SG11201804583YA - Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators - Google Patents

Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators

Info

Publication number
SG11201804583YA
SG11201804583YA SG11201804583YA SG11201804583YA SG11201804583YA SG 11201804583Y A SG11201804583Y A SG 11201804583YA SG 11201804583Y A SG11201804583Y A SG 11201804583YA SG 11201804583Y A SG11201804583Y A SG 11201804583YA SG 11201804583Y A SG11201804583Y A SG 11201804583YA
Authority
SG
Singapore
Prior art keywords
press
international
electronic components
drive system
encapsulating electronic
Prior art date
Application number
SG11201804583YA
Inventor
Wilhelmus Gerardus Jozef Gal
Henricus Antonius Maria Fierkens
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of SG11201804583YA publication Critical patent/SG11201804583YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/7653—Measuring, controlling or regulating mould clamping forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76083—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76391—Mould clamping, compression of the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Control Of Presses (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Producing Shaped Articles From Materials (AREA)

Abstract

with international search report (Art (3)) (54) Title: PRESS, ACTUATOR SET AND METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH AT LEAST TWO INDIVIDUAL CONTROLLABLE ACTUATORS 27 25 Fig. 2D (57) : The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuat- ors, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the meas - wed values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier. (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau 111111111111111111111111111111111111111111111111111131111111111111111111R111111111111111 (10) International Publication Number WO 2017/111594 Al WIPO I PCT (43) International Publication Date 29 June 2017 (29.06.2017) (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KR KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: (51) International Patent Classification: H01L 23/28 (2006.01) B29C 45/02 (2006.01) H01L 23/31 (2006.01) H01L 21/67 (2006.01) H01L 21/56 (2006.01) H01L 23/00 (2006.01) (21) International Application Number: PCT/NL2016/050911 (22) International Filing Date: 22 December 2016 (22.12.2016) English English (25) Filing Language: (26) Publication Language: (30) Priority Data: 2016011 23 December 2015 (23.12.2015) NL (71) Applicant: BESI NETHERLANDS B.V. [NL/NL]; Ratio 6, 6921 RW Duiven (NL). (72) Inventors: GAL, Wilhelmus Gerardus Jozef; Beekseweg 2, 7031 AX Kilder (NL). FIERKENS, Henricus Antonius Maria; Gildestraat 8, 6915 TR Lobith (NL). (74) Agent: SMEETS, Luc; Patentwerk B.V., P.O. Box 1514, 5200 BN 's-Hertogenbosch (NL). W O 20 17 / 1115 9 4 Al
SG11201804583YA 2015-12-23 2016-12-22 Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators SG11201804583YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2016011A NL2016011B1 (en) 2015-12-23 2015-12-23 Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
PCT/NL2016/050911 WO2017111594A1 (en) 2015-12-23 2016-12-22 Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators

Publications (1)

Publication Number Publication Date
SG11201804583YA true SG11201804583YA (en) 2018-06-28

Family

ID=55532265

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804583YA SG11201804583YA (en) 2015-12-23 2016-12-22 Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators

Country Status (12)

Country Link
US (2) US11217463B2 (en)
JP (1) JP7050679B2 (en)
KR (1) KR102182269B1 (en)
CN (1) CN108431948B (en)
DE (1) DE112016006001B4 (en)
MY (1) MY187163A (en)
NL (1) NL2016011B1 (en)
PH (1) PH12018501307A1 (en)
PT (1) PT2017111594B (en)
SG (1) SG11201804583YA (en)
TW (1) TWI678741B (en)
WO (1) WO2017111594A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2021552B1 (en) * 2018-09-03 2020-04-30 Besi Netherlands Bv Method and device for selective separating electronic components from a frame with electronic components
NL2021845B1 (en) * 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
JP7034891B2 (en) * 2018-11-20 2022-03-14 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
JP7108523B2 (en) * 2018-11-27 2022-07-28 Hoya株式会社 Press molding device, press molding method and press molding program
CN111293091B (en) * 2020-02-07 2022-06-21 复旦大学 Preparation method of biochemical sensing module based on two-dimensional material
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices
NL2025807B1 (en) 2020-06-10 2022-02-16 Besi Netherlands Bv Method and mold for encapsulating electronic components mounted on a carrier
CN113937035B (en) * 2021-10-15 2022-08-26 安徽耐科装备科技股份有限公司 Pressure dynamic compensation plastic packaging press
US12394641B2 (en) 2022-06-02 2025-08-19 Samsung Electronics Co., Ltd. Molding apparatus of semiconductor package

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0615190B2 (en) * 1986-10-20 1994-03-02 三菱重工業株式会社 Injection controller
US4759280A (en) * 1986-12-29 1988-07-26 John T. Hepburn, Limited Hydraulic press with adjustable platen clearance
JPS6457724A (en) * 1987-08-28 1989-03-06 Mitsubishi Electric Corp Resin seal device for semiconductor
JP2551627B2 (en) 1988-04-26 1996-11-06 日本電信電話株式会社 Laser magnetic immunoassay device
JPH02239470A (en) 1989-03-13 1990-09-21 Hitachi Ltd Optical disk device
JPH0976319A (en) * 1995-09-13 1997-03-25 Apic Yamada Kk Resin mold device
US6134507A (en) * 1996-02-06 2000-10-17 Perceptron, Inc. Method and apparatus for calibrating a non-contact gauging sensor with respect to an external coordinate system
JP2752960B2 (en) * 1996-06-27 1998-05-18 山形日本電気株式会社 Resin sealing device
US5817347A (en) * 1996-10-28 1998-10-06 Edge Concepts Corporation Apparatus for thermoset injection molding
JPH10268831A (en) 1997-03-27 1998-10-09 Mitsubishi Electric Corp Power recovery circuit for plasma display panel
JP3757597B2 (en) 1998-01-26 2006-03-22 石川島播磨重工業株式会社 Absorbent slurry flow rate control method and apparatus for flue gas desulfurization apparatus
CN100515720C (en) * 1999-12-16 2009-07-22 第一精工株式会社 Mold device for resin encapsulation
NL1022323C2 (en) * 2003-01-08 2004-07-09 Fico Bv Device and method for encapsulating an electronic component mounted on a carrier with encapsulating material.
JP4607429B2 (en) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 Semiconductor device manufacturing method and semiconductor device
JP2006073586A (en) * 2004-08-31 2006-03-16 Renesas Technology Corp Manufacturing method of semiconductor device
US20060082010A1 (en) * 2004-10-19 2006-04-20 Saggese Stefano M Intelligent molding environment and method of controlling applied clamp tonnage
JPWO2006100765A1 (en) * 2005-03-23 2008-08-28 株式会社ルネサステクノロジ Semiconductor device manufacturing method and compression molding apparatus
JP4778725B2 (en) * 2005-05-09 2011-09-21 アピックヤマダ株式会社 Resin molding equipment
DE102006017116B4 (en) 2006-04-10 2013-11-28 Infineon Technologies Ag Device and method for producing an article by means of molding technique, in particular by means of a transfer molding process
TWI295617B (en) 2006-06-23 2008-04-11 Walton Advanced Eng Inc Vacuum mold chase for transfer molding and its utilizing method
JP5002229B2 (en) 2006-10-04 2012-08-15 アピックヤマダ株式会社 Clamping device
JP4858966B2 (en) 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 Electronic component compression molding method and molding apparatus
JP2008125681A (en) 2006-11-17 2008-06-05 Daiichi Shokai Co Ltd Game machine
US7901196B2 (en) * 2008-03-03 2011-03-08 Asm Technology Singapore Pte Ltd Molding apparatus incorporating pressure uniformity adjustment
NL2001818C2 (en) 2008-07-17 2010-01-19 Fico Bv Method for encapsulating electronic components with a controllable closing force.
NL2003792C2 (en) * 2009-07-17 2011-01-18 Fico Bv METHOD AND DEVICE FOR COATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE
JP5203317B2 (en) 2009-08-06 2013-06-05 住友重機械工業株式会社 Compression molding sealing device
JP5229292B2 (en) 2010-10-01 2013-07-03 第一精工株式会社 Resin sealing device and resin sealing method
JP5468574B2 (en) 2011-06-29 2014-04-09 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
NL2007614C2 (en) * 2011-10-18 2013-04-22 Fico Bv METHOD AND DEVICE FOR COVERING ELECTRONIC COMPONENTS USING A REDUCTION MATERIAL UNDERTAKING A PHASE TRANSITION
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
US9120261B2 (en) * 2012-02-13 2015-09-01 Cameron International Corporation Seal molding sleeve
JP5153023B1 (en) 2012-04-13 2013-02-27 株式会社名機製作所 Compression molding method of resin molded product containing fiber
JP5934138B2 (en) 2013-04-12 2016-06-15 Ｔｏｗａ株式会社 Compressed resin sealing method and compressed resin sealing device for electronic parts
US10020211B2 (en) * 2014-06-12 2018-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer-level molding chase design
US9427893B2 (en) * 2014-09-18 2016-08-30 Asm Technology Singapore Pte Ltd Molding press and a platen for a molding press
CN107073780A (en) * 2014-10-23 2017-08-18 爱尔铃克铃尔股份公司 Method for manufacturing composite material part and composite material part

Also Published As

Publication number Publication date
PT2017111594B (en) 2020-09-28
TWI678741B (en) 2019-12-01
US20220301901A1 (en) 2022-09-22
CN108431948A (en) 2018-08-21
TW201725632A (en) 2017-07-16
CN108431948B (en) 2021-11-12
WO2017111594A1 (en) 2017-06-29
MY187163A (en) 2021-09-06
US20180277404A1 (en) 2018-09-27
NL2016011B1 (en) 2017-07-03
JP7050679B2 (en) 2022-04-08
KR102182269B1 (en) 2020-11-25
US11217463B2 (en) 2022-01-04
PH12018501307A1 (en) 2019-02-11
DE112016006001B4 (en) 2025-06-05
US11842909B2 (en) 2023-12-12
KR20180098545A (en) 2018-09-04
DE112016006001T5 (en) 2018-09-27
JP2019501039A (en) 2019-01-17

Similar Documents

Publication Publication Date Title
SG11201804583YA (en) Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
SG11201809535YA (en) Multi -joint tracking combining embedded sensors and an external
SG11201811358RA (en) Positioning and locking system and method for unmanned vehicles
SG11201811396XA (en) Extreme ultraviolet mask blank with multilayer absorber and method of manufacture
SG11201808924TA (en) Time division multiplexing of synchronization channels
SG11201804185VA (en) Features on a porous membrane
SG11201811251RA (en) Multi-chamber deposition equipment for solid free form fabrication
SG11201909858TA (en) Communication device, communication method, program, and communication system
SG11201804672QA (en) Systems and methods for production of low oxygen content silicon
SG11201901188VA (en) Metal powder feedstocks for additive manufacturing, and system and methods for producing the same
SG11201906630SA (en) Wellhead assembly and method
SG11201901986SA (en) Process for the manufacture of a solid pharmaceutical adminstration form
SG11201805056TA (en) A variable behaviour control mechanism for a motive system
SG11201803918VA (en) Production of steviol glycosides in recombinant hosts
SG11201804997XA (en) Process for preparing non-cariogenic, sustained energy release juice
SG11201809782YA (en) A remotely piloted aircraft system
SG11201805280XA (en) Pallet with extruded composite support blocks and associated methods of making the same
SG11201808982VA (en) Sash for a sliding window or a sliding door and method for providing an untreated metal surface in such a sash
SG11201809356YA (en) Multilayer coating and process of preparing the multilayer coating
SG11201806880QA (en) Communicating with two or more slaves
SG11201908605XA (en) Antifouling article
SG11201809911WA (en) Method for fabricating a strained semiconductor-on-insulator substrate
SG11201903595TA (en) Modular construction system
SG11201806068UA (en) Process for the preparation of an aqueous solution comprising at least one earth alkali hydrogen carbonate
SG11201811646YA (en) Movable hardstop for a robotic component