CN102626975A - Mould, thermoplastic resin sealing electronic base plate and manufacturing method thereof - Google Patents
Mould, thermoplastic resin sealing electronic base plate and manufacturing method thereof Download PDFInfo
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- CN102626975A CN102626975A CN2012100234768A CN201210023476A CN102626975A CN 102626975 A CN102626975 A CN 102626975A CN 2012100234768 A CN2012100234768 A CN 2012100234768A CN 201210023476 A CN201210023476 A CN 201210023476A CN 102626975 A CN102626975 A CN 102626975A
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Abstract
The invention provides a mould, a thermoplastic resin sealing electronic base plate and a manufacturing method thereof. The mould can restrain the transformation of an electronic base plate and poor filling in a process of sealing the electronic base plate by using thermoplastic resin injection forming. The electronic base plate can be sealed by using thermoplastic resin injection forming and the mould. The mould comprises a) a pouring gate arranged on a front surface of the electronic base plate; b) a recess I used for forming a guide part on a back surface of the electronic base plate; c) a supply path used for communicating the pouring gate with the recess I; d) a recess II used for communicating with the supply path and the recess I on the surface of the electronic base plate and used for forming a covering part which has a wall thickness thinner than the guide part and is located on the surface of the electronic base plate; and e) a supporting body which is arranged on the back surface of the electronic base plate and is capable of abutting against and separating with the back surface of the electronic base plate, the support body and the back surface of the electronic base plate being abutting to support the electronic base plate.
Description
Technical field
The mould that the present invention relates to be used to utilize the injection molded that adopts thermoplastic resin to come the sealed electrical submounts, make the manufacturing approach and the thermoplastic resin sealed electrical submounts of thermoplastic resin sealed electrical submounts by the injection molded that adopts thermoplastic resin.
Background technology
In order to protect the various electric substrates such as electric substrate of vehicle mounted, thermoplastic resin is sealed this electric substrate as encapsulant with the mode that the whole bag of above-mentioned electric substrate is entered, the electric substrate after the sealing is used as the sealed electrical submounts.
Manufacturing approach as the sealing electric substrate; Consider that the molten thermoplastic resin can cause damage to electric substrate when sealing; Employing is known as the method for hot melt molding (hotmelt moulding), and this method is under low pressure injected low viscous molten thermoplastic resin (patent documentation 1) in mould.
Yet; In the hot melt molding method, need to use the lower thermoplastic resin of melt viscosity; Big limitations the range of choice of encapsulant, under low pressure in mould, inject the molten thermoplastic resin, therefore, have that forming period is long, the manufacturing cost of sealed electrical submounts is than problems such as height.Therefore, the encapsulating method of a kind of range of choice that increases encapsulant of desire exploitation, the electric substrate that undertaken by the higher injection molded method of production efficiency.
Patent documentation 1: TOHKEMY 2010-131966 communique
Yet,, therefore, have the impaired and easily deformable problem of electric substrate that makes owing under the situation of utilizing injection molded sealed electrical submounts, utilize high pressure that the molten thermoplastic resin is injected in the mould moment.In addition, for the surface of sealed electrical submounts fully, need separate from electric substrate at the supporting mass that the stage of in mould, having filled thermoplastic resin to a certain degree is used at mould internal support electric substrate.Yet, in injection molded,, therefore be difficult to control the separation opportunity of supporting mass because moment has been injected thermoplastic resin in mould.Therefore, thermoplastic resin is filled into supporting mass around after make under supporting mass and the situation that electric substrate separates, the filling thermoplastic resin not at the position of supporting mass and electric substrate butt produces the filling condition of poor thereby exist.
Summary of the invention
The present invention makes in order to solve above problem; Its purpose is; Mould is provided, adopts encapsulating method and the thermoplastic resin sealed electrical submounts that utilize to adopt the encapsulating method of the electric substrate of this mould to produce of the electric substrate of this mould, distortion when this mould can suppress to utilize the injection molded that adopts thermoplastic resin to come the sealed electrical submounts, electric substrate and fill bad generation.
The inventor conscientiously studies in order to solve above-mentioned problem repeatedly, and its result finds, uses the injection molded of thermoplastic resin to come the sealed electrical submounts through adopting following mould and utilization, thereby solves above-mentioned problem, so that accomplish the present invention, this mould comprises:
A) cast gate, it is located at the front surface side of electric substrate;
B) recess I, it is used on the back surface of electric substrate, forming guide portion;
C) feed path, it is used to be communicated with cast gate and recess I;
D) recess II, it is connected with feed path and recess I on the surface of electric substrate, and is used on the surface of electric substrate, forming the covering part that wall thickness is thinner than guide portion;
E) supporting mass, its be located at electric substrate back face side, can and separate with the back surperficial butt of electric substrate, the back surperficial butt of this supporting mass and electric substrate supports electric substrate.More particularly, the present invention provides following structure.
(1) have following (a)～(e), be used to utilize the injection molded that adopts thermoplastic resin to come the mould of sealed electrical submounts:
A) cast gate, it is located at the front surface side of above-mentioned electric substrate;
B) recess I, it is used on the back surface of above-mentioned electric substrate, forming guide portion;
C) feed path, it is used to be communicated with above-mentioned cast gate and above-mentioned recess I;
D) recess II, it is connected with above-mentioned feed path and above-mentioned recess I on the surface of above-mentioned electric substrate, and is used on the surface of above-mentioned electric substrate, forming the covering part that wall thickness is thinner than guide sections;
E) supporting mass, its be located at above-mentioned electric substrate back face side, and can and separate with the back surperficial butt of above-mentioned electric substrate, the back surperficial butt of this supporting mass and above-mentioned electric substrate supports above-mentioned electric substrate.
(2) according to (1) described mould; Above-mentioned feed path is to be connected with above-mentioned recess I via side surface from the front surface of above-mentioned electric substrate and to form with the surperficial contacted mode of above-mentioned electric substrate, and the degree of depth of above-mentioned feed path is greater than the degree of depth of above-mentioned recess II.
(3) according to (1) described mould, above-mentioned electric substrate comprises the hole portion that is used to be communicated with front surface and surface, back, and above-mentioned feed path is to form above-mentioned cast gate through above-mentioned hole portion with the mode that above-mentioned recess I is communicated with.
(4) according to (2) described mould; The degree of depth of the degree of depth of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II; The width of the width of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
(5) according to (3) described mould, the degree of depth of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the width of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
(6) according to (2) or (4) described mould, above-mentioned cast gate is being provided with a place than the side surface that comprises above-mentioned electric substrate in interior plane pattern tool side surface side at least.
(7) according to each described mould in (1)～(6); Above-mentioned supporting mass with the surface of above-mentioned electric substrate butt in have recess III; Above-mentioned recess III forms the part of above-mentioned recess I under the state of above-mentioned electric substrate and above-mentioned supporting mass butt, above-mentioned supporting mass and surface above-mentioned electric substrate butt form the part of above-mentioned recess II under the state that above-mentioned electric substrate separates at above-mentioned supporting mass.
(8) comprise following 1)～6) the manufacturing approach of thermoplastic resin sealed electrical submounts of operation:
1) above-mentioned electric substrate is loaded into be located in the mould, can with the back surperficial butt of electric substrate and the supporting mass that separates on after, make the mould matched moulds;
2) utilize injection molding machine in mould, to inject the molten thermoplastic resin from the cast gate of the front surface side of being located at electric substrate of above-mentioned mould;
3) supply with above-mentioned molten thermoplastic resin and above-mentioned molten thermoplastic resin is filled into above-mentioned recess I to above-mentioned recess I via the feed path of the recess I that is used to be communicated with above-mentioned cast gate and mould; Wherein, above-mentioned recess I is used on the back surface of above-mentioned electric substrate, forming guide portion;
4) preferentially supply with above-mentioned molten thermoplastic resin to above-mentioned recess I; And in the recess II of mould, fill above-mentioned molten thermoplastic resin; Wherein, This recess II is connected with above-mentioned feed path and above-mentioned recess I on the surface of above-mentioned electric substrate, and is used on above-mentioned electric substrate surface, forming the covering part that wall thickness is thinner than guide sections;
5) when above-mentioned recess II fills above-mentioned molten thermoplastic resin, above-mentioned supporting mass is separated from electric substrate;
6) after above-mentioned molten thermoplastic resin is solidified, make thermoplastic resin sealed electrical submounts from above-mentioned mold releasability.
(9) manufacturing approach of basis (8) described thermoplastic resin sealed electrical submounts; Above-mentioned feed path is to be connected with above-mentioned recess I via side surface from the front surface of above-mentioned electric substrate and to form with the surperficial contacted mode of above-mentioned electric substrate, and the degree of depth of above-mentioned feed path is greater than the degree of depth of above-mentioned recess II.
(10) manufacturing approach of basis (8) described thermoplastic resin sealed electrical submounts; Above-mentioned electric substrate comprises the hole portion that is used to be communicated with front surface and surface, back, and above-mentioned feed path is to form with the mode that above-mentioned recess I is communicated with via above-mentioned hole portion and with above-mentioned cast gate.
(11) manufacturing approach of basis (9) described thermoplastic resin sealed electrical submounts; The degree of depth of the degree of depth of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II; The width of the width of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
(12) manufacturing approach of basis (10) described thermoplastic resin sealed electrical submounts; The degree of depth of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II; The width of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the wall thickness of above-mentioned recess II is 1.0mm～1.5mm.
(13) according to the manufacturing approach of (9) or (11) described thermoplastic resin sealed electrical submounts, above-mentioned cast gate is being provided with a place than the side surface that comprises above-mentioned electric substrate in interior plane pattern tool side surface side at least.
(14) manufacturing approach of each described thermoplastic resin sealed electrical submounts in basis (8)～(13); Above-mentioned supporting mass with the surface of above-mentioned electric substrate butt in have recess III; Above-mentioned recess III forms the part of above-mentioned recess I under the state of above-mentioned electric substrate and above-mentioned supporting mass butt, above-mentioned supporting mass and surface above-mentioned electric substrate butt form the part of above-mentioned recess II under the state that above-mentioned electric substrate separates at above-mentioned supporting mass.
(15) according to the manufacturing approach of each described thermoplastic resin sealed electrical submounts in (8)～(14), above-mentioned thermoplastic resin is polybutylene terephthalate resin or polyphenylene sulfide.
(16) utilize the thermoplastic resin sealed electrical submounts that each described method manufactures in (8)～(15).
Adopt the present invention; Mould can be provided, adopt encapsulating method and the thermoplastic resin sealed electrical submounts that utilize to adopt the encapsulating method of the electric substrate of this mould to make of the electric substrate of this mould, distortion when this mould can suppress to utilize the injection molded that uses thermoplastic resin to come the sealed electrical submounts, electric substrate and fill bad generation.
Description of drawings
Fig. 1 is the figure of mould that observes the back face side of the 1st embodiment of the present invention from die cavity.
Fig. 2 is the figure of mould that observes the front surface side of the 1st embodiment of the present invention from die cavity.
Fig. 3 is the cutaway view of mould of the back face side of the 1st embodiment of the present invention.
Fig. 4 is the cutaway view of mould of the front surface side of the 1st embodiment of the present invention.
Fig. 5 makes the mould of mould and the front surface side of back face side carry out cutaway view mould, that in inside, be mounted with the state of electric substrate of the 1st embodiment of the present invention behind the matched moulds altogether.
Fig. 6 is to use the mould of the 1st embodiment of the present invention stereogram that make, thermoplastic resin sealed electrical submounts.
Fig. 7 is the figure of mould that observes the back face side of the 2nd embodiment of the present invention from die cavity.
Fig. 8 is the figure of mould that observes the front surface side of the 2nd embodiment of the present invention from die cavity.
Fig. 9 makes the mould of mould and the front surface side of back face side carry out cutaway view mould, that in inside, be mounted with the state of electric substrate of the 2nd embodiment of the present invention behind the matched moulds altogether.
Figure 10 is to use the mould of the 2nd embodiment of the present invention stereogram that make, thermoplastic resin sealed electrical submounts.
Figure 11 is the figure that is illustrated in the example of the electric substrate that is sealed in the mould of the 2nd embodiment of the present invention.
Figure 12 is the figure of mould that observes the front surface side of the 3rd embodiment of the present invention from die cavity.
Figure 13 makes the mould of mould and the front surface side of back face side carry out cutaway view mould, that in inside, be mounted with the state of electric substrate of the 3rd embodiment of the present invention behind the matched moulds altogether.
Figure 14 be make the mould of mould and the front surface side of back face side carry out altogether behind the matched moulds the 3rd embodiment of the present invention, and cutaway view Figure 13 different dies, that in inside, be mounted with the state of electric substrate.
Figure 15 is the stereogram of example of the supporting mass that mould had of expression the 4th embodiment of the present invention.
Figure 16 is the figure of mould that observes the back face side of the 4th embodiment of the present invention from die cavity.
Figure 17 is the figure of mould that observes the back face side of the 4th embodiment of the present invention from die cavity.
Figure 18 makes the mould of mould and the front surface side of back face side carry out cutaway view mould, that in inside, be mounted with the state of electric substrate of the 4th embodiment of the present invention behind the matched moulds altogether.
Figure 19 be expression the 4th embodiment of the present invention back face side mould, supporting mass with the electric substrate butt time the stereogram of state.
Figure 20 is the stereogram of the state when electric substrate separates mould, supporting mass of the back face side of expression the 4th embodiment of the present invention.
Figure 21 is the stereogram of the example of the supporting mass that is made up of movable part and plate-like portion of expression.
Figure 22 is embodiment 1 employed mould, be mounted with the sketch map of the state of electric substrate in inside.
Figure 23 is embodiment 2 employed moulds, be mounted with the sketch map of the state of electric substrate in inside.
The specific embodiment
Below, with reference to accompanying drawing embodiment of the present invention is described.In addition, embodiment of the present invention does not receive any qualification of following embodiment, and protection scope of the present invention is not limited by this embodiment.
In addition, in the application's detailed description of the invention and claims, " front surface " of electric substrate is meant under the situation that in mould, is mounted with electric substrate and is located at the cast gate facing surfaces in the mould.In addition, " surface, back " of electric substrate is meant the surface of a side opposite with front surface of electric substrate.
[1] the 1st embodiment
Unitary construction
At first, with reference to Fig. 1～Fig. 6 to as the 1st embodiment of the present invention, be used to utilize and use the injection molded of thermoplastic resin to come the mould 10 of sealed electrical submounts 1 to describe.
Fig. 1 is the figure that observes the mould 11 of back face side from cavity side, and Fig. 2 is the figure that observes the mould 12 of front surface side from cavity side.In addition, Fig. 3 is the cutaway view at the described A-A ' section of Fig. 1 of the mould 11 of back face side, and Fig. 4 is the cutaway view at the described A-A ' section of Fig. 2 of the mould 12 of front surface side.Fig. 5 be loaded in electric substrate 1 on the supporting mass 13 of mould 11 of back face side after, make the cutaway view in the A-A ' cross section of the mould 10 that the mould 11 of back face side forms with mould 12 matched moulds of front surface side.Fig. 6 is to use the stereogram of the thermoplastic resin sealed electrical submounts 2 that the mould 10 of the 1st embodiment makes.
As shown in Figure 5, the mould 10 of the 1st embodiment comprise following a)～e).
A) cast gate 16, and it is located at the front surface side of electric substrate 1;
B) recess I 14, and it is used on the back surface of electric substrate 1, forming guide portion 21;
C) feed path 17, and it is used to be communicated with cast gate 16 and recess I 14;
D) recess II 15, and it is connected with feed path 17 and recess I 14 on the surface of electric substrate 1, are used on the surface of electric substrate 1, forming the covering part 23 that wall thickness is thinner than guide portion 21;
E) supporting mass 13, and it is located among the recess II 15 in the mould 11 of back face side and can and separates with the back surperficial butt of electric substrate 1, and the back surperficial butt of this supporting mass and electric substrate 1 supports electric substrate 1.
Below, successively to a)～e) describing.
A) cast gate 16
Like Fig. 2, Fig. 4 and shown in Figure 5, cast gate 16 is formed on the feed path 17 of the mould 12 that is formed on the front surface side.Feed path 17 be used to be communicated with cast gate 16 with after the recess I 14 that states.Utilize injection molding machine (not shown) in mould 10, to supply with the molten thermoplastic resin via cast gate 16.Can be according to the shape of the electric substrate that is sealed 1 and suitably select the number of cast gate 16, this cast gate 16 can for one also can be for a plurality of.For the shape of cast gate 16, suitably select the shape of the common cast gate that adopts of mould that also can use from injection molded.
B) recess I 14
Like Fig. 1, Fig. 3 and shown in Figure 5, be purpose on the back surface of electric substrate 1, to form guide portion 21, recess I 14 is to be formed on the mould 11 of back face side with electric substrate 1 contacted mode.As shown in Figure 6, the thermoplastic resin that is filled in recess I 14 becomes the guide portion 21 in the thermoplastic resin sealed electrical submounts 2.In the scope that does not diminish the object of the invention, do not limit the cross sectional shape of recess I 14 is special, the cross sectional shape of above-mentioned recess I 14 can suitably be selected from arbitrary shapes such as square, rectangle, semicircle.
Recess I 14 the surface of electric substrate 1 with after the recess II 15 that states contact, the degree of depth L1 of recess I 14 is greater than the degree of depth L2 of recess II 15.Therefore, via after the feed path stated 17 supply with the molten thermoplastic resin who comes and preferentially be filled among the less recess I 14 of flow resistance, but not the bigger recess II 15 of flow resistance.Thereby, under the situation of the mould that uses the 1st embodiment, can on the back surface of electric substrate 1, form guide portion 21 after, supply with molten thermoplastic resins and form covering part 23 to recess II 15.Therefore, utilize guide portion 21 to strengthen the back surface of electric substrates 1, thus the distortion of the electric substrate 1 can suppress to utilize the injection molded that adopts thermoplastic resin to come sealed electrical submounts 1 time.
For the value of L1 and L2, as long as L1 greater than L2, does not just limit the value of L1 and L2 is special in the scope that does not diminish the object of the invention.Specifically, preferred L1 is 2 times～4 times of L2, more preferably 2.5 times～4 times.In addition, the width of recess I 14 is 2 times～4 times of L2, is preferably 3 times～4 times.Further, preferred L2 is 1.0mm～2.0mm, more preferably 1.0mm～1.5mm.Under the excessive situation of L1, the volume of recess I 14 increases, and therefore has the situation that increases the required amount of resin of sealed electrical submounts 1 and increase the manufacturing cost of thermoplastic resin sealed electrical submounts 2.Under the excessive situation of L2, the situation that existence almost disappears the difference of the flow resistance of recess I 14 and recess II 15.Under this situation, form covering part 23 after being difficult on the back surface of electric substrate 1, form guide portion 21, have the tendency of the distortion that is easy to generate the electric substrate 1 that causes by sealing.Under the too small situation of L2,, therefore there is filling thermoplastic resin's situation in recess II 15 fully because the flow resistance of recess II 15 is too high.
Under the too small situation of the difference of L1 and L2, owing to roughly side by side supply with the molten thermoplastic resin to recess I 14 and recess II15, so electric substrate 1 is easy to produce distortion.Under the excessive situation of the difference of L1 and L2,, therefore there is the situation that increases the required amount of resin of sealed electrical submounts 1 and increase the manufacturing cost of thermoplastic resin sealed electrical submounts 2 because the volume of recess I 14 increases.
In addition, L1 is the distance between the surface of surface and recess I 14 of electric substrate 1, is along the distance of the maximum of the direction detection vertical with this surface from the surface of electric substrate 1.In addition, L2 is the distance between the surface of surface and recess II 15 of electric substrate 1, is along the distance of the direction detection vertical with this surface from the surface of electric substrate 1.
C) feed path 17
Like Fig. 1, Fig. 3 and shown in Figure 5, feed path 17 can be communicated with cast gate 16 to the mode that recess I 14 supplies with the molten thermoplastic resin from cast gate along side surface with the front surface from electric substrate with recess I 14.As shown in Figure 6, the thermoplastic resin that is filled in feed path 17 becomes the supply unit 22 in the thermoplastic resin sealed electrical submounts 2.In the scope that does not diminish the object of the invention, do not limit the cross sectional shape of feed path 17 is special, the cross sectional shape of this feed path 17 can suitably be selected the shape from square, rectangle, semicircle etc. arbitrarily.
In addition, feed path 17 with after the recess II 15 that states contact in the surface of electric substrate 1, the degree of depth L3 of feed path 17 is greater than the degree of depth L2 of recess II 15.For the value of L3 and L2, as long as L3 greater than L2, does not limit the value of L3 and L2 is just special in the scope that does not diminish the object of the invention.Specifically, preferred L3 is 2 times～4 times of L2, more preferably 2.5 times～4 times.In addition, the width of preferred recess I 14 is 2 times～4 times of L2, more preferably 3 times～4 times.In addition, preferred L2 is 1.0mm～2.0mm, more preferably 1.0mm～1.5mm.Under the excessive situation of L3, the volume of feed path 17 increases, and therefore has the situation that increases the required amount of resin of sealed electrical submounts 1 and increase the manufacturing cost of thermoplastic resin sealed electrical submounts 2.Under the excessive situation of L2, the situation that existence almost disappears the difference of the flow resistance of feed path 17 and recess II 15.In this case, be difficult on the back surface of electric substrate 1, form guide portion 21 backs and form covering part 23, have the tendency of the distortion that is easy to generate the electric substrate 1 that causes by sealing.
In addition; Under the too small situation of the difference of L3 and L2; Owing to roughly supply with the molten thermoplastic resin to feed path 17 with recess II 15 simultaneously; Therefore can not supply with the molten thermoplastic resin fully to the back surface of electric substrate earlier, so resin pressure is applied to significantly on the upper surface of electric substrate, thereby electric substrate 1 is easy to produce distortion.Under the excessive situation of the difference of L3 and L2, the volume of feed path 17 increases, and therefore has the situation that increases the required amount of resin of sealed electrical submounts 1 and increase the manufacturing cost of thermoplastic resin sealed electrical submounts 2.
Through constituting feed path 17 and recess II 15 with the above-mentioned degree of depth; Thereby the molten thermoplastic resin who supplies with from cast gate is preferentially flow in the less feed path of flow resistance 17, and preferentially the recess I in the mould 11 that is formed on the back face side 14 supplies with the molten thermoplastic resin.
Therefore, can on the back surface of electric substrate 1, be formed with guide portion 21 after, fill molten thermoplastic resins and form covering part 23 to recess II 15.Under the situation of the mould 10 that uses the 1st embodiment, utilize molten thermoplastic resin's the action of should flowing, electric substrate 1 distortion just can be utilized adopt the injection molded of thermoplastic resin to come sealed electrical submounts 1.
D) recess II 15
Like Fig. 1～shown in Figure 5, in the mould 11 of back face side, recess II 15 is to form with recess I 14 adjacent modes, and this recess II15 is to form with feed path 17 adjacent modes in the mould 12 of front surface side.As shown in Figure 6, the thermoplastic resin that is filled among the recess II 15 becomes the covering part 23 in the thermoplastic resin sealed electrical submounts 2.
E) supporting mass 13
Supporting mass 13 is located in the mould 11 of back face side, can and separate with the back surperficial butt of electric substrate 1, and this supporting mass 13 supports electric substrate 1 with the back surperficial butt of electric substrate 1.As long as can support electric substrate 1, the position of supporting mass 13 in the mould 11 of back face side is not limited especially, the typical case like Fig. 1 and shown in Figure 5, is located at supporting mass 13 among the recess II15 in the mould 11 of back face side.When the molten thermoplastic resin is filled into half left and right sides among recess I 14, play the molten thermoplastic resin when arriving supporting mass 13 during in, make the back surface isolation of supporting mass 13 from electric substrate 1.Through supporting mass 13 is separated from electric substrate 1, thereby can resin fully be filled among the recess II 15.
Be used at the mould that will not have recess I 14 under the situation of sealing of electric substrate 1,, therefore, be difficult to control the opportunity of supporting mass 13 of making from the back surface isolation of electric substrate 1 because the molten thermoplastic resin is filled into the back surface of electric substrate 1 at a heat.Therefore, under the situation of using this mould, because the delay of the separation of supporting mass 13, the existence acquisition is formed with the situation as the thermoplastic resin sealed electrical submounts 2 in the hole of the vestige of supporting mass 13 on the surface, back.
On the other hand; Adopt the mould of the 1st embodiment; Because the difference of the degree of depth L 1 of recess I 14 and the degree of depth L2 of recess II 15; Produce difference between molten thermoplastic resin's among molten thermoplastic resin's in recess I 14 flow resistance and the recess II 15 the flow resistance, thereby the molten thermoplastic resin is filled among the recess II15 more behindhand.Therefore, come under the situation of sealed electrical submounts 1 at the mould that uses the 1st embodiment, it is longer that the molten thermoplastic resin arrives supporting mass 13 required times, makes the opportunity of supporting mass 13 from the back surface isolation of electric substrate 1 thereby be very easy to control.
As long as can support electric substrate 1, do not limit the shape of supporting mass 13 is special, but in order to make supporting mass 13 be easy to move swimmingly with electric substrate 1 butt or when separating, preferably this supporting mass 13 is cylindric.
Adopt the 1st embodiment of above explanation; The distortion of the electric substrate 1 in the time of can suppressing to utilize the injection molded that adopts thermoplastic resin to come sealed electrical submounts 1; Be easy to control the opportunity of supporting mass 13 of making, can suppress to fill bad generation from the back surface isolation of electric substrate 1.
[2] the 2nd embodiments
Below, with reference to Fig. 7～Figure 10 the mould of the 2nd embodiment is described.Fig. 7 is the figure that observes the mould 11 of back face side from cavity side, and Fig. 8 is the figure that observes the mould 12 of front surface side from cavity side.In addition, Fig. 3 is the cutaway view of A-A ' section shown in Figure 1 of the mould 11 of back face side, and Fig. 4 is the cutaway view of A-A ' section shown in Figure 2 of the mould 12 of front surface side.Fig. 9 be on the supporting mass 13 of mould 11 that electric substrate 1 is loaded into the back face side after, make cutaway view mould 10 that the mould 11 of back face side forms with mould 12 matched moulds of front surface side, Fig. 7 and A-A ' section shown in Figure 8.Figure 10 is to use mould 10 stereograms that make, thermoplastic resin sealed electrical submounts 2 of the 2nd embodiment.
Like Fig. 7～shown in Figure 9, the mould of the 2nd embodiment is identical at the mould with the 1st embodiment except following 2, that is, the mould of the 2nd embodiment is used in has the sealing that is used to be communicated with front surface and the electric substrate 1 of the hole portion 18 on surface, back; Feed path 17 forms via hole portion 18 cast gate 16 is communicated with the mode of getting up with recess I 14.
As shown in Figure 9, cast gate 16 be arranged in the hole portion 18 that is formed on electric substrate 1 near.Utilization is communicated with cast gate 16 and recess I 14 as the feed path 17 of the inner space of the hole portion 18 of electric substrate 1.In Fig. 9, be illustrated in the state that is provided with a hole portion 18 as the centre of the electric substrate under the cast gate 16 1, but in the scope that does not diminish the object of the invention, to not special qualification of quantity of the hole portion 18 that is located at electric substrate 1.For example; In thermoplastic resin sealed electrical submounts 2; Under the situation of the guide portion 21 that is formed with the cross shape that intersects in the center on surface, back on the back surface of electric substrate 1; Shown in figure 11, preferably the corresponding position, the position with being formed with guide portion 21 in electric substrate 1 forms a plurality of hole portion 18.Owing to using under the situation of this electric substrate 1, can be apace supply with molten thermoplastic resins, the distortion of the electric substrate 1 when being easy to suppress to seal that therefore becomes to the recess I 14 on the back surface of electric substrate 1.
Under the situation of the mould that adopts the 2nd embodiment, after the molten thermoplastic resin was filled into recess I 14, the molten thermoplastic resin was filled into the recess II 15 of the back face side of electric substrate 1.In addition, after the molten thermoplastic resin is filled into recess I 14, the recess II 15 that the molten thermoplastic resin is filled into the front surface side of electric substrate 1 via the space and/or the space between cast gate 16 and the electric substrate 1 of the periphery of electric substrate 1.
Adopt the 2nd embodiment, the bigger feed path of volume 17 need be set on mould, therefore, can reduce the amount of resin that is used for sealed electrical submounts 1.Therefore, adopt the 2nd embodiment, the distortion of the electric substrate 1 in the time of can suppressing to seal and expectation reduce the manufacturing cost of thermoplastic resin sealed electrical submounts 2.
[3] the 3rd embodiments
Below, with reference to Figure 12, Figure 13 the mould of the 3rd embodiment is described.Figure 12 is the figure of mould that observes the front surface side of the 3rd embodiment of the present invention from die cavity.Figure 13 makes the mould of mould and the front surface side of back face side carry out the cutaway view under state mould, be mounted with electric substrate in inside of the 3rd embodiment of the present invention behind the matched moulds altogether.
Like Figure 12, shown in Figure 13, the mould of the 3rd embodiment except cast gate 16 is located at than the side surface of above-mentioned electric substrate 1 in the outer part this some the mould with the 1st embodiment identical.
Like Figure 12, shown in Figure 13, the side surface that cast gate 16 is positioned at than comprises electric substrate 1 the position of plane pattern tool side surface side.In Figure 12, Figure 13, be illustrated in flow direction that makes the molten thermoplastic resin who supplies with from cast gate 16 and the side surface that comprises electric substrate 1 are provided with cast gate 16 in interior parallel plane position state; But shown in figure 14, also cast gate 16 can be set on the side surface of electric substrate 1.Through cast gate 16 being set, thereby suppress the molten thermoplastic resin and the surperficial direct collision of electric substrate 1 that supply with from cast gate 16 in this position, so the distortion of the electric substrate 1 when being easy to suppress to seal.In addition, under above-mentioned situation, consider the balance between supply and demand of the resin of supplying with to die cavity, preferably be provided with a plurality of cast gates.
In addition, in the mould of the 3rd embodiment, also can be provided with cast gate 16 in a plurality of positions.For example; If with the surperficial relative position of electric substrate 1 (for example; Position shown in Figure 2) and this two place, the position of the cast gate in the 3rd embodiment 16 be provided with cast gate 16; The shared well molten thermoplastic resin of balance on the back surface of the surface of electric substrate 1 and electric substrate 1 then, thereby the distortion of the electric substrate 1 when being easy to suppress to seal.
[4] the 4th embodiments
Below, with reference to Figure 15～Figure 20 the mould of the 4th embodiment is described.Figure 15 is the stereogram about the concrete example of the supporting mass that mould had 13 of the 4th embodiment.Figure 16 is the figure that observes the mould 11 of the back face side with supporting mass 13 from cavity side, this supporting mass 13 with the face of electric substrate 1 butt on have cross groove.Figure 17 is the figure that observes the mould 11 of the back face side with supporting mass 13 from cavity side, this supporting mass 13 with the face of electric substrate 1 butt on have the groove of linearity.Figure 18 is the cutaway view of A-A ' section under the state behind mould 11 matched moulds of the mould 12 that loads electric substrate 1 on the mould 11 of back face side shown in Figure 16 and make front surface side shown in Figure 4 and back face side shown in Figure 16, shown in Figure 16.Figure 19 is the stereogram of the state of supporting mass 13 in the mould 11 of expression back face side shown in Figure 16, supporting mass 13 during with electric substrate 1 butt.Figure 20 is the stereogram that makes the state of supporting mass 13 when electric substrate 1 separates in the mould 11 of expression back face side shown in Figure 16, supporting mass 13.
The mould of the 4th embodiment comprises supporting mass 13; This supporting mass 13 with the face of electric substrate 1 butt in have recess III 19; Recess III 19 is in the state of electric substrate 1 and the supporting mass 13 butts part of formation recess I 14 down, and supporting mass 13 and face electric substrate 1 butt form the part of recess II 15 under the state that electric substrate 1 separates at supporting mass 13.For example; Being shaped as under that kind shown in Figure 6 has cross guide portion 21 in the back face side of electric substrate 1 the situation of shape of thermoplastic resin sealed electrical submounts 2; For example; Shown in figure 15, can be employed in the supporting mass 13 that is provided with the groove of linearity, cross groove with the face of electric substrate 1 butt and is formed with recess III19.
In the scope that does not diminish the object of the invention, do not limit the shape of the recess III19 in the supporting mass 13 is special.Specifically, like Figure 16 and shown in Figure 17, preferably make the side surface of recess I 14 and the side surface of recess III 19 in the mould 11 of back face side, become continuous face.
In addition, recess I 14 and recess III 19 can be continuous face, also can be discontinuous.The typical case; Like Figure 18 and shown in Figure 19; Preferred so that the inner surface of the inner surface of recess III 19 and recess I 14 forms continuous face and make recess III 19 constitute the mode of the part of recess I 14, the mould 11 of supporting mass 13 face side from the back is given prominence to and supporting electric substrate 1.Under this state, support electric substrates 1 through making supporting mass 13, thereby preferentially supply with the thermoplastic resin of molten conditions and form guide portion 21, and can in recess I and recess II, supply with thermoplastic resin to recess I 14.The generation of the distortion of the electric substrate 1 in the time of therefore, can suppressing to seal.
In addition, shown in figure 20, supporting mass 13 after filling thermoplastic resin in recess I so that face supporting mass 13 and electric substrate 1 butt forms the mode of the part of recess II separates from electric substrate 1.Therefore; Adopt the mould of the 4th embodiment; Through this supporting mass 13 being separated before solidifying from electric substrate 1 being filled near the supporting mass 13 thermoplastic resin, thus can not cause fill bad just can be in recess II filling thermoplastic resin and form covering part 23.
In the mould of the 4th embodiment, can utilize a few supporting mass 13 at mould internal support electric substrate 1, therefore, can suppress the cacoplastic generation that causes by the bad grade of the action of supporting mass 13.
[5] the 5th embodiments
Below, the manufacturing approach of the thermoplastic resin sealed electrical submounts of the 5th embodiment is described.In the 5th embodiment, adopt the mould of the 1st embodiment, utilize injection molded to use thermoplastic resin to come the sealed electrical submounts.At first, electric substrate that is sealed and the thermoplastic resin that is used to seal are described, next, each operation included to the manufacturing approach of thermoplastic resin sealed electrical submounts describes.
Electric substrate
The electric substrate that in the 5th embodiment, is sealed mainly is the electric substrate that in the past was used for the manufacturing of electric components, electronic component, and to its not special qualification, this electric substrate can be a single layer substrate, also can be multilager base plate.In addition, can on the surface of electric substrate, electronic component be installed, also electronic component can be installed not.
The material of
electric substrate if in the scope of not decreasing the object of the invention just not special the qualification, can suitably select from being used organic material, inorganic material or their composite as the material of existing electric substrate.As the object lesson of the suitable material of electric substrate, can enumerate out epoxy resin, bismaleimide-triazine resin, cyanate ester resin, polyparaphenylene Ben Bing Er oxazole resin, polyamide, polyimide resin, liquid-crystalline polymer, polyether-ether-ketone resin, polyether ketone resin or their resins such as combination.When the material of electric substrate was resin, these resins preferably contained fibers such as glass fibre, high resiliency resin fibre, carbon fiber or metallic fiber.In this case, fibrous material is preferably weaved cotton cloth or the form of nonwoven.
As long as can distinguish with mould water the suitable front surface of oral-lateral and in mould with the back surface of supporting mass butt, do not limit the shape of electric substrate is special, this electric substrate can be the combined shaped of plane, curved surface shape or above-mentioned shape.
The thickness of the electric substrate that is sealed in the present invention suitably determines according to application target.Under the thin situation of substrate, the situation of the distortion when existence can not suppress to seal fully.
Thermoplastic resin
Do not limit as long as the thermoplastic resin that in the 5th embodiment, uses is can injection molded just special, can be according to the purposes of the electric substrate that is sealed with environment for use and suitably selection.The thermoplastic resin that is used for the sealing of electric substrate can use any crystalline resin and non-crystalline resin.As object lesson, can enumerate out thermoplastic resin commonly used such as polyolefin (polyethylene (PE), polypropylene (PP), gather 4-methyl-amylene-1, gather cyclic olefin etc.), polystyrene (PS), AS resin, ABS resin, polyvinyl chloride (PVC), polyacrylonitrile (PAN), (methyl) acrylic resin, cellulose-based resin, elastomer; Fatty polyamide (nylon 6, nylon 6; 6, nylon 12, nylon 6,12 etc.), aromatic polyamide (MXD nylon etc.), aromatic polyester resins (pet resin (PET), polybutylene terephthalate (PBT) resin (PBT), PBN resin (PEN) etc.), Merlon (PC), polyacetals (POM), polyphenylene oxide resin (PPE), poly arylidene thio-ester (PAS) (polyphenylene sulfide (PPS) etc.), polysulfones (PSu), polyimides (PI), liquid-crystalline polymer (LCP) (liquid crystal polyester, liquid crystal polyester acid amides, liquid crystal polyamide etc.) engineering plastics; The monomer polycondensation that to from the group of forming by aliphatic dicarboxylic acid, aliphatic diol and aliphatic hydroxyl carboxylic acid or its cyclic compound, select and the aliphatic polyester that obtains, the Biodegradable resins such as aliphatic polyester that quantize through macromolecules such as vulcabond.It is two or more that these thermoplastic resins can make up use.
Among above-mentioned thermoplastic resin, preferred especially polybutylene terephthalate resin or polyphenylene sulfide.Because polyphenylene sulfide has good high-fire resistance, mechanical-physical character, drug resistance, dimensional stability and anti-flammability etc.; Polybutylene terephthalate resin has good high mechanical-physical character, electric physical property, drug resistance etc.; Therefore, can in the electric substrate seal process, suitably use above-mentioned substance.
In order to realize improveing the purposes such as mechanical property of formed products, thermoplastic resin can mix with packing material mutually.In the scope that does not diminish the object of the invention to not special qualification of kind of the packing material that mixes mutually with thermoplastic resin; The various packing materials that in the past are used as the packing material of macromolecular material can be used, in inorganic filling material and the organic filler material any can be used.In addition, in the scope that does not diminish the object of the invention, the shape of filling material is not limited, can suitably use in fibrous packing material, powder shape packing material and the tabular packing material any.
As preferred fibrous packing material, for example enumerate the inorganic fibrous materials such as fibrous material of metals such as glass fibre, asbestos fibre, silicon dioxide fibre, silica alumina fiber, alumina fibre, Zirconium oxide fibre, boron nitride fiber, silicon nitride fiber, boron fibre, potassium titanate fibre and stainless steel, aluminium, titanium, copper, brass.
As preferred powder shape packing material; For example, enumerate sulfate and ferrite in addition, carborundum, silicon nitride, the boron nitride of the such metal of carbonate, for example calcium sulfate, the barium sulfate of the such metal of oxide, for example calcium carbonate, the magnesium carbonate of the such metal of carbon black, graphite, silica, quartz powder, bead, felting glass fibre, glass microballoon, glass dust, for example calcium silicates, alumina silicate, kaolin, talcum, clay, diatomite, wollastonite such silicate, for example iron oxide, titanium oxide, zinc oxide, antimony trioxide, aluminium oxide, various metal dusts etc.In addition, as preferred tabular packing material, enumerate mica, sheet glass, various metal formings etc.
Among above-mentioned packing material, the good viewpoint of balance from the physical property of first formed products of cost and acquisition especially preferably adopts glass fibre.
As glass fibre; Can preferably use any known glass fibre, the length of the kind of this glass fibre not by glass fiber diameter, cylinder, cocoon shape cross section, oval cross section prismatic shapes or when being used to make chopped strand, rove (roving) etc., the method for glass-cutting limit.In the present invention, to not special qualification of kind, but in order ensuring the quality of products, preferably to use E glass, in component, to contain the corrosion-resistant glass of zr element as the glass of the raw material of glass fibre.
In addition, for the matrix that improves thermoplastic resin and the interface characteristic of packing material, the preferred use utilizes organic agents such as silane compound, epoxide to carry out the surface-treated packing material.Any of known silane compound, epoxide be can preferably use as the silane compound that is used for this packing material, epoxide, the surface-treated silane compound of packing material, the kind of epoxide are not limited to be used in the present invention.
In the scope that does not diminish the object of the invention, the use amount of packing material is not limited; The typical case; Thermoplastic resin with respect to 100 mass parts; Preferred this packing material is 5 mass parts～120 mass parts, and more preferably 10 mass parts～100 mass parts are preferably 15 mass parts～80 mass parts especially.
In addition, as required, thermoplastic resin can further add and use anti-oxidant, heat-resisting stabilizing agent, ultra-violet absorber, antistatic additive, dyestuff, pigment, lubricant, releasing agent, crystallization promoter, crystallization nucleating agent etc.
The manufacturing approach of thermoplastic resin sealed electrical submounts
The manufacturing approach of the thermoplastic resin sealed electrical submounts of the 5th embodiment comprises the 1st following operation～the 6th operation.
1) electric substrate 1 is loaded into be arranged in the mould 10, can with the back surperficial butt of electric substrate 1 and the supporting mass 13 that separates on after, make mould 10 matched moulds;
2) utilize injection molding machine, in mould 10, inject the molten thermoplastic resin from the cast gate 16 of the front surface side that is located at electric substrate 1 of mould 10;
3) supply with the molten thermoplastic resin via feed path 17 to the recess I 14 of mould; The molten thermoplastic resin is filled among the recess I 14; Wherein, this feed path 17 is used to be communicated with cast gate 16 and this recess I 14 that is used on the back surface of electric substrate 1, forming guide portion 21;
4) after the molten thermoplastic resin being filled among the recess I 14; Recess II 15 to mould fills the molten thermoplastic resin; Wherein, This recess II 15 is connected with feed path 17 and recess I 14 on the surface of electric substrate 1, and is used on the surface of electric substrate 1, forming the covering part 23 that wall thickness is thinner than guide portion 21;
5), supporting mass 13 is separated from electric substrate 1 when recess II 15 fills the molten thermoplastic resin;
6) after the molten thermoplastic resin is solidified, make thermoplastic resin sealed electrical submounts 2 from mould 10 demouldings.
Below, with reference to Fig. 5 and Fig. 6 the 1st operation～the 6th operation is described.
The 1st operation
The 1st operation electric substrate 1 is loaded into be arranged in the mould 10, can with the back surperficial butt of electric substrate 1 and the supporting mass 13 that separates on after make the operation of mould 10 matched moulds.
As shown in Figure 5; Electric substrate 1 is being loaded into 13 last times of supporting mass, in mould 10 so that the degree of depth L3 of the degree of depth L2 of the degree of depth L1 of recess I 14, recess II 15, feed path 17 be setting mode, make supporting mass 13 mould 11 of face side from the back recess II 15 outstanding and with the back surperficial butt of electric substrate 1.After the assigned position of mould 11 that electric substrate 1 is loaded in the back face side, make the mould 12 of mould 11 and the front surface side of electric substrate 1 of the back face side of electric substrate 1 carry out matched moulds altogether.
The 2nd operation
The 2nd operation is to utilize the cast gate 16 of injection molding machine (not shown) from the mould 12 of the front surface side that is located at electric substrate 1 injection molten thermoplastic resin's in the mould 10 that mould 12 matched moulds by the mould 11 of back face side and front surface side form operation.
The injection molded condition in the 2nd operation is not limited especially, can be according to the kind of employed thermoplastic resin and suitably determine this injection molded condition.
The 3rd operation
The 3rd operation is via being used for being communicated with cast gate 16 is filled into recess I 14 with the feed path 17 of the recess I 14 of electric substrate 1, to recess I 14 supply molten thermoplastic resins and with the molten thermoplastic resin operation.The molten thermoplastic resin is filled among the recess I 14, and that kind as shown in Figure 6 forms guide portion 21 on the back surface of electric substrate 1.In addition, as shown in Figure 6, the thermoplastic fusion resin in the feed path 17 becomes the supply unit 22 of the front surface of electric substrate 1.The distortion of the electric substrate 1 when supply unit 22 also likewise is used to suppress to seal with guide portion 21.
As the explanation that the mould to the 1st embodiment carries out; Can satisfy prescribed relationship through the degree of depth L1 that in mould 10, makes recess I 14, the degree of depth L2 of recess II 15 and the degree of depth L3 of feed path 17, thereby preferentially supply with the molten thermoplastic resin to recess I14 via feed path 17.Therefore, form covering part 23 after can on the back surface of electric substrate 1, being formed with guide portion 21, the distortion of the electric substrate 1 in the time of therefore can suppressing to seal.
The 4th operation
The 4th operation be in the 3rd operation, begin after recess I 14 fills molten thermoplastic resins, preferentially to recess I 14 supply with molten thermoplastic resins and in recess II 15 filling thermoplastic resin's operation, this recess II 15 is connected with feed path 17 and recess I 14 on the surface of electric substrate 1.The molten thermoplastic resin is filled among the recess II 15, as shown in Figure 6, on the front surface of electric substrate 1 and surface, back, form the covering part 23 that wall thickness is thinner than guide portion 21 and supply unit 22.
In order to utilize thermoplastic resin that the back surface of electric substrate 1 is sealed fully; When injection molded; In the moment from molten thermoplastic resin to a certain degree to the back surface of electric substrate 1 that supplied with, need make the back surface isolation of the supporting mass 13 on the back surface of supporting electric substrate 1 from electric substrate 1.
Adopt the method for the 5th embodiment; As the explanation that the mould to the 1st embodiment carries out; The degree of depth L 1 that utilizes recess I 14 is poor with the degree of depth L2's of recess II 15; There is difference between molten thermoplastic resin's among molten thermoplastic resin's in recess I 14 flow resistance and the recess II 15 the flow resistance, thereby the molten thermoplastic resin is filled among the recess II 15 more behindhand.Therefore, adopt the method for the 5th embodiment, it is longer that the molten thermoplastic resin arrives supporting mass 13 required times, can control the opportunity of supporting mass 13 from the back surface isolation of electric substrate 1 of making easily.
Adopt the 5th embodiment of above explanation; The distortion of the electric substrate 1 in the time of can likewise being suppressed at the injection molded that utilize to adopt thermoplastic resin and coming sealed electrical submounts 1 with the 1st embodiment; The opportunity of supporting mass 13 of making can be easily controlled, bad generation can be suppressed to fill from the back surface isolation of electric substrate 1.
The 5th operation
The 5th operation is the operation that supporting mass 13 is separated when recess II 15 fills the molten thermoplastic resin from electric substrate 1.When on the surface of electric substrate 1, forming covering part 23, can separate from electric substrate 1 through making supporting mass 13, thereby utilize thermoplastic resin also to cover the contact-making surface of supporting mass 13 and electric substrate 1 to recess II 15 filling thermoplastic resins.
The 6th operation
The 6th operation is in the die cavity of mould 10, to make thermoplastic resin solidify afterwards, make the operation of thermoplastic resin sealed electrical submounts 2 from mould 10 demouldings.Make thermoplastic resin sealed electrical submounts 2 from the not special qualification of the method for mould 10 demouldings.For example, can utilize usual method, after the mould 12 of mould 11 that mould 10 is divided into the back face side and front surface side, use jemmy and 2 demouldings of thermoplastic resin sealed electrical submounts.
[6] the 6th embodiments
The manufacturing approach of the thermoplastic resin sealed electrical submounts of the 6th embodiment manufacturing approach with the thermoplastic resin sealed electrical submounts of the 5th embodiment except the mould that adopts the 2nd embodiment is identical.
Adopt the 6th embodiment, need the bigger feed path of volume 17 likewise be set on mould, therefore can reduce the amount of resin that is used for sealed electrical submounts 1 with the 2nd embodiment.Therefore, adopt the 6th embodiment, the distortion of the electric substrate 1 in the time of can expecting to suppress to seal, and the manufacturing cost of reduction thermoplastic resin sealed electrical submounts 2.
[7] the 7th embodiments
The manufacturing approach of the thermoplastic resin sealed electrical submounts of the 7th embodiment is adopting outside the mould of the 4th embodiment the manufacturing approach with the thermoplastic resin sealed electrical submounts of the 5th embodiment identical.
Adopt the 7th embodiment, owing to can utilize a few supporting mass 13, therefore, can likewise suppress the cacoplastic generation that causes by the bad grade of the action of supporting mass 13 with the 4th embodiment at mould internal support electric substrate 1
Variation
The present invention is not limited to the 1st above-mentioned embodiment～the 7th embodiment, and the distortion of in the scope that can reach the object of the invention, carrying out, improvement etc. are included among the present invention.
Though it is cross being shaped as of the 1st embodiment and the 5th embodiment center dant I 14 and feed path 17; Cross being shaped as of the 2nd embodiment and the 5th embodiment center dant I14, but the shape of recess I 14 and/or feed path 17 also can be grid type or honeycomb type.Can expect to be higher than cross stiffening effect, the distortion of the electric substrate in the time of can further suppressing to seal through making recess I 14 and/or being shaped as above-mentioned shape of feed path 17.
Though in the 1st embodiment～the 7th embodiment; Mould 10 is to be divided into the mould 11 of back face side and mould 12 these two-part moulds of front surface side, but the mould 12 of the mould 11 of back face side and front surface side also can further be divided into the quantity of expectation.Through the mould 11 of face side after making and the mould 12 formation said structures of front surface side, even also can seal this electric substrate 1 for the electric substrate 1 of complicated shape.
Variation 3
Though in the 1st embodiment～the 7th embodiment; Columned supporting mass 13 has been described; But in the 1st embodiment～the 7th embodiment; Shown in figure 21, also can use by the movable part 13a of column be located at the top of movable part and be used for the supporting mass 13 that the plate-like portion 13b with the back surperficial butt of electric substrate 1 constitutes.As long as can make supporting mass 13 with electric substrate 1 butt and separate, just to not special qualification of shape of the movable part 13a of column, for example, the movable part 13a of this column can be cylindric, quadrangular shape.Do not limit the shape of plate-like portion 13b is special, for example, this plate-like portion 13b can be circular, quadrangle.At supporting mass 13 is under the situation of this structure, owing to utilize the plate-like portion 13b supporting electric substrate 1 of area broad, therefore in mould, makes the position stability of electric substrate 1 easily.Therefore, can easily make and make the stable thermoplastic resin sealed electrical submounts of thickness that is formed on lip-deep covering part 23 thermoplastic resins such as grade.
Embodiment
Below, utilize embodiment that the present invention is specified, but the present invention is not limited to following embodiment.
As electric substrate, use the glass epoxy substrate of lengthwise 45mm, width 45mm, thickness 1.6mm.In Figure 22,, be illustrated in the sketch map at line place under the state that is mounted with electric substrate in the mould, that each mid point on the relative limit of electric substrate is formed by connecting for embodiment 1 employed mould.In the mould of front surface side, be provided with the cross feed path that intersects in the center of die cavity, in the mould of back face side, be provided with the cross recess I that intersects in the center of die cavity.
Recess I after being located on the mould of face side is 5mm apart from the degree of depth on electric substrate surface, and width is 4mm.In the mould of mould and the front surface side of back face side, the recess II that is provided with the mode that on front surface, surface, back and the side surface of electric substrate, forms covering part is 2mm apart from the degree of depth on electric substrate surface.In the mould of the mould of front surface side and back face side, the feed path in being located at from the front surface of electric substrate to the scope of side surface is 5mm apart from the degree of depth on electric substrate surface, and width is 4mm.The mould of back face side has four columned supporting masses in recess II.
When the mould of stating shape in the use utilizes injection molding machine according to the above-mentioned electric substrate of the standard molding condition sealing of each resin; Even utilize polybutylene terephthalate resin (
303RA; Wintechpolymer Co., Ltd. system), polyphenylene sulfide (Off オ one ト ロ Application 6165A61; Polyplastics Co., Ltd. system) any in; Can not produce the formation of vestige of distortion and the supporting mass in the covering part of electric substrate yet, can stably make thermoplastic resin sealed electrical submounts.
As electric substrate, use the glass epoxy substrate of lengthwise 45mm, width 45mm, thickness 1.6mm.As the feed path that is used for surface supply thermoplastic resin behind electric substrate, with configuration shown in Figure 11, so that the mode that is spaced apart 5mm between the periphery of through hole is provided with the through hole of diameter 3.5mm on electric substrate.In addition, the through hole of substrate center is to be formed centrally during the intersection of diagonal with substrate is.
In Figure 23,, be illustrated in the sketch map at line place under the state that is mounted with electric substrate in the mould, that each mid point on the relative limit of electric substrate is formed by connecting for embodiment 2 employed moulds.Because the hole portion of electric substrate as feed path, therefore, is not provided with feed path in the mould of front surface side.In addition, in the mould of back face side, be provided with the cross recess I that intersects in the center of die cavity.
The recess I that is located at the mould of back face side is 5mm apart from the surperficial degree of depth of electric substrate, and width is 4mm.In the mould of mould and the front surface side of back face side, the recess II that is provided with the mode that on front surface, surface, back and the side surface of electric substrate, forms covering part is 2mm apart from the degree of depth on electric substrate surface.The mould of back face side has four columned supporting masses in recess II.
State in the use under the mould and situation of shape with the above-mentioned electric substrate of the condition sealing identical with embodiment 1; Even utilize in polybutylene terephthalate resin, the polyphenylene sulfide any; Can not produce the formation of vestige of distortion and the supporting mass in the covering part of electric substrate yet, can stably make thermoplastic resin sealed electrical submounts.
Comparative example 1
Stop up the mould that forms and with the condition sealing embodiment identical 1 under the situation of used electric substrate at the feed path that adopts the mould that embodiment 1 is used and recess I with embodiment 1; Even utilize in polybutylene terephthalate resin, the polyphenylene sulfide any; Also can make electric substrate distortion, thereby can not resin fully be filled into face side behind the substrate.
Description of reference numerals
1, electric substrate; 10, mould; 11, the mould of back face side; 12, the mould of front surface side; 13, supporting mass; 14, recess I; 15, recess II; 16, cast gate; 17, feed path; 18, hole portion; 19, recess III; 2, thermoplastic resin sealed electrical submounts; 21, guide portion; 22, supply unit; 23, covering part.
Claims (16)
1. mould, wherein,
This mould comprise following a)～e), and be used to utilize and adopt the injection molded of thermoplastic resin to come the sealed electrical submounts:
A) cast gate, it is located at the front surface side of above-mentioned electric substrate;
B) recess I, it is used for forming guide portion on the back surface of above-mentioned electric substrate;
C) feed path, it is used to be communicated with above-mentioned cast gate and above-mentioned recess I;
D) recess II, it is connected with above-mentioned feed path and above-mentioned recess I on the surface of above-mentioned electric substrate, and is used for forming the covering part that wall thickness is thinner than guide sections on the surface of above-mentioned electric substrate;
E) supporting mass, it is located at the back face side of above-mentioned electric substrate and can and separates with the back surperficial butt of above-mentioned electric substrate, and the back surperficial butt of this supporting mass and above-mentioned electric substrate supports above-mentioned electric substrate.
2. mould according to claim 1, wherein,
Above-mentioned feed path is to be connected with above-mentioned recess I via side surface from the front surface of above-mentioned electric substrate and to form with the surperficial contacted mode of above-mentioned electric substrate, and the degree of depth of above-mentioned feed path is greater than the degree of depth of above-mentioned recess II.
3. mould according to claim 1, wherein,
Above-mentioned electric substrate comprises the hole portion that is used to be communicated with front surface and surface, back, and above-mentioned feed path is to form the mode of above-mentioned cast gate and above-mentioned recess I connection via above-mentioned hole portion.
4. mould according to claim 2, wherein,
The degree of depth of the degree of depth of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II; The width of the width of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
5. mould according to claim 3, wherein,
The degree of depth of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the width of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
6. according to each described mould in the claim 2 to 4, wherein,
Above-mentioned cast gate is being provided with a place than the side surface that comprises above-mentioned electric substrate in interior plane pattern tool side surface side at least.
7. according to each described mould in the claim 1 to 6, wherein,
Above-mentioned supporting mass with the face of above-mentioned electric substrate butt in have recess III; Above-mentioned recess III forms the part of above-mentioned recess I under the state of above-mentioned electric substrate and above-mentioned supporting mass butt, above-mentioned supporting mass and face above-mentioned electric substrate butt form the part of above-mentioned recess II under the state that above-mentioned electric substrate separates at above-mentioned supporting mass.
8. the manufacturing approach of a thermoplastic resin sealed electrical submounts, wherein,
The manufacturing approach of this thermoplastic resin sealed electrical submounts comprises following 1)～5) operation:
1) with electric substrate be loaded into be arranged in the mould, can with the back surperficial butt of above-mentioned electric substrate and the supporting mass that separates on after, make the mould matched moulds;
2) utilize injection molding machine, the molten thermoplastic resin is injected in the mould from the cast gate of the front surface side that is located at electric substrate of above-mentioned mould;
3) supply with above-mentioned molten thermoplastic resin via the feed path of the recess I that is communicated with above-mentioned cast gate and mould to above-mentioned recess I; Above-mentioned molten thermoplastic resin is filled among the above-mentioned recess I; Wherein, above-mentioned recess I is used for forming guide portion on the back surface of above-mentioned electric substrate;
4) preferentially supply with above-mentioned molten thermoplastic resin to above-mentioned recess I; And above-mentioned molten thermoplastic resin is filled among the recess II of above-mentioned recess I and mould; Above-mentioned recess II is connected with above-mentioned feed path and above-mentioned recess I on the surface of above-mentioned electric substrate, and is used for forming the covering part that wall thickness is thinner than guide sections on above-mentioned electric substrate surface;
5) when above-mentioned recess II fills above-mentioned molten thermoplastic resin, above-mentioned supporting mass is separated from above-mentioned electric substrate;
6), above-mentioned molten thermoplastic resin make thermoplastic resin sealed electrical submounts after solidifying from above-mentioned mold releasability.
9. the manufacturing approach of thermoplastic resin sealed electrical submounts according to claim 8, wherein,
Above-mentioned feed path is to be connected with above-mentioned recess I via side surface from the front surface of above-mentioned electric substrate and to form with the surperficial contacted mode of above-mentioned electric substrate, and the degree of depth of above-mentioned feed path is greater than the degree of depth of above-mentioned recess II.
10. the manufacturing approach of thermoplastic resin sealed electrical submounts according to claim 8, wherein,
Above-mentioned electric substrate comprises the hole portion that is used to be communicated with front surface and surface, back, and above-mentioned feed path is to form the mode of above-mentioned cast gate and above-mentioned recess I connection via above-mentioned hole portion.
11. the manufacturing approach of thermoplastic resin sealed electrical submounts according to claim 9, wherein,
The degree of depth of the degree of depth of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II; The width of the width of above-mentioned feed path and above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
12. the manufacturing approach of thermoplastic resin sealed electrical submounts according to claim 10, wherein,
The degree of depth of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the width of above-mentioned recess I is 2 times～4 times of the degree of depth of above-mentioned recess II, and the degree of depth of above-mentioned recess II is 1.0mm～1.5mm.
13. according to the manufacturing approach of claim 9 or 11 described thermoplastic resin sealed electrical submounts, wherein,
Above-mentioned cast gate is being provided with a place than the side surface that comprises above-mentioned electric substrate in interior plane pattern tool side surface side at least.
14. the manufacturing approach of each described thermoplastic resin sealed electrical submounts in 13 according to Claim 8, wherein,
Above-mentioned supporting mass with the face of above-mentioned electric substrate butt in have recess III; Above-mentioned recess III forms the part of above-mentioned recess I under the state of above-mentioned electric substrate and above-mentioned supporting mass butt, above-mentioned supporting mass and face above-mentioned electric substrate butt form the part of above-mentioned recess II under the state that above-mentioned electric substrate separates at above-mentioned supporting mass.
15. the manufacturing approach of each described thermoplastic resin sealed electrical submounts in 14 according to Claim 8, wherein,
Above-mentioned thermoplastic resin is polybutylene terephthalate resin or polyphenylene sulfide.
16. a thermoplastic resin sealed electrical submounts, wherein,
This thermoplastic resin sealed electrical submounts is to utilize the manufacturing approach of each described thermoplastic resin sealed electrical submounts in the claim 8 to 15 to manufacture.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011021583 | 2011-02-03 | ||
| JP2011-021583 | 2011-02-03 | ||
| JP2011199556A JP2012176601A (en) | 2011-02-03 | 2011-09-13 | Molding die, method of manufacturing thermoplastic resin sealed electronic substrate by injection molding, and thermoplastic resin sealed electronic substrate |
| JP2011-199556 | 2011-09-13 |
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| CN103951977A (en) * | 2014-04-18 | 2014-07-30 | 安徽省中日农业环保科技有限公司 | Glass bead-modified polyphenylene sulfide material for auto plastic parts |
| CN108025466A (en) * | 2015-11-09 | 2018-05-11 | 东和株式会社 | Resin encapsulation equipment and resin encapsulation method |
| CN114208407A (en) * | 2019-09-12 | 2022-03-18 | 欧姆龙株式会社 | Electronic device, non-contact switch, and photoelectric sensor |
| US12020888B2 (en) | 2019-09-12 | 2024-06-25 | Omron Corporation | Electronic apparatus, non-contact switch, and photoelectric sensor |
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