JP4336499B2 - Resin sealing molding method and apparatus for electronic parts - Google Patents

Resin sealing molding method and apparatus for electronic parts Download PDF

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Publication number
JP4336499B2
JP4336499B2 JP2003002949A JP2003002949A JP4336499B2 JP 4336499 B2 JP4336499 B2 JP 4336499B2 JP 2003002949 A JP2003002949 A JP 2003002949A JP 2003002949 A JP2003002949 A JP 2003002949A JP 4336499 B2 JP4336499 B2 JP 4336499B2
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resin
resin material
mold
cavity forming
electronic component
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JP2004216558A (en
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慎二 高瀬
秀樹 徳山
浩 浦上
長 中川
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、ＩＣ等の電子部品の装着した基板が樹脂封止成形用金型に供給された樹脂材料を用いることにより、前記電子部品を樹脂封止成形する、電子部品の樹脂封止成形方法及び装置における改良に関するものである。
【０００２】
【従来の技術】
従来から、電子部品の樹脂封止成形用金型を用いて、前記金型に樹脂材料を供給して、基板に搭載した電子部品である複数個の半導体チップを一括して樹脂封止成形することが行われている。
【０００３】
即ち、従来における電子部品の樹脂封止成形装置は、上型と下型とから成る電子部品の樹脂封止成形用金型と、下型にはタブレット樹脂（樹脂材料）を嵌装させるポットと、ポット内を昇降自在に摺動するプランジャとがあって、まず、半導体チップ（電子部品）を装着した基板が該チップ装着側を上方向にして下型に供給セットして上下型を型締めし、次に、予め加熱溶融化されたタブレット樹脂を溶融樹脂としてポット内のプランジャで押圧し、次に、上型に設けた該チップを嵌装セットするキャビティに溶融樹脂を注入充填し、次に、溶融樹脂が硬化してキャビティ部分と樹脂通路部分とが一体で形成された樹脂成形体を構成し、次に、一体で形成された樹脂成形体を金型より取出してキャビティ部分と樹脂通路部分とを分離する。
以上のことから、キャビティ部分の硬化した樹脂成形後の樹脂封止成形済基板（製品）が完成されて、カル部・ポット部・ランナ部における樹脂通路部分の硬化した樹脂を不要な樹脂材料として廃棄する（例えば、特許文献１参照。）。
【０００４】
【特許文献１】
特開２００１−２８３７７号公報（第４頁、第１図）
【０００５】
【発明が解決しようとする課題】
しかしながら、前述の従来技術を用いて、例えば、複数個の該チップと基板とを電気的に接続するワイヤを装着した基板を、タブレット樹脂を溶融樹脂としてポット内のプランジャを押圧して樹脂通路を介して、該チップとワイヤとが嵌装セットされたキャビティ内に溶融樹脂を注入充填する、トランスファー成形の場合、基板上と樹脂通路とが接触状態で溶融樹脂をキャビティ側面から溶融樹脂を注入充填するので、ワイヤが変形したり或いは断線したりしてワイヤ不良が頻繁に発生すると云う問題があった。
【０００６】
従って、従来のトランスファー成形における金型構造に有するポットとプランジャと樹脂通路部分とを全く設けない、即ち、上下両型を用いて、上型には該チップとワイヤとを装着した基板における該チップ側を下方向に向けた状態で装着固定すると共に、下型に備えたキャビティに樹脂材料を樹脂材料供給機構にてキャビティ内に供給して、キャビティ内の樹脂材料を加熱溶融化して溶融樹脂として、上下両型を型締めすることにより、該チップとワイヤとを溶融樹脂に浸漬内包して樹脂封止成形する基板浸漬成形が行われようになってきた。
また、前記した基板浸漬成形においても、近年の基板の大型化・薄型化や、半導体チップ（電子部品）の極小化・極薄化や、一枚の基板上に複数個の該チップを装着して一括モールドすることから、キャビティの鉛直方向の厚みが非常に薄くなるうえに、キャビティ水平面が非常に広くなるので、樹脂材料としてタブレット樹脂を使用せずに、例えば、顆粒樹脂が用いられることが検討されている。
しかしながら、顆粒樹脂をキャビティにそのまま樹脂材料供給機構から自然落下させて供給した場合、顆粒樹脂の粒子間に空隙部が形成されて空気を多量に含んだ状態で不均一な状態で供給されることになる、つまりは、顆粒樹脂とキャビティ面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることが難しく、顆粒樹脂内の温度差が生じることになって、その状態で顆粒樹脂が溶融樹脂となったとしても多量に含んだ空気が溶融樹脂内にボイドとして残留することになる、この状態で基板浸漬成形にて該チップとワイヤとをキャビティ内に嵌装セットして樹脂封止成形された製品となる樹脂成形済基板における樹脂成形体部分にボイドが発生したり、未充填が発生したりする製品不良が発生するので、製品の歩留まりを著しく低下させると云う問題があった。
また、ボイドを含有した樹脂材料を溶融樹脂とするのには、加熱溶融化時間や溶融樹脂を硬化する硬化所要時間における装置の稼動時間を長びかせてしまうので、製品の生産性を著しく低下させると云う問題があった。
【０００７】
即ち、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供することを目的とするものである。
【０００８】
【課題を解決するための手段】
前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形方法は、上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型を用いて、上型の所定位置に電子部品を装着した基板を装着固定した状態で下型に形成されたキャビティ形成部に樹脂材料供給機構によって顆粒樹脂からなる樹脂材料を供給し、加熱機構によって樹脂材料を加熱溶融化して溶融樹脂を形成し、金型を型締めすることによって溶融樹脂に電子部品を浸漬内包した後に溶融樹脂を硬化させて硬化樹脂を形成する電子部品の樹脂封止成形方法であって、金型の型開き時において、樹脂材料供給機構における樹脂材料が平坦になるように樹脂材料を均一に加圧する工程と、樹脂材料供給機構から均一に加圧された樹脂材料をキャビティ形成部に供給する工程とを備えるとともに、樹脂材料供給機構は、枠体部と該枠体部に囲まれ樹脂材料が収容される空間部と該空間部の下方に設けられ空間部を開閉する開閉部とを有しており、開閉部を開くことによって樹脂材料をキャビティ形成部に供給し、キャビティ形成部における樹脂材料は、加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする。
【０００９】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形方法は、上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型を用いて、上型の所定位置に電子部品を装着した基板を装着固定した状態で下型に形成されたキャビティ形成部に樹脂材料供給機構によって顆粒樹脂からなる樹脂材料を供給し、加熱機構によって樹脂材料を加熱溶融化して溶融樹脂を形成し、金型を型締めすることによって溶融樹脂に電子部品を浸漬内包した後に溶融樹脂を硬化させて硬化樹脂を形成する電子部品の樹脂封止成形方法であって、樹脂材料供給機構から樹脂材料をキャビティ形成部に供給する工程と、金型の型開き時において、キャビティ形成部に供給された樹脂材料が平坦になるように樹脂材料を均一に加圧する工程とを備えるとともに、樹脂材料供給機構は、枠体部と該枠体部に囲まれ樹脂材料が収容される空間部と該空間部の下方に設けられ空間部を開閉する開閉部とを有しており、開閉部を開くことによって樹脂材料をキャビティ形成部に供給し、キャビティ形成部における樹脂材料は、加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする。
【００１０】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形方法は、上述した樹脂封止成形方法において、加熱機構は、下型を介して、又は、樹脂材料とは非接触である状態においてキャビティ形成部の上方から、樹脂材料を加熱することを特徴とする。
【００１１】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型と、上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、下型に形成され電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、キャビティ形成部に顆粒樹脂からなる樹脂材料を供給する樹脂材料供給機構と、キャビティ形成部に供給された樹脂材料を加熱溶融化して溶融樹脂を形成する加熱機構とを含む電子部品の樹脂封止成形装置であって、金型の型開き時において、樹脂材料供給機構における樹脂材料に下向きの力を加えることによって樹脂材料が平坦になるように樹脂材料を均一に加圧する加圧手段を備えるとともに、樹脂材料供給機構は、枠体部と該枠体部に囲まれ樹脂材料が収容される空間部と該空間部の下方に設けられ空間部を開閉する開閉部とを有しており、開閉部を開くことによって樹脂材料をキャビティ形成部に供給し、キャビティ形成部における樹脂材料は、加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする。
【００１２】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型と、上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、下型に形成され電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、キャビティ形成部に顆粒樹脂からなる樹脂材料を供給する樹脂材料供給機構と、キャビティ形成部に供給された樹脂材料を加熱溶融化して溶融樹脂を形成する加熱機構とを含む電子部品の樹脂封止成形装置であって、金型の型開き時において、キャビティ形成部に供給された樹脂材料に下向きの力を加えることによって樹脂材料が平坦になるように樹脂材料を均一に加圧する加圧手段を備えるとともに、樹脂材料供給機構は、枠体部と該枠体部に囲まれ樹脂材料が収容される空間部と該空間部の下方に設けられ空間部を開閉する開閉部とを有しており、開閉部を開くことによって樹脂材料をキャビティ形成部に供給し、キャビティ形成部における樹脂材料は、加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする。
【００１３】
また、前記した技術的課題を解決するために本発明に係る電子部品の樹脂封止成形装置は、上述した樹脂封止成形装置において、加熱機構は、下型に設けられ、又は、キャビティ形成部の上方において樹脂材料とは非接触になるようにして設けられていることを特徴とする。
【００１４】
【発明の実施の形態】
即ち、基本的に、電子部品の樹脂封止成形用金型と、前記した金型のうち上型に電子部品を装着した基板を装着固定する基板固定手段と、前記した金型のうち少なくとも下型に形成された電子部品を嵌装セットするキャビティ形成部と、キャビティ形成部に樹脂材料を供給する樹脂材料供給機構と、キャビティ形成部に供給された樹脂材料を加熱溶融化する少なくとも前記下型に備えた金型加熱機構とを設けた樹脂封止成形装置の基板浸漬成形における金型の型開き時において、当該樹脂材料をキャビティ形成部に供給前に均一に加圧する加圧手段と、キャビティ形成部に当該樹脂材料を供給後に均一に加圧する前記した加圧手段もしくは別の加圧手段とを、適宜に組合わせて設けることを特徴とする。
また、キャビティ形成部に均一に加圧された当該樹脂材料を加熱溶融化して溶融樹脂とする時に、金型加熱機構に加えて、金型の型開き時において、当該樹脂材料と非接触状態にある加熱手段にてさらに加熱溶融化することを促進することができる。
従って、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供できる。
【００１５】
【実施例】
以下、図１乃至図６に基づいて、詳細に説明する。
なお、図１乃至図６は、本発明での樹脂封止成形装置の概略縦断面図である。
【００１６】
即ち、本発明に係る装置は、例えば、図１（１）に示すように、上型１と該上型１と相対向配置された少なくとも下型２とを備えた電子部品の樹脂封止成形用金型と、前記した金型のうち上型１の上型面３に電子部品を装着した基板９を装着固定する基板固定手段５と、前記した金型のうち少なくとも下型２の下型面４に形成された電子部品を嵌装セットするキャビティ形成部６と、キャビティ形成部６に樹脂材料を供給する樹脂材料供給機構７と、キャビティ形成部６に供給された樹脂材料を加熱溶融化する少なくとも下型２に埋設した金型加熱機構８とを設けている。
なお、電子部品を装着した基板９とは、図１（１）で示すように、例えば、電子部品である複数個の半導体チップ１０と該チップ１０と基板９とを電気的に接続するワイヤ１１とで構成された所定個所にマトリクス状に配列され装着した任意の形状である一枚の基板９を示していると共に、複数個の該チップ１０とワイヤ１１とを加熱溶融化された樹脂材料にて一括モールドする樹脂成形体１２と一括モールドされない電子部品装着側に形成された基板外周部１３とで構成されている。
また、キャビティ形成部６に供給される樹脂材料とは、図１（１）で示すように、例えば、前記した基板９の樹脂成形体１２を一括モールドするために必要な所要量の顆粒樹脂１４を示していると共に、樹脂材料供給機構７からキャビティ形成部６に金型の型開き時に当該顆粒樹脂１４を供給するように構成されている。
また、金型加熱機構８は、図１（１）で示すように、例えば、キャビティ形成部６に供給された所要量の顆粒樹脂１４（樹脂材料）を加熱溶融化する設定温度にまで上昇させて、キャビティ形成部６の底面のほぼ下部に配置された複数本の加熱ヒータを適宜に埋設されていると共に、顆粒樹脂１４を加熱溶融化して溶融樹脂１５として基板９における樹脂成形体１２部分を一括モールドして溶融樹脂１５を硬化して硬化樹脂１６を形成するように構成されている。
【００１７】
従って、前述した基板９における樹脂成形体１２部分を前記金型にて一括モールドするのには、まず、金型の型開き時において、基板固定手段５における上型面３の所定位置に電子部品側である樹脂成形体１２部分を下方向に向け供給セットすると共に、樹脂材料供給機構７からキャビティ形成部６に所要量の顆粒樹脂１４を供給する（図１（１）参照）。
次に、金型の型開き時において、金型加熱機構８における加熱ヒータにて下型２を加熱してキャビティ形成部６にある所要量の顆粒樹脂１４を加熱溶融化して溶融樹脂１５とする（図１（２）参照）。
次に、キャビティ形成部６にある溶融樹脂１５に金型を型締めする、つまりは、基板外周部１３と下型面４とが当接することで型締め状態となって、樹脂成形体１２部分である複数個の該チップ１０とワイヤ１１とを浸漬内包して一括モールドする基板浸漬成形を行う（図２（１）参照）。
次に、溶融樹脂１５に浸漬内包された樹脂成形体１２部分を硬化させる硬化所要時間経過後に硬化樹脂１６を形成された基板９である樹脂成形済基板１７（製品）が成形されて、金型が型開き時に、基板固定手段５における上型面３の所定位置に樹脂成形済基板１７を装着固定した状態で硬化樹脂１６部分とキャビティ形成部６より離型して型開き状態となる（図２（２）参照）。
【００１８】
ここで、本発明に係る装置の第一の特徴部分は、所要量の顆粒樹脂１４をキャビティ形成部６に供給する前に、当該顆粒樹脂１４を均一に加圧することであり、図３と図４とを用いて、以下に説明する。
【００１９】
つまり、本発明に係る装置において、例えば、図３（１）に示すように、樹脂材料供給機構７は、所要量の顆粒樹脂１４を供給する後述する枠体部１９と開閉部２０とで形成される樹脂材料供給用の樹脂供給空間部１８と、該空間部１８の顆粒樹脂１４を包囲する鉛直方向に貫通した枠体部１９と、該空間部１８の底面を形成し且つ水平方向に往復動可能な該枠体部１９底面に敷設された開閉部２０とを設けていることである。
また、該枠体部１９の貫通部分に嵌装して当該顆粒樹脂１４を該空間部１８で均一に加圧し且つ鉛直方向に上下往復動する加圧手段２１とを設けている。
この場合、まず、加圧手段２１と樹脂材料供給機構７とが離間した状態で、樹脂材料供給機構７における樹脂供給空間部１８を形成した状態、つまりは、開閉部２０が枠体部１９底面の貫通部分を閉じた状態で、所要量の顆粒樹脂１４を該空間部１８に供給する（図３（１）参照）。
次に、樹脂供給空間部１８にある顆粒樹脂１４を加圧手段２１に形成された樹脂加圧面２２と顆粒樹脂１４が接触し且つ枠体部１９の内周囲に樹脂加圧面２２と鉛直方向に平行に形成された樹脂加圧部２３の外周囲が嵌装されて、加圧手段２１が顆粒樹脂１４を鉛直方向へ下動することにより当該顆粒樹脂１４を均一に加圧すると共に、金型の型開き時において、加圧手段２１にて均一に加圧した状態の樹脂材料供給機構７が、キャビティ形成部６の所定位置における直上部に供給される（図３（２）参照）。
次に、金型の型開き時において、加圧手段２１にて均一に加圧された当該顆粒樹脂１４を、樹脂材料供給機構７における開閉部２０が水平方向にスライドして開く状態、つまりは、図例における左方向に開閉部２０がスライドするのと略同時に、均一に加圧された所要量の顆粒樹脂１４の一部分がキャビティ形成部６に落下して供給される（図４（１）参照）。
次に、金型の型開き時において、加圧手段２１にて均一に加圧された当該顆粒樹脂１４を、樹脂材料供給機構７における開閉部２０が水平方向にスライドして枠体部１９の貫通部分から完全に左方向に退くのと略同時に、加圧手段２１にて均一に加圧した所要量の顆粒樹脂１４がキャビティ形成部６に完全に供給される（図４（２）参照）。
このとき、樹脂材料供給機構７における枠体部１９の貫通部分に樹脂加圧部２３が完全に嵌装されて樹脂加圧面２２が枠体部１９底面よりもほぼ同じか突出するように構成されていると共に、加圧手段２１が枠体部１９の貫通部分より落下しないように枠体部１９天面に当接し且つ樹脂加圧部２３の上面部分を樹脂加圧面２２よりも広く形成されている。
次に、前述した図４（２）から顆粒樹脂供給機構７と加圧手段２１とが金型外部へ退いた後、図１（１）で示すように、均一に加圧された所要量の顆粒樹脂１４をキャビティ形成部６に供給することになる。
次に、図１（２）と図２（１）と図２（２）とで示す基板浸漬成形にて順次実施して、電子部品を装着した基板９を一括モールドして樹脂成形済基板１７（製品）が成形される。
つまり、顆粒樹脂１４の粒子間に空隙部が形成されずに均一な状態で供給されるので、顆粒樹脂１４とキャビティ形成部６底面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることができて、顆粒樹脂１４内の温度差が生じることなく、溶融樹脂１５内のボイドを効率良く防止できる。
従って、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型を用いて、前記金型に樹脂材料（顆粒樹脂１４）を均一に加圧して供給することにより、製品のボイドや未充填等の製品不良を効率良く防止することができる。
【００２０】
ここで、本発明に係る装置の第二の特徴部分は、樹脂材料供給機構７によってキャビティ形成部６に所要量の顆粒樹脂１４を供給した後に、キャビティ成形部６にある所要量の顆粒樹脂１４を均一に加圧することであり、図５を用いて、以下に説明する。
【００２１】
つまり、従来の基板浸漬成形による樹脂材料供給機構７と同様に、所要量の顆粒樹脂１４をキャビティ形成部６に不均一な状態のままで供給してから、図５（１）で示すように、例えば、キャビティ形成部６底面よりもほぼ同じか小さい樹脂加圧面２４を有する鉛直方向に上下往復動し且つキャビティ形成部６の当該顆粒樹脂１４を均一に加圧する図３（１）で示す加圧手段２１もしくは別の加圧手段２５を設けることである。
この場合、まず、従来の基板浸漬成形による樹脂材料供給機構７と同様に、所要量の顆粒樹脂１４をキャビティ形成部６に不均一な状態のままで供給する。
次に、加圧手段２１もしくは別の加圧手段２５が、不均一な所要量の顆粒樹脂１４を有するキャビティ形成部６の所定位置における直上部に供給される（図５（１）参照）。
次に、所要量の顆粒樹脂１４を有するキャビティ形成部６の所定位置における直上部に供給された加圧手段２１もしくは別の加圧手段２５が下動することにより、不均一な当該顆粒樹脂１４をキャビティ形成部６内で均一に加圧される（図５（２）参照）。
次に、前述した図５（２）から加圧手段２１もしくは別の加圧手段２５とが金型外部へ退いた後、図１（１）で示すように、所要量の顆粒樹脂１４がキャビティ形成部６で均一に加圧された状態となる。
次に、図１（２）と図２（１）と図２（２）とで示す基板浸漬成形にて順次実施して、電子部品を装着した基板９を一括モールドして樹脂成形済基板１７（製品）が成形される。
つまり、顆粒樹脂１４の粒子間に空隙部が形成されずに均一な状態となるので、顆粒樹脂１４とキャビティ形成部６底面との接触面側から樹脂表面側へ満遍なく樹脂全体に熱を伝えることができて、顆粒樹脂１４内の温度差が生じることなく、溶融樹脂１５内のボイドを効率良く防止できる。
従って、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型を用いて、前記金型内で樹脂材料（顆粒樹脂１４）を均一に加圧することにより、製品のボイドや未充填等の製品不良を効率良く防止することができる。
【００２２】
更に、前述した本発明に係る装置における第一及び第二の特徴部分のいずれか一方のみを実施するのではなく、適宜に組合わせることにより、キャビティ形成部６の鉛直方向の厚みが非常に薄くなったり、キャビティ形成部６の水平面が非常に広くなったとしても、図３（１）或いは図５（１）で示す各加圧手段２１・２５で、所要量の顆粒樹脂１４を均一に加圧できるので、製品のボイドや未充填等の製品不良をより一層、効率良く防止することができる。
【００２３】
加えて、本発明に係る装置の第三の特徴部分は、キャビティ形成部６に均一に加圧された所要量の当該顆粒樹脂１４（樹脂材料）を、前記した金型が型開きした状態で且つ前記した均一に加圧された顆粒樹脂１４と非接触状態で、前記した金型加熱機構８とは別の樹脂材料用の加熱手段２６を設けることにより、当該顆粒樹脂１４を効率良く加熱溶融化することであり、図６を用いて、以下に説明する。
【００２４】
つまり、図１（１）から図１（２）の動作に至る、当該顆粒樹脂１４を加熱溶融化して溶融樹脂１５とする時に、金型加熱機構８に加えて、金型の型開き時において、当該顆粒樹脂１４と非接触状態にある加熱手段２６に備えた、例えば、図６に示すように、均一に加圧された所要量の顆粒樹脂１４の樹脂表面側から加熱ボード２７・ヒータ２８・断熱ボード２９という任意の順序構成である任意のヒータ板で効率良く加熱溶融化することである。
この場合、当該顆粒樹脂１４と非接触状態にある加熱手段２６であれば、前述した構成ではなく、例えば、遠赤外線やハロゲン等の任意の加熱手段２６を用いてもよい。
従って、加熱溶融化時間や溶融樹脂１５を硬化する硬化所要時間における装置の稼動時間を長びかせることなく、製品の生産性を向上させることができる。
【００２５】
ここで、前述した本発明に係る装置の第一乃至第三の特徴部分は、第一乃至第三の全ての特徴部分、或いは、第一と第三の特徴部分、或いは、第二と第三の特徴部分、或いは、第一の特徴部分のみ、或いは、第二の特徴部分のみを適宜に組合わせて実施することができる。
【００２６】
即ち、本発明は、電子部品である複数個の半導体チップ１０を装着した基板９が樹脂封止成形用金型に均一に加圧された樹脂材料（顆粒樹脂１４）を用いることにより、製品（樹脂成形済基板１７）のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上することができる、電子部品の樹脂封止成形方法及び装置を提供することができる。
【００２７】
なお、第一の特徴部分である所要量の顆粒樹脂１４を樹脂材料供給機構７内で加圧手段２１における樹脂加圧面２２で当該顆粒樹脂１４を水平状態で均一に加圧するように説明してきたが（図３（２）参照）、図示していないが、樹脂加圧面２２を格子状に形成して、所要量の顆粒樹脂１４を丸型や多角型（四角型が好ましい）である任意の形状に区切り、顆粒樹脂１４を均一に加圧するように実施してもよい。
また、樹脂材料供給機構７における開閉部２０において、図４（１）・（２）に示すように、水平方向の片側方向へのみスライドして顆粒樹脂１４をキャビティ形成部６へ供給するような構成で説明しているが、任意の方向でスライドするように実施してもよい、また、図示していないが、開閉部２０を所要の間隔で任意に分割して水平方向に任意の方向でスライドさせたり、任意に分割された開閉部２０を鉛直方向の下側へ各別に各開閉部２０を回動させることにより、開閉状態を行うように適宜に変更して実施してもよい。
【００２８】
なお、第一及び第二の特徴部分である所要量の顆粒樹脂１４を均一に加圧する各加圧手段２１・２５における少なくとも当該顆粒樹脂１４と接触する各樹脂加圧面２２・２４おいては、テフロン（登録商標）等の任意のコーティング材をコーティングして実施してもよい。
また、前記した各加圧手段２１・２５は、当該顆粒樹脂１４と接触させて実施しているが、非接触状態にあるホットエア等の加熱された任意の気体を用いて均一に加圧させてもよい。
【００２９】
また、本実施例においては、顆粒樹脂１４を樹脂材料として用いているが、例えば、任意の複数個のタブレット樹脂を各加圧手段２１・２５でコイン形状等にして任意の形状にて薄くキャビティ形成部６に均一に加圧するような構成にしてもよい。
【００３０】
また、本実施例においては、ワイヤボンデングされた電子部品を樹脂封止成形する構成にて説明してきたが、ワイヤ１１の無い電子部品を搭載されたフリップチップ基板等においても前述の樹脂封止成形を適応することは可能である。
また、本実施例においては、一枚の円型（ウェーハレベルパッケージ型）や多角型（四角型が好ましい）の任意の形状である基板９を一括モールドする構成にしているが、例えば、短冊状の基板９を複数枚配置したり、短冊状の基板９を配置できる専用治具等の任意の治具にて載置固定して前記した装置における基板固定手段５に装着固定するようにして実施してもよい。
【００３１】
また、本実施例においては、金型のうち上型１と下型２（二枚型）のみを図例にて説明してきたが、上下型１・２においても、一括モールドする基板９に対応して、各金型１・２を分割金型構造で実施してもよい、或いは、上下型１・２との間に中間型を設ける三枚型の金型構造にてキャビティ形成部６を中間型と下型２とを型締めして形成するような構成にしてもよい。
この場合、離型フィルムを中間型と下型２との間に供給してキャビティ形成部６の底面を被覆して一括モールドする離型フィルム成形や、或いは、加熱溶融化された樹脂材料により一層、ボイド等の発生を効率良く防止するために少なくとも樹脂材料が接触する金型面を外気遮断範囲として外気遮断範囲の空気等を強制的に吸引して真空引き状態とする真空引き成形とを、一方もしくは両方の成形を併用して実施してもよい。
なお、前記した離型フィルム成形や真空引き成形を本実施例に適宜に選択して実施してもよい。
【００３２】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に変更・選択して採用できるものである。
【００３３】
【発明の効果】
本発明は、本発明は、電子部品である複数個の半導体チップを装着した基板が樹脂封止成形用金型に均一に加圧された樹脂材料を用いることにより、製品のボイドや未充填等の製品不良を効率良く防止して製品の生産性を向上させる、電子部品の樹脂封止成形方法及び装置を提供すると云う優れた効果を奏するものである。
【図面の簡単な説明】
【図１】 図１は、本発明に係る電子部品の樹脂封止成形装置要部の概略拡大縦断面図であって、電子部品の装着された基板を一括モールドする状態を段階的に示す。
【図２】 図２は、図１に対応する前記装置要部の概略拡大縦断面図であって、電子部品の装着された基板を一括モールドする状態を段階的に示す。
【図３】 図３は、図１（１）に至る装置要部の第一の特徴である概略拡大縦断面図であって、樹脂材料を均一に加圧した後に前記金型内に供給する状態を段階的に示す。
【図４】 図４は、図３に対応する前記装置要部の概略拡大縦断面図であって、樹脂材料を均一に加圧した後に前記金型内に供給する状態を段階的に示す。
【図５】 図５は、図１（１）に至る装置要部の第二の特徴である概略拡大縦断面図であって、樹脂材料を前記金型内で均一に加圧する状態を段階的に示す。
【図６】 図６は、図１（１）から図１（２）に至る装置要部の第三の特徴である概略拡大縦断面図であって、前記金型内の均一に加圧された樹脂材料と非接触状態にある加熱手段で加熱溶融化する状態を示す。
【符号の説明】
１ 上型
２ 下型
３ 上型面
４ 下型面
５ 基板固定手段
６ キャビティ形成部
７ 樹脂材料供給機構
８ 金型加熱機構（加熱機構）
９ 基板
１０ 半導体チップ
１１ ワイヤ
１２ 樹脂成形体
１３ 基板外周部
１４ 顆粒樹脂（樹脂材料）
１５ 溶融樹脂
１６ 硬化樹脂
１７ 樹脂成形済基板（製品）
１８ 樹脂供給空間部（空間部）
１９ 枠体部
２０ 開閉部
２１・２５ 加圧手段
２２・２４ 樹脂加圧面
２３ 樹脂加圧部
２６ 加熱手段（加熱機構）
２７ 加熱ボード
２８ ヒータ
２９ 断熱ボード[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a resin sealing molding method for an electronic component, in which the electronic component is resin-sealed by using a resin material supplied to a mold for resin sealing molding of a substrate on which an electronic component such as an IC is mounted. And improvements in the apparatus.
[0002]
[Prior art]
  Conventionally, a resin sealing mold for electronic parts is used to supply a resin material to the mold, and a plurality of semiconductor chips which are electronic parts mounted on a substrate are collectively molded by resin sealing. Things have been done.
[0003]
  That is, a conventional resin-sealing molding apparatus for electronic parts includes a mold for resin-sealing molding of electronic parts composed of an upper mold and a lower mold, and a pot for fitting tablet resin (resin material) into the lower mold. There is a plunger that slides up and down in the pot. First, the substrate on which the semiconductor chip (electronic component) is mounted is supplied and set to the lower mold with the chip mounting side facing upward, and the upper and lower molds are clamped Next, the tablet resin heated and melted in advance is pressed as a molten resin with a plunger in the pot, and then the molten resin is injected and filled into a cavity in which the chip provided in the upper mold is fitted and set. Next, the molten resin is cured to form a resin molded body in which the cavity portion and the resin passage portion are integrally formed. Next, the integrally formed resin molded body is taken out from the mold, and the cavity portion and the resin passage are formed. Separate the parts.
  From the above, a resin-encapsulated molded substrate (product) after resin molding in which the cavity portion is cured is completed, and the cured resin in the resin passage portion in the cull portion, pot portion, and runner portion is used as an unnecessary resin material. Discard (for example, refer to Patent Document 1).
[0004]
[Patent Document 1]
          JP 2001-28377 A (page 4, FIG. 1)
[0005]
[Problems to be solved by the invention]
  However, using the above-described conventional technology, for example, a substrate on which a wire for electrically connecting a plurality of the chips and the substrate is mounted, a tablet resin is used as a molten resin, and a plunger in the pot is pressed to form a resin passage. In the case of transfer molding, the molten resin is injected and filled from the side of the cavity while the substrate and the resin passage are in contact with each other. Therefore, there has been a problem that wire defects frequently occur due to deformation or disconnection of the wire.
[0006]
  Therefore, the pot, plunger, and resin passage portion of the mold structure in the conventional transfer molding are not provided at all. That is, the upper and lower molds are used, and the chip on the substrate on which the chip and the wire are mounted on the upper mold. It is mounted and fixed with the side facing downward, and resin material is supplied into the cavity in the cavity provided in the lower mold by the resin material supply mechanism, and the resin material in the cavity is heated and melted as a molten resin Substrate dip molding has been performed in which both the upper and lower molds are clamped to immerse the chip and wire in a molten resin and encapsulate the resin.
  Also in the above-mentioned substrate immersion molding, the recent increase in size and thickness of the substrate, the miniaturization and thickness reduction of semiconductor chips (electronic components), and mounting of a plurality of chips on a single substrate. In addition, since the vertical thickness of the cavity becomes very thin and the cavity horizontal plane becomes very wide, for example, a granule resin may be used without using a tablet resin as a resin material. It is being considered.
  However, when the granular resin is supplied to the cavity as it is by being naturally dropped from the resin material supply mechanism, a gap is formed between the particles of the granular resin, and the granular resin is supplied in a non-uniform state with a large amount of air. In other words, it is difficult to transfer heat uniformly from the contact surface side of the granule resin to the cavity surface from the resin surface side, resulting in a temperature difference in the granule resin, and in that state the granule resin Even if the resin becomes molten resin, a large amount of air remains as voids in the molten resin. In this state, the chip and the wire are fitted and set in the cavity by substrate immersion molding, and the resin is sealed. Product defects such as voids in the molded resin part of the resin-molded substrate that becomes a molded product, or unfilled parts occur, which significantly reduces the product yield. There has been a problem that the cell is.
  In addition, when resin materials containing voids are used as molten resin, the product operation time is significantly reduced because the operation time of the equipment during the heat melting time and the time required for curing the molten resin is prolonged. There was a problem of letting it.
[0007]
  That is, the present invention uses a resin material in which a substrate on which a plurality of semiconductor chips, which are electronic components, are mounted, is uniformly pressed on a mold for resin sealing molding. It is an object of the present invention to provide a resin sealing molding method and apparatus for electronic parts, which efficiently prevent defects and improve product productivity.
[0008]
[Means for Solving the Problems]
  In order to solve the above technical problem, the resin sealing molding method of the electronic component according to the present invention is as follows.A mold having an upper mold and a lower moldResin sealing of electronic partsMold for moldingUsing,Upper moldA board with electronic parts mounted on it was fixed in placeLower mold in stateResin material supply mechanism in the cavity forming part formed inThe resin material made of granular resin is supplied by theHeat and meltForming a molten resin, Clamping the moldBy molten resinImmersion electronic partsAfter curing the molten resin to form a cured resinA resin sealing molding method for electronic parts,MoldWhen opening the moldThe resin material so that the resin material in the resin material supply mechanism is flat.Uniform pressureAnd a resin material that is uniformly pressurized from the resin material supply mechanismSupplying to the cavity forming section;The resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. The resin material is supplied to the cavity forming part by opening the opening / closing part, and the resin material in the cavity forming part is flat enough to uniformly transmit the heat from the heating mechanism.It is characterized by that.
[0009]
  Further, in order to solve the above technical problem, the resin sealing molding method of the electronic component according to the present invention,A mold having an upper mold and a lower moldResin sealing of electronic partsMold for moldingUsing,Upper moldA board with electronic parts mounted on it was fixed in placeLower mold in stateResin material supply mechanism in the cavity forming part formed inThe resin material made of granular resin is supplied by theHeat and meltForming a molten resin, Clamping the moldBy molten resinImmersion electronic partsAfter curing the molten resin to form a cured resinA resin sealing molding method for electronic parts,Resin material from the resin material supply mechanismSupplying the cavity forming section;MoldWhen opening the moldThe resin material supplied to the cavity forming part is flattened.The process of uniformly pressurizingThe resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. The resin material is supplied to the cavity forming part by opening the opening / closing part, and the resin material in the cavity forming part is flat enough to uniformly transfer the heat from the heating mechanism.It is characterized by that.
[0010]
  Further, in order to solve the above technical problem, the resin sealing molding method of the electronic component according to the present invention,In the resin sealing molding method described above, the heating mechanism heats the resin material through the lower mold or from above the cavity forming portion in a state of non-contact with the resin material.It is characterized by that.
[0011]
  In addition, in order to solve the above-described technical problem, an electronic component resin sealing molding apparatus according to the present invention includes:A mold having an upper mold and a lower moldFor resin sealing molding of electronic partsofMold,Upper moldBoard fixing means for mounting and fixing a board on which electronic components are mounted at predetermined positions;Electronic components formed in the lower moldA cavity forming part for resin molding to be fitted and set;The cavity forming part consists of granular resinA resin material supply mechanism for supplying the resin material;Cavity forming partHeating and melting resin material supplied toHeating mechanism to form molten resinA resin sealing molding apparatus for electronic parts including:MoldWhen opening the moldIn the resin material supply mechanism, the resin material is flattened by applying a downward force to the resin material.UniformlyIn addition to the pressurizing means for pressurizing, the resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part The resin material is supplied to the cavity forming part by opening the opening / closing part, and the resin material in the cavity forming part is flat enough to uniformly transmit the heat from the heating mechanism.It is characterized by that.
[0012]
  In addition, in order to solve the above-described technical problem, an electronic component resin sealing molding apparatus according to the present invention includes:A mold having an upper mold and a lower moldFor resin sealing molding of electronic partsofMold,Upper moldBoard fixing means for mounting and fixing a board on which electronic components are mounted at predetermined positions;Electronic components formed in the lower moldA cavity forming part for resin molding to be fitted and set;The cavity forming part consists of granular resinA resin material supply mechanism for supplying the resin material;Cavity forming partHeating and melting resin material supplied toHeating mechanism to form molten resinA resin sealing molding apparatus for electronic parts including:MoldWhen opening the moldThe resin material is flattened by applying a downward force to the resin material supplied to the cavity forming portion.UniformlyIn addition to the pressurizing means for pressurizing, the resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part The resin material is supplied to the cavity forming part by opening the opening / closing part, and the resin material in the cavity forming part is flat enough to uniformly transmit the heat from the heating mechanism.It is characterized by that.
[0013]
  In addition, in order to solve the above-described technical problem, an electronic component resin sealing molding apparatus according to the present invention includes:In the above-described resin sealing molding apparatus, the heating mechanism is provided in the lower mold, or provided in a non-contact manner with the resin material above the cavity forming portion.It is characterized by that.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
  That is, basically, a resin-sealing mold for electronic components, substrate fixing means for mounting and fixing a substrate on which an electronic component is mounted on the upper die, and at least a lower portion of the above-described mold A cavity forming part for fitting and setting electronic parts formed in the mold, a resin material supply mechanism for supplying a resin material to the cavity forming part, and at least the lower mold for heating and melting the resin material supplied to the cavity forming part A pressurizing means for uniformly pressurizing the resin material before supplying it to the cavity forming portion when the mold is opened in the substrate immersion molding of the resin sealing molding apparatus provided with the mold heating mechanism provided in The above-described pressurizing means or another pressurizing means for uniformly pressurizing the resin material after being supplied to the forming portion is provided in an appropriate combination.
  In addition, when the resin material uniformly pressurized in the cavity forming portion is heated and melted to obtain a molten resin, in addition to the mold heating mechanism, when the mold is opened, the resin material is brought into a non-contact state. Further heating and melting with a certain heating means can be promoted.
  Therefore, the present invention uses a resin material in which a substrate on which a plurality of semiconductor chips, which are electronic components, are mounted, is uniformly pressed to a mold for resin sealing molding, thereby enabling products such as product voids and unfilled products. It is possible to provide a resin sealing molding method and apparatus for an electronic component that can efficiently prevent defects and improve product productivity.
[0015]
【Example】
  Hereinafter, a detailed description will be given based on FIGS. 1 to 6.
  1 to 6 are schematic longitudinal sectional views of the resin sealing molding apparatus according to the present invention.
[0016]
  That is, the apparatus according to the present invention is, for example, as shown in FIG. 1 (1), a resin-sealed molding of an electronic component comprising an upper mold 1 and at least a lower mold 2 arranged opposite to the upper mold 1. A metal mold, substrate fixing means 5 for mounting and fixing a substrate 9 on which an electronic component is mounted on the upper mold surface 3 of the upper mold 1 among the molds described above, and a lower mold 2 of at least the lower mold 2 among the molds described above A cavity forming unit 6 for fitting and setting electronic components formed on the surface 4, a resin material supplying mechanism 7 for supplying a resin material to the cavity forming unit 6, and a resin material supplied to the cavity forming unit 6 are heated and melted. A mold heating mechanism 8 embedded in at least the lower mold 2 is provided.
  As shown in FIG. 1A, the substrate 9 on which electronic components are mounted is, for example, a plurality of semiconductor chips 10 that are electronic components and wires 11 that electrically connect the chips 10 and the substrate 9. And a single substrate 9 having an arbitrary shape arranged and mounted in a matrix at predetermined locations, and a plurality of chips 10 and wires 11 are heated and melted into a resin material. And a substrate outer peripheral portion 13 formed on the electronic component mounting side that is not collectively molded.
  The resin material supplied to the cavity forming portion 6 is, for example, as shown in FIG. 1 (1), for example, a required amount of granular resin 14 required for collectively molding the resin molded body 12 of the substrate 9 described above. In addition, the granular resin 14 is supplied from the resin material supply mechanism 7 to the cavity forming portion 6 when the mold is opened.
  Further, as shown in FIG. 1A, the mold heating mechanism 8 raises the required amount of the granular resin 14 (resin material) supplied to the cavity forming unit 6 to a set temperature for heating and melting, for example. In addition, a plurality of heaters disposed substantially below the bottom surface of the cavity forming portion 6 are appropriately embedded, and the granule resin 14 is heated and melted to form a molten resin 15 so that the resin molded body 12 portion of the substrate 9 is formed. The molten resin 15 is cured by batch molding and the cured resin 16 is formed.
[0017]
  Therefore, in order to collectively mold the resin molded body 12 portion of the substrate 9 with the mold, the electronic component is first placed at a predetermined position on the upper mold surface 3 of the substrate fixing means 5 when the mold is opened. The resin molded body 12 that is the side is set to supply downward, and a required amount of granular resin 14 is supplied from the resin material supply mechanism 7 to the cavity forming portion 6 (see FIG. 1A).
  Next, when the mold is opened, the lower mold 2 is heated by the heater in the mold heating mechanism 8 to heat and melt the required amount of the granular resin 14 in the cavity forming portion 6 to obtain a molten resin 15. (See FIG. 1 (2)).
  Next, the mold is clamped to the molten resin 15 in the cavity forming portion 6, that is, the mold is brought into a clamped state by contacting the substrate outer peripheral portion 13 and the lower mold surface 4, and the resin molded body 12 portion Substrate immersion molding is performed in which a plurality of the chips 10 and the wires 11 are immersed and packaged together (see FIG. 2A).
  Next, a resin-molded substrate 17 (product), which is the substrate 9 on which the cured resin 16 is formed, is molded after the time required for curing the resin molded body 12 portion immersed in the molten resin 15 is cured, and the mold is molded. When the mold is opened, the mold is released from the cured resin 16 portion and the cavity forming portion 6 with the resin-molded substrate 17 mounted and fixed at a predetermined position on the upper mold surface 3 of the substrate fixing means 5 (see FIG. 2 (2)).
[0018]
  Here, the first characteristic part of the apparatus according to the present invention is to uniformly pressurize the granular resin 14 before supplying the required amount of the granular resin 14 to the cavity forming unit 6. 4 and will be described below.
[0019]
  That is, in the apparatus according to the present invention, for example, as shown in FIG. 3 (1), the resin material supply mechanism 7 is formed by a frame body portion 19 and an opening / closing portion 20, which will be described later, for supplying a required amount of granular resin 14. The resin supply space 18 for supplying the resin material, the frame portion 19 penetrating in the vertical direction surrounding the granule resin 14 in the space 18, and the bottom surface of the space 18 are formed and reciprocated in the horizontal direction. An opening / closing part 20 laid on the bottom surface of the movable frame body part 19 is provided.
  Further, pressurizing means 21 is provided which is fitted into the penetrating portion of the frame body portion 19 and uniformly pressurizes the granular resin 14 in the space portion 18 and reciprocates up and down in the vertical direction.
  In this case, first, in a state where the pressurizing means 21 and the resin material supply mechanism 7 are separated from each other, the resin supply space portion 18 in the resin material supply mechanism 7 is formed, that is, the opening / closing portion 20 is the bottom surface of the frame body portion 19. A required amount of the granular resin 14 is supplied to the space 18 in a state where the penetrating portion is closed (see FIG. 3A).
  Next, the granule resin 14 in the resin supply space 18 is brought into contact with the resin pressurization surface 22 formed on the pressurizing means 21 and the granule resin 14, and the resin pressurization surface 22 and the vertical direction are formed in the inner periphery of the frame body portion 19. The outer periphery of the resin press part 23 formed in parallel is fitted, and the pressurizing means 21 presses the granule resin 14 uniformly by moving it downward in the vertical direction. When the mold is opened, the resin material supply mechanism 7 that is uniformly pressurized by the pressurizing means 21 is supplied directly above the cavity forming portion 6 at a predetermined position (see FIG. 3B).
  Next, when the mold is opened, the opening / closing part 20 in the resin material supply mechanism 7 slides and opens the granular resin 14 uniformly pressed by the pressing means 21 in a horizontal direction, that is, At the same time as the opening / closing part 20 slides in the left direction in the figure, a part of the required amount of the granular resin 14 that is uniformly pressurized falls and is supplied to the cavity forming part 6 (FIG. 4A). reference).
  Next, when the mold is opened, the opening and closing part 20 in the resin material supply mechanism 7 slides the granule resin 14 uniformly pressurized by the pressurizing means 21 in the horizontal direction. Substantially simultaneously with retreating leftward from the penetrating portion, the required amount of granular resin 14 uniformly pressurized by the pressurizing means 21 is completely supplied to the cavity forming portion 6 (see FIG. 4 (2)). .
  At this time, the resin pressurizing portion 23 is completely fitted into the penetrating portion of the frame body portion 19 in the resin material supply mechanism 7 so that the resin pressurization surface 22 protrudes from the bottom surface of the frame body portion 19 or substantially the same. In addition, the pressing means 21 is in contact with the top surface of the frame body portion 19 so that it does not fall from the penetrating portion of the frame body portion 19 and the upper surface portion of the resin pressure portion 23 is formed wider than the resin pressure surface 22. Yes.
  Next, after the granule resin supply mechanism 7 and the pressurizing means 21 are withdrawn from the mold from FIG. 4 (2), as shown in FIG. The granular resin 14 is supplied to the cavity forming unit 6.
  Next, the substrates 9 are sequentially molded by the substrate immersion molding shown in FIGS. 1 (2), 2 (1), and 2 (2), and the substrate 9 on which the electronic components are mounted is collectively molded to form the resin-molded substrate 17 (Product) is molded.
  That is, since voids are not formed between the particles of the granular resin 14 and are supplied in a uniform state, heat is uniformly applied to the entire resin from the contact surface side between the granular resin 14 and the bottom surface of the cavity forming portion 6 to the resin surface side. The voids in the molten resin 15 can be efficiently prevented without causing a temperature difference in the granule resin 14.
  Accordingly, the substrate 9 on which a plurality of semiconductor chips 10 which are electronic components are mounted uses a resin sealing molding die to uniformly pressurize and supply the resin material (granular resin 14) to the die. Product defects such as product voids and unfilled products can be efficiently prevented.
[0020]
  Here, the second characteristic part of the device according to the present invention is:After supplying the required amount of granular resin 14 to the cavity forming portion 6 by the resin material supply mechanism 7,This is to pressurize the required amount of the granular resin 14 in the cavity molding portion 6 uniformly, and will be described below with reference to FIG.
[0021]
  That is, as in the conventional resin material supply mechanism 7 by substrate immersion molding, a required amount of the granular resin 14 is supplied to the cavity forming portion 6 in a non-uniform state, as shown in FIG. For example, it is shown in FIG. 3 (1) that reciprocates vertically in the vertical direction having a resin pressing surface 24 that is substantially the same or smaller than the bottom surface of the cavity forming portion 6 and uniformly presses the granular resin 14 in the cavity forming portion 6. The pressure means 21 or another pressure means 25 is provided.
  In this case, first, as in the case of the resin material supply mechanism 7 by conventional substrate immersion molding, a required amount of the granular resin 14 is supplied to the cavity forming portion 6 in a non-uniform state.
  Next, the pressurizing means 21 or another pressurizing means 25 is supplied directly above the predetermined position of the cavity forming portion 6 having a non-uniform amount of the granular resin 14 (see FIG. 5 (1)).
  Next, the pressurizing means 21 or another pressurizing means 25 supplied directly above the predetermined position of the cavity forming portion 6 having the required amount of the granule resin 14 is moved down, so that the non-uniform granule resin 14 is obtained. Is uniformly pressed in the cavity forming portion 6 (see FIG. 5B).
  Next, after the pressurizing means 21 or the other pressurizing means 25 withdraws from the mold shown in FIG. 5 (2) to the outside of the mold, as shown in FIG. It will be in the state pressurized uniformly by the formation part 6. FIG.
  Next, the substrates 9 are sequentially molded by the substrate immersion molding shown in FIGS. 1 (2), 2 (1), and 2 (2), and the substrate 9 on which the electronic components are mounted is collectively molded to form the resin-molded substrate 17 (Product) is molded.
  That is, since no voids are formed between the particles of the granule resin 14 and a uniform state is obtained, heat is uniformly transferred from the contact surface side between the granule resin 14 and the bottom surface of the cavity forming portion 6 to the resin surface side. The voids in the molten resin 15 can be efficiently prevented without causing a temperature difference in the granular resin 14.
  Accordingly, the substrate 9 on which a plurality of semiconductor chips 10 which are electronic components are mounted uses a resin sealing mold, and the resin material (granular resin 14) is uniformly pressed in the mold, whereby a product is obtained. It is possible to efficiently prevent product defects such as voids and unfilled products.
[0022]
  Furthermore, the vertical thickness of the cavity forming portion 6 is very thin by appropriately combining one of the first and second characteristic portions in the apparatus according to the present invention described above. Even if the horizontal surface of the cavity forming portion 6 becomes very wide, the required amount of granular resin 14 is uniformly added by the pressurizing means 21 and 25 shown in FIG. 3 (1) or FIG. 5 (1). Therefore, product defects such as product voids and unfilled products can be more efficiently prevented.
[0023]
  In addition, the third characteristic part of the apparatus according to the present invention is that the required amount of the granule resin 14 (resin material) uniformly pressed onto the cavity forming portion 6 is in a state where the mold is opened. In addition, by providing a heating means 26 for the resin material different from the mold heating mechanism 8 in a non-contact state with the uniformly pressurized granular resin 14, the granular resin 14 is efficiently heated and melted. This will be described below with reference to FIG.
[0024]
  That is, when the granule resin 14 is heated and melted to obtain the molten resin 15 from the operation of FIG. 1 (1) to FIG. 1 (2), in addition to the mold heating mechanism 8, when the mold is opened. For example, as shown in FIG. 6, the heating means 26 provided in the heating means 26 in a non-contact state with the granule resin 14 is heated from the resin surface side of the required amount of the granule resin 14 to the heating board 27 and the heater 28. -It is to heat and melt efficiently with an arbitrary heater plate having an arbitrary order configuration of the heat insulating board 29.
  In this case, as long as the heating means 26 is in a non-contact state with the granular resin 14, any heating means 26 such as far infrared rays or halogen may be used instead of the above-described configuration.
  Therefore, the productivity of the product can be improved without prolonging the operation time of the apparatus during the heat melting time and the time required for curing the molten resin 15.
[0025]
  Here, the first to third feature portions of the device according to the present invention described above are all the first to third feature portions, the first and third feature portions, or the second and third feature portions. It is possible to implement a combination of the above-described characteristic parts, only the first characteristic part, or only the second characteristic part as appropriate.
[0026]
  That is, the present invention uses a resin material (granular resin 14) in which a substrate 9 on which a plurality of semiconductor chips 10 as electronic components are mounted is uniformly pressed on a resin sealing molding die. It is possible to provide an electronic component resin sealing molding method and apparatus that can efficiently prevent product defects such as voids or unfilled resin-molded substrates 17) and improve product productivity.
[0027]
  It has been described that the required amount of granular resin 14 as the first characteristic portion is uniformly pressed in a horizontal state on the resin pressing surface 22 of the pressing means 21 in the resin material supply mechanism 7. (See FIG. 3 (2)), although not shown, the resin pressing surface 22 is formed in a lattice shape, and the required amount of the granular resin 14 is round or polygonal (preferably rectangular). The shape may be divided into shapes and the granular resin 14 may be uniformly pressed.
  Further, in the opening / closing part 20 in the resin material supply mechanism 7, as shown in FIGS. 4 (1) and (2), it slides only in one horizontal direction to supply the granular resin 14 to the cavity forming part 6. Although described in the configuration, it may be carried out so as to slide in an arbitrary direction. Although not shown, the opening / closing part 20 is arbitrarily divided at a required interval and horizontally in an arbitrary direction. The opening / closing unit 20 may be slid or rotated arbitrarily so that each opening / closing unit 20 is rotated downward in the vertical direction so that the opening / closing state is appropriately changed.
[0028]
  In each of the pressurizing means 22 and 24 that uniformly pressurize the required amount of the granule resin 14 as the first and second characteristic parts, at least on each of the resin pressurizing surfaces 22 and 24 in contact with the granule resin 14, An arbitrary coating material such as Teflon (registered trademark) may be coated.
  Moreover, although each said pressurizing means 21 * 25 is carried out in contact with the said granular resin 14, it pressurizes uniformly using arbitrary heated gas, such as hot air in a non-contact state. Also good.
[0029]
  In this embodiment, the granular resin 14 is used as a resin material. For example, an arbitrary plurality of tablet resins can be formed into a coin shape or the like by each pressurizing means 21 and 25 to form a thin cavity with an arbitrary shape. You may make it the structure which pressurizes the formation part 6 uniformly.
[0030]
  Further, in the present embodiment, the description has been made with the configuration in which the electronic component bonded by wire is molded by resin sealing, but the above-described resin sealing is also applied to the flip chip substrate on which the electronic component without the wire 11 is mounted. It is possible to adapt the shaping.
  Further, in the present embodiment, the substrate 9 having an arbitrary shape such as a single circular shape (wafer level package type) or a polygonal shape (preferably a square shape) is collectively molded. This is implemented by placing and fixing a plurality of substrates 9 on the substrate fixing means 5 in the above-mentioned apparatus by placing and fixing them with an arbitrary jig such as a dedicated jig capable of arranging strip-shaped substrates 9. May be.
[0031]
  Further, in the present embodiment, only the upper mold 1 and the lower mold 2 (two-sheet mold) of the molds have been described with reference to the drawings, but the upper and lower molds 1 and 2 correspond to the substrate 9 to be collectively molded. Then, the molds 1 and 2 may be implemented in a divided mold structure, or the cavity forming portion 6 is formed by a three-sheet mold structure in which an intermediate mold is provided between the upper and lower molds 1 and 2. The intermediate mold and the lower mold 2 may be formed by clamping.
  In this case, a release film is supplied between the intermediate mold and the lower mold 2 so as to cover the bottom surface of the cavity forming portion 6 and mold all at once, or by heat-melted resin material. In order to efficiently prevent the generation of voids and the like, vacuum drawing molding that forcibly sucks the air in the outside air blocking range with at least the mold surface in contact with the resin material as the outside air blocking range, One or both moldings may be performed in combination.
  Note that the above-described release film molding and vacuum drawing molding may be appropriately selected and carried out in this embodiment.
[0032]
  Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as necessary within a range not departing from the gist of the present invention. .
[0033]
【The invention's effect】
  In the present invention, the present invention uses a resin material in which a substrate on which a plurality of semiconductor chips, which are electronic components, are mounted, is uniformly pressed on a resin sealing molding die, so that the product voids, unfilled, etc. The present invention provides an excellent effect of providing a resin sealing molding method and apparatus for electronic parts that efficiently prevent product defects and improve product productivity.
[Brief description of the drawings]
FIG. 1 is a schematic enlarged longitudinal sectional view of a main part of a resin seal molding apparatus for electronic parts according to the present invention, and shows a state in which a substrate on which electronic parts are mounted is molded in a stepwise manner.
FIG. 2 is a schematic enlarged longitudinal sectional view of the main part of the apparatus corresponding to FIG. 1, and shows a state in which a substrate on which electronic components are mounted is molded in a stepwise manner.
FIG. 3 is a schematic enlarged longitudinal sectional view which is a first feature of the main part of the apparatus leading to FIG. 1 (1), and after the resin material is uniformly pressurized, it is supplied into the mold. Show the status step by step.
FIG. 4 is a schematic enlarged longitudinal sectional view of the main part of the apparatus corresponding to FIG. 3, and shows a state in which a resin material is uniformly pressurized and then supplied into the mold.
FIG. 5 is a schematic enlarged longitudinal sectional view that is a second feature of the main part of the apparatus leading to FIG. 1 (1), and shows a stepwise state in which a resin material is uniformly pressurized in the mold. Shown in
FIG. 6 is a schematic enlarged longitudinal sectional view showing a third feature of the main part of the apparatus from FIG. 1 (1) to FIG. 1 (2), and is uniformly pressurized in the mold. The state which heat-melts with the heating means in a non-contact state with the obtained resin material is shown.
[Explanation of symbols]
  1 Upper mold
  2 Lower mold
  3 Upper mold surface
  4 Lower mold surface
  5 Substrate fixing means
  6 Cavity forming part
  7 Resin material supply mechanism
  8 Mold heating mechanism(Heating mechanism)
  9 Board
  10 Semiconductor chip
  11 wire
  12 resin moldings
  13 Outer part of substrate
  14 Granule resin (resin material)
  15 Molten resin
  16 Cured resin
  17 Resin molded substrate (product)
  18 Resin supply space(Space part)
  19 Frame
  20 Opening and closing part
  21.25 Pressurizing means
  22.24 Resin pressure surface
  23 Resin pressurizing part
  26 Heating means(Heating mechanism)
  27 Heating board
  28 Heater
  29 Insulation board

Claims (6)

上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型を用いて、前記上型の所定位置に電子部品を装着した基板を装着固定した状態で前記下型に形成されたキャビティ形成部に樹脂材料供給機構によって顆粒樹脂からなる樹脂材料を供給し、加熱機構によって前記樹脂材料を加熱溶融化して溶融樹脂を形成し、前記金型を型締めすることによって前記溶融樹脂に前記電子部品を浸漬内包した後に前記溶融樹脂を硬化させて硬化樹脂を形成する電子部品の樹脂封止成形方法であって、
前記金型の型開き時において、前記樹脂材料供給機構における前記樹脂材料が平坦になるように前記樹脂材料を均一に加圧する工程と、
前記樹脂材料供給機構から均一に加圧された前記樹脂材料を前記キャビティ形成部に供給する工程とを備えるとともに、
前記樹脂材料供給機構は、枠体部と該枠体部に囲まれ前記樹脂材料が収容される空間部と該空間部の下方に設けられ前記空間部を開閉する開閉部とを有しており、前記開閉部を開くことによって前記樹脂材料を前記キャビティ形成部に供給し、
前記キャビティ形成部における前記樹脂材料は、前記加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする電子部品の樹脂封止成形方法。Using a mold for resin-seal-molding an electronic component to a mold having an upper die and a lower die, the lower die in a state in which a substrate mounted with an electronic component mounted fixed in a predetermined position of the upper die wherein by a resin material consisting of granular resin by the resin material supplying mechanism supplies, by heating and melting of the resin material to form a molten resin by a heating mechanism, for clamping the mold to the cavity forming part formed on a method of resin-seal-molding an electronic component to form a cured resin of the molten resin is cured after the electronic component is immersed contained in the molten resin,
Oite during mold opening of the mold, a step of the resin material in the resin material supplying mechanism is uniformly pressurized with the resin material to be flattened,
Supplying the resin material uniformly pressurized from the resin material supply mechanism to the cavity forming unit ,
The resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. Supplying the resin material to the cavity forming part by opening the opening and closing part,
The resin sealing molding method for an electronic component, wherein the resin material in the cavity forming portion is flat enough to uniformly transmit heat from the heating mechanism . 上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型を用いて、前記上型の所定位置に電子部品を装着した基板を装着固定した状態で前記下型に形成されたキャビティ形成部に樹脂材料供給機構によって顆粒樹脂からなる樹脂材料を供給し、加熱機構によって前記樹脂材料を加熱溶融化して溶融樹脂を形成し、前記金型を型締めすることによって前記溶融樹脂に前記電子部品を浸漬内包した後に前記溶融樹脂を硬化させて硬化樹脂を形成する電子部品の樹脂封止成形方法であって、
前記樹脂材料供給機構から前記樹脂材料を前記キャビティ形成部に供給する工程と、
前記金型の型開き時において、前記キャビティ形成部に供給された前記樹脂材料が平坦になるように前記樹脂材料を均一に加圧する工程とを備えるとともに、
前記樹脂材料供給機構は、枠体部と該枠体部に囲まれ前記樹脂材料が収容される空間部と該空間部の下方に設けられ前記空間部を開閉する開閉部とを有しており、前記開閉部を開くことによって前記樹脂材料を前記キャビティ形成部に供給し、
前記キャビティ形成部における前記樹脂材料は、前記加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする電子部品の樹脂封止成形方法。Using a mold for resin-seal-molding an electronic component to a mold having an upper die and a lower die, the lower die in a state in which a substrate mounted with an electronic component mounted fixed in a predetermined position of the upper die wherein by a resin material consisting of granular resin by the resin material supplying mechanism supplies, by heating and melting of the resin material to form a molten resin by a heating mechanism, for clamping the mold to the cavity forming part formed on a method of resin-seal-molding an electronic component to form a cured resin of the molten resin is cured after the electronic component is immersed contained in the molten resin,
Supplying the resin material from the resin material supply mechanism to the cavity forming unit;
Oite during mold opening of the mold, together with the resin material supplied to the cavity forming part and a step of uniformly pressurized with the resin material to be flattened,
The resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. Supplying the resin material to the cavity forming part by opening the opening and closing part,
The resin sealing molding method for an electronic component, wherein the resin material in the cavity forming portion is flat enough to uniformly transmit heat from the heating mechanism . 前記加熱機構は、前記下型を介して、又は、前記樹脂材料とは非接触である状態において前記キャビティ形成部の上方から、前記樹脂材料を加熱することを特徴とする請求項１又は２に記載の電子部品の樹脂封止成形方法。 The heating mechanism, through the lower mold, or, as the resin material from above the cavity forming part in a state in which a non-contact, to claim 1 or 2, characterized in that heating the resin material The resin sealing molding method of the electronic component of description. 上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型と、前記上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、前記下型に形成され前記電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、前記キャビティ形成部に顆粒樹脂からなる樹脂材料を供給する樹脂材料供給機構と、前記キャビティ形成部に供給された樹脂材料を加熱溶融化して溶融樹脂を形成する加熱機構とを含む電子部品の樹脂封止成形装置であって、
前記金型の型開き時において、前記樹脂材料供給機構における前記樹脂材料に下向きの力を加えることによって前記樹脂材料が平坦になるように前記樹脂材料を均一に加圧する加圧手段を備えるとともに、
前記樹脂材料供給機構は、枠体部と該枠体部に囲まれ前記樹脂材料が収容される空間部と該空間部の下方に設けられ前記空間部を開閉する開閉部とを有しており、前記開閉部を開くことによって前記樹脂材料を前記キャビティ形成部に供給し、
前記キャビティ形成部における前記樹脂材料は、前記加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする電子部品の樹脂封止成形装置。And the mold for resin-seal-molding an electronic component to a mold having an upper die and a lower die, and the substrate fixing means for attaching fixing the substrate mounted electronic components to a predetermined position of the upper die, the lower a cavity forming part of the resin molding for insert-setting the electronic component is formed in the mold, a resin material supply mechanism for supplying a resin material consisting of granular resin into the cavity forming part, which is supplied to the cavity forming part resin A resin sealing molding apparatus for an electronic component including a heating mechanism for melting and melting a material to form a molten resin ,
A pressure means for uniformly pressing the resin material so that the resin material becomes flat by applying a downward force to the resin material in the resin material supply mechanism when the mold is opened ;
The resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. Supplying the resin material to the cavity forming part by opening the opening and closing part,
The resin sealing molding apparatus for electronic parts, wherein the resin material in the cavity forming portion is flat enough to uniformly transmit heat from the heating mechanism . 上型と下型とを有する金型であって電子部品の樹脂封止成形用の金型と、前記上型の所定位置に電子部品を装着した基板を装着固定する基板固定手段と、前記下型に形成され前記電子部品を嵌装セットする樹脂成形用のキャビティ形成部と、前記キャビティ形成部に顆粒樹脂からなる樹脂材料を供給する樹脂材料供給機構と、前記キャビティ形成部に供給された樹脂材料を加熱溶融化して溶融樹脂を形成する加熱機構とを含む電子部品の樹脂封止成形装置であって、
前記金型の型開き時において、前記キャビティ形成部に供給された前記樹脂材料に下向きの力を加えることによって前記樹脂材料が平坦になるように前記樹脂材料を均一に加圧する加圧手段を備えるとともに、
前記樹脂材料供給機構は、枠体部と該枠体部に囲まれ前記樹脂材料が収容される空間部と該空間部の下方に設けられ前記空間部を開閉する開閉部とを有しており、前記開閉部を開くことによって前記樹脂材料を前記キャビティ形成部に供給し、
前記キャビティ形成部における前記樹脂材料は、前記加熱機構からの熱が満遍なく伝えられる程度に平坦になっていることを特徴とする電子部品の樹脂封止成形装置。And the mold for resin-seal-molding an electronic component to a mold having an upper die and a lower die, and the substrate fixing means for attaching fixing the substrate mounted electronic components to a predetermined position of the upper die, the lower a cavity forming part of the resin molding for insert-setting the electronic component is formed in the mold, a resin material supply mechanism for supplying a resin material consisting of granular resin into the cavity forming part, which is supplied to the cavity forming part resin A resin sealing molding apparatus for an electronic component including a heating mechanism for melting and melting a material to form a molten resin ,
A pressurizing unit that uniformly pressurizes the resin material so as to flatten the resin material by applying a downward force to the resin material supplied to the cavity forming portion when the mold is opened. With
The resin material supply mechanism includes a frame body part, a space part surrounded by the frame body part to accommodate the resin material, and an opening / closing part provided below the space part to open and close the space part. Supplying the resin material to the cavity forming part by opening the opening and closing part,
The resin sealing molding apparatus for electronic parts, wherein the resin material in the cavity forming portion is flat enough to uniformly transmit heat from the heating mechanism . 前記加熱機構は、前記下型に設けられ、又は、前記キャビティ形成部の上方において前記樹脂材料とは非接触になるようにして設けられていることを特徴とする請求項４又は５に記載の電子部品の樹脂封止成形装置。 The heating mechanism is provided in the lower mold, or, according to claim 4 or 5, wherein the a of the resin material above the cavity forming portion is provided so as to be non-contact Resin sealing molding equipment for electronic parts.
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