TWI659817B - Compression molding device, compression molding method, and manufacturing method of compression molded product - Google Patents

Abstract

The present invention provides a compression molding device capable of easily suppressing variations in package thickness. The compression molding apparatus includes a molding die (10) including: an upper mold (100) to which a substrate (1) is fixed; and a lower mold (200) having a cavity (204) to which a resin material is supplied; and A position determining mechanism (207) that maintains the depth of the cavity (204) at a predetermined depth during mold clamping; and a remaining resin storage portion (205) that holds the remaining resin that is not contained in the cavity (204) during mold clamping. ); And the remaining resin separation part (103), when the upper mold (100) and the lower mold (200) are closed, at least a part of the side surface of the remaining resin receiving portion (205) of the substrate (1) contacts the remaining resin separation Component (103) to suppress or prevent resin from overflowing from the end surface of the substrate (1). After the resin in the cavity (204) and the residual resin are hardened, the residual resin separates the component (103) from the upper mold (100). ) And one or both of the lower molds (200) rise or fall to separate the resin hardened in the cavity (204) and the remaining resin hardened in the remaining resin accommodating portion (205).

Description

   Compression molding device, compression molding method, and manufacturing method of compression molded product   

The present invention relates to a compression molding device, a compression molding method, and a method for manufacturing a compression molded product.

As a method for producing a resin molded product, compression molding is used (for example, Patent Document 1).

[Prior technical literature]

[Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-301950.

However, in the case of compression molding, when the amount of resin supplied to the cavity of the molding die varies, the thickness of the package (resin portion of the resin molded product) may also vary.

Therefore, an object of the present invention is to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variations in package thickness.

In order to achieve the object, the compression molding apparatus of the present invention is characterized by including a molding die having: an upper mold; and a lower mold; and a cavity to which a resin material is supplied; and the mold when the mold is closed. The position determining mechanism that maintains the depth of the cavity at a predetermined depth; and a remaining resin accommodating portion that accommodates the remaining resin that is not contained in the cavity during mold clamping; and a remaining resin separating member; in the upper mold and the lower portion Among the molds, one of the molds has the cavity, and the other mold is a mold to which the substrate is fixed; when the upper mold and the lower mold are clamped, the end surface of the remaining resin receiving portion side of the substrate is used. At least a portion of the resin directly or indirectly contacts the remaining resin separation member or one of the molds to suppress or prevent resin from overflowing from the end surface of the substrate; after the resin in the cavity and the remaining resin are hardened, The remaining resin separating member is raised or lowered with respect to one or both of the upper mold and the lower mold to separate the resin hardened in the cavity and the remaining resin accommodating portion. The hardened residual resin.

The compression molding method of the present invention is characterized by comprising: a resin material supplying step of supplying a resin material into a cavity provided in one of the upper mold and the lower mold of the molding mold; and another of the upper mold and the lower mold. A substrate fixing step for fixing a substrate on top; a clamping step for clamping the upper and lower molds of the forming mold; and performing the remaining resin not contained in the cavity in the clamping step A remaining resin accommodating step of accommodating; and a mold opening step of opening the upper mold and the lower mold; and a residual resin separation step of separating the residual resin from the resin hardened in the cavity; In the mold clamping step, at least a part of the end surface of the remaining resin accommodating portion side of the substrate is directly or indirectly contacted with the remaining resin separation member or one of the molds to suppress or prevent from the end surface of the substrate. Resin overflow; in the remaining resin separation step, after the resin in the cavity and the remaining resin are hardened, one or two of the remaining resin separation parts are opposed to the upper mold and the lower mold Side up or down.

The method for producing a compression-molded article of the present invention is characterized in that a resin is compression-molded by the compression-molding method of the present invention.

According to the present invention, it is possible to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variations in package thickness.

1‧‧‧ substrate

2‧‧‧ release film

10, 10a, 10b, 10c

20a‧‧‧ granular resin (resin material)

20b‧‧‧ molten resin (fluid resin)

20c‧‧‧ molten (flowable resin) remaining resin

20d‧‧‧hardened residual resin (residual resin)

20‧‧‧hardened resin (encapsulation resin, encapsulation)

30‧‧‧ Compression molded products (resin molded products)

40‧‧‧Resin supply mechanism

41‧‧‧Resin Supply Department

42‧‧‧ Lower bezel

100‧‧‧ Upper mold

101‧‧‧ Upper mold base part (upper mold base block)

102‧‧‧ Upper mold substrate installation section

103‧‧‧Residual resin separation part (residual resin separation block)

104‧‧‧Elastic parts

105‧‧‧ Jack

106‧‧‧ ejector support

107‧‧‧ Elastic parts

200‧‧‧ lower mold

201‧‧‧ Base parts (lower mold base parts, lower mold base blocks)

202‧‧‧Bottom part (lower mold bottom part)

203‧‧‧side parts (lower mold side parts)

204‧‧‧ Cavity (lower cavity)

205‧‧‧Residual resin container

205a‧‧‧resin channel

206‧‧‧Resin pressure member (resin pressure lever)

207‧‧‧stop (position determining mechanism)

208, 209, 210, 211‧‧‧ elastic parts

221‧‧‧Residual resin receiving part 205 side end face of substrate 1

222‧‧‧ Ladder of side part 203

223‧‧‧221 and 222 contact

300‧‧‧ substrate transfer mechanism (substrate mounter)

301‧‧‧ base parts

302‧‧‧Substrate mounting section

303‧‧‧ substrate displacement mechanism (substrate displacement component)

1000‧‧‧ compression molding device

1100‧‧‧forming unit

1200‧‧‧ substrate supply unit

1210‧‧‧ substrate supply mechanism

1300‧‧‧Resin material supply unit

1310‧‧‧Resin material supply mechanism

1400‧‧‧Control Department (Position Determination Mechanism)

X1 ~ X6‧‧‧‧ Arrows indicating the moving direction of the lower mold 200

Y1‧‧‧ an arrow indicating the moving direction of the ejector pin 105

Z1, Z2‧‧‧ arrows indicating the moving direction of the substrate mounter 300

a1, a2‧‧‧ arrows indicating the movement direction of the lower baffle 42

FIG. 1 is a cross-sectional view schematically showing an example of a mold structure of a compression molding apparatus of the present invention.

FIG. 2 is a cross-sectional view schematically showing one step of an example of the compression molding method of the present invention using the molding die of FIG. 1.

FIG. 3 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

FIG. 4 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

FIG. 5 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

6 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

FIG. 7 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

Fig. 8 is a cross-sectional view schematically showing another step of the compression molding method of Fig. 2.

FIG. 9 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

FIG. 10 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 2.

11 is a cross-sectional view schematically showing another example of a mold structure of a compression molding apparatus according to the present invention.

FIG. 12 is a cross-sectional view schematically showing another example of a molding die structure of the compression molding apparatus of the present invention.

13 is a cross-sectional view schematically showing one step of another example of the compression molding method of the present invention using the molding die of FIG. 1.

FIG. 14 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 13.

FIG. 15 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 13.

FIG. 16 is a cross-sectional view schematically showing another example of a molding die structure of the compression molding apparatus of the present invention and one step of an example of the compression molding method of the present invention using the molding die.

FIG. 17 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 16.

FIG. 18 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 16.

Fig. 19 is a cross-sectional view schematically showing one step of a substrate setting method for setting a substrate on a compression molding apparatus of the present invention using a substrate mounting machine.

FIG. 20 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. 19.

FIG. 21 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. 19.

FIG. 22 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. 19.

FIG. 23 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. 19.

FIG. 24 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. 19.

FIG. 25 is a plan view schematically showing an example of the structure of a compression molding apparatus according to the present invention.

(A) to (c) of FIG. 26 are each a plan view schematically showing an example of a compression molded product and a residual resin structure produced according to the present invention.

(A) to (c) of FIG. 27 are plan views each schematically showing another example of the compression-molded product and the remaining resin structure.

Next, the present invention will be described in further detail by way of examples. However, the present invention is not limited by the following description.

The compression molding apparatus of the present invention can, for example, closely adhere a release film to a mold surface of one of the molds, and during the mold clamping, the substrate end surface and the One of the molds is touching.

In the compression molding apparatus of the present invention, for example, one of the molds has a bottom member and a side member; the bottom member is fixed to a base member; the side member is connected to the base member by an elastic member; The cavity is formed by a space surrounded by the bottom member and the side member; the position determining mechanism includes a stopper fixed on the base member; and the upper mold and the lower mold are combined During the mold, the depth of the cavity is maintained at a predetermined depth by the side member contacting the stopper.

The compression molding apparatus of the present invention may further include a control unit that controls the operation of the molding die, for example. Further, for example, the control unit may control the clamping of the molding die, and the position determination mechanism may include the control unit.

The compression molding apparatus of the present invention further includes, for example, a control unit that controls the operation of the molding die; the one mold has a bottom surface member and a side surface member; the bottom surface member is fixed to a base member; and the side surface member is an elastic member Connected to the base member; forming the cavity by a space surrounded by the bottom member and the side member; the position determining mechanism includes the control portion; the upper mold and the lower member When the mold is closed, the control unit controls one or both of the rising position and the lowering position of one or both of the upper mold and the lower mold to maintain the depth of the cavity at a predetermined depth.

The compression molding apparatus of the present invention may further include, for example, a resin pressing member capable of moving up and down with respect to the remaining resin accommodating portion, and the resin pressing member may pressurize the cavity and the remaining resin storage. In the resin.

The compression molding apparatus of the present invention may further include, for example, a surplus resin containing portion resin material supply mechanism for supplying a resin material to the surplus resin containing portion.

In the compression molding apparatus of the present invention, the remaining resin separating member can clamp and fix the remaining resin between the remaining resin separating member and the remaining resin accommodating portion, for example.

In the compression molding method of the present invention, for example, a mold release film is closely adhered to a mold surface of one of the molds, and when the mold is closed, the substrate end surface can be formed by the mold release film. Make contact with one of the molds.

In the compression molding method of the present invention, for example, one of the molds has a bottom member and a side member; the bottom member is fixed to a base member; the side member is connected to the base member by an elastic member, The cavity is formed by a space surrounded by the bottom surface member and the side surface member; the position determining mechanism includes a stopper fixed on the base member; and during the mold clamping step, The side member is brought into contact with the stopper while maintaining the depth of the cavity to a predetermined depth.

In the compression molding method of the present invention, for example, the molding die has a resin pressing member that can move up and down with respect to the remaining resin accommodating portion, and in the mold clamping step, the resin pressing member can be used, Pressurize the resin in the cavity and in the remaining resin receiving portion.

In the compression molding method of the present invention, for example, in the resin material supplying step, a resin material may be supplied to the remaining resin accommodating portion.

The apparatus for performing the compression molding method of the present invention is not particularly limited, and for example, the compression molding apparatus of the present invention can be used.

In addition, the order of performing each step of the compression molding method of the present invention is not particularly limited. That is, as long as it can be performed, each step of the compression molding method of the present invention may be performed in various orders, or a plurality of steps may be performed simultaneously.

As described above, the method for producing a compression-molded article of the present invention is characterized in that the resin is compression-molded by the compression-molding method of the present invention. In addition, the method for producing a compression-molded article of the present invention is not particularly limited, and may include, for example, steps other than the step of compression-molding the resin by the compression-molding method of the present invention (compression-molding step), May not be included. The other steps are not particularly limited, and may be, for example, a cutting step of cutting an intermediate product manufactured by the compression molding step and separating a finished compression molded product. More specifically, for example, the plurality of wafers arranged on one substrate are manufactured into an intermediate product of compression molding (resin encapsulation) by the compression molding step, and the intermediate is cut by the cutting step. The product is separated into a compression-molded product (finished product) in which a single wafer is sealed with a resin.

In addition, in the present invention, the resin material (resin for resin encapsulation) is not particularly limited, and may be, for example, a thermosetting resin such as epoxy resin and silicone resin, or a thermoplastic resin. Furthermore, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. Examples of the resin form to be supplied to the resin sealing device include a particulate resin, a flowable resin, a sheet resin, a plate resin, and a powder resin.

Further, in the present invention, the "flowable resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. Furthermore, in the present invention, "liquid" means fluidity at normal temperature (room temperature) and flow under the action of force, regardless of the level of fluidity, in other words, regardless of the degree of viscosity. That is, the "liquid resin" in the present invention is a resin that has fluidity at normal temperature (room temperature) and flows under the action of force. In addition, in the present invention, the "melt resin" means, for example, a resin that is melted into a liquid state or has a fluid state. The form of the molten resin is not particularly limited, and may be, for example, a form that can be supplied to a cavity of a mold.

In addition, the "electronic component" generally refers to the state of the wafer before resin sealing and the state in which the wafer is resin-sealed. However, in the present invention, unless otherwise specified, the "electronic component" only indicates that the wafer has been processed. Resin-encapsulated electronic components (finished electronic components). In the present invention, the "wafer" refers to a wafer in which at least a part is exposed without resin encapsulation, and includes a wafer before resin encapsulation, a part of a wafer encapsulated with resin, and at least one of a plurality of wafers exposed without encapsulation. State of the wafer. The "wafer" of the present invention specifically refers to, for example, a wafer of an integrated circuit (IC), a semiconductor wafer, a semiconductor element for power control, or the like. The "wafer" of the present invention includes a flip chip. In the present invention, at least a part of a wafer that is exposed without being encapsulated by a resin is referred to as a "wafer" for convenience in order to distinguish it from a resin-encapsulated electronic component. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer in a state where at least a part is exposed without being encapsulated by a resin, and may not be wafer-shaped. In the electronic component (resin-encapsulated electronic component) of the present invention, the entire chip may be resin-encapsulated, but only a part of the chip may be resin-encapsulated. That is, in a case where a part of the wafer is not resin-encapsulated as a finished electronic component (resin-encapsulated electronic component) as a product, this state is also included in the “electronic component (resin-encapsulated electronic component)” of the present invention. in.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For the convenience of description, schematic descriptions such as omission, exaggeration, and the like are appropriately omitted.

[Example 1]

FIG. 1 is a sectional view showing an example of a mold structure of a compression molding apparatus according to the present invention. As shown, the molding die 10 includes an upper die 100 and a lower die 200. The molding die 10 is a molding die in which one side of a substrate is resin-encapsulated. The lower mold 200 has a cavity (lower cavity) 204, and the upper mold 100 is a mold in which the substrate is fixed.

The lower mold 200 includes a bottom member (lower mold bottom member) 202 and a side member (lower mold side member) 203. The lower mold bottom surface member 202 is fixed to a base member 201. The lower mold side member 203 is connected to a base member (lower mold base member or lower mold base block) 201 by elastic members 208, 209, and 210. In addition, each elastic member of the compression molding apparatus of FIG. 1 is not specifically limited, For example, it can be a spring etc. The lower cavity 204 is formed by a space surrounded by the upper surface of the lower mold bottom member 202 and the inner peripheral surface of the lower mold side member 203. Stoppers 207 are fixed to both ends of the upper surface of the lower mold base member 201, respectively. The stopper 207 corresponds to at least a part of the “position determining mechanism” of the compression molding apparatus including the molding die 10. When the upper mold 100 and the lower mold 200 are closed, the lower mold side member 203 contacts the stopper 207 to maintain the depth of the lower cavity 204 at a predetermined depth.

The lower mold side member 203 further includes, at the upper portion thereof, a remaining resin accommodating portion 205 for accommodating the remaining resin which is not accommodated in the lower cavity 204 when the mold is closed. The lower cavity 204 is connected to the remaining resin accommodating portion 205, and the resin can move. The lower mold 200 further includes a resin pressing member 206 that can move up and down with respect to the remaining resin accommodating portion 205. The resin pressing member 206 is not particularly limited, but may be, for example, a resin pressing rod. The resin pressing member 206 is connected to the lower mold base member 201 via an elastic member 211. The lower mold side member 203 has a through hole penetrating from the bottom surface of the remaining resin accommodating portion 205 to the lower surface (lower end) of the lower mold side member 203, and the resin pressing member 206 can move up and down through the through hole. Further, the resin in the lower cavity 204 and the remaining resin accommodating portion 205 is pressurized by the resin pressing member 206.

The upper mold 100 includes an upper mold base member (upper mold base block) 101, a substrate installation portion (upper mold substrate installation portion) 102, and a remaining resin separation member (excess resin separation block) 103. The upper mold substrate mounting portion 102 is fixed to the lower surface (lower end) of the upper mold base member 101. The substrate can be fixed on the lower surface (lower end) of the upper mold substrate installation portion 102 by, for example, a substrate fixing member (not shown). The substrate fixing member is not particularly limited, and examples thereof include clamps. The remaining resin separating member 103 is fixed to the lower surface (lower end) of the upper mold base member 101 by the elastic member 104, and can move up and down through a hole opened in the upper mold substrate installation portion 102. The remaining resin separating member 103 is disposed directly above the remaining resin accommodating portion 205, and the remaining resin can be pressed by the remaining resin separating member 103.

The compression molding method (the method of manufacturing a compression molded product) using the compression molding apparatus of FIG. 1 can be performed, for example, as shown in the step cross-sectional views of FIGS. 2 to 10.

First, as shown in FIG. 2, a substrate 1 and a release film 2 are provided on a molding die 10. More specifically, it is as follows. That is, as shown in the figure, the substrate 1 is set on the lower surface of the upper mold substrate mounting portion 102. At this time, the substrate 1 can be transferred to the position of the upper mold substrate mounting portion 102 using a substrate transfer mechanism (not shown), for example. Further, at this time, as shown in FIG. 2, at least a part of the end surface on the side of the remaining resin accommodating portion 205 of the substrate 1 is brought into contact with the remaining resin separating member 103. Thereby, it is possible to eliminate a gap between the end portion (end surface) on the side of the remaining resin accommodating portion 205 of the substrate 1 and the remaining resin separating member 103. Therefore, it is possible to suppress or prevent resin from overflowing from the end surface of the remaining resin accommodating portion 205 side of the substrate 1. Therefore, it is possible to suppress or prevent resin from adhering to the end portion (end surface) of the excess resin storage portion 205 side of the substrate 1. In order to make the substrate 1 contact the remaining resin separation member 103, for example, as described later, after the substrate 1 is transported, the substrate 1 can be moved (pressed) to the remaining resin separation by moving the substrate 1 with a substrate displacement mechanism (substrate displacement member). Part 103. For example, the substrate shifting mechanism (substrate shifting member) may be provided on the mold 10 or the substrate transfer mechanism. In addition, the substrate 1 can be fixed (installed) on the lower surface of the upper mold substrate installation portion 102 by, for example, a substrate fixing member (not shown), as described above. Further, for example, a substrate suction hole (not shown) may be provided at an appropriate position on the lower surface of the upper mold substrate setting portion 102, and the inside of the substrate suction hole may be suctioned by a suction mechanism (suction pump or the like, not shown). Then, the substrate 1 is adsorbed and fixed on the lower surface of the upper mold substrate installation portion 102 by reducing the pressure. Any one or a plurality of arbitrary components may be mounted on the lower surface of the substrate 1 with an arbitrary number, or may not be mounted. The arbitrary component is not particularly limited, and examples thereof include a wafer, a lead, an electrode, and a capacitor (passive element). In addition, these parts can be resin-encapsulated by compression molding. On the one hand, the release film 2 is adsorbed (disposed) on the entire upper surface of the lower mold 200 (lower mold bottom surface member 202, lower mold side member 203, and upper surface of the resin pressing member 206). Thereby, the entire mold surface of the lower cavity 204 and the remaining resin containing portion 205 is covered with the release film 2. For example, a suction hole (not shown) may be provided at an appropriate position on the upper surface of the lower mold 200, and the inside of the suction hole may be suctioned and reduced pressure by a suction mechanism (suction pump, etc., not shown), and The release film 2 is adsorbed on the upper surface of the lower mold 200. In addition, each of the substrate 1 and the release film 2 can be transported to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown), and then set as shown in FIG. 2. The conveyance mechanism (substrate conveyance mechanism) of the board | substrate 1 is as mentioned above.

Next, as shown in FIG. 3, a resin material (pellet resin) 20a is supplied (set) in the lower cavity 204 (resin material supply step). At this time, the resin material 20a is supplied in a slightly larger amount than the amount required for compression molding (an amount corresponding to the target package thickness or package volume). In addition, although the resin material 20a is a particulate resin in the figure, it is not limited to this as described above. 2 and 3 show an example in which the resin material 20a is supplied (installed) after the release film is installed, the present invention is not limited to this. For example, in a state where the resin material 20a is placed on the release film 2, the resin material 20a and the release film 2 can be transported together between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown). And then, the resin material 20a is supplied (set) by adsorbing the release film 2 on the upper surface of the lower mold 200.

Next, as shown in FIG. 4, the resin material (particulate resin) 20 a is melted into a fluid resin (melt resin) 20 b. The melting of the resin material 20a can be performed, for example, by heating (heating) the lower mold 200 by a heating mechanism (heater, not shown). For example, the lower mold 200 may be heated (heated up) before the step (resin material supply step) in FIG. 3. For example, instead of the lower mold 200, the upper mold 100 may be heated (heated) by a heating mechanism (heater, not shown), or in addition to the lower mold 200, heated (temperature raised) by a heating mechanism (heater, not shown). ) 上 模 100。 100 on the mold. At this time, the upper mold 100 may be heated (heated up) before the step (resin material supplying step) of FIG. 3.

Next, as shown in FIGS. 5 to 7, a step (clamping step) of clamping the upper mold 100 and the lower mold 200 is performed. First, as shown in FIG. 5, the entire lower mold 200 is raised in the direction of arrow X1, and the remaining resin separation member 103 and the remaining resin accommodating portion 205 are brought into contact with each other through the release film 2.

Next, as shown by an arrow X2 in FIG. 6, the lower mold 200 as a whole is further raised. At this time, the remaining resin separation member 103 is pushed up by the lower mold side member 203, and the elastic member 104 is contracted. At this time, as shown in FIG. 6, the end portion on the remaining resin accommodating portion 205 side of the substrate 1 is still in contact with the remaining resin separation member 103. This makes it possible to suppress or prevent the resin from adhering to the end portion. On the other hand, as shown in FIG. 6, an end portion on the opposite side to the remaining resin accommodating portion 205 of the substrate 1 is sandwiched between the upper mold substrate setting portion 102 and the lower mold side member 203. At this time, the substrate 1 and the lower mold side member 203 are not in direct contact, but are in contact with each other through the release film 2 as shown in the figure. Further, as shown in FIG. 6, in this state, a resin passage 205 a is formed between the lower cavity 204 and the remaining resin accommodation portion 205. The fluid resin 20b can be moved between the lower cavity 204 and the remaining resin accommodation portion 205 through the resin passage 205a.

Further, as shown by an arrow X3 in FIG. 7, the lower mold base member 201 is further raised. At this time, as described above, the lower mold side member 203 cannot directly rise because it contacts the upper mold 100 directly or indirectly. On the other hand, the lower mold bottom surface member 202 and the resin pressing member 206 rise together with the lower mold base member 201, and the elastic members 208, 209, 210, and 211 contract. As shown in the figure, since the lower mold side member 203 is contacted via the stopper 207, the lower mold base member 201 cannot be further raised and fixed at this position, so the depth of the lower cavity 204 is maintained at a predetermined depth. At this time, as shown in the figure, the lower cavity 204 is filled with the fluid resin 20b. At the same time, the remaining flowable resin 20b (residual resin) flows into the remaining resin containing portion 205 through the resin passage 205a, and is filled in the remaining resin containing portion 205 as the remaining flowable resin (residual resin) 20c. At this time, the elastic force of the elastic member 211 is transmitted to the resin pressurizing member 206, and the fluid resin 20b in the lower cavity 204 and the fluid resin (residual resin) 20c in the remaining resin accommodating portion 205 are pressed by the resin pressurizing member 206. Pressurize. In addition, at this time, since the elastic member 211 can expand and contract, the resin pressurizing member 206 can move up and down, and thus, the capacity of the remaining resin accommodating portion 205 can be changed. Therefore, even if the amount of resin in the remaining resin accommodating portion 205 is uneven, it is possible to suppress or prevent the resin from being unfilled in the remaining resin accommodating portion 205 (resin pressure is not formed). This makes it possible, for example, to suppress or prevent the occurrence of poor molding conditions such as resin underfilling (bubbles, underfilling, etc.) in the package.

Further, as shown in FIGS. 8 to 10, a step (mold opening step) of opening the upper mold 100 and the lower mold 200 is performed. Also, at this time, a step of separating the remaining resin in the remaining resin accommodating portion 205 and the hardened resin in the lower cavity 204 (the remaining resin separation step) is performed at approximately the same time. First, as shown in FIG. 8, after the flowable resins 20 b and 20 c are hardened (cured) into hardened resins 20 and 20 d, respectively, the lower mold base member 201 is lowered in the direction of arrow X4. As shown in the figure, the resin hardened resin (encapsulating resin) hardened in the lower cavity 204 is indicated by symbol 20, and the remaining resin hardened in other places (in the remaining resin accommodating portion 205 and the resin channel 205a) is indicated by symbol 20d said. In addition, when the fluid resins 20b and 20c are cured (cured), when the fluid resins 20b and 20c are thermosetting resins, for example, they can be continuously heated by the heated mold 10 in the mold clamping state. Flowable resins 20b and 20c. When the flowable resins 20b and 20c are thermoplastic resins, the flowable resins 20b and 20c can be cured by, for example, stopping the heating of the molding die 10 and temporarily placing the molds. Then, as the lower mold base member 201 is lowered, as shown in FIG. 8, the lower mold bottom surface member 202 and the resin pressing member 206 are lowered together with the lower mold base member 201, and are removed from the hardened resin 20 and the hardened residual resin 20d. Underside separation.

Next, as shown by an arrow X5 in FIG. 9, the lower mold 200 as a whole is lowered. Thereby, the lower mold side member 203 is separated from the hardened resin 20 hardened in the lower cavity 204. With this, by the restoring force (elastic force) of the elastic member 104, the remaining resin separation block 103 and the lower mold 200 are lowered together. That is, the remaining resin separation block 103 is lowered with respect to the upper mold 100. Thereby, the hardened residual resin 20d is also lowered together with the lower mold 200 and the residual resin separation block 103. At this time, as shown in the figure, since the hardened resin (encapsulating resin) 20 hardened in the lower cavity 204 is still fixed to the upper mold substrate setting portion 102 together with the substrate 1, it can be separated from the remaining resin 20d. In this way, the compression-molded product (resin-molded product) 30 formed from the hardened resin (encapsulated resin, package) 20 and the substrate 1 can be separated from the remaining resin 20d.

Then, as shown by an arrow X6 in FIG. 10, the lower mold 200 as a whole is further lowered to a predetermined position (the same as in FIG. 1 to FIG. 4 before the mold is closed). Thereby, the surplus resin 20d can be separated from the surplus resin accommodating portion 205. The hardened residual resin 20 d can be removed from the mold 10 by being transported to the outside of the mold 10 using a conveyance mechanism (not shown), for example, after being separated (released) from the residual resin separation block 103. As described above, a compression molding method using the compression molding apparatus of FIG. 1 can be performed. This compression molding method is also a method for manufacturing the compression molded product 30.

The compression molding apparatus and the compression molding method shown in FIGS. 1 to 10 can be appropriately modified without departing from the scope of the present invention. For example, although the example in which the release film 2 is provided in the lower mold 200 is shown in FIGS. 2 to 10, the compression molding method can be performed without using the release film.

In the present invention, compression molding is used as the resin molding method.

Generally, compression molding and transfer molding are used as a resin molding method. In transfer molding, since the amount of resin in the cavity during molding is easily maintained constant, there is an advantage that the resin thickness (package thickness) of the resin molded product is easily maintained constant. On the other hand, in transfer molding, resin flows into the cavity during molding. Therefore, due to the flow of the resin, defective parts of the resin molded product (for example, deformation of a lead, cutting, contact, etc.), voids ( Bubbles), unfilled parts, etc.

In order to solve the problem of variation in resin amount (variation in package thickness) in compression molding, the following methods can be considered. That is, a component required for compression molding is added in advance, and a molding resin containing the remaining component is further accommodated in a cavity of a compression molding mold. Then, at the time of compression molding (during mold clamping), the remaining resin flows out of the cavity, and only the resin required for compression molding is left in the cavity. Then, after compression molding, a compression molded product (resin molded product) is taken out of the molding die together with the remaining resin. Thereafter, the remaining resin is separated from the compression-molded product outside the molding die. However, in this method, in addition to the molding die, a mechanism (step) for removing excess resin from the molded substrate must be separately prepared. Therefore, the device size of the compression molding apparatus becomes large and complicated. Moreover, in this method, the manufacturing steps of the compression-molded article are complicated for the operation of separating the remaining resin. Further, in this method, it is necessary to transport the compression-molded product and the surplus resin before the separation from the surplus resin to the outside of the molding die. In addition, as for the compression-molded product, for example, as shown in FIG. 27 (b) described later, the excess resin is attached to the outer periphery of the molded substrate. In this way, in fact, the plan view size of the substrate is larger than that of the substrate before the molding, and the substrate after molding is increased by the amount of the remaining resin. That is, the substrate size may change substantially before and after molding. For this reason, for example, it is necessary to prepare a substrate conveyance mechanism of two systems or a substrate conveyance mechanism of one system with a variable size. Therefore, the device size of the compression molding device becomes further large and complicated.

In contrast, in the present invention, after the compression molding, the resin molded product and the remaining resin in the molding mold can be separated without taking out the resin molded product and the remaining resin from the molding mold. That is, according to the present invention, a compression molding method including a separation step of the remaining resin can be easily performed. Thus, as described above, it is possible to easily suppress variations in the thickness of the package (the resin portion of the resin molded product). In addition, according to the present invention, for example, in a substrate before molding and a molded substrate (compression molded product), it is possible to suppress or prevent a substantial change in the planar size of the substrate. Accordingly, it is not necessary to prepare a substrate transfer mechanism for two systems or a substrate transfer mechanism with a variable size for one system, and the structure of the substrate transfer mechanism can be simplified.

[Example 2]

(A) and (b) of FIG. 11 show another example of the molding die of the compression molding apparatus of this invention. In the drawings, the same components as those in FIGS. 1 to 10 are denoted by the same symbols. As shown in the figure, this molding die 10a is the same as the molding die 10 of FIGS. 1 to 10 except that it has a ejector pin 105. In addition, in FIG. 11, although the elastic member 210 among the elastic members 208, 209, and 210 connecting the lower mold side member 203 and the lower mold base member 201 is omitted, it is not limited thereto, and may be the same as FIGS. 1 to 10. It has an elastic member 210.

As shown in FIG. 11, the ejector pin 105 can move up and down through a through hole that penetrates from the upper end (upper surface) of the upper mold substrate installation portion 102 to the lower end (lower surface) of the remaining resin separation member 103. A jack support member (flange) 106 is fixed to the upper end of the jack 105. As for the upper mold base member 101, a part of the upper portion thereof is penetrated to form a receiving portion of the ejector support member 106. The lower end (lower surface) of the ejector support member 106 is connected to the upper mold base member 101 and the upper mold substrate installation portion 102 on the bottom surface of the accommodating portion by an elastic member 107. The ejector rod 105 penetrates inside the elastic members 104 and 107.

A compression molding method using the molding die 10a of Fig. 11 and a compression molding apparatus including the same can be performed, for example, in the same manner as in Figs. 2 to 10. FIG. 11A is a state after performing the same steps as those in FIGS. 2 to 10. That is, (a) of FIG. 11 is a state where the lower mold 200 as a whole is lowered to a predetermined position as shown by an arrow X6 in the figure. As shown in the figure, the hardened residual resin 20 d is attached to the lower end (lower surface) of the residual resin separation member 103 in a state of being separated from the resin molded product 30. From this state, as shown in FIG. 11 (b), the ejector support member 106 is pushed down in the direction of the arrow Y1, and the ejector 105 is lowered. Thereby, as shown in the figure, the remaining resin 20d can be pushed down to be separated (released) from the remaining resin separating member 103. The excess resin 20d separated (released) from the excess resin separation block 103 can be removed from the molding die 10, for example, by being transferred to the outside of the molding die 10 using a transfer mechanism (not shown).

In addition, although the example which does not use a release film is shown in FIG. 11, it is not limited to this, For example, you may use a release film similarly to FIG. 2-10.

[Example 3]

FIG. 12 shows another example of the structure of a molding die of the compression molding apparatus of the present invention. This molding die 10b has two lower cavities, and can compressively mold two substrates at the same time. More specifically, as shown in the figure, the molding die 10b has two lower cavities 204, which are disposed on both sides of the remaining resin accommodating portion 205. The two lower cavities 204 are each connected to the remaining resin accommodating portion 205, and the resin can move between the lower cavity 204 and the remaining resin accommodating portion 205. Two substrates can be installed on the lower surface (lower end) of the upper mold substrate installation portion 102 by respectively (fixing) the substrates at positions directly above the two lower cavities 204. Otherwise, the molding die 10b of FIG. 12 is the same as the molding die 10 of FIGS. 1 to 10.

The method of using the compression molding apparatus of FIG. 12 is not particularly limited, and it can be used in the same manner as the compression molding apparatus of FIGS. 1 to 10, for example. According to the compression molding apparatus of FIG. 12, since two substrates can be compression-molded at substantially the same time, a compression molding method (a method of manufacturing a compression-molded product) can be effectively performed. In addition, although FIG. 12 shows a state where the release film is not used and the particulate resin 20a is supplied (set) in the lower cavity 204, it is not limited to this, and a release film may be used in the same manner as in FIGS. 2 to 10.

[Example 4]

13 to 15 are cross-sectional views schematically showing a resin material supply step of another example of the compression molding method using the molding die of Example 1 (FIGS. 1 to 10). In this example, in the resin material supplying step (the step of supplying the resin material into the cavity of the molding die), in addition to supplying the resin material into the cavity, the resin material supplying mechanism of the remaining resin containing portion is used. A resin material is supplied into the remaining resin accommodating portion.

First, as in FIG. 2, a substrate 1 and a release film 2 are provided. In this state, as shown in FIG. 13, two resin supply mechanisms 40 accommodating a resin material (particulate resin) 20 a are placed between the upper mold 100 and the lower mold 200. One of the two resin supply mechanisms 40 serves as The “cavity resin material supply mechanism” that supplies the resin material 20a to the cavity 204 functions, and the other functions as the “residual resin container portion resin material supply mechanism” that supplies the resin material 20a to the remaining resin storage portion 205. As shown in the figure, the resin supply mechanism 40 includes a resin supply unit 41 and a lower shutter 42. The resin supply portion 41 has a frame-like shape in which openings are formed at the upper and lower ends. The opening at the lower end of the resin supply section (frame) 41 is closed by the lower shutter 42. Thereby, as shown in FIG. 13, the resin material 20a can be accommodated in the space surrounded by the resin supply portion (frame) 41 and the lower baffle 42.

Next, as shown in FIG. 14, by pulling the lower baffle 42 in the directions of the arrows a1 and a2 (horizontally), the opening at the lower end of the resin supply section (frame) 41 is opened, and the resin material 20a is dropped from the opening. . Thereby, as shown in the figure, the resin material 20a can be supplied (mounted) into the lower cavity 204 and into the remaining resin accommodating portion 205. Thereafter, if the two resin supply mechanisms 40 are withdrawn from between the upper mold 100 and the lower mold 200, as shown in FIG. 15, the resin material is supplied to the lower cavity 204 and the remaining resin accommodating portion 205, respectively. 20a status. Thereafter, for example, compression molding can be performed in the same steps as those in FIGS. 4 to 10.

If, as in this embodiment, a resin material is also supplied to the remaining resin accommodating portion in addition to the cavity in the resin material supplying step, it is possible to suppress the flow of the resin to be smaller in the compression molding step. This can further effectively suppress or prevent problems such as component defects (for example, deformation, cutting, contact, wafer displacement, etc.), voids (air bubbles), and unfilled portions of the resin molded product.

In addition, in FIGS. 13 to 15, although the “cavity resin material supply mechanism” and the “residual resin storage portion resin material supply mechanism” are used to supply the resin material at substantially the same time, the method of supplying the resin material to the remaining resin storage portion is not limited to this. this. For example, the order in which the resin material 20 a is supplied to the lower cavity 204 and the remaining resin accommodating portion 205 is approximately the same in FIGS. 13 to 15, but is not limited thereto, and any of them may be performed first. Furthermore, although two resin supply mechanisms 40 are used in FIGS. 13 to 15, the present invention is not limited to this. For example, by using only one resin supply mechanism 40, the resin material 20a can be sequentially supplied to the lower cavity 204 and the remaining resin accommodating portion 205 without having to be performed at substantially the same time.

In addition, for example, in the resin material supply step of the compression molding method (FIGS. 2 to 10) of Embodiment 1, a resin supply mechanism composed of a resin supply section 41 and a lower baffle 42 can be used in the same manner as in FIGS. 13 to 15. 40.

[Example 5]

16 to 18 show another example of a molding die of the compression molding apparatus of the present invention. In FIGS. 16 to 18, the same components as those in FIGS. 1 to 15 (Embodiment 1 to Embodiment 4) are denoted by the same symbols.

1 to 15 (Examples 1 to 4) are formed when the upper mold 100 and the lower mold 200 are closed, and at least a part of the side surface of the remaining resin accommodating portion 205 of the substrate 1 contacts the remaining resin separation member 103. example. On the other hand, when the molding die of this embodiment shown in FIGS. 16 to 18 is closed when the upper die 100 and the lower die 200 are closed, at least a part of the side surface of the remaining resin accommodating portion 205 of the substrate 1 contacts the lower die 200. As a result, resin can be suppressed or prevented from overflowing from the end surface of the excess resin containing portion 205 side of the substrate 1.

As shown in the sectional view of FIG. 16, in this molding die 10 c, the structure of the upper die 100 is the same as that of FIGS. 1 to 10 (Embodiment 1). The lower mold 200 is the same as FIGS. 1 to 10 (Example 1) except that the lower mold side member 203 has a step. As shown in the figure, the steps of the lower mold side member 203 are disposed directly below the boundary between the upper mold substrate setting portion 102 and the remaining resin separation member 103 (the halfway position of the resin passage 205a). high. 16 shows that the substrate is provided on the lower surface of the upper mold substrate installation portion 102, and is adsorbed on the entire upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203, and the resin pressing member 206). (Installation) A state where the release film 2 is present. The substrate 1 and the release film 2 can be provided in the same manner as in Example 1. However, in FIG. 16, as shown in the figure, the substrate 1 is not adhered to the remaining resin separation member 103, but a gap corresponding to the thickness of the release film 2 is vacated.

FIG. 17 is a side view showing a state of the lower mold 200 in the molding die 10c of FIG. 16. As described with reference to FIG. 16, the side end surface 221 of the remaining resin accommodating portion 205 of the substrate 1 is not closely adhered to the remaining resin separating member 103, but a gap corresponding to the thickness of the release film 2 is vacated. A release film 2 is adsorbed (disposed) on the entire upper surface of the lower mold 200 including the step 222 of the lower mold side member 203.

FIG. 18 shows a state where the molding die 10c of FIGS. 16 and 17 is closed. In FIG. 18, for convenience of illustration, the upper mold 100 and the lower mold 200 are shown in a cross-sectional view and a side view, respectively. As shown in FIG. 18, in the portion 223 where the end surface 221 of the remaining resin accommodating portion 205 and the step 222 of the lower mold side member 203 are in contact, a part of the end surface of the remaining resin accommodating portion 205 side of the substrate 1 (resin passage 205 a) is separated. The mold film 2 indirectly contacts the remaining resin separation member 103. This makes it possible to suppress or prevent resin from overflowing from the end surface of the excess resin containing portion 205 side of the substrate 1.

16 to 18 show examples in which at least a part of the end surface of the remaining resin accommodating portion 205 side of the substrate 1 is indirectly in contact with the lower mold 200 via the release film 2. However, it is not limited to this. For example, without using the release film 2, at least a part of the end surface of the remaining resin accommodating portion 205 side of the substrate 1 may directly contact the lower mold 200. In addition, the structure of the molding die 10c can be variously changed. For example, the molding die 10c can have the ejector pin like the molding die 10a of the second embodiment (FIG. 11), and can also have two lower cavities 204 like the molding die 10b of the third embodiment (FIG. 12).

The compression molding method using the compression molding apparatus including the molding die 10c is not particularly limited, and it can be performed in the same manner as in the foregoing embodiments, for example.

[Example 6]

Next, another example of the present invention will be described.

In the compression molding method and the method for manufacturing a compression molded product of the present invention, as described above, the substrate can be pressed (contacted) to the remaining resin separation member by moving the substrate with the substrate displacement mechanism (substrate displacement member). Specifically, for example, the substrate shifting mechanism (substrate shifting member) may be provided in a mold or a substrate transfer mechanism. This embodiment shows an example of the substrate shifting mechanism (substrate shifting member) and a substrate shifting procedure using the same.

19 to 24 illustrate a substrate displacement mechanism (a substrate displacement member) and a substrate displacement step using the same in this embodiment. These steps can also be referred to as an example of a substrate mounting method for providing a substrate on the compression molding apparatus of the present invention. In addition, in FIGS. 19 to 24, the illustration of the lower mold 200 is omitted for simplicity and clarity of the illustration.

First, as shown in FIG. 19, the substrate transfer mechanism (substrate mount) 300 on which the substrate 1 is placed is moved in the direction (horizontal) of the arrow Z1 to transfer the substrate 1. Then, as shown in the figure, in order to set the substrate on the upper mold 100, a substrate mounter 300 is placed in the molding die (the position between the upper mold 100 and the lower mold). In addition, although the illustration of the lower mold is omitted as described above, it may be the same as, for example, the foregoing embodiments. As shown in the figure, the substrate mounter 300 includes a base member 301, a substrate mounting portion 302, and a substrate displacement mechanism (substrate displacement member) 303 as main components. The substrate mounting portion 302 protrudes from a part of the upper surface of the base member 301 and is capable of moving up and down while placing the substrate 1. A substrate displacement mechanism (substrate displacement member) 303 is attached to one end of the upper surface of the base member 301. The substrate displacement mechanism 303 can move a part of the substrate in the horizontal direction, and press the substrate 1 to bring the substrate 1 closer to the pressing direction.

Next, as shown in FIG. 20, the substrate mounting portion 302 is moved upward, and the substrate 1 is closely adhered to the lower surface of the upper mold substrate setting portion 102.

Further, as shown in FIG. 21, the substrate 1 is temporarily fixed to the lower surface of the upper mold substrate installation portion 102, and the substrate mounting portion 302 is moved downward to be separated from the substrate 1. For the temporary fixing of the substrate 1, for example, a substrate fixing member (not shown, such as a clamp) can be used.

Then, as shown in FIG. 22, a part of the substrate shifting mechanism 303 is horizontally moved in the direction of the substrate 1 and the remaining resin separation member 103 and is closely adhered to the substrate 1.

Next, as shown in FIG. 23, a part of the substrate shift mechanism 303 is further moved in the direction of the remaining resin separation member 103. Thereby, as shown in the figure, the substrate 1 is advanced in the direction of the remaining resin separation member 103 and is brought into close contact (contact) with the remaining resin separation member 103. Then, the substrate 1 is fixed to the lower surface of the upper mold substrate installation portion 102. The substrate 1 can be fixed using, for example, a substrate fixing member (not shown, such as a clamp). Further, for example, a substrate suction hole (not shown) may be provided at an appropriate position on the lower surface of the upper mold substrate setting portion 102, and the inside of the substrate suction hole may be suctioned by a suction mechanism (suction pump, etc., not shown). The pressure is reduced, and the fixed substrate 1 is attracted to the lower surface of the upper mold substrate installation portion 102.

Further, the substrate mounter 300 is moved in the direction of the arrow Z2 (horizontal) shown in FIG. 24 to exit the molding die.

In summary, as described in FIGS. 19 to 24, the substrate transfer step and the substrate shift step can be performed. In the present invention, the substrate conveyance mechanism, the substrate displacement mechanism, the substrate conveyance step, and the substrate displacement step are not limited to the description of FIGS. 19 to 24, and can be arbitrarily changed. In addition, in the present invention, the substrate conveying step and the substrate shifting step are not essential steps and are arbitrary. Furthermore, the steps other than the substrate conveyance step and the substrate displacement step of the compression molding method (the method of manufacturing a compression molded product) of the present invention are not particularly limited, and can be performed, for example, as described in the foregoing embodiments.

[Example 7]

FIG. 25 is a plan view schematically showing a configuration of another example of the compression molding apparatus of the present invention. As shown in the figure, the compression molding apparatus 1000 includes a molding unit 1100, a substrate supply unit 1200, a resin material supply unit 1300, and a control unit 1400. The substrate supply unit 1200 and the resin material supply unit 1300 sandwich the molding unit 1100 and are disposed on opposite sides of each other. The substrate supply unit 1200 includes a substrate supply mechanism 1210. The resin material supply unit 1300 is provided with a resin material supply mechanism 1310. The control unit 1400 is arranged in the substrate supply unit 1200. A molding die (not shown) is arranged in the molding unit 1100. The molding die is not particularly limited except that it is characterized by the molding die of the compression molding apparatus of the present invention, and is arbitrary. For example, the forming mold may be the same as the forming mold 10 of the embodiment (FIG. 1 to FIG. 10), the forming mold 10a of the embodiment 2 (FIG. 11), the forming mold 10b of the embodiment 3 (FIG. 12), or the embodiment 5 ( The molding dies 10c shown in Figs. 16 to 18) are the same.

The compression molding apparatus of FIG. 25 can be used for the compression molding method of this invention or the manufacturing method of a compression molded product. The specific method of use is not particularly limited, and it can be used for, for example, the compression molding method or the method for manufacturing a compression molded product described in Examples 1 to 4.

More specifically, the compression molding apparatus of FIG. 25 can be used as follows, for example. For example, a substrate for compression molding can be arranged in the substrate supply mechanism 1210 in the substrate supply unit 1200, and the substrate can be supplied to a molding die. The substrate can be transferred to a position of a molding die by a substrate transfer mechanism (not shown), for example. The substrate conveyance mechanism may be disposed in the substrate supply unit 1200, for example. In addition, a resin material may be first placed in a resin material supply mechanism 1310 in a resin material supply unit 1300, and the resin material may be supplied to a cavity of a molding die (resin material supply step). The resin material can be transferred to a position of a molding die by a resin material transfer mechanism (not shown), for example. The resin material conveyance mechanism may be arranged in the resin material supply unit 1300, for example. The resin material conveyance mechanism can convey the resin material using, for example, the resin supply mechanism 40 described in Embodiment 4 (FIGS. 13 to 15).

The control unit 1400 controls a part or all of the operations of the compression molding apparatus 1000 of FIG. 25. The operation controlled by the control unit 1400 may be, for example, a part or all of the steps of the compression molding method or the method for manufacturing a compression molded product according to the present invention, and may include one or both of the steps of closing the mold and opening the mold. For example, the mold clamping may be controlled by the control unit 1400, and the cavity depth at the time of mold clamping may be maintained at a predetermined depth. At this time, the control unit 1400 functions as at least a part of the "position determining mechanism" of the compression molding apparatus of the present invention. In addition to the “position determining mechanism”, for example, in addition to controlling the mold clamping by the control unit, as described in the first to fourth embodiments, a stopper fixed to the base member may be used. Further, the operations controlled by the control unit 1400 may include, for example, supplying the substrate to the molding die by the substrate supply unit 1200 (substrate supply step), and supplying the resin material (resin material) into the cavity of the molding die by the resin material supply unit 1300. The supply step) may not be included.

The arrangement of the molding unit 1100, the substrate supply unit 1200, the resin material supply unit 1300, and the control unit 1400 is not limited to the arrangement shown in FIG. 25, and is arbitrary. Further, although the number of the molding units 1100 is three in FIG. 25, it is not limited to this, and is arbitrary, and may be one, two, or four or more. If a plurality of molding units 1100 are provided as shown in FIG. 25, for example, a plurality of substrates can be compression-molded at substantially the same time, and the efficiency of compression molding is high. Alternatively, for example, one molding unit 1100 may be used to compression-mold one surface of a substrate, and then the other surface of the substrate may be compression-molded using another molding unit 1100. That is, it is possible to cope with both sides of the substrate by compression molding.

Further, the compression molding apparatus 1000 of FIG. 25 may or may not have any other unit or mechanism (not shown). Examples of the other arbitrary unit or mechanism include a release film supply unit that supplies a release film to a mold. The release film supply unit may include, for example, a release film supply mechanism in which a release film is disposed, and a release film transport mechanism that transports the release mold to a position of a mold.

[Example 8]

Next, an example of the state of the remaining resin when a compression-molded product is manufactured according to the present invention will be described.

26 (a) to (c) are plan views each showing an example of a structure of a compression-molded article and a residual resin produced according to the present invention. As shown in the figure, (a) to (c) of FIG. 26 respectively show a state before the remaining resin is separated from the resin molded product containing the substrate 1 and the cured resin 20 (for example, the state of FIG. 8 in Example 1). As shown in the figure, in each of (a) to (c) of FIG. 26, one surface of the substrate 1 is resin-sealed with a hardened resin 20 except for a peripheral portion thereof. The hardened resin 20 d is connected to the hardened resin 20 and protrudes from the outer periphery of the substrate 1. (A) of FIG. 26 shows a state where the excess resin 20 d protrudes from one side of the substrate 1. FIG. 26 (b) shows a state where the remaining resin 20 d protrudes from the left and right sides of the substrate 1. (C) of FIG. 26 shows an example in which two compression-molded products are integrally connected to each other at a portion of the cured resin 20 by the remaining resin 20d. (A) of FIG. 26 can be manufactured using the shaping | molding die of Example 1 (FIG. 1-10), for example. (B) of FIG. 26 can be manufactured using the shaping | molding die (not shown) which arrange | positions the surplus resin accommodation part on the left and right sides of a cavity, for example. (C) of FIG. 26 can be manufactured using the shaping | molding die of Example 3 (FIG. 12), for example.

Moreover, (a) to (c) of FIG. 27 each show an example of a structure of a compression-molded article and a residual resin that can be produced by the present invention or a general resin molding method.

Fig. 27A shows an example of the structure of a resin molded product that can be manufactured by a general resin molding method. In the resin molded product of this figure, one surface of the substrate 1 is resin-molded using a hardened resin 20. The hardened resin 20 contains a residual resin at its peripheral portion. The remaining resin does not protrude from the periphery of the substrate 1. In addition, the remaining resin is not separated from the resin molded product, but constitutes a part of the resin molded product (product).

FIG. 27 (b) shows another example of the structure of a resin molded article that can be produced by a general resin molding method. In the resin molded product of this figure, one surface of the substrate 1 is resin-molded using a hardened resin 20. The remaining resin 20 d is connected to the outer periphery of the cured resin 20. The remaining resin 20 d protrudes from the outer periphery of the substrate 1. The remaining resin 20d is separated from the resin molded product after the resin molded product of FIG. 27 (b) is removed (released) from the mold.

FIG. 27 (c) shows an example of the structure of a resin molded product (compressed molded product) that can be produced according to the present invention. The structure of the resin molded product in this figure is the same as that in FIG. 26 (b), except that the left-right direction on the paper surface and the vertical direction on the paper surface are opposite.

When a substrate is molded using a common resin molding method to manufacture a resin molded product (for example, a resin-encapsulated electronic component in which a wafer on the substrate is resin-encapsulated), there are the following problems.

In the molding die, if a surplus resin accommodating portion is provided at a position inside the substrate, for example, as shown in (a) of FIG. 27, there is a surplus resin that cannot be separated from the resin molded product (product) inside the substrate. At this time, the product area (package area) of the substrate becomes smaller, and the number of products per one substrate (the number of electronic components that can be mounted on the substrate) decreases.

On the other hand, in the case where a surplus resin accommodating portion is provided at a position outside the substrate in the molding die, for example, as shown in FIG. 27 (b), the surplus resin is attached to the outer periphery of the molded substrate. In this way, compared with the substrate before molding, the size of the substrate in plan view actually increases the amount of the resin remaining after molding. That is, the substrate size may change substantially before and after molding. For this reason, for example, it is necessary to prepare a substrate conveyance mechanism of two systems or a substrate conveyance mechanism of one system with a variable size. Therefore, the device size of the compression molding device becomes large and complicated. Further, in addition to the molding die, a mechanism (step) for removing excess resin from the molded substrate must be separately prepared. Therefore, the size of the compression molding apparatus becomes further large and complicated. Moreover, the steps of the compression molding method become complicated.

However, according to the present invention, even if the remaining resin accommodating portion is provided at a position outside the substrate, the remaining resin can be removed from the molded substrate in the molding die. Therefore, it is possible to effectively suppress or prevent the device size of the compression molding device from becoming large or complicated. In addition, as described above, it is possible to easily suppress variations in package thickness.

In addition, in the present invention, the structures of the compression-molded article and the remaining resin are not limited to those shown in (a) to (c) of FIG. 26 and (c) of FIG. 27, and are arbitrary, and may be, for example, the structure of (b) of FIG. 27. Wait. However, a structure in which the compression-molded product and the remaining resin are easily separated in the molding die is preferred.

Further, the present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected as needed without departing from the scope of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2016-231494 filed on November 29, 2016, and the entire disclosure thereof is incorporated in this specification.

Claims (9)

A compression molding device includes a molding die. The foregoing molding die includes: an upper mold; a lower mold; a cavity to which a resin material is supplied; a position determining mechanism for maintaining the depth of the cavity at a predetermined depth during mold clamping; The remaining resin accommodating portion for storing the remaining resin not contained in the cavity at the time of the mold; and the remaining resin separating member; among the upper mold and the lower mold, one of the molds has the cavity and the other is fixed The mold of the substrate; when the upper mold and the lower mold are clamped, at least a part of the side surface of the remaining resin accommodating portion of the substrate is directly or indirectly in contact with the remaining resin separation member or one of the molds, thereby suppressing Or prevent resin from overflowing from the end surface of the substrate; one of the molds has a bottom member and a side member; the bottom member is fixed to the base member; the side member is connected to the base member by an elastic member; the bottom member and The space surrounded by the side members forms the cavity; the position determining mechanism includes fixing to the cavity. A stopper on the bottom member; when the upper mold and the lower mold are closed, the depth of the cavity is maintained at a predetermined depth by contacting the stopper with the side member; the resin in the cavity After the remaining resin is cured, the remaining resin separation member is raised or lowered with respect to one or both of the upper mold and the lower mold to separate the resin hardened in the cavity and hardened in the remaining resin receiving portion. Of the aforementioned residual resin. A compression molding device includes a molding die. The foregoing molding die includes: an upper mold; a lower mold; a cavity to which a resin material is supplied; a position determining mechanism for maintaining the depth of the cavity at a predetermined depth during mold clamping; The remaining resin accommodating portion for storing the remaining resin not contained in the cavity at the time of the mold; and the remaining resin separating member; among the upper mold and the lower mold, one of the molds has the cavity and the other is fixed The mold of the substrate; when the upper mold and the lower mold are clamped, at least a part of the side surface of the remaining resin accommodating portion of the substrate is directly or indirectly in contact with the remaining resin separation member or one of the molds, thereby suppressing Or prevent resin from overflowing from the end surface of the substrate; one of the molds has a bottom member and a side member; the bottom member is fixed to the base member; the side member is connected to the base member by an elastic member; the bottom member and The space surrounded by the side members forms the cavity; the position determining mechanism includes controlling the A control unit for the operation of the mold; when the upper mold and the lower mold are closed, the control unit controls one or both of the raised position and the lowered position of one or both of the upper mold and the lower mold so that the foregoing The depth of the cavity is maintained at a predetermined depth; after the resin in the cavity and the remaining resin are hardened, the remaining resin separating member is separated from the upper mold and the lower mold by rising or falling relative to one or both of the upper mold and the lower mold. The resin hardened in the aforementioned cavity and the aforementioned surplus resin hardened in the aforementioned surplus resin receiving portion. The compression molding apparatus according to claim 1 or 2, wherein a mold release film is closely adhered to a mold surface of one of the molds, and the substrate can be made through the mold release film during the mold clamping. The end face makes contact with one of the aforementioned molds. The compression molding device according to claim 1 or 2, further comprising a resin pressing member capable of moving up and down with respect to the remaining resin accommodating portion; and pressing the resin pressing member in the cavity and the remaining resin with the resin pressing member. Resin in the container. The compression molding device according to claim 1 or 2, further comprising a surplus resin containing portion resin material supplying mechanism for supplying a resin material to the surplus resin containing portion. A compression molding method that uses the compression molding apparatus described in claim 1 or 2 and includes the following steps: a resin material supply step of supplying a resin material to a cavity provided in one of the upper mold and the lower mold of the aforementioned mold. ; The substrate fixing step of fixing the upper substrate on the other of the upper mold and the lower mold; a mold clamping step of clamping the upper mold and the lower mold of the foregoing mold; and not accommodating the aforementioned type in the mold clamping step A remaining resin accommodating step of accommodating the remaining resin in the cavity in the remaining resin accommodating portion; a mold opening step of opening the aforementioned upper mold and the aforementioned lower mold; and separating the aforementioned residual resin from the resin hardened in the aforementioned cavity The remaining resin separating step; in the aforementioned mold clamping step, by directly or indirectly contacting at least a part of the side surface of the remaining resin accommodating portion of the substrate with the remaining resin separating member or one of the upper mold and the lower mold, Suppress or prevent resin from overflowing from the end surface of the substrate; the remaining resin separation step is hardened by the resin in the cavity and the remaining resin The separation of the resin member with respect to the remaining one of the lower mold and the upper mold or both the up or down is performed. The compression molding method according to claim 6, wherein the molding die further has a resin pressing member capable of moving up and down with respect to the remaining resin accommodating portion; and in the mold clamping step, the resin pressing member is pressurized. Resin in the aforementioned cavity and in the aforementioned remaining resin receiving portion. The compression molding method according to claim 6 or 7, wherein in the resin material supplying step, a resin material is also supplied to the remaining resin accommodating portion. A method for producing a compression-molded article, which comprises compression-molding a resin by the compression-molding method according to any one of claims 6 to 8.