SG11201908188SA - Reduced footprint platform architecture with linear vacuum transfer module - Google Patents

Reduced footprint platform architecture with linear vacuum transfer module

Info

Publication number
SG11201908188SA
SG11201908188SA SG11201908188SA SG11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA
Authority
SG
Singapore
Prior art keywords
transfer module
international
atv
transfer
california
Prior art date
Application number
Inventor
Richard H Gould
Richard Blank
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG11201908188SA publication Critical patent/SG11201908188SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Prostheses (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)

Abstract

208 ▪ 224 • 212 204 216. 220 FIG. 2A W O 20 18/ 17 0 10 4 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 20 September 2018 (20.09.2018) WIP0 I PCT o mons °nolo it oloim mrnom oimIE (10) International Publication Number WO 2018/170104 Al (51) International Patent Classification: HO1L 21/677 (2006.01) HO1L 21/67 (2006.01) (21) International Application Number: PCT/US2018/022397 (22) International Filing Date: 14 March 2018 (14.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/471,478 15 March 2017 (15.03.2017) US (71) Applicant: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, California 94538 (US). (72) Inventors: GOULD, Richard H.; 4367 Torres Ave., Fre- mont, California 94536 (US). BLANK, Richard; 5033 Paseo Olivos, San Jose, California 95130 (US). (74) Agent: AQUINO, Damian M. et al.; Harness, Dickey & Published: Pierce, P.L.C., P.O. Box 828, Bloomfield Hills, Michigan 48303 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) — with international search report (Art. 21(3)) (54) Title: REDUCED FOOTPRINT PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE (57) : An atmosphere-to-vacuum (ATV) transfer module for a substrate pro- 200-1 236 cessing tool includes a first side configured to interface with at least one loading sta- tion, a transfer robot assembly arranged within the ATV transfer module, and a sec- ond side opposite the first side. The transfer robot assembly is configured to transfer 240 substrates between the at least one loading station and at least one load lock arranged 232 between the ATV transfer module and a vacuum transfer module (VTM). The second side is configured to interface with the at least one load lock. The transfer robot as- sembly is arranged adjacent to the second side, and the at least one load lock extends through the second side into an interior volume of the ATV transfer module.
SG11201908188S 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module SG11201908188SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
PCT/US2018/022397 WO2018170104A1 (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Publications (1)

Publication Number Publication Date
SG11201908188SA true SG11201908188SA (en) 2019-10-30

Family

ID=63523643

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201908188S SG11201908188SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module
SG10202110040S SG10202110040SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202110040S SG10202110040SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Country Status (8)

Country Link
US (3) US11521869B2 (en)
EP (1) EP3596752A4 (en)
JP (2) JP7275039B2 (en)
KR (2) KR20230131969A (en)
CN (1) CN110447095B (en)
SG (2) SG11201908188SA (en)
TW (2) TWI765984B (en)
WO (1) WO2018170104A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11164769B2 (en) * 2019-07-30 2021-11-02 Brooks Automation, Inc. Robot embedded vision apparatus
CN111081619B (en) * 2019-12-27 2022-11-25 上海至纯洁净系统科技股份有限公司 Wafer transmission device and method
JP2023520600A (en) * 2020-04-06 2023-05-17 ラム リサーチ コーポレーション Sliding and pivoting assemblies for process module bias assemblies in substrate processing systems
CN113644005A (en) * 2020-05-11 2021-11-12 中微半导体设备(上海)股份有限公司 Semiconductor processing system
JP2024518235A (en) * 2021-04-28 2024-05-01 ラム リサーチ コーポレーション Semiconductor Tool Configuration
JP2023070364A (en) 2021-11-09 2023-05-19 東京エレクトロン株式会社 Substrate processing system
WO2023086848A1 (en) * 2021-11-11 2023-05-19 Lam Research Corporation Nesting atmospheric robot arms for high throughput
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789890A (en) * 1996-03-22 1998-08-04 Genmark Automation Robot having multiple degrees of freedom
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
US6050891A (en) * 1998-02-06 2000-04-18 Applied Materials, Inc. Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
JP4558981B2 (en) 2000-11-14 2010-10-06 株式会社ダイヘン Transfer robot
EP1535313B1 (en) 2002-07-22 2018-10-31 Brooks Automation, Inc. Substrate processing apparatus
JP4283559B2 (en) 2003-02-24 2009-06-24 東京エレクトロン株式会社 Conveying apparatus, vacuum processing apparatus, and atmospheric pressure conveying apparatus
US7905960B2 (en) * 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
US7246985B2 (en) * 2004-04-16 2007-07-24 Axcelis Technologies, Inc. Work-piece processing system
JP4907077B2 (en) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ Wafer processing apparatus, wafer processing method, and ion implantation apparatus
US20080206036A1 (en) * 2007-02-27 2008-08-28 Smith John M Magnetic media processing tool with storage bays and multi-axis robot arms
JP5006122B2 (en) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
KR101413762B1 (en) * 2007-08-22 2014-07-01 위순임 Substrate processing system
CN101383311B (en) * 2007-09-04 2010-12-08 北京北方微电子基地设备工艺研究中心有限责任公司 Wafer transmission system
JP4473343B2 (en) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 Inline wafer transfer device
KR100998663B1 (en) * 2010-05-24 2010-12-07 지이에스(주) Apparatus for forming vacuum in load-lock chamber
JP5387622B2 (en) * 2011-06-17 2014-01-15 株式会社安川電機 Transfer robot
KR101829397B1 (en) 2011-09-16 2018-02-19 퍼시몬 테크놀로지스 코포레이션 Low variability robot
CN103208447A (en) * 2012-01-13 2013-07-17 诺发系统公司 Dual Arm Vacuum Robot
JP5810929B2 (en) 2012-01-13 2015-11-11 シンフォニアテクノロジー株式会社 Wafer transfer device
TWI629743B (en) 2012-02-10 2018-07-11 布魯克斯自動機械公司 Substrate processing apparatus
US9213565B2 (en) 2013-06-28 2015-12-15 Vmware, Inc. Methods and systems for mining datacenter telemetry data
CN105378907A (en) * 2013-07-24 2016-03-02 应用材料公司 Cobalt substrate processing systems, apparatus, and methods
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
US10777438B2 (en) 2013-10-18 2020-09-15 Brooks Automation, Inc. Processing apparatus
US9299598B2 (en) * 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
US10278501B2 (en) * 2014-04-25 2019-05-07 Applied Materials, Inc. Load lock door assembly, load lock apparatus, electronic device processing systems, and methods
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US10347516B2 (en) 2014-11-11 2019-07-09 Applied Materials, Inc. Substrate transfer chamber
KR102417929B1 (en) * 2015-08-07 2022-07-06 에이에스엠 아이피 홀딩 비.브이. Apparatus for substrate processing
JP6710518B2 (en) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 Conveying device and correction method
JP2018174186A (en) * 2017-03-31 2018-11-08 東京エレクトロン株式会社 Substrate processing apparatus

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Publication number Publication date
US20240194505A1 (en) 2024-06-13
SG10202110040SA (en) 2021-10-28
TWI765984B (en) 2022-06-01
JP2023099172A (en) 2023-07-11
EP3596752A4 (en) 2021-01-06
WO2018170104A1 (en) 2018-09-20
CN110447095A (en) 2019-11-12
CN110447095B (en) 2024-04-26
US11908714B2 (en) 2024-02-20
TWI793000B (en) 2023-02-11
TW201901835A (en) 2019-01-01
JP2020510310A (en) 2020-04-02
TW202232632A (en) 2022-08-16
KR20190120834A (en) 2019-10-24
KR20230131969A (en) 2023-09-14
US11521869B2 (en) 2022-12-06
JP7275039B2 (en) 2023-05-17
EP3596752A1 (en) 2020-01-22
KR102577199B1 (en) 2023-09-08
US20200083071A1 (en) 2020-03-12
US20230062737A1 (en) 2023-03-02

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