CN111414897A - Fingerprint sensing module - Google Patents
Fingerprint sensing module Download PDFInfo
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- CN111414897A CN111414897A CN202010315321.6A CN202010315321A CN111414897A CN 111414897 A CN111414897 A CN 111414897A CN 202010315321 A CN202010315321 A CN 202010315321A CN 111414897 A CN111414897 A CN 111414897A
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- image sensor
- fingerprint sensing
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- display panel
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- 239000000463 material Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 239000011358 absorbing material Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 description 15
- 239000013307 optical fiber Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention provides a fingerprint sensing module which is suitable for being configured below a display panel and comprises an image sensor, a micro-lens array and a beam separator. The image sensor is arranged below the display panel, and the micro-lens array is arranged between the image sensor and the display panel and comprises a plurality of micro-lenses which are arranged in an array. The beam separator is arranged between the image sensor and the micro lens array and is provided with a plurality of light channels, each light channel is surrounded by the shading material, and the light beams from the micro lenses are transmitted to the image sensor through the light channels respectively. The fingerprint sensing module can generate a fingerprint image with high sharpness and high resolution.
Description
Technical Field
The present invention relates to an optical sensing module, and more particularly, to a fingerprint sensing module.
Background
As portable electronic devices (e.g., smart phones or tablet computers) are developed to have a high screen occupation ratio, the conventional capacitive fingerprint sensing module disposed on the front of the device is not suitable, but is replaced by an off-screen fingerprint sensing module.
The under-screen fingerprint sensing module can be divided into an ultrasonic fingerprint sensing module and an optical fingerprint sensing module, wherein the optical fingerprint sensing module is more mass-produced and has lower cost. The conventional optical fingerprint sensing module images a fingerprint image on a display panel onto an image sensor below the display panel through a plurality of lenses arranged on an optical axis, so that the obtained fingerprint image is clear but has the defect of excessively thick sensing module, and the thickness of the portable electronic device is reduced. If a pinhole plate is used instead of the lenses, the amount of light entering the pinhole plate is too low, resulting in a low image contrast and difficulty in recognition. In addition, the pinhole plate can block part of pixels, so that part of pixels do not receive light, and pixels without signals can be additionally processed through software. On the other hand, if the optical fiber plate is used instead of the plurality of lenses, when the light from the fingerprint ridge and the fingerprint groove is transmitted to the image sensor by the same optical fiber at the same time, the image received from the image sensor cannot be identified as the fingerprint ridge or the fingerprint groove, and only a blurred image is seen. In addition, the light emitted from the optical fiber plate has a certain divergence, which causes a crosstalk (crosstalk) problem in the optical signals transmitted by different optical fibers, thereby reducing the resolution and sharpness of the fingerprint image.
Disclosure of Invention
The present invention is directed to a fingerprint sensing module that can generate a fingerprint image with high sharpness and high resolution, and can have a relatively thin thickness.
An embodiment of the present invention provides a fingerprint sensing module, which is suitable for being disposed below a display panel and includes an image sensor, a micro-lens array and a beam splitter. The image sensor is arranged below the display panel, and the micro-lens array is arranged between the image sensor and the display panel and comprises a plurality of micro-lenses which are arranged in an array. The beam separator is arranged between the image sensor and the micro lens array and is provided with a plurality of light channels, each light channel is surrounded by the shading material, and the light beams from the micro lenses are transmitted to the image sensor through the light channels respectively.
In the fingerprint sensing module according to the embodiment of the invention, since the microlens array is adopted to converge the fingerprint image on the image sensor, and the light beams of different optical channels are separated by the light shielding material of the beam separator, the image sensor can sense the fingerprint image with high sharpness and high resolution.
Drawings
FIG. 1 is a schematic cross-sectional view of a fingerprint sensing module according to an embodiment of the present invention;
fig. 2 is a perspective view of the fingerprint sensing module of fig. 1.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Referring to fig. 1 and 2, the fingerprint sensing module 100 of the present embodiment is suitable for being disposed below a display panel 200, wherein the display panel 200 is, for example, a transparent display panel, for example, the display panel 200 may be an organic light-emitting diode (O L ED) display panel, a liquid crystal display panel (liquid crystal display panel) micro light-emitting diode (micro light-emitting diode) display panel, or other suitable transparent display panel.
In the present embodiment, the fingerprint sensing module 100 includes an image sensor 110, a microlens array 120, and a beam splitter 130. The image sensor 110 is disposed below the display panel 200, wherein the image sensor is, for example, a Complementary Metal Oxide Semiconductor (CMOS) image sensor, a Charge Coupled Device (CCD), or other suitable image sensor.
The microlens array 120 is disposed between the image sensor 110 and the display panel 200, and includes a plurality of microlenses 122 arranged in an array. The beam splitter 130 is disposed between the image sensor 110 and the microlens array 120, and has a plurality of light channels 132, and each light channel 132 is surrounded by a light shielding material 134.
The light beam 201 emitted from the display panel 200 irradiates the finger 50 pressing on the upper surface (i.e., the surface S1) of the display panel 200, and then the light beam 201 is reflected by the finger 50 to penetrate through the display panel 200 and is transmitted to the microlens array 120, wherein the light beam 201 reflected by the finger 50 carries the information of the fingerprint 52 of the finger 50. Then, the light beams 201 pass through the micro lenses 122, and the light beams 201 from the micro lenses 122 are respectively transmitted to the image sensor 110 through the light channels 132.
In the present embodiment, the image sensor 110 is a thin film transistor (tft) sensor, which is fabricated by depositing a thin film on a glass-free substrate to form a transistor and a photodiode, for example. In addition, the tft sensor may be disposed under the entire display panel 200 to achieve the effect of full-screen fingerprint sensing. However, in other embodiments, the image sensor 110 may be located under a local area (e.g., a fingerprint sensing area) of the display panel 200, and the image sensor 110 may be a conventional semiconductor image sensor fabricated on a silicon substrate.
In the present embodiment, the light beam 201 from each microlens 122 is transmitted to a corresponding pixel 112 of the image sensor 110 through a corresponding light channel 132. For example, each microlens 122 images a size corresponding to one pixel 112 of the image sensor 110. In the present embodiment, the light shielding material 134 is a light absorbing material, such as a black material. Each light channel 132 may be a space in which air, other gas, or transparent liquid may be disposed, or the space may be a vacuum space. Alternatively, each light channel 132 may be formed of a transparent solid material. In one embodiment, the beam splitter 130 is a fiber optic plate (fiber optic plate) having a plurality of optical fibers arranged in an array to form the optical channels 132, respectively, and a light blocking material 134 filled around the optical fibers. The shape of the light tunnel 132 may be a rectangular cylinder, a square cylinder, a cylinder, or other suitable geometric shape. When the beam splitter 130 is a fiber optic plate, the light tunnel 132 may be cylindrical.
In the fingerprint sensing module 100 of the present embodiment, since the microlens array 120 is employed to converge the fingerprint image on the image sensor 110, and the light shielding material 134 of the beam splitter 130 is employed to separate the light beams 201 of the different light channels 132, the image sensor 110 can sense fingerprint images with high sharpness and high resolution, the number of the microlenses 122 in the microlens array 120 shown in fig. 2 is 4 ×, but fig. 2 is merely a schematic view, and the number of the microlenses 122 in the microlens array 120 can be M × N, where M can be equal to N or not equal to N, and both M and N are positive integers greater than 1, and in one embodiment, the number of the microlenses 122 can be the same as the number of pixels of the image sensor 110. in addition, since the fingerprint sensing module 100 of the present embodiment employs the microlens array 120 and the beam splitter 130 instead of conventional multiple lenses arranged along the optical axis, the thickness of the fingerprint sensing module 100 can be thinner, and the electronic device 300 including the display panel 200 and the fingerprint sensing module 100 can be thinner, wherein the electronic device 300 is an intelligent mobile phone, such as a portable mobile phone, a portable computer, and a portable computer, having the advantages of the fingerprint sensing module 100, such as a thin fingerprint image sensor, a portable computer, such as a portable computer, having a thin tablet computer, and a thin display device, and a thin tablet computer.
To further suppress crosstalk between the light beams 201 passing through different microlenses 122, in the present embodiment, the microlens array 120 may have a light absorbing layer 124 located around the microlenses 122, i.e., located between two adjacent microlenses 122 and the peripheral region of the entire array formed by the microlenses 122.
In the present embodiment, the microlenses 122 can be aspheric lenses, which can accurately focus the light beams 201 on the pixels 112 of the image sensor 110 to form a clear fingerprint image. That is, the quality of the fingerprint image can be improved by using the aspherical lens. When the microlens is manufactured by a conventional semiconductor process, it is usually made into a spherical lens, and cannot be made into an aspherical lens. In contrast, the microlenses 122 and the microlens array 120 of the present embodiment can be formed by liquid silicone injection molding, i.e., the microlenses 122 are lenses of solidified liquid silicone. In one embodiment, the surface S3 facing the display panel 200 and the surface S4 facing the image sensor 110 of each microlens 122 are aspheric. However, in other embodiments, the surface S3 may be aspheric and the surface S4 may be spherical, or the surface S3 may be spherical and the surface S4 may be aspheric, wherein at least the surface S3 is preferably aspheric. In addition, compared to the conventional semiconductor process in which the formed microlens is generally limited to be a single curved surface, the microlens 122 formed by the liquid silicone injection molding technique of the present embodiment may have two curved surfaces (i.e., the surface S3 and the surface S4), which greatly increases the design freedom and the imaging quality of the microlens 122.
The following lists an optical parameter table of the electronic device 300 according to an embodiment:
in the above table, the surface S1 is the upper surface of the display panel 200, the surface S2 is the lower surface of the display panel, and the sensing surface S5 is the sensing surface of the image sensor 110. A spacing of 0 in that row of fingers 50 means that the distance of fingers 50 to the next surface (i.e., surface S1) is 0. The spacing of the row of the surface S1 of the display panel 200 being 1.5 mm means that the distance from the surface S1 to the next surface (i.e., the surface S2) is 1.5 mm. The spacing of the row of the surface S3 of 0.09 mm means that the distance from the surface S3 to the next surface (i.e., the surface S4) on the optical axis a of the microlens 122 is 0.09 mm. The remaining spacings are defined and so on. In the present embodiment, the surface S3 forms an aperture stop (aperture stop), and the surface S3 is aspherical. In addition, in the present embodiment, the surface S4 is a spherical surface. Moreover, the surface S3 is convex, the surface S4 is concave, and the diopter (passive power) of the microlens 122 is positive.
In the present embodiment, the aspheric surface of the surface S3 can be defined by the following formula:
wherein:
r is the radius of curvature of the surface S3 of the microlens 122 near the optical axis a;
z is the depth of the aspheric surface (the perpendicular distance between the point on the aspheric surface that is Y from the optical axis A and the tangent plane tangent to the vertex on the optical axis A);
y is the distance between a point on the aspheric curve and the optical axis A;
k is the cone constant (conc constant).
In this embodiment, the taper coefficient K is-0.6215, and the R value of the surface S3 in the above formula is 0.0909 mm.
In summary, in the fingerprint sensing module according to the embodiment of the invention, since the microlens array is adopted to converge the fingerprint image on the image sensor, and the light shielding material of the beam splitter is used to separate the light beams of different light channels, the image sensor can sense the fingerprint image with high sharpness and high resolution.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A fingerprint sensing module is suitable for being configured below a display panel and comprises:
an image sensor disposed below the display panel;
a microlens array disposed between the image sensor and the display panel and including a plurality of microlenses arranged in an array; and
a beam splitter disposed between the image sensor and the microlens array and having a plurality of light channels, each light channel surrounded by a light shielding material, wherein light beams from the microlenses pass through the light channels respectively and are transmitted to the image sensor.
2. The fingerprint sensing module of claim 1, wherein the light beam from each microlens is delivered to a corresponding pixel of the image sensor through a corresponding light channel.
3. The fingerprint sensing module of claim 1, wherein the image sensor is a thin film transistor sensor.
4. The fingerprint sensing module of claim 1, wherein the light blocking material is a light absorbing material.
5. The fingerprint sensing module of claim 1, wherein the beam splitter is a fiber optic plate.
6. The fingerprint sensing module of claim 1, wherein the microlens array has a light absorbing layer positioned around the plurality of microlenses.
7. The fingerprint sensing module of claim 1, wherein the plurality of microlenses are aspheric lenses.
8. The fingerprint sensing module of claim 7, wherein a surface of each microlens facing the display panel is aspheric.
9. The fingerprint sensing module of claim 1, wherein the plurality of microlenses are lenses of cured liquid silicone gel.
10. The fingerprint sensing module of claim 1, wherein the display panel is spaced less than 1 millimeter from the image sensor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962881960P | 2019-08-02 | 2019-08-02 | |
| US62/881,960 | 2019-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111414897A true CN111414897A (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020598508.7U Expired - Fee Related CN211653677U (en) | 2019-08-02 | 2020-04-21 | Fingerprint sensing module |
| CN202010315321.6A Pending CN111414897A (en) | 2019-08-02 | 2020-04-21 | Fingerprint sensing module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020598508.7U Expired - Fee Related CN211653677U (en) | 2019-08-02 | 2020-04-21 | Fingerprint sensing module |
Country Status (2)
| Country | Link |
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| CN (2) | CN211653677U (en) |
| WO (1) | WO2021022830A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021022830A1 (en) * | 2019-08-02 | 2021-02-11 | 神盾股份有限公司 | Fingerprint sensing module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000113171A (en) * | 1998-10-02 | 2000-04-21 | Fuji Electric Co Ltd | Fingerprint image input device |
| TW561278B (en) * | 2001-10-11 | 2003-11-11 | Nitto Denko Corp | Optical sheet and display device having the optical sheet |
| US20060202104A1 (en) * | 2005-03-14 | 2006-09-14 | Microalign Technologies, Inc. | Contact-type monolithic image sensor |
| KR20090116970A (en) * | 2008-05-08 | 2009-11-12 | 엘지전자 주식회사 | Wafer lever lens portion and light emitting device package using the same |
| CN107358216A (en) * | 2017-07-20 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of fingerprint collecting module, display device and fingerprint identification method |
| US20190080138A1 (en) * | 2017-09-11 | 2019-03-14 | Boe Technology Group Co., Ltd. | Display panel and display device |
| CN211653677U (en) * | 2019-08-02 | 2020-10-09 | 神盾股份有限公司 | Fingerprint sensing module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100651740B1 (en) * | 2005-07-13 | 2006-12-01 | 한국전자통신연구원 | Sensor of recognizing finger print using micro lens |
| CN206058223U (en) * | 2016-08-04 | 2017-03-29 | 京东方科技集团股份有限公司 | A kind of lines identification display device |
| CN108734073B (en) * | 2017-04-14 | 2024-05-24 | 华为技术有限公司 | Detection device and terminal equipment |
| CN207557977U (en) * | 2017-12-05 | 2018-06-29 | 深圳市为通博科技有限责任公司 | Optical path modulation device, fingerprint identification device and terminal device |
| EP3706036B1 (en) * | 2019-01-22 | 2021-12-22 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition apparatus and electronic device |
-
2020
- 2020-04-21 WO PCT/CN2020/085781 patent/WO2021022830A1/en active Application Filing
- 2020-04-21 CN CN202020598508.7U patent/CN211653677U/en not_active Expired - Fee Related
- 2020-04-21 CN CN202010315321.6A patent/CN111414897A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000113171A (en) * | 1998-10-02 | 2000-04-21 | Fuji Electric Co Ltd | Fingerprint image input device |
| TW561278B (en) * | 2001-10-11 | 2003-11-11 | Nitto Denko Corp | Optical sheet and display device having the optical sheet |
| US20060202104A1 (en) * | 2005-03-14 | 2006-09-14 | Microalign Technologies, Inc. | Contact-type monolithic image sensor |
| KR20090116970A (en) * | 2008-05-08 | 2009-11-12 | 엘지전자 주식회사 | Wafer lever lens portion and light emitting device package using the same |
| CN107358216A (en) * | 2017-07-20 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of fingerprint collecting module, display device and fingerprint identification method |
| US20190080138A1 (en) * | 2017-09-11 | 2019-03-14 | Boe Technology Group Co., Ltd. | Display panel and display device |
| CN211653677U (en) * | 2019-08-02 | 2020-10-09 | 神盾股份有限公司 | Fingerprint sensing module |
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| Publication number | Publication date |
|---|---|
| WO2021022830A1 (en) | 2021-02-11 |
| CN211653677U (en) | 2020-10-09 |
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