TWI617419B - Resin packaging device and resin packaging method - Google Patents

Abstract

Provided is a resin encapsulation device and resin encapsulation method that can balance the suppression of substrate warpage and the molding of both sides of the substrate. The resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulating both sides of a substrate, and includes a first molding module and a second molding module. The first molding module is a molding module for compression molding. After the first molding module encapsulates one side of the substrate by compression molding, the second molding module can resin encapsulate the other side of the substrate.

Description

Resin packaging device and resin packaging method

The invention relates to a resin packaging device and a resin packaging method.

In the resin encapsulation step in the manufacturing process of electronic components such as ball grid array (BGA) packaging, usually only one side of the substrate is resin encapsulated. However, the resin encapsulation in the manufacturing steps of dynamic random access memory (DRAM) corresponding chip on board (BOC) packaging and window ball grid array (WindowBGA, WBGA, trade name) packaging In the step, it is required to encapsulate a part of the other surface in addition to one side of the substrate (for example, Reference 1).

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2001-53094.

In order to encapsulate both sides of the aforementioned substrate with resin, there are the following resin encapsulation methods: opening holes (holes for flowing resin from one side of the substrate to the other side of the substrate, hereinafter referred to as "openings") on the aforementioned substrate by transfer molding At the same time, one side of the substrate is resin-encapsulated, and at the same time, the resin is transferred from the opening to the other side and the other side is resin-encapsulated.

On the other hand, recently, with the increase in density of portable devices and the like, there has been a demand for a package in which wafers are mounted on almost the entire surface of one side and the other side (both sides) of the substrate. In the manufacturing process of the package, it is necessary to encapsulate almost the entire surface of each of the two sides of the substrate.

However, in the manufacturing of the package, when the resin packaging method is used to encapsulate both sides of the substrate at the same time, a cavity (upper cavity or lower cavity) on one side (upper mold or lower mold) will be filled first Into the resin. For example, when the cavity (lower cavity) of the lower mold is filled with resin first, there is a problem that the substrate warps into a convex shape (deformation). This is because, if resin is encapsulated on both sides by transfer molding, the resin is filled into the cavity on one side due to gravity, flow resistance, and the like. In this case, the resin flows from one side of the substrate through the opening of the substrate to the other side of the substrate. If so, there is a risk that the substrate will swell to the other surface side due to the flow resistance when the resin flows from the opening of the substrate. If so, the resin is filled into the cavity on the other side with the substrate raised. The resin pressure is applied to the substrate by filling the cavity on one side and the other side with the same pressure, but the resin pressure applied on one side and the other side of the substrate is the same pressure , So the resin pressure is the same), no force is generated to return the substrate from the raised state to the flat state. Therefore, the resin is hardened while the other surface of the substrate is raised, and the molding is completed in a state where the substrate is raised (deformed state). That is, using the resin encapsulation method to encapsulate one side and the other side (both sides) of the substrate at the same time, there is a risk of deformation of the substrate.

Therefore, the object of the present invention is to provide a suppressor capable of taking into account the warpage of the substrate Resin packaging device and resin packaging method formed on both sides of a substrate.

To achieve the foregoing object, the resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulating both sides of a substrate, including a first molding module; and a second molding module; the first molding module is compression molding A molding module used; after the first molding module is used to encapsulate one side of the substrate by compression molding, and then the second molding module is used to encapsulate the other side of the substrate.

The resin encapsulation method of the present invention is a resin encapsulation method that performs resin encapsulation on both sides of a substrate, and includes the following steps: a first resin encapsulation step, encapsulating one side of the aforementioned substrate by compression molding; and a second resin encapsulation step After the first resin encapsulation step, the other side of the substrate is resin encapsulated.

According to the present invention, it is possible to provide a resin encapsulating device and a resin encapsulating method that can achieve both the suppression of substrate warpage and the molding of both sides of the substrate.

1‧‧‧chip

2‧‧‧ substrate

3‧‧‧Wire

4‧‧‧Flip chip

5‧‧‧ball terminals

6‧‧‧Flat terminal

10‧‧‧Upper and lower mold forming module

11‧‧‧Mounting board

20a, 150a‧‧‧Particulate resin

20b, 30a, 150b, 971a ‧‧‧ molten resin (fluid resin)

20, 30, 150, 971‧‧‧‧resin

31、140A‧‧‧Internal through hole

32‧‧‧Frame parts

33‧‧‧Useless resin part

40、130‧‧‧ Release film

140‧‧‧Resin frame parts

200, 900‧‧‧ Upper die

201, 340, 602, 702, 902, 1030

202, 940‧‧‧ Upper mold base

203‧‧‧External air insulation parts of upper mold

204A, 204B, 303‧‧‧O-ring

205‧‧‧ Upper die hole

210, 920‧‧‧ Upper cavity frame parts

220, 901‧‧‧ Upper cavity

230, 910‧‧‧ Upper surface part of upper cavity

300, 700 ‧‧‧ die

301,730‧‧‧Lower mold base

302‧‧‧Lower mold external air insulation parts

304, 950‧‧‧Resin channel

305, 960‧‧‧ barrel

306, 970‧‧‧ Plunger

310、701‧‧‧Lower cavity

320‧‧‧Lower cavity block

330‧‧‧ substrate pin

331‧‧‧Board positioning

500‧‧‧The first molding module

500A‧‧‧Compression molding die module

550‧‧‧Move rod

600, 600B‧‧‧Substrate holding parts (upper die)

601, 1001‧‧‧ cavity

603‧‧‧Air passage

604‧‧‧Air hole

610‧‧‧Connecting parts

620‧‧‧ Cavity upper surface and frame parts

630,930‧‧‧Convex parts

640‧‧‧Board parts

650‧‧‧High-pressure gas source

710‧‧‧Lower cavity lower surface part

711‧‧‧sliding hole

720‧‧‧Lower cavity frame parts

800‧‧‧Second molding module

1000‧‧‧Substrate holding part (lower mold)

1010‧‧‧ Cavity lower surface parts

1020‧‧‧Cavity frame parts

1040‧‧‧Base parts

1100‧‧‧ substrate transport mechanism

1100A‧‧‧Substrate reverse mechanism

X, Y‧‧‧ arrow

FIG. 1 (a) shows a cross-sectional view of the resin encapsulating device of Example 1 and a substrate encapsulated with the resin. FIG. 1 (b) shows a cross-sectional view of a modified example of the substrate lifter of FIG. 1 (a).

2 is a cross-sectional view illustrating one step of an example in the resin encapsulation method of Example 1. FIG.

FIG. 3 is a cross-sectional view illustrating another step in the same resin packaging method as FIG. 2.

4 is a cross-sectional view illustrating still another step in the same resin encapsulation method as FIG. 2.

5 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 2.

6 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 2.

7 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 2.

8 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 2.

9 (a) to (c) are step cross-sectional views showing a modification of the resin encapsulation method of Example 1. FIG.

FIG. 10 shows a cross-sectional view of the first molding module of the resin encapsulating device of Embodiment 2 and the substrate encapsulated with the resin.

11 shows a cross-sectional view of a second molding module of the resin encapsulating device of Example 2 and a substrate encapsulated with the resin.

12 is a cross-sectional view illustrating one step of an example in the resin encapsulation method of Example 2. FIG.

13 is a cross-sectional view illustrating another step in the same resin packaging method as FIG. 12.

14 is a cross-sectional view illustrating still another step in the same resin packaging method as FIG. 12.

15 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 12.

16 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 12.

17 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 12.

18 is a cross-sectional view illustrating yet another step in the same resin packaging method as FIG. 12.

19 is a cross-sectional view of a mold module for compression molding, a substrate inverting mechanism, and a resin-encapsulated substrate of the resin encapsulating device of Example 3. FIG.

20 (a) to (c) are cross-sectional views illustrating one step of an example in the resin encapsulation method of Example 3. FIG.

21 (a) to (b) are cross-sectional views illustrating a substrate to be resin-sealed by the resin-sealing device of the present invention.

Next, examples of the present invention will be further described in detail. However, the present invention is not limited to the following description.

In the present invention, "resin encapsulation" refers to a state where the resin is hardened (cured), but it is not limited to this when the two surfaces are integrally molded as described later. That is, in the present invention, in the case where the two surfaces are integrally molded as described later, "resin encapsulation" means that at least the resin is fully filled in the mold cavity when the mold is closed, and the resin is not hardened (cured) but is in a flowing state can.

As described above, the resin packaging device of the present invention includes the first molding module and the second molding module. The first molding module is a molding module for compression molding. The first molding module is used to convert the substrate Side of After compression molding and resin encapsulation, the other surface of the substrate can be resin encapsulated by the second molding module. In the resin encapsulating device of the present invention, the molding module for compression molding first compresses one side of the substrate by compression molding (the molding cavity is filled with resin by compression molding). For the substrate used in the present invention, it is not necessary to provide an opening for the resin to flow from one side to the other side of the substrate. Moreover, since the opening is not provided, the resin does not flow from one side of the substrate through the opening to the other side of the substrate. Therefore, the deformation (warpage) of the substrate due to the flow resistance when the resin passes through the opening of the substrate does not occur. In addition, when the other side is resin-encapsulated, by supporting one side with a resin for compression molding, even if a resin pressure is applied to the substrate from the other side, the warpage of the substrate can be suppressed. Thus, the present invention can balance the suppression of the warpage of the substrate and the molding of both sides of the substrate.

The conventional method described above, that is, a method of resin-sealing both sides of the substrate by opening an opening in the substrate for transfer molding has a cost problem caused by opening the opening in the substrate. In addition, when the resin is transferred from the opening to the other surface side and the resin is encapsulated, the flow distance of completing the resin encapsulation over the entire surface of the other surface is long, and there is a problem in that voids (bubbles) are deformed as a circuit of the component parts.

In contrast, for the present invention, first, since the opening of the substrate can be opened without performing resin encapsulation on both sides of the substrate, the cost due to opening the opening on the substrate is not incurred, and the resin on both sides is completed The flow distance of the package is also short, which can suppress the generation of voids (air bubbles) and suppress the deformation of the circuit.

For the resin packaging device of the present invention, the upper and lower mold forming modules (1 (Molding module) may have both the first molding module and the second molding module. The upper and lower mold forming modules are provided with an upper mold and a lower mold. In this case, after the resin encapsulating device uses one of the upper mold and the lower mold to encapsulate one side of the substrate by compression molding, the other mold can encapsulate the other side of the substrate . Hereinafter, such a resin encapsulating device is sometimes referred to as a "first resin encapsulating device". Thus, since one molding module can be used to integrally mold both sides of the substrate, the production efficiency is improved and the structure is simplified, so it is preferable to reduce costs.

For the resin packaging device of the present invention, when the upper and lower mold forming modules are included (when one molding module is used to integrally mold both sides of the substrate), it is preferable that the upper mold of the upper and lower mold forming modules is compressed For the molding die for molding, the lower mold of the upper and lower mold molding module is a molding die for transfer molding. Therefore, first, the production efficiency is improved and the structure is simplified, so that the cost can be reduced. Next, if the other surface of the substrate is resin-encapsulated by transfer molding, it is easy to mold with the terminals provided on the substrate (the other surface) exposed from the encapsulating resin. The purpose of exposing the aforementioned terminal is to electrically connect to the substrate.

In the resin packaging device of the present invention, the first molding module may be a molding module having a lower mold for compression molding, and the second molding module may be a molding module having an upper mold for transfer molding. In this case, after the lower mold of the first molding module is used to encapsulate the lower surface of the substrate by compression molding, the upper mold of the second molding module may be used to The surface is sealed by transfer molding Outfit. Hereinafter, such a resin encapsulating device is sometimes referred to as a "second resin encapsulating device". The second molding module is a molding module having an upper mold for transfer molding. If the other side of the substrate is resin-encapsulated by transfer molding, the terminals provided on the substrate (the other side) are easily exposed from the packaging resin Shape. The purpose of exposing the aforementioned terminal is as described above.

For the resin encapsulation device of the present invention, the compression molding die module (one molding module) may have both the first molding module and the second molding module. A mold for compression molding is provided in the mold module for compression molding. The resin encapsulating device may further include a substrate inverting mechanism that inverts the substrate up and down. In this case, one side of the substrate is compression-molded by the compression molding die of the first molding module, and the resin-encapsulated substrate is inverted upside down by the substrate inversion mechanism The other surface of the substrate can be resin-encapsulated by the mold for compression molding. Hereinafter, such a resin encapsulating device is sometimes referred to as a "third resin encapsulating device".

In the resin packaging device of the present invention, it is preferable that the first molding module has an upper mold. In this case, the resin encapsulating device can compress and mold one side of the substrate by compression molding through the upper mold of the first molding module.

In the resin packaging device of the present invention, it is preferable that the second molding module is a molding module for transfer molding. In this case, the resin encapsulation device can perform resin encapsulation on the other surface of the substrate by transfer molding using the mold module for transfer molding. If the second molding module is a molding module for transfer molding, the other side of the substrate is subjected to resin transfer molding For packaging, it is easy to mold with the terminals provided on the substrate (the other side) exposed from the packaging resin. The purpose of exposing the aforementioned terminal is as described above.

The present invention may further include a lift pin. The ejector rod is provided so as to be accessible from the cavity surface of the molding die provided in at least one of the first molding module and the second molding module. For the ejector rod, when the mold is opened, The front end may be raised or lowered so as to protrude from the cavity surface, and when the mold is closed, the front end may be raised or lowered so as not to protrude from the cavity surface. Thus, the resin-encapsulated substrate can be easily released from the aforementioned mold, which is preferable. In addition, the forming mold provided with the above-mentioned lifter rod may be, for example, an upper mold, a lower mold, or both an upper mold and a lower mold.

The resin encapsulating device of the present invention may further include a useless resin separating member, and the useless resin separating member may separate the useless resin portion from the resin-encapsulated substrate after performing resin encapsulation on one side and the other side of the substrate. The useless resin separating member is not particularly limited, and includes, for example, a tool for separating in a known manner such as gate cutting and gate opening.

The resin encapsulating device of the present invention may further include a substrate pin, for example, outside the cavity (lower cavity) of the lower mold provided in at least one of the first molding module and the second molding module It is provided so as to protrude upward, and the substrate can be placed in a state free from the upper surface of the lower mold. Here, the so-called "mounting" also includes "fixing". As a result, when the resin encapsulating device decompresses the mold during intermediate mold clamping, since the cavity (lower cavity) of the lower mold does not have the substrate as a cover, the cavity (lower The cavity is decompressed. Thereby, can This effectively prevents (reduces) excess air and the like from remaining in the cavity (lower cavity) of the lower mold, and can further suppress warpage of the substrate. When excess air or the like remains in the cavity (lower cavity) of the lower mold, the cavity (lower cavity) of the lower mold includes air and the like in addition to the resin. Thus, compared to the upper cavity, the cavity of the lower mold is filled with resin or the like first, so that pressure (resin pressure) is applied to the cavity (lower cavity) of the lower mold first. Therefore, when excess air or the like remains in the cavity (lower cavity) of the lower mold, warpage of the substrate may occur. With the aforementioned substrate pin, such a problem can be prevented.

In addition, the substrate pin may be integrated with the lower mold, or may be separated from the lower mold.

The substrate pin may include a protruding substrate positioning portion at its tip, for example, by being a stepped pin. By inserting the substrate positioning portion into the through hole provided in the substrate, the substrate pin can mount the substrate. Therefore, it is preferable to mount the substrate on the substrate pin to stably fix it at a predetermined position.

In the resin encapsulating device of the present invention, the hole for the substrate positioning portion may be provided in an upper cavity frame member of the upper mold described later or the like.

The resin packaging device of the present invention may further include a substrate transport mechanism and a resin transport mechanism. The substrate conveying mechanism conveys the resin-encapsulated substrate to a predetermined position of each molding module, and the resin conveying mechanism conveys the resin for supplying the substrate onto the substrate. In addition, the resin conveying mechanism conveys, for example, a flat-plate resin to the position of the cartridge. The resin encapsulating device may have a structure in which the substrate transport mechanism also serves as the resin transport mechanism.

The aforementioned resin encapsulating device may not be limited to the aforementioned third resin encapsulating device, but further includes a substrate inverting mechanism. As described above, the substrate inverting mechanism inverts the substrate subjected to resin encapsulation up and down.

The resin encapsulating device of the present invention can be, for example, a compression molding molding module. When compression molding is performed, in order to absorb unevenness in the amount of resin, it is included in a block (component) constituting a cavity of the compression molding molding module A spring is provided to apply pressure to the aforementioned resin. In addition, a ball screw, a hydraulic cylinder, or the like may be attached to the block (component) that constitutes the cavity, and pressurized in a linear motion.

In the resin encapsulating device of the present invention, when each molding module has both an upper mold and a lower mold, a mold release film may be provided in the two to facilitate demolding from the molding mold of the molded resin package product , Can also be set in one of them or not.

In the resin encapsulating device of the present invention, the encapsulating resin contains, for example, air contained in the cavity, gas contained in the resin, etc., which becomes a gas by heating, and voids (bubble) may be generated. If voids (air bubbles) are generated, there is a risk that the durability or reliability of the resin-encapsulated product will be reduced. Therefore, in order to reduce voids (air bubbles) as necessary, a vacuum pump or the like for performing resin encapsulation and molding in a vacuum (reduced pressure) state may be included.

According to the resin packaging device of the present invention, the substrate for resin packaging is, for example, a mounting substrate on which wafers are mounted on both surfaces. As the mounting substrate, for example, as shown in FIG. 21 (a), a wafer 1 and a wire 3 electrically connecting the wafer 1 and the substrate 2 are provided on one of the two surfaces, and an inverted surface is provided on the other of the two surfaces. Chip 4 and spherical end as external terminal The mounting substrate 11 of the sub 5 and the like.

Here, when molding both surfaces of the substrate 2 having the aforementioned configuration, it is necessary to expose the spherical terminal 5 from at least one surface. When exposing the spherical terminal 5 on the compression molding side, it is preferable to press the spherical terminal 5 against the release film to expose it. Further, if necessary, after the resin is encapsulated, the encapsulating resin may be subjected to a grinding process or the like to expose the spherical terminal 5. On the other hand, when exposing the terminal on the transfer molding side, it is preferable to provide a terminal 6 with a flat exposed surface instead of the spherical terminal 5 as shown in the mounting substrate of FIG. 21 (b). The convex portion of the mold of the group is pre-clamped, and the flat terminal 6 is pressed to expose it. In addition, the mounting substrate 11 of FIG. 21 (b) is different from the spherical terminal 5 of the mounting substrate 11 of FIG. 21 (a) and the terminal 6 is flat on the other surface of the mounting substrate 11 of FIG. 21 (a). The mounting substrate 11 is the same. Thus, it can be exposed reliably, which is preferable.

In the present invention, the substrate to be resin-encapsulated is not limited to each mounting substrate 11 of FIGS. 21 (a) and 21 (b), but is arbitrary. As the aforementioned resin-encapsulated substrate, for example, at least one of the wafer 1, the flip chip 4 and the spherical terminal 5 (or the flat terminal 6) can be mounted on the substrate as shown in FIG. 21 (a) and FIG. 21 (b) One side of 2 may be mounted on both sides of the substrate 2. In addition, for example, if the board can be electrically connected (for example, a power circuit or a signal circuit is connected to the board), the terminal may not be provided. In addition, the respective shapes and respective sizes of the substrate 2, the wafer 1, the flip chip 4 and the spherical terminals (or flat terminals 6) are not particularly limited.

Examples of the substrate for resin encapsulation by the resin encapsulation device of the present invention include, for example, high-frequency module substrates for portable communication terminals. before In the substrate for a portable communication terminal, in order to resin encapsulate both sides of the substrate, an opening may be vacated in the bracket portion, but a resin encapsulation molding method that does not require the vacant opening is desired. In addition, when the substrate for the portable communication terminal is small and the components are built in at a high density, it may be difficult to vacate the opening and perform resin packaging molding. On the other hand, in the resin encapsulating device of the present invention, as described above, both sides of the substrate can be resin-encapsulated without leaving the opening, and it is also applicable to such a small-sized substrate with high-density built-in components. The substrate to be resin-encapsulated by the resin-encapsulating device of the present invention is not particularly limited, and examples thereof include a module substrate for power control, a substrate for device control, and the like.

In order to supply the aforementioned substrate to the molding die, a frame member having a through hole may be used. In this case, for example, the substrate is attracted to the lower surface of the frame member and fixed. Then, the resin is supplied into the through hole of the frame member. The substrate fixed by the frame member may be placed between the upper mold and the lower mold in a mold-open state, for example, the frame member may be lowered or the lower mold may be raised, and the substrate may be placed on a substrate pin or the like. The aforementioned frame members can also be withdrawn as required. By using the aforementioned frame member, the resin can be placed in the substrate in a stable state, which is preferable.

The resin is not particularly limited. For example, it may be a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. In addition, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. Examples of the form of the supplied resin include granular resin, fluid resin, flake-shaped resin, flat-plate resin, and powdered resin. In the present invention, The fluid resin is not particularly limited as long as it has fluidity, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin refers to a resin that is liquid at room temperature or has fluidity, for example. In the present invention, the aforementioned molten resin refers to a resin that becomes a liquid state or a fluid state by melting, for example. The form of the aforementioned resin may be other forms as long as it can be supplied to the cavity, cylinder, etc. of the molding die.

In addition, in general, "electronic components" refer to the case of a wafer before resin encapsulation, and refer to the state after the wafer is resin encapsulated. An electronic component (resin electronic component) after the above wafer is resin-encapsulated. In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, for example, a wafer such as an IC, a semiconductor wafer, or a semiconductor element for power control. In the present invention, in order to distinguish the wafer before resin encapsulation from the wafer after resin encapsulation, it is referred to as a "wafer" for convenience. However, the “wafer” in the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in a wafer shape.

In the present invention, "flip-chip" refers to an IC wafer having bump-shaped bump electrodes called bumps on electrodes (pads) on the surface portion of the IC wafer, or such a wafer form. The wafer is mounted face down (face down) on a wiring portion such as a printed circuit board. The aforementioned flip chip is used, for example, as a chip for wireless bonding or as one of mounting methods.

The resin encapsulation method of the present invention is a resin encapsulation method that performs resin encapsulation on both sides of a substrate, and includes: a first resin encapsulation step, encapsulating one side of the aforementioned substrate by compression molding; and a second resin encapsulation step After the first resin encapsulation step, the other side of the substrate is resin encapsulated. In the resin encapsulation method of the present invention, one side of the substrate is resin-encapsulated by compression molding, and when the other side is resin-encapsulated, the resin pressure is applied to the substrate from the other side by supporting one side with compression molding resin. The warpage of the substrate can be suppressed. Therefore, the present invention can balance the suppression of the warpage of the substrate and the molding of both sides of the substrate.

The resin encapsulating method of the present invention may use the resin encapsulating device of the present invention, perform the first resin encapsulating step with the first molding module, and perform the second resin encapsulating step with the second molding module.

In the resin encapsulation method, the first resin encapsulation device of the present invention may be used to perform the first resin encapsulation step and the second resin encapsulation step through the upper and lower mold molding modules (one molding module).

The aforementioned resin encapsulation method may use the aforementioned second resin encapsulation device of the present invention, perform the aforementioned first resin encapsulation step through the lower mold of the aforementioned first molding module, and perform the aforementioned second mold through the upper mold of the aforementioned second molding module Resin encapsulation step.

The aforementioned resin encapsulation method may use the aforementioned third resin encapsulation device of the present invention, which includes inverting the substrate on which the resin is encapsulated on the one side between the first resin encapsulation step and the second resin encapsulation step, and inverting the substrate In the substrate inversion step where the mechanism is inverted upside down, the first resin encapsulation step and the second resin encapsulation step are performed by the compression molding die.

When the resin encapsulation method uses the resin encapsulation device, the first A resin packaging step.

In addition, when the resin encapsulation method of the present invention is used in the resin encapsulation method, the second resin encapsulation step may be performed by the molding module for transfer molding of the resin encapsulation device.

In addition, when the resin encapsulating device of the present invention is used in the resin encapsulating method, the following steps may be included: When the mold is opened by the resin encapsulating device, the front end of the ejector pin protrudes from the bottom surface of the cavity of the mold The step of raising or lowering; the step of raising or lowering the front end of the ejector rod so as not to protrude from the bottom surface of the cavity of the molding die when the mold is closed by the resin packaging device.

In addition, when the resin encapsulating device of the present invention is used in the resin encapsulating method, it may include, after resin encapsulating one side and the other side of the substrate by the resin encapsulating device, passing the unnecessary resin part through the unnecessary resin separating member from the completed resin Useless resin separation step for package substrate separation.

In addition, when the resin encapsulating device of the present invention is used in the resin encapsulating method, the substrate mounting step of placing the substrate on the substrate pin in a state free from the upper surface of the lower mold may be included. Further, in the substrate mounting step, by inserting the substrate positioning portion into a through hole provided in the substrate, the substrate pin can mount the substrate.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For ease of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, etc.

[Example 1]

In this embodiment, first, an example of the resin encapsulation device of the present invention Next, an example of the resin sealing method of the present invention will be described. In addition, the substrate used in this embodiment is the same as the substrate 2 of FIG. 21 (a).

For the resin packaging device of this embodiment, the upper and lower mold forming modules (one forming module) have both the first forming module and the second forming module. The upper and lower mold forming modules are provided with an upper mold and a lower mold, the upper mold is a molding mold for compression molding, and the lower mold is a molding mold for transfer molding. However, the present invention is not limited to this. That is, in the present invention, for example, contrary to the present embodiment described below, the upper mold is a molding mold for transfer molding, and the lower mold is a molding mold for compression molding.

FIG. 1 (a) shows a cross-sectional view of the resin encapsulating device of this embodiment and a substrate encapsulated with the resin. As shown in FIG. 1 (a), the upper and lower mold forming module 10 has an upper mold 200 and a lower mold 300 disposed opposite to the upper mold as constituent elements. On the mold surface (lower surface) of the upper mold 200, as shown in the figure, for example, a mold release film 40 for easily releasing the molded resin package product from the mold can be fixed by suction.

In the resin packaging apparatus of this embodiment, the upper mold 200 is a molding mold (molding module) for compression molding. For example, the upper cavity frame member 210, the upper cavity upper surface member 230, a plurality of elastic members 201, and the upper mold The base 202 and the upper mold external air insulation member 203 having the O-ring 204A and the O-ring 204B are formed. For the upper mold 200, for example, the upper cavity frame member 210 and the upper cavity upper surface member 230 constitute the upper cavity 220. The upper mold 200 is fixed to a fixed plate (not shown) of the upper and lower mold forming modules 10, for example. In addition, the upper mold 200 or the upper and lower mold forming module 10 is provided with, for example, a heating member (not shown) for heating the upper mold 200. By heating the upper mold 200 with the aforementioned heating means, The resin in the upper cavity 220 is heated and solidified (melted and solidified). In addition, the heating member may be provided, for example, on one or both of the upper mold 200 and the lower mold 300, and as long as at least one of the upper mold 200 and the lower mold 300 can be heated, the position thereof is not limited.

The upper cavity frame member 210 and the upper cavity upper surface member 230 are attached to the upper mold base 202 via a plurality of elastic members 201, for example, and are installed. An upper mold external air insulation member 203 is provided at the outer peripheral position of the upper mold base 202. The upper mold external air insulation member 203 is joined to the lower mold external air insulation member 302 via an O-ring 204B as described later, so that the inside of the cavity can be isolated from the outside air. On the upper end surface of the upper mold external air insulation member 203 (the portion sandwiched between the upper mold base 202 and the upper mold exterior air insulation member 203), an O-ring 204A for insulating external air is provided. In addition, an O-ring 204B for blocking outside air is provided on the lower end surface of the outside air blocking member 203 of the upper mold. Further, the upper mold base 202 is provided with, for example, a hole (through hole) 205 of the upper mold 200 for forcibly sucking air in a space portion in the mold to reduce the pressure.

In addition, the resin encapsulation device of FIG. 1 (a) adopts a structure in which the upper cavity frame member 210 and the upper cavity upper surface member 230 are separated, but the resin encapsulation device of this embodiment is not limited thereto, and the foregoing two are integrated The structure is also available.

The lower mold 300 is a molding mold (molding module) for transfer molding, and is formed of, for example, a lower cavity block 320, a lower mold base 301, and a lower mold external air insulation member 302 having an O-ring 303. The lower cavity block 320 has a lower cavity 310. In addition, in the lower mold 300 or the upper and lower mold forming module 10, for example, a heating member (not shown) for heating the lower mold 300 is provided. By using The heating member heats the lower mold 300, and the resin in the lower cavity 310 is heated and solidified (melted and solidified). The lower mold 300 can be moved up and down by a driving mechanism (not shown) provided in the upper and lower mold forming module 10. That is, the lower mold 300 can move closer to the (fixed) upper mold 200 to close the mold. Moreover, the lower mold 300 can move away from the upper mold 200 to open the mold.

The lower cavity block 320 is installed in a state where it is placed on the lower mold base 301, for example. At the outer peripheral position of the lower mold base 301, a lower mold external air insulation member 302 is provided. The lower mold outside air insulation member 302 is disposed directly below the upper mold outside air insulation member 203 and the O-ring 204A and the O-ring 204B for insulating the outside air. On the lower end surface of the lower mold outside air insulation member 302 (the portion sandwiched between the lower mold base 301 and the lower mold outside air insulation member 302), an O-ring 303 for insulating outside air is provided. Due to the above configuration, when the upper and lower molds are closed, the upper mold external air insulation member 203 including the O-ring 204A and the O-ring 204B and the lower mold external air insulation member including the O-ring 303 are joined via the O-ring 204B , It can make the inside of the cavity become a state isolated from outside air.

The lower mold 300 is provided with a resin passage 304 for supplying a resin material, for example. The lower cavity 310 and the cartridge 305 are connected through the resin passage 304. The plunger 306 arranged inside the barrel 305 can be moved up and down by a plunger drive mechanism (not shown) provided in the upper and lower mold forming modules 10. By supplying (setting) resin to the cartridge 305 (on the plunger 306) and moving the plunger 306 toward the upper mold 200, the plunger 306 can inject the resin into the lower cavity 310 via the resin passage 304.

For the lower mold 300, as shown in FIG. 1 (a), further, in the lower mold On the outer side of the lower cavity 310 of 300, the substrate pins 330 may be placed in a state of being protruded upward in a state where the elastic members 340 provided inside the lower cavity block 320 are respectively mounted.

As shown in FIG. 1 (a), each substrate pin 330 is provided on the outer side of the lower cavity 310 of the lower mold 300 so as to protrude upward, and the substrate 2 can be placed free from the upper surface of the lower mold 300. In addition, as shown in FIG. 1 (b), each substrate pin 330 may be a stepped pin and include a protruding substrate positioning portion 331 at its tip, for example. The substrate pin of FIG. 1 (b) is the same as the substrate pin 330 of FIG. 1 (a) except that the substrate positioning portion 331 is included. As shown in FIG. 1 (b), for example, as shown in FIG. 1 (b), the substrate positioning portion 331 can be inserted into a through-hole (not shown) provided in the substrate 2 to free the substrate 2 from the lower cavity block 320. fixed.

At the bottom of the lower cavity 310 of the lower mold 300, a mold rod 550 may be further provided as shown in FIG. 8 described later. The above-mentioned ejector rods may be one or plural. For each of the aforementioned die lifters, when the mold is opened, the front end thereof can be raised to protrude from the bottom surface of the lower cavity 310 of the lower mold 300, and when the mold is closed, the front end thereof can not be pushed out of the lower cavity of the lower mold 300 The bottom surface of 310 descends in a protruding manner.

The resin encapsulating device of this embodiment may further include useless resin separating members (not shown). The useless resin separating member may separate the useless resin portion from the resin-encapsulated substrate after resin-encapsulating one side and the other side of the substrate.

Next, the resin encapsulation method of this embodiment will be described using FIGS. 2 to 8. Hereinafter, the resin seal using the resin sealing apparatus of this embodiment The installation method is explained. More specifically, the resin encapsulating device of FIGS. 2 to 8 is the same as the resin encapsulating device of FIG. 1 (a). In addition, the ejector pin of FIG. 8 may or may not. The aforementioned resin encapsulation method performs the aforementioned first resin encapsulation step and the aforementioned second resin encapsulation step by the upper and lower mold molding module 10.

Before the first resin encapsulation step, the resin encapsulation method of the present embodiment performs a mold raising step, a release film supply step, a substrate mounting step, and a resin supply step described below. Each step is an arbitrary component in the aforementioned resin encapsulation method.

First, the heating member (not shown) heats the forming mold (upper mold 200 and lower mold 300), and raises the forming mold (upper mold 200 and lower mold 300) to a temperature at which the resin can solidify (melt and solidify) (the mold temperature rises) step). Next, as shown in FIG. 2, the release film 40 is supplied to the upper mold 200 (release film supply step). Further, the substrate 2 is placed on the substrate pin 330 in a state of being free from the upper surface of the lower mold 300 (substrate placement step). Here, the substrate positioning portion 331 may be inserted into a through hole (not shown) provided in the substrate 2 to place the substrate 2 on the substrate pin 330.

Next, as shown in FIG. 3, the pellet resin 20a is supplied to the upper surface of the substrate 2, and a flat plate resin (not shown) is supplied (set) to the barrel (on the plunger 306) of the lower mold 300 (resin supply step) Furthermore, the platen resin is heated and melted by the heated cylinder (and the lower mold 300) to become a molten resin (fluid resin) 30a. In addition, the resin encapsulation method of this embodiment is not limited to supplying the granular resin 20a to the upper surface of the substrate 2 after supplying the substrate 2 to the lower mold 300, but for example, the granular resin 20a may be supplied (provided) in advance After reaching the upper surface of the substrate 2, the substrate 2 supplied with the granular resin 20 a is supplied to the lower mold 300.

Next, as shown in FIGS. 4 to 5, the aforementioned first resin encapsulation step is performed. In this embodiment, through the aforementioned first resin encapsulation step, one side of the substrate 2 is resin-encapsulated by compression molding, as the aforementioned compression molding As an example of a method of performing resin encapsulation, specifically, the intermediate mold clamping step and the upper cavity resin filling step described below are performed.

First, as shown in FIG. 4, the lower mold 300 is raised by a driving mechanism (not shown), and intermediate mold clamping is performed (intermediate mold clamping step). In this state, the upper mold outside air insulation member 203 and the lower mold outside air insulation member 302 are joined via the O-ring 204B, and the inside of the mold is in a state of being isolated from outside air. Then, the suction in the arrow direction X shown in FIG. 4 is started from the hole 205 of the upper mold 200 to depressurize the mold.

Next, as shown in FIG. 5, the lower mold 300 is raised to the position where the granular resin 20a is filled in the upper cavity 220 by the driving mechanism (not shown), and the lower mold 300 is temporarily stopped at this position (the upper cavity resin is filled) step). Then, by the heated (heated) upper mold 200, the pellet resin 20a is heated and melted to become a molten resin (fluid resin) 20b. In addition, the molten resin (fluid resin) 20b has a low viscosity, and even if a resin pressure is applied to the substrate 2 from the upper mold side to temporarily warp the substrate, thereafter, if the molten resin (fluid resin) 30a is filled into the lower cavity In 310, when the resin pressure is applied to the substrate from the lower mold side, the warpage of the substrate is reduced and the warpage of the substrate becomes no problem, the lower mold 300 can be raised to the pressure applied by the resin pressure in the upper cavity 220 at this time position.

Next, as shown in FIGS. 6 to 7, the aforementioned second resin encapsulation step is performed. In this embodiment, through the second resin encapsulation step, the other side of the substrate 2 is resin encapsulated by transfer molding. As an example of the method of resin encapsulation by transfer molding, specifically, the following type Cavity resin filling step, resin pressing step, and mold opening step.

First, as shown in FIG. 6, for example, the plunger 306 is raised to a position where the fluid resin 30a is filled in the lower cavity 310 by a plunger driving mechanism (not shown), and the plunger 306 is temporarily stopped at this position (lower type) Cavity resin filling step).

Next, as shown in FIG. 7, for example, the lower mold 300 and the plunger 306 are further raised at about the same time, and the resin pressure is applied to the upper and lower sides of the substrate at the same time by the compression molding fluid resin 20b (resin pressing step) . By doing so, it is possible to suppress substrate warpage. When resin pressure is applied to the upper cavity 220 at the time point shown in FIG. 7, only the plunger 306 is raised.

Next, as shown in FIG. 8, for example, after the molten resin (fluid resin) 20 b and the fluid resin 30 a are cured to form the encapsulating resin 20 and the encapsulating resin 30, the lower mold 300 is lowered by a driving mechanism (not shown) And mold opening is performed (mold opening step).

As such, in the resin packaging method of this embodiment, since one side of the substrate 2 is compression-molded for resin packaging by a molding module for compression molding, when one side is resin-encapsulated by transfer molding, one side is molded by compression The resin is supported, and the resin pressure is applied to the substrate 2 from the other surface side to suppress the warpage of the substrate 2. Therefore, the present invention can balance the suppression of the warpage of the substrate 2 and the molding of both sides of the substrate 2. In addition, since one molding module can be used to integrally mold both sides of the substrate 2, the production efficiency is improved, The structure is also simplified, so the cost can be reduced. In addition, by encapsulating the other surface by transfer molding, for example, the terminal provided on the substrate (the other surface) can be molded in a state where it is exposed from the encapsulating resin. This will be described in Example 2 (FIGS. 10 to 18) described later.

The resin encapsulation method of this embodiment may further include the following steps as shown in FIG. 8: during mold opening, the front end of the lifter rod 550 rises so as to protrude from the bottom surface of the cavity of the lower mold; mold clamping At this time, the step of lowering the front end of the ejector bar 550 so as not to protrude from the bottom surface of the cavity of the lower mold.

In the resin encapsulation method of this embodiment, after the resin-encapsulated substrate (finished substrate) 2 and the unnecessary resin portion 33 shown in FIG. 8 are recovered from the mold together, the unnecessary resin separation member (illustrated) (Omitted), the resin-enclosed substrate (substrate completed molding) 2 and the unnecessary resin portion 33 are separated. In addition, after separating the resin-encapsulated substrate (finished substrate) 2 and the useless resin portion 33, the resin-encapsulated substrate (finished substrate) 2 and The unnecessary resin portion 33 is recovered from the upper and lower mold forming modules 10 together.

In the resin encapsulation method of this embodiment, as shown in FIGS. 9 (a) to 9 (c), the frame member 32 may be used for the resin encapsulation method. First, after the step of raising the temperature of the mold and the step of supplying the release film shown in FIG. 2, as shown in FIG. 9 (a), in the step of placing the substrate and the step of supplying the resin, the substrate 2 is sucked and fixed To the lower surface of the frame member 32 having the internal through hole 31, the pellet resin 20a is supplied to the internal through hole 31 of the frame member 32, and when the upper mold 200 and the lower mold 300 are opened, the frame member 32, The substrate 2 and the granular resin 20a enter between the upper and lower dies. Next, as shown in FIG. 9 (b), by lowering the frame member 32 or raising the lower mold 300, the substrate 2 on which the frame member 32 and the granular resin 20 a are placed is placed on the substrate pin 330. Then, as shown in FIG. 9 (c), the frame member 32 is withdrawn. Except for these steps, it is the same as the aforementioned substrate mounting step and the aforementioned resin supply step shown in FIGS. 2 to 3. In addition, the steps shown in FIGS. 4 to 8 may be performed thereafter. As shown in FIGS. 9 (a) to 9 (c), by using the frame member 32, resin such as granular resin 20 a can be stably supplied onto the substrate 2.

In addition, in this embodiment, one of the two cavities of the molding die is first filled by compression molding. Thus, as described above, it is possible to balance the suppression of warpage (deformation) of the substrate and the molding of both sides of the substrate. The reason is that if it is compression molding, the amount of resin (resin for compression molding) supplied to the cavity can be adjusted. For example, when adjusting the volume of the resin, if the specific gravity of the resin is known, it can be adjusted by measuring the weight of the supplied resin. Specifically, for example, the amount of resin for compression molding is set to approximately the same volume as the cavity on the side (compression molding side) where the substrate is flat, and the resin for compression molding is supplied to the cavity on the side and filled . By doing so, at least the occurrence of swelling or depression of the substrate due to excessive or insufficient amount of resin can be suppressed. After that, even if resin is filled in the cavity on the other side, resin pressure is applied from the other side of the substrate. Since the resin for compression molding having substantially the same volume as the cavity on the other side is supported from one side of the substrate, it can be The substrate is formed in a flat state.

On the other hand, for example, when filling the cavity on one side by transfer molding, the root According to the vertical position of the plunger, the amount of resin supplied to the cavity on the one side changes. Therefore, there is a risk that the substrate will swell or sag due to the excessive or insufficient amount of resin. Therefore, it is preferable to fill the cavity on one side first by compression molding.

In addition, when the cavity in one side is filled by compression molding, if the resin for compression molding in the molten state has a high viscosity, strong resistance may act on the substrate when the resin is filled in the cavity in one side. In this case, the resin may not fill the entire cavity on the aforementioned side, and the volume of the unfilled portion causes the substrate to swell. Even in this case, by filling the cavity on the other side with resin and applying resin pressure to the substrate from the other side of the substrate, the swollen substrate can be flattened and the entire cavity on the side can be filled with resin .

[Example 2]

Next, in this embodiment, another embodiment of the present invention, that is, another example of the resin encapsulating device of the present invention and the resin encapsulating method of the present invention will be described. The substrate used in this embodiment is almost the same as the substrate 2 shown in FIG. 21 (b) except that the number of flat terminals 6 is different and the flat terminals 6 are provided on the same side as the flip chip 4. In addition, the number of flat terminals 6 is 2 in this embodiment and the later-described embodiment 3 (FIG. 10 to FIG. 20), and 3 in FIG. 21 (b), but these numbers are only examples, and there is no limit to the present invention. . The same applies to the wafer 1, the lead 3, the flip chip 4 and the spherical terminal 5 (Example 1 and FIG. 21 (a)).

The resin packaging device of this embodiment includes a first molding module having a lower mold for compression molding and a second molding mold having an upper mold for transfer molding Set 2 molding modules, the lower surface of the first molding module can be used to encapsulate the lower surface of the substrate by compression molding, and the upper surface of the second molding module can be used for the upper surface of the substrate Resin encapsulation by transfer molding. In addition, the resin packaging device of the present embodiment may include a substrate transport mechanism, for example.

FIG. 10 shows a cross-sectional view of the first molding module 500 of the resin encapsulating device of this embodiment and the substrate 2 that is resin-encapsulated therewith. As shown in FIG. 10, the first molding module 500 includes a substrate holding member (upper mold) 600 and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600.

The substrate holding member (upper die) 600 includes, for example, a communication member 610 connected to a high-pressure gas source 650 such as a compressor and a compressed gas tank, a cavity upper surface and a frame member 620, and flat terminals for mounting on the substrate 2 6. The exposed convex member 630, plural elastic members 602, and the plate member 640 are formed. The cavity upper surface and the frame member 620 have a cavity 601. The communication member 610, the cavity upper surface, and the frame member 620 are attached to the plate member 640 via a plurality of elastic members 602, and are installed. The communication member 610 is provided with an air passage (air path) 603 for pressurizing compressed air to the cavity 601 through the high-pressure gas source 650. The cavity upper surface and the frame member 620 have a structure in which an upper cavity upper surface member having a cavity 601 and a frame member surrounding the upper cavity upper surface member are integrated. An air passage 603 of the communication member 610 and a plurality of air holes 604 for communicating with the cavity 601 are provided on the upper surface of the cavity 601.

In this embodiment, the convex member 630 is preferably encapsulated by the first molding module 500 and the substrate 2 is not warped, for example, at the flat end The upper surface of the sub 6 is provided in such a way that the substrate 2 can be pressed.

The lower mold 700 is a molding mold for compression molding, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower mold base 730. For the lower mold 700, the lower cavity lower surface member 710 and the lower cavity frame member 720 constitute a lower cavity 701. The lower surface member 710 of the lower cavity is attached to the lower mold base 730, for example. In addition, the lower cavity lower surface member 710 may be installed in a state where the elastic member 702 is placed on the lower mold base 730, for example. The lower cavity frame member 720 is arranged, for example, in a state where it is placed on the lower mold base 730 via a plurality of elastic members 702 and surrounds the lower cavity lower surface member 710. In addition, a sliding hole 711 is formed by the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720. As described later, the suction through the sliding hole 711 can, for example, attract the release film. In the lower mold 700, for example, a heating member (not shown) for heating the lower mold 700 is provided. By heating the lower mold 700 with the heating member, the resin in the lower cavity 701 is heated and solidified (melted and solidified). The lower mold 700 can be moved up and down by a driving mechanism (not shown) provided in the first molding module 500, for example. In addition, the illustration and detailed description of the lower mold external air insulation member of the lower mold 700 are omitted for simplicity.

FIG. 11 shows a cross-sectional view of the second molding module 800 of the resin encapsulation device of this embodiment and the substrate 2 that is resin-encapsulated therewith. As shown in FIG. 11, the second molding module 800 includes an upper mold 900 and a substrate holding member (lower mold) 1000 disposed opposite to the upper mold.

The upper mold 900 is a molding die for transfer molding, for example, the upper cavity upper surface member 910 and the frame member surrounding the upper cavity upper surface member 910 The upper cavity frame member 920, the convex member 930 for exposing the flat terminal 6 mounted on the substrate 2, a plurality of elastic members 902, and the upper mold base 940 are formed. For the upper mold 900, the upper cavity 901 is constituted by the upper surface member 910 of the upper cavity. For the upper mold 900, the upper cavity upper surface member 910 is installed in a state in which it is suspended on the upper mold base 940 via an elastic member 902, and the upper cavity frame member 920 is installed in a state in which it is suspended on the upper mold base 940. In addition, for the upper mold external air insulation member of the upper mold 900, illustration and detailed description are omitted for simplicity.

In the upper mold 900, for example, a resin passage 950 for supplying a resin material is provided. The upper cavity 901 and the cartridge 960 are connected through the resin passage 950. The plunger 970 disposed inside the barrel 960 can be moved up and down by a plunger drive mechanism (not shown) provided in the second molding module 800, for example.

The substrate holding member (lower mold) 1000 is a plate for mounting the substrate 2 resin-encapsulated on one side by the first molding module 500, and includes, for example, a cavity lower surface member 1010, a cavity frame member 1020, and a plurality of elastic The member 1030 and the base member 1040 are formed. For the substrate holding member (lower mold) 1000, for example, a cavity lower surface member 1010 and a cavity frame member 1020 constitute a cavity 1001. The cavity lower surface member 1010 and the cavity frame member 1020 are installed in a state where they are placed on the base member 1040 via a plurality of elastic members 1030. The substrate 2 is placed on the substrate holding member (lower mold) 1000 so as to accommodate the resin package area in the cavity 1001. In the second molding module 800, for example, a heating member (not shown) for heating the cartridge 960 is provided. By heating the cartridge 960 with the aforementioned heating member (not shown), the resin supplied (installed) to the cartridge 960 is heated and solidified (melted and solidified). Board Holder The piece (lower mold) 1000 can be moved up and down, for example, by a substrate holding member driving mechanism (not shown) provided in the second molding module 800.

In addition, in this embodiment, in the first molding module 500, instead of supplying compressed air to the cavity 601, the cavity 601 may be filled with a gel-like solid. By pressing the substrate 2 with the gel-like solid, the substrate 2 can be suppressed from warping.

Next, the resin sealing method of this embodiment will be described using FIGS. 12 to 18. Hereinafter, the resin encapsulation method using the resin encapsulation device of this embodiment will be described, but the resin encapsulation method of this embodiment is not limited to using the aforementioned resin encapsulation device.

In the resin packaging method of this embodiment, before the first resin packaging step, the substrate supply step and the resin supply step described below are performed. Each step is an arbitrary component in the aforementioned resin encapsulation method.

First, as shown in FIG. 12, the substrate 2 is supplied to the substrate holding member (upper mold) 600 of the first molding module 500 by the substrate transport mechanism 1100, and the substrate 2 is fixed by a substrate jig and a suction hole (not shown) ( Substrate supply step). After the substrate supply step, the substrate transport mechanism 1100 is withdrawn.

Next, a resin conveying mechanism (not shown) is introduced between the substrate holding member (upper mold) 600 and the lower mold 700. By the aforementioned resin conveying mechanism, as shown in FIG. 13, the mold release film 130, the resin frame member 140 placed on the mold release film 130, and the granular resin 150a supplied to the internal through-hole 140A of the resin frame member 140 are conveyed to Lower mold 700. Then, from the sliding hole 711 of the gap between the lower cavity lower surface member 710 and the lower cavity frame member 720, the release film 130 is attracted by suction in the arrow direction Y shown in FIG. 13, thereby The release film 130 and the granular resin 150a are supplied to the lower cavity 701 (resin supply step). Thereafter, the aforementioned resin conveying mechanism and resin frame member 140 are withdrawn.

Next, as shown in FIGS. 14 to 15, the aforementioned first resin encapsulation step of this embodiment is performed. In this embodiment, through the first resin encapsulation step, a first molding module 500 with a lower mold is used to encapsulate one side of the substrate by compression molding.

Specifically, first, as shown in FIG. 14, by the lower mold 700 heated by a heating member (not shown), the pellet resin 150a is heated and melted to become a molten resin (fluid resin) 150b. Then, as shown in FIG. 14, the lower mold 700 is raised by a driving mechanism (not shown), and the wafer 1 and the wire 3 mounted on the lower surface of the substrate 2 are immersed in the molten resin (fluid resin) filled in the lower cavity 701 ) 150b. At the same time, or at a later time, the high-pressure gas source 650 supplies air at the same pressure as the molding pressure to the substrate holding member (upper mold) 600 in the direction of the arrow in FIG. 14. Thereby, while suppressing the warpage of the substrate, one side (lower surface) of the substrate 2 can be resin-encapsulated.

Next, as shown in FIG. 15, after the molten resin (fluid resin) 150 b is solidified to form the encapsulating resin 150, the lower mold 700 is lowered by a driving mechanism (not shown) to perform mold opening (mold opening step). When the mold is opened, for example, as shown in FIG. 15, the attraction through the sliding hole 711 can be released. Then, after the mold is opened, the substrate 2 on one side (lower surface) is conveyed to the second molding module 800 by the substrate conveying mechanism 1100 (second module conveying step).

Next, by the substrate transport mechanism 1100 shown in FIG. 15, as shown in FIG. 16, the substrate 2 is transported to the substrate holding member of the second molding module 800 (Lower mold) 1000. Thereafter, the flat plate resin is supplied to the cylinder 960 by a resin conveying mechanism (not shown), and further, the flat plate resin is heated and melted by a cylinder (lower mold) that has been heated by a heating member (not shown). It becomes molten resin (fluid resin) 971a (resin supply step). The supply of the plate resin may be performed by the substrate transport mechanism 1100. In addition, as shown in Example 3 to be described later, the substrate 2 may be vertically inverted by a substrate inverting mechanism (not shown). In this case, the cavity is upside down.

Subsequently, as shown in FIG. 17, the upper mold 700 and the substrate holding member (lower mold) 1000 are clamped. At this time, as shown in FIG. 17, the lower surface of the convex member 930 provided on the upper cavity surface of the upper mold 900 is brought into contact with and pressed against the upper surface of the flat terminal 6 provided on the upper surface of the substrate 2.

Further, as shown in FIGS. 17 to 18, the foregoing second resin encapsulation step of this embodiment is performed. In this embodiment, the second molding module 800 is used to perform resin encapsulation on the other surface (upper surface) of the substrate 2 by transfer molding. Specifically, as shown in FIG. 17, the substrate holding member (lower mold) 1000 is raised by the substrate holding member driving mechanism (not shown) to sandwich the substrate 2. Then, as shown in FIG. 18, the plunger 970 is raised by a plunger driving mechanism (not shown) to fill the upper cavity 901 with molten resin (fluid resin) 971a, and further, the fluid resin 971a is cured As shown in FIG. 18, it is made into encapsulating resin 971. In this way, the upper surface of the substrate 2 is resin-encapsulated with the encapsulating resin 971 and molded. At this time, as described above, since the upper surface of the flat terminal 6 is pressed against the lower surface of the convex member 930, it is not immersed in the molten resin 971a. Therefore, resin encapsulation can be performed with the upper surface of the flat terminal 6 exposed from the encapsulation resin 971.

In this way, in the resin packaging method of this embodiment, one side of the aforementioned substrate is resin-encapsulated by compression molding through a molding module for compression molding, and when the other side is resin-encapsulated by transfer molding, one side is used for compression molding The resin support can suppress the warpage of the substrate even if resin pressure is applied to the substrate from the other side. Therefore, in this embodiment, both the suppression of the warpage of the substrate and the molding of both sides of the substrate can be achieved. Furthermore, in this embodiment, since the other side is subjected to resin molding by transfer molding, it is easy to mold in a state where the terminals provided on the substrate (the other side) are exposed from the encapsulating resin.

[Example 3]

Next, in this embodiment, another example of the resin encapsulating device of the present invention and the resin encapsulating method of the present invention will be described. The substrate used in this embodiment is the same as the substrate 2 shown in FIG. 21 (a).

In the resin packaging device of this embodiment, the compression molding die module (one molding module) has both the first molding module and the second molding module. The aforementioned mold module for compression molding is provided with a mold for compression molding. The resin encapsulating device further includes a substrate inverting mechanism that inverts the substrate up and down.

FIG. 19 shows a cross-sectional view of the resin encapsulating device of this embodiment and the substrate encapsulated with the resin. As shown in FIG. 19, the mold module 500A for compression molding includes a substrate holding member (upper mold) 600B and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600B. The substrate holding member (upper mold) 600B is the same as the substrate holding member (upper mold) 600 shown in FIG. 15 except that the convex member 630 is not included, and the lower mold 700 is the same as the lower mold 700 shown in FIG. 15. However, in the present embodiment, the height of the cavity 601 takes into consideration, for example, actual processing (molding molds and resin encapsulation) and the encapsulation resins that complete the resin encapsulation The height, etc., is the same as the height of the envisaged encapsulating resin of the molded substrate, or is preset to be slightly higher. By doing so, the encapsulating resin can be reliably accommodated in the cavity 601.

Next, the resin sealing method of this embodiment will be described using FIGS. 20 (a) to 20 (c). In addition, the resin packaging method using the resin packaging device shown in FIG. 19 will be described below, but the resin packaging method of this embodiment is not limited to the method using the aforementioned resin packaging device.

First, instead of using the compression molding die module 500A instead of the first molding module 500 of Embodiment 2, the substrate 2 is supplied to the substrate holding member (upper die) 600B instead of the substrate holding member of the first molding module 500 ( The upper die) 600, and the substrate 2 instead of the embodiment 2 are the same as those shown in FIG. 20 (a) (that is, having the spherical terminals 5 instead of the flat terminals 6) except for the substrate 2 and the substrate supply steps of the embodiment 2 are the same The substrate supply step. Next, the resin supply step was performed in the same manner as the resin supply step of Example 2.

Then, the first resin encapsulation step (not shown) is performed in the same manner as the aforementioned first resin encapsulation step of Example 2.

Next, the mold opening step was performed in the same manner as the mold opening step of Example 2.

Subsequently, as shown in FIG. 20 (a), the substrate 2 with the resin encapsulated on one side is ejected from the compression molding die module 500A by the substrate inverting mechanism 1100A (exit step). In addition, the substrate reversing mechanism may also have the same substrate transport mechanism as the substrate transport mechanism 1100 in the second embodiment.

Next, as shown in FIG. 20 (b), the substrate reversing mechanism 1100A and the substrate 2 fixed to the substrate reversing mechanism 1100A are rotated 180 degrees together (based on Plate reversal step). Then, the substrate reversing mechanism 1100A is entered into the compression molding die module 500A (entry step). Subsequently, as shown in FIG. 20 (c), the substrate 2 fixed to the substrate reversing mechanism 1100A is fixed to the substrate holding member (upper die) 600B by a substrate jig and a suction hole (not shown). In addition, in the present embodiment, the exit step and the entry step are arbitrary constituent elements. For example, even if it does not exit, as long as the substrate 2 can be reversed, it may not be exited. In addition, in the aforementioned substrate inversion step, in FIG. 20 (b), the substrate is inverted by rotating the substrate 180 degrees in the direction of the arrow in the figure. However, the aforementioned substrate inversion step is not limited to this, as long as the substrate can be inverted, for example, the substrate may be rotated in any direction different from the arrow in FIG. 20 (b).

Next, the aforementioned resin supply step is performed in the same manner as the resin supply step of Example 2. In the resin supplying step, for example, first, the release film (used release film) used in the first resin encapsulation step is recovered, and a new release film may be used in the resin supplying step.

Then, the second resin encapsulation step (not shown) is performed in the same manner as the first resin encapsulation step of Example 2 except that the other side is resin-encapsulated on the other side. In the second resin encapsulation step, the surface of the resin encapsulation may be pressed with compressed air, or not pressed.

In this way, in the resin encapsulation method of the present embodiment, one side of the substrate is compression-molded by the compression molding die module first, so when the other side is resin-encapsulated, one side is compressed by the resin for compression molding The support can suppress the warpage of the substrate even if resin pressure is applied to the substrate from the other side.

The present invention is not limited to the above embodiments, without departing from the gist of the present invention Within the scope of, it can be changed in any and appropriate combination as needed, or can be selectively adopted.

1‧‧‧chip

2‧‧‧ substrate

3‧‧‧Wire

4‧‧‧Flip chip

5‧‧‧ball terminals

10‧‧‧Upper and lower mold forming module

11‧‧‧Mounting board

40‧‧‧Release film

200‧‧‧ Upper mold

201,340‧‧‧Elastic parts

202‧‧‧ Upper mold base

203‧‧‧External air insulation parts of upper mold

204A, 204B, 303‧‧‧O-ring

205‧‧‧ Upper die hole

210‧‧‧Upper cavity frame parts

220‧‧‧ Upper cavity

230‧‧‧ Upper surface part of upper cavity

300‧‧‧die

301‧‧‧Lower mold base

302‧‧‧Lower mold external air insulation parts

304‧‧‧Resin channel

305‧‧‧barrel

306‧‧‧ Plunger

310‧‧‧Lower cavity

320‧‧‧Lower cavity block

330‧‧‧ substrate pin

331‧‧‧Board positioning

Claims (11)

A resin packaging device is used for resin packaging on both sides of a substrate. The resin packaging device includes: a first molding module; and a second molding module; the first molding module is a molding with a lower mold for compression molding Module; the second molding module is a molding module with an upper mold for transfer molding; through the lower mold of the first molding module, the lower surface of the substrate is resin-encapsulated by compression molding, and then through the foregoing The second molding module can perform resin packaging on the upper surface of the substrate by transfer molding. A resin packaging device is used for resin packaging on both sides of a substrate. The resin packaging device includes: a first molding module; and a second molding module; the first molding module is a molding module for compression molding; The second molding module is a molding module for transfer molding; through the first molding module, after one side of the substrate is resin-encapsulated by compression molding, the second molding module can be used on the other side of the substrate Carry out resin encapsulation. A resin encapsulation device is used to encapsulate both sides of a substrate. The foregoing resin encapsulation device includes: The first molding module; the second molding module; and the upper and lower mold molding modules; the first molding module is a mold for compression molding; the second molding module is another mold for transfer molding; The upper and lower die forming modules are provided with the aforementioned one die and the aforementioned another die; after the aforementioned one die, one side of the aforementioned substrate is subjected to compression molding for resin encapsulation, and through the aforementioned another die, the other side of the aforementioned substrate can be subjected to transfer molding Resin package. The resin packaging device according to claim 2, wherein the first molding module has an upper mold; and the upper mold of the first molding module can compress and mold one side of the substrate by resin molding. The resin packaging device according to claim 1 or 2, wherein the substrate is a mounting substrate on which chips are mounted on both sides. The resin encapsulating device according to claim 1 or 2, further comprising a mold lifter; the mold lifter can be formed from at least one of the first mold module and the second mold module The cavity surface is set in the way of entering and exiting; for the aforementioned die lifter: when the mold is opened, its front end can be raised or lowered in a manner protruding from the cavity surface; When the mold is closed, its front end can be raised or lowered so as not to protrude from the cavity surface. The resin encapsulating device as described in claim 1 or 2, further comprising a useless resin separating member; after the useless resin separating member can perform resin encapsulation on one side and the other side of the substrate, the useless resin part is encapsulated from the aforementioned resin Substrate separation. The resin packaging device according to claim 1 or 2, further comprising a substrate pin; the substrate pin is outside the cavity of the lower mold provided in at least one of the first molding module and the second molding module It is provided so as to protrude upward; the substrate pin can place the substrate in a state free from the upper surface of the lower mold. The resin packaging device according to claim 8, wherein the substrate pin includes a protruding substrate positioning portion at the front end; the substrate pin can mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate . A resin encapsulation method, which is a resin encapsulation method that encapsulates resin on both sides of a substrate, includes the following steps: a first resin encapsulation step, encapsulating one side of the substrate by compression molding; and a second resin encapsulation step, in the foregoing After the first resin encapsulation step, the other side of the aforementioned substrate is subjected to resin encapsulation by transfer molding. The resin encapsulation method as described in claim 10, wherein the resin encapsulation device as described in any one of claims 1 to 9 is used; the first resin encapsulation step is performed through the first molding module; the second Form the module to perform the aforementioned second resin encapsulation step.