KR20200098738A - Resin-sealing device and resin-sealing method - Google Patents

Abstract

A resin sealing device and a resin sealing method capable of both suppressing the warpage of a substrate and forming both sides are provided. The resin sealing device of the present invention is a resin sealing device for sealing both sides of a substrate with resin, comprising a first molding module and a second molding module, wherein the first molding module is a molding module for compression molding, and the first After resin-sealing one surface of the substrate by compression molding by a molding module, the other surface of the substrate can be resin-sealed by the second molding module.

Description

A resin sealing device and a resin sealing method TECHNICAL FIELD [RESIN-SEALING DEVICE AND RESIN-SEALING METHOD}

The present invention relates to a resin sealing device and a resin sealing method.

In the manufacturing process of electronic components such as a ball grid array (BGA) package, in the resin sealing process, only one side of the substrate is resin-sealed. However, in the resin sealing process in the manufacturing process of BOC (Board On Chip) package for DRAM (Dynamic Random Access Memory) and WBGA (Window BGA, brand name) package, not only one side of the substrate but also some places on the other side are resin. Sealing is required (for example, Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2001-53094

In order to seal both sides of the substrate with resin, holes (holes for flowing resin from one side of the substrate to the other side, hereinafter referred to as'opening') are made in the substrate, and one side of the substrate is made by transfer molding. In addition to the resin sealing box, there is a resin sealing method in which the other surface is resin-sealed by flowing a resin from the opening toward the other surface.

On the other hand, in recent years, with the increase in density of portable devices, etc., a package in which chips are mounted on almost the entire surface of one and the other (both sides) of a substrate is required. In the manufacturing process of the package, it is necessary to resin-enclose almost the entire surface of each of both surfaces of the substrate.

However, in the manufacture of the package, when both sides of the substrate are simultaneously resin-sealed using the resin sealing method, one (upper die or lower die) cavity (upper die cavity or lower die cavity) is first filled with resin. There are cases. For example, when the cavity of the lower die (lower die cavity) is first filled with resin, a problem occurs in that the substrate is bent (deformed) in a convex shape. This is because, when both sides are simultaneously resin-sealed by transfer molding, the resin may be first filled in one cavity due to gravity, flow resistance, or the like. In this case, the resin flows from one side of the substrate to the other side of the substrate through the opening of the substrate. In that case, there is a fear that the substrate swells toward the other surface side due to flow resistance when the resin flows into the opening of the substrate. Then, the other cavity is filled with resin while the substrate is swollen. Resin pressure is applied to the substrate by filling one and the other cavities, but the resin pressure applied to one side and the other side of the substrate is the same (since one and the other cavity are connected by the opening of the substrate, the resin pressure is The same), and no force is generated to return the substrate from the swollen state to the flat state. For this reason, curing of the resin proceeds while the other surface side of the substrate is swollen, and the molding is completed in a state where the substrate is swollen (deformed). That is, if one surface and the other surface (both sides) of the substrate are simultaneously resin-sealed using the resin sealing method, there is a concern that the substrate may be deformed.

Accordingly, an object of the present invention is to provide a resin sealing device and a resin sealing method capable of both suppressing warpage of a substrate and forming both sides of a substrate.

In order to achieve the above object, the resin sealing device of the present invention,

As a resin sealing device for resin sealing both sides of a substrate,

A first shaping module,

Comprising a second shaping module,

The first molding module is a molding module for compression molding,

After resin-sealing one surface of the substrate by compression molding by the first molding module, the other surface of the substrate may be resin-sealed by the second molding module.

The resin sealing method of the present invention,

As a resin sealing method of resin sealing both sides of a substrate,

A first resin sealing step of resin-sealing one surface of the substrate by compression molding,

After the first resin sealing process, a second resin sealing process of resin sealing the other surface of the substrate may be included.

Advantageous Effects of Invention According to the present invention, it is possible to provide a resin sealing device and a resin sealing method capable of suppressing warpage of a substrate and forming both sides of a substrate.

FIG. 1A is a cross-sectional view showing a resin encapsulating apparatus according to Example 1 and a substrate resin-sealed by it, and FIG. 1B is a cross-sectional view showing a modified example of the substrate pin of FIG. 1A.
2 is a cross-sectional view illustrating an exemplary step in the resin sealing method of Example 1. FIG.
3 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
4 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
5 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
6 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
7 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
8 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 2.
9A to 9C are cross-sectional views illustrating a modified example of the resin sealing method of Example 1. FIG.
Fig. 10 is a cross-sectional view showing a first molding module of the resin sealing device of Example 2 and a substrate to be resin-sealed by it.
Fig. 11 is a cross-sectional view showing a second molding module of the resin sealing device of Example 2 and a substrate to be resin-sealed by it.
12 is a cross-sectional view illustrating an exemplary step in the resin sealing method of Example 2. FIG.
13 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
14 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
15 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
16 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
17 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
18 is a cross-sectional view illustrating another step in the same resin sealing method as in FIG. 12.
Fig. 19 is a cross-sectional view showing a die module for compression molding and a substrate inversion mechanism of the resin sealing device of Example 3, and a substrate to be resin-sealed by this.
20A to 20C are cross-sectional views illustrating an exemplary step in the resin sealing method of Example 3. FIG.
21A and 21B are cross-sectional views illustrating a substrate resin-sealed by the resin sealing device of the present invention.

Next, the present invention will be described in detail by way of example. However, the present invention is not limited by the following description.

In the present invention, "resin sealing" means that the resin is in a cured (solidified) state, but is not limited to this when collectively molding from both sides described later. That is, in the present invention, in the case of batch molding from both sides described later, the term'resin sealing' means at least a state in which the resin is filled in the die cavity when the die is fastened, and even if the resin is not cured (solidified) and is in a fluid state. It's okay.

The resin sealing device of the present invention, as described above, includes a first molding module and a second molding module, wherein the first molding module is a molding module for compression molding, and one surface of the substrate by the first molding module After resin-sealing by compression molding, the other surface of the substrate can be resin-sealed by the second molding module. In the resin sealing device of the present invention, one surface of the substrate is first resin-sealed by compression molding by a molding module for compression molding (first, a resin is filled in one cavity by compression molding). In the substrate used in the present invention, it is not necessary to provide an opening for flowing the resin from one side of the substrate to the other side. And, by not providing the opening, the resin does not flow from one side of the substrate to the other side of the substrate through the opening. For this reason, deformation (warpage) of the substrate due to flow resistance when the resin passes through the opening of the substrate does not occur. In addition, when the other surface is resin-sealed, by supporting one surface with a resin for compression molding, it is possible to suppress warping of the substrate even when a resin pressure is applied to the substrate from the other surface side. Accordingly, in the present invention, it is possible to suppress warpage of the substrate and double-sided molding of the substrate.

In the above-described conventional method, that is, a method of piercing an opening in a substrate and resin-sealing both surfaces of the substrate by transfer molding, there is a cost problem due to opening the opening in the substrate. In addition, when resin is flowed from the opening to the other surface to be resin-sealed, the flow distance until the resin-sealing of the entire surface of the other surface is increased, there is also a problem that voids (bubbles) are generated, and deformation of the wire, which is a component, occurs.

On the other hand, in the present invention, first, since resin sealing on both sides of the substrate is possible without opening an opening in the substrate, there is no cost due to opening the substrate, and until the both sides are resin-sealed. Since the flow distance is also short, it is possible to suppress voids (bubbles) and wire deformation.

In the resin sealing device of the present invention, the upper and lower die molding modules (one molding module) may also serve as the first molding module and the second molding module. An upper die and a lower die are provided in the upper and lower die forming module. In this case, the resin encapsulation device is capable of resin-sealing one surface of the substrate by compression molding by one of the upper die and the lower die, and then resin-sealing the other surface of the substrate by the other die. Hereinafter, such a resin sealing device is also referred to as a "first resin sealing device". Accordingly, since both sides of the substrate can be collectively molded using one molding module, production efficiency is improved, and the configuration is also simplified, so that cost reduction is possible, which is preferable.

In the case where the resin sealing device of the present invention includes the upper and lower die molding modules (when both sides of the substrate are collectively molded using one molding module), the upper die of the upper and lower die molding modules is a compression molding die. It is preferable that the lower die of the upper and lower die molding module is a transfer molding die. Accordingly, first of all, production efficiency is improved and the cost is reduced because the configuration is simplified. Further, when the other surface of the substrate is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state exposed from the sealing resin. The purpose of exposing the terminal is for electrical connection to the substrate.

In the resin sealing device of the present invention, the first molding module may be a molding module having a lower die for compression molding, and the second molding module may be a molding module having an upper die for transfer molding. In this case, after resin-sealing the lower surface of the substrate by compression molding by the lower die of the first molding module, the upper surface of the substrate may be resin-sealed by transfer molding by the upper die of the second molding module. . Hereinafter, such a resin sealing device is also referred to as a "second resin sealing device". If the second molding module is a molding module having an upper die for transfer molding, and the other surface of the substrate is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state exposed from the sealing resin. The purpose of exposing the terminal is as described above.

In the resin sealing device of the present invention, a die module for compression molding (one molding module) may also serve as the first molding module and the second molding module. The die module for compression molding is provided with a die for compression molding. Further, the resin encapsulation device may include a substrate inversion mechanism that vertically reverses the substrate. In this case, one surface of the substrate is resin-sealed by compression molding by the compression molding die of the first molding module, and the substrate having the resin-sealed surface is inverted up and down by the substrate inversion mechanism, and then the compression molding The other surface of the substrate may be resin-sealed with a die. Hereinafter, such a resin sealing device is also referred to as a "third resin sealing device".

In the resin sealing device of the present invention, it is preferable that the first molding module has an upper die. In this case, the resin sealing device may be capable of sealing a resin by compression molding one surface of the substrate by an upper die of the first molding module.

In the resin sealing device of the present invention, it is preferable that the second molding module is a molding module for transfer molding. In this case, the resin sealing device may be resin-sealed by transfer molding the other surface of the substrate by the transfer molding molding module. When the second molding module is a molding module for transfer molding, and the other surface of the substrate is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state exposed from the sealing resin. The purpose of exposing the terminal is as described above.

The resin sealing device of the present invention may further include an extruded pin. The extrusion pin is provided so as to be accessible from the cavity surface of the molding die provided on at least one of the first molding module and the second molding module, and can be raised or lowered so that its tip protrudes from the cavity surface when the die is opened. , When the die is fastened, the tip may be raised or lowered so that the tip does not protrude from the cavity surface. Accordingly, the resin-sealed substrate can be easily released from the molding die, which is preferable. On the other hand, the molding die provided with the extruded pins may be, for example, both of the upper die and the lower die, or both of the upper die and the lower die.

The resin sealing device of the present invention may further include an unnecessary resin separation means. The unnecessary resin separation means may be capable of separating the unnecessary resin portion from the resin-sealed substrate after resin-sealing one surface and the other surface of the substrate. The unnecessary resin separation means is not particularly limited, and examples thereof include a separation jig used in a known method such as gate-cut and degate.

The resin sealing device of the present invention may further include a substrate pin. The substrate pins are provided so as to protrude upwardly outside a cavity (lower cavity) of a lower die provided on at least one of the first and second forming modules, for example, and It may be mounted in a state spaced apart from the upper surface. The term'mounting' here includes'fixing'. Accordingly, the resin sealing device, when depressurizing the inside of the die when the intermediate die is fastened, does not cover the cavity (lower die cavity) of the lower die, so that the inside of the cavity (lower cavity) of the lower die is You can reduce the pressure. As a result, it is possible to efficiently prevent (reduce) excess air and the like from remaining in the cavity (lower die cavity) of the lower die, thereby further suppressing the substrate from bending. When excess air or the like remains in the cavity of the lower die (lower die cavity), air or the like is included in the cavity of the lower die (lower die cavity) in addition to resin. Accordingly, the cavity of the lower die is first filled with resin or the like compared to the upper cavity, and pressure (resin pressure) is first applied to the cavity (lower die cavity) of the lower die. Therefore, when excess air or the like remains in the cavity of the lower die (lower die cavity), there is a concern that the substrate may be warped. According to the substrate pin, such a problem can be prevented.

Meanwhile, the substrate pin may be integrated with the lower die or may be separated from the lower die.

The substrate pin may be, for example, a stepped pin, and may include a protruding substrate positioning portion at its tip. The substrate pin may mount the substrate by being inserted into the through hole provided in the substrate. Mounting the substrate on the substrate pin as described above is preferable because it is stable and can be fixed at a predetermined position.

In the resin sealing device of the present invention, the clearance hole for the substrate positioning portion may be provided in an upper cavity frame member, which will be described later, of the upper die.

The resin sealing device of the present invention may further include a substrate transfer mechanism and a resin transfer mechanism. The substrate conveyance mechanism conveys the resin-sealed substrate to a predetermined position of each molding module, and the resin conveyance mechanism conveys the resin for supply to the substrate onto the substrate. In addition, the resin conveying mechanism conveys, for example, a tablet-like resin to a port position. In the resin sealing device, the substrate transport mechanism may also serve as the resin transport mechanism.

The resin sealing device of the present invention is not limited to the third resin sealing device, and may further include a substrate inversion mechanism. As described above, the substrate inversion mechanism reverses the top and bottom of the resin-sealed substrate.

The resin sealing device of the present invention, for example, when compression molding is performed by a compression molding module, in order to absorb variations in the amount of resin, a spring is applied to the block (member) constituting the cavity of the compression molding module. May be provided to apply pressure to the resin. Further, a ball screw or a hydraulic cylinder may be attached to the block (member) constituting the cavity and pressurized by direct-acting.

In the resin sealing device of the present invention, when each molding module has both an upper die and a lower die, a release film for easily releasing the molded resin sealed product from the molding die may be provided on both of the above, or provided on either side. It can be done, and there is no need to prepare it.

In the resin encapsulation device of the present invention, voids (bubbles) may occur when, for example, air contained in the cavity or a gas formed as a gas by heating the moisture contained in the resin is contained in the encapsulating resin. . When voids (bubbles) occur, there is a concern that the durability or reliability of the resin encapsulated product may be deteriorated. Therefore, if necessary, in order to reduce voids (bubbles), a vacuum pump or the like for performing resin sealing molding in a vacuum (reduced pressure) state may be included.

The substrate to be resin-sealed by the resin encapsulation device of the present invention is, for example, a mounting substrate having chips mounted on both surfaces thereof. As the mounting board, for example, as shown in Fig. 21(a), a chip 1 and a wire 3 electrically connecting the chip 1 and the substrate 2 are provided on one of both sides. The mounting board 11 provided and provided with the flip chip 4 and the ball terminal 5 as an external terminal on the other side, etc. are mentioned.

Here, when molding both surfaces of the substrate 2 having the above configuration, it is necessary to expose the ball terminals 5 from at least one surface. When exposing the ball terminal 5 from the compression molding side, it is preferable to expose the ball terminal 5 by pressing it against the mold release film. Further, if necessary, a grinding treatment or the like may be performed on the sealing resin in order to expose the ball terminal 5 after resin sealing. On the other hand, in the case of exposing the terminal from the transfer molding side, for example, as shown on the mounting board in Fig. 21B, instead of the ball terminal 5, the exposed surface is a flat terminal 6, It is preferable to perform die fastening and expose the flat terminal 6 by pressing the flat terminal 6 with the convex portion provided on the die of the molding module for transfer molding. On the other hand, in the mounting board 11 of FIG. 21(b), the ball terminal 5 of the mounting board 11 of FIG. 21(a) is not provided on the one surface, but is provided on the other surface, and a flat terminal ( It is the same as the mounting substrate 11 in Fig. 21A except that it is set to 6). This is preferable because it enables reliable exposure.

In the present invention, the substrate to be resin-sealed is not limited to each of the mounting substrates 11 shown in Figs. 21A and 21B, but is arbitrary. As the resin-sealed substrate, for example, at least one of the chip 1, the flip chip 4 and the ball terminal 5 (or the flat terminal 6) is shown in FIGS. 21A and 21B. Likewise, it may be mounted on one side of the substrate 2 or may be mounted on both sides of the substrate 2. Further, for example, if electrical connection to the substrate (for example, connection of a power supply circuit, signal circuit, etc. to the substrate) is possible, the terminal may not be present. Meanwhile, the shape and size of each of the substrate 2, the chip 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) are not particularly limited.

Examples of the substrate resin-sealed by the resin sealing device of the present invention include a high-frequency module substrate for portable communication terminals. In the substrate for a portable communication terminal, it is possible to make an opening in a cradle portion to seal both sides of the substrate with resin, but a resin sealing molding method that does not need to pierce the opening is required. Further, when the substrate for a portable communication terminal is small and the parts are built in high density, it may be difficult to pierce the opening and perform resin sealing molding. On the other hand, in the resin sealing device of the present invention, as described above, since both surfaces of the substrate can be resin-sealed without piercing the opening, it can be applied to a substrate having a small size and high density of components. Although it does not specifically limit as a board|substrate resin-sealed by the resin sealing apparatus of this invention, For example, a module board for power control, a board|substrate for device control, etc. are mentioned.

In order to supply the substrate to the molding die, a frame member having a through hole may be used. In this case, for example, the substrate is adsorbed and fixed to the lower surface of the frame member. And, the resin is supplied into the through hole of the frame member. The substrate fixed by the frame member enters between an upper die and a lower die in a die-open state, and mounts the substrate on a substrate pin or the like by lowering the frame member or raising the lower die. The frame member may be removed as necessary. The use of the frame member is preferable because the resin can be placed on the substrate in a stable state.

The resin is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. Moreover, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. As a form of the resin to be supplied, a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, a powdery resin, and the like can be exemplified. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin means, for example, a liquid at room temperature or a resin having fluidity. In the present invention, the molten resin refers to, for example, a resin that has become liquid or fluid by melting. The form of the resin may be any other form as long as it can be supplied to a cavity or a port of a molding die.

On the other hand, in general, the term'electronic component' refers to a chip before resin sealing or a state in which the chip is resin-sealed, but in the present invention, the case simply referred to as'electronic component' is not particularly limited , Refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, the "chip" refers to a chip before resin sealing, and specifically, a chip such as an IC (Integrated Circuit), a semiconductor chip, and a power control semiconductor element may be mentioned. In the present invention, a chip before resin sealing is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin sealing. However, the "chip" in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not have a chip shape.

In the present invention, the "flip chip" refers to an IC chip or such a chip type having a bump-shaped protruding electrode called a bump on an electrode (bonding pad) on the surface of the IC chip. This chip is face-down and mounted on a wiring portion such as a printed circuit board. The flip chip is used, for example, as a chip for wireless bonding or a mounting method.

The resin sealing method of the present invention is a resin sealing method of resin-sealing both sides of a substrate, comprising a first resin sealing process of resin sealing one surface of the substrate by compression molding, and after the first resin sealing process, the other surface of the substrate is It characterized by including a second resin sealing process of resin sealing. In the resin sealing method of the present invention, since one surface of the substrate is first resin-sealed by compression molding, when the other surface is resin-sealed, the substrate is supported by a resin for compression molding so that even if resin pressure is applied to the substrate from the other surface This bending can be suppressed. For this reason, in the present invention, the curvature of the substrate and double-sided molding of the substrate are compatible.

In the resin sealing method of the present invention, using the resin sealing device of the present invention, the first resin sealing process is performed by the first molding module, and the second resin sealing process is performed by the second molding module. Also works.

The resin sealing method may use the first resin sealing device of the present invention to perform the first resin sealing process and the second resin sealing process by the upper and lower die molding modules (one molding module).

In the resin sealing method, using the second resin sealing device of the present invention, the first resin sealing process is performed by the lower die of the first molding module, and the second resin sealing process is performed in the second molding. You may implement it by the said upper die of a module.

In the resin sealing method, using the third resin sealing device of the present invention, between the first resin sealing process and the second resin sealing process, the substrate having the one surface resin-sealed up and down by the substrate inversion mechanism. A substrate inversion step of inverting may be included, and the first resin sealing step and the second resin sealing step may be performed by the compression molding die.

In the resin sealing method, when using the resin sealing device, the first resin sealing step may be performed by an upper die of the first molding module of the resin sealing device.

Further, in the resin sealing method, when using the resin sealing device of the present invention, the second resin sealing process may be performed by the transfer molding molding module of the resin sealing device.

In addition, the resin sealing method, in the case of using the resin sealing device of the present invention, is raised or lowered so that the tip of the extruded pin protrudes from the bottom surface of the cavity of the molding die when the die is opened by the resin sealing device. A step and a step of raising or lowering the tip of the extrusion pin so as not to protrude from the bottom surface of the cavity of the molding die when the die is fastened by the resin sealing device.

In addition, the resin sealing method, when using the resin sealing device of the present invention, resin-sealing one side and the other side of the substrate by the resin sealing device, and then resin-sealing the unnecessary resin portion by the unnecessary resin separation means. An unnecessary resin separation step of separating from the finished substrate may be included.

Further, the resin sealing method may include a substrate mounting step of mounting the substrate on a substrate pin while spaced apart from the upper surface of the lower die when the resin sealing device of the present invention is used. Further, in the substrate mounting step, the substrate pin may mount the substrate by inserting the substrate positioning portion into a through hole provided in the substrate.

Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically drawn with appropriate omission and exaggeration for convenience of explanation.

<Example 1>

In the present embodiment, first, an example of the resin sealing device of the present invention will be described, and next, an example of the resin sealing method of the present invention will be described. On the other hand, the substrate used in this embodiment is the same as the substrate 2 of Fig. 21A.

In the resin encapsulation device of this embodiment, an upper and lower die molding module (one molding module) serves as the first molding module and the second molding module. The upper and lower die molding module is provided with an upper die and a lower die, the upper die is a compression molding molding die, and the lower die is a transfer molding molding die. However, the present invention is not limited to this. That is, in the present invention, for example, contrary to the present embodiment described below, the upper die may be a transfer molding die, and the lower die may be a compression molding die.

Fig. 1(a) is a cross-sectional view showing the resin encapsulation device of the present embodiment and the substrate to be resin-sealed by the resin encapsulation device. As shown in (a) of FIG. 1, the upper and lower die forming module 10 includes an upper die 200 and a lower die 300 disposed opposite to the upper die. On the die surface (bottom) of the upper die 200, as shown, for example, a release film 40 for facilitating release from the molding die of the molded resin encapsulated product can be adsorbed (mounted) and fixed. have.

In the resin sealing device of this embodiment, the upper die 200 is a compression molding molding die (molding module), for example, the upper cavity frame member 210, the upper cavity upper surface member 230, and a plurality of elastic members 201 ), an upper die base plate 202, and an upper die air blocking member 203 having O-rings 204A and 204B. In the upper die 200, an upper cavity 220 is formed by, for example, an upper cavity frame member 210 and an upper cavity upper surface member 230. The upper die 200 is fixed to a fixing plate (not shown) of the upper and lower die forming modules 10, for example. Further, the upper die 200 or the upper and lower die forming module 10 is provided with a heating means (not shown) for heating the upper die 200, for example. By heating the upper die 200 by the heating means, the resin in the upper cavity 220 is heated and cured (melted and cured). On the other hand, the heating means may be provided on either or both of the upper die 200 and the lower die 300, for example, if it can heat at least one of the upper die 200 and the lower die 300 Its location is not limited.

The upper cavity frame member 210 and the upper cavity upper surface member 230 are attached to the upper die base plate 202 in a state of being drowned through, for example, a plurality of elastic members 201. An upper die external air blocking member 203 is provided at an outer peripheral position of the upper die base plate 202. As will be described later, the upper die outdoor air blocking member 203 can be bonded to the lower die outdoor air blocking member 302 via an O-ring 204B, so that the inside of the cavity can be in an external air blocking state. An O-ring 204A for external air blocking is provided on an upper end surface of the upper die outdoor air blocking member 203 (a portion sandwiched between the upper die base plate 202 and the upper die external air blocking member 203). In addition, an O-ring 204B for blocking external air is provided on the lower end surface of the upper die external air blocking member 203. Further, the upper die base plate 202 is provided with a hole (through hole, 205) of the upper die 200 for forcibly suctioning air in the space portion of the die and reducing pressure.

On the other hand, in the resin sealing device of Fig. 1(a), the upper cavity frame member 210 and the upper cavity upper surface member 230 are separated from each other, but the resin sealing device of this embodiment is not limited to this, A configuration in which both of the above are integrated may be employed.

The lower die 300 is a molding die (molding module) for transfer molding, for example, a lower die air blocking member having a lower cavity block 320, a lower die base plate 301, and an O-ring 303 ( 302). The lower cavity block 320 has a lower cavity 310. Further, the lower die 300 or the upper and lower die forming module 10 is provided with heating means (not shown) for heating the lower die 300, for example. By heating the lower die 300 by the heating means, the resin in the lower cavity 310 is heated and cured (melted and cured). The lower die 300 may be moved in the vertical direction by a driving mechanism (not shown) provided in the upper and lower die forming module 10. That is, the lower die 300 may move in a direction approaching the upper die 200 (which is fixed) to fasten the die. Further, the lower die 300 may move in a direction away from the upper die 200 to open the die.

The lower cavity block 320 is mounted while being seated on the lower die base plate 301, for example. A lower die external air blocking member 302 is provided at an outer peripheral position of the lower die base plate 301. The lower die external air blocking member 302 is disposed immediately under the upper die external air blocking member 203 and the external air blocking O-rings 204A and 204B. An O-ring 303 for blocking external air is provided on a lower end surface of the lower die external air blocking member 302 (a portion sandwiched between the lower die base plate 301 and the lower die external air blocking member 302). With the above configuration, when the upper and lower dies are fastened, the upper die air blocking member 203 including the O-rings 204A and 204B and the lower die air blocking member 302 including the O-ring 303 By joining them through the O-ring 204B, the inside of the cavity can be in a state of blocking outside air.

The lower die 300 is provided with a resin passage 304 for supplying a resin material, for example. The lower cavity 310 and the port 305 are connected by the resin passage 304. The plunger 306 disposed inside the port 305 can be moved in the vertical direction by a plunger driving mechanism (not shown) provided in the upper and lower die forming module 10. By supplying (setting) the resin to the port 305 (on the plunger 306) and actuating the plunger 306 in a direction approaching the upper die 200, the plunger 306 passes the resin to the resin passage 304 Through this, it may be injected into the lower cavity 310.

The lower die 300 is an elastic member 340 provided outside the lower cavity 310 of the lower die 300, respectively, inside the lower cavity block 320, as shown in FIG. 1(a). In a state seated on, the substrate pin 330 may be further provided so as to protrude upward.

Each of the substrate pins 330 is provided so as to protrude upward from the outside of the cavity 310 of the lower die 300, as shown in FIG. 1(a), so that the substrate 2 is attached to the lower die 300. It may be mounted in a state spaced apart from the upper surface. In addition, each of the substrate pins 330 is, for example, a stepped pin, as shown in Fig. 1B, and may include a protruding substrate positioning portion 331 at its tip. The substrate pin 330 of FIG. 1B is the same as the substrate pin 330 of FIG. 1A except that the substrate positioning portion 331 is included. Each of the substrate pins 330 is, for example, as shown in FIG. 1(b), by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2, the substrate 2 May be fixed in a state spaced apart from the lower cavity block 320.

At the bottom of the lower cavity 310 of the lower die 300, as shown in FIG. 8 to be described later, an extrusion pin 550 may be further provided. The number of the extruded pins may be one, but may be plural. Each of the extruded pins rises so that their tip protrudes from the bottom surface of the lower cavity 310 of the lower die 300 when the die is opened, and when the die is fastened, the tip of the extrusion pin rises to the lower cavity 310 of the lower die 300. You may descend so that it does not protrude from the bottom of ).

The resin sealing device of the present embodiment may further include an unnecessary resin separation means (not shown). The unnecessary resin separation means may be capable of separating the unnecessary resin portion from the resin-sealed substrate after resin-sealing one surface and the other surface of the substrate.

Next, a resin sealing method of the present embodiment will be described with reference to Figs. Hereinafter, a resin sealing method using the resin sealing device of the present embodiment will be described. More specifically, the resin sealing device of Figs. 2 to 8 is the same as the resin sealing device of Fig. 1A. On the other hand, the extrusion pin 550 of FIG. 8 may or may not be present. In the resin sealing method, the first resin sealing process and the second resin sealing process are performed by the upper and lower die molding modules 10.

In the resin sealing method of this embodiment, prior to the first resin sealing process, a molding die temperature raising process, a release film supply process, a substrate mounting process and a resin supply process described below are performed. Each process is an arbitrary component in the resin sealing method.

First, a heating means (not shown) heats the molding die (upper die 200 and lower die 300), and the molding die (upper die 200 and lower die 300) cures (melts) the resin. The temperature is raised to a temperature that can be cured) (molding die heating process). Next, as shown in FIG. 2, the release film 40 is supplied to the upper die 200 (release film supply process). Further, the substrate 2 is mounted on the substrate pin 330 while being spaced apart from the upper surface of the lower die 300 (substrate mounting process). Here, the substrate 2 may be mounted on the substrate pins 330 by inserting the substrate positioning portion 331 into a through hole (not shown) provided in the substrate 2.

Next, as shown in FIG. 3, the granular resin 20a is supplied to the upper surface of the substrate 2, and the tablet-shaped resin (not shown) is supplied to the port of the lower die 300 (above the plunger 306). (Setting) (resin supply process), the tablet-like resin is heated and melted by the heated pot (and the lower die 300), and becomes a molten resin (fluid resin, 30a). On the other hand, in the resin sealing method of this embodiment, it is not limited to supplying the granular resin 20a to the upper surface of the substrate 2 after supplying the substrate 2 to the lower die 300, for example, After supplying (setting) (20a) to the upper surface of the substrate 2, the substrate 2 supplied with the granular resin 20a may be supplied to the lower die 300.

Next, as shown in FIGS. 4-5, the said 1st resin sealing process is implemented. In this embodiment, one surface of the substrate 2 is resin-sealed by compression molding by the first resin sealing process. As an example of the resin sealing method by the compression molding, specifically, an intermediate die fastening process described below. And the upper cavity resin filling process is performed.

First, as shown in Fig. 4, the lower die 300 is lifted by a drive mechanism (not shown) to perform intermediate die fastening (intermediate die fastening step). In this state, the upper die external air blocking member 203 and the lower die external air blocking member 302 are joined via the O-ring 204B, and the inside of the die is blocked from outside air. Then, suction in the direction of arrow X shown in Fig. 4 is started from the hole 205 of the upper die 200 to decompress the inside of the die.

Next, as shown in FIG. 5, the lower die 300 is raised to a position where the upper cavity 220 is filled with the resin 20a by a driving mechanism (not shown), and the lower die 300 at that position. Is temporarily stopped (upper cavity resin filling process). Then, the granular resin 20a is heated and melted by the heated (heated) upper die 200 to become a molten resin (fluid resin, 20b). On the other hand, even if the molten resin (fluid resin, 20b) has a low viscosity and a resin pressure is applied to the substrate 2 from the upper die side to temporarily warp the substrate, the molten resin ( If the curvature of the substrate is reduced by applying resin pressure to the substrate from the lower die side by filling the flowable resin, 30a), if the curvature of the substrate is at a level without a problem, the upper cavity 220 is watered at this point. The lower die 300 may be raised to a position where acupressure is applied.

Next, as shown in FIGS. 6 and 7, the second resin sealing step is performed. In this embodiment, the other surface of the substrate 2 is resin-sealed by transfer molding by the second resin sealing process. As an example of the resin sealing method by the transfer molding, specifically, the lower cavity resin filling process described below. , Resin pressure process and die opening process are performed.

First, as shown in Fig. 6, for example, the plunger 306 is raised by a plunger driving mechanism (not shown) to a position where the flowable resin 30a is filled in the lower cavity 310, and the plunger ( 306) is temporarily stopped (lower cavity resin filling process).

Next, as shown in Fig. 7, for example, the lower die 300 and the plunger 306 are raised substantially simultaneously, and the upper and lower surfaces of the substrate are approximately simultaneously increased by the flowable resin 20b for compression molding. Apply resin pressure (resin pressure process). By doing in this way, it is possible to suppress the substrate from warping. When resin pressure is applied to the upper cavity 220 at the time shown in FIG. 7, only the plunger 306 is raised.

Next, as shown in Fig. 8, for example, after the molten resin (fluid resin, 20b) and the flowable resin 30a are cured to form the sealing resins 20 and 30, the lower die 300 is driven by a drive mechanism ( (Not shown) lowers to perform die opening (die opening process).

As described above, in the resin sealing method of the present embodiment, since one surface of the substrate 2 is first resin-sealed by compression molding by the compression molding module, when the other surface is resin-sealed by transfer molding, one surface is made of a resin for compression molding. By supporting it with, even if resin pressure is applied to the substrate 2 from the other side, the warpage of the substrate 2 can be suppressed. For this reason, in this embodiment, the curvature suppression of the substrate 2 and double-sided molding of the substrate 2 are compatible. In addition, since both sides of the substrate 2 can be collectively molded using one molding module, production efficiency is improved, and the configuration is also simplified, so that cost reduction is possible. On the other hand, by resin-sealing the other surface by transfer molding, for example, it is possible to mold the terminal provided on the substrate (the other surface) in a state exposed from the sealing resin. This will be described in Example 2 (FIGS. 10 and 18) described later.

In the resin sealing method of the present embodiment, as shown in Fig. 8, a rising process in which the tip of the extrusion pin 550 protrudes from the bottom surface of the cavity of the lower die when the die is opened, and the extrusion pin when the die is fastened. A lowering step of lowering the tip of 550 so as not to protrude from the bottom surface of the cavity of the lower die may be further included.

In the resin sealing method of this embodiment, the resin-sealed substrate (formed substrate 2) and the unnecessary resin portion 33 shown in Fig. 8 are recovered together from the molding die, and then the unnecessary resin separation means (not shown) The resin-sealed substrate (the molded substrate 2) and the unnecessary resin portion 33 may be separated by means of a method. On the other hand, after separating the resin-sealed substrate (formed substrate, 2) and the unnecessary resin portion 33, together or separately from the upper and lower die-molding modules 10, the resin-sealed substrate (formed substrate, 2) and the unnecessary resin portion 33 may be recovered together from the upper and lower die molding module 10.

In the resin sealing method of this embodiment, a resin sealing method may be performed using the frame member 32 as shown in Figs. 9A to 9C. First, after the molding die temperature raising process and the release film supply process shown in FIG. 2, as shown in FIG. 9A, in the substrate mounting process and the resin supply process, a frame having an internal through hole 31 The substrate 2 is adsorbed and fixed to the lower surface of the member 32, and the granular resin 20a is supplied to the inner through hole 31 of the frame member 32, and the upper die 200 and the lower die 300 When the die is opened, the frame member 32, the substrate 2, and the granular resin 20a are allowed to enter between the upper and lower dies. Next, as shown in (b) of FIG. 9, by lowering the frame member 32 or raising the lower die 300, the frame member 32 and the substrate 2 on which the granular resin 20a are mounted are removed. It is mounted on the substrate pin 330. Then, as shown in Fig. 9C, the frame member 32 is removed. Other than these, it is the same as the said board|substrate mounting process and the said resin supply process shown in FIG. 2 and FIG. And after that, you may implement each process shown in FIGS. 4-8. In this way, as shown in Figs. 9A to 9C, by using the frame member 32, it is possible to stably supply resin such as granular resin 20a on the substrate 2.

Further, in this embodiment, one of the cavities on both sides of the molding die is first filled by compression molding. Accordingly, as described above, it is possible to suppress warpage (deformation) of the substrate and to achieve both sides molding. The reason is that in compression molding, it is possible to adjust the resin amount of the resin (resin for compression molding) supplied to the cavity. For example, when adjusting the volume of the resin, if the specific gravity of the resin is known, it can be adjusted by measuring the weight of the resin to be supplied. Specifically, for example, the amount of the resin for compression molding is substantially the same as that of the cavity on one side (the side to be compression molded) in a state where the substrate is flat, and the resin for compression molding is supplied to the one cavity to be filled. By doing so, it is possible to suppress the swelling or turning off of the substrate at least due to an excess or shortage of the resin amount. After that, even if the other cavity is filled with resin and resin pressure is applied from the other side of the substrate, the resin for compression molding of approximately the same volume as the one cavity is supported from one side of the substrate, so that the substrate is formed in a flat state. Can be completed.

On the other hand, when one cavity is first filled by, for example, transfer molding, the amount of resin supplied to the one cavity varies depending on the vertical position of the plunger. Therefore, there is a possibility that the substrate swells or turns off due to an excessive or insufficient amount of resin. Therefore, it is desirable to first fill one cavity by compression molding.

On the other hand, when one cavity is first filled by compression molding, for example, if the resin for compression molding in a molten state has a high viscosity, when the resin is filled in one cavity, a strong resistance force may act against the substrate. In that case, the resin may not be filled in the entire cavity, and the substrate may swell due to the volume of the unfilled portion. In such a case as well, by filling the other cavity with a resin and applying a resin pressure to the substrate from the other side of the substrate, the swollen substrate is flattened, and the entire one cavity can be filled with the resin.

<Example 2>

Next, in this embodiment, another embodiment of the present invention will be described, that is, another example of the resin sealing apparatus of the present invention and the resin sealing method of the present invention. The substrate used in this embodiment is the substrate 2 shown in Fig. 21B, except that the number of flat terminals 6 is different, and the flat terminals 6 are provided on the same side as the flip chip 4 ) Is almost the same. On the other hand, the number of flat terminals 6 is 2 in this embodiment and in Embodiment 3 (FIGS. 10 to 20) to be described later, and 3 in FIG. 21 (b), but these numbers are only examples and the present invention Is not limited to. The same applies to the chip 1, the wire 3, the flip chip 4 and the ball terminal 5 (Example 1 and Fig. 21A).

The resin sealing device of this embodiment includes two molding modules of a first molding module having a lower die for compression molding and a second molding module having an upper die for transfer molding, and the lower die of the first molding module The lower surface of the substrate may be resin-sealed by compression molding, and the upper surface of the substrate may be resin-sealed by transfer molding by the upper die of the second molding module. In addition, the resin sealing device of the present embodiment may include, for example, a substrate transfer mechanism.

Fig. 10 shows a cross-sectional view of the first molding module 500 of the resin sealing device of the present embodiment and the substrate 2 to be resin-sealed by it. As shown in FIG. 10, the first shaping module 500 includes a substrate support member (upper die, 600), and a lower die 700 disposed opposite to the substrate support member (upper die, 600).

The substrate support member (upper die, 600) is a communication member 610 that communicates with a high-pressure gas source 650 such as a compressor and a compressed air tank, a cavity upper surface and a frame member 620, and a substrate 2 It is formed of a convex member 630 for exposing the flat terminal 6 mounted on the device, a plurality of elastic members 602, and a plate member 640. The upper surface of the cavity and the frame member 620 have a cavity 601. The communication member 610 and the upper surface of the cavity and the frame member 620 are attached to the plate member 640 in a state of being drowned through the plurality of elastic members 602. The communication member 610 is provided with an air passage (air path) 603 for pressure-feeding the air compressed by the high-pressure gas source 650 to the cavity 601. The cavity upper surface and the frame member 620 have a structure in which an upper cavity upper surface member having a cavity 601 and a frame member surrounding the upper cavity upper surface member are integrated. A plurality of air holes 604 for communicating the air passage 603 of the communication member 610 and the cavity 601 are provided on the upper surface of the cavity 601.

In this embodiment, the convex member 630 may be pressed to prevent the substrate 2 from bending due to resin sealing by the first molding module 500, for example, by pressing the substrate 2, such as the upper surface of the flat terminal 6. It is desirable to provide it in the part that becomes.

The lower die 700 is a compression molding die, and is formed of, for example, a lower cavity lower surface member 710, a lower cavity frame member 720, an elastic member 702, and a lower die base plate 730. In the lower die 700, a lower cavity 701 is formed by a lower cavity lower surface member 710 and a lower cavity frame member 720. The lower cavity lower surface member 710 is mounted while being seated on the lower die base plate 730, for example. Further, the lower cavity lower surface member 710 may be mounted while being seated on the lower die base plate 730 via the elastic member 702, for example. The lower cavity frame member 720 is disposed so as to surround the lower cavity lower surface member 710 while being seated on the lower die base plate 730 via a plurality of elastic members 702, for example. In addition, a sliding hole 711 is formed by a gap between the lower cavity member 710 and the lower cavity frame member 720. As described later, by suction through the sliding hole 711, for example, a release film or the like can be adsorbed. The lower die 700 is provided with heating means (not shown) for heating the lower die 700, for example. By heating the lower die 700 by the heating means, the resin in the lower cavity 701 is heated and cured (melted and cured). The lower die 700 may be moved in the vertical direction by, for example, a driving mechanism (not shown) provided in the first molding module 500. In addition, the illustration and detailed description of the lower die external air blocking member of the lower die 700 will be omitted for simplicity.

Fig. 11 shows a cross-sectional view of the second molding module 800 of the resin encapsulation device of the present embodiment and the substrate 2 to be resin-sealed thereby. As shown in Fig. 11, the second shaping module 800 includes an upper die 900 and a substrate support member (lower die, 1000) disposed opposite the upper die.

The upper die 900 is a molding die for transfer molding, for example, an upper cavity upper surface member 910, an upper cavity frame member 920, which is a frame member surrounding the upper cavity upper surface member 910, and a substrate 2 It is formed of a convex member 930 for exposing the flat terminal 6 mounted on the device, a plurality of elastic members 902, and an upper die base plate 940. In the upper die 900, an upper cavity 901 is formed by an upper cavity upper surface member 910. The upper die 900 is mounted in a state in which the upper cavity upper surface member 910 is lowered to the upper die base plate 940 through a plurality of elastic members 902, and the upper cavity frame member 920 is It is attached to the die base plate 940 in a drooped state. Meanwhile, the illustration and detailed description of the upper die external air blocking member of the upper die 900 are omitted for simplicity.

The upper die 900 is provided with a resin passage 950 for supplying a resin material, for example. The upper cavity 901 and the port 960 are connected by the resin passage 950. The plunger 970 disposed inside the port 960 may move in the vertical direction by, for example, a plunger driving mechanism (not shown) provided in the second shaping module 800.

The substrate support member (lower die, 1000) is a plate for mounting the substrate 2 whose one surface is resin-sealed by the first molding module 500, for example, the cavity lower surface member 1010, the cavity frame member ( 1020), a plurality of elastic members 1030, and a base member 1040. In the substrate support member (lower die, 1000), for example, a cavity 1001 is formed by a cavity lower surface member 1010 and a cavity frame member 1020. The cavity lower surface member 1010 and the cavity frame member 1020 are mounted while being seated on the base member 1040 through a plurality of elastic members 1030. The substrate 2 is mounted on a substrate support member (lower die, 1000) so that the resin encapsulation region is accommodated in the cavity 1001. The second shaping module 800 is provided with a heating means (not shown) for heating the pot 960, for example. By heating the pot 960 by the heating means (not shown), the resin supplied (set) to the pot 960 is heated and cured (melted and cured). The substrate support member (lower die) 1000 may be moved in the vertical direction by, for example, a substrate support member driving mechanism (not shown) provided in the second molding module 800.

On the other hand, in this embodiment, instead of supplying compressed air to the cavity 601 from the first shaping module 500, the cavity 601 may be filled with a gel-like solid. By pressing the substrate 2 with the gel-like solid, warpage of the substrate 2 can be suppressed.

Next, the resin sealing method of this embodiment will be described with reference to FIGS. 12 to 18. Hereinafter, a resin sealing method using the resin sealing device of this embodiment will be described, but the resin sealing method of this embodiment is not limited to using the resin sealing device.

In the resin sealing method of this embodiment, the substrate supplying process and the resin supplying process described below are performed prior to the first resin sealing process. Each process is an arbitrary component in the resin sealing method.

First, as shown in Fig. 12, the substrate 2 is supplied to the substrate support member (upper die 600) of the first molding module 500 by the substrate transfer mechanism 1100, and the substrate clamper and the suction hole (not shown) The substrate 2 is fixed by (substrate supply process). After the substrate supply process, the substrate transfer mechanism 1100 is removed.

Next, a resin conveyance mechanism (not shown) is made to enter between the substrate support member (upper die 600) and the lower die 700. By the resin conveying mechanism, as shown in FIG. 13, the release film 130, the resin frame member 140 mounted on the release film 130, and the internal through-hole 140A of the resin frame member 140 The granular resin 150a supplied to is conveyed to the lower die 700. Then, the release film 130 is sucked from the sliding hole 711 between the lower cavity lower surface member 710 and the lower cavity frame member 720 by suction in the direction of arrow Y shown in FIG. 13, thereby adsorbing the lower cavity ( The release film 130 and the granular resin 150a are supplied to 701 (resin supply process). After that, the resin conveying mechanism and the resin frame member 140 are removed.

Next, as shown in Figs. 14 and 15, the first resin sealing step of the present embodiment is performed. In this embodiment, by the first resin sealing process, one surface of the substrate is resin-sealed by compression molding using the first molding module 500 having a lower die.

Specifically, first, as shown in FIG. 14, the granular resin 150a is heated and melted by the lower die 700 heated by a heating means (not shown), and the molten resin (fluid resin, 150b) is do. Next, as shown in Fig. 14, the lower die 700 is raised by a drive mechanism (not shown), and the molten resin (fluid resin, 150b) filled in the lower cavity 701 is placed on the lower surface of the substrate 2 The prepared chip 1 and wire 3 are immersed. Simultaneously with this or at a slightly late timing, the high-pressure gas source 650 supplies air at a pressure equal to the molding pressure to the substrate support member (upper die) 600 in the direction of the arrow in FIG. 14. Accordingly, while the warpage of the substrate is suppressed, one surface (lower surface) of the substrate 2 can be resin-sealed.

Next, as shown in FIG. 15, after the molten resin (flowable resin, 150b) is cured to form the sealing resin 150, the lower die 700 is lowered by a driving mechanism (not shown) to open the die. Do (die opening process). When the die is opened, suction through the sliding hole 711 may be released, for example, as shown in FIG. 15. Then, after the die is opened, the substrate 2 on which one surface (lower surface) is molded is transported to the second molding module 800 by the substrate transport mechanism 1100 (second module transport process).

Next, as shown in FIG. 16, the substrate 2 is transferred to the substrate supporting member (lower die 1000) of the second shaping module 800 by the substrate transfer mechanism 1100 shown in FIG. 15. Thereafter, the tablet resin is supplied to the pot 960 by a resin conveying mechanism (not shown), and the tablet resin is heated and melted by the heated pot (lower die) by a heating means (not shown). It becomes a molten resin (liquid resin, 971a) (resin supply process). The substrate transfer mechanism 1100 may supply the purified resin. On the other hand, as shown in Example 3 described later, the substrate 2 may be vertically inverted by a substrate inversion mechanism (not shown). In this case, the top and bottom of the cavity are reversed.

Next, as shown in Fig. 17, the upper die 900 and the substrate support member (lower die, 1000) are die-fastened. At this time, as shown in FIG. 17, the lower surface of the convex member 930 provided on the upper cavity surface of the upper die 900 is pressed against the upper surface of the flat terminal 6 provided on the upper surface of the substrate 2.

Further, as shown in Figs. 17 and 18, the second resin sealing step of the present embodiment is performed. In this embodiment, the other surface (upper surface) of the substrate 2 is resin-sealed by transfer molding by the second molding module 800. Specifically, as shown in FIG. 17, the substrate support member (lower die, 1000) is lifted by a substrate support member driving mechanism (not shown) to clamp the substrate 2. Then, as shown in Fig. 18, the plunger 970 is raised by a plunger driving mechanism (not shown), the upper cavity 901 is filled with a molten resin (flowable resin, 971a), and the flowable resin 971a is It is hardened and made into a sealing resin 971 as shown in FIG. In this way, the upper surface of the substrate 2 is resin-sealed with the sealing resin 971 and molded. At this time, as described above, since the upper surface of the flat terminal 6 is pressed against the lower surface of the convex member 930, it is not immersed in the molten resin 971a. Accordingly, the upper surface of the flat terminal 6 can be resin-sealed while being exposed from the sealing resin 971.

As described above, in the resin sealing method of the present embodiment, since one surface of the substrate is first resin-sealed by compression molding by the compression molding module, when the other surface is resin-sealed by transfer molding, one surface is supported by the compression molding resin. By doing so, even if resin pressure is applied to the substrate from the other surface side, it is possible to suppress the substrate from being warped. For this reason, in this embodiment, the curvature suppression of the substrate and the double-sided molding of the substrate are compatible. Further, in this embodiment, since the other surface is resin-sealed by transfer molding, it is easy to mold the terminal provided on the substrate (the other surface) in a state exposed from the sealing resin.

<Example 3>

Next, in this embodiment, another example of the resin sealing device of the present invention and the resin sealing method of the present invention will be described. The substrate used in this embodiment is the same as the substrate 2 shown in Fig. 21A.

In the resin sealing device of this embodiment, a die module for compression molding (one molding module) serves as the first molding module and the second molding module. The die module for compression molding is provided with a die for compression molding. The resin sealing device further includes a substrate inversion mechanism for inverting the substrate by an upper limit.

Fig. 19 is a cross-sectional view showing the resin encapsulation device of the present embodiment and the substrate to be resin-sealed by the resin encapsulation device. As shown in Fig. 19, the die module 500A for compression molding includes a substrate support member (upper die, 600B), and a lower die 700 disposed opposite to the substrate support member (upper die, 600B). The substrate support member (upper die, 600B) is the same as the substrate support member (upper die, 600) shown in FIG. 15, except that the convex member 630 is not included, and the lower die 700 is shown in FIG. Same as lower die 700. However, in the present embodiment, the height of the cavity 601 is, for example, the height of the sealing resin of the molded substrate, which is assumed in consideration of the actual processing (molding die and resin sealing), the height of each sealing resin after resin sealing, etc. Equal to or slightly higher than that. In this way, the sealing resin can be reliably accommodated in the cavity 601.

Next, a resin sealing method of the present embodiment will be described with reference to Figs. 20A to 20C. On the other hand, hereinafter, a resin sealing method using the resin sealing device shown in Fig. 19 will be described, but the resin sealing method of the present embodiment is not limited to the method using the resin sealing device.

First, instead of the first molding module 500 of the second embodiment, a die module 500A for compression molding was used, and a substrate support member (the upper die 600) of the first molding module 500 was used. Supplying the substrate 2 to the upper die 600B, and the same as in Fig. 20A (i.e., not the flat terminal 6 but the ball terminal 5) instead of the substrate 2 of the second embodiment A) A substrate supply process is performed similarly to the substrate supply process of Example 2 except that the substrate 2 is used. Next, the resin supply process is performed similarly to the resin supply process of Example 2.

Next, the first resin sealing process is carried out in the same manner as the first resin sealing process of Example 2 (not shown).

Next, the die opening process is performed in the same manner as the die opening process of the second embodiment.

Next, as shown in Fig. 20A, the substrate 2 whose one surface is resin-sealed is removed from the die module 500A for compression molding by the substrate reversing mechanism 1100A (removal step). On the other hand, the substrate reversing mechanism may also serve as a substrate transport mechanism similar to the substrate transport mechanism 1100 in the second embodiment.

Next, as shown in Fig. 20B, the substrate inversion mechanism 1100A is rotated 180 degrees together with the substrate 2 fixed to the substrate inversion mechanism 1100A (substrate inversion step). Next, the substrate inversion mechanism 1100A is made to enter the die module 500A for compression molding (entry step). Next, as shown in Fig. 20C, the substrate 2 fixed to the substrate reversing mechanism 1100A is fixed to the substrate support member (upper die, 600B) by a substrate clamper and a suction hole (not shown). Do (substrate supply process). On the other hand, in the present embodiment, the exit step and the entry step are arbitrary constituent elements, and for example, if the substrate 2 can be reversed without exiting, it is not necessary to exit. Further, in the substrate inversion step, in Fig. 20B, the substrate is inverted by rotating the substrate 180 degrees in the direction of an arrow in the drawing. However, the substrate inversion step is not limited to this, and if the substrate can be inverted, for example, the substrate may be rotated in an arbitrary direction different from the arrow in Fig. 20B.

Next, similarly to the resin supply process of Example 2, the said resin supply process is implemented. Prior to the resin supply step, for example, the release film (used release film) used in the first resin sealing step may be recovered, and a new release film may be used in the resin supply step.

Next, a second resin sealing process is performed in the same manner as the first resin sealing process of Example 2, except that the other surface is resin-sealed instead of the one surface (not shown). In the said 2nd resin sealing process, although the resin-sealed surface may be pressurized with compressed air, it may not be pressurized.

As described above, in the resin sealing method of the present embodiment, since one surface of the substrate is first resin-sealed by compression molding by the compression molding die module, when the other surface is resin-sealed, the one surface is supported by the compression molding resin, Even if resin pressure is applied to the substrate from the other side, it is possible to suppress warping of the substrate.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, changed, or selected and adopted as necessary within the scope not departing from the spirit of the present invention.

1: chip
2: substrate
3: wire
4: flip chip
5: ball terminal
6: flat terminal (terminal)
10: upper and lower die forming module
11: mounting board
20a, 150a: granular resin
20b, 30a, 150b, 971a: molten resin (flowable resin)
20, 30, 150, 971: sealing resin
31, 140A: internal through hole
32: frame member
33: unnecessary resin part
40, 130: release film
140: resin frame member
200, 900: upper die
201, 340, 602, 702, 902, 1030: elastic member
202, 940: upper die base plate
203: upper die air blocking member
204A, 204B, 303: O-ring
205: hole in upper die
210, 920: upper cavity frame member
220, 901: upper cavity
230, 910: upper cavity upper surface member
300, 700: lower die
301, 730: lower die base plate
302: lower die outdoor air blocking member
304, 950: resin passage
305, 960: port
306, 970: plunger
310, 701: lower cavity
320: lower cavity block
330: board pin
331: substrate positioning unit
500: first shaping module
500A: Die module for compression molding
550: extruded pin
600, 600B: substrate support member (upper die)
601, 1001: cavity
603: air passage
604: air hole
610: communication absence
620: cavity top and frame member
630, 930: convex member
640: plate member
650: high pressure gas source
710: lower cavity lower surface member
711: sliding hole
720: lower cavity frame member
800: second shaping module
1000: substrate support member (lower die)
1010: Absence of cavity lower surface
1020: cavity frame member
1040: base member
1100: substrate transfer mechanism
1100A: substrate inversion mechanism
X, Y: arrows

Claims (2)

As a resin sealing device for resin-sealing a double-sided board,
And a compression molding die including an upper die and a lower die,
The upper die is a space in which gas is supplied from a high-pressure gas source, and a space in which the upper surface of the double-sided mounting substrate is exposed during compression molding is formed,
Wherein the lower die includes a cavity lower surface member and a cavity frame member. As a resin sealing method for resin sealing a double-sided board,
While the double-sided mounting substrate is clamped by the upper and lower dies of the compression molding die, while gas is supplied from a high-pressure gas source to a space formed in the upper die so that the upper surface of the double-sided mounting substrate is exposed, the A resin sealing method, characterized in that compression molding is performed using a resin supplied to a cavity constituted by a cavity lower surface member and a cavity frame member of a lower die.

Images