JP5203317B2 - Compression molding sealing device - Google Patents

Description

  The present invention relates to a compression molding sealing device.

  Conventionally, an article to be sealed is sealed with a resin by a first mold and a second mold that is disposed opposite to the first mold and can be brought into contact with and separated from the first mold. A compression type resin sealing device is known. In this type of compression-type resin sealing device, the product to be sealed is clamped by a frame-shaped mold incorporated on the second mold side.

  Since this frame-shaped mold needs to move differently from the main body of the second mold (the portion where the resin is to be compressed), the frame-shaped mold is controlled by the control using the spring and cam mechanism. Is configured to be driven separately.

JP 2008-221544 A (Claim 1, paragraph [0016], FIG. 2, FIG. 3)

  In recent years, the need to further improve the clamping force has increased with the increase in size of the substrate. However, since the conventional technique basically uses the repulsive force of the spring, it is difficult to obtain a large clamping force. That is, as a countermeasure against this, it is difficult to further increase the number of springs because the space in which the springs can be installed is limited to a very narrow space on the opposite surface of the frame-shaped mold. Increasing the constant is also difficult due to limitations on material properties and manufacturing costs.

  In addition, the mechanism that drives the frame mold using a spring and cam mechanism has a complicated structure due to the use of expensive parts such as cams and servo motors that require high precision and the increased number of parts. As a result, the manufacturing cost tends to increase.

  An object of the present invention is to improve the clamping force of a frame-shaped mold and prevent resin leakage with a low-cost and simple configuration.

  The present invention provides a resin to be encapsulated by a first mold and a second mold that is disposed opposite to the first mold and can be brought into contact with and separated from the first mold. In a compression-type resin sealing device for sealing, a frame-shaped mold that is provided on one or both of the first mold and the second mold and can hold the end of the sealed product A movable platen that installs the second mold and moves the second mold toward the opposing first mold, and the movable platen provided on either the first or second mold side. A reaction force generating mechanism that generates a reaction force against the thrust of the first and second opposing the frame-shaped mold using the thrust of the movable platen and the reaction force generated by the reaction force generating mechanism. The said subject was solved by setting it as the structure provided with the moving force provision mechanism which provides the moving force moved to the metal mold | die side.

  In the present invention, the thrust of the movable platen is basically used as a drive source for the frame-shaped mold. In order to enable independent movement of the movable platen and the frame-shaped mold, reaction force generating means for generating a reaction force against the thrust of the movable platen is provided, and the thrust of the movable platen or the reaction force is provided. Is input to the moving force applying mechanism and transmitted and used as a thrust (moving force) for clamping the frame-shaped mold. That is, since the thrust of the movable platen that is sufficiently larger than the thrust by the spring or the reaction force thereof can be used as the clamping force (moving force) of the frame-shaped mold, the clamping force can be greatly improved. As a result, it is possible to prevent resin leakage caused by insufficient clamping force of the substrate.

  Moreover, since the moving force is transmitted to the frame-shaped mold by the function of the two mechanisms of the reaction force generating mechanism and the moving force applying mechanism, the setting of the thrust (moving force) and these The degree of freedom of installation of this mechanism is large, and as a result, the thrust (moving force) of the frame-shaped mold can be appropriately given according to the type and size of the molded product.

  According to the present invention, the clamping force of the frame-shaped mold can be improved and the resin leakage can be prevented with a low-cost and simple configuration.

Front sectional view of a resin sealing device according to an example of an embodiment of the present invention Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment The conceptual diagram of the compression molding sealing device concerning an example of embodiment of this invention Front sectional view of a resin sealing device according to an example of another embodiment of the present invention

  Hereinafter, the configuration of the resin sealing device J1 according to an example of the embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a conceptual diagram of a resin sealing device J1 according to an example of an embodiment of the present invention.

  The resin sealing device J1 according to the present embodiment includes an upper mold (first mold) 100, and a lower mold (second mold) that is disposed to face the upper mold 100 and can be brought into contact with and separated from the upper mold 100. The mold 104 is used to seal the article 104 to be sealed with the resin 106.

  The resin sealing device J1 includes a movable platen 112 that allows the lower mold 102 to move forward and backward with respect to the upper mold 100 by thrust of a link mechanism (not shown). The upper mold 100 includes an upper compression mold (the main body of the upper mold 100) 100A and an upper frame 100B (a frame mold on the upper mold 100 side) disposed outside the upper compression mold 100A. The lower mold 102 includes a lower compression mold (a main body of the lower mold 102) 102A and a lower frame 102B (a frame mold on the lower mold 102 side) disposed outside the lower compression mold 102A. Has been.

  These molds 100 and 102 form a sealed resin sealed space (cavity) 118 by an action described later, and for example, a sealed product 104 such as a package base is sealed with a resin 106 such as a thermosetting resin. Stop.

  1 and 9, this resin sealing device J1 is provided on the upper mold 100 side, and includes a reaction force generation mechanism P1 that generates a reaction force (force) F2 with respect to the thrust F0 of the movable platen 112, and a movable A moving force applying mechanism M1 that applies a moving force F2 ′ that moves the lower frame 102B to the opposite upper mold 100 side by using the thrust F0 of the platen 112 and the reaction force F2 generated by the reaction force generating mechanism P1. I have.

  The reaction force generation mechanism P1 includes a pneumatic cylinder 124. A piston rod 128 is fitted inside the casing 126 of the pneumatic cylinder 124, and a piston 130 is fixed to one end of the piston rod 128. On the other hand, a resting seat 134 is fixed to the other end. A lower limit position of the lower side (lower side in FIG. 2) of the seat 134 is constrained by a stopper 136. A third spring 132 is attached between the abutment 134 and the casing 126.

  Reference numeral 138 denotes an air supply source that supplies air to be compressed. Reference numeral 140 is an electromagnetic valve for adjusting the air flow rate, and reference numerals 142 and 144 are pressure control valves for adjusting the air pressure. Further, the pneumatic cylinders 124 arranged on both sides on the upper mold 100 side have intake / exhaust ports (not shown) in one place so that the supply / exhaust pressure of each pneumatic cylinder 124 is the same.

  The moving force applying mechanism M1 includes a lever (arm portion) 146. The lever 146 extends to both sides so as to be rotatable about a support point 148 p in a support portion 148 disposed on the movable platen 112. A reaction force F2 from the reaction force generation mechanism P1 is applied to the outer end 146Ot (one side of the arm) of the lever 146 with the support point 148p as a boundary, and the inner end 146In (the other side of the arm). ), The moving force F2 ′ is output to the upper mold 100 side.

  The angle between the horizontal plane Ho and the inner end 146In is θ1, the angle between the horizontal plane Ho and the outer end 146Ot is θ2, and the actual length from the support point 148p to the position where the moving force F2 ′ is input is La, Assuming that the actual length from the point 148p to the position where the reaction force F2 is input is Lb, the horizontal distance (arm length) from the support point 148p to the position where the moving force F2 ′ is output is L1 (= La Cos θ1), and the horizontal distance (arm length) from the support point 148p to the position where the reaction force F2 is input is L2 (= Lb · cos θ2). The angle between the outer end portion 146Ot and the inner end portion 146In with the support point 148p as the center is α. As is apparent from FIG. 1, α is smaller than 180 degrees (α <180 °).

  The inner end 146In of the lever 146 is abutted against the opposite abutting surface 102Bu of the lower frame 102B, and the outer end 146Ot is abutted against the abutment 134 of the pneumatic cylinder 124. Further, rollers 152 and 154 are attached to both ends 146In and 146Ot of the lever 146, so that the thrust is smoothly transmitted from the lower frame 102B to the abutment 134 via the lever 146, and the abutment 134 by the abutment of the lever 146, The lower frame 102B is prevented from being damaged.

  A first spring (elastic body) 120 that urges the upper frame 100B toward the lower mold 102 is attached to the opposite surface 100Bu of the upper frame 100B (pressing force: F3). In addition, a second spring 122 that urges the lower frame 102B toward the lower mold 102 is attached to the opposite contact surface 102Bu of the lower frame 102B (tensile force: F1). The spring constant of the second spring 122 is set to be larger than the spring constant of the first spring 120, and the tensile force F1 of the second spring 122 is set to be smaller than the reaction force F2 output from the pneumatic cylinder 124 side. (F2> F1).

  In the state where the lever 146 does not act, the pulling force F1 of the second spring 122 and the lower limit stopper 170 make the abutting surfaces 102At and 102Bt of the lower mold compression mold 102A and the lower frame 102B flush with each other. A release film (not shown) is stretched without wrinkles over the entire surface of a resin sealing space 118 described later.

  Reference numeral 172A denotes an O-ring attached between the upper mold 100A and the upper frame 100B. Similarly, reference numeral 172B denotes an abutting surface 100Bt of the upper frame 100B, and reference numeral 172C denotes an O-ring attached between the lower mold compression mold 102A and the lower frame 102B.

  The reaction force generation mechanism P1 has a reaction force adjustment function for adjusting the magnitude of the reaction force F2 (force) generated toward the lower mold 102 side. More specifically, the reaction force F2 generated can be adjusted by changing the pressure p1 inside the pneumatic cylinder 124. Even if the pressing force F3 of the first spring 120 and the tensile force F1 of the second spring 122 change with the distance between the upper mold 100 and the lower mold 102 by this reaction force adjusting function, the reaction force generating mechanism P1. A pressurizing force is applied to keep the substrate clamping force F4 of the reaction force F2 generated in step 1 constant (described later).

  Next, the operation of the resin sealing device J1 will be described.

  The process of the shaping | molding operation | movement of the resin sealing apparatus J1 concerning an example of embodiment is shown in FIGS. Please refer to FIG. 9 for the mechanical relationship.

  First, as shown in FIG. 2, the ceramic substrate (sealed product) 104 on which the semiconductor chip is mounted is adsorbed and held by the upper compression mold 100A, and the sealing resin 106 is attached to the lower compression mold 102A. throw into.

  Next, as shown in FIG. 3, the movable platen 112 is raised by a thrust F0 of a link mechanism (not shown), and the roller 152 attached to the outer end 146Ot of the lever 146 provided in the moving force applying mechanism M1 is fixed. It touches against the platen 110 side seat 134.

  From the reaction force generation mechanism P1, the reaction force of the thrust F0 is variably output to the roller 152 as the reaction force F2 of the reaction force generation mechanism P1. That is, with the support point 148p of the lever 146 as a boundary, the reaction force F2 from the reaction force generation mechanism P1 is applied to the outer end portion 146Ot of the lever 146 and moves to the upper mold 100A side via the inner end portion 146In. A force (push-up force) F2 ′ is output, and the lower frame 102B can be clamped. That is, the reaction force F2 is used as a moving force F2 ′ of the lower frame 102B for clamping the lower frame 102B.

  Hereinafter, it demonstrates in detail using the conceptual diagram of the resin sealing apparatus J1 shown in FIG.

  From the pneumatic cylinder 124, a force F2 shown in Expression (1) obtained by multiplying the pressure p in the pneumatic cylinder 124 and the cross-sectional area S of the piston 130 is output.

    F2 = p × S (1)

  On the other hand, the moving force F2 ′ of the lower frame 102B due to the reaction force F2 is expressed by equations (2) and (3) from the balance of lever principle and moment force, where K is a lever ratio (where K ≧ 1). The pushing force F2 ′ is output from the inner end 146In of the lever 146.

F2 ′ = F2 × K (2)
K = (Lb / La) × (cos θ2 / cos θ1) (3)

  Therefore, the substrate clamping force F4 is expressed by the formula (4).

    F4 = F2 × K− (F1 + F3) (4)

  That is, by using the lever principle for the lever 146, the reaction force F2 output from the pneumatic cylinder 124 is amplified even if the pneumatic cylinder 124 has a small capacity, and the substrate clamping force of the upper frame 100B and the lower frame 102B is amplified. F4 can be increased.

  Even when the movable platen 112 is raised by the thrust F0, when the substrate clamping force F4 is greater than or balanced with the drag R1 generated in the ceramic substrate 104 when the lower frame 102B clamps the ceramic substrate 104 ( F4 ≧ R1), the position of the abutment 134 connected to the pneumatic cylinder 124 does not change, and the substrate clamping force F4 is expressed by the above-described equation (4).

  However, when the movable platen 112 further rises and the drag force R1 from the substrate exceeds the substrate clamping force F4, the force is transmitted from the lever 146 to the pneumatic cylinder 124 side, and the pneumatic cylinder 124 is compressed and applied. The position of the seat 134 rises, and the pressure p inside the pneumatic cylinder 124 tends to rise by Δp. For this reason, for example, when the pneumatic cylinder 124 is a closed space as in an embodiment described later, the substrate clamping force F4 increases by K × Δp × S as the pressure Δp increases, The seat 134 stops at a position where the drag force R1 from the ceramic substrate 104 and the substrate clamping force F4 are balanced (this control method will be described in detail later).

  However, in this embodiment, the pressure p inside the pneumatic cylinder 124 is controlled by the pressure control by the pressure control valves 142 and 144 so as to maintain the substrate clamping force F4 constant. In order to perform this control specifically, for example, the currently generated substrate clamping force F4 is detected in real time, and the pressure p in the pneumatic cylinder 124 is feedback-controlled so that the same substrate clamping force F4 is always obtained. That's fine. The substrate clamping force F4 does not necessarily need to be detected directly, but can be calculated by detecting other parameters such as drag, pressing force, tensile force, or the angle θ1, θ2 of the lever 146. You may make it ask | require indirectly.

  Further, the substrate clamping force F4 is determined under conditions where various specifications (thrust force F0 of the movable platen 112, spring constants of the springs 120 and 122, arm lengths L1 and L2, etc. of the lever 146) are specified. Basically, the value depends on the “position” of the movable platen 112. Therefore, by obtaining in advance the relationship between the position of the movable platen 112 and the substrate clamping force F4 in the resin sealing device J1, the air pressure The pressure p of the cylinder 124 can also be configured to be feedforward controlled. When this method is adopted, the position of the movable platen 112 is obtained from, for example, the rotation speed information of a motor (not shown) of the link mechanism (obtained originally), and the pressure p is controlled open based on this position information. Therefore, a separate sensor is unnecessary, and the configuration of the control system can be greatly simplified.

  In any case, according to the control according to this embodiment, even if the movable platen 112 is controlled by paying attention to the position of the lower compression mold 102A in order to perform the original sealing control, Regardless of the position of the movable platen 112, the substrate clamping force F4 by the lower frame 102B can always be kept constant.

  In this embodiment, the conditional expression of the thrust F0 of the movable platen 112 is as follows.

  When the downward drag applied to the lever fulcrum 148p when the ceramic substrate 104 is clamped is R3, the downward drag R3 is equal to the resultant force of the drag R1 from the ceramic substrate 104 and the reaction force F2 of the pneumatic cylinder 124.

    R3 = F2 + R1 (5)

  When the movable platen 112 is finally stopped, the drag R1 from the ceramic substrate 104 and the substrate clamping force F4 are balanced (R1 = F4). Therefore, the above equation (4) is substituted into the equation (5), and the equation (6 ) Is obtained.

    R3 = F2 × (1 + K) − (F1 + F3) (6)

  Here, the necessary pressing force F0 of the movable platen 112 needs to be greater than the resultant force of the thrust (force required for forming) Fp applied to the ceramic substrate 104 during compression molding and the force R3 applied to the lever fulcrum. Equation (7) must be established.

    F0 ≧ Fp + R3 (7)

  That is, the conditional expression of the required pressing thrust F0 of the movable platen 112 is expressed by the following expression (8) from the expressions (6) and (7).

    F0 ≧ Fp + F2 × (1 + K) − (F1 + F3) (8)

  In this embodiment, the moving force imparting mechanism M1 has a greater degree of design freedom by freely combining the lengths L1 and L2 from the support point 148p to the ends 146Ot and 146In and the inclination angles θ1 and θ2 of the lever 146. Since it can raise, moving force F2 'can be controlled more flexibly. As a result, the moving force F2 ′ of the lower frame 102B can be appropriately given according to the type and size of the ceramic substrate 104. According to this embodiment, the substrate clamping force F4 can be greatly improved by utilizing the thrust F0 of the movable platen 112 sufficiently larger than the thrust of a general pressing spring as the substrate clamping force F4 of the lower frame 102B. Thereby, it is possible to prevent the resin leakage from the upper and lower frames 100B and 102B to the external space caused by the shortage of the substrate clamping force F4 of the ceramic substrate 104.

  Further, even if the pressing force F3 of the first spring 120, the tensile force F1 of the second spring 122, and the like change with the distance between the upper mold 100 and the lower mold 102, the reaction force generating mechanism P1 Is adjusted so that the substrate clamping force F4 is constant, so that the substrate clamping force F4 is always constant regardless of the position of the movable platen 112, more specifically, the position of the lower compression mold 102A. Can be held in.

  Further, since the rollers 152 and 154 and the abutment seat 134 are in close contact with each other, they are always in close contact with each other, so that horizontal and vertical positional shifts and rattling are prevented and the upper and lower frames 100B and 102B are stably supported. be able to.

  Since the reaction force generating mechanism P1 and the moving force applying mechanism M1 embodied by the pneumatic cylinder 124 and the lever 146 have a simple configuration, the servo motor and cam employed in the structure for driving the lower frame 102B are eliminated. In addition to saving the space of these mechanisms P1 and M1, the number of parts can be reduced, the structure can be simplified, and the manufacturing cost can be reduced.

  Further, since the inclination angles θ1 and θ2 are provided, the length in the horizontal direction from the inner end 146In to the outer end 146Ot of the lever 146 can be suppressed as a result, so that the reaction force generation mechanism P1 and the moving force can be reduced. The applying mechanism M1 can be accommodated in a compact manner.

  The moving force applying mechanism M1 is disposed outside the lower frame 102B, and the reaction force generating mechanism P1 is disposed above the fixed platen 110 and outside the upper frame 100B. That is, since these mechanisms P1 and M1 are independently configured outside the upper mold and the lower mold 100 and 102, assembly and maintenance can be easily performed.

  In this embodiment, by providing the moving force applying mechanism M1 on the lower mold 102 side and the reaction force generating mechanism P1 on the upper mold 100 side, the air supply source 138 and the solenoid valve 140 for driving the reaction force generating mechanism P1. Can be installed in the upper mold 100 side (fixed platen 110 side), more specifically, in a free space above the fixed platen 110, etc., so that the air supply source 138 and the like can be used without using special members or mechanisms. The heat generated between the upper mold 100 and the lower mold 102 when the resin 106 is heated can be easily avoided.

  As shown in FIG. 4, by moving the lower frame 102B to the upper mold 100 side in this way, the upper compression mold 100A in which the lower frame 102B is in contact with the upper frame 100B and the lower compression mold 102A are in the vertical direction. Since the upper frame 100B and the lower frame 102B cover the left-right direction (left-right direction in FIG. 3) in the up-down direction in FIG. 3, a hermetically sealed resin sealing space (cavity) 118 can be formed. . In this state, the resin sealed space 118 is evacuated.

  Thereafter, as shown in FIG. 5, the ceramic substrate 104 is clamped by the upper mold 100 and the lower mold 102 by further moving the lower frame 102 </ b> B to the upper mold 100 side. This action has already been described in detail.

  In this state, as shown in FIG. 6, the movable platen 112 is further raised, the mold clamping by the lower mold 102 proceeds, the resin 106 is heated and compression molded, and the semiconductor chip portion (not shown) on the ceramic substrate 104. ) Is resin-sealed. It has already been described in detail that the substrate clamping force F4 does not change even if the movable platen 112 is further raised.

  As shown in FIG. 7, after the resin 106 is cured to such an extent that it can be taken out from the upper compression mold 100A and the lower compression mold 102A, the pressure p in the pneumatic cylinder 124 is changed without changing the position of the movable platen 112 in the height direction. Is reduced, and the moving force F2 ′ that pushes the pneumatic cylinder 124 toward the lower mold 102 is reduced. As a result, the reaction force F2 applied to the outer end portion 146Ot of the lever 146 is reduced, so that the inner end portion 146In of the lever 146 is pressed against the lower frame 102B as the outer end portion 146Ot of the lever 146 rises. Is lowered, the clamped state of the ceramic substrate 104 can be released, and the inside of the resin sealed space 118 is opened to the atmosphere.

  The second spring 122 that pulls the lower frame 102B toward the lower mold 102 with the tensile force F1 is attached to the anti-butting surface 102Bu of the lower frame 102B, thereby pressing the first spring 120 described above. Since the urging force F1 of the second spring 122 is applied in addition to the force F3, the substrate clamp can be automatically released only by reducing the pressure p inside the pneumatic cylinder 124.

  Finally, as shown in FIG. 8, the vacuum suction of the ceramic substrate 104 is eliminated, the movable platen 112 is moved to the lower mold 102 side, and the press is opened.

  From the above, according to the present embodiment, it is possible to improve the clamping force of the upper and lower frames 100B and 102B and prevent resin leakage with a low-cost and simple configuration.

  Incidentally, in the above embodiment, the pressure p in the pneumatic cylinder 124 is positively controlled so that the substrate clamping force F4 is constant, but the pressure p in the pneumatic cylinder 124 is not controlled, The substrate clamping force F4 can be controlled more easily by simply causing the pneumatic cylinder 124 to function as a damper.

  When this control method is employed, specifically, even if the movable platen 112 is raised, the pressure p in the pneumatic cylinder 124 is not particularly positively controlled. Then, the pressure p tends to increase at the final stage of the rise of the movable platen 112. Assuming that the initial cylinder pressure is p and the pressure increased thereafter is Δp, the substrate clamping force F4p increases by K × Δp × S as described above. This value changes depending on the current position of the movable platen 112 (including the value of the lever ratio K), but is always a “positive” value. Therefore, it is necessary even if the movable platen 112 further rises in order to perform the original compression work by setting the initial cylinder pressure p to a pressure at which the minimum required reference clamping force can be obtained (F4). The substrate clamping force F4p (above) can always be maintained.

  In this embodiment, since the control of the pressure p inside the pneumatic cylinder 124 is not necessary, the control system can be further simplified.

  Next, another embodiment will be described.

  FIG. 10 shows a front sectional view of a resin sealing device J2 according to an example of another embodiment.

  Similarly to the above embodiment, the resin sealing device J2 in the present embodiment also has a reaction force generation mechanism P2 that generates a reaction force (force) against the thrust of the movable platen 212, and a thrust and reaction force generation mechanism P2 of the movable platen 212. And a moving force applying mechanism M2 for applying a moving force for moving the lower frame 202B to the opposite upper mold 200 side using the reaction force generated in the above.

  However, the reaction force generation mechanism P2 in the present embodiment is composed only of the seat 234 and the third spring 232, and is shown as a part of the reaction force generation mechanism (P1) in the above embodiment (see FIG. 1). The conventional pneumatic cylinder (124) is not provided. For this reason, the moving force of the lower frame 202 </ b> B is generated by the spring reaction force of the third spring 232.

  Also in this embodiment, the lever principle is used for the lever 246 to increase the spring reaction force of the third spring 232 and use it as the moving force of the lower frame 202B for clamping the lower frame 202B.

  More specifically, the movable platen 212 is raised, the roller 252 attached to the lever 246 provided in the moving force applying mechanism M2 is applied to the abutment seat 234 on the fixed platen 210 side, and the support point 248p of the lever 246 is defined as a boundary. Thus, the reaction force from the third spring 232 in the reaction force generation mechanism P2 is applied to the outer end portion 246Ot of the lever 246, and a moving force (push-up force) is output to the upper mold 200A side through the inner end portion 246In. The lower frame 202B can be clamped.

  In the present embodiment, since the spring reaction force of the third spring 232 is used as the moving force of the lower frame 202B, the spring constant of the third spring 232 is used to bias the lower frame 202B toward the movable platen 212. It should be sufficiently larger than the spring constant of 222.

  Since the other parts have the same functions as those in the above embodiment, members having the same or similar functions are given the same reference numerals as the resin sealing device J1 in the above embodiment. The duplicated explanation is omitted.

  In the above embodiment, the frame molds are provided on the first and second mold sides, respectively, but may be provided only on the second mold side. Further, the moving force applying mechanism and the reaction force generating mechanism may be provided only on the upper mold side or on both sides of the upper mold and the lower mold side.

  Further, the elastic body provided on the opposite surface of the lower frame may be one that urges the lower frame toward the opposing upper mold side.

  In the above embodiment, a moving mechanism using a link mechanism that can move the lower mold side closer to and away from the upper mold side is provided, so that the moving time of the movable platen can be shortened and the molding cycle can be shortened. However, by providing a linear movement mechanism having a drive source capable of approaching / separating the lower mold side with respect to the upper mold side, and a ball screw rotated by the drive source, a more precise movable platen can be obtained. Movement can be realized.

  In the present embodiment, the reaction force generation mechanism includes a pneumatic cylinder, but may include a hydraulic cylinder instead of the pneumatic cylinder.

  The distance from the support point of the arm portion to the position where the pressure is applied and the distance from the support point to the position where the second pressure is applied can be changed without being limited to this embodiment. Thereby, the force which pushes up a lower frame can be enlarged more by lengthening the length from the support point of a lever to an outer edge part, for example. Conversely, by lowering the length from the support point to the inner end, the lower frame can be more easily pulled down when the clamp is released.

  The angle between one side and the other side of the arm part may be set to 180 degrees (horizontal) with the support point of the arm part as the center.

  Note that, among the components and elements described in the embodiment, even if not particularly described, the dimensions, materials, shapes, and other relative arrangements of the components are not particularly specified, unless otherwise specified. The scope of the present invention is not intended to be limited to that.

J1 ... resin sealing device M1 ... moving force applying mechanism P1 ... reaction force generating mechanism 100 ... upper mold 102 ... lower mold 100B, 102B ... upper frame, lower frame (frame-shaped mold)
104 ... sealed product F0 ... thrust of movable platen F2 ... reaction force F2 '... moving force

Claims (10)

A product to be sealed is sealed with a resin by a first mold and a second mold that is disposed opposite to the first mold and that can contact and separate from the first mold. In the compression type resin sealing device,
A frame-shaped mold that is provided on one or both of the first mold and the second mold side and can hold an end of the sealed product;
A movable platen for installing the second mold and moving the second mold toward the opposing first mold;
A reaction force generating mechanism that is provided on either the first or second mold side and generates a reaction force against the thrust of the movable platen;
Applying a moving force to apply a moving force to move the frame-shaped mold toward the opposing first or second mold using the thrust of the movable platen and the reaction force generated by the reaction force generating mechanism And a mechanism
A compression molding sealing apparatus characterized by the above. In claim 1,
The moving force imparting mechanism includes an arm portion extending on both sides around a support point disposed on the movable platen,
The reaction force from the reaction force generation mechanism is applied to one side of the arm portion with the support point as a boundary, and the first mold side or the second mold side is provided via the other side of the arm portion. The compression molding sealing device, wherein the moving force is output to any one of the above. In claim 2,
The length of the arm from the support point on the one side of the arm part to the position where the reaction force is input, and the arm from the support point on the other side of the arm part to the position where the moving force is output The compression molding sealing device characterized by the fact that the lengths are different. In claim 2,
The compression molding sealing apparatus characterized in that an angle formed by one side and the other side of the arm portion is other than 180 degrees around the support point. In claims 1 to 4,
The compression molding sealing device, wherein the reaction force generation mechanism has a reaction force adjustment function for adjusting the magnitude of the reaction force. In claim 5,
The frame-shaped mold is provided with an elastic body for biasing the frame-shaped mold toward the first mold or the second mold,
Even if the urging force of the elastic body changes with the distance between the first mold and the second mold, the frame-shaped mold is adjusted by adjusting the reaction force generated by the reaction force generation mechanism. The compression molding sealing apparatus, wherein the holding force of the end portion of the article to be sealed is maintained constant. In claim 5 or 6,
The compression molding sealing device, wherein the reaction force generation mechanism includes a hydraulic cylinder or a pneumatic cylinder, and the reaction force is adjusted by changing a pressure inside the hydraulic pressure or the pneumatic cylinder. In any one of Claims 1-7,
The frame-shaped mold and the moving force applying mechanism are provided on the second mold side, and the reaction force generating mechanism is provided on the first mold side. Compression molding sealing device. In any one of Claims 1-8, Furthermore,
A driving source;
A compression molding seal comprising: a moving mechanism having a ball screw mechanism that allows the second mold side to be moved toward and away from the first mold side by a driving force of the driving source. apparatus. In any one of Claims 1-8, Furthermore,
The drive source;
A compression molding seal comprising: a moving mechanism having a link mechanism that allows the second mold side to approach and separate from the first mold side by the driving force of the driving source. Stop device.

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