JP5658108B2 - Manufacturing method and manufacturing apparatus for substrate with reflector - Google Patents

Manufacturing method and manufacturing apparatus for substrate with reflector Download PDF

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JP5658108B2
JP5658108B2 JP2011181782A JP2011181782A JP5658108B2 JP 5658108 B2 JP5658108 B2 JP 5658108B2 JP 2011181782 A JP2011181782 A JP 2011181782A JP 2011181782 A JP2011181782 A JP 2011181782A JP 5658108 B2 JP5658108 B2 JP 5658108B2
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substrate
reflector
resin
mold
cavity
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JP2013043329A (en
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川窪 一輝
一輝 川窪
徳山 秀樹
秀樹 徳山
雄亮 平田
雄亮 平田
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Towa株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Description

  The present invention relates to a method of manufacturing a substrate with a reflector and a manufacturing apparatus for manufacturing a substrate with a reflector used when manufacturing an optoelectronic component.

  Throughout this application document, the term “optoelectronic component” means an electronic component that has at least one of the function of light emission or light reception and is handled as a product. Electronic parts as products are often called packages. Examples of optoelectronic components include packages such as LEDs (light emitting diodes) and LDs (laser diodes). The term “optical element” means a chip-like electronic component mounted on a substrate (including a substrate with a reflector). The optical element includes an LED chip, an LD chip, and the like. Hereinafter, an LED chip as an optical element and an LED package as an optoelectronic component will be described as examples.

  1 (1) is a cross-sectional view showing a first example of a substrate with a reflector, and FIGS. 1 (2) to 1 (4) are partial cross-sectional views sequentially showing steps of manufacturing an optoelectronic component using the substrate with a reflector. FIG. Any figure included in the application document is schematically omitted or exaggerated as appropriate for easy understanding.

  As shown in FIG. 1 (1), the substrate with reflector 1 has a substrate body 2. As the substrate body 2, a material using a metal as a base material, such as a lead frame, a material using a composite material of a synthetic resin and a glass cloth, a material using a ceramic as a base material, or the like is used. The substrate body 2 is divided into a plurality of lattice-like regions 4 by virtual boundary lines 3 that are orthogonal to each other. Each region 4 has a rectangular planar shape (including a square, the same applies hereinafter). The board | substrate 1 with a reflector is divided | segmented into the four rows lined up in the left-right direction of a figure by the five boundary lines 3 each extended along the front-back direction of a figure. Moreover, the board | substrate 1 with a reflector is divided | segmented into four row | line | columns located in a line from the front of this figure to the back by five boundary lines (not shown) which each extend along the left-right direction of a figure. Accordingly, the reflector-equipped substrate 1 has 16 (= 4 × 4) regions 4.

  In each boundary line 3, a reflector 5 made of a resin material is formed. The reflector 5 has a trapezoidal cross-sectional shape. In each region 4, the reflector 5 has a planar shape obtained by cutting a circle from a rectangle. In each region 4, an optical element (not shown) is mounted on the surface 7 of the substrate body 2 in the recess 6 surrounded by the reflector 5. The slope 8 that is the inner wall surface of the reflector 5 functions as a reflecting surface that reflects light generated by an optical element (not shown) upward.

  In addition, the board | substrate 1 with a reflector can be cut | disconnected along each boundary line 3, and the 16 board | substrates with a reflector corresponding to each area | region 4 can also be manufactured. The 16 substrates with reflectors corresponding to each region 4 are suitable for manufacturing a large package of optoelectronic components.

  Hereinafter, a general process for manufacturing an optoelectronic component will be described in order with reference to FIGS. FIG. 1B shows a pre-sealing substrate 10 having an optical element 9 mounted on the surface 7 of the substrate body 2 in the recess 6. First, the optical element 9 is mounted on the surface 7 of the substrate body 2 in the recess 6 in each region 4 using a die bonder. Next, using a wire bonder or a flip chip bonder, the electrode of the optical element 9 and the electrode of the substrate body 2 are electrically connected by a conductor (not shown) to manufacture the pre-sealing substrate 10.

  Next, as shown in FIG. 1 (2), a mold having at least an upper mold 11 and a lower mold 12 is prepared. The pre-sealing substrate 10 is fixed to the lower surface of the upper mold 11 by known means such as suction and clamping. The lower mold 12 is provided with a cavity 13 that is a space filled with a fluid resin. The cavity 13 is provided with a recess 14 corresponding to each region 4.

  Next, the cavity 13 shown in FIG. 1 (2) is formed by a flowable resin (see the flowable resin 15 in FIG. 1 (3)) made of a thermosetting resin having translucency such as an epoxy resin or a silicone resin. Is in a satisfied state. In this step, a solid resin material such as granular, powder, lump, or sheet is supplied to the cavity 13. A solid resin material is heated and melted using a heater (not shown) provided in the mold. As a result, the cavity 13 is filled with a flowable resin (not shown) made of a molten resin. In this step, a resin material (liquid resin) that is liquid at room temperature can be supplied to the cavity 13 using a dispenser. Furthermore, it is possible to use a resin material in which fine particles of phosphor are mixed.

  Next, as shown in FIG. 1 (3), the upper mold 11 and the lower mold 12 are moved relative to each other to clamp the upper mold 11 and the lower mold 12. As a result, the reflector 5 and the optical element 9 are immersed (immersed) in the fluid resin 15 filled in the cavity 13. Subsequently, the fluid resin 15 is cured by applying pressure (clamping pressure) and heat to the fluid resin 15. As a result, the cured resin 16 shown in FIG. 1 (4) is formed by compression molding. The cured resin 16 can also be formed using transfer molding or injection molding. FIG. 1 (3) shows an example in which the upper mold 11 is lowered. The clamping of the upper mold 11 and the lower mold 12 is not limited to this example. For example, the lower mold 12 can be raised.

  Next, as shown in FIG. 1 (4), the upper mold 11 and the lower mold 12 are opened. In this state, the sealed substrate 17 is fixed to the lower surface of the upper mold 11. The cured resin 16 includes a flat plate portion 18 that completely covers the optical element 9 and a lens portion 19 that functions as a convex lens. The sealed substrate 17 includes a region 20 corresponding to the region 4 of the substrate body 2 and corresponding to the optoelectronic component, and an unnecessary portion 21 located outside the assembly of the regions 20.

  Next, the sealed substrate 17 is removed from the upper mold 11 in the state shown in FIG. Next, the sealed substrate 17 is cut along each boundary line 3 using a known cutting means such as a dicer, a laser processing machine, a water jet processing machine or the like. Thus, the sealed substrate 17 is divided into individual optoelectronic components and unnecessary portions 21 corresponding to the respective regions 20. The individual optoelectronic components correspond to the optoelectronic components 22 shown in FIGS. 2 (1) and 2 (2).

  FIGS. 2A and 2B are a cross-sectional view and a plan view showing a first example of the optoelectronic component, and FIGS. 2C and 2D are a cross-sectional view and a plan view showing a second example of the optoelectronic component. is there. 2 (1) and (3) are AA cross-sectional views of FIGS. (2) and (4), respectively. The optoelectronic components 22 shown in FIGS. 2 (1) and 2 (2) are manufactured by cutting the sealed substrate 17 in units of the regions 20 shown in FIG. 1 (4). In this case, the sealed substrate 17 (see FIG. 1 (4)) is divided into four portions arranged along the left-right direction of the drawing and four portions arranged along the front to the back of the drawing. . Therefore, 16 (= 4 × 4) optoelectronic components are manufactured from the sealed substrate 17 shown in FIG.

  2 (3) and 2 (4), the optoelectronic component 23 shown in FIG. 1 (4) is divided into four regions 20 arranged in two along the X and Y directions in FIG. 2 (4). It is manufactured by cutting the sealed substrate 17 shown in 4) along the boundary line 3. In this case, the sealed substrate 17 (see FIG. 1 (4)) is divided into two parts arranged along the left-right direction in the figure and two parts arranged along the front to back direction in the figure. . Therefore, 4 (= 2 × 2) optoelectronic components are manufactured from the sealed substrate 17 shown in FIG.

  The optoelectronic components 22 and 23 as products have the following components. Those components are a substrate 24, a reflector 25, an optical element 9, and a cured resin 26. The cured resin 26 has a flat plate portion 27 and a lens portion 28. The side surfaces of the optoelectronic components 22 and 23 are constituted by a cut surface 29 when the sealed substrate 17 shown in FIG.

  The sealed substrate 17 can also be cut along the four boundary lines 3 located on the outermost side in FIG. In FIG. 1 (4), these four boundary lines 3 are drawn along both the left and right sides at the two ends and extending along the front to back direction of the drawing, and the front side and the back side of the drawing. It is constituted by two extending (not shown). The sealed substrate 17 is cut along these four boundary lines 3 to remove the unnecessary portions 21 from the sealed substrate 17. Thus, as a third example of the optoelectronic component, one optoelectronic component (not shown) having 16 (= 4 × 4) regions 20 can be manufactured.

  In the present application document, manufacturing one or a plurality of optoelectronic components by cutting the sealed substrate 17 along the boundary line 3 is called singulation. In addition, manufacturing one or a plurality of substrates with reflectors by cutting the substrate with reflectors 1 along the boundary line 3 is also referred to as individualization.

  Now, according to the conventional method, the substrate with a reflector is manufactured by injecting a resin such as a white epoxy resin into the cavity provided in the mold from the injection hole of the mold and curing the resin. (See Patent Document 1). Therefore, the cured resin in the injection hole and the resin flow path leading to the injection hole (usually called a runner, sprue, etc.) is discarded without any contribution to the electronic component that is the product. According to another conventional method, the reflector-equipped substrate forms a concavo-convex shape by etching the first surface of the lead frame, and the concavo-convex shape is filled with resin by resin molding, and then the lead frame first It is manufactured by a process of etching two surfaces (see Patent Document 2).

JP 2003-188422 (7th page, FIG. 7) JP 2011-77366 A (pages 8-9, FIG. 8)

  The method of curing the resin injected from the injection hole into the cavity has the following problems. First, since there is a considerable amount of cured resin to be discarded, the load on the environment is large. Secondly, since there is a considerable amount of cured resin to be discarded, it is difficult to manufacture optoelectronic components at low cost.

  The method of etching the lead frame has the following problems. First, since waste liquid is generated by using an etchant (etching liquid) in etching, the load on the environment is large. Secondly, it is difficult to manufacture optoelectronic components at low cost because many steps are required by repeating the steps of applying, exposing, and etching a photoresist and performing resin molding.

  The first problem to be solved is that a large load is placed on the environment when manufacturing a substrate with a reflector. The second problem is that it is difficult to inexpensively manufacture the substrate with a reflector.

In order to solve the above-described problems, a method for manufacturing a substrate with a reflector according to the present invention uses a molding die having an upper die and a lower die provided with a cavity composed of a plurality of recesses, on a substrate body. A method of manufacturing a substrate with a reflector by forming a reflector on a predetermined portion of a predetermined surface of a plurality of first regions provided to manufacture a substrate with a reflector, wherein a substrate body is disposed on a lower surface of an upper mold. A step of fixing, a step of filling the cavity with a fluid resin, a step of immersing a predetermined portion in the fluid resin by clamping the upper mold and the lower mold, and curing the fluid resin A step of forming a cured resin, a step of opening the upper mold and the lower mold, and a step of removing a molded substrate made of a substrate body on which a reflector made of the cured resin is formed from the upper mold. The lower mold corresponds to the first area. The second region is provided with a recess in each of the second regions, and the planar shape of the recess in the second region is obtained by cutting another closed figure from one closed figure. In the latter form, each of the recesses communicates with the boundary line between the second regions, and in the dipping step, the flowable resin in the resin reservoir communicating with the outermost cavity of the plurality of cavities in the lower mold In the step of pouring an excess amount of the resin and filling the fluid resin evenly into the recesses communicating with each other and forming the cured resin, an unnecessary resin made of the cured resin is formed in the resin reservoir, and A portion other than the predetermined portion is exposed on each of the predetermined surfaces in the first region.

  The manufacturing method of the board | substrate with a reflector which concerns on this invention is equipped with the process of removing an unnecessary resin from the molded board | substrate after the process of removing in the above-mentioned manufacturing method.

  A method of manufacturing a reflector-equipped substrate according to the present invention uses a molding die having an upper die and a lower die provided with a cavity, on a predetermined surface of a plurality of first regions provided on the substrate body. A method for manufacturing a substrate with a reflector for forming a substrate with a reflector by forming a reflector in a predetermined portion, the step of fixing the substrate body to the lower surface of the upper mold, and the cavity filled with a fluid resin A step of clamping the upper mold and the lower mold, immersing a predetermined surface in the fluid resin, curing the fluid resin to form a cured resin, the upper mold and the lower mold A step of opening the mold and a step of removing the molded substrate made of the substrate body on which the reflector made of the cured resin is formed from the upper die, and the lower die corresponding to the first region respectively. Two areas are provided, and the cavity has multiple Each of the plurality of second regions includes a communication portion that includes all of the plurality of second regions in plan view and communicates with each other, and each of the second regions is provided with a recess. The planar shape of the concave portion in the region is a shape after cutting out another closed graphic from one closed graphic, and in the step of forming the cured resin, a reflector made of the cured resin is formed and communicated in the plurality of concave portions. Forming a thin-walled portion made of a cured resin in the portion and removing the thin-walled portion from the molded substrate after the removing step to expose a portion other than the predetermined portion in each of the first regions. To do.

  The method for manufacturing a substrate with a reflector according to the present invention includes a step of disposing a release film between the upper mold and the lower mold in the manufacturing method described above, and a mold release film on the outside of the lower mold in plan view. The step of sandwiching, the step of adhering the release film to the upper surface of the lower mold with the release film sandwiched, and the release film by sucking the release film using the suction path provided in the lower mold A step of bringing the mold into contact with the mold surface in the cavity, and in the step of filling the mold, the release film is in close contact with the mold surface of the cavity, and the cavity is filled with the flowable resin. To do.

  The manufacturing method of the substrate with a reflector according to the present invention includes a step of forming a closed space by blocking a space including at least a cavity from the outside of the molding die and a step of satisfying the above-described manufacturing method. And a step of depressurizing the closed space in at least a part of the process up to the step of immersing.

An apparatus for manufacturing a substrate with a reflector according to the present invention includes a molding die including an upper die and a lower die provided with a cavity including a plurality of recesses, and includes a plurality of first regions provided in the substrate body. A manufacturing apparatus for a substrate with a reflector for forming a substrate with a reflector by forming a reflector on a predetermined portion of a predetermined surface, a fixing means for fixing the substrate body to the lower surface of the upper mold, an upper mold and a lower mold Driving means for clamping and opening the upper mold and the lower mold by relatively moving the mold, a second area provided corresponding to each of the first areas in the lower mold, and a lower area The mold includes a resin reservoir communicating with the outermost cavity among the plurality of cavities, and each of the recesses is provided in each of the second regions, and the planar shape of the recesses in the second region is one closed figure Cut another closed shape from Each of the recesses communicates at the boundary line between the second regions, and the upper mold and the lower mold are clamped so that the upper mold and the lower mold are opened. A predetermined portion is immersed in a fluid resin that is evenly filled in each of the recesses communicating with each other, and an excess amount of the fluid resin flows into the resin reservoir, and the upper mold and the lower mold are clamped. Of the cured resin formed by curing the fluid resin in this state, the cured resin cured in each of the recesses constitutes each of the reflectors, and a portion other than the predetermined portion is exposed in each of the first regions. It is characterized by doing.

  The manufacturing apparatus for a substrate with a reflector according to the present invention is characterized in that in the above-described manufacturing apparatus, there is provided a removing means for removing an unnecessary resin made of a cured resin cured in a resin reservoir.

  An apparatus for manufacturing a substrate with a reflector according to the present invention includes a molding die including an upper die and a lower die provided with a cavity, and a predetermined surface in a predetermined surface of a plurality of first regions provided in the substrate body. Is a manufacturing apparatus for a substrate with a reflector for forming a substrate with a reflector by forming a reflector on the portion of the substrate, wherein the fixing means for fixing the substrate body to the lower surface of the upper mold, and the upper mold and the lower mold are relatively Driving means for clamping and opening the upper mold and the lower mold by moving to each other, a second area provided corresponding to each of the first areas in the lower mold, and each of the second areas And a communication portion that includes all of the plurality of second regions in plan view and communicates with the plurality of recesses, and the cavity includes the recess and the communication portion, and each of the recesses includes A planar shape is a cut out of one closed figure from another closed figure. When the upper mold and the lower mold are clamped, a predetermined surface is immersed in the fluid resin filled in the cavity in the state where the upper mold and the lower mold are opened, and the upper mold The cured resin cured in the plurality of recesses among the cured resin formed by curing the fluid resin in a state where the mold and the lower mold are clamped constitute the reflector, and between the plurality of recesses The cured resin cured at the communicating portion constitutes a thin portion, and includes a removing means for removing the thin portion, and after the thin portion is removed, a portion other than the predetermined portion is exposed in each of the first regions. And

  The reflector-equipped substrate manufacturing apparatus according to the present invention is sandwiched in the above-described manufacturing apparatus by an arrangement unit that arranges the release film between the upper mold and the lower mold, and a clamping unit that sandwiches the release film. In addition to the adhesion means for bringing the release film into close contact with the upper surface of the lower mold and the suction means for bringing the release film into close contact with the mold surface in the cavity by sucking the release film adhered to the upper surface of the lower mold, the mold release The cavity is filled with a fluid resin in a state where the film is in close contact with the mold surface in the cavity.

  The reflector-equipped substrate manufacturing apparatus according to the present invention is the above-described manufacturing apparatus, comprising: a blocking unit that makes a space including at least the cavity closed from the outside of the mold; and a decompressing unit that depressurizes the closed space. It is characterized by providing.

  According to the present invention, the cavity is filled with the fluid resin, the predetermined surfaces of the plurality of first regions provided in the substrate body are immersed in the fluid resin in the cavity, and the predetermined surfaces on the predetermined surface are immersed. A reflector made of a cured resin is formed on the part. Thereby, first, since the resin flow path through which the flowable resin flows until reaching the cavity is not required, the amount of the cured resin to be discarded can be reduced. Second, the reflector is formed by resin molding without repeating the steps of applying, exposing, and etching the photoresist, and without using an etchant. Therefore, the load given to the environment can be reduced, and the reflector-equipped substrate can be manufactured at a low cost.

Further, according to the present invention, in the lower mold, an excess amount of the fluid resin is poured into the resin reservoir communicating with the outermost cavity among the plurality of cavities , and the fluidity is introduced into each of the recesses communicating with each other. The fluid resin is cured with the resin evenly filled. Thereby, portions other than the predetermined portion are exposed in each of the predetermined surfaces in the plurality of first regions provided in the substrate body. Therefore, it is possible to manufacture a reflector-equipped substrate in which portions other than the reflector are reliably exposed.

  Moreover, according to this invention, while forming the reflector which consists of cured resin in the some recessed part which a cavity has, the thin part which consists of cured resin is formed in the communicating part which a cavity has. By removing the thin portion from the molded substrate, portions other than the predetermined portion are exposed in each of the plurality of first regions provided in the substrate body. Therefore, it is possible to manufacture a reflector-equipped substrate in which portions other than the reflector are reliably exposed.

FIG. 1A is a cross-sectional view showing a first example of a substrate with a reflector, and FIGS. 1B to 1D are partial cross-sectional views showing processes for manufacturing an optoelectronic component using the substrate with a reflector. It is. 2 (1) and 2 (2) are a sectional view and a plan view showing a first example of the optoelectronic component, and FIGS. 2 (3) and 2 (4) are a sectional view and a plan view showing a second example of the optoelectronic component. FIG. FIGS. 3 (1) to 3 (3) are partial cross-sectional views showing a process from the formation of a reflector made of a cured resin on the substrate body to manufacture a molded substrate, and FIG. 3 (4) is an individual view of the molded substrate. It is sectional drawing which shows the 2nd example of the board | substrate with a reflector manufactured by manufacturing. 4 (1) to 4 (3) are partial cross-sectional views showing the process from forming a cured resin on the substrate body to producing a molded substrate with a thin portion, and FIG. 3 (4) is a molded portion with a thin portion. It is sectional drawing which shows a board | substrate. FIGS. 5A and 5B are partial cross-sectional views showing a state from a state where the mold is opened to a state where the sandwiched release film is in close contact with the upper surface of the lower mold. 6 (1) and 6 (2) show a state in which a flowable resin is supplied to the cavity after the mold release film is sucked and the mold surface of the lower mold is covered with the mold release film, and the mold is clamped FIG.

  A reflector made of a cured resin is formed on the surface of the substrate body using compression molding. In the first embodiment, by clamping the mold, an excess amount of the fluid resin supplied to the cavity is poured into a resin reservoir formed in the lower mold. As a second embodiment, a reflector made of a cured resin and a thin portion that connects the reflectors are formed to produce a molded substrate, and the thin portion is removed from the molded substrate. As a third embodiment, a release film and vacuum molding (reduced pressure molding) are used in combination to form a reflector made of a cured resin on the surface of the substrate body.

Example 1
With reference to FIG. 3, the manufacturing apparatus which manufactures a board | substrate with a reflector is demonstrated. As shown in FIG. 3 (1), the manufacturing apparatus is provided with a forming die having at least an upper die 30 and a lower die 31. On the upper surface side of the lower mold 31, cavities 33 formed of recesses are provided in regions 32 respectively corresponding to the regions 4 of the substrate body 2. In each region 32, the recess of each cavity 33 has a trapezoidal cross-sectional shape. In each region 32, the concave portion of each cavity 33 has a planar shape after a circle is cut out from the inside of the rectangle. The concave portions of the adjacent cavities 33 are in direct communication (directly connected) at a portion corresponding to the boundary line 3 of the substrate body 2. On the upper surface side of the lower mold 31, a resin reservoir 34 including a recess communicating with the outermost cavity 33 is formed outside the aggregate of the regions 32.

  The planar shape of the concave portion of each cavity 33 may be a shape after a closed figure is cut out from the inside of the rectangle. Examples of the closed graphic include an ellipse, a polygon, and a graphic constituted by a plurality of curves.

  With reference to FIG. 3, the manufacturing process which manufactures a board | substrate with a reflector is demonstrated. First, as shown in FIG. 3 (1), a mold having at least an upper mold 30 and a lower mold 31 and a substrate body 2 having a plurality of regions 4 are prepared. The substrate body 2 is fixed to the lower surface of the upper mold 30 by known means such as suction and clamping. When the substrate body 2 has a through-hole (for example, when the substrate body 2 is a lead frame), an adhesive tape for preventing resin flash is applied to the non-sealing surface (upper surface in the figure) of the substrate body 2. It may be pasted.

  Next, each cavity 33 is filled with a flowable resin made of a thermosetting resin (see the flowable resin 35 in FIG. 3B). In this step, a solid resin material such as granular, powder, lump, or sheet is supplied to the cavity 33. A solid resin material is heated and melted using a heater (not shown) provided in the mold. Thus, the cavity 33 is filled with a flowable resin (not shown) made of a molten resin. In this step, a resin material (liquid resin) that is liquid at room temperature can be supplied to the cavity 33 using a dispenser. Furthermore, in order to improve the reflective performance of the reflector, a resin material mixed with fine particles such as titanium oxide can be used.

  Next, as shown in FIG. 3 (2), the upper mold 30 and the lower mold 31 are relatively moved so that the upper mold 30 and the lower mold 31 are clamped. As a result, a predetermined portion of the surface (lower surface in the figure) of the substrate body 2 is immersed (immersed) in the fluid resin 35 filled in the cavity 33 (see FIG. 3A). Further, by clamping the upper mold 30 and the lower mold 31, an excess amount of the fluid resin 35 supplied to the cavity 33 is poured into the resin reservoir 34 formed in the lower mold 31. Subsequently, the fluid resin 35 is cured by applying pressure (clamping pressure) and heat to the fluid resin 35. As a result, as shown in FIG. 3 (3), a cured resin 36 is formed on the surface (lower surface in the figure) of the substrate body 2 to produce a molded substrate 37.

  Next, as shown in FIG. 3 (3), the upper mold 30 and the lower mold 31 (see FIG. 3 (2)) are opened. In this state, a molded substrate 37 is fixed to the lower surface of the upper mold 30. A reflector 38 and an unnecessary resin 39 made of a cured resin 36 are formed on the surface (lower surface in the drawing) of the substrate body 2. Each region 40 in the molded substrate 37 is delimited by a boundary line 41, and corresponds to each region 4 in the substrate body 2 (see FIG. 3A).

  Next, the molded substrate 37 is removed from the upper mold 30 in the state shown in FIG. Thereafter, the unnecessary resin 39 is removed from the molded substrate 37 by using appropriate means such as polishing and peeling. As a result, the reflector-equipped substrate 1 shown in FIG. 1A is completed. A means for removing the unnecessary resin 39 may be built in the manufacturing apparatus.

  Hereinafter, modifications of the present embodiment will be described with reference to FIGS. 3 (3) and (4). Part of the reference numerals in FIG. 3 (4) corresponds to the reference numerals in FIG. 1 (1) and FIG. 2 (1). As a first modification, the removed molded substrate 37 is cut along all the boundary lines 41. As a result, as shown in FIG. 3 (4), a total of 16 (= 4 × 4) reflector-equipped substrates 42 corresponding to one region 40 can be manufactured. In this case, in the sealed substrate 37 of FIG. 3 (3), the region 40 corresponding to the reflector-equipped substrate 42 of FIG. 3 (4) is along the horizontal direction and the front to back direction of the drawing. Line up 4 each. One reflector-equipped substrate 42 corresponding to one region 40 is suitable for manufacturing a large package of optoelectronic components.

  As a second modified example, the molded substrates 37 are arranged in two rows along three boundary lines 41 at both ends and the middle on one side of the removed molded substrate 37 and the side adjacent thereto. Disconnect. As a result, a total of 4 (= 2 × 2) substrates with reflectors corresponding to 4 (= 2 × 2) regions 40 can be manufactured.

  As a third modification, the removed molded substrate 37 is cut along the four boundary lines 41 located on the outermost side. The molded substrate 37 is cut along these four boundary lines 41 to remove the unnecessary portion 43 (see FIG. 3 (3)) from the molded substrate 37. Thus, one reflector-equipped substrate (not shown) corresponding to 16 (= 4 × 4) regions 40 can be manufactured.

  According to the present embodiment, the reflector 38 made of the cured resin 36 is formed on the surface (lower surface in the drawing) of the substrate body 2 by compression molding. As a result, the amount of the cured resin 36 that is discarded can be reduced to a very small amount corresponding to the unnecessary resin 39. Therefore, first, the load on the environment can be suppressed. Second, since most of the supplied resin material is used as the reflector 38, the reflector-equipped substrate 1 (see FIG. 1 (1)) can be manufactured at low cost.

  In addition, an excess amount of the fluid resin 35 supplied to the cavity 33 is poured into the resin reservoir 34 formed in the lower mold 31. Thereby, since the generation of the flash made of the cured resin 36 is suppressed on the surface 45 of the substrate body 2 in the concave portion 44 surrounded by the reflector 38, the surface 45 can be reliably exposed. When flash is generated on the surface 45, it is necessary to remove the flash. Therefore, by suppressing the occurrence of flash, the discarded portion of the cured resin 36 can be further reduced.

  The embodiment in which the unnecessary resin 39 is removed from the molded substrate 37 has been described. In addition, as the third modification, the example in which the unnecessary portion 43 on which the unnecessary resin 39 is formed is removed from the molded substrate 37 illustrated in FIG. Not limited to this, as long as the size and shape of the unnecessary resin 39 can be tolerated, the molded substrate 37 shown in FIG. 3 (3) can be used as a single substrate with a reflector.

(Example 2)
With reference to FIG. 4, the manufacturing apparatus which manufactures a board | substrate with a reflector is demonstrated. As shown in FIG. 4 (1), the manufacturing apparatus is provided with a forming die having at least an upper die 46 and a lower die 47. On the upper surface side of the lower mold 47, concave portions 48 corresponding to the respective regions 4 of the substrate body 2 are formed. Adjacent concave portions 48 are in direct communication (directly connected) at a portion corresponding to the boundary line 3 of the substrate body 2. The recess 48 has the same shape as the cavity 33 shown in FIG. In addition, on the upper surface side of the lower mold 47, a space 49 in which the fluid resin can be extremely thin in a state where the upper mold 46 and the lower mold 47 are clamped communicates the recesses 48. Is formed. The space 49 includes all portions corresponding to the respective regions 4 of the substrate body 2 in the lower mold 47 in plan view. The cavity 50 includes each recess 48 and a space 49.

  With reference to FIG. 4, the manufacturing process which manufactures a board | substrate with a reflector is demonstrated. In the following description, description of parts common to the first embodiment will be omitted as appropriate. First, as shown in FIG. 4A, the substrate body 2 is fixed to the lower surface of the upper mold 46.

  Next, the cavity 50 is filled with a fluid resin made of a thermosetting resin (see the fluid resin 51 in FIG. 4B). In this step, a solid resin material such as granular, powder, lump, or sheet, or a liquid resin is supplied to the cavity 50. In this embodiment, a resin material is supplied to each recess 48 of the lower mold 47 and a mold surface other than each recess 48. Therefore, the resin material is also thinly supplied on the mold surface other than the recesses 48.

  Next, as shown in FIG. 4B, the upper mold 46 and the lower mold 47 are clamped. Thereafter, the fluid resin 51 is cured by applying pressure (clamping pressure) and heat to the fluid resin 51. By the space 49 functioning as a communication path, the fluid resin 51 can be evenly filled in the cavity 50 including the concave portions 48 and the spaces 49.

  Next, as shown in FIG. 4 (3), the upper mold 46 and the lower mold 47 (see FIG. 4 (2)) are opened. In this state, the molded substrate 52 is fixed to the lower surface of the upper mold 46. On the surface (lower surface in the figure) of the substrate body 2, a reflector 54 and a thin portion 55 are formed, both of which are made of a cured resin 53. The thin portion 55 includes all of the region 4 of the substrate body 2 in plan view, and communicates the plurality of reflectors 54 with each other. In the present embodiment, the depth of the space 49 in the lower mold 47 is determined so that the thin portion 55 is as thin as possible within the range in which the thin portion 55 is reliably formed. In other words, the space 49 in the lower mold 47 is formed as shallow as possible so that the thin-walled portion 55 is reliably formed and becomes as thin as possible.

  Next, the molded substrate 52 is removed from the upper mold 46 in the state shown in FIG. FIG. 4 (4) shows the molded substrate 52 removed, that is, the molded substrate 52 with the thin portion 55.

  Next, the thin portion 55 is removed from the molded substrate 52 shown in FIG. In order to remove the thin portion 55, a known process such as a process using high-pressure water, a process using a laser, an electrolytic method, a dry blast process, or a wet blast process can be used. By these processes, the cured resin 53 is removed with the same removal rate over the entire surface of the cured resin 53 in plan view until the thin portion 55 is removed. By removing the thin portion 55, the reflector-equipped substrate 1 shown in FIG. 1A is completed. Note that it is also possible to remove only the thin portion 55 in a state where the reflector 54 is covered using a masking jig. A means for removing the thin portion 55 can also be incorporated in the manufacturing apparatus.

  According to the present embodiment, the same effect as the first embodiment can be obtained. In addition, by removing the thin portion 55 made of the cured resin 53, the surface of the substrate body 2 (see the surface 45 in FIG. 3 (3)) can be reliably exposed in the portion surrounded by the reflector 54. . In addition, since the thin part 55 which consists of cured resin 53 is removed compared with Example 1, the quantity of the cured resin 53 discarded increases. However, since the thin portion 55 is intentionally formed as thinly as possible, an increase in the amount of the cured resin 53 to be discarded can be minimized.

  In this embodiment, the resin material is supplied to the entire cavity 50 including the plurality of recesses 48. On the other hand, according to the first embodiment, the resin material is supplied to each of the cavities 33 formed of a plurality of concave portions (see FIGS. 3A and 3B). Therefore, the present embodiment is effective in the following case. Firstly, the substrate body 2 is provided with a large number of regions 4 and the planar area of each region 4 is small. Second, the volume of the reflector 54 corresponding to each region 4 is small, and the amount of resin material required in each region 4 unit is small. In these cases, according to the present embodiment, it is not necessary to control the supply amount of the resin material supplied to the cavity 50 with high accuracy. Therefore, according to the present embodiment, the control of the supply amount of the resin material can be simplified.

  In the present embodiment, an example in which the adjacent concave portions 48 are directly connected to each other in the portion corresponding to the boundary line 3 of the substrate body 2 in the lower mold 47 is shown. Instead of this, each recess 48 is independently provided with a portion corresponding to each region 4 of the substrate body 2 in the lower die 47 as a unit, and the adjacent recesses 48 are directly connected at a portion corresponding to the boundary line 3. It is also possible to adopt a configuration without this. In this configuration, adjacent recesses 48 communicate with each other through a space 49 that functions as a communication path.

Example 3
A manufacturing apparatus for manufacturing a substrate with a reflector will be described with reference to FIGS. The feature of the present embodiment is that when a reflector is molded, a release film and vacuum molding (reduced pressure molding) are used in combination for compression molding. Vacuum forming (reduced pressure forming) is to form the pressure in a state where the space filled with the flowable resin is decompressed in the process of clamping the forming die.

  As shown in FIG. 5, the manufacturing apparatus according to the present embodiment includes an upper mold 56 and a lower mold 57. The lower mold 57 is formed with cavities 58 formed of recesses corresponding to the respective regions 4 of the substrate body 2. The cavity 58 is a space surrounded by the cavity surface 59 except for the upper side. A suction path 60 communicates with the inner bottom surface of each cavity 58. Each suction path 60 is connected to decompression means such as a suction pump and a decompression tank (both not shown) via pipes. Similar to the first embodiment, on the upper surface side of the lower mold 57, a resin reservoir 61 formed of a recess communicating with the outermost cavity 58 is formed at a position corresponding to the outside of the assembly of the regions 4 of the substrate body 2. ing.

  A frame-shaped film pressing member 62 is provided between the upper mold 56 and the lower mold 57 so as to surround the lower mold 57 in a plan view. The film pressing member 62 is provided so that it can be moved up and down by a driving means (not shown). A release film 63 is disposed between the lower surface of the film pressing member 62 and the upper surface of the lower mold 57. When the film pressing member 62 is lowered below the mold surface of the lower mold 57, the upper portion of the lower mold 57 enters the space inside the frame-shaped film pressing member 62.

  A frame-shaped film receiving member 64 is provided so as to surround the lower mold 57 in plan view. The film receiving member 64 includes a frame-shaped upper plate 65, a frame-shaped lower plate 66, and a plurality of rod-shaped members 67 that connect the upper plate 65 and the lower plate 66. The film receiving member 64 is supported by an elastic member 68 such as a coil spring. The film pressing member 62 and the upper plate 65 of the film receiving member 64 are provided so as to overlap in a plan view.

  A seal member 69 made of an O-ring or the like is provided on the lower surface of the upper mold 56 at a position overlapping the frame-shaped portion of the film pressing member 62. On the lower surface of the upper mold 56, the suction path 70 communicates with the outside of the portion where the substrate body 2 is disposed. Each suction path 70 is connected to decompression means such as a suction pump and a decompression tank (none of which is shown) via a pipe.

  With reference to FIG. 5 and FIG. 6, the manufacturing method which manufactures a board | substrate with a reflector is demonstrated. As shown in FIG. 5A, first, the substrate body 2 is fixed to the lower surface of the upper mold 56. A release film 63 is supplied between the lower surface of the film pressing member 62 and the upper surface of the lower mold 57. The release film 63 may be supplied in a roll shape or a strip shape. As the release film 63, it is preferable to use a fluororesin having low adhesion to a fluid resin and a cured resin.

  Next, the film pressing member 62 is lowered from the state shown in FIG. 5A, and the release film 63 is sandwiched between the lower surface of the film pressing member 62 and the upper surface of the film receiving member 64.

  Next, as shown in FIG. 5 (2), the film pressing member 62 is continuously lowered. Thereby, the release film 63 is adhered to the upper surface of the lower mold 57. The upper surface of the lower mold 57 means a surface existing between the cavities 58 in the lower mold 57.

  The release film 63 is softened and stretched by being heated by at least a heater (not shown) provided in the lower mold 57. Further, the release film 63 is stretched by lowering the film pressing member 62.

  Next, the release film 63 is sucked through the suction path 60 while the softened release film 63 is in close contact with the upper surface of the lower mold 57. As a result, as shown in FIG. 6 (1), the softened release film 63 is brought into close contact with the cavity surface 59 in the cavity 58 (see FIG. 5 (2)) formed of a recess.

  In this embodiment, the space formed by the recesses provided in the lower mold 57, that is, the space formed by the recesses surrounded by the cavity surface 59 except for the upper part is referred to as a cavity 58. In addition, in a state where the release film 63 is in close contact with the cavity surface 59, a space formed by a recess surrounded by the release film 63 except for the upper side, that is, a space surrounded by the release film 63 and supplied with a resin material. Is also called a cavity for convenience.

  Next, as shown in FIG. 6 (1), each cavity 58 (see FIG. 5 (2)) is filled with a fluid resin 71 made of a thermosetting resin, as in Example 1. To do. In this step, it is preferable to fill each cavity 57 with the flowable resin 71 so that the surface of the flowable resin 71 is slightly raised from the upper surface of the lower mold 57 by utilizing surface tension.

  Next, as shown in FIG. 6 (2), the upper die 56 is lowered. By lowering the upper die 56, the seal member 69 provided on the lower surface of the upper die 56 comes into contact with the upper surface of the film pressing member 62 and deforms. Thus, the lower surface of the upper mold 56, the inner surface of the frame-shaped film pressing member 62, the upper surface of the release film 63, the upper surface of the fluid resin 71, and the surface of the substrate body 2 (the lower surface and the side surface in the figure). ) Is a closed space 72 cut off from the outside of the mold. Thereafter, the closed space 72 is sucked through the suction passage 70 provided in the upper die 56. As a result, moisture contained in the closed space 72, gas components contained in the fluid resin, and the like are discharged to the outside of the closed space 72.

  Next, as shown in FIG. 6B, the upper die 56 is continuously lowered, and the upper die 56 and the lower die 57 are completely clamped. As a result, a predetermined portion of the surface (lower surface in the figure) of the substrate body 2 is immersed (immersed) in the fluid resin 71 filled in the cavity. Thereafter, the fluid resin 71 is cured by applying pressure (clamping pressure) and heat to the fluid resin 71. As a result, a cured resin (see the cured resin 36 in FIG. 3 (3)) is formed on the surface (lower surface in the figure) of the substrate body 2.

  Next, in the same manner as in Example 1, after the upper mold 56 and the lower mold 57 are opened, the molded substrate (see the molded substrate 37 in FIG. 3 (3)) is removed from the upper mold 56. Thereafter, unnecessary resin (see unnecessary resin 39 in FIG. 3 (3)) is removed from the molded substrate. As a result, the reflector-equipped substrate 1 shown in FIG. 1A is completed.

  According to the present embodiment, in addition to the same effects as the first embodiment, the following effects can be obtained. As an effect resulting from the use of the release film 63, first, a reflector having a smooth surface is obtained by transferring the surface of the release film 63 to the cured resin. Secondly, by using a release film 63 having low adhesion to the flowable resin and the cured resin, the surface of the substrate body 2 at the portion surrounded by the reflector (see the surface 45 in FIG. 3 (3)). Can be exposed more reliably. Third, when a soft resin material is used in a high temperature state after curing, the molded substrate (see the molded substrate 37 in FIG. 3 (3)) can be easily removed from the upper mold 56. Conventionally, when a soft resin material is used at a high temperature after curing, it is difficult to release the cured resin from the surface of the mold, so it is necessary to apply a release agent to the surface of the mold every few shots. There is. According to this embodiment, the step of applying a release agent to the surface of the mold can be omitted.

  As an effect resulting from the use of vacuum forming (reduced pressure forming), it is possible to prevent bubbles from being formed in the reflector. In the optoelectronic component, the formation of bubbles in the reflector hinders reflection of light and causes a defect. Therefore, according to the present embodiment, it is possible to improve the yield rate when manufacturing the optoelectronic component.

  Note that the film pressing member 62 may have a planar shape in which a part of the frame is cut out instead of the frame shape. If the lower surfaces of a plurality of members formed by cutting out a part of the frame are on the same surface in the height direction and can be moved up and down at the same time, those members function as the film pressing member 62. Similarly, as for the film receiving member 64, if the upper surfaces of a plurality of members formed by cutting out a part of the frame are present on the same surface in the height direction and are uniformly elastically supported, these members are It functions as a film receiving member 64.

  In addition, depending on the depth, planar size, and number of the cavity 58 formed of the recess, it is preferable to adjust the strength with which the release film 63 is sandwiched between the lower surface of the film pressing member 62 and the upper surface of the film receiving member 64. . For example, when a large number of deep and planar cavities 58 are provided, it is preferable to suppress the strength with which the release film 63 is sandwiched. Thereby, the release film 63 sucked by the suction path 60 slides and moves between the lower surface of the film pressing member 62 and the upper surface of the film receiving member 64. Therefore, the release film 63 can be reliably adhered to the bottom surface of the cavity 58 that is deep and large in plan.

  In this example, a release film and vacuum forming were used in combination. Not only this but any one of a release film and vacuum forming may be used.

  In each of the above-described embodiments, each region 4 is formed in a lattice shape by virtual boundary lines 3 orthogonal to each other, and the planar shape of each region 4 is a rectangle. Not limited to this, the planar shape of each region 4 may be a quadrilateral other than a rectangle or a polygon other than a quadrangle (for example, a regular hexagon). The planar shape of the cavity 33, 58 or the recess 48 in the portion corresponding to each region 4 of the substrate body 2 in the lower mold 31, 57, or 47 is from one closed graphic to another closed completely included in the graphic. It is the shape after cutting out the figure

  Further, the boundary line may be a broken line or a curved line. When the planar shape of each region 4 is a regular hexagon, or when the boundary line is a polygonal line or a curve, a substrate with a reflector along the boundary line using a laser processing machine, a water jet processing machine, or the like Alternatively, the sealed substrate can be cut.

  Further, in Example 2, a reflector 54 made of a cured resin 53 and a thin portion 55 that allows the reflectors 54 to communicate with each other are formed on the surface of the substrate body 2 (the lower surface in FIGS. 4 (1) to (3)). The example in which the thin portion 55 is removed from the molded substrate 52 has been described. In this example, either one or both of a release film and vacuum forming may be used in combination.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

DESCRIPTION OF SYMBOLS 1, 42 Substrate with a reflector 2 Substrate body 3, 41 Boundary line 4 Area (first area)
5, 25, 38, 54 Reflector 6, 44, 48 Recess 7, 45 Surface 8 Slope 9 Optical element 10 Pre-sealing substrate 11, 30, 46, 56 Upper mold 12, 31, 47, 57 Lower mold 13, 33 , 50, 58 Cavity 14 Depression 15, 35, 51, 71 Flowable resin 16, 26, 36, 53 Cured resin 17 Sealed substrate 18, 27 Flat plate portion 19, 28 Lens portion 20, 40 Region 21, 43 Unnecessary portion 22, 23 Optoelectronic components 24 Substrate 29 Cut surface 32 Region (second region)
34, 61 Resin reservoir 37, 52 Molded substrate 39 Unnecessary resin 49 Space (communication part)
55 Thin-walled portion 59 Cavity surface 60, 70 Suction path 62 Film pressing member 63 Release film 64 Film receiving member 65 Upper plate 66 Lower plate 67 Bar-shaped member 68 Elastic member 69 Seal member 72 Closed space

Claims (10)

  1. Using a molding die having an upper die and a lower die provided with a cavity composed of a plurality of recesses, a reflector is formed on a predetermined portion of a predetermined surface of a plurality of first regions provided on the substrate body A method for manufacturing a substrate with a reflector for manufacturing a substrate with a reflector,
    Fixing the substrate body to the lower surface of the upper mold;
    Making the cavity filled with a flowable resin;
    Immersing the predetermined portion in the flowable resin by clamping the upper mold and the lower mold; and
    Curing the flowable resin to form a cured resin;
    Opening the upper mold and the lower mold; and
    Removing the molded substrate made of the substrate main body on which the reflector made of the cured resin is formed from the upper mold, and
    The lower mold is provided with second regions respectively corresponding to the first regions,
    Each of the second regions is provided with the recess,
    The planar shape of the recess in the second region is a shape after cutting out another closed figure from one closed figure,
    Each of the recesses communicates with a boundary line between the second regions,
    In the dipping step, an excess amount of the fluid resin is poured into a resin reservoir that communicates with the outermost cavity among the plurality of cavities in the lower mold, and each of the recesses communicated with each other. Fill the fluid resin evenly,
    In the step of forming the cured resin, an unnecessary resin made of the cured resin is formed in the resin reservoir, and a portion other than the predetermined portion is exposed on each of the predetermined surfaces in the first region. The manufacturing method of the board | substrate with a reflector characterized by these.
  2. In the manufacturing method of the board | substrate with a reflector described in Claim 1,
    A method of manufacturing a substrate with a reflector, comprising: removing the unnecessary resin from the molded substrate after the removing step.
  3. Using a molding die having an upper die and a lower die provided with a cavity, a reflector is formed on a prescribed portion of a prescribed surface of a plurality of first regions provided on the substrate body, with a reflector. A method of manufacturing a substrate with a reflector for manufacturing a substrate,
    Fixing the substrate body to the lower surface of the upper mold;
    Making the cavity filled with a flowable resin;
    Immersing the predetermined surface in the flowable resin by clamping the upper mold and the lower mold; and
    Curing the flowable resin to form a cured resin;
    Opening the upper mold and the lower mold; and
    Removing the molded substrate made of the substrate main body on which the reflector made of the cured resin is formed from the upper mold, and
    The lower mold is provided with second regions respectively corresponding to the first regions,
    The cavity includes a plurality of recesses and a communication portion that includes all of the plurality of second regions in a plan view and communicates the plurality of recesses.
    Each of the second regions is provided with the recess,
    The planar shape of the recess in the second region is a shape after cutting out another closed figure from one closed figure,
    In the step of forming the curable resin, the reflector made of the curable resin is formed in the plurality of concave portions and the thin portion made of the curable resin is formed in the communication portion,
    Manufacturing of a substrate with a reflector, comprising a step of exposing a portion other than the predetermined portion in each of the first regions by removing the thin portion from the molded substrate after the removing step. Method.
  4. In the manufacturing method of the board | substrate with a reflector described in Claim 1 or 3,
    Disposing a release film between the upper mold and the lower mold;
    A step of sandwiching the release film outside the lower mold in plan view;
    Adhering the release film to the upper surface of the lower mold in a state of sandwiching the release film;
    A step of adhering the release film to a mold surface in the cavity by sucking the release film using a suction path provided in the lower mold,
    In the filling step, the cavity is filled with the flowable resin in a state where the release film is in close contact with the mold surface of the cavity. Method.
  5. In the manufacturing method of the board | substrate with a reflector described in any one of Claim 1, 3, or 4,
    Forming a closed space by blocking a space including at least the cavity from the outside of the mold; and
    And a step of depressurizing the closed space in at least a part of a process from the filling step to the dipping step.
  6. A reflector having a molding die including an upper die and a lower die provided with a cavity formed of a plurality of recesses is formed on a predetermined portion of a predetermined surface of a plurality of first regions provided in the substrate body. A substrate with a reflector for manufacturing a substrate with a reflector,
    Fixing means for fixing the substrate body to the lower surface of the upper mold;
    Drive means for clamping and opening the upper mold and the lower mold by relatively moving the upper mold and the lower mold;
    A second region provided corresponding to each of the first regions in the lower mold;
    A resin reservoir communicating with the outermost cavity among the plurality of cavities in the lower mold,
    Each of the recesses is provided in each of the second regions,
    The planar shape of the recess in the second region is a shape after cutting out another closed figure from one closed figure,
    Each of the recesses communicates at a boundary line between the second regions,
    When the upper mold and the lower mold are clamped, a fluid resin that is evenly filled in each of the recesses that communicate with each other when the upper mold and the lower mold are opened. The predetermined portion is immersed, and an excess amount of the flowable resin flows into the resin reservoir;
    The cured resin cured in each of the recesses among the cured resin formed by curing the fluid resin in a state where the upper mold and the lower mold are clamped constitutes each of the reflectors,
    An apparatus for manufacturing a substrate with a reflector, wherein a portion other than the predetermined portion is exposed in each of the first regions.
  7. In the manufacturing apparatus of the board | substrate with a reflector described in Claim 6,
    The manufacturing apparatus of the board | substrate with a reflector characterized by including the removal means which removes the unnecessary resin which consists of the said cured resin hardened | cured in the said resin reservoir.
  8. A substrate with a reflector having a molding die including an upper die and a lower die provided with a cavity, and forming a reflector on a prescribed portion of a prescribed surface of a plurality of first regions provided on the substrate body An apparatus for manufacturing a substrate with a reflector that manufactures
    Fixing means for fixing the substrate body to the lower surface of the upper mold;
    Drive means for clamping and opening the upper mold and the lower mold by relatively moving the upper mold and the lower mold;
    A second region provided corresponding to each of the first regions in the lower mold;
    A recess provided in each of the second regions;
    Including a plurality of the second regions in a plan view and including a communication portion that communicates the plurality of recesses,
    The cavity includes the concave portion and the communication portion,
    Each of the planar shapes of the recesses is a shape after cutting one closed figure from another closed figure,
    When the upper mold and the lower mold are clamped, the predetermined surface is immersed in a fluid resin filled in the cavity in a state where the upper mold and the lower mold are opened,
    The cured resin cured in the plurality of recesses among the cured resin formed by curing the fluid resin in a state where the upper mold and the lower mold are clamped constitutes the reflector, and The cured resin cured at the communicating portion between the plurality of concave portions constitutes a thin portion,
    A removing means for removing the thin portion;
    An apparatus for manufacturing a substrate with a reflector, wherein a portion other than the predetermined portion is exposed in each of the first regions after the thin portion is removed.
  9. In the manufacturing apparatus of the board | substrate with a reflector described in Claim 6 or 8,
    Arranging means for disposing a release film between the upper mold and the lower mold;
    Clamping means for sandwiching the release film;
    A close contact means for bringing the sandwiched release film into close contact with the upper surface of the lower mold;
    A suction means for adhering the release film to the mold surface in the cavity by sucking the release film adhered to the upper surface of the lower mold;
    The manufacturing apparatus of a substrate with a reflector, wherein the fluid resin is filled in the cavity in a state where the release film is in close contact with a mold surface in the cavity.
  10. In the manufacturing apparatus of the board | substrate with a reflector described in any one of Claim 6, 8, or 9,
    A blocking means for making a space including at least the cavity into a closed space blocked from the outside of the mold;
    An apparatus for manufacturing a substrate with a reflector, comprising: a decompression unit that decompresses the closed space.
JP2011181782A 2011-08-23 2011-08-23 Manufacturing method and manufacturing apparatus for substrate with reflector Active JP5658108B2 (en)

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