CN203391230U - LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) - Google Patents

Abstract

The utility model relates to the field of moulds, and particularly discloses an LED (Light Emitting Diode) packaging mould for a PCB (Printed Circuit Board). The LED packaging mould comprises an upper mould, a lower mould, convex ribs and thimbles, wherein the upper surface of the lower mould is fixedly provided with the PCB; the lower mould is provided with a plurality of concave cavities for containing LED sealing compound; the concave cavities are arrayed on the upper surface of the lower mould in multiple lines; a plurality of convex ribs are arranged on the upper surface of the lower mould and are positioned between the two adjacent lines of concave cavities; the convex ribs arranged on two sides of each line of concave cavities form an independent flow passage; the thimbles are arranged on the two sides of the lower mould. According to the LED packaging mould for the PCB, provided by the utility model, the independent flow passages are arranged, so that the LED sealing compound is filled in each concave cavity along with the corresponding independent flow passage, and the conditions of insufficient LED sealing compound in the concave cavities positioned at the rear part of the LED packaging mould are reduced, and thus bubbles generated during the LED packaging process are prevented; an independent glue port is formed, so that LED products are relatively well separated from residue sealing compound.

Description

A kind of LED encapsulating mould for pcb board

Technical field

The utility model relates to mould applications, relates in particular to a kind of LED encapsulating mould for pcb board.

Background technology

At present, the mode of production of industrial frequent employing ejection formation manufactures a product, and concrete is exactly, particles is put into Jet forming machine, after barrel heating and melting, then the glue that melts of molten is injected to mould to form product shape, after cooling curing moulding, can take out.

The processing mode of above-mentioned ejection formation is also widely used in the encapsulation of light-emittingdiode (LED).In prior art, the sealing of pcb board LED is to be molded in a set of mold and bed die cooperatively interacting, and wherein bed die is provided with a plurality of depressions, for producing each LED semi-finished product, in process of production, sealing is poured in this mold, to flow into each depression, complete the processing procedure of this pcb board LED.

Yet, due to factors such as time and costs, above-mentioned LED encapsulating mould encapsulating normally full slice system enters glue, sealing is to pour into and following current backward from the Jiao Kou place that enters in mould the place ahead, and each depression being interconnected along the inflow of monoblock mold in turn, often cause the LED sealing quantity not sufficient in the depression of rear, and cause in part LED sealing and have Bubble formation.And glue-feeder place is because glue amount is too many, more difficult when separated, and on pcb board during residual too many glue, for the processing of back segment, be also disadvantageous.

Utility model content

(1) technical problem that will solve

The purpose of this utility model is to provide a kind of LED encapsulating mould for pcb board, to overcome in prior art, and in the half-finished production process of LED, the problem of the LED sealing quantity not sufficient in the depression at LED encapsulating mould rear.

(2) technical scheme

In order to solve the problems of the technologies described above, the utility model provides a kind of LED encapsulating mould for pcb board, and described LED encapsulating mould comprises: upper die and lower die, fin and thimble;

Fixing pcb board on the upper surface of described counterdie;

On described counterdie, be provided with a plurality ofly for holding the depression of LED sealing, described depression is lined up multiple row on the upper surface of counterdie;

Described fin is a plurality of, and is arranged on the upper surface of described counterdie, and between the described depression of adjacent two row;

The fin that is arranged on the described depression of every row both sides forms an independent runner;

Described thimble is arranged on the both sides of described counterdie, for ejecting LED semi-finished product.

Further, a plurality of described depressions are matrix arrangement on the upper surface of described counterdie.

Further again, described independent runner is parallel to each other.

Further, the described fin of the described depression Yu Qi of every row both sides all contacts.

Further, described in each, the quantity of the described depression in independent runner equates.

Further, described a plurality of fin is structure as a whole.

Further, described fin and described counterdie are into a single integrated structure.

Further, described LED encapsulating mould also comprises independent Jiao Kou;

Described independent Jiao Kou is corresponding with described independent runner, and the width of described independent Jiao Kou is less than the width of described independent runner.

(3) beneficial effect

The LED encapsulating mould for pcb board that the utility model provides, the setting of independent runner, make LED sealing fill up depression described in each along each independent runner, reduced the described depression that is arranged in described LED encapsulating mould rear, there is the situation of LED sealing deficiency, and then avoided producing bubble in the process of LED sealing; The setting of independent Jiao Kou, makes LED product separated with cull better, has avoided occurring on pcb board the situation that cull is too much.

Accompanying drawing explanation

Fig. 1 is the counterdie floor map of the LED encapsulating mould for pcb board that provides of the utility model.

Fig. 2 is that the counterdie of the LED encapsulating mould for pcb board that provides of the utility model is along the cutaway view of A-A line.

Fig. 3 is that the LED encapsulating mould for pcb board that provides of the utility model shown in Fig. 2 is at the partial enlarged drawing at B place.

Fig. 4 is the cutaway view of the LED encapsulating mould for pcb board that provides of the utility model under matched moulds state.

Fig. 5 is that the LED encapsulating mould for pcb board that provides of the utility model shown in Fig. 4 is at the partial enlarged drawing at C place.

Cutaway view when Fig. 6 is the use of the LED encapsulating mould for pcb board that provides of the utility model.

Fig. 7 is the schematic diagram that flows to of the LED encapsulating mould for pcb board that provides of the utility model shown in Fig. 2 LED sealing in use.

In figure, 10: counterdie; 11: depression; 20: patrix; 30: fin; 40:PCB plate; 50:LED sealing; 60: independent runner; 70: independent Jiao Kou; 80: thimble.

The specific embodiment

The specific embodiment of the LED encapsulating mould for pcb board the utility model being provided below in conjunction with accompanying drawing is described in further detail.These embodiments are only for the utility model is described, and are not limitation of the utility model.

In description of the present utility model, it should be noted that, term " " center ", " longitudinally ", " laterally ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of indications such as " outward " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.

As Figure 1-5, the LED encapsulating mould for pcb board that the utility model provides, comprising: patrix 20, counterdie 10, fin 30 and thimble 80.In carrying out the half-finished production process of LED, described patrix 20 correspondences are pressed together on described counterdie 10, after described counterdie 10 is laminated with described patrix 20, can between counterdie 10 and patrix 20, pour into LED sealing.

Fixing pcb board 40 on the upper surface of described counterdie 10, so that after matched moulds cast, the LED semi-finished product of formation are fixed on pcb board 40.On described counterdie 10, be provided with a plurality ofly for holding the depression 11 of LED sealing, described depression 11 is lined up multiple row on the upper surface of counterdie 10.

Described fin 30 is a plurality of, and is arranged on the upper surface of described counterdie 10, and between the described depression 11 of adjacent two row.For easy to process, described a plurality of fins 30 can be structure as a whole.Certainly, in order to reduce the processing cost of described LED encapsulating mould, described fin 30 also can be processed into integrative-structure with described counterdie 10, that is to say, described fin 30 can directly process at the upper surface of counterdie 10.In order to produce more LED semi-finished product on same homalographic, the described fin 30 of the described depression 11Yu Qi of every row both sides all contacts.

The fin 30 that is arranged on the described depression of every row 11 both sides forms an independent runner 60.Described independent runner 60 can be parallel to each other, and the quantity of the described depression 11 described in each in independent runner 60 also can equate.But in order to produce more LED semi-finished product on same homalographic, preferably, a plurality of described depressions 11 are matrix and arrange on described counterdie 10.Certainly, according to actual needs, the arrangement mode of a plurality of described depressions 11 on described counterdie 10 also can adopt other modes.Because the quantity of the described depression 11 in independent runner 60 described in each is equal, therefore the amount of required LED sealing 50 in the time of can accurately controlling moulding, reduce the probability that LED sealing 50 is overflowed, reduce the use amount of LED sealing, and then reduce production costs, and see from environmental angle the waste of also having avoided resource.

The setting of described independent runner 60, make LED sealing fill up depression 11 described in each along each independent runner 60, reduced the described depression 11 that is arranged in described LED encapsulating mould rear, there is the situation of LED sealing deficiency, and then avoided producing bubble in the process of LED encapsulation, in other words, utilize the LED encapsulating mould for pcb board that the utility model provides to carry out the half-finished production of LED, because LED sealing independent runner 60 path described in each is identical, therefore it is approximately identical that LED sealing 50Zi the place ahead independence glue mouth 70 flow to the time at each independent runner 60 rear, therefore can be beneficial to user controls the parameters such as briquetting pressure and time exactly, thereby reach the effect of improving product yield.

Described thimble 80 is arranged on described counterdie 10 both sides, for ejecting LED semi-finished product, as shown in Figure 6.After LED has encapsulated, under the effect of described thimble 80, LED finished product spins off from die cavity.These LED finished products, because of the setting of fin 30, have facilitated follow-up cutting processing, the LED semi-finished product of producing at described LED encapsulating mould, and after cutting processing, the encapsulation that can complete LED finished product is made.

Separated with cull better for LED product, avoid occurring the too much situation of cull on pcb board, described LED encapsulating mould also comprises independent glue mouth 70.Described independent glue mouth 70 is corresponding with described independent runner 60, and the width of described independent glue mouth 70 is less than the width of described independent runner 60.When LED sealing 50 enters after described independent glue mouth 70, along described independent runner 60, flow into described in each in independent runner 100, and sequentially fill up the die cavity 11 in each independent runner 100.

The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model know-why; can also make some improvement and replacement, these improvement and replacement also should be considered as protection domain of the present utility model.

Claims (8)

1. for a LED encapsulating mould for pcb board, it is characterized in that, described LED encapsulating mould comprises: upper die and lower die, fin and thimble;

Fixing pcb board on the upper surface of described counterdie;

On described counterdie, be provided with a plurality ofly for holding the depression of LED sealing, described depression is lined up multiple row on the upper surface of counterdie;

Described fin is a plurality of, and is arranged on the upper surface of described counterdie, and between the described depression of adjacent two row;

The fin that is arranged on the described depression of every row both sides forms an independent runner;

Described thimble is arranged on the both sides of described counterdie, for ejecting LED semi-finished product.

2. the LED encapsulating mould for pcb board according to claim 1, is characterized in that, a plurality of described depressions are matrix and arrange on the upper surface of described counterdie.

3. the LED encapsulating mould for pcb board according to claim 1, is characterized in that, described independent runner is parallel to each other.

4. the LED encapsulating mould for pcb board according to claim 3, is characterized in that, the described fin of the described depression Yu Qi of every row both sides all contacts.

5. the LED encapsulating mould for pcb board according to claim 1, is characterized in that, the quantity of the described depression described in each in independent runner equates.

6. the LED encapsulating mould for pcb board according to claim 1, is characterized in that, described a plurality of fins are structure as a whole.

7. the LED encapsulating mould for pcb board according to claim 1, is characterized in that, described fin and described counterdie are into a single integrated structure.

8. according to the LED encapsulating mould for pcb board described in claim 1-7 any one, it is characterized in that, described LED encapsulating mould also comprises independent Jiao Kou;

Described independent Jiao Kou is corresponding with described independent runner, and the width of described independent Jiao Kou is less than the width of described independent runner.

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