SG11201808547UA - Transfer system for flipping and multiple checking of electronic devices - Google Patents

Transfer system for flipping and multiple checking of electronic devices

Info

Publication number
SG11201808547UA
SG11201808547UA SG11201808547UA SG11201808547UA SG11201808547UA SG 11201808547U A SG11201808547U A SG 11201808547UA SG 11201808547U A SG11201808547U A SG 11201808547UA SG 11201808547U A SG11201808547U A SG 11201808547UA SG 11201808547U A SG11201808547U A SG 11201808547UA
Authority
SG
Singapore
Prior art keywords
electronic devices
international
flipping
singapore
transfer system
Prior art date
Application number
SG11201808547UA
Inventor
Siong Huat Neo
Kim Mone Kwong
Kok Yeow Lim
Zhi Qiang Mao
Original Assignee
Mit Semiconductor Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mit Semiconductor Pte Ltd filed Critical Mit Semiconductor Pte Ltd
Publication of SG11201808547UA publication Critical patent/SG11201808547UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
    • B65G47/846—Star-shaped wheels or wheels equipped with article-engaging elements
    • B65G47/848—Star-shaped wheels or wheels equipped with article-engaging elements the article-engaging elements being suction or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)

Abstract

FIG70 50 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 02 November 2017 (02.11.2017) WIP0 I PCT omit VIII Hot 0 HE Eno iflo oimIE (10) International Publication Number WO 2017/188889 Al (51) International Patent Classification: HO1L 21/67 (2006.01) B65G 47/84 (2006.01) (21) International Application Number: PCT/SG2016/050196 (22) International Filing Date: 27 April 2016 (27.04.2016) (25) Filing Language: English (26) Publication Language: English (71) Applicant: MANUFACTURING INTEGRATION TECHNOLOGY LTD [SG/SG]; Blk 5004, Ang Mo Kio Ave 5, #03-12, TECHplace II, Singapore 569872 (SG). (72) Inventors: NEO, Siong Huat; 64C Eng Neo Avenue, Sin- gapore 289544 (SG). KWONG, Kim Mone; 227 Ponggol 17th Avenue, Northshore Bungalows, Singapore 829694 (SG). LIM, Kok Yeow; 130 Hillview Avenue, #08-01, Sin- gapore 669596 (SG). MAO, Zhi Qiang; Blk 511 Jurong West Street 52, #08-70, Singapore 640511 (SG). (74) Agent: NG, Kim Tean; NANYANG LAW LLC, P.O. Box 1861, Robinson Road Post Office, Singapore 903711 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (54) Title: TRANSFER SYSTEM FOR FLIPPING AND MULTIPLE CHECKING OF ELECTRONIC DEVICES (57) : The present invention includes a transfer system for flipping and checking electronic devices. A first rotary device has a plurality of transfer heads configured to pick electronic devices from a wafer table and place the electronic devices on a transfer head of a second rotary device. Check stations can be positioned around the first and second rotary devices and configured to inspect or check the electronic devices during the flipping process. The transfer system can further include an imaging device to inspect the accuracy of picking and placing of the electronic devices during the flipping process. The wafer table and the first rotary device are inclined to increase the operation space. The system accurately picks, flips and transfers chips at a high operation speed. [Continued on next page] WO 2017/188889 Al MIDEDIMOMOIDEIROIDEMOMMUMMEHOMEMOIMIE GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3))
SG11201808547UA 2016-04-27 2016-04-27 Transfer system for flipping and multiple checking of electronic devices SG11201808547UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2016/050196 WO2017188889A1 (en) 2016-04-27 2016-04-27 Transfer system for flipping and multiple checking of electronic devices

Publications (1)

Publication Number Publication Date
SG11201808547UA true SG11201808547UA (en) 2018-11-29

Family

ID=60159912

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808547UA SG11201808547UA (en) 2016-04-27 2016-04-27 Transfer system for flipping and multiple checking of electronic devices

Country Status (8)

Country Link
US (1) US10699923B2 (en)
KR (1) KR102276620B1 (en)
CN (1) CN109075104B (en)
MY (1) MY191024A (en)
PH (1) PH12018502212A1 (en)
SG (1) SG11201808547UA (en)
TW (1) TWI716570B (en)
WO (1) WO2017188889A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6698212B2 (en) * 2017-03-09 2020-05-27 株式会社Ｆｕｊｉ Parts mounting machine
US10748794B1 (en) * 2019-07-09 2020-08-18 Asm Technology Singapore Pte Ltd Apparatus for transferring electronic devices
CN113003216B (en) * 2021-03-14 2023-02-03 苏州希派智能科技有限公司 Product transfer equipment based on sucking disc
CN118077043A (en) * 2021-09-10 2024-05-24 砺铸智能设备(天津)有限公司 System and method for sorting dies from a wafer using an angled wafer table and an angled turret
US11622485B1 (en) * 2021-09-22 2023-04-04 Asmpt Singapore Pte. Ltd. Flexural pick arm for a pick and place apparatus
CN113921450B (en) * 2021-10-13 2024-01-12 深圳市哈德胜精密科技股份有限公司 Chip sucking method and double-suction-head chip sucking device
CN116544151B (en) * 2023-07-05 2023-09-19 砺铸智能设备(天津)有限公司 Detection and packaging equipment for chip

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JPH06167536A (en) * 1992-11-27 1994-06-14 Oki Electric Ind Co Ltd Ic heat treatment method of ic handler and ic handler
JP3446598B2 (en) 1998-03-23 2003-09-16 株式会社村田製作所 Chip part transfer equipment
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
JP4241439B2 (en) * 2003-06-18 2009-03-18 株式会社村田製作所 Chip-type electronic component handling equipment
JP4849661B2 (en) * 2005-03-30 2012-01-11 上野精機株式会社 Electronic component processing equipment
CH698718B1 (en) 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag A device for mounting a flip chip on a substrate.
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
JP5509645B2 (en) * 2009-03-25 2014-06-04 富士ゼロックス株式会社 Position / posture recognition method, component gripping method, component placement method, component assembly method, position / posture recognition device, component gripping device, component placement device, and component assembly device
CN102556604B (en) * 2011-11-21 2014-06-25 杭州长川科技有限公司 Integrated circuit turnover feeding device for test packaging
JP2012186505A (en) * 2012-06-18 2012-09-27 Murata Mfg Co Ltd Component supply device
US8967368B2 (en) * 2012-10-12 2015-03-03 Asm Technology Singapore Pte Ltd Apparatus for processing electronic devices
CN103975425B (en) * 2012-12-04 2017-11-14 上野精机株式会社 Die Bonder device
CN103199024B (en) * 2012-12-31 2016-06-01 深圳市华鑫精工机械技术有限公司 The manufacture method of a kind of double-interface card and production equipment
US9218995B2 (en) * 2013-05-06 2015-12-22 Asm Technology Singapore Pte Ltd Transfer apparatus for transferring electronic devices and changing their orientations
CN103367208B (en) * 2013-07-02 2015-10-28 华中科技大学 A kind of back bonding platform for superchip

Also Published As

Publication number Publication date
US10699923B2 (en) 2020-06-30
KR20180134934A (en) 2018-12-19
KR102276620B1 (en) 2021-07-13
US20190139795A1 (en) 2019-05-09
MY191024A (en) 2022-05-29
PH12018502212A1 (en) 2019-10-21
CN109075104B (en) 2022-03-18
WO2017188889A1 (en) 2017-11-02
TWI716570B (en) 2021-01-21
CN109075104A (en) 2018-12-21
TW201810489A (en) 2018-03-16

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