DE102006051607B4 - Method and device for the standard application and mounting of electronic components on substrates - Google Patents

Abstract

Method for the standard application and mounting of flip chips (5, 10), in particular RFID chips, on substrates (3), in particular antenna-containing substrates,
with the following steps:
- Receiving at least one of the flip chips (5, 10) from a composite component (4) by means of a receiving device (6-9);
- Transferring the flip chip (10) from the receiving device (6-9) on a displaceable transport device (11-13);
- Applying an adhesive (17) on a bottom of the attached to the transport device (11-13) flip-chip (10) by means of a stationary adhesive application device (15, 16, 20, 21);
- Measuring an orientation of the flip chip (10) in relation to the orientation of a substrate (3) arranged on the laying surface (3a) for storing the flip-chip (10) by means of a measuring device (18, 19), and
- depositing the flip chip (10) on the laying surface (3a) of the substrate (3) by means of the transport device (11-13),
characterized in that
the stationary adhesive application device (15, 16) drops the viscous adhesive in drops as a single drop of adhesive (17) on the underside of the adhesive ...

Description

The The invention relates to a method and a device for serial application and mounting electronic components, in particular RFID chips, on substrates, in particular antennas having substrates, according to the preambles of claims 1 and 5.

electronic Components, in particular flip chips, are conventionally used for equipping Substrates, such as antennas provided with substrates, used to derive from the interaction of the chip with the antenna final Chip card, or the final Get smart label. In such a loading process The flip chips are implemented within a high throughput device from a chip composite, such as a wafer, by means of a flip chip receptacle individually removed and by rotation of this flip-chip receiving device turned upside down to have another receptacle on its back, which also serves as a transport device to let attack. The recording of the individual chips is usually carried out by means of vacuum pipettes, the a gentle holding the chips on the receiving device, too while of transport, allow.

So far will be equipped of the substrate with the single chip and for fixing the chip in the substrate, which is usually on or in a belt which is continuous or discontinuous is moved, an adhesive exclusively in the area of a Able gefläche of Substrates in which the chip are used or stored should, in a first process section within a mostly separate therefor provided processing modules of the machine applied. Subsequently, will within another processing module of the machine in the frame a further process step of the flip chip to be used by the Wafer picked and transported to the depositing surface to him then place on the adhesive bearing surface, which often as a cavity within a card body can be trained.

at the application of the adhesive to the laying surface or cavity of the substrate must the Klebstoffautrageeinrichtung, as a so-called shooter is referred to, above the substrate having the band suspended be and be movable in the X and Y directions, thereby by means of of an X and Y rail system, the individual cavities or, more generally, the individual storage surfaces to be able to approach and targeted individual drops of adhesive at certain designated points within the storage area to be able to order.

A requires such machine with two different process steps the coordination of both process steps on each other and thus the Vote the for these process steps responsible processing modules among themselves, resulting in a time-consuming and costly control electronics circuit for controlling and regulating the editing modules also related with further processing modules of the machine results.

moreover is due to the mandatory X and Y rail system one increased Space required for this provide within the machine, which dictates a predetermined overall size of the machine.

For example disclosed DE 10 2005 012 396 B3 a method for the serial application and mounting of electronic components, such as flip chips, in which a chip is first deposited in a wetting station to wet the bumps of the chips with flux, wherein during the wetting time of the chip, the handling system at least once back to the providing station to take another chip and place it in the wetting station.

An apparatus for applying paste-like material to electronic components by means of an ejection unit without contact and through the medium of air, wherein the paste-like material may be solder paste, flux or adhesive, is disclosed in US Pat DE 102 58 801 A1 described.

US 4,346,124 and JP 04 712 43 A describe the application of adhesive to the backside of bare dies, wherein the adhesive applying means comprises a type of inkpad in which liquid adhesive is provided.

Of the Article "Adhesive technology the third dimension ", Productronic, ISSN 0930-1100, 2001, no. 10, p. 92, 93 shows for chips with a thickness of 50 microns one Adhesive applicator with sieve and template and an underlying Adhesive which is applied to a base plate by means of a squeegee.

US 2002/01 23 173 A1 handles the adhesive application on flip chips, for which they are immersed in an adhesive container, whereby a dipping in a defined depth can be achieved.

DE 38 05 841 A1 describes a method for assembling component carriers with components in surface mounting technology, in which an adhesive is applied to predeterminable placement positions on the component carriers from a positionable injection-metering device, and the components are provided at the placement positions provided for them under adhesion of the adhesive to the Component carriers are fixed, wherein the adhesive is in each case directly assembled at the placement positions of at least two components, which are delivered from different metering channels of the injection metering device to the placement positions.

A working according to the ink printing principle printhead for ejecting a hot, liquid medium and a method for producing a metal solder comprising connection point, whereby solder deposits are applied to components or substrates of microelectronics is in DE 199 31 110 A1 disclosed.

As a result, The following invention is based on the object, a method and a device for serial application and attaching electronic components to substrates in which the / a cost-effective and time-reduced assembly of Substrates and a reduction in the size of the device with high Throughput possible is.

These Task is device side by the features of claim 1 and method side by the features of claim 5 solved.

• – Aufnehmen mindestens eines der elektronischen Bauteile aus einem Bauteilverbund mittels einer Aufnahmeeinrichtung;
• – Übertragen des elektronischen Bauteils von der Aufnahmeeinrichtung auf eine verschiebbare Transporteinrichtung;
• – Auftragen eines Klebstoffes auf eine Unterseite des an der Transporteinrichtung befestigten Bauteils mittels einer stationären Klebstoffauftrageeinrichtung;
• – Messen einer Ausrichtung des Bauteils in Relation zu der Ausrichtung einer auf dem Substrat angeordneten Ablegefläche zum Ablegen des Bauteils mittels einer Messeinrichtung, und
• – Ablegen des Bauteils auf der Ablegefläche des Substrates mittels der Transporteinrichtung, wobei die stationäre Klebstoffauftrageeinrichtung den zähviskos ausgebildeten Klebstoff tropfenartig als einzelnen Klebstofftropfen auf die Unterseite des Flipchip schießt und/oder die stationäre Klebstoffauftrageeinrichtung ein mit dem Klebstoff getränktes Stempelkissen beinhaltet.

An essential point of the invention is that in a method for the serial application and mounting of electronic components, in particular flip chips for the RFID range, the following successive steps take place on substrates, in particular antennas, comprising substrates:

• - Receiving at least one of the electronic components from a composite component by means of a receiving device;
• - Transferring the electronic component from the receiving device to a displaceable transport device;
• - Applying an adhesive to a bottom of the attached to the transport device component by means of a stationary adhesive applicator;
• Measuring an orientation of the component in relation to the alignment of a deposition surface arranged on the substrate for depositing the component by means of a measuring device, and
• - Laying of the component on the support surface of the substrate by means of the transport device, wherein the stationary adhesive applicator drops the viscous adhesive formed like a single drops of glue on the underside of the Flipchip and / or the stationary adhesive applicator includes a saturated with the adhesive ink pad.

By Such a method will be the first and described above second process step, usually in separate processing modules within a common machine take place, advantageously summarized within a processing module. This has the consequence that both manufacturing costs and processing costs saved can be because complex control electronics circuits for mutual coordination of both machining modules and an X-Y rail system for the process the adhesive applicator omitted.

by virtue of such merging of the two process steps becomes also the size of the machine reduced because the X and Y track system for the shooter, which usually is arranged above a substrate strip, can be saved can.

By the consecutive sequence of recording steps and transferring the electronic component, which may be designed as a flip chip, applying the adhesive, measuring an alignment of the Component and the placement of the component on the shelf can a common transport device for transporting the component of station be used to station, resulting in a simplification of total machining module results.

The Transport device is advantageous with a top-mounted Transport rail equipped, along which arranged thereon a vacuum-loaded Pipette can be moved. The vacuum-charged pipette has one or more openings on the underside to an inside the pipette existing vacuum on one side of the chip to hold to let that work.

The other side, namely the bottom of the chip, is in one of the stations, namely the Adhesive application station, according to the invention with the adhesive dropwise shot at by an adhesive shooter. This shooter is from Aligned bottom up and shoots the tough, viscous glue drop towards the bottom of the chip. A subsequent transport of the chip to the laying surface the substrate causes no Sichloslösung of the adhesive of the Bottom of the chip, because the adhesive is viscous.

Such an underside application of the adhesive on the component thus eliminates the application of the adhesive in the depositing surfaces of the substrates and thus the additional step of treating the individual substrates with adhesive. Rather, in the context of a continuous process, the adhesive application in the transport process of the chip or the electronic component in In addition, which results in a time savings in the production of smart labels and smart cards and a higher throughput of the entire apparatus for producing those results.

According to the invention Adhesive applicator designed such that it with a nach open at the top container equipped with adhesive arranged therein, in which one the bottom of the component can dip for a short time.

Preferably is additional in the container Ink pad, which is impregnated with the adhesive, arranged so that a limited and metered amount of adhesive due to short term press on the bottom of the component is discharged onto the ink pad. Such an ink pad also has the advantage that the Adhesive at the same time on the entire surface of the underside of the component equally distributed is.

Between the step of transfer of the electronic component and the step of applying the adhesive The alignment of the component may already be a first time in addition to the after the step of applying the adhesive takes place Vermessungsvorgang be measured, this time in relation to the Orientation of the adhesive applicator to the electronic Component for the subsequent Align adhesive application correctly.

One Such surveying takes place in both cases by means of an optical Measuring method with the aid of, for example, a camera instead and can by means of image data processing on the laying surface and / or the Kelbstoffauftrageeinrichtung tuned in their orientation become.

The Receiving device for receiving the flip chip from the component assembly, which can be designed as a waver is recorded with the attached thereto by means of vacuum application chip around a horizontal aligned axis rotated by 180 °, passed to the electronic component in the inverted state of the transport device to be able to. The transport device takes over then by vacuum application using the vacuum pipette the electronic component on its opposite top.

A Device for standard application and attaching electronic components to substrates According to the invention, the recording device, the transport device below the transport device arranged adhesive application device and, optionally two, measuring devices out, with both measuring devices the orientation of the component which is attached to the transport device during the entire process from the date of delivery of the component of the Receiving device adheres to the transport device measures. The Vacuum pipette of the transport device for sucking the component thus exercises Vacuum on the component, which can be designed as a flip chip, while the recording of the receiving device away, its transport, the Applying adhesive and depositing it on the substrate.

The Adhesive scraper has an ejection element for firing at least one drop of glue from bottom to top on the bottom of the component.

alternative or additionally For example, the adhesive applicator may be used with one with the adhesive soaked Ink pad be fitted to the bottom of the chip its surface for transmission to press the adhesive.

Further advantageous embodiments emerge from the dependent claims.

advantages and expediencies are the following description in conjunction with the drawings refer to. Hereby show:

1 in a first schematic representation of the structure of a process implementing device according to a first embodiment of the invention, and

2 in a schematic representation of the structure of a process implementing device according to a second embodiment of the invention.

In 1 is shown in a schematic representation of an apparatus according to a first embodiment of the invention, as it can be used to carry out the method according to the invention.

On a substrate belt conveyor element 1 is a substrate tape 2 arranged, in which or on which a plurality of successively and / or juxtaposed substrates 3 are arranged. The substrates 3 may be provided with an antenna and may have a cavity for receiving a chip.

The substrate tape 2 is moved into the image plane or out of the image plane continuously or discontinuously.

Each individual substrate has a laying surface 3a , which may be formed as a cavity, to receive a chip therein.

In a schematically illustrated component composite 4 , which may be formed as a wafer, for example, are a plurality of individual components in the form of, for example, flip chips 5 arranged. These flip chips are by means of a recording device 6 - 9 , which can act as a so-called pinball, added. For this purpose, the pinball is a horizontally extending pivot axis 7 that are within a central element 6 is arranged, pivoted so as by means of rod elements 8th and 9 , to which vacuum pipettes not shown here are arranged, individual chips 5 from the chip composite 4 and to another vacuum pipette 11 leading to a transport device 11 . 12 and 13 belongs to pass.

During one of the chips 5 from the composite through the arm 8th is added, another chip 10 , which has already been picked up by the pinball machine, to the vacuum pipette 11 , which underside one or more openings 13 for charging the chip 10 with vacuum, pass.

Subsequently, a transport of the vacuum pipette takes place 11 by a displacement process along a transport rail 12 to the next station, namely an adhesive application station 15 . 16 , instead, as indicated by the arrow 14 is pictured.

In the adhesive applicator 15 . 16 is by means of an ejection element 16 a single drop of glue 17 shot from the bottom up at a time when the vacuum pipette 11 with the chip hanging from it 10 at the adhesive applicator 15 . 16 passes by. For this purpose, the rail-like transport device can be briefly braked or stopped to ensure accurate positioning of the drop of adhesive on the underside of the chip 10 to enable. In addition, another measuring device 22 . 23 as they are in 2 is shown, to detect the chip a first time in its orientation.

Subsequently, takes place in a measuring device 18 . 19 representing the next station, a measurement of the orientation of the chip 10 who continues on the vacuum pipette 11 bottom, instead, if necessary, a correction of this orientation of the chip, for example by twisting the pipette 11 , perform, so that accurate and clean filing of the chip 10 on the storage area 3a of the substrate 3 in another station section is possible.

In 2 is shown in a schematic representation of the apparatus for carrying out the erfindungemäßen method according to a second embodiment of the invention. Identical and equivalent components are provided with the same reference numerals.

In the 2 in a schematic representation reproduced device differs from the in 1 reproduced device in that the adhesive applicator is designed differently and another measuring device 22 . 23 is arranged.

The Kelbstoffauftrageeinrichtung 20 . 21 does not shoot drops of glue from bottom to top on the bottom of the chip 10 , but has a stamp pad on top 21 on, which is soaked with adhesive.

Such an ink pad 21 serves the bottom of the chip 10 to press on it and thereby a uniform distribution of the adhesive on the underside of the chip 10 in dosed quantity. For this purpose, either the adhesive applicator 20 . 21 or the inkpad 21 be traced for yourself if currently a chip 10 is positioned over it, or the vacuum pipette 11 with the attached chip 10 briefly be driven down.

The measuring device 22 . 23 for optical measurement, for example by means of a camera, the orientation of the chip 10 holding the vacuum pipette 11 adheres, serves to capture the chip a first time in its orientation or optionally by a post-correction, for example by twisting the pipette 11 to align their longitudinal axis correctly. The measuring device 22 . 23 compares the aligned data with the orientation of the adhesive applicator 20 . 21 and optionally with the orientation of the laying surface 3a of the substrate.

The measuring device 22 . 23 is in front of the adhesive applicator 20 . 21 arranged. The further measuring device 18 . 19 On the other hand, it is arranged after the adhesive application device and provides a further measurement and, if appropriate, correction of the orientation of the chip 10 for sure. It may alternatively only the measuring device 18 . 19 without the measuring device 22 . 23 be arranged.

All Features disclosed in the application documents are considered to be essential to the invention as long as they are individually or in combination with respect to State of the art are new.

1

Substrate tape transport element

2

substrate strip

3

substratum

3a

laying surface

4

component composite

5

crisps

6 8, 9

pinball

7

swivel axis the flipper

10

chip

11

vacuum pipette

12

transport rail

13

outlet the vacuum pipette

14

transport direction

15 16, 20, 21

adhesive applicator

17

drop of glue

18 19, 22, 23

measuring equipment

Claims (6)

Method for the serial application and mounting of flip chips ( 5 . 10 ), in particular RFID chips, on substrates ( 3 ), in particular antenna-containing substrates, with the following steps: receiving at least one of the flip chips ( 5 . 10 ) from a component composite ( 4 ) by means of a receiving device ( 6 - 9 ); Transferring the flip chip ( 10 ) from the receiving device ( 6 - 9 ) to a displaceable transport device ( 11 - 13 ); - applying an adhesive ( 17 ) on an underside of the transport device ( 11 - 13 ) attached flip chip ( 10 ) by means of a stationary adhesive application device ( 15 . 16 ; 20 . 21 ); Measuring an orientation of the flip chip ( 10 ) in relation to the orientation of one on the substrate ( 3 ) arranged deposition surface ( 3a ) for storing the flip chip ( 10 ) by means of a measuring device ( 18 . 19 ), and - dropping the flip chip ( 10 ) on the laying surface ( 3a ) of the substrate ( 3 ) by means of the transport device ( 11 - 13 ), characterized in that the stationary adhesive application device ( 15 . 16 ) the viscous adhesive formed dropwise as a single drop of adhesive ( 17 ) on the underside of the flip chip ( 10 ) shoots and / or the stationary adhesive application device ( 20 . 21 ) an ink pad impregnated with the adhesive ( 21 ) includes. Method according to claim 1, characterized in that the underside of the flip chip ( 10 ) into the adhesive application device ( 15 . 16 ; 20 . 21 ), which acts as an upwardly opened container with adhesive ( 17 ) is immersed. Method according to one of claims 1 or 2, characterized in that between the step of transmitting the flip chip ( 10 ) and the step of applying the adhesive ( 17 ) the orientation of the flip chip ( 10 ) in relation to the orientation of the adhesive applicator ( 20 . 21 ) is measured. Method according to one of the preceding claims, characterized in that the receiving device ( 6 - 9 ) is rotated about a pivot axis to the flip chip ( 10 ) in the inverted state of the transport device ( 11 - 13 ) to hand over. Device for the standard application and mounting of flip chips ( 5 . 10 ), in particular RFID chips, on substrates ( 3 ), in particular antennas having substrates, with - a receiving device ( 6 - 9 ) for receiving at least one flip chip ( 5 . 10 ) from a component composite ( 4 ) and for turning the flip chip ( 10 ) in an inverted state by means of vacuum application and for transporting the electronic component ( 10 ) from the receiving device ( 6 - 9 ) to an adhesive applicator ( 15 . 16 ; 20 . 21 ); - one below the transport device ( 11 - 13 ) adhesive application device ( 15 . 16 ; 20 . 21 ) for applying adhesive ( 17 ) on the bottom side of the flip chip ( 10 ); A measuring device ( 18 . 19 ) for optically measuring an orientation of the ( 10 ) in relation to the orientation of one on the substrate ( 3 ) arranged deposition surface ( 3a ) for storing the flip chip ( 10 ), and - a subsequent depositing position of the transport device ( 11 - 13 ) in which the transporting flip-chip ( 10 ) on the laying surface ( 3a ) of the substrate ( 3 ), characterized in that the adhesive application device ( 15 . 16 ) an ejection element ( 16 ) for shooting at least a single, viscous viscous adhesive drop from bottom to top on the underside of the flip chip ( 10 ) or the Klebstoffautrageeinrichtung ( 20 . 21 ) an adhesive pad ( 21 ) to the bottom of the flip chip ( 10 ) on it. Apparatus according to claim 5, characterized in that the transport device ( 11 - 13 ) a displaceable vacuum-loaded pipette ( 11 . 13 ) for sucking the flip chip ( 10 ) during its picking up, transporting and depositing it on the substrate ( 3 ) having.