CN109318433A - A kind of LED encapsulating mould for pcb board - Google Patents
A kind of LED encapsulating mould for pcb board Download PDFInfo
- Publication number
- CN109318433A CN109318433A CN201811092790.5A CN201811092790A CN109318433A CN 109318433 A CN109318433 A CN 109318433A CN 201811092790 A CN201811092790 A CN 201811092790A CN 109318433 A CN109318433 A CN 109318433A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- mold
- sliding sleeve
- gear
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 208000002925 dental caries Diseases 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 238000013016 damping Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Closing Of Containers (AREA)
Abstract
The present invention relates to a kind of LED encapsulating moulds for pcb board, including pedestal, the upper end of the pedestal is fixedly connected with lower mold, the upper end sliding sleeve of the lower mold is connected to upper mold, the upper end of the upper mold is fixedly connected with cover board, the two sides of the pedestal are equipped with positioning mechanism, and separating mechanism is equipped between the cover board and pedestal.The present invention passes through the damping, buffering effect of spring, it is being inserted into inserted link, when unclamping cover board, cover board and upper mold will not quickly be fallen, it moves down and slows, and upper mold and lower mold will not hard hit, thus ensure that encapsulation stability and internal structure it is intact, also extend service life, the handle of rotation two sides drives Roof to open upper mold, make upper mold and lower mold separation, when avoiding mobile upper mold, the problem of lower mold and pedestal move together.
Description
Technical field
The present invention relates to encapsulating mould technical field more particularly to a kind of LED encapsulating moulds for pcb board.
Background technique
Currently, the industrial production method through frequently with ejection formation manufactures product, it is specifically exactly to be put into particles
Jet forming machine injects mold to form product shape, through cooling and solidifying after barrel heating and melting, then by the glue that melts of molten
After molding, that is, it can be taken off.The processing method of above-mentioned ejection formation is also widely used in the encapsulation of light-emitting diode (LED).
In the prior art, the sealing of pcb board LED is molded in a set of mutually matched upper mold and lower mold, for producing each LED
Semi-finished product.
In process of production, sealing is poured into the mold, after the completion of cooling, opens encapsulating mould, but due to filling
The colloid solidification entered, separation upper/lower die is relatively difficult, and when playing mold in separation, mobile upper mold may will drive lower die tool
It is mobile, so that the work to staff brings trouble.
Summary of the invention
The purpose of the present invention is to solve in the prior art since sealing being poured into the mold, after the completion of cooling,
The relatively difficult problem of separation upper/lower die, and a kind of LED encapsulating mould for pcb board proposed.
To achieve the goals above, present invention employs following technical solutions: a kind of LED encapsulating mould for pcb board,
Including pedestal, the upper end of the pedestal is fixedly connected with lower mold, and the upper end sliding sleeve of the lower mold is connected to upper mold, described
The upper end of upper mold is fixedly connected with cover board, and the two sides of the pedestal are equipped with positioning mechanism, the cover board and pedestal it
Between be equipped with separating mechanism.
Preferably, the positioning mechanism includes four fixed links being welded on pedestal, the upper end of each fixed link
Slot is offered, the inside of each slot is equipped with inserted link, and the upper end of the inserted link is fixedly connected with the bottom end of cover board,
The lower end of the inserted link is equipped with buffer gear integrally formed with thin bar, the lower end of the inserted link.
Preferably, the buffer gear includes the sliding sleeve that sliding sleeve is connected in thin bar, in the thin bar of sliding sleeve lower end
Sliding sleeve is connected to spring, and the upper end of the spring is fixedly connected with sliding sleeve, the fixed company in the lower end of the spring and the bottom end of slot
It connects.
Preferably, the two sides of the slot offer sliding slot, and the inside of two sliding slots slidably connects sliding block,
Two sliding block sides close to each other are fixedly connected with sliding sleeve.
Preferably, the separating mechanism includes two fixed plates for being symmetrically welded at pedestal two sides, two fixed plates
Inside offer cavity, the inside of two cavitys is equipped with rack gear, and the upper end of two rack gears runs through fixed
Plate is simultaneously welded with top plate, and connecting shaft is inserted on the side wall of the cavity, and the other end of the connecting shaft through fixed plate and is consolidated
Surely it is socketed with handle, gear, the wheel and rack engagement have been fixedly attached in the connecting shaft of cavity inside.
Preferably, the rack gear is equipped with slide bar far from the side of gear, and the both ends of the slide bar are plugged in the side of cavity
In wall, limited block is slidably socketed on the slide bar, the limited block is fixedly connected close to the side of rack gear with rack gear.
Compared with prior art, the invention has the benefit that passing through the damping, buffering effect of spring, plugging in inserted link
Enter, when unclamping cover board, cover board and upper mold will not quickly be fallen, and moved down and slowed, and upper mold and lower mold
Will not hard hit, thus ensure that encapsulation stability and internal structure it is intact, also extend service life；It is using
Cheng Hou rotates the handle of two sides, drives connecting shaft rotation, rotates gear, gear band carry-over bar moves up, and opens top plate
Cover board, to facilitate the separation of upper mold and lower mold, when avoiding mobile upper mold, what lower mold and pedestal moved together is asked
Topic；Limited block slides on slide bar, plays position-limiting action, avoids the mobile offset of rack gear, nibbles rack gear and gear stabilization
It closes.
In conclusion the present invention passes through the damping, buffering effect of spring, it is being inserted into inserted link, when unclamping cover board, cover board
Will not quickly be fallen with upper mold, move down and slow, and upper mold and lower mold will not hard hit, to guarantee
The stability of encapsulation and internal structure it is intact, also extend service life, the handle for rotating two sides drives Roof to open
Mold makes upper mold and lower mold separation, when avoiding mobile upper mold, the problem of lower mold and pedestal move together.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the LED encapsulating mould for pcb board proposed by the present invention；
Fig. 2 is a kind of side view of the LED encapsulating mould for pcb board proposed by the present invention.
In figure: 1 pedestal, 2 lower molds, 3 upper molds, 4 cover boards, 5 fixed links, 6 slots, 7 inserted links, 8 springs, 9 sliding sleeves, 10 are slided
Block, 11 fixed plates, 12 top plates, 13 rack gears, 14 limited blocks, 15 slide bars, 16 gears, 17 connecting shafts.
Specific embodiment
The preferred embodiment of the invention is described in detail below in conjunction with attached drawing.
Referring to Fig.1-2, a kind of LED encapsulating mould for pcb board, including pedestal 1, the upper end of pedestal 1 are fixedly connected with
Lower mold 2, the upper end sliding sleeve of lower mold 2 are connected to upper mold 3, and the upper end of upper mold 3 is fixedly connected with cover board 4, and the two of pedestal 1
Side is equipped with positioning mechanism, and positioning mechanism includes four fixed links 5 being welded on pedestal 1, and the upper end of each fixed link 5 is opened
Equipped with slot 6, the inside of each slot 6 is equipped with inserted link 7, and the upper end of inserted link 7 is fixedly connected with the bottom end of cover board 4, inserted link 7
Integrally formed with thin bar, thin bar diameter is small to facilitate insertion slot 6 for lower end.
The lower end of inserted link 7 is equipped with buffer gear, and buffer gear includes the sliding sleeve 9 that sliding sleeve is connected in thin bar, under sliding sleeve 9
Sliding sleeve is connected to spring 8 in the thin bar at end, and the upper end of spring 8 is fixedly connected with sliding sleeve 9, the lower end of spring 8 and the bottom end of slot 6
It is fixedly connected, by the damping, buffering effect of spring 8, is being inserted into inserted link 7, when unclamping cover board 4, cover board 4 and upper mold 3 are not
Can quickly fall, move down and slow, and upper mold 3 and lower mold 2 will not hard hit, to ensure that encapsulation
Stability and internal structure it is intact, also extend the service life of mold.
The two sides of slot 6 offer sliding slot, and the inside of two sliding slots slidably connects sliding block 10, two 10 phases of sliding block
Mutually close side is fixedly connected with sliding sleeve 9, and position-limiting action is played in the movement in sliding slot of sliding block 10, and the pop-up of sliding sleeve 9 is avoided to slide
Slot.
Be equipped with separating mechanism between cover board 4 and pedestal 1, separating mechanism include be symmetrically welded at two of 1 two sides of pedestal it is solid
Fixed board 11, the inside of two fixed plates 11 offer cavity, and the inside of two cavitys is equipped with rack gear 13, two rack gears 13
Upper end runs through fixed plate 11 and is welded with top plate 12, and connecting shaft 17, the other end of connecting shaft 17 are inserted on the side wall of cavity
Through fixed plate 11 and fixing sleeve is connected to handle, has been fixedly attached gear 16 in the connecting shaft 17 of cavity inside, gear 16 with
Rack gear 13 engages, and after the completion of use, rotates the handle of two sides, connecting shaft 17 is driven to rotate, rotate gear 16,16 band of gear
Carry-over bar 13 moves up, and top plate 12 is made to open cover board 4, to facilitate the separation of upper mold 3 and lower mold 2, avoids moving
When upper mold 3, the problem of lower mold 2 and pedestal 1 move together.
Rack gear 13 is equipped with slide bar 15 far from the side of gear 16, and the both ends of slide bar 15 are plugged in the side wall of cavity, sliding
Limited block 14 is slidably socketed on bar 15, limited block 14 is fixedly connected close to the side of rack gear 13 with rack gear 13, and limited block 14 exists
It is slided on slide bar 15, plays position-limiting action, avoided the mobile offset of rack gear 13, allow rack gear 13 and 16 stable engagement of gear.
Working principle of the present invention can be implemented by following operation:
In the present invention, it is inserted into slot 6 by thin bar, facilitates staff that can quickly position, due to mold and cover board 4
Generally there is metal to be made, quality is very big, and when putting down, upper mold 3 and lower mold can be all shaken, thus influence encapsulation and
The integrality of internal structure, and pass through the damping, buffering effect of spring 8, it is being inserted into inserted link 7, when unclamping cover board 4, cover board 4
Will not quickly be fallen with upper mold 3, move down and slow, and upper mold 3 and lower mold 2 will not hard hit, thus
Ensure that encapsulation stability and internal structure it is intact, also extend service life, after the completion of use, rotate the handle of two sides
Hand drives connecting shaft 17 to rotate, and rotates gear 16, and gear 16 is moved up with carry-over bar 13, and top plate 12 is made to open cover board 4,
To facilitate the separation of upper mold 3 and lower mold 2, when avoiding mobile upper mold 3, what lower mold 2 and pedestal 1 moved together is asked
Topic.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of LED encapsulating mould for pcb board, including pedestal (1), which is characterized in that the upper end of the pedestal (1) is fixed
It is connected with lower mold (2), the upper end sliding sleeve of the lower mold (2) is connected to upper mold (3), and the upper end of the upper mold (3) is solid
Surely it is connected with cover board (4), the two sides of the pedestal (1) are equipped with positioning mechanism, between the cover board (4) and pedestal (1)
Equipped with separating mechanism.
2. a kind of LED encapsulating mould for pcb board according to claim 1, which is characterized in that the positioning mechanism packet
Four fixed links (5) being welded on pedestal (1) are included, the upper end of each fixed link (5) offers slot (6), each
The inside of the slot (6) is equipped with inserted link (7), and the upper end of the inserted link (7) is fixedly connected with the bottom end of cover board (4), described
The lower end of inserted link (7) is equipped with buffer gear integrally formed with thin bar, the lower end of the inserted link (7).
3. a kind of LED encapsulating mould for pcb board according to claim 2, which is characterized in that the buffer gear packet
The sliding sleeve (9) that sliding sleeve is connected in thin bar is included, sliding sleeve is connected to spring (8), the bullet in the thin bar of sliding sleeve (9) lower end
The upper end of spring (8) is fixedly connected with sliding sleeve (9), and the lower end of the spring (8) is fixedly connected with the bottom end of slot (6).
4. a kind of LED encapsulating mould for pcb board according to claim 3, which is characterized in that the slot (6)
Two sides offer sliding slot, and the inside of two sliding slots slidably connects sliding block (10), and two sliding blocks (10) are mutual
Close side is fixedly connected with sliding sleeve (9).
5. a kind of LED encapsulating mould for pcb board according to claim 1, which is characterized in that the separating mechanism packet
Two fixed plates (11) for being symmetrically welded at pedestal (1) two sides are included, the inside of two fixed plates (11) offers cavity,
The inside of two cavitys is equipped with rack gear (13), and the upper end of two rack gears (13) is run through fixed plate (11) and welded
Have top plate (12), be inserted on the side wall of the cavity connecting shaft (17), the other end of the connecting shaft (17) runs through fixed plate
(11) and fixing sleeve is connected to handle, has been fixedly attached gear (16), the gear in the connecting shaft (17) of cavity inside
(16) it is engaged with rack gear (13).
6. a kind of LED encapsulating mould for pcb board according to claim 5, which is characterized in that the rack gear (13) is remote
Side from gear (16) is equipped with slide bar (15), and the both ends of the slide bar (15) are plugged in the side wall of cavity, the slide bar
(15) it has been slidably socketed on limited block (14), the limited block (14) is close to the side of rack gear (13) and rack gear (13) fixed company
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109318433A true CN109318433A (en) | 2019-02-12 |
| CN109318433B CN109318433B (en) | 2024-03-19 |
Family
ID=65266087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811092790.5A Active CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109318433B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111294559A (en) * | 2020-02-11 | 2020-06-16 | 深圳供电局有限公司 | Electric power identification pile |
| CN112589034A (en) * | 2020-12-18 | 2021-04-02 | 山东华民钢球股份有限公司 | Righting device for crank press blank and working method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
| CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
| DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
| CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
| CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
| CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
-
2018
- 2018-09-17 CN CN201811092790.5A patent/CN109318433B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
| CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
| CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
| DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
| CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
| CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111294559A (en) * | 2020-02-11 | 2020-06-16 | 深圳供电局有限公司 | Electric power identification pile |
| CN112589034A (en) * | 2020-12-18 | 2021-04-02 | 山东华民钢球股份有限公司 | Righting device for crank press blank and working method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109318433B (en) | 2024-03-19 |
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Effective date of registration: 20240219 Address after: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Applicant after: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 224000 Photoelectric Industrial Park, No. 66 Lijiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: YANCHENG DONGZI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |
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Effective date of registration: 20240529 Address after: Building 1 and 3, Qilin Communication Electronics Industrial Park, No. 006 Liaoyuan Road, Fenghuang Street Office, Juye County, Heze City, Shandong Province, 274900 Patentee after: Shandong Daning Semiconductor Co.,Ltd. Country or region after: China Address before: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Patentee before: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region before: China |
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