10 ′ of the transfer device 1 ′ includes a push-up needle 16, a disc cam 17 and a push-up motor 18 for pushing up the chip 100 (hereinafter referred to as a push-up needle unit). And a push-up needle actuator 50 that is movable in the Y direction. The push-up needle actuator 50 is an actuator that reciprocates the push-up needle 16 of the push-up needle unit between the pickup position Pua and the pickup position Pub under the control of the control unit 40 ′.
During the pick-up operation at the pick-up position Pua, the control unit 40 ′ causes the push-up needle actuator 50 to move the push-up needle unit to a position corresponding to the pick-up position Pua so that the push-up needle 16 pushes up the chip 100. On the other hand, during the pickup operation at the pickup position Pub, the push-up needle actuator 50 moves the push-up needle unit to a position corresponding to the pickup position Pub, and the push-up needle 16 performs the push-up operation of the chip 100.

As shown in FIG. 14, the place unit 20 ′ of the transfer device 1 ′ holds the place hammer 23 a for pressing the suction nozzle 31 a held by the transfer head 30 a at the place position Pla, and the transfer head 30 b. Two place hammers including a place hammer 23b for pressing the suction nozzle 31b at the place position Plb are provided. The place hammer 23a and the place hammer 23b are connected to the disc cam 24 through the same arm so as to press the suction nozzle 31b at the corresponding place position. For this reason, when the disc cam 24 rotates according to the operation of the upper motor 25, the place hammer 23a and the place hammer 23b simultaneously move in the Z direction. According to the place hammer 23a and the place hammer 23b, the suction nozzle 31 held by either the transfer head 30a or the transfer head 30b during the place operation in the place portion 10 'is pressed.

A series of transfer processes using the transfer apparatus 1 ′ will be described with reference to the flowchart of FIG. 15. First, the adhesive sheet 200 that holds the chip 100 is placed on the pickup table 11 of the pickup unit 10 '(step S1). At the same time or in succession, the arrangement sheet 300 on which the chip 100 is moved is placed on the place table 21 of the place unit 20 '(step S2). Next, the camera 19 of the pickup unit 10 ′ captures images of all the chips 100 disposed on the adhesive sheet 200 and transmits image information to the control unit 40. Based on the transmitted image information, the control unit 40 sets coordinates for each chip 100 on the adhesive sheet 200 and generates position information (step S3). The generated position information is stored in a memory in the control unit 40.

Subsequently, the control unit 40 moves the transfer head 30a to the pickup unit 10 '(step S4a) and executes a pickup operation (step S5a). At the same time, the control unit 40 moves the transfer head 30b to the place unit 20 '(step S4b) and executes a place operation (step S5b). Note that the first place operation at the start of the operation is not executed because the chip 100 is not held by the suction nozzle 31b of the transfer head 30b.

Subsequently, the control unit 40 moves the transfer head 30a to the place unit 20 '(step S6a) and executes a place operation (step S7a). At the same time, the control unit 40 moves the transfer head 30b to the pickup unit 10 '(step S6b), and executes a pickup operation (step S7b).

According to the operation of the transfer device 1 ′, the transfer head 30 b can perform the place operation at the place portion 20 ′ while the transfer head 30 a is performing the pickup operation at the pickup portion 10 ′. At this time, the operation of the transfer head 30a does not affect the operation of the transfer head 30b and the operation of the transfer head 30b depends on the positional relationship and the movement path of the transfer head 30a and the transfer head 30b. It does not affect the operation of 30a.

Therefore, the transfer head 30a and the transfer head 30b can be operated in parallel, and in addition to the effect of the operation of the transfer apparatus 1, the tact time can be further shortened.

The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification, and parts transfer accompanied by such changes Devices and methods are also within the scope of the present invention.

1 Transfer device,
10 pickup section,
11 Pickup stand
12 Pickup base actuator,
13 Pickup hammer,
14 Disc cam,
15 Pickup motor,
16 Push-up needle,
17 Disc cam,
18 Push-up motor,
19 Camera (pickup part),
20 place club,
21 Place table,
22 Place base actuator,
23 Place hammer,
24 disc cam,
25 Place motor,
26 Camera (place part),
30 transfer head,
31 Suction nozzle,
32 head actuator,
40 control unit,
100 chips,
200 adhesive sheet,
300 Placement sheet.

Claims

A component transfer device that takes out a plurality of wafer-like chips held in a holding unit and transfers them to a transfer destination,
A holding unit for holding the chip;
Obtaining means for obtaining position information of the chip held by the holding unit;
Storage means for storing the position information;
A suction nozzle for sucking the chip at a predetermined pickup position;
Determining means for determining a moving amount for moving the chip to the pickup position based on the position information;
Moving means for moving the chip to the pickup position by moving the holding unit based on the amount of movement;
A range setting means for setting a predetermined range based on the chip on the holding unit;
The acquisition unit acquires the position information of the first chip before acquiring the first chip of the plurality of chips by the suction nozzle after acquiring the position information of the chip on the holding unit. Update by getting again,
The determining means determines (i) a moving amount for moving the first chip to the pickup position based on the updated position information of the first chip, and (ii) on the holding unit. Position information before and after updating the first chip with respect to position information of chips other than the first chip held within the predetermined range with the first chip as a reference And determining a moving amount for moving a chip other than the first chip held in the predetermined range to the pickup position based on correction position information that has been corrected based on apparatus.
A plurality of suction nozzles, and a transfer means that moves between the holding unit and the transfer destination of the chip;
2. The apparatus according to claim 1, further comprising nozzle moving means for moving the plurality of suction nozzles held by the transfer means to the pickup position one by one by moving the transfer means. The parts transfer device described in 1.
A biasing means for biasing the plurality of suction nozzles held by the transfer means so as to be separated from the chip held by the holding unit;
3. The nozzle control unit according to claim 2, further comprising: a nozzle control unit that presses the suction nozzle against the biasing force of the biasing unit at the pickup position and sucks the suction nozzle by contacting the suction nozzle. Parts transfer device.
The component transfer according to claim 3, wherein the nozzle control unit presses one of the plurality of suction nozzles at an end provided at a tip of an arm member that is moved by driving of a rotating cam. apparatus.
The component transfer apparatus according to claim 3 or 4, wherein the nozzle control means includes a bearing-shaped end portion that presses one of the plurality of suction nozzles.
The apparatus further comprises pressing means for pressing one of the plurality of chips held by the holding unit to be sucked by one of the plurality of suction nozzles at the pickup position in the direction of the suction nozzle. The component transfer apparatus according to claim 1.
A component transfer method in a component transfer apparatus that takes out a plurality of wafer-like chips held in a holding unit and transfers them to a transfer destination,
An acquisition step of acquiring positional information of the chip held in the holding unit;
A storing step for storing the position information;
A nozzle control step for adsorbing the chip to an adsorption nozzle at a predetermined pickup position;
A determination step for determining a movement amount for moving the chip to the pickup position based on the position information;
A moving step of moving the chip to the pickup position based on the moving amount;
A range setting step for setting a predetermined range on the basis of the chip on the holding unit;
In the acquisition step, after acquiring the position information of the chip on the holding unit, before the first chip of the plurality of chips is sucked by the suction nozzle, the position information of the first chip Update by getting again,
The determining step determines (i) a movement amount for moving the first chip to the pickup position based on the updated position information of the first chip, and (ii) on the holding unit. Position information before and after updating the first chip with respect to position information of chips other than the first chip held within the predetermined range with the first chip as a reference And determining a moving amount for moving a chip other than the first chip held in the predetermined range to the pickup position based on correction position information that has been corrected based on Method.