WO2013108367A1 - Electronic component mounting device and electronic component mounting method - Google Patents

Electronic component mounting device and electronic component mounting method Download PDF

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Publication number
WO2013108367A1
WO2013108367A1 PCT/JP2012/050848 JP2012050848W WO2013108367A1 WO 2013108367 A1 WO2013108367 A1 WO 2013108367A1 JP 2012050848 W JP2012050848 W JP 2012050848W WO 2013108367 A1 WO2013108367 A1 WO 2013108367A1
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WO
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Patent type
Prior art keywords
electronic component
mounting
information
rank
substrate
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PCT/JP2012/050848
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French (fr)
Japanese (ja)
Inventor
望月 学
義昭 坂田
寿治 清水
長谷川 弘和
貢司 渡部
誠寿郎 須永
一成 荘
浩之 小坂
昭一 藤森
浩義 廣田
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パイオニア株式会社
株式会社パイオニアFa
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Abstract

Provided is an electronic component mounting device which efficiently uses manufactured wafer-shape electronic components and which suppresses variation while maintaining the consistent quality required in the final product. This electronic component mounting device (1) is provided with: an electronic component holding table (11) which holds a wafer sheet (200) on which multiple electronic components (100) of different ranks are arranged in a wafer shape; an electronic component information storage unit (41) which stores electronic component information comprising position information about the electronic components (100) on the wafer sheet (200) on the electronic component holding table (11) and rank information about said electronic components (100); a transfer head (30) which extracts one or more electronic components (100) from the wafer sheet (200) at a time and transfers the same to a mounting unit (300); a mounting board information storage unit (42) which stores mounting board information including the necessary number and mounting position of the electronic components (100) on the mounting board (300); a mounting board ratio determination unit which calculates the electronic component rank ratio of each rank in the electronic components (100) on the wafer sheet (200) on the basis of the electronic component information, and determines the mounting ratio of each rank in the mounting board (300) on the basis of the electronic component rank ratio and mounting board information; and a control unit which, on the basis of the mounting ratio and the electronic component information, controls the transfer head (30) so as to mount the electronic components (100) to prescribed positions on the mounting board (300) in a state in which the ranks are mixed.

Description

Electronic component mounting apparatus and an electronic component mounting method

The present invention picks up an electronic component such as a chip, an electronic component mounting apparatus and an electronic component mounting method for transporting implement.
BACKGROUND

Recently, as the electronic component transfer device is divided by dicing, picking up the electronic components arranged into wafers, apparatus arranged to transfer destination is known for each rank. In the electronic component transfer apparatus of this type, by the suction nozzle connected to a vacuum pump, thereby adsorbing the electronic component from above, by the operation of pushing up from below, to pick up electronic parts one by one, transported. In this case the electronic component transfer device, only those of the same rank, arranged in a certain space, had to be easy use in the implementation of the substrate in a later step.

Electronic components arranged in wafer form, because it is composed of numerous electronic components, the electronic component transfer device that performs transfer of electronic components, it can be transported in a short time a large number of electronic components is determined. Therefore, in order to shorten the tact time of the transfer process, it has been made more electronic components invention as transportable Patent Document 1 at the same time.

Patent Document 1, a plurality of suction nozzles arranged in a row, collectively for each column adsorbs semiconductor products (electronic parts), discloses a configuration for transferring to the transfer destination. In this configuration, upon adsorption of semiconductor products, by pushing up in the push-up pin semiconductor products suitable rank from below, it is performed and ranking of semiconductor products to assist the pickup of the pickup.

Also in Patent Document 2, when die bonding the wafer-shaped chips (electronic components), and only the chips belonging to the same rank from the position data and the chip characteristic data described configuration for die bonding.

Patent Registration No. 3712695 JP-A-4-262543

In recent years, has improved precision of the test for electronic components, set of rank has become the details. Also, there are a plurality of ranks by the rank acceptable for use from the highest rank, some products also do not necessarily require only the highest rank products. The one product, since the plurality of electronic components is required with respect to the substrate, by using as much as possible without waste produced electronic components in the previous step, and efficient utilization of limited resources, lowering the cost There has been requested.

However, the conventional electronic component transfer device as described above, the die bonding in the mounting process of the post-process is likely way to transfer the same rank, and a configuration in which sequence. Further, the chip wafer-shaped, although the configuration in which direct die bonding from the wafer was only chips belonging to the same rank configured to die bonding.

That is, in the prior art, or the sequence for each rank, the same rank electronic component of one product, While it is possible to bond to the substrate, one product, a mix of several ranks to the substrate it has not been possible to produce Te.

In the conventional art, a constant quality from the electronic components of a plurality of ranks that are arranged into wafers, and to make less variation product, could only make a product using the same quality electronic components It was. In this case, the quality is lesser unable to specification of the degree of quality electronic components acceptable, it was inefficient.

The present invention has been made in view of the above problems, an example of the object, using efficient wafer-shaped electronic component produced, while maintaining a constant quality required in the final product, to suppress variation to provide an electronic component mounting apparatus and an electronic component mounting method capable.

In order to solve the above problems, an electronic component mounting apparatus of the present invention, an electronic component holding table in which a plurality of electronic components of different ranks holds a wafer sheet which is arranged in a wafer form, the in the electronic component holding table and the electronic component information storage unit which stores electronic component information composed of the positional information and the rank information of the electronic components of the electronic components on the wafer seat, taken out one or a plurality at a time the electronic component from the wafer sheet, transfer to the substrate and the electronic component transfer mounting portion for mounting a mounting board information storage unit for storing mounting board information consisting of mounting positions and the number required in the substrate, each of said electronic components on said wafer sheet on the basis of the electronic components with obtaining the electronic component rank ratio rank, based on the mounting board information and the electronic component rank ratio, the group A mounting substrate ratio determining section that determines a mounting ratio of each rank in, the electronic component on the basis of the electronic component information and the implementation ratio, to a predetermined position in the substrate, mounted in a state where a plurality of ranks are mixed and a control unit for controlling the electronic component transfer mounting portion so as to.

To further achieve the above object, an electronic component mounting method of the present invention, a wafer sheet holding step of holding the wafer sheet in which a plurality of electronic components having different ranks are arranged into wafers to the electronic component holding table,
An electronic component information storage step of storing the electronic component information composed of the positional information and the rank information of the electronic components of the electronic components on the wafer sheet in the electronic component holding table in the electronic component information storage unit,
A mounting board information storage step of storing the mounting board information consisting of mounting positions and the number required in the substrate to a mounting board information storage unit,
With obtaining the electronic component ranks the ratio of each rank in said electronic components on said wafer sheet on the basis of the electronic component information, on the basis of the electronic component ranks the ratio between the mounting board information, the implementation ratio of each rank in said substrate a mounting substrate ratio determining step of determining,
The electronic component on the on the basis of the implementation rate as the electronic component information wafer sheet, 1 or extraction plurality increments, to a predetermined position in the substrate, control to transfer implemented in a state in which a plurality of ranks are mixed and a control step of.

Is a block diagram showing the configuration of an electronic component mounting apparatus and an electronic component mounting method of this embodiment. It is a diagram showing the positional relationship between the operation direction of each part of the electronic component mounting apparatus. Is a diagram showing an aspect of a pickup of the electronic component by an electronic component mounting apparatus. Is a flowchart showing a flow of operation of the electronic component mounting apparatus and an electronic component mounting method of this embodiment. It is a flowchart showing a flow of generation and transmission of the control signal in the control unit. It is a flowchart showing a flow of the pickup operation of the present embodiment. It is a flowchart showing a flow of mounting operation of the present embodiment. A light emitting diode element on a wafer sheet, which is an example of a shows the light emitting diode module mounted on the board. A light emitting diode element on a wafer sheet, which is an example of a shows the light emitting diode module mounted on the board. DESCRIPTION OF THE INVENTION

Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 is a block diagram showing the configuration of an electronic component mounting apparatus and an electronic component mounting method of this embodiment.

The electronic component mounting apparatus 1 constituted as an embodiment of an electronic component mounting apparatus of the present invention will be described with reference to FIG. In this Figure 1 of the pickup unit 10 and the mounting portion 20, the lateral direction X-direction, the near side direction Y direction toward the back side from the vertical direction to the Z direction, as the angle in the XY plane theta, the following description do.

As shown in FIG. 1, the electronic component mounting apparatus 1 includes a pickup unit 10, the mounting portion 20, the transfer head 30 is an electronic component transfer mounting unit, the control unit 40, the electronic component information storage unit 41, stores the mounting board information part 42 is configured to include a mounting substrate ratio determining section 43 and the area determination unit 44. The pickup portion 10 and the mounting portion 20, are spaced apart from each other in the X direction. In the present invention, the electronic component transfer mounting portion is composed of a head actuator for actuating the transfer head and this with a suction nozzle.

Pickup unit 10 is an electronic component mounting apparatus 1, a unit for pickup of the electronic component 100 from the wafer sheet 200 on which an electronic component 100 is disposed. The pickup unit 10 includes an electronic component holding table 11, the electronic component holding table actuator 12, the pickup hammer 13, the upper disk cam 14, the pickup motor 15, the push-up needle 16, the lower disc cam 17, push-up motor 18 and a camera 19 composed of Te.

In the pickup unit 10 includes a pickup position Pu for picking up the electronic component 100 disposed on the wafer sheet 200 by the transfer head 30 is set one place. Pickup position Pu indicates the predetermined position in the X direction and Y direction in the pickup unit 10.

Electronic component holding table 11 is a member having a flat surface capable of holding the wafer sheet 200 on which an electronic component 100 is disposed. Electronic component holding table 11 holds the peripheral portion of the wafer sheet 200, by extending the pressure-sensitive adhesive sheet with stretchability, to each other a predetermined distance separating the electronic part 100 disposed on the wafer seat 200.

Electronic component holding table actuator 12, (in other words, XY plane) electronic component holding table 11 in a plane electronic components 100 are arranged rotated is moved in, the electronic component holding table 11 in the θ direction within the plane an actuator for. Electronic component holding table actuator 12, in response to a control signal supplied from the control unit 40, by moving the electronic component holding table 11, the desired electronic component 100 disposed on the wafer seat 200 to the pickup position Pu set to.

Pickup hammer 13, in the pick-up position Pu, a structure having a bearing-shaped end portion that is disposed above the wafer sheet 200. Bearing shaped end of the pickup hammer 13 is connected to the upper disc cam 14 via the arm.

Upper disc cam 14 is rotatable disk-shaped cam according to the rotation of the pick-up motor 15. Pickup motor 15 rotates in response to a control signal supplied from the control unit 40 rotates the upper disk cam 14. Pickup hammer 13, by the arm in response to rotation of the upper disc cam 14 moves the end portion of the shaped bearing reciprocates in the Z direction.

Push-up needle 16, at the pickup position Pu, which is needle-like structure which is disposed below the wafer sheet 200. Push-up needle 16 is connected to the lower disc cam 17 through the arm, with the rotation of the lower disc cam 17, moves in the Z direction.

Push-up needle 16, as it moves in the Z direction upward by rotation of the lower disc cam 17, the upper end of the push-up needle 16 comes into contact with the wafer sheet 200. Push-up needle 16, at the upper end of the moving range, through the wafer sheet 200 contacts with the electronic component 100, pushing up the electronic component 100.

Push-up needle 16, needle-like upper end is disposed in a possible embodiment push up the electronic components 100 disposed at the pickup position Pu. Push-up motor 18 in response to a control signal supplied from the control unit 40 to rotate the lower disc cam 17.

The camera 19 is configured to be housed the electronic component 100 disposed on the electronic component 100 and the periphery thereof is disposed positioning the pickup position Pu on the wafer seat 200 to the imaging range, are arranged. Image of the electronic component 100 is imaged in the camera 19 is transmitted to the control unit 40.

The mounting portion 20, the pickup unit 10, a unit for mounting the electronic component 100 to mounting board 300 adsorbed by the suction nozzle 31, the mounting substrate holder 21, a mounting substrate holder actuator 22, mounted hammer 23, the circle plate cam 24, and includes a mounting motor 25 and the camera 26.

In the mounting portion 20, the mounting position Pl for mounting on the mounting substrate 300 electronic component 100 is sucked by the suction nozzle 31 is set one place.

Mounting position Pl indicates the predetermined position in the X and Y directions in the mounting portion 20. Incidentally, the mounting position Pl is set to a predetermined distance spaced positions in the X-direction from the pick-up position Pu.

Mounting the substrate holder 21 is a member having a flat surface capable of holding the mounting board 300 on which an electronic component 100 is mounted. Mounting substrate 300 is a substrate of a ceramic substrate, a glass substrate, such as a printed board.

Mounting the substrate holder actuator 22, (in other words, X direction, Y direction and θ direction) plane direction of the mounting substrate holder 21 is an electronic component 100 is mounted is an actuator having a movable shaft is movable.

The mounting substrate 300 is held on the mounting substrate holder 21, a plurality of electronic components 100 to be attracted by the suction nozzle 31 of the transfer head 30 are respectively mounted spaced apart a predetermined margin. Hereinafter, the position where each of the electronic components 100 on the mounting substrate 300 is mounted, will be referred to as the electronic component mounting position. The electronic component mounting position, for example, are set in a matrix consisting of a plurality of columns and rows on the mounting substrate 300.

Implementation hammer 23, the end of the shaped bearing is connected to the arm, is connected to the disc cam 24 via the arm. Disc cam 24 is rotatably constructed in accordance with the driving of the mounting motor 25.

By arm moves along with the rotation of the disc cam 24, a bearing-shaped end portion of the mounting hammer 23 reciprocates in the Z direction. Implementation motor 25 in response to a control signal supplied from the control unit 40 rotates the disk cam 24.

Camera 26, an electronic component 100 and the peripheral is mounted on the mounting position Pl on the mounting board 300 is configured to be included in the imaging range, it is arranged. Image of the mounting substrate 300 which is captured by the camera 26 is transmitted to the control unit 40.

Transfer head 30, a cylindrical suction nozzle 31 and a plurality held, under the action of the head actuator 32 to move between the pick-up portion 10 and the mounting portion 20, performs a pick-up operation and mounting operation of the electronic component 100 . Transfer head 30, the mounting substrate table 21 of the electronic part holding table 11 and the mounting portion 20 of the pickup portion 10 is disposed in the Z direction upward.

Suction nozzle 31 through an intake passage provided in the transfer head 30 (not shown) is connected to a vacuum device such as a vacuum pump (not shown), a control signal supplied from the control unit 40 depending on, to release the suction and adsorption of the electronic component 100 abuts.

Head actuator 32, in response to a control signal supplied from the control unit 40, a uniaxial actuator movable transfer head 30 in the X direction. Head actuator 32, along the transfer head 30 to the line connecting the pick-up position Pu and the mounting position Pl, moves between the pick-up unit 10 and the mounting portion 20 as indicated by the arrows in FIG.

Transfer head 30, a spring lower end of the suction nozzle 31 holds to a predetermined distance apart in the Z direction from the upper end of the electronic component 100, further biases the Z direction upward to stably fix in the holding position the suction nozzle 31 It has a mechanism.

Mounting the substrate holder actuator 22, the electronic component holding table actuator 12 sends a control signal to the head actuator 32, the control unit 40 for controlling each is connected to the electronic component information storage unit 41 and the mounting board information storage unit 42 .

Electronic component information storage unit 41, from the previous step or probe inspection apparatus stores acquired electronic component information including position information and rank information of the electronic components 100 on the wafer sheet 200.

The electronic component information is obtained methods or CD, such as a server via the by LAN, by a method such as electronic storage media such as memory. Location information comprises an index on the wafer sheet 200, the rank information includes amount, wavelength, resistance, processing speed, high voltage resistance, information such as current amplification factor. Further, rank information, the amount of light, wavelength, resistance, processing speed, high voltage resistance, may be divided into predetermined ranks from information such as current amplification factor.

Mounting board information storage unit 42 stores a mounting board information of the electronic component 100 in the mounting substrate 300 which is disposed on the mounting substrate holder 21. Mounting board information is implementation mounting positions of the electronic components in the substrate, and the necessary mounting number information of the electronic component in the mounting substrate contains at least.

Control unit 40, together with obtaining the electronic component ranks the ratio of each rank in the electronic component 100 on the wafer sheet 200 on the basis of the electronic component information, based on a mounting board information the electronic component rank ratios, each rank in the mounting substrate 300 includes the mounting substrate ratio determining unit 43 for determining a mounting ratio, the area determination unit 44 that determines the area in which the electronic components 100 of each rank is implemented in the mounting substrate 300.

Figure 2 is a diagram showing the positional relationship between the operation direction of each part of the electronic component mounting apparatus.

Referring to FIG. 2, further illustrating the positional relationship between each part of the electronic component mounting apparatus 1. 2, the electronic component holding table 11, the arrangement of the mounting substrate holder 21 and the transfer head 30 of the mounting portion 20 and the direction of movement of the pickup portion 10 when viewed electronic component mounting apparatus 1 of FIG. 1 from the Z direction upward is a diagram illustrating a.

As shown in FIG. 2, the transfer head 30 includes a pick-up position Pu of the pickup unit 10, on a straight line connecting the mounting position Pl of the mounting portion 20, a plurality of suction nozzles 31 on respectively spaced predetermined margin in holding in a row.

Thus, the pickup unit 10, by the transfer head 30 is moved in the X direction by the operation of the head actuator 32, the suction nozzle 31 held by the transfer head 30 is transferred one by one pick-up position Pu that. On the other hand, in the mounting portion 20, the operation of the head actuator 32 by the transfer head 30 is moved in the X direction, the transfer suction nozzles 31 held by the transfer head 30 is in one single mounting position Pl It is.

Control unit 40, a pickup unit 10, a CPU for control for controlling the operation of each of the mounting portion 20 and the transfer head 30, is connected to the associated respective units, a control operation, such as by supplying a control signal do.

Control unit 40, for example, by an image of the electronic component 100 on the wafer sheet 200 sent from the camera 19 analyzes, sets the position coordinate on the electronic component 100. Control unit 40, by operating the electronic component holding table actuator 12 in accordance with the position coordinates of the desired electronic components 100, such that the electronic component 100 comes to the pickup position Pu, adjust the position of the electronic component holding table 11.

The control unit 40 sets the position coordinate on the mounting substrate 300, so as to come into mounting position mounting position Pl of the electronic components the desired coordinates as an electronic component mounting position, by operating the mounting substrate holder actuator 22 adjusting the position of the mounting substrate holder 21.

The control unit 40 based on the image analysis result transmitted from the camera 26, or get the inspection and the positional information of the quality of the electronic components 100 disposed on the mounting substrate 300.

The control unit 40, a camera 19, with reference to the image captured by the camera 26, when the electronic component 100 are shifted in the θ direction in the XY plane, the mounting substrate and the electronic component holding table actuator 13 the control signal transmitted to the holder actuator 22, the electronic component holding table 11, a correction moving the mounting substrate holder 21 in the direction θ, respectively. Accordingly, the pickup and mounting of electronic components is performed more reliably.

Control unit 40, the operation in response to information from the electronic component information storage unit 41 and the mounting board information storage unit 42, the control according to the determined result of the implementation substrate ratio determining section 43 and the area determination unit 44 do. For example, the rank information of the electronic component information storage unit 41, the number required in the mounting board 300 of the mounting board information storage unit 42, in the mounting substrate ratio determination unit 43 calculates a mounting ratio, based on the implementation ratio by going to implement the specified location in the mounting substrate 300 electronic component 100 of a given rank of the wafer sheet 200 (area), efficiently mounting an electronic component 100.

Figure 3 is a diagram showing an embodiment of a pickup of the electronic component by an electronic component mounting apparatus.

Next, with reference to FIG. 3, the suction nozzle 31 of the transfer head 30 will be described operation for picking up by suction the electronic components 100 on the wafer sheet 200. In Figure 3, it described separately positional relationship of each section from the state 1 to the state 4. Operation of each unit described below, under the control of the control unit 40, is performed.

In the pickup operation of the electronic component 100, first, the electronic component holding table actuator 12 moves the electronic component holding table 11, to move the desired electronic components 100 to the pickup position Pu (on the axis indicated by dashed line).

At the same time, or in tandem with, the head actuator 32 moves the transfer head 30, to move the desired suction nozzle 31 to the pickup position Pu (state 1). Pickup hammer 13 in this state, push-up needle, the position of the Z-direction of the suction nozzle 31, the initial position in the respective Z-direction.

Then, the pickup motor 15 rotates the upper disc cam 14 to move the pickup hammer 13 downward. Pickup hammer 13, with the movement, after contact with the upper end of the suction nozzle 31, depressing the suction nozzle 31 against the biasing force of the spring mechanism for biasing the suction nozzle 31 upward to downward.

Suction nozzle 31 which is depressed at a position where the pickup hammer 13 has reached the lower end of the movement range, in contact with the electronic component 100 to operate the suction of the suction nozzle 31 in order to advance in the control unit 40 to suck the electronic component 100 , to suck the electronic component 100. Further, by the push-up motor 18 rotates the lower disc cam 17, moves the push-up needle 16 toward the electronic component 100 (state 2).

Then, the pickup motor 15 rotates the upper disc cam 14, by moving the pickup hammer 13 upwardly to release the depression of the suction nozzle 31. Depressing the suction nozzle 31 is released, the biasing force of the spring mechanism, moves upward the electronic component 100 in a state of adsorption. At the same time, the upper end of the push-up needle 16 push up the electronic component 100 in the upward direction through the wafer sheet 200, moves the lower end of the electronic component 100 in the direction to be detached from the wafer sheet 200 (state 3).

Pickup hammer 13, and the push-up needle 16, back to their initial position, the suction nozzle 31 which is adsorbed to the lower end of the electronic component 100 also returns to the initial position in Z-direction. Thereafter, the electronic component holding table actuator 12 to the electronic component holding table 11 is moved so that the next electronic component 100 to the next pick-up position Pu comes. At the same time, or in tandem with, the head actuator 32 moves the transfer head 30 moves next to the suction nozzle 31 to the pickup position Pu (state 4).

Above, the operations described, the electronic component 100 is sucked by the suction nozzle 31 of the transfer head 30. By repeating several times the above-mentioned operation, the electronic component 100 is attracted to each of the plurality of suction nozzles 31 held by the transfer head 30.

Here, also for the mounting operation in the mounting portion 20, it is carried out in the same procedure. Described below for specific instructions. In mounting operation of the electronic component 100, first, the mounting substrate holder actuator 22 moves the mounting substrate holder 21, to move the desired electronic component mounting position on the mounting board 300 to the mounting position Pl. At the same time, or in tandem with, the head actuator 32 moves the transfer head 30, moves the suction nozzle 31 for sucking the electronic component 100 to the mounting position Pl. In this case, mounting the hammer 23 is in the initial position in the Z direction.

Subsequently, mounting motor 25 rotates the disk cam 24 to move the mounting hammer 23 downward. Implementation hammer 23, with the movement, after contact with the upper end of the suction nozzle 31, depressing the suction nozzle 31 against the biasing force of the spring mechanism for biasing the suction nozzle 31 upward to downward. Electronic component 100 is sucked by the suction nozzle 31 which is depressed at a position where mounting hammer 23 has reached the lower end of the movement range, in contact with the mounting substrate 300.

At this time, the control unit 40 by releasing the suction of the suction nozzle 31 for sucking the electronic component 100, the electronic component 100 is disposed in the electronic component mounting position on the mounting substrate 300. Since the mounting substrate 300 is adhesive, the electronic component 100 is bonded to the mounting board 300 in an electronic component mounting position.

Subsequently, mounting motor 25 rotates the disk cam 24, by moving the mounting hammer 23 upwardly to release the depression of the suction nozzle 31. Sucking nozzle 31 depressed is released, the biasing of the spring mechanism, moves upward the electronic component 100 in a state that is not adsorbed.

Return implementation hammer 23 is in the initial position, the suction nozzle 31 which has finished the placement of the electronic component 100 after returning to the initial position in the Z direction to the mounting substrate holder actuator 22 moves the mounting substrate holder 21, the mounting position Pl to move the following mounting position.

At the same time, or in tandem with, the head actuator 32 moves the transfer head 30, moves the suction nozzle 31 for sucking the next electronic component 100 to the mounting position Pl.

Above, the operations described, the electronic component 100 is transferred by the transfer head 30 is mounted on the mounting substrate 300. By repeating several times the above-mentioned operation, the electronic components 100 to be attracted to the plurality of suction nozzles 31 provided in the transfer head 30 is mounted on the mounting substrate 300.

Figure 4 is a flowchart showing a flow of operation of the electronic component mounting apparatus and an electronic component mounting method of this embodiment. Then, including pick-up operation and mounting operation by an electronic component mounting apparatus 1, with reference to FIG. 4 is a flow chart showing the overall flow of operation will be described an operation of the electronic component mounting apparatus 1.

In the electronic component mounting apparatus 1, at the start of a series of operations, the wafer sheet 200 on which an electronic component 100 is held it is placed on the electronic component holding table 11 of the pickup unit 10 (step S1). This wafer sheet 200 on the plurality of electronic components 100 of different rank are arranged into wafers.

At the same time, or in tandem with, a mounting substrate 300 on which an electronic component 100 is mounted it is mounted on the mounting substrate holder 21 of the mount portion 20 (step S2).

Next, the controller 40 generates a control signal for controlling the actuators, and transmits (step S3). This control signal, the electronic component holding table actuator 12, the pickup motor 15, a mounting substrate holder actuator 22, and controls the head actuator 32, the pickup of the electronic component 100, to control the implementation. It will be described later generation and transmission of a control signal.

Next, the control unit 40 moves the transfer head 30 to the pick-up unit 10 (step S4), and executes a pick-up operation (step S5).

Such pickup operation, the electronic component 100 disposed on the wafer sheet 200 is adsorbed to each of the plurality of suction nozzles 31 of the transfer head 30. It should be noted, will be described later pick-up operation.

Subsequently, the control unit 40 moves the transfer head 30 to the mounting portion 20 (step S6), and executes the mounting operation (step S7).

Such mounting operation, the electronic component 100 are attracted to each of the plurality of suction nozzles 31 of the transfer head 30 is mounted to the mounting substrate 300. It will be described later mounting operation.

Control unit 40 until all of the electronic components 100 to be moved on the wafer sheet 200 is mounted on the mounting board 300 (step S8: Yes), then repeating a series of operations from step S4 to step S7, the operation is completed.

Figure 5 is a flow chart showing the flow of generation and transmission of the control signal in the control unit 40. Next, the flow of the generation and transmission of a control signal by the control unit 40 of the electronic component mounting apparatus 1 (step 3 in FIG. 4) will be described with reference to the flowchart of FIG.

Controller 40 acquires the electronic component information (including position information and rank information) from the electronic component information storage unit 41. At the same time, or after the other control unit 40 acquires an image of all of the electronic components 100 by the camera 19 of the pickup portion 10 is disposed on the wafer sheet 200 taken. Control unit 40 based on the acquired image information, collates the index on the wafer sheet 200, and an index included in the electronic component information obtained from the electronic component information storage unit 41 (including the positional information and the rank information) .

Control unit 40, the matching sets the position information of the matching electronic component information (including position information and rank information), the coordinates to the electronic components 100 on the basis of the image information captured by the camera 19, is generated linking and position information. Thereby, the control unit 40 is enabled recognize the position and rank of the electronic component 100 disposed on the wafer seat 200. The electronic component information storage unit 41 is acquired and stored electronic parts information from such storage unit in the storage unit or on the server of the probe testing apparatus of the previous step (step S10).

Subsequently, the control unit 40 calculates the electronic component ranks the ratio of the electronic component 100 on the wafer sheet 200 from the obtained electronic component information (step S11).

Next, the control unit 40 obtains the mounting board information consisting required electronic component number and the mounting position in the mounting board from the mounting board information storage unit 42. The mounting board information storage unit 42 mounting board information comprising the required number electronic component and the mounting position on the mounting board are stored (step S12).

Mounting substrate ratio determining unit 43 of the control unit 40 calculates a mounting ratio from the mounting board information and electronic parts rank ratio (step S13). The implementation ratio is the ratio of the rank of the electronic components mounted in the mounting substrate.

Area determination unit 44 of the controller 40 from a mounting ratio and the mounting board information, determines the area where the electronic component 100 of each rank is implemented (step S14).

Control unit 40 generates a control signal depending on the implementation ratio and area, and transmits (step S15). Area and is an area where the electronic component in the mounting substrate is mounted.

A plurality of electronic components having different ranks wafer sheet holding step of holding the wafer sheet disposed into wafers to the electronic component holding table corresponds to step S1.

Electronic parts information storage step of storing the electronic component information consisting of position information and rank information of the electronic components of the electronic components on the wafer sheet in the electronic component holding table in the electronic component information storage unit corresponds to step S10.

Mounting board information storage step of storing the mounting board information consisting of mounting positions and the number required in the substrate mounting board information storage unit corresponds to step S12.

With obtaining the electronic component ranks the ratio of each rank in the electronic component on the wafer seat on the basis of the electronic component information, based on the electronic component ranks ratio and the mounting board information, the mounting substrate to determine the implementation ratio of each rank in the substrate ratio determining step corresponds to step S11,13.

The implementation ratio and the electronic components the electronic components on the wafer seat on the basis of the information, one or extraction plurality increments, control step of controlling so as to place the substrate, transferring mounted in a state where a plurality of ranks are mixed, corresponding to step S4-7.

Figure 6 is a flow chart showing the flow of the pickup operation of the present embodiment. The next pickup operation of the electronic component 100 by the pickup unit 10 of the electronic component mounting apparatus 1 (step 5 in FIG. 4) will be described with reference to the flowchart of FIG.

First, the control unit 40 sets the first electronic component 100 for pickup based electronic components. Camera 19, an image captured on the reference electronic components, and transmits the image information to the control unit 40. Control unit 40, based on the transmitted image data, again sets the coordinates as a reference electronic component generates position information (step S101).

Control unit 40 compares the acquired from the captured image by the camera 19 at the beginning (FIG. 5, step S10) and the positional information of all the electronic components 100 and the position information of the newly acquired reference electronic components, reference position of the electronic component the first (i.e., detected in step S10) to detect whether the shift much from the position, calculates a position correction amount for correcting the deviation (step S102).

Control unit 40 applies the location information of the newly acquired reference electronic components, and updates the position information of the reference electronic components are stored (step S103).

Next, the control unit 40 moves, operates the electronic component holding table actuator 12 on the basis of the reference electronic component position information after updating, so that the reference electronic component is moved to the pickup position Pu, the electronic component holding table 11 make (step S104).

At the same time, or in tandem with, the control unit 40, the head actuator 32 is operated, so that the suction nozzle 31 that does not suck the electronic component 100 is moved to the pickup position Pu, moves the transfer head 30 (step S105).

Subsequently, the control unit 40, to adsorb the reference electronic component by the suction nozzle 31 to pick up electronic components 100 (step S106).

More specifically, the control unit 40 drives the pickup motor 15 causes push down the suction nozzle 31 to the pickup hammer 13. At the same time, the control unit 40 drives the push-up motor 18, causing the push-up the electronic component 100 to the push-up needle 16.

Electronic component 100 is adsorbed by contact with the suction nozzle 31 which is depressed to pick hammer 13, further with suction nozzle 31 is moved upward, that pushed up by the push-up needle 16, peeled off from the wafer sheet 200 It will be picked up.

Next, there are picked up an electronic component 100 (step S107: Yes), and, if the adsorbable suction nozzle 31 that does not suck the electronic component 100 is present (step S108: Yes), the next electronic component 100 pickup is performed.

Control unit 40 reads out the position information stored for the next electronic component 100 is compared with the coordinates of the pre-update reference electronic components of the electronic part 100 (i.e., the detected coordinates in step S10) , the position of the electronic component 100 it is determined whether it is within the correction amount applied area.

Correction applied area indicates a predetermined range starting from the position coordinates of the reference electronic components. In the correction amount applied in the area, for each electronic component 100, the first detection of the electronic component 100 position (i.e., step S10 in FIG. 5) from the re-detection of the position of the reference electronic components (i.e., step S101 in FIG. 6) shift position occurring between the can be considered to be similar.

Deviation of the electronic component 100 position is adapted stretch of the wafer sheet 200 is a major factor to be extended, if the electronic components 100 within a certain range close, the deviation of the position are considered comparable.

After the pick-up of the reference electronic components, as long as the electronic component to be picked up is present in the amount of correction applied area, the positional deviation of the electronic component is considered to be shifted about the same position of the reference electronic component It is. Therefore, by detecting again the coordinates for the electronic component, even without acquiring the location information, by applying the correction amount of the reference electronic components, the position information after shifted the next electronic component to be picked up It is considered to be calculated.

Incidentally, defining the correction amount applied area, the predetermined range around the reference electronic components may be appropriately changed, for example, depending on the stretch of the wafer sheet 200 which causes the displacement of the position of the electronic component 100 it may be changed as appropriate Te.

Control unit 40, when the correction amount applied in the area where the position of the next electronic component 100 is referenced to the reference electronic components (step S109: Yes), by using the position correction amount of the reference electronic component, the electronic component 100 performing the correction of the position information (step S110).

Specifically, with respect to location information of the electronic component 100 stored, a material obtained by applying the position correction amount of the reference electronic component and positional information after correction.

Control unit 40 based on the position information after the correction of the next electronic component 100, operates the electronic component holding table actuator 12, such that the electronic component 100 is moved to the pickup position Pu, the electronic component holding table 11 thereby moved (step S111).

Subsequently, the next suction nozzle 31 that does not suck the electronic component 100 is moved to the pickup position Pu (step S105), it causes the pickup of the next electronic component 100.

On the other hand, if the correction amount applicable area where the position of the next electronic component 100 is referenced to the reference electronic components (step S109: No), the control unit 40 sets the electronic component 100 to the new standard electronic components .

Control unit 40, the new standard electronic components, the acquisition of position information by the image pickup of the image (step S101), performs the calculation of the position correction amount (step S102), and updates the position information (step S103), step S104 subsequent to perform a pickup operation.

As described above, according to the configuration described, the plurality of suction nozzles 31 held by the transfer head 30, it is possible to perform the suction operation of the electronic component 100 disposed on the wafer sheet 200 continuously. Therefore, by moving the one-time transfer head 30, it is possible to transfer to the mounting portion 20 are collectively a plurality of electronic components 100.

In the electronic component mounting apparatus 1 defines a pickup position Pu is a position for taking out the electronic components 100, and transferring the suction nozzle 31 and the electronic components 100 one by one to the pick-up position Pu. Therefore, it is possible to perform a relatively short time positioning, shortening of tact time can be realized.

Note that the transfer of the electronic component 100, by performing in parallel the transfer of the suction nozzle 31, shortening of further tact time can be expected. The state and shape of the electronic component 100, depending on the rank, by appropriately selecting the electronic components 100 to be adsorbed, it is possible to sort the electronic component 100.

Figure 7 is a flow chart showing the flow of the mounting operation of the present embodiment. The next mounting operation of the electronic component 100 by the mounting portion 20 of the electronic component mounting apparatus 1 (step 7 of FIG. 4) will be described with reference to the flowchart of FIG.

Control unit 40 transmits a control signal for operating the mounting substrate holder actuator 22, so that the desired electronic component mounting position on the mounting board 300 is moved to the mounting position Pl, moving the mounting substrate holder 21 ( step S201).

At the same time, or in tandem with, the control unit 40, the head actuator 32 is operated, so that the suction nozzle 31 that suck the electronic component 100 is moved to the mounting position Pl, it moves the transfer head 30 (step S202).

Subsequently, the control unit 40, so that the electronic component 100 sucked by the suction nozzle 31 is mounted on an electronic component mounting position on the mounting board 300, to release the suction (step S203).

More specifically, the control unit 40 drives the mounted motor 25 causes push down the suction nozzle 31 to the mounting hammer 23. After the electronic component 100 sucked by the suction nozzle 31 which is depressed into contact with the mounting substrate 300, the control unit 40 releases the adsorption of the suction nozzle 31, the electronic component mounting position on the mounting board 300 electronic component 100 to implement to.

Then, until the suction nozzles 31 provided on the transfer head 30 is no longer present the electronic component adsorbed (step S204: Yes), the control unit 40, repeat the series of operations from step S201 to step S203 to.

Whether the electronic component by the suction nozzle 31 is present, the control unit 40, if the number to be specified transported, the number transferred already on the image captured by the camera 26 is matched, the adsorption When the electronic component on the nozzle 31 is not present it can be considered.

Incidentally, the number of mounted electronic parts 100 set by the mounting board information, or until the number of mounted set for each rank of the electronic component 100, the electronic component 100 mounted on a mounting board 300, be moved to the next test step good.

After all of the electronic components 100 to be sucked by the suction nozzle 31 is mounted on the mounting substrate 300 (step S204: Yes), the control unit 40, an image of the electronic component 100 mounted on the mounting substrate 300 by the camera 26 , and it receives an input of image information. Then, based on input image information, whether the electronic component 100 is mounted is inspected for accuracy and appearance of the electronic component 100 of the sequence of the electronic component 100 (step S205). Electronic component 100 after the inspection, the control unit 40 ends the mounting operation.

Referring now to FIGS. 8 and 9, in the case of applying the light emitting diode element as an electronic component, described implementation from the wafer sheet to the substrate. Note that the transport-mounted by the electronic component mounting apparatus 1, since the configuration and operation described above is directly applicable, the description thereof is omitted.

Figure 8 is an example of that shown and the light emitting diode element on a wafer sheet, the light emitting diode module mounted on the board. Here, the electronic component 100 is a light emitting diode element, the mounting substrate 300 is a ceramic substrate or a glass substrate, as the substrate of the light emitting diode module, the light emitting diode element is a substrate that can be implemented.

The light emitting diode element on the wafer sheet 200, due to manufacturing conditions in the manufacturing process of the light emitting diode element in the previous step, receiving a state in which there are variations in quality. Variation in the quality, the light emitting diode element cleaning atmosphere and the light emitting diode element during production in the chamber, which is produced on inevitable variations arising from variations in the thickness of the light emitting diode element. When manufacturing products and modules without considering the variation, variation occurs, eventually yield is deteriorated in the finished product.

Therefore, due probe test, examines one by one light emitting diode element, performs ranking based on the detection result. Wafer sheet 8 is shows the test results schematically, ○ is A rank, ● is B rank, × indicates a C rank. In practice, the rank of tens exists, described in three ranks in the description of the present embodiment. Rank even when several tens ranks, the application of the present invention are possible.

Information of this test result and the ranking is associated with the position information, such as with an index number or code of the wafer sheet attached to one by one, are stored like in the storage unit of the inspection apparatus of the server or on the previous step . Or it may be stored directly in the electronic component information storage unit 41.

Electronic component information storage unit 41 obtains the electronic component information from the inspection device or the storage unit of the previous step. On the other hand, the mounting board information storage unit 42, mounting board information has been input is information relating to the required number and position of the light emitting diode element to be mounted on the substrate.

No. Ratio of the light emitting diode elements on the wafer sheet 200 is calculated by the implementation substrate ratio determination unit 43. No. Ratio of the light emitting diode elements on the wafer sheet 200 in FIG. 8, A Rank: B Rank: C Rank 80: 16: 4.

Mounting substrate ratio determining unit 43 further determines the rank ratio in the mounting board 300 on the basis of the rank ratio on the wafer sheet 200 calculated. In the light emitting diode module comprising a 25 light-emitting diode element, 20 is A rank, B rank 4, C rank constituted used one. Also referred to as mounting proportions as the rank ratio in the mounting substrate 300.

During the implementation, on the basis of the mounting ratios and mounting board information, mounting area of ​​each rank in the mounting substrate 300 is determined by the area determination unit 44. In Figure 8, the rank is determined so that the light emitting diode device of high rank A is mounted in the surrounding area, the light emitting diode element of lower rank C rank is determined to be mounted to the central area.

The rank ratio of the light emitting diode elements on the wafer seat 200 to the mounting substrate 300 as a mounting ratio for mounting the light emitting diode elements of each rank.

For rank information and the position information of the light-emitting diode module, specifically described. In Figure 8, after the step of mounting each rank with respect to the substrate, it will be described with reference to the state 3 the completed as a light emitting diode module.

For light emitting diode modules, all of the light emitting diode element used in the module need not necessarily be the highest ranking. This amount and intensity is less variation as a result as a module, specifications on, because I if produced in an acceptable range.

Therefore, the light emitting diode module, the light emitting diode element of rank other than the highest ranked are also implemented. However, the end portion is required to have a relatively high rank from relationships such as contrast, center, etc. may be those low rank, there are restrictions in accordance with the specification of the LED module.

The light emitting diode module of state 3 of FIG. 8, end the A rank is the highest rank is used, toward the center, are mounted so as to adopt a low rank. That is, mounted around a lower C rank rank, around the B rank, mounted around its so as to surround the A rank, and implemented to guarantee the luminous intensity of the whole module, the amount of light.

The pattern of the array in this way, the light emitting diode elements necessary rank in accordance with the specifications required in the final product, a plurality of patterns from the idea of ​​implementing the appropriate position is provided. Thus, for example, when a plurality of substrates mounting the substrate holder 21 of the mount portion 20 is held, also be implemented with the same arrangement pattern with respect to each of which a plurality of substrates, also be implemented in different patterns It can become.

Control unit 40 refers to the electronic component information in accordance with the implementation ratio, and pick up any position on the wafer sheet 200, a light emitting diode device of any rank, to calculate whether the mounting to the substrate, the electronic component holding table actuator 12, the mounting substrate holder actuator 22, and transmits a control signal to the transfer head 30.

Thus, the light emitting diode element is picked up from the wafer sheet 200 by the suction nozzle 31 of the transfer head 30 is mounted to the substrate.

For example, in FIG. 8, with respect to one substrate disposed on the mounting substrate holder 21, a light emitting diode device of A rank is the most often light emitting diode element of the light emitting diode element to be mounted first, the substrate It has implemented (state 1).

Next, pick up the light emitting diode element of B ranks over the wafer sheet 200 (state 2), implements the last light-emitting diode device C rank picks up from above the wafer sheet 200 to be mounted (state 3).

Note that after mounting of the light emitting diode elements of each rank during this implementation, the already mounted electronic components may be inspected. By performing such a test after mounting of each rank, it is possible to shorten the tact time, also such as A rank, in the case of performing the inspection from many light emitting diode elements on the wafer seat 200, inspection after implementation of A rank in the case of detecting the problem, stop the mounting to the substrate, it is possible to prevent wasteful use of light emitting diode elements B rank and C rank is less electronic components.

In addition, inspection is, after mounting the end of the substrate, may be carried out to each substrate. Test is performed on the basis of the image captured by the camera 26 of the mounting portion 20.

The image captured by the camera 26, the light-emitting diodes or elements are present at positions where there is, or are mounted spaced apart other light emitting diode element with a predetermined distance to a to position, slanted or horizontal and whether not been implemented, to examine.

Note that rank in the description of FIG. 8 has been described to be implemented from the light emitting diode device of A rank is most often mounted on the substrate, mounting order is that not limited thereto, it is most reduced mounted on the substrate of and from the light emitting diode element may be mounted from the light emitting diode element and the smallest light emitting diode device most often ranked on the wafer seat 200.

Further, in the area determination has been determined peripheral portion and the central portion in the position of rank may be determined areas in accordance with the ratio of the rank. In addition, not only the ratio of rank, may determine the area also refer to positions of rank. In this way, the light emitting diode devices on the wafer sheet 200 is mounted to efficiently substrate.

Figure 9 is an example of that shown and the light emitting diode elements on the wafer sheet 200, a light emitting diode module mounted on the board. Next, with reference to FIG. 9, illustrating a light emitting diode element on a wafer sheet, another example of the light emitting diode module mounted on the board.

9, No. Ratio of the light emitting diode elements on the wafer sheet 200, A Rank: B Rank: C Rank is a 64:24:12.

Therefore, it composed 25 in one light emitting diode module comprising a light emitting diode device, A rank 16, 6 B rank, and rank C is used three.

During the implementation, on the basis of the mounting ratios and mounting board information, mounting area of ​​each rank is determined by the area determination unit. 9, the rank information and implementation ratio rank is determined so that the light emitting diode device of high rank A is mounted in the surrounding area, mounted alongside rank lower rank B and C rank of the light emitting diode element in the center area It has been determined to be.

8 and 9, a case has been described in which the rank is three, a case where there tens rank, are equally applicable. You can also set not to use electronic components worst rank, or set so as not to use the electronic component ratio is less rank, to determine the faulty electronic components, also possible to avoid using it is. For example, if a 20 ranks, it is possible to set not to use electronic components worst rank.

The electronic components there is only 1% on the wafer sheet 200 can also be configured to not use. By setting this way, the variation is small, and efficient electronic components on the wafer sheet 200, it is possible to efficiently use.

<Configuration and Effects of Embodiment>
Electronic component mounting apparatus of this embodiment, an electronic component holding table different light emitting diode elements having rank holding the wafer sheet disposed into wafers, the light emitting diode element on a wafer sheet in the electronic component holding table position information and the electronic component information storage unit which stores electronic component information comprising rank information of the light-emitting diode element, and the electronic component transfer mounting portion a light emitting diode element from the wafer sheet 1 or extraction plurality increments, transferring mounted to the substrate a mounting board information storage unit for storing mounting board information consisting of mounting positions and the number required in the substrate, with obtaining the electronic component ranks the ratio of each rank in the light-emitting diode element on a wafer sheet based on electronic components, electronic based on component rank ratio and the mounting board information, the La in the substrate A mounting substrate ratio determining section that determines a mounting ratio of click, the light emitting diode elements based on the implementation ratio and the Electronic Components, to a predetermined position on the substrate, an electronic component to be mounted in a state where a plurality of ranks are mixed and a control unit for controlling the transport mounting portion.

By the structure described above, when implemented directly to the substrate from the wafer sheet, can be implemented efficiently emitting diode element on a wafer sheet, it is possible to reduce waste.

Further, based on the rank ratio of the light emitting diode element of the wafer sheet side, since the mounting to the substrate, it is possible to reduce the light emitting diode element that remains finally the wafer sheet side.

Further comprising an area determination unit that determines the area in which the light emitting diode elements of each rank is implemented.

This allows the light emitting diode element of the same rank, be arranged in a certain area on the substrate.

Electronic component mounting method in this embodiment, the wafer sheet holding step of holding the wafer sheet in which a plurality of electronic components having different ranks are arranged into wafers to the electronic component holding table, on the wafer sheet in the electronic component holding table an electronic component information storage step of storing the positional information and the electronic component information comprising rank information of the electronic components of the electronic component to the electronic component information storage unit, the mounting board information storing mounting board information consisting of mounting positions and the number required in the substrate a mounting board information storage step of storing the parts, together with obtaining the electronic component ranks the ratio of each rank in the electronic component on the wafer seat on the basis of the electronic component information, based on the electronic component ranks ratio and the mounting board information, each of the substrates a mounting substrate ratio determining step of determining a mounting ratio of rank, based on the implementation ratio and electronic components The electronic components on Ehashito, 1 or extraction plurality increments provided in a predetermined position on the substrate, and a control step of controlling to transport mounted in a state where a plurality of ranks are mixed.

By the structure described above, when implemented directly to the substrate from the wafer sheet, can be implemented efficiently emitting diode element on a wafer sheet, it is possible to reduce waste.

<Definition section>
In the present invention, electronic components, is used a light emitting diode device as an example, for example, a semiconductor element, a resistor element, a transistor may be such, also, if the electronic components can be divided into a plurality of ranks by its nature , it may be any kind of electronic components.

In the present invention, the substrate, for example, a ceramic substrate, a glass substrate, a substrate such as a printed circuit board may be a board capable of mounting an electronic component.

In the present invention, the electronic component information, for example, is that the rank information including includes an index on the wafer seat, the position information of each light-emitting diode element, quantity of light, information such as a wavelength. Further, rank information, the amount of light may be a rank information divided into predetermined ranks from information such wavelengths. The electronic component information storage unit, in addition to the storage unit of the electronic component mounting apparatus, an external storage device for the electronic component mounting apparatus, for example, and the storage unit of the previous step of the probe inspection apparatus is connected to the probe testing apparatus servers, CD, and that of a storage medium, such as memory, as long as it can be stored, may be of any type.

In the present invention, the mounting board information, mounting position information of each light emitting diode in the substrate, and that the mounting number and shape of the substrate to the substrate. Incidentally, in addition to the storage portion of the mounting board information storage unit the electronic component mounting apparatus, an external storage device for the electronic component mounting apparatus, for example, an electronic component mounting apparatus and a computer connected to a server, CD, storage media, such as memory it, and the long as it can be stored, may be of any type.

1 electronic component mounting apparatus 10 pickup unit 11 electronic component holding table 12 electronic component holding table actuator 13 pickup hammer 14 push-up upper disc cam 15 pickup motor 16 push-up needle 17 under the disc cam 18 motor 19 camera 20 mounting portion 21 the mounting board holding base 22 mounting the substrate holding table actuator 23 mounted hammer 24 disc cam 25 mounted motor 26 camera 30 transfer head 31 the suction nozzle 32 head actuator 40 the control unit 41 electronic component information storage unit 42 mounting board information storage unit 43 mounted in the substrate ratio determination part 44 area determination unit 100 electronic component 200 wafer sheet 300 mounted board Pu pickup position Pl mounting position

Claims (4)

  1. An electronic component holding table in which a plurality of electronic components of different ranks holds a wafer sheet which is arranged in a wafer form,
    And the electronic component information storage unit which stores electronic component information composed of the positional information and the rank information of the electronic components of the electronic components on the wafer sheet in the electronic component holding table,
    Extraction 1 or more at a time the electronic component from the wafer sheet, and an electronic component transfer mounting unit for transferring mounting to a substrate,
    A mounting board information storage unit for storing mounting board information consisting of mounting positions and the number required in the substrate,
    With obtaining the electronic component ranks the ratio of each rank in said electronic components on said wafer sheet on the basis of the electronic component information, on the basis of the electronic component ranks the ratio between the mounting board information, the implementation ratio of each rank in said substrate a mounting substrate ratio determining unit determining,
    Comprising the electronic component on the basis of the electronic component information and the implementation ratio, to a predetermined position in the substrate, and a control unit for controlling the electronic component transfer mounting portion so as to implement a state where a plurality of ranks are mixed an electronic component mounting apparatus characterized by.
  2. The electronic component mounting apparatus according to claim 1, wherein the electronic component of each rank is characterized in that it comprises an area determining unit that determines an area to be implemented.
  3. The electronic component is a light emitting diode element, the substrate is an electronic component mounting apparatus according to any one of claims 1 or 2, characterized in that a light emitting diode module.
  4. A wafer sheet holding step of holding the electronic component holding table wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer form,
    An electronic component information storage step of storing the electronic component information composed of the positional information and the rank information of the electronic components of the electronic components on the wafer sheet in the electronic component holding table in the electronic component information storage unit,
    A mounting board information storage step of storing the mounting board information consisting of mounting positions and the number required in the substrate to a mounting board information storage unit,
    With obtaining the electronic component ranks the ratio of each rank in said electronic components on said wafer sheet on the basis of the electronic component information, on the basis of the electronic component ranks the ratio between the mounting board information, the implementation ratio of each rank in said substrate a mounting substrate ratio determining step of determining,
    The electronic component on the on the basis of the implementation rate as the electronic component information wafer sheet, 1 or extraction plurality increments, to a predetermined position in the substrate, control to transfer implemented in a state in which a plurality of ranks are mixed electronic component mounting method and a controlling step of.
PCT/JP2012/050848 2012-01-17 2012-01-17 Electronic component mounting device and electronic component mounting method WO2013108367A1 (en)

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JP5789680B2 (en) 2015-10-07 grant

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