JPS6457724A - Resin seal device for semiconductor - Google Patents

Resin seal device for semiconductor

Info

Publication number
JPS6457724A
JPS6457724A JP62215587A JP21558787A JPS6457724A JP S6457724 A JPS6457724 A JP S6457724A JP 62215587 A JP62215587 A JP 62215587A JP 21558787 A JP21558787 A JP 21558787A JP S6457724 A JPS6457724 A JP S6457724A
Authority
JP
Japan
Prior art keywords
force
resin
seal device
semiconductor
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62215587A
Other languages
Japanese (ja)
Inventor
Taizo Ejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62215587A priority Critical patent/JPS6457724A/en
Publication of JPS6457724A publication Critical patent/JPS6457724A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/80—Measuring, controlling or regulating of relative position of mould parts

Abstract

PURPOSE:To prevent a resin flash on a lead frame due to the generation of a clearance between a top force and a bottom force by sensing positions at the time of pressing of both top force and bottom force by a position sensor mounted into molds for a semiconductor resin seal device and controlling a pressure cylinder. CONSTITUTION:When a clearance is formed between mold-clamped top force 50 and bottom force 51, difference is shaped only by the distance of H=H2-H1 at distances H1H2 in two detecting sensors 52. A signal is transmitted over solenoid valves 7 by a controller 8 so as to reduce the distance H, and the pressure P1, P2 of mold-clamping cylinders 5 is controlled. After H is made smaller than a certain fixed value, and a resin is injected into a cavity 60 by an injection cylinder and molded.
JP62215587A 1987-08-28 1987-08-28 Resin seal device for semiconductor Pending JPS6457724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62215587A JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62215587A JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Publications (1)

Publication Number Publication Date
JPS6457724A true JPS6457724A (en) 1989-03-06

Family

ID=16674902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62215587A Pending JPS6457724A (en) 1987-08-28 1987-08-28 Resin seal device for semiconductor

Country Status (1)

Country Link
JP (1) JPS6457724A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002083C2 (en) * 1996-01-12 1997-07-15 Fico Bv Device for enclosing electronic components fixed on lead frames in casing
JP2005536044A (en) * 2002-08-13 2005-11-24 オーテーベー、グループ、ベスローテン、フェンノートシャップ Method and apparatus for completely or partially covering at least one electronic component with a compound.
JP2012156149A (en) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd Resin sealing apparatus and method for sealing resin
CN104416846A (en) * 2013-08-21 2015-03-18 恩格尔奥地利有限公司 Method for operating closing unit of forming machine
WO2017111594A1 (en) * 2015-12-23 2017-06-29 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
CN110694322A (en) * 2019-10-17 2020-01-17 李静业 Floor heating pipe filtering device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002083C2 (en) * 1996-01-12 1997-07-15 Fico Bv Device for enclosing electronic components fixed on lead frames in casing
JP2005536044A (en) * 2002-08-13 2005-11-24 オーテーベー、グループ、ベスローテン、フェンノートシャップ Method and apparatus for completely or partially covering at least one electronic component with a compound.
JP2012156149A (en) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd Resin sealing apparatus and method for sealing resin
CN104416846A (en) * 2013-08-21 2015-03-18 恩格尔奥地利有限公司 Method for operating closing unit of forming machine
WO2017111594A1 (en) * 2015-12-23 2017-06-29 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
CN108431948A (en) * 2015-12-23 2018-08-21 贝斯荷兰有限公司 Press, actuator group and the method for electronic component are encapsulated using at least two individual controllable actuators
KR20180098545A (en) * 2015-12-23 2018-09-04 베시 네덜란드 비.브이. A press, an actuator set, and a method for sealing an electronic component using at least two separate controllable actuators
JP2019501039A (en) * 2015-12-23 2019-01-17 ベシ ネーデルランズ ビー．ヴイ．Ｂｅｓｉ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． Press, actuator set and method for sealing electronic components having at least two individually controllable actuators
CN108431948B (en) * 2015-12-23 2021-11-12 贝斯荷兰有限公司 Press, actuator group and method for encapsulating electronic components with at least two individually controllable actuators
US11217463B2 (en) 2015-12-23 2022-01-04 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
US11842909B2 (en) 2015-12-23 2023-12-12 Besi Netherlands B.V. Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
CN110694322A (en) * 2019-10-17 2020-01-17 李静业 Floor heating pipe filtering device

Similar Documents

Publication Publication Date Title
CA1116365A (en) Sensing system and method for plastic injection molding
CA2284560A1 (en) Injection molding system with sequential gate control
ATE295257T1 (en) DISTRIBUTION SYSTEM WITH FLOW CONTROL
ATE163881T1 (en) COMPONENT WITH MOLDED INSERT
CA2013320A1 (en) Gas sealing valve and valve equipped plastic processing installation
GB1460291A (en) Injection moulding machines
JPS6457724A (en) Resin seal device for semiconductor
DE69226701D1 (en) CLOSING FORCE CONTROL
TWI263577B (en) Control method and device of plastic injection machine for reducing difference in weights of moulded products
JPS5916187Y2 (en) Product underfill detection device for injection molds
CA2274850A1 (en) Process for manufacturing injection mouldings
JPH0618738B2 (en) Press molding machine
JPS5525388A (en) Improper mold detector for plastic injection molding machine
JPS5796833A (en) Method of injection-compression molding
JPS63178114U (en)
JPS5584642A (en) Control of plastic injection molding
ATA247187A (en) INJECTION MOLDING MACHINE
JP3310214B2 (en) Mold clamping device and compression molding method using the same
JPS629718Y2 (en)
JPS53120769A (en) Injection control of injection molding machine
JPS56121748A (en) Injection molding method
JPH0418838Y2 (en)
JPS641513A (en) Molding of thick-wall product
JP2808779B2 (en) Resin encapsulation molding machine for semiconductor elements
JPS6416623A (en) Mold for plastic lens