KR20090116970A - Wafer lever lens portion and light emitting device package using the same - Google Patents

Abstract

PURPOSE: A wafer lever lens portion and a light emitting device package using the same are provided to reduce package production time by making a processing of manufacturing the light emitting device package a batch process. CONSTITUTION: In a wafer lever lens portion and a light emitting device package using the same, a plurality of lens shapes(110) are arranged on a lens substrate(120). A shape reinforced pattern(130) is formed at a lower part of the lens substrate while supporting the lens substrate. The lens substrate and a reinforcement pattern are made of silicon, and the reinforcement pattern is a plurality of polygonal shapes or circulars. The lens unit and a package directly are contacted with each other, and the reinforcement pattern is a depressing or embossed carving.

Description

Wafer level lens portion and light emitting device package using same

The present invention relates to a wafer level lens unit and a light emitting device package using the same, and more particularly, to a wafer level lens unit and a light emitting device package using the same.

Light Emitting Diode (LED) is a light emitting device manufactured using a semiconductor manufacturing process and has been put into practical use in the late 1960s since light emission was observed by applying a voltage to a semiconductor device in the 1920s. Since then, researches and developments have been made to improve the efficiency of LEDs, and in particular, there is a growing interest in LEDs having optical characteristics sufficient to replace existing light sources. In addition, research on LED packages is being actively conducted along with the increase of research on LEDs.

Conventional LED packages can be divided into PLCC (Plastic leaded chip carrier) package, ceramic package and silicon package. The PLCC package is called a plastic lead chip carrier package, and is a package in which leads are placed in all directions of a plastic package.

Ceramic packages are manufactured by firing ceramics at a predetermined temperature, and are used in applications having excellent thermal conductivity and low thermal resistance. Recently released silicon packages are made of thermally conductive silicon wafers similar to those of ceramic packages, resulting in excellent thermal conductivity and low profile.

The technical problem to be achieved by the present invention is to provide a wafer-level lens unit and a light emitting device package using the same, which can be easily manufactured in a batch process, does not contain a glass material can reduce the material cost, and is easier to manufacture There is.

As a first aspect for achieving the above technical problem, the present invention, the lens substrate is arranged a plurality of lens shapes; It characterized in that it comprises a shape reinforcement pattern formed on the lower side of the lens substrate.

According to a second aspect of the present invention, there is provided a light emitting device package, comprising: a package unit in which a light emitting device is mounted in a mounting groove, and a filler is filled in the mounting groove; It is coupled to the package portion upper side, characterized in that it comprises a lens portion and the lens portion formed integrally the shape reinforcement pattern formed below the lens shape.

The present invention can support the structure by itself by the shape reinforcement pattern, the production of the light emitting device package can be made by a batch process (batch process), and since the separate glass substrate is not attached to the lens portion package production time It is possible to shorten, the coupling between the package and the lens is easier, and the production is easier to have the effect of improving the mass productivity and reliability.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

While the invention allows for various modifications and variations, specific embodiments thereof are illustrated by way of example in the drawings and will be described in detail below. However, it is not intended to be exhaustive or to limit the invention to the precise forms disclosed, but rather the invention includes all modifications, equivalents, and alternatives consistent with the spirit of the invention as defined by the claims.

When an element such as a layer, region or substrate is referred to as being on another component "on", it will be understood that it may be directly on another element or there may be an intermediate element in between. . If a part of a component, such as a surface, is expressed as 'inner', it will be understood that this means that it is farther from the outside of the device than other parts of the element.

It will be understood that these terms are intended to include other directions of the device in addition to the direction depicted in the figures. Finally, the term 'directly' means that there is no element in between. As used herein, the term 'and / or' includes any and all combinations of one or more of the recorded related items.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers, and / or regions, such elements, components, regions, layers, and / or regions It will be understood that it should not be limited by these terms.

First Embodiment

The wafer level lens unit means manufacturing a plurality of optical lenses on one substrate.

As shown in FIG. 1, the configuration of the wafer level lens unit 10 includes a plurality of lens shapes 11 arranged on the lens substrate 12, and the lens substrate 12 is a glass substrate. It is formed on (13).

The wafer level lens unit 10 is aligned with and coupled to the wafer level package 20 as shown in FIG. 2. In this case, the light emitting device chip 23 is mounted in the mounting groove 22 formed in the substrate 21 formed of silicon semiconductor or ceramic, and the mounting groove 22 is usually a filler 24. Filled with).

In this case, the wafer level lens unit 10 and the wafer level package 20 may be coupled to each other with an adhesive 25 or the like.

As such, when a plurality of lenses are manufactured on one substrate, the lenses may be combined with a light emitting device package array such as a wafer level package array 20 at a time, thereby reducing the number of processes and manufacturing time. Thereby, the mass productivity can be greatly improved.

At this time, the lens shape 11 included in the lens unit 10 serves to control the intensity of light emitted from the light emitting device chip 23 and the like.

Thereafter, the wafer level lens unit 10 and the wafer level package 20 coupled to each other may be separated into individual elements 30 and used as a light emitting device package as shown in FIG. 3.

On the other hand, the above-described wafer level lens unit 10 is manufactured by molding together with the glass substrate 13.

That is, as shown in FIG. 4, the glass substrate 13 is fixed to the mold upper plate 40, the lens shape 51 is formed on the lens mold 50, and the lens material 50 is formed on the lens mold 50. The filling is to be combined with the mold top plate 40. As the material for the lens, liquid silicone may be generally used.

As shown in FIG. 5, after the mold upper plate 40 is aligned and coupled with the lens mold 50, applying a suitable temperature and pressure may form a solidified lens array on the glass substrate 13. Fig. 6 shows an example of the wafer level lens portion thus manufactured.

The wafer level lens unit 10 formed on the glass substrate 13 may serve to support a lens substrate made of a material such as silicon, but additional cost may be generated by using glass, as described above. Since the glass substrate 13 and the lens substrate 12 are formed to be combined, productivity may be reduced.

Second Embodiment

As illustrated in FIG. 7, the wafer level lens unit 100 includes a plurality of lens shapes 110 arranged on the lens substrate 120, and a shape reinforcement part (below) of the lens substrate 120 is formed. 130) is formed.

That is, the configuration of the lens unit 100 of the present embodiment is formed of one material constituting the lens shape 110, does not use a glass substrate, the shape reinforcement portion 130 for supporting the lens substrate 120 is Is formed, such a shape reinforcement 130 may have a shape reinforcement pattern.

The lens shape 110 and the lens substrate 120 may be formed of a synthetic resin such as silicon, and may be manufactured by using injection molding or compression molding.

In this case, the shape reinforcement pattern 130 of the wafer level lens unit 100 may prevent a problem that may occur due to the flexibility of the structure, such as the bending or expansion or contraction of the lens substrate 120 without the glass substrate during the post-process. You can do that.

That is, as the size of the wafer level lens unit 100 formed only of synthetic resin, such as silicon, the overall structure becomes flexible, which may cause thermal deformation during the process, but the shape reinforcement pattern 130 may prevent such a phenomenon from occurring. It can be.

The shape reinforcement pattern 130 may use an intaglio pattern 131 as shown in FIG. 8 or an embossed pattern 132 as shown in FIG. 9.

In addition, one example of the shape reinforcement pattern 130 may form a honeycomb shape in which hexagonal shapes are connected to each other, as shown in FIG. Can be. These polygonal or circular shapes may be connected to each other, but may be formed at regular intervals.

The shape reinforcement pattern 130 may suppress thermal deformation of the entire wafer level lens unit 100 or the lens substrate 120, and may improve structural robustness, and later join the wafer level package. The yield can be improved.

Meanwhile, as shown in FIG. 11, a reinforcing edge 140 having a step with the lens substrate 120 may be formed on the edge of the wafer level lens unit 100. Such edge 140 may be a wafer level package later. Thermal deformation, such as bending, expansion, or contraction of the lens unit 100, which may occur during the bonding process step with each other, may be alleviated, and the handling of the lens unit 100 may be facilitated in the transportation or bonding step for the process. It can be done.

As shown in FIG. 12, the edge portion 140 is formed outside the lens shape 110 positioned at the outermost portion of the wafer level lens part 100, and its thickness or shape may be arbitrarily adjusted.

In addition, in addition to the spherical lens shape shown in the above-described process, the aspherical lens shape 111 as shown in FIG. 13A may be used as the type of the lens shape included in the lens unit 100. As shown in FIG. 13B, a lens 112 having a scattering agent for dispersing light may be used. In some cases, the lens shape 110 may include a phosphor for converting the color of the light source.

As shown in FIG. 13C, a microlens shape 113 having a plurality of small lens shapes in one unit package may be used, and as shown in FIG. 13D, a fresnel lens shape 114 may be used. May be

Hereinafter, a process of manufacturing individual light emitting device packages by combining the wafer level lens unit 100 and the wafer level package 200 will be described.

First, as shown in FIG. 14A, an individual package on which the light emitting device chip 230 is mounted is arranged on the substrate 210 to prepare a wafer level package 200. As described above, the package 200 may be manufactured through a conventional semiconductor process using the substrate 210 made of a silicon semiconductor.

That is, the substrate 210 is formed in an individual package shape by a method such as etching, and the mounting groove 220 for mounting the light emitting device chip 230 is formed in each individual package. An electrode line (not shown) may be formed in the mounting groove 220 and the substrate 210 to electrically connect the light emitting device chip 230 and later mount the circuit chip on the circuit board. The electrode line may extend to the rear surface of the substrate 210 to facilitate mounting on the circuit board later.

In addition, as shown in FIG. 14B, the wafer level lens unit 100 manufactured by the above-described process is prepared. The wafer level lens unit 100 is formed with a lens shape 110 positioned on the individual packages described above when aligned with the wafer level package 200.

The wafer level lens unit 100 and the wafer level package 200 are aligned and coupled to each other, as shown in FIG. 14C. Such bonding may be used with an adhesive, and in some cases a thermal method may be applied. That is, as described above, since the whole of the wafer level lens unit 100 is made of a synthetic resin such as silicon without a glass substrate, the wafer level lens unit 100 may be more easily combined with the package 200.

In addition, since such a process may be performed by a batch process, mass productivity may be improved, and since a separate glass substrate is not attached to the lens unit 100, package manufacturing time may be shortened. Production becomes easier.

Thereafter, the wafer level lens unit 100 and the wafer level package 200 coupled to each other in the above-described process are separated into individual light emitting device packages 300 as shown in FIG. 15.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the present invention is not limited to the above embodiment, various modifications are possible, and various embodiments of the technical idea are all protected by the present invention. It belongs to the scope.

1 to 6 are diagrams showing a first embodiment of the present invention.

  1 is a cross-sectional view showing an example of a wafer level lens unit.

  2 is a cross-sectional view illustrating a state in which a wafer level lens unit and a wafer level package are combined.

  3 is a cross-sectional view showing a light emitting device package separately separated.

  4 and 5 are schematic views showing the manufacturing process of the lens unit.

  6 is an external view of a lens unit manufactured by the manufacturing process of FIGS. 4 and 5.

  7 to 15 are diagrams showing a second embodiment of the present invention.

  7 is a cross-sectional view illustrating the wafer level lens unit.

  8 is a cross-sectional view illustrating a specific first example of the wafer level lens unit.

  9 is a cross-sectional view illustrating a second specific example of the wafer level lens unit.

  10 is a schematic top view of a wafer level lens portion.

  11 is a cross-sectional view showing a wafer level lens portion having a reinforcing edge portion.

  12 is a plan view showing a wafer level lens portion having a reinforcing edge portion.

  13A to 13D are cross-sectional views illustrating examples of lens shapes.

  14A to 14C are schematic views illustrating a light emitting device package manufacturing process.

  15 is a perspective view illustrating individual light emitting device packages.

Claims (10)

A lens substrate on which a plurality of lens shapes are arranged; And a shape reinforcement pattern formed on the lower side of the lens substrate. The wafer level lens unit of claim 1, wherein the reinforcement pattern has a plurality of polygonal shapes or circular shapes. The wafer level lens unit according to claim 1, further comprising an edge portion having a step with the lens substrate on the edge side of the lens substrate. The wafer level lens unit of claim 1, wherein the lens shape is any one of a spherical lens, an aspherical lens, a plurality of micro lenses, and a Fresnel lens. The wafer level lens unit of claim 1, wherein the lens substrate and the reinforcement pattern are formed of silicon. In the light emitting device package, A package part in which a light emitting device is mounted in a mounting groove, and a filler is filled in the mounting groove; A light emitting device package coupled to an upper side of the package unit and including a lens unit and a lens unit in which a shape reinforcement pattern formed below the lens unit is integrally formed. The light emitting device package of claim 6, wherein the lens unit and the package directly contact each other. The light emitting device package according to claim 6, wherein the lens shape and the lens part are made of silicon. The light emitting device package of claim 6, wherein the reinforcement pattern has an intaglio or an embossed shape. The light emitting device package of claim 6, wherein the reinforcement pattern has a plurality of polygonal shapes, a plurality of circular shapes, or a honeycomb shape.

Images