JP2008283111A - Method and device for resin sealing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compression molding tool which ensures high clamping pressure without enlarging the tool itself. <P>SOLUTION: The resin sealing device has a compression molding tool 100 which consists of a top force and a bottom force 110 which is disposed opposed to the top force and movable to and from the top force. The bottom force 110 has a frame-like tool 106 with a through hole 106A and a compression tool 108 which can move back and forth to the top force side inside the through hole 106A. A spring 112 which energizes and supports the frame-like tool 106 from the compression tool 108 to the top force side is disposed. A brim part 106B which can receive a driving force from an outside of the compression molding tool 100 is formed in the frame-like tool 106, thus energizing the frame-like tool 106 to the top force side via the brim part 106B. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device that compresses and seals a semiconductor chip or the like with a resin.

  Conventionally, a resin sealing device 2 shown in FIG. 4 is known (see Patent Document 1).

  This resin sealing device 2 heat-compresses a resin 8 on a ceramic substrate (molded product) 6 on which a semiconductor chip 4 is mounted, and seals the mounting portion of the semiconductor chip 4 with an upper mold 12. And a lower mold 14 facing the upper mold 12. The upper mold 12 and the lower mold 14 constitute a compression mold. The lower mold 14 includes a frame-shaped mold 16 and a compression mold 18. The upper mold 12 is fixed, and the lower mold 14 is configured to move up and down by the lower mold drive unit 15 (with the frame-shaped mold 16 and the compression mold 18).

  The frame-shaped mold 16 is disposed to face the upper mold 12 and includes a through hole 16A. The compression mold 18 can move forward and backward with respect to the upper mold 12 while being fitted into the through hole 16A. The frame-shaped mold 16 is attached to the compression mold 18 via a spring 20. The spring 20 urges and supports the frame-shaped mold 16 in the direction of the upper mold 12 (upward in FIG. 4). The frame-shaped mold 16 is connected to a lowering drive unit 24 provided outside the lower mold 14 via a hook 22, and resists the biasing force of the spring 20 by driving the lowering drive unit 24. The frame mold 16 can be driven down. The pull-down drive unit 24 is mechanically connected to the compression mold 18 via the structure 25 and can move up and down in accordance with the vertical movement of the compression mold 18.

  In the resin sealing device 2, the operations as shown in FIGS. 5A to 5E are performed. Here, only the molds 12 and 14 in the resin sealing device 2 will be described.

  First, as shown in FIG. 5A, a ceramic substrate (molded product) 6 on which a semiconductor chip 4 is mounted is held on the upper mold 12 by means such as suction or chucking, and then sealed. The resin 8 is put into a molding space 28 formed by the frame-shaped mold 16 and the compression mold 18. Next, as shown in FIG. 5B, the lower die 14, that is, the frame-shaped die 16 and the compression die 18 are driven and raised toward the upper die 12 by the lower die driving unit 15, and the ceramic substrate 6 is moved. The upper mold 12 and the frame-shaped mold 16 are clamped. When the lower mold 14 is further raised in this state, as shown in FIG. 5C, the mold clamping by the compression mold 18 proceeds while the spring 20 is compressed, and the resin 8 is heated and compression molded, so that the semiconductor The portion of the chip 4 is sealed with resin. Thereafter, as shown in FIG. 5D, after the resin 8 has hardened to such an extent that it can be taken out from the molds 12 and 14, the hook 22 (not shown in FIG. 5) is driven to drive the hook 22 (not shown in FIG. 5). The frame-shaped mold 16 is pulled down through (not shown in FIG. 5), and the clamped state with the upper mold 12 is released.

  As shown in FIG. 5 (E), when the entire lower die 14 is further pulled down from the state of FIG. 5 (D), the unsealed portions 6A and 6B of the ceramic substrate 6 become molds (in the case of this embodiment). Is separated from the upper mold 12 and the frame-shaped mold 16), and a state is formed in which only the resin 8 is in contact with a specific mold (in this embodiment, the compression mold 18). Thereafter, the ceramic substrate 6 is taken out, and the next sealing operation is started.

Japanese Patent Laid-Open No. 2005-305951

  In the case of the compression mold described above, the force for clamping the ceramic substrate 6 (the force for clamping by the upper mold 12 and the frame mold 16) is exclusively disposed between the compression mold 18 and the frame mold 16. It relied on the urging force generated by the spring 20 (see FIGS. 5B to 5C).

  When the clamping force is insufficient, the resin 8 overcomes the clamping force and leaks as the resin 8 is compressed, and as a result, there is a problem that a resin burr or the like is generated in the molded product. On the other hand, if the user wants to increase the spring constant of the spring 20 in dislike it, the entire mold needs to be designed large for the sake of space.

  The present invention has been made to solve such problems, and an object thereof is to provide a compression mold that secures a high clamping pressure without increasing the size of the mold itself.

  The present invention includes a compression mold including a first mold and a second mold that is disposed to face the first mold and is capable of coming into contact with and separating from the first mold. The second mold includes a frame-shaped mold having a through hole and a compression mold capable of moving back and forth in the through hole toward the first mold, An elastic body that biases and supports the frame-shaped mold from the compression mold toward the first mold is disposed, and the frame-shaped mold receives a driving force from the outside of the compression mold. The above-described problem is solved by forming a driving force receiving portion capable of supporting the frame-shaped mold toward the first mold through the driving force receiving portion.

  By adopting such a configuration, the “spring” disposed between the frame-shaped mold and the compression mold is left as it is (that is, without increasing the size of the mold itself), and the first of the frame-shaped mold is used. The urging force on the mold side of 1 can be increased. That is, it is possible to increase a clamping force for a substrate (substrate on which a semiconductor chip is mounted: a product to be molded) clamped by the first mold and the frame-shaped mold. As a result, it is possible to prevent the occurrence of resin leakage and burrs due to insufficient clamping force.

  Furthermore, if the frame-shaped mold is configured to be urged to the anti-first mold side via the driving force receiving section, the function of the frame-shaped mold as the “pull-down drive section” is exhibited. Is possible.

  Further, the driving force source of the driving force for urging the frame-shaped mold toward the first mold via the driving force receiving portion is constituted by an elastic body disposed outside the compression molding mold. Then, it is possible to increase the clamping force with a simple configuration. Further, since such an elastic body is arranged outside the mold, for example, when it is desired to change the clamping force, it is possible to cope with it by replacing only the external elastic body, so that it is troublesome to disassemble the mold. No extra work is required.

  In addition, a driving force source of driving force that urges the frame-shaped mold toward the first mold via the driving force receiving portion is configured as an actuator disposed outside the compression mold. Then, the clamping force can be freely changed by adjusting the output of the actuator. That is, it is possible to exert an appropriate clamping force without exchanging a spring or the like according to the type and size of the substrate and the type of resin used.

  In the present invention, the first mold, the frame-shaped mold disposed opposite to the first mold and having a through hole, and the inside of the through hole can be moved forward and backward toward the first mold. A compression mold including a second mold having a compression mold, and an elastic body that supports the frame mold from the compression mold, the frame mold including the compression mold A resin sealing method using a resin sealing device in which a driving force receiving portion capable of receiving a driving force from the outside of a molding die is formed, wherein the first force is obtained by using an elastic force of the elastic body. The step of clamping a substrate on which a semiconductor chip is mounted between the mold and the frame-shaped mold, and the frame-shaped mold using the driving force outside the compression molding mold via the driving force receiving portion It is also possible to grasp as a resin sealing method characterized by including a step of further energizing the first metal mold toward the first mold side.

  By applying the present invention, a high clamping pressure can be secured without increasing the size of the mold itself.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a partial cross-sectional view of a compression mold 100 provided in a resin sealing device according to a first embodiment of the present invention. Here, the upper mold part is omitted, and only the lower mold peripheral part which is the point of the invention is shown.

  The compression molding mold 100 includes an upper mold (first mold: not shown) and a lower mold (second mold) 110 disposed to face the upper mold. The lower mold 110 is arranged on the lower mold platen 116. A press mechanism (not shown) is connected to the lower mold platen 116, and the entire lower mold 110 can be brought into contact with and separated from the upper mold side at a predetermined timing.

  The lower mold 110 includes a frame-shaped mold 106 provided with a through-hole 106A, and a compression mold 108 capable of moving back and forth (reciprocating) in the through-hole vertically (that is, on the upper mold side and the opposite upper mold side). It consists of and. The compression mold 108 includes a fitting portion 108A that fits in the through hole 106A of the frame-shaped mold 106 and a wide portion 108B that is wider than the size of the through hole 106A. The A plurality of springs (elastic bodies) 112 are disposed between the frame-shaped mold 106 and the wide portion 108B, and bias the frame-shaped mold 106 from the compression mold 108 side to the upper mold side. While supporting. Reference numeral 114 denotes a heater.

  Further, the frame-shaped mold 106 is formed with a flange portion (driving force receiving portion) 106B extending in the horizontal direction, and an actuator 122 is connected to the flange portion 106B via a hook 120. The actuator 122 includes a rod 122A and a main body 122B, and the main body 122B is installed and fixed to a lower mold platen 116 that supports the lower mold 110. The actuator 122 can move the rod 122A up and down (that is, on the upper mold side and the opposite upper mold side). As a result, the frame-shaped mold 106 can be lifted to the upper mold side or pulled down to the opposite upper mold side via the hook 120.

  The mold 100 operates as follows.

  First, a substrate (not shown) on which a semiconductor chip or the like is mounted is held on the upper mold by means such as suction or chucking, and then a sealing resin is formed by the frame-shaped mold 106 and the compression mold 108. Into the cavity 140 to be formed. Next, the entire lower mold 110, that is, the frame-shaped mold 106 and the compression mold 108 are driven and raised to the upper mold side by a press mechanism (not shown), and the substrate is clamped by the upper mold and the frame-shaped mold 106. Subsequently, the actuator 122 is operated, and the frame-shaped mold 106 is lifted through the hook 120 and the flange 106B, and is urged toward the upper mold side. When the entire lower mold 110 is further raised in this state, clamping by the compression mold 108 proceeds while the spring 112 is compressed, the resin is heated and compression molded, and the substrate is sealed with the resin.

  As described above, in this embodiment, the frame-shaped mold 106 is provided with the flange portion 106 as a driving force receiving portion, and the driving force from the outside of the mold can be used via the flange portion 106B. That is, in addition to the urging force that urges the frame-shaped mold 106 to the upper mold side by the spring 112 disposed between the frame-shaped mold 106 and the compression mold 108, the hooks 120 and the flange 106 </ b> B are driven by the actuator 122. Since the urging force can be obtained by lifting the frame-shaped mold 106 to the upper mold side through the above, the clamping force as a whole is improved. Further, the spring 112 disposed between the frame-shaped mold 106 and the wide portion 108B of the compression mold 108 can use a spring having the same strength as the conventional one (that is, a spring having the same size as the conventional one). There is no need to increase the size of the entire mold due to the large spring. Furthermore, the clamping force with respect to the substrate can be adjusted by adjusting the driving force generated by the actuator 122. As a result, an optimum biasing force (clamping force) can be generated without exchanging a spring or the like depending on the type and size of the substrate and the type of resin used. At that time, since it is not necessary to replace the spring 112 disposed between the frame-shaped mold 106 and the wide portion 108B of the compression mold 108, it is possible to flexibly cope with a change in the clamping force.

  As the actuator here, various actuators can be used as long as they can generate force up and down (that is, in the reciprocating direction). For example, a mechanical device using a ball screw or a cam may be used.

  In the present embodiment, the collar portion 106 is provided on the frame-shaped mold 106 as the driving force receiving portion. The configuration of the driving force receiving portion can be freely designed as long as the driving force from the outside can be received. For example, a configuration may be adopted in which a horizontal hole is provided in the frame-shaped mold 106 and a rod-shaped body is fitted into the hole to receive a driving force from the outside.

  Next, the configuration of a compression mold 200 provided in the resin sealing device according to the second embodiment of the present invention will be described with reference to FIG. Portions that are the same as or similar to those of the compression mold 100 described above are given the same reference numerals in the last two digits, and descriptions of overlapping configurations and operations are omitted.

  In the compression mold 200, a driving force for lifting (biasing) the frame-shaped mold 206 to the upper mold side via the hook 220 and the flange portion 206B is realized by the auxiliary spring 224 disposed outside the mold. Yes. In other words, this is realized by the auxiliary spring 224 disposed between the hook portion 220 and the lower mold platen 216. On the other hand, a driving force source for generating a driving force for pulling down the frame-shaped mold 206 (biasing it toward the upper mold side) via the hook portion 220 and the flange portion 206B is an actuator 222 including a rod 222A and a main body 222B. is there. By adopting such a configuration, it is possible to divert the conventional pulling-down drive unit in the form as it is. Further, since the auxiliary spring 224 is disposed outside the mold, even if it is desired to change the clamping force, it is not necessary to disassemble the mold itself, so that no complicated work is required.

  Next, the configuration of a compression mold 300 provided in the resin sealing device according to the third embodiment of the present invention will be described with reference to FIG. Here, the same or similar parts as those of the above-described compression molding die 100 are given the same reference numerals in the last two digits, and the description of the overlapping configuration and operation is omitted.

  In the compression mold 300, a driving force for lifting (biasing) the frame-shaped mold 306 to the upper mold side via the hook 320 and the flange portion 306B is realized by a fluid cylinder 326 arranged outside the mold. Yes. That is, it is realized by a fluid cylinder 326 such as a hydraulic cylinder or a pneumatic cylinder disposed between the hook portion 320 and the lower mold platen 316. On the other hand, a driving force source for generating a driving force for pulling down the frame-shaped mold 306 via the hook portion 320 and the flange portion 306B (biasing it toward the upper mold side) is an actuator 322 including a rod 322A and a main body 322B. is there. By adopting such a configuration, it is possible to divert the conventional pulling-down drive unit in the form as it is. Further, by adjusting the output of the fluid cylinder 326, it is possible to adjust the degree to which the frame-shaped mold 306 is lifted (that is, to adjust the urging force), and thus it is possible to easily change the clamping force.

  In all of the above embodiments, the lower mold is composed of a frame-shaped mold having a through-hole and a compression mold that moves forward and backward in the through-hole. However, the upper mold has such a configuration. May be. That is, you may incorporate in the resin sealing apparatus in the aspect which the upper and lower sides of the metal mold | die demonstrated above were reversed.

  If the driving force of the frame-shaped mold through the driving force receiving part is sufficient in relation to the clamping force required for the entire mold, the frame-shaped mold and the compression mold It is also possible to eliminate the spring (elastic body) disposed between the two and simplify the configuration of the lower mold.

  The present invention is preferably applied to a resin sealing device that seals a semiconductor chip or the like with a resin.

1 is a partial cross-sectional view of a compression mold 100 provided in a resin sealing device according to a first embodiment of the present invention. Partial sectional drawing of the compression molding die 200 with which the resin sealing apparatus which is the 2nd Embodiment of this invention is equipped. Partial sectional drawing of the compression mold 300 with which the resin sealing apparatus which is the 3rd Embodiment of this invention is equipped. Schematic configuration diagram of resin sealing device 2 described in Patent Document 1 The figure which showed the effect | action of the metal mold | die in the resin sealing apparatus 2

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Compression molding die 106 ... Frame type 106A ... Through-hole 106B ... Collar part 108 ... Compression die 110 ... Lower die 112 ... Spring 114 ... Heater 116 ... Lower die platen 120 ... Hook 122 ... Actuator 122A ... Rod 122B ... Main body

Claims (6)

Resin-sealing provided with a first mold and a compression mold comprising a second mold disposed opposite to the first mold and capable of coming into contact with and separating from the first mold A device,
The second mold includes a frame-shaped mold having a through-hole and a compression mold capable of moving forward and backward in the through-hole toward the first mold,
An elastic body that biases and supports the frame-shaped mold from the compression mold toward the first mold;
The frame-shaped mold is formed with a driving force receiving portion capable of receiving a driving force from the outside of the compression molding mold,
The resin sealing device, wherein the frame-shaped mold can be biased toward the first mold via the driving force receiving portion. In claim 1,
Furthermore, the frame-shaped mold can be urged to the side opposite to the first mold via the driving force receiving portion. In claim 1 or 2,
The driving force source of driving force that urges the frame-shaped mold toward the first mold via the driving force receiving portion is an elastic body disposed outside the compression mold. A resin sealing device. In claim 1,
The driving force source of driving force for urging the frame mold toward the first mold via the driving force receiving portion is an actuator arranged outside the compression mold. A resin sealing device. A first mold, a frame-shaped mold disposed opposite to the first mold and having a through hole, and a compression mold capable of moving forward and backward in the through hole toward the first mold side A compression mold that includes the second mold, and an elastic body that supports the frame-shaped mold from the compression mold, and the frame-shaped mold includes an outer portion of the compression mold. A resin sealing method by a resin sealing device in which a driving force receiving portion capable of receiving a driving force from is formed,
Clamping a substrate on which a semiconductor chip is mounted with the first mold and the frame mold using the elastic force of the elastic body;
And further urging the frame-shaped mold toward the first mold side by using a driving force external to the compression molding mold via the driving force receiving portion. Resin sealing method. Resin-sealing provided with a first mold and a compression mold comprising a second mold disposed opposite to the first mold and capable of coming into contact with and separating from the first mold A device,
The second mold includes a frame-shaped mold having a through-hole and a compression mold capable of moving forward and backward in the through-hole toward the first mold,
The frame-shaped mold is formed with a driving force receiving portion capable of receiving a driving force from the outside of the compression molding mold,
The resin sealing device, wherein the frame-shaped mold can be urged toward the first mold via the driving force receiving portion.

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