JP5236995B2 - Molding method of optical molded product - Google Patents

Description

  The present invention relates to a method of molding an optical molded product in which an optical molded product such as an optical lens is molded with a resin material (molding material).

  Conventionally, for example, an optical lens (for example, a plastic lens) is molded by an injection molding method (injection molding method). This method is performed as follows.

  That is, first, a resin material heated and melted through a resin passage such as a runner, sprue, or gate provided in the mold from the injection mechanism into a lens molding cavity (concave portion) provided in the injection mold. (Molding material) is injected and injected and filled, and then the heat-melted resin material injected and filled into the mold cavity is cooled and solidified, so that the optics corresponding to the shape of the cavity in the mold cavity A lens (optical molded product) is molded as a product.

JP-A-10-329176

However, since the resin material is injected and filled into the mold cavity through the resin passages such as runners, sprues, and gates, the resin material solidified in the resin passages becomes an unnecessary resin as a product (optical molded product). The product yield is low.
For this reason, the productization rate of the resin material cannot be improved efficiently, and the productivity of the product (optical molded product) cannot be improved efficiently.
Therefore, there is an adverse effect that the product rate of the resin material (molding material) cannot be improved efficiently, and the productivity of the product (optical molded product) cannot be improved efficiently.

  Accordingly, an object of the present invention is to efficiently improve the productization rate of a resin material (molding material) and to efficiently improve the productivity of the product (optical molded product).

In recent years, LED molded products (optical molded products) in which light emitting elements such as light emitting diodes (LEDs) are encapsulated with a resin material have been used.
This LED molded product includes, for example, a light emitting part in which a light emitting LED chip is sealed with a resin, and an optical part (optical lens) that is attached to the light emitting surface and adjusts light emission (light collection, scattering, etc.) from the light emitting part. ).
In particular, the present invention relates to an optical molded product such as an optical lens attached to a light emitting surface of a light emitting portion in an LED molded product.

  The optical molding product molding method according to the present invention for solving the technical problems described above is such that an optical molding is first performed in a space portion formed by individual cavities in a mold cavity for compression molding and molding holes provided in a carrier. A molded carrier having a plurality of required optical molded products is formed by compression molding the product, and then the required plurality of optical molded products are individually ejected from the above-described molded carrier. It is characterized by obtaining a molded product.

  Further, the method for molding an optical molded product according to the present invention for solving the technical problem described above is a method for individually molding a plurality of required optical molded products in a molded carrier in a mold cavity for compression molding. A molded carrier having an optical molded product having a required plurality of multilayer structures is formed by compressing and laminating each separately in a cavity.

A compression molding cavity provided in the lower mold , a plurality of required individual cavities provided on the bottom surface of the compression molding cavity, and a plurality of the required plurality A step of preparing a mold for compression molding of an optical molded product provided with a cavity bottom surface member having an individual cavity as a front end surface, and a release film for covering the inside of the lower mold cavity for compression molding described above; A step of preparing a carrier having a molding hole corresponding to each of a plurality of required individual cavities, a release tape placed on the upper surface of the carrier, and an individual cavity coated with the release film described above The step of supplying a resin material into the cavity for compression molding and heating and melting the carrier, and the carrier on which the release tape is placed, are formed at the positions of the individual cavities described above. In a state of being matched with the position, the steps of feeding set to the required position of the lower mold, a step of clamping the upper and lower mold sections mentioned above, in a state where the lower the dies were clamping, the individual cavities described above By pressing the molten resin in the lower mold cavity with the cavity bottom member and injecting and filling the molten resin into the carrier molding hole, an optical molded product is formed in the space formed by the carrier molding hole and the individual cavity. A step of forming a molded carrier having a plurality of the optically molded products by compression molding, a step of opening both the upper and lower molds, and the above-described molded carrier when the upper and lower molds are opened. And taking out the required plurality of optical molded products compression-molded on the molded carrier from the above-mentioned release tape mounting side. It allows molding method for an optical molded article, characterized in that comprising the step of separating the optical molded article from said molding pre carriers said protruding.

  In addition, the method for molding an optical molded product according to the present invention for solving the technical problem described above is a seat molding recess provided on the upper mold surface corresponding to the carrier molding hole when the resin is pressed by the cavity bottom member. The step of molding the molding seat by injecting resin from the molding hole through the release tape inside, and pressing the punch to the molding seat when ejecting the optical molded product And a step of separating the optical molded product from the carrier.

  In addition, in the method for molding an optical molded product according to the present invention for solving the above technical problems, the protrusion provided on the upper mold is placed in the carrier molding hole and the small cavity when the upper and lower molds are clamped. It is characterized in that it comprises a step of loosely fitting and a step of covering the release tape placed on the upper surface of the carrier with the protruding portion when the upper and lower molds are clamped.

According to the present invention, since the resin material (molding material) is supplied into the resin molding cavity of the compression molding die and the compression molding is adopted, the gate, the runner, etc. as in the injection molding shown in the conventional example. No unnecessary cured resin is generated as a product cured in the resin passage.
That is, according to the present invention, it is possible to efficiently reduce the amount of the cured resin that is not necessary for a product, so that the yield of the product can be improved efficiently.
Therefore, according to the present invention, it is possible to efficiently improve the productization rate of the resin material, and it is possible to effectively improve the productivity of the product (optical molded product).

The present invention starts with “a collective cavity (one large cavity) provided in the lower mold, a plurality of required individual cavities (small cavities) provided on the bottom surface of the large cavity, and a plurality of required small cavities on the tip surface. Compression molding mold (upper and lower molds) for optical molded products (optical lenses) having a cavity bottom member having a cavity, and “molding holes (through holes) individually corresponding to a plurality of required small cavities” And a “projection device for an optical molded product (optical lens) for projecting an optical lens compression-molded in a space formed by a small cavity and a carrier molding hole”.
Also, a release film that covers the inside of the lower mold cavity and a release tape to be placed on the upper surface of the carrier are prepared.
The release film and the release tape used in the present invention have, for example, a mirror-like surface so that the optical transparency of the optically molded product (optical lens) formed by compression can be improved. Is formed.

In other words, a molded carrier having an optical lens (required optical lenses) formed by a space formed by a carrier molding hole and a small cavity can be obtained by compression molding the carrier with a compression molding die. it can.
In addition, a molded carrier provided with an optical lens having a two-layer structure is formed on the optical lens portion of the molded carrier by compression molding the optical lens portion with a small cavity of a compression molding die. can do.
That is, since the lamination by compression molding can be performed a plurality of times (multiple times), a required plurality of optical lenses having a multi-layer structure (multi-layer structure) optical lens portion are formed on one carrier. be able to.
Next, the optical lens can be separately ejected from the molding hole of the carrier having the required plurality of optical lenses by the projecting device.
Accordingly, this optical lens can be attached to the light emitting portion to form a light emitting product.

More specifically, first, a release film is coated in the lower mold cavity of the compression mold, and a resin material is supplied into the lower mold cavity coated with the release film to melt by heating.
Next, the carrier having the release tape placed on the upper surface is supplied to the required position of the lower mold, and the upper and lower molds are clamped.
At this time, the release tape is sandwiched between the upper mold surface and the carrier upper surface, and the positions of the carrier molding holes and the small cavities coincide.
Next, the cavity bottom member is moved upward to press the resin in the lower mold cavity.
At this time, the resin in the lower mold cavity is injected and filled into the carrier molding hole, and the amount of resin injected and filled (press-fitted) into the space formed by the small cavity and the molding hole is between the small cavities (molding holes). It adjusts through the communicating path (large cavity) formed in this.
After the time required for curing has elapsed, the molded carrier can be taken out by opening both the upper and lower molds.
The molded carrier is formed with a required plurality of optical lenses that are compression-molded in a space portion composed of a molding hole and a small cavity.
As described above, by performing this compression molding a plurality of times using a single carrier, a molded carrier having optical lenses having a required plurality of multilayer structures can be formed.
Therefore, the optical lens can then be protruded and separated from the molding hole of the molded carrier.

That is, according to the present embodiment, a configuration in which a resin material (molding material) is supplied into the resin molding cavities (large and small cavities) of the compression molding die and the optical lens is compression molded is adopted. No unnecessary cured resin is generated as a product that cures in a resin passage such as a gate and a runner, such as the injection molding shown.
Therefore, according to the present invention, the amount of cured resin that is unnecessary for a product (optical lens) can be reduced efficiently, so that the yield of the product can be improved efficiently and supplied into the lower mold cavity. The obtained resin material can be efficiently commercialized.
Therefore, according to the present invention, the productization rate of the resin material can be improved efficiently, and the productivity of the product (optical lens) can be improved efficiently.

First, a first embodiment according to the present invention will be described in detail with reference to the drawings.
1 and 2 show a compression molding die for molding a molded carrier having an optical molded product (optical lens) according to Example 1. FIG.
3 and 4 show a cutting device for a molded carrier (optical molded product).
5 (1) to 5 (3) are steps for forming an LED molded product by mounting an optical molded product (optical lens) on the light emitting portion.

(Regarding the structure of the compression molding die for the optical molded product in Example 1)
That is, as shown in FIGS. 1 and 2, a compression molding die 1 of an optical molded product used in Example 1 includes a fixed upper die 2 and a movable lower die 3 positioned opposite to the upper die 2. It is composed of
Further, a lower mold cavity (collective cavity) 4 is provided on the mold surface of the lower mold 3, and a plurality of required individual cavities 5 are provided on the bottom surface of the cavity 4.
That is, a large cavity 4 (collective cavity) for compression molding having a large cavity opening is provided on the lower mold surface, and a plurality of small cavities 5 (individual cavities) are provided on the bottom surface of the large cavity 4. ) Are provided in a matrix form (in a two-dimensional arrangement in the vertical and horizontal directions).
Therefore, the lower mold cavities 4 and 5 are configured by the required plurality of small cavities 5 (in the illustrated example, hemispherical concave portions) and large cavities 4 (in the illustrated example, flat plate-shaped concave portions).
Further, the bottom surface of the large cavity 4 is provided with a cavity bottom member 6 having a plurality of required small cavities 5 (large cavity bottom surfaces) on the front end surface. The bottom member 6 is configured to be movable up and down.
In addition, the mold surface of the upper mold 2 is used for projecting an optical molded product that projects an optical molded product (optical lens), which will be described later, corresponding to the position of the small cavity 5 provided in the cavity bottom member 6. A plurality of required seat molding recesses 7 for molding the molding seat portion 15b are provided in a matrix shape.

The lower mold 3 is provided with a release film 8 that covers the mold surface of the lower mold 3 and the bottom surface of the large cavity 4 including a plurality of required small cavities 5.
Although not shown, suction holes for forcibly sucking and discharging air are formed at required portions of the bottom surface of the large cavity 4 including the mold surface of the lower mold 3 and the required plurality of small cavities 4 in the lower mold 3. It is provided and configured.
Therefore, the release film 8 is adsorbed and coated along the shape of the bottom surface of the lower mold 3 and the bottom surface of the large cavity 4 including the required plurality of small cavities 5 by forcibly sucking and discharging air from the suction holes. It is configured to be able to.

Although not shown, the compression mold 1 (2, 3) includes heating means for heating the mold 1 (2, 3) to a required resin molding temperature and a release film 8. A resin material supply mechanism for supplying the resin material 9 into the coated large cavity 4 is provided.
That is, it is configured such that a required amount of the resin material 9 can be supplied into the large cavity 4 covered with the release film 8 and heated and melted.
Moreover, the resin material 9 used for compression-molding an optical molded product has light transmittance (transparency).
Accordingly, by moving the cavity bottom member 6 upward, the resin 9 in the large cavity 4 (including the small cavity 5) covered with the release film 8 by the cavity bottom member 6 is pressed with a required pressing force. It is configured to be able to.
In FIG. 1, a required amount of the resin material 9 is supplied and set to the release film 8, and in this state, the release film 8 is adsorbed and coated in the lower mold cavities 4 and 5 to supply the resin material 9. Can be adopted.

(About the structure of the carrier for molding optical molded products)
Further, in Example 1, as shown in FIG. 1, a carrier for molding an optical molded product (carrier for optical molded product) 10 is used to mold an optical lens (optical molded product).
The carrier 10 has a flat plate shape, and the carrier 10 has molding holes (through holes) 11 for molding optical molded products corresponding to the positions of a plurality of required small cavities 5 in the lower mold 3. It is provided and configured.
In addition, the carrier 10 is configured such that the molding holes 11 are separately arranged in the matrix mold corresponding to the arrangement of the small cavities 5.
Further, when the carrier 10 is supplied and set at a required position on the mold surface of the lower mold 3, the position of the molding hole 11 of the carrier 10 and the position of the small cavity 5 of the large cavity 4 match each other (in plan). Is configured to do.
Accordingly, the position of the opening of the molding hole 11 on the lower surface of the carrier 10 and the position of the opening of the small cavity 5 on the bottom surface of the large cavity 4 (through the space portion of the large cavity 4) It is configured to be matched separately.

Moreover, in Example 1, it is comprised so that the release tape 12 can be mounted on the upper surface of this carrier 10. FIG.
In addition, the release tape 12 placed on the upper surface of the carrier 10 is configured to cover and close at least the openings of the plurality of required molding holes 11 on the upper surface side of the carrier 10.
Further, when the release tape 12 is placed on the upper surface of the carrier 10 and the carrier 10 is supplied and set to a required position on the mold surface of the lower mold 3 and the upper and lower molds 1 (2, 3) are clamped, The release tape 12 can be sandwiched between the mold surface of the upper mold 2 and the upper surface of the carrier 10.
At this time, the opening of the molding hole 11 and the opening of the seat molding recess 7 are arranged to face each other with the release tape 12 interposed therebetween.
Accordingly, (in plan), the position of the opening of the molding hole 11 on the upper surface of the carrier 10 and the position of the opening of the seat molding recess 7 on the mold surface of the upper mold 2 (via the release tape 12). It is configured to match each.

Further, in Example 1, when the upper and lower molds 1 (2, 3) are clamped, the small cavity (recessed part) 5 of the lower mold 3, the molding hole (through hole) 11 of the carrier 10, and the seat of the upper mold 2 are used. The molding recesses 7 are configured so that they can be arranged in a line in the vertical direction.
The small cavity 5 (including the large cavity 4) and the molding hole 11 are configured to communicate with each other.
Therefore, in the first embodiment, as will be described later, an optical lens (optical molded product) 15 is formed in a space formed by the small cavity 4 (including a part of the large cavity 4), the carrier molding hole 11, and the seat molding concave portion 7. It is comprised so that compression molding can be carried out.

(About release film and release tape)
That is, the release film 8 and the release tape 12 used in the present invention are configured so that the mold surface (cavity surface, mold surface, etc.) of the compression mold 1 and the resin 9 do not adhere to each other. In particular, the release tape 12 is used to efficiently release the resin (molded seat portion 15 a) cured in the seat molding recess 7 provided on the mold surface of the upper mold 2 from the seat molding recess 7. It is used.
In addition, the release film and the release tape used in the present invention have a mirror-like surface, for example, so that the optical transparency of the compression-molded optical molded product (optical lens) can be improved. Is formed.

(About molded carriers)
In Example 1, the molded carrier 13 is formed by compression molding the pre-molding carrier 10 with the resin material 9 using the compression molding die 1 (2, 3).
That is, in the compression mold 1 (2, 3), the resin material (molten resin) 9 heated and melted in the large cavity 4 including the small cavity 5 through the release film 8 is used as the cavity bottom member. 6 is moved up and pressed with a required pressing force, so that the molten resin 9 in the large cavity 4 is first injected and filled (press-fitted) into the carrier molding hole 11 with the required resin pressure. it can.
Next, the molten resin 9 can be injected and filled into the seat molding recess 7 via the release tape 12 through the molding hole 11.
At this time, the release tape 12 corresponds to the shape of the seat molding concave portion 7 by pressing the release tape 12 toward the seat molding concave portion 7 with a required resin pressure from the molding hole 11 by the molten resin 9. Can be coated.
At this time, the amount of resin injected and filled into the compression molding space formed by the small cavity 5, the molding hole 11, and the seat molding recess 7 through the communication passage 4 a which is a part of the large cavity 4 is not excessive or insufficient. It is configured so that it can be adjusted.

That is, by using the compression molding dies 1 (2, 3) and the carrier 10 before molding, the large cavity 4 (including the communication portion 4a) including the required plurality of small cavities 5, the molding hole 11, and the seat molding. The molded carrier 13 can be formed from the resin 14 and the carrier 10 that are collectively cured in the recess 7.
The batch cured resin 14 includes a thin cured resin 14a that is unnecessary as a product (optical lens 15) cured in the communication passage 4a that is a part of the large cavity 4, and a small cavity 5 (detailed). (Including a part of the large cavity 4), a resin hardened by the molding hole 11 of the carrier 10 and the seat molding recess 7 of the upper mold 2, that is, a plurality of required optical lenses 15 (products). Yes.
The thin film-shaped cured resin 14a cured in the communication path 4a is formed in a state of adhering to the lower surface of the carrier 10. On the lower surface of the carrier 10, the thin film-shaped cured resin 14a is an individual optical lens (product) 15. It will be formed around.
Accordingly, in the molded carrier 13, the optical lens (product) 15 is obtained by removing the thin cured resin 14 a unnecessary as a product from the batch cured resin 14, and the optical lens 15 is formed on the carrier 10. Each of the holes 11 is formed and configured in a state of being attached in the hole 11.
The optical lens 15 includes a molded seat portion 15b cured by the seat molding recess 7 and other portions, that is, a small cavity 5 including a portion excluding the communication path 4a of the large cavity 4 and a molding hole 11. It is comprised from the resin (the main body 15a of an optical lens) hardened | cured in the space part which consists of.

Further, the molded carrier 13 is taken out from both the upper and lower molds 1 (2, 3) by performing compression molding with the compression molding dies 1 (2, 3) and opening the upper and lower molds 1 (2, 3). It is configured to be able to.
At this time, on the upper surface of the molded carrier 13, the release tape 12 can be formed in a state of being covered along the shape of the upper surface of the carrier 13 (10) and the molded seat portion 15b.
As described above, according to the first embodiment, the optical lens 15 can be compression-molded using the carrier 10.
Moreover, in Example 1, it is comprised so that the quantity of resin 14a hardened | cured in the communicating path 4a used as unnecessary cured resin as a product (optical lens 15) can be reduced efficiently.
As will be described later, by protruding the resin portions (optical lenses 15) disposed in the respective molding holes 11 from the molded carrier 13 with the thin film-shaped cured resin 14a remaining (or By punching out), an optical lens (product) 15 can be obtained.

(About the structure of the protrusion device of the optical molded product in Example 1)
That is, as shown in FIG. 3, the optically molded product protruding device 16 has a cradle (die) on which the molded carrier 13 is placed (with the release tape 12 placed on the upper surface of the molded carrier 13). ) 17 and a projecting mechanism 18 for projecting the optical molded product (optical lens 15) disposed in the molding hole 11 in the molded carrier 13 in a state where a required portion of the molded carrier 13 is pressed. Yes.
The cradle 17 is configured with a required number of projecting holes 17 a corresponding to optical molded products (optical lenses 15) attached to the molded carrier 13, and the molded carrier 13 When supplied and set to the cradle 17, the position of the optical lens 15 formed in a state of adhering to the molded carrier 13 (molded hole 11) can be arranged at the position of the protruding hole 17a.
Further, the protruding mechanism 18 includes a pressing member 18 a that presses a required portion (including the release tape 12 and excluding the molding hole 11) of the molded carrier 13, and an optical lens disposed in the molding hole 11 of the molded carrier 13. Punches 18b that project 15 (optically molded product) separately and fixing members (not shown) that fix the base ends of the required plurality of punches 18b are provided.
Accordingly, in a state where the required portion of the molded carrier 13 is pressed by the pressing member 18a, the required portion of the molded carrier 13, that is, the side of the molded seat portion 15b of the optical lens 15 disposed in the carrier molding hole 11 is punched 18b. The optical lens 15 can be protruded from the carrier molding hole 11 separately and discharged from the protruding hole 17a of the cradle 17 by being pressed at.
At this time, the thin film resin 14a cured in the communication path 4a remains attached to the lower surface of the molded carrier 13 (excluding the opening of the molding hole 11).
In the example shown in FIG. 4, the state in which the optical lens 15 protrudes from the carrier molding hole 11 (molded carrier 13) is shown in order from the left.

Here, the state of the release tape 12 when the optical lens 15 protrudes from the carrier molding hole 11 (molded carrier 13) will be described.
For example, as shown on the right side of FIG. 4, the release tape 12 can be left on the cradle 17 side.
In this case, at the same time as the protrusion by the punch 18b, the mold seat 15b side of the optical lens 15 is detached from the release tape 12, whereby the release tape 12 and the optical lens 15 are separated.
Further, for example, by cutting the release tape 12 with the punch 18b, the optical lens 15 can be protruded with the release tape 12 attached.
In this case, the release tape 12 covering the projecting optical lens 15 on the molding seat 15b side is removed from the optical lens 15.
In addition, the structure which protrudes the optical lens 15 from the shape | molded carrier 13 in the state which removed the release tape 12 from the shape | molded carrier 13 is employable.

(About the molding method of the optical molded product in Example 1)
That is, as shown in FIG. 1, first, a release film 8 is adsorbed and coated in a lower mold cavity (large cavity 4) including a plurality of required small cavities 5, and the lower mold cavity is coated with the release film 8. The resin material 9 is supplied into 4 and 5 and melted by heating.
Next, in a state where the release tape 12 is placed on the upper surface of the carrier 10 before molding, the carrier 10 is supplied and set to a required position of the lower mold 3 to clamp the upper and lower molds 1 (2, 3).
At this time, the small cavity 5 (more specifically, including a part of the large cavity 4), the molding hole 11 and the seat molding recess 7 are arranged in a line in the vertical direction, and the small cavity 5 (large (Including the cavity 4) and the molding hole 11 are configured to communicate with each other, and a compression molding space is formed from the small cavity 5 and the molding hole 11.
Next, the cavity bottom member 6 is moved upward to inject and fill the resin material 9 heated and melted in the lower mold cavities 4 and 5 into the molding holes 11 separately.
At this time, the mold release tape 12 is brought to the required resin pressure by injecting and filling the molten resin 9 while pressing the release tape 12 with the required resin pressure into the seat molding recess 7 through the molding hole 11. The seat can be coated along the shape of the seat forming recess 7.
Therefore, the molding seat 15b corresponding to the shape of the seat molding recess 7 is molded in the seat molding recess 7 by injecting, filling and curing the molten resin 9 in the seat molding recess 7 coated with the release tape 12. can do.
At this time, the collectively cured resin 14 including the required plurality of optical lenses 15 (optical lens portions) is molded in the large cavity 4 having the required plurality of small cavities 5, the molding hole 11, and the seat molding recess 7. In addition, the molded carrier 13 having the batch cured resin 14 (required optical lens portions 15) can be obtained.
That is, the molded carrier 13 can be compression-molded by the compression-molding mold 1 (2, 3).
For this reason, after the time required for curing has elapsed, by opening the upper and lower molds 1 (2, 3), the molded carrier 13 with the release tape 12 attached to the upper surface of the carrier can be obtained. .

Next, as shown in FIG. 3, the molded carrier 13 with the release tape 12 attached (or with the release tape 12 removed) is supplied and set to the cradle 17 in the protruding device 16.
At this time, the optical lens portion 15 (of the batch cured resin 14) formed in the molding hole 11 of the molded carrier 13 is matched with the position of the protruding hole 17a.
Next, the molded carrier 13 is fixed to the cradle 17 by pressing a required portion of the molded carrier 13 with the pressing member 18 a.
Therefore, next, in this state, the optical lens 15 is protruded and separated from the molding hole 11 of the molded carrier 13 by moving the punch 18b downward and pressing the molding seat 15b side of the optical lens 15. can do.
At this time, the release tape 12 may adhere to the optical lens 15 or the release tape 12 may not adhere to the optical lens 15 (see FIG. 4).
When the release tape 12 is attached to the molding seat 15b side of the optical lens 15, the optical lens 15 can be obtained by removing the release tape 12.

That is, according to the first embodiment, the optical lens 15 is compression-molded by supplying the resin material (molding material) 9 into the compression-molding mold cavities (large and small cavities) 4 and 5 of the compression-molding mold. Therefore, unnecessary cured resin is not generated as a product that is cured in a resin passage such as a gate and a runner as in the injection molding shown in the conventional example.
Therefore, according to the present invention, the amount of cured resin that is unnecessary for the product (optical lens 15) can be efficiently reduced, so that the yield of the product can be improved efficiently, and the lower mold cavities 4, 5 The resin material 9 supplied inside can be efficiently commercialized.
Therefore, according to Example 1, the productization rate of the resin material 9 can be improved efficiently, and the productivity of the product (optical lens 15) can be improved efficiently.
A light emitting product can be formed by mounting the optical lens 15 on the light emitting portion.

(Attaching the optical lens to the light emitting part in Example 1)
An example of a method for forming a light emitting product (for example, an LED product) by mounting the optical lens 15 molded in FIGS. 1 to 4 on a light emitting portion will be described with reference to FIGS.

That is, first, as shown in FIG. 5A, a liquid resin material 105 having transparency from a dispenser 104 in a reflective recess 102 in a light emitting base 103 in which a light emitting element 101 such as an LED is mounted in the reflective recess 102. By dripping and filling (for example, silicone resin), the light emitting portion 106 as shown in FIG. 5B is formed.
Next, as shown in FIG. 5 (2), the optical lens 15 is mounted on the (uncured) reflective concave portion 102 (light emitting portion 106) filled with the liquid resin material 105 on the molding seat portion 15b side.
Next, as shown in FIG. 5 (3), the reflective concave portion 102 on which the optical lens 15 is mounted is heated to cure the liquid resin material 105 in the reflective concave portion 102, whereby the optical lens 15 (molded seat portion 15b). ) Can be fixedly mounted to form the luminescent product 107.

That is, in Example 1, first, the optical lens 15 is compression-molded using the compression-molding mold 1 (2, 3) and the carrier 10, and then the optical lens 15 is mounted on the light emitting unit 106. A luminescent product can be formed.
For this reason, according to Example 1, the light emission product which attached the optical lens 15 to the light emission part 106 can be formed efficiently.

Next, Example 2 according to the present invention will be described in detail with reference to Example drawings. FIGS. 6 and 7 illustrate a molded carrier having an optical molded product (cap-shaped optical lens) according to Example 2. FIG. It is a mold for compression molding of an optical molded product to be molded.
FIG. 8 shows a cutting device for a molded carrier (optical molded product).
FIGS. 9A and 9B are processes for forming an LED molded product by mounting an optical molded product (optical lens) on the light emitting portion.
In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals.
In the second embodiment, the description of the same components as those in the first embodiment is omitted.

(About the structure of the compression molding die of the optical molded product in Example 2)
That is, as shown in FIGS. 6 and 7, the compression molding die 21 of the optical molded product used in Example 2 is opposed to the fixed upper die 22 and the upper die 22 in the same manner as in Example 1. The movable lower mold 23 is positioned.
Further, in the mold 21 (22, 23) shown in the second embodiment, similarly to the first embodiment, the lower mold cavity (large cavity 4) for compression molding and the bottom surface of the large cavity 4 (collective cavity) are provided. The required plurality of small cavities 5 (individual cavities) and a cavity bottom member 6 having the required plurality of small cavities 5 on the front end surface are provided.
In addition, the mold surface of the upper mold 22 is configured such that protrusions (convex parts) 24 are provided corresponding to the positions of the small cavities 5 in the lower mold 23.
That is, as shown in FIG. 7, when the mold 21 (both upper and lower molds 22, 23) is clamped, the projecting portion 24 penetrates without being in contact with the molding hole 11 of the carrier 10 to be described later (free play). And a required space (distance) is formed between the inner surface of the molding hole 11 and the outer surface of the protruding portion 24, and a required space is formed in the molding hole 11. become.
At this time, the tip end side of the projecting portion 24 is arranged in the small cavity 5 so as not to contact the inner surface of the small cavity 5.
That is, a required interval (distance) is maintained between the inner surface of the small cavity 5 and the outer surface (surface) of the tip of the protruding portion 24, and a required space is formed in the small cavity 5.
Therefore, generally, when the mold 21 (both upper and lower molds 22, 23) is clamped, the protruding portion 24 can be loosely fitted into the small cavity 5 and the molding hole 11 (without contact). A space for compression molding is formed in the cavity 5 and the molding hole 11 except for the portion of the protrusion 24.
As will be described later, the hollow portion 27 a having the opening 27 b in the cap-shaped optical lens 27 corresponds to the protruding portion 24.

As shown in FIG. 6, for example, a release film 25 is provided which is adsorbed and covered on the mold surface of the lower mold 23 and the lower mold cavities 4 and 5. An accommodation recess 25a for accommodating the resin material 9 is provided in the center portion.
That is, in a state where the resin material 9 is supplied to the housing recess 25a, the housing recess 25a is fitted and set in the lower mold cavities (large and small cavities) 4 and 5, and the release film 25 is moved to the lower mold cavities 4 and 5 It is comprised so that adsorption | suction coating can be performed along the shape of the type | mold surface of the type | mold 23. FIG.
Accordingly, the resin material (molten resin) 9 heated and melted in the lower mold cavities 4 and 5 can be pressed by the cavity bottom member 6 with the required pressing force through the release film 25 (25a). It is configured to be able to.

(About carrier and release tape)
In Example 2, as in Example 1, the pre-molding carrier 10 and the release tape 12 are used.
The carrier 10 has a plurality of required molding holes (through holes) 11 formed corresponding to the positions of the plurality of small cavities 5 and a plurality of required molding holes formed on the upper surface of the carrier 10. 11 is provided with a tape fastening portion 26 for fastening the release tape 12 covering the 11 openings.
That is, the release tape 12 can be coated on the upper surface of the carrier 10 with a required tensile force.
Accordingly, when the carrier 10 having the release tape 12 fixedly coated is supplied and set at a required position of the lower mold 23 and the mold 21 (both upper and lower molds 22 and 23) is clamped, the protrusion 24 of the upper mold 22 By pressing the release tape 12 downward at the tip, the surface of the projection 24 can be covered with the tensioned release tape 12 (along the surface of the projection 24). Yes.
At this time, as described above, the protruding portion 24 covering the release tape 12 is configured to be arranged in a state of being held at a predetermined interval with respect to the inside of the forming hole 11 and the inside of the small cavity 5. A space for compression molding excluding the projecting portion 24 can be formed in the hole 11 and in the small cavity 5.

That is, the resin material 9 heated and melted in the large cavity 4 including the small cavity 5 when the mold 21 (both upper and lower molds 22, 23) is clamped in the carrier molding hole 11 and the small cavity 5. The space portion excluding the protruding portion 24 is filled.
At this time, in the second embodiment, as in the first embodiment, the resin amount in the space portion excluding the projecting portion 24 in the carrier molding hole 11 and in the small cavity 5 is changed by the communication path 4 a that becomes a part of the large cavity 4. It is configured so that it can be adjusted.
Further, in the second embodiment, a plurality of required “optical lenses 27 cured in the molding hole 11 in which the projecting portions 24 are arranged and the small cavities 4”, and a thin film-shaped cured resin cured in the communication path 4 a. The batch cured resin 28 is formed with 28a.
The optical lens 27 has a hollow portion 27 a corresponding to the protruding portion 24.
Further, a molded carrier 29 is formed by the batch cured resin 28 and the carrier 10, and the inner surface of the hollow portion 27 a of the optical lens 27 is formed so as to be covered with the release tape 12, and on the proximal end side of the optical lens 27. An opening 27b of the hollow portion 27a is provided and configured.

(About the structure of the protrusion device of the optical molded product in Example 2)
That is, in the optical molded product protruding device 30 according to the second embodiment, as in the first embodiment, a cradle for mounting the molded carrier 29 (with the release tape 12 fixed to the molded carrier 29). (Die) 17 and a projecting mechanism 18 for projecting an optical molded product (optical lens) disposed in the molding hole 11 in the molded carrier 29 in a state where a required portion of the molded carrier 29 is pressed. ing.
Similarly to the first embodiment, the receiving base 17 is configured with a required number of protruding holes 17a, and the protruding mechanism 18 is configured with a punch 18b.
Therefore, by pressing the optical lens 27 disposed in the molding hole 11 in the molded carrier 29 with the punch 18b, the optical lens 27 protrudes from the carrier molding hole 11 and is discharged from the protruding hole 17a of the receiving base 17. It is configured to be able to.
At this time, the thin film-like resin 28a hardened in the communication path 4a remains attached to the lower surface of the molded carrier 29 (excluding the opening of the molding hole 11).
In the example shown in FIG. 8, on the left side, the optical lens 27 in a state in which the release tape 12 is attached to the hollow portion 27a is projected (punched) integrally with the release tape 12, and 8 shows a state in which the optical lens 27 from which the release tape 12 has been removed is projected at the center in the example shown in FIG.

(About the molding method of the optical molded product in Example 2)
As shown in FIG. 6, first, the resin material 9 is supplied and set in the receiving recess 25a of the release film 25. In this state, the receiving recess 25a supplied and set with the resin material 9 is placed in the lower mold cavity (large cavity 4). Set to fit.
At this time, the release film 25 including the accommodating recess 25 a is adsorbed and coated along the shape of the lower mold cavity (large cavity 4) including the small cavity 5, and the lower mold cavities 4, 5 covering the release film 25. Inside, the resin material is heated and melted.
Next, the release tape 12 is fastened to the upper surface of the carrier 10 by the fastening portion 26, and in this state, the carrier 10 to which the release tape 12 is fastened is supplied and set at a required position of the lower die 23.
Next, as shown in FIG. 7, the upper and lower molds 21 (22, 23) are clamped.
At this time, it is possible to cover the release tape 12 in a state where the release tape 12 is extended in the direction of the lower mold 23 by the protruding portion 24.
At this time, the protrusion 24 covering the release tape 12 provided on the upper die 22 is formed in the molding hole 11 of the carrier 10 and in the small cavity 5 (specifically, including a part of the large cavity 4). It will enter in the state which does not contact in order, and will loose-fit, and the space part for compression molding will be formed in the molding hole 11 containing the small cavity 5. FIG.
Therefore, the resin 9 in the lower mold cavities 4 and 5 is then pressed by the cavity bottom member 6 through the release film 8.
That is, the molded carrier 29 can be molded by the compression molding die 21 (22, 23).
For this reason, the mold | type carrier 29 in the state to which the release tape 12 adhered can be obtained by opening the metal mold | die 21 (upper and lower mold | types 22 and 23) after progress for the time required for hardening.
In the second embodiment, as in the first embodiment, the thin resin 28a cured in the communication path 4a adheres to the lower surface of the carrier 10 (29). The resin 28a and the optical lens 27 are separated.

Next, as shown in FIG. 8, the molded carrier 29 with the release tape 12 attached (or with the release tape 12 removed) is supplied and set to the cradle 17 in the protruding device 30.
At this time, the optical lens 27 disposed in the molding hole 11 is matched with the position of the protruding hole 17a.
Next, a required portion of the molded carrier 29 is pressed to fix the molded carrier 29 to the cradle 17.
Accordingly, next, in this state, the optical lens 27 can be separated from the molded hole 11 of the molded carrier 29 by pushing the optical lens 27 with the punch 18b.
In the example shown in FIG. 8, the case where the release tape 12 protrudes to the left side toward the optical lens 27 is illustrated, and the release tape 12 is removed from the optical lens 27 in the center of the example. The case where it protrudes is illustrated.

That is, according to the second embodiment, the resin material (molding material) 9 is supplied into the resin molding cavities (both large and small cavities) 4 and 5 of the compression molding die 21, and the (cap-shaped) optical lens 29 is formed. Since a configuration for compression molding is employed, unnecessary cured resin is not generated as a product that is cured in a resin passage such as a gate and a runner as in the injection molding shown in the conventional example.
For this reason, according to the present invention, the amount of cured resin unnecessary for the product (optical lens 29) can be reduced efficiently, so that the yield of the product can be improved efficiently, and the lower mold cavities 4, 5 The resin material 9 supplied inside can be efficiently commercialized.
Therefore, according to Example 1, the productization rate of the resin material 9 can be improved efficiently, and the productivity of the product (optical lens 29) can be improved efficiently.
A light-emitting product can be formed by mounting (covering) the optical lens 29 having the cap-shaped hollow portion 27a (on the opening 27b side) on the light-emitting portion.

(Attaching the optical lens to the light emitting part in Example 2)
Next, an example of a method of forming a light emitting product (for example, an LED product) by mounting the optical lens 27 molded in FIGS. 6 to 8 on the light emitting portion will be described with reference to FIGS. To do.

That is, in Example 2, as shown in FIG. 9A, the light emitting unit 111 includes a light emitting element 112 such as an LED, and a light emitting base 114 having a reflective recess 113 in which the light emitting element 112 such as an LED is mounted. The transparent recess 115 is filled with a transparent resin 115 (for example, silicone resin) and a light emitting lens 116 (convex) provided in the reflective recess 113 of the light emitting base 114.
Accordingly, as shown in FIG. 9 (2), the cap-shaped optical lens (optical molded product) 27 is placed on the light emitting lens 116 (convex portion) of the light emitting portion 111, and the hollow portion (concave portion) 27a side of the opening 24b. The light-emitting product 117 can be formed by covering.

That is, in Example 2, first, the optical lens 27 is compression-molded using the compression-molding dies 21 (22, 23) and the carrier 10, and then the cap-shaped optical lens 27 is formed on the light emitting unit 111. The light emitting product 117 can be formed by mounting.
For this reason, according to Example 2, the light emitting product 117 in which the optical lens 27 is mounted on the light emitting unit 111 can be efficiently formed.

Next, Example 3 according to the present invention will be described in detail with reference to Example drawings. FIGS. 10 and 11 show a molded article having an optical molded product (an optical lens having a two-layer structure) according to Example 3. FIG. A mold for compression molding of an optical molded product for molding a carrier.
FIG. 12 shows a cutting device for a molded carrier (optical molded product).
13 (1), 13 (2), and 13 (3) are steps of forming an LED molded product by mounting an optical molded product (an optical lens having a two-layer structure) on the light emitting portion.
In Example 3, the same constituent members as those in Example 1 (Example 2) are denoted by the same reference numerals.
In Example 3, the description of the same components as those in Example 1 (Example 2) is omitted.

That is, in the third embodiment, basically, the optical lens (optical lens portion) 15 of the (first) molded carrier 13 compression-molded in the first embodiment is further compressed by the second small cavity 45. It is the structure to do.
In Example 3, the “optical lens 55 (second molded carrier 53) having a two-layer structure” is formed by two-stage compression molding.
As will be described later, in Example 3, the basic structure of the “optical lens 55 having a two-layer structure” formed in two steps is the carrier 10, the first compression mold 1 and the second compression molding. The second optical lens portion 55a is laminated on the first optical lens portion 15 by the metal mold 41 and the second projecting device 56.

(About the structure of the molded carrier used in Example 3)
That is, the first molded carrier (molded carrier 13) molded by the first compression molding in Example 3 is compressed by the compression molding die 1 (upper and lower molds 2, 3) shown in Example 1. In the third embodiment, the description of the configuration for compression-molding the first molded carrier 13 is omitted.
Further, “first” is given to the configuration related to the first embodiment, and “second” is given to the configuration related to the second compression molding in the third embodiment.
As shown in FIG. 10, the first molded carrier 13 (as in Example 1) is provided with a carrier 10 before molding and a first batch-cured resin 14, and the first batch. The cured resin 14 is provided with a thin film-shaped cured resin 14a cured in the communication path 4a and a first optical lens 15. The first optical lens 15 includes a first small cavity 5 (first large cavity 5). A first lens body 15a formed by a part of the cavity 4) and the first molding hole 11, and a molded seat portion 15b molded in the first seat molding recess 7; A release tape 12 is attached to the upper surface of the molded carrier 13.

(About the structure of the compression molding die of the optical molded product in Example 3)
That is, as shown in FIGS. 10 and 11, the compression molding die 41 of the second optical molded product used in Example 3 (second compression molding) includes a second fixed upper die 42, A second movable lower mold 43 is provided opposite to the second upper mold 42.
In addition, a second large cavity 44 (collective cavity) is provided on the mold surface of the second lower mold 43, and a plurality of second small cavities 44 are formed on the bottom surface of the second large cavity 44. Cavities 45 (individual cavities) are provided corresponding to the positions of the first optical lens 15 (first optical lens portion 15) of the first molded carrier 13, respectively.
Accordingly, the required number of second small cavities 45 (in the illustrated example, concave portions having various shapes) and the second large cavity 4 (in the illustrated example, flat plate-shaped concave portions) include the second lower mold cavity 44, 45 is configured.

The bottom surface of the second large cavity 44 is provided with a second cavity bottom surface member 46 having a plurality of required second small cavities 45 (second large cavity bottom surfaces) on the tip surface. At the same time, the resin material 47 heated and melted in the second lower mold cavities 44 and 45 coated with the second release film 48 can be pressed by the cavity bottom member 46 with a required pressing force. It is configured as follows.
Further, on the mold surface of the second upper mold 42, an optical molded product (an optical element having a two-layer structure), which will be described later, corresponding to the position of the second small cavity 45 provided in the second cavity bottom surface member 46. A molded seat portion 15b for projecting a first optical molded product (molded) that projects a lens, that is, an optical lens 55 obtained by compression molding the first optical lens 15 with the second compression molding die 41, is formed. The required number of second seat molding recesses 47 (insertion recesses) to be fitted are provided.
The first molded seat 15b (first molded carrier 13) is configured by covering with the first release tape 12.
In addition, the second thin film-shaped cured resin 54a is formed in the communication path 44a of the second mold 41.

That is, as shown in FIG. 10, first, a required amount of resin material 49 is supplied into the second small cavity 45 (in the second large cavity 44) coated with the second release film 48, and heated and melted. At the same time, the first molded carrier 13 is supplied and set in a state where the first optical lens portion 15 is aligned with the position of the second small cavity 45, and the second upper and lower molds 41 (42, 43) are set. ) Is clamped, and the molten resin 49 in the second small cavity 45 can be pressed with a required pressing force by the cavity bottom surface member 46 through the second release film 48.
Next, as shown in FIG. 11, in the second small cavity 45 on the optical lens portion 15 in the first molded carrier 13 (more specifically, the communication path 44a in the second large cavity 44 is excluded). The second optical lens portion 55b hardened in step 2) can be compression molded.

That is, the first optical lens unit 15, the first thin film-shaped cured resin 14a (specifically, a part 14a of the first thin film-shaped cured resin), and the second optical lens unit 55a, The optical lens 55 having a two-layer structure can be molded.
Therefore, the carrier 10 is compression-molded twice with the first compression-molding die 1 and the second compression-molding die 41, whereby the second molding having the optical lens 55 having a two-layer structure. The finished carrier 53 can be molded.
The second molded carrier 53 includes a first molded carrier 13 and a second batch cured resin 54 (second thin film cured resin 54a and second optical lens portion 55a). Yes.
More specifically, the second optical lens portion 55a adheres to the carrier 10 and the portion molded in the first small cavity 5 of the first optical lens portion 15 in the second small cavity 45. The first thin film-like cured resin 14a is molded on the part 14a.

(About the structure of the protrusion device of the optical molded product in Example 3)
That is, the second molded carrier 53 (with the release tape 12 attached to the second molded carrier 53) is applied to the optical molded product protruding device 56 in the third embodiment, as in the first embodiment. An optical molded product (2) arranged in the molding hole 11 in the second molded carrier 53 in a state in which the required place of the second receiving base (die) 57 to be placed and the second molded carrier 53 is pressed. A projecting mechanism 58 for projecting an optical lens 55) having a layer structure is provided.
Similarly to the first embodiment, the pedestal 57 is configured with a required number of projecting holes 57a, and the projecting mechanism 58 is configured with a punch 58b.
Accordingly, the optical lens 55 (product) having a two-layer structure is protruded separately from the carrier molding hole 11 by pressing the optical lens 55 disposed in the molding hole 11 in the second molded carrier 53 with the punch 58b. Thus, it can be discharged from the protruding hole 57a of the cradle 57.

In the example shown in FIG. 12, a case where the optical lens 55 having a two-layer structure is protruded (punched) to the left side through the release tape 12 is shown.
In this case, the release film 12 is not normally attached to the optical lens 55, but the release tape 12 is cut depending on the size and shape of the punch 58 b, and a part of the cut release tape 12 is part of the optical lens 55. It may protrude in the state which adhered to the molding seat part 15b side.
Further, in the example shown in FIG. 12, a case where the optical lens 55 having a two-layer structure is protruded (punched out) on the right side with the release tape 12 removed is shown.
Further, in the example shown in FIG. 12, the case where the optical lens 55 from which the release tape 12 is removed (and the molded seat portion 15b for protrusion) is not protruded is shown at the center.

(About molding method of optical molded product in Example 3)
First, in Example 3, as shown in Example 1, the carrier 10 is compression molded using the first compression mold 1 (both upper and lower molds 2, 3) to form a first molded carrier 13. Form.
At this time, as in Example 1, the upper surface of the first molded carrier 13 is provided with the release tape 12 attached thereto.
In addition, the first molded carrier 13 includes the first small cavity 5 (in detail, including a part of the first large cavity 4), the carrier molded hole 11 and the first seat. A first optical lens portion 15 (lens body 15a and molding seat portion 15b) molded in the molding recess 7 and a thin film-like resin 14a cured in the communication path 4a are formed.
Next, by using the second compression molding die 21 (upper and lower molds 22, 23) shown in the third embodiment, the first molded carrier 13 is compression-molded to form a second molded carrier 53. Can be formed.

That is, as shown in FIG. 10, next, the second release film 48 is adsorbed and coated in the lower mold cavities 44 and 45 of the lower mold 43 of the second compression mold 21 and the second mold A required amount of the resin material 49 is supplied into the lower mold cavities 44 and 45 covered with the release film 48 and melted by heating.
Next, as shown in FIG. 11, the first molded carrier 13 is supplied and set at a required position of the lower mold 43, and the upper and lower molds 22, 23) are clamped.
At this time, the molding seat 7 formed on the upper surface side of the first molded carrier 13 is covered with the release tape 12, and is fitted into the seat molding recess 47 provided in the second upper mold 42. can do.
Next, the resin 49 in the lower mold cavities 44 and 45 is pressed by the second cavity bottom surface member 46 with a required pressing force.
At this time, the second optical lens portion 55a can be compression-molded in the second small cavity 45 including the second large cavity 44, and the second communication path 44a (second large cavity 44). Thus, the second cured thin film resin 54a is formed.
Further, the second collective cured resin 54 can be constituted by the thin cured resin 54 a and the second optical lens portion 55 a cured in the second small cavity 45.
In other words, the second optical lens 55 having a two-layer structure can be molded in a state where the second optical lens portion 55a is covered with the first optical lens portion 15.
Therefore, the second molded carrier 53 having the second optical lens 55 having a two-layer structure can be obtained by opening the second mold 21 (both upper and lower molds 22, 23).

Next, as shown in FIG. 12, a second molded carrier 53 having a second optical lens 55 having a two-layer structure at a required position in the second projecting device 56 is supplied and set.
At this time, the second optical lens 55 having a two-layer structure formed on the second molded carrier 53 is supplied and set in the protruding hole 57 a of the receiving base 57.
Next, the punch 58b of the projecting mechanism 58 is moved downward to press the molding seat 15b to which the release tape 12 is adhered, whereby the second optical lens 55 having the two-layer structure (the first optical lens). The part 15) is protruded (punched out) from the second molded carrier 53 (in the molding hole 11 thereof) and separated.

When the release tape 12 is attached to the second optical lens 55 having a two-layer structure, the release tape 12 is removed.
For example, as shown in the center part of FIG. 12, when the second optical lens 55 having a two-layer structure in which the molding seat 15b is not formed is protruded, the punch 58b inserted through the molding hole 11 is used. Can be ejected using.

In other words, the second optical lens 55 (optically molded product) having the two-layer structure according to the third embodiment uses the carrier 10 to perform the first optical compression by the first-stage compression molding from the inside on the proximal end side. The lens portion 15 is formed, and then the second optical lens portion 55a is formed outside the first optical lens portion 15 by second-stage compression molding. In this state, the carrier 10 ( The second optical lens 55 protrudes from the molding hole 11) and is separated.
In addition, although Example 3 is a structure which forms the 2nd optical lens 55 (optical molded product) provided with the two-layer structure by the compression molding of two steps, in this invention, it is a multilayer structure by multistage compression molding. The structure which forms the optical lens provided with can be employ | adopted.

That is, according to the third embodiment, the optical lens 55 having a two-layer structure is formed (in two steps) using the carrier 10, the first compression mold 1 and the second compression mold 41. Since a configuration for compression molding is employed, unnecessary cured resin is not generated as a product that is cured in a resin passage such as a gate and a runner as in the injection molding shown in the conventional example.
Therefore, according to the present invention, the amount of cured resin that is unnecessary for the product (optical lens 55 having a two-layer structure) can be efficiently reduced, so that the yield of the product can be improved efficiently and the resin The materials 9 and 49 can be efficiently commercialized.
Therefore, according to Example 3, the product rate of the resin materials 9 and 49 can be improved efficiently, and the productivity of the product (optical lens 55 having a two-layer structure) can be improved efficiently.
A light emitting product can be formed by mounting the optical lens 55 having this two-layer structure on the light emitting portion.

(Attaching the optical lens to the light emitting part in Example 3)
An example of a method for forming a light emitting product (for example, an LED product) by attaching the optical lens 55 having the two-layer structure molded in FIGS. 10 to 12 to the light emitting portion using FIGS. 13 (1) to (3). Will be described.

That is, first, as shown in FIG. 13 (1), a liquid resin material 125 having transparency from a dispenser 124 in a reflection recess 122 in a light emitting base 123 in which a light emitting element 121 such as an LED is mounted in the reflection recess 122. A light emitting portion 126 as shown in FIG. 13B is formed by dropping (for example, silicone resin) and covering the light emitting element 121 with a small amount of the resin material 125.
Next, as shown in FIG. 13B, the optical lens 55 having a two-layer structure is attached to the reflective concave portion 122 (light emitting portion 126).
At this time, a portion hardened in the molding hole 11 of the first optical lens unit 15 on the side of the molding seat 15 b can be fitted into the reflection concave portion 122 of the light emitting unit 126.
Therefore, next, as shown in FIG. 13 (3), the reflective concave portion 122 in which the optical lens 55 is mounted is heated to cure the liquid resin material 125 in the reflective concave portion 122. The light emitting product 107 can be formed by fixing and mounting the part 15b).

That is, in Example 3, the compression molding dies 1 and 41 and the carrier 10 are used to perform compression molding in two steps to form the optical lens 55, and then the optical lens 55 is placed on the light emitting portion 126 ( The light emitting product can be formed by mounting.
For this reason, according to the third embodiment, a light-emitting product in which the optical lens 55 is mounted on the light-emitting portion 126 can be efficiently formed.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

Further, the resin materials 9 and 49 used in the above-described embodiments are transparent resin materials, and silicone resin, epoxy resin, and the like are used.
In addition, the resin materials 9 and 49 used in each of the embodiments described above are in the form of granules, powders, liquids, sheets, and the like.

  In each of the above-described embodiments, a phosphorescent substance, a colored substance, or the like can be mixed into the optical lenses 15, 27, 55, and 55a (in the resin materials 9 and 49).

  Further, in each of the above-described embodiments, a configuration in which one large cavity and a plurality of required small cavities are provided is exemplified, but a configuration having only a plurality of required small cavities (individual cavities) can be employed.

FIG. 1 is a schematic longitudinal sectional view schematically showing a compression molding mold of an optical molded article for explaining the compression molding method of the optical molded article according to the present invention, and shows the mold open state of the mold described above. (Example 1). FIG. 2 is a schematic longitudinal sectional view schematically showing a compression molding die of an optical molded product corresponding to the die shown in FIG. 1, and shows a mold clamping state of the above-described die (Example). 1). FIG. 3 is a schematic longitudinal sectional view schematically showing a protruding device of an optical molded product for explaining the compression molding method of the optical molded product according to the present invention, and the optical molded product (molded carrier) is placed in the above-mentioned apparatus. A state where the supply is set is shown (Example 1). FIG. 4 is a schematic longitudinal sectional view schematically showing a protruding device for an optical molded product corresponding to the device shown in FIG. 3, and shows a state in which the optical molded product is protruded from the above-described device (Example 1). ). 5 (1), FIG. 5 (2), and FIG. 5 (3) are steps for forming a light emitting product by mounting an optical molded product molded by the optical molding product compression molding method according to the present invention on a light emitting portion. (Example 1) which is a figure. FIG. 6 is a schematic longitudinal sectional view schematically showing a mold for compression molding of an optical molded product for explaining another method for compression molding of an optical molded product according to the present invention, wherein the mold is opened. (Example 2). FIG. 7 is a schematic longitudinal sectional view schematically showing a compression molding die of an optical molded product corresponding to the die shown in FIG. 6, and shows a mold clamping state of the above-described die (Example). 2). FIG. 8: is a schematic longitudinal cross-sectional view which shows schematically the protrusion apparatus of the optical molded product explaining the compression molding method of the optical molded product which concerns on other this invention (Example 2). FIGS. 9 (1) and 9 (2) are process diagrams for forming a light emitting product by mounting an optical molded product molded by another optical molded product compression molding method according to the present invention on a light emitting part ( Example 2). FIG. 10 is a schematic longitudinal sectional view schematically showing a compression molding die of an optical molded product for explaining another method of compression molding of an optical molded product according to the present invention, wherein the mold is opened. (Example 3). FIG. 11 is a schematic longitudinal sectional view schematically showing a compression molding die of an optical molded product corresponding to the die shown in FIG. 10, and shows a mold clamping state of the above-described die (Example). 3). FIG. 12: is a schematic longitudinal cross-sectional view which shows schematically the protrusion apparatus of the optical molded product explaining the compression molding method of the optical molded product which concerns on other this invention (Example 3). 13 (1), FIG. 13 (2), and FIG. 13 (3) form a light emitting product by attaching an optical molded product molded by another optical molded product compression molding method according to the present invention to a light emitting portion. (Example 3) which is a process figure to perform.

Explanation of symbols

1 (First) Optical Molding Mold 2 (First) Fixed Upper Mold 3 (First) Movable Lower Mold 4 (First) Large Cavity (Batch Cavity)
4a (first) communication path 5 (first) small cavity (individual cavity)
6 (first) cavity bottom member 7 (first) seat molding recess 8 (first) release film 9 resin material (molten resin)
10 (first) carrier before molding 11 (first) molding hole (through hole)
12 Release Tape 13 (First) Molded Carrier 14 (First) Batch Cured Resin 14a Thin Film Cured Resin (Part of First Thin Film Cured Resin)
15 (First) optical lens (optical molded product)
15a (first) optical lens body 15b (first) molding seat 16 projecting device 17 cradle (die)
17a Projection hole 18 Projection mechanism 18a Press member 18b Punch 21 Mold for compression molding of optical molded product 22 Fixed upper mold 23 Movable lower mold 24 Projection (convex)
25 Release film 25a Accommodating recess 26 Tape fixing part 27 Optical lens 27a Hollow part 27b Opening part 28 Collective cured resin 28a Thin cured resin 29 Molded carrier 30 Protruding device 41 Gold for compression molding of second optical molded product Die 42 Second fixed upper mold 43 Second movable lower mold 44 Second large cavity 45 Second small cavity 46 Second cavity bottom surface member 47 Second seat molding recess (fitting recess)
48 Second release film 49 Resin material 53 Second molded carrier 54 Second batch cured resin 54a Second thin film cured resin 55 Second optical lens (second optical lens having a two-layer structure) )
55a Second optical lens unit 56 Projection device (second projection device)
57 Receptacle 57a Protruding hole 58 Protruding mechanism 58b Punch 101 Light emitting element 102 Reflecting recess 103 Light emitting base 104 Dispenser 105 Liquid resin material (resin)
106 Light-Emitting Part 107 Light-Emitting Product 111 Light-Emitting Part 112 Light-Emitting Element 113 Reflective Concave 114 Light-Emitting Base 115 Resin 116 Light-Emitting Lens 117 Light-Emitting Product 121 Light-Emitting Element 122 Reflective Concave 123 Light-Emitting Base 124 Dispenser 125 Liquid Resin Material (Resin)
126 Light Emitting Unit

Claims (5)

First, a molded carrier having a plurality of required optical molded products is formed by compression molding the optical molded product in a space formed by individual cavities in the mold cavity for compression molding and molding holes provided in the carrier. And
Next, a method for forming an optical molded product is characterized in that each of the required plurality of optical molded products is individually ejected from the molded carrier and individual optical molded products are obtained.   An optical molded product having a required plurality of multilayer structures is formed by compressing and laminating a plurality of required optical molded products in a molded carrier individually in individual cavities in a compression mold cavity. 2. The method for molding an optical molded product according to claim 1, wherein the molded carrier is provided. A compression molding cavity provided in the lower mold , a plurality of required individual cavities provided on the bottom surface of the compression molding cavity, and a plurality of the required plurality A step of preparing a mold for compression molding of an optical molded product provided with a cavity bottom surface member having an individual cavity as a front end surface, and a release film covering the inside of the lower mold cavity for compression molding described above;
Preparing a carrier having a molding hole corresponding to each of the required plurality of individual cavities, and a release tape placed on the upper surface of the carrier;
Supplying a resin material into a cavity for compression molding having an individual cavity coated with the above-described release film, and heating and melting;
Supplying and setting the carrier on which the release tape is placed at the required position of the lower mold in a state where the position of the molding hole matches the position of the individual cavity,
Clamping the upper and lower molds as described above;
With the upper and lower molds clamped, the molten resin in the lower mold cavity having the individual cavities described above is pressed by the cavity bottom member to inject and fill the molten resin into the carrier molding hole, as described above. A step of compression molding an optical molded product in a space formed by a carrier molding hole and an individual cavity to form a required carrier having a plurality of the optical molded products,
Opening the upper and lower molds as described above;
When the upper and lower molds are opened, the step of taking out the molded carrier as described above covering the release tape,
A step of separating the above-described optical molded product from the above-described molded carrier by ejecting a plurality of required optical molded products compression-molded on the above-described molded carrier with a punch from the release tape mounting side. A method for molding an optical molded product comprising the steps of: A step of molding a molding seat by injecting resin from the molding hole through a release tape into a seat molding recess provided in the upper mold surface corresponding to the carrier molding hole at the time of resin pressing by the cavity bottom member; ,
The optical molded product according to claim 1, further comprising a step of separating the optical molded product from the molded carrier by pressing and punching the molded seat portion when the optical molded product is ejected. Molding method. A step of loosely fitting the protrusions provided on the upper mold into the carrier molding hole and the small cavity when clamping the upper and lower molds;
The method for molding an optically molded product according to claim 1, further comprising a step of covering the release tape placed on the upper surface of the carrier with the protruding portion when the upper and lower molds are clamped. .

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