JP6057822B2 - Compressed resin sealing method and compressed resin sealing device for electronic parts - Google Patents

Compressed resin sealing method and compressed resin sealing device for electronic parts Download PDF

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JP6057822B2
JP6057822B2 JP2013087096A JP2013087096A JP6057822B2 JP 6057822 B2 JP6057822 B2 JP 6057822B2 JP 2013087096 A JP2013087096 A JP 2013087096A JP 2013087096 A JP2013087096 A JP 2013087096A JP 6057822 B2 JP6057822 B2 JP 6057822B2
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高瀬　慎二
慎二 高瀬
佳久 川本
佳久 川本
衛 砂田
衛 砂田
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Description

この発明は、所謂、圧縮成形方法を用いて大形基板上に装着した多数個の電子部品（半導体チップ）を樹脂により一括して封止成形（樹脂モールド）する樹脂封止方法及び樹脂封止装置に関し、特に、電子部品の樹脂封止成形時において、樹脂封止装置に設けられた圧縮成形用型（上下両型）の型面が弯曲変形することを防止し、且つ、圧縮成形用キャビティ内の樹脂をキャビティ底面部材にて均等に加圧するものに関する。   The present invention relates to a resin sealing method and a resin sealing in which a large number of electronic components (semiconductor chips) mounted on a large substrate using a so-called compression molding method are collectively sealed (resin mold) with a resin. With regard to the apparatus, in particular, during resin sealing molding of electronic components, the mold surface of the compression molding mold (both upper and lower molds) provided in the resin sealing apparatus is prevented from bending and the compression molding cavity It is related with what pressurizes resin inside uniformly with a cavity bottom face member.

大形基板上の電子部品を一括して樹脂封止する方法としては、圧縮成形方法が知られている。
この圧縮成形方法を行うための装置は、例えば、図５に概略図示するように、少なくとも上型１と下型２とから成る圧縮成形用型を備えており、該上下両型１・２を適宜な型開閉機構を介して相対的に接合・離反するように配設している。
そして、このような樹脂封止装置を用いて大形基板３上の電子部品４を一括して樹脂封止するには、次のようにして行われる。
まず、図５(1) に示すように、上型１に大形基板３をその電子部品４の装着面が下向きとなる状態で供給セットすると共に、下型２のキャビティ５内に樹脂材料６を供給して加熱する。
次に、図５(2) に示すように、型開閉機構を介して上下両型１・２を型締めすることにより、上型１にセットした大形基板３上の電子部品４を下型キャビティ５内の溶融樹脂材料６ａ中に浸漬する。
この型締時において、下型２の上面が大形基板３の周縁部を押圧することになる。そして、この状態で、下型２のキャビティ底面部材５ａを上動させて下型キャビティ５内の溶融樹脂材料６ａを所定の樹脂圧にて押圧（圧縮成形）することにより、下型キャビティ５の形状に対応して成形されるパッケージ内に電子部品４を一括して樹脂封止することができる。 A compression molding method is known as a method for collectively resin-sealing electronic components on a large substrate.
An apparatus for performing the compression molding method includes, for example, a compression molding die including at least an upper die 1 and a lower die 2 as schematically shown in FIG. It arrange | positions so that it may join / separate relatively via a suitable type | mold opening / closing mechanism.
Then, the resin sealing of the electronic components 4 on the large substrate 3 by using such a resin sealing device is performed as follows.
First, as shown in FIG. 5 (1), the large substrate 3 is supplied and set on the upper mold 1 with the mounting surface of the electronic component 4 facing downward, and the resin material 6 is placed in the cavity 5 of the lower mold 2. Supply and heat.
Next, as shown in FIG. 5 (2), the upper and lower molds 1 and 2 are clamped via a mold opening / closing mechanism, whereby the electronic component 4 on the large substrate 3 set on the upper mold 1 is moved to the lower mold. It is immersed in the molten resin material 6a in the cavity 5.
During the mold clamping, the upper surface of the lower mold 2 presses the peripheral edge of the large substrate 3. In this state, the cavity bottom member 5a of the lower mold 2 is moved upward to press the molten resin material 6a in the lower mold cavity 5 with a predetermined resin pressure (compression molding). The electronic components 4 can be collectively resin-sealed in a package molded according to the shape.

なお、大形の基板として、現状では、直径 300ｍｍの円形基板や、約95ｍｍ× 260ｍｍ程度の短冊状基板等が用いられているが、これよりも更に大形となる基板、例えば、 500ｍｍ角以上の大形基板を用いてその電子部品を樹脂により一括して封止成形できるようにすることが望まれている。   Currently, circular substrates with a diameter of 300 mm, strip-shaped substrates of about 95 mm × 260 mm, etc. are used as large substrates, but substrates that are larger than this, for example, 500 mm square or more It is desired that the electronic components can be collectively encapsulated with a resin using a large-sized substrate.

また、上下両型の型締圧力が該上下両型を弯曲変形するのを防止するように改善した樹脂封止装置７が提案されている。
即ち、図６に示す樹脂封止装置は、タイバー８を介して上下に固定した上側プラテン９及び下側プラテン10と、上側プラテン９と下側プラテン10との間に配置した固定プラテン11と、固定プラテン11の上面に固着した下型ベース12と、下型ベース12の上部に配置した複数の下型13と、上側プラテン９の下方位置に所定の間隔を介して配置した上型ベース14と、上型ベース14の下部に配置した複数の上型15と、上側プラテン９を上下動させて上下両型13・15の開閉を行うための型開閉機構16と、上型ベース14の上面に設けた盆形状収容部17と、盆形状収容部17内に収容した形状変形可能部材18と、形状変形可能部材18を多数の微小球18ａと該微小球18ａを包む網18ｂ（多孔質部材）とから構成することにより、該微小球18ａを網18ｂ内で自由に移動させることで該形状変形可能部材18の形状を変形させることが可能となるように設けている。
従って、型締時において、上側プラテン９が弯曲変形した場合に、形状変形可能部材18は弯曲した上側プラテン９の形状に合わせた変形が可能となって上側プラテン９の下面に沿って当接することができるため、均一な型締を行うことができる（特許文献２参照）。 Further, there has been proposed a resin sealing device 7 which has been improved so as to prevent the upper and lower mold clamping pressures from bending the upper and lower molds.
That is, the resin sealing device shown in FIG. 6 includes an upper platen 9 and a lower platen 10 fixed up and down via tie bars 8, a fixed platen 11 arranged between the upper platen 9 and the lower platen 10, A lower mold base 12 fixed to the upper surface of the fixed platen 11, a plurality of lower molds 13 disposed above the lower mold base 12, and an upper mold base 14 disposed at a position below the upper platen 9 with a predetermined interval A plurality of upper molds 15 arranged below the upper mold base 14, a mold opening / closing mechanism 16 for moving the upper platen 9 up and down to open and close both upper and lower molds 13 and 15, and an upper surface of the upper mold base 14. The provided tray-shaped accommodating portion 17, the shape-deformable member 18 accommodated in the tray-shaped accommodating portion 17, a number of microspheres 18a enclosing the shape-deformable member 18 and a net 18b (porous member) for enclosing the microspheres 18a By moving the microsphere 18a freely within the network 18b, The shape deformable member 18 is provided so as to be deformable.
Accordingly, when the upper platen 9 is bent and deformed at the time of mold clamping, the shape deformable member 18 can be deformed according to the shape of the bent upper platen 9 and abuts along the lower surface of the upper platen 9. Therefore, uniform mold clamping can be performed (see Patent Document 2).

ところで、大形基板における樹脂封止範囲は大面積であると共に、これに対応して、圧縮成形用型の下型キャビティも大面積となる。
このため、大形基板用のキャビティ部を備えた圧縮成形型においては、上下両型の型締圧力が該上下両型の周辺部で大きく且つその中央部で小さくなって該上下両型が弯曲変形し易いと云う樹脂成形上の問題がある。
また、特許文献２に記載された樹脂封止装置は小形基板を用いるものであるため、大形基板の樹脂封止装置としてそのまま応用することができないのみならず、微小球を網で包む構成の形状変形可能部材はその製作や保守管理が面倒であると云った問題がある。 By the way, the resin sealing range in the large substrate has a large area, and correspondingly, the lower mold cavity of the compression molding die also has a large area.
For this reason, in a compression mold having a cavity for a large substrate, the clamping pressure of both the upper and lower molds is large at the periphery of the upper and lower molds and is reduced at the center, so that the upper and lower molds are bent. There is a problem in resin molding that it is easily deformed.
Further, since the resin sealing device described in Patent Document 2 uses a small substrate, it cannot be applied as it is as a resin sealing device for a large substrate, but also has a configuration of wrapping microspheres with a net. There is a problem that the shape deformable member is troublesome to manufacture and maintain.

特開２００６−１２０８８０号公報（第５頁の段落〔0013〕、図１（１）等を参照）Japanese Unexamined Patent Publication No. 2006-120880 (see paragraph [0013] on page 5, FIG. 1 (1), etc.) 特開２００４−０４２３５６号公報（第４頁の段落〔0008〕及び、第６頁の段落〔0019〕、図１、図２、図７等参照）JP 2004-042356 A (refer to paragraph [0008] on page 4, paragraph [0019] on page 6, FIG. 1, FIG. 2, FIG. 7, etc.)

本発明は、圧縮成形方法を用いて大形基板上に装着した多数個の電子部品を樹脂により一括して封止成形する場合において、上下両型の型締圧力による該上下両型の弯曲変形を防止して、型合せ面からの樹脂漏れが発生しない電子部品の圧縮樹脂封止方法とこの方法を実施するための圧縮樹脂封止装置を提供することを目的とする。   In the case where a large number of electronic parts mounted on a large substrate are collectively encapsulated with a resin by using a compression molding method, the upper and lower molds are bent and deformed by the clamping pressure of the upper and lower molds. An object of the present invention is to provide a compressed resin sealing method for an electronic component which prevents the resin leakage from the mold matching surface and a compressed resin sealing device for carrying out this method.

上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止方法は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
前記上下両型（31・32）の型締する工程と、
少なくとも、前記下型キャビティ内の溶融樹脂材料をキャビティ底面部材32ｃにて所定の樹脂圧を加える工程時において、
前記下型における下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に下型水平空間部42ａを設けると共に、前記下型水平空間部42ａ内に弾性収容体42ｂを装設し、且つ、前記弾性収容体42ｂ内に加圧力調節機構43にて所定の加圧力に調節した圧力媒体44を導入することにより、前記キャビティ底面部材32ｃの弯曲変形防止工程を兼ねる下型32の均等加圧工程とを行うことを特徴とする。 In order to achieve the above-described object, the electronic component compression resin sealing method according to the present invention supplies a substrate to the upper mold surface using at least an electronic component compression molding mold comprising an upper mold and a lower mold. In addition, the mounting surface side of the electronic component is engaged downward, and a resin material is supplied into the lower mold cavity covered with the release film to be melted by heating, and then the upper and lower molds are closed. The electronic component of the substrate on the upper mold side is immersed in the molten resin material in the lower mold cavity, and then a predetermined resin pressure is applied to the molten resin material in the lower mold cavity. An electronic component compression resin sealing method for collectively sealing and molding electronic components mounted on the resin,
Clamping the upper and lower molds (31, 32);
At least in the step of applying a predetermined resin pressure to the molten resin material in the lower mold cavity at the cavity bottom surface member 32c,
A lower mold horizontal space portion 42a is provided between the lower mold hold block 32b and the cavity bottom surface member 32c in the lower mold, and an elastic container 42b is installed in the lower mold horizontal space portion 42a. By introducing the pressure medium 44 adjusted to a predetermined pressurizing force by the pressurizing force adjusting mechanism 43 into the housing body 42b, a uniform pressurizing step of the lower mold 32 that also serves as a bending deformation preventing step of the cavity bottom surface member 32c, It is characterized by performing.

上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止方法は、少なくとも上型31と下型32とから成る電子部品の圧縮成形用型30を用いて、前記上型面に基板70を供給し且つその電子部品71の装着面側を下向きとして係着させると共に、離型フイルム60を被覆した下型キャビティ33ａ内に樹脂材料80を供給して加熱溶融化し、次に、前記上下両型（31・32）を閉じる型締めを行って前記上型31側における基板70の電子部品71を前記下型キャビティ33ａ内の溶融樹脂材料80ａ中に浸漬させ、次に、前記下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えることにより、前記基板70上に装着した電子部品71を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
少なくとも、前記上下両型（31・32）の型締工程時において、
前記上型31における上型ホールドブロック31ｂと基板セットブロック31ｃとの間に上型水平空間部41ａを設けると共に、前記上型水平空間部41ａ内に弾性収容体41ｂを装設し、且つ、前記弾性収容体41ｂ内に加圧力調節機構43にて所定の加圧力に調節した圧力媒体44を導入することにより、前記基板セットブロック31ｃの弯曲変形防止工程を兼ねる上型31の均等加圧工程と、
前記下型32における下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に下型水平空間部42ａを設けると共に、前記下型水平空間部42ａ内に弾性収容体42ｂを装設し、且つ、前記弾性収容体42ｂ内に加圧力調節機構43にて所定の加圧力に調節した圧力媒体44を導入することにより、前記キャビティ底面部材32ｃの弯曲変形防止工程を兼ねる下型32の均等加圧工程とを行うことを特徴とする。 In order to achieve the above-described object, a compression resin sealing method for an electronic component according to the present invention uses an electronic component compression molding die 30 composed of at least an upper die 31 and a lower die 32 on the upper die surface. The substrate 70 is supplied and the mounting surface side of the electronic component 71 is engaged downward, and the resin material 80 is supplied into the lower mold cavity 33a coated with the release film 60 to be heated and melted. The upper and lower molds (31, 32) are closed and the electronic component 71 of the substrate 70 on the upper mold 31 side is immersed in the molten resin material 80a in the lower mold cavity 33a, and then the lower mold A compression resin sealing method for an electronic component in which a predetermined resin pressure is applied to the molten resin material 80a in the cavity 33a to collectively seal and mold the electronic components 71 mounted on the substrate 70 with a resin,
At least during the mold clamping process of the upper and lower molds (31, 32),
An upper mold horizontal space portion 41a is provided between the upper mold hold block 31b and the substrate set block 31c in the upper mold 31, and an elastic container 41b is installed in the upper mold horizontal space portion 41a. By introducing the pressure medium 44 adjusted to a predetermined pressure by the pressure adjusting mechanism 43 into the elastic container 41b, the uniform pressurizing step of the upper mold 31 which also serves as a bending deformation preventing step of the substrate set block 31c; ,
A lower mold horizontal space part 42a is provided between the lower mold hold block 32b and the cavity bottom surface member 32c in the lower mold 32, and an elastic container 42b is installed in the lower mold horizontal space part 42a. By introducing the pressure medium 44 adjusted to a predetermined pressure by the pressure adjusting mechanism 43 into the elastic container 42b, a uniform pressurizing step of the lower die 32 that also serves as a bending deformation preventing step of the cavity bottom member 32c; It is characterized by performing.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記した圧力媒体44として流体を用いることを特徴とする。   Further, the compressed resin sealing method for an electronic component according to the present invention is characterized in that a fluid is used as the pressure medium 44 described above.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記した圧力媒体44として低熱伝導性のシリコーンオイルを用いることを特徴とする。   Further, the compressed resin sealing method of an electronic component according to the present invention is characterized in that a low thermal conductive silicone oil is used as the pressure medium 44 described above.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記上型31側の弾性収容体41ｂ及び前記下型32側の弾性収容体42ｂ内の夫々に、同じ加圧力調節機構43にて所定の加圧力に調節した圧力媒体44を導入することを特徴とする。   Further, the compression sealing method of the electronic component according to the present invention uses the same pressure adjusting mechanism 43 in each of the elastic container 41b on the upper mold 31 side and the elastic container 42b on the lower mold 32 side. A pressure medium 44 adjusted to a predetermined pressure is introduced.

また、本発明に係る電子部品の圧縮樹脂封止方法は、前記上型31側の弾性収容体41ｂ及び前記下型32側の弾性収容体42ｂ内の夫々に、異なる加圧力調節機構にて所定の加圧力に調節した圧力媒体44を導入することを特徴とする。   In addition, the compression resin sealing method of the electronic component according to the present invention is performed by using different pressure adjusting mechanisms in each of the elastic housing body 41b on the upper mold 31 side and the elastic housing body 42b on the lower mold 32 side. The pressure medium 44 adjusted to the applied pressure is introduced.

上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止装置は、少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱溶融化し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の溶融樹脂材料中に浸漬させ、次に、前記下型キャビティ内の溶融樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記圧縮成形用型30に、前記下型32の弯曲変形防止部材を兼ねる均等加圧手段40を備えており、
前記下型32の均等加圧手段42は、下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に設けた下型水平空間部42ａと、前記下型水平空間部42ａ内に装設した圧力媒体44を導入するための弾性収容体42ｂと、前記圧力媒体44による加圧力を調節するための加圧力調節機構43と、前記加圧力調節機構43と前記弾性収容体42ｂとを連通接続させるための連通経路42ｃとを備えていることを特徴とする。 In order to achieve the above object, a compression resin sealing device for an electronic component according to the present invention supplies a substrate to the upper mold surface by using an electronic component compression molding mold comprising at least an upper mold and a lower mold. In addition, the mounting surface side of the electronic component is engaged downward, and a resin material is supplied into the lower mold cavity covered with the release film to be melted by heating, and then the upper and lower molds are closed. The electronic component of the substrate on the upper mold side is immersed in the molten resin material in the lower mold cavity, and then a predetermined resin pressure is applied to the molten resin material in the lower mold cavity. An electronic component compression resin sealing device that collectively seals and molds electronic components mounted on the resin,
The compression mold 30 is provided with a uniform pressure means 40 that also serves as a bending deformation preventing member of the lower mold 32,
The uniform pressure means 42 of the lower mold 32 includes a lower mold horizontal space portion 42a provided between the lower mold hold block 32b and the cavity bottom surface member 32c, and a pressure medium installed in the lower mold horizontal space portion 42a. An elastic container 42b for introducing the pressure 44, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and a pressure connection mechanism 43 and the elastic container 42b for communicating with each other. And a communication path 42c.

上記した目的を達成するための本発明に係る電子部品の圧縮樹脂封止装置は、少なくとも上型31と下型32とから成る電子部品の圧縮成形用型30を用いて、前記上型面に大形基板70を供給し且つその電子部品71の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ33ａ内に樹脂材料80を供給して加熱溶融化し、次に、前記上下両型（31・32）を閉じる型締めを行って前記上型31側における大形基板70の電子部品71を前記下型キャビティ33ａ内の溶融樹脂材料80ａ中に浸漬させ、次に、前記下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えることにより、前記基板70上に装着した電子部品71を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記圧縮成形用型30に、その上下両型（31・32）の弯曲変形防止部材を兼ねる均等加圧手段40を備えており、
また、前記均等加圧手段40は、上型31の均等加圧手段41及び下型32の均等加圧手段42とを含み、
また、前記上型31の均等加圧手段41は、上型ホールドブロック31ｂと基板セットブロック31ｃとの間に設けた上型水平空間部41ａと、前記上型水平空間部41ａ内に装設した圧力媒体44を導入するための弾性収容体41ｂと、前記圧力媒体44による加圧力を調節するための加圧力調節機構43と、前記加圧力調節機構43と前記弾性収容体41ｂとを連通接続させるための連通経路41ｃとを備えており、
また、前記下型32の均等加圧手段42は、下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に設けた下型水平空間部42ａと、前記下型水平空間部42ａ内に装設した圧力媒体44を導入するための弾性収容体42ｂと、前記圧力媒体44による加圧力を調節するための加圧力調節機構43と、前記加圧力調節機構43と前記弾性収容体42ｂとを連通接続させるための連通経路42ｃとを備えていることを特徴とする。 In order to achieve the above object, a compression resin sealing device for an electronic component according to the present invention uses an electronic component compression molding die 30 comprising at least an upper die 31 and a lower die 32 to form the upper die surface. The large substrate 70 is supplied and the mounting surface side of the electronic component 71 is engaged downward, and the resin material 80 is supplied into the lower mold cavity 33a coated with the release film to be melted by heating. The upper and lower molds (31, 32) are closed and the electronic component 71 of the large substrate 70 on the upper mold 31 side is immersed in the molten resin material 80a in the lower mold cavity 33a. An electronic component compression resin sealing device that applies a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a to collectively seal and mold the electronic components 71 mounted on the substrate 70 with resin. There,
The compression molding die 30 is provided with a uniform pressure means 40 that also serves as a bending deformation preventing member for both upper and lower dies (31, 32),
Further, the uniform pressure means 40 includes a uniform pressure means 41 of the upper mold 31 and a uniform pressure means 42 of the lower mold 32,
Further, the uniform pressure means 41 of the upper mold 31 is installed in the upper mold horizontal space portion 41a provided between the upper mold hold block 31b and the substrate set block 31c, and in the upper mold horizontal space portion 41a. An elastic container 41b for introducing the pressure medium 44, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and the pressure adjusting mechanism 43 and the elastic container 41b are connected in communication. And a communication path 41c for
Further, the uniform pressure means 42 of the lower mold 32 is installed in a lower mold horizontal space portion 42a provided between the lower mold hold block 32b and the cavity bottom surface member 32c, and in the lower mold horizontal space portion 42a. The elastic container 42b for introducing the pressure medium 44, the pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and the pressure adjusting mechanism 43 and the elastic container 42b are connected in communication. And a communication path 42c.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記圧力媒体44として流体を用いることを特徴とする。   Further, the compressed resin sealing device for electronic parts according to the present invention is characterized in that a fluid is used as the pressure medium 44.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記圧力媒体44として低熱伝導性のシリコーンオイルを用いることを特徴とする。   Further, the compressed resin sealing device for electronic parts according to the present invention is characterized by using low thermal conductivity silicone oil as the pressure medium 44.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記上型均等加圧手段41の加圧力調節機構43と、前記下型均等加圧手段42の加圧力調節機構43とを兼用させて構成したことを特徴とする。   Further, the compression resin sealing device for an electronic component according to the present invention combines the pressure adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and the pressure adjusting mechanism 43 of the lower mold uniform pressurizing means 42. It is characterized by being configured.

また、本発明に係る電子部品の圧縮樹脂封止装置は、前記上型均等加圧手段41の加圧力調節機構43と、前記下型均等加圧手段42の加圧力調節機構43とを個別に配置して構成したことを特徴とする。   Further, the compression resin sealing device for an electronic component according to the present invention includes a pressure adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and a pressure adjusting mechanism 43 of the lower mold uniform pressurizing means 42 individually. It is characterized by being arranged.

本発明に係る電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置によれば、大形基板70用のキャビティ部を備えた圧縮成形用型30に、上下両型（31・32）の型締時において該上下両型の弯曲変形を防止するための弯曲変形防止部材を兼ねる均等加圧手段40（41・42）を配設したので、上下両型（31・32）の型締時における型締圧力によって該上下両型が弯曲変形されるのを防止することができる。   According to the compression resin sealing method and the compression resin sealing device for electronic parts according to the present invention, both the upper and lower molds (31, 32) are formed on the compression molding mold 30 having the cavity portion for the large substrate 70. Since the uniform pressure means 40 (41, 42) which also serves as a bending deformation preventing member for preventing the bending deformation of the upper and lower molds at the time of clamping is disposed, the upper and lower molds (31, 32) are clamped at the time of clamping. It is possible to prevent the upper and lower molds from being bent and deformed by the mold clamping pressure.

また、本発明に係る電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置によれば、下型キャビティ33ａ内において所定の樹脂圧を得ることができる。
また、電子部品71を樹脂封止するパッケージの厚さ33ｄを、所定の厚みに成形することができる。
また、上型31についての均等加圧手段41と下型32についての均等加圧手段42とを備えたことにより、上下両型（31・32）の弯曲変形を防止することができるため、大形基板70上の電子部品71を樹脂により一括して封止成形する場合に有益である。 In addition, according to the compressed resin sealing method and the compressed resin sealing device for an electronic component according to the present invention, a predetermined resin pressure can be obtained in the lower mold cavity 33a.
Further, the thickness 33d of the package for resin-sealing the electronic component 71 can be formed to a predetermined thickness.
Further, since the uniform pressure means 41 for the upper mold 31 and the uniform pressure means 42 for the lower mold 32 are provided, it is possible to prevent the upper and lower molds (31, 32) from being bent. This is useful when the electronic components 71 on the shaped substrate 70 are collectively encapsulated with resin.

また、型開閉機構50にて上下両型（31・32）を型締し且つ下型キャビティ33ａ内の樹脂80ａを加圧する場合、下型32の均等加圧手段42を駆動することにより、下型水平空間部42ａに設けられた弾性収容体42ｂ内の圧力媒体44による均等加圧作用にて、弾性収容体42ｂの上に付設されたキャビティ底面部材32ｃを、そのキャビティ底面（先端面）を水平状態に保持した状態で上動させることができる。即ち、キャビティ底面部材32ｃを水平フローティング板として傾くことなく均等な圧力で水平に持ち上げて下型キャビティ33ａ内の樹脂80ａを均等に加圧することができる。   Further, when both the upper and lower molds (31, 32) are clamped by the mold opening / closing mechanism 50 and the resin 80a in the lower mold cavity 33a is pressurized, by driving the uniform pressure means 42 of the lower mold 32, The cavity bottom surface member 32c provided on the elastic container 42b is applied to the cavity bottom surface (tip surface) by the uniform pressure action by the pressure medium 44 in the elastic container 42b provided in the mold horizontal space 42a. It can be moved up while being held in a horizontal state. That is, the cavity bottom member 32c can be lifted horizontally with equal pressure without tilting as a horizontal floating plate, and the resin 80a in the lower mold cavity 33a can be evenly pressurized.

本発明に係る圧縮樹脂封止装置の全体構成を示す一部切欠正面図で、上下両型の型開状態を概略的に示している。BRIEF DESCRIPTION OF THE DRAWINGS It is a partially notched front view which shows the whole structure of the compression resin sealing apparatus which concerns on this invention, and has shown the mold open state of both upper and lower mold | types schematically. 図１に対応する圧縮樹脂封止装置の一部切欠正面図で、上下両型の型締状態を概略的に示している。FIG. 2 is a partially cutaway front view of the compression resin sealing device corresponding to FIG. 1, schematically showing both upper and lower mold clamping states. 図１に対応する圧縮樹脂封止装置の要部を示しており、図３(1) はその下型における均等加圧手段の一部切欠拡大正面図、図３(2) はその均等加圧手段を更に拡大して示す一部切欠拡大正面図である。Fig. 3 shows the main part of the compression resin sealing device corresponding to Fig. 1, Fig. 3 (1) is a partially cut-away front view of the uniform pressurizing means in the lower mold, and Fig. 3 (2) is the uniform pressurization. It is a partially notched enlarged front view showing the means further enlarged. 図１に対応する圧縮樹脂封止装置の要部を示しており、図４(1) はその上下両型の型開時における樹脂成形部の拡大縦断面図、図４(2) はその上下両型の型締時における樹脂成形部の拡大縦断面図である。The main part of the compression resin sealing device corresponding to FIG. 1 is shown. FIG. 4 (1) is an enlarged vertical sectional view of the resin molding part when the upper and lower molds are opened, and FIG. It is an expanded vertical sectional view of the resin molding part at the time of mold clamping of both types. 従来の圧縮樹脂封止装置の要部を概略的に示しており、図５(1) はその上下両型の型開時における樹脂成形部の縦断面図、図５(2) はその上下両型の型締時における樹脂成形部の縦断面図である。Fig. 5 (1) is a longitudinal sectional view of the resin molding part when the upper and lower molds are opened, and Fig. 5 (2) is the upper and lower parts. It is a longitudinal cross-sectional view of the resin molding part at the time of mold clamping. 従来の樹脂封止装置における型開閉機構を概略的に示しており、図６(1) はその上下両型の型締時における縦断面図、図６(2) はその形状変形可能部材の要部を示す拡大縦断面図である。6 schematically shows a mold opening / closing mechanism in a conventional resin sealing device. FIG. 6 (1) is a longitudinal sectional view of the upper and lower molds when the mold is clamped, and FIG. 6 (2) is an essential part of the shape deformable member. It is an expanded vertical sectional view which shows a part.

以下、図に示す本発明の実施例について説明する。   Examples of the present invention shown in the drawings will be described below.

図１乃至図４は本発明の一実施例であって、図１及び図２はその圧縮樹脂封止装置の全体構成を示しており、また、図３及び図４はその要部を示している。   FIGS. 1 to 4 show an embodiment of the present invention. FIGS. 1 and 2 show the overall configuration of the compression resin sealing device, and FIGS. 3 and 4 show the main parts thereof. Yes.

また、この圧縮樹脂封止装置はその各構成部材をプレスフレーム（ホールドフレーム）にて保持させる構成のものを示している。
即ち、枠形のプレスフレーム20における上端部の下面側に圧縮成形用の上型31を配置すると共に、該上型31の下方位置には、後述する型開閉機構50によって上下動可能に設けた圧縮成形用の下型32を配置しており、この上型31及び下型32は圧縮成形用型30を構成している。 In addition, this compression resin sealing device has a configuration in which each constituent member is held by a press frame (hold frame).
That is, an upper die 31 for compression molding is disposed on the lower surface side of the upper end portion of the frame-shaped press frame 20, and provided below the upper die 31 so as to be movable up and down by a die opening / closing mechanism 50 described later. A lower mold 32 for compression molding is disposed, and the upper mold 31 and the lower mold 32 constitute a compression molding mold 30.

また、上型31は、プレスフレーム20における上端部の下面側に固着した上型ベース31ａと、該上型ベース31ａの下面側に固着した上型ホールドブロック31ｂと、該上型ホールドブロック31ｂに支持させた基板セットブロック31ｃと、該基板セットブロック31ｃに内装した上型加熱用ヒータ31ｄとを備えている。
また、上型31の型面（下面）には、基板セットブロック31ｃの外方周囲に配置すると共に、後述する下型32の型面（図例では、キャビティ側面部材32ｄの上面）に接合させて上下両型（31・32）の型面間と該上下両型の外部との内外通気を遮断させるためのシール部材31ｅを備えており、更に、上型ホールドブロック31ｂと基板セットブロック31ｃとの間には、該両ブロック（31ｂ・31ｃ）間の通気を遮断させるためのシール部材31ｆを備えている。
なお、上型31には、その型面（下面）に大形基板70を供給し且つその電子部品71の装着面側を下向きとして係着させるための適宜な係着手段（図示なし）を設けている。
また、上型31には、後述する上下両型（31・32）の型締時（図２参照）に、シール部材31ｅにてシール（通気遮断）した該上下両型の型面間と真空ポンプとの間を適宜な吸気経路を介して連通接続させた真空引機構（図示なし）を配設している。 The upper mold 31 includes an upper mold base 31a fixed to the lower surface side of the upper end portion of the press frame 20, an upper mold hold block 31b fixed to the lower surface side of the upper mold base 31a, and an upper mold hold block 31b. A supported substrate set block 31c and an upper die heater 31d provided in the substrate set block 31c are provided.
In addition, the upper mold 31 is disposed on the outer surface of the substrate set block 31c on the mold surface (lower surface), and is bonded to the mold surface of the lower mold 32 to be described later (in the illustrated example, the upper surface of the cavity side member 32d). And a sealing member 31e for blocking internal / external ventilation between the mold surfaces of the upper and lower molds (31, 32) and the outside of the upper and lower molds, and an upper mold holding block 31b and a substrate set block 31c. A sealing member 31f is provided between the two blocks (31b, 31c) to block the ventilation between the blocks.
The upper mold 31 is provided with appropriate engaging means (not shown) for supplying the large substrate 70 to the mold surface (lower surface) and engaging the mounting surface side of the electronic component 71 downward. ing.
Further, the upper die 31 has a vacuum between the upper and lower die surfaces sealed by a seal member 31e when the upper and lower die (31, 32) described later (see FIG. 2) are clamped (see FIG. 2). A vacuum evacuation mechanism (not shown) is provided in communication with the pump via an appropriate intake path.

また、下型32は、プレスフレーム20の下端部に配置した後述する型開閉機構50における可動プラテン52上に配設している。
即ち、下型32は、型開閉機構50の可動プラテン52上に固着した下型ベース32ａと、該下型ベース32ａの上面側に固着した下型ホールドブロック32ｂと、該下型ホールドブロック32ｂに支持させたキャビティ底面部材32ｃと、該キャビティ底面部材32ｃの外方周囲に嵌合させたキャビティ側面部材32ｄと、下型ベース32ａとキャビティ側面部材32ｄとの間に介在させて該キャビティ側面部材32ｄを上方へ弾性押動させるように設けた弾性部材32ｅと、キャビティ底面部材32ｃに内装した下型加熱用ヒータ32ｆとを備えている。
従って、下型32が、キャビティ底面部材32ｃとキャビティ側面部材32ｄとに分割した構成を備えており、また、キャビティ底面部材32ｃとキャビティ側面部材32ｄとを相対的に上下動可能に嵌合させて構成している。
また、キャビティ底面部材32ｃとキャビティ側面部材32ｄとの間には、該両者間の通気を遮断させるためのシール部材32ｇを備えている。 Further, the lower mold 32 is disposed on a movable platen 52 in a mold opening / closing mechanism 50 described later disposed at the lower end portion of the press frame 20.
That is, the lower mold 32 includes a lower mold base 32a fixed on the movable platen 52 of the mold opening / closing mechanism 50, a lower mold hold block 32b fixed on the upper surface side of the lower mold base 32a, and the lower mold hold block 32b. A cavity bottom member 32c that is supported, a cavity side member 32d fitted to the outer periphery of the cavity bottom member 32c, and a cavity side member 32d interposed between the lower mold base 32a and the cavity side member 32d. Is provided with an elastic member 32e provided so as to be elastically pushed upward, and a lower mold heater 32f provided in the cavity bottom surface member 32c.
Therefore, the lower mold 32 has a configuration in which the cavity bottom surface member 32c and the cavity side surface member 32d are divided, and the cavity bottom surface member 32c and the cavity side surface member 32d are fitted so as to be relatively movable up and down. It is composed.
Further, a seal member 32g is provided between the cavity bottom surface member 32c and the cavity side surface member 32d to block the ventilation between the two.

また、大形基板用のキャビティ部を備えた圧縮成形型においては、上下両型（31・32）の型締圧力が該上下両型の周辺部で大きく且つその中央部で小さくなり、その結果、上下両型（31・32）が弯曲変形すると云う成形上の問題がある。
そこで、上記した圧縮成形用型30には、後述する上下両型（31・32）の型締時において該上下両型の弯曲変形を防止するための弯曲変形防止部材を兼ねる均等加圧手段40を備えている。
また、この均等加圧手段40は、図例においては、上型31についての均等加圧手段41と、下型32についての均等加圧手段42（図３参照）とを備えた場合を例示している。 In addition, in a compression mold having a cavity for a large substrate, the clamping pressure of both the upper and lower molds (31, 32) is large at the periphery of the upper and lower molds and small at the center, and as a result There is a molding problem that the upper and lower molds (31, 32) are bent and deformed.
Accordingly, the compression molding die 30 described above has a uniform pressure means 40 that also serves as a bending deformation preventing member for preventing bending deformation of both the upper and lower molds (31, 32), which will be described later. It has.
Further, in the example shown in the figure, the uniform pressurizing means 40 includes a uniform pressurizing means 41 for the upper mold 31 and a uniform pressurizing means 42 for the lower mold 32 (see FIG. 3). ing.

即ち、上型均等加圧手段41は、上型ホールドブロック31ｂと基板セットブロック31ｃとの間に設けた上型水平空間部41ａと、該上型水平空間部41ａ内に装設した圧力媒体44を導入するための弾性収容体41ｂと、該圧力媒体44による加圧力を調節するための加圧力調節機構43と、該加圧力調節機構43と弾性収容体41ｂとを連通接続させるための連通経路41ｃとを備えている。
また、下型均等加圧手段42は、下型ホールドブロック32ｂとキャビティ底面部材32ｃとの間に設けた下型水平空間部42ａと、該下型水平空間部42ａ内に装設した圧力媒体44を導入するための弾性収容体42ｂと、該圧力媒体44による加圧力を調節するための加圧力調節機構43と、該加圧力調節機構43と弾性収容体42ｂとを連通接続させるための連通経路42ｃとを備えている。 That is, the upper mold uniform pressurizing means 41 includes an upper mold horizontal space portion 41a provided between the upper mold hold block 31b and the substrate set block 31c, and a pressure medium 44 installed in the upper mold horizontal space portion 41a. An elastic container 41b for introducing pressure, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and a communication path for connecting the pressure adjusting mechanism 43 and the elastic container 41b to each other 41c.
The lower mold uniform pressurizing means 42 includes a lower mold horizontal space portion 42a provided between the lower mold hold block 32b and the cavity bottom surface member 32c, and a pressure medium 44 installed in the lower mold horizontal space portion 42a. An elastic container 42b for introducing pressure, a pressure adjusting mechanism 43 for adjusting the pressure applied by the pressure medium 44, and a communication path for connecting the pressure adjusting mechanism 43 and the elastic container 42b in communication. 42c.

上記した圧力媒体としては、流体（例えば、エアや不活性ガス等の気体、或は、水等の不活性水溶液や油類等の液体）を用いることが可能である。
例えば、圧力媒体として低熱伝導性のシリコーンオイルを用いることができる。
この場合は、圧力媒体としての機能を備えるのみならず、その断熱機能にて消費電力の低減化を図ることができる。 As the above-described pressure medium, a fluid (for example, a gas such as air or an inert gas, or an inert aqueous solution such as water or a liquid such as oil) can be used.
For example, a low thermal conductivity silicone oil can be used as the pressure medium.
In this case, not only a function as a pressure medium is provided, but also the heat insulation function can reduce power consumption.

なお、図例においては、上型均等加圧手段41と下型均等加圧手段42との加圧力調節機構43を兼用させている場合を例示しているが、上型均等加圧手段41及び下型均等加圧手段42の夫々に対応する専用の加圧力調節機構を配設するようにしてもよい。   In the illustrated example, the case where the pressurization adjusting mechanism 43 of the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means 42 are combined is illustrated, but the upper mold uniform pressurizing means 41 and A dedicated pressure adjusting mechanism corresponding to each of the lower mold uniform pressurizing means 42 may be provided.

また、下型32を上下動させて上型31と下型32とを開閉（型締め或は型開き）するための型開閉機構50は、次のように構成されている。
即ち、圧縮成形用型30の下方位置となるプレスフレーム20の下部にベース51を固着すると共に、ベース51と該ベースの上方位置に設けた可動プラテン52とをリンク機構（トグル機構）によって連結し、更に、該リンクをサーボモータ53によって駆動することにより、上下両型（31・32）の型開閉を行うように構成している。
詳述すると、サーボモータ53とベース51の中心位置に回転可能に立設させたスクリュウ軸54とは、サーボモータ53の出力軸53ａとスクリュウ軸54の下端プーリー53ｂとの間に架設したベルト53ｃを介して連結させている。
また、スクリュウ軸54にはナット部材55を螺装しており、スクリュウ軸54を回転させることによってナット部材55が上下方向へ移動するように設けている。そして、このナット部材55にベース51と可動プラテン52とを連結するリンクを係合させることにより、ナット部材55の上下動に伴って可動プラテン52を上下動させるように設けている。
なお、ベース51と可動プラテン52との間を連結するリンクは、第１リンク板56ａと、第２リンク板56ｂ及び第３リンク板56ｃとから構成している。
そして、軸51ａを介してベース51と第２リンク板56ｂの下端とを軸支し、また、軸52ａを介して可動プラテン52と第３リンク板56ｃの上端とを軸支し、また、軸52ｂを介して第２リンク板56ｂの上端と第３リンク板56ｃの下端とを軸支する。
また、第１リンク板56ａの一端をナット部材55に軸支すると共に、第１リンク板56ａの他端を第２リンク板56ｂにおける中間位置（軸51ａと軸52ｂとの中間位置）に軸支させている。このため、第１リンク板56ａは、ナット部材55の上下動による駆動力を第２リンク板56ｂと第３リンク板56ｃに伝達するための駆動リンクとして作用することになる。
従って、サーボモータ53にてスクリュウ軸54を回転させることにより、ナット部材55、及び、第１リンク板56ａ・第２リンク板56ｂ・第３リンク板56ｃを介して可動プラテン52を上下動させて上下両型（31・32）の型開閉を行うことができる。 A mold opening / closing mechanism 50 for opening / closing (mold clamping or mold opening) the upper mold 31 and the lower mold 32 by moving the lower mold 32 up and down is configured as follows.
That is, the base 51 is fixed to the lower part of the press frame 20 which is the lower position of the compression molding die 30, and the base 51 and the movable platen 52 provided at the upper position of the base are connected by a link mechanism (toggle mechanism). Furthermore, the link is driven by a servo motor 53 so that the upper and lower molds (31, 32) are opened and closed.
More specifically, the servo shaft 53 and the screw shaft 54 installed so as to be rotatable at the center position of the base 51 are a belt 53c installed between the output shaft 53a of the servo motor 53 and the lower end pulley 53b of the screw shaft 54. It is connected via.
Further, a nut member 55 is screwed on the screw shaft 54, and the nut member 55 is provided so as to move in the vertical direction by rotating the screw shaft 54. Then, by engaging the nut member 55 with a link that connects the base 51 and the movable platen 52, the movable platen 52 is moved up and down as the nut member 55 moves up and down.
The link connecting the base 51 and the movable platen 52 includes a first link plate 56a, a second link plate 56b, and a third link plate 56c.
The base 51 and the lower end of the second link plate 56b are pivotally supported via the shaft 51a, and the movable platen 52 and the upper end of the third link plate 56c are pivotally supported via the shaft 52a. The upper end of the second link plate 56b and the lower end of the third link plate 56c are pivotally supported via 52b.
Further, one end of the first link plate 56a is pivotally supported by the nut member 55, and the other end of the first link plate 56a is pivotally supported by an intermediate position (intermediate position between the shaft 51a and the shaft 52b) of the second link plate 56b. I am letting. For this reason, the first link plate 56a acts as a drive link for transmitting the driving force generated by the vertical movement of the nut member 55 to the second link plate 56b and the third link plate 56c.
Therefore, by rotating the screw shaft 54 by the servo motor 53, the movable platen 52 is moved up and down via the nut member 55, the first link plate 56a, the second link plate 56b, and the third link plate 56c. The upper and lower molds (31, 32) can be opened and closed.

なお、上記した型開閉機構50は、図例においては、トグル機構を用いた場合を例示したが、これに替えて、電動モータとスクリュージャッキ手段を採用した型開閉機構や油圧手段を採用した型開閉機構等を用い得ることは明らかである。   In the illustrated example, the above-described mold opening / closing mechanism 50 is exemplified by using a toggle mechanism, but instead of this, a mold opening / closing mechanism employing an electric motor and screw jack means and a mold employing a hydraulic means. Obviously, an opening / closing mechanism or the like can be used.

また、上下両型（31・32）の型面間には、図４に拡大図示するように、樹脂成形部33が構成される。
即ち、キャビティ底面部材32ｃの上面と、キャビティ側面部材32ｄの上面開口部とによって構成される凹所は樹脂成形用の下型キャビティ33ａとして設けられている。
また、図４に示すように、上下両型（31・32）を閉じる型締時（図４(2) 参照）において、該上下両型（31・32）間に、下型キャビティ33ａ内の溶融樹脂材料80ａの一部となる余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させるための狭い間隙33ｃを構成している。また、下型キャビティ33ａ部の周囲に狭い間隙33ｃを通して連通させた余剰樹脂80ｂの収容部33ｂを配置している。また、上下両型（31・32）の型締め最終位置における下型キャビティ33ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ33ｄの間隔と等しくなるように設定している。
更に、余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させるための狭い間隙33ｃは、下型キャビティ33ａと大形基板70における電子部品71の装着面との両者間に構成した下型キャビティ33ａと余剰樹脂80ｂの収容部33ｂとを連通させる樹脂通路となる。
また、上記狭い間隙33ｃは、下型キャビティ33ａから余剰樹脂80ｂの収容部33ｂに向かって浅くなるような傾斜面として設けている。このような傾斜面を用いることによって、余剰樹脂80ｂを収容部33ｂ内へ徐々に（低速で）流入させることができる。 Further, a resin molding portion 33 is formed between the upper and lower molds (31, 32) as shown in an enlarged view in FIG.
That is, a recess formed by the upper surface of the cavity bottom surface member 32c and the upper surface opening of the cavity side surface member 32d is provided as a lower mold cavity 33a for resin molding.
As shown in FIG. 4, when the upper and lower molds (31, 32) are closed (see FIG. 4 (2)), the lower mold cavity 33a is placed between the upper and lower molds (31, 32). A narrow gap 33c is formed for allowing excess resin 80b, which is a part of the molten resin material 80a, to flow out of the lower mold cavity 33a. In addition, an accommodating portion 33b of excess resin 80b communicated through a narrow gap 33c is disposed around the lower mold cavity 33a portion. In addition, the distance between the bottom surface of the lower mold cavity 33a and the mounting surface of the electronic component 71 on the large substrate 70 at the final clamping position of both the upper and lower dies (31, 32) allows the electronic component 71 on the large substrate 70 to be resin-sealed. Therefore, the distance is set to be equal to the interval of the package thickness 33d.
Further, the narrow gap 33c for allowing the excess resin 80b to flow out of the lower mold cavity 33a is formed between the lower mold cavity 33a and the lower mold cavity 33a formed between the mounting surface of the electronic component 71 on the large substrate 70. It becomes a resin passage which makes the accommodating part 33b of the excess resin 80b communicate.
The narrow gap 33c is provided as an inclined surface that becomes shallower from the lower mold cavity 33a toward the accommodating portion 33b of the excess resin 80b. By using such an inclined surface, the surplus resin 80b can be gradually introduced into the accommodating portion 33b (at a low speed).

また、上記した圧縮樹脂封止装置には、下型32に設けた下型キャビティ33ａ部を含む下型面に、ロール巻き状の離型フイルム60を張設するための離型フイルム供給セット機構（図示なし）を併設している。
更に、離型フイルム供給セット機構にて離型フイルム60を張設した下型キャビティ33ａ部にシート状樹脂80を供給するための樹脂供給セット機構（図示なし）を併設している。
また、このシート状樹脂80は、下型キャビティ33ａ部の形状に対応した類似形状に形成され、且つ、所要量の樹脂を平坦化して所要の保形性を備えている。
ここで、所要量とは、後述するように、下型キャビティ33ａ内において大形基板70上の電子部品71を所定厚みに一括して圧縮樹脂封止成形するための樹脂量と、該樹脂量に下型キャビティ33ａの外部へ流出させるための余剰樹脂量を加えた量を意味する。
より具体的には、例えば、大形基板上の電子部品71を断面 0.3ｍｍの厚さのパッケージ内に一括して圧縮樹脂封止成形する場合においては、断面 0.5ｍｍの厚さのシート状樹脂材料80を用いることが好ましい。
なお、まず、ロール巻き状（長尺状）の離型フィルム60を予め切断してプリカットされた短尺状の離型フィルムを形成すると共に、このプリカットされた離型フィルム上にシート状樹脂80を載置し、この状態で、下型面のキャビティの開口部にシート状樹脂80部分を合致させ、次に、下型キャビティ内から空気を強制的に吸引して排出することにより、離型フィルムをキャビティ面に被覆させ、同時に、離型フィルムを被覆したキャビティ内にシート状樹脂80を供給することができる。 Further, in the above-described compression resin sealing device, a release film supply set mechanism for stretching a roll-like release film 60 on a lower mold surface including a lower mold cavity 33a provided in the lower mold 32 (Not shown).
Further, a resin supply set mechanism (not shown) for supplying the sheet-like resin 80 to the lower mold cavity 33a portion where the release film 60 is stretched by the release film supply set mechanism is provided.
The sheet-like resin 80 is formed in a similar shape corresponding to the shape of the lower mold cavity 33a, and has a required shape retaining property by flattening a required amount of resin.
Here, the required amount is, as will be described later, a resin amount for collectively compressing and molding the electronic components 71 on the large substrate 70 to a predetermined thickness in the lower mold cavity 33a, and the resin amount Means the amount of excess resin added to the outside of the lower mold cavity 33a.
More specifically, for example, when the electronic component 71 on the large substrate is collectively molded into a package having a thickness of 0.3 mm by compression resin sealing, a sheet-like resin having a thickness of 0.5 mm is used. It is preferable to use the material 80.
First, a roll-like (long) release film 60 is cut in advance to form a pre-cut short release film, and a sheet-like resin 80 is placed on the pre-cut release film. In this state, the release film is formed by aligning the sheet-shaped resin 80 portion with the opening of the cavity on the lower mold surface, and then forcibly sucking and discharging air from the lower mold cavity. The sheet-like resin 80 can be supplied into the cavity coated with the release film at the same time.

以下、この圧縮樹脂封止装置を用いて大形基板70上に装着した電子部品71を樹脂により一括して圧縮樹脂封止成形する場合について説明する。   Hereinafter, a case where the electronic component 71 mounted on the large substrate 70 is collectively compressed and sealed with resin using this compression resin sealing device will be described.

まず、型開閉機構50を介して、上下両型（31・32）の型開きを行う（図１参照）。
次に、この型開時において、適宜な係着手段（図示なし）を介して、上型31の型面（即ち、基板セットブロック31ｃの下面）に大形基板70を供給すると共に、その電子部品71の装着面側を下向きとして係着させる。
また、離型フイルム供給セット機構（図示なし）を介して、下型キャビティ33ａ部を含む下型32の型面（即ち、キャビティ底面部材32ｃ及びキャビティ側面部材32ｄの上面）に離型フイルム60を張設する。
更に、離型フイルム60を張設した下型キャビティ33ａ部に、樹脂供給セット機構（図示なし）を介して、シート状樹脂80を供給する（図４参照）。
なお、このシート状樹脂80はキャビティ底面部材32ｃに内装した下型加熱用ヒータ32ｆによって加熱溶融化される。 First, the upper and lower molds (31, 32) are opened through the mold opening / closing mechanism 50 (see FIG. 1).
Next, when the mold is opened, the large substrate 70 is supplied to the mold surface of the upper mold 31 (that is, the lower surface of the substrate set block 31c) via an appropriate engaging means (not shown), and the electron The component 71 is engaged with the mounting surface side facing downward.
Further, the release film 60 is applied to the mold surface of the lower mold 32 including the lower mold cavity 33a (that is, the upper surfaces of the cavity bottom surface member 32c and the cavity side surface member 32d) via a release film supply set mechanism (not shown). Install.
Further, the sheet-like resin 80 is supplied to the lower mold cavity 33a portion on which the release film 60 is stretched via a resin supply setting mechanism (not shown) (see FIG. 4).
The sheet-like resin 80 is heated and melted by the lower mold heater 32f built in the cavity bottom member 32c.

次に、均等加圧手段40を介して、加圧力調節機構43により所定の加圧力に調節された圧力媒体44を上型均等加圧手段41の弾性収容体41ｂ内及び下型均等加圧手段42の弾性収容体42ｂ内の夫々に導入することにより、上下両型（31・32）の型締時において該上下両型がその型締圧力によって弯曲変形されるのを防止する（図３参照）。
なお、この均等加圧手段40による上下両型（31・32）の弯曲変形防止工程は、成形工程中において常時行うようにしてもよく、または、後述する上下両型（31・32）の型締工程に先行して行うようにしてもよく、或は、該型締工程と同時的に行うようにしてもよい。要するに、上下両型（31・32）の型締工程における型締圧力によって該上下両型が弯曲変形されるのを防止することができる時期を選定すればよい。 Next, the pressure medium 44 adjusted to a predetermined pressurizing force by the pressurizing force adjusting mechanism 43 through the uniform pressurizing means 40 is supplied to the elastic container 41b of the upper mold uniform pressurizing means 41 and the lower mold uniform pressurizing means. By introducing them into each of the 42 elastic containers 42b, the upper and lower molds (31, 32) are prevented from being bent and deformed by the clamping pressure when the upper and lower molds (31, 32) are clamped (see FIG. 3). ).
The bending deformation preventing process of the upper and lower molds (31, 32) by the uniform pressurizing means 40 may be always performed during the molding process, or the upper and lower molds (31, 32) described later. It may be performed prior to the clamping process, or may be performed simultaneously with the mold clamping process. In short, it is only necessary to select a time when it is possible to prevent the upper and lower molds from being bent and deformed by the clamping pressure in the mold clamping process of the upper and lower molds (31, 32).

次に、図２に示すように、型開閉機構50を介して、下型32を上動させることにより、上下両型（31・32）の型締めを行う。
この上下両型（31・32）の型締めを行うと、上型31の型面に係着させた大形基板70上の電子部品71を離型フイルム60を張設した下型キャビティ33ａ内の溶融樹脂材料80ａ中に浸漬させることができる。
次に、この下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えることにより、大形基板70上に装着した電子部品71を樹脂により一括して圧縮樹脂封止成形することができる。
なお、上記した上下両型（31・32）の型締時にシール部材31ｅにて該上下両型の型面間をシールすることができるため、真空引機構（図示なし）の真空ポンプを作動させて該型面間（下型キャビティ33ａ内）を減圧する、所謂、真空成形（減圧成形）を行うことができる。 Next, as shown in FIG. 2, the upper and lower molds (31, 32) are clamped by moving the lower mold 32 upward through the mold opening / closing mechanism 50.
When the upper and lower molds (31, 32) are clamped, the electronic component 71 on the large substrate 70 engaged with the mold surface of the upper mold 31 is placed in the lower mold cavity 33a in which the release film 60 is stretched. It can be immersed in the molten resin material 80a.
Next, by applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a, the electronic components 71 mounted on the large substrate 70 can be collectively compressed and sealed with resin. .
Since the upper and lower molds (31, 32) can be sealed with the sealing member 31e when the upper and lower molds (31, 32) are clamped, a vacuum pump of a vacuum drawing mechanism (not shown) is operated. Thus, so-called vacuum molding (decompression molding) can be performed in which the pressure between the mold surfaces (in the lower mold cavity 33a) is reduced.

また、上記した上下両型（31・32）の型締工程において、下型キャビティ33ａ内の余剰樹脂80ｂを下型キャビティ33ａの外部へ流出させる余剰樹脂の外部流出段階を行い、そして、この余剰樹脂80ｂの外部流出段階を経た後に、キャビティ底面部材32ｃを所定の高さ位置まで上動させることにより、下型キャビティ33ａ内の溶融樹脂材料80ａに所定の樹脂圧を加えて大形基板70上の電子部品71を一括して樹脂封止成形する樹脂封止段階を行う。
該余剰樹脂80ｂの外部流出段階においては、上下両型（31・32）間に構成される狭い間隙33ｃを通して、余剰樹脂80ｂを下型キャビティ33ａ部の周囲に設けた余剰樹脂80ｂの収容部33ｂ内（図４参照）に案内する。
更に、該樹脂封止段階においては、上下両型（31・32）の型締め最終位置における下型キャビティ33ａの底面と大形基板70の電子部品71装着面との間隔が、大形基板70の電子部品71を樹脂封止するためのパッケージ厚さ33ｄの間隔と等しくなるように設定しているため、下型キャビティ33ａ内において所定の樹脂圧を得ることができると共に、パッケージ厚さ33ｄを所定の厚みに成形することができる。 Further, in the mold clamping process of both the upper and lower molds (31, 32), the excess resin 80b in the lower mold cavity 33a is discharged to the outside of the lower mold cavity 33a. After the resin 80b has flowed out to the outside, the cavity bottom member 32c is moved up to a predetermined height position, thereby applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a and A resin sealing step is performed in which the electronic components 71 are collectively resin-sealed.
In the outflow stage of the surplus resin 80b, the surplus resin 80b is provided around the lower mold cavity 33a through the narrow gap 33c formed between the upper and lower molds (31, 32). Guide inside (see FIG. 4).
Further, in the resin sealing stage, the distance between the bottom surface of the lower mold cavity 33a and the mounting surface of the large substrate 70 on the electronic component 71 at the final clamping position of both the upper and lower molds (31, 32) is the large substrate 70. Since the electronic component 71 is set to be equal to the interval of the package thickness 33d for resin sealing, a predetermined resin pressure can be obtained in the lower mold cavity 33a, and the package thickness 33d can be reduced. It can be molded to a predetermined thickness.

即ち、このとき、上下両型（31・32）による型締作用と、キャビティ底面部材32ｃによる下型キャビティ33ａ内の溶融樹脂材料80ａに対する押圧作用とを行うことができる。
従って、該上下両型の型締作用及び該溶融樹脂材料80ａに対する押圧作用を低速度で且つ低圧にて行うことにより、上記した余剰樹脂80ｂの外部流出段階とこれに続く樹脂封止段階とを低速度で且つ低圧にて行うことができる。
更に、樹脂封止段階における上下両型（31・32）の型締め最終位置において大形基板70の電子部品71を所定厚さのパッケージ内にて樹脂封止することができるように関係付けている。
このため、該上下両型の型締作用時及び該溶融樹脂材料80ａの押圧作用時において、下型キャビティ33ａ内における溶融樹脂材料80ａの流動作用を防止若しくは抑制することができるので、この溶融樹脂材料80ａの流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。 That is, at this time, the mold clamping action by the upper and lower molds (31, 32) and the pressing action on the molten resin material 80a in the lower mold cavity 33a by the cavity bottom member 32c can be performed.
Accordingly, by performing the clamping action of both the upper and lower molds and the pressing action against the molten resin material 80a at a low speed and a low pressure, the above-described external resin outflow stage and the subsequent resin sealing stage are performed. It can be performed at low speed and low pressure.
Further, the electronic components 71 of the large substrate 70 are related to each other so that they can be resin-sealed in a package having a predetermined thickness at the final clamping positions of the upper and lower molds (31, 32) in the resin sealing stage. Yes.
For this reason, when the upper and lower molds are clamped and when the molten resin material 80a is pressed, the flow of the molten resin material 80a in the lower mold cavity 33a can be prevented or suppressed. Generation | occurrence | production of the wire sweep etc. resulting from the flow effect | action of the material 80a can be prevented efficiently.

なお、上記した樹脂封止段階における上下両型（31・32）の型締め最終位置、或は、該型締め最終位置における下型キャビティ33ａの底面位置の設定は、型開閉機構50によって下型32を上動させる限度（上死点）の位置と合致させるようにしてもよい（図２参照）。   The final mold clamping position of the upper and lower molds (31, 32) at the resin sealing stage described above, or the bottom position of the lower mold cavity 33a at the final mold clamping position is set by the mold opening / closing mechanism 50. You may make it correspond to the position of the limit (top dead center) which moves 32 up (refer to Drawing 2).

また、上記した樹脂封止段階における上下両型（31・32）の型締め最終位置、或は、該型締め最終位置における下型キャビティ33ａの底面位置は、型開閉機構50によって上動する下型32、或は、キャビティ底面部材32ｃの所定の高さ位置を検知して該下型32、或は、キャビティ底面部材32ｃの上動作用を停止させる高さ位置制御機構（図示なし）を介して設定するようにしてもよい。   In addition, the mold clamping final position of the upper and lower molds (31, 32) in the resin sealing step described above or the bottom surface position of the lower mold cavity 33a at the mold clamping final position is moved downward by the mold opening / closing mechanism 50. Through a height position control mechanism (not shown) for detecting the predetermined height position of the mold 32 or the cavity bottom member 32c and stopping the upper movement of the lower mold 32 or the cavity bottom member 32c. May be set.

また、定量で定型化したシート状樹脂80を用いることによって、下型キャビティ33ａ内の全域に亘る樹脂材料の供給作用と、該シート状樹脂の加熱溶融化作用と、該溶融樹脂材料80ａに対する低速度且つ低圧による押圧作用との相乗作用によって、該下型キャビティ内における溶融樹脂材料の流動作用に基因するワイヤスイープ等の発生を、より効率良く防止することができる。   In addition, by using the sheet-shaped resin 80 that is fixed in a fixed amount, the resin material supplying action over the entire area of the lower mold cavity 33a, the heat-melting action of the sheet-shaped resin, and the low resistance to the molten resin material 80a. Due to the synergistic action with the pressing action by the speed and the low pressure, the occurrence of wire sweep or the like due to the flow action of the molten resin material in the lower mold cavity can be prevented more efficiently.

なお、樹脂封止段階において、均等加圧手段40を併用することにより、上下両型（31・32）の型締時における型締圧力によって該上下両型が弯曲変形されるのを防止することができる。   In the resin sealing stage, by using the uniform pressure means 40 together, the upper and lower molds (31, 32) can be prevented from being bent and deformed by the clamping pressure at the time of mold clamping. Can do.

この実施例の構成によれば、大形基板70上に装着した多数個の電子部品71を樹脂により一括して封止成形する場合において、下型キャビティ33ａ内における溶融樹脂材料80ａの流動作用に基因するワイヤスイープ等の発生を効率良く防止することができる。
また、下型キャビティ33ａ内において所定の樹脂圧を得ることができる。
また、電子部品71を樹脂封止するパッケージの厚さ33ｄを所定の厚みに成形することができる。 According to the configuration of this embodiment, when a large number of electronic components 71 mounted on the large substrate 70 are collectively encapsulated with resin, the flow of the molten resin material 80a in the lower mold cavity 33a is affected. Generation of the underlying wire sweep or the like can be efficiently prevented.
In addition, a predetermined resin pressure can be obtained in the lower mold cavity 33a.
Further, the thickness 33d of the package for resin-sealing the electronic component 71 can be formed to a predetermined thickness.

また、上型31についての均等加圧手段41と下型32についての均等加圧手段42とを備えたことにより、上下両型（31・32）の弯曲変形を防止することができるため、大形基板70上の電子部品71を樹脂により一括して封止成形する場合に有益である。   Further, since the uniform pressure means 41 for the upper mold 31 and the uniform pressure means 42 for the lower mold 32 are provided, it is possible to prevent the upper and lower molds (31, 32) from being bent. This is useful when the electronic components 71 on the shaped substrate 70 are collectively encapsulated with resin.

また、型開閉機構50にて上下両型（31・32）を型締し且つ下型キャビティ33ａ内の樹脂80ａを加圧する場合、下型32の均等加圧手段42を駆動することにより、下型水平空間部42ａに設けられた弾性収容体42ｂ内の圧力媒体44による均等加圧作用にて、弾性収容体42ｂの上に付設されたキャビティ底面部材32ｃ（水平フローティング板）を、そのキャビティ底面を水平状態に保持した状態で傾くことなく均等な圧力で上動させることができる。   Further, when both the upper and lower molds (31, 32) are clamped by the mold opening / closing mechanism 50 and the resin 80a in the lower mold cavity 33a is pressurized, by driving the uniform pressure means 42 of the lower mold 32, The cavity bottom surface member 32c (horizontal floating plate) provided on the elastic container 42b is moved to the bottom surface of the cavity by the uniform pressure action by the pressure medium 44 in the elastic container 42b provided in the mold horizontal space 42a. Can be moved up with equal pressure without tilting while being held in a horizontal state.

前記実施例では、電子部品の圧縮樹脂封止装置を用いて、大形基板上に装着した電子部品を、（均等な厚さを有する）シート状樹脂により、一括して圧縮樹脂封止成形する場合について説明した。
また、本発明においては、例えば、適宜な方法・手段にて離型フィルムを被覆し、当該離型フィルムを被覆した下型キャビティ内に、所要量の種々の樹脂材料を平坦化した状態（均等な厚さの状態）で供給することができる。
また、前記した種々の樹脂材料として、顆粒状の樹脂材料（顆粒樹脂）、粉末状の樹脂材料（粉末樹脂）、液状の樹脂材料（液状樹脂）、ペースト状の樹脂材料、シート状の樹脂材料を用いることができる。
また、前記した種々の樹脂材料として、透明性を有する樹脂材料、半透明性を有する樹脂材料、不透明性を有する樹脂材料を用いることができる。 In the said Example, the compression resin sealing molding of the electronic component mounted on the large sized board | substrate with a sheet-like resin (with equal thickness) is carried out collectively using the compression resin sealing apparatus of an electronic component. Explained the case.
Further, in the present invention, for example, a release film is coated by an appropriate method / means, and a required amount of various resin materials are flattened in a lower mold cavity covered with the release film (evenly In a state with a sufficient thickness).
In addition, as the various resin materials described above, granular resin material (granular resin), powder resin material (powder resin), liquid resin material (liquid resin), paste resin material, sheet resin material Can be used.
Further, as the various resin materials described above, a resin material having transparency, a resin material having translucency, and a resin material having opacity can be used.

また、本発明においては、圧縮成形されるパッケージの厚さを、即ち、下型のキャビティ底面と基板の電子部品装着面との間を、下型キャビティ内に供給される樹脂材料の均等な所要の厚さよりも薄くして設定して構成されている。
従って、本発明において、まず、下型キャビティ内において、樹脂材料を所要の厚さを有するように平坦化して形成し、次に、下型のキャビティ底面と基板の電子部品装着面との間の距離を、樹脂材料の所要の厚さよりも薄い所要のパッケージの厚さとなるように、キャビティ底面部材（キャビティ底面）を上動させることにより、下型キャビティ内の樹脂を均等に押圧することになります（下型キャビティ内で圧縮成形されるパッケージにおける所要の厚さ＜下型キャビティ内に供給された樹脂材料における所要の厚さ）。
このとき、下型水平空間部42ａに設けられた弾性収容体42ｂ内の圧力媒体44による均等加圧作用にて、弾性収容体42ｂの上に付設されたキャビティ底面部材32ｃ（水平フローティング板）を、そのキャビティ底面（先端面）を水平状態に保持した状態で上動させることができる。即ち、キャビティ底面部材32ｃを傾くことなく均等な圧力で水平に持ち上げて下型キャビティ33ａ内の樹脂80ａを均等に加圧することができる。
また、このとき、下型キャビティ内の溶融樹脂材料は、下型キャビティの外部に、隘路（狭い間隙）を通して流出することになり、下型キャビティ内の樹脂を低圧で加圧することができるものである。
なお、これは、隘路が樹脂材料で緩慢に閉鎖されるためと推測され、下型キャビティ内に所要の樹脂圧を低圧で加えることができる。 Further, in the present invention, the thickness of the package to be compression-molded, that is, between the bottom surface of the cavity of the lower mold and the electronic component mounting surface of the substrate, is equally required for the resin material supplied into the lower mold cavity. The thickness is set to be thinner than the thickness.
Therefore, in the present invention, the resin material is first flattened to have a required thickness in the lower mold cavity, and then between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate. By moving the cavity bottom member (cavity bottom) upward so that the distance becomes the required package thickness that is thinner than the required thickness of the resin material, the resin in the lower mold cavity is pressed evenly. (Required thickness in the package to be compression-molded in the lower mold cavity <Required thickness in the resin material supplied in the lower mold cavity).
At this time, the cavity bottom member 32c (horizontal floating plate) provided on the elastic container 42b is moved by the uniform pressure action by the pressure medium 44 in the elastic container 42b provided in the lower mold horizontal space 42a. The cavity bottom surface (tip surface) can be moved up in a horizontal state. That is, the cavity bottom member 32c can be lifted horizontally with an equal pressure without tilting, and the resin 80a in the lower mold cavity 33a can be evenly pressurized.
At this time, the molten resin material in the lower mold cavity flows out of the lower mold cavity through a bottleneck (narrow gap), and the resin in the lower mold cavity can be pressurized at a low pressure. is there.
This is presumably because the bottleneck is slowly closed with a resin material, and a required resin pressure can be applied to the lower mold cavity at a low pressure.

20 プレスフレーム
30 圧縮成形用型
31 上型
31ａ 上型ベース
31ｂ 上型ホールドブロック
31ｃ 基板セットブロック
31ｄ 上型加熱用ヒータ
31ｅ シール部材
31ｆ シール部材
32 下型
32ａ 下型ベース
32ｂ 下型ホールドブロック
32ｃ キャビティ底面部材
32ｄ キャビティ側面部材
32ｅ 弾性部材
32ｆ 下型加熱用ヒータ
32ｇ シール部材
33 樹脂成形部
33ａ 下型キャビティ
33ｂ 余剰樹脂の収容部
33ｃ 狭い間隙
33ｄ パッケージ厚さ
40 均等加圧手段
41 上型均等加圧手段
41ａ 上型水平空間部
41ｂ 弾性収容体
41ｃ 連通経路
42 下型均等加圧手段
42ａ 下型水平空間部
42ｂ 弾性収容体
42ｃ 連通経路
43 加圧力調節機構
44 圧力媒体
50 型開閉機構（トグル機構）
51 ベース
51ａ 軸
52 可動プラテン
52ａ 軸
53 サーボモータ
53ａ 出力軸
53ｂ プーリー
53ｃ ベルト
54 スクリュウ軸
55 ナット部材
56ａ 第１リンク
56ｂ 第２リンク
56ｃ 第３リンク
60 離型フイルム
70 大形基板
71 電子部品
80 シート状樹脂（シート状の樹脂材料）
80ａ 溶融樹脂材料
80ｂ 余剰樹脂 20 Press frame
30 Mold for compression molding
31 Upper mold
31a Upper mold base
31b Upper hold block
31c Board set block
31d Heater for upper die heating
31e Seal member
31f Seal member
32 Lower mold
32a Lower mold base
32b Lower hold block
32c Cavity bottom member
32d cavity side member
32e Elastic member
32f Lower heater
32g sealing material
33 Plastic molding part
33a Lower mold cavity
33b Housing for excess resin
33c Narrow gap
33d Package thickness
40 Uniform pressure means
41 Upper mold uniform pressure means
41a Upper horizontal space
41b Elastic container
41c Communication route
42 Lower mold uniform pressure means
42a Lower mold horizontal space
42b Elastic container
42c Communication route
43 Pressure adjustment mechanism
44 Pressure medium
50-type opening / closing mechanism (toggle mechanism)
51 base
51a axis
52 Movable platen
52a axis
53 Servo motor
53a Output shaft
53b Pulley
53c belt
54 Screw shaft
55 Nut member
56a First link
56b Second link
56c 3rd link
60 Release film
70 Large board
71 Electronic components
80 Sheet resin (sheet resin material)
80a Molten resin material
80b Surplus resin

Claims (12)

少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型の下面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の樹脂材料中に浸漬させ、次に、前記下型キャビティ内の樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
前記上下両型の型締する工程と、
少なくとも、前記下型キャビティ内の樹脂材料を単一のキャビティ底面部材にて所定の樹脂圧を加える工程時において、
前記下型における下型ホールドブロックと前記キャビティ底面部材との間に下型水平空間部を設けると共に、前記下型水平空間部内に弾性収容体を装設し、且つ、前記弾性収容体内に加圧力調節機構にて所定の加圧力に調節した圧力媒体を導入することにより、共通の前記下型キャビティにおける前記キャビティ底面部材の弯曲変形防止工程を兼ねる下型の均等加圧工程とを行うことを特徴とする電子部品の圧縮樹脂封止方法。 Using at least upper mold and compression mold of an electronic component consisting of a lower mold, the mounting surface of and the electronic component supplying the substrate under surface of the upper die causes the engaging applied as downward, release film A resin material is supplied into the lower mold cavity coated with heat and heated, and then the upper and lower molds are closed and the electronic components of the substrate on the upper mold side are placed in the resin material in the lower mold cavity. Compressed resin sealing of electronic parts that are then sealed and molded together with resin by applying a predetermined resin pressure to the resin material in the lower mold cavity. A method,
Clamping the upper and lower molds;
At least in the step of applying a predetermined resin pressure to the resin material in the lower mold cavity with a single cavity bottom member,
A lower mold horizontal space is provided between the lower mold hold block and the cavity bottom member in the lower mold, an elastic container is installed in the lower mold horizontal space, and a pressure is applied to the elastic container. By introducing a pressure medium adjusted to a predetermined pressurizing force by an adjusting mechanism, a lower mold uniform pressurizing step that also serves as a bending deformation preventing process of the cavity bottom member in the common lower mold cavity is performed. Compressed resin sealing method for electronic parts. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型の下面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の樹脂材料中に浸漬させ、次に、前記下型キャビティ内の樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止方法であって、
少なくとも、前記上下両型の型締工程時において、
前記上型における上型ホールドブロックと基板セットブロックとの間に上型水平空間部を設けると共に、前記上型水平空間部内に上型側の弾性収容体を装設し、且つ、前記上型側の弾性収容体内に加圧力調節機構にて所定の加圧力に調節した圧力媒体を導入することにより、共通の前記下型キャビティにおける前記基板セットブロックの弯曲変形防止工程を兼ねる上型の均等加圧工程と、
前記下型における下型ホールドブロックと成形時に樹脂圧を加える単一のキャビティ底面部材との間に下型水平空間部を設けると共に、前記下型水平空間部内に下型側の弾性収容体を装設し、且つ、前記下型側の弾性収容体内に加圧力調節機構にて所定の加圧力に調節した圧力媒体を導入することにより、共通の前記下型キャビティにおける前記キャビティ底面部材の弯曲変形防止工程を兼ねる下型の均等加圧工程とを行うことを特徴とする電子部品の圧縮樹脂封止方法。 Using at least upper mold and compression mold of an electronic component consisting of a lower mold, the mounting surface of and the electronic component supplying the substrate under surface of the upper die causes the engaging applied as downward, release film A resin material is supplied into the lower mold cavity coated with heat and heated, and then the upper and lower molds are closed and the electronic components of the substrate on the upper mold side are placed in the resin material in the lower mold cavity. Compressed resin sealing of electronic parts that are then sealed and molded together with resin by applying a predetermined resin pressure to the resin material in the lower mold cavity. A method,
At least during the mold clamping process of the upper and lower molds,
An upper mold horizontal space is provided between the upper mold hold block and the substrate set block in the upper mold, and an upper mold side elastic container is installed in the upper mold horizontal space, and the upper mold side By introducing a pressure medium adjusted to a predetermined pressing force by a pressing force adjusting mechanism into the elastic housing of the upper mold, the uniform pressurization of the upper mold that also serves as a bending deformation prevention process of the substrate set block in the common lower mold cavity Process,
A lower mold horizontal space is provided between the lower mold hold block in the lower mold and a single cavity bottom member that applies resin pressure during molding, and a lower mold side elastic container is mounted in the lower mold horizontal space. In addition, by introducing a pressure medium adjusted to a predetermined pressure by a pressure adjustment mechanism into the elastic housing on the lower mold side, bending deformation of the cavity bottom member in the common lower mold cavity is prevented. A compression resin sealing method for an electronic component, comprising performing a uniform pressing step of a lower mold that also serves as a step. 前記圧力媒体として流体を用いることを特徴とする請求項１、又は、請求項２に記載の電子部品の圧縮樹脂封止方法。   The method of claim 1 or 2, wherein a fluid is used as the pressure medium. 前記圧力媒体として低熱伝導性のシリコーンオイルを用いることを特徴とする請求項１、又は、請求項２に記載の電子部品の圧縮樹脂封止方法。   The method for compressing an electronic component according to claim 1, wherein a silicone oil having low thermal conductivity is used as the pressure medium. 前記上型側の弾性収容体及び前記下型側の弾性収容体内の夫々に、同じ加圧力調節機構にて所定の加圧力に調節した圧力媒体を導入することを特徴とする請求項２に記載の電子部品の圧縮樹脂封止方法。   The pressure medium adjusted to a predetermined pressure by the same pressure adjustment mechanism is introduced into each of the upper mold-side elastic container and the lower mold-side elastic container. Compressed resin sealing method for electronic parts. 前記上型側の弾性収容体及び前記下型側の弾性収容体内の夫々に、異なる加圧力調節機構にて所定の加圧力に調節した圧力媒体を導入することを特徴とする請求項２に記載の電子部品の圧縮樹脂封止方法。   3. The pressure medium adjusted to a predetermined pressure by a different pressure adjusting mechanism is introduced into each of the upper mold-side elastic container and the lower mold-side elastic container. Compressed resin sealing method for electronic parts. 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型の下面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱し、次に、前記上下両型を閉じる型締めを行って前記上型側における基板の電子部品を前記下型キャビティ内の樹脂材料中に浸漬させ、次に、前記下型キャビティ内の樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記圧縮成形用型に、共通の前記下型キャビティにおける前記下型の弯曲変形防止部材を兼ねる均等加圧手段を備えており、
前記下型の均等加圧手段は、下型ホールドブロックと成形時に樹脂圧を加える単一のキャビティ底面部材との間に設けた下型水平空間部と、前記下型水平空間部内に装設した圧力媒体を導入するための弾性収容体と、前記圧力媒体による加圧力を調節するための加圧力調節機構と、前記加圧力調節機構と前記弾性収容体とを連通接続させるための連通経路とを備えていることを特徴とする電子部品の圧縮樹脂封止装置。 Using at least upper mold and compression mold of an electronic component consisting of a lower mold, the mounting surface of and the electronic component supplying the substrate under surface of the upper die causes the engaging applied as downward, release film A resin material is supplied into the lower mold cavity coated with heat and heated, and then the upper and lower molds are closed and the electronic components of the substrate on the upper mold side are placed in the resin material in the lower mold cavity. Compressed resin sealing of electronic parts that are then sealed and molded together with resin by applying a predetermined resin pressure to the resin material in the lower mold cavity. A device,
The compression molding die is provided with a uniform pressurizing means that also serves as a bending deformation preventing member of the lower mold in the common lower mold cavity,
Uniformly pressurizing means of said lower mold includes a lower horizontal space portion provided between the single cavity bottom member for applying the resin pressure during molding and lower mold holding block and So設the lower horizontal space portion An elastic container for introducing a pressure medium, a pressure adjusting mechanism for adjusting a pressure applied by the pressure medium, and a communication path for connecting the pressure adjusting mechanism and the elastic container. A compressed resin sealing device for electronic parts, comprising: 少なくとも上型と下型とから成る電子部品の圧縮成形用型を用いて、前記上型の下面に基板を供給し且つその電子部品の装着面側を下向きとして係着させると共に、離型フイルムを被覆した下型キャビティ内に樹脂材料を供給して加熱し、次に、前記上下両型を閉じる型締めを行って前記上型側における大形基板の電子部品を前記下型キャビティ内の樹脂材料中に浸漬させ、次に、前記下型キャビティ内の樹脂材料に所定の樹脂圧を加えることにより、前記基板上に装着した電子部品を樹脂により一括して封止成形する電子部品の圧縮樹脂封止装置であって、
前記圧縮成形用型に、共通の前記下型キャビティにおける前記上型及び前記下型の弯曲変形防止部材を兼ねる均等加圧手段を備えており、
また、前記均等加圧手段は、上型の均等加圧手段及び下型の均等加圧手段とを含み、
また、前記上型の均等加圧手段は、上型ホールドブロックと基板セットブロックとの間に設けた上型水平空間部と、前記上型水平空間部内に装設した圧力媒体を導入するための弾性収容体と、前記圧力媒体による加圧力を調節するための加圧力調節機構と、前記加圧力調節機構と前記弾性収容体とを連通接続させるための連通経路とを備えており、
また、前記下型の均等加圧手段は、下型ホールドブロックと成形時に樹脂圧を加える単一のキャビティ底面部材との間に設けた下型水平空間部と、前記下型水平空間部内に装設した圧力媒体を導入するための弾性収容体と、前記圧力媒体による加圧力を調節するための加圧力調節機構と、前記加圧力調節機構と前記弾性収容体とを連通接続させるための連通経路とを備えていることを特徴とする電子部品の圧縮樹脂封止装置。 Using at least upper mold and compression mold of an electronic component consisting of a lower mold, the mounting surface of and the electronic component supplying the substrate under surface of the upper die causes the engaging applied as downward, release film The resin material is supplied into the lower mold cavity coated with heat and heated, and then the upper and lower molds are closed to clamp the electronic component of the large substrate on the upper mold side with the resin in the lower mold cavity. Compressed resin for electronic parts that is immersed in the material, and then encapsulated with the resin for electronic parts mounted on the substrate by applying a predetermined resin pressure to the resin material in the lower mold cavity A sealing device,
The compression molding die is provided with a uniform pressure means that also serves as a bending deformation preventing member for the upper die and the lower die in the common lower die cavity,
The uniform pressure means includes an upper mold uniform pressure means and a lower mold uniform pressure means,
The upper mold equal pressure means is for introducing an upper mold horizontal space provided between the upper mold hold block and the substrate set block, and a pressure medium installed in the upper mold horizontal space. An elastic container, a pressure adjusting mechanism for adjusting the pressure applied by the pressure medium, and a communication path for connecting the pressure adjusting mechanism and the elastic container.
The lower mold equal pressure means includes a lower mold horizontal space provided between the lower mold hold block and a single cavity bottom member to which resin pressure is applied during molding, and the lower mold horizontal space is mounted in the lower mold horizontal space. An elastic container for introducing the pressure medium, a pressure adjusting mechanism for adjusting the pressure applied by the pressure medium, and a communication path for connecting the pressure adjusting mechanism and the elastic container in communication with each other; A compression resin sealing device for electronic parts, comprising: 前記圧力媒体として流体を用いることを特徴とする請求項７、又は、請求項８に記載の電子部品の圧縮樹脂封止装置。   9. The compressed resin sealing device for electronic parts according to claim 7, wherein a fluid is used as the pressure medium. 前記圧力媒体として低熱伝導性のシリコーンオイルを用いることを特徴とする請求項７、又は、請求項８に記載の電子部品の圧縮樹脂封止装置。   9. The compressed resin sealing device for an electronic component according to claim 7, wherein a silicone oil having low thermal conductivity is used as the pressure medium. 前記上型の均等加圧手段の加圧力調節機構と、前記下型の均等加圧手段の加圧力調節機構とを兼用させて構成したことを特徴とする請求項８に記載の電子部品の圧縮樹脂封止装置。 Compression of the electronic component according to claim 8, characterized in that the pressure regulating mechanism equivalent pressurizing means of the upper die, constituted by combined the pressure regulating mechanism of the lower mold isostatic pressing means Resin sealing device. 前記上型の均等加圧手段の加圧力調節機構と、前記下型の均等加圧手段の加圧力調節機構とを個別に配置して構成したことを特徴とする請求項８に記載の電子部品の圧縮樹脂封止装置。 Electronic component according to claim 8, characterized in that the pressure regulating mechanism equivalent pressurizing means of the upper die, and a pressure regulating mechanism of the lower mold isostatic pressing means constituted by arranging separately Compressed resin sealing device.
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